MODULAR DIE HANDLING SYSTEM AND DIE HANDLING PROCEDURES

Abstract

Die handling system (100), comprising: a first cassette (105a) configured to store wafers with an initial configuration; an expanding device (109) configured to expand the wafers with the first configuration to a first pre-expanded wafer; a device (119) for holding first pre-expanded wafers, configured to store the first pre-expanded wafer received from the expanding device (109); and a die handling device (150) comprising a pickup head configured to extract one or more dies from the first pre-expanded wafer, wherein a second cassette (105b) configured to store second prepared wafers comprising a wafer with a second configuration, wherein properties of the second configuration differ from properties of the first configuration; and a device (119) for holding second pre-expanded wafers, configured to receive a second pre-expanded wafer (126; 726) from the expanding device (109).

Description

TECHNICAL AREA

[0001] The present subject matter relates to a die handling system and in particular to die handling systems which have a modular wafer handling subsystem. BACKGROUND

[0002] Typically, a large number of integrated circuits are fabricated on a single wafer, such as a silicon wafer. The silicon wafer is cut into individual semiconductor dies (also called semiconductor chips), which are then packaged for use. A semiconductor package typically contains a semiconductor die, which has several bond pads for making electrical connections to the die's integrated circuitry, and is mounted with the bond pads exposed. Bond pads that provide input / output (I / O) connections to the die are usually placed along the edges of the die. Inner ends of conductive traces (also called bond fingers, lead fingers, or leads) are arranged around the perimeter of the die to form an array of connection points surrounding it.A die is usually mounted or attached in a die receiving area of ​​the semiconductor device package, that is, in the area defined by the inner ends of the conductor tracks.

[0003] US 2011 / 0 038 694 A1 refers to the area of ​​semiconductor backend process for wafer level packaging (WLP), categorized as bare wafer stamping, bump die or leadless package sorting in wafer ring form.

[0004] JP H09 - 199 575 A describes a die handling method and a device for joining semiconductor pellets and in particular a device for joining semiconductor pellets which is suitable for installing a wafer-equipped wafer ring unit on a wafer platform.

[0005] AT 514 134 A2 relates to a flip-chip bonding device and a flip-chip bonding method, and in particular to a flip-chip bonding device and a flip-chip bonding method for checking the bond condition before and after flip-chip dip soldering.

[0006] After the semiconductor die is mounted, the bond pads of the semiconductor die are connected to the connection points provided by the inner ends of the conductive traces in one of several ways. Very thin bond wires, usually made of aluminum or gold, are often used to connect the connection points sequentially to the bond pads on the semiconductor die. Tape-automated and solder-bump bonding techniques have been used to connect the semiconductor die. Conductive traces run from the die receiving area outwards and eventually terminate at outer pins of the semiconductor device package for coupling to external circuit assemblies and providing an electrical connection. The semiconductor device package may be mounted in a socket on a printed circuit board, usually with additional components. SUMMARY

[0007] A first embodiment of the present disclosure relates generally to a die handling system comprising a first cassette configured for storing wafers with a first configuration; an expansion unit configured to expand the wafers with the first configuration to a first pre-expanded wafer; a device for holding first pre-expanded wafers, configured to store the first pre-expanded wafer received from the expanding device; and a die handling device comprising a receiving head configured to extract one or more dies from the first pre-expanded wafer, wherein a second cassette configured to hold second prepared wafers comprising a wafer with a second configuration, wherein properties of the second configuration differ from properties of the first configuration; and a device for holding second pre-expanded wafers configured to receive a second pre-expanded wafer from the expanding device.

[0008] A second embodiment of the present disclosure relates generally to a die-handling method comprising the steps: Pulling a prepared wafer, comprising a wafer with an initial configuration, from a cassette to an expanding device; Expanding the wafer to a pre-expanded wafer; Storing the pre-expanded wafer in a device for holding first pre-expanded wafers; Pulling the pre-expanded wafer from the pre-expanded wafer holding device to a table of a die handling device; and Extracting one or more dies from the pre-expanded wafer; the die handling procedure further comprising the following steps: Drawing a second prepared wafer, comprising a second wafer with a second configuration, from a second cassette to the expanding device, wherein the The second wafer has a different configuration than the wafer with the first configuration; and Expanding the second wafer to create a second pre-expanded wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Some of the embodiments are described in detail with reference to the following figures, where identical designations denote identical elements; they show: Fig. 1a an isometric view of an embodiment of a die handling system comprising a modular wafer handling subsystem; Fig. 1b a front view of an embodiment of a die handling system comprising a modular wafer handling subsystem; Fig. 2a an isometric view of an embodiment of a wafer handling subsystem; Fig. 2b a top view of the embodiment of the wafer handling subsystem of Fig. 2a; Fig. 2c a front view of the embodiment of the wafer handling subsystem of Fig. 2a; Fig. 3a an isometric view of an embodiment of a wafer storage module of a wafer handling subsystem; Fig. 3b an isometric view of an embodiment of a wafer storage module connected to a lift system of a wafer handling subsystem; Fig. 3c a front view of the elevator system of Fig. 3b connected wafer storage module; Fig. 3D side view of the elevator system from Fig. 3b connected wafer storage module; Fig. 4a an isometric view of an embodiment of an expansion module of a wafer handling subsystem; Fig. 4b a top view of the expansion module of Fig. 4a; Fig. 4c a side view of the expansion module of Fig. 4a; Fig. 4d a front view of the expansion module of Fig. 4a; Fig. 5 an embodiment of a wafer prepared for pre-expansion; Fig. 6a an isometric view of an embodiment of a pre-expanded wafer loaded into a magazine with a first configuration; Fig. 6b a top view of the pre-expanded wafer loaded into a magazine with an initial configuration of Fig. 6a; Fig. 7a an isometric view of an embodiment of a pre-expanded wafer loaded into a magazine with a second configuration; Fig. 7b a top view of the pre-expanded wafer loaded into a magazine with a second configuration of Fig. 7a; Fig. 8a an isometric view of an embodiment of a die handling device; Fig. 8b a front view of an embodiment of a die handling device; Fig. 9a an isometric view of an embodiment of a vision system inspecting one or more extracted dies; Fig. 9b a top view of the embodiment of the vision system of Fig. 9a; Fig. 9c a side view of the embodiment of the vision system of Fig. 9a; Fig. 9d a side view of an embodiment of a viewing system inspecting one or more extracted dies rotated by a rotating receiving head; Fig. 9e a side view of an embodiment of a viewing system inspecting the edge of an extracted die in a rotated position; Fig. 10 a flowchart describing the steps for processing a die using an embodiment of a conventional wafer die handling system; Fig. 11 a flowchart describing the steps for processing a die using an embodiment of a die handling system comprising a modular wafer handling subsystem. DETAILED DESCRIPTION

