Component assembly equipment and determination methods

Abstract

A component mounting device and a method are provided which are capable of determining the need for cleaning a measuring device depending on a component.The component mounting device includes: a component supply unit configured to supply a component to be mounted on a board; a measuring device configured to measure an electrical property of the component supplied from the component supply unit; a moving device configured to move the component supplied from the component supply unit to the measuring device; and a control device configured to determine, using an upper limit value that differs depending on the resistance value of the component, that cleaning of the measuring device is required when a number of measurements of the electrical property of the component measured by the measuring device is equal to or greater than the upper limit value.

Description

Technical area

[0001] The present disclosure relates to a technique for determining the need for cleaning of a measuring device that measures an electrical property of a component mounted on a board.

[0002] Conventionally, in a component mounter for mounting a component on a board, various methods for measuring the electrical property of the component have been proposed. For example, a component mounter disclosed in Patent Literature 1 includes an electrical property measurement section that measures an electrical property of a component. The electrical property measurement section includes two measuring electrodes and measures the electrical property of the component by bringing the two measuring electrodes into contact with the component. The measuring electrodes become contaminated with repeated measurements, for example, by blackening. Therefore, the component mounter checks the condition of the measuring electrodes and determines whether cleaning of the measuring electrodes is necessary.Specifically, the component mounting device takes an image of the measuring electrodes with a plate recognition camera, analyzes the image of the measuring electrodes, determines contamination based on the brightness of the image of the measuring electrodes, and determines the need for cleaning. List of citations Patent literature

[0003] Patent Literature 1:JP-A-2018-174249 Summary of the inventionTechnical problem

[0004] The component mounting device of Patent Literature 1 described above checks the condition of the measuring electrodes and determines the need for cleaning after every predetermined number of measurements. However, the timing of cleaning varies depending on the component measured in the past or the component being measured. Therefore, there is a need for improvement in the technique for determining the need for cleaning.

[0005] The present invention has been made in view of the above-mentioned problem, and an object of the present disclosure is to provide a component mounting apparatus and a determination method capable of determining the cleaning necessity of a measuring device depending on a component. Problem solving

[0006] To solve the problem described above, the present invention describes a component mounting apparatus comprising: a component supply unit configured to supply a component to be mounted on a board; a measuring device configured to measure an electrical characteristic of the component supplied from the component supply unit; a moving device configured to move the component supplied from the component supply unit to the measuring device; and a control device configured to determine, using an upper limit value that differs depending on the resistance value of the component, that cleaning of the measuring device is required when a number of measurements of the electrical characteristic of the component measured by the measuring device is equal to or greater than the upper limit value.

[0007] To solve the above-described problem, the present specification discloses a component mounting apparatus comprising: a component supply unit configured to supply a component to be mounted on a board; a measuring device configured to measure an electrical characteristic of the component supplied from the component supply unit; a moving device configured to move the component supplied from the component supply unit to the measuring device; and a control device configured to count, for each size of the component, a number of measurements of the electrical characteristic of the component measured by the measuring device and to determine that cleaning of the measuring device is required when at least one number of measurements among a plurality of numbers of measurements is equal to or greater than an upper limit value.

[0008] Furthermore, the content of the present disclosure is not limited to the implementation as a component mounting device, but is also useful in the implementation as a determination method for determining whether cleaning of a measuring device is necessary in a component mounting device having the measuring device. Advantageous effects of the invention

[0009] With the component mounting device and the determination method of the present disclosure, the need for cleaning the measuring device can be determined depending on the component. Short description of the drawings Fig. 1 is a perspective view of the component mounting device 1 of the present example. Fig. 2 is a perspective view of the measuring device 22 viewed from the left side (upstream in the conveying direction). Fig. 3 is a perspective view of the measuring device 22 viewed from the right side (downstream in the conveying direction), and is a perspective view showing a main part of the measuring device 22. Fig. 4 is a partial plan view of the measuring device 22. Fig. 5 is a cross-sectional view of the main part of the measuring device 22 and a partially enlarged view of a portion of the component s. Fig. 6 is a schematic view in which the component s is located in the V-groove 44c as seen from the y-direction. Fig. 6(a) is a view showing a state in which a small component is arranged. Fig. 6(b) is a view showing a state in which a large component is arranged. Fig. Figure 7 is an air circuit diagram of the measuring device 22. Fig. 8 is a diagram conceptually showing the control device 100 of the component mounting apparatus 1. Fig. Figure 9 is a flowchart of a first determination process. Fig. 10 is a flowchart of a second determination process. Fig. 11 is a plan view showing the operation of the measuring device 22. Fig. Figure 11(a) is a view showing the initial state. Fig. 11(b) is a view showing the clamping state. Fig. 11(c) is a view showing the measurement state. Fig. 11(d) is a view showing the disposal status. Description of embodiments

[0010] In the following, a component mounting device as an example of the present disclosure will be described in detail with reference to the drawings. Fig. Fig. 1 is a perspective view of the component mounting device 1 of the present example. The component mounting device 1 is a device that mounts a component on a board, and as shown in Fig. Fig. 1, the component mounting device 1 includes the device main body 2, the plate conveying and holding device 4, the component feeding device 6, the head moving device 8, the camera 20, the measuring device 22, the operation section 116 and the like.

[0011] The plate conveying and holding device 4 conveys and holds the plate P in a horizontal orientation.

