Busbar arrangement for a power module

Abstract

A busbar for a power module (20) is described. The busbar comprises: a layer stack (60) with at least two electrically conductive first layers (62) for carrying a first current, at least two electrically conductive second layers (64) for carrying a second current, wherein one electrical current direction of the first current is opposite to one electrical current direction of the second current, and wherein the first and second layers (62, 64) are arranged alternately one above the other in a first direction (90), with at least one insulating layer (60) between each of the first and second layers (62, 64) for electrically insulating the first and second layers (62, 64) from each other.

Description

[0001] The invention relates to a busbar arrangement for a power module. The power module can be an electrical converter, e.g., an inverter or a rectifier, and / or can represent or comprise one or more half-bridges.

[0002] A conventional power module may comprise a carrier, at least one semiconductor chip mounted on the carrier, and a driver board arranged above the semiconductor chip. The carrier may comprise a DBC (direct bonded copper) or IMS (insulated metal substrate) substrate. The driver board may be designed for electrically contacting and / or controlling the semiconductor chip. The semiconductor chip may be a high-performance semiconductor chip. The power module may be designed to convert an alternating current into a direct current or vice versa.

[0003] Some modern power modules, such as those that incorporate SiC- or GaN-based semiconductor chips, can achieve high efficiency because very little switching energy is required to turn the semiconductor chips on or off. However, when switching semiconductors at high speeds, voltage ripple can be caused by the rapid switching. This can lead to an EMC (electromagnetic compatibility) problem for the power module.

[0004] The magnitude of the voltage ripple is proportional to the inductance generated during power module operation. Reducing the inductance thus reduces the voltage ripple and thus the EMC problem. In conventional power modules, a large portion of the inductance, e.g., 40% to 70%, can be caused by a busbar that electrically couples a power module converter stage to a power module DC connection.

[0005] An object of the present invention is therefore to provide a busbar arrangement for a power module that contributes to generating only low inductance during operation of the power module. Furthermore, an object of the present invention is to provide a power module that can enable fast switching, that can require only low switching energy, that can ensure high EMC, and / or that can, in particular, generate low or negligible voltage ripple.

[0006] The objects are achieved by the subject matter of the independent claims. Advantageous embodiments are provided in the dependent claims.

[0007] One aspect relates to a busbar for a power module. The busbar comprises: a layer stack with at least two electrically conductive first layers for carrying a first current, at least two electrically conductive second layers for carrying a second current, wherein a first electrical current direction of the first current is opposite to a second electrical current direction of the second current, and wherein the first and second layers are arranged one above the other in an alternating manner in a first direction, at least one insulating layer between each of the first and second layers for electrically isolating the first and second layers from each other, a first through-hole in a first lateral end region of the layer stack, wherein the first through-hole extends in the first direction through the entire layer stack, and wherein a lateral direction is perpendicular to the first direction,a second through-hole in the first lateral end region of the layer stack adjacent to the first through-hole, wherein the second through-hole extends in the first direction through the entire layer stack; a third through-hole in a second lateral end region of the layer stack, wherein the third through-hole extends in the first direction through the entire layer stack, and wherein the second lateral end region is arranged at a lateral end of the layer stack opposite the first lateral end region; a fourth through-hole in the second lateral end region of the layer stack adjacent to the third through-hole, wherein the fourth through-hole extends in the first direction through the entire layer stack; an electrically conductive first pin for electrically contacting the first layers, wherein the first pin is arranged in the first through-hole;is electrically coupled to the first layers and is electrically insulated from the second layers; an electrically conductive second pin for electrically contacting the second layers, wherein the second pin is arranged in the second through-hole, is electrically coupled to the second layers, and is electrically insulated from the first layers; an electrically conductive third pin for electrically contacting the first layers, wherein the third pin is arranged in the third through-hole, is electrically coupled to the first layers, and is electrically insulated from the second layers; and an electrically conductive fourth pin for electrically contacting the second layers, wherein the fourth pin is arranged in the fourth through-hole, is electrically coupled to the second layers, and is electrically insulated from the first layers.

