Adaptation element for a printed circuit board unit

Abstract

The present invention relates to an adapter element (10) for a printed circuit board unit (100), wherein the adapter element (10) comprises a conductive element (12) and an insulating element (14), wherein the insulating element (14) is configured to electrically insulate at least a portion of an outer surface of the conductive element (12) and to achieve a specific impedance of the conductive element, wherein the conductive element (12) comprises at least one contact surface (16) and a test surface (18), wherein the contact surface (16) is configured to form a signal- and / or energy-conducting connection with a conductor track (102) of the printed circuit board unit (100), wherein the test surface (18) is configured to provide a signal on the conductor track (102) by means of the signal- and / or energy-conducting connection at the test surface (18), wherein the adapter element (10) is configured toto keep the transmission behavior between the contact surface (16) and the test surface (18) essentially constant.

Description

State of the art

[0001] The present invention relates to an adaptation element for a printed circuit board unit, a printed circuit board unit, a method for determining the signal integrity of a signal on a conductor track, an electronic unit and a vehicle.

[0002] Currently, numerous different solutions exist for determining transmission behavior in electronics. Due to the increasing transmission speed of communication interfaces and the heightened quality requirements, the need for innovative and robust methods for measuring simple and differential microstrip lines is constantly growing. Disclosure of the invention

[0003] The adaptation element according to the invention for a printed circuit board unit, in particular with a simple or differential microstrip line as a transmission interface, having the features of claim 1, has the advantage over known devices that a signal on the conductor track can be captured as realistically as possible. By subtracting the characterized adaptation element, the original signal can be deduced. In particular, by measuring or simulating the adaptation element, the S-parameters, such as a scattering parameter, can be determined, and thus conclusions can be drawn about the transmission behavior of the adaptation element.For example, the transmission characteristics of a simple or differential microstrip line in a transmission interface on a printed circuit board (PCB) can be analyzed using an oscilloscope by subtracting the transmission characteristics of the adapter element from the measured signal. This preferably eliminates the need for test points on the PCB and reduces manufacturing costs.

[0004] According to the invention, this is achieved by the adapter element for a printed circuit board unit comprising a conductive element and an insulating element. Furthermore, the insulating element is configured to electrically insulate at least a portion of the outer surface of the conductive element and to achieve a specific impedance of the conductive element. The conductive element comprises at least one contact surface and one test surface, wherein the contact surface is configured to form a signal- and / or energy-conducting connection with a conductor track of the printed circuit board unit. The test surface is configured to provide a signal on the conductor track via the signal- and / or energy-conducting connection at the test surface. The adapter element is configured to maintain a substantially constant transmission characteristic between the contact surface and the test surface.

[0005] In other words, the adapter element can be mounted on a printed circuit board (PCB) to measure the signal integrity of a signal on a conductor track, thus enabling its consideration in the qualitative evaluation of a communication interface of a higher-level assembly. Preferably, the adapter element comprises at least one insulating element, which is specifically configured to set the desired impedance and achieve the correct transmission characteristics. More preferably, the adapter element can also include a conductive element, which is specifically configured to transmit a signal from the PCB trace to a test area. Thus, a signal on the conductor track can preferably be provided at the test area via the signal- and / or energy-conducting connection between the conductive element and the conductor track.Due to the known transmission characteristics of the adapter element between the conductor track and the test area, the signal integrity of a signal on a conductor track can be measured. In other words, the transmission characteristics between the contact area, which is in contact with the conductor track, and the test area can be kept essentially constant. Essentially constant in this context means, in particular, a deviation of ± 15%, especially manufacturing tolerances. Preferably, the adapter element can be used in a method for ensuring signal integrity in various transmission interfaces. Transmission interfaces are implemented on the printed circuit board in the form of simple and differential microstrip lines.

[0006] The dependent claims describe preferred embodiments of the invention.

[0007] Preferably, the transfer behavior includes at least one scattering parameter of the adaptation element.

[0008] One advantage of this embodiment is that the scattering parameters of the adaptation element provide a characteristic value that is easily processed for further processing.