[0012] In the following description, as in the Fig. 1, the conveying direction of the board P is referred to as the x-direction, a direction parallel to the plane of the board P and orthogonal to the x-direction is referred to as the y-direction, and a direction orthogonal to both the x and y directions is referred to as the z-direction. The x-direction, the y-direction, and the z-direction denote a left-right direction of the component mounter 1, a front-back direction of the component mounter 1 (a width direction of the board P), and the up-down direction of the component mounter 1 (a thickness direction of the board P), respectively. The component supply device 6 supplies the electronic component s (hereinafter referred to as "component") to be mounted on the board P and includes a plurality of tape feeders 14 and the like. The head moving device 8 supports and moves the mounting head 16 in the x-, y-, and z-directions. The mounting head 16 comprises a suction nozzle 18 which picks up and holds the component s.

[0013] Furthermore, the camera 20 is located at the front of the plate conveying and holding device 4 and is mounted in an upwardly directed state. The camera 20 is a part camera that captures the component s held by the suction nozzle 18 from below. The control device 100 (see the Fig. 8) The component mounting device 1 determines whether the component s is to be mounted on the plate P based on the image captured by the camera 20. The operation section 116 is a user interface and includes, for example, a touch panel and operation switches. The operation section 116 receives an operation input from the user and outputs a signal corresponding to the received operation input to the control device 100. The operation unit 116 changes the display content based on the control of the control device 100.

[0014] The measuring device 22 is a device for measuring an electrical property of the component s. The electrical property of the component s to be measured may include L (inductance), C (capacitance), R (resistance), Z' (impedance), and the like. The measuring device 22 measures, for example, at least one or more of these electrical properties. The component s may, for example, be a component with electrodes at both ends and may be measured by the pair of measuring elements 37 (see the Fig. 4 and Fig. 5) of the measuring device 22. In particular, the component s can comprise, for example, a so-called square chip component. A collecting container 26 is provided behind the measuring device 22. The collecting container 26 has the shape of a rectangular parallelepiped that extends in the top-bottom direction and has an opening in an upper section. The measuring device 22 is connected to the plate conveying and holding device 4 via the collecting container 26.

[0015] The measuring device 22 is provided in such a way that the height of the measuring device 22 can be adjusted in relation to the collecting container 26. In detail, the Fig. 2 a perspective view of the Fig. 1 shown measuring device 22 viewed from the left side (upstream in the conveying direction) of the component assembly device 1. The Fig. Fig. 3 shows a perspective view of the measuring device 22 as viewed from the right side (downstream in the conveying direction) of the component mounting device 1 and is a perspective view of a main part of the measuring device 22. The Fig. 4 is a partial plan view of the measuring device 22. The Fig. Fig. 5 shows a cross-sectional view of the measuring device 22, which is cut at a location of the V-groove 44c to be described later. As shown in Figs. Fig. 2 to 5, the measuring device 22 includes the main body 29, the base section 30, the holding table 32, the pair of measuring elements 37, a holding table moving device 40, a moving element moving device 41, an LCR detecting section 42, and the like.

[0016] A measuring station is provided on the base section 30. The base section 30 is fixed to the front of the disposal container 26. The base part 30 is attached to the collecting container 26 in a liftable and lowerable manner by means of a sliding element and bolts or the like for fixing the sliding element. The main body 29 is fixed by the fixing section 31 (see the Fig. 5) including screws and nuts to the base section 30. This holds the main body 29 and the base section 30 in a liftable and lowerable manner in one piece with respect to the collecting container 26. The collecting container 26 and the measuring device 22 are connected by the disposal channel 28 (see the Fig. 1) and the component s is collected after the measurement through the disposal channel 28 in the collecting container 26. The main body 29 and the base section 30 have openings 29a and 30a, respectively, which are connected to the disposal channel 28 (see the Fig. 4 and Fig. 5).

[0017] The holding table 32 is a member that holds the component and includes a component placement section 44 and a placement section holding body 46 that holds the component placement section 44. The component placement section 44 is provided in the upper portion of the holding table 32. A substantially V-shaped, upwardly opening V-groove 44c is formed in the upper portion of the component placement section 44, and the component is placed into the V-groove 44c. The component placement section 44 may be made of an electrically conductive, wear-resistant, and hardly oxidized material. The component placement section 44 is electrically connected to the base section 30 via a plurality of conductive elements, and by grounding the base section 30, the component placement section 44 is also grounded.

[0018] The placement section holding body 46 is provided below the component placement section 44. The component placement section 44 is in contact with the placement section holding body 46 and is fixed to the placement section holding body 46 by the fixing section 47 (see the Fig. 4).The placement section holding body 46 can come into contact with the main body 29 via the stopper 80 (see the Fig. 5) As described above, the main body 29 is fixed to the base portion 30 by the fixing portion 31. The placement portion holding body 46, the stopper 80, the main body 29, the base portion 30, the fixing portions 31 and 47, and the like are conductive. Therefore, by bringing the placement portion holding body 46 into contact with the stopper 80, the component placement portion 44 is grounded, and electrostatic discharge of the placed component s can occur. The component placement portion 44 is made of a material that is hardly oxidized, for example, a material on which a passive film, which is a metal oxide layer, can form, and thus is rust-resistant. This prevents rust from adhering to the component s, thereby increasing the accuracy of measuring the electrical property of the component s.For example, the material of the component placement section 44 may include materials such as aluminum alloys or stainless steel. The component placement section 44 may be a material with at least one of the properties of conductivity, wear resistance, and oxidation resistance, or a material that does not have all three properties.

[0019] In the present example, the pair of measuring elements 37 comprises the stator 34, whose position is fixed, and the moving element 36, which moves relative to the stator 34. The stator 34 and the moving element 36 have opposing surfaces 34f and 36f (see the Fig. 5) which are opposite each other. The pair of opposite surfaces 34f and 36f grips the component s. The stator 34 is fixed to the main body 29 via the stator holding body 55 (see the Fig. 4). The moving element 36 is integrally held by the moving element holding body 56 and slides in the y-direction, moving toward or away from the stator 34. The opposing surface 36f has, for example, a triangular cross-section and moves along the V-groove 44c.

