Acoustic damping in data storage enclosures

Abstract

Data storage arrangement (110) comprising: a housing (113) configured to hold at least one data storage device (120-124); a fan assembly (115-117) configured to provide an airflow within the housing (113) for ventilating at least one data storage device (120-124), wherein a plurality of sound waves from one or more fans of the fan assembly (115-117) radiate into the data storage device (120-124) in operation; and an acoustic damping device (200) disposed within the housing (113) and configured to deflect at least a portion of the plurality of sound waves away from the at least one data storage device (120-124) and to absorb a portion of the sound wave energy from at least a second portion of the plurality of sound waves, characterized in that the acoustic damping device (200) is arranged closer to the at least one data storage device (120 - 124) than to the fan arrangement (115 - 117), the acoustic damping device (200) further comprises a plurality of openings (225) extending therethrough and configured to allow the air flow to pass through the acoustic damping device (200) and the flow resistance of the plurality of openings (225) with respect to the air flow passing through the acoustic damping device (200) is lower than the flow resistance of the air flow passing through the data storage device (120 - 124).

Description

FIELD OF EXPERTISE

[0001] Aspects of the invention relate to the field of data storage and sound attenuation in data storage enclosures. TECHNICAL BACKGROUND

[0002] Computer and network systems such as data storage systems, server systems, cloud systems, personal computers, and workstation systems typically include data storage devices for storing and retrieving data. These data storage devices may include hard disk drives (HDDs), solid-state storage drives (SSDs), tape storage devices, optical storage devices, and hybrid storage devices that include both rotating and fixed data storage elements and other mass storage devices.

[0003] As the number and capabilities of computer systems and networks increase, the need for ever-increasing storage capacities is growing. Data centers, cloud computing devices, and other large-scale data processing systems have further increased the need for digital data storage systems capable of transferring and storing immense amounts of data. Data centers can accommodate a large number of data storage devices in various rack-mounted and high-density storage configurations.

[0004] One approach to providing sufficient data storage in data storage centers is the use of arrays of independent data storage devices. Many data storage devices can be housed within an electronics enclosure. An electronics enclosure is a modular unit that can house and operate independent data storage devices in an array, computer processors, routers, and other electronic equipment. The data storage devices are housed and operated in close proximity within the electronics enclosure, allowing many data storage devices to be fitted into a given volume. Operating multiple data storage devices in close proximity within the electronics enclosure can lead to heat problems and premature failure of data storage devices.

[0005] Electronics enclosures typically include fans or other cooling devices. If a fan fails in an electronics enclosure with two or more fans, the failed fan becomes the path of least resistance to airflow, directing cooling airflow away from the data storage device. Some electronics enclosures include hinged vent assemblies mounted on the exhaust side of the fan. If a fan fails, the vents close due to gravity or an active servomechanism, preventing reverse airflow through the failed fan. These vent assemblies are typically mounted outside the data storage assembly or electronics enclosure to maximize the use of internal space for the electronic components. Externally mounted reverse airflow vents add mass to the enclosure and can interfere with cables, charging cords, and walls near the enclosure.Furthermore, designs with vents include many moving parts, which can lead to reduced reliability of the electronics enclosures.

[0006] As the density and workload of data storage devices increase, increased failure rates may be observed in individual data enclosures due to increased density and higher operating temperatures. Additionally, dense packing of data storage devices within the enclosure, such as in rack-mounted modular units, can lead to harsher vibrational and thermal environments for data storage devices. These harsh environments, such as those due to mechanical fan vibration, acoustic noise, flow-related noise, or other acoustic noise, can affect the reliability and readability of data storage devices containing rotating magnetic media.In systems with dozens of hard drives and fans for cooling, the fans can cause vibration interference while reading from and writing to the hard drives, with hard drives closest to the fan being most affected by the fan noise.

