Cooler arrangement

Abstract

The present invention relates to a cooler arrangement, in particular for cooling the power electronics of a converter, comprising: an aluminum cooler with a U-shaped form, having a first wall region, a second wall region, and a third wall region connecting the first wall region to the second wall region, wherein the cooler comprises a hollow extruded component forming the first, second, and third wall regions and having a cavity which, in the direction of flow through the cavity, has at least one intermediate floor dividing the cavity into at least two sub-chambers, wherein the first, second, and third wall regions allow a continuous flow of cooling fluid through the cooler from an inlet at the first wall region to an outlet at the second wall region, and wherein a receiving space for receiving components to be cooled is formed between the first, second, and third wall regions.and a sheet-metal housing with a first side wall, a second side wall and a base, wherein the cooler is arranged in the housing, and wherein there is a space between the first side wall of the housing and the first wall area of ​​the cooler, which is designed to accommodate components to be cooled.

Description

State of the art

[0001] The present invention relates to a cooling arrangement, in particular for cooling power electronics of a charger, converter, or a combined device, with significantly improved cooling performance, simple design, reduced weight, and lower material costs.

[0002] To cool electronic components such as converters, coolant flows are typically routed through a channel between an aluminum casting and a friction stir welded aluminum casting. While the use of castings is generally efficient, it necessitates thick walls, draft angles, and demoldable geometries. In addition to geometric limitations, the increased wall thickness of the castings results in additional installation space and material, adding weight. Furthermore, heat transfer for heat dissipation can be hampered. A major problem with cast components, however, is their partially porous structure, which can lead to leaks. Therefore, quality tests, which are time-consuming and expensive, must be performed before installing such coolers. Disclosure of the invention

[0003] The cooling arrangement according to the invention, particularly for cooling electronic components of converters, with the features of claim 1, has the advantage that a cooling channel can be manufactured simply and cost-effectively. In particular, manufacturing can be carried out using methods proven effective for cooling arrangements. Furthermore, the cooling arrangement according to the invention has significantly thinner walls than cast components, resulting in advantages in terms of installation space, reduced weight, and reduced costs. In particular, components of the cooling arrangement can be provided as extruded aluminum profiles, which further reduces manufacturing costs.

[0004] According to the invention, this is achieved by the cooler assembly comprising an aluminum cooler with a U-shaped form (as seen from above) and a first, second, and third wall section. The cooler is a hollow extruded aluminum component that forms the first, second, and third wall sections. The cooler has a cavity through which a cooling fluid flows and which, in the direction of flow through the cavity, has at least one intermediate floor, so that the cavity is divided into at least two sub-chambers. The third wall section connects the first and second wall sections. This results in a continuous flow through the cooler from an inlet at the first wall section to an outlet at the second wall section.Preferably, the U-shaped form is achieved through forming steps, with a 90° bend preferably provided between the first and third wall sections, and again between the third and second wall sections. Components to be cooled can thus be arranged in a receiving space provided by the U-shaped form of the cooler. Furthermore, the cooler assembly comprises a sheet-metal housing with a first and second side wall and a base. The housing preferably also has a U-shape. The cooler is arranged within the sheet-metal housing. A space is provided between the first side wall of the housing and the first wall section of the cooler, which is designed to receive components to be cooled. Thus, in the cooler assembly according to the invention, a plurality of components can be arranged on both sides of the cooler.The components can be arranged in the space between the housing and the wall area of ​​the cooler, as well as in the receiving space in the inner area of ​​the U-shaped cooler. The U-shaped forms of the cooler and the housing are arranged rotated 90° relative to each other, allowing the cooler and housing to be nested inside one another. Preferably, the extruded component has several intermediate layers, resulting in multiple sub-cavities within the extruded component.

[0005] Thus, a continuous flow through the cooler can occur, starting from a first free end of the first wall section, through the first wall section into the third wall section with a 90° bend, and from the third wall section with another 90° bend into the second wall section, ending at the free end of the second wall section at the outlet. Components to be cooled can be positioned on the inside and outside of the cooler.

[0006] The dependent claims describe preferred embodiments of the invention.

