ELECTRONIC MODULE

Abstract

problem Providing an electronic module whose reliability can be sufficiently ensured. Solution An electronic module 1 includes a first circuit board 10; a chip 20 disposed on the first circuit board 10 and having, on its surface on a side opposite to its surface on the first circuit board 10 side, a main electrode 21 and a control electrode 22; a power chip connection terminal 30 disposed on the main electrode 21 and electrically connected to the main electrode 21; and a columnar signal chip connection terminal 40 disposed on the control electrode 22 and electrically connected to the control electrode 22.

Description

Technical area

[0001] The present invention relates to an electronic module. background

[0002] An electronic module including a chip mounted on a circuit board and a power chip connection terminal mounted on a main electrode of the chip is conventionally known (for example, see Patent Literature Example 1).

[0003] As in Fig. As shown in Fig. 7, a conventional electronic module 900 includes a first circuit board 910; a chip 920 disposed on the first circuit board 910 and having a main electrode 921 and a control electrode 922 on its surface on the side opposite the first circuit board 910; and a columnar power chip connection terminal 930 disposed on the main electrode 921 and electrically connected to the main electrode 921. In the conventional electronic module 900, the control electrode 922 is connected to a wiring 913 disposed on the first circuit board 910 via a wire W.

[0004] In the conventional electronic module 900, a second board 970 is arranged at a position opposite to the first board 910, and the chip 920 and the second board 970 are connected to each other via the power chip connection terminal 930. Furthermore, the first board 910 and the second board 970 are connected to each other via an internal connection terminal 950. State of the artPatent literature

[0005] Patent Literature Example 1: JP-A-2020-503697 Brief description of the inventionTechnical problem

[0006] When the second board 970 is arranged at the position opposite to the first board 910 as described above in the conventional electronic module 900, it is necessary in the manufacturing process to perform reflow in a state where the first board 910, the chip 920, the second board 970, and the like are pressed from both sides, that is, from the first board 910 side and from the second board 970 side.

[0007] However, when the reflow is performed in a state where the first board 910 and the second board 970 are pressed, the main electrode 921 is formed as shown in Fig. 8, the chip 920 is physically pressed through the power chip connection terminal 930 and the chip 920 is thereby tilted, so that the chip 920 may not be held horizontally with respect to the first board 910, which may make it difficult to sufficiently ensure the reliability of the electronic module 900. What Fig. 8, in which a terminal member 940 is formed by applying machining to a flat plate made of a metal instead of the wire W, the same possibility is expected to occur.

[0008] Regarding this drawback, not only when reflow is performed in a state where the first board 910 and the second board 970 are pressed, but also in a case where a board is arranged on only one surface, the main electrode 921 is physically pressed by the dead weight of the power chip connection terminal 930 or the like, and the chip 920 is thereby tilted. Also in this case, it is possible that the chip 920 cannot be held horizontally with respect to the first board 910.

[0009] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic module whose reliability can be sufficiently ensured. Solution to the problem

[0010] An electronic module according to the present invention comprises a first circuit board; a chip disposed on the first circuit board and having, on its surface on a side opposite to its surface on the first circuit board side, a main electrode and a control electrode; a power chip connection terminal disposed on the main electrode and electrically connected to the main electrode; and a columnar signal chip connection terminal disposed on the control electrode and electrically connected to the control electrode. Advantageous effects of the present invention

[0011] According to the electronic module of the present invention, the electronic module has the columnar signal chip connection terminal arranged on the control electrode and electrically connected to the control electrode, and therefore, even in a case where the main electrode is physically pressed by the power chip connection terminal, the chip tilting phenomenon can be prevented from occurring because the control electrode is pressed using the signal chip connection terminal.

