Power conversion device

Abstract

Power conversion device (100) comprising: an engine (200); and a converter (300); wherein at least one power module (301) for the inverter (300) is arranged on a metal housing (201) for the motor (200); characterized in that a metal plate (306) for heat dissipation is arranged on a surface of the power module (301) which is positioned opposite a surface of the power module (301) which is in contact with the metal housing (201), wherein a circuit board (308) for supplying electrical power to the power module (301) is arranged on a surface of the metal plate (306).

Description

Technical field

[0001] The present invention relates to a power conversion device that converts electrical power from DC power to AC power or from AC power to DC power, and in particular to a method for implementing a power module to which housings for a motor and for an inverter are directly connected, or for implementing a mechatronically integrated power module for which the motor and the inverter are arranged in the same housing. State of the art

[0002] The prior art in the aforementioned technical field is described in PATENT LITERATURE 1 and PATENT LITERATURE 2. PATENT LITERATURE 1 describes an encapsulated module obtained by encapsulating several terminals forming a wiring configuration and several electronic components attached to each terminal with injection resin. At least some of the terminals are exposed from the back surface of the injection resin. An electric motor housing to which the encapsulated module is attached is a housing oriented towards and attached to a reduction mechanism.

[0003] Patent Literature 2 describes a power module comprising a heat dissipation layer, an insulating layer, a circuit wiring section, several switching elements, several external terminals, and resin. The heat dissipation layer has a first main surface and a second main surface positioned opposite the first main surface. The insulating layer is arranged on the first main surface of the heat dissipation layer. The circuit wiring section is provided for the insulating layer. The several switching elements are arranged on the insulating layer and electrically connected to the circuit wiring section. The several external terminals are electrically connected to the circuit wiring section. The resin seals the insulating layer, the circuit wiring section, the switching elements, the entire first main surface of the heat dissipation layer, and a portion of the second main surface of the heat dissipation layer.The power module is connected to a power module bracket of an engine.

[0004] Patent literature 3 discloses a mounting structure for a semiconductor module, wherein a heat sink is attached to a heat-radiating surface of a semiconductor module in such a way that it is in close contact with it; and the semiconductor module is covered with an electromagnetic noise shielding cover which has an electromagnetic noise shielding effect.

[0005] Patent literature 4 describes a power semiconductor device with a power semiconductor element having a rear surface bonded to a wiring pattern on a substrate and a surface electrode on a surface opposite the rear surface. A cylindrical communication part is provided with a lower surface bonded to the surface electrode of the power semiconductor element and to the wiring pattern.

[0006] Patent literature 5 discloses a semiconductor device comprising a semiconductor chip and leads that are electrically connected to the electrodes of the semiconductor chip. A hollow base accommodates the semiconductor device, which is encapsulated with a highly thermally conductive resin possessing electrically insulating properties. The cooling base incorporates a cooling medium channel. List of prior art patent literature PATENT LITERATURE 1: WO 2012 / 137 333 A1 PATENT LITERATURE 2: Published Japanese patent application no. JP 2008 - 118 067 A Patent literature 3: JP 2013- 8 741 A Patent literature 4: DE 10 2011 084 803 A1 Patent literature 5: US 2009 / 0 160 048 A1 Summary of the invention: Technical problem

[0007] When a conventional mechatronically integrated structure is used to directly connect the housing for a motor to the housing for an inverter, or to allow the motor and inverter to use the same housing, an electric power steering device, such as the one described in PATENT LITERATURE 1, is configured such that the underside of the metal wiring for the module is exposed. Therefore, it is necessary to prepare an insulating material with high thermal conductivity if the module is to be connected to a metal housing. Furthermore, a hardening process is required for the insulating material if an insulating material with adhesive strength is to be used. This leads to an increase in manufacturing time. In addition, the electric power steering device described in PATENT LITERATURE 1 and PATENT LITERATURE 2 has only one cooling surface for the module.Therefore, the module requires a large heat dissipation surface so that the heat generated by a semiconductor element within the module can be properly transferred to the metal housing. In this case, it is difficult to reduce the size of the module.

[0008] When using conventional technology, the metal wiring for the power module is exposed to dissipate heat, as described above, and this exposed surface requires an insulating element. Since there is only one cooling surface, reducing the module's heat dissipation area further increases its thermal resistance. Consequently, the temperature rise in the semiconductor element exceeds an acceptable limit, making it difficult to reduce the module's size. Solution to the problem

[0009] To solve the above problem, a configuration defined, for example, in the attached claims is used.

[0010] The present application contains several means for solving the above problem. In accordance with one example of such means, a power conversion device comprising a motor and an inverter is provided. At least one power module for the inverter is arranged on a metal housing for the motor. A heat-dissipating metal plate is arranged on a surface of the power module, positioned opposite its surface in contact with the metal housing. Advantageous effects of the invention

[0011] In accordance with the present invention, one surface of the power module provided for the inverter is in contact with the metal housing for the motor, and the other surface is in contact with the heat-dissipating metal plate. Thus, heat generated by the power module can be dissipated from both surfaces. This makes it possible to implement a power conversion device with high heat dissipation capacity. As a result, the size of the power module can be significantly reduced.

