Method and device for monitoring a manufacturing process on a component

Abstract

The invention relates to a method for monitoring a manufacturing process on a component (12), wherein the component (12) is machined at at least two machining points during the manufacturing process, wherein the at least two machining points are checked by sensors to determine whether the machining of the machining point is error-free or faulty, wherein a machining point checked as faulty is permanently marked on the component (12).The invention further relates to a device (10) for monitoring a manufacturing process on a component (12), wherein the device (10) comprises a processing device (14) and a testing device (16), wherein the processing device (14) processes the component (12) at at least two processing points during the manufacturing process, wherein the testing device (16) uses sensors to test the at least two processing points to determine whether the processing of the processing point is error-free or faulty, wherein the device (10) comprises a marking device (18), wherein the marking device (18) is designed to permanently mark a processing point on the component (12) that has been checked as faulty with a marking (74). In addition, the invention comprises a component (12) in which a faulty processing point is permanently marked on the component (12).

Description

State of the art

[0001] The invention relates to a method and a device for monitoring a manufacturing process on a component, as well as the component.

[0002] DE 199 62 967 A1 discloses a method for monitoring a manufacturing process in which recorded measured values ​​are compared with process limits and, if the process limits are exceeded, a corresponding error signal is issued. Disclosure of the inventionAdvantages of the invention

[0003] The method according to the invention for monitoring a manufacturing process on a component, wherein the component is machined at at least two processing points during the manufacturing process, wherein the at least two processing points are checked by sensors in such a way, in particular to determine whether the processing of the processing point is error-free or faulty, wherein a processing point checked as faulty is permanently marked on the component, has the advantage that structures can be flexibly marked so that detected anomalies are made visible and thus subsequently traceable without impairing the actual component functionality. This has the advantage of enabling rework of the detected defects, since the position of the defects, for example, along the weld seam, can be traced.This advantage is already achieved with a simple marking, which can be used to mark the exact position of an anomaly or a corresponding area. Because the position is precisely known, a qualified assessment can be made quickly as to whether further testing or, if necessary, rework is advisable. Overall, the method has the advantage that there is less scrap in the manufacturing process, as the permanent marking enables targeted rework. Furthermore, once identified, scrap remains traceable if no rework is carried out, thus preventing the risk of it being placed on the market. A further advantage is that the visual inspection is supported both in machine testing and in testing by a quality inspector, as any anomalies can be identified immediately.

[0004] A method is particularly advantageous in which the processing point on the component that has been checked as defective is permanently marked with a marking laser and / or a processing laser, in particular is permanently marked by engraving, since engraving can be carried out particularly quickly and easily by a marking laser or by the processing laser.

[0005] A method is also advantageous in which the processing location on the component that has been checked as defective is permanently marked in the immediate vicinity of the processing location that has been checked as defective with at least one identifier, in particular with at least one arrow and / or with at least one cross and / or with at least one dot, in particular as a defective area. Marking with a simple identifier, such as an arrow or a cross, can be carried out particularly quickly, thus ensuring short production times. Immediate vicinity means in particular a distance of less than 20 mm, in particular less than 10 mm, preferably a distance of less than 5 mm, between the identifier and the processing location that has been checked as defective.

[0006] A particularly advantageous method is one in which the processing point on the component that has been inspected as defective is permanently marked with an optical code, in particular a barcode and / or a QR code. It is advantageous if the optical code contains error information and / or a link to a storage location for the error information of the processing point. By designing the marking as a barcode or a QR code (QR: Quick Response), detailed information about the type of anomaly found can be stored directly on the welded component and made accessible at any time. This ensures that even after a longer period of time, it is still possible to trace why a component was (initially) classified as scrap and whether re-inspection and / or rework is possible and advisable.Finally, components for which rework is not advisable can be directly marked so that they are always recognizable as scrap, thus preventing the accidental installation of defective parts. This can be done, for example, by applying a cross over the machining area or weld seam, so that the intersection point of the cross lies on the machining area or weld seam.

