AN OPTOELECTRONIC COMPONENT

Abstract

Optoelectronic component (10, 20), which comprises a housing body (100) and an optical element (300), wherein a fold (200) having a shoulder (210) and a cheek (220) is formed on a top side (101) of the housing body (100), wherein the optical element (300) is received in the fold (200) such that an edge region (310) of the optical element (300) rests on the shoulder (210) of the fold (200), wherein an adhesive (260) is arranged between the shoulder (210) of the fold (200) and the edge region (310) of the optical element (300), wherein the adhesive (260) extends to an area between the cheek (220) of the fold (200) and the edge area (310) of the optical element (300).

Description

[0001] The present invention relates to an optoelectronic component.

[0002] Optoelectronic components with integrated optical elements are known in the prior art. It is known to provide optoelectronic components with housing bodies containing integrated optical reflectors and optical elements arranged on the housing body.

[0003] US patent 2016 / 0005931A1 describes a light-emitting module with a housing that surrounds an LED chip. The housing has a recess with a reflective wall.

[0004] US 2008 / 0111145A1 describes an LED component with a housing and a cover element arranged on a fold of the housing.

[0005] US 8 952 410 B2 describes an LED component with a lens facing an LED chip.

[0006] US 9 544 484 B2 describes a light-emitting component with a housing and a cover element.

[0007] US 2018 / 0 306 405 A1 describes a light-emitting module with an optical lens.

[0008] One object of the present invention is to provide an optoelectronic component. This object is achieved by an optoelectronic component having the features of the independent claims. Various embodiments are disclosed in the dependent claims.

[0009] An optoelectronic component comprises a housing body and an optical element. A fold is formed on the top surface of the housing body, featuring a shoulder and a cheek. The optical element is accommodated in the fold such that an edge region of the optical element rests on the shoulder of the fold.

[0010] Advantageously, the fold in the housing protects the optical element of this optoelectronic component from accidental removal. In particular, the fold prevents the optical element from being pulled out or sheared off. This reduces the risk of damage to the optoelectronic component.

[0011] According to one embodiment of the optoelectronic component, the height of the fold differs from the thickness of the edge region of the optical element by less than 40%, preferably by less than 20%, and preferably by less than 10%. Advantageously, the fold of the housing body provides particularly effective protection for the optical element if the height of the fold and the thickness of the edge region of the optical element are approximately equal.

[0012] In one embodiment of the optoelectronic component, a gap is formed between the edge region of the optical element and the cheek of the fold. The gap has a width of less than 200 µm or less than 100 µm. Advantageously, a gap of such a width allows both easy mounting of the optical element to the housing body and precise alignment of the optical element relative to the housing body.

[0013] In one embodiment of the optoelectronic component, an obtuse angle is formed between the cheek of the fold and the shoulder of the fold. Advantageously, the obtuse angle simplifies the mounting of the optical element in the fold of the optoelectronic component's housing. The obtuse angle ensures automatic centering of the optical element in the fold of the housing.

[0014] An adhesive is applied between the shoulder of the fold and the edge of the optical element. Advantageously, the adhesive secures the optical element within the fold. A further advantage of the fold is that its flange prevents the adhesive from being squeezed out of the housing. Furthermore, the fold increases the contact area between the housing, the adhesive, and the optical element, thereby enhancing the adhesion between the housing and the optical element.

[0015] The adhesive extends to the area between the flange of the rebate and the edge of the optical element. Advantageously, the adhesive applied in this area increases the contact area between the rebate of the housing body, the adhesive, and the edge of the optical element, thereby increasing the adhesion between the housing body and the optical element.

[0016] In one embodiment of the optoelectronic component, the top surface of the housing body has a rectangular shape. The shoulder of the fold is only formed at the corners of the fold. Advantageously, this allows for a housing body design of the optoelectronic component with very small external dimensions.

[0017] In one embodiment of the optoelectronic component, the housing body comprises a cavity with an opening at the top of the housing body. Advantageously, the cavity of the housing body can serve to accommodate an optoelectronic semiconductor chip of the optoelectronic component.

[0018] In one embodiment of the optoelectronic component, the fold surrounds the opening of the cavity. Advantageously, this allows the fold to support and hold the optical elements in several spatial directions.

