Fixable marking medium, method for producing the fixable marking medium, use of the fixable marking medium and system comprising a casting device / patch device and the fixable marking medium

Abstract

The fixable marking medium comprises a carrier substrate and an RFID component with an antenna structure and a chip. The RFID component is configured to store information. The antenna structure is manufactured, for example, using an etching process. The fixable marking medium can be fixed to an object.

Description

[0001] The invention relates to a fixable marking medium comprising an RFID component. The marking medium is suitable, for example, for an in-mold fixing method and / or a post-mold fixing method.

[0002] An in-mold fixation process is a casting process (e.g., injection molding) for a cast object in which a medium is introduced into, attached to, or integrated into the cast object. For example, such a marking medium could be a label that is attached to the outside of a plastic part (e.g., a beverage crate) during production. The special feature of this method is that the marking medium bonds to the plastic part through heating during the casting process. This firmly bonds the marking medium to the cast object. Consequently, this fixation process is highly resistant to temperature fluctuations, humidity, and mechanical stress.

[0003] A post-mold fixation process is a fixation method in which a marking medium is fixed to an object by applying the marking medium to the object and bonding it to the object using heat, for example, from a laser device. This process also offers high resistance to temperature fluctuations, humidity, and mechanical stress. The difference between the fixation methods is that the marking medium is fixed once during the molding of the object and once after the molding.

[0004] Today, marking media often include RFID components that contain an antenna and a chip. For this purpose, material that forms an antenna is first printed onto a mold substrate, for example a polyolefin, HDPE, or PP material. A chip is then placed onto the antenna structure using a pick-and-place process, and contact is established. The marking medium is then affixed to an object, with the RFID component located on the surface of the marking medium, which is subjected to an elevated temperature. This affixes the surface with the RFID component to the object, with the RFID component enclosed between the object and the mold substrate. Furthermore, the mold substrate can be printed with information on the side opposite the RFID component.

[0005] However, the following disadvantages may occur with the previously described marking medium and process. There is a risk of damage to the chip or antenna structure due to thermal stress. Furthermore, the feature size of a printing process for the antenna is limited. Furthermore, the level of detail and accuracy of the antenna printing process are restricted. Summary of the invention

[0006] It is an object of the invention described here to provide a fixable marking medium which contains an RFID component and has a high level of detail and accuracy of the electrical components and at the same time a reduced temperature sensitivity.

[0007] This object is achieved by the fixable marking medium having the features of claim 1, the method for producing the fixable marking medium having the features of claim 7, the method for producing the fixable marking medium having the features of claim 8, the use of the fixable marking medium having the features of claim 9, the use of the fixable marking medium having the features of claim 10, the fixing system for fixing a fixable marking medium having the features of claim 11 and the fixing system for fixing a fixable marking medium having the features of claim 12. Further advantageous embodiments and further developments are the subject of the subsequent claims.

[0008] The fixable marking medium comprises a carrier substrate and an RFID component with an antenna structure and a chip. The RFID component is configured to store information.

[0009] According to one aspect, the fixable marking medium further comprises a mold substrate configured to bond to an object under the influence of heat. The RFID component is enclosed between the carrier substrate and the mold substrate.

[0010] According to one aspect, the antenna structure is manufactured by means of an etching process.

[0011] According to one aspect, the carrier substrate has a printing surface and the RFID component is applied to the surface opposite the printing surface.

[0012] According to one aspect, the mold substrate is laminated to the carrier substrate with the RFID component.

[0013] A method for producing the fixable marking medium comprises providing the carrier substrate, providing the RFID component, providing the mold substrate, fixing the RFID component on the carrier substrate, and laminating the mold substrate on the carrier substrate and / or the RFID component.

[0014] A method for producing the fixable marking medium comprises providing the carrier substrate, providing the RFID component, providing the mold substrate, fixing the RFID component on the mold substrate, and laminating the mold substrate on the carrier substrate.

[0015] One use of the fixable marking medium includes providing the fixable marking medium for a casting process and casting an object. The fixable marking medium is provided in such a way that it is integrated into the object.

