Media-robust sensor

Abstract

Sensor (1) for measuring state variables in a medium, comprising a housing (2, 3) designed for mounting on a container, wherein the housing (2, 3) has a through-opening (4) extending from a first housing side (5) to a second housing side (6), wherein a carrier (7) is guided from the first housing side (5) into the through-opening (4), wherein a seal (10) is arranged in the through-opening (4) between the carrier (7) and the housing (2, 3), wherein the seal (10) annularly surrounds a portion of the carrier (7) and seals the through-opening (4) between the carrier (7) and the housing (2, 3), wherein the carrier (7) is arranged with a first carrier section (8) on the first side of the through-opening (4), wherein a sensor element (20) is arranged on the first carrier section (8), wherein the sensor element (20) has electrical contacts (21).wherein the electrical contacts (21) are connected to electrical conductors (22), wherein the electrical conductors (22) are arranged on the carrier (7), wherein the electrical conductors (22) are guided from the electrical contacts (21) via the seal (10) to a second carrier section (9), and wherein the electrical contacts (21) and the electrical conductors (22) are designed to be media-resistant and / or are protected against the medium by a protective layer (23).

Description

[0001] The present invention relates to a media-robust sensor for measuring state variables in a medium. State of the art

[0002] Media-robust sensors for measuring state variables in a medium are already known from the state of the art.

[0003] The measurement of state variables, such as pressure, in a medium with a high moisture content and / or other corrosive substances is usually carried out using sensors that have an additional coupling volume to transmit the pressure to the actual sensor element. The change in the medium to be measured is transmitted to a membrane using a coupling medium, such as oil, located in the reference volume and is then recorded using piezoresistive resistors or by capacitance measurements in the area of ​​the sensor membrane. With these sensors, it is not possible to record a change in the state variables directly in the medium, as the sensor element measures the change in the reference volume via a coupling medium. This requires a reference volume, which is complex to manufacture, and an additional membrane to record the changes in the medium. Disclosure of the invention

[0004] The object of the invention is therefore to provide an improved media-robust sensor for measuring state variables directly in a medium. The sensor has the particular task of exhibiting good resistance to damaging substances in a medium, especially moisture, and being able to be in direct contact with the medium. This enables improved measurement of changes in state variables.

[0005] The object is achieved by a media-robust sensor of claim 1. Advantageous embodiments are the subject of the dependent claims.

[0006] According to one aspect of the invention, a sensor for measuring state variables in a medium is provided. The sensor has a housing designed for mounting on a container. The housing has a through-opening that extends from a first housing side to a second housing side. The sensor further comprises a carrier that is guided from the first housing side into the through-opening. Furthermore, a seal is arranged in the through-opening between the carrier and the housing. The seal surrounds a partial section of the carrier in a ring shape and seals the through-opening between the carrier and the housing. The carrier is arranged with a first carrier section on the first housing side. A sensor element is arranged on the first carrier section. The sensor element has electrical contacts. The electrical contacts are connected to electrical lines.The electrical lines are arranged on the carrier, and the electrical lines are routed from the electrical contacts via the seal to a second carrier section. Furthermore, the electrical contacts and electrical lines are designed to be media-robust and / or protected from the medium with a protective layer.

[0007] This design has the advantage that a first support section, on which the sensor element is arranged, can protrude directly into the medium for condition measurement. The seal ensures that harmful substances in the medium, such as moisture, cannot penetrate the housing. This offers the advantage that only the electrical contacts of the sensor element, the other electrical contacts of the support, and the electrical cables need to be robustly designed to withstand harmful substances in the medium. The processing and evaluation of the electrical signals can be carried out in a space that is separated from the medium by the seal. Consequently, no special additional protection against the medium is required.

[0008] In an advantageous embodiment, the seal is hermetically sealed. The seal is therefore preferably airtight. The seal can be made at least partially, but also entirely, of glass. This offers the advantage that the space for evaluating the sensor signal is particularly well protected against penetration by the medium.

[0009] In another embodiment, the contacts and / or the lines are covered with a protective layer. The protective layer serves to prevent direct contact between the electrical contacts and / or the electrical lines and the medium. This offers the advantage that harmful substances, such as fungus, cannot attack the electrical contacts and / or the electrical lines.

