Semiconductor manufacturing device, wafer assembly device, cutting device and semiconductor manufacturing process

Abstract

One objective is to provide a technique that can suppress unevenness in the force applied to a slicing blade when cutting an orientation flat. A semiconductor manufacturing device comprises a platform and a transport machine. A semiconductor wafer with an orientation flat and a clamping device with a shape corresponding to the orientation flat, intended for cutting the orientation flat with a slicing blade, are fixed to each other on the platform by a slicing belt. The transport machine moves the clamping device so that it is positioned opposite the orientation flat on the platform.

Description

BACKGROUND OF THE INVENTION Area of ​​the invention

[0001] The present disclosure relates to a semiconductor manufacturing device, a wafer assembly device, a dividing device and a semiconductor manufacturing process. Description of the background technology

[0002] In the fabrication of a semiconductor device, a semiconductor chip, cut from a semiconductor wafer using a cutting or dicing device, is generally mounted onto a semiconductor module. When a semiconductor wafer is cut using a dicing device, the semiconductor wafer is adhered to a dicing tape so that the semiconductor chip does not move (for example, International Publication No. 2015 / 056303). SUMMARY

[0003] In many cases, an orientation flat is provided as a cutout for setting the position and rotation angle of the semiconductor wafer. There are instances where, depending on the semiconductor chip design, the slicing device cuts the orientation flat along its straight edge. In this case, one surface of a plate-shaped cutting or slicing blade absorbs the force from the semiconductor wafer; however, its other surface borders a free space and does not absorb the force, resulting in an uneven force being exerted on the slicing blade. Consequently, the slicing blade is prone to breakage, leading to problems such as a reduction in the blade's lifespan.

[0004] The present disclosure was therefore created to solve the above problems, and one objective of the present disclosure is to provide a technique capable of suppressing the unevenness of the force applied when cutting an orientation flat.

[0005] A semiconductor manufacturing apparatus according to the present disclosure comprises: a table or platform on which a semiconductor wafer with an orientation flat and a clamping device with a shape corresponding to the orientation flat, which is to be used for cutting the orientation flat by means of a slicing blade, are fixed to one another by a slicing belt; and a transport machine which transports the clamping device such that the clamping device is opposite the orientation flat on the table.

[0006] The unevenness of the force exerted on the dividing blade can be suppressed when cutting the orientation flat.

[0007] These and other tasks, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when it is taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a schematic cross-sectional view illustrating a configuration of a wafer assembly device according to embodiment 1. Fig. Figure 2 is a top view illustrating an example of a structure to be cut. Fig. Figure 3 is a schematic cross-sectional view illustrating a configuration of a dividing device according to embodiment 1. DESCRIPTION OF PREFERRED EXECUTION FORMS

[0008] With reference to the accompanying illustrations, embodiments are described below. Features described in each embodiment below are exemplary, so not all features necessarily apply. The same or similar reference numerals are assigned to the same or similar components in a multitude of embodiments in the following description, and the different components are primarily described below. A specific position and direction such as "top side," "bottom side," "left," "right," "front side," or "back side," for example, does not necessarily correspond to a position and direction in an actual implementation described below. <Ausführungsform 1>

[0009] Fig. Figure 1 is a schematic cross-sectional view illustrating a configuration of a wafer assembly device including a semiconductor fabrication device according to the present embodiment 1. The semiconductor fabrication device of the wafer assembly device in Fig. 1 comprises a wafer table 1 as a platform and a transport machine 2. The wafer assembly device in Fig. 1 includes not only the semiconductor manufacturing device, but also an adhesive roller 3 as a part for gluing tapes.

[0010] The wafer table 1 is a platform on which a semiconductor wafer 21 and a clamping device 22 are fixed to one another by a slicing belt 26. In the present embodiment 1, the semiconductor wafer 21, the clamping device 22, and a wafer ring 23 are mounted on the wafer table 1 and then glued to the slicing belt 26. Fig. Figure 2 is a top view illustrating an example of a structure to be cut, in which the semiconductor wafer 21, the clamping device 22, and the wafer ring 23 are bonded to the slicing belt 26. The semiconductor wafer 21 in the structure to be cut is subsequently sliced ​​using a cutting device, as described below.

[0011] The semiconductor wafer 21 has an orientation flat 21a. A semiconductor chip comprising at least one metal-oxide-semiconductor field-effect transistor (MOSFET), one insulated-gate bipolar transistor (IGBT), one reverse-conducting IGBT (RC-IGBT), one Schottky barrier diode (SBD), and one PN junction diode (PND) is mounted on the semiconductor wafer 21. In this description, for example, at least one of A, B, C, ..., and Z specifies any combination of these components.