[0019] In one embodiment of the optoelectronic component, the optical element covers the opening of the cavity. Advantageously, light emitted inside the cavity passes through the optical element before being emitted by the optoelectronic component. A further advantage of the optical element covering the opening of the cavity is that it provides protection for components of the optoelectronic component located within the cavity.

[0020] In one embodiment of the optoelectronic component, a side wall of the cavity forms a reflector. Advantageously, the reflector formed by the side wall of the cavity can serve to reflect and collect light emitted by an optoelectronic semiconductor chip arranged in the cavity of the optoelectronic component's housing.

[0021] In one embodiment of the optoelectronic component, the reflector comprises a gold coating. Advantageously, the reflector exhibits high reflectivity and is insensitive to aging.

[0022] In one embodiment of the optoelectronic component, the adhesive partially covers the reflector. Advantageously, the adhesive covering parts of the reflector can serve to improve the homogeneity of the light emitted by the optoelectronic component.

[0023] In one embodiment of the optoelectronic component, the optical element comprises an optical lens.

[0024] Advantageously, the optical lens can serve to form light that is emitted by the optoelectronic component.

[0025] In one embodiment of the optoelectronic component, the optical lens is arranged on the underside of the optical element. The optical lens extends into the cavity. This advantageously allows for a particularly compact design of the optoelectronic component. Because the optical lens is arranged on the underside of the optical element and within the cavity, the outer surface of the optical element can be flat, resulting in a uniform and robust external appearance of the optoelectronic component.

[0026] In one embodiment of the optoelectronic component, the lens is asymmetric. Advantageously, an asymmetric optical lens makes it possible to deflect light in a selected direction, so that the optoelectronic component has a tilted viewing angle.

[0027] In one embodiment of the optoelectronic component, the component comprises a carrier with a die mounting area arranged on the top side of the carrier and a soldering area arranged on the bottom side of the carrier. The housing body is arranged on the top side of the carrier. Advantageously, the carrier of the optoelectronic component can serve to support one or more optoelectronic semiconductor chips and other components of the optoelectronic component. The carrier can also serve to electrically connect electrical components of the optoelectronic component.

[0028] In one embodiment of the optoelectronic component, at least one via extends through the carrier between the die mounting area and the soldering area.

[0029] Advantageously, the via can serve to dissipate heat generated by an optoelectronic semiconductor chip located on the die mounting field of the substrate.

[0030] In one embodiment of the optoelectronic component, the underside of the housing body includes a cutout. An optoelectronic semiconductor chip is arranged on the die mounting area of ​​the substrate within this cutout in the housing body. Advantageously, the optoelectronic semiconductor chip can be used to emit electromagnetic radiation. For example, the optoelectronic semiconductor chip can be an LED chip. The optoelectronic semiconductor chip can be designed to emit light in the visible or infrared range, for example.

[0031] Another optoelectronic component comprises a housing body with a cavity and includes an optical element with an outer surface. The optical element is arranged on the housing body such that its outer surface faces a side wall of the cavity. Advantageously, this optoelectronic component has compact external dimensions. The optical element of this optoelectronic component can serve to collect light emitted from an optoelectronic semiconductor chip of this optoelectronic component. For this purpose, the outer surface of the optical element can serve as a reflective surface from which light is reflected by total internal reflection. Advantageously, this can eliminate the need for an additional reflector element.

[0032] In one embodiment of the optoelectronic component, the optical element comprises an optical lens. The optical lens extends into the cavity and covers the outer surface. Advantageously, the optical lens of the optical element, which is arranged in the cavity of the optoelectronic component's housing, enables a compact design of the optoelectronic component.

[0033] In one embodiment of the optoelectronic component, the optical lens is asymmetric. Advantageously, an asymmetric optical lens allows light to be deflected in a selected direction, so that the optoelectronic component has a tilted viewing angle.

[0034] In one embodiment of the optoelectronic component, the optical lens is a total internal reflection (TR) lens. Advantageously, this allows for a compact design of the optical lens. A further advantage is that the TR lens has a central funnel, which allows light emitted at a wide angle to enter the optical lens. This light can then reach the outer surface of the optical element and be reflected by total internal reflection, thus collecting and concentrating the light emitted at a wide angle.