[0010] In another embodiment, the protective layer consists at least partially or entirely of glass. This offers the advantage that the electrical contacts and / or electrical lines are hermetically separated from the medium. Thus, the electrical contacts and / or electrical lines are hermetically sealed against the medium.

[0011] In a further embodiment, the electrical contacts and / or the electrical lines are made of an inert material, particularly gold. This offers the advantage that the signals from the sensor element can be transmitted particularly well via the electrical contacts and / or the electrical lines. Furthermore, this provides particularly good corrosion protection.

[0012] In a further embodiment, the sensor element is arranged on a first support side. A first sensor end piece protrudes laterally beyond the first support side. A measuring element of the sensor element is formed, in particular, on the first sensor end piece. This offers the advantage that the measuring element of the sensor element can protrude freely into the media space. This significantly reduces stresses that can be transferred from the support to the sensor element. Consequently, very high sensor accuracy is enabled.

[0013] In a further embodiment, the sensor element with its electrical contacts rests on additional electrical contacts of the carrier. A circumferential frame is formed between the sensor element and the carrier. The frame surrounds the electrical contacts and the additional electrical contacts in a ring-like manner. A contact area is formed within the frame, which is sealed from the medium by the frame. This offers the advantage that the electrical contacts of the sensor element and the additional electrical contacts of the carrier can be connected to one another, for example with a solder joint. The resulting electrical contact area is protected and sealed from the medium by means of the frame, for example a solder frame.

[0014] In a further embodiment, the sensor element is designed to detect a pressure and / or a temperature and / or a flow velocity and / or a gas concentration. This offers the advantage that the sensor can be used not only to measure one state variable, but also to detect multiple state variables simultaneously.

[0015] In a further embodiment, the sensor element is designed as a MEMS sensor.

[0016] In another embodiment, the carrier comprises a ceramic substrate. Furthermore, the carrier and the electrical lines are formed integrally. The carrier serves as a matrix for the electrical lines, and the electrical lines can be protected within the carrier. This offers the advantage that the carrier is particularly rigid and not susceptible to changes in the medium's state, and the electrical lines do not require any special additional protection.

[0017] In a further embodiment, the sensor element is mechanically and firmly attached to the carrier with a glass layer. The electrical contacts of the sensor element and the other electrical contacts of the carrier are implemented, for example, with bonding wires, with the bonding wires and the electrical contacts being passivated with a glass layer. This offers the advantage that the mechanical attachment, or positioning of the sensor element, and the passivation of the electrical contacts and the bonding wires can be realized in a single manufacturing step.

[0018] In a further embodiment, the sensor serves to measure a state variable in a humid environment and / or in a hydrogen environment. The sensor can be designed, in particular, for measuring state variables in a fuel cell.

[0019] The invention is explained in more detail below with reference to the figures. These show: -Fig. 1 a cross-section of a sensor in an exemplary embodiment. - Fig. 2 a sectional view along a Fig. 1 shown section plane AA through the sensor. - Fig. 3 a sectional view along a Fig. 1 shown section plane BB through the sensor. - Fig. 4 a perspective partial view of a sensor with a first carrier section and a possible media-robust and mechanical connection of the sensor element to the carrier. - Fig. 5 a top view of a partial representation of a sensor with a first carrier section and another possible mechanical and media-robust connection of the sensor element to the carrier. - Fig. 6 a side view of the Fig. Partial representation of a sensor shown in Figure 5. - Fig. 7 a side view of a partial representation of a sensor with a first carrier section and another possible mechanical and media-robust connection of the sensor element to the carrier. - Fig. 8 a plan view of the Fig. Partial representation of a sensor shown in Figure 7. - Fig. 9 a side view of a partial representation of a sensor with a first carrier section and another possible mechanical and media-robust connection of the sensor element to the carrier. - Fig. 10 is a perspective sectional view of another exemplary embodiment of a sensor. - Fig. 11 is a perspective view of another exemplary embodiment of a sensor.

[0020] Fig. 1 shows the side view of a sensor 1 in an exemplary embodiment.