[0008] For ease of explanation, this description assumes that the layer stack is oriented such that the first direction is the vertical direction. With this orientation, the lateral ends of the layer stack correspond to horizontal ends of the layer stack. The lateral direction extends from one lateral end of the layer stack to another lateral end of the layer stack. The lateral direction may be referred to as the second direction, where the second direction is always perpendicular to the first direction. However, the layer stack may be oriented differently, in which case the first direction may no longer be vertical, and the second direction may still be perpendicular to the first direction.

[0009] The first lateral end region of the layer stack comprises the first lateral end of the layer stack and extends toward the second lateral end of the layer stack. The second lateral end region of the layer stack comprises the second lateral end of the layer stack and extends toward the first lateral end of the layer stack. The second lateral end is opposite the first lateral end. The first lateral end region does not overlap with the second lateral end region. In contrast, the first lateral end region is spaced a positive distance from the second lateral end region, such that a mid-region is disposed between the first and second lateral ends.

[0010] The first and third pins are designed for electrical contact with the first layers. Therefore, the first current can be transported, for example, from the first pin via the first layers to the third pin. The second and fourth pins are designed for electrical contact with the second layers. Therefore, the second current can be transported, for example, from the fourth pin via the second layers to the second pin. The first and second currents therefore flow in opposite directions through the stack, so that the corresponding current loop is mixed. This can lead to a reduction in mixed mutual inductance compared to the prior art when the busbar is arranged in the power module. This low inductance can contribute to a low voltage ripple of the power module. This can contribute to a high efficiency of the power module.This can enable fast switching of the power module's semiconductor chips. Furthermore, high EMC can be ensured by the power module. Furthermore, the power module can be provided at a low cost and / or with a lightweight compared to conventional power modules. Furthermore, due to the low leakage inductance, overvoltage spikes during one or more switching operations of the power module can be reduced. Therefore, one or more snubber capacitors of the power module can be omitted or at least their number reduced.

[0011] According to one embodiment, the through-holes are arranged so that they do not overlap. This can help prevent any short circuits from one pin to another pin.

[0012] According to one embodiment, the first and third pins are electrically coupled to the first layers by the first and third pins touching the first layers in the first and third vias, respectively. This can contribute to proper electrical coupling of the first and third pins to the first layers. Alternatively or additionally, the second and fourth pins are electrically coupled to the second layers by the second and fourth pins touching the second layers in the second and fourth vias, respectively. This can contribute to proper electrical coupling of the second and fourth pins to the second layers.

[0013] Alternatively, the first and third pins may be electrically coupled to the first layers by electrically conductive first means disposed between the first and third pins and the first layers in the first and third through-holes, respectively. Alternatively or additionally, the second and fourth pins may be electrically coupled to the second layers by electrically conductive second means disposed between the second and fourth pins and the second layers in the second and fourth through-holes, respectively. The electrically conductive first and / or second means may each be electrically conductive electroplating, coating, or adhesive, such as solder, solder paste, or an electrically conductive adhesive.

[0014] According to one embodiment, the second and fourth pins are electrically insulated from the first layers by electrically insulating first coatings formed on inner walls of the first layers in the second and fourth through-holes. This can help prevent any short circuits between the first and second layers via the second and fourth pins. Alternatively or additionally, the first and third pins are electrically insulated from the second layers by electrically insulating second coatings formed on inner walls of the second layers in the first and third through-holes. This can help prevent any short circuits between the first and second layers via the first and third pins.

[0015] According to one embodiment, at least one of the pins comprises a recess for receiving a fixing means, wherein the recess extends through the corresponding pin in the first direction. This can enable the busbar assembly to be mechanically fastened to a DC connection and / or to a converter stage of the power module via the fixing means. The pins can thus provide a dual function. In particular, the first and third pins can provide the functions of electrically coupling the first layers to one another and electrically coupling the first layers to first and third DC terminals of the power module. Similarly, the second and fourth pins can provide the functions of electrically coupling the second layers to one another and electrically coupling the second layers to second and fourth DC terminals of the power module.The first direction again refers to the exemplary orientation of the stack, as explained above. In other words, the recess extends vertically through the corresponding pin. In still other words, the pin may include a longitudinal axis, and the recess may extend along the pin's longitudinal axis.

