LIGHT EMIPING MODULE

Abstract

A light-emitting module comprises a light-emitting device and a wiring plate. The light-emitting device includes a substrate on which semiconductor laser elements are arranged along a longitudinal direction. The wiring plate has a mounting surface that includes a first region on which the light-emitting device is mounted. The wiring plate has a longitudinal direction extending in a first direction. The wiring plate includes first and second fixation regions, a first electrode region to which the substrate is connected, and a second electrode region. The second electrode region is configured to be connected to an interconnect for electrical connection to an external device. In the top view, the first region is located between the first and second fixation regions.The second fixation area is positioned between the first and second electrode areas. The substrate has a longitudinal orientation that extends in the first direction.

Description

CROSS-REFERENCE TO A RELATED REGISTRATION

[0001] This application claims priority over Japanese patent application No. 2024-173252, filed on October 2, 2024, the disclosure of which in its entirety is hereby incorporated by reference. TECHNICAL AREA

[0002] The present disclosure relates to a light-emitting module. BACKGROUND

[0003] Japanese patent publication No. 2024-42909 discloses a light-emitting module in which a light-emitting element is mounted on a wiring board. This light-emitting module is configured such that a through-hole provided in the wiring board can be used as a screw hole and connected to another component. OVERVIEW

[0004] One objective of the present disclosure is to provide a compact light-emitting module which takes into account the possibility of assembly.

[0005] As disclosed in various embodiments of the invention, a light-emitting module comprises a light-emitting device and a wiring board. The light-emitting device includes a plurality of semiconductor laser elements and a substrate on which the plurality of semiconductor laser elements are arranged along a longitudinal direction of the substrate. The wiring board has a mounting surface comprising a first region on which the light-emitting device is mounted. In a top view viewed from a direction orthogonal to the mounting surface, the wiring board has a longitudinal direction extending in a first direction and a lateral direction extending in a second direction orthogonal to the first direction.The wiring plate includes a first fixing area and a second fixing area, where the wiring plate is configured to be fixed in place; a first electrode area, to which the substrate is connected for electrical contact with the majority of semiconductor laser elements; and a second electrode area, which is electrically connected to the first electrode area. The second electrode area is configured to be connected to a connecting element for electrical connection of the light-emitting device to an external device. In the top view, the first area is located between the first fixing area and the second fixing area. The second fixing area is located between the first electrode area and the second electrode area.The substrate has a longitudinal direction extending in the first direction and a lateral direction extending in the second direction.

[0006] In at least one of the embodiments of the invention disclosed herein, a compact light-emitting module can be provided which takes into account the mountability. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a perspective view of the light-emitting module according to one embodiment. Fig. Figure 2 is a top view of the light-emitting module according to one embodiment. Fig. Figure 3 is a lateral side view of the light-emitting module according to one embodiment. Fig. Figure 4 is a perspective view of the light-emitting device according to one embodiment. Fig. 5 is a lateral side view of the in Fig. 4 light-emitting device shown. Fig. Figure 6A is a top view of the light-emitting device according to one embodiment. Fig. 6B is a sectional view of the light-emitting device, taken along the VIB-VIB line in Fig. 6A. Fig. Figure 7 is a perspective view of the packaging according to one embodiment. Fig. Figure 8A is a top view of the packaging according to one embodiment. Fig. 8B is a sectional view of the package according to one embodiment, taken along line VIIIB-VIIIB in Fig. 8A. Fig. Figure 9 is a top view of the substrate according to one embodiment. Fig. Figure 10 is a bottom view of the substrate according to one embodiment. Fig. 11 is a sectional view, taken along line XI-XI in Fig. 9. Fig. Figure 12 is a top view to illustrate the internal structure of the light-emitting device according to one embodiment. Fig. Figure 13A is a view in which a wiring pattern is overlapped on the top view of the wiring board according to one embodiment. Fig. Figure 13B is a top view of the wiring pattern on the wiring board according to one embodiment. Fig. Figure 13C is a representation of the wiring pattern on the wiring board according to one embodiment. Fig. Figure 14 is a perspective view of the light-emitting module according to another embodiment. Fig. 15A is a view in which a wiring pattern is overlapped on the top view of the wiring board according to another embodiment. Fig. Figure 15B is a top view of the wiring pattern on the wiring board according to a further embodiment. Fig. Figure 15C is a representation of the wiring pattern on the wiring board according to another embodiment. DETAILED DESCRIPTION

[0007] With regard to polygons, such as triangles and quadrilaterals, referenced in this description and the claims, the term "polygon" is understood to include a polygon that has rounded, chamfered, rounded, or otherwise configured corners. The term "polygon" also includes a polygon that, in addition to the corner (end of each side), has a rounded corner at any intermediate region of any side. In short, a partially machined shape based on a polygon is also included in the interpretation of the "polygon" described in this description and the claims.

[0008] Furthermore, the same applies to words or terms that refer to a specific shape, such as a trapezoid, a circle, or protrusions and indentations, as well as to each face that forms that shape. In short, even if the corner or an intermediate area of ​​a given face is modified, the modified area is included in the interpretation of the "face." It should be noted that if the "polygon" or "face" that has not been modified is to be distinguished from the modified shape, the word "strict" is added, as in "strict quadrilateral."

[0009] It is assumed that in the present description and claims, expressions such as "top / bottom (upwards / downwards)", "above / below", "left / right", "front / backwards", "in front / after (forwards / backwards)" and "forwards / backwards" refer only to relative positions, orientations and directions; they do not necessarily have to correspond to the conditions in use.

[0010] In drawings, directions such as the X, Y, and Z directions are often indicated by arrows. The direction indicated by such an arrow is derived from multiple drawings depicting the same embodiment. The direction of an arrow to which X, Y, and Z are added is a positive direction, and the opposite direction is a negative direction. For example, X at the tip of a particular arrow indicates an X direction and a positive direction. It should be noted that the direction that is the X direction and a positive direction is referred to as the "positive X direction," while the opposite direction is referred to as the "negative X direction." It is understood that when the "X direction" is referenced, it indicates both positive and negative directions. The same applies to the Y and Z directions.

[0011] In the present description, it is assumed that when the phrase "one or more" is added to a particular subject to explain it, configurations with one subject and multiple subjects are described collectively. Accordingly, the explanation specified by the phrase "one or more" is to be understood as supporting an embodiment that includes one or more subjects, an embodiment that includes at least one subject, and an embodiment that includes multiple subjects.

[0012] The description given here for "one or each" item encompasses a joint explanation of one item in an embodiment comprising one item, an explanation of one item in an embodiment comprising multiple items, and an explanation of multiple items in an embodiment comprising multiple items. Accordingly, the description relating to the explanation of "one or each" item provides complete support for an explanation of one item in an embodiment comprising one item, an explanation of at least one item in an embodiment comprising multiple items, and an explanation of multiple items in an embodiment comprising multiple items.

[0013] When components are explained herein, the terms "parts" and "areas" are often added. "Part" refers to a single object when viewed physically. This single object might be considered as a part in a manufacturing process. Conversely, "part" or "area" refers to an object that is not necessarily viewed as a single physical object. For example, when a part of a single component is considered, or when multiple components are considered as a single object, the terms "part" or "area" are used.

[0014] Such a distinction between the “component” and the “part” or “area” does not indicate any intention to deliberately limit the scope of rights in the interpretation of the teaching from the equivalents. In other words, even if a component is designated as a “component” in the claims, the applicant does not necessarily acknowledge that it is essential for the application of the present invention to consider this component as a single physical object.

[0015] In this description and in the claims, when there are multiple specific components to be described independently, the words "first" and "second" are often placed directly before the components. There may be a case where the items to be distinguished differ between this description and the claims. Therefore, even if the component that has the same additional remark in the description is also included in the claims, the item specified by that component may not be the same between this description and the claims.

