Component, part, assembly, component and method for manufacturing a component

Abstract

The invention relates to a component arrangement (100) comprising a first component (102), a second component (104), and a reactive multilayer system (106) arranged between the first component (102) and the second component (104). At least one of the components (102, 104) has a structured surface (112, 114), and the reactive multilayer system (106) is arranged adjacent to the structured surface (112, 114) between the first component (102) and the second component (104) in order to effect a material-bonded and form-locking connection between the first component (102) and the second component (104) in response to an ignition (422, 424).

Description

[0001] The present invention relates to a component, a component assembly, a component and a method for manufacturing a component.

[0002] A reactive multilayer system (RMS) can be used to connect elements.

[0003] Against this background, the present invention provides an improved component, an improved component assembly, an improved component, and an improved method for manufacturing a component according to the main claims. Advantageous embodiments are described in the dependent claims and the following description.

[0004] Advantageously, a connection between two components produced using a reactive multilayer system can be improved if at least one contact side of at least one of the components is not smooth but structured.

[0005] A component for manufacturing a multi-component part using a reactive multilayer system has a contact side for contacting the reactive multilayer system. The contact side has a structured layer.

[0006] The component to be manufactured can be an assembly of components. For example, the component can comprise a first component and a second component, which are materially bonded to each other via a reactive multilayer system and, due to the structured arrangement of the contact side of at least one of the components, are also form-fitted. Depending on the embodiment, either the first or the second component, or both components, can have a contact side with a structured layer. Similarly, one of the components can have a contact side with a structured layer and the other a contact side without a structured layer. The reactive multilayer system can be applied, or may have been applied, to the contact side of the first or the second component for the manufacture of the component. A reactive multilayer system can also be applied to the contact sides of each component.A structured layer can be understood as a surface that deviates from a flat or smooth surface. The structured layer may have a contour or height profile, for example, comprising multiple raised areas and depressions. The structured layer can include structures that exceed the typical surface roughness of corresponding components. The structured layer may exhibit a structure that has been formed on the surface of the corresponding component using a suitable manufacturing process. This structure may have a predefined and therefore reproducible pattern. The structured layer may form multiple depressions that have sufficient width and depth to accommodate material from a reactive multilayer system when applied or during a reaction of the reactive multilayer system.This allows material from the reacted reactive multilayer system to interact with the structured layer, thus forming a form-fit connection with the structured layer in addition to a material-bonded connection.

[0007] The reactive multilayer system can also be referred to as a reactive multilayer system. Responding to ignition, also known as activation, the reactive multilayer system can provide immediate heat for a wide variety of applications in many industries. The reactive multilayer system can be fabricated by vapor deposition of thousands of alternating nanoscale layers, for example, of aluminum and nickel. The reactive multilayer system can be grown on at least one of the components. Ignition of the reactive multilayer system can be achieved in known ways by introducing activation energy, for example, using a laser beam or by applying an electrical voltage.

[0008] The first component can be an electronic component. Accordingly, the first component can have at least one electrical contact. An electronic component can be, for example, a semiconductor device, a chip, or a bare die cut from a wafer. For example, the first component can be a transistor, a diode, or a sensor chip. The first component can also be a sensor, such as a force sensor. The second component can be a substrate for the first component. For example, the second component can be a substrate for electronic components, such as a printed circuit board or a substrate, such as a copper or ceramic substrate. The second component can also be a machine element, such as a connecting element or an element for transmitting forces or movements, such as a shaft.The second component can include at least one connection surface for electrically contacting an optional electrical contact of the first component.

[0009] Depending on the embodiment, a surface of the structured layer can be in direct contact with the reactive multilayer system for the production of the component, or a solder layer applied to the structured layer can be located between the structured layer and the reactive multilayer system.

[0010] According to one embodiment, the contact side can thus be formed as the structured layer covered by a solder layer. The solder layer can improve contacting of the reactive multilayer system.

[0011] The solder layer can be smooth on the side facing away from the structured layer, thus forming a smooth surface. In this way, the solder layer can flatten the height profile of the structured layer. This can, for example, create a flat surface for depositing the reactive multilayer system. Alternatively, the solder layer can follow the height profile of the underlying structured layer and therefore also be structured.

