Method for backlash-free orientation of an interface element for MEMS components relative to a receiving body

Abstract

The invention relates to a method for backlash-free orientation of an interface element (150), in particular a carrier for at least one MEMS micromirror unit and / or at least one MEMS mirror array assembly, which is / are received on a top surface (170) of the interface element (150), by means of contact surfaces (154, 158) for positioning and / or aligning the interface element (150) relative to a receiving body (132). The following method steps are carried out: a) Inserting the interface element (150) into the receiving body (132) in the assembly direction (130) and thereby significantly limiting movements into five degrees of freedom, b) Establishing contact between the contact surfaces (154, 158) of the interface element (150) and those of the receiving body (132), c) during the execution of process steps a) and b), bringing a spring-loaded stop (136) of the receiving body (132) into contact with a nose-shaped projection (168) such that a direction of movement (134) in the circumferential direction, corresponding to a sixth degree of freedom about an axis of symmetry (144), is significantly limited.

Description

Technical field

[0001] The invention relates to a method for backlash-free orientation of an interface device for MEMS components relative to a receiving body for use in semiconductor technology equipment and to a MEMS micromirror unit for use in semiconductor technology equipment. Furthermore, the invention relates to semiconductor technology equipment with a corresponding MEMS micromirror unit and to an electronic component manufactured with such equipment. State of the art

[0002] Semiconductor technology equipment refers to equipment used for the production or testing of microstructured devices or the components required for their manufacture. An example of such equipment is a projection exposure system for photolithography.

[0003] This process is used to manufacture microstructured components, such as integrated circuits. The projection exposure system used comprises an exposure system and a projection system. The image of a mask illuminated by the exposure system, also called a reticulum, is projected in a reduced size by the projection system onto a substrate coated with a photosensitive layer and positioned in the image plane of the projection system, for example, in a silicon wafer, in order to transfer the mask structure onto the photosensitive coating of the substrate.

[0004] In exposure systems, particularly projection exposure systems designed for the EUV range (i.e., for exposure wavelengths from 5 nm to 30 nm), two faceted mirrors are typically positioned in the beam path between the actual exposure radiation source and the mask to be illuminated. These mirrors, operating on the principle of a honeycomb condenser, homogenize the radiation. The faceted mirror closer to the exposure radiation source in the beam path is often a field faceted mirror, while the other is a pupil faceted mirror.

[0005] To produce different intensity and / or angle-of-incidence distributions during the exposure of the mask, it is known to form the facets of at least one of the two faceted mirrors, in particular those of the field faceted mirror, from one or more electromechanically individually pivotable micromirrors. A corresponding method is known from WO 2012 / 130768 A2.

[0006] To achieve a small size for individual micromirrors, it is known to form groups of micromirrors in the form of a mirror array, specifically a mirror array made of microelectromechanical systems (MEMS). In such a MEMS mirror array, a multitude of small mirror elements are mounted on a common base, each individually movable. At least one actuator is provided for each mirror element, allowing it to be adjusted along a predefined degree of freedom. Often, the mirror elements can be pivoted about two axes perpendicular to each other and parallel to the base, with a sufficient number of actuators provided to allow the mirror element to be pivoted independently about these axes.Sensors can also be provided for the individual mirror elements to determine their position relative to the base, thus enabling monitoring of the mirror alignment. A particularly advantageous embodiment for the mirrors of a MEMS mirror array is described in DE 10 2015 204 184 A1.

[0007] A method for manufacturing a micromirror or a MEMS mirror array, comprising a plurality of such micromirrors, is disclosed together with further details on a possible design of the micromirrors in DE 10 2015 220 018 A1.

[0008] To form a faceted mirror for projection exposure systems, several MEMS mirror arrays are mounted in a densely packed, planar grid arrangement on a higher-level assembly. For this purpose, the MEMS mirror arrays are designed as MEMS micro mirror units (MMUs), which, in addition to the actual MEMS mirror arrays, also include an interface element that allows the units to be attached to the higher-level assembly.