[0021] The sensor 1 has, for example, a first housing 2 and a second housing 3. The sensor 1 is not limited to consisting of two housings. It can, for example, also consist of one housing or several housings. The first housing 2 is made, for example, of plastic, while the second housing 3 is made, for example, of a metallic material. The first housing 2 and the second housing 3 can be connected in different ways. They can, for example, be welded or clipped together. The second housing 3 has a through-opening 4 which extends from a first housing side 5 to a second housing side 6. The through-opening 4 has, for example, a round cross-section perpendicular to its longitudinal axis. However, the through-opening 4 is not limited to having a round cross-section.The cross-section can take on different geometric shapes and be, for example, triangular, square, or even oval. The second housing 3 is designed so that it can be mounted on a container. For this purpose, a thread can be provided on the second housing 3, for example. A carrier 7 is guided from the first housing side 5 into the through-opening 4. In one embodiment, the carrier 7 consists of a ceramic substrate. The carrier 7 can also be made of glass or silicon carbide, for example. The material for the carrier 7 can be an insulator and have good resistance to heat and corrosion.

[0022] It is further provided that a partial section of the carrier 7 is enclosed by a seal 10 in the through-opening 4. The seal 10 serves to seal the through-opening 4 between the carrier 7 and the second housing 3. In an exemplary embodiment, the seal 10 consists of a glass substrate or of glass. The seal 10 is not limited to being made of glass. It is also conceivable to manufacture the seal from a plastic that has low air permeability. The seal 10 is preferably hermetically sealed, i.e., the seal is impermeable to air. Furthermore, it is possible to additionally protect the seal 10, for example against heat, with a first insulating layer 57 and a second insulating layer 58.In this case, a first insulating layer 57 can be arranged above the seal 10 from a second housing side 6 and a second insulating layer 58 can be arranged below the seal 10 from a first housing side 5. In this embodiment, the seal 10 is thus surrounded on both sides by the first insulating layer 57 and the second insulating layer 58, as an example. The carrier 7 is divided into a first carrier section 8 and a second carrier section 9 with the aid of the seal 10 and optionally with the first insulating layer 57 and the second insulating layer 58. A sensor element 20 is provided on the first carrier section 8, which can, for example, protrude directly into a media space from the first housing side 5, i.e. can be in direct contact with a medium. The second carrier section 9 is arranged on the second housing side 6, i.e. outside the media space.The sensor element 20 can, for example, be designed as a MEMS sensor.

[0023] It is possible to use the sensor element 20 to detect, for example, a pressure and / or a temperature and / or a flow velocity and / or a gas concentration in the medium. The sensor element 20 has electrical contacts, wherein the electrical contacts serve to be connected to electrical lines 22. The electrical lines 22 are arranged on the carrier 7, wherein the electrical lines 22 are guided from the electrical contacts via the seal 10 to the second carrier section 9. Furthermore, the electrical contacts and the electrical lines 22 are preferably designed to be robust to the medium and / or can be protected from the medium with a protective layer.

[0024] The seal 10, or optionally the first insulating layer 57, together with the first housing 2 and the second housing 3, defines a space 53. For example, a printed circuit board 50, an electrical evaluation unit 51, clamping elements 52, an electrically conductive spring element 55, and a mounting plate 56 can be provided in the space 53. The carrier 7 projects into the space 53 with the second carrier section 9. The second carrier section 9 can be electronically connected to the printed circuit board 50 using clamping elements 52. The connection of the second carrier section 9 to the printed circuit board 50 is not limited to being realized with clamping elements 52. Different types of electrical contact between the second carrier section 9 and the printed circuit board 50 are conceivable. An electrical evaluation unit 51 can be provided on the printed circuit board 50. The electrical evaluation unit 51 serves to evaluate the signals of the sensor element 20.The evaluated signals of the electrical evaluation unit 51 can be transmitted to a sensor connection 54, for example, using an electrical spring element 55 which is electrically connected to the circuit board 50.

[0025] Fig. 2 shows a sectional view along a Fig. 1 shown section plane AA through a sensor 1.