[0012] The structured layer can extend across the entire contact surface. This is advantageous when the reactive multilayer system covers the entire contact surface. Alternatively, the structured layer can extend only across one or more sections of the contact surface.

[0013] The structured layer can have a uniform structure throughout. For example, the structured layer can have a uniform height profile across its entire surface. Such a uniform structure is easy to produce. The structured layer can have any suitable height profile. For example, the structured layer can have a wave-like shape. The structured layer can have multiple parallel grooves and, additionally or alternatively, multiple parallel ridges. Such grooves and ridges are easy to form. The grooves and / or ridges can have a linear path or, for example, be jagged or ring-shaped. The direction of the holding force of the frictional connection created by the structured layer can be defined by its structure.

[0014] The structured layer can have multiple holes distributed across it, and additionally or alternatively, raised areas. The holes and / or raised areas can, for example, be arranged in a matrix-like pattern. Such a design of the structured layer enables a strong holding force for the friction-fit connection in all directions parallel to the structured layer.

[0015] According to one embodiment, less than 60%, less than 50%, less than 40%, or less than 30% of the structured layer can be planar. Additionally or alternatively, less than 60%, less than 50%, less than 40%, or less than 30% of the structured layer can be located in a single plane. Thus, a substantial proportion of the structured layer can be structured.

[0016] The structured layer can represent a surface produced by removing material and, additionally or alternatively, by applying material. Therefore, common manufacturing processes can be used to form the structured layer.

[0017] A component for manufacturing a component comprising several elements using a reactive multilayer system includes an element and the reactive multilayer system. The reactive multilayer system is grown on the contact side of the element. Depending on the embodiment, the reactive multilayer system also has a contour, i.e., a height profile corresponding to the structured layer, or a smooth surface on a side facing away from the element. To manufacture the component, the composite of the element and the grown reactive multilayer system can be brought into contact with a similarly structured or a smooth contact side of another element.

[0018] A component assembly for manufacturing a component comprising several building elements includes a first building element, a second building element, and a reactive multilayer system, wherein the reactive multilayer system is arranged between the first and second building elements and is grown on one of the building elements. At least one of the building elements is shaped as one of the aforementioned building elements, i.e., it has a contact side with a structured layer.

[0019] Depending on the embodiment, at least one of the components can be an unstructured component, i.e., it does not have a structured layer on the contact side.

[0020] For example, the first component can have a structured layer on its contact side, and the reactive multilayer system can be grown on the contact side of the first component. Advantageously, the second component can then have an unstructured contact side.

[0021] Alternatively, the second component can have a structured layer on its contact side, and the reactive multilayer system can be grown on the smooth surface of the first, unstructured component. Thus, the reactive multilayer system can alternatively be grown on an unstructured component. Therefore, the described approach can also be used, for example, with a component that cannot be structured or can only be structured with considerable effort. In such a case, the other component can be provided with a suitable structure.

[0022] A corresponding component comprises a stack consisting of a first component, a second component, and a reacted reactive multilayer system. The reacted reactive multilayer system is positioned between the first and second components. At least one of the components is shaped as a component of the type mentioned, meaning it has a contact side with a structured layer.

[0023] A reacted reactive multilayer system can be understood as a reactive multilayer system that has already fully reacted. Due to at least one structured layer, the reaction of the reactive multilayer system has resulted in not only a material bond but also a force-fit bond.

[0024] A process for manufacturing a component comprising several building elements includes the following steps: Providing a first component and a second component, wherein at least one of the components has a contact side with a structured layer; Growth of a reactive multilayer system onto one of the components; Arranging the first and second components into a stack, wherein the reactive multilayer system is positioned between the first and second components and is in contact with the contact side; and Triggering the ignition of the multilayer system to bond the first and second components together in a material-bonded and form-fit manner. In the provisioning step, either the first or the second component can be provided with the previously described structured layer. Depending on the embodiment, at least one of the components can be provided as an unstructured component, i.e., a component that does not have a structured layer on the contact side. In the growth step, layers of the reactive multilayer system can be grown onto the first and / or the second component, depending on the embodiment. In the activation step, the ignition can be achieved, for example, by activating and / or aligning a laser beam to a point on the reactive multilayer system, by passing an electric current through a section of the reactive multilayer system, or by sparking.

