Device comprising a heat absorption device, heat absorption device, and method for operating a heat absorption device

Abstract

The invention relates to a device (10) comprising a component (12) and a heat absorption device (11), wherein at least one heat absorption element (13) of the heat absorption device (11) is thermally connected to the component (12) of the device (10) and is configured to absorb heat from the component (12) and / or dissipate heat from the component (12). The heat absorption element (13) comprises a phase-change material (14) configured to undergo a phase change in a critical temperature range by absorbing latent heat. The invention provides that the heat absorption element (13) comprises particles (15) of a ferromagnetic or magnetizable material, which are mixed with the phase-change material (14).The device (10) has a magnetic device (16) which is configured to provide a magnetic field (17), wherein the magnetic device (16) is configured to attract the particles (15) by means of the provided magnetic field (17) in order to hold the heat absorption element (13) on a surface of the component (12) by means of the provided magnetic field (17).

Description

[0001] The invention relates to a device comprising a heat absorption unit. Furthermore, the invention includes a method for operating a heat absorption unit.

[0002] Devices may contain components that generate heat during operation. Under normal operating conditions, this heat generation is harmless, as the components and devices are generally designed to dissipate the heat produced. However, heat generation can become problematic if a malfunction occurs in the component's area. Such a malfunction could be, for example, a short circuit in electrical components or a mechanical overload. In such cases, tolerances beyond a normal temperature range can be exceeded, potentially leading to damage to the component or other elements of the device.

[0003] Particularly in the event of a component malfunction, extreme heat generation can occur, which cannot be dissipated to the required extent by conventional heat absorption devices.

[0004] The heat absorption devices are not solely intended to counteract heat generation in the event of a malfunction, but also to mitigate heat generation during normal operation in which no malfunction occurs. Such situations primarily include a time-defined and / or energy-defined normal operation in which a known or approximately known amount of heat is generated.

[0005] One solution for heat dissipation is the use of phase change materials. Phase change materials are a group of materials used for heat storage.

[0006] Phase change materials (PCMs) are substances that change their state of matter at specific temperatures. Examples of phase change materials include paraffins, fats, hydrated salts, alcohols, and various organic compounds. The advantages of phase change materials for heat release or absorption compared to other methods lie in their high specific heat capacity during the phase transition and the relatively small temperature change during the process. This allows phase change materials to efficiently and uniformly store, transport, and release heat or cold.

[0007] Phase-change materials are designed so that the phase change occurs within a specific temperature range. This approach utilizes the fact that the necessary transformation enthalpy is used to increase the heat capacity during the phase change, thus delaying overheating. As a result, more heat can be absorbed than would be possible outside of the phase change.

[0008] As already described, this effect is particularly suitable for processes defined by time and / or energy. For example, phase change material can be used to cool power electronics for charging chemical energy storage devices such as secondary cells used in motor vehicles. The charging time of an electric car battery is known. Accordingly, the quantity and / or properties of the phase change material can be designed to enable efficient operation within this defined time range.

[0009] Up to now, the phase change material has been introduced in such a way that it is physically fixed. This is usually achieved through mechanical structures such as housing walls. In this way, the entire interior of the device can be encased by the phase change material to prevent it from flowing away from the heat source and / or heat sink.

[0010] Devices into which phase change materials are introduced using conventional methods are either completely encapsulated or contain mechanical structures that specifically prevent the flow of these materials. In fully encapsulated enclosures, the volumetric expansion of the phase change material is a problematic factor that can lead to mechanical stress, which in turn reduces the reliability of the electrical and mechanical components. Often, for various reasons, it is not possible to completely encapsulate enclosures with phase change materials.

[0011] Electronic semiconductor components, which often consist of multiple layers with different coefficients of thermal expansion, are particularly susceptible to internal defects. This risk increases especially under mechanical stress, as the layers can shift relative to each other under tension.

[0012] To hold the heat-absorbing element at the component's contact surface, it is common practice in the art to provide a housing that holds the element to the component's surface. This can require additional installation space. Furthermore, the volume of the heat-absorbing element can change during a phase transition of the phase-change material. This can lead to stresses in the housing and the components. Additionally, in the prior art, it may be necessary to completely enclose the heat-absorbing element to prevent it from escaping.