[0020] The Fig. Figure 6 schematically shows a state in which the component s is located in the V-groove 44c, viewed from the y-direction. As shown in the Fig. As shown in Figure 6, the V-groove 44c has a bottom portion 44d, which is a flat surface extending in the x-direction at the apex of the substantially V-shaped form. Therefore, the shape of the V-groove 44c, viewed in the y-direction, is a shape in which the inclined surfaces 44e are formed upward and outward from both ends of the x-direction flat surface (bottom portion 44d) extending in the y-direction. For example, the component s can be placed on the bottom portion 44d depending on the size of the component s (see the Fig. 6(a)) or placed on the V-shaped inclined surface 44e (see the Fig. 6(b)). Since the V-groove 44c is V-shaped, the component s slides downward along the inclined surface 44e to the bottom portion 44d even when the component s is placed on the inclined surface 44e. Therefore, the position of the component s can be precisely positioned within a certain range in contact with the bottom portion 44d. As described above, the shape of the opposing surface 36f of the moving member 36 substantially corresponds to the V-groove 44c, and the opposing surface 36f of the moving member 36, the opposing surface 34f of the stator 34, and the V-groove 44c of the holding table 32 are substantially at the same height. Therefore, even if the component s is positioned at any position of the bottom portion 44d in the V-groove 44c, the component s can be gripped (clamped) by the opposing surfaces 34f and 36f.

[0021] The moving member 36 is a longitudinal member extending in the y-direction (moving direction) and is held at the retracted end by the moving member holding body 56. The moving member 36 has a shape that can be inserted into the V-groove 44c. Therefore, the holding table 32 and the moving member 36 are configured to be movable relative to each other. The holding table 32 can move forward or backward in the y-direction from the position of the opposing surface 36f with the bottom portion 44d of the V-groove 44c located below the moving member 36 (a state in which the moving member 36 is inserted into the V-groove 44c).

[0022] As in the Fig. 3, an electrical circuit 58 is formed in the measuring device 22 with the pair of measuring elements 37, an LCR detection section 42 and the like. As shown in the Fig. As shown in Figure 8, the component mounting device 1 includes the power supply device 126, which supplies power to each component of the component mounting device 1. The control device 100 causes the power supply device 126 to supply power between the stator 34 and the moving element 36 of the switching circuit 58, detects the flowing current, and measures the electrical characteristic of the component s through the LCR detection section 42. The LCR detection section 42 is, for example, a so-called LCR measuring device, detects the current flowing between the stator 34 and the moving element 36 when a voltage is applied between the stator 34 and the moving element 36, obtains the electrical characteristic of the component s based on the applied voltage, the detected current, and the like, and outputs the electrical characteristic to the control device 100.The LCR detection section 42 is, for example, a detection section that detects L, C, and R, but is not limited to this, and may detect one or more physical quantities representing electrical properties such as L, C, R, and Z'. The component mounter 1 does not need to include the LCR detection section 42. For example, the component mounter 1 may include an ammeter or a voltmeter connected to the pair of measuring elements 37, and the control device 100 may calculate LCR based on the detected values ​​of the ammeter or the like. The circuits shown in FIGS. Fig. 2 to 5 also indicate connection areas of the pair of measuring elements 37 to the circuit 58.

[0023] As in the Fig. As shown in Figure 5, the opening 60a of the air duct 60 for discharging air toward the opposing surface 36f of the moving element 36 is formed in the upper region of the stator 34. The air cylinders 64 and 70 are connected to the air duct 60. The ionizer 62 is provided in a portion of the air duct 60 downstream of the air cylinders 64 and 70. The ionizer 62 generates a corona discharge to ionize the air and directs the ionized air to the opposing surface 36f. By supplying the ionized air, the opposing surfaces 36f and 34f of the moving element 36 and the stator 34 can be electrically neutralized, thereby increasing the measurement accuracy of the electrical properties of the subsequent component s.

[0024] Additionally, the lid portion 50 is attached to the holding table 32 to prevent air diffusion and scattering of the component s, which is caused to fall due to the air discharge. By extending the lower end portion of the lid portion 50 to near the opening 29a of the main body 29, the component s can be efficiently conveyed from the opening 29a through the discharge channel 28 into the collection container 26.

[0025] The holding table moving device 40 is a device that moves the holding table 32 and includes, for example, an air cylinder 64 fixedly provided in the main body 29 as a drive source. The placement section holding body 46 is connected to the piston rod 66 (see Fig. 7) of the air cylinder 64. The component mounting device 1 further comprises an air source 68 which supplies the air cylinder 64 and the later-described air cylinder 70 with air (see the Fig. 7 and Fig. 8). The air cylinder 64 has two air chambers 64a and 64b separated by a piston within the cylinder housing. The air source 68, the air duct 60, and a filter (atmosphere) are connected to the two air chambers 64a and 64b via a solenoid valve device 69. The solenoid valve device 69 may include one or more solenoid valves, for example, a directional selector valve and a variable throttle, as shown in Fig. 7. The direction of movement of the placement section holding body 46 is controlled by the direction selection valve, and the variable throttle causes the placement section holding body 46 to move and stop. When the solenoid valve device 69 causes the air chamber 64b to be connected to the air source 68 and the air chamber 64a to be connected to the air duct 60, respectively, the holding table 32 is caused to advance (move in the direction of arrow F in the Fig. 5), whereas when the solenoid valve device 69 causes the air chamber 64b and the air chamber 64a to open to the atmosphere and to communicate with the air source 68, the holder table 32 is caused to move back (in the direction of arrow B in the Fig. 5 to move).