[0012] The following description of embodiments reveals configurations and advantageous effects beyond those described previously. Brief description of the drawings Fig. Figure 1 is a cross-sectional representation depicting a power conversion device in accordance with a first embodiment of the present invention. Fig. Figure 2 is a circuit diagram representing a power module provided for the power conversion device in accordance with the first embodiment of the present invention. Fig. Figure 3 is a top view showing the power module provided for the power conversion device in accordance with the first embodiment of the present invention. Fig. Figure 4 is a cross-sectional representation showing the power module provided for the power conversion device in accordance with the first embodiment. Fig. Figure 5 is a top view showing essential parts to illustrate by way of example how the power module is implemented in accordance with the first embodiment of the present invention. Fig. Figure 6 is a cross-sectional view showing essential parts to indicate another form of a heat-emitting metal plate in accordance with the first embodiment of the present invention. Fig. Figure 7 is a cross-sectional view showing the power conversion device in accordance with a second embodiment of the present invention. Fig. Figure 8 is a cross-sectional view showing the power conversion device in accordance with a third embodiment of the present invention. Fig. Figure 9 is a top view showing the power module provided for the power conversion device in accordance with the third embodiment of the present invention. Fig. Figure 10 is a top view showing a front end of a busbar provided for the power conversion device in accordance with the third embodiment of the present invention. Fig. Figure 11 is a cross-sectional view showing the power conversion device in accordance with a fourth embodiment of the present invention. Fig. Figure 12 is a cross-sectional view representing an electric power steering device in accordance with a fifth embodiment of the present invention. Fig. Figure 13 is a cross-sectional view showing a converter device in accordance with a sixth embodiment of the present invention. Fig. Figure 14 is a cross-sectional view showing a mechatronically integrated drive device in accordance with a seventh embodiment of the present invention. Description of embodiments

[0013] With reference to the accompanying drawings, embodiments of the present invention will now be described. However, the present invention is not limited to the following embodiments. <Erste Ausführungsform>

[0014] A first embodiment of the present invention is described on the basis of an example of a power conversion device comprising an inverter for converting electrical power and a motor for converting electrical energy into mechanical energy.

[0015] Fig. Figure 1 is a cross-sectional view in the axial direction of the motor 200 to illustrate a configuration of the power conversion device 100 in accordance with the first embodiment. The power conversion device 100 comprises the motor 200, which has a stator 202 and a rotor 204, and the inverter 300, which includes a motor control circuit.

[0016] The stator 202 for the motor 200 consists of a stator winding around an electromagnetic steel plate. The stator 202 is arranged circularly on the inside of a cylindrical metal housing 201 on the motor side and is secured, for example, by a press fit or a shrink fit. Furthermore, a space for mounting a bearing 203 is provided in the center of a blocking section 201s, which blocks an opening at an axial end of the metal housing 201 on the motor side. The bearing 203 is secured by a press fit.

[0017] An opening at the other axial end of the metal housing 201 on the motor side is provided with a metal cover 207 and a sleeve structure 209. The metal cover 207 secures another bearing 208. The sleeve structure 209 connects to the metal cover 207. The bearing 208 is press-fitted into the metal cover 207. The metal cover 207 is attached to the metal housing 201 on the motor side, for example, by screws or by a press fit.

[0018] Although not shown, the other axial end of the metal housing 201, on the side facing the motor 200, is provided with a screw section for connecting to a cover 312 on the side facing the inverter 300. The screw section is located, for example, on the outside (on the outer circumference) of the sleeve structure 209, to which the metal cover 207 is attached. Furthermore, a section of the metal housing 201, positioned towards the inverter 300 (250), can be formed from an element other than the element for the metal housing 201.

[0019] The inverter 300 is arranged between the metal cover 207 and the other axial end of the metal housing 201 on the motor side. A printed circuit board 308 is arranged on a section positioned at a predetermined distance from the metal cover 207 and in the direction of the other axial end of the metal housing 201 on the motor side. A printed circuit board 311 is arranged between the cover 312, the printed circuit board 308, and the other axial end of a shaft 205.

[0020] The stator winding for stator 202 is formed from windings for three phases, i.e., windings for the U, V, and W phases. The wiring for the individual stator windings is electrically connected by a busbar 210, which is potted with insulating resin. The wiring method for the stator winding can be either a star wiring method or a delta wiring method. Furthermore, the metal wires 213 for the U, V, and W phases extend axially from the busbar 210 and pass through a hole 211 in the metal cover 207.

[0021] The rotor 204 consists of the shaft 205 and a permanent magnet attached to the outer circumference of the shaft 205. The rotor 204 can rotate due to the bearings 203 and 208 and a rotating magnetic field generated when current flows to the stator winding. The permanent magnet can be made of materials such as neodymium or ferrite.

[0022] A power module 301 for the inverter 300 is arranged on the metal cover 207. Fig. Figure 2 is a circuit diagram representing the power module 301. The power module 301 contains semiconductor elements 302a, 302b ( Fig. 2(a)) or semiconductor elements (302a-302c ( Fig. 2(b)). The semiconductor elements 302a-302c are used for power conversion. Examples of semiconductor elements 302a-302c include an IGBT or a MOSFET.

[0023] As in Fig. As shown in 3, these are, for example, in Fig. 2(a) Semiconductor elements 302a, 302b shown and a (not shown) metal wiring 303 electrically connected to the semiconductor elements 302a, 302b are covered with insulating resin 304. Individual terminals connected to the metal wiring are exposed to the outside of the resin 304.

