COMPONENT ASSEMBLY SYSTEM AND ADHESIVE INSPECTION DEVICE

Abstract

A component mounting system (13) comprising a component mounting machine (42) for mounting an electronic component (5) having a predetermined electrode portion (6) onto a solder (4) printed on a substrate (2) and for fixing the electronic component (5) to the substrate (2) using a thermosetting adhesive (7), the component mounting system (13) comprising a solder inspection device (41), the solder inspection device (41) comprising: an illumination unit (52) for irradiating the plumb line (4) with a predetermined light; an imaging unit (53) for taking an image of at least the plumb line (4) irradiated with the light by the illumination unit (52); a three-dimensional measuring unit (64) for performing a three-dimensional measurement of the plumb line (4) based on the image captured by the imaging unit (53); a unit for determining the good / bad quality (66) of the solder (4) based on a result of the measurement by the three-dimensional measuring unit (64); and an information output unit (67) that outputs height-related information of the solder (4) in the height direction perpendicular to a side of the substrate (2) to which the adhesive (7) is applied, based on the result of the measurement by the three-dimensional measuring unit (64), wherein the component mounting machine (42) comprises a mounting height setting unit for setting at least a target mounting height of the electronic component (5) in the vertical height direction based on the information input from the output unit (67), and is configured to mount the electronic component (5) at the target mounting height set by the mounting height setting unit, with respect to the electronic component (5) to be fixed by the adhesive (7) which cures at a temperature lower than a melting temperature of the solder (4), the mounting height adjustment unit is designed to set the target mounting height to an ideal mounting height based on design data or to a height which is lower than the ideal mounting height by a value corresponding to a sinking of the electronic component (5) accompanying the melting of the solder (4), the component mounting system (13) further comprises an adhesive inspection device (41), the adhesive testing device (41) comprises: an adhesive height measuring unit for measuring a height of the adhesive (7) relative to the substrate (2); and a unit for determining the good / bad quality (66) of the adhesive (7) based on the height of the adhesive (7) measured by the adhesive height measuring unit, and when the adhesive (7) which is a determination target of the unit for determining the good / poor quality (66) of the adhesive (7) is specified as a determination target adhesive (7) and the electronic component (5) which is a mounting target to be mounted by the determination target adhesive (7) is specified as an electronic mounting target component (5), the adhesive (7) good / poor quality determining unit (66) determines whether a height of the determination target adhesive (7) is equal to a predetermined inspection reference height based on a target mounting height of the electronic mounting target component (5), regardless of an amount of the solder (4) on which the electronic mounting target component (5) is mounted, and thereby determines a good / poor quality of the determination target adhesive (7).

Description

Technical area

[0001] The present invention relates to a component mounting system for mounting an electronic component on a substrate such as a printed circuit board, and an adhesive inspecting apparatus for inspecting an adhesive applied to the substrate. background

[0002] A general method for mounting electronic components on a printed circuit board (PCB) first prints solder paste onto electrode patterns applied to the PCB. The method then applies a thermosetting adhesive to the PCB to prevent the electronic components from falling off, for example, when the PCB passes through a predetermined reflow oven. The adhesive is generally applied when electronic components are mounted on both sides of the PCB. After applying the adhesive, the method temporarily sticks the electronic components onto the PCB with the solder paste printed on it, taking advantage of the viscosity of the solder paste. In this state, the electronic components, which are mounting targets, are in contact with the adhesive through the adhesive.

[0003] After the electronic components are mounted, the circuit board is passed through a reflow oven to undergo a predetermined reflow soldering process. Generally, each electronic component has multiple electrode sections (electrodes and leads). Each electrode section is bonded to different portions of the solder paste. When the circuit board undergoes the reflow process, the adhesive cures, firmly securing the electronic components.

[0004] An inspection of the solder paste printing condition is performed in a step before the reflow process. A recently proposed component mounting system includes a solder inspection device for inspecting a solder paste and a component mounting machine for correcting mounting positions of individual electronic components based on information obtained by the solder inspection device (as described, for example, in JP 2006-313100 A).

[0005] In this component mounting system, the solder inspection device performs three-dimensional measurement of the solder paste and then performs inspection of the solder paste based on the measurement results. The solder paste's plane position information obtained by the three-dimensional measurement and position information in a height direction perpendicular to a predetermined inspection target side (for example, a side of the printed circuit board on which the solder paste is printed as an inspection target) are output from the solder inspection device to the component mounting machine. The component mounting machine corrects a mounting position of each electronic component based on the input information and then mounts the electronic component.For example, when an actual height of the actually printed solder paste is higher than an ideal height of the solder paste based on design data, the component placement machine mounts an electronic component at a position higher than the ideal mounting height of the electronic component based on the design data.

[0006] JP 2012-59814 A discloses a component placement system with a component placement machine for mounting an electronic component on a substrate printed with solder. The electronic component is attached to the substrate using a thermosetting adhesive that cures at a temperature lower than the melting temperature of the solder. To prevent soldering defects after the reflow process, the mounting height is adjusted to a target mounting height by controlled pressure of the adhesive and solder during component mounting.

[0007] JP 2006-313100 A discloses a component mounting system comprising a component mounting machine that mounts an electronic component on a substrate having a predetermined electrode portion with solder. The component mounting system further comprises a solder inspection device. The solder inspection device includes an illumination unit for irradiating the solder with a predetermined light, an imaging unit for capturing an image of the solder, a unit for three-dimensionally measuring the solder based on the captured image, wherein the quality of the solder is determined based on the three-dimensional measurement, and an output unit for outputting height information of the solder, wherein the mounting height is adjusted according to the measured solder height.

[0008] JP 2000 - 151 196 A discloses a component mounting system having a component mounting machine for mounting an electronic component on solder printed on a substrate, the component mounting system further comprising a solder inspection device comprising an illumination unit, an imaging unit, a unit for three-dimensionally measuring the solder, a unit for judging the measurement result, and an output unit for outputting the determined height information, wherein the component mounting height is adjusted according to the height information of the solder.

[0009] DE 11 2006 003 019 T5 discloses a placement system with a placement machine for assembling a printed circuit board with components, comprising a solder paste testing machine which comprises an illumination device for irradiating the solder paste deposits on the printed circuit board with predetermined light, an image acquisition system, a controller which performs calculations for determining the metrics such as size, height, shape and volume of the solder paste deposits, and a unit for creating and outputting the solder paste test results. Brief descriptionTechnical problem

[0010] However, if the adhesive has a curing temperature lower than the melting temperature of the solder paste, the adhesive will cure to secure the electronic component before the solder paste melts to wet and spread. Therefore, when the component mounting system described above corrects the mounting height of the electronic component according to a change in the solder paste height, curing of the adhesive will cause the electronic component to be mounted at a position of the corrected height. Such correction may cause the electronic component to be mounted at a position higher than an ideal mounting height. This is likely to protrude the electronic component from a normal placement position, causing a placement error.Furthermore, this is likely to result in the electrode portion of the electronic component being separated from the electrode pattern of the substrate, thus causing a soldering defect. The occurrence of a dimensional error or soldering defect leads to a reduction in yield.