[0009] Further preferably, the adaptation element has a second conductive element, a second contact surface and a second test surface, wherein the second contact surface is configured to form a second signal and / or energy-conducting connection with a second conductor track of the printed circuit board unit, wherein the second test surface is configured to provide a further signal on the second conductor track by means of the second signal and / or energy-conducting connection at the second test surface.

[0010] An advantage of this embodiment is that the signal integrity of a signal on a differential microstrip line can be measured using an adapter element. Preferably, the assembly effort can be significantly reduced by automated assembly. More preferably, the adapter element comprises a second conductive element, a second contact surface, and a second test surface, wherein a first combination of the first contact surfaces and the second contact surface is configured to form a differential signal connection with each conductor track of the printed circuit board assembly, and wherein a combination of the first test surface and the second test surface is configured to provide a differential signal connection on the conductor track via a signal- and / or energy-conducting connection between the conductor tracks and the contact surfaces on the test surfaces.

[0011] Preferably, the conducting element and the second conducting element are arranged at a predetermined distance from each other in the insulating element, the predetermined distance being configured to establish an electrical impedance between the first conducting element and the second conducting element.

[0012] An advantage of this embodiment is that the measurement of the respective conductor track cannot be hindered by signals on the other conductor track. In particular, a distance is chosen such that a differential impedance between a first signal on the first conductor element and a second signal on the second conductor element does not influence each other.

[0013] Preferably, the guide element and the second guide element are designed to be essentially symmetrical to a longitudinal extension of the adaptation element, which is essentially orthogonal to the predetermined distance.

[0014] One advantage of this embodiment is that the symmetry significantly simplifies the handling of the adapter element, since, in particular, the relative position to the conductor tracks can be determined more easily when aligning the adapter element.

[0015] Another aspect of the invention relates to a printed circuit board unit comprising a conductor track and an adapter element as described above and below, wherein a contact surface of a guide element of the adapter element forms a signal- and / or energy-conducting connection with the conductor track, wherein a test surface of the guide element is configured to provide a signal on the conductor track by means of the signal- and / or energy-conducting connection at the test surface, and wherein the adapter element is configured to keep a connection, in particular a transmission behavior, between the contact surface and the test surface essentially constant.

[0016] An advantage of this embodiment is that a signal on a conductor track of the printed circuit board assembly can be measured using the adapter element and the test area, while simultaneously taking into account the individual transmission characteristics between the contact area and the test area of ​​the adapter element during the conductor track measurement. More preferably, "essentially constant" in this context can include a deviation of ±15%, particularly manufacturing-related tolerances. For example, the conductor track can be a simple transmission interface, such as an LVDS or PCI Express (PCIe) interface. Preferably, the term "printed circuit board assembly" can include a printed circuit board, PCB, or similar device.

[0017] Further preferably, the printed circuit board unit has a covering element over the conductor track, wherein the conductor track is substantially free of the covering element for an area substantially equal to the contact area in order to form the signal and / or energy-conducting connection.

[0018] One advantage of this embodiment is that the conductor track lacks a covering element only on the area required for contacting the adapter element, thus ensuring protection of the conductor track. For example, the covering element could be a solder mask. For the portions of the conductor track where the adapter element is contacted, the conductor track is essentially free of the covering element. "Essentially free" in this context means, in particular, that only minimal remnants of the covering element remain on the conductor track. Furthermore, the area of ​​the conductor track exposed by the covering element can be filled with solder paste to enable the adapter element to be firmly bonded to the printed circuit board assembly using an automated SMD assembly process, including reflow soldering.Preferably, the area can be substantially identical to the contact area, with "substantially" in this context particularly encompassing a deviation of ±15%, especially manufacturing-related tolerances. Even more preferably, the adapter element can be removed from the printed circuit board assembly after measurement, and the area can then be covered with a protective element. After a final measurement, the adapter element can be excluded from the assembly process, and the conductor track can be either fully or partially exposed. Thus, no residues of the adapter element will be visible in subsequent mass production.