[0024] Fig. Figure 3 is a top view showing the power module 301. A positive wiring terminal 331, a negative wiring terminal 332, a phase output terminal 333, a gate terminal 334, and a gate terminal 335 are exposed on the resin 304. The positive wiring terminal 331 is at the same potential as a drain electrode of the semiconductor element 302a. The negative wiring terminal 332 is at the same potential as a source electrode of the semiconductor element 302b. The phase output terminal 333 connects to a motor winding. The gate terminal 334 is electrically connected to a gate electrode of the semiconductor element 302a for an upper branch. The gate terminal 335 is electrically connected to a gate electrode of the semiconductor element 302b for a lower branch.

[0025] The figure shows that the gate terminals 334, 335 protrude from the same side as the phase output terminal 333. Alternatively, however, the gate terminals 334, 335 can protrude from the same side as the positive and negative terminals 331, 332, or they can protrude from a transverse side angled at 90 degrees from the aforementioned side. Furthermore, the individual output terminals can be bent into other positions and their lengths can differ. If individual output terminals are easily connected to the busbar 210 and to the circuit boards 308, 311, they can be appropriately designed.

[0026] Fig. Figure 2(b) shows an example of the power module, which includes the semiconductor elements 302a and 302b for the upper and lower branches, respectively, and the semiconductor element 302c on the motor output side. The semiconductor element 302c on the motor output side is connected between the phase output terminal 333 and a common connection point for the semiconductor elements 302a and 302b.

[0027] The in Fig. 2(b) The power module shown is in the same way as the one shown in Fig. 3. Configured as shown. More precisely, the three semiconductor elements 302a-302c and the metal wiring are encapsulated with the insulating resin 304, with the individual connections 331-335 exposed to the outside from the resin 304.

[0028] Fig. 4 is a cross-sectional view representing the power module in which the two in Fig. 2(a) The semiconductor elements 302a, 302b shown are covered with the resin 304. Based on Fig. 4. The positive wiring terminal 331, made of metal, is connected to the drain electrode of the semiconductor element 302a for the upper branch, and the phase output terminal 333 is connected to a source electrode of the same semiconductor element 302a. These terminals are connected, for example, by soldering. Furthermore, the phase output terminal 333 is connected to a drain electrode of the semiconductor element 302b, and the negative wiring terminal 332, also made of metal, is connected to the source electrode of the same semiconductor element 302b. These terminals are connected, for example, by soldering.

[0029] The phase output terminal connected to semiconductor element 302a and the phase output terminal connected to semiconductor element 302b need not be formed from a single metal plate. Each of these phase terminals can be formed from two or more metal plates.

[0030] Suitable materials for the aforementioned metal terminals include, for example, copper, which exhibits low electrical resistance, or aluminum, which has a low relative density. Although not shown, metal wiring is electrically connected to the gate electrodes of semiconductor devices 302a and 302b. The electrodes of the semiconductor devices can be electrically connected to the metal terminals, for example, by direct soldering or by wire contacting using aluminum or similar materials.

[0031] For example, an injection molding process can be used as the method for coating with the insulating resin 304. Epoxy resin or the like can be used as the resin 304. Preferably, the resin 304 has a thermal conductivity of 3 W / (m·K) or higher. Furthermore, the thickness 305 of the resin covering the metal terminals 331-335 is preferably not greater than 300 µm. The fact that the semiconductor elements 302a, 302b are covered with the resin 304 reduces the stress imposed on a soldering material or other joining material due to a difference in the coefficient of linear expansion between the semiconductor elements and the metal terminals.

[0032] Fig. 5 is a top view showing the Fig. Figure 3 shows the power module when attached to the metal cover 207. A total of three power modules 301a, 301b, and 301c are attached to the metal cover 207, corresponding in that order to the U, V, and W phases. A metal cover hole 211 is formed at a location opposite the phase output terminal 333 of each power module on the metal cover 207, through which motor wiring passes.

[0033] The phase output terminal 333 is electrically connected, for example, by welding to an output wiring 213 of the busbar 210. Grease or another material reducing thermal contact resistance may be arranged between the metal cover 207 and the power module 301. Furthermore, a hole 214 is formed in the center of the metal cover 207, which penetrates the motor shaft 205. To prevent interference from the heat generated in the power modules and considering the output terminal connections, the power modules 301a-301c are preferably arranged concentrically and symmetrically. In addition, the metal cover 207 may have a groove or other recess for positioning the power modules. The metal cover 207 may also have a groove to provide sufficient insulation distance between the power modules and the metal wiring (to the metal terminals 331-335).

[0034] Based on Fig. Section 1 now describes a configuration of the inverter 300. A rectangular metal plate 306 for heat dissipation is arranged on a surface of the power module 301 that is positioned opposite its surface in contact with the metal cover 207. The metal plate 306 is screwed to the metal cover 207 or otherwise attached to it. Alternatively, the metal plate 306 can be attached to the power module 301 with adhesive or the like. For example, aluminum, which has a high specific heat capacity, can be used as the material for the metal plate 306. Grease or another material that reduces thermal contact resistance can be placed between the metal plate 306 and the power module 301. Furthermore, a heat dissipation fin can be arranged on a surface of the metal plate 306 that is positioned opposite its surface in contact with the power module 301.

