Electrical connection unit

Abstract

The electrical connection unit comprises a first electronic component, a base element, and a busbar. The base element includes a flat surface section in a plate or sheet form. The flat surface section has a first surface facing the first electronic component and a second surface located on one side opposite the first surface. In a case where a thickness direction of the flat surface section is a first direction, the flat surface section includes a receiving section that is recessed in or penetrates the flat surface section in the first direction. The busbar includes a plate section that is received in the receiving section. The plate section includes an exposed section that faces the outside of the base element on the side of the second surface.

Description

BACKGROUND OF THE INVENTION Area of ​​the invention

[0001] Embodiments of the present invention relate to an electrical connection unit. Description of relevant technology

[0002] An electrical connection unit with a housing that accommodates electronic components and a busbar that is vertically attached to the housing is known. [State of the art document][Patent document]

[0003] [Patent document 1] Japanese unexamined patent application, first publication no. 2024-037492 PRESENTATION OF THE INVENTION

[0004] Furthermore, it is expected to improve the heat dissipation properties of an electrical connection unit.

[0005] One embodiment provides an electrical connection unit that is capable of improving heat dissipation properties.

[0006] An electrical connection unit according to one embodiment comprises a first electronic component, a base element, and a busbar. The base element includes a flat surface section in a plate or sheet shape. The flat surface section has a first surface facing the first electronic component and a second surface located on one side opposite the first surface. In a case where a thickness direction of the flat surface section is a first direction, the flat surface section includes a receiving section that is recessed in the first direction or that penetrates the flat surface section in the first direction. The busbar is electrically connected to the first electronic component. The busbar includes a plate section that is received in the receiving section and extends along the flat surface section.The plate section contains an exposed section that is exposed to the outside of the base element on the side of the second surface.

[0007] According to one embodiment, it is possible to improve the heat dissipation properties of an electrical connection unit. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a cross-sectional view illustrating an electrical connection unit of a first embodiment. Fig. Figure 2 is a perspective view to describe a main body of the first embodiment. Fig. Figure 3 is a perspective view to describe a subunit of the first embodiment. Fig. Figure 4 is a partially separated perspective view of the subunit of the first embodiment. Fig. Figure 5 is a perspective view to describe an electronic component and a connecting component of the first embodiment. Fig. Figure 6 is a perspective view to describe the electronic component and the connection component of the first embodiment. Fig. Figure 7 is a perspective view illustrating the connecting component of the first embodiment. Fig. Figure 8 is a perspective view illustrating a laying board of the first embodiment. Fig. Figure 9 is a partially separated perspective view of the laying board according to the first embodiment. Fig. Figure 10 is a top view illustrating the laying board of the first embodiment. Fig. Figure 11 is a partially separated perspective view of a connecting unit of the first embodiment. Fig. Figure 12 is a view from below, illustrating the routing board of the first embodiment. Fig. 13 is a cross-sectional view along line F13-F13 of a Fig. 10 illustrated structures. Fig. Figure 14 is a cross-sectional view illustrating a modification example of the first embodiment. Fig. Figure 15 is a cross-sectional view illustrating a modification example of the first embodiment. Fig. Figure 16 is a cross-sectional view illustrating a modification example of the first embodiment. Fig. Figure 17 is a cross-sectional view illustrating a modification example of the first embodiment. Fig. Figure 18 is a perspective view illustrating a three-dimensional routing structure of a busbar of the first embodiment. Fig. Figure 19 is a top view illustrating the three-dimensional routing structure of the busbar of the first embodiment. Fig. 20 is a cross-sectional view along the line F20-F20 of the in Fig. 10 illustrated structures. Fig. Figure 21 is a cross-sectional view to describe a heat dissipation path with respect to a fixing section of the first embodiment. Fig. Figure 22 is a cross-sectional view to describe a heat dissipation path according to a modification example of the first embodiment. Fig. Figure 23 is a cross-sectional view to describe an absorption structure for thermal expansion / contraction in connection with the fixing section of the first embodiment. Fig. Figure 24 is a cross-sectional view illustrating an effect of the absorption structure of the first embodiment. Fig. Figure 25 is a perspective view describing a first aspect of an insulating rib of the first embodiment. Fig. Figure 26 is a perspective view to describe a first modification example for the first aspect of the first embodiment. Fig. Figure 27 is a cross-sectional view to describe a second modification example for the first aspect of the first embodiment. Fig. Figure 28 is a perspective view that describes a second aspect of the insulating rib of the first embodiment. Fig. Figure 29 is a cross-sectional view to describe a structure connected to the connecting component of the first embodiment. Fig. Figure 30 is a cross-sectional view to describe a method for manufacturing the electrical connection unit of the first embodiment. Fig. Figure 31 is a cross-sectional view to describe the method for manufacturing the electrical connection unit of the first embodiment. Fig. Figure 32 is a cross-sectional view to describe the method for manufacturing the electrical connection unit of the first embodiment. Fig. Figure 33 is a cross-sectional view to describe the method for manufacturing the electrical connection unit of the first embodiment. Fig. Figure 34 is a cross-sectional view to describe the method for manufacturing the electrical connection unit of the first embodiment. Fig. Figure 35 is a perspective view to describe a subunit of a second embodiment. Fig. 36 is a cross-sectional view along line F36-F36 of the in Fig. 35 illustrated structures. Fig. Figure 37 is a perspective view to describe a subunit of a third embodiment. Fig. Figure 38 is a perspective view to describe a subunit of a fourth embodiment. Fig. 39 is a cross-sectional view along line F39-F39 of the in Fig. 38 illustrated structures. Fig. Figure 40 is a cross-sectional view illustrating a modification example of the fourth embodiment. Fig. Figure 41 is a perspective view to describe a subunit of a fifth embodiment. Fig. 42 is a cross-sectional view along line F42-F42 of the in Fig. 41 illustrated structure. DETAILED DESCRIPTION OF THE INVENTION

[0008] The following descriptions illustrate embodiments with reference to the drawings. In the following description, assemblies with the same or similar functions are named using the same reference numerals. Redundant descriptions of these assemblies may be omitted. Note that the assembly described below does not limit the scope of the embodiment.

[0009] In the present disclosure, the terms are defined as follows. The term "connection" is not limited to a mechanical connection and may also include an electrical connection. That is, the term "connection" is not limited to a case in which two elements that are connection targets are directly connected and may include a case in which two elements that are connection targets are connected by another, intervening element. The term "reception" is not limited to the case in which the entire component is received, but may also include the case in which only a part of the component is received (a state in which the remaining part of the component protrudes). The term "facing" indicates that the virtual projection images of two target objects overlap when viewed from a certain direction.This means that the term "facing" is not limited to the case where two target objects are directly facing each other, but can also include the case where two target objects are facing each other in a state in which another element is located between the two target objects. "Parallel," "orthogonal," or "equal" can each include "substantially parallel," "substantially orthogonal," or "substantially equal," respectively.

[0010] In the present disclosure, a +X direction, a -X direction, a +Y direction, a -Y direction, a +Z direction, and a -Z direction are defined as follows. The +X direction is a direction from a first end 80e1 to a second end 80e2 of a metal plate 80, which is described later (see Fig. 11) The -X direction is a direction opposite to the +X direction. When the +X and -X directions are not distinguished, the directions are referred to simply as the "X direction" in the following. The +Y direction and the -Y direction are directions that intersect the X direction (for example, orthogonal to it). The +Y direction is a direction from a third end 80e3 to a fourth end 80e4 of the metal plate 80, which is described later (see Fig. 11) The -Y direction is a direction opposite to the +Y direction. When the +Y and -Y directions are not distinguished, the directions are simply referred to as the "Y direction" in the following. The +Z direction and the -Z direction are directions that intersect the X and Y directions (for example, are orthogonal to them). The +Z direction is a direction from the metal plate 80, which is described later, to a principal body MU (see Fig. 1) The -Z direction is the opposite of the +Z direction. When the +Z and -Z directions are not distinguished, the directions are simply referred to as the "Z direction" in the following. The Z direction is an example of a "first direction." The X direction is an example of a "second direction." The "second direction" is not limited to the X direction but can also be the Y direction or other directions.

[0011] If the X and Y directions are not distinguished, the directions can be referred to as the "horizontal direction" in the following. The Z direction can be referred to as the "vertical direction" in the following. The side with the +Z direction can be referred to as "top" and the side with the -Z direction as "bottom". However, these terms are descriptive and do not define a gravity direction of an electrical connection unit 1 (an installation position of the electrical connection unit 1). (First embodiment)<1. Structure of the electrical connection unit>

[0012] Fig. Figure 1 is a cross-sectional view illustrating an electrical connection unit 1 in a first embodiment. The electrical connection unit 1 is, for example, an in-vehicle device attached to a vehicle such as an electric vehicle (EV), a hybrid electric vehicle (HEV), or a plug-in hybrid electric vehicle (PHEV). The electrical connection unit 1 can be referred to, for example, as an "electrical junction box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0013] The electrical connection unit 1 contains, for example, a main body MU, a metal plate 80, an insulating film 91 (see Fig. 11), a plurality of heat transfer elements 92 and an insulating cover 93. <2nd main body>

[0014] First, the main body MU is described.

[0015] Fig. Figure 2 is a perspective view illustrating the main body MU. The main body MU is a section that performs a main function (for example, switching electrical connection states or overcurrent protection) of the electrical connection unit 1. In the present embodiment, the main body MU is divided into a plurality of subunits SU. The main body MU is formed by connecting a plurality of subunits SU. In the present embodiment, the main body MU contains three subunits SU (subunits SUX, SUY, and SUZ). Each subunit SU can be referred to as a "circuit structure body".

[0016] The subunit SUX has a primary electrical function. For example, the subunit SUX contains a plurality of electronic components 10X and a primary distribution board 40X. The majority of the electronic components 10X are electrically connected to the primary distribution board 40X.

[0017] The subunit SUY has a secondary electrical function. This secondary function differs from the primary function. For example, the subunit SUY contains a plurality of electronic components 10Y and a secondary circuit board 40Y. The majority of the electronic components 10Y are electrically connected to the secondary circuit board 40Y.

[0018] The subunit SUZ has a third electrical function. This third function is distinct from the first and second functions. For example, the subunit SUZ contains a plurality of electronic components 10Z and a third routing board 40Z. The majority of the electronic components 10Z are electrically connected to the third routing board 40Z.

[0019] In the present embodiment, the three subunits SUX, SUY, and SUZ are arranged such that they lie in the X direction. For example, subunit SUX is arranged on the +X direction side with respect to subunit SUY. Subunit SUX and subunit SUY are electrically connected via a plurality of coupling busbars 75 extending between the first routing board 40X and the second routing board 40Y. Subunit SUZ, on the other hand, is arranged on the -X direction side with respect to subunit SUY. Subunit SUZ and subunit SUY are electrically connected via a plurality of coupling busbars 75 (in Fig. (Figure 2 is only illustrated) connected, extending between the third routing board 40Z and the second routing board 40Y. The coupling busbar 75 is located on the side opposite the metal plate 80 with respect to the majority of the subunits SU.

[0020] In the present embodiment, the three routing boards 40X, 40Y, and 40Z, contained in the three subunits SUX, SUY, and SUZ, are arranged in the same plane. In other words, the three routing boards 40X, 40Y, and 40Z are arranged at the same height in the Z-direction. Thus, the three routing boards 40X, 40Y, and 40Z form one large routing board 40M.

[0021] In the present embodiment, the three subunits SUX, SUY, and SUZ have the same or a similar basic structure. Therefore, one subunit SU will be described in detail below as a representative example. If the subunits SUX, SUY, and SUZ are not distinguished, they will simply be referred to as "subunit SU." If the electronic components 10X, 10Y, and 10Z are not distinguished, they will simply be referred to as "electronic component 10." If the first routing board 40X, the second routing board 40Y, and the third routing board 40Z are not distinguished, they will simply be referred to as "routing board 40." A subunit SU contained within the three subunits SUX, SUY, and SUZ is an example of a "first subunit."Another subunit SU, which is contained within the three subunits SUX, SUY and SUZ, is, however, an example of a "second subunit".

[0022] Note that the main body MU need not be subdivided into a plurality of subunits SU, as in the example described above. That is, the main body MU can be formed from a plurality of electronic components 10 and a distribution board 40. Furthermore, the two or more subunits SU are not limited to subunits SU with different functions, but can also be subunits SU with the same function. <3. Subunit Structure>

[0023] Next, the structure of the subunit SU will be described.

[0024] Fig. Figure 3 is a perspective view to describe subunit SU. Fig. Figure 4 is a partially disassembled perspective view of subunit SU. Subunit SU contains, for example, a plurality of electronic components 10, a plurality of connection components 20 for connecting components, a plurality of connection components 30 for external connection, and a routing board 40. The connection components 20 and 30 are elements that form a power supply path in the vertical direction. The connection components 20 and 30 can be referred to as "vertical routing elements". <3.1 Electronic component and connection component for connecting components>

[0025] First, the electronic component 10 and the connection component 20 for connecting components are described.

[0026] Electronic component 10 is an electronic component attached according to a function required for subunit SU. Electronic component 10 could be, for example, a terminal, a fuse, a relay (for example, a mechanical relay or a solid-state relay), a capacitor, a branching component, any of several different sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component assembly in which two or more of these components are combined. Note that the type of electronic component 10 is not limited to the above example. Electronic component 10 could, for example, be a heat-generating component that produces heat when energy is supplied.Below, an electronic component of the first kind 10M and an electronic component of the second kind 10N are described as examples of the electronic component 10.

[0027] The connection component 20 is a component that electrically connects the electronic component 10 to the routing board 40. The connection component 20 forms part of a power supply path in the subunit SU. The connection component 20 is made of a metal (for example, copper or a copper alloy). The connection component 20 can be referred to as a "metal component". A first-type connection component 20M and a second-type connection component 20N are described below as examples of the connection component 20. <3.1.1 Electronic component of the first kind>

[0028] Fig. Figure 5 is a perspective view illustrating the electronic component of the first type 10M and the connection component of the first type 20M. The electronic component of the first type 10M is an electronic component in which a plurality of terminals 13 are arranged at one end of the electronic component 10M. The electronic component 10M includes, for example, a housing 11, a component body 12, a plurality of terminals 13, and a plurality of mounting sections 14. (Housing)

[0029] The housing 11 is an outer element that forms most of the outer shape of the electronic component 10M. The housing 11 is made of, for example, synthetic resin and has insulating properties. The housing 11 contains the component body 12. The housing 11 and the component body 12 can be formed from a single piece.

[0030] In the present embodiment, the housing 11 has an insulating rib 11a that projects horizontally (for example, in the X-direction) and extends in the Z-direction. The insulating rib 11a has, for example, a plate-like shape formed horizontally (for example, in the X-direction) and in the Z-direction. The insulating rib 11a extends, for example, over the entire length of the housing 11 in the Z-direction. The insulating rib 11a is arranged between the plurality of terminals 13 (a terminal 13A and a terminal 13B, which will be described later). The insulating rib 11a electrically isolates terminal 13A from terminal 13B. In the present embodiment, a portion of the insulating rib 11a is arranged between first sections 21 (which will be described later) of two connection components 20M that are connected to the electronic component 10M.The insulating rib 11a electrically isolates the first sections 21 of the two connecting components 20M connected to the electronic component 10M from each other. (Component body)

[0031] The component body 12 is a section that performs a main function of the electronic component 10M. For example, if the electronic component 10M is a relay, the component body 12 contains a switch (for example, a contact) that toggles between a conductive and a non-conductive state. For example, if the electronic component 10M is a fuse, the component body 12 contains a melting section that blows when an overcurrent flows. For example, if the electronic component 10M is a capacitor, the component body 12 contains a section that stores electrical charge. (Connection)

[0032] Terminal 13 is an electrical connection section exposed to the outside of the housing 11. Terminal 13 is electrically connected to the component body 12 inside the housing 11. In the present embodiment, the electronic component 10M includes one terminal 13A and one terminal 13B as the plurality of terminals 13. One of the terminals 13A and 13B is a terminal on the positive electrode side. The other of the terminals 13A and 13B is a terminal on the negative electrode side. One of the terminals 13A and 13B is an example of a "first terminal." The other of the terminals 13A and 13B is an example of a "second terminal."

[0033] In the present embodiment, terminal 13A and terminal 13B are provided at one end of the electronic component 10M in a horizontal direction (for example, in the X-direction). Terminal 13A and terminal 13B are arranged such that they lie in the horizontal direction (for example, in the Y-direction). Each terminal 13 has a mounting hole 13h to which a fastening element 71 (for example, a screw or a bolt), which will be described later, is attached. The mounting hole 13h is open in the horizontal direction (for example, in the X-direction). An inner circumferential surface of the mounting hole 13h of the electronic component 10M has a groove for the screw. (Fortification section)

[0034] Mounting section 14 is a section for fixing the electronic component 10M. Mounting section 14 has a mounting hole 14h to which a fastening element 112 (for example, a screw or a bolt; see Fig. 11), which will be described later, is attached. The mounting hole 14h is open in the Z-direction. The mounting hole 14h is an insertion hole through which the fastening element 112 passes. A fixing target for the fastening section 14 will be described later. <3.1.2 First-type connection component>

[0035] The connecting component of the first type 20M is a component that electrically connects the electronic component of the first type 10M to the routing board 40. In the present embodiment, the connecting component 20M electrically connects the electronic component 10M to a busbar 42 (see Fig. 8), which is contained in the routing board 40. In the present embodiment, a width L12 of the connecting component 20M in a longitudinal direction (for example, the X-direction) of the electronic component 10M is smaller than a width L11 of the electronic component 10M in the longitudinal direction. The connecting component 20M includes, for example, a first section 21 and a second section 22. (First section)

[0036] The first section 21 of the connecting component 20M is a section connected to terminal 13 of the electronic component 10M. The first section 21 is a plate-shaped or rectangular parallelepiped section extending in the Z-direction. The first section 21 extends in the Z-direction along one end (for example, an end in the X-direction) of the electronic component 10M. The first section 21 is a vertical section oriented in the Z-direction with respect to the routing board 40 (for example, with respect to a busbar 42, which will be described later). The first section 21 is horizontally adjacent (for example, in the X-direction) to the electronic component 10M.For example, the first section 21 borders the terminal 13 of the electronic component 10M in a horizontal direction (for example, in the X direction) and is connected to the terminal 13 of the electronic component 10M from a horizontal direction (for example, in the X direction).

