Actuator with a control unit

Abstract

An actuator (1) comprises a control unit (3) and a cylindrical housing (10) in which the actuator (1) and the control unit (3) are accommodated. A heat sink (20) extends in an axial direction (2) in the cylindrical housing (10) and is in thermal contact therewith. The heat sink (20) comprises at least a first part (22) and a second part (23). A single multilayer printed circuit board (5) in a middle ground layer (7) also extends in the axial direction (2) in the cylindrical housing (10) and is located between the first part (22) and a second part (23) of the heat sink (20). A plurality of projections (25) projecting in a radial direction (4) of the first part (22) and the second part (23) of the heat sink (20) thermally contact the multilayer printed circuit board (5), divide the heat sink (20) into a plurality of subsections (211, 212,..., 21 N ) and thus provide electromagnetic compatibility.

Description

[0001] The invention relates to an actuator with a control unit. State of the art

[0002] In the automotive sector, systems with cylindrical actuators are often used. Examples include roll stabilizers or rear-axle steering systems. These are often 12-volt or 48-volt (low-voltage) systems. The cylindrical shape has the advantage that it can be positioned between two tires, as is often necessary in chassis systems.

[0003] Cylindrical actuators often comprise an actuator housing, a control unit, a motor, and sensors (cylindrical control unit architecture). They comprise hardware, software, and mechanical components. The control unit, which generates the control signals for the motor, must be fitted into the cylindrical actuator housing. Furthermore, the three motor phases must be connected to the motor. Sensor signals, such as temperature and rotor position signals, must also be connected from the motor to the control unit.

[0004] The control unit comprises a certain amount of power electronics circuitry and a further portion of logic circuitry. In the current state of the art, several circuit boards are often used in cylindrical arrangements to accommodate the individual circuit components.

[0005] A control unit typically has interfaces to the vehicle manufacturer. For 12-volt systems, for example, the terminal designations are typically Terminal 30 (positive wire directly from the battery) and Terminal 31 (negative wire directly from the battery or vehicle ground) for supplying the power electronics. A separate power supply is often also provided for the logic circuits. In addition, additional logic signals usually need to be routed externally, such as CAN bus signals. Depending on the system, additional logic signals may also be routed externally.

[0006] In addition, the demands on cylindrical ECU architectures in the automotive sector are also high. On the one hand, thermal requirements must be considered. On the other hand, the strict electromagnetic compatibility (EMC) requirements must be met. This requires filter circuits with large and heavy components, such as common mode chokes and differential mode chokes, especially for power electronics. Further requirements arise from the available installation space. All of these requirements repeatedly lead to challenges in the arrangement of the various ECU components in cylindrical housings when improving or redesigning actuators.

[0007] With regard to the known prior art, reference is further made to DE 10 2017 200 556A1, DE 10 2014 203 207 A1, DE 10 2021 211 662 A1, US 2018 / 0 288 873 A1 and DE 44 43 498 C1. Overview of the invention

[0008] It is therefore an object of the invention to provide an actuator with a control unit, wherein the architecture of the control unit is improved with regard to thermal and EMC properties.

[0009] This object is achieved by an actuator comprising the features of claim 1.

[0010] In one embodiment, an actuator comprises a control unit and a cylindrical housing in which the actuator and the control unit are housed. A heat sink extends in an axial direction within the cylindrical housing and is in thermal contact with it. The heat sink can comprise at least a first part and a second part, optionally even more than two parts.

[0011] The first and second parts of the cylindrical heat sink each form half a cylinder with a semicircle as a cross-section.

[0012] In one embodiment, a single printed circuit board (PCB) consisting of two or more layers in a central grounding layer (ground layer, ground layer, GND) also extends axially within the cylindrical housing and is located between the first part and a second part of the heat sink. A single, shared printed circuit board for logic and power electronics is important because, compared to multiple printed circuit boards, it offers the advantage that a ground layer with the largest possible area in the center of the printed circuit board can act as a shield between the logic and power electronics. This reduces the interference from the noisy power signals.

