PRETREATMENT OF A SUBSTRATE FOR MELT-DIP COATING

Abstract

A hot-dip coating system comprising a substrate path with one or more rollers configured to move a substrate along the substrate path between a first end and a second end, a pre-coating area arranged in relation to the substrate path and configured to apply a first coating to the substrate, a preheating area arranged in relation to the substrate path and configured to heat the substrate and the first coating, and a hot-dip coating area arranged in relation to the substrate path and configured to apply a second coating to the substrate.

Description

INTRODUCTION

[0001] The information contained in this section serves to present the context of the disclosure in general terms. Works of the inventors mentioned herein, insofar as they are described in this introduction, as well as aspects of the description that might not otherwise be considered prior art at the time of filing, are neither expressly nor implicitly admitted as prior art against this disclosure.

[0002] The present disclosure relates generally to a hot-dip coating plant and in particular to a plant for pretreating a substrate before it enters a melt bath.

[0003] Hot-dip coating involves applying a molten coating to the surface of a substrate in a continuous process. The substrate can be guided as a continuous ribbon through a bath of molten material. In the melt bath, the substrate reacts with the molten material to bond the coating to the substrate. In some cases, the molten material adheres to the surface of the substrate; in others, the molten material bonds to the substrate by becoming embedded in at least part of it.

[0004] Depending on the substrate and melt pool materials, quality problems can occur during hot-dip coating. For example, some substrate materials are good thermal conductors (e.g., copper), which can lead to undesirable local solidification of the molten material (e.g., lithium) on a surface of the substrate. The shortcomings of existing hot-dip coating processes are remedied by one or more principles of this disclosure. BRIEF SUMMARY OF THE INVENTION

[0005] In a training exercise, a hot-dip coating system is provided and includes a substrate path with one or more rollers designed to move a substrate along the substrate path between a first end and a second end, a pre-coating area arranged in relation to the substrate path and designed to apply a first coating to the substrate, a preheating area arranged in relation to the substrate path and designed to heat the substrate and the first coating, and a hot-dip coating area arranged in relation to the substrate path and designed to apply a second coating to the substrate.

[0006] The hot-dip coating system may include one or more of the following optional features. For example, the hot-dip coating system may include a masking area preceding the pre-coating area along the substrate path. The masking area may be designed to apply a mask to a portion of the substrate. The hot-dip coating system may also include one or more quality assessment areas arranged along the substrate path. According to one feature, the one or more quality assessment areas comprise a first quality area immediately preceding the masking area and a second quality area immediately following the pre-coating area.According to another aspect, the hot-dip coating system may also include a finishing area which is arranged in relation to the substrate path and designed to remove the mask and cut off untreated parts of the substrate.

[0007] According to at least one aspect, the substrate comprises copper, the first coating a zinc oxide material, and the second coating a lithium-based material.

[0008] According to another aspect, the preheating area comprises one or more heating elements arranged relative to a first surface of the substrate and relative to a second surface of the substrate. The one or more heating elements can be configured to emit heat at a temperature between 180 °C and 250 °C. According to one example, the heating rate of the substrate and the first coating is adjustable based on the distance between the one or more heating elements and the substrate, as well as the angle of the one or more heating elements relative to the substrate. According to another example, the one or more heating elements can be induction heaters or VCSEL (surface emitter) heating elements.

[0009] In another training document, a method for manufacturing a current collector for a vehicle battery is provided. The method includes providing a substrate with a first surface, a second surface opposite the first surface, a first side, and a second side spaced laterally from the first side; applying a mask to a portion of the first and second surfaces as well as to the first and second sides of the substrate; applying a first coating to the first and second surfaces of the substrate; preheating the substrate and the first coating with one or more heating elements arranged next to the substrate; immersing the substrate in a molten bath of a second coating so that the second coating can adhere to the substrate; removing the mask; and trimming the substrate on the first and second sides.

[0010] The process may include one or more of the following optional aspects. For example, providing a substrate may include providing a copper substrate.

[0011] According to one aspect, the process for manufacturing the current collector further includes the application of the first coating using a cold spraying process. The process for manufacturing the current collector may also include the application of the first coating with a zinc oxide material.

[0012] According to another aspect, preheating the substrate and the first coating also includes placing the substrate between one or more heating elements.

[0013] According to at least one example, preheating the substrate and the first coating further includes arranging the one or more heating elements in relation to the first surface or the second surface of the substrate.