[0010] A detailed description of the embodiments of the disclosed device and method described below is provided herein as an illustration and not as a limitation, with reference to the figures.

[0011] As an introduction to the detailed description, it should be noted that, as used in the present description and in the attached claims, the singular forms “ein”, “eine”, “einer” and “der”, “die”, “das” include plural referents unless the context clearly indicates otherwise. OVERVIEW

[0012] Currently available wafer handling systems consist of an expansion or stretching mechanism with an associated fixed frame configuration. These systems support a programmable, adjustable wafer expansion or stretching distance. However, these wafer handling systems typically only operate with a single wafer configuration at a time. If a wafer with a different configuration needs to be processed, currently available wafer handling systems must first de-stretch the first wafers, return them to a presentation area, configure the system to use a second wafer configuration, and repeat the stretching process for the second set of wafers.

[0013] Currently available wafer handling systems have several disadvantages. For example, these systems require wafers to be processed sequentially. Serial processing limits the systems' ability to handle multiple wafers simultaneously. No wafers can be processed during expansion or de-expansion, and components cannot be attached to the wafer dies at the same time. As a result, existing systems must continuously perform an expansion and de-expansion cycle, which can increase the risk of material damage to the wafers that are currently being expanded. Furthermore, current wafer processing methods typically use a single wafer configuration at a time, via a single associated feeding mode, to process wafers sequentially.Changing materials and products requires wafers to be expanded and deexpanded as needed. Even the latest wafer handling systems and machines are not modular. Wafer expansion in a serial system increases downtime because die extraction and handling processes are paused during expansion. Using pre-expanded wafers requires significant hardware, and accommodating variable wafer configurations necessitates a high degree of downtime and hardware changes during serial operation.

[0014] Embodiments of the die handling systems of this disclosure address the shortcomings and disadvantages of previous wafer and die handling systems described above. The die handling systems of this disclosure can prepare and extract dies from several types of wafer materials without stopping one or more sections of the die handling device during wafer expansion. Wafer expansion and die extraction processes can be performed simultaneously on the same system, enabling concurrent processes for wafer expansion, wafer processing, die extraction, and die inspection without any downtime of one or more processes by the handling system.

[0015] Embodiments of the die handling systems may include a wafer handling module subsystem capable of preparing pre-expanded wafers of various configurations and materials for storage and feeding to an associated die handling device. Embodiments of the wafer handling module may include a mechanism, such as an expansion device, that can stretch or expand the wafer(s), which may have one or more different configurations, into a pre-expanded state without interrupting the die handling device. The pre-expanded wafers may be arranged as a magazine comprising a wafer that is stored between two interlocking plates before being expanded by the expansion device.The pre-expanded wafers can be stored as needed and fed to the die handling equipment, ensuring a continuous flow of die extraction without interruption or unnecessary downtime.

[0016] Embodiments of the wafer handling module can contain multiple cassettes loaded with wafers. In some embodiments, each cassette can be loaded with different types of wafers, which may have different dimensions. Each cassette can be indexed to an expansion unit of the wafer handling module. The expansion unit and / or the wafer table can pull the wafer with a suitable configuration from a selected cassette, prepare the wafer with the suitable configuration as a pre-expanded wafer within a magazine, and temporarily store the magazine in a device for holding pre-expanded wafers prior to die extraction.Each magazine filling the device for holding pre-expanded wafers can be considered "on board" and ready for selection by the die handling device for die extraction via a pickup head that removes the die from the pre-expanded wafer.

[0017] In this embodiment, the wafer handling system can have at least two cassettes that act as a feeding mechanism for prepared wafers loaded into each cassette, each with different configurations, including different dimensions, materials, die configurations, thicknesses, or circuit arrangements. By providing multiple cassettes filled with different prepared wafers with different configurations, the system can offer high flexibility in selecting input materials and handling modes. Different types of wafers and materials can be selected and pre-expanded before the die handling device pulls one or more pre-expanded wafers to the die handling device's table and extracts the dies from the pre-expanded wafers via the pickup head.Furthermore, the wafer handling system can prepare multiple pre-expanded wafers and preemptively store them in each of the pre-expanded wafer holding devices. The wafer handling system can fill the pre-expanded wafer holding devices in anticipation of processing the pre-expanded wafers.

[0018] Embodiments of the wafer handling system can pre-expand any type of prepared wafer, even while the die handling unit is simultaneously processing one or more pre-expanded wafers that may have been removed from the pre-expanded wafer holding device. This allows the wafer handling system to pre-expand wafers stored in each cassette while the die handling unit extracts dies from one or more pre-expanded wafer magazines. Accordingly, the die handling system, which includes a wafer handling module, can operate continuously and process several different types of prepared wafers with minimal or zero downtime caused by material changes or modifications to operating modes, resulting in an increased production volume of extracted dies.