[0026] The moving element moving device 41 is a device that moves the moving element 36 closer to or away from the stator 34 and includes an air cylinder 70 fixedly provided in the main body 29 as a drive source. The moving element moving device 56, which can move integrally with the moving element 36, is coupled to the piston rod 71 of the air cylinder 70 (see the Fig. 7). The air cylinder 70 has two air chambers 70a and 70b, which are divided by a piston within the cylinder housing. The air source 68, the air duct 60, and a filter (atmosphere) are connected to the two air chambers 70a and 70b via a solenoid valve device 72. The solenoid valve device 72 may include one or more solenoid valves, such as a directional selector valve and a variable throttle, and the like. When the solenoid valve device 72 causes the air chamber 70b and the air chamber 70a to communicate with the air duct 60 and the air source 68, respectively, the moving element 36 is caused to retract. Conversely, when the solenoid valve device 72 causes the air chamber 70a and the air chamber 70b to open to the atmosphere and communicate with the air source 68, respectively, the moving element 36 is caused to advance. The air supply configuration described above is an example.For example, the solenoid valve devices 69 and 72 may comprise a three-position valve or multiple on / off valves. The component assembly device 1 need not include an ionizer 62.

[0027] As in the Fig. As shown in Figures 2 to 4, a pair of guide rods 74 and 75 extending in the y-direction are provided between the moving element holding body 56 and the main body 29. A pair of guide rods 76 and 77 are arranged in the y-direction between the holding table 32 and the moving element holding body 56. The first end portions of the guide rods 74 and 75 are coupled to the moving element holding body 56, and the second end portions are slidably engaged with the main body 29. The first end portions of the guide rods 76 and 77 are coupled to the placement section holding body 46, and the second end portions are slidably engaged with the moving element holding body 56.The guide rods 74, 75, 76, and 77 enable the holding table 32 and the moving element 36 to move in the y-direction relative to the main body 29 and also enable the holding table 32 and the moving element 36 to move relative to each other in the y-direction. The guide rods 74 to 77 are shared by the holding table moving device 40 and the moving element moving device 41.

[0028] As continued in the Fig. 5, a stopper 82 is provided on the stator side 34 of the moving element holding body 56 and a stopper 80 is provided on the portion of the main body 29 that holds the stator holding body 55. The stopper 82 defines a proximity limit between the moving element holding body 56 and the holding table 32 (placement section holding body 46), and the stopper 80 defines a proximity limit between the stator 34 (main body 29) and the holding table 32 (placement section holding body 46). As shown in the Fig. 5, the gap Ld between the front end portion of the stopper 82 when the moving member 36 is in the retracted end position and the placing portion holding body 46 when the holding table 32 is in the advanced end position is a distance that allows the relative movement between the moving member 36 and the holding table 32.

[0029] As in the Fig. As shown in Figure 8, the control device 100 of the component mounting apparatus 1 includes the controller 102 and a plurality of drive circuits 104. The controller 102 includes the CPU 102a and the storage device 102b. The storage device 102b may be, for example, a RAM, ROM, HDD, and the like. The storage device 102b stores the control program 103. The storage device 102b is not limited to the storage medium described above and may be a flash memory, an SSD, or an external storage medium such as a USB memory. Alternatively, the storage medium for storing the control program 103 may be, for example, a CD-ROM or DVD-ROM.

[0030] The controller 102 is connected to the plate conveying and holding device 4, the head moving device 8, the camera 20, and the like. The controller 102 is connected to the plate conveying and holding device 4, the component feeding device 6, the head moving device 8, and the air source 68 via the drive circuit 104. The drive circuit 104 is, for example, an amplifier circuit (drive circuit) that drives the motor of the plate conveying and holding device 4. The control device 100 controls each device (such as the plate conveying and holding device 4) provided in the component mounting device 1 by executing the control program 103 stored in the storage device 102b with the CPU 102a. The control program 103 includes programs for a first Fig. 9 and a second one in the Fig. 10, which will be described later.

[0031] When changing the board P to be produced, the control device 100 further obtains job data JOB corresponding to the type of the board P to be produced next, for example, from a higher-level management device (not shown), and stores this job data JOB in the storage device 102b. The management device manages a production line. The control device 100 changes the job data JOB depending on the type of board P to be produced (on which the component s is mounted). Job data JOB includes, for example, data including each piece of information such as the type of component s to be mounted on the circuit board P, the mounting position at which the component s is mounted on the board P, the arrangement of the tape feeder 14 that feeds the component s, and the production quantity.Based on the acquired job data JOB, the control device 100 causes each device of the component mounting device 1 to perform the mounting of the component s onto the plate P.

[0032] For example, the job data JOB specifies information about the electrical property, resistance value, and size of the component s to be mounted. This information is specified, for example, by the user who creates the job data JOB. The control device 100 measures the electrical property of the component s using the measuring device 22 and determines whether the measured electrical property matches the information about the electrical property of the component s (measurement target component s) contained in the job data JOB. For example, the control device 100 determines whether the measured electrical property matches the electrical property of the component s to be used for the next job.

[0033] The pair of measuring elements 37 of the measuring device 22 are metallic elements and become contaminated by blackening or the like during repeated measurements. Since the measurement accuracy decreases when the measuring elements 37 become contaminated, regular cleaning of the measuring elements 37 is required. The number of measurements CT, which indicates the number of times of measurements, and the upper limit value TH for determining the number of measurements CT are stored in the storage device 102b. The control device 100 counts the number of times of measurements by the measuring device 22 for each size of the measured component s and stores the number of times of measurements as the number of measurements CT. Therefore, the number of measurements CT for each size of the component s is stored in the storage device 102b.The control device 100 stores the number of measurements CT, for example, in a non-volatile memory area such as the hard disk of the storage device 102b, and reads the number of measurements CT into the RAM as needed. The control device 100 may include a dedicated register for storing the number of measurements CT. The control device 100 does not need to count the number of measurements CT for each size of the component s; for example, the control device 100 may count the number of measurements as a number of measurements CT for all components s.