[0025] Optionally, the process can include a step of forming the structured layer on an unstructured component. For example, a manufactured component can be provided and then subjected to a surface treatment that transforms an existing surface of the component into the structured layer. For instance, a previously smooth surface of the component can be textured.

[0026] For example, the structured layer can be formed into at least one unstructured component by etching one or more structures. Additionally or alternatively, the structured layer can be formed by mechanically removing material from the at least one unstructured component and, additionally or alternatively, by growing material onto the at least one unstructured component. This allows the use of known manufacturing processes to transform an unstructured component into one containing the at least one structured layer, which can then be permanently bonded to another component using the reactive multilayer system.

[0027] Optionally, the process can include a step of applying a solder layer to the structured layer. This can improve the solderability of the contact side and, if necessary, allow for adjustment of the contact side's contour.

[0028] The invention is explained in more detail by way of example with reference to the accompanying drawings. These show: Fig. 1 a schematic representation of an exemplary embodiment of a component; Fig. 2 a flowchart of an exemplary embodiment of a method for manufacturing a component; Fig. 3. A process flow of an exemplary embodiment of a method for manufacturing a component; Fig. 4 a representation of an exemplary embodiment of a component arrangement; Fig. 5 a schematic representation of a reaction of an embodiment of a reactive multilayer system; Fig. 6. A representation of an exemplary embodiment for manufacturing a component; Fig. 7. A representation of an exemplary embodiment for manufacturing a component; and Fig. 8 A representation of an exemplary embodiment for the manufacture of a component.

[0029] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, without repeating these elements.

[0030] Fig. Figure 1 shows a schematic representation of an embodiment of a component 100. The component 100 comprises a stacked arrangement of a first component 102, a second component 104, and a reacted reactive multilayer system 106 arranged between the components 102 and 104. The contact surfaces of the components 102 and 104 are bonded together via the reacted reactive multilayer system 106. At least one of the components 102 or 104, here by way of example the first component 102, has a contact surface with a structured layer 108. Due to the structured layer 108, the contact surface has a height profile that differs from a smooth surface. As a result, the reacted reactive multilayer system 106 forms not only a bonded but also a positive-locking connection with at least the first component 102.

[0031] According to different embodiments, the structured layer 108 extends over the entire contact side of the first component 102 or only over a section of the contact side. In one embodiment, the structured layer 108 constitutes a continuous area. Alternatively, the structured layer 108 is divided into at least two spaced-apart sub-areas. In another embodiment, the contact side has several spaced-apart structured layers 108.

[0032] The structured layer 108 has a height profile with one or more structures suitable for forming a positive-locking connection with material of a reacted reactive multilayer system 106. Depending on the manufacturing process, the structured layer 108 can have a random or a predefined structure.

[0033] Depending on the embodiment, the structured layer 108 has a uniform structure throughout or different structures. For example, the structured layer 108 is less than half flat. For example, the structured layer is wave-shaped. Additionally or alternatively, the structured layer has, for example, a plurality of holes and / or bumps distributed across the structured layer 108. For example, to form such a structured layer, a plurality of grooves and / or holes have been introduced into an existing surface of the first component 102 and / or a plurality of ridges or bumps have been applied to the surface. Alternatively, the first component 102 is already manufactured with the structured layer 108 during its initial production, so that subsequent surface treatment is unnecessary.

[0034] For example, the structured layer 108 has a structure depth of more than 0.1 µm, more than 0.5 µm, more than 1 µm, more than 2 µm, more than 3 µm, more than 5 µm, more than 10 µm, more than 20 µm, or more than 50 µm. For example, the structure depth is an average depth across the entire surface of the structured layer 108. In the case of a wave-shaped structured layer 108, the structure depth is defined, for example, by the height difference between a wave trough and a wave crest.

[0035] According to one embodiment, the first component 102 is an electronic component, for example a semiconductor component, and the second component 104 is a support for the first component 102, for example in the form of a printed circuit board or a substrate, for example a copper substrate. For example, the first component 102 is a chip, or, by way of example, a transistor or a diode. According to one embodiment, at least one electrical connection of the first component 102 is permanently electrically and mechanically connected to an electrical contact of the second component 104 after ignition of the reactive multilayer system. For example, the structured layer 108 is located in the region of the electrical connection of the first component 102, and the reacted reactive multilayer system 106 is arranged between the electrical connection and the electrical contact.