[0014] According to another example, preheating the substrate and the first coating further includes arranging the one or more heating elements in relation to the first side or the second side of the substrate.

[0015] According to at least one aspect, the process for manufacturing the current collector also includes providing the second coating with a lithium material.

[0016] According to another aspect, the process for manufacturing the current collector also includes evaluating the quality of the substrate and the first coating.

[0017] According to at least one example, trimming the substrate on the first and second sides further includes providing a laser to remove untreated parts of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described here serve only to illustrate selected designs and are not intended to limit the scope of the present disclosure. Fig. Figure 1 is a schematic representation of a hot-dip coating plant according to the principles of the present disclosure; Fig. Figure 2 is a cross-sectional view of a substrate made of Fig. 1 with a mask on part of the substrate; Fig. Figure 3 is a close-up of a pre-coating area of ​​the hot-dip coating system made of Fig. 1; Fig. Figure 4 is a cross-sectional view of the substrate made of Fig. 1 with a first coating on a first surface and a second surface of the substrate; Fig. Figure 5 is a top view of the substrate made of Fig. 4; Fig. Figure 6 is a close-up of a preheating section of the hot-dip coating system. Fig. 1; Fig. Figure 7 is a close-up of the cross-section of a substrate with one or more local hardenings of a second coating; Fig. Figure 8 is a close-up of the cross-section of a substrate with a uniformly distributed layer of a second coating; and Fig. Figure 9 is a flowchart of a process for manufacturing a current collector for a vehicle battery according to the principles of the present disclosure.

[0019] Corresponding reference symbols identify corresponding parts in the drawings. DETAILED DESCRIPTION

[0020] Based on the accompanying drawings, exemplary embodiments are now described in more detail. These exemplary embodiments are provided to illustrate this disclosure comprehensively and to convey its full scope to the person skilled in the art. Specific details are given, such as examples of specific components, devices, and processes, to provide a comprehensive understanding of the embodiments described in this disclosure. It is understood by the person skilled in the art that specific details need not be used, that exemplary embodiments can take many different forms, and that the specific details and exemplary embodiments should not be interpreted as limiting the scope of the disclosure.

[0021] The terminology used here serves only to describe specific training examples and is not to be understood as restrictive. Unless the context clearly indicates otherwise, the singular articles "ein," "eine," and "der," "die," "das" used here are intended to also include the plural forms where applicable. The terms "umfassen," "umfassend," "haltten," and "aufweisen" are inclusive and thus indicate the presence of features, steps, processes, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, processes, elements, components, and / or groups thereof. The procedural steps, processes, and operations described here are not to be interpreted as necessarily having to be carried out in the specific order explained or illustrated, unless they are explicitly marked as a sequence of execution.Additional or alternative steps can be applied.

[0022] When an element or layer is described as being "on" or "interacting with" another element or layer, or as being "connected" or "coupled" or "attached" to the same, it may be directly on or interacting with, connected with, coupled to, or attached to the other element or layer, or there may be intervening elements or layers. However, when an element is described as being "directly on" or "directly interacting with" another element or layer, or as being "directly connected" or "directly coupled" or "attached" to the same, there must be no intervening elements or layers. Other words used to describe the relationship between elements should be interpreted similarly (e.g.,(e.g., "between" as opposed to "directly between", "neighboring" or "adjacent" as opposed to "directly adjacent" or "directly bordering", etc.). The term "and / or" used here encompasses all combinations of one or more of the listed points.

[0023] The terms "first," "second," "third," etc., may be used here to describe different elements, components, areas, layers, and / or sections. These elements, components, areas, layers, and / or sections should not be restricted by these terms. These terms may only be used to distinguish one element, component, area, layer, or section from another. Unless explicitly stated by the context, terms such as "first," "second," and other numerical terms do not imply any particular sequence or order.Thus, one could refer to a first element, a first component, a first area, a first layer or a first section, which are discussed below, as a second element, second component, second area, second layer or second section, without deviating from the teachings of the exemplary trainings.

[0024] In this application and the following definitions, the term "module" may be replaced by the term "circuit". The term "module" may refer to, be part of, or include: an application-specific integrated circuit (ASIC), a digital, analog, or mixed analog / digital discrete circuit, a digital, analog, or mixed analog / digital integrated circuit, a combinational logic circuit, a field-programmable gate array (FPGA), a processor (common, dedicated, or group) that executes code, a memory (common, dedicated, or group) that stores code executed by a processor, other suitable hardware components that provide the described functionality, or a combination of some or all of the above components, e.g., in a system-on-a-chip.