[0019] Further preferably, the printed circuit board unit has a second conductor track, wherein the adapter element has a second conductive element which has a second contact surface and a second test surface, wherein the second contact surface is configured to form a second signal and / or energy-conducting connection with the second conductor track, wherein the second test surface is configured to provide a further signal on the second conductor track by means of the second signal and / or energy-conducting connection at the second test surface.

[0020] One advantage of this embodiment is that, with the help of an SMD assembly process including a reflow soldering process, the adapter element can be contacted to both conductor tracks, thus reducing the assembly effort for the adapter element.

[0021] Preferably, the adaptation element is detachably arranged on the conductor track.

[0022] One advantage of this embodiment is that, if a measurement on the conductor track has been successfully completed, the adaptation element can be excluded from the SMD assembly process.

[0023] Another aspect of the invention relates to a method for determining the signal integrity of a signal on a conductor track, which comprises the following steps: - Arranging or providing an adapter element, as described above and below, on a conductor track, - Determining the signal integrity of the signal on the conductor track by measuring a test area of ​​the adapter element.

[0024] One advantage of this embodiment is that the signal integrity of a signal on the conductor track can be determined using the adapter element by attaching a measuring unit such as an oscilloscope and / or a spectrum analyzer to a test area of ​​the adapter element.

[0025] Furthermore, the procedure preferably includes the following step: - Excluding the adapter element, in particular by removal, from a component placement process.

[0026] One advantage of this embodiment is that the number of components on the printed circuit board unit can be reduced by removing the adapter element.

[0027] Another aspect of the invention relates to a vehicle which has an adaptation element as described above and below and / or a printed circuit board unit as described above and below. Brief description of the drawings

[0028] Exemplary embodiments of the invention are described in detail below with reference to the accompanying drawings. The drawing shows: Fig. 1 to 5 an adaptation element according to an embodiment, Fig. 6 a vehicle according to an embodiment, Fig. 7 A flowchart illustrating steps of the procedure according to one embodiment. Embodiments of the invention

[0029] Preferably, all identical elements, units and / or steps in all figures are labelled with the same reference symbols.

[0030] Fig. Figure 1a shows an adapter element 10 according to one embodiment. The adapter element 10 for a printed circuit board unit 100 has a conductive element 12 and an insulating element 14, wherein the insulating element 14 is configured to electrically insulate at least a portion of an outer surface of the conductive element 12 and to achieve a specific impedance of the conductive element, wherein the conductive element 12 has at least one contact surface 16 and a test surface 18, wherein the contact surface 16 is configured to form a signal- and / or energy-conducting connection with a conductor track 102 of the printed circuit board unit 100, wherein the test surface 18 is configured to provide a signal on the conductor track 102 by means of the signal- and / or energy-conducting connection at the test surface 18, and wherein the adapter element 10 is configured to maintain a substantially constant transmission behavior between the contact surface 16 and the test surface 18.Preferably, the adapter element 10 has a second conductive element 20, which has a second contact surface 22 and a second test surface 24. Preferably, a signal can thus be transmitted from the conductor track 102 or the second conductor track 104 of the adapter element 10 to the respective test surfaces 18 and 24, respectively.Further preferably, the adaptation element 10 has a second guide element 20, a second contact surface 22 and a second test surface 24, wherein a first combination of the first contact surface 16 and the second contact surface 22 is configured to form a differential signal connection with each conductor track 102 of the printed circuit board unit 100, wherein a combination of the first test surface 18 with the second test surface 24 is configured to provide a differential signal connection on the conductor track 102 via a signal and / or energy-conducting connection between the conductor tracks 102 and the contact surfaces 16, 22 at the test surfaces 18, 24.

[0031] Fig. Figure 1b shows an adaptation element 10 according to one embodiment. The adaptation element 10 comprises a guide element 12 and a second guide element 20. Preferably, a signal can be transmitted from the conductor track to the test area 18 or the second test area 24 by means of the guide element 12 and the second guide element 20.