[0019] Embodiments of the die handling system may further include a vision system comprising one or more cameras positioned at one or more locations throughout the die handling system. The vision system can provide visual data of each wafer during the expansion process via a camera positioned within the field of view of the wafer handling system and / or the wafer handling system's extraction unit. In some embodiments, the vision system may be positioned in alignment with a capture head that extracts the dies from each pre-expanded wafer, thus allowing the vision system to inspect the dies as they are extracted from the wafer. Embodiments of the vision system may provide a three-dimensional view of the wafer's dies while the capture head extracts them.Embodiments of the receiving head can rotate the positioning of the extracted die, providing a three-dimensional view of the extracted die through the viewing system. THE HANDLING SYSTEM

[0020] Referring to the drawings, illustrates Fig. 1. An embodiment of a die-handling system 100. In some embodiments, the die-handling system 100 can be configured as several subsystems and / or modules interconnected. By constructing the system 100 as a group of subsystems or modules, one or more subsystems or modules can be added to or removed from the system 100 as desired by a user. As described in Fig. As shown in Figure 1, the die handling system 100 can include a die handling device 150 and a wafer handling system 101. The wafer handling system 101 can be further subdivided into additional subsystems and modules, for example, a wafer storage module 300, an expansion module 400, and a lift module 130.

[0021] Embodiments of the wafer handling system 101 can perform the functions of receiving, storing, pre-expanding, and feeding prepared wafer materials to a die handling device 150. Prepared wafers 500 can be loaded into the wafer handling system 101 by attaching one or more pre-loaded cassettes filled with prepared wafers 500 of one or more different configurations. The attachment of the one or more cassettes 105a, 105b (referred to as "cassettes 105") can be performed manually by a user or automatically using a robotic system. The term "wafer" 115 can refer to a disc or substrate of semiconductor material. The semiconductor material can be a material with a crystalline structure. The semiconductor material most commonly used in wafers today is crystalline silicon.In some configurations of the prepared Wafer 500, however, silicon materials can be replaced by other semiconductor materials known to a person skilled in the art. In addition to silicon, the Wafer 115 can, for example, be made of germanium, gallium arsenide, silicon carbide, gallium nitride, gallium phosphide, cadmium sulfide, or lead sulfide.

[0022] The wafers 115 loaded into the cassettes 105 of the wafer handling system 110 can have various dimensions, including different diameters and thicknesses. In some embodiments, the wafers 115 can have a diameter ranging from less than 25 mm to 450 mm (1 in to 17.7 in). For example, the wafer diameters can be 25 mm (1 in), 51 mm (2 in), 76 mm (3 in), 100 mm (4 in), 125 mm (4.9 in), 130 mm (5 in), 150 mm (5.9 in), 200 mm (7.9 in), 300 mm (11.8 in), or 450 mm (17.7 in). The wafers 115 loaded into the cassettes 105 of the die handling system 100 can also have different thicknesses. The thickness of the Wafer 115 can vary between 25 µm and 3000 µm. For example, the thickness of the Wafer 115 can be 25 µm, 50 µm, 100 µm, 200 µm, 275 µm, 375 µm, 525 µm, 625 µm, 675 µm, 725 µm, 775 µm, 925 µm, 1000 µm, 1500 µm, 2000 µm, 3000 µm or thicker.

[0023] The 105 cassettes can each store several prepared 500 wafers, as shown in Fig. Figure 5 shows that each prepared wafer 500 can comprise a wafer with a specific configuration. The term "configuration" can refer to differences in the properties of the wafers 115, including dimensions, materials, thicknesses, circuit arrangement, die configuration, etc. Each of the prepared wafers 500 that is fed to or received from the die handling system 100 can be indexed for one of the slots 113 of one or more cassettes 105. In the exemplary embodiment of the cassettes 105 of the wafer handling system 101, each cassette 105a and 105b can store up to 25 prepared wafers 500. For each prepared wafer 500, one wafer 115 can be attached to a frame 117 containing a film 116, such as a Mylar film. In some embodiments, the prepared wafers 500 can be further prepared for expansion before loading into the cassettes 105.In some embodiments, the prepared wafers 500 can undergo back-side grinding, UV curing and separation steps before being loaded into the cassettes 105.

[0024] The indexing of each prepared wafer 500 to a specific cassette 105 can depend on the material and dimensions of the wafer 115. As shown in the figures, several cassettes 105 can be integrated into the wafer handling system 101. Each cassette 105 can index and store wafers of different dimensions or materials.For example, a first cassette 105a can index and store prepared wafers 500, comprising silicon wafers of 150 mm in diameter and 275 µm thick, while the second cassette 105b can index and store prepared wafers 500 comprising wafers 115 of 300 mm in diameter and 575 µm thick. This allows the die handling system 100 to expand and process several different types of wafers 115 without having to change the wafer materials, reconfigure any of the devices within the system 100, or replace the cassettes 105. In some embodiments, cassette changes 105 can be performed while the die handling system 100 is in operation.Each cassette 105 can be detached from the wafer handling system 101 and replaced either by a fresh cassette 105 loaded with the same prepared wafers 500, or by a cassette 105 loaded with prepared wafers 500 made of a different wafer material. The cassettes 105 can be detached and replaced manually by human operators or, in some embodiments, by robotic devices.

