LOAD PRESSURE INSPECTION DEVICE

Abstract

Solder printing testing device (21) arranged upstream of a component assembly machine (22) used to mount an electronic component (4) on a solder (3, 3a1, 3a2, 3a3, 3a4) printed onto a substrate (1) by a solder printing machine (12), and designed to test the solder (3, 3a1, 3a2, 3a3, 3a4) on the substrate (1) on which a thermosetting adhesive (6, 6a) is applied, wherein the solder printing testing device (21) comprises: an irradiation unit (32) designed to irradiate at least the plumb line (3, 3a1, 3a2, 3a3, 3a4) with light; an imaging unit (33) designed to capture an image of at least the perpendicular (3, 3a1, 3a2, 3a3, 3a4) illuminated by the light; an actual plumb position information generation unit (45) designed to generate actual plumb position information (Pjh, Pjh1, Pjh2), which is position information of a plumb group (5, 5a1, 5a2) containing two or more plumb bobs (3, 3a1, 3a2, 3a3, 3a4) and on which the electronic component (4) is mounted, based on image data acquired by the imaging unit (33); an ideal solder inspection reference information generation unit (46) designed to generate ideal solder inspection reference information (Krh, Krh1, Krh2, Krh3, Krh4) specifying a reference inspection position and / or reference inspection area of ​​the solder (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2) based on design data or manufacturing data; an assembly position setting information output unit (49) designed to output assembly position setting information (Cji) to the component assembly machine (22), wherein the assembly position setting information (Cji) is information that specifies the magnitude and direction of a position misalignment of expected assembly position information, which specifies an expected assembly position of the electronic component (4), relative to ideal assembly position information, which specifies an ideal assembly position of the electronic component (4), and is based on the magnitude and direction of a position misalignment of the actual solder position information (Pjh, Pjh1, Pjh2) relative to ideal solder position information, which specifies a position of the solder group (5, 5a1, 5a2) in the design data or the manufacturing data; and an adhesive information acquisition unit designed to obtain information relating to a curing temperature of the adhesive (6, 6a), wherein If the curing temperature of the adhesive (6, 6a) used to fix the electronic component (4), corresponding to the solder group (5, 5a1, 5a2), which is a predetermined test object, is obtained by the adhesive information acquisition unit, is higher than a melting temperature of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2), an investigation of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2) is carried out based on actual test reference information (Kjh, Kjh1, Kjh2, Kjh3, Kjh4) obtained by shifting the ideal solder test reference information (Krh, Krh1, Krh2, Krh3, Krh4) by the assembly position setting information (Cji) regarding the plumb group (5, 5a1, 5a2) will be obtained,is carried out and the assembly position setting information (Cji) is output by the assembly position setting information output unit (49) to the component assembly machine (22), and , If the curing temperature of the adhesive (6, 6a) used to fix the electronic component (4), which corresponds to the solder group (5, 5a1, 5a2) that is the object of investigation, obtained by the adhesive information acquisition unit, is lower than the melting temperature of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2), an investigation of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2) is carried out on the basis of the ideal solder investigation reference information (Krh, Krh1, Krh2, Krh3, Krh4) with respect to the solder group (5, 5a1, 5a2).

Description

Technical field

[0001] The present invention relates to a solder pressure testing device designed to examine a substrate such as a printed circuit board or similar. background

[0002] A general procedure for mounting electronic components onto a printed circuit board (PCB) first prints solder paste onto electrode patterns placed on the PCB. The procedure then temporarily adheres the electronic components to the printed PCB, taking into account the viscosity of the solder paste. A heat-curing adhesive may be applied to the PCB to, for example, prevent the electronic components from falling off when the PCB, with the mounted electronic components, passes through a predetermined reflow oven. After the electronic components are mounted, the PCB is passed to the reflow oven for a predetermined reflow process to solder and cure the adhesive. Generally, each electronic component has multiple electrode sections (electrodes and leads).The individual electrode sections are connected to different parts of the solder paste. Accordingly, an electronic component is mounted on a specific solder group, which consists of several solder paste sections.

[0003] An examination of the solder paste print quality is performed in a stage prior to the reflow process. A proposed testing device for conducting such an examination takes advantage of a self-aligning effect during the reflow process. This self-alignment effect is achieved by a function that melts the solder paste during the reflow process, causing it to become wet and spread along the surface of the electrode pattern. A proposed configuration of this type of testing device offsets or shifts a reference position for the examination by a predetermined amount within a unit of a given electronic component.for a unit of a respective solder group) in relation to the positions of an actually printed solder paste and examines the print quality of each part of the solder paste on the basis of this shifted reference position (as described, for example, in JP 2009 - 192 282 A).

[0004] JP H08 - 130 363 A discloses a method for firmly soldering an electronic part without impairing a self-alignment effect, wherein the curing temperature of the joining material used for the temporary attachment of an electronic part to a circuit board is set higher than the melting point of the solder, and the holding force of the joining material at a temperature at which the solder melts is set lower than that at room temperature.

[0005] JP 2002-271 096 A discloses a mounting method for electronic components that utilizes a self-alignment effect. When solder paste is printed onto a printed circuit board with contact pads and electronic components are mounted on it, the position of the printed solder paste on the circuit board is detected in order to mount the electronic components relative to the position of the printed solder paste.

[0006] DE 10 2008 050 836 A1 discloses a device for inspecting solder applied by printing, comprising: a storage medium, an ideal solder information generation unit, and an image processing unit. Design data is stored in the storage medium. The ideal solder information generation unit generates "ideal solder position information" and an "ideal solder size" from the ideal solder areas in the design data. The image processing unit extracts the actual solder areas on the printed circuit board K from image data acquired by a CCD camera and generates "actual solder position information" from the actual solder areas.The image processing unit generates "position deviation amounts" between the "ideal solder position information" and the "actual solder position information", generates "print deviation rates" which indicate the extent of the "position deviation amounts" relative to the "ideal solder sizes", calculates a correction value with respect to a print position based on the "print deviation rates" and outputs a correction value signal to the solder printing machine.

[0007] JP 2015-119134A discloses an assembly system for electronic components. In the assembly process, an adhesive for attaching the light-emitting element to the substrate is applied between contact points on a top surface of the substrate via a soldered connection. A positional displacement of a light-emitting component within the light-emitting element is detected, and the position of the light-emitting element is determined based on an image of its back side. When the light-emitting element is packed onto the substrate, it is aligned by utilizing the detected positional displacement and its position, being moved only by the amount of the displacement.The adhesive is then cured, a solder is melted in the state in which the light-emitting element is fixed, and a connection of the light-emitting element and the contact surface of the substrate are joined.

[0008] US Patent 6,225,573 B1 discloses a method for mounting a connector on a printed circuit board (PCB). The method includes a coating step for applying solder paste to the PCB, a layering step for layering a connector end onto the solder paste-coated areas, and a heating step for heating and melting the solder paste to solder the connector end to the PCB. A further step for applying adhesive to the PCB is also included, and in the layering step, the connector end is brought into contact with the adhesive-coated areas. In the heating step, the solder paste is heated and melted while the connector end is bonded to the PCB by the adhesive.

[0009] US Patent 2015 / 0351295A1 discloses an assembly system for electronic components comprising: a printing device, an assembly device for electronic components, and an assembly information storage unit in which assembly information is stored. The assembly information includes information on the execution mode, specifying a first or second assembly mode for each electronic component. In the first assembly mode, the electronic component is placed in a mounting position corrected based on the detection result of a first detection mark formed on a printed circuit board. In the second assembly mode, the electronic component is placed in a mounting position corrected based on the detection result of a second detection mark formed by paste printed on the printed circuit board.The electronic components are mounted on the circuit board according to the mounting methods specified for the respective electronic components, with reference to the mounting information. Summary Technical Problem

[0010] However, the self-aligning effect may not be fully utilized depending on the curing temperature of the adhesive. If, in such cases, the print quality of the solder paste is examined based on the shifted reference position, this is likely to lead to an error in appropriately or correctly determining the print quality of the solder paste.

[0011] Taking into account the circumstances described above, it is an object of the present invention to provide a solder pressure testing device designed to suitably determine the printing quality of soldering materials or solders on a substrate to which an adhesive has been applied. This object is achieved by a solder pressure testing device having the features of claim 1, claim 2, and claim 3. The dependent claim is directed to an advantageous embodiment of the invention. Solution to the problem

[0012] The following section describes various aspects for solving the problems described above. Functions and beneficial effects inherent in each aspect are also described as needed.

[0013] Aspect 1. A solder printing inspection device is provided, arranged upstream of a component assembly machine used to mount an electronic component onto a solder printed onto a substrate by a solder printing machine, and designed to inspect the solder on the substrate, which has a thermosetting adhesive applied thereto. The solder printing inspection device comprises: an irradiation unit designed to irradiate at least the solder with light; an imaging unit designed to capture an image of at least the solder being irradiated with light;an actual solder position information generating unit designed to generate actual solder position information, which is position information of a solder group containing two or more solders and on which the electronic component is mounted, based on image data acquired by the imaging unit; an ideal solder inspection reference information generating unit designed to generate ideal solder inspection reference information, which specifies a reference inspection position and / or reference inspection area of ​​the solder contained in the solder group, based on design or manufacturing data;an assembly position setting information output unit designed to output assembly position setting information to the component assembly machine, wherein the assembly position setting information is information specifying a magnitude and direction of position misalignment of expected assembly position information, which specifies an expected assembly position of the electronic component, relative to ideal assembly position information, which specifies an ideal assembly position of the electronic component, and based on a magnitude and direction of position misalignment of actual solder position information relative to ideal solder position information, which specifies a position of the solder group in the design data or in the manufacturing data;and an adhesive information acquisition unit designed to obtain information regarding the curing temperature of the adhesive.

[0014] If the curing temperature of the adhesive used to fix the electronic component, corresponding to the solder group that is a predetermined object of investigation, as obtained by the adhesive information acquisition unit, is higher than a melting temperature of the respective solders contained in the solder group, an investigation of the respective solders contained in the solder group is carried out based on actual investigation reference information obtained by shifting the ideal solder investigation reference information by the assembly position setting information with respect to the solder group, and the assembly position setting information is output to the component assembly machine by the assembly position setting information output unit.

[0015] If the curing temperature of the adhesive used to fix the electronic component, obtained by the adhesive information acquisition unit, which corresponds to the solder group that is the object of investigation, is lower than the melting temperature of the respective solders contained in the solder group, an investigation of the respective solders contained in the solder group is carried out based on the ideal solder investigation reference information with respect to the solder group.

