PLASMONY RESONATOR COMPREHENSIVE HYBRID SENSOR

Abstract

Sensor, showing: a plasmonic thin film (510), wherein the plasmonic thin film exhibits sensitivity to a known analyte; and a semiconductor structure comprising a source (554) and a drain (558) of a field-effect transistor (550), wherein the plasmonic thin film is physically and electrically connected to a gate (562) of the semiconductor structure.

Description

TECHNICAL AREA

[0001] The present invention relates generally to a sensor and in particular to a multimodal sensor which combines electrical and optical sensors. BACKGROUND

[0002] The detection of chemical and biological elements can be used for health monitoring and environmental monitoring. Health monitoring is important for investigating and supporting individuals' personal health needs, whether for personal use or in a healthcare setting. Monitoring chemical and biological elements in the environment is crucial for environmental safety and security concerns. Ideally, sensors with high sensitivity for these elements should be used, and the collected data should be transmitted remotely via wired or wireless means to a remote monitoring point.

[0003] Publication US 2018 / 0188171A1 relates to a chemical sensor comprising: a carbon nanotube test area; a detector configured to receive a signal from the carbon nanotube test area that responds to illumination of the nanotube test area; and a matching module configured to determine, based on a comparison between the signal and a spectral profile of the chemical, whether a chemical is present on the carbon nanotube test area.

[0004] Publication US 2016 / 0123973A1 relates to a multimodal biosensor device comprising: at least two sensors selected from: (i) a nanomechanical resonator; (ii) plasmonic nanodisk antennas; and (iii) a field-effect transistor, wherein the biosensor device is capable of converting the adsorption of biomolecules on the biosensor device into at least two signals selected from optical, electrical, and mechanical signals. SUMMARY

[0005] The invention relates to sensors and a method, the features of which are specified in the corresponding claims. Embodiments are specified in the dependent claims.

[0006] A semiconductor structure is provided. The semiconductor structure comprises a channel connecting a source and a drain on the semiconductor substrate, the channel including a plasmonic resonator.

[0007] A sensor is provided. The sensor comprises a plasmonic thin film, wherein the plasmonic thin film includes a sensitivity for a known analyte, a semiconductor structure comprising a source and a drain of a field-effect transistor, and an electrical connection between the plasmonic thin film and a gate of the semiconductor structure.

[0008] A method for forming a sensor is provided. The method comprises forming a field-effect transistor (“FET”) on a semiconductor substrate, wherein the field-effect transistor comprises a source, a drain, and a gate, the gate comprising a plasmonic resonator. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] These and other tasks, features, and advantages of the present invention will become apparent from the following detailed description of illustrative embodiments, which should be read in conjunction with the accompanying drawings. The various features of the drawings are not to scale, as the illustrations, in conjunction with the detailed description, are intended to provide clarity for those skilled in the art to understand the invention. In the drawings: presents Fig. 1. A graph according to one embodiment; Fig. Figure 2 shows a block diagram of components of a Fourier transform infrared spectrometer according to one embodiment; Fig. 3A and Fig. Figure 3B shows a cross-sectional view or a top view of a semiconductor according to one embodiment; Fig. Figure 4A shows a cross-sectional view of a semiconductor according to one embodiment; Fig. Figure 4B shows a cross-sectional view of a semiconductor according to one embodiment; Fig. Figure 5 shows a cross-sectional view of a semiconductor according to one embodiment; Fig. Figure 6 shows a cross-sectional view of a semiconductor according to one embodiment; Fig. Figure 7 shows a flowchart of a procedure for carrying out a recording procedure according to one embodiment; Fig. Figure 8 shows a block diagram of internal and external components of computers and servers according to one embodiment; Fig. Figure 9 shows a cloud computing environment according to one embodiment and Fig. Figure 10 shows abstraction model layers according to an embodiment of the present invention. DETAILED DESCRIPTION

[0010] This document discloses detailed embodiments of the claimed structures and methods.

[0011] Embodiments of the present invention relate to sensors, and in particular a multimodal sensor that combines an electrical sensor and an optical sensor. The exemplary embodiments described below provide a system, a method, and a software product for, among other things, combining the speed and sensitivity of an electrical sensor with the chemical sensitivity of an optical sensor by using a material that has dual functionality as a channel of the electrical sensor and as a plasmonic resonator. The embodiments of the present invention have the potential to improve the technical fields of both medical examinations and environmental monitoring.

[0012] As previously described, health monitoring or medical monitoring is important for investigating and supporting individuals' personal health needs, either for personal use or within a healthcare setting. Monitoring chemical and biological elements in the environment is crucial for environmental safety and security concerns. It is desirable to have sensors with high sensitivity for such elements and to transmit the collected data remotely, via wired or wireless means, to a remote monitoring point.

[0013] Bioanalytical sensors are useful for health screenings and monitoring. Examples of analytes that can be used in health screenings include glucose, cholesterol, calcium, blood cell count, and vitamin levels.

[0014] Environmental sensors are useful for monitoring air quality and can be used to detect leaks and monitor hazardous contaminants. This can help protect the environment and human health. Examples of analytes that can be detected in an environment include various types of gases, such as methane, carbon dioxide, hydrogen chloride, pH, carbon monoxide, and explosive gases.

[0015] A wireless digital sensor can electronically transmit information from one location to another. This information can be stored for comparison between locations and over time.