[0012] When a connecting element is formed by bending a small part (see, for example, reference numeral 940 in Fig. 8), it is difficult to increase the bending accuracy, and therefore difficult to position the terminal with respect to a small terminal area such as a gate electrode with high accuracy. However, according to the electronic module of the present invention, the electronic module includes the signal chip connection terminal, and therefore, it is not necessary to bend a small part, so that the connection terminal can be positioned with respect to a small terminal area such as the gate electrode. Short description of the drawings Fig. 1 is a perspective view of an electronic module 1 according to an embodiment 1. Fig. 2 is a view illustrating an internal structure of the electronic module 1 according to Embodiment 1. Fig. Fig. 2 is a view in which a representation of a casting resin 80 in the perspective view in Fig. 1 was waived. Fig. 3 is a view illustrating an internal structure of the electronic module 1 according to Embodiment 1. Fig. Fig. 3(a) is a plan view showing the structure on the side of a second board 70 and the molding resin 80 in Fig. 1 was waived, and Fig. Fig. 3(b) is a plan view showing a first support member 60 and a second support member 62 in Fig. 3(a) was waived. Fig. 4 is a view showing a power chip connection terminal 30 and a signal chip connection terminal 40 in Embodiment 1. Fig. Fig. 4(a) is a perspective view illustrating the power chip connection terminal 30 and the signal chip connection terminal 40, and Fig. 4(b) is a schematic side view showing the power chip connection terminal 30 and the signal chip connection terminal 40. Arrows in Fig. 4(b) show forces (pressures) exerted on a chip 20. The same applies to the structure shown in Fig. 5(b) and Fig. 6(b). For the sake of brevity, the illustration of conductive bonding materials other than a conductive bonding material S1 between the first board 10 and the chip 20 has been omitted. The same applies to the structure shown in Fig. 5(b) and Fig. 6(b). Fig. 5 is a view showing a power chip connection terminal 30a and the signal chip connection terminal 40 in Embodiment 2. Fig. 5(a) is a plan view illustrating the power chip connection terminal 30a and a gate electrode 22, and Fig. 5(b) is a schematic side view showing the power chip connection terminal 30a and the signal chip connection terminal 40. Fig. 6 is a view showing a power chip connection terminal 30b and the signal chip connection terminal 40 in Embodiment 3. Fig. 6(a) is a plan view showing the power chip connection terminal 30b and the gate electrode 22, and Fig. 6(b) is a schematic side view showing the power chip connection terminal 30b and the signal chip connection terminal 40. Fig. 7 is a side view showing a conventional electronic module 900. In Fig. 7, reference numerals 912, 914 indicate wiring and reference numeral S1 indicates solder. Fig. Fig. 8 is an enlarged side view of the essential portion illustrating a disadvantage of the conventional electronic module 900. Reference numeral S3 indicates solder, and reference numeral 935 indicates a spacer. In addition, an arrow near a power chip connection terminal 930 in Fig. 8 indicates a force (pressure) applied to the chip 920, and an arrow near a terminal 940 indicates a direction of a force lifting the chip 920 on the side of a control electrode 922. Description of embodiments

[0013] Below, electronic modules according to the present invention will be described based on embodiments illustrated in the drawings. The following embodiments are not intended to limit the present invention as claimed in the claims. Furthermore, all the various elements and combinations of these elements described in the embodiment are not necessarily indispensable as means for solving the problem of the present invention. Embodiment 11. The structure of an electronic module 1 according to Embodiment 1.

[0014] As in Fig. 1, the electronic module 1 according to Embodiment 1 is an electronic module 1 molded in a molding resin 80. A metal plate for heat radiation is arranged on an upper surface and a lower surface of the electronic module 1 (the metal plate on the upper surface of the electronic module 1 is indicated by reference numeral 73, and the lower surface of the electronic module 1 is not shown). Power terminals 69a, 66, 69b, which are external terminals through which a main current flows, extend from one side surface of the electronic module 1, and signal terminals 63, 68 and sensor terminals 61, 65, which are external terminals, extend from the other side surface of the electronic module 1.