[0016] For example, if there are components that are to be distinguished by the additional remarks "first," "second," and "third" in the present description, and the components bearing the additional remarks "first" and "third" are specified in the claims, these components are distinguished by the additional remarks "first" and "second" so that they are visible in the claims. In this case, it is assumed that the components followed by "first" and "second" refer to the components followed by "first" and "third." It should be noted that this rule can reasonably and flexibly be applied not only to components but also to other things.

[0017] Several ways of carrying out the invention will now be explained. With reference to the accompanying drawings, some specific ways of carrying out the invention are explained; however, it is assumed that the ways of carrying out the invention are not limited to these. In other words, the embodiments shown here do not represent just one way of realizing the present invention. It is further assumed that the size, position, etc., of the component shown in each drawing are exaggerated for the sake of clarity. Designs

[0018] A light-emitting module 901 according to an embodiment of the invention will now be explained. Fig. 1, Fig. 2 and Fig. Figure 3 shows an exemplary mode of the light-emitting module 901. Fig. Figure 1 is a perspective view of the light-emitting module 901 according to an embodiment of the invention; Fig. Figure 2 is a top view of the light-emitting module 901; and Fig. Figure 3 is a lateral side view of the light-emitting module 901.

[0019] The light-emitting module 901 comprises a plurality of components, including a plurality of light-emitting devices 1, a wiring board 101, a connector 201 and a thermistor 301.

[0020] It is assumed here that the light-emitting module 901 may also include other components. For example, the light-emitting module 901 may include a light-emitting device that differs from the assemblies 1, and some of the multiple components mentioned here may be omitted.

[0021] The light-emitting module 901 can comprise a light-emitting device 1 containing one or more light-emitting elements 20 and a substrate 11 on which the one or more light-emitting elements 20 are mounted, as well as a wiring plate 101 having a mounting surface that includes a first area 1A on which the light-emitting device 1 is mounted. A semiconductor laser element can be used for the light-emitting element 20. The wiring plate 101 includes an electrode area 101E for electrically connecting the light-emitting device 1 to the outside (e.g., an external device such as a power source). The electrode area 101E is connected to a connecting component, such as a connector 201 and a wire. The light-emitting module 901 can have a shape that includes a connecting component, such as a connector 201 or a wire.The light-emitting module 901 may further include a thermistor 301, which is operated as a temperature sensing element configured to measure temperatures.

[0022] Each component of the light-emitting module 901 will now be explained. Light-emitting device 1

[0023] The light-emitting device 1 according to one embodiment is first explained. Fig. Figures 4 to 12 are representations of an exemplary form of the light-emitting device 1. Fig. Figure 4 is a perspective view of the light-emitting device 1 according to one embodiment. Fig. 5 is a lateral side view, which the Fig. 4 corresponds to. Fig. Figure 6A is a top view of the light-emitting device according to one embodiment. Fig. 6B is a sectional view of the light-emitting device, taken along the VIB-VIB line in Fig. 6A. Fig. Figure 7 is a perspective view of the packaging according to one embodiment. Fig. Figure 8A is a top view of the packaging according to one embodiment. Fig. 8B is a sectional view of the package according to one embodiment, taken along line VIIIB-VIIIB in Fig. 8A. Fig. Figure 9 is a top view of the substrate according to one embodiment. Fig. Figure 10 is a bottom view of the substrate according to one embodiment. Fig. 11 is a sectional view, taken along line XI-XI in Fig. 9. Fig. Figure 12 is a top view to explain the internal structure of the light-emitting device according to one embodiment.

[0024] The light-emitting device 1 comprises a plurality of components. Several such components include a packing 10, one or more light-emitting elements 20, one or more submounts 30, one or more reflective components 40, a plurality of wires 60, and an optical component 70.

[0025] It should be noted that the light-emitting device 1 may also comprise other components. For example, apart from the one or more light devices 20, the light-emitting device 1 may include an additional light-emitting element or devices. It is also assumed that some of the multiple components mentioned here need not be included in the light-emitting device 1.

[0026] Each of the components of the light-emitting device 1 will now be explained. Pack of 10

[0027] The package 10 comprises a substrate 11 and a lid 14. The lid 14 is connected to the substrate 11, thus forming the package 10. An internal space is defined within the package 10, such that other components can be located within it. This internal space is a closed space surrounded by the substrate 11 and the lid 14. Such an internal space can be sealed in a vacuum or airtight condition.

[0028] In a top view, the packing 10 has a rectangular outer edge shape. This rectangular shape can include a long side and a short side. In the illustrated packing 10, the long-side direction of this rectangular shape is the same as the X-direction, and the short-side direction is the same as the Y-direction. In a top view, the outer edge shape of the packing 10 is not necessarily rectangular.

[0029] Within the packing 10, an internal space is defined in which another component(s) is located. A first upper surface 11A of the packing 10 forms part of a region that defines the internal space. Each inner surface 11E and a lower surface 14B of the packing 10 form part of a region that defines the internal space.

[0030] Substrate 11 has a first upper surface 11A and a lower surface 11B. Substrate 11 has a second upper surface 11C. Substrate 11 has one or more outer surfaces 11D. Substrate 11 has one or more inner surfaces 11E. The one or more outer surfaces 11D intersect the second upper surface 11C. The one or more outer surfaces 11D intersect the one or more outer surfaces 11D and intersect the lower surface 11B. The one or more inner surfaces 11E intersect the second upper surface 11C.

[0031] In a top view, the outer edge shape of the substrate 11 is rectangular. In a top view, the outer edge shape of the substrate 11 is the same as the outer edge shape of the packing 10. In a top view, the outer edge shape of the first upper surface 11A is rectangular. This rectangle may have a long side and a short side. The long-sided direction of the first upper surface 11A is parallel to the long-sided direction of the outer edge shape of the substrate 11. In a top view, the outer edge shape of the first upper surface 11A need not be rectangular.

[0032] In a plan view, the first upper surface 11A is surrounded by the second upper surface 11C. The second upper surface 11C is an annular surface that surrounds the first upper surface 11A in a plan view. The second upper surface 11C is an annular rectangular surface. A frame defined by the inner edge of the second upper surface 11C is called the inner frame of the second upper surface 11C, and a frame defined by the outer edge of the second upper surface 11C is called the outer frame of the second upper surface 11C.

[0033] Substrate 11 includes a recessed area surrounded by the frame of the second upper surface 11C. The recessed area defines a region that extends downwards from the second upper surface 11C into substrate 11. The first upper surface 11A is part of the recessed area. One or more inner lateral surfaces 11E are also part of the recessed area. The second upper surface 11C is located at a higher level than the first upper surface 11A.

[0034] Substrate 11 includes one or more stepped regions 11F. The stepped region 11F includes an upper surface 11G and a lateral surface 11H that intersects the upper surface 11G and extends downwards from the upper surface 11G. It is assumed that the surfaces of a stepped region are only an upper surface 11A and a lateral surface 11H. The upper surface 11G meets the inner lateral surface 11E. The lateral surface 11H meets the first upper surface 11A.

[0035] The one or each stepped region 11F is provided in a plan view within the inner frame of the second upper surface 11C. The one or each stepped region 11F is formed in a plan view along a region or the entire inner surface 11E. In the substrate 11, the lateral surface 11H is an inner lateral surface, but it is distinct from the inner surface 11E. The one or each inner lateral surface 11E and the one or each lateral surface 11H are orthogonal to the first upper surface 11A. The term "orthogonal" allows a difference of ±3 degrees.

[0036] Each stepped region 11F can comprise a first stepped region 11F1 and a second stepped region 11F2. The first stepped region 11F1 and the second stepped region 11F2 are positioned so that their respective lateral surfaces 11H face each other. Each of the first stepped region 11F1 and the second stepped region 11F2 is located on a short side of the inner frame of the second upper surface 11C.