[0016] The “(actual or ideal) plumb position information” shows a relative position of a plumb group with respect to a substrate and can, for example, be the center or centroid of an area (= plumb area) occupied by the respective plumb lines contained in the plumb group on the substrate, where the center or centroid of a rectangle circumscribing the plumb area is the center point or centroid of the respective plumb areas (for example, a center point or centroid of the centers or centroids of the respective plumb areas).

[0017] The "ideal mounting position information" shows an ideal mounting position for an electronic component, generated based on, for example, plumb line positions in the data. This information can be, for example, the ideal plumb line position information itself, or the center point or centroid of the respective plumb line areas.

[0018] The "expected mounting position information" shows the expected mounting position of an electronic component, generated based on actually printed solder joints. This information can include, for example, actual solder joint position information, or the center point or centroid of the respective solder joint areas.

[0019] The "ideal plumb line reference information" indicates a study position or study area of ​​a given plumb line within the data. This information can be, for example, ideal plumb line position information, a study window (ideal plumb line study window) generated based on an area in the data occupied by the plumb line (ideal plumb line area), or the center or centroid of the plumb line area within the data.

[0020] The “mounting position adjustment information” is information that specifies the degree or extent of each size of a position misalignment and a direction of a position misalignment with respect to an actually printed plumb line relative to a plumb line in the data, and can be expressed, for example, by vector information or rotation angle information.

[0021] The "actual inspection reference information" is information that specifies an inspection reference position and inspection reference area of ​​a given printed plumb line. This information can be obtained, for example, by shifting the ideal plumb line inspection reference information (such as coordinate information or an inspection window) by a predetermined vector component, or it can be obtained by rotating the ideal plumb line inspection reference information (such as coordinate information or an inspection window) by a predetermined angle of rotation.

[0022] If the curing temperature of the adhesive used to fix an electronic component, corresponding to a solder group that is an object of investigation, as obtained by the adhesive information acquisition unit, is higher than the melting temperature of the solders contained in the solder group—that is, under the condition that a self-alignment effect is likely to be used—the configuration of aspect 1 above performs an investigation of the respective solders contained in the solder group based on the actual investigation reference information obtained by shifting the ideal solder investigation reference information by the assembly position setting information. In other words, under the condition that the self-alignment effect is likely to be used, the configuration of aspect 1 modifies an investigation reference position in the unit.with regard to a given electronic component (within the unit of a given solder group), based on the positions of actually printed solders, an examination of the respective solders is carried out based on this modified reference position. For example, if the respective solders contained in the solder group exhibit relatively large positional misalignment magnitudes, but the magnitudes and directions of the positional misalignment are appropriately fixed, and the solders and similar components are expected to be placed in suitable positions by self-alignment, this can lead to the determination of "good print quality." If, according to another example, the individual solders exhibit relatively small positional misalignment magnitudes, but the individual solders exhibit varying directions of positional misalignment, and appropriate orWhile correct assembly of an electronic component is unlikely, this can, on the other hand, lead to a significant deviation of a particular solder from the reference position of the test and thus to the determination of "poor print quality". This configuration therefore enables a suitable investigation of the print quality of the solder, taking into account the utilization of the self-aligning effect.

[0023] If the curing temperature of the adhesive used to fix the electronic component, corresponding to the solder group that is the object of investigation, as obtained by the adhesive information acquisition unit, is lower than the melting temperature of the solders contained in the solder group, then, on the other hand, the configuration of aspect 1 above performs an investigation of the respective solders contained in the solder group based on the ideal solder investigation reference information. In other words, provided that the self-alignment effect is not used or is unlikely to be used, the configuration of aspect 1 above performs an investigation of the respective solders based on the positions and areas of the respective solders in the design data or manufacturing data (ideal positions and ideal areas of the respective solders on a finally produced substrate).This configuration therefore allows for a suitable investigation of the printing quality of the solders, taking into account the absence or unlikely use of the self-aligning effect.

[0024] As described above, the configuration of aspect 1 allows for a suitable examination of the solder printing quality both when the self-alignment effect is used and when it is not (or is unlikely to be) used. As a result, this configuration prevents the electronic components from being mounted on a substrate where the solder is not printed correctly, thus increasing yield and avoiding increased manufacturing costs.

[0025] If the curing temperature of the adhesive is higher than the melting temperature of the solder, the configuration of the aspect described above outputs assembly position adjustment information to the component assembly machine. This information is based on the magnitude and direction of the positional misalignment of the actual solder position relative to the ideal solder position information. Accordingly, this configuration enables the positioning of an electronic component in a location determined by considering the self-aligning effect and ensures reliable assembly of the electronic component in a suitable position. This configuration utilizes information generated during a testing process for the assembly process. Therefore, there is no need to perform a sequence of processes, as in the testing process, to duplicate or reuse the information.This redundant approach is used in the assembly process. This improves manufacturing efficiency.

[0026] Aspect 2. A solder print inspection device is provided, arranged upstream of a component assembly machine used to mount an electronic component onto a solder printed onto a substrate by a solder printing machine, and designed to inspect the solder on the substrate to which the thermosetting adhesive has been applied. The solder print inspection device comprises: an irradiation unit designed to irradiate at least the solder with light; an imaging unit designed to capture an image of at least the solder being irradiated with light; and an actual solder position information generation unit designed to generate actual solder position information, which is position information of a solder group containing two or more solders on which the electronic component is mounted, based on image data captured by the imaging unit.an ideal solder inspection reference information generation unit designed to generate ideal solder inspection reference information specifying a reference inspection position and / or reference inspection area of ​​the solder contained in the solder group, based on design data or manufacturing data;an assembly position setting information output unit designed to output assembly position setting information to the component assembly machine, wherein the assembly position setting information is information that is a magnitude of position misalignment and a direction of position misalignment of expected assembly position information that specifies an expected assembly position of the electronic component relative to ideal assembly position information that specifies an ideal assembly position of the electronic component and is based on a magnitude of position misalignment and a direction of position misalignment of the actual solder position information relative to ideal solder position information that specifies a position of the solder group in the design data or in the manufacturing data;and an adhesive information acquisition unit designed to obtain information relating to the curing temperature of the adhesive.

[0027] If the curing temperature of the adhesive used to fix the electronic component, corresponding to the solder group that is a predetermined object of investigation, as obtained by the adhesive information acquisition unit, is higher than a melting temperature of the respective solders contained in the solder group, an investigation of the respective solders contained in the solder group is carried out, at least on the basis of actual investigation reference information obtained by shifting the ideal solder investigation reference information by the assembly position setting information with respect to the solder group, and the assembly position setting information is output to the component assembly machine by the assembly position setting information output unit.

[0028] If the curing temperature of the adhesive used to fix the electronic component, corresponding to the solder group that is the object of investigation, as obtained by the adhesive information acquisition unit, is higher than the melting temperature of the solders contained in the solder group—that is, under the condition that the self-alignment effect is likely to be exploited—the configuration of aspect 2 above performs an investigation of the respective solders contained in the solder group based on the actual investigation reference information obtained by shifting the ideal solder investigation reference information by the assembly position setting information. In other words, under the condition that the self-alignment effect is likely to be exploited, the configuration of aspect 2 takes this condition into account to establish a reference position for an investigation within the unit.The system allows for the modification of the position of the actually printed solders with respect to a specific electronic component (within the unit or with respect to a specific solder group) and performs an examination of the respective solders based on this modified reference position. This configuration therefore enables a suitable examination of the print quality of the solders, taking into account the utilization of the self-aligning effect.

[0029] If the curing temperature of the adhesive is higher than the melting temperature of the solder, the configuration of aspect 2 above outputs the assembly position adjustment information to the component assembly machine. This information is based on the magnitude and direction of any positional misalignment of the actual solder position relative to the ideal solder position information. Accordingly, this configuration enables the positioning of an electronic component in a location determined by its self-alignment effect and ensures reliable assembly of the electronic component in a suitable or correct position. This configuration utilizes information generated during a testing process for an assembly process. Therefore, there is no need to duplicate a sequence of processes similar to those in the testing process.This redundant approach is used in the assembly process. This improves manufacturing efficiency.

[0030] Aspect 3. A solder printing inspection device is provided, arranged upstream of a component assembly machine used to mount an electronic component onto a solder printed onto a substrate by a solder printing machine, and designed to inspect the solder on the substrate to which the thermosetting adhesive has been applied. The solder printing inspection device comprises: an irradiation unit designed to irradiate at least the solder with light; an imaging unit designed to capture an image of at least the solder being irradiated with light;an actual solder position information generating unit designed to generate actual solder position information, which is position information of a solder group containing two or more solders and on which the electronic component is mounted, based on image data acquired by the imaging unit; an ideal solder examination reference information generating unit designed to generate ideal solder examination reference information, which specifies a reference examination position and / or reference examination area of ​​the solder contained in the solder group, based on design or manufacturing data;an assembly position setting information output unit designed to output assembly position setting information to the component assembly machine, wherein the assembly position setting information is information that is a magnitude of position misalignment and a direction of position misalignment of expected assembly position information that specifies an expected assembly position of the electronic component relative to ideal assembly position information that specifies an ideal assembly position of the electronic component and is based on a magnitude of position misalignment and a direction of position misalignment of the actual solder position information relative to ideal solder position information that specifies a position of the solder group in the design data or in the manufacturing data;and an adhesive information acquisition unit designed to obtain information relating to the curing temperature of the adhesive.

[0031] If the curing temperature of the adhesive used to fix the electronic component, which corresponds to the solder group that is a predetermined object of investigation, as obtained by the adhesive information acquisition unit, is lower than a melting temperature of the respective solders contained in the solder group, an investigation of the respective solders contained in the solder group is carried out, at least on the basis of the ideal solder investigation reference information with respect to the solder group.

[0032] If the curing temperature of the adhesive used to fix the electronic component, as obtained by the adhesive information acquisition unit, corresponding to the solder group that is the object of investigation, is lower than the melting temperature of the solders contained in the solder group, the configuration of aspect 3 above performs an investigation of the respective solders contained in the solder group based on the ideal solder investigation reference information. In other words, provided that the self-alignment effect is not or is unlikely to be exerted or utilized, the configuration of aspect 3 performs an investigation of the respective solders based on the positions and areas of the respective solders in the design data or in the manufacturing data (ideal positions and ideal areas of respective solders on a finally produced substrate).This configuration therefore allows for a suitable examination of the printing quality of the solders, taking into account a lack of or unlikely self-alignment effect.

[0033] In the case where the self-alignment effect is likely to be used, the configuration of aspect 3 above enables the output of information regarding the mounting position of an electronic component (mounting position setting information) by the mounting position setting information output unit, taking into account the self-alignment effect.