[0011] Taking the above-described circumstances into account, it is an object of the present invention to provide a component mounting system and an adhesive inspection device with which a higher yield can be achieved. This object is achieved by a component mounting system having the features of claims 1, 2, 6, and 7, respectively, and by an adhesive inspection device having the features of claim 4. The dependent claims are directed to advantageous developments of the invention.

[0012] The “ideal mounting height based on design data” refers to a mounting height of an electronic component relative to a substrate that is set in advance in design data (the same applies below).

[0013] According to the invention, the component mounting machine includes the mounting height adjustment unit for adjusting the target mounting height of the electronic component based on the solder measurement result by the three-dimensional measuring unit. The component mounting machine is configured to mount the electronic component at the set target mounting height. This configuration therefore enables the electronic component to be arranged at an appropriate position according to the solder formation state. For example, this configuration enables the electronic component to be fixed with an adhesive that cures at a temperature higher than the melting temperature of the solder to be arranged at a mounting height corresponding to the actual solder height.

[0014] According to the present invention, the target mounting height of the electronic component to be fixed by the adhesive that cures at a temperature lower than the melting temperature of the solder is set to the ideal mounting height or the like, regardless of the amount (height) of the solder. When the adhesive cures to fix the electronic component before the solder melts, the electronic component is mounted at a usual mounting position (ideal mounting height) or at a position lower than this usual mounting position. This configuration thus more reliably prevents the electronic component from being mounted at a position protruding from the usual mounting position, thereby preventing the occurrence of a dimensional error.Furthermore, this configuration more effectively ensures electrical contact between electrode portions (including electrodes and leads arranged on solders) of the electronic component and electrodes (including electrode patterns and pads) on the substrate side, and more reliably prevents the occurrence of soldering defects, thereby increasing yield.

[0015] The target mounting height can be set to a height lower than the ideal mounting height by the amount corresponding to the sagging of the electronic component accompanied by solder melting. When the adhesive cures before the solder melts, such a setting allows the electronic component to be fixed by this curing adhesive at an appropriate position determined by considering the amount of sagging accompanied by solder melting. This configuration thus more effectively ensures electrical contact between the electrode portions of the electronic component and the electrodes on the substrate side, thereby further increasing yield.

[0016] The configuration of the present invention thus more reliably prevents the electronic component from being mounted at a position protruding from the usual placement position, thereby preventing the occurrence of a dimensional error. Furthermore, this configuration more effectively ensures electrical contact between electrode portions (including electrodes and leads disposed on solders) of the electronic component and electrodes (including electrode patterns and pads) on the substrate side, and more reliably prevents the occurrence of soldering defects. This increases yield.

[0017] The target mounting height can be set to a height lower than the ideal mounting height by the amount corresponding to the sagging of the electronic component accompanied by solder melting. If the adhesive cures before the solder melts, such a setting allows the electronic component to be fixed by the curing adhesive at a suitable position determined by considering the amount of sagging accompanied by solder melting. This configuration thus more effectively ensures electrical contact between the electrode portions of the electronic component and the electrodes on the substrate side, thereby further increasing yield.

[0018] The "inspection reference height" is based on an ideal mounting height of the electronic component set in the design data, or a height lower than the ideal mounting height by a value corresponding to the sagging of the electronic component accompanied by solder melting. In other words, the "inspection reference height" refers to a height at a location where the electronic component comes into contact with the adhesive when the electronic component is mounted at the target mounting height. The inspection reference height is generally not specified by an exact numerical value, but by a numerical range with a certain width, for example, a numerical range not less than a given lower limit, or a numerical range from a given lower limit to a given upper limit (the same applies below).

[0019] An inspection can be performed on the adhesive application state in a step before a reflow process. A technical concept of the component mounting system for correcting the mounting height of the electronic component according to the solder height can be applied to an adhesive inspection technique. Specifically, an applicable technique can change the inspection reference height used as an inspection reference for the adhesive height based on the amount (height) of solder and use the changed inspection reference height to inspect the adhesive height.

[0020] However, this inspection technique requires a higher inspection reference height setting when the solder quantity is large (when the solder height is high). Consequently, this likely increases the likelihood that the adhesive will be determined as bad due to insufficient height, even if there is no significant problem with the adhesive securing the electronic component or the like. This increases the likelihood that the adhesive, which is assumed to be good, will be determined as bad, and reduces the yield.

[0021] According to the present invention, however, an inspection of the determination target adhesive is performed by determining whether the height of the determination target adhesive is equal to the predetermined inspection reference height based on the target mounting height of the electronic component mounting target, regardless of the amount of solder. In other words, an inspection of the determination target adhesive is performed based on the inspection reference height, which does not change with a change in the amount (e.g., height) of solder. Therefore, compared with a configuration that changes the inspection reference height with a change in the amount (height) of solder, this configuration reduces the possibility of the adhesive being determined to be defective due to insufficient height even though there is no substantial problem with the electronic component mounting or the like by the adhesive.Thus, this configuration ensures a more accurate determination of the good quality of the adhesive, which is assumed to be determined as good, and thereby further increases the yield.

[0022] Furthermore, the inspection reference height is based on the target mounting height of the electronic mounting target component, so that the adhesive is inspected according to the mounting height of the electronic mounting target component. This configuration ensures more accurate determination of the good / poor quality of the adhesive.

[0023] According to a preferred embodiment, the inspection reference height is determined by considering a height difference between an electrode portion of the electronic mounting target component and a bottom surface of the electronic mounting target component. For example, the inspection reference height is determined based on a height difference between a location of the electrode portion that comes into contact with the solder and the bottom surface. Accordingly, this configuration enables a more accurate inspection to determine whether the determination target adhesive comes into contact with the bottom surface of the electronic mounting target component, that is, whether the electronic mounting target component can be fixed by the adhesive, without considering the exact shape of the electronic component.This ensures a more accurate determination of the good / bad quality of the adhesive through a relatively simple technique and further increases the yield.

[0024] According to the invention, there is also provided an adhesive inspection device for performing an inspection of a thermosetting adhesive after applying the adhesive to at least one of a front and a back side of a substrate to attach an electronic component to the at least one side and before mounting the electronic component onto the solder printed on the substrate. The adhesive inspection device includes an adhesive height measuring unit for measuring a height of the adhesive relative to the substrate; and a unit for determining the good / poor quality of an adhesive based on the height of the adhesive measured by the adhesive height measuring unit.

