Power semiconductor module with a molded body and method for its production

Abstract

A power semiconductor module and a method for its production are presented, comprising a frame-like molded body with a first substrate arranged therein, with a first substrate conductor track having a normal direction, with a second substrate conductor track, and with a first connection element, wherein the molded body has a first and a second frame section, preferably opposite thereto, wherein the first and second frame sections are connected to a web, wherein the first connection element has a first contact section, which is electrically conductively connected to an associated section of the first substrate conductor track in a material-to-material manner, a first mounting section, which is connected to the web, and a first connection section, which is provided for external connection, wherein a second connection element, which has a second contact section,which is electrically conductively connected to an associated second section of the second substrate conductor track, has a second mounting section which is connected to the web and has a second connection section which is provided for external connection, wherein the connection elements are arranged mirror-symmetrically to one another, wherein the respective contact section protrudes laterally with respect to the longitudinal direction of the respective connection element aligned in the normal direction.

Description

The invention describes a power semiconductor module and a method for producing the same, having a frame-like shaped body having a first substrate arranged therein and a first connection element, wherein the shaped body has a first frame section and a second frame section preferably opposite the latter, wherein the first and second frame sections are connected to a web.DE 10 2021 134 003 A1 discloses a power semiconductor module and a method for producing the same, having a housing, a switching device arranged in this housing and having a plurality of connection elements, wherein the respective connection elements have a first connection section which is arranged in each case in a positively locking manner in the housing and a second connection section which is arranged in the housing in a materially bonded or non-positively locking manner.DE 10 2016 224 586 A1 discloses a semiconductor package comprising a substrate, a housing connected to the substrate and a plurality of press-fit pins, wherein the press-fit pins are cast in the housing and are firmly connected to the housing, and wherein the pins are electrically and mechanically connected to the substrate.DE 10 2008 033 465 A1 discloses a semiconductor assembly, a power semiconductor module, a housing and method for assembling the power semiconductor housing. An embodiment comprising an electrically insulating substrate comprises an inner housing having a cover and a rim and at least one pressure element disposed adjacent a side surface of the rim. The pressing member is elastically coupled to the inner housing.DE 10 2008 049 193 A1 discloses a power semiconductor arrangement comprising a power semiconductor chip electrically connected to a first set of plug-like elements having at least two plug-like elements, and further comprising a metal strip conductor having a set of openings receiving the first set of plug-like elements, wherein the set of openings in the metal strip conductor and the set of plug-like elements form a press-fit connection.With the knowledge of the stated circumstances, the object of the invention is to present a power semiconductor module and a method for producing the same with improved electrical properties and improved assembly.This object is achieved according to the invention by a power semiconductor module having a frame-like shaped body with a first substrate arranged therein, having a first substrate conductor track having a normal direction, having a second substrate conductor track, and having a first connection element, wherein the shaped body has a first and a second frame section preferably opposite the latter, wherein the first and second frame sections are connected to a web, wherein the first connection element has a first contact section which is electrically conductively connected to an associated section of the first substrate conductor track in a materially bonded manner, a first mounting section which is connected to the web and has a first connection section which is provided for the external connection, wherein a second connection element which has a second contact section which is electrically conductively connected to an associated second section of the second substrate conductor track in a materially bonded manner has a second mounting section, which is connected to the web and has a second connection section which is provided for external connection, wherein the connection elements are arranged mirror-symmetrically with respect to one another, wherein the respective contact section protrudes laterally with respect to the longitudinal direction of the respective connection element which is oriented in the normal direction.It is preferred if the molded body and the web are formed in one piece.It may likewise be preferred for the shaped body and the web to be formed in two pieces, preferably from the same material, and to be connected to one another preferably by means of a snap-in latching connection.It can also be preferred if the first and the second mounting section are arranged so as to stand away from one anotherFurthermore, it may be advantageous if a third conductor track is arranged on the first substrate or a second