LASER PACKAGE AND LASER DEVICE COMPREHENSIVE LASER PACKAGES

Abstract

The invention relates to a laser package comprising: a base element having a mounting surface on which at least one semiconductor laser element is arranged; a frame element having a ceramic as its main material, which is connected to the base element and forms a frame that surrounds the at least one semiconductor laser element in a lateral direction, wherein the frame element has a circumferential first stage extending laterally from a base surface with a connecting surface that is at least partially connected to a part of the mounting surface, and wherein the frame element has a circumferential second stage extending laterally from a cover surface opposite the base surface; a cover element that is substantially transparent to the laser light emitted by the at least one semiconductor laser element and is arranged on the cover surface;at least one optical element arranged on or integrated into the cover element; and at least one deflecting element arranged in the beam path of the at least one semiconductor laser element and configured to deflect laser light emitted by the at least one semiconductor laser element in the direction of the at least one optical element.

Description

[0001] The present invention relates to a laser package and a laser device comprising at least two laser packages, and a method for producing a laser package. BACKGROUND

[0002] An encapsulated laser package with a deflection mirror is an advanced technology widely used in the laser industry. This type of laser module is characterized by its compact design, in which a laser beam is deflected using a deflection mirror to enable precise alignment. The encapsulated design offers many advantages, such as protecting the laser elements from external influences and allowing easy integration into various applications.

[0003] Despite the numerous advantages, there are also some potential disadvantages that may be associated with the geometry of currently known encapsulated laser packages and their emitted luminance.

[0004] In terms of geometry, the compactness of the package can lead to limitations. Due to the limited space, all components of the laser package must be carefully positioned and arranged. This can lead to challenges in the electrical connection of the laser elements inside the laser package, as well as limitations in the direction and position of the light emitted from the laser package.

[0005] A further disadvantage relates to the emitted luminance of multiple encapsulated laser packages emitting laser light next to one another simultaneously. In particular, with current laser packages arranged next to one another to create a common light spot, only limited focusing and a limited luminance of this common light spot can be achieved. This is due, among other things, to the fact that the individual light spots of the adjacent laser packages can only be arranged close to one another to a limited extent, thus limiting the focus of the common light spot and, accordingly, providing only a limited luminance.

[0006] There is therefore a need to provide a laser package and a laser device comprising at least two laser packages, by means of which at least some of the aforementioned disadvantages can be overcome. Furthermore, there is a need to provide a method for producing such a laser package. SUMMARY OF THE INVENTION

[0007] This need is addressed by the subject matter of the independent patent claims. Further developments and embodiments of the proposed principle are specified in the subclaims.

[0008] The inventor proposes a laser package with a frame element, wherein the frame element, together with a base element, forms a cavity for at least one semiconductor laser element. An inner side wall of the frame element has a circumferential step on an upper side of the laser package, which step has multiple functions. Firstly, the step can cause the inner side wall of the frame element to be set back in the region of the step, thereby preventing shadowing of laser light emitted by the at least one semiconductor laser element. Secondly, the step can be used according to developments of the invention to provide further functionalities of the laser package in or on it.Thanks to the step, a deflection mirror for deflecting the light emitted by the semiconductor laser element can also deflect the main axis of the laser beam by an angle of less than 90° to the horizontal, in order to direct the laser beam further toward an outer edge of the package without being shadowed by the frame element, as would be the case with a frame element without such a step. A lens mounted on a cover element or integrated into the cover element can then be pushed onto this outer edge of the laser package into the deflected beam path, and its optical axis can be tilted in such a way that vertical light exits the laser package. This type of arrangement allows the emission point of the laser package to be moved as close as possible to one of the outer edges of the package.

[0009] Particularly in the case of a laser device comprising at least two laser packages arranged in such a way that the emission points of the laser packages are directly adjacent to one another, the luminance within a jointly emitting light-emitting surface (LES) of the laser device can be significantly increased compared to an identical device with different types of laser packages. The luminance can be measured in particular as luminous flux with the unit cd / mm 2 which can be significantly increased with the laser packages according to the invention compared to an identical device with different types of laser packages at a smaller LES and with the same power.

[0010] According to one aspect of the invention, a laser package comprises a base element having an arrangement surface on which at least one semiconductor laser element is arranged. In addition, the laser package comprises a frame element having a ceramic as the main material, which is connected to the base element and forms a frame that surrounds the at least one semiconductor laser element in a lateral direction. The frame element has a circumferential first step extending in the laterally direction from a base surface and having a connecting surface that is at least partially connected to a part of the arrangement surface, and the frame element has a circumferential second step extending in the lateral direction from a cover surface opposite the base surface.The laser package further comprises a cover element that is substantially transparent to the laser light emitted by the at least one semiconductor laser element and is arranged on the cover surface, as well as at least one optical element that is arranged on the cover element or integrated into it. An optical axis of the at least one optical element can be tilted relative to a direction perpendicular to the lateral direction. Furthermore, the laser package comprises at least one deflection element that is arranged in the beam path of the at least one semiconductor laser element and that is designed to deflect laser light emitted by the at least one semiconductor laser element in the direction of the at least one optical element.The at least one deflection element can be designed to deflect the laser light by less than 90° such that at least a part of the deflected laser light intersects a region between the rotating second stage and the cover element.