[0025] In some embodiments of the system 100, the wafer handling system 101 can attach each of the cassettes 105 to a lift module 130 (each separate lift 130 can be designated as a special lift, for example, lift 130a, which is connected to cassette 105a, and lift 130b, which is connected to cassette 105b, as shown in the drawings). The lifts 130 can be configured to raise and lower the cassettes 105 and devices 119 attached to the cassettes 105 for holding pre-expanded wafers between the wafer table 120 of the wafer handling system 101 and the platform 161 of the die handling device 150. Embodiments of the elevator 130 can align the appropriate slot 113 of the cassette 105 with the wafer table 120 to allow the wafer table arm 127 to pull a prepared wafer 500 from the slot 113 to the expanding device 109.After the prepared wafer 500 has been expanded, the elevator 130 can adjust the height of the storage module 300 to align the pre-expanded wafer holding device 119 with the wafer table 120. By adjusting the height of the storage module 300 containing the pre-expanded wafer holding device, the wafer table arm 127 can remove the pre-expanded wafer 126, 726 from the expansion unit 109 and load the pre-expanded wafer 126, 726 into a slot of the pre-expanded wafer holding device 119, which is aligned with the wafer table 120. In some embodiments, the wafer table arm 127 can rotate or turn the pre-expanded wafer 126, 726 to pre-orient the position of the pre-expanded wafer 126, 726 while the pre-expanded wafer 126, 726 is stored in the device 119 for holding pre-expanded wafers.The wafer table arm 127 can rotate the pre-expanded wafer 126, 726 before depositing the pre-expanded wafer 126, 726, for example in increments of 90 degrees.

[0026] Embodiments of the elevator module 130 can include an elevator frame 305 that supports the components of the elevator system 130 described below. A servo motor 307 can manage the commissioning of a drive mechanism that controls the activity of the elevator 130, the threaded spindle 309, and a rear plate 121, which is connected to the wafer storage module 300 comprising the cassette 105 and the device 119 for holding pre-expanded wafers. The rear plate 121 can be attached to the rear of the device 119 for holding pre-expanded wafers, as shown in Fig. 3a. In some alternative embodiments, however, the rear plate 121 may be attached to the rear of the cassette 105 or to other parts of the wafer storage module. In some embodiments of the lift system 130, guide rail holders 301 may be attached to the rear plate 121. The guide rail holders may be dimensioned and shaped to form a channel that can be connected to the guide rail 123 positioned on the rear of the frame 305, as shown in the drawings.

[0027] When the servomotor 307 starts the drive mechanism, the elevator can be raised or lowered via the threaded spindle 309. The rear plate 121, which is attached to the guide rail 123 via the guide rail holders 301, can be raised and lowered along the guide rails 123, while the threaded spindle raises and lowers the rear plate 121, thereby changing the overall position of the bearing module 300 and the orientation of the wafer slots 113 or the slots of the device 119 for holding pre-expanded wafers with respect to both the wafer table 120 and the platform 161 of the die handling device 150.

[0028] In some embodiments of the wafer handling system 101, the wafer handling system 101 may include an expansion module 400. Embodiments of the expansion module 400 may include a frame 103 that supports the wafer table 120 with an expansion device 109 positioned thereon. In some embodiments, a vision system may be installed in the expansion module 400, comprising a camera that can inspect the removal of prepared wafers 500, the expansion of the prepared wafers 500 to pre-expanded wafers 126, 726, and the storage of the pre-expanded wafers 126, 726 in a slot of the pre-expanded wafer holding device 119. Furthermore, embodiments of the frame 103 may include a positioning and removal system comprising a raceway 111 which may extend along the length of the wafer table 120 and a movable wafer table arm 127.Embodiments of the movable wafer table arm 127 can be connected to the raceway 111, thereby allowing the wafer table arm 127 to move along the raceway 111 during the operation of the wafer table 120 and the expanding device 109.

[0029] Using the raceway 111 as a guide, the wafer table arm 127 can move along the axis created by the raceway 111. The raceway 111 enables the arm 127 to move from one side of the wafer table 120 to the other. As in the embodiments of the Fig. As shown in Figures 1a-2c, each of the cassettes 105 can be aligned with the edges of the wafer table 120, allowing the wafer table arm 127 to position itself next to each of the cassettes 105, remove a prepared wafer 500 indexed for a slot 113 of the cassette 105, and pull the prepared wafer 500 out of the slot 113. After the prepared wafer has been pulled out of the slot 113 of the cassette 105, the wafer table arm 127, with the pulled wafer 500 in tow, can travel along the track 111 to the expanding device 109. The wafer table arm 127 can then position the prepared wafer 500 on the expanding device 109 for expansion into a pre-expanded wafer 126, 726.

[0030] Embodiments of the expanding device 109 can perform the function of expanding the prepared wafers 500 into pre-expanded wafers 126, 726. The expanding device 109 can increase the surface area of ​​the wafer 115 by expanding the wafer 115 in the x and y directions to an expanded configuration. The expanding device 109 can compress the wafer 115 and can be assisted by heat applied by the expanding device 109 to increase the expansion depth of the wafer 115, resulting in an expanded wafer 124, 724.

[0031] Embodiments of the expanding device 109 can encapsulate the expanded wafers 124, 724 in a magazine 122, which can maintain the expanded wafer 124, 724 as a pre-expanded wafer 126, 726 until either the die handling device 150 has extracted the dies from the pre-expanded wafer 126, 726 or the pre-expanded wafer 126, 726 has been de-expanded back to a prepared wafer 500 by the expanding device 109. Fig. Figures 6a-6b show an embodiment of a pre-expanded wafer 126 comprising an expanded wafer 124 encapsulated by a magazine 122 with a first configuration, while the Fig. Figures 7a-7b show a pre-expanded wafer 726 having a second configuration of expanded wafer 724 encapsulated by the magazine 122. Each of the magazines 122 can encapsulate wafers 115 with different dimensions and thicknesses. In some embodiments, the opening of the magazines 122, which exposes the expanded wafers 124, 724, can be adjustable to accommodate the configuration of wafers 115 used during the expansion process. In alternative embodiments, the plates forming the magazine 122 can be specifically designed for particular configurations of expanded wafers.