[0035] In one embodiment of the optoelectronic component, an optoelectronic semiconductor chip is arranged in the cavity. Light emitted by the optoelectronic semiconductor chip is at least partially coupled into the optical element and is at least partially reflected by total internal reflection at the outer surface. Advantageously, the optical element of this optoelectronic component serves to collect and concentrate the light emitted by the optoelectronic semiconductor chip. This can make it possible to design the optoelectronic component without additional reflectors.

[0036] The properties, features and advantages of this invention described above, and the manner in which they are achieved, will become clearer and more easily understood in conjunction with the following description of the exemplary embodiments, which are explained in more detail in conjunction with the drawings, in which, in schematic representation: Fig. Figure 1 shows a perspective view of the housing body of an optoelectronic component; Fig. 2 shows a perspective view of a carrier of an optoelectronic component; Fig. 3 shows a perspective view of an optical element of an optoelectronic component; Fig. 4 shows a bottom side of the optical element that includes an optical lens; Fig. 5 shows a top view of the housing body, the support and an optoelectronic semiconductor chip; Fig. Figure 6 shows a sectional view of an optoelectronic component comprising the carrier, the housing body, the optoelectronic semiconductor chip and the optical element; Fig. Figure 7 shows a partially transparent perspective view of the optoelectronic component; Fig. Figure 8 shows another perspective view of the optoelectronic component; and Fig. Figure 9 shows a sectional view of another optoelectronic component comprising a housing body, an optoelectronic semiconductor chip and an optical element.

[0037] Fig. Figure 1 shows a schematic perspective view of a housing body 100. The housing body 100 is designed to be part of a housing for an optoelectronic component, for example, a light-emitting diode component.

[0038] The housing body 100 comprises an approximately cube-shaped form with a top 101 and a bottom 102 opposite the top 101.

[0039] The housing body 100 has a cavity 110. The cavity 110 has an opening 120 on the upper surface 101 of the housing body 100. On the lower surface 102 of the housing body 100, the cavity 110 forms a cutout 130. Together, the cavity 110 forms a tunnel that extends through the housing body 100 between the opening 120 on the upper surface 101 of the housing body and the cutout 130 on the lower surface 102 of the housing body 100.

[0040] The opening 120 on the upper side 101 of the housing body 100 has a larger area than the cutout 130 on the lower side 102 of the housing body 100. Between the cutout 130 and the opening 120, the cavity 110 widens such that one side wall 140 of the cavity 110 is convex.

[0041] The side wall 140 of the cavity 110 forms a reflector 150. For this purpose, the side wall 140 of the reflector 150 can have a gold coating 160. However, the gold coating 160 can also be omitted.

[0042] The housing body 100 can be made of a plastic material, for example, black polyphthalamide (PPA). The housing body 100 can be manufactured, for example, by molding.

[0043] The housing body 100 includes a rebate 200, which is arranged on the top surface 101 of the housing body 100. The rebate 200 has a rectangular shape and extends along the outer edges of the top surface 101 of the housing body 100. Consequently, the rebate 200 surrounds the opening 120 of the cavity 110. The rebate 200 can also be referred to as a frame.

[0044] The rebate 200 comprises a shoulder 210 and a cheek 220. The shoulder 210 is oriented parallel to the top surface 101 of the housing body 100 and offset from the top surface 101 of the housing body 100. The cheek 220 of the rebate 200 is oriented upwards and surrounds the shoulder 210 of the rebate 200. The cheek 220 has a height 211, which is measured in a direction perpendicular to the top surface 101 of the housing body 100, so that the shoulder 210 of the rebate 200 is offset from the top surface 101 by the height 211.

[0045] The cheek 220 of the fold 200 can be oriented perpendicular to the shoulder 210 of the fold. It is also possible that an obtuse angle 230, greater than 90°, is formed between the cheek 220 of the fold 200 and the shoulder 210 of the fold 200. The figure shows an embodiment in which the angle 230 is obtuse with an angle greater than 90°.

[0046] Near the corners 240 of the rectangular rebate 200, the shoulder 210 of the rebate 200 has an extended area, whereas at the midpoints of the edges of the upper surface 101 of the housing body 100, the opening 120 of the cavity 110 extends to the cheek 220 of the rebate 200, so that the width of the shoulder 210 vanishes. Consequently, the shoulder 210 of the rebate 200 is only formed at the corners 240 of the rebate 200.

[0047] Fig. Figure 2 shows a schematic perspective view of a support 400. The support 400 can, for example, be a printed circuit board (PCB). The support 400 has a flat shape with a top surface 401 and a bottom surface 402 opposite the top surface 401.