[0011] Thanks to the circumferential second step, the deflection element for deflecting the light emitted by the semiconductor laser element can deflect the main axis of the laser beam by an angle of less than 90° to the horizontal, in order to direct the laser beam further toward the at least one optical element in the region of an outer edge of the laser package without being shadowed by the frame element, as would be the case with a frame element without such a step. The optical element placed on the cover element or integrated into the cover element can thus be pushed onto this outer edge of the laser package into the deflected beam path, and its optical axis can be tilted in such a way that vertical light exit from the laser package is still ensured.This type of arrangement allows the emission point of the laser package to be moved as close as possible to one of the outer edges of the laser package without being shadowed by the frame element.

[0012] In one aspect, the optical axis of the at least one optical element is tilted toward a first side surface of the frame element connecting the base surface and the cover surface. In particular, the at least one optical element also borders a first plane extending through the first side surface and is spaced apart from a second plane extending through a second side surface of the frame element opposite the first side surface. The optical element can in particular be arranged eccentrically above the at least one semiconductor laser element and in particular very close to one of the outer edges of the laser package. In addition, the optical axis of the at least one optical element is tilted toward this outer edge in order to ensure perpendicular light exit from the laser package despite the deflection of the laser beam by less than 90° by the deflection element.

[0013] In one aspect, the laser package is configured to emit laser light in a direction substantially perpendicular to the lateral direction. Furthermore, the laser package has, in particular, a laser light emission region arranged off-center of the laser package above the region between the circumferential second stage and the cover element. This laser light emission region is, in particular, arranged adjacent to the first plane or is arranged along or adjacent to an outer edge of the laser package.

[0014] In one aspect, the base element essentially does not protrude beyond the base surface, but rather is essentially flush with the base surface. The frame element has a surrounding frame, particularly in the area of ​​the surrounding first step, into which the base element is inserted with the aim of creating a substantially flush component underside of the laser package.

[0015] In one aspect, the base element is arranged at a laterally spaced distance from a third side surface of the frame element, which connects the base surface and the connecting surface to one another. In particular, the base element is not pressed into the frame element, but is arranged at a distance from the frame element on at least opposite side surfaces of the base element. However, the base element is in particular designed and arranged such that the arrangement surface and the connecting surface have a continuous contact area with one another, viewed in the circumferential direction. The frame element can be closed accordingly on one side by means of the base element.

[0016] In addition to the at least one deflection element, the laser package can also comprise further optical elements for beam shaping or beam deflection, which are arranged in the beam path between the at least one semiconductor laser element and the at least one optical element. Such a further optical element for beam shaping or beam deflection can be arranged, for example, on the base plate.

[0017] In one aspect, the laser package comprises a plurality of semiconductor laser elements arranged spaced apart from one another on the base element and surrounded laterally by the frame element. In particular, one or more semiconductor laser elements can be provided in the laser package that emit light of the same or different wavelengths. For example, the laser package can be provided to emit only short-wave laser light in the range of, for example, 450 nm, which is then converted into a desired color. Alternatively, the laser package can be provided to emit light of different wavelengths, for example, red, green, and blue light, thus forming an RGB laser package. However, any other combination of wavelengths / colors that can be emitted by the laser package using multiple semiconductor laser elements is also conceivable.

[0018] In one aspect, the semiconductor laser elements of the plurality of semiconductor laser elements can be arranged adjacent to one another in a row. In particular, the semiconductor laser elements can be arranged equidistantly or at different distances from one another on the base plate.

[0019] In one aspect, the laser package comprises a plurality of optical elements, each having an optical axis that is tilted relative to a direction perpendicular to the lateral direction. In particular, the laser package comprises an optical element assigned to a semiconductor laser element. In the case of a plurality of semiconductor laser elements, the laser package can have the same number of optical elements as the number of semiconductor laser elements. However, it is also conceivable for the optical element to be formed by a lens array having a plurality of optical axes, wherein each semiconductor laser element is assigned an optical axis.

[0020] In one aspect, the laser package comprises a plurality of deflection elements, each of which is arranged in the beam path of one of the plurality of semiconductor laser elements and is designed to deflect laser light emitted by the corresponding semiconductor laser element in the direction of the at least one first optical element. In particular, the laser package comprises a respective deflection element assigned to a semiconductor laser element. In the case of a plurality of semiconductor laser elements, the laser package can have the same number of deflection elements as the number of semiconductor laser elements. However, it is also conceivable for the deflection element to be formed by a continuous mirror, which deflects the light emitted by the semiconductor laser elements by less than 90° in the direction of the at least one optical element.

[0021] In one aspect, contact surfaces are arranged on the circumferential second stage, which are electrically coupled to at least one of the plurality of semiconductor laser elements. In particular, the circumferential second stage has contact surfaces on its upper side, which are electrically connected, for example, to the bottom surface of the frame element via internal conductor tracks and vias. The conductor tracks or vias can in particular be formed by contact planes integrated into the frame element, which are electrically connected to the contact surfaces. For this purpose, the frame element can be designed, for example, as a multilayer ceramic (e.g.: Al2O3, AlN). In particular, the contact surfaces on the circumferential second stage can be formed at different heights in order to facilitate contacting of the contact surfaces or arrangement of the contact planes.The contact surfaces at different heights in the circumferential second stage are connected, for example, to different connection levels in the frame element.

[0022] In one aspect, the plurality of semiconductor laser elements are coupled in series. In particular, the two outer series-coupled semiconductor laser elements can be contacted by means of bonding wires to contact surfaces on the circumferential second stage.