[0007] A method is also advantageous in which the position of the processing point on the component is recorded and / or stored, particularly during processing and / or sensory testing. This has the advantage that the current position of the weld is always maintained. This offers the possibility of linking defects directly to the corresponding position. It is advantageous that the processing point on the component identified as defective is permanently marked at the determined and / or stored position after processing using the determined and / or stored position.

[0008] A particularly advantageous method is one in which the manufacturing process involves producing a weld seam using a processing laser, with the weld seam being inspected using sensors to determine whether the weld seam is defect-free or defective along the entire length. This method is particularly advantageous for long weld seams, as the probability of a processing error generally increases with the length of the weld seam. Therefore, marking the defective processing location to facilitate rework is particularly advantageous.

[0009] A particularly advantageous method is one in which the machining area identified as defective and / or the permanently marked machining area of ​​the component is reworked. This has the advantage of reducing scrap and thus increasing the cost-effectiveness of the manufacturing process.

[0010] The invention further comprises a device for monitoring a manufacturing process on a component, wherein the device comprises a processing device and a testing device, wherein the processing device processes the component during the manufacturing process at at least two processing points, wherein the testing device uses sensors to check the at least two processing points to determine whether the processing of the processing point is error-free or faulty, wherein the device comprises a marking device, wherein the marking device is designed to permanently mark a processing point on the component that has been checked as faulty with a mark. In particular, the device is characterized in that - the processing device comprises a processing laser, and / or - the processing device is designed to produce a weld seam, and / or - the marking device comprises a marking laser and / or the processing laser, and / or - the test device comprises a camera and / or a light-sensitive sensor, and / or - the device is designed to carry out the method described above.

[0011] The invention further comprises a component in which a defective processing location is permanently marked on the component. The defective processing location preferably has at least one marking, in particular a laser engraving and / or a laser marking. In particular, the defective processing location is marked with an arrow and / or a cross and / or a dot and / or an optical code, in particular a barcode and / or a QR code. It is particularly advantageous for the permanently marked processing location to have post-processing such that the post-processing renders the processing location error-free.

[0012] The advantages described for the method apply accordingly to the device for monitoring a manufacturing process on a component and the component itself.

[0013] Further advantages will become apparent from the following description of embodiments with reference to the figures and from the dependent claims. Short description of the drawings

[0014] Embodiments of the invention are illustrated in the drawings using several figures and explained in more detail in the following description.

[0015] They show: Fig. 1 a device for monitoring a manufacturing process on a component, Fig. 2 a flowchart of a method for monitoring a manufacturing process on a component, Fig. 3 detailed flow diagram of a procedure for monitoring a manufacturing process on a component, and Fig. 4 examples of characteristics of machining points of a welding track that have been checked as defective. Description of implementation examples

[0016] The following describes a method for monitoring a manufacturing process on a component, wherein the component is machined at at least two processing points during the manufacturing process, wherein the at least two processing points are sensor-checked to determine whether the processing of the processing point is error-free or faulty, wherein a processing point checked as faulty is permanently marked on the component.Furthermore, a device for monitoring a manufacturing process on a component is described, wherein the device comprises a processing device and a testing device, wherein the processing device processes the component at at least two processing points during the manufacturing process, wherein the testing device uses sensors to check the at least two processing points to determine whether the processing of the processing point is error-free or faulty, wherein the device comprises a marking device, wherein the marking device is designed to permanently mark a processing point on the component that has been checked as faulty with a mark. In addition, a component is described in which a faulty processing point is permanently marked on the component. The components of the device and the method necessary for implementing the intelligent defect marking are explained below.

