Microelectromechanical component and method for manufacturing a microelectromechanical component

Abstract

A microelectromechanical component (1) comprises a microelectromechanical semiconductor chip (2) and a fluid connector (3). The fluid connector (3) is made of plastic. The fluid connector (3) has a top surface (4), an engagement section (5) formed in the region of the top surface (4), and a mounting surface (6). The fluid connector (3) has a fluid passage (7) extending from the top surface (4) to the mounting surface (5). The microelectromechanical semiconductor chip (2) is arranged on the mounting surface (6) of the fluid connector (3) such that a functional structure of the microelectromechanical semiconductor chip (2) is located in the region of the fluid passage (7) and is accessible via the fluid passage (7). The microelectromechanical component (1) is designed to be installed in a device such that the engagement section (5) projects into a through-opening of a housing of the device.

Description

[0001] The present invention relates to a microelectromechanical component and a method for manufacturing a microelectromechanical component.

[0002] It is known from the prior art to integrate microelectromechanical sensors (MEMS sensors) into the housing of a device, for example, a smartphone or smartwatch. Such MEMS sensors can be designed, for example, to detect ambient pressure. Typically, a seal must be created against the inside of the device's housing. For this purpose, it is known to bond a cylindrical metal tube with a recess for an O-ring to a rigid ceramic substrate of a MEMS chip. The MEMS chip is thereby pressed against the inside of the housing in the area of ​​an opening. To ensure that the MEMS chip remains in the area of ​​the opening, a force must be constantly applied to it. The metal tube is electrically and mechanically connected to an application-specific integrated circuit (ICC).Application Specific Integrated Circuit (ASIC) connected, enabling the MEMS chip to communicate with the device's environment and with elements inside the device.

[0003] One disadvantage of such MEMS sensors is that, due to the contact pressure, a very soft adhesive must be used for stress decoupling in addition to a rigid ceramic substrate. This is necessary to firmly bond the MEMS chip to the sensor housing and thus prevent deformation of the MEMS chip, which could impair the sensor signal. Furthermore, manufacturing a metal tube for the microchip housing is very expensive.

[0004] An object of the present invention is to provide an improved microelectromechanical component and to disclose an improved method for manufacturing a microelectromechanical component. This object is achieved by a microelectromechanical component and a method for manufacturing a microelectromechanical component having the features of the respective independent claims. Advantageous embodiments are specified in the respective dependent claims.

[0005] A microelectromechanical component comprises a microelectromechanical semiconductor chip and a fluid connector. The fluid connector is made of plastic. It has a top surface, an engagement section formed in the top surface, and a mounting surface. The fluid connector has a fluid passage extending from the top surface to the mounting surface. The microelectromechanical semiconductor chip is arranged on the mounting surface of the fluid connector such that a functional structure of the microelectromechanical semiconductor chip is located in the area of ​​the fluid passage and is accessible via the fluid passage. The microelectromechanical component is designed to be installed in a device such that the engagement section projects into a through-opening of a housing of the device.

[0006] Advantageously, the microelectromechanical component features a direct fluid connection between the microelectromechanical semiconductor chip and a plastic component, namely the fluid connector. The fact that the fluid connector is made of plastic means that the fluid connector is at least partially made of plastic, i.e., that the fluid connector has at least a plastic area. At least this plastic area of ​​the fluid connector can be manufactured using a molding process.

[0007] Due to the fluid flow through the fluid connector, a metal tube, as required by the prior art, can be omitted. Furthermore, a rigid ceramic substrate for the microelectromechanical semiconductor chip is not necessary. Overall, the fabrication of the microelectromechanical component is simpler and less expensive compared to known components, as it utilizes a fluid connector made of plastic that can be easily manufactured using a molding process. Moreover, no semiconductor processing is required for mounting the microelectromechanical semiconductor chip; it simply needs to be mounted onto the mounting surface of the fluid connector.

[0008] In one embodiment, the fluid connector has a contact surface opposite its upper surface. This contact surface allows the fluid connector, with its engagement section, to remain within the through-opening of the device housing by applying a force to it. The contact force is transferred directly from the contact surface to the upper surface of the fluid connector. If the through-opening in the device housing is designed to taper towards the surrounding area, this prevents the fluid connector from protruding from the housing.

[0009] In one embodiment, the fluid connector has a groove for receiving a seal on a region of the engagement section facing away from the top. Alternatively, the fluid connector is materially bonded to a seal on the region of the engagement section facing away from the top.