[0016] According to one embodiment, the fixing means is a screw, and an internal thread is formed in the recess of the corresponding pin, wherein the internal thread is designed such that the screw can be screwed into the internal thread. The screw can help to easily couple the busbar assembly to the DC connection and / or to the converter stage of the power module.

[0017] One aspect relates to the power module. The power module comprises: the converter stage for converting an alternating current to a direct current or a direct current to an alternating current; the direct current connection for electrically coupling the converter stage to a direct current device; and at least one busbar assembly, as discussed above, wherein the busbar assembly is arranged to electrically couple the converter stage to the direct current connection.

[0018] Embodiments, features, and advantages of the present invention will be described partly with reference to the busbar assembly and partly with reference to the power module incorporating the busbar assembly. However, the embodiments, features, and advantages can easily be transferred from the busbar assembly to the power module and vice versa. Therefore, unnecessary repetition of these embodiments, features, and advantages is omitted in order to provide a condensed description.

[0019] According to one embodiment, the converter stage comprises the first DC terminal electrically coupled to the first pin of the busbar assembly and the second DC terminal electrically coupled to the second pin of the busbar assembly. Alternatively or additionally, the DC connection comprises the third DC terminal electrically coupled to the third pin of the busbar assembly and the fourth DC terminal electrically coupled to the fourth pin of the busbar assembly.

[0020] According to one embodiment, the DC connection comprises a DC capacitor, and the DC capacitor is electrically coupled to the first DC terminal and the second DC terminal.

[0021] According to one embodiment, the busbar assembly is mechanically coupled to the converter stage and / or the DC connection by one or more fixing means extending through recesses of the corresponding pins. The fixing means may comprise one or more screws.

[0022] According to one embodiment, the power module is designed as an electrical inverter. The converter stage may comprise two or more semiconductor chips that are electrically coupled to one another. The converter stage may comprise one or more half-bridges. The half-bridge(s) may be formed, for example, by the semiconductor chips. One or more of the semiconductor chips may be high-power semiconductor chips. The high-power semiconductor chips may be designed to process high voltages, for example, more than 100 V, and / or high currents, for example, more than 10 A.

[0023] These and other aspects of the invention will become apparent and explained with reference to the embodiments described below. Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Fig. 1 shows a schematic diagram of an exemplary embodiment of a power module. Fig. Figure 2 shows a side view of a conventional busbar arrangement for a conventional power module. Fig. Figure 3 shows a plan view of the conventional busbar arrangement of Fig. 2. Fig. 4 shows a side view of a cross section of an exemplary embodiment of a busbar assembly for the power module of Fig. 1. Fig. Figure 5 shows a plan view of the busbar arrangement of Fig. 4. Fig. Figure 6 shows a bottom view of the busbar arrangement of Fig. 4. Fig. Figure 7 shows a side view of a cross-section of an exemplary embodiment of a busbar arrangement across the power module of Fig. 1. Fig. Figure 8 shows a side view of a cross-section of an exemplary embodiment of a busbar assembly for the power module of Fig. 1.

[0024] The reference symbols used in the drawings and their meanings are briefly summarized in the following list of reference symbols. In principle, identical parts in the figures are provided with the same reference symbols.

[0025] Fig. 1 shows a schematic diagram of an exemplary embodiment of a power module 20. The power module 20 can be designed as an inverter or as a rectifier.

[0026] The power module 20 includes a converter stage 22 for converting an alternating current to a direct current or a direct current to an alternating current, and a direct current connection 26 electrically coupled to the converter stage 22 by a conductor arrangement 30. The busbar arrangement 30 may be referred to as a busbar.