[0009] In order for the MEMS mirror arrays to be arranged with a small distance between them for the stated purpose and to have the required precise position and orientation when inserted and fixed in the assembly, it is necessary that the individual mirror elements of a MEMS micromirror unit are positioned and aligned with high precision relative to its interface element. Disclosure of the invention

[0010] According to the invention, a method for backlash-free orientation of an interface element, in particular a carrier for at least one MEMS mirror unit and / or at least one MEMS mirror array assembly, which is / are received on a top side of the interface element, is proposed by means of contact surfaces for positioning and / or aligning the interface element relative to a receiving body with the following method steps: a) Inserting the interface element into the receiving body in the assembly direction and thereby significantly limiting movements in five degrees of freedom, b) Establishing contact between the contact surfaces of the interface element and those of the receiving body, c) during the execution of process steps a) and b), bringing a spring-loaded stop of the receiving body into contact with a nose-shaped projection in such a way that a direction of movement in the circumferential direction corresponding to the sixth degree of freedom about an axis of symmetry is significantly limited.

[0011] The method proposed according to the invention allows various functionalities to be realized in one step, such as bringing an interface element into contact with the receiving body and creating a heat transfer through a large-area contact between the components to be joined.

[0012] In an advantageous embodiment of the method proposed according to the invention, after carrying out method step c), a designated contact point between the interface element on the one hand and the receiving body on the other hand is permanently maintained while maintaining freedom of movement, at least in the direction of the sixth degree of freedom.

[0013] In an advantageous further development of the method proposed according to the invention, after carrying out the process steps b) and c), a blockage of all six degrees of freedom between the interface element and the receiving body is carried out, forming minimized gaps and representing a heat transfer.

[0014] In an advantageous further development, the method proposed according to the invention provides that the mounting direction of the interface element in the receiving body runs essentially in the axial direction.

[0015] In an advantageous further development of the method proposed according to the invention, a rough alignment of the interface element to be received in the receiving body is carried out by means of an alignment element that projects substantially in the axial direction and extends substantially parallel to the axis of symmetry of the interface element.

[0016] Furthermore, the invention relates to a device for carrying out the method with an interface element and a receiving body, wherein the interface element and the receiving body each have circumferential contact surfaces which can be cylindrical to each other or in a complementary conicity with respect to each other. This facilitates easier joining and also ensures reliable contact for efficient heat transfer, particularly along the contacting lateral surfaces of the components involved, i.e., the interface element on the one hand and the receiving body on the other.

[0017] In an advantageous embodiment of the device proposed according to the invention, a spring-loaded stop is formed on the receiving body, which can be deflected in a deflection direction by the insertion movement of the interface element in the assembly direction. The spring-loaded stop is designed to be flexible in the axial direction, which allows deflection in the assembly direction, while it is very rigid in a tangential plane. Alternatively, a sliding design can be provided instead of a flexible deflection.

[0018] In the device proposed according to the invention, it is further advantageously provided that the spring stop is essentially designed as a flat spring. Alternatively, the spring stop can also be represented by a stop surface against which the nose-shaped projection is positioned by a spring element.

[0019] In the device proposed according to the invention, it is further provided that the spring-loaded stop is located on the receiving body and the nose-shaped projection is located on the interface element, or vice versa.

[0020] In the device proposed according to the invention, it is further provided that the receiving body comprises an alignment element that extends parallel to the axis of symmetry of the interface element. This enables a first pre-alignment during the joining process of the components to be joined, i.e., the interface element on the one hand and the receiving body on the other.

[0021] The device proposed according to the invention is further characterized in that a number of MEMS micromirror units and / or MEMS micromirror array assemblies are arranged on a top side of the interface element.

[0022] Furthermore, the invention relates to a MEMS micromirror element mounted on a top surface of the interface element, which is attached to a higher-level assembly, wherein the MEMS micromirror unit is positioned and / or aligned according to the method according to one of claims 1 to 5.

[0023] Furthermore, the invention relates to the use of the method according to one of claims 1 to 5 in equipment for semiconductor technology. Advantages of the invention

[0024] The solution proposed according to the invention advantageously enables repeated assembly and disassembly of the interface element and the receiving body, which are to be joined with high precision. Furthermore, the proposed solution significantly limits movements in all six degrees of freedom after the proposed method has been executed, thus allowing for easy yet highly accurate positioning or alignment of the interface element relative to the receiving body. In particular, the provision of a spring-loaded stop and its interaction with the stop surface enables essentially backlash-free positioning of the interface element in the circumferential direction relative to the axis of symmetry with respect to the receiving body.Furthermore, the solution proposed according to the invention allows a relatively large circumferential area to be used when inserting the interface element into the opening of the receiving body in order to achieve effective heat transfer.

[0025] Finally, the solution proposed according to the invention, by providing a sealing element in a flat contact surface on the upper side of the receiving body, offers the possibility of sealing against media or even against a vacuum. The solution proposed according to the invention for joining the interface element achieves a virtually zero clearance over an axial joining path, particularly in MEMS applications, even during the joining process.

