Methods for setting up a data center or server room or part thereof

Abstract

The invention relates to a method for setting up a data center or server room, or a part thereof, in which the heat load of electronic components is dissipated by air and an internal coolant, wherein the internal coolant is contained in an insulated inner circuit that can transfer heat to an external coolant system via a liquid-liquid heat exchanger, comprising a manufacturing of an assembly comprising a device base, a rack for holding electronic components, the inner circuit, wherein a cooling element is arranged on the rack which is part of the inner circuit, the liquid-liquid heat exchanger, a pump for moving the internal coolant in the inner circuit, an air-liquid heat exchanger arranged on the rack which can be connected to an external coolant system, and a control cabinet.in which the electrical components of the assembly are electrically connected for connection to a main electrical supply line, transport of the manufactured assembly to the data center or server room building, connection of the assembly to an external coolant system present in the building, so that the liquid-liquid heat exchanger is part of an external coolant circuit and so that the air-liquid heat exchanger is part of an external coolant circuit.

Description

[0001] The invention relates to a method for setting up a data center or server room or part thereof.

[0002] To meet the increasing demand for computing power, driven in particular by AI-based services, advanced analytics, and rapidly advancing digitalization, processor capacity in data centers and server rooms is experiencing strong growth. At the same time, server density can increase. This leads to a rising heat load per rack; in some cases, the heat load per rack exceeds 80 kW. This necessitates cooling solutions that can efficiently manage this heat while ideally requiring as little space as possible.

[0003] Systems exist in which the heat load of electronic components is also dissipated using a coolant. In these systems, cooling elements through which the coolant flows are positioned in close proximity to the heat sources on the racks. This close proximity ensures rapid and precise heat transfer, thereby optimizing cooling efficiency. The cooling process can be facilitated, in particular, by a network of small pipes that direct the fluid straight to the processors. Once the heat has been absorbed by the coolant, it is dissipated and circulated to a recooler.

[0004] It is also known to include an additional air cooling component in systems with liquid cooling. DE 10 2012 218 873 A1 discloses a multi-rack assembly that includes an air-liquid heat exchanger and a cooling unit.

[0005] However, such solutions with liquid cooling and air cooling have a disadvantage in that the complexity of the installations is increased compared to solutions that are only air-cooled, which also increases the risk of errors, especially during assembly.

[0006] The object of the invention is to provide a method for setting up a data center or server room or part thereof in which the heat load of electronic components is dissipated with air and with cooling liquid, which is advantageous compared to known methods.

[0007] The problem is solved by a method according to claim 1. Further advantageous embodiments are the subject of the dependent claims or are described below.

[0008] The inventive method provides that the assembly, which includes the inner circuit, is not manufactured in the data center or server room to be set up, but rather beforehand, at another location, typically a factory.

[0009] Manufacturing the internal cooling loop in a factory ensures higher piping quality. Access to the pipes and lighting conditions are generally better in a factory than in the data center or server room being set up. Furthermore, a factory offers better opportunities for cleaning and testing the piping. The best tools are also readily available. An error in the design of the internal cooling loop, such as incorrect components or incorrectly sized pipes and lines, can cause the server's cooling process to fail, rendering the server unusable. During installation, it is crucial not only to prevent leaks in the internal cooling loop but also to achieve a very high level of piping cleanliness. Contaminants in the cooling fluid can also lead to cooling system malfunctions.This can already apply to particles larger than 25 microns. Such error risks are significantly reduced by the method according to the invention.

[0010] Commissioning in the data center or server room to be set up using the method according to the invention involves significantly less installation and / or logistical effort for the installer, thereby considerably reducing the risk of errors. This results in savings in the number of skilled personnel required in the data center or server room to be set up, and thus a reduction in costs. Planning the on-site installation is also significantly simplified. Overall, the method according to the invention leads to increased efficiency and thus a reduction in costs.

[0011] The method according to the invention is particularly advantageous when the data center or server room is to be set up in geographical regions where there is little qualified personnel and little technically developed infrastructure. Especially in such situations, the method according to the invention enables significantly better time planning and saves on specialist personnel who would otherwise have to travel from afar.

[0012] Preferably, all components of the assembly are mounted on the device base. The device base is preferably a frame construction. All components can be delivered pre-assembled and ready for operation.