[0016] An electrical sensor can use changes in charge, current, or voltage to detect changes in charge. The charge on the sensing surface can cause a change in current between a source and a drain of a field-effect transistor (hereinafter referred to as "FET") of the electrical sensor. In one embodiment, an electrical sensor can use one or more field-effect transistors (hereinafter referred to as "FETs"). Alternatively, an electrical sensor can use one or more bipolar junction transistors (hereinafter referred to as "BJTs"). FET sensors are sensitive to charges (Q) on a sensing surface. The sensing surface can be a gate dielectric surface or a gate electrode. Ions and many biomolecules (proteins, exosomes, viruses) carry charges.When the ion or biomolecule binds to the detection surface, it causes a change in the surface potential, which in turn changes the detection current. Specificity is achieved by functionalizing the detection surface so that only a target analyte binds to it. The detection surface can become more or less conductive as a result of the analyte or reactant. The advantages of using an electrical sensor include speed and sensitivity.

[0017] An optical sensor uses Fourier transform infrared spectroscopy (hereinafter referred to as "FTIR") to measure a range of infrared wavelengths absorbed by a material under investigation. A broadband light source is guided through a sample by an interferometer to an infrared detector, which measures a range of infrared wavelengths absorbed by the sample or unit under investigation. The infrared absorption wavelength bands identify molecular components and structures in the sample, thus identifying the analyte present. Molecules can be sensitively and specifically identified and analyzed by their infrared spectrum of molecular vibrations / rotations. FTIR allows for the determination of the analyte concentration present in the sample.

[0018] When a molecule is located near a plasmonic resonator / antenna (typically within a distance of several tens of nanometers), its absorption can be radically enhanced due to the Purcell effect, which arises from the high concentration of optical modes near the resonator. In the infrared, this effect is called surface-enhanced infrared absorption (SEIRA) and is similar to the well-known surface-enhanced Raman scattering (SERS) effect. When using SEIRA, an optical field is spatially concentrated at a molecule by means of a plasmonic resonance, thereby enhancing the absorption of that molecule.

[0019] Plasmonic resonators can be made of metals or heavily doped semiconductors and can include low-dimensional materials. Low-dimensional materials are those with a sufficiently low charge density that they do not shield electric fields. Their resonant frequency is a function of the material, its geometry, and its charge density.

[0020] In one embodiment, a material for the multimodal sensor can be selected that performs a dual role as a semiconductor material for the electrical sensor and as a good plasmonic resonator for the optical sensor. Material properties required for the semiconductor material include good transistor channel properties, high mobility, low charge density, and low dimensionality to prevent electric field shielding. Material properties required for the plasmonic resonator include a material that functions as a good optical cavity, low optical loss, low dimensionality, and a suitable charge density. The charge is configured such that the plasmonic resonator exhibits a response in the infrared range.The material can be specifically manufactured as a good plasmonic resonator for a particular molecule or analyte.

[0021] In one embodiment, the material can comprise silicon, carbon nanotubes, and graphene. Each of these materials can serve a dual role as a channel material for a FET in the electrical sensor and as a plasmonic resonator. Using the material as a channel material for the FET allows for the concentration of an optical field due to its plasmonic resonator properties.

[0022] Graphene, a two-dimensional crystal of carbon atoms, can be used for gas sensors, chemical sensors, and biosensors. Carbon nanotubes are rolled-up graphene sheets. Due to their high surface-to-volume ratio and electronic sensitivity to surface molecules, graphene and carbon nanotubes can be used to detect an analyte, such as an environmental substance. The electronic sensitivity of graphene and carbon nanotubes can manifest as a change in their resistance and conductivity when molecules from the environment are absorbed. Graphene can be treated, functionalized, or cut to detect specific molecules or analytes. Graphene and carbon nanotubes can be used to detect analytes and provide a digital signal.

[0023] With reference to the accompanying drawings in Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9 to Fig. Section 10 below describes in detail a method for manufacturing sensors according to an illustrative embodiment.

[0024] Now, referring to Fig. Figure 1 shows a graph 100 according to an exemplary embodiment. Graph 100 shows the current as a function of a gate voltage between a source and a drain of a field-effect transistor sensor (hereinafter referred to as a "FET" sensor) fabricated with a graphene or carbon nanotube gate channel that is sensitive to a specific analyte. As shown in graph 100, the current between a source and a drain of the FET increases when the gate voltage between the source and the drain increases. The solid line in graph 100 shows an operating state in the absence of the specific analyte. An initial current, I1, occurs at a gate voltage V1 in the absence of the specific analyte. The dashed line in graph 100 shows a shift of the gate voltage curve relative to the current.The current characteristic changes when influenced by the presence of a low concentration of the specific analyte. At a low concentration of the specific analyte, a second current, I2, occurs at the gate voltage V1, which is lower than the first current, I1. The dotted line in Graph 100 shows a shift in the characteristic curve of the gate voltage relative to the current when influenced by the presence of a high concentration of the specific analyte. At a high concentration of the specific analyte, a third current, I3, occurs at the gate voltage V1, which is lower than the second current, I2. Thus, when a gate voltage V1 is applied, a measurement of the current between the source and the drain indicates the concentration of the specific analyte present.

[0025] In one embodiment, the FET channel can comprise graphene or carbon nanotubes, and the absorption of the analyte on the graphene or carbon nanotubes can influence the current versus the gate voltage of the FET. The FET can be used as a sensor by measuring the current at a specific gate voltage. The dashed and dotted lines in Graph 100 each show a shift in the current characteristic curve versus the gate voltage when influenced by a low and a high concentration of a chemical molecule or analyte, respectively.