[0013] In one embodiment, a plurality of projections are provided that protrude in a radial direction from the first part and the second part of the heat sink. The projections thermally contact the multilayer circuit board, divide the heat sink into several subsections, and thus provide improved electromagnetic compatibility (EMC).

[0014] With such a heat sink, such a single multilayer circuit board, and such protrusions, the architecture of the actuator control unit is improved in terms of thermal and EMC properties. In particular, both EMC and thermal properties are considered in their entirety with the combination of the previously described features. The combination of these features creates a robust overall concept for an actuator, especially for control units in the low-voltage range, for example, 12 volts and 48 volts.

[0015] By axially dividing the heat sink into a first and a second part by means of the single multilayer circuit board, and by radially dividing the cylindrical space of the heat sink into several subsections by means of the projections, the circuit board can advantageously be contacted at several points for heat dissipation, and individual areas of the circuit board can advantageously be shielded from each other with regard to EMC. The heat sink can, for example, consist of two parts.

[0016] Another important aspect is the arrangement of the components. In one embodiment, the single multilayer circuit board carries power electronics on the side of the multilayer circuit board facing the first part of the heat sink. In another embodiment, the single multilayer circuit board carries logic on the side of the multilayer circuit board facing the second part of the heat sink. In another embodiment, the protruding projections of the heat sink, together with the middle ground layer of the multilayer circuit board, shield the power electronics from the logic.

[0017] In one embodiment, consistent with the above-described division of power electronics and logic, at least one logic connector for the logic is arranged in the second part of the heat sink at an input of the control unit on the housing. The at least one logic connector supplies the logic with logic signals. Each logic connector has one or a plurality of logic outputs for the logic.

[0018] In a further embodiment, at least one power connector for the power electronics is arranged in the first part of the heat sink at the input of the control unit on the housing. The at least one power connector supplies the power electronics with voltage, for example, via a terminal block 30 and / or a terminal block 31. Typically, only one power connector is provided. However, multiple power connectors can also be provided. The type of arrangement of the outlined components is therefore relevant and part of the invention. As described above, a distinction is made between logic and power electronics, which are arranged separately within the heat sink. The power electronics are arranged in the first (e.g., upper) part of the cylindrical heat sink (above the circuit board), and the logic with its circuits are arranged in the second (e.g., lower) part of the cylindrical heat sink.Accordingly, the connectors for logic and power electronics must also be arranged in the respective first and second parts (each half a cylinder with a semicircle as a cross-section in the cylindrical heat sink), as also described above.

[0019] In one embodiment, a connection or interconnection plate, optionally additionally with lead frames, is provided at the input of the control unit, and another connection or interconnection plate, optionally additionally with other lead frames, is also provided at the output of the control unit as part of the architecture. The respective connection plate at the input or output serves to connect the interfaces of the control unit to the surrounding components.

[0020] In particular, in one embodiment, at the input of the control unit, both the at least one power connector with its respective outputs and the at least one logic connector with its respective outputs are connected to a side of a first connection plate facing the housing. Accordingly, the first connection plate extends from the first part into the second part of the heat sink. In addition, a first leadframe can be arranged on the first connection plate, specifically on the side of the first connection plate facing the power electronics and within the first part of the heat sink for the power electronics. In addition, a second leadframe can be arranged on the first connection plate, specifically on the side of the first connection plate facing the logic and within the second part of the heat sink for the logic.The two leadframes, the first and the second, are therefore always arranged in only one part, the first part or the second part, of the heat sink and are therefore assigned either only to the power electronics or only to the logic.

[0021] In particular, a second connection plate with its outputs from the power electronics and logic can be connected to a motor at the output of the control unit. Accordingly, here too, the second connection plate extends from the first part into the second part of the heat sink. Additionally, a third leadframe can be arranged on the second connection plate, specifically on the side of the second connection plate facing the power electronics and within the first part of the heat sink for the power electronics. Additionally, a fourth leadframe can be arranged on the second connection plate, specifically on the side of the second connection plate facing the logic and within the second part of the heat sink for the logic.These two, the third and the fourth, lead frames are also always arranged in only one part, the first part or the second part, of the heat sink and are therefore assigned either only to the power electronics or only to the logic.