[0037] The one or more internal lateral surfaces 11E can include a first and a second internal surface 11E1 and 11E2, respectively, which are opposite each other. The first upper surface 11A is located in a top view between the first internal surface 11E1 and the second internal surface 11E2. The first stepped region 11F1 is provided closer to the first internal surface 11E1. The second stepped region 11F2 is provided closer to the second internal surface 11E2.

[0038] The substrate 11 comprises a base region 11M and a frame region 11N. The base region 11M and the frame region 11N can be formed from different components. The substrate 11 can be formed such that it comprises a substrate component corresponding to the base region 11M and a frame component equivalent to the frame region 11N.

[0039] The base area 11M includes the first upper surface 11A. The frame area 11N includes the second upper surface 11C. The frame area 11N includes one or more outer sides 11D and one or more inner sides 11E. The frame area 11N includes one or more stepped areas 11F.

[0040] The base region 11M has a lower surface configured to form a region or all of the lower surface 11B of the substrate 11. If the lower surface of the base region 11M forms a specific region of the lower surface 11B of the substrate 11, the lower surface of the frame region 11N forms the remaining region of the lower surface 11B of the substrate 11.

[0041] The substrate 11 includes a plurality of wiring areas 12A. The plurality of wiring areas 12A includes one or more first wirings 12A1 located in the internal space of the pack 10, and one or more second wirings 12A2 located on the outer surface of the pack 10.

[0042] One or more first wiring areas 12A1 are provided on the upper surface 11G of the stepped area 11F. The substrate 11 includes one or more first wiring areas 12A1 arranged on the upper surface 11G of the first stepped area 11F1. The substrate 11 includes one or more second wiring areas 12A1 arranged on the upper surface 11G of the second stepped area 11F2.

[0043] One or every second wiring area 12A2 is located on the lower surface 11B of the package 10. One or every second wiring area 12A2 is located on the lower surface of the frame area 11N. It should be noted that the second wiring area 12A2 may be located on an outer surface that differs from the lower surface 11B of the package 10.

[0044] If the substrate 11 is divided into two regions by a virtual line passing through the lateral surface 11H of the first stepped region 11F1 and parallel to that lateral surface 11H in a top view, the substrate 11 includes one or more second wiring regions 12A2 provided on the lower surface 11B of the substrate 11 in a region that includes the upper surface 11G of the first stepped region 11F1.

[0045] If it is divided into two areas by a virtual line passing through the lateral surface 11H of the second stepped area 11F2 and parallel to this lateral surface 11H in a top view, the substrate 11 includes one or more second wiring areas 12A2 provided on the lower surface 11B of the substrate 11 in an area that includes the upper surface 11G of the second stepped area 11F2.

[0046] In substrate 11, one or more first wiring areas 12A1 are electrically connected to the second wiring area 12A2. One or more first wiring areas 12A1 are electrically connected to the second wiring areas 12A2, which differ from each other.

[0047] Substrate 11 incorporates a connection pattern. The connection pattern is provided on the second upper surface 11C. The connection pattern is arranged in an annular shape. The connection pattern is arranged in a rectangular, annular shape. In the top view, the first upper surface 11A is surrounded by the connection pattern.

[0048] For example, substrate 11 can be formed using a ceramic as the main material. The ceramic used as the main material of substrate 11 typically includes aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide.

[0049] It is assumed here that the main material refers to the material that has the highest volume ratio in the resulting product. However, if a component is made from a single material, then that material is the main material. It follows that a particular material being the main material includes a case where the proportion occupied by that material can reach 100%.

[0050] Substrate 11 can be formed using a base component and a frame component, each composed of different main materials. For example, the base component can be formed using a main material with good thermal conductivity, such as a metal, a metal-containing composite material, graphite, or diamond. The metal providing the main material of the base component includes, for example, copper, aluminum, or iron. The metal-containing composite providing the main material of the base component includes, for example, copper-molybdenum or copper-tungsten. The frame component can be formed, for example, using the aforementioned ceramic as the main material of substrate 11.

[0051] For example, wiring section 12A can be formed using a metal material as the main material. Examples of metal materials for the main material of wiring sections 12A can include a single metal, such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or an alloy containing these. Wiring section 12A can also be formed from one or more layers of metal.

[0052] For example, the bonding pattern can be formed using a metallic material as the main material. Examples of metallic materials for the main material of the bonding pattern can include a single metal, such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, or an alloy containing these. The bonding pattern can also be formed from one or more layers of metal.

[0053] The lid 14 has a top surface 14A and a bottom surface 14B. The lid 14 also has one or more lateral surfaces 14C. The lid 14 is configured in a flat cuboid shape. It should be noted that the shape of the lid 14 does not have to be cuboid.

[0054] The lid 14 is connected to the substrate 11. The lower surface 14B of the lid 14 is connected to the second upper surface 11C of the substrate 11. The lid 14 is connected to the substrate 11 via the connection pattern. The lid 14 is connected to the substrate 11 via an adhesive.

[0055] The lid 14 is light-transmitting. The term "light-transmitting" means that the transmission of light entering and passing through the lid 14 is at least 80%. The lid 14 may have a non-transmitting area (without light transmittance).

[0056] For example, lid 14 can be made using glass as the main material. Alternatively, lid 14 can be made using sapphire as the main material. Light-emitting element 20

[0057] A light-emitting element 20 has a top surface 21A, a bottom surface 21B, and a plurality of lateral surfaces 21C. The top surface 21A has a rectangular outer shape. This rectangular outer shape has a long side and a short side. In a top view, the light-emitting element 20 has a rectangular outer shape. This rectangular outer shape has a long side and a short side. The shape of the top surface 21A and the outer shape of the light-emitting element 20 in a top view are not limited thereto.

[0058] The light-emitting element 20 has a light-emitting surface 22 that can emit light. For example, the lateral surface 21C can be configured as the light-emitting surface 22. The lateral surface 21C, configured as the light-emitting surface 22, meets the short side of the upper surface 21A. For example, the upper surface 21A can serve as the light-emitting surface 22. The light-emitting element 20 has one or more light-emitting surfaces 22.

[0059] For example, a light-emitting element capable of emitting blue light can be used for light-emitting element 20. Similarly, a light-emitting element capable of emitting green light can be used for light-emitting element 20. Typically, a light-emitting element capable of emitting red light can be used for light-emitting element 20. It should be noted that any light-emitting element capable of emitting other colors can be used for light-emitting element 20.

[0060] "Blue light" refers to light with a peak emission wavelength within a range of 420 nm to 494 nm. "Green light" refers to light with a peak emission wavelength in a range of 495 nm to 570 nm. "Red light" refers to light with a peak emission wavelength in a range of 605 nm to 750 nm.

[0061] A light-emitting element containing a nitride semiconductor for light-emitting element 20, which emits blue or green light. A GaN-based semiconductor, such as GaN, InGaN, and AlGaN, can be used as the nitride semiconductor. Examples of light-emitting element 20, which emits red light, can include a light-emitting element containing a semiconductor based on InAlGaP, GaInP, and GaAs, such as GaAs or AlGaAs.

[0062] For example, a semiconductor laser element can be used for the light-emitting element 20. A single-emitter semiconductor laser element, consisting of a single emitter, can be used for the light-emitting element 20. Alternatively, a multi-emitter semiconductor laser element, consisting of multiple emitters, can be used for the light-emitting element 20. It should be noted that not only semiconductor laser elements but also light-emitting diodes can be used for the light-emitting element 20.

[0063] Reference is made here to a semiconductor laser element, which is an example of the light-emitting element 20.