[0048] A die mounting field 410 and a wire mounting field 420 are arranged on the top surface 401 of the carrier 400.

[0049] Fig. Figure 3 shows a schematic perspective view of an optical element 300. Fig. Figure 4 shows a schematic bottom view of optical element 300. Optical element 300 comprises an optically transparent material and is designed to form light that passes through it. Optical element 300 can, for example, comprise an epoxy resin. Optical element 300 can, for example, be manufactured using molds.

[0050] The optical element 300 comprises a rectangular plate 305 with a top surface 301 and a bottom surface 302 opposite the top surface 301. The plate 305 has a thickness 311, which is measured between the top surface 301 and the bottom surface 302.

[0051] The top surface 301 of the plate 305 of the optical element 300 is flat. In other embodiments, however, the top surface 301 of the plate 305 of the optical element 300 can be structured.

[0052] On the underside 302 of the circuit board 305, the optical element 300 has an optical lens 330. The optical lens 330 is attached to the underside 302 of the board 305 and covers only a central part of the underside 302 of the board 305, so that the projecting parts of the board 305 form an edge region 310. The parts of the underside 302 of the board 305 that are not covered by the optical lens 330 form contact surfaces 320. The contact surfaces 320 are the parts of the underside 302 of the parts of the board 305 that form the edge region 310.

[0053] The optical lens 330 is a converging lens and is located in the Fig. 3 and Fig. The example shown in Figure 4 is designed as a TR lens (total internal reflection lens) with an outer section of 350 and an inner section of 360. However, the optical lens 330 can also be designed differently, for example as a spherical convex lens.

[0054] The optical lens 330 of the optical element 300, designed as a TR lens, means that the inner section 360 of the optical lens 330 is offset relative to the outer section 350 such that an outer surface 380 of the optical lens 330 has a discontinuity at the transition between the outer section 350 and the inner section 360 of the optical lens 330 on the underside 302 of the optical element 300. The inner section 360 is offset relative to the outer section 350 of the optical lens 330, so that a funnel 390 is formed on the underside 302 of the optical element 300. The funnel 390 includes a funnel wall 395 that connects the outer surface 380 of the outer section 350 of the optical lens 330 with the outer surface 380 of the inner section 360 of the optical lens 330.

[0055] In the Fig. 3 and Fig. In the example shown in Figure 4, the optical lens 330 is asymmetrical. An optical axis 340 of the optical lens 330 of the optical element 300 is not oriented perpendicular to the top 301 and the bottom 302 of the plate 305 of the optical element 300, but is inclined in a direction perpendicular to the bottom 302 of the plate 305 of the optical element 300. In other embodiments, however, the optical lens 330 can be symmetrical.

[0056] Fig. Figure 5 shows a schematic top view of the housing body 100 of Fig. 1 and the carrier 400 of Fig. 2 in a partially assembled state.

[0057] An optoelectronic semiconductor chip 500 was placed on the die mounting area 410 on the top surface 401 of the substrate 400. The optoelectronic semiconductor chip 500 was electrically connected to the wire mounting area 420 on the top surface 401 of the substrate 400 by means of a bonding wire 510. The optoelectronic semiconductor chip 500 is designed to emit electromagnetic radiation, for example, visible light. The optoelectronic semiconductor chip 500 can, for example, be a light-emitting diode (LED) chip. The optoelectronic semiconductor chip 500 can be designed, for example, to emit light in the visible or infrared range.

[0058] The housing body 100 was positioned above the top surface 401 of the carrier 400 such that the underside 102 of the housing body 100 faces the top surface 401 of the carrier 400. The optoelectronic semiconductor chip 500 and the bond wire 510 are arranged in the cutout 130 of the cavity 110 of the housing body 100 such that the optoelectronic semiconductor chip 500 is located within the cavity 110 of the housing body 100.

[0059] It is possible to position the housing body 100 above the top surface 401 of the carrier 400 before or after the placement of the optoelectronic semiconductor chip 500 on the die mounting field 410 on the top surface 401 of the carrier 400.

[0060] An adhesive 260 was applied to the corners 240 of the fold 200 on the shoulder 210 of the fold 200 of the housing body 100. The adhesive 260 could have been applied, for example, by stamping. It is possible to apply the adhesive 260 to the shoulder 210 in such a way that initially only parts of the shoulder 210 are covered by the adhesive 260. Subsequently, the adhesive 260 can spread to cover most or all of the surface of the shoulder 210 of the fold 200.