[0025] The term "code," as used above, can include software, firmware, and / or microcode and may refer to programs, routines, functions, classes, and / or objects. The term "shared processor" includes a single processor that executes some or all of the code from multiple modules. The term "group processor" includes a processor that, in combination with additional processors, executes some or all of the code from one or more modules. The term "shared memory" includes a single memory that stores some or all of the code from multiple modules. The term "group memory" includes memory that, in combination with additional memory, stores some or all of the code from one or more modules. The term "memory" can be a subcategory of the term "computer-readable medium."The term "computer-readable medium" does not include transitory electrical or electromagnetic signals propagating through a medium and can therefore be considered tangible and non-transient storage. Non-restrictive examples of non-transient storage include tangible, computer-readable media, including non-volatile memory, magnetic memory, and optical memory.

[0026] The devices and methods described in this application can be implemented in whole or in part by one or more computer programs executed by one or more processors. The computer programs comprise processor-executable instructions stored on at least one non-transient, concrete, computer-readable medium. The computer programs may also include and / or be based on stored data.

[0027] A software application (i.e., a software resource) can refer to computer software that causes a computer device to perform a task.

[0028] In some examples, a software application may be referred to as an application, app, or program. Examples of such applications include system diagnostics applications, system administration applications, system maintenance applications, word processing applications, spreadsheet applications, messaging applications, media streaming applications, social networking applications, and gaming applications.

[0029] Non-transient memory can be physical devices used for the temporary or permanent storage of programs (e.g., sequences of instructions) or data (e.g., program status information) for use by a computer. Non-transient memory can be volatile and / or non-volatile addressable semiconductor memory. Examples of non-volatile memory include flash memory and read-only memory (ROM) / programmable read-only memory (PROM) / erasable programmable read-only memory (EPROM) / electronically erasable programmable read-only memory (EEPROM) (e.g., typically used for firmware, such as boot programs). Examples of volatile memory include random-access memory (RAM), dynamic random-access memory (DRAM), static random-access memory (SRAM), phase-change memory (PCM), and floppy disks or tapes.

[0030] These computer programs (also referred to as programs, software, software applications, or code) contain machine instructions for a programmable processor and may be implemented in a procedural and / or object-oriented high-level programming language and / or in assembly language / machine language. The terms "machine-readable medium" and "computer-readable medium" as used here refer to all computer program products, non-transient computer-readable media, apparatus, and / or devices (e.g., magnetic disks, optical disks, memory, programmable logic circuits (PLDs)) that serve to supply machine instructions and / or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term "machine-readable signal" refers to all signals that serve to supply machine instructions and / or data to a programmable processor.

[0031] Various implementations of the systems and techniques described here can be realized in digital electronic and / or optical circuits, integrated circuits, specially designed ASICs (application-specific integrated circuits), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include one or more computer programs that are executable and / or interpretable on a programmable system comprising at least one programmable processor that can be used for special or general purposes and is coupled in such a way that it receives data and instructions from and transmits data and instructions to a storage system, as well as at least one input device and at least one output device.

[0032] The processes and logical sequences described in this patent can be executed by one or more programmable processors, also known as data processing hardware, which run one or more computer programs to perform functions by responding to input data and producing outputs. The processes and logical sequences can also be executed by specialized logic circuits, such as an FPGA (field-programmable gate array) or an ASIC (application-specific integrated circuit). Processors suitable for executing a computer program include, for example, both general-purpose and specialized microprocessors, as well as one or more processors of any type of digital computer. Generally, a processor receives instructions and data from read-only memory, random-access memory, or both.The essential elements of a computer are a processor for executing instructions and one or more storage devices for storing instructions and data. Generally, a computer also includes one or more mass storage devices for storing data, such as magnetic, magneto-optical, or optical disks, or is functionally coupled to them to receive data from or transmit data to them, or both. However, a computer does not necessarily have to have such devices. Computer-readable media suitable for storing computer program instructions and data include all forms of non-volatile memory, media, and storage devices, including, for example, semiconductor memory devices such as EPROM, EEPROM, and flash memory devices; magnetic disks such as internal hard disks or removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.The processor and memory can be supplemented by special logic circuits or integrated into them.