[0015] As in Fig. 1 to Fig. 4, the electronic module 1 comprises a first circuit board 10; a chip 20; power chip connection terminals 30, 33; a spacer 35; signal chip connection terminals 40, 41; internal connection terminals 50, 51; first support elements 60, 64; second support elements 62, 67; external terminals (power terminals 69a, 66, 69b, signal terminals 63, 68 and SENSE terminals 61, 65); a second circuit board 70 (see Fig. 2); and the casting resin 80 (see Fig. 1) appears.

[0016] The first board 10 is a direct copper bonding (DCB) board, which includes an insulation board (a ceramic board) 12; circuit wiring 11 formed on one surface (the upper surface) of the insulation board 12; and a metal plate for heat radiation (not shown in the drawing) formed on the other surface (the lower surface) of the insulation board 12.

[0017] The second board 70 is also a DCB board, which includes an insulation board (a ceramic board) 72; a circuit wiring (not shown in the drawing) formed on a surface (a lower surface in Fig. 2) the insulation board 72; and a metal plate 73 for heat radiation formed on the other surface (the upper surface in the drawing) of the insulation board 12. The first board 10 and the second board can be formed from a suitable board such as a printed circuit board.

[0018] The chip 20 is arranged on the circuit wiring 11 of the first board 10 and is formed of a vertical type metal oxide semiconductor field effect transistor (MOSFET), wherein a source electrode 21 (a main electrode) and a gate electrode 22 (a control electrode) are arranged on a surface of the chip 20 on a side opposite to a surface on the side of the first board 10, and a drain electrode 23 (see Fig. 4(b)) is formed on the surface on the side of the first circuit board 10. The source electrode 21 is divided into three regions and occupies three regions when the rectangular chip 20 is divided into four regions in a plan view. In the chip 20 divided into four regions in a plan view, the gate electrode 22 is formed in a corner, which is an outer edge of a region in which no source electrode 21 is formed. The drain electrode 23 is formed on the entire surface of the chip 20 on the side of the first circuit board 10.

[0019] To ensure a large area of ​​the main electrode, the source electrode 21 occupies a considerable portion of an area of ​​the chip 20. On the other hand, the source electrode 21 must be spaced apart from the control electrode (the gate electrode 22) by a predetermined distance to prevent short-circuiting between the source electrode 21 and the control electrode (the gate electrode 22). As a result, the probability that the power chip connection terminal 30 is connected at a position away from the center of gravity of the chip 20 increases, and the chip 20 is prone to tilting. The signal chip connection terminal 40 described later is also particularly effective in view of such a case.

[0020] The spacer 35 is a plate-shaped member formed to span the three-divided source electrode 21. Recesses are formed in the spacer 35 to receive power chip connection terminals 30 described later, and the spacer 35 is bonded to the power chip connection terminals 30 in the recesses via a conductive bonding material (for example, solder).

[0021] The power chip connection terminal 30 is a columnar member made of a conductive material (e.g., a metal material). The power chip connection terminal 30 is disposed on the source electrode 21 (the main electrode). One end (a lower-side end portion) of the power chip connection terminal 30 is electrically connected to the source electrode 21 (the main electrode), and the other end (the upper-side end portion) is electrically connected to a wiring (not shown in the drawing) of the second circuit board 70. The lower-side end portion of the power chip connection terminal 30 is bonded to the recess of the spacer 35 via a conductive bonding material (e.g., solder), and the upper-side end portion of the power chip connection terminal 30 is bonded to the wiring of the second circuit board 70 via a conductive bonding material (e.g., solder).

[0022] As in Fig. 3(a), the power chip connection terminal 30 is held by the first support member 60 in a state in which the power chip connection terminal 30 is inserted through a first through hole H1 (see Fig. 4(b)) formed in the first support member 60 described later. The power chip connection terminal 30 is press-fitted into the first through-hole H1.

[0023] As in Fig. As shown in Figure 4(a), the power chip connection terminal 30 includes a body portion 32 having a round column shape and a flange portion 33 having a ring shape formed at an intermediate position of the body portion 32 in a height direction. A lower surface of the flange portion 33 is bonded to the first support member 60. The shape of the body portion 32 is not limited to a round column shape, but may be a rectangular column shape or any suitable column shape.