[0025] When the adhesive that is a determination target of the adhesive quality determination unit is specified as a determination target adhesive and the electronic component that is a mounting target to be mounted by the determination target adhesive is specified as a mounting target electronic component, the adhesive quality determination unit determines whether a height of the determination target adhesive is equal to a predetermined inspection reference height based on an ideal mounting height of the electronic mounting target component based on design data or a height lower than the ideal mounting height by an amount corresponding to a sinking of the electronic mounting target component accompanied by melting of the solder, regardless of an amount of solder on which the electronic mounting target component is mounted,and thereby determines the good / poor quality of the target adhesive.

[0026] An inspection of the determination target adhesive is performed by determining whether the height of the determination target adhesive is equal to the predetermined inspection reference height, which is based on the ideal mounting height of the electronic mounting target component based on the design data, or the like, regardless of the solder quantity. In other words, an inspection of the determination target adhesive is performed based on the inspection reference height, which remains unchanged even when the amount (for example, height) of the solder changes.Therefore, compared to a configuration that changes the inspection reference height when the amount (height) of solder changes, this configuration reduces the probability that the adhesive is determined to be poor due to insufficient height even though the adhesive actually has no significant problem in attaching the electronic attachment target component, etc. Therefore, this configuration ensures more accurate determination of the good quality of the adhesive, which is assumed to be determined to be good, and thereby further increases the yield.

[0027] This configuration is preferably used when the curing temperature of the inspection target adhesive is lower than the melting temperature of the solder used to attach the electronic mounting target component. In this case, it is effective to set the target mounting height of the electronic mounting target component by the component placement machine to an ideal mounting height of the electronic mounting target component based on design data, or to a height lower than the ideal mounting height by a value corresponding to the sinking of the electronic mounting target component accompanied by the melting of the solder. Setting the target mounting height in this way enables inspection of the adhesive according to the mounting height of the electronic mounting target component, thus enabling more accurate determination of the good / poor quality of the adhesive. Short description of drawings Fig. 1 is a block diagram showing the schematic configuration of a manufacturing system; Fig. Fig. 2 is a partially enlarged plan view showing the schematic configuration of a mounted substrate; Fig. 3 is a partially enlarged sectional view showing the schematic configuration of the mounted substrate; Fig. 4 is a block diagram showing the schematic configuration of a component mounting system; Fig. 5 is a diagram showing the schematic configuration of a printing state / application state inspection apparatus; Fig. 6 is a partially enlarged sectional view showing no change in the mounting height of an electronic component due to a change in the height of a solder; and Fig. 7 is a partially enlarged sectional view showing no change in the mounting height of the electronic component due to the change in the height of a solder. Description of embodiments

[0028] An embodiment is described below with reference to the drawings. Fig. 1 is a block diagram showing the schematic configuration of a manufacturing system 10 for manufacturing a mounted substrate by mounting electronic components and the like on a substrate such as a printed circuit board. Fig. 2 is a partially enlarged plan view showing a part of a mounted substrate 1. Fig. 3 is a partially enlarged sectional view showing a part of the mounted substrate 1.

[0029] First, the configuration of the mounted substrate 1 is described. As shown in Fig. 2 and Fig. 3, the mounted substrate 1 comprises a flat-plate substrate 2 having a plurality of electrically conductive electrode patterns 3 arranged thereon. Viscous solder paste (hereinafter referred to as “solder”) 4 is printed on the electrode patterns 3. In Fig. 3 and the like, the electrode patterns 3 and the like are shown exaggeratedly thick.

[0030] The solder 4 used may, for example, be an Sn-Ag based solder such as Sn - 3.0 Ag - 0.5 Cu or Sn - 0.3 Ag - 0.7 Cu, an Sn-Cu based solder such as Sn - 0.7 Cu, an Sn-Zn based solder such as Sn - 8 Zn - 3 Bi or an Sn-Pb based solder such as Sn 67% - Pb 37%.

[0031] For reference, the melting point of solder 4 made of Sn - 3.0 Ag - 0.5 Cu or Sn - 0.3 Ag - 0.7 Cu is approximately 217°C, and the melting point of solder 4 made of Sn - 0.7 Cu is approximately 227°C. The melting point of solder 4 made of Sn - 8 Zn - 3 Bi is approximately 187 to 196°C, and the melting point of solder 4 made of Sn 67% - Pb 37% is approximately 183°C.

[0032] The mounted substrate 1 further includes a plurality of electronic components 5, such as a chip, mounted on the solders 4. Each of the electronic components 5 includes a plurality of electrode portions 6 consisting of electrodes and leads. Each of the electrode portions 6 is connected to a respective solder 4. The electrode portion 6 and the electrode pattern 3 are electrically connected to each other via the solder 4.

[0033] Further, the electronic component 5 is fixed by the solder 4. According to the embodiment, in order to improve the fixing, a specific electronic component 5 among the plurality of electronic components 5 that is more likely to fall off (for example, an electronic component 5 with a relatively heavy weight) is additionally fixed by an adhesive 7 applied to the substrate 2. The adhesive 7 is an insulating thermosetting adhesive.

[0034] The adhesive 7 can either have a curing temperature lower than the melting temperature of the solder 4 or a curing temperature higher than the melting temperature of the solder 4. A component placement system 13 described below uses a different technique to adjust the mounting height of the electronic component 5. This is described in detail below.

[0035] The manufacturing system 10 for manufacturing the mounted substrate 1 is described below. As in Fig. 1, the manufacturing system 10 includes a first solder printing device 11, an adhesive applying device 12, a component mounting system 13, and a first reflow device 14, which are sequentially arranged from an upstream side (upper left side in the drawing) along a conveying path of the substrate 2.

[0036] The first solder printing apparatus 11 is configured to print a predetermined amount of the solder 4 onto the electrode pattern 3 of the substrate 2. Specifically, the first solder printing apparatus 11 includes a metal screen (not shown) having a plurality of holes formed at positions corresponding to the electrode patterns 3, and uses this metal screen to screen-print the solder 4 onto the substrate 2.

[0037] The adhesive application device 12 is configured to apply a predetermined amount of the adhesive 7 to a predetermined position on the substrate 2 (for example, at a position where a predetermined electronic component 5 is expected to be arranged). The adhesive application device 12 includes, for example, a nozzle or jetting head (not shown) movable in an XY direction and causes the adhesive 7 to be ejected from the nozzle head and applied to the substrate 2.

[0038] The component mounting system 13 includes a printing state / application state inspection device 41 (hereinafter, simply referred to as "inspection device 41") for inspecting the printed solder 4 and the applied adhesive 7, a branching device 37, and a first component mounting machine 42 for mounting the electronic component 5. According to the embodiment, the inspection device 41 corresponds to the solder inspection device and the adhesive inspection device. According to the embodiment, the first component mounting machine 42 corresponds to the component mounting machine. The details of the component mounting system 13 are described below.

[0039] The first reflow device 14 is configured to heat and melt the solder 4 and to heat and cure the adhesive 7. In the substrate 2 undergoing a reflow process by the first reflow device 14, the solder 4 serves to bring the electrode pattern 3 into electrical contact with the electrode portions 6, whereas the adhesive 7 serves to attach the electronic components 5.