[0013] DE 10 2008 040 281 A1 describes a device for cooling components, comprising a housing with a cavity containing phase-change material. This phase-change material contains ferromagnetic or magnetizable particles and is enclosed by at least one coil.

[0014] It is an object of the invention to provide a solution that ensures the maintenance of contact between a phase-change material and a contact surface.

[0015] This problem is solved by the subject matter of the independent patent claims. Advantageous embodiments and further developments of the invention are the subject matter of the dependent patent claims, the description, and the figures.

[0016] A first aspect of the invention relates to a device. The device comprises a component which, during normal operation, maintains a temperature within a normal temperature range. In other words, the device includes the component. The device and / or the component are designed such that the component maintains a temperature within the normal temperature range during normal operation. The component may, for example, be an electrical component which heats up during normal operation so that the component maintains a temperature within the normal temperature range. The device may, for example, be configured as a digital tachograph. In other words, the device may be a digital tachograph. The digital tachograph may, for example, be a tachograph in accordance with Regulation (EU) No 165 / 2014 of the European Parliament and of the Council of 4 May 2014.February 2014 on tachographs in road traffic.

[0017] The device includes a heat absorption unit, wherein at least one heat absorption element of the unit is thermally connected to the component of the device and is configured to absorb heat from and / or dissipate heat from the component. In other words, the heat absorption unit is configured to absorb heat from the component or to conduct heat away from the component. The heat absorption unit includes the at least one heat absorption element. The heat absorption element is thermally connected to the component so that the heat absorption element can act as a heat sink and the component as a heat source. The heat absorption element can, in particular, have a common contact surface with the component.

[0018] The heat-absorbing element incorporates a phase-change material, which is configured to undergo a phase transition from a first phase to a second phase within a critical temperature range exceeding the normal operating temperature range, while absorbing latent heat. This critical temperature range could, for example, be a temperature range that might occur during a malfunction. It could also encompass a temperature range that might occur during specific intended phases. For instance, the critical temperature range could be reached during intended operating phases of the component. Therefore, the critical temperature range could also be reached during normal operation without any malfunction.

[0019] The heat-absorbing element is designed to contain particles. These particles are made of a ferromagnetic or magnetizable material and are mixed with the phase-change material.

[0020] The device includes a magnetic element arranged to generate a magnetic field. In other words, the magnetic field is generated by the magnetic element.

[0021] The magnetic device is designed to attract particles through the provided magnetic field, thereby holding the heat-absorbing element to a surface of the component. In other words, the particles are incorporated into the phase-change material of the heat-absorbing element so that the element can be attracted by the magnetic field provided by the magnetic device. The particles within the heat-absorbing element enable the magnetic device to act upon it, holding it to the surface of the component. For example, the magnetic field can be used to hold the heat-absorbing element to the surface of the component, forming the contact area between the component and the heat-absorbing element.

[0022] The heat dissipation and / or cooling by the phase change material is designed such that the amount of heat generated matches the properties of the phase change material. These properties include, among others, its heat capacity.

[0023] By providing the particles in the heat absorption element and the corresponding magnetic device, a solution is provided that ensures the maintenance of contact between the heat absorption element and the surface of the component without a housing.

[0024] The invention also includes further developments that result in additional advantages.

[0025] A further development of the invention provides that the magnetic device comprises a permanent magnet. The permanent magnet enables the magnetic device to provide a constant magnetic field. The permanent magnet ensures that the heat-absorbing element is held on the surface of the component without requiring an external energy source to power the magnetic device. For example, the magnetic field can be provided entirely by the permanent magnet, thus making its provision independent of an external energy source. Alternatively, the magnetic field can comprise a magnetic field provided by the permanent magnet and a magnetic field provided by an electromagnet.

[0026] A further development of the invention provides that the magnetic device includes an electromagnet. The electromagnet can, for example, include a coil through which current can be passed to control the magnetic field. The provision of the electromagnet enables variable application of the magnetic field. For example, it can be provided that the magnetic field is switched on or off as needed, or that its field strength is regulated.