[0022] In one embodiment, a subsection of the first part of the heat sink for the power electronics following the first leadframe of the control unit's input (second subsection, directly after the power supply interface) comprises at least one EMC filter. The at least one EMC filter includes, for example, a common-mode choke (also called a current-compensated choke, or CMC for short), a differential-mode choke (also called DMC for short), and X and Y capacitors.

[0023] In a further embodiment, a next subsection (third subsection) of the first part comprises a driver circuit. The driver circuit comprises, for example, at least DC link capacitors and a gate driver, optionally also other components of the driver circuit.

[0024] In yet another embodiment, a B6 bridge is arranged in a subsequent subsection (fourth subsection) of the first part of the heat sink.

[0025] The advantages of this arrangement in the aforementioned three subsections (second, third, and fourth subsections) are numerous. Firstly, the highly noise-prone B6 bridge is shielded from other circuit components. Furthermore, the EMC-filtered second subsection is also shielded from the outside. This allows a plastic cover to be used as the actuator housing without any concerns.

[0026] In one embodiment, the common-mode choke, the differential-mode choke, and the DC-link capacitors are mounted in a bracket and thus connected to the heat sink. The bracket is made of plastic, for example. This has the advantage that heavy components such as the common-mode choke (CMC), the differential-mode choke (DMC), and at least one DC-link capacitor can be connected to the heat sink with a plastic bracket, thus passing vibration tests.

[0027] This arrangement can be adopted in a similar way for the logic with regard to EMC filtering. In one embodiment, at least one EMC filter for the logic is located in a subsection (second subsection) of the second part of the heat sink for the logic that follows the second leadframe of the control unit input. In a further embodiment, at least one further circuit is provided in a next subsection (third subsection) and / or in a further subsequent subsection (fourth subsection) of the second part of the heat sink for the logic. The further circuit can be a µ-controller, for example. The third and fourth subsections can also be combined or, depending on the existing circuits, used for one or more further separations of circuit subsections.

[0028] In one embodiment, the circuit board interacts with contact springs in the heat sink. The circuit board can be pressed against the heat sink using the contact springs in the heat sink. This allows the ground layer (ground layer, ground layer, ground (GND)) of the circuit board to be connected to the housing at multiple points. Together with existing contact pads (thermal pads; see the next paragraph) on the circuit board, this provides an extremely low-impedance connection to the heat sink or housing. This is advantageous for EMC emissions.

[0029] In one embodiment, the circuit board is connected to the heat sink via at least one thermal contact. The contact is, for example, indirectly via a paste or directly via thermal pads on the circuit board or metal surfaces on the circuit board. Such a good thermal connection between the components and the heat sink ensures heat dissipation between the component and the heat sink, even under high thermal loads.

[0030] In one embodiment, the actuator's heat sink is made of aluminum. The actuators with control units described in this way can be used, for example, in roll stabilizers and rear-axle steering systems. Short description of the drawings

[0031] The invention and its advantages are described in more detail below with reference to the attached schematic drawings. Fig. 1 shows a schematic representation of the rough structure of an embodiment of the actuator with control unit; Fig. 2 shows a schematic representation of the more detailed structure of an embodiment of the actuator with control unit; and Fig. 3 shows a sectioned front view of the housing of the actuator with control unit.

[0032] In the following, exemplary embodiments will explain the invention and its advantages in more detail with reference to the accompanying figures. The proportions in the figures do not always correspond to the actual proportions, as some shapes are simplified and others are shown enlarged relative to other elements for better illustration. Detailed description of the drawings and embodiments

[0033] Fig. 1 shows a schematic representation of the rough structure of an embodiment of the actuator 1 with a control unit 3. Fig. Figure 2 shows a schematic representation of the more detailed structure of an embodiment of the actuator 1 with control unit 3. The actuator 1 comprises the control unit 3 and a cylindrical housing 10 in which the actuator 1 and the control unit 3 are housed. A heat sink 20 extends in an axial direction 2 within the cylindrical housing 10 and is in thermal contact with it. The heat sink 20 can comprise at least a first part 22 and a second part 23, optionally even more than two parts.