[0034] As shown in the enlarged view of the Fig. 5, the component s has, for example, a pair of electrodes 92 at both ends of the chip main body portion 91 with wiring and circuits contained therein. The chip main body portion 91 has, for example, a rectangular box shape in plan view. If a direction in which the electrode pairs 92 face each other is taken as the longitudinal direction (left-right direction in the Fig. 5) and a direction orthogonal to the longitudinal direction and the thickness direction of the component s as the width direction (top-bottom direction in the Fig. 5), the size of the component s corresponds, for example, to the length (width W1) in the width direction. The size of the component s corresponds, for example, to the width W1 of the area where the electrodes 92 come into contact with the opposing surfaces 34f and 36f. In this case, the value of the width W1 of each of the plurality of components s is set in the job data JOB. The definition of the size of the component s is not limited to the width W1 described above. The size of the component may be an area of ​​a portion where the electrodes 92 come into contact with the opposing surfaces 34f and 36f. Alternatively, the size of the component s may correspond to the length Lg of the component s in the longitudinal direction. The size of the component s may also be the volume of the component s.

[0035] The position and size of the contamination appearing on the pair of measuring elements 37 differ depending on the size of the component s. For example, the control device 100 changes the position of the component s in the V-groove 44c depending on the size of the component s. For example, as shown in the Fig. As shown in Fig. 6(a), for a component s having a width W1 in the x-direction that is shorter than the width W2 of the bottom portion 44d, the control device 100 causes the head moving device 8 and the like to position the component s so that it is in surface contact with the upper surface of the bottom portion 44d. As shown in Fig. Fig. 6(b), the control device 100 also causes the head moving device 8 and the like to arrange the component s so that it is in surface contact with the inclined surface 44e when the component s has a width W1 equal to or longer than the width W2. Since, in this arrangement, small components s (the Fig. 6(a)) and large components s (the Fig. 6(b)) are located at different positions, the locations where the pair of measuring elements 37 is contaminated differ. If only large or only small components s are measured, a need for cleaning need only be determined when the number of times CT of measurements counted in a number of measurements reaches the upper limit TH. However, if large and small components s are mixed, it may happen that the measuring elements 37 are not sufficiently contaminated to require cleaning even if the total number of measurements CT reaches the upper limit TH. Therefore, the control device 100 counts, for example, as in the Fig. 6, the number of measurements is calculated using different counting of measurements CT for the component s with a width W1 shorter than W2 and the component s with a width W1 equal to or longer than W2. This allows cleaning to be performed at a more appropriate time.

[0036] The classification of the size of the component s is not limited to the two types described above. Even if the component s is placed at the same position of the V-groove 44c, the locations where the measuring elements 37 are contaminated differ depending on the position, shape, and size of the electrodes 92. Therefore, the component s can be classified based on at least one of the following criteria: position, shape, and size of the electrodes 92, and the number of measurements CT can be counted for each component s of each classification. Alternatively, depending on the structure of the element on which the component s is placed, there may be three or more types of positions where the component s is placed. In this case, the number of measurements CT can be counted for each component s at each position to be arranged.For example, the holding table 32 may be configured such that a portion on which the component s is placed has a step shape with different widths for each step. The control device 100 may place the component s on different steps depending on the size of the component s and perform measurements. For each step, the number of measurements CT may be counted. Therefore, the number of measurements CT may be three or more. The control device 100 may place the component s at the same position regardless of the size of the component s. For example, all components s above the inclined surface 44e may be released, and the components s may be moved along the inclined surface 44e.

[0037] The control device 100 further sets a value, which varies depending on the resistance value, as the upper limit value TH, which is to be compared with the number of measurements CT. The influence of impurities on the measuring elements 37 on the accuracy of the measurement result varies depending on the resistance value of the measurement target component s. For example, through the applicant's investigation and the like, it was determined that the influence of impurities on the accuracy of the measurement result is greater for a square chip component with a low resistance of 1 Ω or less than for a component with a resistance greater than 1 Ω. The square chip component with a low resistance of 1 Ω or less is a component for establishing conduction between two contact points and is ideally a square chip component with a resistance of 0 Ω or the like.Therefore, for the component s with a resistance of 1 Ω or less, it is preferable to shorten the cleaning interval and it is advisable to set a low value as the upper limit TH.

[0038] Therefore, when changing the job data JOB, the controller 100 sets a lower upper limit value TH when the smallest resistance value of the component s among the resistance values ​​set in the job data JOB for the next production is greater than 1 Ω, compared to the case where the smallest resistance value is less than 1 Ω. Specifically, for example, when the component s with a resistance of 1 Ω or less is included in the job data JOB, the upper limit value TH is set to 300 times, and when the component with a resistance of 1 Ω or less is not included, the upper limit value TH is set to 1000 times. This makes it possible to determine the appropriate cleaning timing depending on the resistance value.