[0024] The signal chip connection terminal 40 is a columnar member made of a conductive material (for example, a metal material). The signal chip connection terminal 40 is attached to the gate electrode 22 (the control electrode). One end (the lower end portion) of the signal chip connection terminal 40 is electrically connected to the gate electrode 22 (the control electrode), and the other end (the upper end portion) of the signal chip connection terminal 40 is electrically connected to a wiring arranged on the second circuit board 70 (not shown in the drawing).The lower end portion of the signal chip connection terminal 40 is bonded to the gate electrode 22 via a conductive bonding material (e.g., solder), and the upper end portion of the signal chip connection terminal 40 is connected to the wiring arranged on the second circuit board 70 via a conductive bonding material (e.g., solder). The signal chip connection terminal 40 may not be bonded to the second circuit board 70.

[0025] As in Fig. 3(a), the signal chip connection terminal 40 is held by a second support member 65 in a state in which the signal chip connection terminal 40 is inserted through a second through hole H2 (see Fig. 4(b)) formed in the second support member 62 described later. The signal chip connection terminal 40 is inserted into the second through-hole H2.

[0026] As in Fig. As shown in Fig. 4(a), the signal chip connection terminal 40 includes a body portion 42 having a round columnar shape and a flange portion 43 having a ring shape formed at an intermediate position of the body portion 42 in the height direction. A lower surface of the flange portion 43 is bonded to the second support member 62. The shape of the body portion 42 is not limited to a round columnar shape, but may be a rectangular columnar shape or any suitable columnar shape. The signal chip connection portion 40 may not include the flange portion 43.

[0027] A chip (not shown in the drawing) is arranged on a circuit wiring (not shown in the drawing) of the second board 70. A spacer (not shown in the drawing) and the power chip connection terminal 31 are arranged above the source electrode (on a side where the chip is arranged with respect to the second board 70 defined as the upper side) of the chip (not shown in the drawing), and the signal chip connection terminal 41 is arranged above the gate electrode. These structures are the same as those obtained by inverting the chip 20, the spacer 35, the power chip connection terminal 30, and the signal chip connection terminal 40 on the first board 10. Accordingly, the description of these structures will be omitted.

[0028] In addition, as in Fig. 3, the first support member 64 is arranged at the intermediate position of the power chip connection terminal 31 in the height direction, and the power chip connection terminal 31 is held by the first support member 64. Further, the second support member 67 is arranged at the intermediate position of the signal chip connection terminal 41 in the height direction, and the signal chip connection terminal 41 is held by the first support member 64.

[0029] The internal connection terminals 50, 51 are columnar members that connect the first circuit board 10 and the second circuit board 70. In Embodiment 1, three internal connection terminals 50, 51 are arranged at end portions of the first circuit board 10. The power terminal 69a, which forms an external terminal, is connected to an intermediate position of the internal connection terminal 50 in the height direction, and the power terminal 69b, which forms an external terminal, is connected to an intermediate position of the internal connection terminal 51 in the height direction.

[0030] The first support member 60 is a conductive plate-shaped member having three through-holes H1. The power chip connection terminal 30 is inserted (press-fitted) into each first through-hole H1. The first support member 60 extends in a horizontal direction to the outside of the molding resin 80 (see Fig. 1). A portion of the first support member 60 outside the molding resin 80 forms the SENSE terminal 61, which constitutes an external terminal.

[0031] The first support element 64 is a conductive plate-shaped element having three through-holes. The first support element 64 extends horizontally from the molding resin 80 in a direction opposite to the direction of the SENSE terminal 61 (see Fig. 1) outward, and a portion of the first support member 64 outside the molding resin 80 constitutes an external terminal. An external terminal extending in the same direction as the SENSE terminal 61 is a SENSE terminal 65 connected to a source electrode of a chip (not shown in the drawing) arranged on the second board 70, and an external terminal extending in the opposite direction to the SENSE terminal 61 is a power terminal 66.