[0034] As in Fig. 3, the first and second parts 22, 23 of the cylindrical heat sink 20 each form half a cylinder with a semicircle as a cross-section.

[0035] Referring again to Fig. 1, in one embodiment, a single multilayer printed circuit board (PCB) 5 extends in a central grounding layer 7, also in the axial direction 2, in the cylindrical housing 10 and is located between the first part 22 and a second part 23 of the heat sink 20. A single common printed circuit board 5 for a logic 13 and a power electronics 14 is important because, compared to multiple printed circuit boards, it offers the advantage that a ground layer with the largest possible area in the center of the printed circuit board 5 can function as a shield between the logic 13 and the power electronics 14. Thus, the interference-prone power signals cannot interfere with the logic signals.

[0036] In one embodiment, a plurality of projections 25 are provided, projecting in a radial direction 4 of the first part 22 and the second part 23 of the heat sink 20. The projections 25 thermally contact the multilayer circuit board 5, dividing the heat sink 20 into a plurality of subsections 211, 212,..., 21 N and thus provide electromagnetic compatibility (EMC).

[0037] With such a heat sink 20, such a single multilayer circuit board 5, and such protrusions 25, the architecture of the control unit 3 of the actuator 1 is improved in terms of thermal and EMC properties. In particular, both EMC and thermal properties are considered in their entirety with the combination of the previously described features. By combining these features, a robust overall concept is created for an actuator 1, especially for control units 3 in the low-voltage range, for example, 12 volts and 48 volts.

[0038] By axially dividing the heat sink 20 into a first part 22 and a second part 23 by means of the single multi-layer printed circuit board 5 and by radially dividing the cylindrical space of the heat sink 20 into several subsections 211, 212,..., 21 N By means of the projections 25, the circuit board 5 can advantageously be contacted at several points for heat dissipation, and individual areas of the circuit board 5 can advantageously be shielded from each other with regard to EMC. The heat sink 20 can, for example, consist of two parts 22, 23.

[0039] Another important aspect is the arrangement of the components. In one embodiment, the single multilayer circuit board 5 carries power electronics 14 on the side of the multilayer circuit board 5 facing the first part 22 of the heat sink 20. In another embodiment, the single multilayer circuit board 5 carries logic 13 on the side of the multilayer circuit board 5 facing the second part 23 of the heat sink 20. In another embodiment, the protruding projections 25 of the heat sink 20, together with the middle ground layer 7 of the multilayer circuit board 5, shield the power electronics 14 from the logic 13.

[0040] In one embodiment, matching the above-described division of power electronics 14 and logic 13, at least one logic connector 15 for logic 13 is arranged at an input 11 of control unit 3 on housing 10 in the second part 23 of heat sink 20. The at least one logic connector 15 supplies logic 13 with logic signals. Each logic connector 15 has one or a plurality of logic outputs 151 to logic 13.

[0041] In a further embodiment, at least one power connector 16 for the power electronics 14 is arranged in the first part 22 of the heat sink 20 at the input 11 of the control unit 3 on the housing 10. The at least one power connector 16 supplies the power electronics 14 with voltage, for example, via a terminal 30 and / or a terminal 31. Typically, only one power connector 16 is provided. However, multiple power connectors 16 can also be provided.

[0042] The type of arrangement of the outlined components is therefore relevant and part of the invention. As described above, a distinction is made between logic 13 and power electronics 14, and these are arranged separately within the heat sink 20. The power electronics 14 is arranged in the first (in Fig. 1 and Fig. 2 for example upper) part 22 of the cylindrical heat sink 20 (above the circuit board 5) and the logic 13 with its circuits in the second (in Fig. 1 and Fig. 2 (for example, the lower) part 23 of the cylindrical heat sink 20. Accordingly, the connectors 16, 15 for the logic 13 and power electronics 14 must also be arranged in the respective first part 22 and second part 23 (each half a cylinder with a semicircle as a cross-section in the cylindrical heat sink 20), as also described above.