substrate and wherein a power semiconductor component is arranged on this third conductor track, which is electrically conductively connected to the first or second conductor track by means of a connecting device.It can be advantageous here if the connecting device, as viewed in the normal direction, is partially overlapped by a section of the first or second connection element.It may likewise be preferred if a metal body 6 has a third contact section which is electrically conductively connected to an associated section 360 of one of the conductor tracks of one of the substrates or a metallization surface of the power semiconductor component in a materially bonded manner, and a third mounting section which is connected to the web and preferably has a fourth contact section which is electrically conductively connected in a materially bonded manner to an associated section of one of the conductor tracks of one of the substrates or a metallization surface of the power semiconductor component.It can be advantageous here if the third and fourth contact sections are connected to the same conductor track.It can likewise be advantageous, if present, preferably all mounting sections are connected to the web in a force-fitting, form-fitting or materially integral manner.It is preferred if a printed circuit board is arranged above the web in the normal direction, which printed circuit board has an elongate recess for the first and second connection sections, wherein broad sides of the recesses are arranged next to one another.The object mentioned above is furthermore achieved according to the invention by a method for producing an above-described power semiconductor module, having the following steps in the stated sequence: a) arranging the molded body, wherein the web is formed integrally therewith and has a first and second connection element, to form a first substrate; b) materially connecting the first contact section of the first connection element to the assigned section of the first substrate conductor track and materially connecting the second contact section of the second connection element to the assigned section of the second substrate conductor track.The object mentioned above is furthermore achieved according to the invention by a method for producing an above-described power semiconductor module, having the following steps in the stated sequence: a) arranging the molded body to form a first substrate; b) arranging the web together with the first and second connection elements and connecting the web to the molded body; c) materially connecting the first contact section of the first connection element to an associated section of the first substrate conductor track and materially connecting the second connection element to an associated section of the second substrate conductor track contact section.It may be preferred here if a metal body is arranged on the web. It can also be preferred if the cohesive connection is designed as an adhesive, solder, sintered or welded connection.Of course, unless explicitly or per se excluded or contradicting the idea of the invention, the features or groups of features mentioned in the singular, for example the substrate, can be present multiple times in the power semiconductor module according to the invention.It is understood that the various embodiments of the invention, regardless of whether they are mentioned in connection with the power semiconductor module or with the method, can be realized individually or in any combinations in order to achieve improvements. In particular, the features mentioned and explained above and below can be used not only in the combinations indicated, but also in other combinations or alone, without departing from the scope of the present invention.Further explanations of the invention, advantageous details and features, are given in the following description of the exemplary embodiments of the invention schematically illustrated in FIGS. 1 to 7, or of respective parts thereof. FIG. 1 shows a first and second substrate of a power semiconductor module according to the invention in a plan view. FIG. 2 shows a molded body of a power semiconductor module according to the invention with connection elements and metal bodies in a plan view. FIG. 3 shows a power semiconductor module according to the invention in a plan view. FIG. 4 shows a section of a molded body having a web and connection elements of a power semiconductor module according to the invention in a side view. FIG. 5 shows a first substrate with connecting devices in detail of a power semiconductor module according to the invention in a plan view. FIG. 6 shows a molded body with connection elements of a power semiconductor module according to the invention in a three-dimensional view. FIG. 7 shows a molded body with connection elements in detail of a power semiconductor module according to the invention in a plan view.FIG. 1 shows a first configuration of a first and second symmetrical substrate 3, 300 of a power semiconductor module 1 according to the invention in a plan view. The first and second substrates 3, 300 are arranged spaced apart from one another when viewed in the x direction. The first substrate 3 has here, likewise spaced apart from one another, commercially available first, second, third, fourth and fifth substrate conductor tracks 30, 32, 36, 38. The second substrate 300 is formed analogously to the first substrate 3, i.e. corresponds to the structure of the first substrate 3.The first substrate conductor track 30, here AC conductor track, is arranged below the second substrate conductor track 32, here TOP side, as viewed in the y direction, and