[0032] The second support element 62 is a conductive plate-shaped element with a second through-hole H2. The second support element 62 extends horizontally from the molding resin 80 (see Fig. 1) to the outside, and a portion of the second support member 62 outside the molding resin 80 forms an external terminal (the signal terminal 63).

[0033] The second support element 67 is a plate-shaped element with a second through-hole (not shown in the drawing). The second support element 67 extends horizontally from the casting resin 80 (see Fig. 1) to the outside, and a portion of the second support member 67 outside the molding resin 80 forms an external terminal (the signal terminal 68).

[0034] The first support elements 60, 64, the second support elements 62, 67 and the external terminals (the signal terminals 63, 68, the SENSE terminals 61, 65, the power terminals 66, 69a, 69b) may be formed from a single lead frame.

[0035] The casting resin 80 (see Fig. 1) Seals the first circuit board 10, the chip 20, the first support member 60, the second support member 62, the power chip connection terminal 30, and the signal chip connection terminal 40. The molding resin 80 is made of a thermosetting molding material obtained by adding a silicon oxide filler and the like to the epoxy resin, which is the main component. The molding resin 80 protects the chip 20 and the like from heat, light, moisture, and the like. 2. Advantageous effects obtained by Embodiment 1

[0036] The electronic module 1 according to Embodiment 1 includes the signal chip connection terminal 40 disposed on the control electrode (the gate electrode 22) and electrically connected to the control electrode (the gate electrode 22). With such a structure, even in a case where the main electrode (the source electrode 21) is physically pressed by the power chip connection terminal 30, the phenomenon of the chip 20 tilting can be prevented from occurring because the control electrode (the gate electrode 22) is pressed using the signal chip connection terminal 40. Accordingly, the chip 20 can be held horizontally with respect to the first board 10. As a result, sufficient reliability of the electronic module 1 can be ensured.

[0037] If a conventional connecting element is formed by bending a small part (see, for example, reference numeral 940 in Fig. 8), it is difficult to increase the bending accuracy, and therefore difficult to perform the positioning of the terminal with respect to a terminal portion with a small terminal area, such as the control electrode, with high accuracy. However, according to the electronic module 1 of Embodiment 1, the electronic module 1 has the signal chip connection terminal 40 in a columnar shape, and therefore, it is not necessary to bend a small part, so that the connection terminal can be positioned with high accuracy with respect to a small terminal portion, such as the gate electrode 22.

[0038] The electronic module 1 of Embodiment 1 includes the plate-shaped first support member 60 having the first through-hole H1 and the second support member 62 having the second through-hole H2, wherein the power chip connection terminal 30 is held by the first support member 60 in a state where the power chip connection terminal 30 passes through the first through-hole H1, and the signal chip connection terminal 40 is held by the second support member 62 in a state where the signal chip connection terminal 40 passes through the second through-hole H2, whereby the power chip connection terminal 30 and the signal chip connection terminal 40 can be stably held in a state where the power chip connection terminal 30 and the signal chip connection terminal 40 stand upright.Furthermore, signal wiring can be formed by the first support member 60, the second support member 62, the power chip connection terminal 30, and the signal chip connection terminal 40, thereby making a wiring mounting area on the first board 10 and the second board 70 small, thereby realizing downsizing of the electronic module 1. Furthermore, the wiring can be formed in a stereoscopic space, and therefore, it is possible to provide a module with a high degree of freedom in module design. Furthermore, by uniformly pressing the chip 20, the chip 20 can be more securely held horizontally with respect to the first board 10, thus providing a module that ensures greater reliability.

[0039] According to the electronic module 1 of Embodiment 1, the second support members 62, 67 extend in a horizontal direction to the outside of the molding resin 80, and portions of the second support members 62, 67 outside the molding resin 80 form the signal terminals 63, 68 of the gate electrode 22. Accordingly, a circuit connecting the gate electrode 22 of the chip 20 and the signal terminals 63, 68 can be formed from the signal chip connection terminals 40, 41 and the second support members 62, 67. Accordingly, the mounting areas for wiring on the first board 10 and the second board 70 can be made small, and therefore, the downsizing of the electronic module 1 is further improved, and at the same time, it is possible to provide an electronic module with an even greater degree of freedom with regard to the design of the electronic module.