[0043] Referring to Fig. 1 and Fig. 2, in one embodiment, a connection or interconnection plate 8, optionally additionally with lead frames 9, at the input 11 of the control unit 3, and another connection or interconnection plate 18, optionally additionally with other lead frames 19, at the output 12 of the control unit 3 are also provided as part of the architecture. The connection plate 8 at the input 11 and the connection plate 18 at the output 12 serve to connect the interfaces of the control unit 3 to the surrounding components.

[0044] In particular, in one embodiment, at the input 11 of the control unit 3, both the at least one power connector 16 with its respective outputs 161 and the at least one logic connector 15 with its respective outputs 151 are connected to a side of a first connection plate 8 facing the housing 10. Accordingly, the first connection plate 8 extends from the first part 22 into the second part 23 of the heat sink 20. In addition, a first (in Fig. 2 the upper left) leadframe 9 can be arranged on the first connection plate 8, specifically on the side of the first connection plate 8 facing the power electronics 14 and within the first part 22 of the heat sink 20 for the power electronics 14. In addition, a second (in Fig. 2 the lower left) leadframe 9 can be arranged on the first connection plate 8, specifically on the side of the first connection plate 8 facing the logic 13 and within the second part 23 of the heat sink 20 for the logic 13. The two, the first and the second, leadframes 9 are therefore always arranged in only one part, in the first part 22 or in the second part 23, of the heat sink 20 and are thus assigned either only to the power electronics 14 or only to the logic 13.

[0045] In particular, a second connection plate 18 with its outputs 191 from the power electronics 14 and the logic 13 can be connected to a motor 100 at the output 12 of the control unit 3. Accordingly, the second connection plate 18 extends from the first part 22 into the second part 23 of the heat sink 20. In addition, a third (in Fig. 2 the upper right) leadframe 19 can be arranged on the second connection plate 18, specifically on the side of the second connection plate 18 facing the power electronics 14 and within the first part 22 of the heat sink 20 for the power electronics 14. In addition, a fourth (in Fig. 2 the lower right) leadframe 19 can be arranged on the second connection plate 18, specifically on the side of the second connection plate 18 facing the logic 13 and within the second part 23 of the heat sink 20 for the logic 13. These two, the third and the fourth, leadframes 19 are therefore always arranged in only one part, in the first part 22 or the second part 23, of the heat sink 20 and are thus assigned either only to the power electronics 14 or only to the logic 13.

[0046] The motor 100 comprises, for example, a shaft 101, around which the actuator 1 including the control unit 3 and the cylindrical housing 10 as well as the motor 100 rotate. The motor 100 also comprises, for example, at least one sensor, for example a rotor position sensor 102 and a temperature sensor 103, which are connected to the logic 13 by means of the fourth leadframe 19 (bottom right in Fig. 2) and the second connection plate 16 at the output 12 of the heat sink 20.

[0047] In one embodiment (see Fig. 2) comprises a first leadframe 9 (in Fig. 2 top left) of the input 11 of the control unit 3, the following subsection (second subsection 212, directly after the voltage supply interface) of the first part 22 of the heat sink 20 for the power electronics 14 comprises at least one EMC filter 30. The at least one EMC filter 30 comprises, for example, a common mode choke 31 (also called a current-compensated choke or CMC for short), a differential mode choke 32 (also called DMC for short) and X and Y capacitors 33.

[0048] In a further embodiment, a next subsection (third subsection 213) of the first part 22 comprises a driver circuit 34. The driver circuit 34 comprises, for example, at least DC-link capacitors 35 and a gate driver 36, optionally also further components of the driver circuit 34.

[0049] In yet another embodiment, a B6 bridge 37 is arranged in a subsequent subsection (fourth subsection 214) of the first part 22 of the heat sink 20.

[0050] The advantages of this arrangement in the aforementioned three subsections 212, 213, and 214 are manifold. Firstly, the highly noise-prone B6 bridge 37 is shielded from other circuit components, such as the common-mode choke 31, the differential-mode choke 32, the X and Y capacitors 33, the DC-link capacitors 35, and the gate driver 36. Furthermore, the EMC-filtered second subsection 212 is also shielded from the outside. Thus, a plastic cover (housing 10) can be used without concern as a cover for actuator 1.