[0007] Furthermore, the disclosures of US 2008 / 0 065 245 A1, US 2011 / 0 063 795 A1, US 2006 / 0 131 101 A1, US 6 104 608 A, US 5 326 317 A, DE 299 12 274 U1, and US 2001 / 0 006 453 A1 may be helpful for understanding the present invention. For example, US 2008 / 0 065 245 A1 describes a computer system that, in one embodiment, includes a fan and a silencer configured to suppress noise from the fan. The silencer may include a plurality of sound absorption panels, each of the sound absorption panels having a hole that is at least generally aligned with a flow region of the fan. US 2011 / 0 063 795 A1 relates to a computer system comprising a housing with a fan installed therein, a cover plate that can be attached to the housing, and a noise absorber that is attached to the cover plate.The fan is capable of generating an airflow for cooling at least one component in the housing. The noise absorber comprises a plurality of projections facing the fan and capable of dampening the airflow impinging on the cover plate and reducing the noise level of the computer system. US 2006 / 0 131 101 A1 discloses a device comprising a fan assembly having an inlet side and an outlet side, and a sound-absorbing structure arranged on the inlet side of the fan assembly and near the fan assembly. US 6 104 608 A describes a noise-damping hood for dampening the noise emanating from cooling fans in an electronic housing. The hood consists of a base constructed and arranged to be supported on the housing.The base has an air duct configured to allow air to pass through in a first direction, and it includes at least one sound-damping panel disposed in the air duct to dampen acoustic noise emanating from the housing. US 5 326 317 A relates to a fan having an air blower built into its main body. This fan has a fan housing provided with a fan inlet opening opposite an inlet opening of the fan main body. A cylindrical sound-damping unit is disposed in a space between the fan inlet opening and the inlet opening of the main body. The sound-damping unit makes it possible to reduce the noise generated by the air blower while barely increasing the ventilation resistance. DE 299 12 274 U1 describes a low-noise fan-filter unit for supplying a clean room with filtered air.The unit has a rectangular, hollow housing having an air inlet formed in a first wall thereof and an air outlet formed in a second wall opposite the first wall. A fan is installed in the housing near the air inlet to draw air through the air inlet into the housing. A filter is installed in the housing and disposed between the fan and the air outlet to remove impurities from the air flowing through the housing. A flow guide plate is installed in the housing and disposed below the fan to redirect the direction of air drawn through the inlet.A noise reduction plate assembly includes a first plate portion and a second plate portion installed in the enclosure and disposed between the airflow guide plate and the filter to form a curved air duct between the airflow guide plate, the noise reduction plate assembly, and the filter. The air duct is lined with sound-absorbing materials to reduce the noise of air flowing through the duct. Finally, US 2001 / 0 006 453 A1 discloses a reduction in noise in a hard drive enclosure through the use of vibration-damping materials on the inside of the enclosure. These materials and their placement on the inside of the enclosure reduce noise without thermally isolating the drive. A temperature-controlled fan can be used to dissipate heat by convection while generating minimal noise. OVERVIEW

[0008] The object of the present invention is to provide improved operation of data storage devices and systems. For this purpose, various systems and devices are provided according to the independent claims. In this sense, the present invention relates to a data storage arrangement according to claim 1. Accordingly, a data storage arrangement according to the invention comprises a housing configured to accommodate at least one data storage device and a fan arrangement configured to provide airflow within the housing to ventilate at least one data storage device. A plurality of sound waves radiate from one or more fans of the fan arrangement into the data storage device during operation.An acoustic dampening device positioned within the housing and configured to deflect at least a first portion of the plurality of sound waves away from the at least one data storage device and to absorb a portion of the sound wave energy from at least a second portion of the plurality of sound waves. The acoustic dampening device is positioned closer to the at least one data storage device than to the fan assembly. The acoustic dampening device further includes a plurality of openings extending therethrough configured to allow airflow to pass through the acoustic dampening device, wherein the flow resistance of the plurality of openings to airflow passing through the acoustic dampening device is less than the flow resistance of airflow passing through the electronic storage device.

[0009] Furthermore, the present invention relates to a data storage system according to claim 7. In this sense, a data storage system according to the invention comprises a chassis having a data storage device space defined therein for receiving a data storage device, the chassis having a first opening on a first side and a second opening on a second side opposite the first. A fan assembly is coupled to the housing and is configured to cause airflow to flow through the chassis from the first side to the second side and around the data storage device to cool the data storage device.An acoustic damping device is contained in the chassis and is configured to deflect a first portion of a first plurality of sound waves generated by the fan assembly away from the data storage device and to absorb sound wave energy of the second portion of the first plurality of sound waves. The damping device is arranged closer to the data storage device space than to the fan assembly. Furthermore, the damping device has a plurality of openings extending therethrough, wherein a flow resistance of the plurality of openings with respect to the air flow passing through the damping device is lower than the flow resistance of the cooling air flowing around the data storage device arranged in the data storage device space.

[0010] Advantageous embodiments of the invention may each have features of dependent claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Many aspects of the disclosure can be better understood with reference to the drawings. The components in the drawings are not necessarily exhaustive, focusing rather on clearly illustrating the principles of the present disclosure. Also, throughout the drawings, like reference numerals show related parts from different perspectives. Although some embodiments are described in connection with these drawings, the disclosure is not limited to the embodiments disclosed herein. On the contrary, the intention is to cover all alternatives, modifications, and equivalents. Fig. Figure 1 is a system diagram showing a data system. Fig. 2 shows an acoustic damping device. Fig. 3 shows an electronics housing containing the acoustic damping device of Fig. 2 contains. Fig. 4 shows an acoustic damping device. Fig. Figure 5 shows an exploded view of a data storage device insert assembly incorporating the acoustic damping device of Fig. 4 contains. Fig. Figure 6 shows an acoustic damping device contained in an electronics housing. Fig. Figure 7 shows a schematic diagram of a data system without acoustic damping. Fig. Figure 8 shows a schematic diagram of a data system without acoustic damping. Fig. 9 shows an acoustic damping device. Fig. 10 shows an acoustic damping device contained in an electronics housing. DETAILED DESCRIPTION