[0037] The first section 21 of the connecting component 20M has a first mounting hole 21h through which the fastening element 71 (for example, a screw or a bolt) passes. The first mounting hole 21h is open in the horizontal direction (for example, in the X direction). The first section 21 has a recess 25 around the first mounting hole 21h. The recess 25 is a receiving section that accommodates a head of the fastening element 71 that has been inserted into the first mounting hole 21h. The fastening element 71, passing through the first mounting hole 21h, is connected to the mounting hole 13h of the terminal 13 of the electronic component 10M, so that the first section 21 is physically and electrically connected to the terminal 13 of the electronic component 10M. The first section 21 need not have the recess 25. (Second Section)

[0038] The second section 22 of the connection component 20M is a section that is connected to the busbar 42 (see Fig. 8) The second section 22 projects horizontally (for example, in the X direction) from the end of the first section 21 on the -Z direction side. The second section 22 is a plate section provided in the horizontal direction. The second section 22 borders the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second section 22 of the connecting component 20M is attached to the fastening element 43 (for example, a screw or a bolt; see Fig. 8) is attached, projecting from the busbar 42 in the +Z direction, and is physically and electrically connected to the busbar 42. In the present embodiment, the second section 22 of the connecting component 20M has a second mounting hole 22h through which the fastening element 43 passes. The second mounting hole 22h is open in the Z direction. In the second section 22, the fastening element 43 passes through the second mounting hole 22h. A coupling element 44 (for example, a nut; see Fig. 3) is coupled to the tip of the fastening element 43, which passes through the second fastening hole 22h, thereby fixing the second section 22 to the busbar 42. In the present embodiment, the first section 21 and the second section 22 form an L-shaped connecting component 20M. <3.1.3 Second type electronic component>

[0039] Fig. Figure 6 is a perspective view illustrating the second-order electronic component 10N and the second-order connection component 20N. The second-order electronic component 10N is an electronic component in which two terminals 13 are arranged separately at both ends in the horizontal direction of the electronic component 10N. The electronic component 10N includes, for example, a housing 11, a component body 12, and a plurality of terminals 13. Note that among the assemblies of the electronic component 10N, those assemblies that have similar functions to the electronic component 10M are named with the same reference numerals. In this case, in the description of the electronic component 10N, "electronic component 10M" can be replaced by "electronic component 10N" in the description of the electronic component 10M described above.

[0040] In electronic component 10N, terminals 13A and 13B are arranged separately at both ends of the electronic component 10N in a horizontal direction (for example, in the X-direction). Each terminal 13 has a mounting hole 13h to which a fastener 72 (for example, a screw or a bolt), described later, is attached. The mounting hole 13h is open in the Z-direction. For example, the mounting hole 13h of electronic component 10N is an insertion hole through which the fastener 72 passes. One of the terminals 13A and 13B is an example of a "first terminal." The other of the terminals 13A and 13B is an example of a "second terminal." <3.1.4 Second type connection component>

[0041] The connecting component of the second type 20N is a component that electrically connects the electronic component of the second type 10N to the routing board 40. In the present embodiment, the connecting component 20N electrically connects the electronic component 10N to the busbar 42 (see Fig. 8), which is contained in the routing board 40. In the present embodiment, a width L12 of the connecting component 20N in the longitudinal direction (for example, in the X-direction) of the electronic component 10N is smaller than a width L11 of the electronic component 10N in the longitudinal direction. The connecting component 20N includes, for example, a first section 21, a second section 22, and a third section 23. (First section)

[0042] The first section 21 of the connecting component 20N is a section connected to terminal 13 of the electronic component 10N. The first section 21 is a rectangular parallelepiped section extending in the Z-direction. The first section 21 is a vertical section oriented in the Z-direction relative to the routing board 40 (for example, relative to the busbar 42). The first section 21 borders terminal 13 of the electronic component 10N in the Z-direction and is connected to terminal 13 of the electronic component 10N in the Z-direction. The first section 21 of the connecting component 20N has a first mounting hole 21h into which the fastening element 72 engages. The first mounting hole 21h is open in the Z-direction. An inner circumferential surface of the first mounting hole 21h of the connecting component 20N has a groove for the screw.The fastening element 72, which passes through the mounting hole 13h of the terminal 13 of the electronic component 10N, is connected to the mounting hole 21h of the first section 21, so that the first section 21 is physically and electrically connected to the terminal 13 of the electronic component 10N. (Second Section)

[0043] The second section 22 of the connecting component 20N is a section that is connected to the busbar 42 (see Fig. 8) The second section 22 projects horizontally (for example, in the X direction) from the end of the first section 21 on the -Z direction side. The second section 22 is a plate section provided in the horizontal direction. The second section 22 borders the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second section 22 of the connecting component 20N is attached in the Z direction to the fastening element 43 (for example, a screw or a bolt; see Fig. 8) is attached, projecting from the busbar 42 in the +Z direction, and is physically and electrically connected to the busbar 42. In the present embodiment, the second section 22 of the connecting component 20N has a second mounting hole 22h through which the fastening element 43 passes. The second mounting hole 22h is open in the Z direction. In the second section 22, the fastening element 43, which will be described later, passes through the second mounting hole 22h. A coupling element 44 (for example, a nut; see Fig. 3) is coupled to the tip of the fastening element 43, which passes through the second fastening hole 22h, thereby fixing the second section 22 to the busbar 42. (Third Section)

[0044] The third section 23 is a standing wall (side wall) extending horizontally in the +Z direction from both ends of the second section 22. The third section 23 is a wall provided in the Z direction. The third section 23 is connected to the first section 21 and also to the second section 22. For example, the third section 23 extends diagonally, increasing in the X direction while running in the -Z direction. The third section 23 can be provided in the connection component 20M described above. The connection component 20N, however, does not need to include the third section 23. <3.2 Connection component for external connection>

[0045] Next, the connection component 30 for the external connection will be described.

[0046] Fig. Figure 7 is a perspective view illustrating the connection component 30 for the external connection. The connection component 30 is a component that electrically connects an external busbar 76 to the distribution board 40. In the present embodiment, the connection component 30 electrically connects the external busbar 76 to the busbar 42 contained in the distribution board 40 (see Figure 7). Fig. 8) The external connecting busbar 76 is electrically connected to an external device. In the present disclosure, the “external device” is an electrical device that exists outside the electrical connecting unit 1. The external device is, for example, a battery attached to a vehicle or an inverter for driving a motor of the vehicle, but is not limited to these examples. The connecting component 30 includes, for example, a first section 31, a second section 32, and a third section 33. (First section)

[0047] The first section 31 is a section connected to the external busbar 76. The first section 31 is a rectangular parallelepiped section extending in the Z-direction. The first section 31 is oriented in the Z-direction with respect to the routing board 40 (for example, with respect to the busbar 42). The first section 31 borders the external busbar 76 in the Z-direction and is connected to the external busbar 76 in the Z-direction. The first section 31 has a first mounting hole 31h through which a fastener 73 (for example, a screw or a bolt) passes. The first mounting hole 31h is open in the Z-direction. An inner circumferential surface of the first mounting hole 31h has a groove for the screw.The fastening element 73, which passes through the mounting hole 76h of the external connecting busbar 76, is coupled to the mounting hole 31h of the first section 31, so that the first section 31 is physically and electrically connected to the external connecting busbar 76. (Second Section)

[0048] The second section 32 is a section that is connected to the busbar 42 (see Fig. 8) The second section 32 projects horizontally (for example, in the X direction) from the end of the first section 31 on the -Z direction side. The second section 32 is a plate section provided in the horizontal direction. The second section 32 borders the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second section 32 is attached in the Z direction to the fastening element 43 (for example, a screw or a bolt; see Fig. 8) is attached, projecting from the busbar 42 in the +Z direction, and is physically and electrically connected to the busbar 42. In the present embodiment, the second section 32 has a second mounting hole 32h through which the mounting element 43 passes. The second mounting hole 32h is open in the Z direction. In the second section 32, the mounting element 43, which will be described later, passes through the second mounting hole 32h. The coupling element 44 (for example, a nut; see Fig. 3) is coupled to the tip of the fastening element 43, which passes through the second fastening hole 32h, thereby fixing the second section 32 to the busbar 42. (Third Section)

[0049] The third section 33 is a standing wall (side wall) extending horizontally in the +Z direction from both ends of the second section 32. The third section 33 is a wall provided in the Z direction. The third section 33 is connected to the first section 31 and also to the second section 32. For example, the third section 33 extends diagonally to increase in the X direction (or Y direction) while running parallel in the -Z direction. The connecting component 30 does not need to include the third section 33. <3.3 Installation board>

[0050] Next, the routing board 40 will be described.

[0051] Fig. Figure 8 is a perspective view illustrating the routing board 40. The routing board 40 is a component that forms at least part of a power supply path between the plurality of electronic components 10 and / or at least part of a power supply path between the electronic component 10 and an external device. In the present disclosure, the “routing board” denotes a board-like routing structure. The term “board-like” denotes a plate-like shape along a plane when viewed as a whole, irrespective of any fine detail.In the present disclosure, the term "plate-shaped," "sheet-shaped," or "flat" shape is not limited to the case where it is completely flat and may include a case in which a fixing structure, a rib, or the like, projecting in the Z-direction, is partially present, a case in which a non-uniform shape, following the thickness of the busbar, is present on the surface, and the like. In the present embodiment, the routing board 40 has a plate-shaped form in the X and Y directions.

[0052] The routing board 40 includes, for example, a base plate 41, one or more (for example, a plurality of) busbars 42, and a plurality of fastening elements 43. In the present embodiment, the base plate 41 and the plurality of busbars 42 are integrated by insert forming. For example, the routing board 40 is formed as a single element by insert forming the busbar 42 with the base plate 41 after the fastening element 43 has been fixed to the busbar 42.

[0053] This means that the busbar 42 is integrated with the base plate 41 without the use of a fastening element such as a screw or bolt. Note that the routing plate 40 can also be formed by a different structure instead of an insert form. A modification example in which the routing plate 40 is formed by a different structure will be described later.

[0054] Fig. Figure 9 is a partially separated perspective view of the routing board 40. For the sake of simplicity, the base plate 41, the busbar 42 and the fastening element 43 are described below with reference to the drawings in which the routing board 40 is partially separated. (Base plate)

[0055] The base plate 41 is a retaining element that holds the majority of the busbars 42, arranged horizontally at intervals, in one piece. The base plate 41 is made, for example, of synthetic resin and has insulating properties. The base plate 41 electrically insulates the majority of the busbars 42 from each other. The base plate 41 is an example of a "base element." The base plate 41 can also be referred to as an "insulating substrate." The base plate 41 contains, for example, a flat surface section 51 and a plurality of fixing sections 52. The fixing section 52 will be described later.

[0056] The flat surface section 51 is a section formed in the base plate 41 in the form of a plate. The flat surface section 51 has the shape of a plate formed in the horizontal direction. The flat surface section 51 forms a main section of the base plate 41. The flat surface section 51 forms an (insulating) base section of the base plate 41. In the present embodiment, the flat surface section 51 extends over the entire width in the X direction of the base plate 41 and over the entire width in the Y direction of the base plate 41, with the exception of four corner sections of the base plate 41.

[0057] The flat surface section 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface oriented in the +Z direction. The first surface 51a is a flat surface provided in the horizontal direction. The first surface 51a faces the majority of electronic components 10 and is adjacent to the insulating cover 93 (see Fig. 1) facing the electrical connection unit 1. The second surface 51b is located on the side opposite the first surface 51a. The second surface 51b is a surface oriented in the -Z direction. The second surface 51b is a flat surface provided in the horizontal direction. The second surface 51b faces the metal plate 80 (see Fig. 1) The thickness direction (plate thickness direction) of the flat surface section 51 is the Z-direction.

[0058] The flat surface section 51 has, for example, one or more (e.g., a plurality of) receiving sections 55 in which the busbars 42 are each received. The plurality of receiving sections 55 are spaced apart from one another in the X or Y direction. Each of the receiving sections 55 is, for example, a through-hole that penetrates the flat surface section 51 in the Z direction. Note that the receiving section 55 can be a recess provided on the first surface 51a or the second surface 51b of the flat surface section 51 and is recessed in the Z direction, instead of a through-hole.In the present disclosure, the phrase “the receiving section penetrates the flat surface section in the first direction (Z-direction)” may include a case in which part of the total length of the receiving section 55 penetrates the flat surface section 51 in the Z-direction (for example, the remaining part of the receiving section 55 may be a recess in the Z-direction or be provided within the base plate 41 and not be exposed to the outside of the base plate 41).Similarly, in the present disclosure, the phrase “the receiving section is recessed in the first direction (Z direction)” may include a case in which part of the total length of the receiving section 55 is recessed in the Z direction (for example, a remaining part of the receiving section 55 may be a through hole penetrating the flat surface section 51 in the Z direction, or it may be provided within the base plate 41 and is not exposed to the outside of the base plate 41).

[0059] Each receiving section 55 has an outer shape that, viewed from the Z-direction, corresponds to the shape of the busbar 42 to be received. In the present embodiment, the flat surface section 51, for example, includes five receiving sections 55A, 55B, 55C, 55D, and 55E as the plurality of receiving sections 55. Receiving section 55A is provided to correspond to a busbar 42A, which will be described later, and receives the busbar 42A. Receiving section 55B is provided to correspond to a busbar 42B, which will be described later, and receives the busbar 42B. Receiving section 55C is provided to correspond to a busbar 42C, which will be described later, and receives the busbar 42C. Receiving section 55D is provided to correspond to a busbar 42D, which will be described later, and receives the busbar 42D.The receiving section 55E is provided in such a way that it corresponds to a busbar 42E, which will be described later, and accommodates the busbar 42E. (Busbar)

[0060] The busbar 42 is a routing element (electrical connection element) contained in the routing board 40. The busbar 42 is, for example, a routing element for electrically connecting a plurality of electronic components 10. Alternatively, the busbar 42 can also be a routing element for connecting the electronic component 10 to an external device. The busbar 42 is made of a metal (for example, copper or a copper alloy) and is conductive. In the present embodiment, the routing board 40 contains, for example, five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged such that they are positioned at intervals in the horizontal direction. The five busbars 42A, 42B, 42C, 42D and 42E contain sections that are arranged in the same plane.The five busbars 42A, 42B, 42C, 42D and 42E are held by the flat surface section 51 of the base plate 41.

[0061] At least a portion of each busbar 42 has a plate-like shape extending horizontally. At least a portion of each busbar 42 is received in the receiving section 55 and extends along the flat surface section 51. That is, at least a portion of each busbar 42 extends along the first surface 51a of the flat surface section 51. At least a portion of each busbar 42 extends horizontally within the receiving section 55. In the present embodiment, each busbar 42 has a plate-like shape extending horizontally over its entire length. Each busbar 42 is received in the receiving section 55 over its entire length and extends along the flat surface section 51.A section of each busbar 42 that is received into the receiving section 55 and extends along the flat surface section 51 may be referred to below as the "plate section 42p". The busbar 42 is an element that forms a horizontal power supply path. The busbar 42 may also be referred to as the "horizontal routing element".

[0062] Fig. Figure 10 is a top view to illustrate the routing board 40. The board section 42p of each busbar 42 has, for example, a first connecting section 61, a second connecting section 62 and an extending section 63.

[0063] The first connection section 61 is a section connected to a connection component 20 (hereinafter referred to as "first connection component 20"). The first connection component 20 is a connection component that connects an electronic component 10 (hereinafter referred to as "first electronic component 10") to the busbar 42. The first connection section 61 is a section of the busbar 42 that overlaps the first connection component 20 when viewed from the Z-direction. The first connection section 61 is adjacent to the first connection component 20 in the Z-direction and is connected to the first connection component 20 in the Z-direction.

[0064] The second connection section 62 is a section that is connected to another connection component 20 (hereinafter referred to as "second connection component 20"). The second connection component 20 is a connection component that connects another electronic component 10 (hereinafter referred to as "second electronic component 10"), which is contained within the majority of the electronic components 10, to the busbar 42. The second connection section 62 is a section of the busbar 42 that overlaps the second connection component 20 when viewed from the Z-direction. The second connection section 62 is adjacent to the second connection component 20 in the Z-direction and is connected to the second connection component 20 in the Z-direction.

[0065] Note that the second connection section 62, instead of the example above, can also be a section connected to another connection component 30 (hereinafter referred to as "second connection component 30"). The connection component 30 is a connection component for connecting an external device to the busbar 42. In this case, the second connection section 62 is a section of the busbar 42 that overlaps the second connection component 30 as viewed from the Z-direction. The second connection section 62 is adjacent to the second connection component 30 in the Z-direction and is connected to the second connection component 30 in the Z-direction.

[0066] The second connection section 62 can be a section that is in contact with the coupling busbar 75 in order to be connected to a different subunit SU instead of the connection components 20 and 30. In this case, the second connection section 62 is a section of the busbar 42 that overlaps the coupling busbar 75 when viewed from the Z-direction. The second connection section 62 is adjacent to the coupling busbar 75 in the Z-direction and is connected to the coupling busbar 75 from the Z-direction.

[0067] The extending section 63 extends from the first connecting section 61 in the X-direction or in the Y-direction. The extending section 63 is provided between the first connecting section 61 and the second connecting section 62. The extending section 63 extends over the first connecting section 61 and the second connecting section 62. The extending section 63 connects the first connecting section 61 with the second connecting section 62.

[0068] In the present embodiment, the first connecting section 61, the second connecting section 62, and the extending section 63 have a plate-like shape formed in the horizontal direction. In the present embodiment, each busbar 42 is received in the receiving section 55 at least above the first connecting section 61 and the second connecting section 62 and extends along the flat surface section 51. For example, the first connecting section 61, the second connecting section 62, and the extending section 63 are received in the receiving section 55 and extend along the flat surface section 51.

[0069] In the present embodiment, the extending sections 63 of some busbars 42 are received in the receiving section 55 such that they extend over both sides of a region R, specifically through the region R that overlaps the electronic component 10 when viewed from the Z direction. For example, the extending section 63 extends linearly in the X direction. The extending section 63 extends over a region R that overlaps the electronic component 10 when viewed from the Z direction, over both the +X-direction and -X-direction sides of region R. That is, the busbar 42 is received in the receiving section 55 in such a way that it can easily be routed along a better path (for example, a path with a shorter distance) without being obstructed by the presence of the electronic component 10.

[0070] The one or more busbars 42 may, in addition to the first connecting section 61, the second connecting section 62, and the extending section 63, have an extension 64. The extension 64 is a section in which the busbar 42 extends to increase a heat dissipation area and / or to increase heat storage capacity (heat absorption). The extension 64 is a section that is not used for electrical connections. For example, the extension 64 is located on the side opposite the extending section 63 with respect to the first connecting section 61 (or the second connecting section 62). The extension 64 has a plate-like shape formed in the horizontal direction. The extension 64 is received in the receiving section 55 and extends along the flat surface section 51.The extension 64 extends to the region R, which overlaps the electronic component 10 as seen from the Z direction, and has an end 42e1 of the busbar 42 at a position which overlaps the electronic component 10 as seen from the Z direction.