[0026] Following the method proposed according to the invention, the receiving body can be paired with the interface element, which can be done using methods known from the prior art. With this pairing, movements in five of the six possible degrees of freedom can be significantly limited or, ideally, eliminated. Advantageously, the interface between the receiving body and the interface element is not point-like or edge-like, but relatively large and, in particular, two-dimensional, thus providing favorable conditions for heat transfer.In the method proposed according to the invention, during the assembly of the interface element into the receiving body, for example in the axial direction, contact is brought about between the contact surface and the spring stop, which is designed in such a way that a rotation of the interface element in the circumferential direction about its axis of symmetry relative to the receiving body, a movement in the sense of the sixth and last degree of freedom still available, is significantly limited and ideally excluded.

[0027] The spring-loaded stop allows the original location of the designated contact point to be changed, with an angled surface of the stop facing in the direction of joining, which effectively prevents the movement still possible in the direction of the sixth degree of freedom, namely a rotational movement in the circumferential direction around the axis of symmetry.

[0028] In the device proposed according to the invention, the joining process, i.e., the insertion of the interface element into an opening of the receiving body, is advantageously facilitated by the fact that the corresponding outer surfaces can be cylindrical or conically shaped, complementary to each other, and thus enable easy joining with a minimal gap. This particularly facilitates heat transfer.

[0029] In particular, the connection between the interface element and the receiving body can be designed to be free of play in the circumferential direction. This play-free connection between the interface element and the receiving body is maintained even while the components remain in the joined state. Regarding the designated contact point or contact area between, for example, the spring stop located on an end face of the receiving body and the opposing contact surface, the contact surface can be trapezoidal, rectangular, symmetrical, asymmetrical, or have other geometries.

[0030] The design of the contact surface ensures that, even during the joining process steps a) and b), contact is established between the spring-loaded stop (e.g., a flat spring) and the opposing nose-shaped projection during the axial joining process. This prevents relative rotation in the circumferential direction between the two components. Instead of a nose-shaped projection, a slot with an insertion chamfer or similar feature could be used as an alternative. Due to the spring-loaded design of the stop, play-free operation between the interface element and the receiving body is guaranteed for the duration of the joined state.

[0031] The spring stop is advantageously designed to have a relatively high spring stiffness with respect to its lateral extension, but to be flexible with respect to the mounting direction, particularly in the axial direction in which the interface element is inserted into the opening of the receiving body, for example, from the top. The spring stop can be designed as a flat spring, but can also be designed to be recessed in a depression, for example, on the lower end face of the receiving body. The spring stop and the contact surface can be formed in one and the same component, in which case the designated contact area or contact point can be located on another component that is oriented in the mounting direction of the interface element into the receiving body.

[0032] The method and device proposed according to the invention enable further functions, such as sealing, force transmission, torque transmission, position compensation, heat transfer, transmission of electrical power and lines, signal transmission and magnetic coupling, to be achieved with high-precision positioning and alignment of the components involved relative to each other.

[0033] Furthermore, it should be emphasized that the method proposed according to the invention significantly limits the movement of the interface element in the direction of the sixth remaining degree of freedom even during the joining process. On the other hand, the joining process is still possible. Although the solution proposed according to the invention does not yet involve an axial stop, the rotation of the interface element in the circumferential direction can nevertheless be significantly limited. This is particularly advantageous when working with very high accuracies, which is especially the case in MEMS applications. Brief description of the drawings

[0034] Embodiments of the invention are explained in more detail with reference to the drawings and the following description.

[0035] They show: Fig. 1 a schematic representation of a projection exposure system with an exposure system and a projection system, Fig. 2 a view of the underside of a receiving body including a spring stop that contacts a contact surface of a sleeve-shaped component, Fig. 3 a sectional view of the device with an interface element inserted into a receiving body and a spring stop applied to the contact surface of the sleeve-shaped component and Fig. 4 a view of the interface element with a sleeve-shaped component provided on its underside. Embodiments of the invention

[0036] In the following description of embodiments of the invention, identical or similar elements are designated by the same reference numerals, and repeated descriptions of these elements are omitted in individual cases. The figures represent the subject matter of the invention only schematically.