[0034] Aspect 4. In the solder pressure testing device described in one of the above aspects 1 to 3, if the electronic component corresponding to the solder group that is the predetermined test object cannot be fixed by the adhesive, the assembly position setting information regarding the solder group can be output to the component assembly machine by the assembly position setting information output unit.

[0035] If the electronic component cannot be fixed by the adhesive, the mounting position setting information is output to the component assembly machine as information regarding the mounting position of the electronic component, independent of the adhesive's curing temperature. In other words, the mounting position setting information is output with respect to the electronic component, which is movable due to its self-aligning effect. This configuration therefore allows the electronic component to be positioned according to its self-aligning properties, resulting in more reliable mounting of the electronic component in a suitable position. Furthermore, this configuration utilizes information generated during a testing process for the assembly process.Therefore, there is no need to perform a sequence of processes similar to those in the investigation process in a duplicate or redundant manner during the assembly process. This improves manufacturing efficiency even more effectively. Brief description of the drawings Fig. Figure 1 is a block diagram that represents the schematic configuration of a manufacturing system. Fig. Figure 2 is a partially enlarged top view showing the schematic configuration of a printed circuit board. Fig. Figure 3 is a partially enlarged sectional view showing the schematic configuration of the printed circuit board. Fig. Figure 4 is a schematic diagram showing the schematic configuration of a solder pressure testing device and similar equipment. Fig. Figure 5 is a block diagram that illustrates the configuration of a control device and similar equipment. Fig. Figure 6 is a flowchart that shows an investigation process. Fig. Figure 7 is a flowchart showing an initial extraction generation process. Fig. Figure 8 is a flowchart showing a second extraction generation process. Fig. Figure 9 is a schematic top view showing the pressure state of solder and similar items used in the description of the investigation process. Fig. Figure 10 is a schematic top view showing ideal plumb areas and ideal plumb position information. Fig. 11 is a schematic top view showing plumb line search areas. Fig. Figure 12 is a schematic top view showing solder points and similar features. Fig. Figure 13 is a schematic top view showing actual plumb areas, actual plumb position information, and the like. Fig. 14 is a schematic top view that provides ideal reference information for plumb line analysis. Fig. Figure 15 is a schematic top view showing assembly position adjustment information and similar details. Fig. Figure 16 is a schematic top view that represents actual investigation-related information. Fig. Figure 17 is a schematic top view representing an investigation of solders using the actual investigation reference information when the curing temperature of an adhesive is higher than the melting temperature of the solders. Fig. Figure 18 is a schematic top view representing an investigation of solders using the actual investigation reference information or the ideal solder investigation reference information when the curing temperature of the adhesive is lower than the melting temperature of the solders. Fig. Figure 19 is a schematic top view showing an arrangement of plumb lines and similar items in suitable positions by using or exercising a self-aligning effect. Fig. Figure 20 is a schematic top view showing a case in which the plumb lines and similar items are moved by utilizing the self-aligning effect, and a case in which the plumb lines and similar items are not moved due to the lack of use or exercise of the self-aligning effect caused by the influence of the adhesive. Description of the embodiments

[0036] The following describes one embodiment with reference to the drawings. Fig. Figure 1 is a block diagram showing the schematic configuration of a manufacturing system for producing a printed circuit board (hereinafter referred to as the “substrate”). Fig. Figure 2 is a partially enlarged top view showing part of substrate 1. Fig. Figure 3 is a partially enlarged cross-sectional view showing part of substrate 1.

[0037] First, the configuration of substrate 1 is described. As it is in Fig. 2 and Fig. As shown in Figure 3, the substrate 1 has several electrically conductive electrode patterns 2. Solder paste 3, which has a viscosity (hereinafter referred to as "solder" 3), is printed onto the electrode patterns 2.

[0038] The solder 3 used can be, for example, a Sn-Ag-based solder such as Sn-3.0 Ag-0.5 Cu or Sn-0.3 Ag-0.7 Cu, a Sn-Cu-based solder such as Sn-0.7 Cu, a Sn-Zn-based solder such as Sn-8 Zn-3 Bi, or a Sn-Pb-based solder such as Sn-67% Pb-37%. According to the embodiment, the solders 3 printed onto the respective parts of the substrate 1 do not differ from one another; rather, the identical type of solder 3 is printed onto the respective parts of the substrate 1.

[0039] The melting point of solder 3, consisting of Sn - 3.0 Ag - 0.5 Cu or Sn - 0.3 Ag - 0.7 Cu, is approximately 217°C, and the melting point of solder 3, consisting of Sn - 0.7 Cu, is approximately 227°C. The melting point of solder 3, consisting of Sn - 8 Zn - 3 Bi, is approximately 187 to 196°C, and the melting point of solder 3, consisting of Sn 67% - Pb 37%, is approximately 183°C.

[0040] Electronic components 4, such as a chip or similar device, are mounted on the solders 3. More precisely, the electronic component 4 contains several electrode sections 7, which consist of electrodes and conductors. Each of the electrode sections 7 is connected to a specific, predetermined solder 3. Accordingly, the electronic component 4 is mounted on a solder group 5, which consists of several solders 3.

[0041] Furthermore, each of the electronic components 4 mounted on the substrate 1 is fixed by the solders 3. To improve the fixation, at least one of the electronic components 4 is bonded by means of an adhesive 6 applied to the substrate 1. However, according to the embodiment, at least one of the electronic components 4 is not fixed by the adhesive 6.

[0042] The adhesive 6 is an insulating adhesive that exhibits thermosetting properties. The curing temperature of the adhesive 6 varies depending on the type of adhesive 6 used and can be higher or lower than the melting temperature of the solder 3. According to the embodiment, the same type of adhesive 6 is applied to the respective parts of the substrate 1.

[0043] The following describes a manufacturing system 11 designed to produce substrate 1. As it is described in Fig. As shown in Figure 1, the manufacturing system 11 of the embodiment includes a solder printing device 12 as a solder printing machine, an adhesive application device 13, a component assembly system 14, a reflow device 15 and a component assembly condition inspection device 16, which are arranged successively along a transfer line of the substrate 1 from a current side (top side of the drawing).

[0044] The solder printing device 12 is designed to print a predetermined quantity of solder 3 at a predetermined position on the substrate 1 (for example, on the electrode pattern 2). More precisely, the solder printing device 12 has a metal screen (not shown) with multiple holes at positions corresponding to the electrode patterns 2 on the substrate 1. The solder printing device 12 uses this metal screen to apply the solder 3 to the substrate 1 by screen printing.

[0045] The adhesive application device 13 is designed to apply a predetermined quantity of the adhesive 6 to a predetermined position on the substrate 1 (for example, a position where a predetermined electronic component 4 is expected to be placed). The adhesive application device 13 has, for example, a nozzle head (not shown) that can be moved in an XY direction and sprays the adhesive 6 from this nozzle head to apply the adhesive 6 to the substrate 1.

[0046] The component assembly system 14 includes a solder pressure testing device 21, designed to test the printed solder 3, and a component assembly machine 22, designed to assemble the electronic components 4. The solder pressure testing device 21 and the component assembly machine 22 will be described in more detail later.

[0047] The reflow device 15 is designed to heat and melt the solder 3 as well as to heat and cure the adhesive 6. On the substrate 1, after a reflow process carried out by the reflow device 15, the electrode sections 7 of the electronic component 4 are connected to the electrode patterns 2 by means of the solder 3, and the electronic component 4 is securely fixed by the adhesive 6.

[0048] The component assembly condition inspection device 16 is designed to examine whether each of the electronic components 4 is mounted at a predetermined position and to examine whether the electrical continuity or conduction with the respective electronic components 4 is adequately or correctly ensured.

[0049] The component assembly system 14 is described below. The solder pressure testing device 21 is described first.

[0050] As it is in Fig. As shown in Figure 4, the solder pressure testing device 21 includes a mounting table 31 configured such that the substrate 1 is arranged on the mounting table 31; a lighting device 32, designed as the irradiation unit for irradiating the surface of the substrate 1 obliquely downwards with light; a CCD camera 33, designed as the imaging unit for capturing an image of the substrate 1 irradiated with light; and a control device 41, designed to perform various control, image processing, and arithmetic operations in the solder pressure testing device 21.

[0051] The assembly table 31 has electric motors 34 and 35, each with rotating shafts arranged orthogonally to each other. The control device 41 drives and controls these motors 34 and 35 to, for example, move the substrate 1, which is arranged on the assembly table 31, in any desired direction (X-axis and Y-axis). This changes the imaging position of the substrate 1 by the CCD camera 33.

[0052] The lighting device 32 is designed to irradiate the substrate 1 with predetermined light and to emit light at least to the plumb line 3.

[0053] The CCD camera 33 has a sensitivity in a wavelength range of the light emitted by the illumination device 32 and is designed to capture an image of at least the perpendicular 3 illuminated by the light. Image data captured by the CCD camera 33 is transmitted to an arithmetic device 43 of the control device 41, which will be described later. According to the embodiment, the transmitted image data is luminance data or brightness data with respect to light reflected from the substrate 1. However, the transmitted image data is not limited to luminance data but can include color data, height data, or similar information about the substrate 1.

[0054] The following describes the control device 41. As it is in Fig. As shown in Figure 5, the control device 41 includes a storage device 42 designed to store various data and an arithmetic device 43 designed to perform various arithmetic operations. Fig. 5 represents areas and information parts provided by the respective units 44 to 47 described later, as well as the respective components of the control device 41.

[0055] These areas and pieces of information are represented by dashed-line boxes. Fig. 5 shown.

[0056] The storage device 42 stores results of calculations performed by the arithmetic device 43, as well as design data, manufacturing data and similar information relating to substrate 1.According to the embodiment, the storage device 42 stores, for example, the positions and sizes of the electrode patterns 2 on the substrate 1, the expected pressure positions of the solders 3, the type of solders 3, the melting temperature of each type of solder 3, the sizes of the solders 3 (for example, the length of each side of the solder 3, the area and outline length of the solder 3, the length of the diagonal of the solder 3, the volume of the solder 3, and the like) in an ideal pressure state, various pieces of information relating to the electronic components 4, including information regarding whether the respective electronic components 4 are to be fixed by the adhesive 6 and regarding the expected arrangement area of ​​the respective electronic components 4, and the size of the substrate 1 as design data and manufacturing data.The storage device 42 also stores, for example, information regarding which solder 3 is used to assemble the respective electronic components 4, and information regarding which solder 3 is contained in which solder group 5.

[0057] The arithmetic device 43 includes an ideal solder position information generation unit 44, an image processing unit 45, an ideal solder examination reference information generation unit 46, an assembly position setting information generation unit 47, an information acquisition unit 48 which serves as an adhesive information acquisition unit, and an assembly position setting information output unit 49.