[0036] According to an alternative embodiment, the first component 102 is a sensor and the second component 104 is a machine element, for example, a shaft for an electric drive or a gearbox. For example, the first component 102 is a force sensor that is rigidly connected to the second component 104 by means of the reacted reactive multilayer system 106 in order to detect a deformation of the second component 104.

[0037] According to the illustrated embodiment, the first component 102 has a contact side with the structured layer 108, and the second component 104 has a smooth, unstructured contact side. According to an alternative embodiment, the second component 104 has a contact side with a correspondingly structured layer, and the first component 102 has a smooth, unstructured contact side. Optionally, both components 102 and 104 have a contact side with a correspondingly structured layer.

[0038] Fig. Figure 2 shows a flowchart of an exemplary embodiment of a method for manufacturing a component, as exemplified in Fig. 1 is shown.

[0039] In step 201, a first component and a second component are provided. At least one of the components has a contact side with a structured layer. In step 203, a reactive multilayer system is grown onto one of the components. Depending on the embodiment, the reactive multilayer system is grown either onto the component with the structured layer or onto the other component.

[0040] Step 201 of the provisioning process can be implemented in several sub-steps. For example, in step 201 only one of the components can be provided initially, which is then coated with the reactive multilayer system in step 203, and only subsequently is the other component provided.

[0041] In step 205, the first and second components are arranged in a stack. The reactive multilayer system is positioned between the first and second components. The reactive multilayer system is located on the contact side with the structured layer. According to one embodiment, the reactive multilayer system was grown onto this contact side in step 203.

[0042] In step 207, ignition of the reactive multilayer system is triggered in order to transform the reactive multilayer system into a reacted reactive multilayer system. This results in the first and second components being bonded together in a material-bonded and form-fit manner.

[0043] Optionally, the structured layer is formed on at least one of the components in step 209. For example, structures or contours of the structured layers are etched or formed by mechanical removal of material or by material growth.

[0044] Optionally, in step 211, a solder layer is applied to the structured layer.

[0045] Fig. Figure 3 shows a process flow of an exemplary embodiment of a method for creating a component arrangement 300 for manufacturing a component, as is the case, for example, with regard to Fig. 1 is described.

[0046] The first element shown is an unstructured component 302, which is, for example, a functional component that could be attached to a second component 104 as is, using a reactive multilayer system.

[0047] According to the approach described here, a structuring process is carried out beforehand, in which, according to one embodiment, a structured layer 108 is formed on at least one section of a contact side 303 of the unstructured first component 302, as described with reference to the preceding figures. This results in a first component 102 with a structured contact side 303. A corresponding structuring process can also be carried out on a corresponding second unstructured component.

[0048] On the contact side 303, here on the structured layer 108 of the first component 102, layers for forming a reactive multilayer system 306 are deposited according to the illustrated embodiment, as indicated by an arrow 305.

[0049] The first component 102, onto which the reactive multilayer system 306 is deposited, is also referred to as the component. The component and the second component 104 are then stacked during placement to create the component assembly 300. The reactive multilayer system 306 is in direct contact with a contact side of the second component 104 on a side opposite the first component 102. Optionally, pressure 307 is applied to the stack consisting of the components 102, 104, and the reactive multilayer system 306. For example, a corresponding force is applied to a side of the first component 102 facing away from the reactive multilayer system 306.

[0050] Activation of the reactive multilayer system 306 transforms it into a reacted reactive multilayer system, which establishes a material-bonded connection between the components 102 and 104. Furthermore, the structured arrangement of the first component 102 creates a force-fit connection between the reacted reactive multilayer system and the first component 102.

[0051] According to the described approach, instead of using only flat layers for growth, in one embodiment either the layer of the second component 104, for example a so-called target, or the layer of the first component 102, for example a chip, or both layers are pretreated. For this purpose, a specific height profile is imprinted on the respective layer. The height profile, in Fig. Figure 3, schematically depicted as a cross-section through the structured layer 112, consists, for example, of depressions, such as grooves or holes, and / or of raised areas, such as ridges. Depressions are produced, for example, by etching structures into the corresponding part, such as the unstructured component 301, or by mechanical removal, such as milling. Raised areas are produced, for example, by growth, such as by physical or chemical vapor deposition.