[0051] In one embodiment, the common-mode choke 31, the differential-mode choke 32, and the DC-link capacitors 33 are mounted in a holder 38 and thus connected to the heat sink 20. The holder 38 is made of plastic, for example. This has the advantage that heavy components such as the common-mode choke 31 (CMC), the differential-mode choke 32 (DMC), and the at least one DC-link capacitor 35 can be connected to the heat sink 20 with a plastic holder 38 in order to pass vibration tests.

[0052] This arrangement can be adopted in a similar way for the logic 13 with regard to EMC filtering. In one embodiment, the second leadframe 9 (in Fig. 2 bottom left) of the input 11 of the control unit 3, at least one EMC filter 40 for the logic 13 is provided in the subsection (second subsection 212) of the second part 23 of the heat sink 20 for the logic 13. In a further embodiment, at least one further circuit 41 is provided in a next subsection (third subsection 213) and / or in a further subsequent subsection (fourth subsection 214) of the second part 23 of the heat sink 20 for the logic 13. The further circuit 41 can be, for example, a µ-controller. The third subsection 213 and the fourth subsection 214 can also be combined or, depending on the existing circuits, for one or more further separations of circuit subsections 21 i be used.

[0053] Fig. 3 shows a sectional front view of an embodiment of the housing 10 of the actuator 1 with a control unit 3. The printed circuit board 5 interacts with contact springs 27 in the heat sink 20. The printed circuit board 5 can be pressed against the heat sink 20 using the contact springs 27 in the heat sink 20. This allows the grounding layer 7 (ground layer, ground position, GND) of the printed circuit board 5 to be connected to the housing 10 at several points and, together with existing contact pads 29 (thermal pads; see next paragraph) on the printed circuit board 5, to provide an extremely low-resistance connection to the heat sink 20 or the housing 10. This is advantageous for improved EMC radiation.

[0054] In one embodiment, the circuit board 5 is connected to the heat sink 20 via at least one thermal contact 29. The contact is, for example, indirectly via a paste or directly via thermal pads on the circuit board 5 or metal surfaces on the circuit board 5. By means of such a good thermal connection of the components to the heat sink 20, heat dissipation is introduced between the component and the heat sink 20 even under high thermal loads. Fig.2 shows that, for example, a thermal contact 29 is arranged at the end of each protrusion 25 of the heat sink 20 in the direction of the respective grounding layer 7 of the circuit board 5. Thus, heat from the components (in this embodiment: circuit board 7, common-mode choke 31, differential-mode choke 32, X and Y capacitors 33, DC link capacitors 35, gate driver 36, B6 bridge 37, EMC filter 40, additional circuitry 41) can be dissipated via the thermal contact 29 to the protrusions 25 and further outward relative to the actuator 1.

[0055] In one embodiment, the heat sink 20 of the actuator 1 is made of aluminum. The embodiments of the actuator 1 with the control unit 3 described in this way can be used, for example, in roll stabilizers (not shown) and in rear-axle steering (not shown).

[0056] It is believed that the present disclosure and many of the advantages recited therein will be understood from the foregoing description. It will be apparent that various changes in the form, construction, and arrangement of components may be made without departing from the disclosed subject matter. The described forms and arrangements are merely illustrative, and it is the intent of the appended claims to encompass and embrace such changes. Accordingly, the scope of the invention should be limited only by the appended claims. List of reference symbols 1 actuator 2 axial direction 3 Control unit 4 radial direction 5 Printed circuit board, circuit board 7 Grounding layer 8 first connection plate at the input 9 first or second leadframe at the entrance 10 housings 11 Control unit input 12 Control unit output 13 Logic 14 Power electronics 15 logic connectors 16 power connectors 18 second connection plate at the output 19 third or fourth leadframe at the output 20 heat sinks 211, 212,..21 N Subsection 22 first part 23 second part 25 lead 27 Contact spring 29 thermal contact 30 EMC filters 31 Common mode choke 32 Differential mode throttle 33 X and Y capacitors 34 driver circuit 35 DC-Link capacitors 36 Gate Drivers 37 B6 Bridge 38 bracket 40 EMC filters 41 further circuit 100 engine 101 Wave 102 Rotor position sensor 103 Temperature sensor 151 Output of the logic connector 161 Output of the power connector 191 Output second connection plate