[0064] The semiconductor laser element emits directional laser light. Expansive, divergent light is emitted from a light-emitting surface of the semiconductor laser element. The light emitted by the semiconductor laser element forms an oval far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light-emitting surface 22. "FFP" refers to the shape and light intensity distribution of emitted light at a location distant from the light-emitting surface of the semiconductor laser element.

[0065] Here, light passing through the center of the oval FFP shape, or in other words, light exhibiting a peak intensity in the FFP's light intensity distribution, is referred to as light passing along or through an optical axis. In the FFP's light intensity distribution, light with an intensity of at least 1 / e 2 relative to the peak intensity value, it is referred to as the main area light.

[0066] The FFP shape of light emitted by the semiconductor laser element is elongated, with the layering direction being longer than an orthogonal direction when viewed on a plane parallel to the light-emitting surface 22. The lamination direction refers to the direction in which multiple semiconductor layers, including an active layer, are stacked or laminated on top of each other in the semiconductor laser element. A direction orthogonal to the layering direction can also be referred to as the planar direction of the semiconductor layer. The long-axis and short-axis directions of the oval FFP shape can be referred to as the fast-axis and late-axis directions, respectively.

[0067] An angle at which light with a luminous intensity of 1 / e 2The angle of light spreading, which exhibits peak light intensity based on the FFP light intensity distribution, is defined as the angle of light spreading. The angle of light spreading is defined here as the angle between light exhibiting peak light intensity (passing through the optical axis) and light exhibiting a light intensity of 1 / e 2 the peak light intensity is produced. The angle of light spread is sometimes additionally determined from the light intensity of 1 / e 2 the peak light intensity from a light intensity corresponding to half the peak light intensity. In the present disclosure, the mere reference to the “angle of light expansion” refers to the angle of light expansion at a light intensity of 1 / e 2 the peak light intensity. Submount 30

[0068] A submount 30 comprises a top surface 31A, a bottom surface 31B, and one or more lateral surfaces 31C. The top surface 31A can be described as the mounting surface on which other components are to be mounted. The top surface 31A can be provided in a rectangular shape. This rectangular shape of the top surface 31A can include a short side and a long side. It should be noted that the top surface 31A is not limited to a rectangular shape.

[0069] In a top view, the submount 30 has a rectangular outer shape. This rectangular shape of the submount 30 can include a short side and a long side. It should be noted that the outer shape of the submount 30 is not limited to a rectangular shape in a top view. In a top view, the submount 30 can have an outer shape in which one direction (hereinafter referred to as the width direction of the submount 30) has a shorter length than the length of a direction orthogonal to it (hereinafter referred to as the length direction). In the submount 30 shown, the width direction is equal to the X direction and the length direction is equal to the Y direction.

[0070] The length of submount 30 in the short-sided direction (or width direction) is, for example, in the range of 500 µm to 1000 µm. The length of submount 30 in the long-sided direction (or length direction) is, for example, in the range of 1500 to 2500 µm. There is a difference in length between the length and width directions in the range of 500 µm to 1000 µm. Reflection component 40

[0071] A reflective component 40 has a lower surface 41A and a light-reflecting surface 41B. The light-reflecting surface 41B is inclined relative to the lower surface 41A. A straight line connecting the lower and upper ends of the light-reflecting surface 41B is also inclined relative to the lower surface 41A. The angle at which the light-reflecting surface 41B is inclined relative to the lower surface 41A is hereby referred to as the inclination angle of the light-reflecting surface 41B.

[0072] The light reflection surface 41B is defined by a plane. It should be noted that the light reflection surface 41B can be defined by a curved surface. The inclination angle of the light reflection surface 41B is 45 degrees. However, the inclination angle of the light reflection surface 41B is not limited to this.

[0073] A glass, metal, or the like can be used as the main material for the reflective component 40. Preferably, a heat-resistant material is used for the main material of the reflective component 40. For example, a glass, such as quartz or BK7 (borosilicate glass), or a metal, such as aluminum, can be used for the main material. Alternatively, the reflective component 40 can be formed using silicon as the main material.

[0074] If the main material is provided by a reflective material, such as Al, is it possible to form the light-reflecting surface 41B from the main material? Alternatively, instead of forming the light-reflecting surface 41B from the main material, it is possible to form a preliminary shape of the reflective component 40 and then form the light-reflecting surface 41B on the surface of this preliminary shape. In this case, the light-reflecting surface 41B can be formed using a metal layer, such as Ag and Al, or a dielectric multilayer, such as Ta₂O₅ / SiO₂, TiO₂ / SiO₂, and Nb₂O₅ / SiO₂.

[0075] The light-reflecting surface 41B has a reflectance of 90% or more relative to the peak wavelength of light incident on the light-reflecting surface 41B. The reflectance can be 95% or more. It is also possible to adjust this reflectance to 99% or more. Thus, the light reflectance cannot be more than 100% or less. Wiring 60

[0076] Wiring 60 is defined by an electrically conductive, linear material that has connection areas at both ends. These connection areas provide points for connection to another component. Wiring 60 is used to provide an electrical connection between two components. A typical example of wiring 60 is a metal wire. For example, gold, aluminum, silver, and copper can be used for the metal. Optical component 70

[0077] The optical component 70 has a top surface 71A, a bottom surface 71B, and one or more sides 71C. The optical component 70 provides an optical effect to the incident light. The optical effects provided by the optical component 70 to incident light typically include concentration, collimation, diffusion, polarization, diffraction, multiplexing, guiding, reflection, and wavelength conversion of light.

[0078] The optical component 70 includes an optical active surface capable of producing optical effects. The upper surface 71A, the lower surface 71B, or the lateral surface 71C can serve as an optical active surface. Alternatively, this optical component 70 can have an optical active surface at a location other than the upper surface 71A, the lower surface 71B, and the lateral surface 71C. Typically, the optical active surface can be formed within the optical component 70 rather than on its surface.

[0079] The optical component 70 can include one or more lens surfaces 71D. The one or more lens surfaces 71D serve as the optical working surface of the optical component 70. It should be noted that the optical component 70, which has the lens surface 71D, can also be referred to as a lens component. Optical effects, such as light concentration, diffusion, or collimation, are exerted by the optical component 70 on the light that passes through the lens surface 71D and exits the optical component 70. For example, the optical component 70 can be a collimating lens for converting light incident on the optical component 70 into collimated light that then exits.

[0080] The optical component 70 has a rectangular outer shape in a top view. It should be noted that the outer shape of the optical component 70 is not limited to a rectangular shape. The lower surface 71B is defined by a plane. The lens surface 71D is not formed on the side of the lower surface 71B of the optical component 70. The lower surface 71B is rectangular. It is assumed that the shape of the lower surface 71B is not limited to a rectangular shape.

[0081] The optical component 70 can comprise a plurality of lens surfaces 71D aligned in one direction. The direction in which the multiple lens surfaces 71D are aligned is referred to here in a top view as the lens connection direction. In the optical component 70 shown, the lens connection direction is the same as the X-direction.

[0082] The majority of lens surfaces 71D are formed such that their vertices are arranged in a straight line. This virtual straight line connecting the respective vertices is parallel to the lower surface 71B of the optical component 70. It should be noted that such a parallel arrangement includes a tolerance on the order of ±5 degrees.

[0083] The optical component 70 is light-transmitting. The optical component 70 has a transmittance of 80% or more relative to the peak wavelength of the incident light. The optical component 70 can comprise a light-transmitting region and a non-transmitting region (hereinafter referred to as the opaque region). The non-transmitting region has a transmittance of 50% or less relative to the peak wavelength of the incident light. The optical component 70 can be formed using a glass such as BK7.

[0084] The light-emitting device 1 is then explained. Light-emitting device 1

[0085] With respect to the light-emitting device 1, one or more light-emitting elements 20 are located on a substrate 11. The one or more light-emitting elements 20 are arranged on the first upper surface 11A. The light-emitting device 1 is configured to emit light from the one or more light-emitting elements 20.