[0032] Fig. Figure 1c shows the adaptation element 10 according to one embodiment. As in the Fig. As can be seen in 1c, the guide element 12 and the second guide element 20 are preferably essentially symmetrical to a longitudinal extension direction 28 of the adaptation element, which are essentially orthogonal to the predetermined distance 26.

[0033] Fig. Figure 2a shows an adapter element 10 according to one embodiment. The adapter element 10 has a longitudinal extension 28, wherein the guide element 12 and the second guide element 20 can be arranged at a predetermined distance 26 from each other. For example, the guide element 12 can have a width of 0.5 mm and a length of 0.7 mm. More preferably, the overall dimensions of the adapter element 10 can be 1.04 mm, 1.3 mm, or 0.72 mm. Preferably, the adapter element 10 or the guide element 12 can be made of copper, and the insulating element 14 can be formed from a dielectric ceramic core. Preferably, the ceramic core has a dielectric constant of approximately 10. More preferably, the guide element 12 and the test area 18 can have an impedance of approximately 100 ohms. More preferably, the impedance can be influenced by the material parameters of the printed circuit board unit 100.Preferably, the width of the conductor track 102 can be, for example, 100 µm. Preferably, the conductor track 102 or the second conductor track 104 can be substantially free of a covering element 106 for a length of approximately 1 mm. Preferably, the adapter element 10 comprises a second conductive element 20, a second contact surface 22, and a second test surface 24, wherein a first combination of the first contact surface 16 and the second contact surface 22 is configured to form a differential signal connection with each conductor track 102 of the printed circuit board unit 100, and wherein a combination of the first test surface 18 with the second test surface 24 is configured to provide a differential signal connection on the conductor track 102 via a signal- and / or energy-conducting connection between the conductor tracks 102 and the contact surfaces 16, 22 at the test surfaces 18, 24.

[0034] Fig. Figure 2b shows the adaptation element 10 from a front view, so that it becomes clear how the guide element 12 can form a signal-conducting connection with the circuit board 102 and can provide this signal to a test area 18.

[0035] Fig. Figure 2c shows the adaptation element 10 according to one embodiment. The adaptation element 10 preferably comprises a guide element 12 and a second guide element 20, which are arranged at a predetermined distance 26 from each other. For example, the predetermined distance 26 can be 200 µm or similar.

[0036] Fig. Figure 3 shows a printed circuit board unit 100 with a conductor track 102 and a second conductor track 104, which are substantially free of a covering element 106 for an area 108. Preferably, the area 108 can be 100 µm wide and approximately 1 mm long. More preferably, the conductor track 102 and the second conductor track 104 can be arranged at a predetermined distance of approximately 200 µm from each other.

[0037] Fig. Figure 4 shows a printed circuit board unit 100 according to one embodiment. The printed circuit board unit 100 has three adapter elements 10. Preferably, the adapter element 10 can have a single test area 18. Preferably, the printed circuit board unit 100 can also have an adapter element 10 with a first test area 18 and a second test area 24.

[0038] Fig. Figure 5 shows a printed circuit board unit 100 according to one embodiment. The adapter elements 10 are shown in a perspective view to illustrate how the signal can be transmitted from conductor 102 or from the second conductor 104 to the test area 18 or the second test area 24.

[0039] Fig. Figure 6 shows a vehicle 300 according to one embodiment. The vehicle 300 preferably has an adapter element 10, as described above and below, and / or a printed circuit board unit 100, as described above and below.

[0040] Fig. Figure 7 shows a flowchart illustrating the steps of method 200 according to one embodiment. Method 200 for determining the transfer behavior of a conductor track 102 comprises the following steps: - Arranging and / or providing S1 of an adaptation element 10, as described above and below, on a conductor track 102, - Determine S2 of the transfer behavior of the conductor track 102 by measuring a test area 18 of the adaptation element 10.

[0041] Further preferably, the method 200 also includes a step of removing S3 of the adaptation element 10 from the conductor track 102.

[0042] Fig. Figure 8 shows an electronic unit 400 according to one embodiment. The electronic unit 400 preferably has an adapter element 10, as described above and below.