[0035] The metal plate 306 can be provided separately for each of the power modules 301a-301c. Alternatively, only one metal plate is provided for a group of three power modules. Furthermore, the metal plate 306 does not always have to be rectangular.

[0036] On a surface of the metal plate 306, which is positioned opposite the power module 301, the circuit board 308 is arranged for supplying electrical power to the positive and negative wiring terminals 331, 332 of the power modules 301a-301c. The wiring terminals 331, 332 are electrically connected to the circuit board 308, for example, by soldering or by press fit. On a surface of the circuit board 308, which is positioned towards the metal cover 207, components such as a capacitor 309 for smoothing the voltage between the positive and negative terminals of the power module and an induction coil 310 for suppressing noise are soldered.

[0037] The capacitor 309 can be, for example, an electrolytic capacitor or a capacitor with a conductive polymer. A groove can be formed in a section of the metal cover 207 opposite the capacitor 309 to provide sufficient distance to an explosion-proof valve for the capacitor 309, or a hole can be formed into which the housing for the capacitor 309 is inserted.

[0038] The printed circuit board 308 is formed from several wiring layers (generally an even number of wiring layers). Wiring at positive and negative potential on the printed circuit board 308, leading to the power module 301, is arranged in alternating layers. More precisely, a wiring connection at positive potential is located in an nth layer, and a wiring connection at negative potential is located in an (n + 1)th layer. To reduce the wiring inductance between the capacitor 309 and the power module 301, the wiring connections at positive and negative potential are further arranged opposite each other. In addition, the wiring inductances between the capacitor and the individual power modules 301a, 301b, 301c are standardized so that the individual power modules generate the same amount of heat. Although not shown, the printed circuit board 308 can, for example,A shunt resistor for current detection and a chip capacitor for noise suppression may be included. Although the circuit board 308 is shown in the present embodiment as an electrical wiring system for supplying electrical power, alternatives such as a resin-coated busbar, a metal wiring board, or a ceramic board may be used.

[0039] A printed circuit board 311 is arranged on one side opposite the metal cover 207 for the printed circuit board 308. Soldered onto the printed circuit board 311 are, for example, a driver IC and a microcomputer that control the semiconductor elements 302a, 302b in the power module 301, and an operational amplifier that amplifies a current value detected by the shunt resistor. The gate wires 334, 335 for the power module 301 are electrically connected to the printed circuit board 311, for example, by soldering or by press fit. A magnet 212 for position detection is press-fitted into the front end of the shaft 205 of the motor 200 through the resin. On a surface of the printed circuit board 311 opposite the position detection magnet 212, one or more ICs for detecting the position of a motor axis are mounted.

[0040] A connector 307 is attached to each of the printed circuit boards 308, 311 to enable signal exchange between the printed circuit boards. Furthermore, the power conversion device 100 can be electrically connected to external components such as a battery and a torque sensor if a cover 312 with a hole is provided at one point on the connector 307.

[0041] In the configuration described above, the heat generated by the power module 301 (301a-301c) for the inverter 300 is dissipated via a heat dissipation path from the metal cover 207 on the side of the motor to the metal housing 201 on the side of the motor and via a heat dissipation path from the metal plate 306.

[0042] As described above, the first embodiment produces the following advantageous effects. (1) Metals (the metal cover 207 and the metal plate 306) are arranged on both surfaces of the power module (301) to increase the heat dissipation area and heat capacity. This allows the heat generated by the power module to be released effectively. This makes it possible to reduce the size of the power module. (2) The metal terminals (331-335) of the power module are all covered with resin. This reduces the number of additional components required for insulation and heat dissipation. Furthermore, the thermal resistance of the resin decreases when the resin 304 has a thermal conductivity of 3 W / (m·K) and a thickness of 300 µm. This further improves the heat dissipation performance of the power module. (3) The inverter 300 does not require a metal housing. This results in a simplified structure. <Modification of the first embodiment>

[0043] In the first embodiment, the metal plate 306 is only in contact with the power module 301. However, in a modification of the first embodiment, as described in Fig. Figure 6 shows a cross-sectional structure from which a circumferential section of the power module 301 has been extracted, also a metal plate 306' in planar contact with the metal cover 207. In the first embodiment, some of the heat generated by the power module 301, which is conducted to the metal plate 306, is released only by heat transfer to the air in the inverter 300. In contrast, in the modification of the first embodiment, the heat conducted to the metal plate 306' is transferred via the metal cover 207 to the metal housing 201 on the motor side. This allows for the use of a larger heat dissipation area.

[0044] When the above modification of the first embodiment is used, the heat generated by the power module 301 can be dissipated with increased efficiency. This allows the size of the power module to be further reduced. Furthermore, the metal plate 306' can be used to position the power module 301. Grease or another material that reduces thermal contact resistance can be arranged between the metal plate 306' and the metal cover 207, which are in planar contact with each other. Additionally, a heat dissipation fin can be arranged on a surface of the metal plate 306' that faces the circuit board 308. <Zweite Ausführungsform>

[0045] The following description of a second to seventh embodiment of the present invention does not address elements with the same functions as those described in the figures above. Fig. 1 to 5 of the power conversion device 100, the elements designated with the same reference numerals.