[0012] Data storage devices, such as hard disk drives (HDDs), solid-state storage drives (SSDs), and hybrid storage devices, which include both rotating and fixed data storage elements and other mass storage devices, may be included in various arranged configurations, such as rack-mounted enclosures that house dozens of individual drives. Cooling or ventilation fans may be included in the enclosures to direct airflow over the various hard disk drives. Power delivery devices may also be included to provide power to the various storage devices, converting input power from a utility or building infrastructure into a form usable by the storage devices.

[0013] Drives that contain rotating media, such as the rotating magnetic media of hard disk drives or hybrid disk drives, also include some electromechanical elements for positioning read / write heads over the rotating media. These electromechanical elements include armatures, motors, actuators, voice coils, servos, and other elements that can be affected by vibrations from the drive itself or from the vibrating environment in which they are housed. This vibrating environment can include vibrations or acoustic noise induced by the ventilation fans, as well as from the drives themselves. For example, a drive that performs many random read / write operations may introduce more vibration to the environment surrounding the drive due to the rapid movements of the associated electromechanical element in the drive. Other components within the storage enclosure, such asFans can also affect the vibration levels within the associated enclosure. The examples herein address some systems, software, devices, and methods for modifying the vibration disturbance environment of storage enclosures. In particular, the speed and phase relationships of ventilation fans can be modified to reduce the acoustic disturbance to the data storage devices in an enclosure.

[0014] The first example of a data storage device is Fig. 1 shown. Fig. 1 is a system diagram showing system 100. System 100 includes a data storage system 110 and one or more host systems 140. Data storage system 110 and host system 140 communicate via storage interconnect 130. Data storage system 110 may be included in an environment including one or more data storage devices, such as a rack-mount computing environment.

[0015] In Fig. 1, the data storage system 110 comprises an assembly including a control system 111, sensors 112, a chassis or housing 113, a plurality of fan assemblies 115-117, a sound attenuation system 118, and a plurality of data storage devices 120-124. Each of the data storage devices 120-124 may include one or more rotating storage media, such as shown in the detailed views for the data storage device 124, which includes rotating media 125 and read / write head / armature assemblies 126. In some examples, some of the data storage devices 120-124 include solid-state storage media, and rotating media may be omitted, or may include combinations of rotating media and solid-state storage media.

[0016] The control system 111 is communicatively coupled to the data storage devices 120-124 and the sensors 112. Although the control system 111 is shown as being within the data storage system 110 in this example, it should be understood that in other examples, the control system 111 may be included in other elements external to the data storage system 110. Furthermore, elements of the control system 111 may be included in individual ones of the data storage devices 120-124.

[0017] In operation, the data storage system 110 receives write or read transactions issued via the storage connection 130 from the host system 140, such as write operations 131 or read operations 132. In response to read operations, individual data storage devices within the data storage system 110 may receive data stored in associated media for transfer to the host system 140. In response to write operations, individual data storage devices within the data storage system 110 may write data to the associated memories. This should be understood to mean that further components of the data storage systems 110 and data storage devices 120-124 in Fig. 1 are omitted for clarity, such as transaction queues, chassis, interconnect systems, read / write heads, media, armatures, preamplifiers, receivers, processors, amplifiers, motors, servos, housings and other electrical or mechanical elements.

[0018] The data storage system 110 includes a plurality of data storage devices 120-124. These data storage devices are coupled to a control system 111 through one or more storage connections, which may include a serial ATA interface, a serial attached small computer system (SAS) interface, an integrated drive electronics (IDE) interface, a non-volatile memory express (NVMe) interface, an ATA interface, a peripheral component interconnect express (PCIe) interface, a universal serial bus (USB) interface, a wireless interface, a direct media (DMI) interface, an Ethernet interface, a network interface, or another communication and data interface, including combinations, variations, and improvements thereof.The data storage system 110 may further include cache systems, chassis, housings 113, fan assemblies 115-117, interconnect systems, cables, or other circuitry and equipment.

[0019] The control system 111 includes processing circuitry, communication interfaces, and one or more non-transitory, machine-readable storage media. The processing circuitry may include one or more microprocessors and other circuitry that obtains and executes firmware from memory for operation as described herein. The processing circuitry may be implemented within a processor device, but may also be distributed across multiple processor devices or subsystems that cooperate in executing program instructions. Examples of processing circuitry include general purpose central processing units (CPUs), application-specific processors and logic devices, as well as any other type of processor device, combinations, and variations thereof. The communication interfaces may include one or more memory interfaces for communicating with host systems, networks, and the like.The communication systems may include preamplifiers, interface circuits, connectors, buffers, microcontrollers and other interface equipment.