[0023] In one aspect, however, at least two of the plurality of semiconductor laser elements are each electrically coupled to at least two contact surfaces on the rotating second stage such that each of the at least two of the plurality of semiconductor laser elements can be operated individually. In particular, using the contact surfaces in or on the rotating second stage in conjunction with appropriate internal wiring in the frame element, it is possible to control several semiconductor laser elements mounted in the laser package independently of one another. In the case of an RGB laser package, for example, this can be particularly advantageous, since it allows a desired color mixing of the light emitted by the laser package to be achieved.The circumferential second stage offers the advantage of providing a corresponding surface for the contact surfaces adjacent to the respective semiconductor laser elements, enabling wiring between the semiconductor laser element and the contact surfaces over a short distance and without contact with other components of the laser package. Contacting the semiconductor laser elements with the contact surfaces can be achieved, for example, using bonding wires to the contact surfaces on the circumferential second stage.

[0024] In one aspect, the base element comprises a ceramic as the main material and, in particular, has a metallic coating and / or electrical vias, at least in some regions. The ceramic base element can comprise AlN or SiC, for example, and have a metallic coating and / or electrical vias, at least in some regions. Alternatively, the base element can be formed substantially entirely from a metallic material such as Cu or a Cu-based alloy.

[0025] In one aspect, a submount is arranged between the at least one semiconductor laser element and the base plate. In particular, the at least one semiconductor laser element and the submount can form a subassembly that is arranged on the assembly surface. The submount can, on the one hand, enable better heat dissipation from the at least one semiconductor laser element and, on the other hand, can represent a raised area in order to prevent so-called beam clipping of the laser light emitted from a laser facet of the at least one semiconductor laser element. The submount can, for example, be metallic or have a ceramic as the main material and, in particular, have a metallic coating at least in some regions and / or electrical vias. In particular, the laser package comprises a submount that is assigned to a semiconductor laser element.In the case of a plurality of semiconductor laser elements, the laser package can have the same number of submounts as the number of semiconductor laser elements. However, it is also conceivable for only one contiguous submount to be provided on which the semiconductor laser elements are arranged. Furthermore, it is also conceivable for multiple submounts to have different heights, such that the semiconductor laser elements are also arranged at different heights and emit laser light at different heights. This can be particularly advantageous since multiple deflection elements and optical elements can also be arranged at different heights and thus can be laterally offset from one another to enable an even more compact arrangement of the elements, thus further increasing the luminance of the LES.

[0026] In one aspect, the laser package further comprises at least one electrical component that is arranged on the second stage or integrated into the frame element in the region of the second stage and is electrically coupled to contact surfaces on the circumferential second stage. The circumferential second stage can be configured accordingly for the integration of additional functions. For example, at least one of the following components can be arranged on the second stage or integrated into the frame element in the region of the second stage: an ESD protection diode, a photodiode with a monitoring function, an NTC as a temperature sensor, a capacitor as a voltage source, or other passive electrical components.

[0027] In one aspect, the at least one semiconductor laser element is hermetically encapsulated in the interior space between the base element, the cover element, and the frame element. In particular, the frame element can be hermetically joined to the base element and the cover element.

[0028] For this purpose, connecting elements between the components can be formed, for example, by a metallic solder (Cu / Sn; Cu / Sn / Ag) or glass. This results in a hermetically encapsulated laser package that prevents rapid aging of the semi-precipitator laser elements.

[0029] In one aspect, the circumferential first and / or second step has a different width on different sides of the frame element, viewed in plan view. In particular, the upper sides of the circumferential step(s) have a different width on different sides, viewed in plan view.

[0030] A further aspect relates to a laser device comprising a plurality of laser packages according to at least one of the aspects described above. In this case, two laser packages are arranged adjacent to one another in such a way that the optical axes of the optical elements of the two laser packages run mirrored relative to one another, and in particular the first side surfaces of the two frame elements are arranged adjacent to one another. The laser packages are arranged in particular in a so-called vis-à-vis arrangement such that the individual light spots of the laser packages arranged next to one another are arranged as close to one another as possible. In particular, the laser device comprises an even number of laser packages, with two of the laser packages always being arranged in a vis-à-vis arrangement and pairs of laser packages being arranged in rows and / or columns.

[0031] Such a laser device can also be referred to as a cluster of laser packages and can be used as a light source for laser projection applications. Due to the displacement of the individual light points of the individual laser packages according to the invention as close as possible to an edge of the laser packages, such a laser device offers, compared to previously known devices of this type, a high optical flux combined with high luminance of a common light point composed of at least two individual light points. In particular, the introduction of the rotating second stage in combination with the deflection of the laser light beam by less than 90° and the tilting of the optical axis of the optical element enables a smaller possible distance between individual light points than in previously known devices of this type.

[0032] In one aspect, the plurality of laser packages are arranged on a common carrier substrate, in particular a printed circuit board. For example, the carrier substrate can be formed by a so-called "exposed copper board" on which the laser packages are arranged.