[0071] Some routing examples for the busbar 42 are described below. The majority of electronic components 10 contain three electronic components 10A, 10B, and 10C. Electronic components 10A and 10B are, for example, type 10M. Electronic component 10C is, for example, type 10N. Note that the type of electronic component 10 is not limited to the example above. The majority of connection components 20 contain six connection components 20A, 20B, 20C, 20D, 20E, and 20F. The majority of connection components 30 contain two connection components 30A and 30B. The majority of coupling busbars 75 contain two coupling busbars 75A and 75B. The majority of the external connecting busbars 76 contain two external connecting busbars 76A and 76B. (First installation example)

[0072] First, a routing example for busbar 42A is described. Busbar 42A has a first connection section 61, a second connection section 62, and an extending section 63. Viewed from the Z-direction, the first connection section 61 is located in the +X direction relative to electronic component 10A. The first connection section 61 is electrically connected to terminal 13A of electronic component 10A via connection component 20A, which is the first connection component 20. Viewed from the Z-direction, the second connection section 62 is located in the -X direction relative to electronic component 10A. The second connection section 62 is electrically connected to another subunit SU via the coupling busbar 75A.

[0073] Extending section 63 is received in receiving section 55 such that, viewed from the Z-direction, it extends over both sides of region R through region R, which overlaps electronic component 10A. For example, extending section 63 extends linearly in the X-direction. Extending section 63 extends over region R, which overlaps electronic component 10A viewed from the Z-direction, over the +X-direction side and the -X-direction side of region R. Busbar 42A is an example of a "first busbar." Receiving section 55A, which receives busbar 42A, is an example of a "first receiving section." Busbar 42A is, for example, a busbar contained in the positive electrode line PL, which is connected to electrical connection unit 1. (Second installation example)

[0074] Next, an installation example for busbar 42B is described. Busbar 42B has the first connection section 61, the second connection section 62, the extending section 63, and the extension 64. The first connection section 61 is electrically connected to terminal 13B of electronic component 10A via connection component 20B, which is the first connection component 20. The second connection section 62 is electrically connected to the external connection busbar 76A via connection component 30A, which is the second connection component 30. The extension 64 extends to region R, which overlaps electronic component 10A as viewed from the Z-direction, and has an end 42e1 of busbar 42 at a position that overlaps electronic component 10A.Similar to busbar 42A, busbar 42B can also have an extending section 63 that, viewed from the Z-direction, extends through region R, which overlaps electronic component 10, and across both sides of region R. Busbar 42B is another example of a "first busbar." The receiving section 55B, which receives busbar 42B, is another example of a "first receiving section." From another perspective, busbar 42B is an example of a "second busbar." The receiving section 55B is another example of a "second receiving section." For example, busbar 42B is a busbar contained within the positive electrode line PL, which is connected to the electrical connection unit 1. (Third laying example)

[0075] Next, an installation example for busbar 42C is described. Busbar 42C contains the first connecting section 61, the second connecting section 62, the extending section 63, and the extension 64. The first connecting section 61 is electrically connected to terminal 13B of electronic component 10B via connecting component 20C, which is the first connecting component 20. The second connecting section 62 is electrically connected to another subunit SU via coupling busbar 75B. The extension 64 extends to region R, which overlaps electronic component 10B as viewed from the Z-direction, and has an end 42e1 of busbar 42 at a position that overlaps electronic component 10B as viewed from the Z-direction. Busbar 42C is another example of a "first busbar".The receiving section 55C, which receives the busbar 42C, is another example of a "first receiving section". Busbar 42C, for example, is a busbar contained in the negative electrode line NL, which is connected to the electrical connection unit 1. From another perspective, busbar 42C is an example of a "third busbar". Receiving section 55C is an example of a "third receiving section". (Fourth laying example)

[0076] Next, an installation example for busbar 42D is described. Busbar 42D has a first connection section 61, a second connection section 62, and an extending section 63. The first connection section 61 is electrically connected to terminal 13A of electronic component 10B via connection component 20D, which is the first connection component 20. The second connection section 62 is electrically connected to terminal 13B of electronic component 10C via connection component 20E, which is the second connection component 20. Busbar 42D is another example of a "first busbar." The receiving section 55D, in which busbar 42D is received, is another example of a "first receiving section."Busbar 42D, for example, is a busbar contained within the negative electrode line NL, which is connected to the electrical connection unit 1. From another perspective, busbar 42D is another example of a "third busbar." Receiver section 55D is another example of a "third receiver section." (Fifth laying example)

[0077] Next, an installation example for busbar 42E is described. Busbar 42E has a first connection section 61, a second connection section 62, and an extending section 63. The first connection section 61 is electrically connected to terminal 13A of electronic component 10C via connection component 20F, which is the first connection component 20. The second connection section 62 is electrically connected to the external connection busbar 76B via connection component 30B, which is the second connection component 30. Busbar 42E is another example of a "first busbar." The receiving section 55E, in which busbar 42E is received, is another example of a "first receiving section."Busbar 42E, for example, is a busbar contained within the negative electrode line NL, which is connected to the electrical connection unit 1. From another perspective, busbar 42E is another example of a "third busbar." Receiver section 55E is another example of a "third receiver section." (fastening element)

[0078] Next, the fastener 43 will be installed. Fig. 9 described. The fastening element 43 is a component for fixing the busbar 42 to a connection target component (the connection component 20, the connection component 30, the coupling busbar 75 or a connection component 100) of the busbar 42. The fastening element 43 is, for example, a crimping bolt fixed to the busbar 42. The fastening element 43 is, for example, a “fastening section”.

[0079] In the present embodiment, the first connecting section 61 and the second connecting section 62 of the busbar 42 each have a through-hole 42h. The through-hole 42h penetrates the busbar 42 in the Z-direction. The fastening element 43 is, for example, a bolt with a shank 43a and a head 43b. A circumferential surface of the shank 43a has a groove for the screw. The head 43b has a diameter larger than that of the shank 43a. The head 43b of the fastening element 43 is riveted and fixed to the busbar 42 in such a way that the shank 43a passes through the through-hole 42h of the busbar 42. With this fixing, the fastening element 43 is electrically and physically connected to the busbar 42, in a state in which the shaft 43a protrudes in the +Z direction from the through hole 42h of the busbar 42.The fastening element 43 is not limited to fixing by riveting, but can also be fixed to the busbar 42 by welding or other methods.

[0080] In the present embodiment, the connecting component 20 is attached to the fastening element 43 in the Z-direction after it has been previously fixed to the electronic component 10 via the fastening element 72 or the fastening element 71. For example, in the connecting component 20, the shaft 43a of the fastening element 43 is inserted into the fastening hole 22h of the second section 22. The coupling element 44 (for example, a nut) is connected to the shaft 43a of the fastening element 43, which protrudes from the fastening hole 22h of the second section 22 of the connecting component 20. The coupling element 44 is, for example, attached to the shaft 43a in the Z-direction. This coupling secures the second section 22 of the connecting component 20 to the fastening element 43. <4 Metal plate, insulating film, heat transfer element and insulating cover>

[0081] Next, the metal plate 80, the insulating film 91, the heat transfer element 92 and the insulating cover 93 are described. <4.1 Metal plate>

[0082] Fig. Figure 11 is a partially unfolded perspective view of the electrical connection unit 1. The metal plate 80 is an element for ensuring the rigidity of the electrical connection unit 1 and for improving its heat dissipation properties. The metal plate 80 is made of a metal (for example, aluminum or an aluminum alloy). The metal plate 80 can also be referred to as a "rigid element".

[0083] The metal plate 80 has a rectangular shape formed in the X direction, viewed from the Z direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of ends of the metal plate 80 in the longitudinal direction and are separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of ends of the metal plate 80 in the lateral direction, separated from each other in the Y direction. The metal plate 80 includes, for example, a flat surface section 81, a plurality of fixing sections 82, and a plurality of fixing sections 83.

[0084] The flat surface section 81 is a section formed in the metal plate 80 in a plate-like shape. The flat surface section 81 has a plate-like shape formed in the horizontal direction. The flat surface section 81 forms a main section of the metal plate 80. The flat surface section 81 forms a base section (metal base section) of the metal plate 80. In the present embodiment, the flat surface section 81 has a size that covers the three subunits SU from below. The flat surface section 81 faces the laying plates 40 of the three subunits SU. In the present embodiment, the metal plate 80 forms a gap S1 (see Fig. 13) with the second surface 51b of the flat surface section 51 of each subunit SU and is facing the second surface 51b of the flat surface section 51 of each subunit SU. The gap S1 is an example of a ‘first gap’.

[0085] The fixing section 82 is a section for fixing the base plate 41 of each subunit SU to the metal plate 80. The fixing section 82 is provided in a position that, viewed from the Z-direction, corresponds to the fixing section 52 of the base plate 41 of each subunit SU. The fixing section 82 is a cylindrical or prismatic projection that extends in the +Z direction from the flat surface section 81 of the metal plate 80. The fixing section 82 is described in detail later.

[0086] The fixing section 83 is a fixing section for directly fixing the electronic component 10 of each subunit SU to the metal plate 80 without the intermediate base plate 41. The fixing section 83 is provided in a position corresponding to the mounting section 14 of the electronic component 10 of each subunit SU when viewed from the Z-direction. The fixing section 83 is a cylindrical or prismatic projection that extends from the flat surface section 81 in the +Z direction. The fixing section 83 is described in detail later. <4.2 Insulating film>

[0087] The insulating foil 91 is an insulator for the electrical insulation of the metal plate 80 and the busbar 42 of each subunit SU. The insulating foil 91 consists, for example, of a synthetic resin such as polyester or polyimide and has insulating properties. Viewed from the Z-direction, the insulating foil 91 has a rectangular shape. The insulating foil 91 has a sheet-like shape formed in the horizontal direction. The insulating foil 91 is arranged between the flat surface section 81 of the metal plate 80 and the busbar 40 of each subunit SU. For example, the insulating foil 91 is arranged between the flat surface section 81 of the metal plate 80 and the majority of the heat transfer elements 92.

[0088] In the present embodiment, the insulating film 91 is attached to the flat surface section 81 of the metal plate 80. The insulating film 91 has a notch or opening to bypass the fixing section 82 and the fixing section 83 of the metal plate 80. Note that instead of the above example, the insulating film 91 can also be provided between the routing board 40 of each subunit SU and the plurality of heat transfer elements 92. Note that if the heat transfer element 92 has an insulating property and the necessary insulating property is ensured by the heat transfer element 92, the insulating film 91 can be omitted. <4.3 Heat transfer element>

[0089] The heat transfer element 92 is an element for transferring the heat generated by the electronic component 10 at the time of energy supply and / or the heat generated by the busbar 42 itself at the time of energy supply (Joule heat) to the metal plate 80. The heat transfer element 92 is, for example, a heat transfer film (for example, a thermally conductive silicone film) that is elastic. The heat transfer element 92 is made, for example, of a material with a higher thermal conductivity than that of the base plate 41. However, the heat transfer element 92 is not limited to the above example, but can also be a heat transfer element made of a thermally conductive gel or another material.

[0090] Fig. Figure 12 is a bottom view illustrating the routing board 40. In the present embodiment, the majority of the heat transfer elements 92 are partially provided in the routing board 40. For example, the majority of the heat transfer elements 92 are arranged in positions that overlap a portion of the busbar 42 when viewed from the Z-direction. More precisely, the majority of the heat transfer elements 92 are arranged in positions that overlap a portion of the busbar 42 near the electronic component 10 (for example, electronic components 10A and 10B) when viewed from the Z-direction. In the present embodiment, the majority of the heat transfer elements 92 are arranged in positions that overlap the connecting component 20 when viewed from the Z-direction.

[0091] Fig. 13 is a cross-sectional view along line F13-F13 of the in Fig. The structure is illustrated in Figure 10. In the present embodiment, the heat transfer element 92 is arranged between the metal plate 80 and the busbar 42. The heat transfer element 92 transfers the heat transferred from the electronic component 10 to the busbar 42 and / or the heat generated by the busbar 42 from the busbar 42 to the metal plate 80.

[0092] In the present embodiment, part of the heat transfer element 92 is in contact with the busbar 42 at a position that overlaps the connecting component 20 when viewed from the Z-direction. In this case, the heat transfer element 92 easily transfers the heat transferred from the terminal 13 of the electronic component 10 to the connecting component 20 from the connecting component 20 via the busbar 42 to the metal plate 80.

[0093] In the present embodiment, part of the heat transfer element 92 is arranged in a position that overlaps the head 43b of the fastening element 43 when viewed from the Z-direction and is in contact with the head 43b of the fastening element 43. In this case, the heat transfer element 92 easily transfers the heat transferred from the terminal 13 of the electronic component 10 to the connecting component 20 from the fastening element 43 to the metal plate 80.

[0094] In the present embodiment, part of the heat transfer element 92 is in contact with the busbar 42 at a position that overlaps the electronic component 10 when viewed from the Z-direction. In this case, the heat transfer element 92 readily transfers the heat transferred from the electronic component 10 to the busbar 42 from the busbar 42 to the metal plate 80. In the Fig. In the illustrated example 13, the upper surface of the busbar 42 is in contact with the electronic component 10, and thus the busbar 42 is thermally connected to the electronic component 10. Note that the busbar 42 can be thermally connected to the electronic component 10 at the extending section 63 or at the extension 64. (Modification example)

[0095] Fig. Figure 14 is a cross-sectional view illustrating a modification example. In this modification example, an air gap AS, forming a gap, is located between the busbar 42 and the electronic component 10. The busbar 42 is thermally connected to the electronic component 10 via the air gap AS. According to this configuration, the heat generated by the electronic component 10 is transferred to the busbar 42 through the air gap AS. The heat transferred to the busbar 42 is then transferred to the metal plate 80 via the heat transfer element 92 and dissipated. (Modification example)

[0096] Fig. Figure 15 is a cross-sectional view illustrating another modification example. In this modification example, a heat transfer element 98 is provided between the busbar 42 and the electronic component 10. The heat transfer element 98 is arranged between the busbar 42 and the electronic component 10 in the Z-direction. The busbar 42 is thermally connected to the electronic component 10 via the heat transfer element 98. The heat transfer element 98 transfers the heat generated by the electronic component 10 to the busbar 42. The heat transfer element 98 is, for example, a heat transfer film (e.g., a thermally conductive silicone film) that is elastic. However, the heat transfer element 98 is not limited to the above example but can also be a heat transfer element made of a thermally conductive gel or another material.According to this design, the heat generated by the electronic component 10 is efficiently transferred to the busbar 42 via the heat transfer element 98. The heat transferred to the busbar 42 is then transferred to the metal plate 80 via the heat transfer element 92 and dissipated. <4.4 Insulating cover>

[0097] Referring to Fig. Section 1 describes the insulating cover 93. The insulating cover 93 prevents the main body MU from coming into contact with the energy supply path. The insulating cover 93 is made, for example, of a synthetic resin and has insulating properties. The insulating cover 93 has, for example, a box-shaped form that is open on the -Z side. The insulating cover 93 has a plurality of vent holes 93h. The insulating cover 93 is attached to the metal plate 80 in the Z direction. Note that the insulating cover 93 is not limited to a box-shaped form, but can also be a sheet-like element that covers the energy supply path of the main body MU. <5. Busbar exposure structure>

[0098] Next, an exposure structure of busbar 42 is described. <5.1 Exposure structure on the upper surface side of the busbar>

[0099] First, an exposure structure is created on the upper surface side of the busbar 42 with reference to Fig. 8 described. In the present embodiment, at least a part of the extending section 63 of the busbar 42 is exposed towards the outside of the base plate 41 on the upper surface side (the first surface side 51a of the flat surface section 51). For example, the extending section 63 of the busbar 42 is exposed towards the outside of the base plate 41 on the upper surface side at least in a part of region R (see Fig. 10) exposed, overlapping the electronic component 10 as seen from the Z direction.

[0100] In the present embodiment, the busbar 42 is received in the receiving section 55 at least over its entire length between the first connecting section 61 and the second connecting section 62 and extends along the first surface 51a of the flat surface section 51. The busbar 42 is exposed to the outside on the upper surface side of the base plate 41 at least over its entire length between the first connecting section 61 and the second connecting section 62.

[0101] In the present embodiment, the busbar 42 is received in the receiving section 55 over its entire length and extends along the first surface 51a of the flat surface section 51. The busbar 42 is exposed on its upper surface side over its entire length towards the outside of the base plate 41.

[0102] As in Fig. As illustrated in Figure 13, at least part of the extending section 63 of the busbar 42 is exposed not only on the upper surface side but also on the lower surface side (second surface side 51b) towards the outside of the base plate 41. For example, the busbar 42 is exposed along its entire length on the lower surface side towards the outside of the base plate 41. (Modification example)

[0103] Fig. Figure 16 is a cross-sectional view illustrating a modification example. In this modification example, the flat surface section 51 of the base plate 41 has a cover section 51v that covers at least part of the extending section 63 of the busbar 42 on the lower surface side (second surface side 51b). In the region covered by the cover section 51v, the busbar 42 is not exposed to the lower surface side. The cover section 51v can be provided over the entire length of the busbar 42. Note, for example, that the cover section 51v need not be provided in a region that overlaps the heat transfer element 92 as viewed from the Z-direction. <5.2 Exposure structure on the lower surface side of the busbar>

[0104] Next, an exposure structure will be created on the lower surface side of busbar 42 with reference to Fig. 13 described. In the present embodiment, the plate section 42p of the busbar 42 includes an exposed section 42u, which is exposed towards the outside of the base plate 41 on the lower surface side (the second surface side 51b of the flat surface section 51). In the present embodiment, the exposed section 42u of the busbar 42 extends over the entire length of the busbar 42. In the present embodiment, the heat transfer element 92 is arranged between the exposed section 42u of the busbar 42 and the metal plate 80. For example, the heat transfer element 92 is in contact with the exposed section 42u of the busbar 42.

[0105] In the present embodiment, at least a portion of the exposed section 42u of the busbar 42 is provided in a region that overlaps the connecting component 20 when viewed from the Z-direction. At least a portion of the heat transfer element 92 overlaps the exposed section 42u of the busbar 42 in a region that overlaps the connecting component 20 when viewed from the Z-direction. For example, at least a portion of the heat transfer element 92 is in contact with the exposed section 42u of the busbar 42 in a region that overlaps the connecting component 20 when viewed from the Z-direction.

[0106] In the present embodiment, the exposed section 42u of the busbar 42 includes a first section 42ua, which is arranged in a region that overlaps the connecting component 20 as seen from the Z direction, and a second section 42ub, which is arranged in a region that overlaps the electronic component 10 as seen from the Z direction.