[0010] When the microelectromechanical component is installed in the device, the device is advantageously sealed against its surroundings by the seal. This prevents the ingress of media into the device housing. Simultaneously, the microelectromechanical semiconductor chip is connected to the device's environment via the fluid passage of the fluid connector. In one embodiment, pressure can be exerted on the seal via the contact surface located opposite the top surface to generate an effective pressure effect.

[0011] In one embodiment, the mounting surface is formed by a section of the contact surface of the fluid connector. Alternatively, the mounting surface is designed as a surface of the fluid connector that differs from the contact surface, with the contact surface of the fluid connector being oriented transversely or parallel to the contact surface. This makes the fluid connector particularly easy to manufacture. If the mounting surface is oriented transversely or parallel to the contact surface, a microelectromechanical component with a particularly low profile can advantageously be provided. A flat microelectromechanical component is required, for example, if the housing of the device is particularly flat.

[0012] In one embodiment, the fluid connector has a cavity formed and accessible in the area of ​​the contact surface. The mounting surface forms the bottom of the cavity, located between the contact surface and the top surface of the fluid connector. The microelectromechanical semiconductor chip is thus located at the bottom of the cavity. In this embodiment, the contact surface laterally encloses the mounting surface, at least partially. The mounting surface can, for example, be parallel to the contact surface, although this is not mandatory. Advantageously, in this embodiment, contact forces are not transmitted to the microelectromechanical semiconductor chip, but rather to the top surface of the fluid connector. Furthermore, the fluid passage through the fluid connector can be straight, making it particularly easy to manufacture.

[0013] A flat device is particularly useful, for example, when the device is intended to be placed on a patient's skin to administer medication such as insulin. In this case, the microelectromechanical semiconductor chip is designed as a micropump intended to deliver a medication, such as insulin, to the patient's body via the fluid channel. If the mounting surface and the contact surface are different surfaces of the fluid connector, only minor deformations occur in the area of ​​the mounting surface when a force is applied to the contact surface, thus preventing stress-induced error signals from the microelectromechanical component.

[0014] In one embodiment, a membrane, in particular a semipermeable membrane, is arranged in the fluid passage. Advantageously, the membrane can make it possible to influence the composition of the medium to be transported through the fluid passage.

[0015] In one embodiment, the engagement section of the fluid connector is hollow-cylindrical, i.e., it has an annular cross-section. Advantageously, this can facilitate the installation of the microelectromechanical component in the device housing. The fluid passage does not necessarily have to run parallel to a cylinder axis of the engagement section. Furthermore, the engagement section of the fluid connector does not necessarily have to have an annular cross-section. It can also have any cross-section, for example, a rectangular cross-section, or a cross-section of another shape.

[0016] In one embodiment, the microelectromechanical semiconductor chip has at least one additional functional structure. Alternatively, the microelectromechanical component has at least one additional microelectromechanical semiconductor chip with at least one additional functional structure. In both cases, the fluid connector has an additional fluid passage extending to the mounting surface. The additional functional structure is located in the region of the additional fluid passage and is accessible via this passage. Like the fluid passage, the additional fluid passage extends to the mounting surface of the fluid connector. However, the additional fluid passage need not necessarily extend to the top surface of the fluid connector. For example, the additional fluid passage can extend from the mounting surface to a region located between the mounting surface and the top surface.If the microelectromechanical component is designed to measure pressure, then in this embodiment, it is advantageous to measure both the ambient pressure of the microelectromechanical component and the pressure inside the housing of the device. For this purpose, the fluid passage must extend to a region between the mounting surface and the engagement section. In this way, a pressure difference between the environment of the device and the interior of the housing can be determined.

[0017] In one embodiment, the microelectromechanical semiconductor chip has a receiving structure on a side facing the mounting surface of the fluid connector. An alignment structure is formed on the mounting surface of the fluid connector. The receiving structure is designed to accommodate the alignment structure. Advantageously, the alignment structure and the receiving structure enable the microelectromechanical semiconductor chip to be arranged in a predetermined position and orientation on the mounting surface. The alignment structure and the receiving structure are particularly efficient when the height of the alignment structure is less than the depth of the receiving structure.

[0018] In one embodiment, the microelectromechanical semiconductor chip has a first locking structure on a side facing the mounting surface of the fluid connector. A second locking structure is formed on the mounting surface of the fluid connector. The first and second locking structures interlock. Advantageously, the microelectromechanical semiconductor chip is fixed with respect to its lateral positioning and orientation relative to the mounting surface. This ensures that the functional structure of the microelectromechanical semiconductor chip is always accessible through the fluid passage. This locking of the microelectromechanical semiconductor chip is particularly efficient when the second locking structure has a height greater than the surface roughness of the mounting surface of the fluid connector.