[0012] The semiconductor wafer 21 can be made of ordinary silicon (Si) or of a wide-bandgap semiconductor such as silicon carbide (SiC), gallium nitride (GaN), or diamond. Using a wide-bandgap semiconductor allows for stable operation at high temperatures and voltages, as well as increased switching speed.

[0013] The wafer table 1 is provided with a recess 1a, and the semiconductor wafer 21 is mounted on the wafer table 1 manually or by means of the transport machine 2 or the other transport machine such that only an outer rim of the semiconductor wafer 21 is supported by the wafer table 1. The recess 1a prevents contact between a surface structure of the semiconductor chip arranged on the semiconductor wafer 21 and the wafer table 1.

[0014] The clamping device 22 in Fig. 2 is a clamping device that has a shape corresponding to the orientation flat 21a and is used to cut the orientation flat 21a by means of a dividing blade. In the example of Fig. 2 has a part on the right side of the clamping device 22 that has a straight shape corresponding to the straight shape of the orientation flat 21a, as the shape corresponding to the orientation flat 21a. In the example of Fig. 2 The entire clamping device 22 has an arc-shaped form that complements a circle of the semiconductor wafer 21. The shape of the clamping device 22 is not based on the shape in Fig. 2 limited, as long as it has a form corresponding to the orientation flat 21a.

[0015] The transport machine 2 transports the clamping device 22 such that the straight shape of the clamping device 22 is opposite the straight shape of the orientation flat 21a on the wafer table 1. Accordingly, the clamping device 22 is mounted on the wafer table 1.

[0016] The wafer ring 23 is mounted manually or by means of the transport machine 2 or the other transport machine on the wafer table 1 such that, in a top view, it surrounds the semiconductor wafer 21 and the clamping device 22. One material of the wafer ring 23 is, for example, stainless steel.

[0017] The adhesive roller 3 adheres the semiconductor wafer 21, the clamping device 22 opposite the orientation flat 21a, and the wafer ring 23 surrounding the semiconductor wafer 21 and the clamping device 22, all mounted on the wafer table 1, to the slicing belt 26. Specifically, the adhesive roller 3 presses the slicing belt 26, fed by a feeding machine (not shown in the drawings), against the semiconductor wafer 21, the clamping device 22, and the wafer ring 23, thereby bonding the slicing belt 26. This creates the structure to be sliced. Fig. 2 formed. One material of the adhesive roller 3 is, for example, Si rubber, and one material of the dividing tape 26 is, for example, UV-curable polyolefin.

[0018] The semiconductor wafer 21 of the structure to be cut in Fig. 2 is cut using a dividing blade similar to the dividing blade 8 described below. Fig. 3 cuts, so that the semiconductor chip is cut out of the semiconductor wafer 21. When cutting the orientation flat 21a, the slicing blade cuts the orientation flat 21 along the straight shape of the orientation flat 21 while in contact with the clamping device 22. <Overview of embodiment 1>

[0019] According to the semiconductor manufacturing device of the present embodiment 1 described above, the transport machine 2 transports the clamping device 22 such that the straight shape of the clamping device 22 is opposite the straight shape of the orientation flat 21a on the wafer table 1. According to such a configuration, the structure to be sliced, in which the semiconductor wafer 21 and the clamping device 22 are fixed to one another, can be formed while the clamping device 22 is opposite the orientation flat 21a, as shown in Fig. Figure 2 illustrates this. Accordingly, when cutting the orientation flat 21a, one surface of the cutting blade absorbs the force from the semiconductor wafer 21, and its other surface absorbs the force from the clamping device 22, thus suppressing any unevenness in the force exerted on the cutting blade. Consequently, breakage of the cutting blade can be prevented. <Ausführungsform 2>

[0020] Fig. Figure 3 is a schematic cross-sectional view illustrating a configuration of a dividing device including a semiconductor manufacturing device according to the present embodiment 2. The semiconductor manufacturing device of the dividing device in Fig. 3 comprises a dividing table 6 as a platform and the transport machine 2. The dividing device in Fig. 3 includes not only the semiconductor manufacturing device, but also a ring holding part 7 and the dividing blade 8.

[0021] The slicing table 6 is a platform on which the semiconductor wafer 21 and the clamping device 22 are fixed to one another by the slicing belt 26. In the present embodiment 2, the slicing belt 26, to which the semiconductor wafer 21 and the wafer ring 23 surrounding the semiconductor wafer 21 are bonded, is mounted on the slicing table 6 manually or by means of the transport machine 2 or another transport machine. A portion of the slicing table 6, on which the semiconductor wafer 21 is mounted, can be provided with a porous structure through which air can be drawn in at the semiconductor wafer 21 via the slicing belt 26.