[0016] One use of the fixable marking medium includes providing the fixable marking medium for a heat-setting process, applying the fixable marking medium to an object, and heat-treating the fixable marking medium. The heat treatment is carried out in such a way that the fixable marking medium bonds to the object.

[0017] A fixing system for fixing the fixable marking medium to the object comprises a casting device for casting the object and a holding unit for holding the fixable marking medium. The holding unit holds the fixable marking medium in such a way that the fixable marking medium is integrated into the object.

[0018] A fixing system for fixing the fixable marking medium to the object comprises a holding unit for holding the fixable marking medium on the object and a patching device for heating the fixable marking medium and a surface of the object. This creates bonding points between the fixable marking medium and the object. Short description of the drawings Fig. 1 shows a front side and a back side of a fixable marking medium according to a first embodiment. Fig. 2 shows a manufacturing process of a fixable marking medium. Fig. 3 shows a use of the fixable marking medium in a casting process. Fig. Figure 4 shows a use of the fixable marking medium in a patch process. Detailed description of the embodiments

[0019] The embodiments will be described below with reference to the drawings. Note that the fixable marking medium is referred to both as a "fixable marking medium" and as a "marking medium." (First embodiment)

[0020] As in Fig. 1, the fixable marking medium 1 according to the first embodiment comprises a carrier substrate 2, an RFID component 3 and a mold substrate 4, wherein the carrier substrate 2, the RFID component 3 and the mold substrate 4 are connected to one another and the RFID component 3 is arranged between the carrier substrate 2 and the mold substrate 4. In Fig. 1 shows a back side R of the marking medium 1 in the manufactured state. The dashed rectangle in Fig. 1 shows the carrier substrate 2 located beneath the mold substrate 4. The RFID component 3 is visible through the mold substrate 4, which is transparent according to the first embodiment.

[0021] The carrier substrate 2 is, for example, a printable label material, film material, etc., which according to the first embodiment is designed in a rectangular shape. The carrier substrate 2 is printable on at least one side, such as on the front side V of the marking medium 1 in Fig. 1 is shown.

[0022] The RFID component 3 comprises an adhesive film 31, an antenna structure 32, and a chip 33. The antenna structure 32 and the chip 33 are electrically connected, thus ensuring RFID functionality. The adhesive film 31 according to the first embodiment has an adhesive covering its entire surface on one side, by means of which the antenna structure 32 adheres to the adhesive film 31. The RFID component 3 is fixed to the carrier substrate 2 by the adhesive film 31, wherein the RFID component 3 has a smaller surface area than the carrier substrate 2.

[0023] Furthermore, the antenna structure 32 is manufactured using an etching process. This means that the antenna structure 32 is not printed onto the carrier substrate 2, but rather is manufactured using the etching process and subsequently applied to the adhesive film 31. The adhesive film 31 allows the antenna structure 32 to be easily applied. The etching process has the advantage of achieving high structural accuracy and enabling more detailed and smaller structures. Furthermore, the etching process allows for higher production volumes in a shorter time than the antenna printing process.

[0024] The mold substrate 4 is applied or laminated to the carrier substrate 2 with the RFID component 3. According to the first embodiment, the RFID component 3 is completely enclosed between the carrier substrate 2 and the mold substrate 4, since the mold substrate 4 also has a larger surface area than the RFID component. The mold substrate 4 is a material that bonds to another material, e.g., plastic, under the influence of heat. According to the first embodiment, the mold substrate 4 can be made of, for example, polyolefin, PP, PE, or HDPE.

[0025] Due to the previously described structure, the marking medium 1 has the mold substrate 4 over its entire surface on the rear side R. According to this embodiment, the laminated mold substrate 4 is permanently and firmly connected to the carrier substrate 2 and the RFID component 3. Since the mold substrate 4 is provided over its entire surface on the rear side R, a full-surface connection is created under the influence of heat between the fixable marking medium 1 and an object 5 to which the marking medium 1 is fixed. (Advantages)

[0026] The fixable marking medium 1 according to the first embodiment achieves several advantages.