[0033] A further aspect relates to a method for producing a laser package comprising the steps: Providing a frame element having a ceramic as the main material, wherein the frame element has a circumferential first step extending in the lateral direction from a bottom surface with a connecting surface, and wherein the frame element has a circumferential second step extending in the lateral direction from a cover surface opposite the bottom surface; Inserting a floor element having an arrangement surface into the frame element such that the connecting surface is at least partially connected to a part of the arrangement surface; Arranging at least one semiconductor laser element on the arrangement surface such that the frame element surrounds the at least one semiconductor laser element in a lateral direction; Arranging at least one deflection element in the beam path of the at least one semiconductor laser element; and Providing a cover element on the cover surface that is essentially transparent to the laser light emitted by the at least one semiconductor laser element, and at least one optical element that is arranged on the cover element or integrated therein, wherein an optical axis of the at least one optical element is in particular tilted with respect to a direction perpendicular to the lateral direction; wherein the at least one deflection element is designed to deflect a laser light emitted by the at least one semiconductor laser element in the direction of the optical element, and wherein the at least one deflection element is in particular designed to deflect the laser light by less than 90° such that at least a portion of the deflected laser light intersects a region between the rotating second stage and the cover element.

[0034] The step of inserting the base element into the frame element may, for example, comprise gluing or bonding the base element into the frame element. In particular, the step of inserting the base element into the frame element may comprise hermetically joining the base element into the frame element.

[0035] The step of arranging the at least one semiconductor laser element on the arrangement surface can, in particular, comprise gluing or bonding the at least one semiconductor laser element to the arrangement surface. Furthermore, the step can comprise arranging a submount on the arrangement surface and subsequently arranging the at least one semiconductor laser element on the submount. Furthermore, the step can comprise arranging a subassembly comprising a submount and the at least one semiconductor laser element on the arrangement surface.

[0036] The step of arranging the at least one deflection element may comprise arranging and aligning it on the arrangement surface.

[0037] The step of providing the cover element, which is essentially transparent to the laser light emitted by the at least one semiconductor laser element, on the cover surface and the at least one optical element can comprise gluing or bonding the cover element to the frame element. In particular, the step of gluing or bonding the cover element to the frame element can comprise hermetically joining the cover element to the frame element. Furthermore, the step of providing the cover element, which is essentially transparent to the laser light emitted by the at least one semiconductor laser element, on the cover surface and the at least one optical element can comprise gluing or bonding the at least one optical element to the cover element.However, it is also conceivable that the at least one optical element is already present as a subassembly with the cover element or is integrated into the cover element, so that a separate gluing or bonding of the at least one optical element is no longer necessary.

[0038] The method may further comprise electrically connecting the at least one semiconductor laser element to contact surfaces on the rotating second stage. The electrically connecting step may, for example, comprise creating bond wires or other types of conductor tracks that extend from the at least one semiconductor laser element to contact surfaces on the rotating second stage.

[0039] The method for producing a laser package can in particular be a method for producing a laser package according to at least one of the aspects described above, so that the aspects described for the laser package are also applicable to the laser package produced by means of the method. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Further aspects and embodiments according to the proposed principle will become apparent with reference to the various embodiments and examples which will be described in detail in conjunction with the accompanying drawings. Fig. 1A and Fig. 1B shows a cross-sectional view and a plan view of a laser device; Fig. 2A and Fig. 2B show a cross-sectional view and a top view of a laser device comprising two laser packages according to some aspects of the proposed principle; Fig. 3 shows a plan view of another embodiment of a laser device comprising laser packages according to some aspects of the proposed principle; Fig. Figure 4 shows a plan view of a laser package according to some aspects of the proposed principle; Fig. 5A and Fig. 5B show two cross-sectional views of the laser package of Fig. 4; Fig. 6 shows a plan view of another embodiment of a laser package according to some aspects of the proposed principle; Fig. Figure 7 shows a cross-sectional view of the laser package of Fig. 6; Fig. 8 shows a plan view of another embodiment of a laser package according to some aspects of the proposed principle; Fig. 9 shows a cross-sectional view of the laser package of Fig. 8; and Fig. 10A to 10C show cross-sectional views of further embodiments of a laser package according to some aspects of the proposed principle. DETAILED DESCRIPTION

[0041] The following embodiments and examples illustrate various aspects and their combinations according to the proposed principle. The embodiments and examples are not always to scale. Likewise, various elements may be enlarged or reduced in size to emphasize individual aspects. It goes without saying that the individual aspects and features of the embodiments and examples shown in the figures can be readily combined with one another without compromising the inventive principle. Some aspects have a regular structure or shape. It should be noted that minor deviations from the ideal shape may occur in practice without, however, contradicting the inventive idea.

[0042] Furthermore, the individual figures, features, and aspects are not necessarily depicted in the correct size, nor are the proportions between the individual elements necessarily accurate. Some aspects and features are emphasized by being enlarged. However, terms such as "top," "above," "below," "below," "larger," "smaller," and the like are correctly depicted in relation to the elements in the figures. This makes it possible to infer such relationships between the elements from the illustrations.