[0107] The heat transfer element 92 comprises a first heat transfer section 92a and a second heat transfer section 92b. The first heat transfer section 92a overlaps the first section 42ua of the exposed section 42u of the busbar 42 in a region that overlaps the connecting component 20 as viewed from the Z direction. For example, the first heat transfer section 92a is in contact with the first section 42ua of the exposed section 42u of the busbar 42. On the other hand, the second heat transfer section 92b overlaps the second section 42ub of the exposed section 42u of the busbar 42 in a region that overlaps the electronic component 10 as viewed from the Z direction. For example, the second heat transfer section 92b is in contact with the second section 42ub of the exposed section 42u of the busbar 42.

[0108] As described above, at least part of the extending section 63 of the busbar 42 is exposed not only on the lower surface but also on the upper surface (first surface 51a) towards the outside of the base plate 41. For example, the busbar 42 is exposed along its entire length on the upper surface towards the outside of the base plate 41. For example, the second section 42ub of the exposed section 42u of the busbar 42 is exposed not only on the lower surface but also on the upper surface towards the outside of the base plate 41 and faces the electronic component 10. (Modification example)

[0109] Fig. Figure 17 is a cross-sectional view illustrating a modification example. In this modification example, the flat surface section 51 of the base plate 41 has a cover section 51v that covers at least part of the extending section 63 of the busbar 42 on the surface side (first surface side 51a). In the region covered by the cover section 51v, the busbar 42 is not exposed on the surface side. Note that the cover section 51v can be provided over the entire length of the busbar 42. Note, for example, that the cover section 51v does not have to be provided in a region that overlaps the first connecting section 61 and the second connecting section 62 as viewed from the Z-direction. <6. Three-dimensional busbar routing structure>

[0110] Next, a three-dimensional routing structure CS of busbar 42 is described.

[0111] Fig. Figure 18 is a perspective view illustrating the three-dimensional laying structure CS of busbar 42. Fig. Figure 19 is a top view illustrating the three-dimensional routing structure CS of the busbar 42. The three-dimensional routing structure CS contains a busbar 42F, a busbar 42G, a busbar 42H, and a busbar 42I, as a plurality of busbars 42. Furthermore, the three-dimensional routing structure CS contains a plurality of connecting components 100. Additionally, the three-dimensional routing structure CS contains a coupling busbar 75C and a coupling busbar 75D, as a plurality of coupling busbars 75.

[0112] Busbar 42F and busbar 42G are examples of busbars 42 contained in subunit SUY. The flat surface section 51 of the base plate 41 of subunit SUY contains a receiving section 55F and a receiving section 55G, as the plurality of receiving sections 55. Busbar 42F is received in receiving section 55F and extends along flat surface section 51. Busbar 42G is received in receiving section 55G and extends along flat surface section 51. Busbar 42F is an example of a "first busbar." The receiving section 55F, which receives busbar 42F, is an example of a "first receiving section." Busbar 42G is an example of a "fourth busbar." The receiving section 55G, which receives busbar 42G, is an example of a "fourth receiving section."Busbar 42F and busbar 42G are the busbars 42 located in the first layer (lower layer) of the three-dimensional installation structure CS.

[0113] In the present embodiment, the busbar 42F comprises a first section 42Fa extending in the X direction and a second section 42Fb, which is bent from the first section 42Fa and extends in the Y direction. The second section 42Fb extends along a boundary B between subunit SUY and subunit SUZ.

[0114] On the other hand, busbar 42H and busbar 42I, for example, are the busbars 42 contained in subunit SUZ. The flat surface section 51 of the base plate 41 of subunit SUZ contains a receiving section 55H and a receiving section 55I as a plurality of receiving sections 55. Busbar 42H is received in receiving section 55H and extends along the flat surface section 51. Busbar 42I is received in receiving section 55I and extends along the flat surface section 51. Busbar 42H and busbar 42I are the busbars 42 located in the first layer (bottom layer) of the three-dimensional installation structure CS.

[0115] The connecting component 100 has the same structure as the connecting component 30 described above for the external connection. For example, the connecting component 100 has a first section 101, a second section 102, and a third section 103. For details of the connecting component 100, in the above description of connecting component 30, "connecting component 30" can be replaced by "connecting component 100", "first section 31" can be replaced by "first section 101", "first mounting hole 31h" can be replaced by "first mounting hole 101h", "second section 32" can be replaced by "second section 102", "second mounting hole 32h" can be replaced by "second mounting hole 102h", and "third section 33" can be replaced by "third section 103". The connecting component 100 is an element that forms an energy supply path in a vertical direction.The connecting component 100 can be described as a “vertical installation element”.

[0116] The majority of connection components 100 contain a connection component 100A and a connection component 100B. Connection component 100A overlaps the second connection section 62 of busbar 42G in subunit SUY, viewed from the Z-direction. Connection component 100A borders the second connection section 62 of busbar 42G in the Z-direction and is connected to it from the Z-direction. Connection component 100A projects from busbar 42G in the +Z-direction. Connection component 100A is an example of a "third connection component".

[0117] The connecting component 100B overlaps the second connecting section 62 of the busbar 42I in the subunit SUZ, viewed from the Z-direction. The connecting component 100B is adjacent to the second connecting section 62 of the busbar 42I in the Z-direction and is connected to it from the Z-direction. The connecting component 100B projects from the busbar 42I in the +Z-direction.

[0118] One end of the coupling busbar 75C is adjacent to the second connection section 62 of busbar 42F in the Z-direction and is connected to the second connection section 62 of busbar 42F from the Z-direction in subunit SUY. The other end of the coupling busbar 75C lies next to the second connection section 62 of busbar 42H in the Z-direction and is connected to the second connection section 62 of busbar 42H from the Z-direction in subunit SUZ. In this configuration, busbar 42F of subunit SUY and busbar 42H of subunit SUZ are electrically connected via the coupling busbar 75C. The coupling busbar 75C is busbar 75, which is located in the first layer (bottom layer) of the three-dimensional installation structure CS.

[0119] On the other hand, the coupling busbar 75D in subunit SUY is adjacent to the first section 101 of the connecting component 100A in the Z direction and is connected to the first section 101 of the connecting component 100A from the Z direction. The other end of the coupling busbar 75D is adjacent to the first section 101 of the connecting component 100B in the Z direction in subunit SUZ and is connected to the first section 101 of the connecting component 100B from the Z direction.

[0120] The coupling busbar 75D is supported at a position remote from busbar 42F in the Z-direction by the first section 101 of connection component 100A and the first section 101 of connection component 100B. The coupling busbar 75D is supported by the first section 101 of connection component 100A and the first section 101 of connection component 100B and extends horizontally (for example, in the X-direction). The coupling busbar 75D is electrically connected to the first section 101 of connection component 100A and the first section 101 of connection component 100B. In this configuration, busbar 42F of subunit SUY and busbar 42I of subunit SUZ are electrically connected via the two connection components 100 and the coupling busbar 75D. The coupling busbar 75D is an example of a "fifth busbar".

[0121] In the present embodiment, the coupling busbar 75D extends such that it spans the second section 42Fb of the busbar 42F at a position remote from the busbar 42F in the +Z direction. This creates a three-dimensional, intersecting structure formed by the coupling busbar 75D and the busbar 42F. In the present embodiment, the coupling busbar 75D extends such that it spans the boundary B of the majority of the subunits SU.

[0122] In the present embodiment, the three-dimensional routing structure CS of the busbar 42 is provided at a position spanning the boundary B of the plurality of subunits SU. According to this arrangement, the coupling structure between the plurality of subunits SU is reinforced by the three-dimensional routing structure CS. Note that the three-dimensional routing structure CS of the busbar 42 can be provided inside one or more subunits SU instead of being provided at the boundary B of the plurality of subunits SU. <7. Fixing Structure>

[0123] Next, a fixing structure of the subunit SU is described. <7.1 Structure of the metal plate>

[0124] Fig. 20 is a cross-sectional view along the line F20-F20 of the in Fig. 10 illustrated structure. As described above, the metal plate 80 contains the fixing section 82 and the fixing section 83.

[0125] The fixing section 82 is a projection that extends in the +Z direction from the flat surface section 81 of the metal plate 80. For example, the fixing section 82 extends in the +Z direction from the first surface 51a of the flat surface section 51 of the base plate 41. In the present embodiment, the fixing section 82 extends further in the +Z direction than the fixing section 83 described later. The fixing section 82 faces the fixing section 52 of the base plate 41 in the Z direction. The fixing section 82 has a coupling hole 82h that is open in the +Z direction. An inner circumferential surface of the coupling hole 82h has a groove for the screw. The fixing section 82 is an example of a "first fixing section." The coupling hole 82h is an example of a "first coupling hole."

[0126] The fixing section 83 is a projection that extends from the flat surface section 81 in the +Z direction. The fixing section 83 is inserted into a through-hole 51h (described later) in the flat surface section 51 of the base plate 41. For example, the fixing section 83 passes through the through-hole 51h of the flat surface section 51 and projects at the same position as, or beyond, a position of the first surface 51a of the flat surface section 51 (a position on the +Z-direction side with respect to the first surface 51a). The fixing section 83 faces the mounting section 14 of the electronic component 10 in the Z direction. The fixing section 83 has a coupling hole 83h that is open in the +Z direction. An inner circumferential surface of the coupling hole 83h has a groove for the screw.Fixing section 83 is an example of a "second fixing section". Coupling hole 83h is an example of a "second coupling hole".

[0127] A fastening element 112 (for example, a screw or a bolt) passes through the mounting hole 14h of the mounting section 14 of the electronic component 10 from the +Z direction side. When the fastening element 112, passing through the mounting hole 14h of the mounting section 14 of the electronic component 10, engages in the coupling hole 83h of the fixing section 83 of the metal plate 80, the electronic component 10 is fixed to the metal plate 80 without the intermediate base plate 41. The fastening element 112 is an example of a "second fastening element". <7.2 Structure of the installation board>

[0128] The base plate 41 is fixed to the fixing section 82 of the metal plate 80 by the fixing section 52. The fixing section 52 contains, for example, a vertical plate section 52a and a horizontal plate section 52b.

[0129] The vertical plate section 52a extends in the +Z direction from the end of the flat surface section 51 of the base plate 41. The vertical plate section 52a is a plate section provided in the Y and Z directions. The thickness direction of the vertical plate section 52a is the X direction.

[0130] The horizontal plate section 52b extends horizontally from the end of the upright plate section 52a in the +Z direction. The horizontal plate section 52b is a plate section that is provided in a horizontal direction. The horizontal plate section 52b faces the fixing section 82 of the metal plate 80 in the Z direction. The horizontal plate section 52b has an insertion hole 52h that faces the coupling hole 82h of the fixing section 82 of the metal plate 80. A fastener 111 (for example, a screw or a bolt) passes through the insertion hole 52h. When the fastener 111, which passes through the insertion hole 52h of the fixing section 52 of the base plate 41, engages in the coupling hole 82h of the fixing section 82 of the metal plate 80, the base plate 41 is fixed to the metal plate 80. Fastener 111 is an example of a “first fastener”.

[0131] The flat surface section 51 of the base plate 41 has the through-hole 51h described above. The through-hole 51h penetrates the flat surface section 51 in the Z-direction. The through-hole 51h is positioned corresponding to the fixing section 83 of the metal plate 80 when viewed from the Z-direction. The fixing section 83 of the metal plate 80 passes through the through-hole 51h of the base plate 41 and protrudes at the same position as the first surface 51a of the flat surface section 51, or laterally in the +Z-direction with respect to the first surface 51a of the flat surface section 51. The fastening section 14 of the electronic component 10 is fixed to the fixing section 83 in the same position as the first surface 51a of the flat surface section 51 or at a position on the side of the +Z direction with respect to the first surface 51a of the flat surface section 51. <8. Heat dissipation path in relation to the fixing structure>

[0132] Next, a heat dissipation path is described that is associated with the fixing section 83 of the metal plate 80.

[0133] Fig. Figure 21 is a cross-sectional view illustrating a heat dissipation path with respect to the fixing section 83 of the metal plate 80. In the present embodiment, the fixing section 83 of the metal plate 80 is not in contact with a high-temperature section (for example, the terminal 13) of the electronic component 10. In the present embodiment, a gap S2 is provided between the inner circumferential surface 51ha of the through-hole 51h of the base plate 41 and the fixing section 83, through which air can flow. For example, the through-hole 51h can be largely open, such that a portion of the through-hole 51h does not overlap the mounting section 14 of the electronic component 10 when viewed from the Z-direction (so that a portion of the through-hole 51h is located on the outer circumferential side of the mounting section 14 when viewed from the Z-direction). The fixing section 83 is an example of a "protruding section".

[0134] In the present embodiment, the temperature of the fixing section 83 of the metal plate 80 tends to be lower than the temperature of the busbar 42. In this case, convection occurs due to a temperature difference between the fixing section 83 (low temperature) of the metal plate 80 and the busbar 42 (high temperature).

[0135] In particular, in response to the generation of an upward flow of warm air (see arrow A1) around the busbar 42, a downward flow (see arrow A2) is generated. This downward flow passes through the through-hole 51h of the base plate 41 and is directed downwards from the base plate 41 around the fixing section 83 of the metal plate 80. When the downward flow is generated, an upward flow (see arrow A3) is created by being forced out by the air moving in the downward flow. This upward flow is generated near the inner circumferential surface 51ha of the through-hole 51h to move warm air upwards (outside the gap S1) in the gap S1 between the metal plate 80 and the base plate 41. This prevents the warm air from becoming trapped in the gap S1 between the metal plate 80 and the base plate 41 and promotes heat dissipation from the electrical connection unit 1. (Modification example)

[0136] Fig. Figure 22 is a cross-sectional view illustrating a modification example of a heat dissipation path. In this modification example, the metal plate 80 has a protruding section 84 instead of, or in addition to, the fixing section 83. The protruding section 84 is a heat dissipation section. The protruding section 84 need not be used for the fixing structure. The protruding section 84 is a cylindrical or prismatic projection extending in the +Z direction from the flat surface section 81 of the metal plate 80. The protruding section 84 is inserted into the through-hole 51h of the flat surface section 51 of the base plate 41.For example, the protruding section 84 passes through the through hole 51h of the flat surface section 51 and protrudes into the same position as the first surface 51a of the flat surface section 51 or protrudes beyond a position of the first surface 51a of the flat surface section 51 (a position on the side of the +Z direction with respect to the first surface 51a).

[0137] According to the setup of the present modification example, the temperature of the protruding section 84 of the metal plate 80 tends to be lower than the temperature of the busbar 42. In this case, convection occurs due to a temperature difference between the protruding section 84 (low temperature) of the metal plate 80 and the busbar 42 (high temperature). This generates air currents, indicated by arrows A1 to A3 as described above, and promotes heat dissipation from the electrical connection unit 1. <9. Absorption structure for thermal expansion / contraction in relation to the fixing structure>

[0138] Next, an absorption structure for thermal expansion / contraction is described in relation to the fixing structure.

[0139] Fig. Figure 23 is a cross-sectional view illustrating an absorption structure for thermal expansion / contraction with respect to the fixing section 82. In the present embodiment, the routing plate 40 of the subunit SUX includes the base plate 41 and the busbar 42. The flat surface section 51 of the base plate 41 has the receiving section 55, which receives the busbars 42. The fixing section 52 of the base plate 41 includes the vertical plate section 52a, which extends from the flat surface section 51 in the Z-direction, and the horizontal plate section 52b, which extends horizontally from the end of the vertical plate section 52a in the +Z-direction. The horizontal plate section 52b is positioned differently from the first surface 51a in the Z-direction. The horizontal plate section 52b has the insertion hole 52h through which the fastening element 111 passes.The horizontal plate section 52b is fixed to the fixing section 82 of the metal plate 80 via the fastening element 111.

[0140] The metal plate 80 has the fixing section 83, which projects from the flat surface section 81 of the metal plate 80, is inserted into the through-hole 51h of the base plate 41, and to which the electronic component 10 is fixed. A length L1 of the upright plate section 52a in the Z-direction is greater than a length L2 of the fixing section 83 in the Z-direction.

[0141] Busbar 42 of subunit SUX is an example of a "first busbar". Base plate 41 of subunit SUX is an example of a "first base element". Flat surface section 51 of subunit SUX is an example of a "first flat surface section". Vertical plate section 52a of subunit SUX is an example of a "first section". Horizontal plate section 52b of subunit SUX is an example of a "second section". Fixing section 82 of metal plate 80 is an example of a "first fixing section". Fixing section 83 of metal plate 80 is an example of a "second fixing section".

[0142] In the present embodiment, the routing board 40 of subunit SUY comprises the base plate 41 and the busbar 42. The flat surface section 51 of the base plate 41 has the receiving section 55, which receives the busbars 42. The fixing section 52 of the base plate 41 comprises the vertical plate section 52a, which extends from the flat surface section 51 in the Z-direction, and the horizontal plate section 52b, which extends horizontally from the end of the vertical plate section 52a in the +Z-direction. The horizontal plate section 52b is positioned differently from the first surface 51a in the Z-direction. The horizontal plate section 52b of the base plate 41 of subunit SUY overlaps the base plate 41 and the horizontal plate section 52b of subunit SUX.The horizontal plate section 52b of the base plate 41 of the sub-unit SUY has the insertion hole 52h through which the fastening element 111 passes. The horizontal plate section 52b of the base plate 41 of the sub-unit SUY, together with the base plate 41 and the horizontal plate section 52b of the sub-unit SUX, is fixed to the fixing section 82 of the metal plate 80 via the fastening element 111.

[0143] Busbar 42 of subunit SUY is an example of a "second busbar". Base plate 41 of subunit SUY is an example of a "second base element". Flat surface section 51 of subunit SUY is an example of a "second flat surface section". First surface 51a of flat surface section 51 of subunit SUY is an example of a "third surface". Second surface 51b of flat surface section 51 of subunit SUY is an example of a "fourth surface". Vertical plate section 52a of subunit SUY is an example of a "third section". Horizontal plate section 52b of subunit SUY is an example of a "fourth section".

[0144] Fig. Figure 24 is a cross-sectional view illustrating the effect of the absorption structure. Here, the linear coefficient of expansion of the base plate 41, made of a synthetic resin, is greater than the linear coefficient of expansion of the metal plate 80, made of a metal. Therefore, the base plate 41 tends to expand more than the metal plate 80 during thermal expansion. Conversely, the base plate 41 tends to contract more than the metal plate 80 during thermal contraction.