[0058] The ideal solder position information generation unit 44 is designed to generate ideal solder position information Prh, which specifies an ideal position of a respective solder group 5 in the design data or in the manufacturing data stored in the storage device 42. According to the embodiment, the ideal solder position information generation unit 44 first receives an ideal solder area Arh for each of the solders 3 contained in a respective solder group 5, based on the data stored in the storage device 42. According to the embodiment, the ideal solder area Arh denotes a planar area or surface area in the data that is occupied by the respective solders 3 on the substrate 1.

[0059] The ideal perpendicular position information generation unit 44 then obtains the center-of-mass coordinates with respect to each of the ideal perpendicular regions Arh. If the perpendicular group 5 contains two perpendiculars 3, the ideal perpendicular position information generation unit 44 generates midpoint coordinates (i.e., center-of-mass coordinates) [= (Lx, Ly)] of the two center-of-mass coordinates with respect to these two ideal perpendicular regions Arh as ideal perpendicular position information Prh. If the perpendicular group 5 contains three or more perpendiculars 3, the ideal perpendicular position information generation unit 44, on the other hand, generates midpoint coordinates (i.e., center-of-mass coordinates) [= (Lx, Ly)] of the respective center-of-mass coordinates with respect to the respective ideal perpendicular regions Arh as ideal perpendicular position information Prh.

[0060] A three-dimensional area or similar feature in the data, occupied by the respective solder 3 on the substrate 1, can also be obtained as an ideal solder area Arh. The center of a respective ideal solder area Arh, the centroid, or the center of a rectangle that circumscribes a respective ideal solder area Arh or similar feature, can also be generated as ideal solder position information Prh. According to the embodiment, the ideal solder area Arh is defined as identical to an area occupied by a respective electrode pattern 2 on the substrate 1.

[0061] The image processing unit 45 is designed to extract an actual plumb area Ajh based on the image data captured by the CCD camera 33 and to generate actual plumb position information Pjh based on the extracted actual plumb area Ajh.

[0062] The actual lot area Ajh essentially refers to an area of ​​image data occupied by a given lot 3. However, a lot 3 with significantly poor print quality is not extracted as the actual lot area Ajh. The actual lot position information Pjh refers to positional information of image data in relation to a given lot group 5 that was actually printed.

[0063] The extraction of the actual solder area Ajh is described in more detail. The image processing unit 45 first performs a binarization process of the image data using a predetermined luminance value, which is determined in advance as a reference value, and thereby extracts an area occupied by each solder 3 on the substrate 1. The image processing unit 45 then stores information relating to the extracted area of ​​each solder 3 in the storage device 42.

[0064] The image processing unit 45 then sets a predetermined plumb line search area. This search area has a similar shape to the ideal plumb lines Arh and features center coordinates identical to those of the ideal plumb line Arh. However, the search area is set to be slightly larger than the ideal plumb line Arh.

[0065] The image processing unit 45 then uses the information regarding the area of ​​each solder 3 stored in the storage device 42 and determines whether the area of ​​the solder 3 present in the solder search area occupies a predetermined or greater proportion of the area of ​​the solder search area. If this determination condition is met, the image processing unit 45 extracts the solder 3 present in the solder search area as a solder point. However, an area smaller than a predetermined area (for example, less than 1% of the area of ​​the solder search area) within the area of ​​the solder 3 present in the solder search area is not extracted as part of a solder point.

[0066] The image processing unit 45 then extracts a solder area to be connected to the extracted solder point (i.e., a solder area containing the extracted solder point) as the actual solder area Ajh based on the information regarding the area of ​​the solder 3 stored in the storage device 42. This extracts the actual solder area Ajh with respect to the respective solders 3 contained in the solder group 5, with the exception of the solder 3 that has a significantly poor print quality.

[0067] If the area of ​​the solder 3 present in the solder search area is smaller than the predetermined proportion of the area of ​​the solder search area, the image processing unit 45 does not extract this solder 3 as a solder point, but instead outputs a "printing error signal" to the component assembly machine 22. This process is carried out because printing the solder 3 in a position that deviates significantly from its ideal printing position will likely lead to difficulties in subsequently correcting the position of the solder 3, even when the self-aligning effect is utilized. The operations of the component assembly machine 22 in response to the input of the "printing error signal" are described later.

[0068] If multiple areas of solder 3, each with a predetermined or larger area (for example, 20% or a higher percentage of the solder search area), are present in the solder search area, the image processing unit 45 does not extract these solders as a solder point but outputs the "print error signal" to the component assembly machine 22. This process is carried out because the solder 3 is likely to be excessively close to an adjacent solder due to "bleeding" or similar issues, or because the solder 3 is likely smeared.

[0069] The following describes the generation of the actual plumb line position information Pjh. The image processing unit 45 first determines the center of gravity coordinates with respect to the respective actual plumb line ranges Ajh contained in each plumb line group 5. If the plumb line group 5 contains two plumb lines 3, the image processing unit 45 generates center coordinates (i.e., midpoint coordinates) [= (x, y)] of the two center of gravity coordinates with respect to these two actual plumb line ranges Ajh contained in the plumb line group 5 as actual plumb line position information Pjh. Conversely, if the plumb line group 5 contains three or more plumb lines 3, the image processing unit 45 generates center coordinates (i.e., center of gravity coordinates) [= (x, y)] of the respective center of gravity coordinates with respect to the actual plumb line ranges Ajh contained in the plumb line group 5 as actual plumb line position information Pjh.According to the embodiment, the image processing unit 45 corresponds to the actual plumb position information generation unit.

[0070] The center coordinates (centroid coordinates) of a given actual perpendicular range Ajh, the centroid or center of a rectangle circumscribing a given actual perpendicular range Ajh, or similar, can be generated as actual perpendicular position information Pjh. However, the actual perpendicular position information Pjh must be of the same type (i.e., identical category type and identical parameters) as the ideal perpendicular position information Prh. According to the embodiment described above, the center coordinates of the centroid coordinates of the ideal perpendicular range Arh are generated as ideal perpendicular position information Prh, and the center coordinates of the centroid coordinates of the actual perpendicular range Ajh are generated as actual perpendicular position information Pjh.

[0071] The ideal plumb line investigation reference information generation unit 46 is designed to generate ideal plumb line investigation reference information Krh, which specifies an investigation area corresponding to the ideal plumb line area Arh. According to the embodiment, the ideal plumb line investigation reference information generation unit 46 generates the ideal plumb line investigation reference information Krh based on the ideal plumb line area Arh, which is obtained by the ideal plumb line position information generation unit 44.

[0072] More precisely, the ideal perpendicular investigation reference information generation unit 46 generates an ideal perpendicular investigation window that has a similar shape to the ideal perpendicular region Arh and has center coordinates identical to the center coordinates of the ideal perpendicular region Arh, as ideal perpendicular investigation reference information Krh. This ideal perpendicular investigation window specifies an investigation reference area for a given perpendicular 3 contained in the perpendicular group 5. The ideal perpendicular investigation window is set to be slightly larger than the size of the ideal perpendicular region Arh. The ideal perpendicular investigation reference information Krh can be suitably modified by changing the ideal perpendicular region Arh.

[0073] The mounting position setting information generation unit 47 is designed to generate mounting position setting information Cji with respect to a respective solder group 5, or in other words, with respect to a respective electronic component 4. The mounting position setting information Cji specifies the magnitude and direction of a position misalignment of expected mounting position information relative to ideal mounting position information. The ideal mounting position information specifies a mounting position in the design data or in the manufacturing data with respect to the electronic component 4 to be mounted on the solder group 5 and is identical to the ideal solder position information Prh according to the embodiment.The expected mounting position information specifies an expected mounting position of the electronic component 4 to be mounted on the solder group 5 and is identical to the actual solder position information Pjh according to the embodiment.

[0074] According to the embodiment, the assembly position adjustment information Cji is generated based on the magnitude and direction of any position misalignment of the actual plumb position information Pjh relative to the ideal plumb position information Prh. More precisely, vector information is generated as assembly position adjustment information Cji based on the actual plumb position information Pjh [= (x, y)] and the ideal plumb position information Prh [= (Lx, Ly)]. An X component of the assembly position adjustment information Cji is "x-Lx", and a Y component of the assembly position adjustment information Cji is "y-Ly".

[0075] The information acquisition unit 48 is designed to obtain information regarding the curing temperature of the adhesive 6 applied to the substrate 1 and the type of solder 3 printed onto the substrate 1. According to the embodiment, the information acquisition unit 48 consists, for example, of a keyboard and a touch-sensitive surface and receives information regarding the curing temperature of the adhesive 6 and the type of solder 3 via a predetermined input device 50, which is electrically connected to the control device 41.

[0076] The assembly position setting information output unit 49 is designed to output position setting information, used in the process of determining the actual assembly position of the respective electronic components 4, to the component assembly machine 22. According to the embodiment, the assembly position setting information output unit 49 first uses the information regarding the type of solder 3, obtained by the information acquisition unit 48, to extract information regarding the melting temperature of the solder 3 from the storage device 42. The assembly position setting information output unit 49 then compares the melting temperature of the solder 3, as indicated by the extracted information, with the curing temperature of the adhesive 6, which is obtained by the information acquisition unit 48.The assembly position setting information output unit 49 also uses the data stored in the storage device 42 to check whether the respective electronic components 4 are to be fixed by the adhesive 6.

[0077] If the curing temperature of the adhesive 6 is higher than the melting temperature of the solder 3, the mounting position setting information output unit 49 outputs the mounting position setting information Cji as information on the position setting with respect to the electronic component 4, regardless of whether the electronic component 4 is to be fixed by the adhesive 6.

[0078] If the curing temperature of the adhesive 6 is lower than the melting temperature of the solder 3, and the electronic component 4 is to be fixed by the adhesive 6, the assembly position setting information output unit 49 outputs a non-setting signal as information for the position setting of the electronic component 4. The operations of the component assembly machine 22 in response to the input of the non-setting signal are described later.

[0079] If the curing temperature of the adhesive 6 is lower than the melting temperature of the solder 3, but the electronic component 4 cannot be fixed by the adhesive 6, the mounting position setting information output unit 49 outputs the mounting position setting information Cji as information on the position setting with respect to the electronic component 4. The mounting position setting information Cji or the non-setting signal is output only if the examination of the solder group 5 by the arithmetic device 43 described below determines that the solder group 5 is of "good quality".

[0080] The following describes an investigation process for each solder group using the arithmetic device 42. The arithmetic device 43 investigates the good / poor quality of the solder group 5 on the substrate 1, for example, based on the information generated by the respective units 44 to 48 described above.