[0043] The Fig. 1A and Fig. 1B show a cross-sectional view and a plan view of a laser device comprising two laser packages, each with a base element 2 having an arrangement surface 3 on which semiconductor laser elements 4 are arranged. The laser packages also each comprise a frame element 5 that is connected to the base element 2 and forms a frame that surrounds the semiconductor laser elements 4 in a lateral direction x. The frame element 5 has a circumferential step 7 extending laterally from a base surface 6 and having a connecting surface 8 that is connected to the arrangement surface 3. Furthermore, the laser packages each comprise a cover element 11 that is arranged on a cover surface 9 of the frame element 5 opposite the base surface.Optical elements 12 are also attached to the cover element 11 by means of an auxiliary carrier and an adhesive 26, and a deflection element 14 is arranged on the arrangement surface 3 in the beam path of the semiconductor laser elements 4, which deflects a laser light L emitted by the semiconductor laser elements 4 by 90° in the direction of the optical elements 12. The optical elements 12 are arranged such that their optical axis 13 runs perpendicularly and along the main axis of the deflected laser light L in order to ensure laser light emission in a direction y of the laser packages that is perpendicular to the lateral direction x.Due to the arrangement and geometries of the components of the laser package, in particular of the frame element 5, the main axes of the laser light L emitted by the laser packages are spaced apart from each other by at least a distance d1 in the lateral direction x, since the laser packages can only be arranged close to each other on a carrier substrate 25 to a limited extent and the components / elements within the laser device can only be pushed close to the edge of the frame element or to the edge of the laser device to a limited extent in order to achieve a desired directed and efficient light extraction from the laser packages.

[0044] In particular, with current laser packages arranged side by side to create a common light spot, only limited focusing and a limited luminance of this common light spot can be achieved due to the minimum distance d1. This is due, among other things, to the fact that the individual light spots of the adjacent laser packages can only be arranged close to one another to a limited extent, thus limiting the focus of the common light spot and, accordingly, providing a limited luminance.

[0045] The inventor therefore proposes a laser package 1 with a frame element 5, in which the frame element 5, together with a base element 2, forms a cavity for at least one semiconductor laser element 4. An inner side wall of the frame element 5 has, on an upper side of the laser package 1 or starting from a cover surface 9 of the frame element 5, a circumferential step 10 that has several functions. Firstly, the circumferential step 10 causes the inner side wall of the frame element 5 to be set back in the region of the circumferential step 10, thus preventing shadowing of a laser light L emitted by the at least one semiconductor laser element 4. Secondly, the circumferential step 10 can be used according to developments of the invention to provide further functionalities of the laser package 1 in or on it.

[0046] Thanks to the circumferential step 10, a deflection mirror 14 for the beam deflection of a laser light L emitted by the semiconductor laser element 4 can deflect the main axis of the laser light L by an angle of less than 90° to the horizontal in order to direct the laser light L further towards an outer edge of the laser package 1 without being shaded by the frame element 5, as is the case with a frame element according to Fig. 1A and Fig. 1B would be the case. A lens 12 placed on a cover element 11 or integrated into the cover element 11 can then be pushed onto this outer edge of the laser package 1 into the deflected beam path of the laser light L and its optical axis 13 can be tilted in such a way that a vertical light exit from the laser package 1 is ensured. By this type of arrangement, the emission point of the laser package 1 can be pushed as close as possible to one of the outer edges of the laser package 1, so that in the case of a laser device 100 which is similar to the Fig. 1A and Fig. 1B, but with laser packages 1 according to the invention, the main axes of the laser light L emitted by the laser packages 1 have a smaller distance d2 from each other than the distance d1. In the case of such a laser device 100, which are arranged in such a way that the emission points of the laser packages 1 are arranged directly next to each other and only at a distance d2 from each other, the luminance within a jointly emitting light emission surface (LES) of the laser device 100 can be Fig. 1A and Fig. 1B shown laser device, can be significantly increased.

[0047] The Fig. 2A and Fig. 2B show a cross-sectional view and a top view of such a laser device 100 comprising two laser packages 1 according to some aspects of the proposed principle. The laser device 100 has two laser packages 1, each with a base element 2, which has an arrangement surface 3 on which subassemblies consisting of a submount 22 and a semiconductor laser element 4 are arranged. The laser packages 1 can each have one or more such subassemblies, i.e., one or more semiconductor laser elements 4, arranged on the base element.

[0048] The laser packages 1 each further comprise a frame element 5, which has a ceramic as the main material, which is connected to the base element 2 and forms a frame that surrounds the semiconductor laser elements 4 in a lateral direction x. The frame element 5 has a circumferential first step 7 extending laterally from a base surface 6 with a connecting surface 8 that is connected to the arrangement surface 3, as well as a circumferential second step 10 extending in the lateral direction x from a cover surface 9 opposite the base surface 6.

[0049] Furthermore, the laser packages 1 each comprise a cover element 11, which is arranged on the cover surface 9 of the frame element 5 and, together with the frame element 5 and the base element 2, forms a closed interior space 24 of the laser package 1. Furthermore, optical elements 12 are attached to the cover element 11 by means of an auxiliary carrier and an adhesive or bonding material 26, and a deflection element 14 is further arranged on the arrangement surface 3 in the beam path of the semiconductor laser elements 4, which deflects a laser light L emitted by the semiconductor laser elements 4 in the direction of the optical elements 12. However, the illustrated embodiment of the optical elements 12 in combination with an auxiliary carrier is to be understood merely as an example, and the optical elements 12 can also be integrated directly into the cover element 11 or arranged separately on the cover element 11.In the illustrated case, this can be, in particular, a glass plate with integrated micro-optics 12. Such a design can be particularly advantageous because the joints between the cover element 11 and the glass plate or the optical elements 12 can be located outside the area through which the laser light radiates. Accordingly, the efficiency of the laser packages 1 can be increased.