[0086] The individual light-emitting elements 20 are configured to emit light in the latitude direction of the substrate 11. It should be noted that in the light-emitting device 1 shown, the latitude direction of the substrate 11 is the same as the short-sided direction of the substrate 11; however, the term "latitude direction" is used here because the outer edge shape of the substrate 11 is not limited to a rectangular shape. The same applies to the "longitudinal direction" of the substrate 11.

[0087] The one or more light-emitting elements 20 can be composed of a plurality of light-emitting elements 20. The one or more light-emitting elements can be composed of a plurality of light-emitting elements 20, which include one or more first light-emitting elements 20A and one or more second light-emitting elements 20B. The plurality of light-emitting elements 20 can further include one or more third light-emitting elements 20C.

[0088] In the light-emitting device 1, the one or more first light-emitting elements 20A are configured to emit light having a first color. The one or more second light-emitting elements 20B are configured to emit light having a second color. The one or more third light-emitting elements 20C are configured to emit light having a third color. The first, second, and third colors are different from each other.

[0089] In the Fig. In the example shown in Figure 12, the light-emitting device 1 includes a first light-emitting element 20A configured to emit red light as the first color, a second light-emitting element 20B configured to emit green light as a second color, and a third light-emitting element 20C configured to emit blue light as a third color.

[0090] A plurality of light-emitting elements 20 are arranged and localized in one direction. In the light-emitting device 1 shown, this direction is the same as the X-direction. In the light-emitting device 1, a plurality of light-emitting elements 20 are arranged and localized in the longitudinal direction of the substrate 11.

[0091] The one or more light-emitting elements 20 are located in a top view between two first wiring regions 12A1. The one or more light-emitting elements 20 are sandwiched between the two first wiring regions 12A1 in the longitudinal direction of the substrate 11. The slow-axis direction of light emitted by the one or each light-emitting element 20 is the same as the longitudinal direction of the substrate 11.

[0092] The one or more light-emitting elements 20 are arranged on one or more submounts 30. The one or more light-emitting elements 20 are arranged on the substrate 11 above the one or more submounts 30. The one or more submounts 30 are provided with a light-emitting element 20.

[0093] In the light-emitting device 1, one or more reflective elements 40 are arranged on the substrate 11. The one or more reflective elements 40 are arranged on the first upper surface 11A. The one or more reflective elements 40 are located at positions orthogonal to a light-emitting surface 22 in a direction from the one or more light-emitting elements 20. The one or more reflective elements 40 are configured to reflect light from the one or more light-emitting elements 20. The light reflected by the one or more reflective elements 40 propagates upwards. In the field path (FFP) of the reflected light, the longitudinal direction of the substrate 11 defines the slow-axis direction, and the lateral direction defines the fast-axis direction.

[0094] If the light-emitting device 1 includes several light-emitting elements 20, the position at which the axis of light emitted by each light-emitting element 20 is illuminated by the corresponding axis of one or more reflective components 40 is arranged on a straight line in a top view. Arranging the light axis illumination points on a straight line facilitates optical control.

[0095] In the light-emitting device 1, a plurality of wires 60 are used for the electrical connection of one or more light-emitting elements 20. A suitable number of wires 60 are connected to the package 10, the light-emitting elements 20, or the submount 30 such that the one or more light-emitting elements 20 can be electrically connected to the package 10. Accordingly, current can be supplied to the one or more light-emitting elements 20, which are arranged in the internal space of the package 10, from an external power source that is electrically connected to the package 10.

[0096] The wiring 60 connected to the packing 10 is also connected to a wiring area 12A located within the internal space of the packing 10. The plurality of wiring 60 includes one or more wiring 60 connected to a first wiring area 12A1 located on the side of the first inner surface 11E1, and one or more wiring 60 connected to a first wiring area 12A1 located on the side of the second inner surface 11E2. The one or more light-emitting elements 20 are electrically connected to the first wiring area 12A1 of the substrate 11. The first and second inner surfaces 11E1 and 11E2 are opposite each other in the longitudinal direction of the substrate 11.

[0097] In the light-emitting device 1, light emitted by one or more light-emitting elements 20 emerges from the upper surface 14A of the packing 10. The light emitted by the light-emitting element 20 is defined by a "light-per-element" unit. Light with one light-per-element unit is emitted by one light-emitting element 20, while light with multiple light-per-element units is emitted by multiple light-emitting elements 20.

[0098] A principal area of ​​light, having a light-per-element unit, emitted by a particular light-emitting element 20, does not overlap with a principal area of ​​light, having a light-per-element unit, emitted by another light-emitting element 20 on the upper surface 14A. Light having a light-per-element unit is incident on and exiting the upper surface 14A without the respective principal areas overlapping.

[0099] In the light-emitting device 1, the optical component 70 is fixed to the packing 10. The optical component 70 is connected to the packing 10. The optical component 70 is connected to the packing 10 via an adhesive. An ultraviolet curing adhesive can be used for the optical component 70.

[0100] The optical component 70 is located above the packing 10. Light emitted from the upper surface 14A strikes the optical component 70, undergoes an optical action, and then exits the optical component 70. For example, the light strikes lens surfaces that have different optical axes of light-per-element units, where it is collimated, and then exits the optical component 70. Wiring board 101

[0101] The wiring plate 101 according to an embodiment of the invention will now be explained. Fig. 13A, Fig. 13B, Fig. Figure 13C shows an exemplary embodiment of the wiring plate 101; Fig. Figure 13A shows that the top view of the wiring plate 101 according to one embodiment and a wire pattern are superimposed; Fig. Figure 13B shows a wiring pattern on the wiring board 101 according to one embodiment; and Fig. Figure 13C is a top view of the wiring plate 101 according to one embodiment.

[0102] The wiring board 101 has a top surface 101A, a bottom surface 101B, and one or more lateral surfaces 101C. The wiring board 101 has a plate-like shape. In a top view, the outer edge of the wiring board 101 is rectangular, which may include a long side and a short side.

[0103] The wiring board 101 is provided with one or more fixing through-holes 101H. The one or more fixing through-holes 101H include a through-hole 101H configured to fix the wiring board 101 to another component. The through-hole 101H is provided, for example, for the purpose of fixing with screws; a screw is inserted into the through-hole 101H to fix the wiring board 101 to another component.

[0104] The one or more through-holes 101H include a first fixing area 101H1 for fixing the wiring board 101 in one location and a second fixing area 101H2 for fixing the wiring board 101 in one location. The first screw 102A is screwed firmly through the first fixing area 101H1 and the second screw 102B is screwed firmly through the second fixing area 101H2 to fix the wiring board 101 to another component.

[0105] The wiring plate 101 includes a heat dissipation area 101D, an electrode area 101E, and an insulation area 101F. The heat dissipation area 101D acts as a heat dissipation path for heat generated by another component mounted on the wiring plate 101. The electrode area 101E is configured to provide an electrical connection to another component mounted on the wiring plate 101.

[0106] The insulation area 101F is configured to provide insulation between the heat dissipation area 101D and the electrode area 101E. The insulation area 101F is provided on the wiring board 101 to isolate an electrical connection between the heat dissipation area 101D and the electrode area 101E.

[0107] On the upper surface 101A of the wiring plate 101, there is an area where the heat dissipation area 101D is located in the uppermost position (hereinafter referred to as the upper surface heat dissipation area 101A), an area where the electrode area 101E is located in the uppermost position (hereinafter referred to as the upper surface electrode area 101A), and an area where the insulation area 101F is located in the uppermost position (hereinafter referred to as the upper surface insulation area 101A). On the upper surface 101A, the heat dissipation area and the electrode area are insulated by the insulation area.