[0027] A further development of the invention provides that the magnetic device is configured to provide the magnetic field alternately. In other words, the magnetic device is configured to provide the magnetic field in such a way that it alternates in its orientation and / or field strength. This further development offers the advantage that the magnetic particles within the phase-change material are not separated within the phase-change material. In particular, this prevents the magnetic particles from accumulating on the surface of the component over time and thus no longer having a relevant influence on the phase-change material of the heat-absorbing element.

[0028] A further development of the invention provides that the magnetic device is configured to supply the magnetic field such that the magnetic field strength decreases towards at least one contact surface. In other words, the magnetic device can be configured to supply an inhomogeneous magnetic field. The magnetic field can be supplied such that the magnetic field strength in a region near the contact surface is lower than in a region further away from the contact surface.

[0029] A further development of the invention provides that the magnetic device is configured to vary the magnetic field such that the particles in the heat-absorbing element are guided along a predetermined path to effect a predetermined material flow of the phase-change material. In other words, the magnetic field provided by the magnetic device can be varied over time, following a predetermined pattern. This pattern can be designed such that the effect of the magnetic field on the particles changes over time in a predetermined manner, causing the particles to move in different directions depending on the time. By being guided along the predetermined path, the particles act upon the phase-change material.If the phase change material is in a liquid state, for example, a specific flow of the phase change material can be generated by guiding the particles along a predetermined path. For instance, it can be designed that varying the magnetic field induces a flow in the heat absorption element to accelerate heat transfer from a heat source to a heat sink. The advantage of this development is that heat dissipation can be improved.

[0030] A further development of the invention provides that the magnetic device is configured to determine the current phase state of the phase-change material. The magnetic device is configured to provide the magnetic field depending on the current phase state. In other words, the magnetic device is configured to determine whether the phase-change material is in a solid or a liquid phase. Depending on the current phase of the phase-change material, the requirements for holding the phase-change material or the surface may change, and the magnetic field can be adjusted accordingly.

[0031] A further development of the invention provides that the magnetic device is configured to determine the current temperature of the phase-change material and to provide the magnetic field as a function of the current temperature. For example, it is possible that the temperature of the phase-change material influences its viscosity, and the particles are affected by the magnetic field depending on the viscosity.

[0032] A further development of the invention provides that the magnetic device is configured to provide the magnetic field depending on the current operating state of the device. For example, it can be provided that the field strength of the magnetic field is increased when the device is in an operating state in which greater forces act on the heat-absorbing element. In order to keep the heat-absorbing element on the surface, the magnetic device can, in this case, provide the magnetic field with a higher field strength.

[0033] A second aspect of the invention relates to a heat absorption device.

[0034] The heat absorption device comprises a heat absorption element configured to absorb and / or dissipate heat from a component. The heat absorption element includes a phase-change material configured to undergo a phase change from a first phase to a second phase within a critical temperature range above the normal temperature range, absorbing latent heat in the process. The heat absorption element also includes particles made of a ferromagnetic or magnetizable material, which are mixed with the phase-change material. The heat absorption device includes a magnetic device configured to generate a magnetic field, which holds the particles in the heat absorption element against a surface of the component.

[0035] A third aspect of the invention relates to a method for operating a heat absorption device.

[0036] The heat absorption device comprises a heat absorption element configured to absorb and / or dissipate heat from a component. The heat absorption element includes a phase-change material configured to undergo a phase change from a first phase to a second phase within a critical temperature range above the normal temperature range, absorbing latent heat in the process. The heat absorption element also includes particles made of a ferromagnetic or magnetizable material, which are mixed with the phase-change material. The heat absorption device includes a magnetic device configured to generate a magnetic field, which holds the particles in the heat absorption element against a surface of the component.

[0037] The method comprises providing an alternating magnetic field through the magnetic device, wherein the magnetic field is alternated by the magnetic device in such a way that a polarity and / or a magnetic field strength of the magnetic field changes over a period of time.

[0038] The invention also includes further developments of the heat absorption device and the method according to the invention, which have features already described in connection with the further developments of the device according to the invention. For this reason, the corresponding further developments of the heat absorption device and the method according to the invention are not described again here.