[0040] A first mounting condition inspection device 21 is arranged downstream of the component mounting system 13 to inspect the condition of the mounted electronic components 5. Furthermore, a first soldering condition inspection device 22 is arranged downstream of the first reflow device 14 to inspect whether the soldering condition is suitable.

[0041] Furthermore, branching devices 31 and 32 are arranged between the first mounting state inspection device 21 and the first reflow device 14, and between the first soldering state inspection device 22 and a substrate reversing device 15, which will be described later, respectively. The branching devices 31 and 32 are each configured to guide the substrate 2 determined to be non-defective by the inspection devices 21 and 22 located immediately upstream thereof, downstream, and to guide the substrate 2 determined to be defective by the respective inspection devices 21 and 22 located immediately upstream thereof, to predetermined defective substrate storage sections (not shown).

[0042] The respective devices including the first solder printing device 11 and the adhesive applying device 12 described above each serve to perform various processes with respect to the surface of the substrate 2 and with respect to the solder 4 and the like disposed on this surface.

[0043] The substrate 2, whose surface and the like are processed, is guided from the branching device 32 to the substrate reversing device 15. The substrate reversing device 15 is a device designed to reverse the front / back of the substrate 2 coming from the upstream. This causes the mounted surface of the substrate 2 with the electronic components 5 mounted thereon to face downward. The electronic component 5, which is likely to fall off, is fixed in advance by the adhesive 7, so that it is unlikely to actually fall off.

[0044] The substrate 2, whose front and back sides have been reversed, is transferred from the substrate reversing device 15 to various devices for performing various processes on the back side of the substrate 2 and on the solder 4 and the like arranged on this back side. The manufacturing system 10 includes a second solder printing device 16, a second component placement machine 17, and a second reflow device 18 downstream of the substrate reversing device 15.

[0045] The second solder printing apparatus 16 has similar functions to those of the first solder printing apparatus 11. The second reflow apparatus 18 has similar functions to those of the first reflow apparatus 14. The second component mounting machine 17 has substantially similar functions to those of the first component mounting machine 42 and is configured to correct a mounting position based on, for example, measurement results regarding the solder 4 input from a printing condition inspection apparatus 23 described below, and to mount the electronic component 5 at the corrected mounting position.

[0046] The printing state inspection device 23 is arranged downstream of the second solder printing device 16. A second mounting state inspection device 24 is arranged downstream of the second component placement machine 17. The printing state inspection device 23 has a function corresponding to the function of inspecting the solder 4 of the inspection device 41 and a function corresponding to the function of outputting the measurement result regarding the solder 4 of the inspection device 41. The second mounting state inspection device 24 has functions similar to those of the first mounting state inspection device 21.

[0047] Furthermore, a second soldering condition inspection device 25 and an electrical continuity inspection device 26 are arranged downstream of the second reflow device 18. The second soldering condition inspection device 25 has similar functions to those of the first soldering condition inspection device 22. The electrical continuity inspection device 26 is designed to inspect whether the electrical continuity is properly ensured after soldering.

[0048] Further, branching devices 33, 34, 35, and 36 are arranged immediately upstream of the inspection devices 23, 24, 25, and 26, respectively. The branching devices 33 to 36 each serve to guide the substrate 2 determined to be non-defective by the respective inspection devices 23 to 26 arranged upstream immediately before them downstream, and to guide the substrate 2 determined to be defective by the respective inspection devices 23 to 26 arranged upstream immediately before them to predetermined defective substrate storage sections (not shown). The substrate 2 (i.e., the mounted substrate 1) determined to be non-defective by the electrical continuity inspection device 26 is guided to a non-defective substrate take-out section 27. The finally obtained mounted substrate 1 is taken out by the non-defective substrate taking out section 27.

[0049] The component assembly system 13 is described below. As in Fig. 4, the component placement system 13 includes the inspection device 41 and the first component placement machine 42.

[0050] First, the inspection device 41 will be described. The inspection device 41 is arranged downstream of the adhesive application device 12 and serves to perform an inspection regarding the printing position, height, amount, and the like of the solder 4 and an inspection regarding the application position, height, amount, and the like of the adhesive 7.

[0051] Fig. Figure 5 is a schematic configuration diagram schematically showing the inspection apparatus 41 according to the embodiment. As shown in this figure, the inspection apparatus 41 includes a mounting table 51, an illumination device 52 serving as the illumination unit, a CCD camera 53 serving as the imaging unit, and a control device (hereinafter referred to as "control device") 61.

[0052] The mounting table 51 is a base on which the substrate 2 is arranged. The mounting table 51 includes motors 56 and 57. The controller 55 controls the operation of these motors 56 and 57, for example, to move the substrate 2 arranged on the mounting table 51 in any direction (X-axis direction and Y-axis direction).

[0053] The illumination device 52 is designed to irradiate at least the solders 4 and the adhesives 7 on the surface (top side) of the substrate 2 from obliquely above with a predetermined light component pattern.

[0054] The CCD camera 53 is sensitive to the light reflected from the substrate 2 or the like and captures an image of at least the solders 4 and the adhesives 7 irradiated with the light component pattern. The image (image data) captured by such imaging is (are) supplied to the control device 61.

[0055] With reference to Fig. 4, the electrical configuration of the control device 61 is described below. The control device 61 is constituted by a computer system including, for example, a CPU, a ROM, a RAM, a storage medium such as a hard disk, and I / O ports. The control device 61 is configured to control the entire inspection device 41 and perform various controls (hereinafter referred to as "controllers"), image processing, and arithmetic processing in the inspection device 41.

[0056] The control device 61 includes a design data storage section 62, an inspection information storage section 63, a three-dimensional measuring section 64 serving as the three-dimensional measuring unit and the adhesive height measuring unit, a measurement result storage section 65, a determination process section 66 serving as the solder good / bad quality determining unit and the adhesive good / bad quality determining unit, and an output section 67 serving as the output unit.

[0057] The design data storage section 63 is constituted by, for example, a RAM or a hard disk drive. Design data relating to the mounted substrate 1 is stored in advance in the design data storage section 63.

[0058] The design data includes, for example, the positions and sizes of the electrode pattern 3 on the substrate 2, the expected printing positions of the solders 4, the sizes of the solders 4 (for example, the length of each side of each solder 4, the height, the area, the contour length of the solder 4, the diagonal length of the solder 4, and the volume of the solder 4, and the like) in an ideal printing state, the expected application positions of the adhesives 7, the sizes of the adhesives 7 (for example, the area, height, contour length, volume, and the like of each of the adhesives 7) in an ideal application state, various information regarding the electronic components 5 such as the expected arrangement position of the individual electronic components 5 and the configuration of the electrode portions 6, and the dimensions of the substrate 2.The data regarding the configuration of the electrode sections 6 includes information regarding a height difference between the individual electrode sections 6 (for example, a lowest position of the respective electrode section 6) and a bottom surface of the electronic component 5. The design data further includes, for example, information regarding which of the solders 4 is used to mount the individual electronic components 5 and information regarding which of the electronic components 5 are to be fixed by the adhesive 7.