[0108] The wiring plate 101 comprises a heat dissipation component 111, a plurality of electrode components 121, and an insulation component 131. The heat dissipation area 101D includes the heat dissipation component 111; the electrode area 101E includes a plurality of electrode components 121; and the insulation area 101F includes the insulation component 131.

[0109] The wiring board 101 has a mounting surface that includes a first region 1A, and the upper surface 101A of the wiring board 101 can provide a mounting surface. The heat dissipation region and the electrode region are exposed by the insulating component 131, which is arranged on the mounting surface. The first region 1A includes the electrode region. The first region 1A includes the heat dissipation region. The first region 1A includes the insulation region.

[0110] A region of electrode region 101E that overlaps, in a top view (viewed from the plane in a direction orthogonal to the mounting surface), the electrode region contained in the first region 1A is hereby referred to as the first electrode region 103A. A region of electrode region 101E that overlaps an electrode region configured to be electrically connected to the first electrode region 103A and located outside the first region 1A is hereby referred to as the second electrode region 103B.

[0111] A plurality of electrode components 121 includes an electrode component 121 that has the first and second electrode regions 103A and 103B. In short, one region of an electrode component 121 can provide the first electrode region 103A, while at least one other region can provide the second electrode region 103B.

[0112] The first electrode region 103A comprises two or more electrode components 121. Each electrode component 121 is partially contained within the second electrode region 103A. The electrode region contained within the first electrode 103A can be divided into a plurality of first electrode regions 103A1, which are arranged and located in one direction. The first electrode region 103A comprises a plurality of first electrode regions 103A1 that are not electrically connected to one another. On the wiring board 101 shown, a plurality of the first electrode regions 103A1 are aligned in the Y-direction.

[0113] The second electrode region 103B comprises two or more electrode components 121. Each electrode component 121 is partially contained within the second electrode region 103B. The electrode region contained within the second electrode 103B can be subdivided into a plurality of second electrode regions 103B1. The second electrode region 103B comprises a plurality of second electrode regions 103B1 that are not electrically connected to one another.

[0114] When viewed in the orientation direction of a plurality of the first electrode regions 103A1, the length W1 of the first electrode region 103A from one end to the opposite end is greater than the length W2 of the second electrode region 103B from one end to the opposite end in the same direction. It should be noted that the length W1 of the first electrode region 103A from one end to the opposite end is the length W1 at both outer endpoints of the two first electrode regions 103A1 that are positioned on their outermost sides in the same direction. Likewise, the length W2 of the second electrode region 103B from one end to the opposite end is the length W2 at both outer endpoints of the two second electrode regions 103B1 that are positioned on their outermost sides in the same direction.

[0115] The wiring plate 101 may further include a connection area 101J, which is contained in the first region 1A in a plan view. In a plan view, the heat dissipation region is located between the connection area 101J and the first electrode region 103A. The connection area 101J is located at a position separated from the first electrode region 103A in the long-sided direction of the wiring plate 101. In a plan view, a virtual straight line L1, running parallel to this long-sided direction, passes through the connection area 101J, the heat dissipation region, and the first electrode region 103A. In a plan view, the connection area 101J may have the same shape as the first electrode region 103A. The connection area 101J is not electrically connected to the electrode region 101E.

[0116] In a top view, a virtual straight line L2 passes through both ends of the heat dissipation area in the short-side direction of the wiring plate 101, but not through the electrode area. In a top view, the first electrode area 103A and the connection area 101J are located in a position where the virtual straight line L2 does not pass. Similarly, in a top view, the electrode area 101E is located in a position where the virtual straight line L2 does not pass. This, in turn, helps to reduce the width of the wiring plate 101 in the short-side direction.

[0117] In a plan view, the upper surface 101A of the wiring plate 101 is divided into three regions by a virtual straight line L3 and a virtual straight line L4: a first end region, a second end region, and a central region located between the first and second end regions in a plan view. The virtual straight line L3 passes through or coincides with one of the two ends of the heat dissipation region in the long direction of the wiring plate 101 in the plan view. The virtual straight line L4 passes through or coincides with the other end of the heat dissipation region in the plan view. Both of these ends of the heat dissipation region extend parallel to the short direction of the wiring plate 101. Both of the virtual straight lines L3 and L4 extend along the long direction of the wiring plate 101.In all of the electrode components 121 that the wiring plate 101 comprises, there is subsequently no electrode component that has a connection from the first end region to the second end region via the central region. This can reduce the width of the wiring plate 101 in the short-side direction.

[0118] With respect to the long-sided direction of the wiring plate 101 in a plan view, a center point M1 of the length of the heat dissipation region is positioned closer to the connection region 101J than a center point M2 of the width of the upper surface 101A. It should be noted that "closer to the connection region 101J" means a direction from the heat dissipation region towards the connection region 101J, while a direction from the heat dissipation region towards the first electrode region 103A is referred to as the side of the first electrode region 103A. In either case, "closer to the connection region 101J" and "closer to the first electrode region 103A" can define a direction that is parallel to the long-sided direction of the wiring plate 101.

[0119] In a top view, the second electrode region 103B is positioned closer to the first electrode 103A than the center point M2, and in a top view, the first electrode region 103A is located between the connection region 101J and the second electrode region 103B.

[0120] In a top view, the first region 1A is located between a first fixing region 101H1 and a second fixing region 101H2 in the wiring plate 101. In a top view, the second fixing region 101H2 is located between the first electrode region 103A and the second electrode region 103B. In a top view, the heat dissipation region is located between the fixing region 101H1 and the first electrode 103A. In a top view, the connection region 101J is located between the first fixing region 101H1 and the heat dissipation region.

[0121] In a top view, the first fixing area 101H1, the first area 1A, the second fixing area 101H2, and the second electrode area 103B are aligned with each other along the long side of the wiring plate 101. In a top view, the virtual linear line L, parallel to the first direction X, passes through the light-emitting device 1, the first fixing area 101H1, the second fixing area 101H2, and the second electrode area 103B. In a top view, the virtual linear line L can be a straight line passing through the midpoint of the width along the short side of the wiring plate 101.

[0122] The first fixation area 101H1 is located at a position a certain distance in the long direction from the center point M1, and the second fixation area 101H2 is located at a position the same distance in the opposite direction from the center point M1. As mentioned herein, the “long direction” corresponds to the negative X-direction in the light-emitting module 901 shown in the figure(s), and the “opposite direction” corresponds to the positive X-direction in the light-emitting module 901 shown.

[0123] With respect to the long-sided direction of the wiring plate 101, the length of the wiring plate 101 can be 1.4 to 3 times the distance between the fixation area 101H1 and the second fixation area 101H2. The 1.4-fold length makes it easy to ensure an area in which the second electrode area 103B is located, and the less than 3-fold length makes it possible to reduce the length of the wiring plate 101 in the long-sided direction.

[0124] If, in a top view, a virtual straight line passing through the center point M2 and parallel to the short-side direction of the wiring plate 101 is used to divide the upper surface 101A into two regions, it is then possible to locate the first fixing region 101H1 in one region and the second fixing region 101H2 in another region. The first fixing region 101H1 is located closer to the connection region 101J from the center point M2, and the second fixing region 101H2 is located closer to the first electrode 103A from the center point M2. Such a positioning of the first 101H1 and the second 101H2 fixing region can help to reduce the length of the wiring plate 101 in the long-side direction.

[0125] A metallic material is used as the main material for the heat dissipation component 11. For example, a single metal, such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or an alloy containing such metals, can be used as the main material for the heat dissipation component 111. Preferably, the heat dissipation component 111 is made of a material with good heat dissipation properties. The heat dissipation component 111 could be made incorporating 95 wt.% or more copper.