[0022] After the slicing belt 26 described above is mounted on the slicing table 6, the transport machine 2 transports the clamping device 22 such that the straight shape of the clamping device 22 is opposite the straight shape of the orientation flat 21a on the slicing table 6, thereby bonding the clamping device 22 to the slicing belt 26. This positions the structure to be cut in Fig. 2 formed.

[0023] The semiconductor wafer 21 of the structure to be cut in Fig. The slicing blade 8 cuts the semiconductor chip from the semiconductor wafer 21. During the cutting of the orientation flat 21a, the slicing blade 8 cuts the orientation flat 21a along its straight edge while in contact with the clamping device 22. The slicing blade 8 is, for example, a blade made of abrasive grains hardened by a bonding agent. The ring holder 7 holds the wafer ring 23 while the slicing blade 8 performs the cutting operation, thereby fixing the semiconductor wafer 21. <Overview of embodiment 2>

[0024] According to the semiconductor manufacturing device of the present embodiment 2 described above, the transport machine 2 transports the clamping device 22 such that the straight shape of the clamping device 22 is opposite the straight shape of the orientation flat 21a on the wafer table 1. In such a configuration, the structure to be sliced, in which the semiconductor wafer 21 and the clamping device 22 are fixed to one another, can be formed while the clamping device 22 faces the orientation flat 21a as shown in the figure. Fig.Figure 2 illustrates this. Accordingly, when cutting the orientation flat 21a, one surface of the cutting blade absorbs the force from the semiconductor wafer 21, and its other surface absorbs the force from the clamping device 22, thus suppressing any unevenness in the force exerted on the cutting blade. Consequently, breakage of the cutting blade can be prevented. <modifikationsbeispiel>

[0025] In the description of embodiment 1 and embodiment 2, the clamping device 22 is transported by means of the transport machine 2. However, the configuration is not limited to this; the clamping device 22 can be transported manually such that the straight shape of the clamping device 22 is opposite the straight shape of the orientation flat 21a.

[0026] In embodiment 1, the semiconductor wafer 21 is, for example, glued to the slicing belt 26 after it has been mounted on the wafer table 1, and in embodiment 2, the clamping device 22 is glued to the slicing belt 26 after the slicing belt 26 has been mounted, for example, on the slicing table 6. However, the process in embodiment 1 and the process in embodiment 2 can be interchanged. That is, it is also possible that in embodiment 1 the clamping device 22 is glued to the slicing belt 26 after the slicing belt 26 has been mounted, for example, on the wafer table 1, and in embodiment 2 the semiconductor wafer 21 is glued to the slicing belt 26 after it has been mounted on the slicing table 6. <Ausführungsform 3>

[0027] In the present embodiment 3, the material of the clamping device 22 and the material of the semiconductor wafer 21 are the same in embodiments 1 and 2. According to such a configuration, compared to a case in which the materials of the semiconductor wafer 21 and the clamping device 22 differ, any unevenness of the force exerted on the slicing blade can be further suppressed when the slicing blade 8 is in contact with the orientation flat 21a. <Ausführungsform 4>

[0028] In the present embodiment 4, the thickness of the clamping device 22 and the thickness of the semiconductor wafer 21 are the same in embodiments 1 and 2. The condition in which the thickness of the clamping device 22 and the thickness of the semiconductor wafer 21 are equal includes a condition in which the difference between the thickness of the clamping device 22 and the thickness of the semiconductor wafer 21 is equal to or greater than 5% of the thickness of the clamping device 22 or the semiconductor wafer 21 that is greater than that of the other element. According to such a configuration, compared to a case in which the thicknesses of the semiconductor wafer 21 and the clamping device 22 differ, any unevenness in the force exerted on the slicing blade 8 can be further suppressed when the slicing blade 8 is in contact with the orientation flat 21a. <modifikationsbeispiel>

[0029] The configuration of embodiment 3 can be combined with the configuration of embodiment 4. That is, in embodiments 1 and 2, it is applicable or possible for the material of the clamping device 22 and the material of the semiconductor wafer 21 to be the same, and for the thickness of the clamping device 22 and the thickness of the semiconductor wafer 21 to be the same. According to such a configuration, compared to a case in which the thicknesses of the semiconductor wafer 21 and the clamping device 22 differ, any unevenness in the force exerted on the slicing blade can be further suppressed when the slicing blade 8 is in contact with the orientation flat 21a. <Ausführungsform 5>

[0030] In the present embodiment 5, the transport machine 2 transports the clamping device 22 such that a gap exists between the clamping device 22 and the orientation flat 21a in embodiments 1 and 2. According to such a configuration, abrasion of the dividing blade 8 can be suppressed, thus increasing the service life of the dividing blade 8. The configuration of the present embodiment 5 can be combined with at least one of the configurations of embodiment 3 and / or embodiment 4.

[0031] Each embodiment and each modification example can be combined in any way, or each embodiment and each modification can be varied or omitted in any way.