[0027] The power module 20 may further include a DC device 24, e.g., a battery, coupled to the DC connection 26, a first DC terminal 42, a second DC terminal 44, and an AC terminal 40 having three or more electrical contacts. The DC connection 26 may include a DC capacitor 28, a third DC terminal 47, and a fourth DC terminal 48. One side of the DC capacitor 28 may be electrically coupled to the third DC terminal 47, and another side of the DC capacitor 28 may be electrically coupled to the fourth DC terminal 48. The first DC terminal 42 may be electrically coupled to the third terminal 47 via the busbar assembly 30, and the second DC terminal 44 may be electrically coupled to the fourth DC terminal 48 via the busbar assembly 30.For example, the first and third DC terminals 42, 47 may be DC+ terminals, and the second and fourth DC terminals 44, 48 may be DC- terminals.

[0028] During operation of the power module 20, a current can flow through the conductor assembly 30 in a first electrical current direction 34 from the third DC terminal 47 to the first DC terminal 42 and in a second electrical current direction 36 from the second DC terminal 44 to the fourth DC terminal 48, or vice versa. The current flowing through the busbar assembly 30 can create a parasitic inductance 32 between the third DC terminal 47 and the first DC terminal 42 and between the fourth DC terminal 48 and the second DC terminal 44.

[0029] The converter stage 22 comprises a semiconductor arrangement 38 with two or more electrically coupled semiconductor chips 46. The converter stage 22 may comprise or form one or more half-bridges. The half-bridge(s) may be formed, for example, by the semiconductor chips 46. One or more of the semiconductor chips 46 may be high-power semiconductor chips. The high-power semiconductor chips may be designed for processing high voltages, for example, more than 100 V, and / or high currents, for example, more than 10 A. The semiconductor chips 46 may comprise SiC or GaN.

[0030] Fig. Figure 2 shows a side view of a conventional busbar assembly 50 for a conventional power module (not shown). The conventional power module may be described as the one described with reference to Fig. 1 described power module 20, with the exception of the busbar arrangement 30, as described below with reference to Fig. 4 to 8. In contrast, the conventional power module can control the Fig. 2 and Fig. 3 described conventional conductor arrangement 50.

[0031] Fig. 3 shows a plan view of the conventional conductor assembly 50 of Fig. 2.

[0032] The conventional conductor arrangement 50 may include a conventional first conductor 52 and a conventional second conductor 54. The conventional first conductor 52 may be disposed on the conventional second conductor 54. An insulating foil 56 may be disposed between the conventional first conductor 52 and the conventional second conductor 54. The insulating foil 56 electrically insulates the conventional first conductor 52 from the conventional second conductor 54. The conventional first conductor 52, the insulating foil 56, and / or the conventional second conductor 54 may each be in the form of a layer, wherein the foils and / or layers may be parallel to one another.

[0033] During operation of the power module 20, the current can flow through the conventional first conductor 52 in the first electrical current direction 34 and through the conventional second conductor 54 in the second electrical current direction 36, or vice versa. Fig. 3, the conventional second conductor 54 is arranged below the conventional first conductor 56 and is not visible. The arrow indicating the second electrical current direction 36, which indicates the direction in which the current flows through the conventional second conductor 54, is therefore Fig. 3 dashed.

[0034] Fig. 4 shows a side view of a cross section of an exemplary embodiment of a busbar assembly 30 for the power module 20 of Fig. 1. The busbar assembly 30 comprises a layer stack 60 and four electrically conductive pins 70, 72, 74, 76.

[0035] The layer stack 60 comprises at least four electrically conductive layers 62, 64 stacked one above the other. In particular, the layer stack 60 comprises at least two electrically conductive first layers 62 for carrying a first current and at least two electrically conductive second layers 64 for carrying a second current. The first electrical current direction 34 of the first current is opposite the second electrical current direction 36 of the second current. The first and second layers 62, 64 are arranged one above the other in an alternating manner in a first direction 90. At least one insulating layer 66 is arranged between each of the first and second layers 62, 64 to electrically insulate the first and second layers 62, 64 from one another.The layers 62, 64, 66 may have such flexibility that the layer stack 60 can be easily bent without being damaged, in particular without damaging the layers 62, 64, 66 and / or separating the layers 62, 64, 66 from one another.

[0036] The layers 62, 64, 66 may each have a thickness in the first direction 90 between, for example, 0.1 mm and 0.9 mm, for example, 0.3 mm and 0.7 mm, for example, approximately 0.5 mm. This may allow the layer stack 60 to be bent without damaging it.