[0026] Specifically, if the gate voltage is V1 and the measured current is I1, this indicates that no analyte is present. If the gate voltage is V1 and the measured current is I2, then a small amount of analyte is present. If the gate voltage is V1 and the measured current is I3, then a large amount of analyte is present.

[0027] The relationship between gate voltage and current changes with the concentration of the analyte present. This allows the analyte concentration to be determined at a specific voltage difference between the source and the drain.

[0028] Graphene or carbon nanotubes can influence an electrical property, as in Fig. Figure 1 illustrates this. A surface functionalization can be performed on the graphene or carbon nanotubes such that, by adding other molecules to the nanotubes, they are sensitized to absorb a specific analyte. The presence of a specific analyte influences a conductivity property of the graphene or carbon nanotube. In this way, the graphene or carbon nanotubes can be used as medical or environmental sensors. The current property in the graphene or carbon nanotubes differs depending on the absence or concentration of the specific analyte. In one embodiment, the graphene or carbon nanotubes can be fabricated as a channel between a source and a drain of a FET.

[0029] In one embodiment, an analyte can be an acidic gas such as hydrogen chloride (HCl), glucose, carbon monoxide, or an explosive gas.

[0030] In an alternative embodiment, the current between a source and a drain for a specific gate voltage for the FET with a plasmonic resonator can be higher than the current between the source and the drain for the specific gate voltage for the FET without a plasmonic resonator.

[0031] Now, referring to Fig. Figure 2 shows a block diagram of a Fourier transform infrared spectrometer (hereinafter referred to as "FTIR" spectrometer) 200 according to one embodiment. The FTIR spectrometer 200 is an optical sensor and comprises a broadband light source 202, a beam splitter 204, a first mirror 206, a second mirror 208, a mounting surface 212 for a device under test (hereinafter referred to as "DUT" (Device Under Test)) 300, and a detector 210. As described above, the broadband light source 202 emits light to the beam splitter 204, which deflects the light to both the first mirror 206 and the second mirror 208. The first mirror 206 and the second mirror 208 reflect light back to the beam splitter 204. The beam splitter 204 directs light onto the DUT 300, which is mounted on the mounting surface 212.The detector 210 measures a range of wavelengths in the infrared region that are absorbed by the DUT 300, thereby identifying whether an analyte is present in the DUT 300. The detector 210 may include a data processing unit.

[0032] As described above, FTIR can identify the concentration of an analyte present in the DUT 300.

[0033] Now, referring to Fig. 3A and Fig. Figure 3B shows the DUT 300 according to one embodiment. Fig. 3A is a cross-sectional view of the DUT 300 and Fig. 3B is a top view of Fig. 3A along section line AA. The DUT 300 can be a hybrid field-effect transistor (hereinafter referred to as "FET") that has been modified to detect specific molecules or analytes. The DUT 300 comprises a source 302, a drain 304, a channel 310, a substrate 312, a dielectric 314, an insulator 316, and an upper layer 320.

[0034] The DUT 300 can be manufactured using conventional FET methods and is a hybrid due to a modification in the material and a structuring of the channel 310, which enables the channel 310 to function as a plasmonic resonator that has been treated to detect specific molecules or analytes.

[0035] Substrate 312 can be made from any of several known semiconductor materials, such as a silicon-on-insulator (SOI) wafer. Other non-restrictive examples include solid silicon, silicon, germanium, silicon-germanium alloy, silicon carbide, silicon-germanium carbide alloy, and compound semiconductor materials (e.g., III-V and II-VI compound semiconductor materials). Non-restrictive examples of compound semiconductor materials include gallium arsenide, indium arsenide, and indium phosphide. Typically, substrate 312 can be approximately several hundred micrometers thick, without limitation. For example, the substrate can have a thickness in the range of 0.5 mm to approximately 1.5 mm.

[0036] In one embodiment, the DUT 300 can be fabricated on the substrate 312 using existing fabrication techniques. For example, the DUT 300 can be fabricated in the conventional manner with an open space that does not connect the source 302 and the drain 304, so that the channel 310 can subsequently be added after fabrication of the insulator or dielectric 316.

[0037] In one embodiment, the dielectrics 314 and 316 may comprise SiO2, HfO2 or other dielectric materials.

[0038] Channel 310 comprises a plasmonic resonator sensitized to absorb a specific analyte. The presence of this analyte influences the electrical conductivity of the plasmonic resonator. In this way, the plasmonic resonator can be used as a sensor. Depending on the presence or absence of the specific analyte, the conductivity characteristics of the plasmonic resonator vary. In this embodiment, the plasmonic resonator can be used as Channel 310 and serve as a gate between Source 302 and Drain 304.

[0039] Channel 310 can comprise silicon, graphene, gold, silver, carbon nanotubes, and metal oxides, among other materials. Channel 310 can be patterned during the semiconductor fabrication process. This structuring process can utilize conventional photolithography or electron beam lithography. First, the channel material is deposited onto the substrate. Next, a polymer resist is applied to the substrate via spin coating, followed by patterning of the resist using photolithography or electron beam lithography. The channel material is then dry-set or wet-set in the desired area, and finally, the resist is stripped.