[0007] Flat components, especially transistors, are preferably arranged in the space between the housing and the cooler for heat dissipation. Large components requiring heat dissipation are preferably arranged in the space between the cooler's wall sections.

[0008] To securely fix the components to be cooled in the space between the housing and the cooler, fixing devices are preferably arranged on the first side wall. These fixing devices are preferably protruding sections, in particular resilient protruding sections, which are preferably produced by punching and forming processes. Preferably, the components to be cooled are electrically connected from above in the space.

[0009] Preferably, the components to be cooled, which are arranged in the space between, are pre-mounted on a common mounting frame or the like. The mounting frame preferably also serves for the electrical contacting of the components.

[0010] The foreground areas are preferably spring-loaded tabs. This can be easily achieved by manufacturing the housing from spring steel or the like.

[0011] Preferably, the base of the housing has at least one mounting bracket for fixing the cooler. This bracket is preferably also designed as a tab, which is provided by punching and forming, preferably by a 90° bending of the punched-out tab.

[0012] For particularly cost-effective manufacturing, the housing is designed as a sheet metal component, especially made of spring steel or aluminum. The base of the housing preferably serves as a support for the cooler. Preferably, a material-bonded connection, in particular an adhesive bond or a soldered connection, is made between the cooler and the housing during assembly.

[0013] Preferably, the connection of the profile to the housing is supported by form-fitting clip elements.

[0014] Preferably, the side walls of the housing completely cover the outer wall areas of the cooler. This results in a large mounting surface on which components requiring heat dissipation, which are fixed to the housing, can be positioned.

[0015] Preferably, the housing has a first support area on the first side wall and a second support area on the second side wall. These two support areas are preferably a further 90° bend in the sheet metal housing and are designed to serve as supports for additional components. Preferably, a shielding plate rests on the first and / or second support area of ​​the housing to provide electromagnetic shielding for the components arranged in the cooler assembly.

[0016] Preferably, an inlet aid and an outlet aid are arranged at the inlet and / or outlet. The inlet aid and the outlet aid are preferably designed as funnels. Preferably, components located in the cooler's receiving chamber between the wall sections are potted with a potting compound. Particularly preferably, partitions are arranged in the receiving chamber so that only partial areas of the receiving chamber can be filled with potting compound.

[0017] Preferably, the cooler has fins or the like projecting into the cavity of the cooler as additional cooling fins.

[0018] Furthermore, the present invention relates to an electronic arrangement with a cooler arrangement according to the invention.

[0019] The electronic arrangement preferably comprises a holding device, in particular a sub-circuit board, on which components to be cooled, located in the space between the cooler and the housing, are fixed. The sub-circuit board is preferably connected via a conductor to a main circuit board located on the top side of the cooler arrangement. This simplifies the mounting of a large number of components to be cooled in the space between the cooler and the housing. The components to be cooled are preferably flat components, in particular transistors. The sub-circuit board is more preferably in direct contact with the cooler, thus enabling direct cooling of the sub-circuit board itself.

[0020] Preferably, the first wall area of ​​the cooler has a first width B1, and the space between the housing and the cooler has a second width B2, where B2 equals B1 + / - 10%. Preferably, the first and second widths B1 and B2 are the same width.

[0021] This allows components requiring cooling to be positioned on both sides of the cooler and cooled. drawing

[0022] A preferred embodiment of the invention is described in detail below with reference to the accompanying drawing. The drawing shows: Fig. 1 a schematic, perspective view of a cooler arrangement according to a preferred embodiment of the invention, Fig. 2 a schematic exploded view of the cooler arrangement of Fig. 1, Fig. 3 A schematic side view of a wall area of ​​a housing of the cooler arrangement of Fig. 1, Fig. 4 a schematic partial sectional view of the cooler arrangement of Fig. 1, and Fig. 5 another schematic partial sectional view of the cooler arrangement of Fig. 1. Preferred embodiment of the invention

[0023] The following refers to the Fig. 1 to 5 a cooler arrangement 1 of an electronic arrangement according to a preferred embodiment of the invention is described in detail.