[0145] In the present embodiment, the fixing section 52 of the base plate 41 comprises the standing plate section 52a. When the standing plate section 52a is provided, it is bent in the X-direction at the time of thermal expansion, thus preventing a large load from acting on the flat surface section 51 and / or the fixing section 52 of the base plate 41. Since the standing plate section 52a is bent in the X-direction at the time of thermal contraction, it is possible to suppress a large load acting on the flat surface section 51 and / or the fixing section 52 of the base plate 41. <10. Fixing structure in relation to the plurality of subunits>

[0146] Next, in Fig. 11 describes a fixing structure relating to the plurality of subunits SU. In the present embodiment, the main body MU is subdivided into a plurality of subunits SU (for example, the three subunits SUX, SUY and SUZ).

[0147] The subunit SUX contains the majority of the electronic components 10X, the base plate 41, and the majority of the busbars 42. The majority of the busbars 42 contain sections that lie on the same plane and are electrically connected to the majority of the electronic components 10X. The subunit SUX is an example of a "first subunit." The electronic components 10X are an example of a "first electronic component." The base plate 41 of the subunit SUX is an example of a "first base element." The flat surface section 51 of the base plate 41 of the subunit SUX is an example of a "first flat surface section."

[0148] Subunit SUY contains the majority of the electronic components 10Y, the base plate 41, and the majority of the busbars 42. The majority of the busbars 42 contain sections arranged on the same plane and are electrically connected to the majority of the electronic components 10Y. Subunit SUY is electrically connected to subunit SUX, for example, via the coupling busbar 75. Subunit SUY is an example of a "second subunit." Electronic component 10Y is an example of a "second electronic component." The base plate 41 of subunit SUY is an example of a "second base element." The flat surface section 51 of the base plate 41 of subunit SUY is an example of a "second flat surface section."

[0149] The subunit SUZ contains the majority of the electronic components 10Z, the base plate 41, and the majority of the busbars 42. The majority of the busbars 42 contain sections that lie on the same plane and are electrically connected to the majority of the electronic components 10Z. The subunit SUZ is, for example, electrically connected to the subunit SUY via a majority of coupling busbars 75. The subunit SUZ is an example of a "third subunit." The electronic component 10Z is an example of a "third electronic component." The base plate 41 of the subunit SUZ is an example of a "third base element." The flat surface section 51 of the base plate 41 of the subunit SUZ is an example of a "third flat surface section."

[0150] In the present embodiment, each of the plurality of subunits SU (for example, the three subunits SUX, SUY, and SUZ) is fixed to the metal plate 80. Thus, the plurality of subunits SU (for example, the three subunits SUX, SUY, and SUZ) are held together by a metal plate 80.

[0151] In the present embodiment, the longitudinal direction of subunit SUX is the X-direction. The longitudinal direction of subunit SUY is the X-direction. The longitudinal direction of subunit SUZ is the X-direction. The plurality of subunits SU (for example, the three subunits SUX, SUY, and SUZ) lie side by side in the X-direction and are arranged in a line in the X-direction. The longitudinal direction of metal plate 80 is the X-direction. The length of metal plate 80 in the X-direction is greater than the sum of the lengths of the plurality of subunits SU (for example, three subunits SUX, SUY, and SUZ) in the X-direction.

[0152] In the present embodiment, the fixing section 52 of subunit SUX and the fixing section 52 of subunit SUY are arranged at positions that overlap in the Z-direction. The fixing section 52 of subunit SUX and the fixing section 52 of subunit SUY are jointly fixed to the fixing section 82 of the metal plate 80 by means of a fastening element 111. The fixing section 52 of subunit SUX is an example of a "first fixing section". The fixing section 52 of subunit SUY is an example of a "second fixing section".

[0153] Similarly, the fixing section 52 of subunit SUY and the fixing section 52 of subunit SUZ are arranged in positions that overlap each other in the Z-direction. The fixing section 52 of subunit SUY and the fixing section 52 of subunit SUZ are jointly fixed to the fixing section 82 of the metal plate 80 by a fastening element 111.

[0154] In the present embodiment, the heat generated by the electronic component 10X and the busbar 42 contained in the subunit SUX is transferred to the metal plate 80 via one or more heat transfer elements 92 facing the subunit SUX. Similarly, the heat generated by the electronic component 10Y and the busbar 42 contained in the subunit SUY is transferred to the metal plate 80 via one or more heat transfer elements 92 facing the subunit SUY. The heat generated by the electronic components 10Z and the busbars 42 contained in the subunit SUZ is transferred to the metal plate 80 via one or more heat transfer elements 92 facing the subunit SUZ.

[0155] In the present embodiment, the plurality of subunits SU (for example, three subunits SUX, SUY, and SUZ) can exhibit different amounts of heat generation. Even if the plurality of subunits SU generate different amounts of heat, it is possible to promote the cooling of the plurality of subunits SU (for example, the three subunits SUX, SUY, and SUZ) by using a large metal plate 80. For example, in a case where the plurality of subunits SU generate different amounts of heat, the heat of the plurality of subunits SU can be balanced by a large metal plate 80. <11. Structure in relation to the insulating rib>

[0156] Next, a structure related to insulating rib 53 will be described. <11.1 First aspect of the insulating rib>

[0157] Fig. Figure 25 is a perspective view describing a first aspect of the insulating rib 53. In the present embodiment, the base plate 41 incorporates the insulating rib 53. The insulating rib 53 is a rib that projects in the +Z direction from the first surface 51a of the flat surface section 51. The insulating rib 53 is made of a synthetic resin and has insulating properties. The insulating rib 53 is provided, for example, as part of the base plate 41. The insulating rib 53 is positioned between two busbars 42 arranged side by side in a state where an upper surface face (first surface face 51a) of the two busbars 42 is exposed, and provides an insulating distance between the two busbars 42. In the present embodiment, the first surface 51a is an example of a "first surface." The second surface 51b is an example of a "second surface."

[0158] In the present embodiment, the routing board 40 includes a busbar 42J and a busbar 42K as the plurality of busbars 42. Furthermore, the base plate 41 includes a receiving section 55J and a receiving section 55K as the plurality of receiving sections 55.

[0159] At least part of the busbar 42J is received in the receiving section 55J and extends along the flat surface section 51. The busbar 42J is electrically connected via the connecting component 20 to terminal 13A of an electronic component 10 (hereinafter referred to in some cases as the "first electronic component 10"). The busbar 42J is an example of a "first busbar". The receiving section 55J is an example of a "first receiving section".

[0160] At least part of the busbar 42K is accommodated in the receiving section 55K and extends along the flat surface section 51. The busbar 42K is electrically connected via another connecting component 20 to terminal 13 of another electronic component 10 (second electronic component). Alternatively, the busbar 42K can be electrically connected via another connecting component 20 to terminal 13B of the first electronic component 10. The busbar 42K is an example of a "second busbar". The receiving section 55K is an example of a "second receiving section".

[0161] In the present embodiment, the insulating rib 53 projects from the first surface 51a in the +Z direction at a position between the receiving section 55J and the receiving section 55K. The insulating rib 53 is an example of an “insulating wall” and a “first rib”.

[0162] In the present embodiment, the busbar 42J is received in the receiving section 55J in a state in which it is exposed towards the upper surface (first surface 51a) and includes, for example, a first straight section 42Ja extending linearly in the X direction. The busbar 42K is received in the receiving section 55K in a state in which it is exposed towards the upper surface (first surface 51a) and includes, for example, a second straight section 42Ka extending linearly in the X direction. The first straight section 42Ja of the busbar 42J and the second straight section 42Ka of the busbar 42K are, for example, adjacent to each other in the Y direction. The second straight section 42Ka of the busbar 42K runs parallel to the first straight section 42Ja of the busbar 42J.

[0163] The insulating rib 53 is located, viewed from the Z-direction, between the first straight section 42Ja of the busbar 42J and the second straight section 42Ka of the busbar 42K, and extends parallel to the first straight section 42Ja of the busbar 42J and the second straight section 42Ka of the busbar 42K. The first straight section 42Ja of the busbar 42J, the second straight section 42Ka of the busbar 42K, and the insulating rib 53 can extend linearly in the Y-direction instead of in the X-direction.

[0164] In the present embodiment, the subunit SU comprises the connecting component 30C and the connecting component 30D as the plurality of connecting components 30. The connecting component 30C abuts the busbar 42J in the Z-direction and is connected to the busbar 42J in the Z-direction. The connecting component 30C is electrically connected to a first external device via the external connecting busbar 76. The connecting component 30D abuts the busbar 42K in the Z-direction and is connected to the busbar 42K in the Z-direction. The connecting component 30D is electrically connected to the first external device or a second external device via a further external connecting busbar 76.In the present embodiment, part of the insulating rib 53 is arranged between the connection component 30C (first connection component) and the connection component 30D (second connection component) in order to electrically isolate the connection component 30C (first connection component) from the connection component 30D (second connection component).

[0165] Note that the first connection component is not limited to connection component 30 and can be connection component 20, which is connected to another electronic component 10 (third electronic component) contained in the same subunit SU. Likewise, the second connection component is not limited to connection component 30 and can be connection component 20, which is connected to another electronic component 10 (fourth electronic component) contained in the same subunit SU. (First modification example)

[0166] Fig. Figure 26 is a perspective view illustrating a first modification example of the first aspect of the insulating rib 53. In this modification example, the insulating rib 53 is a rib projecting in the -Z direction from the second surface 51b of the flat surface section 51. The insulating rib 53 is provided, for example, as part of the base plate 41. The insulating rib 53 is positioned between two busbars 42 arranged side by side in a state where a lower surface face (second surface face 51b) of the two busbars 42 is exposed, and it provides an insulating distance between the two busbars 42. In this modification example, the second surface 51b is an example of a "first surface." The first surface 51a is an example of a "second surface." The insulating rib 53 is an example of an "insulating wall."

[0167] In the present modification example, the busbar 42J is recorded in the receiving section 55J in a state where it is exposed towards the lower surface (second surface 51b) and contains, for example, a first straight section 42Ja extending linearly in the X direction. The busbar 42K is recorded in the receiving section 55K with its lower surface (second surface 51b) exposed and contains, for example, a second straight section 42Ka extending linearly in the X direction. The insulating rib 53 is located, viewed from the Z direction, between the first straight section 42Ja of the busbar 42J and the second straight section 42Ka of the busbar 42K and extends parallel to the first straight section 42Ja of the busbar 42J and the second straight section 42Ka of the busbar 42K. (Second modification example)

[0168] Fig. Figure 27 is a cross-sectional view illustrating a second modification example of the first aspect of the insulating wall. In this modification example, an insulating wall 53A is provided between the second surface 51b of the flat surface section 51 of the base plate 41 and the flat surface section 81 of the metal plate 80. The insulating wall 53A is provided on the second surface 51b of the flat surface section 51. In this modification example, the second surface 51b is an example of a "first surface." The first surface 51a is an example of a "second surface."In the present disclosure, the phrase “provided on a surface” is not limited to the case where the surface is formed integrally with an element containing the surface, and may include a case where the surface exists in association with the surface by being arranged to be in contact with the surface after it has been formed as a separate body.

[0169] For example, in the present modification example, the insulating wall 53A extends in the Z-direction over the second surface 51b of the flat surface section 51 of the base plate 41 and the flat surface section 81 of the metal plate 80. The insulating wall 53A is made of a synthetic resin and has insulating properties. The insulating wall 53A is formed, for example, by compressing an elastic insulator between the base plate 41 and the metal plate 80. Similar to the insulating rib 53 of the first modification example, the insulating wall 53A is arranged between the two busbars 42 in such a way that a lower surface of the two busbars 42 is exposed, thus ensuring an insulating distance between the two busbars 42. Other configurations of the insulating wall 53A are similar to those of the insulating rib 53 of the first modification example. <11.2 Second aspect of the insulating rib>

[0170] Fig. Figure 28 is a perspective view illustrating a second aspect of the insulating rib 53. In the present embodiment, the subunit SU comprises a connection component 20G and a connection component 20H as the plurality of connection components 20. The connection component 20G is connected to terminal 13A of the electronic component 10. The connection component 20G borders the busbar 42J in the Z direction and is connected to the busbar 42J in the Z direction. The connection component 20H is connected to terminal 13B of the electronic component 10. The connection component 20H borders the busbar 42K in the Z direction and is connected to the busbar 42K in the Z direction.In the present embodiment, part of the insulating rib 53 is arranged between the connecting component 20G (first connecting component) and the connecting component 20H (second connecting component) in order to electrically isolate the connecting component 20G (first connecting component) from the connecting component 20H (second connecting component).

[0171] In the present embodiment, the electronic component 10 includes the insulating rib 11a described above. The insulating rib 11a is an example of a "rib" and a "second rib". In the present embodiment, the insulating rib 53 provided on the base plate 41 is connected to the insulating rib 11a of the electronic component 10. Thus, the insulating rib 11a of the electronic component 10 and the insulating rib 53 form a series of insulating ribs.

[0172] In the present embodiment, the insulating rib 53 provided on the base plate 41 has a coupling section 56 which is coupled to the insulating rib 11a of the electronic component 10. The coupling section 56 has, for example, a recess 56a. The recess 56a is recessed in the projecting direction (X-direction) of the insulating rib 11a and extends in the Z-direction. The recess 56a is open in the +Z-direction. The insulating rib 11a of the electronic component 10 can be inserted into the recess 56a in the Z-direction. Furthermore, the electronic component 10 is movable in the Z-direction when the insulating rib 11a is inserted into and guided through the recess 56a. The electronic component 10 is positioned in the X direction and the Y direction by inserting the insulating rib 11a into the recess 56a. <12. Structure in relation to the connection component>

[0173] Next, a structure related to the connection component 20 will be described.

[0174] Fig. Figure 29 is a cross-sectional view illustrating a structure connected to the connection component 20. In the present embodiment, the connection components 20 (for example, connection component 20M and connection component 20N) are heat storage elements (heat-absorbing elements) that increase the heat capacity of the energy supply path of the electrical connection unit 1. The connection component 20 stores (absorbs) at least some of the heat generated, for example, by the electronic component 10. Alternatively / additionally, the connection component 20 can store (absorb) at least some of the heat generated by the busbar 42 itself due to the energy supply. The connection component 20 can be referred to as a "heat-storing component" or a "heat-absorbing component".

[0175] In the present embodiment, the busbar 42 is arranged at a position remote from the terminal 13 of the electronic component 10 (for example, at a position remote in the Z direction). The connecting component 20 is arranged between the electronic component 10 and the busbar 42. In the present disclosure, the phrase "the connecting component is arranged between the electronic component and the busbar" is not limited to the case where part of the connecting component is arranged between the electronic component and the busbar when viewed from the X or Y direction.The phrase "the connecting component is arranged between the electronic component and the busbar" can correspond to a case in which part of the connecting component is located between the electronic component and the busbar when viewed from a direction inclined with respect to the X-direction or the Y-direction. The connecting component 20 electrically connects the terminal 13 of the electronic component 10 to the busbar 42.

[0176] In the present embodiment, the thickness of at least a portion of the connecting component 20 is greater than the plate thickness (a thickness in the Z-direction) T3 of the busbar 42. For example, the thickness T1 of at least a portion of the connecting component 20 in the X-direction is greater than the plate thickness T3 of the busbar 42. In the present embodiment, the thickness T1 of the first section 21 of the connecting component 20 in the X-direction is greater than the plate thickness T3 of the busbar 42. In the present embodiment, the thickness T1 of the first section 21 in the X-direction is greater than the plate thickness T3 of the busbar 42 over the entire length of the first section 21 in the Z-direction. For example, the thickness T1 of the first section 21 of the connecting component 20 in the X-direction is twice or more than the plate thickness T3 of the busbar 42.From another perspective, the thickness T2 of the second section 22 of the connecting component 20 in the Z-direction can be greater than the plate thickness T3 of the busbar 42.

[0177] In the present embodiment, the thickness T1 of the first section 21 of the connecting component 20 in the X-direction is greater than the thickness T2 of the second section 22 of the connecting component 20 in the Z-direction. In the present embodiment, the thickness T1 of the first section 21 in the X-direction is greater than the thickness T2 of the second section 22 in the Z-direction over the entire length of the first section 21 in the Z-direction.

[0178] The size ratio described above also applies to connection component 30, to which the external busbar 76 is connected, and / or connection component 100, to which the coupling busbar 75 is coupled. For example, in the description of connection component 30, "connection component 20" can be replaced by "connection component 30", "first section 21" by "first section 31", and in the description of connection component 20, "second section 22" can be replaced by "second section 32". Similarly, in the description of connection component 100, "connection component 20" can be replaced by "connection component 100", "first section 21" by "first section 101", and "second section 22" by "second section 102". <13. Method for manufacturing an electrical connection unit>

[0179] Next, a method for manufacturing the electrical connection unit 1 is described.

[0180] Fig. Figures 30 to 34 are cross-sectional views illustrating the method for manufacturing the electrical connection unit 1. In the routing board 40 of each subunit SU, the base plate 41 and the majority of busbars 42 are integrated by insert forming or another method in a state where the fastening element 43 is fixed to the busbar 42. This pre-prepares the routing board 40 of each subunit SU. (First step)

[0181] Fig. Figure 30 illustrates a first step. In the first step, the connecting component 20 is fixed to the terminal 13 of the electronic component 10 using the fastening element 71 or the fastening element 72. In this way, an assembly SA is formed in which the electronic component 10 and the connecting component 20 are connected.

[0182] The first step, relating to electronic component 10M, is performed as follows. First, electronic component 10M is placed on a placement table MP in a position where the mounting hole 13h of connector 13 of electronic component 10M is oriented vertically. Next, connector component 20M is placed on electronic component 10M in a position where the first mounting hole 21h of connector component 20M is oriented vertically. The first mounting hole 21h of connector component 20M is aligned with the mounting hole 13h of connector 13 of electronic component 10M. This first step is performed in a state where electronic component 10M and connector component 20M are in their initial position.The first position is one in which the mounting hole 13h and the first mounting hole 21h are oriented in the vertical direction.

[0183] Next, the fastener 71 is inserted vertically into the first mounting hole 21h of the connecting component 20M. The fastener 71, passing through the mounting hole 21h of the connecting component 20M, connects to the mounting hole 13h of the terminal 13 of the electronic component 10. In this way, the assembly SA is formed, in which the electronic component 10M and the connecting component 20M are connected. The vertical direction is an example of a "first mounting direction". (Second step)

[0184] Fig. Figure 31 illustrates a second step. In the second step, the assembly SA is fixed to the routing board 40 of the respective subunit SU. For example, the connecting component 20 contained in the assembly SA is fixed to the busbar 42 contained in the routing board 40. This electrically connects the electronic component 10 and the busbar 42.