[0037] Fig. Figure 1 shows a projection exposure system 1 for photolithography as an example of a system for semiconductor technology in a schematic meridional section. The projection exposure system 1 essentially comprises an exposure system 10 within a projection system 20. An object field 11 in an object plane or reticulum plane 12 is illuminated by means of the exposure system 10. For this purpose, the exposure system 10 includes an exposure radiation source 13, which, in the illustrated embodiment, emits exposure radiation that includes at least useful light in the EUV range, i.e., in particular with a wavelength between 5 nm and 30 nm. The exposure radiation source 13 can be a plasma source, for example, an LPP source (laser-produced plasma) or a GPP source (gas-discharge-produced plasma).It could also be a synchrotron-based radiation source. The exposure radiation source 13 could also be a free-electron laser (FEL).

[0038] The light emitted from the light source 13 is first focused in a collector 14. The collector 14 can be a collector with one or more ellipsoidal and / or hyperpoloidal reflective surfaces. The at least one reflective surface of the collector 14 can be illuminated with the light at grazing incidence (Gl), i.e., with angles of incidence greater than 45°, or at normal incidence (NI), i.e., with angles of incidence less than 45°. The collector 14 can be structured and / or coated to optimize its reflectivity for the useful light and to suppress stray light.

[0039] After the collector 14, the exposure radiation propagates through an intermediate focus in an intermediate focal plane 15. If the exposure system 10 is to be constructed in a modular design, the intermediate focal plane 15 can be used for the separation – including structural separation – of the exposure system 10 in a radiation source module, which comprises the exposure radiation source 13, the collector 14, and the exposure optics 16 described below. With such separation, the radiation source module and the exposure optics 16 together form a modularly constructed exposure system 10. The exposure optics 16 also includes a deflecting mirror 17. The deflecting mirror 17 can be a planar deflecting mirror or, alternatively, a mirror with an effect that influences the beam beyond the mere deflection effect.

[0040] Alternatively or additionally, the deflecting mirror 17 can be designed as a spectral filter that separates a useful wavelength of the exposure radiation from false light of a different wavelength.

[0041] The deflecting mirror 17 deflects the radiation from the exposure radiation source 13 onto a first faceted mirror 18. If the first faceted mirror 18 is arranged – as in the present case – in a plane of the exposure optics 16 that is optically conjugate to the reticulated plane 12 as the field plane, it is also referred to as a field faceted mirror.

[0042] The first faceted mirror 18 comprises a plurality of micromirrors 18', each individually pivotable about two mutually perpendicular axes, for the controllable formation of facets. Each micromirror is preferably equipped with an orientation sensor (not shown) for determining its orientation. The first faceted mirror 18 is thus a microelectromechanical system (MEMS system), as described, for example, in DE 10 2008 909 690 A1. In the beam path of the exposure optics 16, a second faceted mirror 19 is arranged downstream of the first faceted mirror, resulting in a doubly faceted system, the basic principle of which is also referred to as a honeycomb condenser (fly's eye integrator). If the second faceted mirror is arranged in a pupil plane of the exposure optics 16, as in the present embodiment, it is also referred to as a pupil faceted mirror.The second faceted mirror 19 can also be arranged at a distance from a pupil plane of the exposure optics 16, whereby the combination of the first and second faceted mirrors 18, 19 results in a specular reflector, as described, for example, in US 2006 / 0132747 A1, EP 1 614 008 B1 and US 6,573,978. The second faceted mirror 19 need not be constructed from pivotable micromirrors, but can instead comprise individual facets formed from one or a manageable number of mirrors that are significantly larger than micromirrors, and which are either fixed or tiltable only between two defined end positions.However, as shown, it is also possible to provide a microelectromechanical system with a plurality of micromirrors 19', each of which can be pivoted individually about two axes perpendicular to each other and preferably includes an orientation sensor, in the second faceted mirror 19.

[0043] With the aid of the second faceted mirror 19, the individual facets of the first faceted mirror 18 are projected onto the object field 11, although this is regularly only an approximate projection. The second faceted mirror 19 can be the last beam-shaping or even the last mirror for the exposure radiation in the beam path before the object field 11.

[0044] Each of the facets of the second faceted mirror 19 is assigned to exactly one of the facets of the first faceted mirror 18 to form an exposure channel for illuminating the object field 11. This can result in, in particular, exposure according to Köhler's principle.

[0045] The facets of the first faceted mirror 18 are each superimposed by a corresponding facet of the second faceted mirror 19 to illuminate the object field 11. The illumination of the object field 11 is kept as homogeneous as possible. It preferably exhibits a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different exposure channels.