the fourth substrate conductor track 38, here DC+, is arranged above the first substrate conductor track 30. The fourth substrate conductor track 38 surrounds the second substrate conductor track 32 in this case. the third substrate conductor track 36, here DC-, surrounds the first and fourth substrate conductor tracks 30, 38 in the manner of a frame. The fifth substrate conductor track, here as a BOT side, is likewise surrounded in a frame-like manner by the first substrate conductor track 30.The first substrate conductor track 30 has a first section 340, on which a first connection element 4, for example an AC PressPin, can be arranged in the positive z direction. The first section 340 is arranged approximately centrally on the first substrate 3. Parallel to the first section 340, a second section 350 for a second connection element 5, for example a gate press pin of the TOP side, is arranged on the second substrate conductor track 32 in the y direction. The second section 350 is also arranged centrally on the second substrate conductor track 32. The two connection elements 4, 5 are connected to the respective sections 340, 350 in the arranged state in a materially bonded and electrically conductive manner, see also FIG. 4 in this regard. A connection element 4, 5, for example a gate press pin of the BOT side, can also be arranged on the fifth substrate conductor track, which is situated opposite the second substrate conductor track 32 in parallel in the y direction, on a section which is not shown here.The third substrate conductor track 36 furthermore has a third section 360 which is designed such that a metal body 6, for example as a DC connector, is arranged in the z direction and is connected to the substrate conductor track 36 in an electrically conductive manner in a materially bonded manner, see also FIG. 2 in this respect. The third substrate conductor track 36 can alternatively also have more than one third section 360.On the first substrate conductor track 30 and on the fourth substrate conductor track 38, two power semiconductor components 380, here configured as IGBTs, are respectively arranged symmetrically next to one another at the lower edge of the respective substrate conductor track 30, 38 as viewed in the y direction and are connected in an electrically conductive manner to the corresponding substrate conductor tracks 30, 38 by sintering in a materially bonded manner. The power semiconductor components 380 are arranged, for example, rotated with respect to the outer sides of the substrate 3. The power semiconductor device 380 pairs are arranged symmetrically spaced apart from each other and do not contact each other. The power semiconductor components 380 on the first substrate conductor track 30 are arranged parallel to the power semiconductor components 380 on the third substrate conductor track 38.Alternatively, the power semiconductor components 380 can also be soldered onto the substrate conductor track 30, 38. Furthermore, the respective connections can also be formed as another cohesive connection, such as, for example, as an adhesive connection. The power semiconductor components 380 can furthermore also be embodied as MOSFETs.The two power semiconductor components 380 on the fourth substrate conductor track 38 are electrically conductively connected to the first substrate conductor track 30 in a materially bonded manner by means of in each case two connecting devices 382, in this case embodied as a bonding strip by way of example. The bonding tapes 382 are arranged spaced apart from one another and extend toward the first section 340 on the first substrate conductor track 30. the two power semiconductor components 380 on the first substrate conductor track 30 are likewise connected to the third substrate conductor track 36 in a materially bonded and electrically conductive manner by two connecting devices 382, also designed as a bonding tape. The two bond tapes 382 of the power semiconductor devices 380 on the third substrate trace 36 are arranged parallel to the connection devices 382 on the first substrate trace 30 and also extend towards each other.The power semiconductor components 380 of the corresponding substrates 3, 300 are furthermore electrically conductively connected to the second and fifth substrate conductor tracks 32 by means of in each case a connecting device 382, not shown here for the sake of clarity. In this case, the upper power semiconductor components 380 are connected to the second substrate conductor track 32 and the lower power semiconductor components 380 are connected to the fifth substrate conductor track. The connecting devices 382 are configured as a bonding wire or alternatively as a bonding tape. Also, only one of the first or second power semiconductor devices 380 may be connected to the corresponding substrate traces 32, respectively.The material-to-material connection of the connecting devices 382, 384 to the substrate conductor tracks 30, 36 is here each formed, for example, as a welded connection by means of a laser welding method. Furthermore, the material-to-material connection can also be implemented by soldering, adhesive bonding or sintering.The second substrate 300 corresponds to the structure of the first substrate 3 and accordingly has the first, second, third, fourth and fifth substrate conductor tracks 30, 32, 36, 38, a first section 340 for a first connection element 4, a second section 350 for a second connection element 5 and four power semiconductor components 380 having connecting devices 382. The second substrate 300 differs from the first substrate 3 in that it has a fourth section 366, which