[0185] The second step is carried out, for example, as follows. As described above, the fastening element 43 is fixed to the busbar 42 in the routing board 40. The fastening element 43 protrudes vertically from the busbar 42. The assembly SA is positioned on the routing board 40 such that the fastening element 43 is inserted vertically into the second mounting hole 22h of the second section 22 of the connecting component 20. The coupling element 44 (for example, a nut) is then coupled vertically to the upper end of the fastening element 43. This fixes the second section 22 of the connecting component 20, which is contained in the assembly SA, to the busbar 42. Each sub-unit SU is thus completed.

[0186] Here, the second step, which relates to the electronic component 10M, is carried out as follows, for example. First, the position of the assembly SA is rotated 90 degrees relative to the first step. That is, the first position (see Fig. 30), in which the fixing hole 13h and the first fixing hole 21h are directed in the vertical direction, is moved into the second position (see Fig. 31) amended, in which the fixing hole 13h and the first fixing hole 21h are directed in the horizontal direction and the second fixing hole 22h of the connecting component 20 is directed in the vertical direction.

[0187] In the second position, the assembly SA is placed on the routing board 40 such that the fastening element 43 is inserted vertically into the second mounting hole 22h of the second section 22 of the connecting component 20. The coupling element 44 (for example, a nut) is then coupled vertically to the upper end of the fastening element 43. This secures the second section 22 of the connecting component 20M, which is contained in the assembly SA, to the busbar 42. (Third step)

[0188] Fig. Figure 32 illustrates a third step. In this third step, each subunit SU is attached to the metal plate 80. The third step is carried out, for example, as follows. First, the insulating film 91 is attached to the surface of the flat surface section 81 of the metal plate 80. Next, the heat transfer element 92 is fixed to the lower surface of each subunit SU with an adhesive or the like. Subsequently, each subunit SU is placed on the metal plate 80, with the insulating film 91 and the heat transfer element 92 between them. The fixing section 52 of each subunit SU is fixed to the fixing section 82 of the metal plate 80 via the fixing element 111. (Fourth step)

[0189] Fig. Figure 33 illustrates a fourth step. In the fourth step, the mounting section 14 of the electronic component 10 of each subunit SU is fixed to the fixing section 83 of the metal plate 80 via the fastening element 112. The fourth step can be performed together with the third step. (Fifth step)

[0190] Fig. Figure 34 illustrates a fifth step. In the fifth step, the insulating cover 93 is attached vertically to the metal plate 80. This completes the electrical connection unit 1.

[0191] Instead of / in addition to the assembly in which the electronic component 10 and the connection component 20 are connected, the assembly SA can also be an assembly in which the coupling bus 75 and the connection component 100 are connected, or an assembly in which the external connection bus 76 and the connection component 30 are connected. Each of the electronic component 10, the coupling bus 75, and the external connection bus 76 is an example of a "connection target component." Therefore, the "electronic component 10" in the above description can be replaced by the "coupling bus 75" or the "external connection bus 76." The "connection component 20" in the above description can be replaced by the "connection component 100" or the "connection component 30." <14. Advantages><A. Vorteile der Verlegungsplatine>

[0192] As a comparative example, consider an electrical connection unit where a busbar is arranged in a vertical position relative to the lower wall of an enclosure. Since, for example, a specific cross-sectional area of ​​the busbar is determined to function as a routing element in such a configuration, reducing the width (height) of the vertical busbar can be challenging. In this case, the width of the vertical busbar becomes a bottleneck, and reducing the height of the electrical connection unit can be difficult.

[0193] On the other hand, in the present embodiment, the electrical connection unit 1 comprises the first electronic component 10 and the routing board 40. The routing board 40 comprises the base plate 41 and the first busbar 42. The base plate 41 has a plate-shaped, flat surface section 51 with a first surface 51a facing the first electronic component 10. The flat surface section 51 has the first receiving section 55, which is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction. At least a portion of the first busbar 42 is received in the first receiving section 55 and extends along the flat surface section 51. According to such a configuration, the width of the busbar is smaller compared to the configuration of the comparative example, in which at least a portion of the routing path (or(Routing path) is formed on a plane, is less likely to represent a bottleneck, and the height of electrical connection unit 1 can be easily reduced.

[0194] In the present embodiment, the electrical connection unit 1 has a first connection component 20. The first connection component 20 electrically connects the first electronic component 10 to the first busbar 42. The first busbar 42 has a first connection section 61, which is connected to the first connection component 20. The first connection section 61 is received in the first receiving section 55 and extends along the flat surface section 51. According to this design, it is also easy to reduce the height of the electrical connection unit 1, since more sections of the routing path are formed in one plane.

[0195] In the present embodiment, the electrical connection unit 1 has a second connection component 20. The second connection component 20 electrically connects the second electronic component or an external device to the first busbar 42. The first busbar 42 has a second connection section 62, which is connected to the second connection component 20. The first busbar 42 is received in the first receiving section 55 at least above the first connection section 61 and the second connection section 62 and extends along the flat surface section 51. According to such a design, it is also easy to reduce the height of the electrical connection unit 1, since more sections of the routing path are formed in one plane.

[0196] In the present embodiment, the first busbar 42 has the extending section 63 between the first connecting section 61 and the second connecting section 62. The extending section 63 is accommodated in the first receiving section 55, passes through the region R that overlaps the electronic component 10 when viewed from the Z-direction, and extends across both sides of region R. According to this design, since the extending section 63 is accommodated in the first receiving section 55, it is difficult to be restricted in the routing layout due to the presence of the electronic component 10. For example, it is possible to achieve a routing layout that improves the electrical properties, such as facilitating a linear extension of the extending section 63.Furthermore, it is possible to prevent the busbar from being routed in such a way that it bypasses the electronic component 10. This makes it possible to improve the electrical properties of the electrical connection unit 1 and / or to reduce the size of the electrical connection unit 1.

[0197] In the present embodiment, the first busbar 42 extends to region R, which overlaps the first electronic component 10 as viewed from the Z-direction, and has extension 64, the end of which 42e1 is located in a position that overlaps the first electronic component 10. Extension 64 is received in the first receiving section 55 and extends along the flat surface section 51. According to this design, because extension 64 is received in the first receiving section 55, the height of the electrical connection unit 1 can be reduced, and a metallic heat dissipation section (extension 64) for promoting heat dissipation and / or heat storage of the first electronic component 10 can be arranged below the first electronic component 10.This makes it possible to improve the heat dissipation and / or heat storage properties of the electrical connection unit 1 while simultaneously reducing the height of the electrical connection unit 1.

[0198] In the present embodiment, the first busbar 42 is received in the first receiving section 55 over its entire length and extends along the flat surface section 51. According to such a design, it is also easy to reduce the height of the electrical connection unit 1, since more sections of the routing path are formed in one plane.

[0199] In the present embodiment, the electrical connection unit 1 includes the second busbar 42, which is electrically connected to the second terminal 13B of the first electronic component 10. The flat surface section 51 has the second receiving section 55, which is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction at a position remote from the first receiving section 55. At least a portion of the second busbar 42 is received in the second receiving section 55 and extends along the flat surface section 51. According to this design, it is easier to reduce the height of the electrical connection unit 1, since several sections of the routing path, containing the majority of busbars 42, are held in one plane by a base plate 41.

[0200] In the present embodiment, the electrical connection unit 1 includes the third busbar 42. The first busbar 42 is a busbar contained in the positive electrode line PL. The third busbar 42 is a busbar contained in the negative electrode line NL. The flat surface section 51 has the third receiving section 55, which is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction at a position remote from the first receiving section 55. At least a portion of the third busbar 42 is received in the third receiving section 55 and extends along the flat surface section 51.According to such a design, it becomes easier to reduce the height of the electrical connection unit 1, since several sections of the routing path forming the positive electrode line PL and the negative electrode line NL are held in one plane by a base plate 41.

[0201] In the present embodiment, the electrical connection unit 1 comprises the fourth busbar 42G, the fifth busbar 75D, and the third connection component 100, which electrically connects the fourth busbar 42G to the fifth busbar 75D. The flat surface section 51 has the fourth receiving section 55, which is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction at a position remote from the first receiving section 55. At least a portion of the fourth busbar 42G is received in the fourth receiving section 55 and extends along the flat surface section 51. The third connection component 100 includes a section that is oriented relative to the fourth busbar 42G.The fifth busbar 75D is supported by the third connecting component 100 at a position remote from the first busbar 42 in the Z-direction and extends parallel to the first surface 51a. According to this configuration, a three-dimensional routing path can be easily formed by the fourth busbar 42G, the third connecting component 100, and the fifth busbar 75D. This allows for the provision of an electrical connection unit 1 that is easy to assemble. Since the fourth busbar 42G is located in the receiving section 55 of the base plate 41, part of the three-dimensional routing path is formed within the thickness of the base plate 41. This makes it easier to reduce the height of the electrical connection unit 1.

[0202] In the present embodiment, the fifth busbar 75D extends such that it spans the first busbar 42 at a position remote from the first busbar 42 in the Z-direction. According to this configuration, it is easy to create a routing path using the third connecting component 100 and the fifth busbar 75D, which intersects the first busbar 42 three-dimensionally. In this way, an electrical connection unit 1 can be provided that is easy to install. <B. Vorteile von flachen Sammelschienen>

[0203] As a comparative example, consider an electrical connection unit where a busbar is arranged in a vertical position relative to the lower wall of an enclosure. With this configuration, it is necessary to fix the busbar vertically to the enclosure, and improving the busbar's mounting capabilities is difficult. In this case, improving the mounting capabilities of the electrical connection unit 1 can also be challenging.

[0204] On the other hand, in the present embodiment, the electrical connection unit 1 comprises the base plate 41 and the busbar 42. The base plate 41 includes the flat surface section 51, which has a plate-like shape. The flat surface section 51 has the first receiving section 55, which is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction. At least a portion of the busbar 42 is received in the first receiving section 55 and extends along the flat surface section 51. According to such a design, the base plate 41 and the busbar 42 can be easily handled as an integral unit, and the workability with regard to fastening the busbar can be improved compared to the design of the comparative example. Thus, the assembly capability of the electrical connection unit 1 can be improved.

[0205] In the present embodiment, the busbar 42 is received in the receiving section 55 over its entire length and extends along the flat surface section 51. According to such a design, it is easy to reduce the height of the electrical connection unit 1 while simultaneously improving the ease of assembly of the electrical connection unit 1.

[0206] In the present embodiment, the busbar 42 is integrated with the base plate 41 by means of an insert molding. According to this design, it is possible to eliminate or reduce the work involved in manually attaching the busbar 42 to the housing. This further improves the ease of assembly of the electrical connection unit 1.

[0207] In the present embodiment, the fastening element 43, which projects from the busbar 42 in the Z-direction, and the connecting components 20 and 30, which are attached to the fastening element 43 in the Z-direction, are provided. The connecting components 20 and 30 electrically connect the electronic component 10 or an external device to the busbar 42. According to this design, the working direction for connecting a target connection component to the busbar 42 can be easily aligned with the Z-direction. In cases where the working direction can be aligned, the ease of assembly of the electrical connection unit 1 can be further improved.

[0208] In the present embodiment, the connecting component 20 is connected to the electronic component 10 from the X-direction (or the Y-direction). According to this configuration, the connection direction of the electronic component 10 with respect to the busbar 42 can be changed to the Z-direction by using the connecting component 20 for the electronic component 10 that needs to be connected from the X-direction. This further improves the ease of assembly of the electrical connection unit 1. <C. Vorteile der Freilegungsstruktur auf der oberen Oberflächenseite der Sammelschiene>

[0209] As a comparative example, an electrical connection unit is considered in which the upper surface of the busbar 42 is coated with a synthetic resin. With such a design, it can be difficult to improve the heat dissipation properties of the electrical connection unit.

[0210] On the other hand, in the present embodiment, the electrical connection unit 1 comprises the first electronic component 10, the base plate 41, and the busbar 42. The base plate 41 has a plate-shaped, flat surface section 51, the first surface 51a of which faces the first electronic component 10 and the second surface 51b of which is located on the side opposite the first surface 51a. The flat surface section 51 has the receiving section 55, which is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction. At least a portion of the busbar 42 has the plate section 42p, which is received in the receiving section 55 and extends along the flat surface section 51.Plate section 42p contains the first connecting section 61, which overlaps the first connecting component 20 in the Z-direction, and the section 63 extending from the first connecting section 61 in a direction intersecting the Z-direction. At least a portion of the extending section 63 is exposed on the side of the first surface 51a facing the outside of the base plate 41. According to this configuration, at least a portion of the busbar 42 not connected to the connecting sections 61 and 62 is exposed to the outside of the base plate 41 and serves as a heat dissipation area. In this case, the heat dissipation properties of the electrical connection unit 1 can be improved.

[0211] In the present embodiment, the extending section 63 is exposed to the outside of the base plate 41 on the side of the first surface 51a, at least in a portion of the region R that overlaps the first electronic component 10 as viewed from the Z direction. According to such a design, a portion of the extending section 63 can easily function as a heat dissipation section, transferring heat from the first electronic component 10. In this case, the heat dissipation properties of the electrical connection unit 1 can be improved.

[0212] In the present embodiment, the first busbar 42 overlaps the second connection components 20 and 30 in the Z-direction with the second connection section 62. The first busbar 42 is received in the receiving section 55 at least over its entire length between the first connection section 61 and the second connection section 62, extends along the flat surface section 51, and is exposed on the side of the first surface 51a facing the outside of the base plate 41. According to this design, the heat dissipation properties of the electrical connection unit 1 can be further improved, since the wider section acts as a heat dissipation area.

[0213] In the present embodiment, the busbar 42 is received in the receiving section 55 over its entire length, extends along the flat surface section 51, and is exposed to the outside of the base plate 41 on the side of the first surface 51a. According to this design, the heat dissipation properties of the electrical connection unit 1 can be further improved, since the wider section acts as a heat dissipation area.

[0214] At least part of the extending section 63 is exposed not only on the first surface 51a, but also on the second surface 51b towards the outside of the base plate 41. According to this design, the heat dissipation properties of the electrical connection unit 1 can be further improved, since the wider section acts as a heat dissipation area.

[0215] In the modified example of the present embodiment, the electrical connection unit 1 comprises the metal plate 80, which faces the flat surface section 51, with the gap S1 between the metal plate 80 and the flat surface section 51, and the heat transfer element 92, which is arranged between the busbar 42 and the metal plate 80. The base plate 41 includes a cover section 51v, which covers at least part of the extending section 63 on the second surface 51b. According to such a design, even in a case where heat is likely to be trapped in the gap S1 between the base plate 41 and the metal plate 80, it is possible to prevent the heat from being easily trapped in the gap S1 by providing the cover section 51v. <D. Vorteile der Freilegungsstruktur auf der unteren Oberflächenseite der Sammelschiene>

[0216] As a comparative example, an electrical connection unit is considered in which the lower surface of the busbar 42 is coated with a synthetic resin. With such a design, it can be difficult to improve the heat dissipation properties of the electrical connection unit.

[0217] On the other hand, in the present embodiment, the electrical connection unit 1 comprises the first electronic component 10, the base plate 41, and the busbar 42. The base plate 41 has a plate-shaped, flat surface section 51, the first surface 51a of which faces the first electronic component 10 and the second surface 51b of which is located on the side opposite the first surface 51a. The flat surface section 51 has the receiving section 55, which is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction. At least a portion of the busbar 42 has the plate section 42p, which is received in the receiving section 55 and extends along the flat surface section 51. The plate section 42p includes the exposed section 42u, which is exposed to the outside of the base plate 41 on the side of the second surface 51b.According to this design, at least part of the plate section 42p in the busbar 42 is exposed towards the outside of the base plate 41 and acts as a heat dissipation area. In this case, the heat dissipation properties of the electrical connection unit 1 can be improved. From this perspective, the heat transfer element 92 does not need to be in contact with the exposed section 42u.

[0218] In the present embodiment, at least part of the exposed section 42u of the busbar 42 is arranged in a region that overlaps the connecting component 20 when viewed from the Z-direction. According to this design, the heat from the connecting component 20 is easily dissipated through the exposed section 42u of the busbar 42. In this way, the heat dissipation properties of the electrical connecting unit 1 can be further improved.

[0219] In the present embodiment, the electrical connection unit 1 further comprises the metal plate 80 and the heat transfer element 92. The metal plate 80 faces the second surface 51b of the flat surface section 51, with a gap S1 between the metal plate 80 and the flat surface section 51. The heat transfer element 92 is arranged between the exposed section 42u of the busbar 42 and the metal plate 80. According to this configuration, the heat from the busbar 42 is readily transferred to and dissipated from the metal plate 80 via the heat transfer element 92. In this way, the heat dissipation properties of the electrical connection unit 1 can be further improved.

[0220] In the present embodiment, at least a portion of the exposed section 42u of the busbar 42 is arranged in a region that overlaps the connecting component 20 when viewed from the Z-direction. At least a portion of the heat transfer element 92 overlaps the exposed section 42u of the busbar 42 in a region that overlaps the connecting component 20 when viewed from the Z-direction. According to this configuration, the heat from the electronic component 10 is readily transferred to and dissipated from the metal plate 80 via the heat transfer element 92. In this way, the heat dissipation properties of the electrical connecting unit 1 can be further improved.

[0221] Instead of / in addition to the example above, at least part of the heat transfer element 92 overlaps the exposed section 42u of the busbar 42 in a region that overlaps the connection component 30 when viewed from the Z-direction. According to this configuration, even if the heat is received from an external device via the external connection busbar 76, it is easily dissipated and carried away by the metal plate 80. In this way, the heat dissipation properties of the electrical connection unit 1 can be further improved.

[0222] In the present embodiment, the exposed section 42u of the busbar 42 comprises the first section 42ua, which is arranged in a region that overlaps the connecting component 20 as viewed from the Z-direction, and the second section 42ub, which is arranged in a region that overlaps the first electronic component 10 as viewed from the Z-direction. The heat transfer element 92 comprises the first heat transfer section 92a, which overlaps the first section 42ua of the exposed section 42u as viewed from the Z-direction, and the second heat transfer section 92b, which overlaps the second section 42ub of the exposed section 42u as viewed from the Z-direction. According to this configuration, the heat from the first electronic component 10 is efficiently transported from the metal plate 80 via the heat transfer element 92 and readily dissipated.In this way, the heat dissipation properties of the electrical connection unit 1 can be further improved.

[0223] In the present embodiment, the second section 42ub of the exposed section 42u of the busbar 42 is exposed towards the outside of the base plate 41 and faces the first electronic component 10 not only on the side of the second surface 51b, but also on the side of the first surface 51a. According to this design, the heat from the first electronic component 10 is efficiently transported from the metal plate 80 via the heat transfer element 92 and easily dissipated. In this way, the heat dissipation properties of the electrical connection unit 1 can be further improved.