[0046] Fig. Figure 7 shows an exemplary configuration of the power conversion device in accordance with the second embodiment. Fig. Figure 7 is an axial cross-sectional view of the motor 200. The configuration of the motor 200 is the same as that described in connection with the first embodiment. The opening at the other axial end of the metal housing 201 on the side of the motor has a larger diameter than the opening in the first embodiment ( Fig. 1) on. In the second embodiment, a metal housing 313 for the inverter is located instead of above the in Fig. Cover 312 shown in 1 is arranged above the opening.

[0047] Instead of the in Fig. In Figure 1, a metal base 314 is arranged on a section of the metal housing 313 opposite the power module 301 on the metal plate 306 shown. Thus, one surface of the power module 301 is in contact with the metal cover 207, and the other surface is in contact with the base 314. The base 314 may have a groove for positioning the power module 301. Furthermore, grease or another similar material may be placed between the power module 301, the metal cover 207, and the base 314. The base 314 may also be oriented towards the metal cover 207.

[0048] The power module 301 in the second embodiment is configured such that the gate terminals 334, 335 are arranged in different locations than in the first embodiment. More precisely, the gate terminals 334, 335 are positioned in the direction of the positive and negative wiring terminals 331, 332.

[0049] The circuit board 308 is positioned opposite the positive and negative wiring terminals 331, 332 and the gate terminals 334, 335 of the power module 301 and is screwed or otherwise attached to the metal housing 313 or to the metal housing 201 and the metal cover 207. The circuit board 308 carries, for example, wiring for electrically connecting an external power supply to the power module 301, the capacitor 309 for voltage smoothing, and an induction coil.

[0050] Furthermore, on the circuit board 308, for example by soldering, an IC for controlling the semiconductor elements 302a, 302b of the power module 301 and a position detection IC, which is positioned such that it is opposite the position detection magnet 212, are attached. In order to dissipate heat to the socket 314 arranged on the metal housing 313 via an insulating heat dissipation plate or the like, a thermal contact hole can also be arranged in a surface on which the IC for controlling the semiconductor elements 302a, 302b is attached and in a surface on which the capacitor 309 is attached.

[0051] The metal housing 313 also acts as a cover and is screwed or otherwise attached to the metal housing 201 for the motor 200.

[0052] In the configuration described above, the heat generated by the power module 301 for the inverter 300 is transferred via a heat transfer path from the metal cover 207 on the side of the motor to the metal housing 201 on the side of the motor and via a heat transfer path from the base 314 on the side of the inverter to the metal housing 313 on the side of the inverter and to the metal housing 201 on the side of the motor.

[0053] As described above, the second embodiment creates the following advantageous effects. (1) By using the existing inverter metal housing (313) and without having to add the metal plate (306) to release the heat generated by the power module (301), an increase in the number of parts required can be avoided. (2) The heat generated by the power module is conducted to both the inverter metal housing (313) and the motor metal housing (201). This increases the heat dissipation area, which in turn allows the size of the power module to be reduced. (3) Heat generated by the circuit board (308), on which, for example, a capacitor is mounted, is also conducted to the inverter metal housing (313) and released to the outside. This makes it possible to reduce the size of both the circuit board and the capacitor. <Dritte Ausführungsform>

[0054] Based on Fig. The third embodiment is now described in sections 8 to 10. Fig. Figure 8 is a cross-sectional view showing the power conversion device in accordance with the third embodiment. Fig. Figure 9 is a top view showing the power module. Fig. Figure 10 is a top view showing a front end of the busbar connection. In the first and second embodiments, the terminals 331-335 of the power module 301 project outwards from a side surface of the power module and connect to the stator winding of the motor 200 and to the electrical wiring of the circuit board.

[0055] As in Fig. As shown in Figure 9, in the third embodiment, on the other hand, a window 350 is formed by the resin 304 at one or more locations at the phase output terminal 333 of the power module 301. As shown in Figure 9. Fig. As shown in Figure 10, the front end of the output wiring 353 of the terminal busbar 210 further has a forked structure that fits into the window 350 of the power module 301.

[0056] While using the configuration described above, a good electrical connection can be established between the phase output terminal 333 of the power module 301 and the output wiring 353, while they are in pressure contact with each other when the output wiring 353 is inserted into the window 350. In the present embodiment, the window 350 is provided only for the phase output terminal 333 of the power module 301. However, the same window can alternatively also be provided for the positive and negative wiring terminals 331 and 332 and for the gate terminals 334 and 335. In such an alternative configuration, the wiring electrically connected to the individual terminals should be shaped to establish a pressure contact connection.The wiring for the inverter 300, which is to be electrically connected to the positive and negative wiring terminals 331, 332, can be formed from a potted busbar.

[0057] As described above, the third embodiment creates the following advantageous effects. (1) When the individual parts are assembled, the electrical connections between the power module terminals and the wiring on the motor side and the wiring on the inverter side can be made simultaneously. This eliminates the need for welding and other processes. (2) The length of the metal wiring for the power module can be reduced. This not only makes it possible to reduce the electrical resistance of the metal wiring, but also to achieve a cost reduction. (3) The power module can be structured so that its connections are not exposed from its side surface. This makes it possible to further reduce the mounting area required for the power module. <Vierte Ausführungsform>

[0058] Fig. Figure 11 shows a cross-sectional structure of the power conversion device in accordance with the fourth embodiment. In the preceding embodiments, the inverter 300 is arranged in the axial direction of the motor 200. In contrast, in the fourth embodiment, the inverter 300 is arranged in the circumferential direction of the motor 200. The motor 200 has the same configuration as in the first embodiment. However, the fourth embodiment is configured such that it eliminates the opening in the other axial end of the metal housing 201 on the side of the motor that uses the metal cover 207 as a boundary.