[0027] The etched antenna structure 32 ensures improved RFID functionality. Furthermore, the improved manufacturing process opens up further fields of application for RFID component 3.

[0028] The adhesive film 31 of the RFID component 3 can be a material that does not bond to the object 5 to which the marking medium 1 is to be attached. The laminated mold substrate 4 creates a full-surface connection between the object 5 and the marking medium 1 when they are attached to each other.

[0029] In addition, the adhesive film 31 and the mold substrate 4 represent a protective layer for the antenna structure 32 and the chip 33. If the marking medium 1 is heated from a rear side R in order to bond to the object 5, the antenna structure 32 and the chip 33 are heated to a lesser extent because the adhesive film 31 and the mold substrate 4 are located between the heat source and the antenna structure 32 and the chip 33. The probability of damage to the RFID component 3 and temperature sensitivity of the marking medium 1 can thus be reduced. (Second embodiment)

[0030] A marking medium 1 according to a second embodiment has the same structure as the marking medium 1 according to the first embodiment. Only the difference between the first and second embodiments will be described below.

[0031] According to the first embodiment, the RFID component 3 adheres to the carrier substrate 2. In contrast, the RFID component 3 of the second embodiment adheres to the mold substrate 4, i.e., the adhesive of the adhesive film 31 faces the back side R.

[0032] Furthermore, it is possible that the RFID component 3 is enclosed with a separate adhesive or only in a form-fitting manner between the carrier substrate 2 and the mold substrate 4.

[0033] The fixable marking medium 1 according to the second embodiment achieves the same advantages as the fixable marking medium 1 according to the first embodiment. (Third embodiment)

[0034] A marking medium 1 according to a third embodiment has a different structure than the marking medium 1 according to the first or second embodiment.

[0035] In contrast to the first and second embodiments, the marking medium 1 of the third embodiment does not have a mold substrate 4. This means that the RFID component 3 is fixed to the carrier substrate 2 and is exposed on the back side R.

[0036] In this case, the carrier substrate 2 is a material which, like the mold substrate 4, bonds to an object 5 under the influence of heat. Since the mold substrate 4 is not provided and the adhesive film 31 of the RFID component according to this embodiment does not bond under the influence of heat, no full-surface connection is created between the fixable marking medium 1 and the object 5 during a fixing process. Nevertheless, the fixable marking medium 1 can be fixed to the object 5 according to the third embodiment.

[0037] In addition, similar advantages to those in the first and second embodiments can be achieved. For example, there is also a lower temperature sensitivity because the adhesive film 31 is located between the heat source and the antenna structure 32 and the chip 33. Furthermore, the antenna structure 32 according to the third embodiment is also manufactured using the etching method. (Procedure)

[0038] The fixable marking medium 1 is, as in Fig. 2 shown, manufactured.

[0039] First, the carrier substrate 2 is provided. The RFID component 3 is applied to the carrier substrate 2, wherein the RFID component 3 is fixed to the carrier substrate 2 by means of the adhesive film 31. The RFID component 3 has a smaller surface area than the carrier substrate 2. The RFID component 3 can be aligned essentially centrally with respect to the carrier substrate 2 during application. However, the application position can be freely selected depending on the application. This step corresponds to step A1.

[0040] Step A1 is followed by step A2, in which the mold substrate 4 is laminated to the carrier substrate 2 with the RFID component 3. An adhesive is applied over the entire surface of the back of the carrier substrate 2 with the RFID component 3, and then the mold substrate 4 is placed over the entire surface on the back side R. The adhesive permanently and firmly bonds the components to one another. This process is referred to as laminating the mold substrate 4.

[0041] According to the previously described embodiments, the mold substrate 4 is transparent. This makes it possible to use a UV adhesive as an adhesive during lamination. Once the adhesive has cured, the mold substrate 4 is permanently fixed to the carrier substrate 2 with the RFID component 3.

[0042] The described method serves to produce the fixable marking medium 1 according to the first embodiment. The method can be adapted accordingly to produce the fixable marking media 1 according to the second and third embodiments.