[0061] Fig. Figure 6 shows a schematic sectional view of the housing body 100, the carrier 400 and the optoelectronic semiconductor chip 500 after assembly of the optical element 300 to complete the manufacture of an optoelectronic component 10. Fig. Figure 7 shows a schematic and partially transparent perspective view of the optoelectronic component 10. Fig. Figure 8 shows another schematic perspective view of the optoelectronic component 10.

[0062] The optical element 300 was positioned on the upper surface 101 of the housing body 100 such that it is received in the rebate 200. The lower surface 302 of the optical element 300 faces the housing body 100 and the support 400. The bearing surfaces 320 of the edge region 310 of the optical element 300 rest on the shoulder 210 of the rebate 200.

[0063] The adhesive 260, previously applied to the shoulder 210 of the fold 200, holds the optical element 300 in the fold 200. The adhesive 260 is located between the shoulder 210 of the fold 200 and the bearing surfaces 320 of the edge region 310 of the optical element 300. A certain amount of the adhesive may have been forced into an area between the cheek 220 of the fold 200 and the edge region 310 of the optical element 300. Some of the adhesive 260 may have flowed into the cavity 110 and covered part of the side wall 140 of the cavity 110, which forms the reflector 150.

[0064] It is advantageous that the height 211 of the shoulder 210 of the fold 200 of the housing body 100 is approximately equal to the thickness 311 of the edge region 310 of the optical element 300. The height 211 of the shoulder 210 of the fold 200 may differ from the thickness 311 of the edge region 310 of the optical element 300 by no more than 10%, or no more than 20%, or no more than 40%, or, for example, by no more than 50 µm.

[0065] It is advantageous for the size of the plate 305 of the optical element 300 to be slightly smaller than the area of ​​the rebate 200 of the housing body 100. This allows a small gap 250 to be formed between the edge region 310 of the optical element 300 and the cheek 220 of the rebate 200 when the optical element 300 is received in the rebate 200. The gap 250 can have a width 251, measured near the shoulder 210 of the rebate 200, and be, for example, less than 200 µm or less than 100 µm.

[0066] The optical element 300, which is incorporated in the fold 200, covers the opening 120 of the cavity 110 of the housing body 100.

[0067] The optical lens 330 of the optical element 300 extends into the cavity 110 of the housing body 100. The outer surface of the outer section 350 of the optical lens 330 can closely follow the shape of the side wall 140 of the cavity 110. If the optical lens 330 is asymmetrical, the cavity 110 of the housing body 100 can exhibit a corresponding asymmetry.

[0068] The recessed inner section 360 of the optical lens 330 provides sufficient space for the optoelectronic semiconductor chip 500, which is located on the top surface 401 of the carrier 400. The optical lens 330 of the optical element 300 may have a notch 370 for receiving the bond wire 510.

[0069] A solder pad 430 is located on the underside 402 of the carrier 400. The solder pad 430 is positioned opposite the die mounting area 410 located on the top side 401 of the carrier 400. The die mounting area 410 and the solder pad 430 are electrically connected to each other by several vias 440 extending through the carrier 400. The solder pad 430 thus establishes an electrical connection to the optoelectronic semiconductor chip 500 of the optoelectronic component 10. The solder pad 430 enables the electrical connection of the optoelectronic component 10 using a surface mount technology, for example, by reflow soldering.

[0070] The vias 440 not only establish an electrical connection between the die mounting area 410 and the solder pad 430, but also provide good thermal contact. Heat generated by the optoelectronic semiconductor chip 500 during operation of the optoelectronic component 10 can be dissipated through the die mounting area 410, the vias 440, and the solder pad 430.

[0071] Fig. Figure 9 shows a schematic sectional view of an optoelectronic component 20. The in Fig. The optoelectronic component 20 shown in 9 is the one in the Fig. Figures 6 to 8 illustrated the optoelectronic component 10 similarly, so that the above description of the optoelectronic component 10 also applies to the optoelectronic component 20 of Fig. 9 applies, with the exception of the differences explained below. For elements of the optoelectronic component 20 that correspond to similar or identical elements of the optoelectronic component 10, in Fig. 9 the same reference figures as in the Fig. 6 to 8 used.