[0059] In the fourth embodiment, the power module 301 is arranged in the metal housing 313 on the inverter side for the inverter 300. More precisely, the power module 301 is arranged on the inner surface of a thick section 313aa of a plate 313a that forms the metal housing on the inverter side. A surface of the power module 301, positioned opposite the thick section 313aa, is in contact with the base 314 located on the cover 312 (the other plate), which is opposite one plate 313a. One plate 313a of the metal housing 313 on the inverter side is in contact with and attached to an outer circumferential plate 201a of the metal housing 201 on the motor side.

[0060] The metal wiring 213, positioned towards the motor 200 and originating from the busbar 210, passes through a hole (not shown) formed in the metal cover 207 and the outer circumferential plate 201a of the metal housing 201 on the motor side towards the inverter 300. One end of the metal wiring 213 is electrically connected to the terminal section 390, which is located on the outer surface of the thick section 313aa of the plate 313a of the metal housing 313a on the inverter side.

[0061] A front end of the phase output terminal 333, which is exposed to the outside from the power module 301 in the metal housing 313, is also connected to the terminal section 390 and is fastened together with the metal wiring 213, e.g. with a metal screw which is part of the terminal section 390.

[0062] The other terminals 331, 332, 334, 335 of the power module 301 are connected to the circuit board 308 arranged in the metal housing 313.

[0063] In the configuration described above, the heat generated by the power module 301 is dissipated from a heat dissipation path that passes through the base 314 of the metal housing 313 on the inverter side and through the cover 312, and from a heat dissipation path that passes through the thick section 313aa and through the outer circumferential plate 201a of the metal housing 201 on the motor side.

[0064] As described above, the fourth embodiment creates the following advantageous effects. (1) The metal housing for the motor and the metal housing for the inverter can both be used for heat dissipation. This allows the heat generated by the power module to be released further to the outside. This makes it possible to reduce the size of the power module. (2) The motor and the inverter can be prepared and connected separately. This significantly increases the degree of freedom in the selection and installation of the parts. <Fünfte Ausführungsform>

[0065] Fig. Figure 12 shows a cross-sectional structure of the fifth embodiment, which describes an electric power steering device to which the present invention is applied. Fig. Figure 12 shows part of the electric power steering system. Fig. 12(a) is attached to the metal housing 201 for use in conjunction with the first embodiment ( Fig. 1) The power conversion device 100 described has a reduction mechanism 400 screwed to it or otherwise attached to it. The reduction mechanism 400 comprises a steering spindle 401, a worm gear 402, a worm shaft 403, a worm 404, and a reduction mechanism metal housing 405. The reduction mechanism metal housing 405 is made of aluminum or an aluminum alloy.

[0066] When a driver of a vehicle manipulates a steering wheel, the electric power steering device exerts an auxiliary torque on the steering spindle 401 via the reduction mechanism 400 to reduce the steering wheel manipulation force required by the driver.

[0067] When the configuration described above is used, the heat generated by the power module 301 can be conducted via the metal cover 207 and the metal housing 201 on the side of the motor to the metal housing 405 for the reduction mechanism 400.

[0068] The reduction mechanism 400, the motor 200 and the inverter 300 do not always need to be as shown in Fig. 12(a) shown to be arranged. As e.g. in Fig. As shown in Figure 12(b), the inverter 300 can be arranged between the reduction mechanism 400 and the motor 200.

[0069] The in Fig. The alternative configuration shown in 12(b) differs from the one in Fig. The configuration shown in 12(a) is more precise. Fig. In the configuration shown in Figure 12(b), the other axial end of the shaft 205 is hermetically sealed with a locking section 201ss, the opening in the metal housing 201 being positioned on the side of the motor at one axial end, the same as in Figure 12(b). Fig. Figure 12(a) shows the inverter 300 arranged in the opening, the connector 307 arranged on the outer circumference of the housing 201, and the connector 307 connected to the circuit boards 308, 311 by means of a wire. Reference numeral 220 denotes a resolver.

[0070] In the alternative configuration described above, the heat generated by the power module 301 is dissipated because one surface of the power module 301 is in contact with the metal cover 207 for the motor, and the other surface is in contact with the metal plate 306. Another alternative configuration can be used in which the power module 301 is attached to the metal housing 405 for the reduction mechanism 400. In this configuration, the heat generated by the power module 301 is dissipated to the metal housing 405 for the reduction mechanism and to the metal plate 306.

[0071] As described above, the fifth embodiment creates the following advantageous effects. (1) The heat generated by the power module can be conducted from the metal housing 201 to the reduction mechanism 400. This leads to a further increase in the dissipation area. Consequently, the size of the power module can be reduced. (2) The degree of freedom in the design of the motor, the inverter, and the reduction mechanism can be significantly increased. Therefore, the present invention can be applied to a wide variety of products. <Sechste Ausführungsform>

[0072] Fig. Figure 13 shows a cross-sectional structure of the sixth embodiment. Fig. Figure 13 shows part of the inverter device (300). Based on Fig. A spacer 503 is arranged adjacent to the power module 301 at point 13. The spacer 503 has essentially the same thickness as the power module 301. A cooling fin 501 is arranged on both the surface of the spacer 503 and the surface of the power module 301 for heat dissipation.