[0050] The deflection element 14 is designed such that it deflects the laser light L emitted by the semiconductor laser elements 4 by an angle α of less than 90° such that at least a portion of the deflected laser light L intersects a region 15 between the rotating second stage 10 and the cover element 11. Furthermore, the optical elements 12 are arranged and aligned such that their optical axis 13 is tilted relative to a direction y perpendicular to the lateral direction x in order to ensure laser light emission in a direction y of the laser packages 1 perpendicular to the lateral direction x. Accordingly, the optical elements 12 can realign the laser light L passing "obliquely" through the region 15 so that it exits the laser packages 1 in a direction y perpendicular to the lateral direction x.

[0051] By deflecting the laser light by less than 90°, it is possible to guide a light emission closer to an edge region of the laser package 1 and by means of the optical elements 12, the laser light L passing "obliquely" through the region 15 can then be realigned again. In the illustrated case of two laser packages 1 arranged opposite one another on a carrier substrate 25, the main axes of the laser light L emitted by the laser packages 1 can be pushed together accordingly up to a distance d2 in the lateral direction x, so that compared to the embodiment of the Fig. 1A and Fig. 1B the luminance can be increased due to the same light power emitted by the laser packages 1 within a smaller LES.

[0052] In particular, the optical axes 13 of the optical elements 12 are tilted toward a first side surface 16a of the frame element 5, connecting the base surface 6 and the cover surface 9, in order to align the laser light L passing "obliquely" through the region 15. In the laser device, the side surfaces 16a of the laser packages 1 are arranged opposite one another in such a way as to result in the desired face-to-face arrangement. In addition, the optical elements 12 border a first plane 17a passing through the first side surface 16a and are spaced apart from a second plane 17b passing through a second side surface 16b of the frame element 5 opposite the first side surface 16a in order to enable light emission from the laser packages at their edge. A laser light emission region 18 of the laser packages is thus arranged off-center above the region 15 and in particular adjacent to the first plane 17a.

[0053] In the illustrated embodiments, the base element 2 essentially does not protrude beyond the base surface 6 and is essentially flush with the base surface 6. This has the advantage of enabling a flat application to the carrier substrate 25, thus increasing the mechanical stability of the laser device 100. Furthermore, electrical contacts can be provided over the entire contact area between the laser packages and the carrier substrate 25 for operating the laser packages 1.

[0054] In addition, the base element 2 is arranged at a lateral distance from a third side surface 16c of the frame element 5, which connects the base surface 6 and the connecting surface 8. In particular, the base element 2 is glued or bonded to the connecting surface 8 and not pressed into the frame element 5, which determines the distance shown. For example, the base element 2 and the frame element 5 can be hermetically joined.

[0055] From the top view 2B, it can be seen how the optical elements 12 of a laser package 1 and the respective associated underlying semiconductor laser elements 4 are arranged in series along an outer edge of the laser package 1. Laser light emitted from the optical elements 12 of the two laser packages 1 can together form a jointly emitting light emission surface (LES) of the laser device 100.

[0056] Fig. 3 shows a plan view of another embodiment of a laser device 100 comprising four laser packages 1 according to some aspects of the proposed principle. Two of the laser packages 1 are arranged in a vis-à-vis arrangement and together form a jointly emitting light emission surface (LES) of the laser device 100. In the illustrated case, the pairs of laser packages 1 are arranged clustered in a column. However, this is merely an example, and multiple pairs of laser packages 1 can also be arranged, for example, in a matrix arrangement in rows and columns.

[0057] Fig. Figure 4 shows a top view of a laser package 1, showing a possible embodiment of the interior view of a laser package 1 according to some aspects of the proposed principle. Fig. 5A and Fig. 5B also show two cross-sectional views along the cutting lines AA and BB of the laser package of Fig. 4.

[0058] The laser package 1 has contact surfaces 19 on the rotating second stage 10, which, in the illustrated case, are arranged to the side of the semiconductor laser elements 4 on the rotating second stage 10. In the illustrated case, the semiconductor laser elements 4 are connected in series and electrically coupled to one another by means of bond wires 27. The last two semiconductor laser elements 4 in the row are also electrically coupled to the contact surfaces 19 on the rotating second stage 10 by means of bond wires 27 to enable control and supply of the row of semiconductor laser elements 4.

[0059] The Fig. 5A and Fig. 5B show two cross-sectional views along the section lines AA and BB of the laser package of Fig. 4. This makes it particularly clear that not only the first step 7, but also the second step 10 are completely circumferential. It is also clear that different sides of the circumferential second step can have a larger contact surface when viewed from above. In the case shown, for example, the circumferential second step 10 is wider along the short sides of the frame element than on the long sides in order to provide sufficient space for the contact surfaces 19. Furthermore, in the case shown, the circumferential first and circumferential second steps are essentially the same width. However, this is only to be understood as an example and can vary depending on the application, so that, for example, the first or second step is wider at least in some areas.

[0060] Fig. 6 shows a top view of a laser package 1 of a possible further embodiment of the interior view of a laser package 1 according to some aspects of the proposed principle. Fig. 7 also shows a cross-sectional view along the section line CC of the laser package of Fig. 6.

[0061] The laser package 1 has contact surfaces 19 on the rotating second stage 10, which, in the illustrated case, are arranged next to the semiconductor laser elements 4 on the rotating second stage 10. In the illustrated case, the semiconductor laser elements 4 can each be operated separately and are electrically connected to the contact surfaces assigned to the semiconductor laser elements 4 by means of bond wires 27. This allows the semiconductor laser elements 4 to be controlled and supplied separately.