[0039] The resistance value set in the job data JOB may be a resistance value set by the user for each component s, or it may be a value obtained by calculating the impedance of each component s. The upper limit value TH may be changed based on the maximum value, the average value, and the like, instead of the minimum value of the resistance value. The value used to determine the setting of the upper limit value TH is not limited to R (resistance) and may be L (inductance) or C (capacitance). Therefore, the upper limit value TH can be set based on the maximum value set in the job data JOB or the minimum value of the resistance or capacitance of the component s. The method for determining the upper limit value TH from the resistance value is not limited to the above-described method of finding the minimum value from the job data JOB.For example, the user may pre-set only one resistance value for determining the upper limit value TH in the job data JOB. In this case, the control device 100 may set the upper limit value TH based only on the determination value (resistance value) set in the job data JOB. Furthermore, the classification of the resistance value for determining the upper limit value TH is not limited to the above-described two categories of whether the resistance value is 1 Ω or less. The control device 100 may divide the resistance value into three or more levels, such as a resistance value ≤ 1 Ω, 1 Ω < a resistance value ≤ 1 kΩ, and 1 kΩ < a resistance value ≤ 10 kΩ, and set the upper limit value TH depending on each level.

[0040] The method for obtaining the size and resistance value of the component s is not limited to the method for obtaining the size and resistance value from the job data JOB. For example, the control device 100 may obtain the size and resistance value of the component s when changing the job data JOB in the operation section 116. Alternatively, the control device 100 may determine the tape feeder 14 to be used for the next production based on the job data JOB, feed the component s from the tape feeder 14, detect the size using image processing by the camera 20, and detect the resistance value by the measuring device 22. That is, the size and resistance value of the component s can be detected based on the actually measured value.

[0041] As in the Fig. 8, the component mounting device 1 comprises the moving element motion sensor 118 (see the Fig. 3), the holding table motion sensor 120 (see the Fig. 3) and the nozzle height sensor 122. The controller 102 is connected to the LCR detection section 42, the operation section 116, the moving element movement sensor 118, the holding table movement sensor 120, the nozzle height sensor 122, etc. For example, the moving element movement sensor 118 outputs an ON signal when the moving element holding body 56 is in the retracted end position and turns OFF when the moving element holding body 56 moves away from the retracted end position. For example, the holding table position sensor 120 outputs an ON signal when the holding table 32 is in the advanced end position and turns OFF when the holding table 32 moves away from the advanced end position. The nozzle height sensor 122 detects the height of the suction nozzle 18. (First determination process)

[0042] With reference to the Fig. 9, a first determination process executed by the control device 100 when changing the job data JOB will now be described. For example, when the production of the number of plates specified in the job data JOB is completed, the control device 100 receives the job data JOB to be used for the next production from the management device and starts the Fig. 9. The conditions for starting the process in the Fig. 9 are not limited to the conditions for receiving new job data JOB. For example, the control device 100 can Fig. 9 if the job data JOB has been manually updated by a user operation.

[0043] First, the control device 100 places in step (hereinafter referred to as S) 11 in the Fig. 9 sets the upper limit TH based on the received job data JOB, that is, the job data JOB to be used for the next production.

[0044] As described above, the control device 100 sets, for example, an upper limit value TH which differs depending on whether the smallest resistance value among the resistance values ​​of the components s specified in the job data JOB for the next production is 1 Ω or less.

[0045] Subsequently, the controller 100 checks whether the total number of measurements CT is less than the upper limit TH set in S11 (S13). The total number of measurements CT refers to the cumulative value of the number of measurements CT counted for each component size s since the last cleaning was performed. If the total number of measurements CT is less than the upper limit TH (S13: YES), the controller 100 terminates the Fig. 9. For example, the control device 100 starts the next production (assembly work) based on the job data JOB.

[0046] On the other hand, if at least one total number of measurements CT among several (e.g., two) numbers of measurements CT is equal to or higher than the upper limit value TH (S13: NO), the controller 100 determines that cleaning of the measuring device 22 is required and executes S15. In S15, the controller 100 issues a notification about cleaning of the measuring device 22. For example, the controller 100 displays the message "Clean measuring device!" on the touch panel of the operation section 116. This makes it possible to count the number of measurements CT depending on the size of the component s and to determine whether cleaning is required based on the upper limit value TH depending on the resistance value of the component s. When the user checks the message on the touch panel, the cleaning of the measuring elements 37 and the V-groove 44c is performed with a nonwoven fabric or the like.After cleaning is completed, the user inputs an input indicating the completion of cleaning via the operation section 116. When the operation input indicating that cleaning is completed is received via the operation section 116, the control device 100 applies, for example, a voltage in a state where the two measuring elements 37 come into contact with each other or are spaced apart from each other, measures a current value, etc., and performs correction, etc., of the LCR detection section 42. After the correction is normally completed, the control device 100 resets, for example, the total number of measurements CT to zero and resumes the assembly work. In S13, when determining three or more numbers of measurements CT, the control device 100 may determine that cleaning of the measuring device 22 is required when multiple numbers of measurements CT, e.g.two or three, instead of at least one number of measurements CT equal to or greater than the upper limit TH (S13: NO).

[0047] After the execution of S15, the control device 100 terminates the Fig. 9. The process executed when the control device 100 determines that cleaning is required (S13: YES) is not limited to the notification process (S15) described above. For example, the control device 100 may perform cleaning automatically. The control device 100 may move to the nozzle station, mount a cleaning nozzle in place of the suction nozzle 18 of the mounting head 16, and perform cleaning of the sensing elements 37, the V-groove 44c, and the like.

[0048] As described above, the control device 100 changes the job data JOB according to the type of board P to be produced and determines whether the measured number of measurements CT is equal to or greater than the upper limit value TH according to the change in the job data JOB (S13). Subsequently, the component s is replaced, and the upper limit value TH can be adjusted according to the change in the resistance value of the measurement target component s, so that the cumulative number of measurements CT can be determined. When the resistance value changes, and thus the appropriate cleaning timing changes, it is possible to determine the need for cleaning and notify this before starting the next production.