[0039] For use cases or application situations that may arise during the procedure and are not explicitly described here, it may be provided that, according to the procedure, an error message and / or a request for user feedback is issued and / or a default setting and / or a predetermined initial state is set.

[0040] The invention also includes combinations of the features of the described embodiments.

[0041] An embodiment of the invention is described below. The following is shown: Fig. Figure 1 shows a schematic representation of a device which has a heat absorption device; Fig. Figure 2 shows a schematic representation of another device which has a heat absorption device; Fig. Figure 3 shows a schematic representation of another device which has a heat absorption device; Fig. Figure 4 shows a schematic representation of another device which includes a heat absorption device; and Fig. Figure 5 shows a schematic representation of another device which has a heat absorption device.

[0042] The embodiment described below is a preferred embodiment of the invention. In this embodiment, the described components each represent individual features of the invention that can be considered independently of one another. Each of these features further develops the invention independently and can therefore be considered part of the invention individually or in a combination other than that shown. Furthermore, the described embodiment can also be supplemented by other features of the invention already described.

[0043] In the figures, functionally identical elements are each provided with the same reference symbols.

[0044] Fig. Figure 1 shows a schematic representation of a device which includes a heat absorption device.

[0045] The device 10 can be configured as a guided missile, rocket, satellite, or projectile. The device 10 can have a temporary heat source. The heat source can be, for example, rocket propellant or a turbine engine. The device 10 can include a printed circuit board that may contain electrical and / or electronic components 12. The electronic components 12 may be used to control the missile's flight. To ensure the proper operation of the electronic components 12, it may be necessary for them to operate within a normal temperature range. During missile operation, the environment surrounding the electronic components 12 may heat up. Without countermeasures, this heat generation could cause the temperature of the electronic components 12 to rise to such an extent that their operation is impaired.The provision of thermal insulation may not be sufficient to ensure that the electronic components 12 are kept within this temperature range. For this purpose, the device 10 may be provided with a heat absorption device 11 comprising at least one heat absorption element 13, which is thermally connected to the components 12 of the device 10 and is configured to absorb heat from and / or dissipate heat from the components 12.

[0046] The heat-absorbing element 13 can comprise a phase-change material 14, which may be configured to transition from a first phase to a second phase within a critical temperature range above the normal temperature range, absorbing latent heat. This phase transition can prevent the component 12 from heating up further. During the phase transition, the phase-change material 14 may melt. To absorb the heat from the component 12, it may be necessary to maintain a contact surface 18 between the component 12 and the heat-absorbing element 13. In the prior art, it is common to provide a housing that prevents the phase-change material 14 from flowing out. However, under certain circumstances, it may be necessary to replace the housing or supplement it with additional components to maintain contact between the phase-change material 14 and the component 12.

[0047] It may be provided that, for this purpose, the heat absorption device 11 has a magnetic device 16 for providing a magnetic field 17 and that, in addition, particles 15 having a ferromagnetic or magnetic material are mixed with the phase-change material 14. The magnetic device 16 is configured to provide a magnetic field 17, wherein the magnetic field 17 may be configured to attract the particles 15 in order to hold the heat absorption element 13 to the surface of the component 12 by means of the provided magnetic field 17.

[0048] The magnetic device 16 can comprise a permanent magnet and / or an electromagnet. The magnetic field 17 can thus have a constant and a controllable component. By providing the permanent magnet, it can be ensured that part of the magnetic field 17 can be generated independently of the availability of a source. The electromagnet can enable a change in the magnetic field 17 over time. The heat absorption device 11 can be configured to control the magnetic device 16 so that the magnetic field 17 corresponds to a current situation. For example, the heat absorption device 11 can be configured to include sensors that can be set up to detect specific quantities. For example, the sensor device can include a thermometer that can detect the current temperature of the phase-change material 14.Depending on the temperature of the phase change material 14, its viscosity can change. The magnetic field 17 can be adjusted using temperature-dependent viscosity curves. It can also be provided that, for example, forces currently acting on the heat-absorbing element 13 are detected. For instance, the acceleration of the guided missile can be detected and the magnetic field 17 adjusted accordingly to prevent the phase change material 14 from detaching from the surface of the component 12.