[0040] As described above, graphene or carbon nanotubes can be treated, functionalized, or carbon-engineered to detect specific molecules or analytes. In one embodiment, a plasmonic resonator comprising graphene or carbon nanotubes can be used as a sensor. The plasmonic resonator exhibits different conductivity characteristics when exposed to an analyte than when it is not. In another embodiment, a FET can include a graphene channel. Depending on the voltage between the source and drain, the FET can exhibit a different threshold voltage and current response when exposed to the analyte and a different analyte concentration than when it is not exposed to the analyte.

[0041] In one embodiment, the upper layer 320 can comprise a solution which is being tested for the concentration of the analyte, for example, by examining a blood sample for a medical examination. In the DUT 300, the channel 310 can be exposed to the solution, and other components of the DUT 300 can be protected from the solution by the insulator 316. The solution can contain the analyte dissolved in it. In this way, the plasmonic resonator of the channel 310 is exposed to the solution to determine an analyte concentration or quantity in the blood sample.

[0042] In one embodiment, the upper layer 320 can be an open environment for environmental testing. In the DUT 300, the channel 310 can be exposed to the solution, and other components of the DUT 300 can be protected from the solution by the insulator 316. In this way, the plasmonic resonator of the channel 310 is exposed to an open environment for determining the presence of the analyte.

[0043] Now, referring to Fig. Figure 4A shows a front view of a DUT 400 according to one embodiment. The DUT 400 can be essentially the same as the DUT 300, except that the DUT 400 can include an array of FETs comprising FET 300A, FET 300B, and FET 300C. Each FET in the array can be configured to be a sensor for a different analyte, each tailored to act as a plasmonic resonator when exposed to the specific analyte for which it was designed.

[0044] In one embodiment, the upper layer 320 can be exposed to air and each FET of the array of FETs can investigate a different analyte.

[0045] Now, referring to Fig. Figure 4B shows a front view of a DUT 410 according to one embodiment. The DUT 410 can be essentially the same as the DUT 300, except that the DUT 410 can comprise an array of FETs, including the FET 300D, the FET 300E, and the FET 300F. In one embodiment, the top layer 320 can be exposed to air, while the FET 300D and the FET 300E are not. The top layer 340 can be an insulator covering the channel 310 of the FET 300F, and a control FET, which is not exposed to air, can be used.

[0046] In one embodiment, each of the array of FETs can be configured to be a sensor for a different analyte, each tailored to act as a plasmonic resonator when exposed to the specific analyte for which it was designed.

[0047] In an alternative embodiment, the FET 300D, the FET 300E and the FET 300F can be tailored to function as a plasmonic resonator for the same analyte, and duplicated FETs and a control FET can be used to confirm the concentration and presence of the analyte.

[0048] In one embodiment, the DUT 410 can comprise a combination of plasmonic resonator FETs as controls which are not exposed to any analyte, and a combination of duplicated plasmonic resonator FETs or unique plasmonic resonator FETs which are exposed to possible analytes, either in open air or in a solution.

[0049] In one embodiment, the array can contain several thousand FETs.

[0050] Now, referring to Fig. Figure 5 shows a unit to be examined (hereinafter referred to as “DUT”) 500 and a field-effect transistor (hereinafter referred to as “FET”) 550 according to an embodiment. Fig. Figure 5 shows a cross-sectional view of the DUT 500 and a cross-sectional view of the FET 550. The DUT 500, together with the FET 550, can be an alternative embodiment for a unit used to detect specific molecules or analytes.

[0051] The DUT 500 comprises a substrate 512, a dielectric 514, a plasmonic thin film 510, and an upper layer 520. The FET 550 comprises a substrate 552, a source 554, a silicon layer 556, a drain 558, a gate dielectric 560, and a gate 562. Similarly designated components of the DUT 500 and the FET 550 can have the same function and be formed, and may comprise the same materials as components of the DUT 300. The plasmonic thin film 510 is physically and electrically connected to the gate 562 of the FET 550.

[0052] The plasmonic thin film 510 can function as a plasmonic resonator and may be sensitized to absorb a specific analyte, as previously described in relation to channel 310 of the DUT 300. The plasmonic thin film 510 may comprise silicon, graphene, gold, silver, carbon nanotubes, and metal oxides, among other materials.

[0053] The FET 550 can be fabricated using conventional methods. The plasmonic thin film 510 is conductive and forms a common detection surface for both the optical sensor, i.e., the FTIR spectrometer 200, and the electronic sensor, i.e., the measurement of a threshold voltage and current of the FET 550 when the voltage between the source 554 and the drain 558 increases.

[0054] The plasmonic thin film 510 is in contact with the upper layer 520. In one embodiment, the upper layer 520 can comprise a solution which is being tested for a specific concentration of the analyte, for example, to examine a blood sample for a medical examination. In the DUT 500, the plasmonic thin film 510 can be exposed to the solution, which may contain the analyte dissolved therein.

[0055] In one embodiment, the upper layer 320 can be open to the air for examining the surroundings.

[0056] Advantages of the FET 550 being electrically connected and not physically located inside the FTIR 200 include the ability to connect a plasmonic thin film 510 to more than one FET 550. The plasmonic thin film 510 can be connected to a group of two or more FETs 550. Each FET in the group of two or more FETs 550 can be sensitized to a specific analyte, used as a duplicate to improve result accuracy, or be a control FET 550 not connected to the plasmonic thin film 510.

[0057] Now, referring to Fig. 6, therein a unit to be examined (hereinafter referred to as “DUT”) 600 and a bipolar junction transistor (hereinafter referred to as “BJT”) 650 are shown according to an embodiment. Fig. Figure 6 shows a cross-sectional view of the DUT 600 and a cross-sectional view of the BJT 650. The DUT 600, together with the BJT 650, can be an alternative embodiment of a unit used for detecting specific molecules or analytes.