[0059] The inspection information storage section 63 is configured to store in advance inspection information used for inspections of the solders 4 and the adhesives 7. The inspection information includes various information used to perform various processes (for example, a binarization process) on an image input from the CCD camera 53, and numerical information used for inspections.The numerical information used for the inspections includes, for example, individually determined inspection reference distances for the respective plumb lines 4 and for the respective adhesives 7 to be used in the process for checking the plane positions of the respective plumb lines 4 and the respective adhesives 7, and individually determined inspection reference heights for the respective plumb lines 4 and for the respective adhesives 7 to be used in the process for checking the heights of the respective plumb lines 4 and the respective adhesives 7.

[0060] According to the embodiment, the inspection reference height of the solder 4 or the adhesive 7 is specified by a numerical range from a predetermined lower limit to a predetermined upper limit. Specifically, the inspection reference height of the adhesive 7 is set in advance in the design data based on an ideal mounting height of an electronic component 5 (electronic component mounting target) to be mounted by the adhesive 7 as an inspection target (inspection target adhesive). Specifically, the inspection reference height of the adhesive 7 is set taking into account a height difference HD between an electrode portion 6 of the electronic component 5 (mounting target electronic component) and a bottom surface of the electronic component 5 (as shown in Fig. 3) determined in the design data. For example, the inspection reference height of the adhesive 7 used to fix an electronic component 5 with a relatively large difference HD is specified by a numerical range between a relatively large lower limit and a relatively large upper limit. The inspection reference height of the adhesive 7 used to fix an electronic component 5 with a relatively small difference HD is specified by a numerical range between a relatively small lower limit and a relatively small upper limit. The inspection reference height may be specified as a numerical range not smaller than a predetermined lower limit. In other words, the upper limit does not necessarily need to be specified.

[0061] The three-dimensional measuring section 64 is designed to perform three-dimensional measurement regarding the heights and volumes of the solders 4 and the adhesives 7 based on the image captured by the CCD camera 53.

[0062] The measurement result storage section 65 is constituted by, for example, a hard disk drive or the like to store results of measurements performed by the three-dimensional measurement section 64.

[0063] The determination process section 66 is configured to use the inspection information stored in the inspection information storage section 63 to perform a determination process on the measurement results obtained by the three-dimensional measuring section 64 and to determine the good / bad quality of the solders 4 and the adhesives 7.

[0064] The output section 67 is configured to output information based on the measurement results stored in the measurement result storage section 65. According to the embodiment, the output section 67 outputs information based on the measurement results to the first component mounting machine 42. However, information based on the measurement results regarding the substrate 2 determined to be defective by the inspection device 41 is not output to the first component mounting machine 42.

[0065] The control device 61 is further connected to an input device 71 and a display device 72.

[0066] The input device 71 includes a keyboard and a mouse or includes a touch panel and is used to input information into the control device 61. The design data stored in the control device 61 and the like can be appropriately modified via the input device 71.

[0067] The display device 72 has a display screen such as a CRT or a liquid crystal display and is configured to display information such as the design data stored in the control device 61, images taken by the CCD camera 53, and the like.

[0068] In the inspection device 41 having the above-described configuration, the control device 61 controls the illumination device 52 and the CCD camera 53 to irradiate the solders 4, the adhesives 7, and the like with light through the illumination device 52 and capture an image of the solders 4 and the adhesives 7 with the CCD camera 53. This imaging is performed in the unit of each inspection area set in advance.

[0069] The three-dimensional measurement section 64 then performs three-dimensional measurement based on the image obtained by the imaging process of the CCD camera 53. According to the embodiment, a phase-shift method is used for the three-dimensional measurement. This method measures the plane position, height (maximum height and average height), volume value, and three-dimensional shape of each printed solder 4, and the plane position, height (maximum height and average height), volume value, and three-dimensional shape of each applied adhesive 7, respectively. The image obtained by the imaging process may be subjected to predetermined image processing before the three-dimensional measurement. According to the embodiment, a height in a direction perpendicular to a side (surface) of the substrate 2 on which the solders 4 and the adhesive 7 are arranged is measured as the height of the solder 4 or the height of the adhesive 7.

[0070] The measurement results are stored in the measurement result storage section 65 and used for an inspection process on the solder 4 and an inspection process on the adhesive 7 performed by the determination process section 66.

[0071] The inspection process regarding the lot 4 performs a determination process to determine whether an amount of misalignment between a measured plane position of a lot 4 and an expected print position of the lot 4 in the design data is within the inspection reference range regarding the lot 4. The inspection process regarding the lot 4 further performs a determination process to determine whether the height of a lot 4 (maximum height according to the embodiment) is equal to the inspection reference height regarding the lot 4. If both the plane position and the height are suitable, the lot 4 is determined to be good. Conversely, if at least one of the plane position and the height is not suitable, the lot 4 is determined to be bad. The object of inspection of the lot 4 can be appropriately changed. For example, an inspection may be performed based on the three-dimensional shape of the lot 4.In another example, an investigation regarding the height of Lot 4 may be performed using the average height of Lot 4.

[0072] The inspection process with respect to the adhesive 7 performs a determination process to determine whether an amount of misalignment between a plane position of an applied adhesive 7 and a preset ideal plane position of the adhesive 7 is within the inspection reference distance with respect to the adhesive 7.

[0073] The inspection process regarding the adhesive 7 includes a process for determining whether the measurement height of the adhesive 7 (maximum height according to the embodiment) is equal to the inspection reference height regarding the adhesive 7, and thereby determining the good / poor quality of the adhesive 7. The inspection reference height regarding the adhesive 7 is not changed by a change in the amount (height) of the solder 4 on which the electronic component 5 (mounting target electronic component) to be mounted by the adhesive 7 as the inspection target (inspection target adhesive) is mounted. Accordingly, the good / poor quality of each of the adhesives 7 is determined using a consistently set inspection reference height for each of the adhesives 7. The object of inspection of the adhesive 7 can be appropriately changed.For example, an investigation may be performed based on the three-dimensional shape of the adhesive 7. In another example, an investigation regarding the height of the adhesive 7 may be performed using the average height of the adhesive 7.

[0074] Such imaging and inspection described above are performed in the unit of each inspection area described above while moving the mounting table 51 by means of the motors 56 and 57. Accordingly, the respective solders 4 and the respective adhesives 7 arranged in the entire area of the surface (top) of the substrate 2 are inspected. According to a modification, only a specific solder 4 and also only a specific adhesive 7 may be set as the inspection targets.