[0049] Fig. Figure 2 shows a schematic representation of another device which has a heat absorption device.

[0050] In this example, the device 10 can comprise a printed circuit board assembly that may include electronic components 12. The magnetic assembly 16 can include electromagnets, which may be provided as conductor coils by conductive traces within or on a printed circuit board. The heat-absorbing element 13, which may include the phase-change material 14 and the particles 15, can be provided between the printed circuit boards. It must be ensured that contact between the heat-absorbing element 13 and the components 12 is maintained during operation. A housing may not be provided in the illustrated device 10. Accordingly, it may be provided to prevent the phase-change material 14 from flowing away from the electronic components 12 by a magnetic field 17, which is not shown in the figure for clarity.

[0051] Fig. Figure 3 shows a schematic representation of another device which has a heat absorption device.

[0052] The device 10 can be configured as a shock absorber. The shock absorber can consist of a cylinder and a piston rod, with an actuator and / or a sensor being arranged on the piston rod as components 12 requiring cooling. During operation, the piston rod may heat up. To cool the actuator or sensor, it can be arranged in a housing and at least partially surrounded by phase-change material 14. The component 12 can be arranged between two coils that can be energized during operation to keep the phase-change material 14 in contact with the component 12. The amplification of the magnetic field 17 can be adjusted depending on the temperature or the applied shocks.

[0053] Fig. Figure 4 shows a schematic representation of another device which has a heat absorption device.

[0054] The device 10 can be configured as part of a high-pressure fuel system. The device 10 can have an inlet and a return line as well as an outlet for the discharge of a fuel mist. A portion of the line can be arranged as a component 12 to be cooled on the heat absorption device 11.

[0055] Fig. Figure 5 shows a schematic representation of another device 10, which has a heat absorption device 11.

[0056] The device 10 can comprise a printed circuit board with electronic components as components 12 to be cooled, wherein the heat-absorbing element 13 can comprise the particles 15 and the phase-change material 14. Electromagnets of the magnetic device 16 can be arranged such that the magnetic field 17 can be provided to hold the heat-absorbing element 13. It can be provided that the magnetic field 17 can be provided alternately. This can be done, for example, to influence the particles 15 in the heat-absorbing element 13 in such a way that a flow of the phase-change material 14 can occur, thereby, for example, dissipating heat.

[0057] One aspect of the invention is to add magnetic particles 15 to the phase change material 14 and to provide electromagnets to the surfaces to be contacted with the phase change material 14 at a heat source and a heat sink.

[0058] A heat source can be represented by components of all kinds, such as: power transistors or microprocessors or mechanical bearings or thermocouples.

[0059] A heat sink can also be represented by structures of any kind, for example: heat sinks made of aluminum, copper, metal or plastic, heat pipes, thermoelectric elements, heat exchangers, water cooling and / or air cooling.

[0060] The phase-change material 14, to which the magnetic particles 15 have been added, is now fixed to the previously described relevant surfaces by the electromagnets. This is achieved by applying an electrical voltage to the coils and the resulting magnetic field 17. The strength of this magnetic field 17 is chosen such that a force indirectly acts on the phase-change material 14 via the magnetic particles 15, which counteracts all other forces. These other forces are primarily gravity and acceleration forces of all kinds.

[0061] The polarity of the magnetic field 17 can be reversed so that the magnetic particles 15 are not pulled out of the phase-change material 14. This is analogous to iron filings on a magnetic oil drain plug. This ensures that a force vector opposing the external forces constantly exists within the phase-change material 14, caused by the inertia of the phase-change material 14 in which the magnetic particles 15 are located. However, the reversal of the magnetic field 17 ensures that the magnetic particles 15 do not detach from the phase-change material 14. It is also conceivable to design the electromagnets such that the electromagnetic field strength is weaker at the mechanical contact surfaces 18 and increases towards the center of the phase-change material 14. This would further prevent the separation of the magnetic particles 15.