[0126] A metallic material is used as the main material for the electrode component 121. For example, a single metallic material, such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or an alloy containing such metals, can be used as the main material for the electrode component 121.

[0127] The insulating component 131 is formed from an insulating material. For example, a polyimide can be used as the main material for the insulating component 131. Alternatively, a glass epoxy, obtained by impregnating the main material, which comprises one or more glass fabrics, with a thermosetting insulating resin, such as an epoxy resin, and subsequently curing this thermosetting insulating resin, a liquid crystal polymer, or the like, can be used as the main material for the insulating component 131. Also as an alternative, a resist, such as a solder resist, can be used for the insulating component. Connector 201

[0128] A connector 201 is a typical connecting component useful for electrical connections. Using the connector 201, it is possible to insert a wiring terminal into the connector 201 for an electrical connection.

[0129] The connector 201 shown in the figure(s) has an upward-facing insertion hole configured to receive a wiring terminal. The terminal associated with the insertion hole extends in a planar direction with one side of a lower surface providing a mating surface configured to connect the terminal to other components. The insertion hole may be oriented laterally instead of upwards.

[0130] In a top view, the connector 201 has an external shape, the length of which is greater than the length of which is orthogonal to it. Here, "one direction" is defined as the longitudinal direction of the connector 201 and "another direction" as the transverse direction of the connector 201. In the connector 201 shown in the figure(s), the transverse direction is identical to the X-direction and the longitudinal direction is identical to the Y-direction. Thermistor 301

[0131] The Thermistor 301 can be used as a temperature sensing element. The Thermistor 301 is an example of a temperature sensing element configured to measure temperature. The light-emitting module 901 will now be explained.

[0132] In the light-emitting module 901, the light-emitting device 1 is mounted on the wiring board 101. The light-emitting device 1 is mounted in the first area 1A of the wiring board 101. The light-emitting device 1 is mounted on the wiring board 101 such that the longitudinal direction of the substrate 11 in the light-emitting device 1 is identical to the longitudinal direction of the wiring board 101. This allows for a reduction in the width of the wiring board 101 in the lateral direction, which contributes to a further reduction in the size of the light-emitting module 901. In the light-emitting module 901 shown in the figure(s), the longitudinal direction of the wiring board 101 is identical to the long-sided direction, and the lateral direction is identical to the short-sided direction.

[0133] Herein, the longitudinal direction of the wiring plate 101 is defined as a first direction and the lateral direction of the wiring plate 101 as a second direction. The longitudinal and lateral directions of the substrate 11 could be the first and second directions, respectively. In the light-emitting module 901 shown in the figure(s), the first direction is the same as the X-direction and the second direction is the same as the Y-direction.

[0134] The first electrode area 103A of the wiring plate 101 is connected to the substrate 11 in the light-emitting device 1. The first electrode area 103A is electrically connected to the substrate 11 in the light-emitting device 1 and to one or more light-emitting elements 20.

[0135] The first electrode region 103A is connected to the second wiring region 12A2 of the substrate 11. The first electrode region 103A is connected to the second wiring region 12A2, which is located on the first inner surface 11E1 of the substrate 11.

[0136] The first electrode region 103A is connected to one of the second wiring regions 12A2, which is electrically connected to the first wiring region 12A1, which is electrically connected to the light-emitting element 20 and is located on the side of the first inner surface 11E1, and to another of the second wiring regions 12A2, which is electrically connected to the first wiring region 12A1, which is electrically connected to the light-emitting element 20 and is located on the side of the second inner surface 11E2. A plurality of the first electrode regions 103A1 are each connected to the corresponding second wiring region 12A2.

[0137] The connection area 101J of the wiring plate 101 is connected to the substrate 11 in the light-emitting device 1. The connection area 101J is connected to the second wiring area 12A2 of the substrate 11. The connection area 101J is also connected to the second wiring area 12A2, which is located on the side of the second inner surface 11E2 of the substrate 11. Alternatively, the connection area 101J can be connected to a connection area other than the second wiring area 12A2. In short, the area of ​​the substrate 11 to be connected to the connection area 101J does not have to be defined by an area that is electrically connected to the first wiring area 12A1.

[0138] A current path for supplying current to the one or more light-emitting elements 20 is formed by the first electrode area 103A. The connection area 101J is not directly involved in forming the current path for supplying current to the one or more light-emitting elements 20. In short, the light-emitting device 1 does not need to be electrically connected to the connection area 101; if the light-emitting device 1 is electrically connected to the first electrode area 103A, current can be supplied to it externally. This further contributes to the size reduction of the wiring plate 101.

[0139] A plurality of first electrode regions 103A1 includes two first electrode regions 103A1 that form a current path for supplying current to one or more first light-emitting elements 20A. A plurality of first electrode regions 103A1 includes two first electrode regions 103A1 that form a current path for supplying current to one or more second light-emitting elements 20B. One of the two electrodes that each of the first light-emitting element 20A and the second light-emitting element 20B has can be electrically connected to the same first electrode region 103A1. In this case, current from three first electrode regions 103A1 can be supplied to the first light-emitting element 20A and the second light-emitting element 20B.

[0140] A plurality of the first electrode regions 103A1 include two first electrode regions 103A1 that form a current path for supplying current to one or more third light-emitting elements 20C. It should be noted that one of the two electrodes that each of the first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C has may be electrically connected to the same first electrode region 103A1. In this case, current from four first electrode regions 103A1 can be supplied to the first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C.

[0141] The heat dissipation area of ​​the wiring plate 101 is connected to the substrate 11 in the light-emitting device 1. The heat dissipation area of ​​the wiring plate 101 is connected to the base 11M of the substrate 11, and the first electrode area 103A and the connection area 101J are connected to the frame 11N. The connection of the base area 11M to the heat dissipation area allows the dissipation of heat generated by the one or more light-emitting elements 20 located on the first upper surface 11A.

[0142] In a top view, the first fixing area 101H1 is located at a position a certain distance away from the light-emitting device 1 in the longitudinal direction of the wiring plate 101, and the second fixing area 101H2 is located at a position the same distance away from the light-emitting device 1 in the opposite direction. Equalizing the distances from the light-emitting device, for example, contributes more to the heat dissipation effect of the light-emitting device 1 when the wiring plate 101 is fixed to a heat sink.

[0143] In the light-emitting module 901, the connector 201 is mounted on the wiring plate 101. The connector 201 is connected to the second electrode area 103B, thus electrically connecting the connector 201 to the light-emitting device 1. The connector 201 is electrically connected to an external power source and is used to supply current from the external power source to the light-emitting device 1. The connector 201 can be described as a component for the electrical connection of one or more light-emitting elements 20 to the outside world.

[0144] In the light-emitting module 901, the connector 201 is mounted on the wiring plate 101 such that the longitudinal direction of the connector 201 runs along a second direction and the lateral direction of the connector 201 runs along a first direction. The length of the connector 201 in the longitudinal direction is less than the length of the light-emitting device 1, such that even when the connector 201 is mounted on the wiring plate 101, the width of the wiring plate 101 is not increased in the lateral direction, while the length in the longitudinal direction decreases.

[0145] In the light-emitting module 901, the length of the wiring plate 101 in the second direction is greater than 100% or 150% or less than the length of the light-emitting device 1. If a plurality of light-emitting modules 901 are aligned and arranged in the second direction, it is possible to shorten the interval(s) of the respective light-emitting device 1 in the second direction. Furthermore, additional advantages can be expected, such as facilitating individual control of the drive by separating the light-emitting modules 901 per unit and making the number of light-emitting devices 1 easily adjustable.