[0052] After structuring, the reactive multilayer system 306 is grown onto the first component 102 or the second component 104. This creates a positive-locking connection between the reactive multilayer system 306 and the corresponding component of the components 102 and 104, resulting in a large effective bonding area. The positive-locking connection and the increased bonding area lead to enhanced mechanical stability and increased force transmission. Because the reactive multilayer system 306 is grown directly onto the structured first component 102 or the structured second component 104, the step of placing the reactive multilayer system 306 is eliminated, and the reactive multilayer system 306 is already optimally adapted to the structure on one side, as, for example, nanometer-precise masking processes can be used for growth.

[0053] Alternatively, the reactive multilayer system 306 can also be applied to a non-structured component 102, 104.

[0054] Optionally, a solder layer is applied to the contact side 308 of the already structured component, here exemplified by the first component 102, onto which the layers of the reactive multilayer system 306 are then deposited.

[0055] In Fig. Figure 3 illustrates the process for creating depressions in the first component 102, for example, a chip. As described above, these can also be raised areas, or a combination of both. Similarly, instead of the first component 102, the second component 104 can be structured, or both components, i.e., both components 102 and 104.

[0056] The precise method of growth of the reactive multilayer system 306 is crucial, and exemplary variants are presented based on the Fig. Illustrated in 6 to 8.

[0057] Another positive side effect of this approach is the prevention of solder spatter from the reactive multilayer system 306. Under certain circumstances, the explosive expansion during activation of the reactive multilayer system 306 can lead to solder spatter, which can damage other components or cause short circuits. According to the described approach, the solder can spread into the structured surfaces of the contact side 308, thus reducing the tendency for spatter to occur.

[0058] Fig. Figure 4 shows an embodiment of a component arrangement 300, as it is used, for example, in Fig. Figure 3 is shown. Optionally, the second component 104 has a solderable layer in the form of a solder layer 420. The reactive multilayer system 306 is grown either on the solder layer 420 or on a contact side of the first component 102. The reactive multilayer system 306 is arranged between the contact sides of the components 102 and 104. The first component 102 is optionally pressed against the second component 104 by the pressure 307.

[0059] To activate the reactive multilayer system 306, a first ignition 422 and a second ignition 424 are shown as examples, by which the reactive multilayer system 306 is ignited simultaneously at different positions.

[0060] For example, the first component 102 is designed as a sensor and the second component as a carrier, for example a machine component.

[0061] Fig. Figure 5 shows a schematic representation of a reaction of an embodiment of a reactive multilayer system 306, such as that used for manufacturing a component as described with reference to the preceding figures. The reactive multilayer system 306 is, for example, composed of a plurality of first layers 530 and a plurality of second layers 532, which are arranged alternately, with optionally mixed regions 534 located between adjacent layers 530, 532.

[0062] A schematic representation of the position of an ignition point 422 is shown. Starting from the position of the ignition point 422, the material of the reactive multilayer system 306 reacts to form reacted material of a reacted reactive multilayer system 106. A corresponding direction of propagation 536 is indicated by an arrow.

[0063] The reactive multilayer system 306 is configured according to one embodiment to provide instant heat for a wide variety of applications in many industries. The reactive multilayer system 306 is fabricated by vapor deposition of thousands of alternating nanoscale layers, which are in Fig. 5 are schematically represented by layers 530 and 532 and consist, for example, of aluminum (Al) and nickel (Ni). Activation is triggered by a small local energy pulse from electrical, optical, or thermal sources, as described in Fig. Figure 5 schematically illustrates the ignition 422. The reactive multilayer system 306 reacts exothermically to generate precise local heat up to 1500 °C in fractions of a second.

[0064] In this way, a connection that is both electrically and thermally conductive can be established, e.g. between a bare chip in electronics and a leadframe, a packaged chip and a printed circuit board, etc. - i.e. generally a connection between two parts, which are here exemplified as components 102, 104.

[0065] By ensuring that the contact surfaces of all components are not flat, the mechanical stability and force transmission of the resulting connection are increased compared to exclusively flat contact surfaces. This means that at least one of the components 102, 104, which represent, for example, a so-called target and a sensor chip, and optionally the reactive multilayer system 306, have a non-flat contact surface.