[0046] By selecting the exposure channels used, which is easily achieved by appropriately adjusting the micromirrors 18' of the first faceted mirror 18, the intensity distribution in the entrance pupil of the projection system 20 described below can be further adjusted. This intensity distribution is also referred to as the exposure setting. Furthermore, it can be advantageous not to arrange the second faceted mirror 19 exactly in a plane that is optically conjugate to a pupil plane of the projection system 20. In particular, the pupil faceted mirror 19 can be tilted relative to a pupil plane of the projection system 20, as is shown, for example, in DE 10 2017 220 586 A1.

[0047] At the in Fig. In the arrangement of the components of the exposure optics 16 shown in Figure 1, the second faceted mirror 19 is arranged in a plane conjugate to the entrance pupil of the projection system 20. The deflecting mirror 17 and the two faceted mirrors 18, 19 are arranged at an angle both relative to the object plane 12 and relative to each other.

[0048] In an alternative embodiment of the exposure optics 16, not shown here, a transmission optic comprising one or more mirrors can be provided in the beam path between the second faceted mirror 19 and the object field 11. This transmission optic can, in particular, comprise one or two mirrors for perpendicular incidence (NI mirrors) and / or one or two mirrors for grazing incidence (GI mirrors). With an additional transmission optic, different positions of the entrance pupil for the tangential and sagittal beam input of the projection system 20 described below can be taken into account.

[0049] Alternatively, it is possible that on the in Fig. The deflecting mirror 17 shown in Figure 1 is dispensed with, for which the faceted mirrors 18, 19 are to be arranged in a suitable manner opposite the radiation source 13 and the collector 14.

[0050] Using the projection system 20, the object field 11 in the reticulum plane 12 is transferred to the image field 21 in the image plane 22.

[0051] The projection system 20 comprises a plurality of mirrors M. i , which are numbered according to their arrangement in the beam path of the projection exposure system 1.

[0052] At the in Fig. In the example shown, projection system 20 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve or another number of mirrors M are possible. i are also possible. The penultimate mirror M5 and the last mirror M6 each have a passage for the exposure radiation, making the depicted projection system 20 a doubly obscured optic. The projection system 20 has an image-side numerical aperture that is greater than 0.3 and can also be greater than 0.6, for example 0.7 or 0.75.

[0053] The reflective surfaces of the mirrors M i can be designed as freeform surfaces without an axis of rotational symmetry. Alternatively, the reflective surfaces of the mirrors M can be i but can also be designed as aspherical surfaces with exactly one axis of rotational symmetry or as reflective surfaces. The mirrors M i Like the mirrors of the exposure optics 16, they can have high-reflectivity coatings for irradiation. These reflective coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0054] The projection system 20 has a large object-image offset in the y-direction between a y-coordinate of the center of the object field 11 and a y-coordinate of the center of the image field 21. This object-image offset in the y-direction can be approximately as large as a z-distance between the object plane 12 and the image plane 22.

[0055] The projection system 20 can in particular be anamorphic, i.e. it has in particular different image scales β x , β y in the x and y directions. The two image scales β x , β y of the projection system 20 are preferably located at (β x , β y ) = (+ / - 0.25, + / - 0.125). A magnification β of 0.25 corresponds to a reduction in the ratio of 4:1, while a magnification β of 0.125 results in a reduction in the ratio of 8:1. A positive sign for the magnification β indicates a magnification without image inversion, whereas a negative sign indicates a magnification with image inversion.

[0056] Other magnification ratios are also possible. Magnification ratios with the same sign and those with the same absolute value β are also possible. x , β y In the x and y directions, adjustments are possible.

[0057] The number of intermediate image planes in the x- and y-directions in the beam path between the object field 11 and the image field 21 can be the same or different, depending on the design of the projection system 20. Examples of projection systems 20 with different numbers of such intermediate images in the x- and y-directions are known from US 2018 / 0074303 A1.

[0058] Projection system 20 can, in particular, have a homocentric entrance pupil. This may be accessible. However, it may also be inaccessible.

[0059] Exposure by the exposure system 10 and transfer to the image plane 21 by the projection system 20 creates a reticule 30 (also called a mask) arranged in the object field 21. The reticule 30 is held by a reticule holder 31. The reticule holder 31 can be moved, particularly in a scan direction, by means of a reticule displacement drive 32. In the illustrated embodiment, the scan direction is in the y-direction.

[0060] A structure on the reticulum 30 is imaged onto a photosensitive layer of a wafer 35 located in the image plane 22 within the image field 21. The wafer 38 is held by a wafer holder 36. The wafer holder 36 can be displaced, particularly along the y-direction, via a wafer transfer drive 37. The displacement of the reticulum 30 via the reticulum transfer drive 32 and of the wafer 35 via the wafer transfer drive 37 can be synchronized.