[0081] The arithmetic device 43 checks whether the respective parts of the assembly position setting information Cji, obtained by the assembly position setting information generation unit 47, are suitable or correct. More precisely, if the size of the assembly position setting information Cji, the size of the X-direction component of the assembly position setting information Cji, or the size of the Y-direction component of the assembly position setting information Cji exceeds a predetermined reference value that is set in advance, the arithmetic device 43 determines that the lot 3 is printed in a position that deviates significantly and has poor print quality. In this case, the arithmetic device 43 outputs the "printing error signal" to the component assembly machine 22.

[0082] If the respective assembly position setting information Cji is suitable, the arithmetic device 43 shifts the ideal plumb line inspection reference information Krh (ideal plumb line inspection window) by the assembly position setting information Cji to generate actual inspection reference information Kjh. According to the embodiment, the arithmetic device 43 generates an inspection window (actual plumb line inspection window) as actual inspection reference information Kjh by shifting the ideal plumb line inspection reference information Krh (ideal plumb line inspection window) by the assembly position setting information Cji.The actual plumb line inspection window has center coordinates identical to coordinates determined by shifting the center coordinates of the ideal plumb line inspection window by the mounting position setting information Cji, and has a shape identical to the shape of the ideal plumb line inspection window. The actual inspection reference information Kjh is generally generated for each plumb line group 5.

[0083] The arithmetic device 43 then determines an investigation standard for each of the solder groups 5. If the curing temperature of the adhesive 6, obtained by the information acquisition unit 48, is higher than the melting temperature of the solder 3, the arithmetic device 43, more precisely, sets the actual investigation reference information Kjh as the investigation standard of the solder group 5.

[0084] If the curing temperature of the adhesive 6, obtained by the information acquisition unit 48, is lower than the melting temperature of the solder 3, and the electronic component corresponding to solder group 5 as the object of investigation is to be fixed by the adhesive 6, then the arithmetic device 43 sets the ideal solder investigation reference information Krh (ideal solder investigation window) as the investigation standard of solder group 5. Conversely, if the curing temperature of the adhesive 6, obtained by the information acquisition unit 48, is lower than the melting temperature of the solder 3, but the electronic component 4 corresponding to solder group 5 as the object of investigation is not to be fixed by the adhesive 6, then the arithmetic device 43 sets the actual investigation reference information Kjh as the investigation standard of solder group 5.

[0085] The arithmetic device 43 then uses the actual investigation reference information Kjh or the ideal solder investigation reference information Krh to investigate a particular solder group 5. If the curing temperature of the adhesive 6 is higher than the melting temperature of the solder 3, or if the curing temperature of the adhesive 6 is lower than the melting temperature of the solder 3, but the electronic component 4 to be mounted on the solder group 5 is not expected to be fixed by the adhesive 6, the arithmetic device 43 uses the actual investigation reference information Kjh (actual solder investigation window) to investigate the solder group 5.The arithmetic device 43 examines the plumb line group 5 more precisely by determining whether a proportion of an area occupied by an area other than the actual plumb line area Ajh exceeds a predetermined reference value in the actual investigation reference information Kjh (actual plumb line investigation window), which is set in advance.

[0086] If the curing temperature of the adhesive 6 is lower than the melting temperature of the solder 3, and the electronic component 4, which is to be mounted on the solder group 5, is expected to be fixed by the adhesive 6, the arithmetic device 43 uses the ideal solder examination reference information Krh (ideal solder examination window) to examine the solder group 5. More precisely, the arithmetic device 43 examines the solder group 5 by determining whether a fraction of an area occupied by a region other than the actual solder area Ajh exceeds a predetermined reference value in the ideal solder examination reference information Krh (ideal solder examination window).

[0087] If all the respective solders 3 on the substrate 1 do not meet the determination condition described above, the arithmetic device 43 determines that each of the solder groups 5 on the substrate 1 has a “good” print quality.

[0088] If at least one lot 3 meets the determination condition described above, the arithmetic device 43 determines, on the other hand, that the lot group 5 on the substrate 1 has a “poor” print quality and outputs the “print error signal” to the component assembly machine 22.

[0089] If the print quality of the solders 3 is determined to be "good print quality", the arithmetic device 43 determines that the substrate 1 is a "non-defective product". The arithmetic device 43 (more precisely, the assembly position setting information output unit 49) then outputs several assembly position setting information Cji or the non-setting signal, which is set with respect to a respective solder group 5, to the component assembly machine 22.

[0090] The component assembly machine 22 is described below. If the assembly position setting information Cji or the non-setting signal is entered after completion of the inspection process by the solder pressure inspection device 21, that is, if it is determined that the substrate is a “non-defective product”, the component assembly machine 22 mounts the electronic component 4 onto the substrate 1.

[0091] When the mounting position setting information Cji is entered with respect to a specific electronic component 4, the component assembly machine 22 mounts this electronic component 4 onto the solder group 5 such that the center of the electronic component 4 is positioned in a location that is offset by this entered mounting position setting information Cji relative to the mounting position information (ideal mounting position information) of the electronic component 4 in the design data or in the manufacturing data that is entered in advance. This causes the electronic component 4 to be mounted at the actual printing position of the solder group 5.

[0092] On the other hand, if the non-adjustment signal is input with respect to a specific electronic component 4, the component assembly machine 22 mounts this electronic component 4 onto the solder group such that the center of the electronic component 4 is located in a position specified by the ideal mounting position information of the electronic component 4. This causes the electronic component 4 to be mounted at the ideal pressure position of the solder group 5.

[0093] When the “print error signal” is input from the arithmetic device 43, the component assembly machine 22 conveys the substrate 1 to a hopper or container for defective products (not shown) without mounting the electronic component 4 on the substrate 1.

[0094] The following section describes in more detail the testing process carried out by the solder pressure testing device 21 with reference to the flowcharts of the Fig. 6 to 8 and further drawings are described. In the Fig. Figures 9 to 17 show the standard of investigation, for example, of the plumb line search area and the actual investigation reference information Kjh (actual plumb line investigation window) with a thick line.

[0095] For illustrative purposes, the investigation process described below concerns a solder group 5a1 consisting of solders 3a1 and 3a2 printed on electrode patterns 2a1 and 2a2, and a solder group 5a2 consisting of solders 3a3 and 3a4 printed on electrode patterns 2a3 and 2a4 (as shown in each case in Fig. 9 is shown). A similar investigation process is carried out for the other lot groups 5.

[0096] Solders 3a1 and 3a2 are identical in size, and solders 3a3 and 3a4 are also identical in size. Solders 3a1 and 3a2 are larger than solders 3a3 and 3a4. A relatively large electronic component 4 is mounted on solders 3a1 and 3a2, whereas a relatively small electronic component 4 is mounted on solders 3a3 and 3a4. The electronic component 4 mounted on solders 3a1 and 3a2 is fixed by the adhesive 6, whereas the electronic component 4 mounted on solders 3a3 and 3a4 is not fixed by the adhesive 6.

[0097] It is assumed that the solders 3a1, 3a2, 3a3, and 3a4 are printed with a deviation of 1 mm in the X-axis direction and 1 mm in the Y-axis direction from the corresponding electrode patterns 2a1, 2a2, 2a3, and 2a4. It is also assumed that the solders 3a1, 3a2, 3a3, and 3a4 are printed with substantially ideal sizes (dimensions). Furthermore, it is assumed that the adhesive 6a is applied in an ideal position with an ideal size. These numerical values ​​are only examples.

[0098] The investigation process first performs an extraction generation process in step S11, as described in Fig. 6 is shown.

[0099] The first extraction generation process generates the ideal plumb position information Prh based on the design data or similar in step S31, as described in Fig. Figure 7 shows that, according to the embodiment, the first extraction generation process generates a center point (Lx1, Ly1) of the center coordinates of an ideal plumb line area Arh1 with respect to the plumb line 3a1 in the design or manufacturing data, and center coordinates of an ideal plumb line area Arh2 with respect to the plumb line 3a2 in the design or manufacturing data as ideal plumb position information Prh1. The first extraction generation process also generates a center point (Lx2, Ly2) of the center coordinates of an ideal plumb line area Arh3 with respect to the plumb line 3a3 in the design or manufacturing data, and center coordinates of an ideal plumb line area Arh4 with respect to the plumb line 3a4 in the design or manufacturing data as ideal plumb position information Prh2 (each in Fig. 10 shown).

[0100] In step S32, the first extraction generation process then extracts the respective surface areas covered by the respective perpendiculars 3a1, 3a2, 3a3 and 3a4 on the substrate 1, based on the image data acquired by the CCD camera 33. Information regarding the extracted surface areas is stored in the storage device 42.

[0101] In step S33, the first extraction generation process then sets up perpendicular search areas SA1, SA2, SA3, and SA4, each of which has center coordinates identical to the center coordinates of the ideal perpendicular areas Arh1, Arh2, Arh3, and Arh4, and slightly larger than the ideal perpendicular areas Arh1, Arh2, Arh3, and Arh4 (as shown in Fig. 11 is shown).

[0102] According to Fig. 6. Following the initial extraction generation process, the investigation process in step S12 determines whether the print quality of the solder 3 exhibits any significant defects. More specifically, the investigation process determines whether a surface area of ​​each solder 3a1, 3a2, 3a3, and 3a4, located within the solder search areas SA1, SA2, SA3, and SA4, occupies a predetermined or larger proportion of the area of ​​the respective solder search area SA1, SA2, SA3, or SA4. The investigation process also determines whether there are multiple surface areas of the solder 3 that each occupy predetermined or larger areas (for example, 20% of the area of ​​the solder search area SA1, SA2, SA3, or SA4) within the solder search area SA1, SA2, SA3, or SA4.

[0103] If the proportion of the area of ​​the respective solders 3a1, 3a2, 3a3 and 3a4 within the area of ​​the solder search area SA1, SA2, SA3 or SA4 is smaller than the predetermined proportion, or if several area regions of solders 3a1, 3a2, 3a3 or 3a4, each exhibiting the predetermined or larger areas, are present in the solder search area SA1, SA2, SA3 or SA4 (step S12: Yes), the investigation process proceeds to S20. In step S20, the investigation process then outputs the "print error signal" to the component assembly machine 22 and is then terminated.

[0104] If the area of ​​the respective perpendiculars 3a1, 3a2, 3a3 and 3a4 occupies the predetermined or larger proportion of the area of ​​the respective perpendicular search areas SA1, SA2, SA3 or SA4 and several area of ​​the perpendicular 3a1, 3a2, 3a3 or 3a4, which each have the predetermined or larger areas, are not present in the perpendicular search area SA1, SA2, SA3 or SA4 (step S12: No), the investigation process, on the other hand, proceeds to a second extraction generation process in step S13.