[0024] As from the Fig. 1 and Fig. As can be seen in Figure 2, the cooler arrangement 1 essentially has a trough-shaped form, with one side open and no lid. An inlet 4 and an outlet 5 are arranged on the open side.

[0025] The cooler arrangement 1 comprises a cooler 2, which includes three wall areas, namely a first wall area 21, a second wall area 22 and a third wall area 23. The third wall area 23 connects the first wall area 21 with the second wall area 22 at the closed long end of the cooler 2.

[0026] The cooler 2 has a continuous cavity 20, which is also detailed from the Fig. 4 and Fig. As can be seen in Figure 5. The cavity 20 is continuous because the cooler 2 is an extruded component. This allows a cooling fluid to flow from the inlet 4 through the first wall section 21, the third wall section 23, and the second wall section 22 to the outlet 5. This cooler shape can be achieved by forming the extruded component, whereby three wall sections are produced by bending it twice at 90°, forming a U-shape when viewed from above.

[0027] As detailed from the Fig. 4 and Fig. As can be seen in Figure 5, there are four intermediate floors 26 which divide the cavity 20 into five sub-rooms 20a, 20b, 20c, 20d and 20e.

[0028] The cooler 2 is preferably made of aluminum and can be given its U-shape through two forming processes. Naturally, the radius of the forming areas is selected such that no constriction is created in the hollow profile of the cooler 2. As the cooling fluid flows through, it thus undergoes two 90° bends from the inlet 4 to the outlet 5.

[0029] A receiving space 25 for electrical and / or electronic components (not shown) is formed between the three wall sections 21, 22, 23 of the cooler 2. In particular, large-volume components such as transformers can be arranged in the receiving space 25.

[0030] Since the cooler 2 is an extruded profile, the intermediate floors 26 are also continuous from the inlet 4 to the outlet 5.

[0031] The cooler assembly 1 further comprises a housing 3 made of sheet metal. The housing 3 is in particular made of Fig. 2. The housing 3 comprises a first side wall 31, a second side wall 32, and a base 30. The housing 3 thus also essentially has a U-shape. The cooler 2 is arranged on the base 30.

[0032] As especially from Fig. As can be seen in Figure 1, the base has 30 cutouts which serve as a holder 34 for the cooler 2. The cutouts are angled at 90°, as shown in Figure 1. Fig. 1 shown, bent over and hold the cooler firmly on the base 30 of the housing 3. It should be noted that an additional material-bonded connection between the cooler 2 and the housing 3, in particular a soldered connection, can be formed.

[0033] The housing 3 further comprises a first support area 35 and a second support area 36. The first support area 35 is produced by a further 90° bend of the first side wall 31 and the second support area 36 is produced by a further 90° bend of the second side wall 32 (see figure). Fig. 1 and Fig. 2).

[0034] The support areas 35, 36 serve to support a shielding plate 6, which is schematically shown in the Fig. 1 and Fig. Figure 2 shows the shielding plate 6 having a first wing 61 and a second wing 62. The first wing 61 rests on the first support area 35, and the second wing 62 rests on the second support area 36. Connecting webs 37 and large gaps are formed between the wings, allowing for easy electrical contact with the components located inside the receiving space 25.

[0035] The housing 3 is preferably made of spring steel. As further details can be seen in particular from the Fig. 3 and Fig. As can be seen in Figure 5, tabs 33 are punched out and bent over on the first and second side walls 31 and 32 to act as spring clamping areas. The tabs 33 serve to fix components 8 that are to be cooled (see Figure 5). Fig. 5).

[0036] As from the Fig. 1 and Fig. As can be seen in Figure 5, a gap 7 is formed on both sides between the side walls 31, 32 of the housing 3 and the wall areas 21, 22 of the cooler 2, which is designed to accommodate components 8 to be cooled. The components to be cooled are preferably flat, preferably transistors.

[0037] As from Fig. As can be seen in Figure 5, the components to be cooled can already be arranged on a common sub-circuit board 9, which is connected to a main circuit board 10 via an electrical connection 11. This eliminates the need to mount a large number of electronic transistors or the like on a large number of tabs 33, as shown in Figure 5. Fig. As shown in Figure 3, this is possible. This can significantly simplify the assembly of the components to be cooled.