[0020] Sensors 112 may include analog or digital vibration sensors or acoustic disturbance sensors configured to detect vibration or acoustic disturbances in the enclosure 113, near one of the data storage devices 120-124, or in conjunction with other elements of the data storage system 110, such as a fan assembly 115-117. Vibration sensors may include accelerometers, gyroscope sensors, microphones, acoustic sensors, or other vibration sensors. Sensors 112 may further detect failures of various components of the data storage system 110, such as the failure of power supplies, fans, data storage devices, and the like, which may affect the vibration environment of the data storage systems 110. Sensors 112 may also include various interfaces for communicating measured information, such as with the control system 111.These interfaces may include, among other elements, receivers, analog-to-digital converters, amplifiers, filters, signal processors. In some examples, sensors 112 may each include microcontroller elements, programmable logic circuits, or discrete logic circuits for controlling the operations of sensor 112. In some examples, data storage devices 120-124 may each include a sensor 112, and data storage devices 120-124 include equipment and circuitry for transporting information from the sensors to control system 111 via an associated storage or host interface.

[0021] The housing 113 includes structural elements that house and structurally support elements of the data storage system 110. The housing 113 may include, among other things, chassis elements, frames, fasteners, rack-mount features, and ventilation elements. In many examples, the housing 113 further includes fans 115-117 or other cooling and ventilation elements to provide airflow to the elements of the data storage system 110.

[0022] Fan assemblies 115-117 provide airflow to the elements within enclosure 113, such as the elements of data storage system 110. Airflow is created by drawing air through one or more openings 114 at one end of enclosure 113 and forcing it through one or more openings 119 at another, opposite end of enclosure 113. Fan assemblies 115-117 may include any type of fan, such as axial, centrifugal, cross-flow, or other fan types, including associated ducts, grilles, vanes, or other directional elements, including combinations and variations thereof.

[0023] The data storage system 110 further includes one or more power supply devices for converting external input power sources or for providing various forms of electrical energy to the elements of the data storage system 110. Power supply devices may each include, among other elements, power conversion elements, power electronics, transformers, and voltage conversion circuitry. Power supply devices may further be incorporated into an arrangement with one or more ventilation fans, such as an arrangement 115-117, to provide cooling and ventilation to the power supply devices and other components of the enclosure 113.

[0024] Each of the data storage devices 120-124 includes one or more computer-readable storage media accessible via one or more read / write heads and associated electromechanical elements. Fig. 1 shows a detailed example view of data storage device 124, highlighting rotating media 125 and read / write heads and armature assemblies 126. These elements may be included in each data storage device 120-124, although variations in data storage devices are possible, such as when solid-state storage media are used. Data storage devices 120-124 each further include processing circuitry, communication interfaces, armatures, preamplifiers, transceivers, processors, amplifiers, motors, servos, housings, and other electrical and mechanical elements. Data storage devices 120-124 may each include a hard disk drive, a hybrid hard disk drive, a solid-state storage drive, or other computer-readable storage devices, and combinations thereof. Data storage devices 120-124 may further include elements similar to sensor 112.The computer-readable storage media of data storage devices 120-124 may each comprise rotating magnetic data storage media, but may also comprise other media, such as solid-state storage drive elements, caches, or cache systems. These other media may comprise solid-state storage media, optical storage media, non-rotating magnetic media, phase-change magnetic media, spin-based storage media, or other storage media, including combinations, variations, and improvements thereof. In some examples, data storage devices 120-124 each comprise a hybrid hard disk drive that employs solid-state storage elements in combination with rotating magnetic storage media. The associated storage media may employ various magnetic storage schemes, such asIncluding random writing techniques, Shingled Magnetic Recording (SMR), Perpendicular Magnetic Recording (PMR) or Heat-Assisted Magnetic Recording (HAMR), combinations, variations and improvements.

[0025] Host system 140 may include processing elements, data transfer elements, and user interface elements. In some examples, host system 140 is a central processing unit of a computing device or system. In other examples, host system 140 also includes memory elements, data storage and transfer elements, control elements, logic elements, firmware, execution elements, and other processing system components. In still other examples, host system 140 includes a RAID control processor or a central storage system processor, such as a microprocessor, microcontroller, field programmable gate array (FPGA), or other processing and logic device, including combinations thereof.Host system 140 may include or interface with user interface elements that may allow a user of data system 100 to control the operations of data system 100 or monitor the status or operations of data system 100. These user interface elements may include graphical or text displays, indicator lights, network interfaces, web interfaces, software interfaces, user input devices, or other interface elements. Host system 140 may further include interface circuitry and elements for handling communication over bus 130, such as logic, processing sections, buffers, transceivers, and the like.