[0040] According to the electronic module 1 of Embodiment 1, the first support members 60, 64 extend in a horizontal direction toward the outside of the molding resin 80, and portions located outside the molding resin 80 form the external terminals (the SENSE terminals 61, 65 and the power terminal 66), and therefore, a circuit connecting the source electrode 21 of the chip 20 and the external terminals can be formed by the power chip connection terminals 30, 31 and the first support members 60, 64. Accordingly, from this point of view, wiring mounting areas on the first board 10 and the second board 70 can be made small, and the downsizing of the electronic module is further improved.

[0041] According to the electronic module 1 of Embodiment 1, the second circuit board 70 is arranged at a position opposite to the first circuit board 10, and the power chip connection terminal 30 and the signal chip connection terminal 40 are connected to the second circuit board 70. Accordingly, heat can be radiated from both surfaces of the first circuit board 10 and the second circuit board 70, thus providing an electronic module with high heat radiation properties. Furthermore, the first circuit board 10, the chip 20, the second circuit board 70, and a chip (arranged on the second circuit board) can be connected to each other by the power chip connection terminal 30 and the signal chip connection terminal 40, thereby improving the dimensional stability of the electronic module 1.

[0042] According to the electronic module 1 of Embodiment 1, the main electrode (source electrode 21) is divided into a plurality of (three) electrode sections, and the power chip connection terminals 30, 31 are arranged to correspond to the three divided electrode sections, respectively, thereby facilitating the power supply between the power chip connection terminals 30, 31 and the three divided electrode sections. Minimal current density bias occurs, and therefore, heat generated by the chip 20 can be radiated (transferred) to the second board 70 via the power chip connection terminals 30, 31.

[0043] In the electronic module 1 of Embodiment 1, the gate electrode 22 is arranged on an outer edge region of the chip 20. Such a structure allows the gate electrode 22 to be easily connected to the outside while simultaneously ensuring a large area for the source electrode 21.

[0044] According to the electronic module 1 of Embodiment 1, the spacer 35 is disposed between the main electrode (the source electrode 21) and the power chip connection terminal, and therefore, a thermal stress applied to a conductive material between the main electrode (the source electrode 21) and the power chip connection terminal 30 can be alleviated. Embodiment 2

[0045] An electronic module 2 according to Embodiment 2 has substantially the same structure as the electronic module 1 according to Embodiment 1. However, the electronic module 2 according to Embodiment 2 differs from the electronic module 1 according to Embodiment 1 in terms of the structure of the source electrode and the structure of the power chip connection terminal. That is, in the electronic module 2 according to Embodiment 2, the source electrode is as shown in Fig. 5, rather than being divided into three parts, a source electrode 21a having a relatively large area is formed, and a power chip connection terminal 30a corresponding to the source electrode 21a is arranged.

[0046] In this way, the electronic module 2 according to Embodiment 2 differs from the case of the electronic module 1 according to Embodiment 1 in the structure of the source electrode and the structure of the power chip connection terminal. However, the electronic module 2, like the electronic module 1 according to Embodiment 1, has a signal chip connection terminal 40 disposed on the gate electrode 22 and electrically connected to the gate electrode 22. Accordingly, the electronic module 2 can ensure sufficient reliability, and at the same time, the signal chip connection terminal 40 can be positioned with high accuracy even with respect to a small connection area such as the gate electrode 22.