[0061] The in Fig. The projection exposure system 1 shown in Figure 1, or its exposure system 10, the description of which essentially reflects known prior art, is characterized in that the first and / or second faceted mirror 18, 19 is each composed of several MEMS micromirror units, wherein the MEMS micromirror units each comprise several pivotable micromirrors 18', 19'. The individual MEMS micromirror units are mounted on a higher-level assembly to jointly generate the Fig. The two faceted mirrors 18 and 19 shown in Figure 1 are to be formed. In addition to the mechanical fastening, the higher-level assembly also handles all necessary connections of the individual MEMS micromirrors, for example to control electronics and / or cooling circuits.

[0062] According to the representation Fig. Figure 2 shows a bottom view of a receiving body 132, on the underside of which is a laterally arranged spring-loaded stop 136 and an interface element 150 embedded in a sleeve-shaped component 172. The sleeve-shaped component 172 can be part of the receiving body 132 or designed as a separate component. Furthermore, the sleeve-shaped component 172 can be part of the interface element 150, which represents another embodiment.

[0063] From the representation according to Fig. Figure 2 shows that a spring stop 136, formed by a flat spring having a fork 138, blocks or at least significantly limits rotation, i.e., circumferential movement, of the sleeve-shaped component 172 about the axis of symmetry 144. Thus, circumferential movement of the sleeve-shaped component 172 and the interface element 150 received therein is blocked or at least significantly limited, corresponding to a sixth degree of freedom. The spring stop 136, located on the underside of the receiving body 132, encloses a nose-shaped projection 168, which may have a chamfer. The spring stop 136 has a region of high spring stiffness (flexurally rigid) in the tangential direction (see illustration according to Figure 2). Fig. 2) and in the axial direction a flexible deflection range of 160° (see illustration according to Fig. 3) The fork 138 is resilient (see illustration according to Fig. 3) on the rectangular or trapezoidal, nose-shaped projection 168 extending into the plane of the drawing, on the lateral surface of the sleeve-shaped component 172. Due to the engagement of the nose-shaped projection 168 in the fork 138 of the spring stop 136, there is no play 135.

[0064] From the representation according to Fig. Figure 3, a partial section, shows that the interface element 150 is inserted into a through-opening of the receiving body 132. The insertion of the interface element 150 is essentially axial, corresponding to an assembly direction 130. The receiving body 132 comprises a circumferentially extending contact surface 158, as does the interface element 150. The circumferential contact surfaces 158 of the aforementioned components can be designed with a complementary taper 166 to facilitate easier joining of the components in the assembly direction 130, i.e., essentially in the axial direction.

[0065] To facilitate a rough alignment between the interface element 150 and the receiving body 132, the latter includes an alignment element 152 extending essentially parallel to the axis of symmetry 144. This element interacts with a complementary notch, recess, or the like on the head of the interface element 150. MEMS micromirrors, such as swiveling micromirrors 18', 19' as MEMS mirror array assemblies, can be mounted on a substrate or a wiring element on its upper surface 170.

[0066] According to the representation Fig. 2 can also be seen that the nose-shaped projection 168 is located on the side of a flattening 164 on the sleeve-shaped component 172.

[0067] As can be seen from the representation according to Fig. As further shown in Figure 3, a seal 156, for example in the form of a ring, is located on the upper end face of the receiving body 132 and is embedded in the material of the receiving body 132. Alternatively, the seal 156 can also be embedded in the material of the interface element 150. The lower end face of the receiving body 132 is shown in the illustration. Fig. Two spring-loaded stops 136, shown from below, are arranged to ensure freedom from play 135. From the illustration according to Fig. 3 shows that the spring stop 136 can, for example, be designed as a flat spring, the bifurcation of which 138 according to Fig. 2 clamps the nose-shaped projection 168 of the sleeve-shaped component 172 on both sides, so that a movement of the sleeve-shaped component 172 according to the sixth degree of freedom, i.e. in the circumferential direction according to Fig. 2, is prevented. A double arrow 160 indicates a deflection direction of the spring-loaded stop 136, which is particularly advantageously designed as a flat spring. The spring-loaded stop 136 deflects when the interface element 150 is inserted into the opening of the receiving body 132 during assembly in the mounting direction 130, which essentially coincides with the axial direction.