[0033] To enable interaction with a user, one or more aspects of the revelation can be implemented on a computer that has a display device, such as a CRT or LCD monitor or a touchscreen, to show information to the user, and optionally a keyboard and pointing device, such as a mouse or trackball, with which the user can input information into the computer. Other types of devices can also be used to enable interaction with the user; for example, the user can receive any form of sensory feedback, such as visual, auditory, or tactile feedback, and user input can be received in any form, including acoustic, verbal, or tactile input. Furthermore, a computer can interact with a user by sending and receiving documents to and from a device used by the user, such as...by sending web pages to a web browser on a user's client device after requests have been received from the web browser.

[0034] Copper-based current collectors can be used in energy storage systems such as lithium-ion batteries, sodium-ion or sodium-metal batteries, or supercapacitors because they are conductive, structurally stable, and easy to manufacture. Coating copper-based current collectors with one or more materials, such as lithium, can improve the performance of lithium-ion batteries. However, creating a smooth and / or uniform lithium layer on the copper-based current collector can be challenging because copper is an excellent thermal conductor. Generally, the lithium on the copper-based current collector solidifies when it enters a lithium melt. This is undesirable and therefore requires further improvement.

[0035] With reference to Fig. Figure 1 shows a schematic representation of a hot-dip coating system 100. A substrate track or path 102 with one or more rollers 104 extends between a first end 106 and a second end 108. One or more pretreatment areas, zones, and / or stations are arranged with respect to the substrate path 102. As explained below, the one or more pretreatment areas can be configured to assess, treat, and / or modify a substrate 110 before it enters a molten material. The rollers 104 can be arranged to control the (horizontal, vertical, inclined, etc.) position and movement of the substrate 110 between the first end 106 and the second end 108.

[0036] The substrate 110 can be a continuous roll of material (e.g., foil, wire, etc.) or a single component (e.g., a blank). In the present example, the substrate 110 can be stored as a roll of copper foil (not shown) and arranged with respect to the substrate path 102 such that the substrate 110 can be fed continuously between the first end 106 and the second end 108. Additional rolls of material can be joined together (e.g., by soldering, welding, or otherwise) so that the substrate 110 can be processed without interruption. The substrate 110 comprises a first or top surface 112, a second or bottom surface 114 opposite the first surface 112, a first side 116, and a second side 118 spaced laterally from the first side 116 (see Figure 1). Fig. 2) The substrate 110 has a thickness 120 between the first surface 112 and the second surface 114 and a width 122 between the first side 116 and the second side 118.

[0037] Although in Fig. Not shown in Figure 1, the hot-dip coating system 100 may include an area for cleaning and / or preparing the substrate 110 for processing. In other words, the substrate 110 may be treated with a cleaning agent or other preparation that removes, for example, oil, dust, and / or deposits from the substrate 110. With further reference to Fig. 1. The hot-dip coating system 100 may further include one or more quality assessment areas for evaluating the physical and / or chemical properties of the substrate 110. For example, a first quality assessment area 200 is arranged with respect to the substrate path 102 and may be configured to determine the flatness and / or thickness of the substrate 110. In the present example, the flatness and / or thickness is determined using a laser profile measurement system 202.

[0038] With further reference to Fig. 1. The hot-dip coating system 100 includes a covering area 300, which is located immediately after the first quality assessment area 200 with respect to the substrate path 102. The covering area 300 can be configured to cover or mask a portion of the substrate 110. In other words, a portion of the first surface 112, the second surface 114, the first side 116, and the second side 118 of the substrate 110 can be covered with a mask 302 (see Figure 1). Fig. 2) According to one aspect, the material of the mask 302 is a removable material that can be mechanically removed or removed by a user at a location downstream of the covering area 300. The mask 302 is designed to temporarily protect parts of the substrate 110 from being coated with one or more materials while the substrate 110 moves to the second end 108. Thus, when the mask 302 is removed, the substrate 110 has an untreated portion 304 on the first surface 112, the second surface 114, the first side 116, and the second side 118. According to another aspect, the mask 302 is made of a flexible material that can easily follow the movement of the substrate 110 as it moves along the rollers 104 to the second end 108 of the substrate path 102.