[0058] The DUT 600 comprises a substrate 612, a dielectric 614, a plasmonic thin film 610, and an upper layer 620. The BJT 650 comprises a substrate 652, an emitter 654, a base 656, and a collector 658. Similarly designated components of the DUT 600 and the BJT 650 can have the same function and be formed, and may comprise the same materials as components of the DUT 300. The plasmonic thin film 610 can be physically and electrically connected to the base 656 of the BJT 650.

[0059] The plasmonic thin film 610 can function as a plasmonic resonator and may be sensitized to absorb a specific analyte, as previously described in relation to channel 310 of the DUT 300. The plasmonic thin film 610 may comprise silicon, graphene, gold, silver, carbon nanotubes, and metal oxides, among other materials.

[0060] The BJT 650 can be manufactured using conventional methods.

[0061] The plasmonic thin film 610 is conductive and forms a common detection surface for both the optical sensor, i.e. the FTIR spectrometer 200, and the electronic sensor, i.e. the measurement of a collector current of the BJT 650, when the voltage at the emitter 654 changes, while the voltage at the collector 658 and the voltage at the base 656 are both kept constant.

[0062] The plasmonic thin film 610 is in contact with the upper layer 620. In one embodiment, the upper layer 620 can comprise a solution which is being tested for a specific concentration of the analyte, for example, to examine a blood sample for a medical examination. In the DUT 600, the plasmonic thin film 610 can be exposed to the solution, which may contain the analyte dissolved therein.

[0063] In one embodiment, the upper layer 620 can be open to the air for examining the surroundings.

[0064] Advantages of the BJT 650 being electrically connected and not physically located inside the FTIR 200 include the ability to connect a plasmonic thin film 610 to more than one BJT 650. The plasmonic thin film 610 can be connected to a group of two or more BJTs 650. Each BJT in the group of two or more BJTs 650 can be sensitized to a specific analyte, used as a duplicate to improve result accuracy, or be a control BJT 650 not connected to the plasmonic thin film 610.

[0065] Now, referring to Fig. Figure 7 shows a flowchart according to an embodiment, illustrating a detection method 700. In Figure 702, the unit under investigation can be mounted in the FTIR spectrometer 200. The unit under investigation may have been sensitized to react to a specific analyte via a plasmonic component.

[0066] Next, at 704, the unit to be examined can either be exposed to air which may contain the specific analyte, or it can be exposed to a solution which contains a dissolved material which may contain the specific analyte.

[0067] At 706, the examination can be carried out on the unit under investigation. An optical examination can include testing with the FTIR spectrometer 200. An electrical examination can include applying a voltage difference and measuring a threshold voltage and a resulting current at different voltage differences.

[0068] At 708, the presence and concentration of the specific analyte are determined. This is done using the FTIR spectrometer 200 and electrical analysis.

[0069] A semiconductor device can be specifically designed to include a channel or gate element made of a conductive material that can be used as a plasmonic material. This plasmonic material can be chemically programmed to detect a specific analyte and can be analyzed using FTIR to determine its presence. Furthermore, the plasmonic material establishes a threshold voltage and current based on a voltage difference applied to the semiconductor device, which are then used to determine the presence and concentration of the specific analyte.

[0070] Now, referring to Fig. Figure 8 shows a block diagram of components of a data processing unit such as that contained in the detector 210 of the FTIR spectrometer 200, according to an embodiment of the present invention. It is understood that Fig. Figure 8 merely provides an illustration of one implementation and implies no limitations regarding the environments in which different embodiments can be realized. Many modifications can be made to the depicted environment.

[0071] The data processing unit can comprise one or more processors 802, one or more computer-readable RAMs 804, one or more computer-readable ROMs 806, one or more computer-readable storage media 808, unit drivers 812, a read / write drive or read / write interface 814, a network adapter or network interface 816, all connected via a data transmission architecture 818. The data transmission architecture 818 can be implemented with any architecture designed to transmit data and / or control information between processors (e.g., microprocessors, data transmission and network processors, etc.), system memory, peripheral units, and any other hardware components within a system.

[0072] One or more operating systems 810 and one or more application programs 811 are stored for execution by one or more of the processors 802 via one or more of the corresponding RAMs 804 (which typically include cache memory) on one or more of the computer-readable storage media 808. For example, the process 700 for recording the presence and concentration of an analyte may be stored on one or more of the computer-readable storage media 808.In the illustrated embodiment, each of the computer-readable storage media 808 can be a magnetic disk storage unit of an internal hard disk drive, a CD-ROM, a DVD, a memory stick, a magnetic tape, a magnetic disk, an optical disk, a semiconductor storage unit such as a RAM, a ROM, an EPROM, a flash memory, or any other computer-readable physical storage unit capable of storing a computer program and digital information.

[0073] The data processing unit may also include the R / W drive or R / W interface 814 for reading from one or more and writing to one or more of the removable computer-readable storage media 826. Application programs 811 on the data processing unit may be stored on one or more of the removable computer-readable storage media 826, read via the corresponding R / W drive or R / W interface 814, and loaded onto the corresponding computer-readable storage media 808.