[0068] A seal between the interface element 150 on the one hand and the receiving body 132 on the other hand is provided by the sealing element, designed as a sealing ring 156, which is embedded in an end face of the receiving body 132 and which interacts with a lower sealing surface, namely a flat contact surface 154 of the head of the interface element 150, and can thus ensure a media tightness.

[0069] Out of Fig. Figure 4 shows that the interface element 150 can be provided on its upper surface 170, for example, with MEMS micromirror units 100 [not in BZL], which can be configured as MEMS mirror array assemblies 110 [not in BZL]. The circumferential / contact surface 158, formed with a taper 166, extends below the head-shaped region of the interface element 150. The taper 166 of the circumferential / contact surface 158 of the interface element 150 corresponds to a taper in which the opening in the receiving body 132 for receiving the interface element 150, inserted in the axial mounting direction 130, is formed. From the illustration according to Fig. 4 shows in the top view the nose-shaped projection 168 at the upper end of the flattening 164.

[0070] When the interface element 150, which is provided with pivotable MEMS micromirrors 18', 19' on its upper surface 170, is inserted into the receiving body 132 in the mounting direction 130, only a sixth degree of freedom remains, corresponding to a circumferential movement of the interface element 150 about its axis of symmetry 144. This movement is blocked, however, by the engagement of the nose-shaped projection 168 by the spring-loaded stop 136 during insertion in the mounting direction 130, thus enabling precise positioning of the interface element 150, including the MEMS structures mounted on its upper surface 170. The sleeve-shaped component 172 can be attached to the interface element 150 and is mounted together with it in the receiving body 132.

[0071] In the method proposed according to the invention for backlash-free orientation of the interface element 150, in particular a carrier for a MEMS micromirror unit and / or at least one MEMS mirror array assembly, which is / are received on the top surface 170 of the interface element 150 on a higher-level assembly, given by the receiving body 132 by means of the contact surfaces 154, 158, the interface element 150 is positioned and / or aligned relative to the higher-level assembly in the form of the receiving body 132. The following method steps are carried out: a) Inserting the interface element 150 into the receiving body 132 in the assembly direction 130 and thereby significantly limiting five degrees of freedom, b) Establishing contact between the contact surfaces 154, 158 of the interface element 150 and the receiving body 132, c) during the execution of process steps a) and b), bringing a spring-loaded stop 136 of the receiving body 132 into contact with a nose-shaped projection 168 such that a movement 134 in the circumferential direction - corresponding to a sixth degree of freedom - about an axis of symmetry 144 is significantly limited.

[0072] The method proposed according to the invention maintains a designated contact point 140 between the spring-loaded stop 136 and the nose-shaped projection 168 while preserving free play 135. In the present context, the receiving body 132 represents the higher-level assembly already mentioned above.

[0073] According to the method proposed in the invention, after carrying out process steps b) and c), a significant limitation of movement possibilities of all six degrees of freedom between the interface element 150 on the one hand and the receiving body 132 on the other hand takes place. Minimal gaps are formed between the receiving body 132, which represents the higher-level assembly, on the one hand and the interface element 150 on the other, thereby promoting heat transfer between said components.

[0074] The solution proposed according to the invention allows for repeated assembly and disassembly of the interface element 150 and the receiving body 132, whereby, in the joined state of the two components, all six degrees of freedom are significantly limited, thus ensuring and maintaining clearance 135 during further processes of the joined components, namely the interface element 150 on the one hand and the receiving body 132 on the other. In particular, the solution proposed according to the invention provides a very large heat transfer surface in the form of the circumferential contact surface 158 and achieves a media seal by means of the seal in the form of a sealing ring 156 running along the top of the receiving body 132.

[0075] The receiving body 132 on the one hand and the interface element 150 on the other hand can be combined using pairing methods known from the prior art in such a way that initially a significant limitation of five degrees of freedom results and, after assembly of said components, the movement of the interface element 150 with respect to the receiving body 132, i.e. the remaining sixth degree of freedom, is also blocked or at least significantly limited.

[0076] The receiving body 132 can be cylindrical or conical with the aforementioned taper 166, so that, on the one hand, the interface element 150 can be easily inserted into the central opening of the receiving body 132, and, on the other hand, a large heat transfer surface is provided in the form of the circumferential contact surface 158. During the assembly of the interface element 150 into the receiving body 132 in the assembly direction 130, the coarse and fine circumferential alignment of the interface element 150 with respect to the receiving body 132 is determined by the alignment element 152 and the position of the spring stop 136 on the lower end face of the receiving body 132.