[0026] The bus 130 may include one or more serial or parallel connections, such as a Peripheral Component Interconnect Express (PCIe) interface, Integrated Drive Electronics (IDE) interface, ATA interface, Universal Serial Bus (USB) interface, wireless interface, Direct Media Interface (DMI) interface, Ethernet interface, network interface, or other communication and data interfaces, including combinations, variations, and improvements thereof. Although a bus 130 in Fig. 1, it should be clarified that one or more discrete connections may be applied between the elements of the data system 100.

[0027] When data storage devices 120-124 are positioned close together within enclosure 113, the thermal load increases and tends to make heat dissipation more difficult. For example, powerful cooling fans 115-117 are used to force enough air through the limited flow area. This typically results in greater acoustic interference, in addition to the interference due to the seek functions performed by neighboring drives. Such acoustic interference from a data storage device 120-124 positioned close to a cooling fan 115-117 within enclosure 113 can be severe enough to significantly degrade the performance of these hard drives.

[0028] Fig. 2 shows an example of an acoustic damping device 200 of the sound damping system 118 of Fig. 1. The acoustic damping device 200 includes one or more acoustically dampening or attenuating materials that can alter the acoustic properties in conjunction with the fan assemblies 115-117 to reduce negative acoustic effects on data storage devices 120-124. An acoustic damping device 200 achieves the reduction of acoustic effects at least by attenuating or absorbing acoustic energy across a range of frequencies, as well as by redirecting or deflecting the sound waves.

[0029] The material or material composition of the acoustic damping device 200 is designed to attenuate or absorb sound waves within the damping device material. The acoustic damping device 200 may comprise foam, polymers, metal foam, glass fibers, cellulose, baffles, resonating chambers, or other materials and elements that absorb or trap sound waves at interfering frequencies. Examples of material compositions of the acoustic damping device layers include the following: closed-cell polymeric foam material; open-cell polymeric foam material; fiberboard or cardboard, which has a high density but is soft and lossy; corrugated paper, which has a low density and is dampening due to its structure; corrugated plastics, elastomers; woven or pressed textiles; fibers; molded paper pulp, such as egg carton and packaging corner blocks; and combinations of these materials.

[0030] With a material like foam, which has a density comparable to that of air, part of the sound wave enters the material and the rest is deflected. The foam dissipates some of the energy, the part that passes through the foam. Multiple deflections and absorptions of energy by the foam result in the attenuation of the sound waves.

[0031] The material of the acoustic damping device 200 typically has one or more damping frequencies or frequency ranges for which the sound waves are damped or reduced. In another example, the acoustic damping device may comprise metamaterials that can be selectively tuned by microstructures to damp certain selected acoustic frequencies.

[0032] In addition to dampening the sound waves within the material itself, the outer surface 205 of the acoustic dampening device 200 may include contours or other texturing 210 designed to deflect and disperse sound waves from the data storage devices 120-124. In this way, the waves are deflected before reaching the file storage devices 120-124. In a preferred embodiment, the texturing 210 of the surface of the dampening device 205 minimizes the dispersion of the sound waves to reduce the amount of sound waves that have a direct line of propagation toward the file storage devices 120-124. The texturing 210 preferably causes a sound wave to be deflected or redirected multiple times by the acoustic file storage device before it is able to penetrate the acoustic dampening material.Each time sound waves are deflected at an interface, a portion of the energy passes through the interface and is partially absorbed. As a result, the deflected wave energy may be less than the energy of the original wave. Therefore, multiple deflections of acoustic damping materials can attenuate acoustic disturbances. Typically, lower-density and lossy materials, such as open-cell acoustic foam, can provide the best absorption and deflection.

[0033] As in Fig. 2, texture 210 on surface 205 includes surface corrugations designed to deflect sound waves from surface 205. In this embodiment, texture 210 includes horizontal groups 215 with three corrugations and vertical groups 220 with three corrugations. The alternating structure of horizontal and vertical groups 215, 220 can also assist in resistive matching of the interfaces and improving sound wave absorption.

[0034] As described above, fan assemblies 115-117 provide airflow to elements within the housing 113. While reducing their acoustic effects on the data storage devices 120-124 is desired, their ability to provide cooling to the data storage devices 120-124 must also be maintained. Accordingly, the damping device further includes passages and holes 225 that allow the cooling air to flow through.

[0035] In relation to Fig. 3 shows a data storage system 110 with acoustic reduction. Fig. 3 shows a plurality of bays 320-324, each containing data storage devices 120-124. Each bay includes an opening 305 on a first side facing away from the fans 115-117 and another opening 310 on a second side facing the fans 115-117. When the fans 115-117 are operating, air is drawn through the openings 305 and 310 of the bays 320-324 in the general direction of the airflow 315 through the housing 113.