[0038] The sub-circuit board 9 is thus provided as a pre-assembled component and can already be fixed to the main circuit board 10, so that in a final assembly step both circuit boards 9 and 10 can then be fixed to the cooling assembly 1 in one step. This can be done, for example, by means of a screw connection, as shown in Fig.As indicated in section 5, the mounting takes place on the wings 61, 62. For this purpose, fixing holes or the like are provided in the wings 61, 62 of the shielding plate 6. Mounting holes for fixing the circuit boards are also provided in the bearing areas 35, 36.

[0039] Thus, by using an extruded aluminum profile as the cooler 2, a particularly cost-effective cooler arrangement 1 can be provided. The cooler arrangement 1 can enable heat dissipation from components on both sides of the cooler 2. For this purpose, the receiving space 25 between the wall sections 21, 22 of the cooler 2 is provided for large-volume components, as is the space 7 between the housing 3 and the cooler 2. Preferably, the first width B1 of the first wall section is equal to the second width B2 of the space 7.

[0040] Furthermore, the cooler 2 can be easily connected to the housing 3 by means of the brackets 34 on the bottom 30 and the components to be cooled can be fixed in the space 7 by means of the tabs 33 in the side walls 31, 32.

[0041] Preferably, the cooler 2 can be mounted on the housing 3 without material-bonded connections, and preferably, the components to be cooled can also be mounted in the space 7 without material-bonded connections.

Claims

[1] Cooling arrangement, in particular for cooling the power electronics of a charger, converter, or a combined device, comprising: - a cooler (2) made of aluminium with a U-shaped shape having a first wall area (21), a second wall area (22) and a third wall area (23) connecting the first wall area (21) with the second wall area (22), - wherein the cooler (2) comprises a hollow extruded component which forms the first, second and third wall regions and which has a cavity (20) which, in the direction of flow through the cavity, has at least one intermediate floor (26) which divides the cavity into at least two sub-cavities (20a), (20b), (20c), (20d), (20e), - wherein the first, second and third wall regions allow a continuous flow of cooling fluid through the cooler from an inlet (4) on the first wall region (21) to an outlet (5) on the second wall region (22), wherein a receiving space (25) for receiving components to be cooled is formed between the first, second and third wall regions, and - a sheet-metal housing (3) with a first side wall (31), a second side wall (32) and a base (30), wherein the cooler (2) is arranged in the housing (3), and - wherein between the first side wall (31) of the housing (3) and the first wall area (21) of the cooler (2) there is a space (7) which is designed to accommodate components (8) to be cooled. [2] Cooler arrangement according to claim 1, wherein the first side wall (31) and / or the second side wall (32) has fixing devices which are designed to fix components to be cooled which are arranged in the space (7). [3] Cooler arrangement according to claim 2, wherein the fixing device has protruding areas. [4] Cooler arrangement according to claim 3, wherein the protruding areas are tabs (33), in particular resilient tabs. [5] Cooler arrangement according to claim 3 or 4, wherein the protruding areas are punched-out and bent-over areas of the side wall. [6] Cooler arrangement according to one of the preceding claims, wherein the housing (3) has supports (34) on the bottom (30) to fix the cooler (2) to the housing (3). [7] Cooler arrangement according to one of the preceding claims, wherein the housing (3) is a sheet metal component, in particular made of spring steel. [8] Cooler arrangement according to one of the preceding claims, further comprising a shielding plate (6) which is arranged on the cooler arrangement. [9] Cooler arrangement according to claim 8, wherein the housing (3) further comprises a first support area (35) on the first side wall (31) and a second support area (36) on the second side wall (32) to support the shielding plate (6). [10] Electronic arrangement comprising a cooler arrangement according to any of the preceding claims. [11] Electronic arrangement according to claim 10, further comprising a holding device on which components to be cooled are arranged and fixed in the space (7) between the cooler (2) and the housing (3). [12] Electronic arrangement according to claim 11, wherein the holding device is a printed circuit board (9) which is in contact with the cooler (2) in particular.

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