[0105] The following describes the second extraction generation process of step S13. As it is in Fig. As shown in Figure 8, the second extraction generation process first extracts the solders 3a1, 3a2, 3a3 and 3a4, which are present in the solder search areas SA1, SA2, SA3 and SA4, as solder points or spots K1, K2, K3 and K4 (areas defined by oblique lines in Figure 8). Fig. 12 are shown) (as it is in Fig. 12 is shown).

[0106] Following step S51, the second extraction generation process extracts the actual solder areas Ajh in step S52. More precisely, the second extraction generation process extracts solder areas associated with the extracted solder points K1, K2, K3, and K4, as actual solder areas Ajh1, Ajh2, Ajh3, and Ajh4 (areas defined by the dotted pattern in Fig. 13 are shown) (as it is in Fig. 13 is shown).

[0107] In step S53, the second extraction generation process then generates the actual perpendicular position information Pjh. According to the embodiment, the second extraction generation process generates a midpoint (x1, y1) of the center-of-mass coordinates of the actual perpendicular range Ajh1 and center-of-mass coordinates of the actual perpendicular range Ajh2 as actual perpendicular position information Pjh1. The second extraction generation process also generates a midpoint (x2, y2) of the center-of-mass coordinates of the actual perpendicular range Ajh3 and the center-of-mass coordinates of the actual perpendicular range Ajh4 as actual perpendicular position information Pjh2 (each in Fig. 13 shown).

[0108] In the subsequent step S54, the second extraction generation process generates the ideal perpendicular datum information Krh (ideal perpendicular datum windows). According to the embodiment, the second extraction generation process generates ideal perpendicular datum windows, each with shapes similar to those of the ideal perpendicular regions Arh1, Arh2, Arh3, and Arh4, slightly larger than the ideal perpendicular regions Arh1, Arh2, Arh3, and Arh4, and each with center coordinates identical to the respective centroid coordinates of the ideal perpendicular regions Arh1, Arh2, Arh3, and Arh4, as ideal perpendicular datum information Krh1, Krh2, Krh3, and Krh4 (as it Fig. 14 is shown).

[0109] In step S55, the second extraction generation process then generates the assembly position setting information Cji. More precisely, the second extraction generation process generates vector information [=(Px1, Py1)] based on the actual plumb position information Pjh1 [=(x1, y1)] generated in step S53 and the ideal plumb position information Prh1 [=(Lx1, Ly1)] generated in step S31, as assembly position setting information Cji1. The second extraction generation process also generates vector information [=(Px2, Py2)] based on the actual plumb position information Pjh2 [=(x2, y2)] and the ideal plumb position information Prh2 [=(Lx2, Ly2)] as assembly position setting information Cji2 (each in Fig. 15 shown).

[0110] According to Fig. 6. Following the second extraction generation process, the investigation process in step S14 determines whether the generated assembly position setting information Cji1 and Cji2 is suitable. The investigation process checks, for example, the size or similar aspects of the assembly position setting information Cji1 and Cji2. If any part of the assembly position setting information Cji1 and Cji2 is unsuitable (step S14: No), the investigation process outputs the "print error signal" in step S20 and then terminates.

[0111] If both assembly position setting information Cji1 and Cji2 are suitable (step S14: Yes), the investigation process proceeds to step S15 to generate the actual investigation reference information Kjh. According to the embodiment, the investigation process generates actual plumb investigation windows obtained by shifting the respective ideal plumb investigation reference information Krh1 and Krh2 (ideal plumb investigation windows) around the assembly position setting information Cji1, as actual investigation reference information Kjh1 and Kjh2. Furthermore, the investigation process generates actual plumb investigation windows obtained by shifting the respective ideal plumb investigation reference information Krh3 and Krh4 (ideal plumb investigation windows) around the assembly position setting information Cji2, as actual investigation reference information Kjh3 and Kjh4 (each in Fig. 16 shown).

[0112] In step S16, the investigation process then determines, based on the information obtained by the information acquisition unit 48, whether the curing temperature of the adhesive 6 is higher than the melting temperature of the solder 3.

[0113] If the curing temperature of the adhesive 6 is higher than the melting temperature of the solder 3 (step S16: Yes), the testing process proceeds to step S17 to set the actual testing reference information Kjh as the testing standard for solder group 5. According to the embodiment, the testing process sets the actual testing reference information Kjh1 and Kjh2 as the testing standard for solder group 5a1, and sets the actual testing reference information Kjh3 and Kjh4 as the testing standard for solder group 5a2.

[0114] If the curing temperature of the adhesive 6 is lower than the melting temperature of the solder 3 (step S16: No), the testing process proceeds to step S18 to set the ideal solder testing reference information Krh as the testing standard for solder group 5 corresponding to the electronic component 4 to be fixed by the adhesive 6, and to set the actual testing reference information Kjh as the testing standard for solder group 5 corresponding to the electronic component 4 that is not to be fixed by the adhesive 6. According to the embodiment, the respective ideal solder testing reference information Krh1 and Krh2 are set as the testing standard for solder group 5a1, and the respective actual testing reference information Kjh3 and Kjh4 are set as the testing standard for solder group 5a2.According to the embodiment, the answer in step S16 is no if the curing temperature of the adhesive 6 is equal to the melting temperature of the solder 3. According to a modification, the answer in step S16 is yes if the curing temperature of the adhesive 6 is equal to the melting temperature of the solder 3.

[0115] In step S19 following either step S17 or step S18, the investigation process uses the investigation standard, which is either the actual investigation reference information Kjh or the ideal plumb investigation reference information Krh, to determine whether the actual plumb ranges Ajh are suitable.

[0116] If, according to the embodiment, the curing temperature of the adhesive 6 is higher than the melting temperature of the solder 3, the testing process determines whether the proportion of an area occupied by an area other than the actual solder area Ajh1, Ajh2, Ajh3 or Ajh4 exceeds a reference value preset (as it is Fig. 17 is shown).

[0117] If the proportion of the area occupied by an area other than the actual solder area Ajh1, Ajh2, Ajh3 or Ajh4 in the corresponding part of the actual investigation reference information Kjh1, Kjh2, Kjh3 or Kjh4 is equal to or less than the reference value above (step S19: Yes), the investigation process determines the print qualities of the solder groups 5a1 and 5a2 as "good print quality" and is then terminated.

[0118] If at least one of the actual solder areas Ajh1, Ajh2, Ajh3 and Ajh4 does not meet the determination condition described above (step S19: No), the investigation process, in contrast, outputs the “print error signal” to the component assembly machine 22 in step S20 and is then terminated.

[0119] If the curing temperature of the adhesive 6 is lower than the melting temperature of the solder 3, the inspection process determines whether the proportion of an area occupied by an area other than the actual solder area Ajh1, Ajh2 exceeds a preset reference value in the corresponding ideal solder inspection reference information Krh1 or Krh2 (ideal solder inspection window), and also determines whether the proportion of an area occupied by an area other than the actual solder area Ajh3 or Ajh4 exceeds a preset reference value in the corresponding actual inspection reference information Kjh3 or Kjh4 (actual solder inspection window) (as specified in Fig. 18 is shown).

[0120] If the proportion of the area occupied by an area other than the actual solder area Ajh1 or Ajh2 in the corresponding ideal solder investigation reference information Krh1 or Krh2 is equal to or less than the reference value above, and if the proportion of the area occupied by an area other than the actual solder area Ajh3 or Ajh4 in the corresponding actual investigation reference information Kjh3 or Kjh4 is equal to or less than the reference value above (step S19: Yes), the investigation process determines the respective print qualities of the solder groups 5a1 and 5a2 as "good print quality" and is then terminated.

[0121] If at least one of the actual solder areas Ajh1, Ajh2, Ajh3 and Ajh4 does not meet the determination condition described above (step S19: No), the investigation process, in contrast, outputs the “print error signal” to the component assembly machine 22 in step S20 and is then terminated.

[0122] The sequence of testing procedures described above is then performed for a different lot group 5 than lot groups 5a1 and 5a2. If the print quality of all lot groups 5 is determined to be "good print quality", substrate 1 is determined to be a "non-defective product".

[0123] Based on the above, if the curing temperature of the adhesive 6 is higher than the melting temperature of the solder 3, the control device 41 (more precisely, the assembly position setting information output unit 49) outputs several assembly position setting information Cji, set for the respective solder groups 5, to the component assembly machine 22. Conversely, if the curing temperature of the adhesive 6 is lower than the melting temperature of the solder 3, the control device 41 (more precisely, the assembly position setting information output unit 49) outputs the non-setting signal for the electronic component 4 to be fixed by the adhesive 6 and outputs the assembly position setting information Cji for the electronic component 4 that is not to be fixed by the adhesive 6 to the component assembly machine 22.

[0124] In response to the input of the assembly position setting information Cji or the non-setting signal, the component assembly machine 22 mounts the electronic component 4 at a position determined by shifting the ideal assembly position information by the assembly position setting information Cji, or at a position specified by the ideal assembly position information.

[0125] If the print quality of any of the solder groups 5 is determined to be "poor print quality", the substrate 1 is, conversely, determined to be a "defective product". In this case, neither the mounting position setting information Cji nor the non-setting signal is output to the component assembly machine 22. Accordingly, no electronic component 4 is mounted on the substrate 1.

[0126] The substrate 1 with the electronic components 4 mounted on it by the component assembly machine 22 is fed to the reflow device 15 as described above.

[0127] If the curing temperature of the adhesive 6 is higher than the melting temperature of the solder 3, a self-aligning effect is exerted in a reflow process. As described in Fig. As shown in Figure 19, this results in the solder 3 being positioned on the electrode pattern 2 and the electrode section 7 being positioned appropriately. As a result, the electronic component 4 is positioned appropriately (not in Fig. 19 or Fig. 20 shown).

[0128] If the curing temperature of the adhesive 6 is lower than the melting temperature of the solder 3, the self-aligning effect will not be exerted, or will be very unlikely, in the reflow process for the electronic component 4 to be fixed by the adhesive 6, or for the solder group 5 corresponding to this electronic component 4. As described in Fig.As shown in Figure 20, the solder 3 corresponding to the electronic component 4, which is to be fixed by the adhesive 6, is moved only slightly or hardly at all, whereas the solder 3 corresponding to the electronic component 4 that is not to be fixed by the adhesive 6 is moved. As a result, the electronic component 4, which is mounted in the position specified by the ideal mounting position information and which is to be fixed by the adhesive 6, is held in the appropriate position even after the reflow process. The electronic component 4, which is mounted in the position determined by shifting the ideal mounting position information by the mounting position setting information and which is not to be fixed by the adhesive 6, is, on the other hand, positioned appropriately in conjunction with the movement of the solder 3.