[0039] With renewed reference to Fig. 1 The hot-dip coating system 100 comprises a pre-coating area 400, which is arranged immediately after the masking area 300 with respect to the substrate path 102. The pre-coating area 400 can be configured to apply a first coating or a first material 402 to the first surface 112 and / or the second surface 114 of the substrate 110 (e.g. by spraying, spray mist, etc.) (see Fig. 4 and Fig. 5). As in Fig. As shown in Figure 3, the pre-coating area 400 can comprise one or more first or upper spray devices 404 arranged next to the first surface 112, and one or more second or lower spray devices 406 arranged next to the second surface 114. In the present example, the substrate 110 can move in a horizontal direction (see arrow in Figure 3). Fig. 3) while the first coating 402 is applied to the first surface 112 and / or the second surface 114 by one or more first spray devices 404 and / or one or more second spray devices 406. In another example, the substrate path 102 may be arranged such that the substrate 110 moves or is pulled vertically upwards while the first coating 402 is applied to the first surface 112 and / or the second surface 114. Different orientations of the substrate 110 may be desirable so that, for example, the first coating 402 is applied uniformly to the substrate 110. According to one aspect, the first coating 402 may consist of a zinc oxide material. According to another aspect, the first coating 402 may be applied to the substrate 110 by cold spraying. The first coating 402 may be desirable to improve the adhesion of another material (e.g.,to improve lithium) on substrate 110, as will be explained in more detail below.

[0040] With renewed reference to Fig. 1. The hot-dip coating system 100 can include a second quality assessment area 500 for evaluating the physical properties of the substrate 110. The second quality assessment area 500 can be located immediately downstream of the pre-coating area 400 with respect to the substrate path 102 and configured to evaluate the oxide thickness and / or oxide type on the substrate 110. In the present example, an X-ray fluorescence spectroscopy source 502 and an XRF detector 504 can be used to determine the oxide thickness and / or oxide type of the substrate 110.

[0041] The hot-dip coating system 100 further comprises a preheating zone 600, which is located after the pre-coating zone 400 and, in the present example, immediately after the second quality assessment zone 500 with respect to the substrate path 102. With reference to Fig. 6 The preheating area 600 is configured to release heat towards the substrate 110 in order to increase the temperature of the substrate 110 and / or the first coating 402. The preheating area 600 can include one or more heating elements 602 arranged alongside the substrate path 102 (see Fig. 1 and Fig. 6) According to one aspect, the one or more heating elements 602 can be induction heaters or VCSEL heating elements. According to another aspect, the one or more heating elements 602 can have a temperature of approximately 180 °C to 250 °C, and each of the heating elements 602 can be maintained at approximately the same temperature or at different temperatures. In general, several arrangements of the one or more heating elements 602 are possible within the preheating area 600. For example, the one or more heating elements 602 can be arranged with respect to the first surface 112 and / or the second surface 114, or with respect to the first side 116 and / or the second side 118. In at least one example, the one or more heating elements 602 can be arranged from top to bottom, with the substrate 110 moving vertically downwards through an arrangement of the one or more heating elements 602.In another example, the substrate 110 can be embedded between two or more of the one or more heating elements 602. Additionally or alternatively, a heated roller (not shown) can be configured to contact the substrate 110 and / or the first coating 402 and increase their temperature as the substrate 110 moves over the heated roller. Furthermore, the one or more heating elements 602 can be arranged at different distances from the substrate 110 or at different angles to the substrate 110. Arranging the one or more heating elements 602 at different distances and / or angles to the substrate 110 may be desirable to maintain the heating rate of the substrate 110 and / or the first coating 402.Preheating the substrate 110 and / or the first coating 402 may be desirable to shorten the residence time of the substrate 110 in a hot-dip coating area 700 of the hot-dip coating system 100.

[0042] With renewed reference to Fig. In Figure 1, the hot-dip coating area 700 is located immediately downstream of the preheating area 600 with respect to the substrate path 102. The hot-dip coating area 700 is configured to coat the substrate 110 with a second coating or a second material 702. In this example, the hot-dip coating area 700 includes a furnace 704, which provides a melt bath for the second coating 702. According to one aspect, the second coating 702 consists mainly of lithium.

[0043] So far, with reference to Fig. 7. Local solidification of lithium usually occurs on the surface of a copper substrate when it is placed in a lithium melt and the copper substrate is not pretreated. The local solidification of lithium can eventually melt again if the substrate remains in the molten bath for a prolonged time (i.e., with a longer residence time). However, this usually leads to dissolution of the underlying copper substrate, which compromises the integrity of the substrate and can, for example, lead to cracking or rupture of the substrate.