[0224] In the present embodiment, the busbar 42 is received in the receiving section 55 over its entire length, extends along the flat surface section 51, and is exposed on the side of the second surface 51b towards the outside of the base plate 41. According to this design, the heat dissipation properties of the electrical connection unit 1 can be further improved, since the wider section acts as a heat dissipation area. <E. Vorteile einer isolierenden Wand>

[0225] As a comparative example, consider an electrical connection unit where no insulating barrier is provided between adjacent busbars within a predetermined distance. In such a configuration, it is necessary to separate the busbars by a predetermined distance or more to ensure insulation between them. When the busbars must be separated by a predetermined distance or more, miniaturizing the electrical connection unit can be challenging.

[0226] On the other hand, in the present embodiment, the base plate 41 includes the first receiving section 55J, the second receiving section 55K, and an insulating wall (for example, the insulating rib 53 or the insulating wall 53A). The first receiving section 55J is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction and receives the first busbar 42J in a state in which at least a portion of the first busbar 42J is exposed on the first surface 51a. The second receiving section 55K is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction and receives the second busbar 42K in a state in which at least a portion of the second busbar 42K is exposed towards the side of the first surface 51a. The insulating wall is provided on the first surface 51a at a position between the first receiving section 55J and the second receiving section 55K.According to such a design, even if the first receiving section 55J and the second receiving section 55K are arranged within a predetermined distance, the necessary insulation distance can be ensured by the insulating wall. Therefore, the majority of the busbars 42 can easily be arranged close together. If the majority of the busbars 42 can be easily arranged close together, the electrical connection unit 1 can be miniaturized.

[0227] In the present embodiment, an upward airflow, heated by each busbar 42, can be straightened by the insulating wall. This makes it possible to improve the heat dissipation properties of the electrical connection unit 1.

[0228] In the present embodiment, the first busbar 42J contains the first straight section 42Ja, which is received in the first receiving section 55J in a state where it is exposed to the first surface 51a and extends linearly. The second busbar 42K contains the second straight section 42Ka, which is received in the second receiving section 55K in a state where it is exposed to the first surface 51a and extends linearly parallel to the first straight section 42Ja. The insulating wall is arranged between the first straight section 42Ja and the second straight section 42Ka and extends, viewed from the Z-direction, parallel to the first straight section 42Ja and the second straight section 42Ka. According to such a design, the first straight section 42Ja and the second straight section 42Ka can easily be arranged close to each other, and it is easy to further miniaturize the electrical connection unit 1.

[0229] In the present embodiment, the electrical connection unit 1 has a first connection component (for example, connection component 20 or connection component 30) and a second connection component (for example, connection component 20 or connection component 30). The first connection component is connected to the first busbar 42J and electrically connects the first busbar 42J to a third electronic component or a first external device. The second connection component is connected to the second busbar 42K and electrically connects the second busbar 42K to a fourth electronic component, a first external device, or a second external device. A portion of the insulating wall is arranged between the first connection component and the second connection component.According to such a design, even if the first and second connection components are located within a predetermined distance of each other, the necessary insulation distance between them can be ensured by the insulating wall. Therefore, the first and second connection components can easily be positioned close together. If the first and second connection components can be easily positioned close together, the electrical connection unit 1 can be further miniaturized.

[0230] In the present embodiment, the electrical connection unit 1 comprises a first connection component (for example, connection component 20) and a second connection component (for example, connection component 20). The first connection component is attached to the first busbar 42J and electrically connects the first busbar 42J to the first terminal 13A of the first electronic component 10. The second connection component is attached to the second busbar 42K and electrically connects the second busbar 42K to the second terminal 13B of the first electronic component 10. A portion of the insulating wall is arranged between the first connection component and the second connection component.According to such a design, even if the first and second connection components, which are connected to the same electronic component 10, are located within a predetermined distance, the necessary insulation distance between the first and second connection components can be ensured by the insulating wall. Therefore, the first and second connection components can easily be positioned close to each other. If the first and second connection components can be easily positioned close to each other, the electrical connection unit 1 can be further miniaturized.

[0231] In the present embodiment, the first electronic component 10 has an insulating rib 11a located between the first terminal 13A and the second terminal 13B. Insulating rib 53 has a coupling section 56 that is coupled to insulating rib 11a of the first electronic component 10. According to this configuration, the electronic component 10 can be aligned by coupling insulating rib 11a of the electronic component 10 to insulating rib 53. This improves the assembly capability of the electrical connection unit 1. According to this configuration, a series of insulating walls can be formed by insulating rib 53 and insulating rib 11a of the first electronic component 10. Consequently, multiple power supply paths in the electrical connection unit 1 can be easily arranged close together.If the majority of the energy supply paths are located close together, the electrical connection unit 1 can easily be miniaturized further.

[0232] In the present embodiment, the coupling section 56 of the insulating rib 53 has the recess 56a into which the insulating rib 11a of the electronic component 10 is inserted. According to this design, the electronic component 10 can be easily aligned by inserting the insulating rib 11a of the electronic component 10 into the recess 56a of the insulating rib 53. This further improves the ease of assembly of the electrical connection unit 1. <F. Vorteile der fixierenden Struktur der elektronischen Komponente>

[0233] As a comparative example, consider a case where the mounting section 14 of the electronic component 10 is fixed to the base plate 41. In such a setup, it is difficult to ensure rigidity around the mounting section 14 due to the fact that the base plate 41 is made of a synthetic resin. Furthermore, in this setup, because the base plate 41 has a larger coefficient of linear expansion than the electronic component 10, the position of the electronic component 10 may shift significantly during thermal expansion / contraction.

[0234] On the other hand, in the present embodiment, the base plate 41, the busbar 42, the metal plate 80, and the electronic component 10 are provided. The base plate 41 has a plate-shaped, flat surface section 51, the first surface 51a of which faces the first electronic component 10 and the second surface 51b of which is located on the side opposite the first surface 51a. The flat surface section 51 has the receiving section 55, which is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction, and the through-hole 51h, which penetrates the flat surface section 51 in the Z-direction. At least a portion of the busbar 42 is received in the receiving section 55 and extends along the flat surface section 51.The metal plate 80 contains the plate-shaped flat surface section 81, which faces the second surface 51b, the first fixing section 82, to which the base plate 41 is fixed, and the second fixing section 83, which projects from the flat surface section 81 in the Z-direction and is inserted into the through-hole 51h. The electronic component 10 faces the first surface 51a, is electrically connected to the busbar 42, and is fixed to the second fixing section 83. According to this configuration, the base plate 41 and the electronic component 10 are fixed to the metal plate 80. Since the metal plate 80 is made of metal, the rigidity around the fixing section 14 can be easily ensured in this case. This improves the durability of the electrical connection unit 1.Since the linear expansion coefficient of the metal plate 80 is smaller than the linear expansion coefficient of the base plate 41, it is possible in this setup to suppress a significant movement of the electronic component 10 in its positioning at the time of thermal expansion / contraction.

[0235] In the present embodiment, the second fixing section 83 extends through the through-hole 51h and projects into the same position as the first surface 51a or projects beyond a position of the first surface 51a in the Z-direction. The electronic component 10 is fixed to the second fixing section 83 on the side of the first surface 51a. According to this design, the electronic component 10 can be easily fixed to the second fixing section 83, since the second fixing section 83 projects near the first surface 51a. This further improves the ease of assembly of the electrical connection unit 1. Furthermore, the second fixing section 83 projects to allow insertion into the through-hole 51h, thus enabling the base plate 41 to be positioned closer to the metal plate 80.If the base plate 41 can be easily positioned near the metal plate 80, it is easy to further reduce the height of the electrical connection unit 1.

[0236] In the present embodiment, the first fixing section 82 has the first coupling hole 82h, which is open in the Z-direction and is coupled to the first fastening element 111, which fixes the base plate 41 to the metal plate 80. The second fixing section 83 has a second coupling hole 83h, open in the Z-direction, which is coupled to a second fastening element 112 to fix the electronic component 10 to the metal plate 80. According to such a design, the working direction for fixing the base plate 41 to the first fixing section 82 and the working direction for fixing the electronic component 10 to the second fixing section 83 can be aligned in the same direction. If these working directions are the same, the assembly capability of the electrical connection unit 1 can be further improved.

[0237] In the present embodiment, the electrical connection unit 1 includes the connection component 20, which electrically connects the electronic component 10 to the busbar 42. The connection component 20 is fixed to the electronic component 10 and also to the busbar 42. According to this configuration, the electronic component 10 is fixed to the busbar 42 via the connection component 20, in addition to being fixed to the metal plate 80. This further reinforces the fixing structure of the electronic component 10.

[0238] In the present embodiment, the electrical connection unit 1 includes the fastening element 43, which projects from the busbar 42 in the Z-direction. The connection component 20 is attached to the fastening element 43 in the Z-direction and connected to the busbar 42. According to this design, the working direction for fixing the base plate 41 to the first fixing section 82, the working direction for fixing the electronic component 10 to the second fixing section 83, and the working direction for fixing the connection component 20, which is fixed to the electronic component 10, to the busbar 42 can all be aligned in the same direction. If these working directions are the same, the ease of assembly of the electrical connection unit 1 can be further improved. <G. Vorteile der Struktur zur Konvektionserzeugung>

[0239] For comparison: If the metal plate 80 faces the second surface 51b of the flat surface section 51 of the base plate 41, heat can become trapped in the gap S1 between the flat surface section 51 of the base plate 41 and the metal plate 80. If heat accumulates in the gap S1, the heat dissipation properties of the electrical connection unit 1 can deteriorate.

[0240] On the other hand, in the present embodiment, the electrical connection unit 1 comprises the base plate 41, the busbar 42, and the metal plate 80. The base plate 41 has the plate-like shape of the flat surface section 51. The flat surface section 51 has the receiving section 55, which is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction, and the through-hole 51h, which penetrates the flat surface section 51 in the Z-direction. At least a portion of the busbar 42 is received in the receiving section 55 and extends along the flat surface section 51. The metal plate 80 comprises the flat surface section 81 and a projecting section (for example, the second fixing section 83 or the projecting section 84).The flat surface section 81 has a plate shape facing the second surface 51b, with the first gap S1 located between the flat surface section 81 and the second surface 51b. The protruding section extends from the flat surface section 81 in the Z-direction and is inserted into the through-hole 51h, forming the second gap S2 through which air can flow between the protruding section and the inner circumferential surface 51ha of the through-hole 51h. According to this configuration, the airflows indicated by arrows A1 to A3 described above are generated, and the heat dissipation properties of the electrical connection unit 1 can be improved.

[0241] In the present embodiment, the projecting section extends through the through-hole 51h and projects into the same position as the first surface 51a or projects beyond a position of the first surface 51a in the Z-direction. According to such a configuration, the airflows indicated by arrows A1 to A3 described above are more likely to be generated. Therefore, the heat dissipation properties of the electrical connection unit 1 can be further improved.

[0242] In the present embodiment, the protruding section is the fixing section 83, to which the electronic component 10 is fixed. According to this design, the airflows indicated by arrows A1 to A3 described above are generated by the use of the fixing section 83, to which the electronic component 10 is fixed. This makes it possible to improve the heat dissipation properties of the electrical connection unit 1 while simultaneously achieving miniaturization. <H. Vorteile der Schutzstruktur in Bezug auf thermische Ausdehnung / Kontraktion>

[0243] As a comparative example, a setup with the fixing section 52 without the stationary plate section 52a is considered. In such a setup of the comparative example, due to the expansion / contraction of the resin at a high / low temperature, a length difference is created between the fixing positions of the base plate 41 and the metal plate 80, and there is a possibility that the area around the fixing section 52 of the base plate 41 will be damaged.

[0244] On the other hand, in the present embodiment, the electrical connection unit 1 comprises the metal plate 80, the first electronic component 10, the first busbar 42, and the first base plate 41. The first base plate 41 comprises the first flat surface section 51, the vertical plate section 52a, and the horizontal plate section 52b. The first flat surface section 51 has a first surface 51a facing the electronic component 10 and a second surface 51b located on the side opposite the first surface 51a and facing the metal plate 80, and has a plate-like shape that supports the first busbar 42. The vertical plate section 52a has a plate-like shape that extends from the first flat surface section 51 in the Z-direction and intersects the first surface 51a.The horizontal plate section 52b is supported by the vertical plate section 52a, is located at a position differing from the first surface 51a in the Z-direction, and is fixed to the metal plate 80. According to this configuration, the thermal expansion / contraction of the base plate 41 can be accommodated by the displacement of the first plate section 52a. This reduces the possibility of damage occurring near the fixing section 52 of the base plate 41. Thus, the durability of the electrical connection unit 1 can be improved.

[0245] In the present embodiment, the metal plate 80 comprises the flat surface section 81, which faces the second surface 51b of the flat surface section 51, and the first fixing section 82, which projects from the flat surface section 81 in the Z-direction and to which the horizontal plate section 52b of the first base plate 41 is fixed. According to this design, the horizontal plate section 52b is easily fixed to the metal plate 80. With the first plate section 52a provided, it is easy to ensure an insulating property between the fixing section 52b of the metal plate 80 and the busbar 42.

[0246] In the present embodiment, the first base plate 41 has a through-hole 51h that penetrates the flat surface section 51 in the Z-direction. The metal plate 80 has a fixing section 83 that projects from the flat surface section 81 in the Z-direction, is inserted into the through-hole 51h of the first base plate 41, and to which the first electronic component 10 is fixed. The length L1 of the vertical plate section 52a in the Z-direction is greater than the length L2 of the fixing section 83 in the Z-direction. According to this design, the vertical plate section 52a is large, and the thermal expansion / contraction of the base plate 41 is more easily accommodated.

[0247] In the present embodiment, the electrical connection unit 1 further comprises the second base plate 41. The second base plate 41 comprises the second flat surface section 51, the upright plate section 52a, and the horizontal plate section 52b. The second flat surface section 51 has a plate-like shape, comprises the third surface 51a, which faces the second electronic component, and the fourth surface 51b, which is located on the side opposite the third surface 51a and faces the metal plate 80, and supports the second busbar 42. The second flat surface section 51 has a plate-like shape that extends from the second flat surface section 51 in the Z-direction.The horizontal plate section 52b is supported by the vertical plate section 52a, is positioned differently from the first surface 51a in the Z-direction, overlaps the horizontal plate section 52b of the first base plate, and is fixed to the metal plate 80. According to this configuration, the horizontal plate sections 52b of the two base plates 41 are fixed to a fixing section 82. In this way, the electrical connection unit 1 can be miniaturized. <I. Vorteile des Herstellungsverfahrens>

[0248] As a comparative example, consider a setup in which an electronic component and a busbar are directly connected. In such a setup, either state (1) or (2) can occur. (1) If a busbar is first attached to an electronic component and then mounted to an enclosure, the contact with a peripheral component and the busbar mounting must be checked while the busbar is housed in the enclosure, which can impair its functionality. (2) If the electronic component and busbar are attached after they are housed in the enclosure, space for horizontal mounting is required, and thus unusable space can be created in the electrical connection unit.

[0249] On the other hand, in the present embodiment, a method for manufacturing the electrical connection unit 1 includes preparing the routing board 40, forming the assembly SA, and connecting a connection component (connection component 20, connection component 30, or connection component 100) to the busbar 42. The routing board 40 comprises the base plate 41 with the plate-shaped, flat surface section 51 and the busbar 42, which is held by the flat surface section 51. The flat surface section 51 has the receiving section 55, which is recessed in the Z-direction or penetrates the flat surface section 51 in the Z-direction. At least a portion of the busbar 42 is received in the receiving section 55 and extends along the flat surface section 51.Forming the assembly SA involves fixing the connecting component to a connection target component (the electronic component 10, the coupling busbar 75, or the external connection busbar 76) using a first fastening element (fastening element 71, fastening element 72, or fastening element 73) to form the assembly SA, in which the connection target component and the connecting component are integrated. Connecting the connecting component to the busbar 42, after the assembly SA has been formed, involves connecting the connecting component contained in the assembly SA to the busbar 42 using a second fastening element (for example, fastening element 43). According to this assembly, the mountability of the connection target component and the connecting component with respect to the busbar 42 can be improved.This can improve the assembly capability of the electrical connection unit 1.

[0250] The second fastening element is not limited to the fastening element 43 that protrudes from the busbar 42. In a case where a fastening hole (for example, a screw hole) is formed in the busbar 42, the second fastening element can be a fastening element (for example, a bolt or a screw) that passes through an insertion hole formed in the connection target component and couples with the fastening hole of the busbar 42.

[0251] In the present embodiment, an example of the connection target component is the electronic component 10. The connection component is fixed to the terminal 13 of the electronic component 10 using the first fastening element. According to such a configuration, forming the assembly SA using the electronic component 10 and the connection component 20 can improve the mountability of the electronic component 10 and the connection component 20 with respect to the busbar 42. Thus, the mountability of the electrical connection unit 1 can be improved.

[0252] In the present embodiment, the fixing of the connecting component to the connecting target component is carried out using the first fastening element in a state in which the connecting target component and the connecting component are in a first position. The fixing of the connecting component contained in assembly SA to the busbar 42 using the second fastening element is carried out in a state in which the connecting target component and the connecting component are in a second position, different from the first.According to such a setup, even in a case where the connection direction between the connection target component and the connection component is the horizontal direction in the assembled state of the electrical connection unit 1, the load on a worker can be reduced and the assembly capability of the electrical connection unit 1 improved by fixing the connection target component and the connection component in a direction that differs from the horizontal direction at the time of assembly.

[0253] In the present embodiment, the connecting component includes a first mounting hole into which the first fastener is inserted, and a second mounting hole that is open in a different direction than the first mounting hole and into which the second fastener is inserted. The first orientation is one in which the first mounting hole is oriented in a first mounting direction. The second orientation is one in which the first mounting hole is oriented in a different direction than the first mounting direction, and the second mounting hole is oriented in the first mounting direction.According to such a design, even in a case where the connection direction between the connection target component and the connection component is horizontal, the fastening direction of the connection target component and the connection component, and the mounting direction of the assembly SA with respect to the busbar 42, can be aligned in the same direction. This further reduces the workload for a worker and further improves the assembly capability of the electrical connection unit 1.

[0254] In the present embodiment, the connecting component 20 comprises the first section 21, to which the first fastening element is attached and which is connected to the electronic component 10, and the second section 22, to which the second fastening element is attached and which is connected to the busbar 42. The thickness T1 of the first section 21 in the X-direction is greater than the thickness of the second section 22 in the Z-direction. According to this configuration, the connecting component 20 has a greater heat capacity per unit length than the busbar 42. Therefore, even in a case where a large current flows through the electronic component 10 for a short period and the temperature of the electronic component 10 increases rapidly, some of the heat generated by the electronic component 10 is stored by the connecting component 20.This makes it possible to suppress temperature changes within the electrical connection unit 1. This allows the thermal properties (for example, the thermal resistance) of the electrical connection unit 1 to be improved.