[0013] The fluid used in the external coolant system is preferably water. The entire water supply is preferably provided via a central supply line.

[0014] Preferably, the assembly comprises at least two racks.

[0015] Preferably, the assembly comprises a coolant distribution unit, which includes the liquid-liquid heat exchanger and the pump for moving the internal coolant in the internal circuit.

[0016] Preferably, the coolant distribution unit includes a control of the flow rate and the temperature difference.

[0017] Preferably, the cooling element is designed as a cooling plate, below which an electronic component can be arranged in the rack.

[0018] Preferably, the electronic component is a processor.

[0019] Preferably, the air-liquid heat exchanger includes a fan, wherein the air-liquid heat exchanger can move air out of the interior of the rack and thereby cool the air.

[0020] Preferably, the air-liquid heat exchanger is arranged on a door located at the rear of a rack.

[0021] Preferably, the fan is an EC fan.

[0022] Preferably, all elements of the assembly are hydraulically and electrically connected and ready for operation.

[0023] Preferably, the heat load dissipation capacity is at least 20 kW.

[0024] The invention is described by reference to the Fig. 1 explains, which is a schematic representation of an example of an assembly produced according to the invention.

[0025] The assembly comprises a frame structure 1 as a base for the device, three racks 2 for housing electronic components, the internal circuit 3, with cooling elements 4 arranged on the racks 2 and forming part of the internal circuit 3, a liquid-to-liquid heat exchanger 5, a pump 6 for circulating the internal coolant in the internal circuit 3, air-to-liquid heat exchangers 7 arranged on the racks and which can be connected to an external cooling water system, and a control cabinet 8 in which the electrical components of the assembly are wired for connection to a main electrical supply. All water is supplied via a central supply line 9. The assembly, i.e., all components, can be delivered pre-assembled on the frame structure 1, ready for operation.

Claims

[1] Method for setting up a data center or server room or part thereof in which the heat load of electronic components is dissipated by air and by is dissipated by an internal coolant, wherein the internal coolant is contained in an insulated internal circuit (3) which can transfer heat to an external coolant system via a liquid-liquid heat exchanger (5), comprehensive a manufacturing of an assembly encompassing a device base(1), a rack (2) for holding electronic components, the internal circulation (3), wherein a cooling element (4) is arranged on the rack (2), which is part of the internal circuit (3), the liquid-liquid heat exchanger (5), a pump (6) for moving the internal coolant in the internal circuit (3), an air-liquid heat exchanger (7) arranged on the rack (2), which can be connected to an external coolant system, a control cabinet (8) in which electrical components of the assembly are electrically connected for connection to a main electrical supply line, characterized by a transport of the manufactured assembly to the building of the data center or server room, a connection of the assembly to an external coolant system present in the building, so that the liquid-liquid heat exchanger (5) is part of an external coolant circuit and so that the air-liquid heat exchanger (7) is part of an external coolant circuit. [2] Method according to claim 1 characterized by , that all elements of the assembly are installed on the device base (1). [3] Method according to any one of the preceding claims, characterized bythat the assembly comprises at least two racks (2). [4] Method according to any one of the preceding claims, characterized by , that the assembly includes a coolant distribution unit comprising the liquid-liquid heat exchanger (5) and the pump (6) for circulating the internal coolant in the internal circuit (3). [5] Method according to claim 4, characterized by that the coolant distribution unit includes a control of the flow rate and the temperature difference. [6] Method according to any one of the preceding claims, characterized by , that the cooling element (4) is designed as a cooling plate, below which an electronic component can be arranged in the rack (2). [7] Method according to any one of the preceding claims, characterized by that the electronic component is a processor. [8] Method according to any one of the preceding claims, characterized by, that the air-liquid heat exchanger (7) includes a fan, wherein the air-liquid heat exchanger (7) can move air out of the interior of the rack (2) and thereby cool the air. [9] Method according to claim 8, characterized by , that the air-liquid heat exchanger (7) is arranged on a door which is located at the rear of a rack (2). [10] Method according to any one of claims 8 to 9, characterized by that the fan is an EC fan. [11] Method according to any one of the preceding claims, characterized by that all elements of the assembly are hydraulically and electrically connected and ready for operation. [12] Method according to any one of the preceding claims, characterized by that the heat load dissipation capacity is at least 20 kW.

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