[0075] The substrate 2 that has been subjected to inspection by the inspection device 41 is then transported to the diverting device 37 disposed between the inspection device 41 and the first component mounting machine 42. The substrate 2 that has been determined by the inspection device 41 to be good with respect to both the solder 4 and the adhesive 7 is guided downstream to the first component mounting machine 42 by the diverting device 37. On the other hand, the substrate 2 that has been determined by the inspection device 41 to be bad with respect to at least one of the solder 4 and the adhesive 7 is guided by the diverting device 37 to a defective substrate storage section (not shown).

[0076] Further, regarding the substrate 2 determined to be good, information based on the measurement results stored in the measurement result storage section 65 is output to the first component mounting machine 42 via the output section 67. Specifically, with respect to each electronic component 5, the inspection device 41 outputs position misalignment information (in-plane information) of an actual or actual printing position of the solder 4 against an expected printing position of the solder 4, height information (maximum height and average height) and volume value information of the solder 4, and height-related information (information in a height direction perpendicular to the surface of the substrate 2) including information about the three-dimensional shape of the solder 4.

[0077] The first component mounting machine 42 is described below. The first component mounting machine 42 has a predetermined mounting head (not shown) and is configured to pick up an electronic component 5 using this mounting head and mount this electronic component 5 on the substrate 2 by utilizing the viscosity of the printed solder 4. The first component mounting machine 42 includes a computer including, for example, a CPU, a ROM, a RAM, and I / O ports. Design data regarding the mounted substrate 1 is input to the first component mounting machine 42 in advance.

[0078] The design data includes information regarding the target mounting positions of all electronic components 5. The information regarding the target mounting position includes at least an ideal target mounting position of the electronic component 5 in an XY plane and an ideal target mounting height of the electronic component 5 in the height direction (Z direction) perpendicular to the surface of the substrate 2.

[0079] For example, an expected sinking amount of the electronic component 5 after a reflow process is further stored as the design data in the first component mounting machine 42. According to the embodiment, the expected sinking amount of the electronic component 5 refers to an expected value of the sinking amount caused by mounting the electronic component 5 at an ideal mounting position relative to the solder 4 printed in an ideal state, and is determined in advance by calculation (simulation) or the like. Another method may experimentally produce a plurality of mounted substrates 1, may measure actual sinking amounts with respect to the plurality of mounted substrates 1 in advance, and may set a value based on the measured sinking amounts (for example, an average value or a median value) as the expected sinking amount.

[0080] Further, the first component mounting machine 42 includes a mounting position setting section 42a serving as the mounting position setting unit. The mounting position setting section 42a is configured to set the target mounting position of the electronic component 5 based on the measurement results input from the output section 67. According to the embodiment, the target mounting position includes at least a target mounting height of the electronic component 5 in the height direction (X direction). The target mounting position may include a plane target mounting position of the electronic component 5.

[0081] The mounting position setting section 42a sets the target mounting height of the electronic component 5 as described below according to the magnitude relationship between the melting temperature of the solder 4 and the curing temperature of the adhesive 7.

[0082] When the curing temperature of the adhesive 7 is lower than the melting temperature of the solder 4, the mounting position setting section 42a sets the target mounting height of the electronic component 5 to a height lower than an ideal mounting height of the electronic component 5 based on the design data by a value corresponding to the expected sinking amount of the electronic component 5 accompanied by the melting of the solder 4. In other words, when the curing temperature of the adhesive 7 is lower than the melting temperature of the solder 4, the mounting position setting section 42a sets the target mounting height of the electronic component 5 to the height described above without making any corrections based on the measurement results. Accordingly, the target mounting height of the electronic component 5 is not changed even when the amount (height) of the solder 4 on which the electronic component 5 is mounted changes.

[0083] On the other hand, when the curing temperature of the adhesive 7 is higher than the melting temperature of the solder 4, the mounting position setting section 42a sets the ideal mounting height of the electronic component 5 based on the design data appropriately corrected based on the measurement results to the target mounting height of the electronic component 5.

[0084] The first component mounting machine 42 then mounts the electronic component 5 at the target mounting height set by the mounting position setting section 42a.

[0085] Accordingly, when the curing temperature of the adhesive 7 is lower than the melting temperature of the solder 4, an electronic component 5 is mounted at a position which is lower than an ideal mounting height of the electronic component 5 according to the design data by a value corresponding to a sinking amount of the electronic component 5 expected with the melting of the solder 4, regardless of a change in the amount (height) of the solder 4. Even if a height HS of the solder 4 is changed within an appropriate range, such an adjustment does not change a mounting height HP of the electronic component 5 mounted on this solder 4, as shown in Fig. 6 and Fig. 7 is shown.

[0086] On the other hand, when the curing temperature of the adhesive 7 is higher than the melting temperature of the solder 4, an electronic component 5 is mounted at a target mounting height appropriately set according to the amount (height) of the solder 4. For example, when the height of the solder 4 specified by the height-related information included in the input information is higher than an ideal height of the solder 4, the electronic component 5 is mounted at an upper position at a relatively greater distance from the substrate 2. On the other hand, when the height of the solder 4 specified by the height-related information is higher than the ideal height of the solder 4, the electronic component 5 is mounted at a lower position near the substrate 2.

[0087] As described in detail above, the first component mounting machine 42 according to the embodiment includes the mounting position setting section 42a for setting the target mounting height of the electronic component 5 based on the measurement results of the solder 4 by the three-dimensional measuring section 64. The first component mounting machine 42 can thus mount the electronic component 5 at the set target mounting height. This configuration thus enables the electronic component 5 to be arranged at an appropriate position corresponding to the formation state of the solder 4. For example, with respect to the electronic component 5 to be fixed by the adhesive 7 that hardens at a temperature higher than the melting temperature of the solder 4, the first component mounting machine 42 mounts this electronic component 5 at a height corresponding to the actual or actual height of the solder 4.

[0088] On the other hand, with respect to the electronic component 5 to be fixed by the adhesive 7 that hardens at a temperature lower than the melting temperature of the solder 4, the mounting position setting section 42a sets the target mounting height to a height lower than the ideal mounting height based on the design data by the value corresponding to the sinking amount of the electronic component 5 accompanied by the melting of the solder 4. In other words, the target mounting height of the electronic component 5 to be fixed by the adhesive 7 that hardens at a temperature lower than the melting temperature of the solder 4 is set to the height described above regardless of the amount (height) of the solder 4.Accordingly, when the adhesive 7 cures to fix the electronic component 5 before the solder 4 melts, the electronic component 5 is mounted at a position lower than a usual mounting position (ideal mounting height). This configuration more reliably prevents the electronic component 5 from being mounted at a position protruding from the usual mounting position, thereby preventing the occurrence of a dimensional error. Furthermore, this configuration more effectively ensures electrical contact between the electrode portion 6 of the electronic component 5 and the electrode pattern 3 of the substrate 2, and more reliably prevents the occurrence of a soldering error. Thus, this configuration increases the yield.