[0019] In one embodiment, the microelectromechanical semiconductor chip has an opening located in the fluid passage area, making the functional structure accessible via the fluid passage. If the microelectromechanical device comprises a plurality of microelectromechanical semiconductor chips and / or a microelectromechanical semiconductor chip with a plurality of functional structures, a separate opening can be provided for each functional structure.

[0020] In one embodiment, the opening area is larger than the first etch width of the receiving structure. The first etch width of the receiving structure is larger than the second etch width of the first locking structure. The opening of the microelectromechanical semiconductor chip, the receiving structure, and the first locking structure can each be fabricated using a trenching process, in which the microelectromechanical semiconductor chip is etched.

[0021] An etch rate typically depends on the opening area or etch width of the structure being produced. Larger structures can typically be etched faster than smaller ones. Therefore, it is possible to produce the receiving structure and the locking structures simultaneously, where the opening area of ​​the receiving structure is larger than the first etch width, and the first etch width of the receiving structure is larger than the second etch width of the first locking structure. Thus, the opening, the receiving structure, and the first locking structure do not need to be produced sequentially.

[0022] A method for manufacturing a microelectromechanical component according to one embodiment comprises the following process steps. The microelectromechanical semiconductor chip is provided. The fluid connector is formed. The microelectromechanical semiconductor chip is positioned on the mounting surface of the fluid connector such that the functional structure of the microelectromechanical semiconductor chip is located in the fluid passage area of ​​the fluid connector and is accessible via the fluid passage.

[0023] In one embodiment, providing the microelectromechanical semiconductor chip includes forming an opening in the microelectromechanical semiconductor chip and arranging the microelectromechanical semiconductor chip on the mounting surface with the opening in the area of ​​the fluid passage, thereby making the functional structure accessible via the fluid passage.

[0024] In one embodiment, providing the microelectromechanical semiconductor chip comprises forming a receiving structure facing the mounting surface of the fluid connector. Forming the fluid connector comprises forming an alignment structure on the mounting surface of the fluid connector. The receiving structure is designed to receive the alignment structure. Arranging the microelectromechanical semiconductor chip comprises aligning the microelectromechanical semiconductor chip such that the alignment structure of the fluid connector engages in the receiving structure of the microelectromechanical semiconductor chip.

[0025] In one embodiment, providing the microelectromechanical semiconductor chip comprises forming a first locking structure facing the mounting surface of the fluid connector. Forming the fluid connector comprises forming a second locking structure on the mounting surface of the fluid connector. The microelectromechanical semiconductor chip is arranged such that the first and second locking structures interlock.

[0026] In one embodiment, the formation of the opening and / or the formation of the receiving structure and / or the formation of the first locking structure is carried out by structuring, in particular by means of an etching process.

[0027] In one embodiment, the microelectromechanical component is mounted in the device such that the engagement section of the fluid connector projects into the through-opening of the housing of the device.

[0028] In one embodiment, the fluid connector is shaped such that it has a contact surface opposite the top, wherein the microelectromechanical component is pressed against the housing by exerting a force on the contact surface.

[0029] The microelectromechanical component is explained in detail in the following description in conjunction with schematic drawings. These show: Fig. 1: a microelectromechanical component according to a first embodiment in a perspective view; Fig. 2: a microelectromechanical component according to a second embodiment in a perspective view; Fig. 3: a microelectromechanical component according to a third embodiment in a cross-sectional view; Fig. 4: a cross-section of a microelectromechanical component in the area of ​​the microelectromechanical semiconductor chip; Fig. 5: a microelectromechanical semiconductor chip in a top view; And Fig. 6: Process steps of a method for manufacturing a microelectromechanical component.

[0030] Fig. Figure 1 shows a microelectromechanical component 1 according to a first embodiment in a perspective view.

[0031] The microelectromechanical device 1 comprises a microelectromechanical semiconductor chip 2 and a fluid connector 3. The microelectromechanical semiconductor chip 2 comprises a semiconductor material, for example, silicon. However, the microelectromechanical semiconductor chip 2 can also comprise a different semiconductor. The microelectromechanical semiconductor chip 2 can, for example, be configured as a pressure sensor. However, this is not mandatory. The microelectromechanical semiconductor chip 2 can alternatively be configured, for example, as a micropump or as another microfluidic semiconductor chip. For example, the microelectromechanical semiconductor chip 2 can comprise microvalves.