[0074] The data processing unit may also include the network adapter or network interface 816, such as a TCP / IP adapter card or a wireless communication adapter (e.g., a 4G wireless communication adapter with OFDMA technology). Application programs 811 can be downloaded from an external computer or storage device to the data processing unit via a network (e.g., the Internet, a local area network, or another wide area network or wireless network) and the network adapter or network interface 816. From the network adapter or network interface 816, the programs can be loaded onto the computer-readable storage media 808. The network may include copper wires, fiber optic cables, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers.

[0075] The data processing unit may also include a display screen 820, a keyboard or keypad 822, and a computer mouse or touchpad 824. Unit drivers 812 are connected to the display screen 820, the keyboard or keypad 822, the computer mouse or touchpad 824, and / or to the display screen 820 for print capture of alphanumeric input and user selections. The unit drivers 812, the read / write drive or interface 814, and the network adapter or interface 816 may include hardware and software (stored on the computer-readable storage media 808 and / or the ROM 806).

[0076] The programs described herein are identified based on the application for which they are implemented in a specific embodiment of the invention. However, it is understood that any specific program nomenclature used herein is for simplicity only, and the invention is therefore not intended to be limited to use in only one specific application identified and / or implied by such nomenclature.

[0077] Embodiments of the invention can be provided to end users via a cloud computing infrastructure. Cloud computing generally refers to the provision of scalable data processing resources as a service over a network. More formally, cloud computing can be defined as a data processing capability that provides an abstraction between the data processing resource and its underlying technical architecture (e.g., servers, storage, networks), thereby enabling convenient, on-demand network access to a shared pool of configurable data processing resources that can be rapidly provisioned and released with minimal administrative overhead or service provider interaction. Thus, cloud computing allows a user to access virtual data processing resources (e.g.,Accessing storage, data, applications and even entire virtualized data processing systems in "the cloud" without considering the underlying physical systems (or locations of those systems) used to provide the data processing resources.

[0078] Typically, cloud computing resources are provided to a user on a pay-as-you-go basis, with users only being charged for the data processing resources they actually use (e.g., the amount of storage space used or the number of virtualized systems instantiated by the user). A user can access any of the resources located in the cloud at any time and from anywhere on the internet. In the context of the present invention, a user can access a standardized search engine or related data located in the cloud. The standardized search engine can, for example, run on a data processing unit in the cloud and perform standardized searches. In such a case, the standardized search engine could standardize a corpus of information and store an index of the standardizations at a storage location in the cloud.This allows a user to access this information from any data processing system connected to a network linked to the cloud (e.g., the internet).

[0079] It should be clarified from the outset that the implementation of the teachings set forth herein is not limited to a cloud computing environment, although the present disclosure includes a detailed description of cloud computing. Instead, embodiments of the present invention can be implemented together with any type of data processing environment, now known or hereafter invented.

[0080] Cloud computing is a service delivery model that enables seamless, on-demand network access to a shared pool of configurable computing resources (e.g., networks, network bandwidth, servers, processing power, main memory, storage, applications, virtual machines, and services) that can be rapidly provisioned and released with minimal management overhead or interaction with a service provider. This cloud model can include at least five characteristics, at least three service models, and at least four deployment models.

[0081] The properties are as follows:

[0082] On-Demand Self-Service: A cloud user can unilaterally and automatically provide data processing functions such as server time and network storage as needed, without requiring human interaction with the service provider.

[0083] Broad Network Access: Functions are available over a network, accessed through standard mechanisms that support use by heterogeneous thin or thick client platforms (e.g., mobile phones, laptops, and PDAs).

[0084] Resource pooling: The provider's data processing resources are pooled to serve multiple users using a multi-tenant model, with various physical and virtual resources being dynamically allocated and reassigned as needed. There is a perceived location independence, as the user generally has no control over or knowledge of the exact location of the provided resources, but may be able to define a location at a higher level of abstraction (e.g., country, state, or data center).

[0085] Rapid Elasticity: Features can be deployed quickly and elastically for rapid horizontal scaling (scale-out), in some cases automatically, and released quickly for rapid scale-in. To the user, the available features often appear unlimited and can be acquired in any quantity at any time.

[0086] Measured Service: Cloud systems automatically control and optimize resource usage by employing a measurement function at a certain level of abstraction appropriate for the type of service (e.g., storage, processing, bandwidth, and active user accounts). Resource usage can be monitored, controlled, and reported, thereby creating transparency for both the provider and the user of the service.

[0087] The service models are as follows:

[0088] Software as a Service (SaaS): The functionality provided to the user consists of using the provider's applications running in a cloud infrastructure. These applications are accessible from various client devices via a thin-client interface, such as a web browser (e.g., web-based email). The user does not manage or control the underlying cloud infrastructure, including the network, servers, operating systems, storage, or even individual application functions, with the possible exception of limited user-specific application configuration settings.

[0089] Platform as a Service (PaaS): The function provided to the user is to deploy applications created or obtained by the user, using programming languages ​​and tools supported by the provider, within the cloud infrastructure. The user does not manage or control the underlying cloud infrastructure, including networks, servers, operating systems, or storage, but has control over the deployed applications and potentially over configurations of the application hosting environment.

[0090] Infrastructure as a Service (IaaS): The functionality provided to the user consists of supplying processing, storage, networking, and other basic data processing resources, enabling the user to deploy and run any software, including operating systems and applications. The user does not manage or control the underlying cloud infrastructure but has control over operating systems, storage, deployed applications, and potentially limited control over selected network components (e.g., host firewalls).