[0037] A first through-hole 80 is formed in a first lateral end region 67 of the layer stack 60, wherein the first through-hole 80 extends in the first direction 90 through the entire layer stack 60. In the first lateral end region 67 of the layer stack 60, a second through-hole 82 is formed next to the first through-hole 80. The second through-hole 82 extends in the first direction 90 through the entire layer stack 60. In a second lateral end region 68 of the layer stack 60, a third through-hole 84 is formed. The third through-hole 84 extends in the first direction 90 through the entire layer stack 60. In the second lateral end region 68 of the layer stack, a fourth through-hole 86 is formed next to the third through-hole 84. The fourth through-hole 86 extends in the first direction 90 through the entire layer stack 60.The through-holes 80, 82, 84, 86 are arranged so that they do not overlap. This can help prevent any short circuits from one of the pins 70, 72, 74, 76 to another of the pins 70, 72, 74, 76.

[0038] The first lateral end region 67 of the layer stack 60 comprises a first lateral end of the layer stack 60 (right side of the layer stack 60, as in Fig. 4) and extends towards a second lateral end of the layer stack 60 (left side of the layer stack 60, as shown in Fig. 4). The second lateral end region 68 of the layer stack 60 comprises the second lateral end of the layer stack 60 and extends toward the first lateral end of the layer stack 60. The second lateral end is opposite the first lateral end. The first lateral end region 67 does not overlap with the second lateral end region 68. The first lateral end region 67 is spaced a positive distance from the second lateral end region 68, such that a middle region is disposed between the first and second lateral end regions 67, 68.

[0039] An electrically conductive first pin 70 for electrically contacting the first layers 62 is arranged in the first through-hole 80, is electrically coupled to the first layers 62, and is electrically insulated from the second layers 64. An electrically conductive second pin 72 for electrically contacting the second layers 64 is arranged in the second through-hole 82, is electrically coupled to the second layers 64, and is electrically insulated from the first layers 62. An electrically conductive third pin 74 for electrically contacting the first layers 62 is arranged in the third through-hole 84, is electrically coupled to the first layers 62, and is electrically insulated from the second layers 64.An electrically conductive fourth pin 76 for electrically contacting the second layers 64 is arranged in the fourth through-hole 86, is electrically coupled to the second layers 64 and is electrically insulated from the first layers 62.

[0040] The first pin 70 can be electrically coupled to the first DC terminal 42, for example, by welding, for example, by laser welding. The second pin 72 can be electrically coupled to the second DC terminal 44, for example, by welding, for example, by laser welding. The third pin 74 can be electrically coupled to the third DC terminal 47, for example, by welding, for example, by laser welding. The fourth pin 76 can be electrically coupled to the fourth DC terminal 48, for example, by welding, for example, by laser welding.

[0041] The first and third pins 70, 74 are designed for electrically contacting the first layers 62. Therefore, the first current can be transported, for example, from the first pin 70 via the first layers 62 to the third pin 74. The second and fourth pins 72, 76 are designed for electrically contacting the second layers 64. Therefore, the second current can be transported, for example, from the fourth pin 76 via the second layers 64 to the second pin 72. The first and second currents therefore flow in opposite directions through the layer stack 60, so that the corresponding current loop is mixed.

[0042] The first and third pins 70, 74 may be electrically coupled to the first layers 62 by the first and third pins 70, 74 contacting the first layers 62 in the first and third through-holes 80, 84, respectively. In particular, the first and third pins 70, 74 may be formed and arranged to contact inner walls of the first and third through-holes 80, 84, respectively, at the first layers 62. Alternatively, the first and third pins 70, 74 may be electrically coupled to the first layers 62 by electrically conductive first means (not shown) arranged between the first and third pins 70, 74 and the first layers 62 in the first and third through-holes 80, 84, respectively. The electrically conductive first means may be electrically conductive plating, coating, or adhesive, such as solder, solder paste, or an electrically conductive glue.