[0032] Fluid connector 3 is made of a plastic. Fluid connector 3 can, for example, be made of a thermoplastic material. Furthermore, the thermoplastic material can be an elastomer. However, fluid connector 3 can also be made of a different type of plastic.

[0033] The fluid connector 3 has a top surface 4, an engagement section 5 formed in the area of ​​the top surface 4, and a mounting surface 6. The fluid connector 3 also has a fluid passage 7 extending from the top surface 4 to the mounting surface 6. The fluid passage 7 is designed to allow a fluid to flow from the top surface 4 to the mounting surface 6 of the fluid connector 3.

[0034] The microelectromechanical semiconductor chip 2 is arranged on the mounting surface 6 of the fluid connector 3 such that a functional structure of the microelectromechanical semiconductor chip 2 is located in the area of ​​the fluid passage 7 and is accessible via the fluid passage 7. The functional structure of the microelectromechanical semiconductor chip 2, which is located in Fig. While Figure 1 is not shown for simplicity, it could, for example, be a flexible membrane designed for pressure measurement. In this case, fluid pressure measurement is enabled by pressure-dependent deflection of the membrane. If the microelectromechanical semiconductor chip 2 is configured as a micropump, for example, the functional structure in this case includes means for compressing a fluid.

[0035] The microelectromechanical component 1 is configured to be installed in a device such that the engagement section 5 of the fluid connector 3 projects into a through-opening in the housing of the device. In this way, a fluid can reach the microelectromechanical semiconductor chip 2 via the through-opening in the housing of the device and the fluid passage 7. The device can be any device with a housing and a through-opening in the housing. For example, the device can be a mobile device, such as a smartphone.

[0036] The fluid connector 3 has a contact surface 8. In the exemplary embodiment of the microelectromechanical component 1, the contact surface 8 is designed as a surface distinct from the mounting surface 6. For example, the mounting surface 6 is designed transversely to and adjacent to the contact surface 8, meaning that the mounting surface 6 and the contact surface 8 share a common edge. The contact surface 8 is opposite the top surface 4 and is parallel to it. The contact surface 8 allows the fluid connector 3, with its engagement section 5, to remain in the through-opening of the housing of the device by exerting a force on the contact surface 8.

[0037] To seal the microelectromechanical component 1 against the housing of the device, it has a seal 9. In the exemplary embodiment of the microelectromechanical component 1 of the Fig. 1. The fluid connector 3 has a feature on an area of ​​the engagement section 5 facing away from the top 4. Fig. 1. Groove (not shown) for receiving the seal 9. The seal 9 can, for example, be designed as an O-ring. In an alternative embodiment, the fluid connector 3 is materially bonded to the seal 9 at the area of ​​the engagement section 5 facing away from the top 4. A seal 9 materially bonded to the fluid connector 3 can, for example, be manufactured by a molding process. The fluid connector 3 and the seal 9 can, for example, be manufactured simultaneously using a two-component molding process. However, it is also possible to bond the seal 9 to the fluid connector 3 by a molding process after the fluid connector 3 has been manufactured.

[0038] In the exemplary presentation of the Fig. In the microelectromechanical component 1, a hollow cylindrical engagement section 5 is featured. In this case, the fluid passage 7 has, for example, a circular disk-shaped cross-section. This results in the upper surface 4 of the fluid connector 3, or a cross-section of the engagement section 5, being annular. For this reason, the seal 9 is also, for example, annular in shape. However, this is not mandatory. The engagement section 5, the seal 9, and the cross-section of the fluid passage 7 can each have other geometric shapes.

[0039] The seal 9 is formed in a plane parallel to the contact surface 8. This allows pressure to be transferred from the contact surface 8 to the seal 9, effectively sealing the housing. However, the seal 9 can also be omitted. Likewise, the contact surface 8, located opposite the top surface 4 of the fluid connector 3, can be omitted. If necessary, other means of exerting a force on the fluid connector 3 perpendicular to its top surface 4 can also be provided.

[0040] The microelectromechanical semiconductor chip 2 is connected to an ASIC 10. The ASIC 10 is used to control and / or read the microelectromechanical semiconductor chip 2. Electrical contact between the ASIC 10 and the microelectromechanical semiconductor chip 2 is made via a solder material 11. The ASIC 10 is located on a side of the microelectromechanical semiconductor chip 2 facing away from the mounting surface 6. Solder contacts are provided on a side of the ASIC 10 facing away from the microelectromechanical semiconductor chip 2. The solder material 11 is located in the area of ​​the solder contacts and is connected to at least one electrical cable 12. The electrical cable 12 enables an electrical connection between the microelectromechanical semiconductor chip 2 and a printed circuit board (PCB) of the device.However, the ASIC 10, the soldering material 11 and the electrical cable 12 do not necessarily have to be part of the microelectromechanical component 1 and can each be omitted.