[0044] With reference to Fig. 8. The pretreatment zones introduced above are desirable because they shorten the residence time of the substrate 110 in the melt bath and also ensure that no local solidification of the second coating 702 (e.g., lithium) occurs on the surface of the substrate 110. In other words, the pre-coating zone 400 and the preheating zone 600 are desirable to maintain the integrity of the underlying substrate 110 and to ensure that the second coating 702 adheres uniformly to the substrate 110. Furthermore, the pretreatment zones allow the second coating 702 to bond, fuse, or at least be partially embedded in the substrate 110, thus establishing a strong bond between the second coating 702 and the substrate 110.After the substrate 110 has been coated with the second coating 702 and while the substrate 110 is removed from the hot-dip coating area 700, an interlocking section 124 forms between the second coating 702 and the substrate 110.

[0045] With renewed reference to Fig. 1. A finishing area 800 can be arranged immediately downstream of the hot-dip coating area 700 with respect to the substrate path 102. The finishing area 800 can be configured to remove the mask 302 from the substrate 110 and expose the untreated portion 304 of the substrate 110. Furthermore, the finishing area 800 can include a laser or trimming mechanism 802 for cutting, trimming, and / or removing the untreated portion 304. The mask 302 may be particularly desirable so that the laser 802 only has to cut through one material (e.g., copper) instead of several materials (e.g., lithium and copper).

[0046] With reference to Fig.In 9, a method 900 for manufacturing a current collector for a vehicle battery is provided. In 910, the substrate 110 is provided, comprising the first surface 112, the second surface 114 opposite the first surface 112, the first side 116, and the second side 118, which is laterally spaced from the first side 116.

[0047] At 920, the mask 302 is applied to a part of the first surface 112 and the second surface 114, as well as to the first and second sides 116, 118 of the substrate 110.

[0048] At 930, the first coating 402 is applied to the first surface 112 and the second surface 114 of the substrate 110.

[0049] At 940, the substrate 110 and / or the first coating 402 is preheated with the one or more heating elements 602 that are arranged next to the substrate 110.

[0050] At 950, the substrate 110 is immersed in the melt bath of the second coating 702, so that the second coating 702 can cover and / or adhere to the substrate 110.

[0051] At 960, the mask 302 is removed from the substrate 110 to expose the untreated part 304 of the substrate 110.

[0052] At 970, the substrate 110 can be trimmed on the first side 116 and the second side 118 with the laser 802 to remove the untreated parts 304 of the substrate 110.

[0053] A number of embodiments have been described. However, it is understood that various modifications can be made without deviating from the spirit and scope of the disclosure. Consequently, other embodiments also fall within the scope of the following claims.

[0054] The foregoing description serves for illustration and description. It is neither exhaustive nor intended to limit the revelation. Individual elements or features of a particular training are generally not restricted to that training, but are interchangeable and may be used in a selected training, even if they are not specifically presented or described. They may also be modified in many ways. Such modifications are not to be understood as a deviation from the revelation, but rather as falling within the scope of the revelation.

Claims

[1] Hot-dip coating plant comprising: a substrate path with one or more rollers designed to move a substrate along the substrate path between a first end and a second end; a pre-coating area which is arranged in relation to the substrate path and is designed to apply a first coating to the substrate; a preheating zone arranged in relation to the substrate path and designed to heat the substrate and the first coating; and a hot-dip coating area that is arranged in relation to the substrate path and designed to apply a second coating to the substrate. [2] Hot-dip coating system according to claim 1, further comprising a covering area preceding the pre-coating area with respect to the substrate path, wherein the covering area is configured to apply a mask to a part of the substrate. [3] Hot-dip coating system according to claim 2, further comprising one or more quality assessment areas arranged in relation to the substrate path. [4] Hot-dip coating system according to claim 3, wherein the one or more quality assessment areas comprise a first quality area immediately preceding the covering area and a second quality area immediately following the pre-coating area. [5] Hot-dip coating system according to claim 3, further comprising a finishing area arranged in relation to the substrate path and configured to remove the mask and cut off untreated parts of the substrate. [6] Hot-dip coating system according to claim 1, wherein the substrate comprises copper, the first coating comprises a zinc oxide material and the second coating comprises a lithium-based material. [7] Hot-dip coating system according to claim 1, wherein the preheating area comprises one or more heating elements arranged in relation to a first surface of the substrate and in relation to a second surface of the substrate. [8] Hot-dip coating system according to claim 7, wherein one or more heating elements are configured to emit heat at a temperature between 180 °C and 250 °C. [9] Hot-dip coating system according to claim 7, wherein the heating rate of the substrate and the first coating is adjustable by means of the distance between the one or more heating elements and the substrate and the angle of the one or more heating elements with respect to the substrate. [10] Hot-dip coating system according to claim 7, wherein one or more heating elements are induction heaters or VCSEL heating elements.

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