[0072] Just like the optoelectronic component 10, which is in the Fig. The section shown in 6 to 8 includes the following: Fig. Figure 9 shows an optoelectronic component 20 comprising a housing body 100 with a cavity 110 and a side wall 140. The optoelectronic component 20 also includes the optical element 300 with the outer surface 380. The optical element 300 is arranged on the housing body 100 such that its outer surface 380 faces the side wall 140 of the cavity 110 of the housing body 100. In particular, the optical element 300 is arranged on the housing body 100 such that the optical lens 330 of the optical element 300 extends into the cavity 110 of the housing body 100. The outer surface 380 of the optical lens 330 faces the side wall 140 of the cavity 110. This is the same arrangement as in the Fig. 6 to 8 shown optoelectronic component 10. In particular, the optical element 300 of the optoelectronic component 20 is identical to the optical element 300 of the optoelectronic component 10.

[0073] In the optoelectronic component 20 of Fig. 9 The side wall 140 of the cavity 110 of the housing body 100 has no gold coating. Light 520 emitted from the optoelectronic semiconductor chip 500 is radiated into the funnel 390 at the bottom 302 of the optical element 300. Light 520, emitted at a small angle with respect to a direction perpendicular to the top of the optoelectronic semiconductor chip 500, enters the inner section 360 of the optical lens 330 of the optical element 300 and is deflected and focused by the inner section 360 of the optical lens 330 of the optical element 300. Light emitted at a large angle in a direction perpendicular to the top of the optoelectronic semiconductor chip 500 enters the outer section 350 of the optical lens 330 of the optical element 300 through the funnel wall 395 of the funnel 390 at the bottom 302 of the optical element 300.This light propagates within the outer section 350 of the optical lens 330 of the optical element 300 until it reaches the outer surface 380 of the outer section 350 of the optical lens 330. At the outer surface 380, the light is reflected by total internal reflection. The light reflected at the outer surface 380 of the outer section 350 of the optical lens 330 is thus also concentrated by the optical lens 330 of the optical element 300 and can be extracted from the optical element 300 at the top surface 301 of the optical element 300. Since the light emitted by the optoelectronic semiconductor chip 500 at a large angle is collected by total internal reflection from the outer surface 380 of the optical lens 330, it is not necessary for the side wall 140 of the cavity 110 of the housing body 100 to have a coating to increase the reflectivity of the side wall 140 of the cavity 110.

[0074] The housing body 100 of the in Fig. The optoelectronic component 20 shown in 9 differs slightly from the housing body 100 shown in the Fig. The optoelectronic component 10 shown in Figures 6 to 8. The housing body 100 of the optoelectronic component 20 has no cutout on the bottom 102 of the housing body 100. Instead, the cavity 110 of the housing body 100 of the optoelectronic component 20 is closed at the bottom. The optoelectronic component 20 does not have a carrier separate from the housing body 100. Instead, the housing body 100 of the optoelectronic component 20 comprises a first conductor frame section 450 and a second conductor frame section 460, which are embedded in the housing body 100 at the bottom 102 of the housing body 100. The first conductor frame section 450 forms the die mounting area 410 at the bottom of the cavity 110 and a solder pad 430 at the bottom 102 of the housing body 100. The second conductor frame section 460 forms the wire attachment field 420 at the bottom of the cavity 110 and another soldering field 430 on the underside 102 of the housing body 100.The housing body 100 of the in . Fig. The optoelectronic component 20 shown in Figure 9 can, for example, comprise an epoxy forming compound.