[0032] Embodiments of the magazine 122 may include two locking plates that can be connected, snapped into one another, or fastened together to hold the wafer 115, positioned on the film 116 and the frame 117, within the magazine 122. The expanded wafer 124, 724, the film 116, and the frame 117 may be positioned between the upper and lower plates of the magazine 122. The frame 117 of the prepared wafer 500 may be positioned between the upper and lower plates of the magazine 122. When the plates of the magazine 122 are joined or fastened together, the magazine 122 can hold the frame 117 in position between the plates of the magazine 122, thus holding the wafer 115 in position while the wafer 115 is exposed to the expanding device during the expansion process to become an expanded wafer 124, 724.During the expansion process, the wafer 115 can be stretched to different depths as desired to produce the expanded wafer 124, 724.

[0033] After completion of the expansion process, the pre-expanded wafers 126, 726 encapsulated by the magazine 122 can be removed from the expansion unit 109 by the wafer table arm 127. The wafer table arm 127 can pull the pre-expanded wafer 126, 726 from the expansion unit 109, move the pre-expanded wafer 126, 726 over the track 111 across the wafer table 120, and deposit the pre-expanded wafer into a device 119a, 119b for holding pre-expanded wafers (generally or collectively referred to as the "device 119 for holding pre-expanded wafers"). Embodiments of the device 119 for holding pre-expanded wafers can each be attached to a cassette 105 and a lift 130.Each device 119 for holding pre-expanded wafers can contain multiple slots, each slot of the device 119 for holding pre-expanded wafers prior to die extraction by the die handling device 150 being able to accommodate the pre-expanded wafers 126, 726. In some embodiments of the system 100, the system 100 can index each slot of the device 119 for holding pre-expanded wafers in order to ensure that the system 100 can know which slots of the device for holding pre-expanded wafers are currently occupied by pre-expanded wafers 126, 726, wherein these pre-expanded wafers 126, 726 have been removed from the slots because the pre-expanded wafers 126, 726 are currently being processed by the die handling device 150, and wherein the slots of the device 119 for holding pre-expanded wafers may still be empty or ready to receive an additional pre-expanded wafer 126, 726.

[0034] In the embodiments shown in the drawings, a device 119 for holding pre-expanded wafers can comprise four slots. However, the number of available slots for receiving pre-expanded wafers 126, 726 can vary. Depending on the throughput and configuration of the system 100, the system 100 may include additional slots or fewer slots in the devices 119 for holding pre-expanded wafers. To load a specific slot of the device 119 for holding pre-expanded wafers, the elevator 130 can raise or lower a desired slot of the device 119 for holding pre-expanded wafers to align it with the height of the wafer table 120.The wafer table arm 127, which moves the pre-expanded wafers 126, 726 back and forth over the wafer table 120 from the expanding device 109, can place the pre-expanded wafer 126, 726 into the slot of the device 119 for holding pre-expanded wafers.

[0035] Embodiments of the die handling device 150 can perform the function of extracting one or more dies 601 from each of the pre-expanded wafers 126, 726, and displaying the extracted dies 161 of the pre-expanded wafers 126, 726 via the inline viewing system 157a, 157b (hereinafter referred to either collectively or generically as "viewing system 157"), as shown in the Fig. As shown in Figures 9a-9e, the extracted dies 180 are visually inspected and delivered to downstream processing equipment, such as a pick-and-place machine. Embodiments of the die handling device 150 may include an XY table that can move and position the pre-expanded wafers 126, 726 in the proper position and orientation, thereby allowing the pickup head 170 of the die handling device to properly position itself over the die 601 and begin extracting the die. Embodiments of the XY table of the die handling device 150 may include a raceway system 155 and a puller 163 similar to the raceway 111 and wafer table arm 127 of the expansion system 400 described above.

[0036] The track system 155 of the xy-table allows movement along an x-axis across the xy-table from one end of the xy-table to the other. For example, the puller 163 can traverse the length of the xy-table to access the pre-expanded wafers 126, 726 housed in the slots of the pre-expanded wafer holding device 119. The puller 163 can remove the pre-expanded wafers 126, 726 from the pre-expanded wafer holding device 119 and traverse the track 155 until the puller secures the pre-expanded wafer 126, 726 to one of the platforms 161a, 161b (collectively or generically referred to as platform 161) of the xy-table. Runway 155 may also contain a separate inner runway to which platforms 161 may be coupled.The inner track of the xy-table allows each platform 161a, 161b to change its position along the x-axis of the table with respect to the pickup head 170 for alignment with the pickup head, whereby the appropriate die is extracted during the processing of the pre-expanded wafers 126, 726. The combination of the movement of the platform 161 along the inner track of the track 155 and the y-axis movement of the pickup head carriage 159 along the y-axis track 153 allows the pickup head to be aligned with any point on the expanded wafer 126, 726 during the extraction of the dies 601.

[0037] Embodiments of the die handling device 150 may include an xy-table equipped with one or more y-axis raceways 153a, 143b (generically or collectively referred to as y-axis raceway 153) attached to the xy-table. The y-axis raceway may permit movement of the pick-up head carriage 159 along the y-axis raceway, thereby providing a positioning system for aligning the pick-up head 170 with the dies 601 of the pre-expanded wafers 126, 726 in conjunction with the movement of the platforms along the x-axis raceway 155. By coordinating the movement of the platforms 161 in the x-direction and the movement of the pickup head carriage 159 in the y-direction, the pickup head 170 can accurately target and extract any die 601 of the pre-expanded wafer 126, 726.

[0038] Embodiments of the die handling device 150 can be programmed using an xy coordinate system according to the positions of the expanded wafer 124, 724. Using the programmed coordinate plane, the receiving head 170 can select a suitable nozzle 169 from the nozzle tray, which in some embodiments may be integrated into the drawing device 163, as shown in Fig. As shown in Figure 8a, the pickup head 170 can align the nozzle 169 over the die 601, positioned at the programmed xy coordinates, using a combination of the movement of the platform 161 along the raceway 155 and the movement of the pickup head carriage 159 along the y-axis raceway 153. The pickup head 170 can use its suction force to extract the die 601 at the programmed location on the coordinate plane and can deliver the extracted die 180 to a downstream device for further processing, such as a pick-and-place machine.