[0017] Fig. 1 shows a device 10 for monitoring a manufacturing process on a component 12. The device comprises a processing device 14, wherein the processing device 14 is designed to process the component 12 during the manufacturing process. The processing device 14 comprises a processing laser 20. In the preferred embodiment, the processing laser 20 is designed as a laser scanner such that the processing laser beam 22 generated by the processing laser 20 can be moved relative to the component 12, so that different areas of the surface of the component 12 are processed sequentially, in particular in the form of a weld seam. The device 10 further comprises a testing device 16. The testing device 16 comprises at least one sensor designed to sensorically test the manufacturing process, in particular the surface of the component 12 processed by the processing laser 20.In the preferred embodiment, the inspection device 16 comprises a camera 24 as a sensor. The camera 24 of the inspection device 16 is designed to optically record the surface of the component 12 processed by the processing laser 20 and to generate image data for further processing. The device 10 further comprises an evaluation device 28. The evaluation device 28 is designed to receive the data acquired by the inspection device 16, in particular the image data from the camera 24, and to evaluate the data. In this case, the inspection device 16, in the preferred embodiment together with the evaluation device 28, is designed to check whether the processing of processing points by the processing laser 20 was carried out error-free or with errors. The device 10 further comprises a marking device 18, wherein the marking device 18 comprises a marking laser 26.The marking device 18 is configured to permanently mark a processing location identified as defective with a marking laser 26 on the component 12 in the immediate vicinity of the processing location identified as defective. In the preferred embodiment, the device 10 comprises two different lasers: the processing laser 20 of the processing device 14 and the marking laser 26 of the marking device 18. In a variant of the preferred embodiment, the processing laser 20 is simultaneously configured as the marking laser 26.Preferably, after processing the component 12 with the processing laser 20, the parameters, in particular the power and / or the focus diameter of the laser beam, of the processing laser 20 are changed, in particular reduced, and the processing laser 20 takes over the function of the marking laser 26 and applies the mark to the component 12. In the preferred embodiment, the described device 10 is designed, which is described below with reference to the . Fig. 2 and Fig. 3 and in particular the procedures described with reference to the Fig. 4 must be applied to the component 12.

[0018] Fig. 2 shows a flow chart of a method for monitoring a manufacturing process on a component, in particular by means of the method described with reference to Fig. 1 described device for monitoring a manufacturing process on a component. After the start 30 of the method, in the first method step 32 the component is processed during the manufacturing process, in particular at least two processing points. The component is preferably processed by a processing laser. In one variant, the component is processed by mechanical processing, for example milling and / or drilling. In the preferred embodiment, a weld seam is created by the processing laser during the manufacturing process. The second method step 34 and the third method step 36 are carried out continuously in parallel to the first method step 32. In the second method step 34, the at least two processing points are sensor-checked to determine whether the processing of the processing point is error-free or faulty.If a processing location is checked as defective, the position of the processing location checked as defective is detected and preferably stored in the second method step 34. In the third method step 36, the processing location checked as defective is permanently marked on the component at the detected position, in particular in the immediate vicinity of the detected position. Preferably, the processing location checked as defective is permanently marked on the component with a marking laser. In particular, the processing location checked as defective is permanently marked on the component in the immediate vicinity of the processing location checked as defective with at least one marking, in particular with at least one arrow and / or with at least one cross and / or with at least one dot.Particularly preferably, the processing location on the component that is inspected as defective is additionally or alternatively permanently marked with an optical code, in particular a barcode and / or a QR code. The optical code contains, in particular, error information and / or a link to a storage location for the error information of the processing location. After completion of the first method step 32, the fourth method step 38 is carried out. In the fourth method step 38, the processed component is optically inspected, in particular optically inspected using a camera. The images generated by the camera are evaluated in such a way that the images are searched for the markings permanently affixed to the component.If a marking is detected, in particular after reading out the error information in the optical code, the processing location checked as faulty by the marking and / or the permanently marked processing location of the component is reworked in the subsequent fifth method step 40. This reaches the end 42 of the method. In one variant of the preferred exemplary embodiment, the second method step 34 and the third method step 36 are not carried out in parallel to the first method step 32, but rather the first method step 32, the second method step 34 and the third method step 36 are carried out sequentially, such that the component is first processed, then checked and finally marked. In a further variant, the second method step 34 is carried out continuously in parallel to the first method step 32.After completion of the processing, the third process step 36 is then carried out, so that the processing of the component and its quality assessment by means of a camera are carried out in parallel and finally the marking takes place.