[0041] The fluid connector 3 can also include a membrane arranged in the fluid passage 7. The membrane can, in particular, be designed as a semipermeable membrane. The membrane makes it possible to define the composition of a fluid, for example, by preventing unwanted components from passing through the membrane before they reach the microelectromechanical semiconductor chip 2. However, the membrane arranged in the fluid passage 7 can also be omitted. In the exemplary embodiment of the Fig. 1 is not shown for the sake of clarity.

[0042] In another embodiment, a barb is embedded in the fluid connector 3 and protrudes partially from it. Using the contact surface 8 or an additional element on the fluid connector 3, the fluid connector 3 is pressed into the through-opening of the device housing. The barb engages in a structure of the device housing and securely holds the fluid connector 3 in position with a seal. This can simplify the assembly of the microelectromechanical component 1 in the device housing. However, the barb can also be omitted.

[0043] Fig. Figure 2 schematically shows a microelectromechanical component 1 according to a further embodiment in a perspective view. The microelectromechanical component 1 according to the embodiment of Fig. 2 exhibits similarities to the microelectromechanical component 1 according to the embodiment of the Fig. 1. The following description only highlights the differences between the microelectromechanical components 1 of the Fig. 1 and Fig. 2 explained. The reference numerals are retained in the following. The optional electrical cable 12 is in Fig. 2 not shown for the sake of clarity.

[0044] In contrast to the embodiment according to Fig. 1 is the microelectromechanical component 1 of Fig. 2. The mounting surface 6 is not perpendicular, but parallel to the contact surface 8. In comparison to the fluid connector 3 of the Fig. 1. The fluid connector 3 of the microelectromechanical component 1 can be used. Fig. 2. This results in a smaller height measured from the contact surface 8 to the top surface 4 of the fluid connector 3, making the microelectromechanical component 1 more compact and requiring less space in the device. This is achieved by the mounting surface 6 being raised relative to the contact surface 8, or rather, being formed between the contact surface 8 and the top surface 4 of the fluid connector 3 and aligned parallel to the contact surface 8 or the top surface 4 of the fluid connector. In this case, the mounting surface 6 and the contact surface 8 do not share a common edge, but are connected to each other via another surface of the fluid connector 3.

[0045] Fig. Figure 3 schematically shows a cross-sectional view of a microelectromechanical component 1 according to a further embodiment. The microelectromechanical component 1 according to the embodiment of Fig. 3 exhibits similarities to the microelectromechanical component 1 according to the embodiment of the Fig. 1. The following description only highlights the differences between the microelectromechanical components 1 of the Fig. 1 and Fig. 3 explained. The reference numerals are retained in the following. The optional electrical cable 12 is in Fig. 3 not shown for the sake of clarity.

[0046] In the case of the microelectromechanical component 1 according to Fig. The fluid connector 3 has a cavity 19 formed and accessible in the area of ​​the contact surface 8. The microelectromechanical semiconductor chip 2 is arranged in the cavity 19. The mounting surface 6 is located between the top surface 4 and the contact surface 8 and forms a base of the cavity 19 located between the contact surface 8 and the top surface 4 of the fluid connector 3. The microelectromechanical semiconductor chip 2 is arranged on the mounting surface 6 or on the base of the cavity 19. The contact surface 8 encloses the mounting surface 6 laterally, at least partially. By way of example, the mounting surface 6 is configured to run parallel to the contact surface 8, which is not mandatory. The mounting surface 6 can also run transversely to the contact surface 8. In this case, either the mounting surface 6 or the contact surface 8 can be configured parallel to the top surface 4 of the fluid connector 3.Preferably, but not necessarily, the microelectromechanical semiconductor chip 2 is designed or arranged in such a way that it does not protrude from the cavity 19 or beyond the contact surface 8, thereby protecting it against mechanical damage.

[0047] In an alternative embodiment, the mounting surface 6 is formed by a section of the contact surface 8 of the fluid connector 3. In this case, the microelectromechanical component 1 has a greater height because the microelectromechanical semiconductor chip 2 is arranged directly on the contact surface 8 and thus contributes to the height of the microelectromechanical component 1. The cavity 19 is omitted in this case.