[0129] As described in detail above, according to the embodiment, if the curing temperature of the adhesive 6, which is used to fix an electronic component 4 corresponding to a solder group 5 that is an object of investigation, obtained by the information acquisition unit 48, is higher than the melting temperature of the solders 3 contained in the solder group 5, an investigation of the respective solders 3 contained in the solder group 5 is carried out on the basis of the actual investigation reference information Kjh, which is obtained by shifting the ideal solder investigation reference information Krh around the assembly position setting information Cji.In other words, provided that the self-aligning effect is applied, the reference position for the examination of a respective electronic component 4 (a respective solder group 5) is changed based on the positions of the solders 3 that were actually printed, and an examination of the respective solders 3 is carried out based on this changed reference position. This configuration accordingly enables a suitable examination of the print quality of the solders 3, taking into account the application of the self-aligning effect.

[0130] If the curing temperature of the adhesive 6, which is used to fix the electronic component 4 corresponding to the solder group 5 that is the object of investigation, as obtained by the information acquisition unit 48, is lower than the melting temperature of the solders 3 contained in the solder group 5, then, on the other hand, an investigation of the respective solders 3 contained in the solder group 5 is carried out based on the ideal solder investigation reference information Krh. In other words, provided that the self-alignment effect is not or is unlikely to occur, an investigation of the respective solders 3 is carried out based on the positions and areas of the respective solders 3 in the design data or manufacturing data (ideal positions and ideal areas of the respective solders 3 on a finally produced substrate 1).This configuration therefore allows for a suitable investigation of the printing quality of the solders 3, taking into account a lack of or unlikely exercise of the self-aligning effect.

[0131] As described above, the configuration of this embodiment allows for a suitable examination of the printing quality of the solders 3 both when the self-aligning effect is exerted and when the self-aligning effect is not exerted (or is unlikely to be exerted). As a result, this configuration prevents the electronic components 4 from being mounted on the substrate 1 on which the solders 3 are not printed appropriately or correctly, thereby increasing the yield and preventing an increase in manufacturing costs.

[0132] If the curing temperature of the adhesive 6 is higher than the melting temperature of the solder 3, the assembly position setting information Cji is output to the component assembly machine 22. This configuration allows the electronic component 4 to be positioned according to its self-alignment effect, resulting in more reliable assembly of the electronic component 4 in a suitable position. This configuration utilizes information generated during the investigation process for the assembly process. Consequently, there is no need to perform a sequence of processes similar to those in the investigation process in a duplicated or redundant manner during the assembly process. This improves manufacturing efficiency.

[0133] If the curing temperature of the adhesive 6 is lower than the melting temperature of the solder 3, the electronic component 4, which is to be fixed by the adhesive 6, is mounted in a position specified by the ideal mounting position information. Accordingly, this configuration allows the electronic component 4 to be positioned appropriately from the outset, taking into account that the self-aligning effect is either not exerted or is unlikely to be exerted, and that the electronic component 4 is moved only minimally or with great difficulty.

[0134] If the electronic component 4 cannot be fixed by the adhesive 6, the mounting position setting information Cji is output to the component assembly machine 22 as information concerning the mounting position of the electronic component 4, independent of the curing temperature of the adhesive 6. In other words, the mounting position setting information Cji is output with respect to the electronic component 4, which is movable due to its self-aligning effect. This configuration therefore allows the electronic component 4 to be positioned according to its self-aligning effect, and enables more reliable mounting of the electronic component 4 in a suitable position.

[0135] The present invention is not limited to the description of the embodiment above, but can, for example, be implemented by the configurations described below. The present invention can, of course, be implemented by other applications and modifications than those shown below.

[0136] (a) According to the embodiment described above, the respective coordinate information of each plumb group 5 is generated as ideal plumb position information Prh and as actual plumb position information Pjh. According to a modification, coordinate information of each plumb line 3 contained in each plumb group 5 can be generated as ideal plumb position information Prh and as actual plumb position information Pjh. For example, center of gravity coordinates of each plumb line 3 in the data can be generated as ideal plumb position information Prh, and center of gravity coordinates of each plumb line 3 that were actually printed can be generated as actual plumb position information Pjh. The type of ideal plumb position information need not be identical to the type of actual plumb position information.

[0137] If multiple coordinate information is generated as ideal plumb position information Prh and as actual plumb position information Pjh, similar to the modification above, the ideal plumb line investigation reference information Krh, the assembly position adjustment information Cji, and the actual investigation reference information Kjh can also be suitably modified. For example, coordinates identical to the center-of-mass coordinates of the ideal plumb line range Arh can be generated as ideal plumb line investigation reference information Krh. Vector information [=(Qx, Qy)] can, for example, be generated as assembly position adjustment information Cji with respect to each of the plumb line groups 5.This vector information can, for example, consist of an average (Qx) of the magnitudes of a position misalignment Δx along the X-axis and an average (Qy) of the magnitudes of a position misalignment Δy along the Y-axis of the actual plumb position information Pjh relative to the ideal plumb position information Prh. Furthermore, coordinates obtained by shifting the ideal plumb line reference information Krh (coordinate information) by the vector information can be generated as actual reference information Kjh.

[0138] A modified procedure for examining the print quality of plumb line 5 can determine whether the print quality of plumb line 5 is good or poor by assessing whether the respective absolute values ​​of position misalignment magnitudes along the X-axis and Y-axis of the actual plumb line position information Pjh, relative to the actual test reference information Kjh or relative to the ideal plumb line test reference information Krh, lie within predetermined reference values. More precisely, if the respective values ​​of a position misalignment are equal to or less than the respective reference values ​​of the respective plumb lines 3 contained in plumb line 5, the print quality of plumb line 5 can be determined as "good print quality".If at least one of the respective quantities of a position misalignment is greater than the corresponding reference value of at least one of the plumb lines 3 contained in plumb line group 5, the print quality of plumb line group 5 can be determined as "poor print quality".

[0139] (b) According to the embodiment described above, the inspection process is carried out for all solder groups 5. According to a modification, the inspection process can be carried out only for a predetermined solder group 5, which is selected by an operator or similar. This simplifies the inspection process and improves manufacturing efficiency. In this modification, an average of the assembly position setting information Cji for one solder group 5 as the object of investigation can be used as the assembly position setting information Cji for other solder groups 5.

[0140] (c) According to the embodiment described above, the vector information is generated as mounting position setting information Cji. For example, if the curing temperature of the adhesive 6 is higher than the melting temperature of the solder 3, the electronic component 4 is mounted at the position determined by shifting the ideal mounting position information by this vector information. In other words, the electronic component 4 is mounted at the position determined by shifting the ideal mounting position information in the X-axis and Y-axis directions. According to a modification, rotation angle information can be generated as mounting position setting information Cji.For example, a range of coordinates specifying the ideal plumb range Arh can be set to the ideal plumb position information Prh, and a range of coordinates specifying the actual plumb range Ajh can be set to the actual plumb position information Pjh. The magnitude and direction of a rotation of the actual plumb position information Pjh around the center of electronic component 4 in the data, as a center of rotation relative to the ideal plumb position information Prh, can be generated as mounting position setting information Cji. The mounting position of electronic component 4 can be set based on the magnitude and direction of this rotation. According to another modification, the mounting position setting information Cji can include both the vector information and the information regarding the magnitude and direction of the rotation.

[0141] (d) The above embodiment determines the good / poor print quality of each plumb group 5 by determining whether the proportion of the area occupied by the area other than the actual plumb area Ajh exceeds a predetermined reference value relative to the actual inspection reference information Kjh (actual plumb inspection window) or relative to the ideal plumb inspection reference information Krh (ideal plumb inspection window). A modification may determine the good / poor print quality of each plumb group 5 by determining whether the magnitude of a positional misalignment of the center-of-mass coordinates of the actual plumb area Ajh relative to the center coordinates of the actual inspection reference information Kjh (actual plumb inspection window) or relative to the ideal plumb inspection reference information Krh (ideal plumb inspection window) exceeds a predetermined reference value.Another modification can determine the good / poor print quality of each solder group based on a match ratio of the actual solder area Ajh with respect to the actual investigation reference information Kjh (actual solder investigation window) or with respect to the ideal solder investigation reference information Krh (ideal solder investigation window).

[0142] (e) At the time the “printing defect signal” is issued, the inspection process carried out by the solder printing inspection device 21 can be skipped and terminated with respect to uninspected solder groups 5, although this is not specifically described in the embodiment above. This modification prevents the continuation of the inspection process with respect to the substrate 1, which is a defective product, and thereby improves inspection efficiency.

[0143] (f) According to the embodiment described above, the ideal plumb line reference information Krh and the actual plumb line reference information Kjh are set to be larger than the ideal plumb line range Arh. According to a modification, the ideal plumb line reference information Krh and the actual plumb line reference information Kjh can be set to be the same size as the ideal plumb line range Arh.

[0144] (g) The above embodiment generates the ideal solder area Arh and then generates the ideal solder position information Prh based on the ideal solder area Arh. A modification can generate the ideal solder position information Prh directly from the design data or the manufacturing data without generating the ideal solder area Arh.

[0145] (h) The above embodiment generates the ideal solder inspection reference information Krh based on the ideal solder area Arh. A modification can pre-store information relating to an inspection reference position and an inspection reference area in the form of design data or manufacturing data in the storage device 42 and generate the ideal solder inspection reference information Krh based on the stored information.

[0146] (i) If the “printing error signal” is output during the process of examining multiple solder groups 5, it is possible that a metal screen may be positioned in a location that deviates from the substrate, although this is not specifically described in the embodiment above. With a view to correcting such a positional misalignment of the metal screen, a modification can adjust the solder printing position by the manufacturing system 11 based on the assembly position setting information generated with respect to the respective solder group 5 (i.e., it can move the metal screen).

[0147] (j) According to the embodiment described above, the information acquisition unit 48 is designed to receive input information regarding the curing temperature of the adhesive 6 via the input device 5 and thereby obtain the information regarding the curing temperature of the adhesive 6. According to a modification, the information regarding the curing temperature of the adhesive 6 can be contained in the manufacturing or design data. The information acquisition unit 48 can be designed to obtain the information regarding the curing temperature of the adhesive 6 from the manufacturing data or similar sources. For example, CAD data, which are design data of the substrate 1, can contain the information regarding the curing temperature of the adhesive 6.