[0036] The acoustic noise of the fans 115-117 propagating through the housing 113 toward the bays 320-324 is attenuated by the damping devices 200 as described above. As shown, a separate acoustic damping device 200 is attached to one end of each bay 320-324 near the corresponding openings 310 to dampen the fan noise or prevent it from reaching the data storage devices 120-124. To continue to allow airflow to pass through the housing 113, the size and distribution of the holes 225 in the damping devices 200 are selected to have as minimal an impact on the airflow as possible while still allowing the damping device 200 to provide increased acoustic damping.

[0037] In a preferred embodiment, the combined cross-sectional area of ​​the holes 225 in each damping device 200 prevents increased airflow resistance through the data storage system 110, and the cross-section of each hole 225 is small enough to allow the acoustic damping devices 200 to attenuate most sound waves generated by the fans 115-117. In addition, the effect of dust clogging, which can occur with small-diameter holes, is taken into account when sizing the diameters of the holes 225. If the individual diameters are too small, dust can collect in the holes 225 and partially or completely block the airflow through them, which in turn can lead to a reduction in the amount of cooling air for cooling the system 110.

[0038] While Fig. While Figure 3 shows an embodiment with separate acoustic damping devices 200 coupled to individual bays 320-324, alternative embodiments are also contemplated. For example, a single, large damping device traversing the width of the enclosure 113 between the bays 320-324 and the fans 115-117 may be included, rather than a separate damping device 200 for each bay 320-324.

[0039] Fig. 4 shows an acoustic damping device 400 according to another embodiment. The acoustic damping device 400 has certain similarities to the acoustic damping device 200. For example, the acoustic damping device 400 is also designed to dampen or absorb sound waves within the material of the damping device. The acoustic damping device 400 can also be made of the same materials as described above, such as an open-cell foam for high sound wave absorption and damping.

[0040] The acoustic dampening device 400 is shown with a different surface texture 410 or contour 405. To increase cross flow within the housing, the surface 405 may have one or more cross cuts 415 formed therein, which increase the resistance to cross flow in the air gap inside the housing between the fan assembly (e.g., fans 115-117 of Fig. 1) and the acoustic damping device 400. In addition, some or all of the passages or holes 425 may be formed adjacent to a corresponding angled opening 427, designed to reduce the flow resistance of the acoustic damping device 400 and thereby provide a smoother flow profile. The contour 410 of the surface 405 is preferably designed to maximize the volume of the damping device while attempting to reduce the influence of the damping device's resistance on airflow.

[0041] Fig. 5 shows an exploded view of an arrangement of an acoustic damping device 400 adjacent to a plug-in assembly 500. The plug-in assembly 500 includes a plug-in housing 505 in which a data storage device 510 is housed. The acoustic damping device 400 is positioned between a plug-in divider 515 and a rear panel 520 of the housing 505. In an embodiment in which the plug-in housing 505 does not have a rear panel 520, the acoustic damping device 400 may be coupled to the plug-in assembly 500, for example, using an adhesive.

[0042] In addition, as in Fig. 6, individual acoustic dampening devices 600-602 may be coupled to each fan 115-117, respectively, rather than to data storage device bays 320-324. Fig. Figure 6 shows a portion of the housing 113, including an end wall 605 coupled to the fans 115-117. A rear or back surface 610 of the damping devices 600-602 is shown. A front surface of the damping devices 600-602, facing the fans 115-117, is designed to have contours that redirect or deflect sound waves back toward the fans 115-117, as described above. The rear surface 615, however, is shown as planar; surface contours such as contour 210 may be incorporated therein. Since the rear surface 615 faces away from the noise source, this additional texturing provides a reduced effect of scattering the noise.

[0043] Fig. Figure 6 further shows that the thickness of the acoustic damping devices 602 differs from the thickness of the damping devices 600-601. In addition to the design of the material, hole sizing, shape, and surface texturing of the damping device to achieve the desired damping properties, the thickness also contributes to the airflow and sound wave attenuation properties. In general, the thicker the damping device, the greater the damping capability. However, thicker damping devices also require more space or area within the housing 113 and can affect the crossflow of cooling air within the housing 113. Thicker damping devices tend to have larger airflow resistance values, causing the overall system flow resistance to be affected.Sometimes it is less desirable or even impossible to increase the space within an enclosure to accommodate the addition of acoustic dampening devices. Accordingly, the space available within the enclosure is often an important factor in the design of acoustic dampening devices according to the design specifications. While . Fig. 6 shows acoustic damping devices of different thicknesses within the same system to illustrate different design thicknesses, all damping devices in the same system can share all design characteristics (e.g. material, hole sizing, shape, surface texturing, etc.) or have their own unique and different design characteristics.