however corresponds to the third section 360 in terms of structure, shape and arrangement. The second substrate 300 is furthermore arranged mirror-symmetrically with respect to the first substrate 3, such that the third section on the third substrate conductor track 36 of the first substrate 3 and the fourth section 366 on the third substrate conductor track 36 of the second substrate 3 are arranged next to one another, in the x direction, in order to connect the two substrates 3, 300 to one another in an electrically conductive manner by means of the metal body 6. Here too, the substrate conductor tracks, the power semiconductor components and the connecting devices are formed and arranged symmetrically with respect to one another, as in the case of the first substrate 3.FIG. 2 shows a plan view of an embodiment of a frame-like shaped body 2, shown here by hatching, of a power semiconductor module 1 according to the invention having connection elements 4, 5 and metal bodies 6. The molded body 2 has a first frame section 20 and a second frame section 22 opposite it, as viewed in the y direction. The molded body 2 further has an upper and a lower frame section in the x direction, which frame section connects the frame sections 20, 22 arranged in the y direction to one another. The four outer frame sections 20, 22 together form a rectangular frame of a rectangular cuboid shape.The first and second frame sections 20, 22 are connected to one another here by two webs 24 which are arranged in the x direction and are spaced apart from one another and are arranged between the upper and lower outer frame sections. The molded body 2 further has a third web 26 in the x direction, which is arranged centrally between the first and second frame sections 20, 22 and likewise connects the upper and lower frame sections to one another.The frame sections 20, 22 and the webs 24, 26 are formed in one piece from a plastic, for example by injection molding. They form a type of grid, so that free surfaces are present between the frame sections and webs, which free surfaces can be filled with a silicone gel, for example. Alternatively, these clearances can also be filled with another filler or else not filled.Furthermore, frame sections 20, 22 and web 24 or webs 24, 26 can also be formed in two pieces, i.e., from two or more parts. In this case, they can be formed, for example, from the same material, for example plastic, or alternatively also from different materials. The frame sections 20, 22 and the web or webs 24, 26 can be connected to one another here, for example, by means of a snap-in latching connection, so that they likewise form a grid-shaped arrangement. Alternatively, they can also be connected to one another by a cohesive connection such as, for example, adhesive bonding. In this embodiment, too, the free surfaces produced can be filled with a filler such as silicone, for example.Alternatively, the frame-like shaped body 2 can also have only two frame sections 20, 22 and one web 24, 26 or more than two webs 24, 26.The molded body 2 here has ten connection elements 4, 5, which are designed as commercially available PressPin, for electrical contacting. In this case, the connection elements 4, 5 are connected to the webs 24 of the molded body 2 via a mounting section 42. The connection elements 4, 5 are surrounded by the material of the molded body 2. The connection is also produced here by injection molding, for example.The connection elements 4, 5 are arranged here such that five can be assigned to each substrate 3, 300. The arrangement of the connection elements 4, 5 of the first substrate 3 is symmetrical in the x direction with respect to the arrangement of the connection elements 4, 5 of the second substrate 300. The upper outer frame section of the molded body 2 viewed in the y direction here has, for example, two projections spaced apart from one another, each having a connection element 4, 5. At the middle webs 24, two connection element groups are arranged in each case here, consisting of a first connection element 4 and a second connection element 5. The respective connection element 4, 5 has an electrically conductive contact section 40, 50, here formed from copper, which is arranged on the respective substrate conductor track of the respective substrate 3, 300. These contact sections 40, 50 are therefore not arranged on the molded body 2 and extend from the web 24 to the substrate conductor track, cf. FIG. 4. the contact section 40 of the first connection element 4 is directed toward the upper outer frame section and the contact section 50 of the second connection element 5 is directed toward the lower frame section.Likewise, more or fewer than the illustrated connection elements 4, 5 can be present. The connection elements 4, 5 can also be arranged on the molded body 3 individually and offset from one another.As a result of this configuration, the connection elements 4, 5 can be arranged close to one another and thus a rapid electrical switching can be ensured.The molded body 2 also has two metal bodies 6 spaced apart from one another and arranged one below the other in the y direction for the electrical contacting of the two substrates 3, 300 with one another. The two metal bodies 6 each have a third contact section 60 which is connected to an associated third section 360 of the third substrate conductor track 36 of the first substrate 3 in a materially bonded manner. In addition, each metal body has a fourth contact section 66, which is likewise connected in a materially integral manner to a fourth section 366 of the third substrate conductor track 36 of the second substrate 300. The