[0073] The cooling fin 501 is screwed onto the spacer 503 or otherwise attached to it. This prevents the pressure exerted on the power module 301 from exceeding a rated value. Grease or another material that reduces thermal contact resistance can be placed between the power module 301 and the cooling fin 501. Although not shown, several power modules 301 are arranged. One cooling fin 501 can be provided for each power module 301. Alternatively, two cooling fins can be provided for the multiple power modules (one for one surface of the power modules and the other for the other surface of the power modules).

[0074] For example, in Fig. As shown in Figure 2(a), the power module 301 contains two semiconductor elements, terminals connected to the semiconductor elements, and resin 304 with which the terminals are encapsulated. All terminals are arranged on one side and inserted into a resin capsule 500, which is positioned opposite the spacer 503 and adjacent to the cooling fin 501.

[0075] The resin capsule 500 contains, for example, a film capacitor 504, the printed circuit board 308 (on which, for example, an IC for semiconductor element control is mounted), and a terminal strip 505. The area around the film capacitor 504 is impregnated with resin 506.

[0076] The layer capacitor 504 is welded or otherwise connected to the output terminal of the power module 301. The circuit board 308 is soldered or otherwise connected to the gate terminal of the power module 301.

[0077] As described above, the sixth embodiment creates the following advantageous effects. (1) Heat is released from both surfaces of the fully encapsulated power module (301). This makes it possible to reduce the size of the power module, i.e., the size of the inverter device. (2) Since the fully encapsulated power module and the heat sink are used, the heat-generating power module can be separated from the electronic components. This improves the thermal resistance of the electronic components. (3) Since the cooling fin is separate from the power module, the size of the cooling fin and the power module can be changed if desired. <Siebente Ausführungsform>

[0078] Fig. Figure 14 shows a cross-sectional structure of the seventh embodiment, which describes a mechatronically integrated drive device in an oil pump system to which the present invention is applied. Based on Fig. Figure 14 contains the mechatronically integrated drive device 600, the motor 200, and the inverter 300. The inverter 300 is used to control the motor 200 in order to control the amount of oil flowing from an inlet section 604 to an outlet section 605.

[0079] A metal housing for the inverter 300 is formed from a flat heat sink 601 and a capsule 602. The circuit board 311 is arranged in the metal housing, parallel to the heat sink 601. A hole 603 is formed essentially in the center of the circuit board 311. At least one power module for power conversion is arranged through the hole 603.

[0080] One surface of the power module 301 is in contact with the heat sink 601. The metal plate 306 is arranged on the other surface of the power module 301. One surface of the metal plate 306 is in contact with the power module 301, and the other surface is in contact with the metal capsule 602. The motor 200 is arranged on the capsule 602, which is in contact with the metal housing 201 on the side of the motor.

[0081] The power module 301 contains the semiconductor elements and the components, for example, in Fig. 2(a) shown connections and resin with which the semiconductor elements and the connections are encapsulated. The connections, which are made of metal, project linearly outwards and are connected to the circuit board 311.

[0082] Consequently, the connections of the power module 301 are flush with the electrical connection surface of the circuit board 311. Thus, the connections do not need to be bent or otherwise modified.

[0083] The circuit board 311, for example, carries a capacitor 610, an induction coil 611, a connector 612, and a control IC. Thus, the circuit board 311 can precisely control the motor 200. The heat sink 601 is made of aluminum or another thermally conductive material with a high heat capacity. The capsule 602 is made of iron or another inexpensive, easily machinable metal.

[0084] In the configuration described above, one surface of the power module 301 is in direct contact with the heat sink 601, without the circuit board 311 being positioned between them. This allows the heat generated by the semiconductor elements in the power module to be effectively dissipated. Furthermore, a heat transfer path is provided between the other surface of the power module 301 and the capsule 602. This further improves the heat dissipation efficiency.

[0085] The metal plate 306 can be part of the capsule 602. Furthermore, grease or the like can be arranged between the power module 301 and the heat sink 601. In addition, the metal housing 201 for the motor 200 can function as the capsule 602.