[0048] The microelectromechanical components 1 of the Fig. 1, Fig. 2 and Fig. Each of the three components can have a microelectromechanical semiconductor chip 2 with at least one further functional structure. Alternatively, the microelectromechanical component 1 can have at least one further microelectromechanical semiconductor chip 2 with at least one further functional structure. In both cases, the fluid connector 3 has a further fluid passage extending to the mounting surface 6 of the fluid connector 3. The further functional structure is arranged in the region of the further fluid passage and is accessible via the further fluid passage.

[0049] Fig. Figure 4 schematically shows a part of the fluid connector 3 in the area of ​​the mounting surface 6 and the microelectromechanical semiconductor chip 2 arranged on the mounting surface 6 in a cross-sectional view. The microelectromechanical component 1 of the Fig. 4 can be like the microelectromechanical component 1 of the Fig. 1, Fig. 2 or Fig. 3. Alternatively, the mounting surface 6 can be formed by a section of the contact surface 8. The reference numerals are retained in the following description.

[0050] The microelectromechanical semiconductor chip 2 of the Fig. Figure 4 is merely an example of a sensor device for measuring pressure. For this purpose, the microelectromechanical semiconductor chip 2 has a movable membrane 13, which is part of the functional structure of the microelectromechanical semiconductor chip 2. Alternatively, the microelectromechanical semiconductor chip 2 can also be configured, for example, as a micropump. In this case, the fluid connector 3 can serve as a reservoir for substances such as medications. Such a microelectromechanical component 1 can, for example, be designed to deliver insulin to a patient via the fluid connector 3. In any case, the microelectromechanical semiconductor chip 2 has an opening 14 in the area of ​​the fluid passage 7. The functional structure is accessible via the fluid passage 7 and the opening 14.

[0051] The microelectromechanical semiconductor chip 2 has a receiving structure 15 on one side facing the mounting surface 6 of the fluid connector 3. The fluid connector 3 has an alignment structure 16 on its mounting surface 6. The receiving structure 15 is designed to receive the alignment structure 16. The provision of the receiving structure 15 and the alignment structure 16 defines the positioning and orientation of the microelectromechanical semiconductor chip 2 on the mounting surface 6. Incorrect mounting of the microelectromechanical semiconductor chip 2 on the mounting surface 6 is thus prevented.

[0052] The microelectromechanical semiconductor chip 2 also has a first locking structure 17 on the side facing the mounting surface 6 of the fluid connector 3. The fluid connector 3 has a second locking structure 18 on the mounting surface 6. The first and second locking structures 17, 18 interlock when the microelectromechanical semiconductor chip 2 is mounted. This locks the microelectromechanical semiconductor chip 2 in position and orientation on the mounting surface 6.

[0053] By providing the receiving structure 15, the alignment structure 16 and the first and second locking structures 17 and 18, it can be ensured that the functional structure of the microelectromechanical semiconductor chip 2 is always accessible via the fluid passage 7 and the opening 14 in the microelectromechanical semiconductor chip 2.

[0054] Fig. Figure 5 schematically shows a view of the side of the microelectromechanical semiconductor chip 2 facing the mounting surface 6 of the fluid connector 3. The reference numerals are retained in the following.

[0055] The recording structure 15 is shown in the exemplary representation in the Fig. The receiving structure 15 is formed in an annular shape and laterally encloses the opening 14 and the first locking structure. The receiving structure 15 is thus formed as an annularly closed groove with a first etching width. However, this is mandatory; the receiving structure 15 can alternatively have other geometric shapes, for example, it can be rectangular, and does not necessarily have to laterally enclose the opening 14 and the first locking structure 17. In addition to the opening 14, another opening can also be provided, for example, for another functional structure of the microelectromechanical semiconductor chip 2 or another functional structure of a further microelectromechanical semiconductor chip 2. In the representation of the Fig. In section 5, the opening 14 has a circular cross-section, which is not necessary, however, since the opening 14 can have any geometric cross-section.

[0056] The first locking structure 17 has a plurality of circular disk-shaped depressions in the microelectromechanical semiconductor chip 2 with a second etching width. The in Fig. The number of recesses shown in Figure 5 of the first locking structure 17 is merely an example and may differ. Accordingly, the second locking structure 18 of the fluid connector has 3 projections designed to engage the first locking structure 17. It is also possible, in principle, for the first locking structure 17 of the microelectromechanical semiconductor chip to have 2 projections and the second locking structure 18 of the fluid connector to have 3 interlocking recesses to lock the microelectromechanical semiconductor chip 2 onto the mounting surface 6 of the fluid connector 3.