material-bonded connections are formed here by way of example using a welding method. The two metal bodies 6 are here exemplarily bow-shaped and formed from copper. Each metal body 6 also has a third mounting portion 62 which is connected to a portion of the central web 26. The form-fitting connection is likewise formed here by injection molding during the production of the molded body 2.The mounting sections of the connection elements 42, 52, 62 are here connected in a form-fitting manner to the webs 24, 26, for example. Alternatively, the connection between the webs 24, 26 and the mounting portions 42, 52, 62 can also be designed as a force-fit or material-fit connection.The molded body 2 can alternatively also have only one metal body 6 or also more than two metal bodies 6. The third and fourth contact sections 60, 66 can also be connected to the same conductor track 30, 32, 36, 38 of a substrate 3, 300. Furthermore, the third contact section 60 and the fourth contact section 66 can also each be connected to a metallization surface of a power semiconductor component 380.FIG. 3 shows a power semiconductor module 1 according to the invention in a plan view. The power semiconductor module 1 has the first and second substrates 3, 300 described in FIG. 1, shown here in dotted lines, and the molded body 2 described in FIG. 2, which is arranged on the two substrates 3, 300 as viewed in the normal direction N, that is to say in the z direction, and surrounds these in a frame-like manner, here completely. The molded body 2 can be connected to the substrate 3, 300 in a force-fit, form-fit or firmly bonded manner.FIG. 4 shows a section of a molded body 2 having a web 24 and connection elements 4, 5 and also a first and second substrate conductor track 30, 32 of the first substrate 3 of a power semiconductor module 1 according to the invention in a side view. The two connection elements 4, 5 are identical and arranged mirror-symmetrically to one another. The respective contact sections 40, 50 thus point away from one another when viewed in the y direction. The contact sections 40, 50 are thus laterally spaced apart from the longitudinal direction 46, 56 of the respective connection element 4, 5, which longitudinal direction is aligned laterally with respect to the normal direction N. In this case, they are arranged spaced apart from one another and are connected in a positive-locking manner at their mounting portions 42, 52 to the web 24 and are each completely surrounded by the latter in the mounting portion 45, 52. The connection elements 4, 5 accordingly do not touch one another. The connection elements 4, 5 are arranged uniformly in the web 24. For the sake of clarity, the web 24 has been shown spaced apart from the connection elements 4, 5.The first connection element 4 has a first longitudinal direction 46 and the second connection element 5 has a second longitudinal direction 56, which corresponds to the normal direction N. In the normal direction N, i.e. here in the z direction, the first connection element 4 is connected on the first section 340 of the first substrate conductor track 30 to its first contact section 40 in an electrically conductive, materially bonded manner by laser welding. The first contact section 40 is here Z-shaped. Furthermore, the connection element 4 has a connection section 44 for external connection, which merges seamlessly from the mounting section 42.The second connection element 5 having a connection section 54, a mounting section 52 and a contact section 50 corresponds to the structure of the first connection element 4; however, they differ in that the second contact section 50 of the second connection element 5 is arranged on the second section 350 of the second conductor track 32 and is connected thereto in a materially integral manner.FIG. 5 shows a further embodiment of the first substrate 3 with connecting devices 380 in detail of a power semiconductor module 1 according to the invention in a plan view. The first substrate 3 is here likewise constructed symmetrically. The first substrate 3 also has a plurality of substrate conductor tracks 30, 32, 36 here. In this case, not all substrate conductor tracks are described in more detail below for reasons of clarity. The first substrate 3 has, among other things, a first substrate conductor track 30 with a first section 340 and a second substrate conductor track 32 with a second section 350 and a third substrate conductor track 36 with four power semiconductor components 380. The first substrate conductor track 30 is arranged below the second and third substrate conductor tracks 32, 36 in the y direction. In this case, two power semiconductor components 380, wherein the second substrate conductor track 32 is arranged between these two power semiconductor components 380, are arranged towards the first section 340 of the first substrate conductor track 30 and are connected to each of two connecting devices, here configured as bonding strips 382, in a materially integral manner by laser welding. Alternatively, the material connection can also be formed by adhesive bonding, sintering or soldering.The detailed illustration here shows a part of the second substrate conductor track 32 and a part of the power semiconductor component 380 arranged on the left next to the second substrate conductor track 32 in the x direction. The second substrate conductor track 32 is electrically conductively and materially connected to the power semiconductor component 380 by means of a connecting device, in this case embodied as a bonding wire 384.On the substrate conductor tracks, also though not shown, further sections 