[0086] As described above, the seventh embodiment produces the following advantageous effects. (1) Heat is released from both surfaces of the fully encapsulated power module 301 without being transferred via the printed circuit board 311. This makes it possible to reduce the size of the power module, i.e., to reduce the size of the inverter device. (2) The metal terminals of the power module are flush with the surface of the electrical connections on the printed circuit board. Therefore, the metal terminals do not need to be bent or otherwise machined. This reduces costs and man-hours. Reference symbol list 100 Power conversion device, 200 engine, 201 Metal housing on the side of the engine, 201s, 201ss, restricted section, 202 Stator, 203, 208 storage units, 204 Rotor, 205 wave, 206 Stator winding output section, 207 Metal cover, 209 Sleeve structure, 210 connection busbar, 11 Metal cover hole, 212 Position detection magnet, 213 Metal wiring, 14 holes, 300 inverters, 301 Power Module, 302a-302c semiconductor element, 304 Harz, 305 resin thickness, 306, 306' metal plate, 307, 612 connectors, 308, 311 circuit board, 309, 610 Capacitor, 310, 611 Induction coil, 312 Cover, 313 Metal housing on the side of the inverter, 313a a plate, 313aa thick section, 314 sockets, 331 positive wiring connection, 332 negative wiring connection, 333 Phase output connection, 334, 335 Gate connector, 350 power module windows, 353 Output wiring, 390 Connection section, 400 reduction mechanism, 401 Steering spindle, 402 worm gear, 403 worm shaft, 404 Snail, 405 Metal housing for reduction mechanism, 500 resin capsules, 501 cooling fin, 503 spacers, 504 Layer capacitor, 505 terminal strip, 506 Harz, 600 mechatronically integrated drive devices, 601 Heat sink, 602 capsules, 603 holes, 604 Entrance section, 605 Outlet section.

Claims

[1] Power conversion device (100) comprising: an engine (200); and a converter (300); wherein at least one power module (301) for the inverter (300) is arranged on a metal housing (201) for the motor (200); characterized by , that a metal plate (306) for heat dissipation is arranged on a surface of the power module (301) which is positioned opposite a surface of the power module (301) which is in contact with the metal housing (201), wherein a circuit board (308) for supplying electrical power to the power module (301) is arranged on a surface of the metal plate (306). [2] Power conversion device (100) according to claim 1, wherein the power module (301) comprises semiconductor elements (302a - 302c), a metal wiring (213) connected to electrodes of the semiconductor elements (302a - 302c), and insulating resin with which the semiconductor elements (302a - 302c) and the metal wiring (213) are encapsulated; and wherein a surface of the motor (200) in contact with the metal housing (201) and a surface of the motor (200) in contact with the metal plate (306) are covered with the insulating resin. [3] Power conversion device (100) according to claim 1 or 2, wherein the metal plate (306) has a surface that is flush with the surface of the power module (301) that is in contact with the metal housing (201). [4] Power conversion device (100) according to one of claims 1 to 3, wherein the metal plate (306) for heat dissipation is a metal housing (313) for the converter (300). [5] Power conversion device (100) according to any one of claims 1 to 3, wherein the power conversion device (100) is an electric power steering device comprising a reduction mechanism, a motor (200) coupled to the reduction mechanism and an inverter (300) which supplies electrical power to the motor (200). [6] Power conversion device (100) comprising: an engine (200); and a converter (300); wherein at least one power module (301) for the inverter (300) is arranged on a metal housing (313) for the inverter (300); and characterized by, that a metal plate (306) for heat dissipation is arranged on a surface of the power module (301) which is positioned opposite a surface of the power module (301) which is in contact with the metal housing (313), wherein a circuit board (308) for supplying electrical power to the power module (301) is arranged on a surface of the metal plate (306). [7] Power conversion device (100) according to claim 6, wherein the inverter (300) is arranged parallel to a shaft of the motor (200); wherein the power module (301) is arranged on the inner surface of the plate forming the metal housing (313) for the inverter (300); wherein the metal plate (306) for heat dissipation is formed from another plate opposite one plate of the metal housing (313) for the inverter (300); and wherein one plate of the metal housing (313) for the inverter (300) is in contact with an outer circumferential plate of the metal housing (201) for the motor (200), which is parallel to the motor shaft. [8] Power conversion device (100) according to claim 6, wherein the metal plate (306) for heat dissipation is in contact with the metal housing (201) for the motor (200). [9] Power conversion device (100) according to any one of claims 2 to 8, wherein the resin of the power module (301) is provided with a window that exposes the metal wiring (213) encapsulated with the resin; and wherein a wiring connected to a winding of the motor (200) is inserted into the window and connected to the metal wiring (213). [10] Power conversion device (100) according to any one of claims 2 to 9, wherein the semiconductor elements (302a - 302c) in the power module (301) comprise a semiconductor element (302a) on the upper branch side, a semiconductor element (302b) on the lower branch side and a semiconductor element (302c) on the motor output side, wherein the semiconductor element (302c) on the motor output side is connected between a phase output terminal and a common connection point for the semiconductor elements (302a, 302b) on the upper branch side and on the lower branch side. [11] Power conversion device (100) comprising: a semiconductor element (302a - 302c); a metal wiring (213) which is connected at one end to an electrode of the semiconductor element (302a - 302c); a power module (301) comprising insulating resin with which the semiconductor element (302a - 302c) and the metal wiring (213) are encapsulated; and a heat dissipation fin arranged on both surfaces of the power module (301); wherein the power module (301) and the heat dissipation fin are in contact with each other via the resin, wherein the other end of the metal wiring (213) is led outwards from the power module (301); and wherein the metal wiring (213) led from the drain and source electrodes of the semiconductor element (302a - 302c) is connected to a capacitor; and wherein the metal wiring (213) guided by the gate electrode of the semiconductor element (302a - 302c) is connected to a circuit board on which a part for controlling the semiconductor element (302a - 302c) is mounted, wherein the capacitor and the circuit board are contained in a single unit within a capsule formed from resin. [12] Power conversion device (100) according to claim 11, wherein a spacer (503) is arranged between the heat dissipation fins (501) arranged on each surface of the power module (301).

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