[0091] The following are the deployment models:

[0092] Private Cloud: The cloud infrastructure is operated solely for one organization. It can be managed by the organization or a third party and can be located on the organization's own premises or on external premises.

[0093] Community Cloud: This cloud infrastructure is shared by multiple organizations and supports a specific user community with shared concerns (e.g., mission, security requirements, policies, and regulatory compliance considerations). It can be managed by the organizations themselves or a third party and can be located on-premises or external premises.

[0094] Public Cloud: The cloud infrastructure is made available to the general public or a large industry group and is owned by an organization that sells cloud services.

[0095] Hybrid Cloud: The cloud infrastructure is a composition of two or more clouds (private, community or public) that remain separate units but are connected by a standardized or proprietary technology that enables data and application portability (e.g. cloud audience distribution for load balancing between clouds).

[0096] A cloud computing environment is service-oriented, focusing on state independence, low coupling, modularity, and semantic interoperability. At the heart of cloud computing is an infrastructure consisting of a network of interconnected nodes.

[0097] Now, referring to Fig. Figure 9 shows the illustrative Cloud Computing Environment 900. As shown, the Cloud Computing Environment 900 comprises one or more Cloud Computing Nodes 910, with which local data processing units used by cloud users, such as the electronic assistant (PDA, Personal Digital Assistant) or mobile phone 940A, the desktop computer 940B, the laptop computer 940C, and / or the automotive computer system 940N, can exchange data. The Cloud Computing Nodes 910 can exchange data with each other. They can be grouped physically or virtually into one or more networks, such as private, community, public, or hybrid clouds (not shown), as described above, or into a combination thereof. This enables the Cloud Computing Environment 900 to offer infrastructure, platforms, and / or software as services, for which a cloud user does not need to maintain resources on a local data processing unit.It should be noted that the types of in . Fig. The data processing units 940A to N shown are for illustrative purposes only, and the cloud computing nodes 910 and the cloud computing environment 900 can exchange data with any type of computer unit via any type of network and / or any type of network-accessible connection (e.g., using a web browser).

[0098] Now, referring to Fig. 10, there is a group of functional abstraction layers represented by the Cloud Computing Environment 900 ( Fig. 9) will be provided. It should be clear from the outset that the in Fig.The components, layers, and functions shown in Figure 10 are for illustrative purposes only, and embodiments of the invention are not limited to them. As shown, the following layers and corresponding functions are provided:

[0099] A hardware and software layer 1060 comprises hardware and software components. Examples of hardware components include: mainframe computers 1061; servers based on the RISC (Reduced Instruction Set Computer) architecture 1062; servers 1063; blade servers 1064; storage units 865; and networks and network components 1066. In some embodiments, software components include network application server software 1067 and database software 1068.

[0100] A virtualization layer 1070 provides an abstraction layer from which the following examples of virtual entities can be provided: virtual servers 1071, virtual storage 1072, virtual networks 1073, including virtual private networks; virtual applications and operating systems 1074; and virtual clients 1075.

[0101] In one example, the management layer 1080 can provide the functions described below. Resource provisioning (1081) provides the dynamic procurement of data processing resources and other resources used to perform tasks within the cloud computing environment. Metering and pricing (1082) provides cost tracking for resource usage within the cloud computing environment and billing for resource consumption. In one example, these resources could include application software licenses. Security provides identity verification for cloud users and tasks, as well as protection for data and other resources. User portal (1083) provides users and system administrators with access to the cloud computing environment.Service Scope Management (1084) provides the allocation and management of cloud computing resources to ensure that required service goals are met. Service Level Agreement (SLA) Planning and Fulfillment (1085) provides the pre-deployment and procurement of cloud computing resources for which a future need is anticipated, in accordance with an SLA.

[0102] A workload layer 1090 provides examples of the functionality for which the cloud computing environment can be used. Examples of workloads and functions that can be provided by this layer include: mapping and navigation 1091; software development and lifecycle management 1092; delivery of training in virtual classrooms 1093; data analytics processing 1094; transaction processing 1095; and sensor program 1096. The sensor program 1096 can refer to examining a unit under investigation to determine the presence and concentration of an analyte.

[0103] The present invention may comprise a system, a method, and / or a computer program product with any level of integration of technical details. The computer program product may include a computer-readable storage medium (or media) containing computer-readable program instructions to induce a processor to execute aspects of the present invention.

[0104] A computer-readable storage medium can be a physical unit capable of retaining and storing instructions for use by a system for executing instructions. For example, a computer-readable storage medium can be an electronic storage unit, a magnetic storage unit, an optical storage unit, an electromagnetic storage unit, a semiconductor storage unit, or any suitable combination thereof, without limitation. A non-exhaustive list of more specific examples of computer-readable storage media includes the following: a removable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), and erasable programmable read-only memory (EPROM).Flash memory), static random-access memory (SRAM), removable compact disc read-only memory (CD-ROM), DVD (Digital Versatile Disc), USB flash drive, floppy disk, a mechanically coded unit such as punched cards or raised structures in a groove on which instructions are stored, and any suitable combination thereof. For the purposes of this text, a computer-readable storage medium shall not be understood as volatile signals per se, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide or other transmission medium (e.g., light pulses traveling through an optical fiber cable), or electrical signals transmitted by a wire.

[0105] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to individual data processing units or, via a network such as the internet, a local area network, a wide area network, and / or a wireless network, to an external computer or external storage device. The network may include copper transmission cables, fiber optic transmission lines, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each data processing unit receives computer-readable program instructions from the network and forwards the computer-readable program instructions for storage on a computer-readable storage medium within the respective data processing unit.