[0043] Furthermore, it is possible to fix a plurality of RFID components 3 on a carrier substrate 2 and then laminate the mold substrate 4. Subsequently, either a fixable marking medium 1 is created, which has a plurality of RFID components 3, or punching, cutting, perforation, etc., can be carried out to create a plurality of individual fixable marking media 1. (Use - In-Mould)

[0044] Depending on the materials used, the fixable marking medium 1 can be used for an in-mould and / or a post-mould process.

[0045] In the in-mould process, the fixable marking medium 1 is connected to or integrated into an object 5 during a casting process. Fig. 3 shows an example of an injection molding process.

[0046] In step B1, the marking medium 1 is inserted or placed in a casting device 6 and held in a predetermined position. The back side R of the marking medium 1 faces toward the interior of the casting device 6. The printed front side V of the marking medium 1 faces away from the interior of the casting device 6 and rests against the inner wall of the casting device 6.

[0047] In step B2, the molding device is closed, and an injection of, for example, a liquid plastic material is performed. This material fills the interior of the molding device 6 to form the object 5. The liquid and heated plastic material comes into contact with the marking medium 1. The heat generated bonds the liquid plastic forming the object 5 to the mold substrate 4 of the marking medium 1. This can cause vulcanization between the materials, permanently bonding them to one another at their surfaces.

[0048] In step B3, the solidified object 5 is removed from the casting device 6. The marking medium 1 is permanently fixed to the object 5. The front side V of the marking medium 1 is exposed to the outside. This exposes the printed surface of the marking medium 1.

[0049] However, it is also possible to completely cast the marking medium 1 into the object 5. In this case, either a transparent casting material is present or the marking medium 1 has no printing or at least no printing that will be required later.

[0050] It should be mentioned again that the RFID component 3 is protected from thermal stress during molding, since the mold substrate 4 but not the RFID component 3 comes into direct contact with the liquid plastic.

[0051] Together, the casting device 6 and the fixable marking medium 1 form a fixing system for fixing the fixable marking medium 1 to the object 5. (Use - Post-Mould)

[0052] The post-mold process differs from the in-mold process in that the marking medium 1 is not fixed during the casting process, but after the casting process. Nevertheless, the post-mold process is also based on a thermosetting principle. The post-mold process is Fig. 4 illustrates.

[0053] In step C1 of the post-mold process, the fixable marking medium 1 and the object 5 are provided. The marking medium 1 is placed or held on the object 5 at a predetermined position. The front side V of the marking medium 1 faces away from the object 5, while the back side R of the marking medium 1 faces the object.

[0054] In step C2, for example, a patch device 7 is provided. The patch device 7 can, for example, be a laser. Specific positions or areas of the marking medium 1 located on the object 5 can be irradiated with the laser. This is referred to below as a "patch". As a result, the mold substrate 4, which here can be a sealable film, for example, also heats up on the back R of the marking medium 1. The surface of the object 5 at the irradiated points is also heated. At the points thus heated, a connection point 8 is formed, at which the mold substrate 4 and the object 5 are permanently connected. The laser can, for example, be applied circumferentially, so that a connection point 8 is created or formed around the marking medium 1.

[0055] After step C2, the fixable marking medium 1 is permanently connected to the object 5 by the connection point 8 or the plurality of connection points 8.

[0056] It should be mentioned that the RFID component 3 is protected from thermal stress during patching, since the mold substrate 4 but not the RFID component 3 comes into direct contact with the heated surface of the object 5.

[0057] Together, the patch device 7 and the fixable marking medium 1 form a fixing system for fixing the fixable marking medium 1 to the object 5. The patch device 7 can be any suitable device capable of generating point-like or area-wide heating on the exterior of the marking medium 1 and the object. This means that the patch device 7 is not necessarily a laser. (Modifications)

[0058] According to the previously described embodiments, a carrier substrate 2 and a mold substrate 4 are provided. Although different terms are used for the carrier substrate 2 and the mold substrate 4, both can be made of the same material.

[0059] The fixable marking medium 1 has been described as rectangular. However, the shape of the fixable marking medium 1 can be arbitrary.