Claims

[1] An actuator (1) comprising a control unit (3) and a cylindrical housing (10) in which the actuator (1) and the control unit (3) are housed, characterized by a heat sink (20) extending in an axial direction (2) in the cylindrical housing (10) and being in thermal contact therewith, the heat sink (20) comprising at least a first part (22) and a second part (23); a single multilayer printed circuit board (5) in a central grounding layer (7), which also extends in the axial direction (2) in the cylindrical housing (10) and is located between the first part (22) and a second part (23) of the heat sink (20); and a plurality of projections (25) projecting in a radial direction (4) of the first part (22) and the second part (23) of the heat sink (20), which projections thermally contact the multilayer printed circuit board (5), the heat sink (20) being divided into a plurality of subsections (211, 212,..., 21 N ) and thus provide electromagnetic compatibility. [2] The actuator (1) according to claim 1, wherein the single multilayer printed circuit board (5) carries a power electronics unit (14) on that side of the multilayer printed circuit board (5) which faces the first part (22) of the heat sink (20), the single multilayer printed circuit board (5) carries a logic (13) on that side of the multilayer printed circuit board (5) which faces the second part (23) of the heat sink (20), and the protruding projections (25) of the heat sink (20) together with the middle grounding layer (7) of the multilayer printed circuit board (5) shield the power electronics (14) from the logic (13). [3] The actuator (1) according to claim 2, wherein at least one logic connector (15) for the logic (13) in the second part (23) of the heat sink (20) is arranged at an input (11) of the control unit (3) on the housing (10) and at least one power connector (16) for the power electronics (14) in the first part (22) of the heat sink (20) is arranged at the input (11) of the control unit (3) on the housing (10). [4] The actuator (1) according to claim 3, wherein a connection plate (8, 18) is provided on the power connector (16) for the power electronics (14) in the first part (22) at the input (11) of the control unit (3) and at the output (12) of the control unit (3), wherein each connection plate (8, 18) is connected to a lead frame (9, 19) assigned to the first part (22) and to the second part (23) of the heat sink (20). [5] The actuator (1) according to claim 4, wherein a subsection (212) of the first part (22) of the heat sink (20) for the power electronics (14) following the first leadframe (9) of the input (11) of the control unit (3) comprises at least one EMC filter (30), which comprises, for example, a common-mode choke (31), a differential-mode choke (32) and X and Y capacitors (33), wherein a next subsection (213) of the first part (22) comprises a driver circuit (34) comprising, for example, at least DC link capacitors (35) and a gate driver (36), and wherein a B6 bridge (37) is arranged in a subsequent subsection (214) of the first part (22). [6] The actuator (1) according to claim 5, wherein the common mode choke (31), the differential mode choke (32) and the DC link capacitors (35) are seated in a holder (38), for example made of plastic, and are thus connected to the heat sink (20). [7] The actuator (1) according to one of claims 4 to 6, wherein in a subsection (212) of the second part (23) of the heat sink (20) for the logic (13) following the second leadframe (9) of the input (11) of the control unit (3) at least one EMC filter (40) for the logic (13) is located, and / or wherein in the next subsection (213) and / or the next following subsection (214) of the second part (23) of the heat sink (20) for the logic (13) at least one further circuit (41), for example a µ-controller, is provided. [8] The actuator (1) according to one of the preceding claims, wherein the printed circuit board (5) interacts with contact springs (27) in the heat sink (20) and is pressed against it, so that a low-resistance ground connection of the printed circuit board (5) to the heat sink (20) is provided. [9] The actuator (1) according to one of the preceding claims, wherein the circuit board (5) is connected to the heat sink (20) via at least one thermal contact (29), which is, for example, a paste, thermal pads on the circuit board (5) or metal surfaces on the circuit board (5). [10] The actuator (1) according to any one of the preceding claims, wherein the heat sink (20) is made of aluminum.

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