[0066] This allows for the creation of connections for many applications where a highly stable and rigid connection is required, e.g., in power electronics or force measurement, where material deformation is used as a measurement parameter. Compared to a flat contact surface, the described approach increases the effective adhesive area, improves the mechanical stability of the bond, and enhances force transmission.

[0067] The reactive multilayer system 306 is used, according to one embodiment, to join two parts with solderable layers, here exemplified by components 102 and 104. Activating the reactive multilayer system 306 allows for the creation of a highly stable and rigid bond, as required, for example, in power electronics or in force measurement applications where material deformation is used as the measured parameter. The described approach increases the mechanical stability of an adhesive bond achieved with the reactive multilayer system 306 and improves force transmission by structuring the position of the parts to be bonded, or at least one of them. This results in a positive-locking connection and increases the effective bonding area.The positive-locking connection using the grown reactive multilayer system 306 serves to increase the mechanical stability and force transmission between the components 102, 104.

[0068] Fig. Figure 6 shows an embodiment of a component 600, such as that used for manufacturing the component in Fig. The component shown in section 1 can be used. The component includes a building element, which is exemplified here as the aforementioned first building element 102. Alternatively, the building element can correspond to the second building element already described. Thus, the building element can be, for example, a chip or a carrier.

[0069] Layers are grown onto the contact side, here exemplified by the first component 102, as symbolized by arrow 305. This deposits the reactive multilayer system 306. A surface of the contact side of the first component 102 is formed by a surface of the structured layer 108. According to the illustrated embodiment, the reactive multilayer system 306 has a contour 608 on a side facing away from the first component 102, which maps the surface of the structured layer 108. For example, a height profile of the surface of the reactive multilayer system 306 corresponds to a height profile of the structured layer 108.

[0070] Thus, according to this embodiment, the reactive multilayer system 306 grows directly while maintaining the structure of the corresponding component, for example the carrier or chip, here by way of example maintaining the structure of the first component 102.

[0071] Fig. Figure 7 shows an embodiment of a component 600, such as that used for manufacturing the component in Fig. The component shown in section 1 can be used. The component includes a building element, which is shown here as the first building element 102 already mentioned. Alternatively, the building element can correspond to the second building element already described. Thus, the building element can be, for example, a chip or a carrier.

[0072] A solder layer 420 is applied to the contact side, here exemplified by the first component 102. The solder layer 420, which is applied to the structured layer 108 of the first component 102, thus forms a surface of the contact side of the first component 102. According to the illustrated embodiment, the solder layer 420 has a smooth surface 708 on a side facing away from the first component 102. The solder layer 420 results, for example, from the fact that the contact side of the first component 102 is pre-soldered, for example with tin.

[0073] Layers are grown onto the smooth surface 708 of the solder layer 420, as symbolized by arrow 305. This deposits the reactive multilayer system 306. According to the illustrated embodiment, the reactive multilayer system 306 has a smooth surface on a side facing away from the first component 102.

[0074] Thus, according to this embodiment, a pre-soldering is carried out, for example with tin, to create a flat surface, here the smooth surface 708.

[0075] Fig. Figure 8 shows an embodiment of a component 100 for manufacturing, as can be seen, for example, in Fig. 1 is described.

[0076] A component 600 comprises a device whose contact side, according to this embodiment, has no structured layer. For example, the device is designed as an unstructured first device 302. Alternatively, the device can also correspond to an unstructured second device. Thus, the device can, for example, be a chip or a carrier.

[0077] Layers are grown onto the contact side, here exemplified by the unstructured first component 302. This deposits the reactive multilayer system 306. Due to the lack of a structured layer, the contact side of the unstructured first component 302 has a smooth surface. Consequently, according to the illustrated embodiment, the reactive multilayer system 306 also has a smooth surface on a side facing away from the unstructured first component 302.

[0078] In addition to component 600, another component, for example the second component 104, is provided. Alternatively, the additional component can correspond to the first component already described. Thus, the additional component can be, for example, a chip or a carrier. A surface of the contact side of the second component 104 is formed by a surface of the structured layer 108.

[0079] Component 600 and the second component 104 are stacked such that the reactive multilayer system 306 is located between the contact surfaces of components 302 and 104. After placement, the reactive multilayer system 306 is activated, transforming into the reacted reactive multilayer system 106 and forming a positive-locking connection, thereby mechanically and stably connecting components 302 and 104 of component 100.