[0019] Fig. 3 shows a detailed flow chart of the process related to the Fig. 2 for monitoring a manufacturing process on a component. To carry out the method, the device preferably comprises a processing device 14 in the form of a laser scanner and an evaluation device 28, wherein the processing device 14 is connected to the evaluation device 28. The evaluation device 28 is designed to process the current coordinates of the laser scanner in real time or to forward them to an external data acquisition device. The evaluation device 28 also generates a start signal in the form of a start message 50 and a time base adjustment 54, with which a common time base 52 is generated in order to achieve time synchronization 62 between a testing device 16 in the form of a sensor for measuring data acquisition and the position of the laser scanner. This time base 52 is used in particular by the sensors for quality monitoring and data acquisition.This ensures that all sensor data is referenced to a common time base. This enables an exact assignment of all sensor data to the laser scanner coordinates. The quality assessment is performed on a real-time system, which, after data acquisition 56, preprocesses 58 the acquired data and makes the actual decision during evaluation 60. Furthermore, coordination 68 takes place between the evaluation device 28 and the data acquisition 56. The algorithms for assessing quality depend on the application. Preferably, these are evaluations of limit values ​​and / or regression models are used. The assessment of anomalies is preferably available at the end of the welding process. Marking is only useful at the end; the assessment is not mandatory. If the manufacturing process is error-free 64, the process ends.If a processing location is defective 66, this data is transmitted together with the coordinates of the position to the evaluation device 28. This ensures that the type of anomaly and the corresponding coordinates can be transmitted back to the evaluation device 28, which, in a final step, triggers the marking of the anomaly on the component, which is then carried out by the processing laser or a marking laser.

[0020] Fig.4 shows examples of markings 74 of processing points 72 inspected as defective, using the preferred example of a weld path 70. The examples of markings 74 are explained from left to right along the weld path 70. The points on the weld path 70 mark processing points 72 inspected as defective, whereby the points are not markings 74 and are not applied. The points serve solely to illustrate the position of the processing points 72. The first example shows a processing point 72 inspected as defective, which is marked with an arrow 76 as marking 74. Preferably, the arrow 76 is an engraving, in particular a laser engraving, on the surface of the component. The arrow 76 is located outside the weld path 70 in the immediate vicinity of the processing point 72 inspected as defective.The arrowhead of the arrow 76 points in the direction of the processing point 72 that was checked as defective. The second example shows a processing point 72 that was checked as defective and is marked with a cross 78 as an identifier 74. The cross 78 is preferably an engraving, in particular a laser engraving, on the surface of the component. The cross 78 is located outside the weld path 70 in the immediate vicinity of the processing point 72 that was checked as defective. The cross 78 is arranged at a predetermined distance from the weld path 70 and / or substantially at a right angle to the weld path 70. The third example shows a processing point 72 that was checked as defective and is marked with an arrow 76 and a barcode 80 as an identifier 74. The arrow 76 and / or the barcode 80 is preferably an engraving, in particular a laser engraving, on the surface of the component.The arrow 76 is located outside the welding path 70 in the immediate vicinity of the processing point 72 that was checked as defective. The arrowhead of the arrow 76 points in the direction of the processing point 72 that was checked as defective. The barcode 80 is located outside the welding path 70 in the immediate vicinity of the processing point 72 that was checked as defective. A link to a storage location in a memory is preferably encoded in the barcode 80, wherein the storage location contains error information from the storage location that was checked as defective. The fourth example shows a processing point 72 that was checked as defective and is marked with a first arrow 76, a QR code 82, and a second arrow 76 as an identifier 74. The first arrow 76 and / or the QR code 82 and / or the second arrow 76 is preferably an engraving, in particular a laser engraving, on the surface of the component.The first arrow 76 and the second arrow are located outside the welding path 70 in the immediate vicinity of the processing point 72 that has been checked as defective. The arrowheads of the first arrow 76 and the second arrow 76 point in the direction of the welding path 70. The area between the first arrow 76 and the second arrow 76 indicates a defective area 84 within which the processing point 72 that has been checked as defective is located. Between the first arrow 76 and the second arrow 76, the QR code 82 is arranged outside the welding path 70 in the immediate vicinity of the processing point 72 that has been checked as defective.Because the QR code 82 or, in one variant, another optical code, in particular a barcode 80, is located between the first arrow 76 and the second arrow 76, or, in one variant, between a first identifier 74 and a second identifier 74, it follows that the processing location 72 checked as faulty is located between these two identifiers 74. Preferably, error information and / or a link to a memory location in a memory is encoded in the QR code 82, wherein the memory location contains error information of the memory location checked as faulty. The error information is, for example, an indication of the error type, for example, an interruption of the welding path 70. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 199 62 967 A1