[0039] In some embodiments of the die handling device 150, the xy-table, the pickup head, and / or the pickup head carriage 159 can be equipped with one or more viewing systems 157a, 157b (generally or collectively referred to as "viewing system 157"). The viewing systems 157 can include one or more inline cameras capable of inspecting the dies 180 of the pre-expanded wafer 126, 726 extracted by the pickup head 170. In some embodiments, the viewing system 157 can provide a three-dimensional view of the pre-expanded wafer 126, 726 along two axes using a single camera. In other embodiments, multiple cameras can be positioned to allow viewing of the dies from multiple angles.In some cases, the viewing system 157 can use one or more optical techniques, such as using a prism or mirror, to view the extracted dies 180 from multiple axes using a single camera.

[0040] In some embodiments of the die handling device 150, the receiving head 170 can rotate. The rotation of the receiving head 170 with the extracted die 180 allows the viewing system 157 to have three-dimensional access to both sides of the extracted die 180 of the pre-expanded wafer 126, 726 during the inspection process. By providing a receiving head 170 that can tilt or rotate the position of the extracted die 180, the die handling device 150 can offer the flexibility to view the dies 601 extracted by the receiving head 170 in both an orientation with the circuit facing up (flip-chip orientation) and / or a orientation facing down (aligned die orientation) without requiring any changes to the operating modes of the die handling device 150.In some embodiments, the viewing system 157 can view different positions of the extracted die 180 by rotating the recording head 170, which can present the extracted die 180 in different orientations, thereby allowing a side view or a marginal view 181 of the extracted die 180, as shown in the . Fig. Figures 9d-9e show that embodiments of the vision system 157 can allow a complete inspection of the boundaries of the extracted die 180 after extraction of the die 601 from the pre-expanded wafer 126, 726.

[0041] As in the embodiment of the die handling device 150 in the Fig. As shown in Figures 1a-1b and 8a-8b, the die handling device 150 can simultaneously process several pre-expanded wafers 126, 726. As shown in the embodiment, two pre-expanded wafers 126, 726 can be loaded onto separate platforms 161a, 161b, wherein the pre-expanded wafers 126, 726 can be processed independently by separate pickup heads, each attached to a separate pickup head carriage 159a, 159b. Although the disclosure shows two pickup head carriages 159a, 159b and two platforms 161a, 161b, this should in no way limit the number of pickup heads 170, pickup head carriages 159, or platforms 161 that may be present in the system 100.Any plurality of elements can be duplicated in the system 100 to allow additional simultaneous processing and extraction of dies 601 from the pre-expanded wafers 126, 726 loaded into the die handling unit 150. Since the die handling unit 150 is a module independent of the wafer handling system 101, the system 100 can also simultaneously and jointly extract dies 180 from several pre-expanded wafers 126, 726 and inspect the extracted dies, while the wafer handling system 101 expands the prepared wafers 500 into pre-expanded wafers 126, 726. DIE-HANDLING PROCEDURES

[0042] Referring to the drawings, illustrates Fig. 10 describes an embodiment of a method 900 that can be used by a die handling system and that can be used in a serial process for processing one or more dies. In contrast to the die handling system 100, the system implementing the methods of method 900 does not have a parallel wafer handling system 101. Instead, indexing, expansion, and die extraction are performed sequentially. Wafer expansion and die extraction are performed sequentially and cannot be performed simultaneously.

[0043] The in Fig. The embodiment shown in Figure 11 of the method 1000 describes a workflow of the die handling system 100 of the present disclosure, which can expand one or more prepared wafers 500 in an expansion device 109 while simultaneously performing die extraction from one or more pre-expanded wafers 126, 726 that have just been processed by the die handling device 150. In step 1003, the wafer handling system 101 can select a prepared wafer 500 for expansion in an expansion device 109 to convert the prepared wafer 500 into a pre-expanded wafer 126, 726. As part of the selection process, the wafer handling system 101 can index a prepared wafer 500 for the expansion device 109.The wafer handling system 101 can mark the slot 113 previously occupied by the selected prepared wafer 500 as empty and update the expanding device 109 as occupied by the selected prepared wafer 500.

[0044] Subsequently, in step 1005, the wafer handling system 101 can perform the process of pulling the prepared wafer 500 from the slot 113 to the expansion device 109. In step 1005, the wafer handling system can first start the elevator 130, which comprises the cassette 105 containing the prepared wafer 500 selected for expansion in step 1003. The elevator 130 can start the servo motor 307, causing the threaded spindle 309 of the elevator to rotate and thus raise or lower the rear plate 121 attached to the device 119 for holding pre-expanded wafers, causing the cassette 105 to move up or down. The elevator 130 can align the slot 113 of the cassette 105, which holds the prepared wafer 500, with the wafer table 120. The wafer table arm 127 can move along the track 111 to the cassette 105, which has been raised or lowered to the level of the wafer table 120.When the wafer table arm 127 reaches the slot 113 aligned with the wafer table 120, the wafer table arm 127 can pull the selected prepared wafer 500 from the slot 113 for indexing by the expander 109 and move it along the track 111 to the expander 109. The wafer table arm 127 can then feed the selected wafer, indexed in step 1003, to the expander 109 for expansion into a pre-expanded wafer 126, 726.