[0062] The following operating modes are possible, simplifying the assumption to include a heat source A and a heat sink B, each with an electromagnet, between which the phase-change material 14 is fixed. However, the application is not limited to one heat sink and one heat source. Multiple heat sources and heat sinks are also possible. It is also possible to provide multiple permanent magnets and / or electromagnets.

[0063] A and B are magnetic, the direction of the magnetic field 17 changes according to a time constant which is determined by the movement of the magnetic particles 15 in the liquid phase change material 14.

[0064] A and B are magnetic, phase change material 14 is solid, therefore there is no movement of the magnetic particles 15 in the phase change material 14, since its viscosity is very high (solid). A change in the direction of the magnetic field 17 between A and B is not strictly necessary, but also not detrimental. A magnetic, B less magnetic, then change to B magnetic, A less magnetic according to the time constant determined by the movement of the magnetic particles 15 in the liquid phase change material 14.

[0065] Other methods are conceivable. The basic idea is to utilize the influence of the magnetic particles 15 on the phase-change material 14 by influencing the magnetic particles 15 within the phase-change material 14 using electromagnets positioned at the relevant locations.

[0066] A controlled change in the magnetic field prevents the separation of the magnetic particles 15 from the phase-change material 14. Similar to the process described in DE 10 2008 040 281 A1, it is conceivable to use this movement for heat transfer itself.

[0067] Additionally, it is advantageous to implement a control of the magnetic field strength as a function of the temperature of the phase-change material 14. The viscosity of the phase-change material 14 correlates directly with its temperature. Therefore, the field strength of the electromagnets is selected according to the viscosity, and thus also the temperature, of the phase-change material 14. Higher temperatures, i.e., higher viscosity, require a lower electric field strength, and lower temperatures, i.e., lower viscosity, require a higher electric field strength.

[0068] The phase change material 14 can be fixed to the surfaces by the magnetic particles 15 and the electromagnets in such a way that a housing for fixing the phase change material 14 is no longer required. This solves the problem of fully encapsulated housings or components being deformed by volume changes of the phase change material 14.

[0069] The heat absorption device 11 can be used for all types of electrical circuits that require cooling with phase-change material 14, including circuits that require heating in certain operating conditions. In particular, mechanical, electrical, or electronic devices subjected to high acceleration forces can be applications for the heat absorption device 11. Targeted cooling of a specific area of ​​an electrical circuit can be achieved by fixing the phase-change material 14, which is impregnated with magnetic particles 15, by means of magnetic devices 16 attached to the relevant heat sources and sinks.

[0070] A targeted movement or mixing of the phase change material 14 in the direction of the heat flow can be provided to increase the cooling capacity.

[0071] Advantages arise from the elimination of heavy heat sinks and the flexibility afforded by the phase-change material 14, which, due to latent heat effects, is superior to conventional cooling methods. This is particularly true for a specific time range until the latent heat of fusion is reached or until complete melting occurs. The heat absorption device 11 is suitable for applications with unusual gravity and sometimes very high acceleration forces, such as aircraft, rockets, guided missiles, projectiles of all kinds, and satellites. The heat absorption device 11 enables the shielding of circuits located in close proximity to (time-defined) heat sources (rocket engines, e.g., solid-propellant rockets or turbine engines, which exhibit very high heat output and very high acceleration forces for a defined period). The heat absorption device 11 is also suitable for cooling the undercarriage of vehicle components (cars, trucks, motorcycles, etc.), e.g.,Shock absorbers and actuators containing mechanical or electrical components that must not exceed a certain temperature and are also subjected to high acceleration forces are suitable. This can also include high-pressure components in modern combustion engines. Cooling of fuel cells or chemical energy storage devices (“electric car batteries”). High flexibility through phase-change materials.