[0026] In the Fig. Figure 2 shows an exemplary arrangement of the circuit board 50. The circuit board 50 can be, for example, a PCB circuit board. Different types of circuit boards can be used, for example, an FPC circuit board. The clamping elements 52 are electrically connected to the circuit board 50. The electrical evaluation unit 51 can be mounted on the circuit board 50. The electrical evaluation unit 51 can be, for example, an ASIC unit that serves to evaluate the signals from the sensor element 20. The evaluation of the sensor signal using an ASIC unit is thus located outside the media space. There is therefore no need to equip the circuit board 50, the electrical evaluation unit 51, and the clamping elements 52 with additional protective measures against moisture, hydrogen, or other media.Consequently, the connections of the clamping elements 52 and the electrical evaluation unit 51 to the circuit board 50 can be realized with less complexity.

[0027] Fig. 3 shows a sectional view along a Fig. 1 shown section plane BB through the sensor 1.

[0028] The through-hole 4 is filled by the carrier 7 and the seal 10. The clamping elements 52 are attached to the carrier 7. The clamping elements 52 serve to transmit the electrical signal transmitted via the carrier 7 to the printed circuit board 50. The contact between the carrier 7 and the printed circuit board 50 is not limited exclusively to the clamping elements 52. Various contact options between the printed circuit board 50 and the carrier 7 are conceivable. For example, a soldered connection can also be provided between the carrier 7 and the printed circuit board 50.

[0029] Fig. 4 shows a perspective partial view of a sensor 1 with a first carrier section 8 and a possible media-robust and mechanical connection of the sensor element 20 with the carrier 7.

[0030] In Fig. 4 shows an exemplary connection of the sensor element 20 to the first carrier section 8. The sensor element 20 can, for example, be designed as a MEMS sensor and have a measuring element 27. Several measuring elements 27 can also be present on the sensor element 20. The measuring element 27 can serve to detect different state variables and changes in the state variables in the medium, for example a pressure, and / or a temperature, and / or a flow velocity, and / or a gas concentration. The sensor element 20 can have electrical contacts 21. The carrier 10 has, for example, further electrical contacts 28. The electrical contacts 21 can be connected via bonding wires 35 to the further electrical contacts 28 of the carrier 7 for transmitting a sensor signal. The bonding wires 35 can, for example, be made of gold.The bond wires 35 can be made of different electrically conductive materials, such as tungsten or copper. The bond wires 35, the electrical contacts 21, and the additional electrical contacts 28 can be completely covered with a protective layer 23 and protected from the environment. The protective layer 23 encloses the part of the sensor element 20 where the electrical contacts 21 are arranged. The bond wires 35 are also enclosed by the protective layer 23. Starting from the electrical contacts 21, the protective layer 23 continues in the direction of the additional electrical contacts 28 located on the carrier 7. The protective layer 23 thus at least partially encloses the sensor element 20. The protective layer 23 completely covers the electrical contacts 21, the bond wires 35, the additional electrical contacts 28, and is arranged on the surface of the carrier 7.The protective layer 23 thus also serves to mechanically fasten the sensor element 20 to the carrier 7. Furthermore, the sensor element 20 can be mechanically fastened to the carrier 7 via a connecting layer 24 that supports the protective layer 23. The connecting layer 24 is located between the carrier 7 and the sensor element 20. The connecting layer 24 can be designed, for example, as an adhesive layer. It is also conceivable for the protective layer 23 and the connecting layer 24 to be designed as a common layer and from the same material. For example, it is possible to design the protective layer 23 and the connecting layer 24 as a common glass layer 30.

[0031] In this exemplary embodiment, the electrical lines 22 up to the further electrical contacts 28 are integrated in the carrier 7. It is also conceivable for the electrical lines 22 to protrude from the carrier 7 and be connected directly to the electrical contacts 21. In this example, electrical lines 22 up to the further electrical contacts 28 are routed within the carrier 7. The carrier 7 serves as a matrix for the electrical lines 22. This offers the advantage that the electrical lines 22 do not require any additional protection from the medium. In one embodiment, the electrical lines 22 do not run within the carrier 7, but are arranged on the surface of the carrier 7. In this case, the electrical lines 22 can also be covered by a protective layer 23 in order to be protected from the medium.

[0032] Fig. 5 shows a top view of a partial representation of a sensor 1 with a first carrier section 8 and a further possible mechanical and media-robust connection of the sensor element 20 to the carrier 7.