[0045] In step 1006, the prepared wafer 500 can be encapsulated in a magazine 122 and expanded via the expansion device 109 to form a pre-expanded wafer 126, 726, which has a surface configuration different from that of the wafer 115 drawn to the expansion device 109 in step 1005. Embodiments of the expanded wafer 124, 724 can be locked in the encapsulation magazine 122 between the upper and lower plates of the magazine 122, thereby forming a pre-expanded wafer 126, 726. After completion of the wafer expansion in step 1006, the pre-expanded wafer 126, 726 can be drawn from the expansion device 109 by the wafer table arm 127. The wafer table arm 127 can move along the track 111 towards the device 119 for holding pre-expanded wafers and place the pre-expanded wafer 126, 726 into a slot of the device 119 for holding pre-expanded wafers.The wafer handling system 101 can select an open slot of the wafer handling device 119 and start the elevator 130 to raise or lower the device 119 for holding pre-expanded wafers for the purpose of aligning the open slot with the wafer table 120, thereby allowing the wafer table arm 127 to pull the pre-expanded wafer 126, 726 into the slot of the device 119 for holding pre-expanded wafers selected by the system.

[0046] In step 1008, a pre-expanded wafer 126, 726, which was drawn in step 1007 to the device 119 for holding pre-expanded wafers, can be indexed for die extraction by the die handling device 150. The system 100 can change the queue of pre-expanded wafers 126, 726 in the device 119 for holding pre-expanded wafers to accommodate an empty space reserved for the pre-expanded wafer intended for removal from the device 119 for holding pre-expanded wafers and drawing onto the platform 161 of the xy-table of the die handling device 150. In step 1009, the pre-expanded wafer 126, 726, indexed by the system 100 for pulling to the die handling device 150, can be pulled by the pulling device 163 to a platform 161 of the die handling device 150.

[0047] The process of drawing the pre-expanded wafer 126, 726, indexed in step 1008, to the platform 161 can be accomplished by aligning the slot of the pre-expanded wafer holding device 119 with the platform 161 on the xy-table. Alignment between the platform 161 and the slot of the pre-expanded wafer holding device 119 can be achieved by starting the elevator 130 and either raising or lowering the rear plate 121 and the pre-expanded wafer holding device 119, which are attached to the elevator 130, until the slot holding the indexed wafer is aligned with the platform 161. The platform 161 can slide along the x-axis generated by the track system 155. The platform 161 can then slide into position against the slot of the pre-expanded wafer holding device 119.The pulling device 163 can also slide along the raceway 155 to remove the pre-expanded wafer 126, 726 from the pre-expanded wafer holding device 119 and to fix the pre-expanded wafer 126, 726 to the platform 161.

[0048] In embodiments, the platform 161, attached to the magazine of the pre-expanded wafer 126, 726, can move along the track 155 in the opposite direction from the device 119 for holding pre-expanded wafers to the receiving head 170 housed in the receiving head carriage 159. In step 1010, the die handling device 150 can begin processing the pre-expanded wafer 126, 726 by extracting one or more dies 601 from the pre-expanded wafer 126, 726 via the receiving head. In some embodiments, the receiving head 170 can be aligned with the nozzle tray to select a nozzle 169, which can be attached to extract the dies 601 through the receiving head 170. The pulling device 163 can move along the raceway system 155 until it is aligned with the receiving head slide and, in particular, is aligned within the suction distance of the receiving head 170 below the y-axis raceway 153.After alignment with the drawing device, the pickup head carriage can slide along the y-axis track 153 until the pickup head 170 is positioned above the desired nozzle 169. In some embodiments, the pickup head 170 can lift and / or secure the nozzle 169 from the nozzle tray and proceed with the extraction of the dies 601 from the pre-expanded wafer 126, 726 using the nozzle 169.

[0049] After selecting the nozzle 169, the nozzle tray can slide away from the pickup head 170 along the raceway system 155, while the platform 161 can move along the raceway system 155 until it is positioned in a pre-programmed position aligned with a first die selected by the system 100 for processing with the y-axis raceway 153. The pickup head 170 can move along the y-axis raceway 153 by moving the pickup head carriage 159 until it is aligned with the pre-programmed xy-coordinate position. The pickup head 170 can then lower to the die 601 in the position below it and extract the selected die 601 from the pre-expanded wafer 126, 726 positioned below it.The recording head 170 can be continuously aligned and realigned to each die 601 via the movement of the platform 161 and the recording head carriage 159 until all selected dies 601 have been extracted.

[0050] In some embodiments, processing step 1010 can be performed by inspecting the extracted dies 180 using the inline vision system 157, as described in the Fig. The process shown in 9a-9e will be continued. The cameras of the vision system 157 can ensure that the extracted dies 180 are extracted as intended by the system 100 and that none of the extracted dies 180 are damaged. The recording head 170 can tilt the extracted dies 180 in different directions, as shown in the Fig.Figures 9d-9e show that the vision system 157 is able to inspect the die in three-dimensional space. During inspection, the vision system 157 can observe the exposed surface of each extracted die 180 facing the vision system 157 after the extraction of the die 601. The vision system 157 can also view each of the edges of the extracted die 180 facing the vision system 157 as the pickup head 170 rotates from one position to another. The vision system 157 can identify defects at the edges of the extracted die 180. After the inspection by the vision system 157 is complete, the pickup head 170 can transfer the extracted die 180 to a downstream processing unit that can further process the die 601. For example, the pickup head 170 can transfer the extracted die 180 to a pick-and-place machine.Embodiments of the die handling device 150 can further extract each of the dies 601 from the expanded wafer 124, 724 until the pre-expanded wafer 126, 726 is emptied, leaving behind an empty magazine 122 and an empty frame 117. In step 1013, the empty magazine 122 containing the frame 117 can be retracted by the pulling device 163 to the empty slot of the wafer holding device 119.