[0062] Such a design can be particularly advantageous if a color mixing of the laser light emitted by the semiconductor laser elements 4 is to take place as soon as it leaves the laser package 1, such as in the case of an RGB laser package, or in order to be able to activate different wavelengths as required.

[0063] The contact surfaces 19 can be used as shown in Fig. 7, different levels can be formed on the circumferential second stage 10, and the contact surfaces 19 can be electrically connected via contact levels within the frame element 5. This allows separate operation or control of the semiconductor laser elements 4 to be provided.

[0064] Fig. Figure 8 shows a top view of a laser package 1 of a possible further embodiment of the interior view of a laser package 1 according to some aspects of the proposed principle. Fig. 9 also shows a cross-sectional view along the section line DD of the laser package of Fig. 8.

[0065] In addition to the Fig. 6 and Fig. In the embodiment shown in Figure 7, the laser package 1 has electrical components 23 that are arranged on the rotating second stage 10 or are integrated into cavities 28 in the frame element 5 in the region of the second stage and are electrically coupled to contact surfaces 19 on the rotating second stage 10. The rotating second stage 10 can be configured accordingly for the integration of additional functions. The electrical components 23 can be, for example, an ESD protection diode and / or a photodiode with a monitoring function and / or an NTC as a temperature sensor and / or a capacitor as a voltage source and / or another active or passive electrical component.

[0066] However, the electrical components 23 do not have to be arranged in a cavity 28 as shown, but can also be arranged on the upper side of the rotating second stage 10 on contact surfaces 19. Furthermore, the electrical components 23 do not have to be arranged in the area "behind" the deflection elements 14 as shown, but can also be arranged in a different area on the rotating second stage 10. However, it is advantageous if the electrical components 23 are arranged on the second stage 10 in such a way that a laser light L emitted by the semiconductor laser elements 4 is not shadowed by the electrical components 23.

[0067] For the statements of the Fig. 4 to 9, as well as for all other versions, the number of semiconductor laser elements 4 and submounts 22, deflection elements 14, contact surfaces 19 and electrical components 23 as well as all other elements and components shown is to be understood as an example only and can be modified. Fig. In figures 4 to 9 this is particularly illustrated by the points "...".

[0068] The Fig. 10A to 10C each show a cross-sectional view of another embodiment of a laser package 1 according to some aspects of the proposed principle. In particular, possible embodiments of the base element 2 are shown. Fig. 10A, the base element 2 may be formed by a metallic element that is inserted into the frame element 5. According to the Fig. 10B and Fig. 10C, however, the base element 2, like the frame element 5, can have a ceramic as the main material and can be coated in some areas with a metallic coating 20 and optionally have electrical vias 21 ( Fig. 10C). In particular, areas of the base element 2 that are in contact with the frame element 5, the submount 22, and the deflecting mirror 14, as well as areas on the underside of the base element 2 that will later be in contact with a carrier substrate, can be metallically coated. The same can also apply to the base surface 6 of the frame element 5.

[0069] The vias 21 can also be used to control or operate the semiconductor laser elements 4 separately via the submount and through the base element 2. LIST OF REFERENCE SYMBOLS 1 laser package 2 floor elements 3 Arrangement area 4 half-liter laser elements 5 frame element 6 Floor area 7 circumferential steps 8 Connecting surface 9 Lid area 10 circumferential steps 11 Cover element 12 optical element 13 optical axis 14 Deflection element 15 Area 16a, 16b, 16c side surface 17a, 17b Level 18 Laser light emission area 19 Contact surface 20 metallic coating 21 vias 22 Submount 23 electrical components 24 Interior 25 Carrier substrate 26 Adhesive 27 Bonding wire 28 Cavity x direction y direction L Laser light d1, d2 distance