[0033] In this exemplary embodiment, two measuring elements 27 are provided on a first sensor end piece 25. The electrical contacts 21 of the sensor element 20 are located on a second sensor end piece 26. The sensor element 20 can protrude beyond a first carrier side 11 of the carrier 7 with a first sensor end piece 25. In this embodiment, the sensor element 20 protrudes beyond the first carrier side 11 with more than half of its surface area, for example. The sensor element 20 can also protrude beyond the first carrier side 11 with half of its surface area or one third of its surface area. In this exemplary embodiment, it is advantageous that the measuring elements 27 on the first sensor end piece 25 of the sensor element 20 are arranged laterally spaced from the first carrier side 11.This means that the sensor element 20 can protrude freely into the medium, at least with the first sensor end piece 25, and the two measuring elements 27 can measure state variables without the influence of the carrier 7, or with a reduced influence of the carrier. It is also conceivable for the sensor element 20 to be positioned differently and for the first sensor end piece 25 to protrude beyond the first carrier side 11 in a different direction.

[0034] The second sensor end piece 26 is arranged above the carrier 7. The electrical contacts 21 are arranged on the carrier 7. For example, the electrical lines 22 run within the carrier 7; they can also run on the surface of the carrier 7. The electrical lines 22 are led to the further electrical contacts 28 of the carrier 7. The electrical contacts 21 and the further electrical contacts 28 are connected, for example, via bonding wires 35. The second sensor end piece 26, the electrical contacts 21, the further electrical contacts 28, and the bonding wires 35 are surrounded by a protective layer 23. The protective layer 23 also serves as a mechanical connection between the sensor element 20 and the carrier 7. For example, the protective layer 23 can be designed as a glass layer 30.

[0035] Fig. 6 shows a side view of the Fig. 5 shows a partial representation of a sensor 1.

[0036] In Fig. 6 protrudes, as previously in Fig. 5, the sensor element 20 with a first end piece 25 and the measuring elements 27 extends beyond the first carrier side 11. The protective layer 23, in particular the glass layer 30, covers the sensor element 20, in particular a second sensor end piece 26, the electrical contacts 21, the bonding wires 35, and the further electrical contacts 28. In this embodiment, the sensor element 20 does not lie directly on the carrier 7. Consequently, there is no direct contact between the sensor element 20 and the carrier 7. In this embodiment, the connection between the sensor element 20 and the carrier 7 is realized via a connecting layer 24. The connecting layer 24 is exemplified as part of the protective layer 23 and can therefore also be realized as a glass layer 30.The advantage of this embodiment is that the mechanical attachment of the sensor element 20 to the carrier 7 and the passivation of the electrical contacts 21, the additional electrical contacts 28, and the bonding wires 35 can be performed in a single manufacturing step. Furthermore, the connecting layer 24 achieves mechanical and / or thermal decoupling of the sensor element 20 from the carrier 7.

[0037] Fig. 7 shows a side view of a partial representation of a sensor 1 on a first carrier section 8 and a further possible mechanical and media-robust connection of the sensor element 20 on the carrier 7.

[0038] In this embodiment, the sensor element 20 protrudes, analogous to Fig. 5 and Fig. 6, with a first sensor end piece 25 beyond a first carrier side 11. A measuring element 27 is provided on the first sensor end piece 25. The electrical contacts 21 are provided on the second sensor end piece 26. The electrical contacts 21 of the sensor element 20 are arranged on the surface of the carrier 7. The further electrical contacts 28 are located on the surface of the carrier 7. The sensor element 20 is arranged such that the electrical contacts 21 and the further electrical contacts 28 can be connected directly to one another. The connection of the electrical contacts 21 and the further electrical contacts 28 can be realized, for example, with a soldered connection. An advantage of this embodiment is that no bonding wires are required to connect the electrical contacts 21 and the further electrical contacts 28.The soldered connection between the electrical contacts 21 and the additional electrical contacts 28 exhibits good resistance to a medium. Consequently, the electrical contacts 21 and the additional electrical contacts 28 do not necessarily require a protective layer. The soldered connection also provides a mechanical attachment of the sensor element 20 to the carrier 7. Consequently, it is also not necessary to provide a connecting layer in this embodiment. Fig. 8 shows a top view of the partial representation of the sensor 1 shown in Fig. 7