[0255] From another perspective, in the present embodiment, the connecting component 20 is arranged between the first terminal 13 of the electronic component 10 and the busbar 42. The connecting component 20 electrically connects the electronic component 10 to the busbar 42. The thickness of at least part of the connecting component 20 is greater than the plate thickness of the busbar 42 in the Z-direction. According to this configuration, the connecting component 20 has a greater heat capacity per unit length than the busbar 42. Therefore, even in a case where a large current flows through the electronic component 10 for a short period and the temperature of the electronic component 10 increases rapidly, some of the heat generated by the electronic component 10 is stored by the connecting component 20.This makes it possible to suppress temperature changes within the electrical connection unit 1. This allows the thermal properties (for example, the thermal resistance) of the electrical connection unit 1 to be improved. <J. Vorteile der Unterteilungsstruktur>

[0256] As a comparative example, a structure is considered in which the metal plate 80 is not present, and the main body MU is divided into a plurality of subunits SU. In such a comparative example, it may be necessary to increase the thickness of the base plate 41 or to add a reinforcing component to ensure the stiffness of a coupling section of the plurality of subunits SU. In this case, it may be difficult to reduce the height of the electrical connection unit 1.

[0257] On the other hand, in the present embodiment, the electrical connection unit 1 comprises the first subunit SU, the second subunit SU, which is electrically connected to the first subunit SU, and the metal plate 80. The first subunit SU comprises a plurality of first electronic components (for example, the plurality of electronic components 10), a plurality of first busbars (for example, the plurality of busbars 42), and a first base element (for example, the base plate 41). The plurality of first busbars comprises sections that lie on the same plane and are electrically connected to the plurality of first electronic components. The first base element comprises a plate-shaped first flat surface section that supports the plurality of first busbars.The second subunit SU contains a plurality of second electronic components (for example, the plurality of electronic components 10), a plurality of second busbars (for example, the plurality of busbars 42), and a second base element (for example, the base plate 41). The plurality of second busbars contain sections that lie on the same plane and are electrically connected to the plurality of second electronic components. The second base element contains a plate-shaped second flat surface section that holds the plurality of second busbars. The metal plate 80 is fixed to both the first subunit SU and the second subunit SU, holding the first and second subunits firmly together. According to this configuration, the rigidity of the coupling section between the first subunit SU and the second subunit SU can be ensured by the metal plate 80.Therefore, it is not or less necessary to increase the thickness of the base plate 41 or to add a reinforcing component, and it is possible to reduce the height of the electrical connection unit 1 compared to the case where the metal plate 80 is not present.

[0258] In the present embodiment, the first flat surface section comprises a plurality of first receiving sections that are recessed in the Z-direction or penetrate the first flat surface section in the Z-direction to accommodate a plurality of first busbars. The second flat surface section comprises a plurality of second receiving sections that are recessed in the Z-direction or penetrate the second flat surface section in the Z-direction to accommodate a plurality of second busbars. According to such a design, it is possible to further reduce the height of the electrical connection unit 1.

[0259] In the present embodiment, the longitudinal direction of the first subunit SU is the X-direction. The longitudinal direction of the second subunit SU is also the X-direction. The second subunit SU is positioned adjacent to the first subunit SU in the X-direction. The longitudinal direction of the metal plate 80 is the X-direction. The length of the metal plate 80 in the X-direction is greater than the sum of the lengths of the first subunit SU in the X-direction and the lengths of the second subunit SU in the X-direction. With this configuration, it is easy to securely hold the first subunit SU and the second subunit SU together with the metal plate 80.

[0260] In the present embodiment, the electrical connection unit 1 further includes the coupling busbar 75, which electrically connects the first subunit SU to the second subunit SU. The coupling busbar 75 is arranged on the side opposite the metal plate 80 with respect to the first subunit SU and the second subunit SU. According to this design, the coupling section between the first subunit SU and the second subunit SU is reinforced on both sides in the Z-direction (the side in the +Z direction and the side in the -Z direction) by the metal plate 80 and the coupling busbar 75. This allows the metal plate 80 to be thinner, and the height of the electrical connection unit 1 can be further reduced.

[0261] In the present embodiment, the first subunit SU contains the first fixing section 52. The second subunit SU contains the second fixing section 52, which overlaps the first fixing section 52 when viewed from the Z-direction. The first fixing section 52 and the second fixing section 52 are fixed to the metal plate 80 by means of a fastening element 111. According to such a design, it is possible to reduce the size of the electrical connection unit 1 in the X-direction, and it is possible to reduce costs by decreasing the number of components. <15. Modification Examples>

[0262] The following are some modification examples. Note that in each modification example, the structure differs from the one described below and corresponds to the structure of the first embodiment. (First modification example)

[0263] The routing board 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrated by insert forming. For example, the busbar 42 can be positioned in the receiving section 55 after the base plate 41, which provides the receiving section 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 can be fixed to the receiving section 55 by a fit or by an adhesive or other fastener. In these cases, potting can be performed to fill any gap between the busbar 42 and the receiving section 55. (Second modification example)

[0264] A basic element of the busbar 40 is not limited to the base plate 41 with the plate-shaped, flat surface section 51. The busbar 40 can be a basic element (for example, an insulating film) with a sheet-like, flat surface section 51. In this case, the receiving section 55 can be formed by a portion of the flat surface section 51 that follows the outer shape of the busbar 42. In the present disclosure, the term "sheet-like" or "sheet" is not limited to an element with a thickness of 1 mm or more, and an element (a so-called film) with a thickness of less than 1 mm can also be used. (Third modification example)

[0265] The base plate 41 of the installation board 40 can contain a plurality of elements (plate elements or sheet metal elements). These elements are provided to accommodate the plurality of busbars 42, which are arranged horizontally. For example, the plurality of elements are integrated by joining the plurality of busbars 42 together, for instance, by laminate forming. The plurality of elements forms the flat surface section 51. In this case, the receiving section 55 can be formed in a hollow shape within the base plate 41 (between the plurality of elements). The plurality of elements can be a plurality of plate elements, a plurality of sheet metal elements, or a combination of a plate element and a sheet metal element. The plate element can, for example, be a flexible plate element.The flat surface section 51 formed from the majority of the elements has an opening through which at least the first connecting section 61 and the second connecting section 62 of the busbar 42 are exposed. (Fourth modification example)

[0266] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting component 20. The electronic component 10 can be connected directly to the busbar 42 by means of a fastening element (for example, a bolt or a screw), by welding, or similar means. (Second embodiment)

[0267] Next, a second embodiment is described. The second embodiment differs from the first in that an opening 121 for heat dissipation is provided in a base plate 41. Apart from what is described below, the structure is the same as in the first embodiment.

[0268] Fig. Figure 35 is a perspective view to describe a subunit SU of the second embodiment. Fig. 36 is a cross-sectional view along line F36-F36 of the in Fig. Figure 35 illustrates the structure. Similar to the first embodiment, in the electrical connection unit 1 of the second embodiment, the metal plate 80 is arranged with the gap S1 between the metal plate 80 and the base plate 41 and faces the second surface 51b of the flat surface section 51. The heat transfer element 92 is located between the busbar 42 and the metal plate 80. In this configuration, heat can be trapped in the gap S1 between the base plate 41 and the metal plate 80.

[0269] In the present embodiment, the flat surface section 51 of the base plate 41 has an opening 121 for heat dissipation. The opening 121 penetrates the flat surface section 51 in the Z-direction, communicates with the gap S1 between the flat surface section 51 and the metal plate 80, and allows air to flow through it. The air in the gap S1 between the flat surface section 51 and the metal plate 80 is moved through the opening 121 over the flat surface section 51, for example, in response to heating.

[0270] According to this design, it is less likely that heat will be trapped in the gap S1 between the base plate 41 and the metal plate 80. In a case where heat is hardly trapped in the gap S1, the heat dissipation properties of the busbar 42 are improved. If the heat dissipation properties of the busbar 42 are improved, the heat dissipation properties of the electrical connection unit 1 can also be improved. (Third embodiment)

[0271] Next, a third embodiment is described. The third embodiment differs from the first embodiment in that an insulating section is provided to improve an insulating property between adjacent busbars 42. Apart from what is described below, the construction is the same as in the first embodiment.

[0272] Fig. Figure 37 is a perspective view illustrating a subunit SU of the third embodiment. In the third embodiment, the base plate 41 includes a cover section 51v. The cover section 51v is an insulator that covers a portion of the busbar 42 on the first surface 51a and / or the second surface 51b. For example, the cover section 51v covers at least a portion of the extending section 63 of the busbar 42. Instead of / in addition to the above example, the cover section 51v covers at least a portion of the extension 64 of the busbar 42. For example, the cover section 51v is provided in a section where two busbars 42 are adjacent to each other at a predetermined distance.

[0273] According to such a design, it is easy to improve the insulating properties between adjacent busbars 42 and to ensure an insulating distance between them. Note that the cover section 51v, for example, can be formed by insert forming, similar to other sections of the flat surface section 51. Alternatively, the cover section 51v can also be formed by applying an insulating material to the surface of the busbar 42, by adhering an insulating film, or similar means. The cover section 51v can be provided as part of the base plate 41 or formed from a component that is attached to the base plate 41 after being supplied separately from the base plate 41. (Fourth embodiment)

[0274] Next, a fourth embodiment is described. The fourth embodiment differs from the first embodiment in that a retaining section 131, which supports a busbar 42, is provided. Apart from what is described below, the construction is the same as in the first embodiment.

[0275] Fig. Figure 38 is a perspective view to describe a subunit SU of the fourth embodiment. Fig. 39 is a cross-sectional view along line F39-F39 of the in Fig. Figure 38 illustrates the structure. In the fourth embodiment, the base plate 41 has retaining sections 131 and 132 which, viewed from the Z-direction, overlap a portion of the busbar 42 and support the busbar 42 in the Z-direction. Note that only one of the retaining sections 131 and 132 can be provided.

[0276] For example, the retaining section 131 is located next to the first surface 51a of the flat surface section 51, above the busbar 42, and supports the busbar 42 from above. The retaining section 131 holds the busbar 42 securely, preventing it from falling upwards. The retaining section 132, on the other hand, is located next to the second surface 51b of the flat surface section 51 and supports the busbar 42 from below. The retaining section 132 holds the busbar 42 securely, preventing it from falling downwards. The retaining sections 131 and 132 are provided, for example, in the extending section 63 or the extension 64 of the busbar 42. However, the retaining sections 131 and 132 can also be provided in the first connecting section 61 or the second connecting section 62 of the busbar 42.

[0277] According to such a design, even if a gap could arise between the receiving section 55 and the busbar 42 due to a difference between the linear expansion coefficient of the base plate 41 and the linear expansion coefficient of the busbar 42 at the time of thermal expansion, the busbar 42 is less likely to detach from the base plate 41. This improves the thermal resistance of the electrical connection unit 1.

[0278] Note that the retaining sections 131 and 132 can be formed similarly to other sections of the flat surface section 51, e.g., by insert forming. Alternatively, the retaining sections 131 and 132 can also be formed from separate components that are attached to the base plate 41 after being supplied separately from the base plate 41. (Modification example)

[0279] Fig. Figure 40 is a cross-sectional view illustrating a modification example of the fourth embodiment. In this modification example, the surface of the busbar 42 has a recess 42g extending in the -Z direction. The recess 42g extends, for example, in the Y direction. The lower surface of the busbar 42 also has a recess 42g extending in the +Z direction. The recess 42g extends, for example, in the Y direction.

[0280] In the present modification example, the retaining section 131 is provided in the recess 42g on the upper surface of the busbar 42. Similarly, the retaining section 132 is provided in the recess 42g on the lower surface of the busbar 42. For example, the retaining sections 131 and 132 are formed within the thickness of the busbar 42 in the Z-direction. With such a design, it is easy to further reduce the height of the electrical connection unit 1. (Fifth embodiment)

[0281] Next, a fifth embodiment is described. The fifth embodiment differs from the first embodiment in that a support section 141 is provided, which presses the busbar 42 against the heat transfer element 92. Apart from what is described below, the construction is the same as in the first embodiment.

[0282] Fig. Figure 41 is a perspective view to describe a subunit SU of the fifth embodiment. Fig. 42 is a cross-sectional view along line F42-F42 of the in Fig. 41 illustrated structure. In the fifth embodiment, the base plate 41 is arranged on the side opposite the heat transfer element 92 with respect to the busbar 42 and includes the support section 141, which presses the busbar 42 against the heat transfer element 92.

[0283] In the present embodiment, the heat transfer element 92 is elastic. If the busbar 42 can be pressed against the heat transfer element 92 to improve the contact between the busbar 42 and the heat transfer element 92, the heat dissipation properties can be improved. A plurality of support sections 141, for example, includes a support section 141A and a support section 141B. Note that only one of the support sections 141A and 141B can be provided.

[0284] For example, the support section 141A is arranged next to the first surface 51a of the flat surface section 51, is located above the busbar 42, and supports the busbar 42 from above. The support section 141A overlaps at least a portion of the heat transfer element 92 when viewed from the Z-direction. The support section 141A presses the busbar 42 against the heat transfer element 92 in a region that overlaps the heat transfer element 92 when viewed from the Z-direction.

[0285] For example, the support section 141B is arranged next to the first surface 51a of the flat surface section 51, is located above the busbar 42, and supports the busbar 42 from above. The support section 141B overlaps at least part of the electronic component 10 when viewed from the Z-direction. The support section 141B presses the busbar 42 against the heat transfer element 92 in a region that overlaps the electronic component 10 when viewed from the Z-direction.

[0286] Note that the support section 141 is not limited to the support section 141A or support section 141B described above and may be a support section that presses the busbar 42 against the heat transfer element 92 in a different position.

[0287] According to this design, the busbar 42 is pressed by the support section 141 towards the heat transfer element 92, and the contact between the busbar 42 and the heat transfer element 92 is improved. In this way, the heat dissipation properties of the electrical connection unit 1 can be further improved.

[0288] Note that the support section 141, like other sections of the flat surface section 51, can be formed, for example, by insert forming. Alternatively, the support section 141 can also be formed from separate components that are attached to the base plate 41 after being provided separately from the base plate 41.

[0289] Several embodiments and examples of modification have been described above. However, the embodiment and the examples of modification are not limited to the examples described above. For example, a plurality of embodiments can be implemented in combination with one another. The embodiments described above can be implemented in various other forms, and various additions, omissions, substitutions, and modifications can be made without departing from the concept of the present disclosure. INDUSTRIAL APPLICABILITY

[0290] According to the present disclosure, it is possible to improve the heat dissipation properties of the electrical connection unit. REFERENCE MARK LIST 1 electrical connection unit SU subunit 10 electronic components 13, 13A, 13B connection 20 connection components 21 first section 21h first mounting hole 22 second section 22h second mounting hole 30 connection components 31 first section 32 second section 40 installation board 41 Base plate 42 busbar 42e1 End of busbar 42p plate section 42u exposed section 42ua first section 42ub second section 43 Fastening element (fastening section) 51 flat surface section (insulating base section) 51a first surface, third surface 51b second surface, fourth surface 52 Fixing section 52a first section, third section 52b second section, fourth section 55 Recording section 56 Coupling section 56a In-depth study 61 first connecting section 62 second connecting section 63 extending section 64 Extension 71 Fastening element 72 Fastening element 73 Fastening element 80 metal plate 81 flat surface section (metal base section) 82 Fixing section 83 Fixing section 92 Heat transfer element 92a first heat transfer section 92b second heat transfer section 100 connection components 101 first section 102 second section 111 Fastening element 112 Fastening element 121 Opening 131, 132 Stop section 141 Support section

Claims

[1] Electrical connection unit (1) comprising: a first electronic component (10); a basic element (41) comprising a flat surface section (51) having a plate or sheet shape and a first surface (51a) facing the first electronic component (10) and a second surface (51b) located on one side opposite the first surface (51a), wherein the flat surface section (51) has a receiving section (55) that is recessed in a first direction or penetrates the flat surface section (51) in a first direction, in a case where a thickness direction of the flat surface section (51) is the first direction; and a busbar (42) which is electrically connected to the first electronic component (10) and includes a plate section (42p) which is received in the receiving section (55) and extends along the flat surface section (51), wherein the plate section (42p) includes an exposed section (42u) which is exposed to an outside of the base element (41) on the side of the second surface (51b). [2] Electrical connection unit (1) according to claim 1, further comprising: a connecting component (20) that connects the first electronic component (10) to the busbar (42), wherein at least part of the exposed section (42u) of the busbar (42) is located in a region (R) that overlaps the connecting component (20) when viewed from the first direction. [3] Electrical connection unit (1) according to claim 1 or 2, further comprising: a metal plate (80) facing the second surface (51b) of the flat surface section (51), with a gap (S1) between the metal plate (80) and the flat surface section (51); and a heat transfer element (92) which is arranged between the exposed section (42u) of the busbar (42) and the metal plate (80). [4] Electrical connection unit (1) according to claim 3, further comprising a connecting component (20) that connects the first electronic component (10) to the busbar (42), wherein at least part of the exposed section (42u) of the busbar (42) is located in the region (R) that overlaps the connecting component (20) when viewed from the first direction, and at least part of the heat transfer element (92) overlaps the exposed section (42u) of the busbar (42) in the region (R) that overlaps the connecting component (20) when viewed from the first direction. [5] Electrical connection unit (1) according to claim 4, wherein the exposed section (42u) of the busbar includes a first section (42ua) located in the region (R) overlapping the connecting component (20) when viewed from the first direction, and a second section (42ub) located in a region (R) overlapping the first electronic component when viewed from the first direction, and the heat transfer element (92) includes a first heat transfer section (92a) that overlaps the first section (42ua) of the exposed section (42u) when viewed from the first direction, and a second heat transfer section (92b) that overlaps the second section (42ub) of the exposed section (42u) when viewed from the first direction. [6] Electrical connection unit (1) according to claim 5, wherein the second section (42ub) of the exposed section (42u) of the busbar (42) is exposed to the outside of the base element (41) not only on the side of the second surface (51b) but also on the side of the first surface (51a) and the first electronic component (10). [7] Electrical connection unit (1) according to claim 1 or 2, wherein the busbar (42) is received over an entire length of the busbar (42) in the receiving section (55), extends along the flat surface section (51), and is exposed to the outside of the base element (41) on the side of the second surface (51b).

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