[0044] Fig. 7 and Fig. 8 show simplified schematic diagrams of the data storage systems 110. In Fig. 7, sound waves 700-720 emanating from the fan assembly 116 are shown. Sound waves 700, 720 that bounce off or are deflected by the housing 113 and impinge on the storage device 122 are shown. Sound waves 705-715 that impinge directly on the storage device 122 without being deflected by other surfaces are shown. Sound waves 700-720 are only examples, and other sound waves may occur in the housing 113 that take paths other than those into the Fig. 7 and Fig. 8. The data storage system 110 shown in Fig. 7, does not include an acoustic device, as described herein, for reducing or eliminating sound waves emanating from a fan assembly 116. Thus, the sound waves 700-720 may penetrate into the storage device 122 and impair the operation and reliability of the storage device 122, as described above.

[0045] Fig. Figure 8 illustrates a schematic diagram that is shown in Fig. 7, with the addition of an acoustic device 800 configured as described herein. The acoustic device 800 provides an entry barrier for sound waves 700, 720 into the storage device 122. This means that sound waves 700, 720 are completely absorbed in the acoustic device 800. Sound waves 705, 715 are redirected and deflected away from the storage device 122 before impinging upon it. Acoustic devices 800 partially absorb and attenuate sound waves 705, 715 such that their reflected energy is reduced.

[0046] Acoustic devices 800 cannot prevent all sound waves from reaching the storage device 122. Thus, some sound wave interference may penetrate the storage device 122. For example, the sound wave 710 may pass through the acoustic device 800 and into the storage device 122. Nevertheless, as shown, the acoustic device 800 is configured to reduce the intensity or strength of the sound wave 710 so as to lessen its impact on the storage device 122.

[0047] Fig. 7 and Fig. 8 show an air flow 725 flowing through the data storage system 110. As in Fig. 7, the operation of the fan assembly 116 causes the airflow 725 to flow through the data storage system 110 to ventilate the components therein, such as the data storage device 122. The components in the data storage system 110 have an airflow resistance that inhibits or reduces the strengthening of the airflow 725 as it is drawn through the housing 113. As shown in Fig. 7, the strength of the air flow 725 through the housing 113 is not significantly reduced by the addition of the acoustic device 800 to the data storage system 110. The flow resistance or the air flow resistance of the holes (such as the holes 225 shown in Fig. 3) the acoustic device 800 is less than the flow resistance or airflow resistance of the components of the data storage system 110 without the acoustic device 800; thus, the strength of the airflow 725 is maintained when the acoustic device 800 is deployed in the system 110.

[0048] Fig. 9 illustrates an example of an acoustic damping device 900 of the sound damping system 118 of Fig. 1 according to another embodiment. Like the acoustic damping device 200, the acoustic damping device 900 includes one or more acoustically active materials that can alter the acoustic properties in conjunction with the fan assembly 115-117 to reduce the negative acoustic effects on the storage devices 120-124. The acoustic damping device 900 achieves the acoustic effect reduction at least by damping or absorbing acoustic frequencies, as well as by redirecting and deflecting the acoustic frequencies or sound waves.

[0049] The attenuator 900 includes a first attenuator 905 and a second attenuator 910. In one embodiment, the first attenuator 905 comprises a cardboard plate 915 with first and second corrugated plates 920, 925 on both sides. The second attenuator 910 is made from a cardboard plate 930 with first and second corrugated plates 935, 940 on each side. In a preferred embodiment, the first and second attenuators 905, 910 are die-cut plates. The cardboard material of the first and second attenuators 905, 910 helps absorb sound waves. Nevertheless, other materials that absorb sound waves, such as those described above, are often provided. In another embodiment, the first and second attenuators 905, 910 each consist of only one corrugated plate. Furthermore, in another embodiment, additional layers of flat and corrugated plates may be added as shown for each attenuator 905, 910.

[0050] As shown, corrugated plates 920, 925 have horizontal, corrugated surfaces, and corrugated plates 935, 940 have vertically corrugated surfaces. The corrugations in the surface of the first and second attenuators 905, 910 assist in deflecting and redirecting sound waves away from the acoustic attenuator 900 before they reach the storage device 120-124, as described above. When positioned side by side to form a 3D structure, the opposing corrugation directions of the first and second attenuators 905, 910 serve to further scatter, absorb, and trap the sound waves before they pass through to the storage device 120-124.

[0051] To allow airflow through the damper 900, a first set of openings 945 are formed in the first damper 905 and a second set of openings 950 are formed in the second damper 910. When positioned side by side, the openings 945 and 950 prevent a direct path or line of sight between the fan on one side and the storage device on the other side. In this way, the sound waves emanating from the fans 115-117 come into contact with and are dampened by one or both of the first and second dampers 900, 910. The number, offset pattern, and placement of the openings 945, 950 are designed to prevent a significant increase in the resistance to the overall cooling airflow through the system 110.The openings 945, 950 are preferably dimensioned and placed such that airflow resistance through the acoustic attenuator 900 is lower than the airflow resistance through the rest of the data storage system 110.