[0057] This is merely an example. Fig. 5, that the opening area of ​​the opening 14 is larger than the first etch width of the receiving structure 15, and that the first etch width of the receiving structure 15 is larger than the second etch width of the first locking structure 17, more precisely, the recesses of the first locking structure 17. However, the opening area of ​​the opening 14, the first etch width of the receiving structure 15, and the second etch width of the first locking structure 17 can also be chosen differently. The in Fig. However, the configuration of the opening area, the first etching width and the second etching width shown in Figure 5 allows the opening 14, the receiving structure 15 and the first locking structure 17 to be produced simultaneously.

[0058] The microelectromechanical semiconductor chip 2 can be mounted on the mounting surface 6 of the fluid connector 3, for example, by ultrasonic welding, laser welding, or adhesive bonding. Other methods for mounting and securing the microelectromechanical semiconductor chip 2 to the mounting surface 6 are also possible. However, bonding the microelectromechanical semiconductor chip 2 to the mounting surface 6 with special, soft adhesives to prevent stress is unnecessary.

[0059] Fig. Figure 6 schematically shows process steps of a method 20 for manufacturing a microelectromechanical component 1 according to one of the described embodiments.

[0060] In a first process step 21, the microelectromechanical semiconductor chip 2 is provided. Providing the microelectromechanical semiconductor chip 2 can include forming the opening 14 in the microelectromechanical semiconductor chip 2. In this case, the microelectromechanical semiconductor chip 2 is positioned on the mounting surface 6 with the opening 14 in the area of ​​the fluid passage 7, thus making the functional structure accessible via the fluid passage 7.

[0061] In a second process step 22, the fluid connector 3 is formed. The provision of the microelectromechanical semiconductor chip 2 can further include the formation of the receiving structure 15. In this case, the forming of the fluid connector 3 includes the formation of the alignment structure 16 on the mounting surface of the fluid connector 3. When the microelectromechanical semiconductor chip 2 is positioned on the mounting surface 6, it is oriented such that the alignment structure 16 of the fluid connector 3 engages in the receiving structure 15 of the microelectromechanical semiconductor chip 2.

[0062] The provision of the microelectromechanical semiconductor chip 2 can also include forming the first locking structure 17. In this case, forming the fluid connector 3 includes forming the second locking structure 18 on the mounting surface 6 of the fluid connector 3. The microelectromechanical semiconductor chip 2 is arranged such that the first and second locking structures 17, 18 interlock.

[0063] In a third process step 23, the microelectromechanical semiconductor chip 2 is attached to the mounting surface 6 of the fluid connector 3 in such a way that the functional structure of the microelectromechanical semiconductor chip 2 is arranged in the area of ​​the fluid passage 7 of the fluid connector 3 and is accessible via the fluid passage 7.

[0064] In an optional fourth process step 24, the microelectromechanical component 1 is mounted in the device such that the engagement section 5 of the fluid connector 3 projects into the through-opening of the device housing. The microelectromechanical component 1 can then be pressed against the housing by applying a force to the contact surface 8.