[0072] Overall, this example shows how the fixation and mixing of phase change material can be provided using magnetic particles and a magnetic device. Reference symbol list 10 Device 11 Heat absorption device 12 components 13 Heat absorption element 14 Phase change material 15 particles 16 Magnetic device 17 Magnetic field 18 Contact area QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2008 040 281 A1 [0013, 0066] Cited non-patent literature

[0000] Regulation (EU) No 165 / 2014 of the European Parliament and of the Council of 4 February 2014

[0016]

Claims

[1] Device (10) wherein - the device (10) includes a component (12) which, during normal operation of the component (12), has a temperature within a normal temperature range; - the device (10) comprises a heat absorption device (11), wherein at least one heat absorption element (13) of the heat absorption device (11) is thermally connected to the component (12) of the device (10) and is configured to absorb heat from the component (12) and / or to dissipate heat from the component (12); and - the heat absorption element (13) comprises a phase change material (14), wherein the phase change material (14) is configured to perform a phase change from a first phase to a second phase in a critical temperature range above the normal temperature range by absorbing latent heat, characterized by , that - the heat-absorbing element (13) comprises particles (15) having a ferromagnetic or magnetizable material which are mixed with the phase-change material (14); and - the device (10) has a magnetic device (16) which is configured to provide a magnetic field (17), wherein the magnetic device (16) is configured to attract the particles (15) by means of the provided magnetic field (17) in order to hold the heat absorption element (13) on a surface of the component (12) by means of the provided magnetic field (17). [2] Device (10) according to claim 1, characterized by , that the magnetic device (16) has a permanent magnet. [3] Device (10) according to claim 1 or 2, characterized by , that the magnetic device (16) has an electric magnet. [4] Device (10) according to any of the preceding claims, characterized by, that the magnetic device (16) is configured to provide the magnetic field (17) alternately. [5] Device (10) according to any of the preceding claims, characterized by , that the magnetic device (16) is configured to provide the magnetic field (17) such that the magnetic field (17) has a magnetic field strength that decreases towards at least one contact surface (18). [6] Device (10) according to any of the preceding claims, characterized by , that the magnetic device (16) is configured to vary the magnetic field (17) in such a way that the particles (15) are guided along a predetermined path in order to cause a predetermined flow of the phase change material (14). [7] Device (10) according to any of the preceding claims, characterized by, that the magnetic device (16) is configured to determine a current phase state of the phase-change material (14) and to provide the magnetic field (17) depending on the current phase state. [8] Device (10) according to any of the preceding claims, characterized by , that the magnetic device (16) is configured to determine a current temperature of the phase change material (14) and to provide the magnetic field (17) depending on the current temperature. [9] Device (10) according to any of the preceding claims, characterized by , that the magnetic device (16) is configured to provide the magnetic field (17) depending on a current operating state of the device (10). [10] Heat absorption device (11), wherein - the heat absorption device (11) comprises at least one heat absorption element (13) configured to absorb heat from a component (12) and / or to dissipate heat from the component (12); and - the heat absorption element (13) comprises a phase change material (14), wherein the phase change material (14) is configured to perform a phase change from a first phase to a second phase in a critical temperature range above the normal temperature range by absorbing latent heat, characterized by , that - the heat-absorbing element (13) comprises particles (15) having a ferromagnetic or magnetizable material which are mixed with the phase-change material (14); and - the heat absorption device (11) has a magnetic device (16) which is configured to provide a magnetic field (17), wherein the magnetic device (16) is configured to attract the particles (15) by means of the provided magnetic field (17) in order to hold the heat absorption element (13) on a surface of the component (12) by means of the provided magnetic field (17). [11] Method for operating a heat absorption device (11) wherein - the heat absorption device (11) comprises at least one heat absorption element (13) configured to absorb heat from a component (12) and / or to dissipate heat from the component (12); and - the heat absorption element (13) comprises a phase change material (14), wherein the phase change material (14) is configured to perform a phase change from a first phase to a second phase in a critical temperature range above the normal temperature range by absorbing latent heat, characterized by , that - the heat absorption device (11) has a magnetic device (16) which is configured to provide a magnetic field (17), wherein the magnetic device (16) is configured to attract the particles (15) by means of the provided magnetic field (17) in order to hold the heat absorption element (13) on a surface of the component (12) by means of the provided magnetic field (17), and - the method comprises providing an alternating magnetic field (17) by the magnetic device (16), wherein the magnetic field (17) is alternated by the magnetic device (16) such that a polarity and / or a magnetic field strength of the magnetic field (17) changes over a period of time.

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