[0077] The nose-shaped projection 168 and the contact surface or a designated contact point 140 can be pyramidal, conical, rectangular, cylindrical, symmetrical, asymmetrical, convex, concave, or have other geometries. It must be ensured that the spring stop 136 prevents circumferential movement of the nose-shaped projection 168. In a particularly advantageous embodiment, the spring stop 136 is designed as a flat spring, which is provided, for example, with a fork 138 at its front end.

[0078] The present invention further relates to a MEMS micromirror unit mounted on the top side 170 of the interface element 150, which is attached to a higher-level assembly in the form of a receiving body 132.

[0079] Furthermore, the invention relates to the use of the method according to the invention in systems for semiconductor technology.

[0080] The invention is not limited to the embodiments described here and the aspects highlighted therein. Rather, within the scope specified by the claims, a multitude of modifications are possible that fall within the bounds of what is considered skilled in the art. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] WO 2012 / 130768 A2

[0005] DE 10 2015 204 184 A1

[0006] DE 10 2015 220 018 A1

[0007] DE 10 2008 909 690 A1

[0042] US 2006 / 0132747 A1

[0042] EP 1 614 008 B1

[0042] US 6,573,978

[0042] DE 10 2017 220 586 A1

[0046] US 2018 / 0074303 A1

[0057]

Claims

[1] Method for backlash-free orientation of an interface element (150), in particular a carrier for at least one MEMS micromirror unit and / or at least one MEMS mirror array assembly, which is / are received on a top surface (170) of the interface element (150) by means of contact surfaces (154, 158) for positioning and / or aligning the interface element (150) relative to a receiving body (132), comprising the following method steps: a) Inserting the interface element (150) into the receiving body (132) in the assembly direction (130) and thereby significantly limiting movements into five degrees of freedom, b) Establishing contact between the contact surfaces (154, 158) of the interface element (150) and those of the receiving body (132), c) during the execution of process steps a) and b), bringing a spring-loaded stop (136) of the receiving body (132) into contact with a nose-shaped projection (168) such that a direction of movement (134) in the circumferential direction, corresponding to the sixth degree of freedom about an axis of symmetry (144), is significantly limited. [2] Method according to claim 1, characterized by , that after carrying out process step c) a designated contact point (140) between the interface element (150) and the receiving body (132) is permanently maintained while maintaining freedom of movement (135), at least in the direction of the sixth degree of freedom. [3] Method according to claims 1 and 2, characterized by, that after carrying out process steps b) and c) all six degrees of freedom between the interface element (150) and the receiving body (132) are blocked and heat transfer takes place with the formation of minimized gaps between them. [4] Method according to claims 1 to 3, characterized by , that the mounting direction (130) of the interface element (150) into the receiving body (132) is essentially in an axial direction. [5] Method according to claims 1 to 4, characterized by , that a rough alignment in the circumferential direction is carried out by means of an alignment element (152) formed on the receiving body (132) and extending parallel to the axis of symmetry (144) of the interface element (150). [6] Device for carrying out the method according to one of claims 1 to 5, comprising an interface element (150) and a receiving body (132), characterized by, that the interface element (150) and the receiving body (132) each have circumferential contact surfaces (158) which are cylindrical to each other or in complementary conicity (166) with respect to an axis of symmetry (144). [7] Device according to claims 1 to 6, characterized by , that a spring-loaded stop (136) is formed on the receiving body (132), which can be deflected in the deflection direction (160) by the insertion movement of the interface element (150) in the assembly direction (130). [8] Device according to claims 6 to 7, characterized by , that the spring stop (136) is essentially designed as a flat spring. [9] Device according to claims 6 to 8, characterized by , that the spring stop (136) is located on the receiving body (132) and the nose-shaped projection (168) is located on the interface element (150), or vice versa. [10] Device according to claims 6 to 9, characterized by, that the receiving body (132) comprises an alignment element (152) which extends essentially in an axial direction parallel to the axis of symmetry (144) of the interface element (150). [11] Device according to claims 6 to 10, characterized by , that a number of MEMS micromirror units and / or a number of swiveling MEMS micromirrors (18', 19') are arranged on a top surface (170) of the interface element (150). [12] MEMS micromirror unit mounted on a top side (170) of an interface element (150) mounted on a receiving body (132), characterized by that the MEMS micromirror unit is positioned and / or aligned according to a method according to one of claims 1 to 5. [13] Use of the method according to any one of claims 1 to 5 in semiconductor technology plants.

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