[0047] The semiconductor module 2 according to the embodiment has, in principle, substantially the same structure as the semiconductor module 1 according to Embodiment 1 with respect to points other than the structure of the source electrode and the structure of the power chip connection terminal. Accordingly, the semiconductor module 2 according to Embodiment 2 can achieve advantageous effects equivalent to those of the semiconductor module 1 according to Embodiment 1, among all the advantageous effects achieved by Embodiment 1. Embodiment 3

[0048] An electronic module 3 according to Embodiment 3 basically has substantially the same structure as the electronic module 1 according to Embodiment 1. However, the electronic module 3 according to Embodiment 3 differs from the electronic module 2 according to Embodiment 2 in terms of the structure of a power chip connection terminal. That is, in the electronic module 3 according to Embodiment 3, the power chip connection terminal 30b is as shown in Fig. 6, the terminal is not formed in a columnar shape, but in a shape such that the power chip connection terminal 30b spans two electrode portions (a so-called clip shape or connector shape) as a bridge (a so-called clip shape or connector shape) or is arranged therebetween in a bridge-like manner.

[0049] In Embodiment 3, the power chip connection terminal 30b is not a terminal with a columnar shape. The chip 20 is pressed when the power chip connection terminal 30b is placed on a source electrode 21a of the chip 20, or the chip 20 is pressed due to the weight of the power chip connection terminal 30b. In this case, too, providing a signal chip connection terminal can prevent the chip from floating.

[0050] In Embodiment 3, the power chip connection terminal 30b is not a terminal having a columnar shape and therefore, no member corresponding to a first support member is provided.

[0051] Although the electronic module 3 according to Embodiment 3 differs from the electronic module 2 according to Embodiment 2 in terms of the structure of the power chip connection terminal, the electronic module 3 according to Embodiment 3, like the electronic module 2 according to Embodiment 2, has the signal chip connection terminal 40 disposed on the gate electrode 22 and electrically connected to the gate electrode 22. Accordingly, the electronic module 3 can sufficiently ensure reliability, and at the same time, the power chip connection terminal can be positioned with high accuracy even with respect to a small connection area such as the gate electrode 22.

[0052] The semiconductor module 3 according to Embodiment 3 has, in principle, substantially the same structure as the semiconductor module 2 according to Embodiment 2 with respect to points other than the power chip connection terminal. Accordingly, among all the advantageous effects achieved by Embodiment 2, the semiconductor module 3 according to Embodiment 3 can achieve advantageous effects corresponding to the advantageous effects of the semiconductor module 2 according to Embodiment 2.

[0053] The present invention has been described above based on the above-mentioned embodiments, but the present invention is not limited to the above-mentioned embodiments. The present invention can be embodied in various ways without departing from the gist of the present invention, and the following modifications are conceivable.

[0054] (1) The positions, terminals, numbers, and the like of the constituent elements described in the above-mentioned respective embodiments (including respective modifications, the same understanding being applied to the following description) are provided for the purpose of exemplary illustration, and these values ​​can be appropriately changed as long as the technical features of the present invention are not affected.

[0055] (2) In the above-mentioned respective embodiments, a vertical-type MOSFET was used as the chip. However, the present invention is not limited to such a MOSFET. A horizontal-type MOSFET, that is, a horizontal MOSFET in which a drain electrode is formed on a side opposite to a board side, may be used. In this case, the MOSFET may be connected to both the source electrode and the drain electrode using power chip connection terminals, or the MOSFET may be connected to only one of the source electrode and the drain electrode using a power chip connection terminal. Furthermore, the chip is not limited to a MOSFET, but a transistor other than a MOSFET, such as an IGBT, a thyristor, or a triac, may also be used as the chip.That is, as long as the chip has the control electrode and the main electrode, any suitable element can be used.

[0056] (3) In the above-mentioned respective embodiments, the signal chip connection terminal is held using the second support member. However, the present invention is not limited to such a structure. The signal chip connection terminal may be held without using the second support member.

[0057] (4) In the above embodiments, a case where the present invention is applied to an electronic module having two chips was described. However, the present invention is not limited to such a configuration. The present invention can be applied to an electronic module having one chip, or the present invention can be applied to an electronic module having three or more chips.