[0032] The aspects of the present revelation are described together below as appendices. (Annex 1)

[0033] A semiconductor manufacturing device comprising: a platform on which a semiconductor wafer with an orientation flat and a clamping device with a shape corresponding to the orientation flat, which is to be used for cutting the orientation flat by means of a slicing blade, are fixed to each other by a slicing band; and a transport machine that transports the clamping device in such a way that the clamping device is opposite the orientation flat on the platform. (Annex 2)

[0034] A wafer assembly device comprising: the semiconductor manufacturing apparatus according to Annex 1; and a part for gluing tapes, which glues the semiconductor wafer, the clamping device 22, which is opposite the orientation flat, and a wafer ring surrounding the semiconductor wafer and the clamping device, which are mounted on the platform, to the slicing tape. (Annex 3)

[0035] A dividing device comprising: a semiconductor manufacturing device as specified in Annex 1; and a dividing blade, whereby the transport machine transports the clamping device and adheres it to the slicing belt, to which the semiconductor wafer and a wafer ring surrounding the semiconductor wafer are adhered and which is mounted on the platform, and The dividing blade cuts the orientation flat along the orientation flat while in contact with the clamping device. (Annex 4)

[0036] The semiconductor manufacturing apparatus according to one of Annexes 1 to 3, wherein the material of the clamping device and the material of the semiconductor wafer are the same. (Annex 5)

[0037] The semiconductor manufacturing apparatus according to one of Annexes 1 to 4, wherein the thickness of the clamping device and the thickness of the semiconductor wafer are the same. (Annex 6)

[0038] The semiconductor manufacturing apparatus according to one of Annexes 1 to 5, wherein The transport machine transports the clamping device in such a way that there is a gap between the clamping device and the orientation flat. (Annex 7)

[0039] A semiconductor manufacturing process, comprising: Preparing a semiconductor wafer with an orientation flat and a clamping device having a shape corresponding to the orientation flat, which is to be used for cutting the orientation flat by means of a dividing blade; and Transport the clamping device so that the clamping device is opposite the orientation flat on a platform on which the semiconductor wafer and the clamping device are fixed to each other by a dividing belt.

[0040] While the invention has been presented and described in detail, the preceding description is illustrative in all aspects and not limiting. It is therefore understood that numerous modifications and variants can be conceived without deviating from the scope of the invention. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] WO 2015 / 056303

[0002] < / modifikationsbeispiel> < / modifikationsbeispiel>

Claims

[1] A semiconductor manufacturing apparatus comprising: a platform (1, 6) on which a semiconductor wafer (21) having an orientation flat (21a) and a clamping device (22) having a shape corresponding to the orientation flat (21a), which is to be used for cutting the orientation flat (21a) by means of a dicing blade (8), are fixed to one another by a dicing belt (26); and a transport machine (2) which transports the clamping device (22) such that the clamping device (22) is opposite the orientation flat (21a) on the platform (1, 6). [2] Wafer mounting apparatus, comprising: the semiconductor manufacturing apparatus according to claim 1; and a tape bonding part (3) that bonds the semiconductor wafer (21), the chuck (22) facing the orientation flat (21a), and a wafer ring (23) surrounding the semiconductor wafer (21) and the chuck (22), which are mounted on the platform (1), to the dicing tape (26). [3] Cutting device, comprising: the semiconductor manufacturing apparatus according to claim 1; and the cutting blade (8), whereby the transport machine (2) transports the clamping device (22) and adheres it to the dicing belt (26) to which the semiconductor wafer (21) and a wafer ring (23) surrounding the semiconductor wafer (21) are adhered and which is mounted on the platform (6), and the dicing blade (8) cuts the orientation flat (21a) along the orientation flat (21a) while in contact with the clamping device (22). [4] A semiconductor manufacturing apparatus according to any one of claims 1 to 3, wherein a material of the chuck (22) and a material of the semiconductor wafer (21) are the same. [5] A semiconductor manufacturing apparatus according to any one of claims 1 to 4, wherein a thickness of the chuck (22) and a thickness of the semiconductor wafer (21) are the same. [6] The semiconductor manufacturing apparatus according to any one of claims 1 to 5, wherein the transport machine (2) transports the chuck (22) such that there is a gap between the chuck (22) and the orientation flat (21a). [7] A semiconductor manufacturing method comprising: Preparing a semiconductor wafer (21) with an orientation flat (21a) and a chuck (22) having a shape corresponding to the orientation flat (21a), which chuck is to be used for cutting the orientation flat (21a) by means of a dicing blade (8); and Transporting the clamping device (22) such that the clamping device (22) is opposite the orientation flat (21a) on a platform (1, 6) on which the semiconductor wafer (21) and the clamping device (22) are fixed to one another by a dicing belt (26).

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