[0039] The electrical contacts 21 and the further electrical contacts 28 are as previously in Fig. 7, for example, electrically connected by means of a solder connection and mechanically fastened to the carrier 7. Furthermore, in this embodiment, a circumferential frame 40 can be provided around the electrical contacts 21 and the further electrical contacts 28. The circumferential frame 40 rests circumferentially on the sensor element 20 and circumferentially on the carrier. The circumferential frame 40 serves, for example, as protection for the electrical contacts 21 and the further electrical contacts 28 from the medium and delimits a contact area 45. Furthermore, the circumferential frame 40 can serve as an additional mechanical fastening of the sensor element 20 to the carrier 7. The circumferential frame 40 can, for example, be designed as a solder frame.

[0040] Fig. 9 shows a side view of a partial representation of a sensor 1 with a first carrier section 8 and a further possible mechanical and media-robust connection of the sensor element 20 to the carrier 7.

[0041] The electrical contacts 21 of the sensor element 20 are arranged on a first sensor element side 13, and the measuring element 27 is arranged on a second sensor element side 14. In this embodiment, the sensor element 20 rests over its entire surface on the carrier 7. The sensor element 20 is positioned such that the electrical contacts 21 and the further electrical contacts 28 abut one another. A connection of the electrical contacts 21 and the further electrical contacts 28 would be possible in this embodiment via a through-hole connection 59, in particular a silicon through-hole connection. It would also be conceivable in this embodiment to provide a circumferential frame 40 around the sensor element 20 and the carrier 7. The circumferential frame 40 can again serve to improve the mechanical fastening of the sensor element 20 to the carrier 7 and additionally protect the electrical contacts 21 and the further electrical contacts 28 from the medium.

[0042] Fig. 10 shows a perspective sectional view of another exemplary embodiment of the sensor 1.

[0043] The housing consists of a first housing 2 and a second housing 3. The structure and design of the second housing 3 is analogous to that in Fig. 1. A sensor element 20 is provided on the first carrier section 8. The sensor element 20 can, for example, be media-robustly and mechanically connected to the first carrier section 8 in one of the ways explained above. The carrier 7 is guided from a first housing side 5 into the through-opening 4. The through-opening 4 and a partial section of the carrier 7 are enclosed by a seal 10. Furthermore, a first insulating layer 57 and a second insulating layer 58 can be provided. A second carrier section 9 projects into the first housing 2. In this embodiment, the first housing 2 is angled. The printed circuit board 50 and the carrier 7 are oriented in the same direction, by way of example. The carrier 7 is connected to the printed circuit board 50 at its second carrier section 9. The sensor connection 54 is arranged in a transverse direction to the printed circuit board 50 and is electrically connected to it.

[0044] Fig. 11 shows a perspective view of another embodiment of the sensor 1.

[0045] The sensor 1 has, for example, a first housing 2 and a second housing 3. The first housing 2 can be made of plastic and can be attached to the second housing 3, for example, by welding. The second housing 3 consists, for example, of a metallic material. A thread 60 can be provided on the second housing 3 for connecting the sensor 1 to a container. To simplify the screw connection of the second housing 3 to a container, the second housing 3 can, for example, have a hexagon shape 65. This makes it possible for the sensor 1 to be securely attached to the container with the aid of a tool, in particular a hexagon wrench, via the hexagon shape 65 and the thread 60. A through-opening 4 is again provided in the second housing 3. The carrier 7 is guided from the first housing side 5 into the through-opening 4.It is further provided that in the through-opening 4, a partial section of the carrier 7 is enclosed by a seal 10. The seal 10 delimits a first carrier section 8 and a second carrier section 9. A sensor element 20 with a measuring element 27 is provided on the first carrier section 8. The sensor element 20 has electrical contacts 21, wherein the electrical contacts 21 serve to be connected to electrical lines 22. The electrical lines 22 run, for example, within the carrier 7 and are guided from a first carrier section 8 via the seal 10 to a second carrier section 9. The electrical lines 22 are connected to the electrical contacts 21 of the sensor element 20 via bonding wires 35. The sensor element 20, the electrical contacts 21 and the bonding wires 35 are mechanically and media-robustly attached to the first carrier section 8 via a protective layer 23, in particular glass layer 30.The second support section 9 extends into a chamber 53, which is hermetically separated from the medium by the seal 10. In this chamber, it is possible to evaluate and transmit the sensor signals without providing special protection against the medium.