[0080] Thus, according to this embodiment, the reactive multilayer system 306 is deposited on a planar counterpart, for example the first unstructured component 302, e.g. on a substrate if the chip is structured or on a chip if the substrate is structured. Reference sign 100 components 102 first component 104 second component 106 reacted reactive multilayer system 108 structured location Step 201 of deployment 203rd step of growing up 205 Step of the ordering process 207th step of ignition 209th step of shaping 211 Step of application 300 component arrangement 302 unstructured component 303 Contact page 305 Separation 306 reactive multilayer system 307 Print 420 solder layer 422, 424 Ignition 530 first layer 532 second layer 534 mixed regions 536 Direction of propagation 600 component parts 608 contour 708 smooth surface

Claims

[1] Component (102) for producing a component (100) comprising a plurality of components (102, 104) using a reactive multilayer system (306), wherein the component (102) has a contact side (303) for contacting the reactive multilayer system (306), characterized by that the contact side (303) has a structured layer (108). [2] Component (102) according to claim 1, wherein the contact side (303) is formed as the structured layer (108) covered by a solder layer (420). [3] Component (102) according to claim 2, wherein the solder layer (420) forms a smooth surface (708) on a side facing away from the structured layer (108). [4] The device (102) according to any one of the preceding claims, wherein the structured layer (108) comprises a plurality of trenches and / or ridges and / or wherein the structured layer (108) comprises a plurality of holes and / or hillocks. [5] Component (102) according to one of the preceding claims, wherein the structured layer (108) represents a surface produced by removing and / or applying material. [6] Component (102) according to one of the preceding claims, wherein the component (102) is an electronic component, a sensor, a carrier for electronic components or a machine element. [7] Component (600) for producing a component (100) comprising a plurality of components (102, 104) using a reactive multilayer system (306), wherein the component (600) comprises a component (102) according to one of the preceding claims and the reactive multilayer system (306), characterized by that the reactive multilayer system (306) is grown on the contact side (303) of the component (102). [8] Component (600) according to claim 7, wherein the component (600) comprises the component (102) according to claim 1 or 2 and the reactive multilayer system (306) has, on a side facing away from the structured layer (108), a contour (608) corresponding to a contour of the structured layer (108). [9] Component arrangement (300) for producing a component (500) comprising a plurality of components (102, 104), wherein the component arrangement (300) comprises a first component (102; 302), a second component (104) and a reactive multilayer system (306), wherein the reactive multilayer system (306) is arranged between the first component (102) and the second component (104) and is grown on one of the components (102, 104; 302), characterized by that at least one of the components (102, 104) is formed as a component according to one of claims 1 to 6. [10] Component arrangement (300) according to claim 9, wherein the first component (102) is formed as the component according to one of claims 1 to 6 and the reactive multilayer system (306) is grown on the contact side (303) of the first component (102). [11] Component arrangement (300) according to claim 9, wherein the first component is an unstructured first component (302) and the second component (104) is formed as the component according to one of claims 1 to 6, wherein the reactive multilayer system (306) is grown on a smooth surface of the unstructured first component (302). [12] Component (500) comprising a stack of a first component (102; 302), a second component (104) and a reacted reactive multilayer system (106), wherein the reacted reactive multilayer system (106) is arranged between the first component (102) and the second component (104), characterized bythat at least one of the components (102, 104) is formed as a component according to one of claims 1 to 6. [13] Method for producing a component (100) comprising a plurality of components (102, 104), the method comprising the following steps: Providing (201) a first component (102; 302) and a second component (104), wherein at least one of the components (102, 104) has a contact side (303) with a structured layer (108); Growing (203) a reactive multilayer system (306) on one of the components (102, 104); Arranging (205) the first component (102) and the second component (104) to form a stack, wherein the reactive multilayer system (306) is arranged between the first component (102) and the second component (104) and on the contact side (303); and Causing (207) an ignition (422, 424) of the reactive multi-layer system (306) in order to connect the first component (102) and the second component (104) to one another in a materially and positively locking manner. [14] Method according to claim 13, wherein in the step of providing the first component is provided as a first unstructured component (302) and in a step (207) of forming the structured layer (108) is formed on the first unstructured component (302). [15] Method according to claim 13 or 14, comprising a step of applying a solder layer (420) to the structured layer (108).

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