[0060] Furthermore, the carrier substrate 2 was described as printable. The carrier substrate 2 does not necessarily have to be printable and may have two non-printable surfaces.

[0061] The carrier substrate 2, the RFID component 3, and the mold substrate 4 have been described as being permanently connected to one another. This is advantageous if a permanent marking on the object 5 is to be achieved using the fixable marking medium 1. However, it is possible to appropriately adjust the stability and strength of the connection and thus also create a connection that is not permanent. Likewise, a connection surface or the connection points between the object 5 and the marking medium 1 can be appropriately adjusted.

[0062] Furthermore, the mold substrate 4 was described as being applied over the entire surface. The mold substrate 4 can have any suitable shape and does not necessarily have to be applied over the entire surface. For example, the mold substrate 4 can be applied exclusively to the adhesive film 31. Furthermore, as described in the third embodiment, the mold substrate 4 can be omitted. (List of reference symbols) 1 marking medium 2 Carrier substrate 3 RFID component 31 adhesive film 32 Antenna structure 33 chips 4 Mould substrate 5 Object 6 Casting device 7 Patch device 8 Connection point V front R back

Claims

[1] Fixable marking medium (1), comprising: a carrier substrate (2), an RFID component (3) having at least one antenna structure (32) and one chip (33), wherein the RFID component (3) is configured to store information. [2] Fixable marking medium (1) according to claim 1, further comprising: a mould substrate (4) which is configured to bond to an object (5) under the influence of heat, and the RFID component (3) is enclosed between the carrier substrate (2) and the mold substrate (4). [3] Fixable marking medium (1) according to claim 1 or claim 2, wherein the antenna structure (32) is produced by means of an etching process. [4] Fixable marking medium (1) according to one of claims 1 to 3, wherein the RFID component (3) has an adhesive film (31) to which at least the antenna adheres, and the RFID component (3) is fixed to the carrier substrate (2) by means of the adhesive film (31). [5] Fixable marking medium (1) according to one of claims 1 to 4, wherein the carrier substrate (2) has a printing surface and the RFID component (3) is applied to the surface opposite to the printing surface. [6] Fixable marking medium (1) according to one of claims 1 to 5, wherein the mold substrate (4) is laminated onto the carrier substrate (2) with the RFID component (3). [7] A method for producing a fixable marking medium (1) according to one of claims 1 to 6, comprising: Providing a carrier substrate (2), Providing an RFID component (3), Providing a mold substrate (4), Fixing the RFID component (3) on the carrier substrate (2), and Laminating the mold substrate (4) on the carrier substrate (2) and / or the RFID component (3). [8] A method for producing a fixable marking medium (1) according to one of claims 1 to 6, comprising: Providing a carrier substrate (2), Providing an RFID component (3), Providing a mold substrate (4), Fixing the RFID component (3) on the mold substrate (4), and Laminating the mould substrate (4) onto the carrier substrate (2). [9] Use of a fixable marking medium (1) according to one of claims 1 to 6, comprising: Providing the fixable marking medium (1) for a casting process, Casting an object (5), wherein the fixable marking medium (1) is provided in such a way that it is integrated into the object (5). [10] Use of a fixable marking medium (1) according to one of claims 1 to 6, comprising: Providing the fixable marking medium (1) for a heat fixing process, Applying the fixable marking medium (1) to an object (5), heat-treating the fixable marking medium (1) such that the fixable marking medium (1) bonds to the object (5). [11] Fixing system for fixing a fixable marking medium (1) according to one of claims 1 to 6 to an object (5), comprising: a casting device (6) for casting the object (5), a holding unit for holding the fixable marking medium (1), wherein the holding unit holds the fixable marking medium (1) in such a way that the fixable marking medium (1) is integrated into the object (5) during casting of the object (5). [12] Fixing system for fixing a fixable marking medium (1) according to one of claims 1 to 6 to an object (5), comprising: a holding unit for holding the fixable marking medium (1) on the object (5), a patch device (7) for heating the fixable marking medium (1) and a surface of the object (5) so that connection points (8) are formed between the fixable marking medium (1) and the object (5).

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