340, 350 can be present for contacting connection elements 4, 5 with their contact sections 40, 50. Likewise, the illustration of further connecting devices 382, 384 such as bonding wires or bonding tapes has been omitted for improved understanding.FIG. 6 shows a three-dimensional view of a further configuration of a molded body 2 having connection elements 4, 5 and a substrate having substrate conductor tracks of a power semiconductor module 1 according to the invention. The molded body 2 differs from the molded body 2 from FIG. 2 in that it has a first and second frame section 20, 22 and two webs 24, which converge to form a web section at the respective frame section 20, 22 and connect the two frame sections 20, 22 to one another.The shaped body 2 is configured here such that it encloses a substrate in the manner of a frame. The upper web 24 viewed in the y direction here has two two groups of connection elements 4, 5. On the lower web 24, in addition to the two groups, a single connection element is also arranged. Both the groups and the individual connecting element 4, 5 are arranged on the two webs 24 spaced apart from one another in the x direction, wherein the two groups of the two webs 24 are arranged parallel to one another and the individual connecting element is arranged on the lower web 24 between the two groups. At the sections at which the connection elements are arranged, the webs 24 here have arches in comparison with the webs 24, 26 from FIG. 2. The molded body 2 here has four metal bodies 6 for electrical contacting.FIG. 6 also shows a detailed view of a two group consisting of a first and second connection element 4, 5 of the upper web 24. the connection elements 4, 5 are arranged parallel but mirror-symmetrically, see also FIG. 4 here. the two connection elements are completely surrounded by the web 24 at their mounting portions 42, 52, not visible here. Viewed in the z-direction, the first and second connection sections 55, 54 of the respective connection element 4, 5 are arranged above the web 24 and accordingly protrude therefrom. The contact sections 40, 50 are here likewise electrically conductive and formed from copper and are connected to the substrate conductor tracks in a materially bonded manner. The contact section 40 of the first terminal element 4 is arranged here in the negative y-direction, whereas the contact section 50 of the second terminal element 5 is arranged in the positive y-direction. The contact sections 40, 50 here have an arcuate subsection and a rectangular, flat subsection, wherein this is larger than the arcuate subsection, which is connected to the substrate conductor track. Both contact sections 40, 50 are located outside the web 24 and are electrically conductively and materially connected to different substrate conductor tracks.The molded body 2 furthermore has load connection elements for external contacting, here formed from copper.FIG. 7 shows the molded body 2 from FIG. 2 with connection elements 4, 5 and a detailed view of the connection elements 4, 5 with a printed circuit board 7.In this case, as described in FIG. 4, the web 24 is arranged above the contact portions 40, 50 in the normal direction N and has the mounting portions of the connection elements 4, 5. Furthermore, the printed circuit board 7 is likewise arranged above the web 24 in the normal direction N. The printed circuit board 7 has in this case an elongate cutout 74, 75 in the x direction for the first and second connection sections 44, 54. For the purpose of illustration, the illustration of the second connection section 54 has been omitted. The recesses 74, 75 are arranged in the normal direction N in the region of the connection sections 44, 54, so that they protrude from the recesses 74, 75. The elongated recesses 74, 75 have broad sides 740, 750, which are formed here by round, overlapping recesses, for example, by nibbling. Alternatively, the recesses can also be produced by another subtractive method, such as, for example, cutting, milling, lasering or etching. The recesses 74, 75 can also be of cuboidal, round or other shape.As a result, the recesses 74, 75 can be placed particularly close to one another on the printed circuit board 7, so that the connection elements 4, 5 can likewise be placed close to one another. As a result, the electrical switching can be implemented particularly efficiently.List of reference characters1 Power semiconductor module 2 Molded body 20 First frame section 22 Second frame section 24 Web 26 Web 3 First substrate 30 First substrate conductor track 32 Second substrate conductor track 36 Third substrate conductor track 38 Fourth substrate conductor track 300 Second substrate 340 First section 342 Connecting device 350 Second section 360 Third section Substrate conductor track 366 Fourth section Substrate conductor track 380 Power semiconductor component 382 Connecting device, Bonding tape 384 Connecting device, Bonding wire 4 First connection element 40 First contact section 42 First mounting section 44 First connection section 46 First longitudinal direction 5 Second connection element 50 Second contact section 52 Second mounting section 54 Second connection section 56 Second longitudinal direction 6 Metal body 60 Third contact section 62 Third mounting section 66 Fourth contact section 7 Printed circuit board 74 First recess 740 First broad side 75 Second recess 750 Second broad side N Normal direction

Claims