[0058] (5) In the above-mentioned embodiments, a thickness of the first support members 60, 64 is set to be equal to a thickness of the second support members 62, 67. However, the present invention is not limited to such a configuration. The thickness of the first support members 60, 64 may be greater than the thickness of the second support members 62, 67. With such a configuration, the first support members 60, 64 connected to the source electrode allow a relatively large current to flow through, while ensuring a sufficient width for supporting the power chip connection terminals 30, 31 having a relatively large cross-sectional area. In addition, the diameter of the through-hole can be increased, and therefore the power chip connection terminal 30, 31 having a relatively large cross-sectional area can be passed through the through-hole.

[0059] The signal chip connection terminals 40, 41 are formed by a pin terminal with a relatively small cross-sectional area through which a small amount of current flows. To allow such a signal chip connection terminal 40, 41 to pass through, it is necessary to make a diameter of the second through-hole H2 small. However, when a thickness of the second support member is large, forming such a through-hole with a small diameter is not easy. Accordingly, the second through-hole H2 with a small diameter can be formed by setting a thickness of the second support members 62, 67 to be smaller than a thickness of the first support members 60, 64.

[0060] (6) In the above-mentioned embodiments, a gap between the signal chip connection terminal 40, 41 and the second through-hole H2 can be set larger than a gap between the power chip connection terminal 30, 31 and the first through-hole H1. With such a structure, the signal chip connection terminal 40, 41 can be positioned in a correct position even during the manufacturing process (self-alignment can be enabled). List of reference symbols 1, 2, 3 Electronic module 10 first board 20 chips 21, 21a Source electrode (main electrode) 22 Gate electrode 30, 30a, 30b, 31 Power chip connection terminal 35 spacers 40, 41 Signal chip connection terminal 60, 64 first support element 62, 67 second support element 61, 63,65, 66, 68, 69a, 69b external connection 70 second board H1 first passage opening H2 second through opening QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP-A-2020-503697

[0005]

Claims

An electronic module comprising a first circuit board; a chip disposed on the first circuit board and having a main electrode and a control electrode on a surface thereof opposite to its surface on the first circuit board side; a power chip connection terminal disposed on the main electrode and electrically connected to the main electrode; and a columnar signal chip connection terminal disposed on the control electrode and electrically connected to the control electrode. The electronic module according to claim 1, further comprising a first support member having a plate shape and a first through-hole; and a second support member having a plate shape and a second through-hole, wherein the power chip connection terminal is held by the first support member in a state where the power chip connection terminal passes through the first through-hole, and the signal chip connection terminal is held by the second support member in a state where the signal chip connection terminal passes through the second through-hole. The electronic module according to claim 2, wherein the first board, the chip, the first support member, the second support member, the power chip connection terminal, and the signal chip connection terminal are sealed by a molding resin, and the second support member extends to an outside of the molding resin, and a portion of the second support member disposed outside the molding resin forms an external terminal of the control electrode. The electronic module according to claim 2, wherein the first board, the chip, the first support member, the second support member, the power chip connection terminal, and the signal chip connection terminal are sealed by a molding resin, and the first support member extends to an outside of the molding resin, and a portion of the first support member disposed outside the molding resin forms an external terminal connected to the main electrode. The electronic module according to any one of claims 1 to 4, further comprising a second circuit board arranged at a position opposite to the first circuit board, wherein the power chip connection terminal and the signal chip connection terminal are each connected to the second circuit board. Electronic module according to claim 2, wherein a thickness of the first support element is set greater than a thickness of the second support element. The electronic module according to claim 2, wherein a gap formed between the signal chip connection terminal and the second through-hole is larger than a gap formed between the power chip connection terminal and the first through-hole. The electronic module according to any one of claims 1 to 7, wherein the main electrode is divided into a plurality of electrode sections, and the power chip connection terminal is arranged to correspond to the respective divided electrode sections. Electronic module according to one of claims 1 to 8, wherein the control electrode is arranged on an outer peripheral region of the chip. Electronic module according to one of claims 1 to 9, wherein a spacer is arranged between the main electrode and the power chip connection terminal.

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