[0089] Specifically, according to the embodiment, the target mounting height is set to the height lower than the ideal mounting height by the amount corresponding to the sagging amount of the electronic component associated with the melting of the solder. This configuration enables the electronic component 5 to be fixed by curing the adhesive 7 at a more appropriate position, taking into account the sagging amount associated with the melting of the solder 4. This configuration thus more reliably provides electrical contact between the electrode portion 6 and the electrode pattern 3 and further increases the yield.

[0090] An inspection of the adhesive 7 is performed by determining whether the height of the adhesive 7 is equal to the predetermined inspection reference height based on the target mounting height of the electronic component 5, regardless of the amount of solder 4. In other words, an inspection of the adhesive 7 is performed based on the inspection reference height, which is not changed by a change in the amount (for example, the height) of the solder 4. Accordingly, compared with a configuration that changes the inspection reference height with a change in the amount (height) of the solder 4, this configuration reduces the possibility of the adhesive 7 being determined to be defective due to insufficient height, even though the adhesive 7 actually has no significant problems in attaching the electronic component 5 and the like.Thus, this configuration ensures a more accurate determination of the good / bad quality of the adhesive 7 to be determined as good, thereby further increasing the yield.

[0091] Furthermore, the inspection reference height is based on the target mounting height of the electronic component 5, so that an inspection of the adhesive 7 is performed according to the mounting height of the electronic component 5. This configuration ensures a more accurate determination of the good / poor quality of the adhesive 7.

[0092] Furthermore, the inspection reference height is determined by considering a height difference between the electrode portion 6 of the electronic component 5, which is fixed by the adhesive 7 as the inspection target, and the bottom surface of the electronic component 5. Accordingly, this configuration enables a more accurate inspection to determine whether the adhesive 7 comes into contact with the bottom surface of the electronic component 5, that is, whether the electronic component 5 can be fixed by the adhesive 7, without considering the exact shape of the electronic component 5. This ensures the more accurate determination of the good / poor quality of the adhesive 7 by a relatively simple technique and further increases the yield.

[0093] The present invention is not limited to the description of the above embodiment, but may be implemented by, for example, configurations described below. (a) According to the above-described embodiment, when the curing temperature of the adhesive 7 is lower than the melting temperature of the solder 4, the target mounting height of the electronic component 5 is set to the height lower than the ideal mounting height of the electronic component 5 based on the design data by the value corresponding to the amount of sagging of the electronic component 5 expected with the melting of the solder 4. However, when the curing temperature of the adhesive 7 is lower than the melting temperature of the solder 4, a modification may be to set the target mounting height of the electronic component 5 to the ideal mounting height of the electronic component 5 based on the design data. (b) According to the above-described embodiment, the first component mounting machine 42 is configured to appropriately change the mounting height of the electronic component 5. However, according to a modification, the first component mounting machine may be configured to mount the electronic component 5 at a predetermined height set in advance when the first component mounting machine is used only under the condition that the curing temperature of the adhesive 7 is lower than the melting temperature of the solder 4. The first component mounting machine of this modification can consistently set the target mounting height of the electronic component 5 to an ideal mounting height of the electronic component 5 based on the design data, or to the height lower than the ideal mounting height by the value corresponding to the amount of sagging of the electronic component 5 expected with the melting of the solder 4.Using this first component mounting machine can enable the omission of the inspection device 41 or the mounting position adjusting section 42a. (c) According to the above-described embodiment, the information regarding the height, volume value, and three-dimensional shape of the plumb line 4 are output as the height-related information. However, according to a modification, at least one of these information may be output as the height-related information. (d) According to the above-described embodiment, both the maximum height and the average height are output to indicate the heights of the solder 4 and the adhesive 7. However, according to a modification, only either the maximum height or the average height may be output. (e) According to the above-described embodiment, the phase shift technique is used as the three-dimensional measurement method. Any other techniques such as an optical cutting method, a moiré technique, a focusing technique, a confocal technique, a spatial code method, and a fringe projection method can be used as the three-dimensional measurement method. List of reference symbols 1 mounted substrate 2 substrate, 3 electrode patterns 4 solder paste (solder), 5 electronic components, 6 electrode section, 7 adhesives, 10 Manufacturing system 11 first solder printing device 12 Adhesive application device 13 Component assembly system, 14 first reflow device 15 Substrate reversing device 16 second solder printing device 17 second component placement machine 18 second reflow device 21 first assembly condition inspection device 22 first soldering condition inspection device 23 Pressure condition testing device 24 second fastening condition inspection device 25 second soldering condition inspection device 26 Device for testing electrical continuity 27 Non-defective substrate removal section 31 branching device 32 branching device 33 branching device 34 branching device 35 branching device 36 branching device 37 branching device 41 Printing condition / application condition inspection device (solder inspection device, adhesive inspection device), 42 first component assembly machine (component assembly machine), 42a Mounting position adjustment section (mounting height adjustment unit), 51 assembly table 52 lighting device, 53 CCD camera (imaging unit), 56 engine 57 Engine 61 Control device 62 Design data storage section 63 Examination information storage section 64 Section on three-dimensional measurement (unit for three-dimensional measurement, adhesive height measuring unit), 65 Measurement result storage section 66 Determination process section (unit for determining the good / bad quality of a solder, unit for determining the good / bad quality of an adhesive), 67 Output section (output unit) HD height difference HP mounting height of the electronic component HS Height of the plumb line