Claims

[1] A sensor (1) for measuring state variables in a medium, comprising a housing (2, 3) designed for mounting on a container, wherein the housing (2, 3) has a through-opening (4) extending from a first housing side (5) to a second housing side (6), wherein a carrier (7) is guided from the first housing side (5) into the through-opening (4), wherein a seal (10) is arranged in the through-opening (4) between the carrier (7) and the housing (2, 3), wherein the seal (10) surrounds a partial section of the carrier (7) in an annular manner and seals the through-opening (4) between the carrier (7) and the housing (2, 3), wherein the carrier (7) is arranged with a first carrier section (8) on the first side of the through-opening (4), wherein a sensor element (20) is arranged on the first carrier section (8), wherein the sensor element (20) has electrical contacts (21),wherein the electrical contacts (21) are connected to electrical lines (22), wherein the electrical lines (22) are arranged on the carrier (7), wherein the electrical lines (22) are guided from the electrical contacts (21) via the seal (10) to a second carrier section (9), and wherein the electrical contacts (21) and the electrical lines (22) are designed to be media-robust and / or protected from the medium by a protective layer (23). [2] Sensor (1) according to claim 1, wherein the seal (10) is hermetically sealed and in particular comprises glass or is made of glass. [3] Sensor (1) according to one of the preceding claims, wherein the electrical contacts (21) and / or the electrical lines (22) are covered with a protective layer (23), wherein the protective layer (23) prevents direct contact between the electrical contacts (21) and / or the electrical lines (22) and the medium. [4] Sensor (1) according to claim 3, wherein the protective layer (23) comprises glass and / or consists of glass. [5] Sensor (1) according to one of the preceding claims, wherein the electrical contacts (21) and / or the electrical lines (22) are formed from an inert material, in particular gold. [6] Sensor (1) according to one of the preceding claims, wherein the sensor element (20) is mechanically fastened to the carrier (7) by means of a connecting layer (24), wherein the connecting layer (24) is designed in particular as part of a protective layer (23) for the electrical contacts (21) and / or the electrical lines (22). [7] Sensor (1) according to one of the preceding claims, wherein the sensor element (20) is arranged on a first carrier side (11), wherein a first sensor end piece (25) projects laterally beyond the first carrier side (11), and wherein in particular on the first sensor end piece (25) a measuring element (27) of the sensor element (20) is formed. [8] Sensor (1) according to one of the preceding claims, wherein the sensor element (20) with the electrical contacts (21) rests on further electrical contacts (28) of the carrier (7), wherein a circumferential frame (40) is formed between the sensor element (20) and the carrier (7), wherein the circumferential frame (40) surrounds the electrical contacts (21) and the further electrical contacts (28) in a ring shape, wherein a contact region (45) is formed within the frame (40) and is sealed off from the medium by the frame (40). [9] Sensor (1) according to one of the preceding claims, wherein the sensor element (20) is designed to detect a pressure and / or a temperature and / or a flow velocity and / or a gas concentration. [10] Sensor (1) according to one of the preceding claims, wherein the sensor element is designed as a MEMS sensor. [11] Sensor (1) according to one of the preceding claims, wherein the carrier (7) comprises a ceramic substrate, and / or the carrier (7) and the electrical lines (22) are formed integrally, i.e. the carrier (7) represents a matrix for the electrical lines (22). [12] Sensor (1) according to one of the preceding claims, wherein the sensor element (20) is mechanically fixed to the carrier (7) by means of a glass layer (30) and / or the electrical contacts (21) of the sensor element (20) and the further electrical contacts (28) of the carrier (7) are designed with bonding wires (35), wherein the bonding wires (35) and the electrical contacts (21, 28) are passivated with a glass layer (30). [13] Sensor (1) according to one of the preceding claims, wherein the sensor (1) is designed for measuring a state variable in a humid environment and / or in a hydrogen environment, in particular for a fuel cell.

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