[0043] The second and fourth pins 72, 76 may be electrically coupled to the second layers 64 by the second and fourth pins 72, 76 contacting the second layers 64 in the second and fourth through-holes 82, 86, respectively. In particular, the second and fourth pins 72, 76 may be formed and arranged to contact inner walls of the second and fourth through-holes 82, 86, respectively, at the second layers 64. Alternatively, the second and fourth pins 72, 76 may be electrically coupled to the second layers 64 by electrically conductive second means (not shown) arranged between the second and fourth pins 72, 76 and the second layers 64 in the second and fourth through-holes 82, 86, respectively. The electrically conductive second means may be electrically conductive plating, coating, or adhesive, such as solder, solder paste, or an electrically conductive glue.

[0044] The second and fourth pins 72, 76 can be electrically insulated from the first layers 62, for example, by electrically insulating first coatings 88 formed on inner walls of the first layers 62 in the second and fourth through-holes 82, 86. The first and third pins 70, 74 can be electrically insulated from the second layers 64, for example, by electrically insulating first coatings 89 formed on inner walls of the second layers 64 in the first and third through-holes 70, 74.

[0045] A lateral direction, which may be referred to as the second direction 92, is perpendicular to the first direction 90. The second lateral end region 68 is arranged at an opposite lateral end of the layer stack 60 with respect to the first lateral end region 67. For ease of explanation, it is assumed in this description that the layer stack 60 is oriented such that the first direction 90 is the vertical direction, as in Fig. 4, Fig. 7 and Fig. 8. With this orientation, the lateral ends of the layer stack 60 correspond to horizontal ends of the layer stack 60. In reality, however, the layer stack 60 may be oriented differently, in which case the first direction 90 may no longer be vertical and the second direction 92 may still be perpendicular to the first direction 90.

[0046] Fig. 5 shows a plan view of the busbar assembly 40 of Fig. 4. From Fig. 5 it can be seen that the second coatings 89 can surround the first and third pins 70, 74, in particular completely.

[0047] Fig. Figure 6 shows a bottom view of the busbar assembly 30 of Fig. 4. From Fig. 6 it can be seen that the first coatings 88 can surround the second and fourth pins 72, 76, in particular completely.

[0048] Fig. 7 shows a side view of a cross section of an exemplary embodiment of a busbar assembly 30 for the power module 20 of Fig. 1. The Fig. 7 can generally be the busbar arrangement 30 shown with reference to Fig. 4 to 6. Therefore, only the features of the busbar arrangement 30 described in Fig. 7, in which the busbar arrangement 30 of Fig. 7 of the busbar arrangement 30 of Fig. 4 to 6 in order to avoid unnecessary repetition and to ensure a concise description.

[0049] At least one of the pins 70, 72, 74, 76, e.g. all of the pins 70, 72, 74, 76, comprise a recess 94, e.g. for receiving a fixing means 96 (see Fig. 8). The recess 94 extends through the corresponding pin 70, 72, 74, 76 in the first direction 90. The pin 70, 72, 74, 76 may include a longitudinal axis, and the recess 94 may extend along the longitudinal axis of the pin 70, 72, 74, 76. This may enable mechanical attachment of the busbar assembly 30 to the DC connection 26 and / or to the converter stage 22 of the power module 20, e.g., via the fixing means 96. The pins 70, 72, 74, 76 may thus provide a dual function. In particular, the first and third pins 70, 74 may provide the functions of electrically coupling the first layers 62 to each other and electrically coupling the first layers 62 to the first and third DC terminals 42, 47 of the power module 20.Similarly, the second and fourth pins 72, 76 may provide the functions of electrically coupling the second layers 64 to each other and electrically coupling the second layers 64 to the second and fourth DC terminals 44, 48 of the power module 20.

[0050] Fig. Figure 8 shows a side view of a cross-section of an exemplary embodiment of a busbar assembly 30 for the power module 20 of Fig. 1. The Fig. The busbar arrangement 30 shown in Figure 8 may generally be similar to that shown in Figure 8 Fig. 7. Therefore, only the features of the busbar arrangement 30 described in Fig. 8, in which the busbar arrangement 30 of Fig. 8 of the busbar arrangement 30 of Fig. 7 in order to avoid unnecessary repetition and to ensure a concise description.