[0052] Furthermore, it is contemplated that in another embodiment, a first damping member 905 and a second damping member 910 may be manufactured by forming layers of foam with similar offset openings as those in Fig. 9. The individual layers can be adjacent to one another or separated by a distance that allows additional freedom of movement for the cooling air flowing through the damping element.

[0053] Fig. Figure 10 illustrates a portion of the housing 113, which includes fans 115-117 and the damper 900 coupled to the end wall 605. When the fans 115-117 are operating, the air flow 1000 through the system 110 is Fig. 1 and out the rear. The airflow 1000 must wind through openings 950 and 945 in a more non-linear manner to escape from the interior of the enclosure 113. Sound waves traveling in the opposite direction must also wind through openings 950 and 945 to reach the interior of the enclosure. Due to the ability of the acoustic attenuator 900 to reduce sound waves, as described above, some sound waves may never reach the storage devices 120-124, while other sound waves may significantly lose intensity.

Claims

[1] A data storage device (110) comprising: a housing (113) configured to hold at least one data storage device (120-124); a fan assembly (115-117) configured to provide an airflow within the housing (113) for ventilating at least one data storage device (120-124), wherein a plurality of sound waves from one or more fans of the fan assembly (115-117) radiate into the data storage device (120-124) during operation; and an acoustic damping device (200) disposed within the housing (113) and configured to deflect at least a portion of the plurality of sound waves away from the at least one data storage device (120-124) and to absorb a portion of the sound wave energy from at least a second portion of the plurality of sound waves, characterized by , that the acoustic damping device (200) is arranged closer to the at least one data storage device (120 - 124) than to the fan arrangement (115 - 117), the acoustic damping device (200) further comprises a plurality of openings (225) extending therethrough and configured to allow the air flow to pass through the acoustic damping device (200) and the flow resistance of the plurality of openings (225) with respect to the air flow passing through the acoustic damping device (200) is lower than the flow resistance of the air flow passing through the data storage device (120 - 124). [2] The data storage assembly (110) of claim 1, wherein the acoustic damping device (200) includes a plurality of surface contours (210) formed in a first surface (205) thereof. [3] The data storage device (110) of claim 2, wherein the plurality of surface contours (210) comprises a first set (215) of surface contours arranged in a first contour structure and a second set (220) of surface contours arranged in a second contour structure, the first and second contour structures (215, 220) alternating along the first surface (205). [4] The data storage assembly (110) of claim 2, wherein the acoustic damping device (200) has a second surface opposite the first surface (205), and wherein the first surface (205) is disposed closer to the fan assembly (115-117) than the second surface. [5] The data storage assembly (110) of claim 1, wherein the acoustic damping device (200) is further comprised of a material configured to dampen sound waves entering it. [6] The data storage assembly (110) of claim 5, wherein the material comprises cardboard or a polymer foam material. [7] A data storage system (110) comprising: a chassis (113) having a data storage device space defined therein for receiving a data storage device (120-124), the chassis (113) having a first opening (114, 305) on a first side and a second opening (119, 310) on a second side opposite the first side; a fan assembly (115-117) coupled to the chassis (113) and configured to cause an airflow (315) to pass through the chassis (113) from the first side to the second side and around the data storage device (120-124) for cooling the data storage device (120-124); and an acoustic damping device (118, 200) housed in the chassis (113) and configured to deflect a first portion of a first plurality of sound waves generated by the fan assembly (115-117) away from the data storage device space and to absorb the sound wave energy of a second portion of the first plurality of sound waves, characterized by , that the damping device (118, 200) is arranged closer to the data storage device space than to the fan arrangement (115 - 117), the damping device (118, 200) has a plurality of openings (225) extending therethrough and a flow resistance of the plurality of openings (225) with respect to the air flow (315) passing through the damping device (118, 200) is lower than the flow resistance of the cooling air flowing around the data storage device (120 - 124) arranged in the data storage device space. [8] The data storage system (110) of claim 7, further comprising: a plug-in unit (320 - 324) arranged in the module carrier (113); a data storage device (120 - 124) arranged in the insert (320 - 324), wherein the damping device (200) is coupled to the insert (320 - 324). [9] Data storage system (110) according to claim 7, wherein a cross-flow enabling air space is formed between the damping device (200) and the fan arrangement (115 - 117). [10] The data storage system (110) of claim 7, wherein the damping device (118, 200) is made of a material configured to absorb sound waves entering it. [11] The data storage system (10) of claim 7, wherein the damping device (118, 200) has a plurality of surface contours (210).

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