[0051] In step 1015, the elevator 130 can raise the slot containing the spent magazine 122 and the frame 117 back into alignment with the wafer table 120. The wafer table arm 127 can retract the empty magazine 122 and the frame 117 along the track 111 from the pre-expanded wafer holding device 119 to the expansion unit 109. Subsequently, in step 1016, the expansion unit 109 can de-expand the magazine 122 and open it. In some embodiments, the expansion unit can hold the magazine for the next pre-expanded wafer 126, 726 to be formed within the expansion unit 109. After the de-expansion of the magazine 122 is complete, the spent wafer frame 117 can be returned to the cassette 105 in step 1017. The wafer table arm 127 can pull the frame 117 from the expanding device 109 to the cassette 105.The elevator 130 can align an empty slot of the cassette 105 with the wafer table 120. After alignment with the wafer table 120, the wafer table arm 127 can place the empty frame 117 into the empty slot 113, thus allowing the frame 117 to be used in conjunction with another wafer 115 that may be loaded into the cassette.

Claims

[1] The handling system (100), comprising: a first cassette (105a) configured to store wafers with an initial configuration; an expanding device (109) configured to expand the wafers with the first configuration to a first pre-expanded wafer; a device (119) for holding first pre-expanded wafers, configured to store the first pre-expanded wafer received from the expanding device (109); and a die handling device (150) comprising a pickup head configured to extract one or more dies from the first pre-expanded wafer, wherein a second cassette (105b) configured to store second prepared wafers comprising a wafer with a second configuration, wherein properties of the second configuration differ from properties of the first configuration; and a device (119) for holding second pre-expanded wafers, configured to receive a second pre-expanded wafer (126; 726) from the expanding device (109). [2] Die handling system (100) according to claim 1, wherein the first pre-expanded wafer is held in a first magazine (122) which comprises positioning the wafer with the first configuration between an upper plate and a lower plate of the first magazine (122). [3] Die handling system (100) according to claim 1, wherein the first pre-expanded wafer and the second pre-expanded wafer are stored in a pre-oriented position in the device (119) for holding first pre-expanded wafers or device (119) for holding second pre-expanded wafers. [4] The handling system (100) according to claim 1, further comprising: a first elevator (130a) attached to the device (119) for holding first pre-expanded wafers; a second elevator (130b) attached to the device (119) for holding second pre-expanded wafers; and The die handling device (150) is connected to both the first elevator (130a) and the second elevator (130b). [5] Die handling system (100) according to claim 1, wherein the receiving head of the die handling device (150) simultaneously extracts one or more dies from the first pre-expanded wafer, while the expanding device (109) expands the wafers with the second configuration to a second pre-expanded wafer. [6] The handling system (100) according to claim 1, further comprising: a camera attached to the die handling device (150), wherein the camera has a three-dimensional view of each extracted die of the first pre-expanded wafer. [7] Die handling system (100) according to claim 6, wherein the three-dimensional view of the camera allows a side view and a perimeter view of the one or more dies extracted from the first pre-expanded wafer. [8] Die handling system (100) according to claim 1, wherein the receiving head (170) is rotatable. [9] Die handling system (100) according to claim 6, wherein the receiving head rotates and presents each extracted die of the first pre-expanded wafer (124; 724) to the camera. [10] The handling procedure, which includes the following steps: Pulling a prepared wafer comprising a wafer with a first configuration from a cassette to an expanding device (109); Expanding the wafer to a pre-expanded wafer (124; 724); Storing the pre-expanded wafer (124; 724) in a device (119) for holding first pre-expanded wafers (124; 724); Pulling the pre-expanded wafer (124; 724) from the device (119) for holding pre-expanded wafers (124; 724) to a table of a die handling device (150); and Extracting one or more dies from the pre-expanded wafer (124; 724); wherein the die handling procedure further comprises the following steps: Drawing a second prepared wafer, comprising a second wafer with a second configuration, from a second cassette to the expanding device (109), wherein the second wafer has a different configuration than the wafer with the first configuration; and Expanding the second wafer to a second pre-expanded wafer (124; 724). [11] The handling method according to claim 10, further comprising the following steps: Storing the second pre-expanded wafer (126; 726) in a device (119) for holding second pre-expanded wafers; and Pulling the second pre-expanded wafer (126; 726) from the device (119) for holding second pre-expanded wafers to the die handling device (150). [12] Die handling method according to claim 10, wherein the step of expanding the prepared wafer to a pre-expanded wafer (124; 724) further comprises: Preparing a magazine that includes a top plate, a bottom plate, and the prepared wafer; Arranging the prepared wafer between the upper plate and the lower plate of the magazine (122); Expanding the wafer by compressing the upper plate under the lower plate; and Locking the upper and lower plates together creates a pre-expanded wafer. [13] Die handling method according to claim 10, wherein the step of extracting one or more dies of the pre-expanded wafer (124; 724) and the step of expanding the second prepared wafer to a second pre-expanded wafer are performed simultaneously. [14] The handling method according to claim 10, further comprising the following step: Inspecting one or more dies extracted from the pre-expanded wafer (124; 724) by means of a viewing system attached to the die handling device (150). [15] Die handling method according to claim 14, wherein the vision system provides a three-dimensional view of the one or more dies extracted from the pre-expanded wafer (124; 724). [16] Die handling method according to claim 14, wherein the inspection step includes viewing a side view or edge view of one or more dies extracted from the pre-expanded wafer (124; 724) by means of a camera of the viewing system. [17] Die handling method according to claim 10, wherein the step of storing the pre-expanded wafer (124; 724) in a device (119) for holding first pre-expanded wafers (124; 724) further comprises the following step: Rotating the pre-expanded wafer (124; 724) into a pre-oriented position; and Placing the pre-expanded wafer (124; 724) into the device (119) for holding pre-expanded wafers (124; 724) in the pre-oriented position. [18] The handling method according to claim 10, comprising the following steps: Storing the second pre-expanded wafer (126; 726) in a device (119) for holding second pre-expanded wafers; Withdrawing the second pre-expanded wafer (126, 726) from the device (119) for holding second pre-expanded wafers to the table of the die handling device (150); and Extracting one or more dies from the second pre-expanded wafer (126; 726) while simultaneously extracting one or more dies from the first pre-expanded wafer.

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