Claims

[1] Adaptation element (10) for a printed circuit board unit (100), wherein the adaptation element (10) comprises a conductive element (12) and an insulating element (14), wherein the insulating element (14) is configured to electrically insulate at least a part of an outer surface of the conductive element (12) and to achieve a specific impedance of the conductive element, wherein the conductive element (12) comprises at least a contact surface (16) and a test surface (18), wherein the contact surface (16) is configured to form a signal- and / or energy-conducting connection with a conductor track (102) of the printed circuit board unit (100), wherein the test surface (18) is configured to provide a signal on the conductor track (102) by means of the signal- and / or energy-conducting connection at the test surface (18), wherein the adaptation element (10) is configured toto keep the transmission behavior between the contact surface (16) and the test surface (18) essentially constant. [2] Adaptation element (10) according to claim 1, wherein the transfer behavior comprises at least one scattering parameter of the adaptation element (10). [3] Adaptation element (10) according to one of the preceding claims, wherein the adaptation element (10) comprises a second guide element (20), a second contact surface (22) and a second test surface (24), wherein the second contact surface (22) is configured to form a second signal and / or energy-conducting connection with a second conductor track (104) of the printed circuit board unit (100), wherein the second test surface (24) is configured to provide a further signal on the second conductor track (104) by means of the second signal and / or energy-conducting connection at the second test surface (24). [4] Adaptation element (10) according to claim 3, wherein the guide element (12) and the second guide element (20) are arranged in the insulation element (14) at a predetermined distance (26) from each other, wherein the predetermined distance (26) is configured to establish an electrical impedance between the first guide element (12) and the second guide element (20). [5] Adaptation element (10) according to one of claims 3 to 4, wherein the guide element (12) and the second guide element (20) are formed substantially symmetrically to a longitudinal extension direction (28) of the adaptation element (10), which is oriented substantially orthogonally to the predetermined distance (26). [6] Printed circuit board unit (100) comprising at least one conductor track (102) and an adapter element (10) according to one of the preceding claims, wherein a contact surface (16) of a guide element (12) of the adapter element (10) forms a signal and / or energy-conducting connection with the conductor track (102), wherein a test surface (18) of the guide element (12) is configured to provide a signal on the conductor track (102) by means of the signal and / or energy-conducting connection at the test surface (18), wherein the adapter element (10) is configured to maintain a transmission behavior between the contact surface (16) and the test surface (18) substantially constant. [7] Printed circuit board unit (100) according to claim 6, wherein the printed circuit board unit (100) has a covering element (106) over the conductor track (102), wherein the conductor track (102) is substantially free of the covering element (106) for an area (108) substantially equal to the contacting area (16) to form the signal and / or energy-conducting connection. [8] Printed circuit board unit (100) according to one of claims 6 to 7, wherein the printed circuit board unit (100) has a second conductor track (104), wherein the adapter element (10) has a second guide element (20) which has a second contact surface (22) and a second test surface (24), wherein the second contact surface (22) is configured to form a second signal and / or energy-conducting connection with the second conductor track (104), wherein the second test surface (24) is configured to provide a further signal on the second conductor track (104) by means of the second signal and / or energy-conducting connection at the second test surface (24). [9] Printed circuit board unit according to one of claims 6 to 8, wherein the adapter element (10) is detachably arranged on the conductor track (102). [10] Method (200) for determining the signal integrity of a signal on a conductor track (102), comprising the steps: - Arranging and / or providing (S1) an adaptation element (10) according to one of claims 1 to 5 on a conductor track (102), - Determining (S2) the signal integrity of the signal on the conductor track (102) by measuring a test area (18) of the adapter element (10). [11] Method (200) according to claim 10, further comprising the step: - Exclusion (S3) of the adapter element (10), in particular by removal, from a placement process. [12] vehicle (300) comprising an adaptation element (10) according to any one of claims 1 to 5 and / or a printed circuit board unit (100) according to any one of claims 6 to 9. [13] Electronic unit (400) comprising an adapter element (10) according to any one of claims 1 to 5 and / or a printed circuit board unit (100) according to any one of claims 6 to 9.

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