Claims

[1] Laser package (1) comprising: a base element (2) having an arrangement surface (3) on which at least one semiconductor laser element (4) is arranged; a frame element (5) which has a ceramic as the main material, which is connected to the base element (2) and which forms a frame which surrounds the at least one semiconductor laser element (4) in a lateral direction (x), wherein the frame element (5) has a circumferential first step (7) extending in the lateral direction from a base surface (6) with a connecting surface (8) which is at least partially connected to a part of the arrangement surface (3), and wherein the frame element (5) has a circumferential second step (10) extending in the lateral direction (x) from a cover surface (9) opposite the base surface (6); a cover element (11) which is substantially transparent to the laser light (L) emitted by the at least one semiconductor laser element (4) and which is arranged on the cover surface (9); at least one optical element (12) arranged on the cover element (11) or integrated therein; and at least one deflection element (14) which is arranged in the beam path of the at least one semiconductor laser element (4) and is designed to deflect a laser light (L) emitted by the at least one semiconductor laser element (4) in the direction of the at least one optical element (12). [2] Laser package according to claim 1, wherein an optical axis (13) of the at least one optical element (12) is tilted relative to a direction (y) perpendicular to the lateral direction (x). [3] Laser package according to claim 1 or 2, wherein the at least one deflection element (14) is designed to deflect the laser light (L) by an angle (α) of less than 90° such that at least a part of the deflected laser light (L) intersects a region (15) between the circumferential second step (10) and the cover element (11). [4] Laser package according to one of claims 1 to 3, wherein the optical axis (13) of the at least one optical element (12) is tilted in the direction of a first side surface (16a) of the frame element (5) connecting the bottom surface (6) and the cover surface (9), and wherein in particular the at least one optical element (12) adjoins a first plane (17a) running through the first side surface (16a) and is spaced from a second plane (17b) running through a second side surface (16b) of the frame element (5) opposite the first side surface (16a). [5] Laser package according to one of claims 1 to 4, wherein the laser package (1) is designed to emit laser light in a direction (y) substantially perpendicular to the lateral direction (x), and in particular has a laser light emission region (18) which is arranged off-center of the laser package (1) above the region (15) between the circumferential second step (10) and the cover element (11) and in particular is arranged adjacent to the first plane (17a). [6] Laser package according to one of the preceding claims, wherein the base element (2) substantially does not protrude beyond the base surface (6) and in particular is substantially flush with the base surface (6). [7] Laser package according to one of the preceding claims, wherein the base element (2) is arranged at a distance in the lateral direction from a third side surface (16c) of the frame element (5) which connects the base surface (6) and the connecting surface (8) to one another. [8] Laser package according to one of the preceding claims, comprising a plurality of semiconductor laser elements (4) which are arranged at a distance from one another on the base element (2) and are surrounded by the frame element (5) in the lateral direction (x). [9] Laser package according to claim 8, comprising a plurality of optical elements (12), each having an optical axis (13) which is tilted with respect to a direction (y) perpendicular to the lateral direction (x). [10] Laser package according to claim 8 or 9, comprising a plurality of deflection elements (14) which are each arranged in the beam path of one of the plurality of semiconductor laser elements (4) and are designed to deflect a laser light (L) emitted by the corresponding semiconductor laser element (4) in the direction of the at least one optical element (12). [11] Laser package according to one of claims 8 to 10, wherein contact surfaces (19) are arranged on the circumferential second stage (10) and are electrically coupled to at least one of the plurality of semiconductor laser elements (4), and wherein in particular the frame element (5) has integrated contact planes which are electrically connected to the contact surfaces (19). [12] Laser package according to one of claims 8 to 11, wherein the plurality of semiconductor laser elements (4) are coupled in series with each other. [13] Laser package according to claim 11, wherein at least two of the plurality of semiconductor laser elements (4) are each electrically coupled to at least two contact surfaces (19) on the rotating second stage (10) such that each of the at least two of the plurality of semiconductor laser elements (4) is individually operable. [14] Laser package according to one of the preceding claims, wherein the base element (2) comprises a ceramic as the main material and in particular comprises at least a partially metallic coating (20) and / or electrical vias (21). [15] Laser package according to one of the preceding claims, wherein a submount (22) is arranged between the at least one semiconductor laser element (4) and the base plate (2). [16] Laser package according to one of the preceding claims, further comprising at least one electrical component (23) which is arranged on the rotating second stage (10) or is integrated into the frame element (5) in the region of the rotating second stage (10) and is electrically coupled to contact surfaces (19) on the rotating second stage (10). [17] Laser package according to one of the preceding claims, wherein the at least one semiconductor laser element (4) is hermetically encapsulated in the interior space (24) between the base element (2), the cover element (11) and the frame element (5). [18] Laser package according to one of the preceding claims, wherein the circumferential first and / or second step (7, 10) has a different width on different sides when viewed in plan view. [19] Laser device (100) comprising a plurality of laser packages (1) according to one of the preceding claims, wherein two laser packages (1) are arranged adjacent to one another in such a way that the optical axes (13) of the optical elements (12) of the two laser packages (1) are mirrored with respect to a direction (y) perpendicular to the lateral direction (x), and in particular the first side surfaces (16a) of the two frame elements (5) are arranged adjacent to one another. [20] Laser device according to claim 19, wherein the plurality of laser packages (1) are arranged on a common carrier substrate (25), in particular a printed circuit board. [21] Method for producing a laser package (1) comprising the steps: Providing a frame element (5) which has a ceramic as the main material, wherein the frame element has a circumferential first step (7) extending from a bottom surface (6) in the lateral direction (x) and having a connecting surface (8), and wherein the frame element (5) has a circumferential second step (10) extending from a cover surface (9) opposite the bottom surface (6) in the lateral direction (x); Inserting a floor element (2) having an arrangement surface (3) into the frame element (5) such that the connecting surface (8) is at least partially connected to a part of the arrangement surface (3); Arranging at least one semiconductor laser element (4) on the arrangement surface (3) such that the frame element (5) surrounds the at least one semiconductor laser element (4) in the lateral direction (x); Arranging at least one deflection element (14) in the beam path of the at least one semiconductor laser element (4); and Providing a cover element (11) on the cover surface (9) which is substantially transparent to the laser light (L) emitted by the at least one semiconductor laser element (4) and at least one optical element (12) which is arranged on the cover element (11) or integrated therein, wherein an optical axis (13) of the at least one optical element (12) is in particular tilted with respect to a direction (y) perpendicular to the lateral direction (x); wherein the at least one deflection element (14) is designed to deflect a laser light (L) emitted by the at least one semiconductor laser element (4) in the direction of the optical element (12), and wherein the at least one deflection element (14) is designed in particular to deflect the laser light (L) by an angle (α) of less than 90° such that at least a part of the deflected laser light (L) intersects a region (15) between the rotating second step (10) and the cover element (11).

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