[0146] In a top view, the second fixing area 101H2 is located between the light-emitting device 1 and the connector 201. For example, if a wire connecting to an external power source extends from a wiring terminal inserted into the insertion opening of the connector 201, the wire could potentially extend from the connector 201 to the side of the first electrode area 103A (the positive X direction in the drawing). However, the second fixing area 101H2 is located from the connector 201 to the side of the connection area 101J (the negative X direction in the drawing), thus eliminating or reducing the risk of contact between a screw fixed in the second fixing area 101H2 and the wire. This allows access to the light-emitting module 901 while still permitting the installation of wiring on the light-emitting module 901.

[0147] In the light-emitting module 901, the thermistor 301 is mounted on the wiring plate 101. The thermistor 301 is mounted on the upper surface 101A of the wiring plate 101. The thermistor 301 is connected to the electrode area 101E. The electrode area 101E, to which the thermistor 301 is connected, is electrically connected to the second electrode area 103B. A plurality of the electrode components 121 includes an electrode component 121 to which the thermistor 301 and the connector 201 are connected.

[0148] In the light-emitting module 901, the thermistor 301 can be used to measure the temperature of the light-emitting device 1. The thermistor 301 can also be used to monitor the ambient temperature of the light-emitting element 20 contained within the light-emitting device 1. The "ambient temperature of the light-emitting element 20" refers, in addition to the precise temperature of the light-emitting element 20, to whether its temperature is higher than in the non-operating state, to what extent the temperature rises, and similar information.

[0149] In a top view, the thermistor 301 is arranged between the second fixing area 101H2 and the second electrode area 103B. In a top view, the second fixing area 101H2 is arranged between the thermistor 301 and the light-emitting device 1. When used to measure the temperature of the light-emitting device 1, the thermistor 301 is preferably located as close as possible to the light-emitting device 1. However, since the electrode area 101E, which is connected to the thermistor 301, is connected to the second electrode area 103B, it is desirable to configure the thermistor 301 as described above. This helps to reduce the width of the wiring board 101 in the lateral direction and thus contributes further to reducing the size of the light-emitting module 901.

[0150] The distance between the thermistor 301 and the light-emitting device 1 is preferably 10 mm or less in a top view. By setting this distance to 10 mm or less, the thermistor 301 can be positioned such that the temperature environment of the light-emitting device 1 or the light-emitting element 20 can be easily monitored. This distance is greater than the length of the second fixing area 101H2 in the first direction.

[0151] In the light-emitting module 901, the first fixing area 101H1, the light-emitting device 1, the second fixing area 101H2, and the connector 201 are located or provided in a position through which the virtual straight line L passes in a top view. The thermistor 301 is also located in a position through which the virtual straight line L passes in a top view. Other embodiments

[0152] Some other embodiments of the light-emitting module 901 will now be explained. Fig. Figure 14 is a perspective view of a light-emitting module 901 according to another embodiment. Fig. Figure 15A shows an overlap of a wiring pattern on the top view of the wiring plate 101 according to another embodiment. Fig. Figure 15B is a top view of the wiring plate 101 according to another embodiment. Fig. Figure 15C shows a wiring diagram of the wiring board 101 according to another embodiment. For the sake of simplicity, the light-emitting module 901 according to another embodiment will be referred to as the second light-emitting module.

[0153] The second light-emitting module comprises a light-emitting device 1 and a wiring board 101. The second light-emitting module does not include connectors or thermistors. The second light-emitting module need not be free of connectors and thermistors. The second light-emitting module may include a wire or similar component as a connecting element instead of the connector. Other configurations may be the same or similar to those shown in Fig. 1. embodiment shown.

[0154] Since the second light-emitting module does not include a thermistor, it is possible to reduce the length of the wiring plate 101. The aforementioned contact risk can also be avoided or eliminated with the second light-emitting module because the second fixing area 101H2 is located between the first electrode area 103A, to which the light-emitting device 1 is connected, and the second electrode area 103B, to which a wire is connected as a connecting component. In this way, it is possible to incorporate the light-emitting module 901 while typically taking into account the possibility of mounting a connecting component on the wiring plate 101.

[0155] While some embodiments of the present invention have been explained, it is understood that the light-emitting module 901 according to the present invention is not strictly limited to the light-emitting device 1 according to the respective embodiments. In short, the present invention can be achieved without being limited to the external shape and structure of the light-emitting module 901 disclosed herein. The present invention can be achieved without using all elements or components as essential requirements. Even if, for example, some of the elements or components disclosed in the embodiments for the light-emitting module 901 are not described within the scope of the claims, the inventions described in these claims are particularly applicable to that part, provided that substitutions, omissions, variations in shape, and variations in material are within the scope of the design freedom of a person skilled in the art.

[0156] The light-emitting device 1 shown in some embodiments can be used for projectors. In other words, the projector can be considered one application area of ​​the present invention. It should be noted that the present invention can also be used for various other applications, such as lighting, illumination, vehicle-mounted headlights, head-mounted displays, and other display headlights. Semiconductor laser element QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2024-173252

[0001] JP 2024-42909

[0003]

Claims

[1] Light-emitting module comprising: a light-emitting device comprising a plurality of semiconductor laser elements and a substrate on which the plurality of semiconductor laser elements are arranged along a longitudinal direction of the substrate; and a wiring board having a mounting surface comprising a first area on which the light-emitting device is mounted, wherein the wiring board, in a top view viewed from a direction orthogonal to the mounting surface, has a longitudinal direction extending in a first direction and a lateral direction extending in a second direction orthogonal to the first direction, wherein the wiring board includes a first fixing area and a second fixing area where the wiring plate is configured to be fixed in one place, a first electrode area, with which the substrate is connected to the majority of semiconductor laser elements for an electrical connection, and a second electrode region which is electrically connected to the first electrode region, wherein the second electrode region is configured to be connected to a connecting component for an electrical connection of the light-emitting device to an external device, in top view the first area is located between the first fixation area and the second fixation area, the second fixation area is located between the first electrode area and the second electrode area, and The substrate has a longitudinal direction extending in the first direction and a lateral direction extending in the second direction. [2] Light-emitting module according to claim 1, further comprising the connecting component, wherein the connecting component is a connector. [3] Light-emitting module according to claim 2, wherein the connector has, in plan view, a width direction extending in the first direction and a length direction extending in the second direction. [4] Light-emitting module according to claim 3, wherein the light-emitting device, the first fixing area, the second fixing area and the second electrode area are arranged such that a virtual straight line parallel to the first direction passes through the light-emitting device, the first fixing area, the second fixing area and the second electrode area in the top view. [5] Light-emitting module according to claim 4, wherein the virtual straight line in the top view passes through a midpoint of a width of the wiring plate in the width direction. [6] Light-emitting module according to one of the preceding claims, wherein the light-emitting device, the first fixing area, the second fixing area and the second electrode area are arranged such that a virtual straight line parallel to the first direction passes through the light-emitting device, the first fixing area, the second fixing area and the second electrode area in the top view. [7] Light-emitting module according to claim 6, wherein the virtual straight line in the top view passes through a midpoint of a width of the wiring plate in the width direction. [8] Light-emitting module according to any of the preceding claims, wherein The wiring plate includes an insulating component located on the mounting surface. the first electrode area and the second electrode area are exposed by the insulating component, the first electrode region includes a plurality of first electrode regions that are not electrically connected to each other, the second electrode area includes a plurality of second electrode areas that are not electrically connected to each other, and the length of the first electrode region from one end to an opposite end in the second direction is greater than the length of the second electrode region from one end to an opposite end in the second direction. [9] Light-emitting module according to any of the preceding claims, wherein each of the first fixing area and the second fixing area is a through-hole through which a screw is configured to be inserted for fastening the wiring plate. [10] Light-emitting module according to any of the preceding claims, further comprising a temperature measuring element configured to measure a temperature, wherein The temperature measuring element is arranged in the top view between the second fixing area and the second electrode area on the mounting surface of the wiring plate.

Images