[0148] According to another modification, information relating to the curing temperatures of several different types of adhesives 6 can be stored in advance in the storage device 42, and the arithmetic device 43 can be configured to receive input information relating to the type of adhesive 6 from the input device 50. In this modification, the information acquisition unit 48 can be configured to obtain the information relating to the curing temperature of the adhesive 6 from the storage device 42 based on the input information relating to the type of adhesive 6.

[0149] (h) According to the embodiment described above, identical types of solders 3 and identical types of adhesives 6 are arranged on the substrate 1. According to a modification, different types of solders 3 and different types of adhesives 6 can be arranged on the substrate 1. Reference symbol list 1 printed circuit board (substrate) 2, 2a1, 2a2, 2a3, 2a4 electrode pattern 3, 3a1, 3a2, 3a3, 3a4 solder paste (solder) 4 electronic components 5, 5a1, 5a2 Lot group 6, 6a Adhesives 7 Electrode section 11 Manufacturing system 12 Solder printing device (solder printing machine) 13 Adhesive application device 14-component assembly system 15 Reflow device 16 Component assembly condition inspection device 21 Solder pressure testing device 22 Component assembly machine 31 Assembly table 32 Lighting device (irradiation unit) 33 CCD camera (imaging unit) 34, 35 Electric motor 41 Control device 42 Storage device 43 Arithmetic device 44 Ideal plumb line analysis reference information generation unit 45 Image processing unit (Actual plumb position information generation unit) 46 Ideal plumb line analysis reference information generation unit 47 Assembly position setting information generation unit 48 Information Acquisition Unit (Adhesive Information Acquisition Unit) 49 Assembly position setting information output unit Ajh, Ajh1, Ajh2, Ajh3, Ajh4 actual plumb line Arh, Arh1, Arh2, Arh3, Arh4 ideal plumb line Ars ideal adhesive range Cji Mounting Position Adjustment Information Kjh, Kjh1, Kjh2, Kjh3, Kjh4 actual examination reference information Krh, Krh1, Krh2, Krh3, Krh4 ideal plumb inspection reference information Pjh, Pjh1, Pjh2 actual plumb position information Prh, Prh1, Prh2 ideal plumb position information SA1, SA2, SA3, SA4 Lotsuchbereich

Claims

[1] Solder printing testing device (21) arranged upstream of a component assembly machine (22) used to mount an electronic component (4) on a solder (3, 3a1, 3a2, 3a3, 3a4) printed onto a substrate (1) by a solder printing machine (12), and designed to test the solder (3, 3a1, 3a2, 3a3, 3a4) on the substrate (1) on which a thermosetting adhesive (6, 6a) is applied, wherein the solder printing testing device (21) comprises: an irradiation unit (32) designed to irradiate at least the plumb line (3, 3a1, 3a2, 3a3, 3a4) with light; an imaging unit (33) designed to capture an image of at least the perpendicular (3, 3a1, 3a2, 3a3, 3a4) illuminated by the light; an actual plumb position information generation unit (45) designed to generate actual plumb position information (Pjh, Pjh1, Pjh2), which is position information of a plumb group (5, 5a1, 5a2) containing two or more plumb bobs (3, 3a1, 3a2, 3a3, 3a4) and on which the electronic component (4) is mounted, based on image data acquired by the imaging unit (33); an ideal solder inspection reference information generation unit (46) designed to generate ideal solder inspection reference information (Krh, Krh1, Krh2, Krh3, Krh4) specifying a reference inspection position and / or reference inspection area of ​​the solder (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2) based on design data or manufacturing data; an assembly position setting information output unit (49) designed to output assembly position setting information (Cji) to the component assembly machine (22), wherein the assembly position setting information (Cji) is information that specifies the magnitude and direction of a position misalignment of expected assembly position information, which specifies an expected assembly position of the electronic component (4), relative to ideal assembly position information, which specifies an ideal assembly position of the electronic component (4), and is based on the magnitude and direction of a position misalignment of the actual solder position information (Pjh, Pjh1, Pjh2) relative to ideal solder position information, which specifies a position of the solder group (5, 5a1, 5a2) in the design data or the manufacturing data; and an adhesive information acquisition unit designed to obtain information relating to a curing temperature of the adhesive (6, 6a), wherein If the curing temperature of the adhesive (6, 6a) used to fix the electronic component (4), corresponding to the solder group (5, 5a1, 5a2), which is a predetermined test object, as obtained by the adhesive information acquisition unit, is higher than a melting temperature of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2), an investigation of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2) is carried out based on actual test reference information (Kjh, Kjh1, Kjh2, Kjh3, Kjh4) obtained by shifting the ideal solder test reference information (Krh, Krh1, Krh2, Krh3, Krh4) by the assembly position setting information (Cji) regarding the plumb group (5, 5a1, 5a2) will be obtained,is carried out and the assembly position setting information (Cji) is output by the assembly position setting information output unit (49) to the component assembly machine (22), and, If the curing temperature of the adhesive (6, 6a) used to fix the electronic component (4), which corresponds to the solder group (5, 5a1, 5a2) that is the object of investigation, obtained by the adhesive information acquisition unit, is lower than the melting temperature of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2), an investigation of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2) is carried out on the basis of the ideal solder investigation reference information (Krh, Krh1, Krh2, Krh3, Krh4) with respect to the solder group (5, 5a1, 5a2). [2] Solder printing testing device (21) arranged upstream of a component assembly machine (22) used to mount an electronic component (4) on a solder (3, 3a1, 3a2, 3a3, 3a4) printed onto a substrate (1) by a solder printing machine (12), and designed to test the solder (3, 3a1, 3a2, 3a3, 3a4) on the substrate (1) on which a thermosetting adhesive (6, 6a) is applied, wherein the solder printing testing device (21) comprises: an irradiation unit (32) designed to irradiate at least the plumb line (3, 3a1, 3a2, 3a3, 3a4) with light; an imaging unit (33) designed to capture an image of at least the perpendicular (3, 3a1, 3a2, 3a3, 3a4) illuminated by the light; an actual plumb position information generation unit (45) designed to generate actual plumb position information (Pjh, Pjh1, Pjh2), which is position information of a plumb group (5, 5a1, 5a2) containing two or more plumb bobs (3, 3a1, 3a2, 3a3, 3a4) and on which the electronic component (4) is mounted, based on image data acquired by the imaging unit (33); an ideal solder inspection reference information generation unit (46) designed to generate ideal solder inspection reference information (Krh, Krh1, Krh2, Krh3, Krh4) specifying a reference inspection position and / or reference inspection area of ​​the solder (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2) based on design data or manufacturing data; an assembly position setting information output unit (49) designed to output assembly position setting information (Cji) to the component assembly machine (22), wherein the assembly position setting information (Cji) is information specifying a magnitude and direction of position misalignment of expected assembly position information, which specifies an expected assembly position of the electronic component (4), relative to ideal assembly position information, which specifies an ideal assembly position of the electronic component (4), and based on a magnitude and direction of position misalignment of the actual solder position information (Pjh, Pjh1, Pjh2) relative to ideal solder position information, which specifies a position of the solder group (5, 5a1, 5a2) in the design data or the manufacturing data; and an adhesive information acquisition unit designed to obtain information relating to a curing temperature of the adhesive (6, 6a), wherein If the curing temperature of the adhesive (6, 6a) used to fix the electronic component (4), corresponding to the solder group (5, 5a1, 5a2) that is a predetermined test object, obtained by the adhesive information acquisition unit, is higher than a melting temperature of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2), an investigation of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2) is carried out, at least on the basis of actual test reference information (Kjh, Kjh1, Kjh2, Kjh3, Kjh4) obtained by shifting the ideal solder test reference information (Krh, Krh1, Krh2, Krh3, Krh4). to obtain the assembly position setting information (Cji) regarding the plumb group (5, 5a1, 5a2),is carried out and the assembly position setting information (Cji) is output by the assembly position setting information output unit (49) to the component assembly machine (22). [3] Solder printing testing device (21) arranged upstream of a component assembly machine (22) used to mount an electronic component (4) on a solder (3, 3a1, 3a2, 3a3, 3a4) printed onto a substrate (1) by a solder printing machine (12), and designed to test the solder (3, 3a1, 3a2, 3a3, 3a4) on the substrate (1) on which a thermosetting adhesive (6, 6a) is applied, wherein the solder printing testing device (21) comprises: an irradiation unit (32) designed to irradiate at least the plumb line (3, 3a1, 3a2, 3a3, 3a4) with light; an imaging unit (33) designed to capture an image of at least the perpendicular (3, 3a1, 3a2, 3a3, 3a4) illuminated by the light; an actual plumb position information generation unit (45) designed to generate actual plumb position information (Pjh, Pjh1, Pjh2), which is position information of a plumb group (5, 5a1, 5a2) containing two or more plumb bobs (3, 3a1, 3a2, 3a3, 3a4) and on which the electronic component (4) is mounted, based on image data acquired by the imaging unit (33); an ideal solder inspection reference information generation unit (46) designed to generate ideal solder inspection reference information (Krh, Krh1, Krh2, Krh3, Krh4) specifying a reference inspection position and / or reference inspection area of ​​the solder (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2) based on design data or manufacturing data; an assembly position setting information output unit (49) designed to output assembly position setting information (Cji) to the component assembly machine (22), wherein the assembly position setting information (Cji) is information that specifies the magnitude and direction of a position misalignment of expected assembly position information, which specifies an expected assembly position of the electronic component (4), relative to ideal assembly position information, which specifies an ideal assembly position of the electronic component (4), and is based on the magnitude and direction of a position misalignment of the actual solder position information (Pjh, Pjh1, Pjh2) relative to ideal solder position information, which specifies a position of the solder group (5, 5a1, 5a2) in the design data or the manufacturing data; and an adhesive information acquisition unit designed to obtain information relating to a curing temperature of the adhesive (6, 6a), wherein If the curing temperature of the adhesive (6, 6a) used to fix the electronic component (4) corresponding to the solder group (5, 5a1, 5a2), which is a predetermined object of investigation, obtained by the adhesive information acquisition unit, is lower than a melting temperature of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2), an investigation of the respective solders (3, 3a1, 3a2, 3a3, 3a4) contained in the solder group (5, 5a1, 5a2) is carried out at least on the basis of the ideal solder investigation reference information (Krh, Krh1, Krh2, Krh3, Krh4) with respect to the solder group (5, 5a1, 5a2). [4] Solder pressure testing device (21) according to one of claims 1 to 3, wherein if the electronic component (4) corresponding to the solder group (5, 5a1, 5a2) which is the predetermined test object is not fixed by the adhesive (6, 6a), the assembly position setting information (Cji) regarding the solder group (5, 5a1, 5a2) is output to the component assembly machine (22) by the assembly position setting information output unit (49).

Images