[0049] The control device 100 sets the upper limit value TH based on the resistance value of the component s included in the job data JOB (S11). The control device 100 resets the upper limit value TH according to the change in the job data JOB, and determines that cleaning of the measuring device 22 is required when the number of measurements CT measured so far is equal to or greater than the newly set upper limit value TH (S13: NO). Thus, the upper limit value TH can be automatically set and determined based on the resistance value of the component s to be used for the next production according to the change in the job data JOB. According to the change in the job data JOB, the minimum resistance value among the resistance values ​​of the component s to be used for the next production can be received from the user via the operation section 116 without being acquired from the job data JOB.

[0050] Furthermore, the control device 100 sets the upper limit value TH based on the smallest resistance value among the resistance values ​​of a plurality of components s mounted on a board P. Accordingly, the upper limit value TH can be set according to the component s with the smallest resistance value, for which the influence of contamination on the measurement result is greatest. It is possible to perform cleaning and notify thereof at the appropriate time. The timing of setting the upper limit value TH is not limited to the time of changing the job data JOB. After receiving the job data JOB, the control device 100 can set the upper limit value TH based on the smallest resistance value of the component s in the job data JOB at the first measurement time. (Second determination process)

[0051] With reference to the Fig. 10, a second determination process is now described, which is carried out by the control device 100 according to the measurement carried out by the measuring device 22. When carrying out a configuration change, such as setting up a new tape feeder 14 or replacing the tape feeder 14, the control device 100 starts the process of Fig. 10 and measures the electrical property of the component s held by the tape feeder 14. The conditions for starting the process of Fig. 10 are not limited to the conditions for replacing the tape feeder 14 or the like. The control device 100 can control the process of Fig. 10 for the tape feeder 14 and measure the electrical property, for example, each time the component s is fed a predetermined number of times (e.g., 100 times or so) by the same tape feeder 14. Accordingly, it is possible to check whether the quality of the component s on a tape feeder 14 (roll) is guaranteed.

[0052] If the Fig. 10 is started, the control device 100 first starts measuring the electrical property of the component s of the newly attached tape feeder 14 or the like (S21). Fig. 11 is a plan view showing an initial state (a), a clamping state (b), a measuring state (c), and a disposal state (d) of the measuring device 22. In the measuring device 22, the solenoid valve devices 69 and 72 are controlled based on the output signal of the holding table position sensor 120, the output signal of the moving element position sensor 118, the elapsed time of each operation, etc., and the holding table 32 and the moving element 36 are caused to move back and forth, respectively. The control of the solenoid valve devices 69 and 72 is performed, for example, by the control device 100 based on the output signals of the holding table position sensor 120 and the moving element position sensor 118.

[0053] In addition, the control of the solenoid valve devices 69 and 72 can be automatically sequenced by a PLC or the like based on the output signals and the elapsed time. For example, the measuring device 22 is located in the Fig. 11(a), in a state where the measurement is not performed. The moving member 36 is in the retracted end position, and the holding table 32 is in the advanced end position, that is, in a position where the holding table 32 is in contact with the stopper 80. In this initial state, the holding table 32 is grounded through the internal wire or the like. The holding table 32 is in a state where the moving member 36 is not located above the V-groove 44c and in a state where the component s can be placed. The lid portion 50 is positioned on both sides of the stator 34 (spaced apart in the x-direction). Both the moving member position sensor 118 and the holding table position sensor 120 are in the ON state.

[0054] The control device 100 moves the mounting head 16, causes the suction nozzle 18 to pick up the component s fed from the measuring target tape feeder 14, and places the component s in the V-groove 44c of the holding table 32. The mounting head 16 lowers the suction nozzle 18, releases the component s, and places the component in the V-groove 44c. As described above, the control device 100 changes the position where the component s is to be placed depending on the size of the component s specified in the job data JOB (see the Fig. 6) is placed on the bottom portion 44d or the inclined surface 44e. The component s is made of conductive material and is electrostatically discharged by being placed on the grounded component placement portion 44. When the suction nozzle 18 is raised after placing the component s onto the V-groove 44c and the nozzle height sensor 122 detects that the suction nozzle 18 has reached the raised end, the control device 100 causes the solenoid valve device 72 to advance the moving element 36. The moving element position sensor 118 is switched from ON to OFF. The opposing surface 36f of the moving element 36 advances along the V-groove 44c and clamps the component s between the opposing surface 36f and the opposing surface 34f of the stator 34 (the Fig. 11(b)). The stroke L1 (see the Fig. 5) The travel of the moving member 36 from the retracted end position to the clamping of the component s is determined by the size (length Lg) of the component s to be clamped, and the like. Therefore, the stroke L1 can be determined by setting a value in the job data JOB in advance or by the size of the component s detected before measurement by the camera 20. For example, after an advance time corresponding to the stroke L1 has elapsed since the control device 100 started advancing the moving member 36, the variable throttle of the solenoid valve device 72 or the like causes the advancing of the moving member 36 to stop. The holding table 32 is located at the advanced end position, the moving member 36 is advanced, and the component s is clamped by the two opposing surfaces 34f and 36f.

[0055] Subsequently, the control device 100 causes the solenoid valve device 69 to move the holding table 32 back.

[0056] For example, by causing the solenoid valve device 69 to open the air chamber 64b to the atmosphere and to communicate the air chamber 64a with the air source 68, the holding table 32 is moved by the piston rod 66 in the direction of arrow B in the Fig. 5 until it comes into contact with the stop 82 (the Fig. 11(c)) and held in this position. The stroke of the holding table 32 during this time is L2 (see the Fig. 5). The holding table position sensor 120 is switched from ON to OFF. The component placement section 44 is spaced from the component s by approximately the stroke L2. The stroke L2 is preferably large enough so that the component placement section 44 with conductive properties is sufficiently spaced from the component s and does not cause defects such as electrostatic induction or eddy currents between the component s and the component placement section 44 during electrical property measurement. The control device 100 causes the power supply device 126 and the like to supply power to the measuring elements 37 and measures the electrical property of the component s through the LCR detection section 42 (S21).