Claims

[1] Microelectromechanical device (1) comprising a microelectromechanical semiconductor chip (2) and a fluid connector (3) and a plastic wherein the fluid connector (3) has a top surface (4), an engagement section (5) formed in the area of ​​the top surface (4) and a mounting surface (6), wherein the fluid connector (3) has a fluid passage (7) extending from the top (4) to the mounting surface (6), wherein the microelectromechanical semiconductor chip (2) is arranged on the mounting surface (6) of the fluid connector (3) such that a functional structure of the microelectromechanical semiconductor chip (2) is arranged in the area of ​​the fluid passage (7) and is accessible via the fluid passage (7), wherein the microelectromechanical component (1) is designed to be installed in a device such that the engagement section (5) projects into a through-opening of a housing of the device. [2] Microelectromechanical component (1) according to claim 1, wherein the fluid connector (3) has a contact surface (8) opposite the top surface (4). [3] Microelectromechanical component (1) according to claim 2, wherein the mounting surface (6) is formed by a section of the contact surface (8) of the fluid connector (3). [4] Microelectromechanical device (1) according to claim 2, wherein the fluid connector (3) has a cavity (19) formed and accessible in the area of ​​the contact surface (8), wherein the mounting surface (6) forms a bottom of the cavity (19) arranged between the contact surface (8) and the top (4) of the fluid connector (3). [5] Microelectromechanical device (1) according to any one of the preceding claims, wherein the fluid connector (3) has a groove for receiving a seal (9) on a region of the engagement section (5) facing away from the top (4) or, wherein the fluid connector (3) is materially connected to a seal (9) on the area of ​​the engagement section (5) facing away from the top (4). [6] Microelectromechanical device (1) according to one of the preceding claims, wherein a membrane, in particular a semipermeable membrane, is arranged in the fluid passage (7). [7] Microelectromechanical component (1) according to one of the preceding claims, wherein the engagement section (5) of the fluid connector (3) is hollow cylindrical. [8] Microelectromechanical device (1) according to any one of the preceding claims, wherein the microelectromechanical semiconductor chip (2) has at least one further functional structure or, wherein the microelectromechanical component (1) comprises at least one further microelectromechanical semiconductor chip (2) with at least one further functional structure, wherein the fluid connector (3) has a further fluid passage extending to the mounting surface (6), wherein the further functional structure is arranged in the area of ​​the further fluid passage (7) and is accessible via the further fluid passage (7). [9] Microelectromechanical device (1) according to any one of the preceding claims, wherein the microelectromechanical semiconductor chip (2) has a receiving structure (15) on one side facing the mounting surface (6) of the fluid connector (3), wherein an alignment structure (16) is formed on the mounting surface (6) of the fluid connector (3), wherein the receiving structure (15) is designed to receive the alignment structure (16). [10] Microelectromechanical device (1) according to any one of the preceding claims, wherein the microelectromechanical semiconductor chip (2) has a first locking structure (17) on one side facing the mounting surface (6) of the fluid connector (3), wherein a second locking structure (18) is formed on the mounting surface (6) of the fluid connector (3), wherein the first and second locking structures (17, 18) interlock. [11] Microelectromechanical component (1) according to one of the preceding claims, wherein the microelectromechanical semiconductor chip (2) has an opening (14) arranged in the area of ​​the fluid passage (7), whereby the functional structure is accessible via the fluid passage (7). [12] Microelectromechanical device (1) according to claims 9 to 11, wherein an opening area of ​​the opening (14) is larger than a first etch width of the receiving structure (15), wherein the first etch width of the receiving structure (15) is larger than a second etch width of the first locking structure (17). [13] Method (20) for manufacturing a microelectromechanical component (1) according to one of the preceding claims comprising the following method steps: - Provision of the microelectromechanical semiconductor chip (2), - Forms of the fluid connector (3), - Arranging the microelectromechanical semiconductor chip (2) on the mounting surface (6) of the fluid connector (3) such that the functional structure of the microelectromechanical semiconductor chip (2) is arranged in the area of ​​the fluid passage (7) of the fluid connector (3) and is accessible via the fluid passage (7). [14] Method (20) according to claim 13, wherein the provision of the microelectromechanical semiconductor chip (2) comprises forming an opening (14) in the microelectromechanical semiconductor chip (2) and the microelectromechanical semiconductor chip (2) is arranged on the mounting surface (6) with the opening (14) in the area of ​​the fluid passage (7), whereby the functional structure is accessible via the fluid passage (7). [15] Method (20) according to claim 13 or 14, wherein the provision of the microelectromechanical semiconductor chip (2) comprises forming a receiving structure (15) facing the mounting surface (6) of the fluid connector (3), wherein the forming of the fluid connector (3) comprises forming an alignment structure (16) on the mounting surface of the fluid connector (3), wherein the receiving structure (15) is designed to receive the alignment structure (16), wherein the arrangement of the microelectromechanical semiconductor chip (2) comprises aligning the microelectromechanical semiconductor chip (2) such that the alignment structure (16) of the fluid connector (3) engages in the receiving structure (15) of the microelectromechanical semiconductor chip (2). [16] Method (20) according to any one of the preceding claims 13 to 15, wherein the provision of the microelectromechanical semiconductor chip (2) comprises forming a first locking structure (17) facing the mounting surface (6) of the fluid connector (3), wherein the forming of the fluid connector (3) comprises forming a second locking structure (18) on the mounting surface (6) of the fluid connector (3), wherein the microelectromechanical semiconductor chip (2) is arranged such that the first and second locking structures (17, 18) interlock. [17] Method (20) according to any one of the preceding claims 14 to 16, wherein the formation of the opening (14) and / or the formation of the receiving structure (15) and / or the formation of the first locking structure (17) is carried out by structuring, in particular by means of an etching process. [18] Method (20) according to any one of the preceding claims 13 to 17, comprising the following further method step: - Mounting the microelectromechanical component (1) in the device such that the engagement section (5) of the fluid connector (3) projects into the through-opening of the housing of the device. [19] Method (20) according to claim 18, wherein the fluid connector (3) is shaped such that it has a contact surface (8) opposite the top surface (4), wherein the microelectromechanical component (1) is pressed against the housing by applying a force to the contact surface (8).

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