Power semiconductor module (1) having a frame-like shaped body (2) with a first substrate (3) arranged therein, having a first substrate conductor track (30) having a normal direction (N), having a second substrate conductor track (32), and having a first connection element (4), wherein the shaped body (2) has a first and a second frame section (20, 22), which is preferably opposite the latter, wherein the first and second frame sections (20, 22) are connected to a web (24), wherein the first connection element (4) has a first contact section (40), which is electrically conductively connected to an associated first section (340) of the first substrate conductor track (30) in a materially bonded manner, a first mounting section (42), which is connected to the web (24), and has a first connection section (44), which is provided for the external connection, wherein a second connection element (5), a second contact section (50), which is connected to an associated second section (350) of the second substrate conductor track (32) in an electrically conductive manner by substance bonding, has a second mounting section (52), which is connected to the web (24) and has a second connection section (54), which is provided for the external connection, wherein the connection elements (4, 5) are arranged mirror-symmetrically to one another, wherein the respective contact section (40, 50) protrudes laterally with respect to the longitudinal direction (46, 56) of the respective connection element (4, 5) aligned in the normal direction (N).Power semiconductor module according to Claim 1, wherein the shaped body (2) and the web (24) are formed in one piece.Power semiconductor module according to Claim 1, wherein the shaped body (2) and the web (24) are formed in two pieces, preferably from the same material, and are preferably connected to one another by means of a snap-in latching connection.The power semiconductor module according to any one of the preceding claims, wherein the first and second mounting portions (42, 52) are arranged apart from each other.Power semiconductor module according to one of the preceding claims, wherein a third substrate conductor track (36) is arranged on the first substrate (3) or a second substrate (300), and wherein a power semiconductor component (380) is arranged on this third substrate conductor track (36), which is electrically conductively connected to the first or second substrate conductor track (30, 32) by means of a connecting device (382, 384).The power semiconductor module according to claim 5, wherein the connecting device (382, 384) is partially overlapped by a portion of the first or second terminal element (4, 5) as viewed in the normal direction (N).Power semiconductor module according to one of the preceding claims, wherein a metal body (6) has a third contact section (60) which is electrically conductively connected to an associated third section (360 of one of the substrate conductor tracks (30, 32, 36, 38) of one of the substrates (3, 300) or a metallization surface of the power semiconductor component (380) in a materially bonded manner, and a third mounting section (62) which is connected to the web (24, 26) and preferably has a fourth contact section (66) which is electrically conductively connected to an associated fourth section (366) of one of the substrate conductor tracks (30, 32, 36) of one of the substrates (3, 300) or a metallization surface of the power semiconductor component (380) in a materially bonded manner.The power semiconductor module of claim 7, wherein the third and fourth contact portions (60, 66) are connected to the same substrate trace (30, 32, 36).Power semiconductor module according to one of the preceding claims, wherein, if present, preferably all mounting sections (42, 52, 62) are connected to the web (24, 26) in a force-fit, form-fit or firmly bonded manner.Power semiconductor module according to one of Claims 4 to 11, wherein a printed circuit board (7) is arranged above the web (24) in the normal direction (N), said printed circuit board having in each case an elongate cutout (74, 75) for the first and second connection sections (44, 54), wherein broad sides (740, 750) of the cutouts (74, 75) are arranged next to one another.Method for producing a power semiconductor module (1) according to one of Claims 1 to 10, having the following steps in the stated sequence: a) arranging the shaped body (2), wherein the web (24) is formed integrally therewith and has a first and second connection element (4, 5), to form a first substrate (3); b) materially connecting the first contact section (40) of the first connection element (4) to the associated section (340) of the first substrate conductor track (30) and materially connecting the second contact section (50) of the second connection element (5) to the associated section (350) of the second substrate conductor track (32).Method for producing a power semiconductor module (1) according to one of Claims 1 to 10, having the following steps in the stated sequence: a) arranging the shaped body (2) to form a first substrate (3); b) arranging the web (24) together with the first and second connection elements (4, 5) and connecting the web (24) to the shaped body (2); c) materially connecting the first contact section (40) of the first connection element (4) to an associated section (340) of the first substrate conductor track (30) and materially connecting the second connection element (5) to an associated section (350) of the second substrate conductor track (32) of the contact section (50).Method according to either of Claims 11 and 12, wherein a metal body (6) is arranged on the web (24).Method according to one of Claims 11 to 13, wherein the cohesive connection is implemented as an adhesive, solder, sintered or welded connection.

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