Claims

[1] A component mounting system (13) comprising a component mounting machine (42) for mounting an electronic component (5) having a predetermined electrode portion (6) onto a solder (4) printed on a substrate (2) and for fixing the electronic component (5) to the substrate (2) using a thermosetting adhesive (7), the component mounting system (13) comprising a solder inspection device (41), the solder inspection device (41) comprising: an illumination unit (52) for irradiating the plumb line (4) with a predetermined light; an imaging unit (53) for taking an image of at least the plumb line (4) irradiated with the light by the illumination unit (52); a three-dimensional measuring unit (64) for performing a three-dimensional measurement of the plumb line (4) based on the image captured by the imaging unit (53); a unit for determining the good / bad quality (66) of the solder (4) based on a result of the measurement by the three-dimensional measuring unit (64); and an information output unit (67) that outputs height-related information of the solder (4) in the height direction perpendicular to a side of the substrate (2) to which the adhesive (7) is applied, based on the result of the measurement by the three-dimensional measuring unit (64), wherein the component mounting machine (42) comprises a mounting height setting unit for setting at least a target mounting height of the electronic component (5) in the vertical height direction based on the information input from the output unit (67), and is configured to mount the electronic component (5) at the target mounting height set by the mounting height setting unit, with respect to the electronic component (5) to be fixed by the adhesive (7) which cures at a temperature lower than a melting temperature of the solder (4), the mounting height adjustment unit is designed to set the target mounting height to an ideal mounting height based on design data or to a height which is lower than the ideal mounting height by a value corresponding to a sinking of the electronic component (5) accompanying the melting of the solder (4), the component mounting system (13) further comprises an adhesive inspection device (41), the adhesive testing device (41) comprises: an adhesive height measuring unit for measuring a height of the adhesive (7) relative to the substrate (2); and a unit for determining the good / bad quality (66) of the adhesive (7) based on the height of the adhesive (7) measured by the adhesive height measuring unit, and when the adhesive (7) which is a determination target of the unit for determining the good / poor quality (66) of the adhesive (7) is specified as a determination target adhesive (7) and the electronic component (5) which is a mounting target to be mounted by the determination target adhesive (7) is specified as an electronic mounting target component (5), the adhesive (7) good / poor quality determining unit (66) determines whether a height of the determination target adhesive (7) is equal to a predetermined inspection reference height based on a target mounting height of the electronic mounting target component (5), regardless of an amount of the solder (4) on which the electronic mounting target component (5) is mounted, and thereby determines a good / poor quality of the determination target adhesive (7). [2] A component mounting system (13) comprising a component mounting machine (42) for mounting an electronic component (5) having a predetermined electrode portion (6) on a solder (4) printed on a substrate (2) and for fixing the electronic component (5) to the substrate (2) using a thermosetting adhesive (7), wherein: with respect to the electronic component (5) to be fixed by the adhesive (7) that cures at a temperature lower than a melting temperature of the solder (4), the component mounting machine (42) is designed to set a target mounting height in the height direction perpendicular to a side of the substrate (2) to which the adhesive (7) is applied to an ideal mounting height based on design data or a height that is lower than the ideal mounting height by a value corresponding to a sinking of the electronic component (5) accompanying the melting of the solder (4), and to mount the electronic component (5) at the target mounting height, the component mounting system (13) further comprises an adhesive inspection device (41), the adhesive testing device (41) comprises: an adhesive height measuring unit for measuring a height of the adhesive (7) relative to the substrate (2); and a unit for determining the good / bad quality (66) of the adhesive (7) based on the height of the adhesive (7) measured by the adhesive height measuring unit, and when the adhesive (7) which is a determination target of the unit for determining the good / poor quality (66) of the adhesive (7) is specified as a determination target adhesive (7) and the electronic component (5) which is a mounting target to be mounted by the determination target adhesive (7) is specified as an electronic mounting target component (5), the adhesive (7) good / poor quality determining unit (66) determines whether a height of the determination target adhesive (7) is equal to a predetermined inspection reference height based on a target mounting height of the electronic mounting target component (5), regardless of an amount of the solder (4) on which the electronic mounting target component (5) is mounted, and thereby determines a good / poor quality of the determination target adhesive (7). [3] Component assembly system (13) according to claim 1 or 2, wherein the inspection reference height is determined taking into account a height difference (HD) between the electrode portion (6) of the electronic attachment target component (5) and a bottom surface of the electronic attachment target component (5). [4] An adhesive inspection device (41) for performing an inspection of a thermosetting adhesive (7) after applying the adhesive (7) to at least one of a front and a back side of a substrate (2) to attach an electronic component (5) to the at least one side and before mounting the electronic component (5) on a solder (4) printed on the substrate (2), the adhesive inspection device (41) comprising: an adhesive height measuring unit for measuring a height of the adhesive (7) relative to the substrate (2); and a unit for determining the good / bad quality (66) of the adhesive (7) on the basis of the height of the adhesive (7) measured by the adhesive height measuring unit, wherein when the adhesive (7) which is a determination target of the unit for determining the good / poor quality (66) of the adhesive (7) is specified as a determination target adhesive (7) and the electronic component (5) which is a mounting target to be mounted by the determination target adhesive (7) is specified as an electronic mounting target component (5), the unit for determining the good / poor quality of the adhesive (7) determines whether the height of the determination target adhesive (7) is equal to a predetermined inspection reference height which is based on an ideal mounting height of the electronic mounting target component (5) based on design data or a height which is lower than the ideal mounting height by a value corresponding to a sinking of the electronic mounting target component (5) accompanied by the melting of the solder (4), regardless of an amount of the solder (4) on which the electronic mounting target component (5) is mounted, and thereby determines a good / poor quality of the determination target adhesive (7). [5] The adhesive inspection device (41) according to claim 4, wherein the inspection reference height is determined taking into account a height difference (HD) between an electrode portion (6) of the electronic attachment target component (5) and a bottom surface of the electronic attachment target component (5). [6] A component mounting system (13) comprising a component mounting machine (42) for mounting an electronic component (5) having a predetermined electrode portion (6) onto a solder (4) printed on a substrate (2) and for fixing the electronic component (5) to the substrate (2) using a thermosetting adhesive (7), the component mounting system (13) comprising a solder inspection device (41), the solder inspection device (41) comprising: an illumination unit (52) for irradiating the plumb line (4) with a predetermined light; an imaging unit (53) for taking an image of at least the plumb line (4) irradiated with the light by the illumination unit (52); a three-dimensional measuring unit (64) for performing a three-dimensional measurement of the plumb line (4) based on the image captured by the imaging unit (53); a unit for determining the good / bad quality (66) of the solder (4) based on a result of the measurement by the three-dimensional measuring unit (64); and an information output unit (67) that outputs height-related information of the solder (4) in the height direction perpendicular to a side of the substrate (2) to which the adhesive (7) is applied, based on the result of the measurement by the three-dimensional measuring unit (64); wherein the component mounting machine (42) comprises a mounting height setting unit for setting at least a target mounting height of the electronic component (5) in the vertical height direction based on the information input from the output unit (67), and is configured to mount the electronic component (5) at the target mounting height set by the mounting height setting unit, and with respect to the electronic component (5) to be fixed by the adhesive (7) that cures at a temperature lower than a melting temperature of the solder (4), the mounting height setting unit is configured,to set the target mounting height to a height based on design data which is lower than an ideal mounting height by a value corresponding to a sinking of the electronic component (5) associated with the melting of the solder (4). [7] A component mounting system (13) comprising a component mounting machine (42) for mounting an electronic component (5) having a predetermined electrode portion (6) onto a solder (4) printed on a substrate (2) and for fixing the electronic component (5) to the substrate (2) using a thermosetting adhesive (7), wherein: with respect to the electronic component (5) to be fixed by the adhesive (7) which cures at a temperature lower than a melting temperature of the solder (4), the component mounting machine (42) is designed to set a target mounting height in a height direction perpendicular to a side of the substrate (2) to which the adhesive (7) is applied, to a height based on design data which is lower than an ideal mounting height by a value corresponding to a sinking of the electronic component (5) accompanying the melting of the solder (4), and to mount the electronic component (5) at the target mounting height.

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