[0075] In the Fig. The housing body 100 of the optoelectronic component 20 shown in Figure 9 comprises the rebate 200 with the shoulder 210 and the cheek 220 on the upper surface 101 of the housing body 100, just like the housing body 100 of the in Fig.The optoelectronic component 10 shown in Figures 6 to 8. The optical element 300 of the optoelectronic component 20 is identical to the optical element 300 of the optoelectronic component 10 and comprises the plate 305, with the edge region 310 forming the contact surface 320. However, it is possible to design the housing body 100 and the optical element 300 of the optoelectronic component 20 differently such that the optical element 300 of the optoelectronic component 20 is not received in a groove 200 of the housing body 100. For example, the optical element 300 can rest on a flat surface on the top 101 of the housing body 100. REFERENCE MARK LIST 10 optoelectronic components 20 optoelectronic components 100 housing bodies 101 Top 102 Subpage 110 cavity 120 opening 130 excerpt 140 side wall 150 reflector 160 gold plating 200 folds 210 Shoulder 211 Height 220 cheek 230 obtuse angle 240 corner 250 gap 251 width 260 adhesive 300 optical elements 301 Top 302 Underside 305 plate 310 Edge area 311 Thickness 320 mm contact area 330 optical lens 340 optical axis 350 Exterior section 360 interior section 370 notch 380 outer surface 390 funnels 395 Funnel wall 400 carriers 401 Top 402 Underside 410 Die mounting field 420 wire mounting field 430 soldering field 440 Via-Contact 450 first ladder frame section 460 second ladder frame section 500 optoelectronic semiconductor chips 510 Bond wire 520 light

Claims

[1] Optoelectronic component (10, 20), comprising a housing body (100) and an optical element (300), wherein a fold (200) having a shoulder (210) and a cheek (220) is formed on an upper side (101) of the housing body (100), wherein the optical element (300) is received in the fold (200) such that an edge region (310) of the optical element (300) rests on the shoulder (210) of the fold (200), wherein an adhesive (260) is arranged between the shoulder (210) of the fold (200) and the edge region (310) of the optical element (300), wherein the adhesive (260) extends to an area between the cheek (220) of the fold (200) and the edge region (310) of the optical element (300). [2] Optoelectronic component (10, 20) according to claim 1, wherein a height (211) of the fold (200) differs from a thickness (311) of the edge region (310) of the optical element (300) by less than 40%, preferably by less than 20%, preferably by less than 10%. [3] Optoelectronic component (10, 20) according to one of claims 1 and 2, wherein a gap (250) is formed between the edge region (310) of the optical element (300) and the cheek (220) of the fold (200), wherein the gap (250) has a width (251) of less than 200 µm or less than 100 µm. [4] Optoelectronic component (10, 20) according to one of the preceding claims, wherein an obtuse angle (230) is included between the cheek (220) of the fold (200) and the shoulder (210) of the fold (200). [5] Optoelectronic component (10, 20) according to one of the preceding claims, wherein the upper side (101) of the housing body (100) has a rectangular shape, wherein the shoulder (210) of the fold (200) is formed only in the corners (240) of the fold (200). [6] Optoelectronic component (10, 20) according to one of the preceding claims, wherein the housing body (100) comprises a cavity (110) having an opening (120) on the top side (101) of the housing body (100). [7] Optoelectronic component (10, 20) according to claim 6, wherein the fold (200) surrounds the opening (120) of the cavity (110). [8] Optoelectronic component (10, 20) according to one of claims 6 and 7, wherein the optical element (300) covers the opening (120) of the cavity (110). [9] Optoelectronic component (10) according to one of claims 6 to 8, wherein a side wall (140) of the cavity (110) forms a reflector (150). [10] Optoelectronic component (10) according to claim 9, wherein the reflector (150) has a gold coating (160). [11] Optoelectronic component (10) according to one of claims 9 and 10, wherein the adhesive (260) partially covers the reflector (150). [12] Optoelectronic component (10, 20) according to one of the preceding claims, wherein the optical element (300) comprises an optical lens (330). [13] Optoelectronic component (10, 20) according to claim 12, wherein the optical lens (330) is arranged on a bottom side (302) of the optical element (300), wherein the optical lens (330) extends into the cavity (110). [14] Optoelectronic component (10, 20) according to one of claims 12 and 13, wherein the optical lens (330) is asymmetric. [15] Optoelectronic component (10) according to one of the preceding claims, wherein the optoelectronic component (10) comprises a carrier (400) having a die attachment field (410) arranged on a top side (401) of the carrier (400) and a soldering field (430) arranged on a bottom side (402) of the carrier (400), wherein the housing body (100) is arranged on the upper side (401) of the carrier (400). [16] Optoelectronic component (10) according to claim 15, wherein at least one via (440) extends through the carrier (400) between the die attachment field (410) and the solder field (430). [17] Optoelectronic component (10) according to one of claims 15 and 16, wherein a bottom side (102) of the housing body (100) has a cutout (130), wherein an optoelectronic semiconductor chip (500) is arranged on the die attachment field (410) of the carrier (400) in the cutout (130) of the package body (100).

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