[0051] The power module 20 may include one or more fasteners 96 for mechanically coupling the busbar assembly 30 to the DC link 26, the DC capacitor 28, and / or the DC device 24, and / or for mechanically coupling the busbar assembly 30 to the converter stage 22. For example, the power module 20 may provide a fastener 96 for each of the pins 70, 72, 74, 76. The fastener 96 may be arranged to extend through the recesses 94 of the corresponding pins 70, 72, 74, 76. In this way, the DC link 26, the DC capacitor 28, and / or the DC device 24 may be mechanically coupled to the converter stage 22 through the busbar assembly 30.

[0052] The fixing means 96 can be a bolt or a screw. In the case of a screw, an internal thread can be formed in the recess 94 of the corresponding pin 70, 72, 74, 76, wherein the internal thread is designed such that the screw can be screwed into the internal thread.

[0053] With regard to the first and second electrical current directions 34, 36, it is noted that in this description, the current directions 34, 36 may refer to the electrical current direction or the physical current direction. Furthermore, during operation of the power module, the current in one of the electrically conductive layers 62, 64 may flow in the first electrical current direction 34 at one time and in the second electrical current direction 36 at another time, depending on the operating state of the power module 20. Therefore, in the context of the present invention, the first and second electrical current directions 34, 36 may be interchangeable; it is only important that the first electrical current direction 34 is opposite to the second electrical current direction 36 in order to keep the induced inductance low.

[0054] Although the invention has been fully illustrated and described in the drawings and the above description, such illustration and description are not to be considered limiting, but merely illustrative or exemplary. In particular, the invention is not limited to the above embodiments. For example, the bus bar assembly 30 may include more or fewer electrically conductive layers 62, 64 and insulating layers 66 between these layers 62, 64. Other modifications to the disclosed embodiments will be understood and effected by those skilled in the art practicing the claimed invention from a study of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality.A single processor, controller, or other unit may perform the functions of several items recited in the claims. The mere fact that certain measures are recited in different dependent claims does not indicate that a combination of those measures cannot be advantageously used. Any reference signs in the claims should not be construed as limiting the scope of protection. List of reference symbols 20 power module 22 converter stage 24 DC device 26 DC connection 28 DC capacitor 30 Busbar arrangement 32 parasitic inductance 34 first electrical current direction 36 second electrical current direction 38 semiconductor device 40 AC outlets 42 first DC connection 44 second DC connection 46 semiconductor chips 47 third DC connection 48 fourth DC connection 50 conventional busbar arrangement 52 conventional first conductor 54 conventional second conductor 56 insulating foil 60 layer stacks 62 first layer 64 second layer 66 insulating layer 67 first lateral end region 68 second lateral end region 70 first pin 72 second pin 74 third pin 76 fourth pin 78 Axis 80 first through hole 82 second through hole 84 third through hole 86 fourth through hole 88 first coating 89 second coating 90 first direction 92 second direction 94 recess 96 Fixatives