[0106] The computer-readable program instructions for executing the steps of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state-setting data, configuration data for integrated circuits, or either source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, etc., as well as conventional procedure-oriented programming languages ​​such as the programming language "C" or similar programming languages.The computer-readable program instructions can be executed entirely on the user's computer, partially on the user's computer as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on the remote computer or server. In the latter case, the remote computer can be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection can be made to an external computer (for example, via the internet using an internet service provider).In some embodiments, electronic circuits, including, for example, programmable logic circuits, field programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), can execute the computer-readable program instructions by using state information from the computer-readable program instructions to personalize the electronic circuits to perform aspects of the present invention.

[0107] Aspects of the present invention are described herein with reference to flowcharts and / or block diagrams of processes, devices (systems), and computer program products according to embodiments of the invention. It is noted that each block of the flowcharts and / or block diagrams, as well as combinations of blocks in the flowcharts and / or block diagrams, can be executed by means of computer-readable program instructions.

[0108] These computer-readable program instructions can be provided to a processor of a computer or other programmable data processing device to create a machine such that the instructions executed through the processor of the computer or other programmable data processing device generate means for carrying out the functions / actions specified in the block or blocks of the flowchart and / or block diagrams.These computer-readable program instructions may also be stored on a computer-readable storage medium capable of controlling a computer, programmable data processing device and / or other units to function in a particular manner, such that the computer-readable storage medium on which instructions are stored comprises a manufactured product, including instructions that implement aspects of the function / action specified in the block or blocks of the flowchart and / or block diagrams.

[0109] The computer-readable program instructions can also be loaded onto a computer, other programmable data processing device or other unit to cause a series of process steps to be executed on the computer or other programmable device or other unit in order to produce a process executed on a computer, such that the instructions executed on the computer, other programmable device or other unit implement the functions / actions specified in the block or blocks of the flowchart and / or block diagrams.

Claims

[1] Sensor, comprising: a plasmonic thin film (510), wherein the plasmonic thin film exhibits sensitivity to a known analyte; and a semiconductor structure comprising a source (554) and a drain (558) of a field-effect transistor (550), wherein the plasmonic thin film is physically and electrically connected to a gate (562) of the semiconductor structure. [2] Sensor, comprising: a unit (500) to be investigated comprising a plasmonic thin film (510) on a substrate (512), wherein the plasmonic thin film exhibits a sensitivity for a known analyte; a semiconductor structure on another substrate (522) which has a source (554) and a drain (558) of a field-effect transistor (550); and an electrical connection between the plasmonic thin film and a gate of the semiconductor structure. [3] Sensor, comprising: a plasmonic thin film (610) wherein the plasmonic thin film exhibits sensitivity to a known analyte; and a semiconductor structure comprising an emitter (654) and a collector (658) of a bipolar junction transistor (650); wherein the plasmonic thin film is physically and electrically connected to a base (656) of the semiconductor structure. [4] Sensor, comprising: a unit (600) to be investigated comprising a plasmonic thin film (610) on a substrate (612), wherein the plasmonic thin film exhibits a sensitivity for a known analyte; a semiconductor structure on another substrate (652) comprising an emitter (654) and a collector (658) of a bipolar junction transistor (650); and an electrical connection between the plasmonic thin film and a base of the semiconductor structure. [5] Sensor according to one of the preceding claims, wherein the plasmonic thin film exhibits a response in the infrared range. [6] Sensor according to any of the preceding claims, wherein the plasmonic thin film comprises carbon. [7] Sensor according to any of the preceding claims, wherein the plasmonic thin film comprises graphene or carbon nanotubes. [8] Sensor according to one of the preceding claims, further comprising: a group of two or more semiconductor structures; and an electrical connection between the plasmonic thin film and each gate of the group of two or more semiconductor structures. [9] Sensor according to any of the preceding claims, wherein the sensor comprises a plurality of sensors, each of the plurality of sensors having a sensitivity for a different analyte. [10] Procedures, including: Mounting the sensor according to one of the preceding claims with reference to claim 1 in a Fourier transform infrared spectrometer; Exposure of the sensor to an environment under investigation; and Determining the presence and concentration of a known analyte. [11] The method of claim 10, further comprising: Applying a voltage difference between a source and a drain of the field-effect transistor; Measuring a threshold voltage of the field-effect transistor; and Measuring the current of the field-effect transistor. [12] Method according to claim 10 or 11, further comprising: Measuring the infrared response of the sensor. [13] The method of claim 12, further comprising: Mounting a second sensor in the Fourier transform infrared spectrometer; and Protect the second sensor from the environment. [14] The method of claim 12, further comprising: Mounting an array of sensors in the Fourier transform infrared spectrometer. [15] Procedures, including: Mounting the sensor unit to be examined according to claim 2, the sensor according to claim 4 with reference back to claim 2, or a sensor according to one of claims 5 to 9 with reference back to claim 4 2 or 4 in a Fourier transform infrared spectrometer; Exposure of the unit under investigation (500) to an environment under investigation; and Determining the presence and concentration of a known analyte. [16] Procedure, comprehensive: Mounting the sensor according to one of claims 3 or 5 to 9 with reference to claim 3 in a Fourier transform infrared spectrometer; Exposure of the sensor to an environment under investigation; and Determining the presence and concentration of a known analyte.

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