[0002]

Claims

[1] Method for monitoring a manufacturing process on a component (12), wherein the component (12) is machined at at least two machining points during the manufacturing process, wherein the at least two machining points are sensor-checked to determine whether the machining of the machining point is error-free (64) or faulty (66), characterized by that a machining point (72) checked as defective (66) is permanently marked on the component (12). [2] Method according to claim 1, characterized by that the processing point (72) on the component (12) which has been checked as defective (66) is permanently marked with a marking laser (26) or a processing laser (20), in particular is permanently marked by an engraving. [3] Method according to one of the preceding claims, characterized bythat the processing point (72) on the component (12) which is checked as defective (66) is permanently marked in the immediate vicinity of the processing point (72) which is checked as defective (66) with at least one marking (74), in particular with at least one arrow (76) and / or with at least one cross (78) and / or with at least one point, in particular as a defective area (84). [4] Method according to one of the preceding claims, characterized by that the processing point (72) on the component (12) which has been checked as defective (66) is permanently marked with an optical code, in particular a barcode (80) and / or a QR code (82). [5] Method according to claim 4, characterized by that the optical code contains error information and / or a link to a storage location for the error information of the processing station. [6] Method according to one of the preceding claims, characterized bythat a position of the processing point on the component (12), in particular during processing and / or sensory testing, is recorded and / or stored. [7] Method according to claim 6, characterized by that the processing point (72) on the component (12) which has been checked as defective (66) is permanently marked at the determined and / or stored position after its processing by means of the determined and / or stored position. [8] Method according to one of the preceding claims, characterized by that the manufacturing process is a production of a weld seam (70) by means of the processing laser (20), wherein the weld seam (70) is sensor-tested in such a way as to determine whether the weld seam (70) is free of defects (64) or defective (66) along the weld seam (70). [9] Method according to one of the preceding claims, characterized bythat the machining point (72) checked as defective (66) and / or the permanently marked machining point of the component (12) is reworked. [10] Device (10) for monitoring a manufacturing process on a component (12), wherein the device (10) comprises a processing device (14) and a testing device (16), wherein the processing device (14) processes the component (12) during the manufacturing process at at least two processing points, wherein the testing device (16) sensorily tests the at least two processing points in such a way as to determine whether the processing of the processing point is error-free (64) or faulty (66), characterized by that the device (10) comprises a marking device (18), wherein the marking device (18) is designed to permanently mark a processing point (72) on the component (12) that has been checked as defective (66) with a mark (74). [11] Device (10) according to claim 10, characterized by , that - the processing device (14) comprises a processing laser (20), and / or - the processing device (14) is designed to produce a weld seam (70), and / or - the marking device (18) comprises a marking laser (26) and / or the processing laser (20), and / or - the testing device (16) comprises a camera (24) and / or a light-sensitive sensor, and / or - the device (10) is designed to carry out the method according to one of claims 1 to 9. [12] Component (12) in which a defective (66) machining point on the component (12) is permanently marked. [13] Component (12) according to claim 12, characterized by that the faulty (66) processing point has at least one marking (74), in particular a laser engraving. [14] Component (12) according to claim 13, characterized bythat the faulty (66) processing point is marked with an arrow (76) and / or a cross (78) and / or a dot and / or an optical code, in particular a barcode (80) and / or a QR code (82). [15] Component (12) according to one of claims 12 to 14, characterized by that the permanently marked processing point has been reworked in such a way that the processing point is free of errors (64) as a result of the rework.

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