Claims

[1] Busbar arrangement (30) for a power module (20), the busbar arrangement (30) comprising: a layer stack (60) with at least two electrically conductive first layers (62) for carrying a first current, at least two electrically conductive second layers (64) for conducting a second current, wherein a first electrical current direction (34) of the first current is opposite to a second electrical current direction (36) of the second current, and wherein the first and second layers (62, 64) are arranged one above the other in a first direction (90) in an alternating manner, at least one insulating layer (66) between each of the first and second layers (62, 64) for electrically isolating the first and second layers (62, 64) from each other, a first through-hole (80) in a first lateral end region (67) of the layer stack (60), wherein the first through-hole (80) extends in the first direction (90) through the entire layer stack (60) and wherein a lateral direction is perpendicular to the first direction (90), a second through-hole (82) in the first lateral end region (67) of the layer stack (60) adjacent to the first through-hole (80), wherein the second through-hole (82) extends in the first direction (90) through the entire layer stack (60), a third through-hole (84) in a second lateral end region (68) of the layer stack (60), wherein the third through-hole (84) extends in the first direction (90) through the entire layer stack (60) and wherein the second lateral end region (68) is arranged at a lateral end of the layer stack (60) opposite the first lateral end region (67), a fourth through-hole (86) in the second lateral end region (68) of the layer stack (60) adjacent to the third through-hole (84), the fourth through-hole (84) extending in the first direction (90) through the entire layer stack (60); an electrically conductive first pin (70) for electrically contacting the first layers (62), the first pin (70) being arranged in the first through-hole (80), being electrically coupled to the first layers (62) and being electrically insulated from the second layers (64); an electrically conductive second pin (72) for electrically contacting the second layers (64), the second pin (72) being arranged in the second through-hole (82), being electrically coupled to the second layers (64) and being electrically insulated from the first layers (62); an electrically conductive third pin (74) for electrically contacting the first layers (62), wherein the third pin (74) is arranged in the third through-hole (84), is electrically coupled to the first layers (62) and is electrically insulated from the second layers (64); and an electrically conductive fourth pin (76) for electrically contacting the second layers (64), wherein the fourth pin (76) is arranged in the fourth through-hole (86), is electrically coupled to the second layers (64) and is electrically insulated from the first layers (62). [2] The busbar assembly (30) of claim 1, wherein the through holes (80, 82, 84, 86) are arranged so as not to overlap. [3] Busbar arrangement (30) according to one of the preceding claims, wherein the first and third pins (70, 74) are electrically coupled to the first layers (62) by the first and third pins (70, 74) contacting the first layers (62) in the first and third through-holes (80, 84), respectively, and / or the second and fourth pins (72, 76) are electrically coupled to the second layers (64) by the second and fourth pins (72, 76) contacting the second layers (64) in the second and fourth through-holes (82, 86), respectively. [4] Busbar arrangement (30) according to one of the preceding claims, wherein the second and fourth pins (72, 76) are electrically insulated from the first layers (62) by electrically insulating first coatings (88) formed on inner walls of the first layers (62) in the second and fourth through-holes (82, 86) and / or the first and third pins (70, 74) are electrically insulated from the second layers (64) by electrically insulating second coatings (89) formed on inner walls of the second layers (64) in the first and third through-holes (80, 84). [5] Busbar assembly (30) according to one of the preceding claims, wherein at least one of the terminals (70, 72, 74, 76) comprises a recess (94) for receiving a fixing means (96), the recess (94) extending in the first direction (90) through the corresponding pin (70, 72, 74, 76). [6] Busbar arrangement (30) according to claim 5, wherein the fixing means (96) is a screw and an internal thread is formed in the recess (94) of the corresponding pin (70, 72, 74, 76), wherein the internal thread is designed such that the screw can be screwed into the internal thread. [7] Power module (20), comprising: a converter stage (22) for converting an alternating current into a direct current or a direct current into an alternating current; a DC connection (26) for electrically coupling the converter stage (22) to a DC device (24); and at least one busbar arrangement (30) according to one of the preceding claims, wherein the busbar arrangement (30) electrically couples the converter stage (22) to the DC connection (26). [8] Power module (20) according to claim 7, wherein the converter stage (22) comprises a first DC terminal (42) electrically coupled to a first pin (70) of the busbar arrangement (30) and a second DC terminal (44) electrically coupled to a second pin (72) of the busbar arrangement (30) and / or the DC connection (26) comprises a third DC terminal (47) electrically coupled to a third pin (74) of the busbar assembly (30) and a fourth DC terminal (48) electrically coupled to a fourth pin (76) of the busbar assembly (30). [9] Power module (20) according to claim 8, wherein the DC connection (26) comprises a DC capacitor (28) and the DC capacitor (28) is electrically coupled to the first DC terminal (42) and the second DC terminal (44). [10] Power module (20) according to one of claims 8 or 9, wherein the busbar arrangement (30) is mechanically coupled to the converter stage (22) and / or the DC connection (26) by one or more fixing means (96) extending through recesses (94) of the corresponding pins (70, 72, 74, 76). [11] Power module (20) according to one of the preceding claims, which is designed as an electrical inverter.

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