[0057] After the electrical property measurement is complete, the control device 100 causes the solenoid valve device 72 to move the moving element 36 back. The moving element position sensor 118 is turned ON as soon as the moving element 36 reaches the retracted end position. For example, when the control device 100 detects that the output signal of the moving element position sensor 118 has changed from OFF to ON, the control device 100 causes the solenoid valve device 69 to move the holding table 32 back (the Fig. 11 (d)). For example, the holding table 32 moves backward until it comes into contact with the stopper 82, with the moving member 36 in the retracted end position. The holding table 32 is located behind the opposing surface 36f of the moving member 36 (on the retracted end position side) and is in a state (disposal state) in which the holding table 32 is not present below between the pair of opposing surfaces 34f and 36f. The space between the opposing surfaces 34f and 36f is in communication with the openings 29a and 30a and the disposal channel 28 in the up-down direction. The control device 100 can move the moving member 36 and the holding table 32 backward simultaneously.

[0058] When the moving element 36 is moved back, the solenoid valve device 72 is activated, whereby, for example, the air chamber 70b is brought into connection with the air channel 60 and the air chamber 70a is brought into connection with the air source 68. When the moving element 36 is moved back into the position shown in the Fig. In the disposal state shown in Fig. 11(d), the air flowing from the air chamber 70b through the air duct 60 is blown out from the opening 60a toward the opposing surface 36f of the moving member 36. The air blown out from the opening 60a mainly impacts the opposing surface 36f and then flows downward along the opposing surface 36f, causing the component s to fall. At this time, ionized air is supplied by, for example, the ionizer 62. The space between the pair of opposing surfaces 34f and 36f is covered in the x-direction by the lid portion 50. This can cause the component s to fall efficiently from the opposing surface 36f, and scattering of the component s can be prevented.Even if the component s is placed on the V-groove 44c and is not dropped due to the air, the component s can be reliably dropped by the relative advancing movement of the opposing surface 36f of the moving member 36 upon retraction of the holding table 32. The dropped component is received in the collecting container 26 through the openings 29a and 30a and the disposal channel 28.

[0059] The control device 100 causes the solenoid valve device 69 to connect the air chamber 64b of the air cylinder 64 to the air source 68 and to connect the air chamber 64a to the air channel 60. The stroke from the measurement state in the Fig. 11(c) until the holding table 32 comes into contact with the stopper 82, with the moving element 36 in the retracted end position, L1 (see the Fig. 5). The stroke L1 can be set in advance as described above. For example, when the time required for the holding table 32 to return by the stroke L1 has elapsed, the control device 100 determines that the holding table 32 has come into contact with the stopper 82 and causes the solenoid valve device 69 to advance the holding table 32. For example, the control device 100 advances the holding table 32 until it hits the stopper 80, and the holding table position sensor 120 is turned ON. The holding table 32 is positioned between the pair of opposing surfaces 34f and 36f (the V-groove 44c is positioned below between the opposing surfaces 34f and 36f), and a space is defined above the V-groove 44c. That is, an initial state in which the component s can be placed is established.

[0060] As the holding table 32 advances, the air chamber 64a is connected to the air duct 60. This allows air to be supplied to the opposing surface 36f of the moving element 36 even during the transition from the disposal state to the initial state, and the electrostatic discharge of the opposing surface 36f of the moving element 36 can be effectively performed. The control device 100 compares the measured electrical property with the electrical property contained in the job data JOB (e.g., LCR constant), determines whether the component s is suitable for the job data JOB to be executed, and displays the determined result in the operation section 116. If it is unsuitable, the tape feeder 14 is replaced.

[0061] As in the Fig. As shown in Figure 10, when the control device 100 starts the second determination process and starts the measurement in S21, it determines whether the electrical property measurement is finished (S23). The control device 100 repeatedly executes the determination process of S23 until the measurement is finished (S23: NO). When the measurement is finished (S23: YES), the control device 100 increases the number of measurements CT by one depending on the size of the measured component s (S25). The size of the component s to be measured can be determined from the job data JOB as described above. In addition, the control device 100 captures the component s to be measured with the camera 20 before the measurement and detects the size of the component s by performing image processing on the image data of the camera 20.The control device 100 determines whether the detected size (length Lg or the like) matches the size set in the job data JOB (or whether the detected size matches the size set in the job data JOB within a certain error tolerance range). If the detected size does not match the size set in the job data JOB, the control device 100 takes a countermeasure, such as discarding the component s and re-performing the feeding and picking of the component s, or an error message. If the sizes match, the control device 100 performs the measurement and increments the number of measurements CT by one depending on the size (S25). The control device 100 can perform either only the size detection specified in the job data JOB or the size detection by image processing.Alternatively, the control device 100 may also obtain information about the size of the component using other methods, for example by querying the management device.

[0062] After execution of S25, the control device 100 determines whether the number of measurements CT increased in S25 is less than the upper limit value TH (S27). The upper limit value TH is a value determined in the first Fig. 9, ie, a value determined based on the resistance value in the job data JOB. If the number of measurements CT is less than the upper limit value TH (S27: YES), the controller 100 terminates the process of Fig. 10. The control device 100 continues the assembly work or the like. However, if the number of measurements CT is equal to or greater than the upper limit value TH (S27: NO), the control device 100 reports the cleaning of the measuring device 22 (S29) as in S15 of the Fig. 9 and ends the process of Fig. 10. The control device 100 temporarily interrupts the assembly work and, for example, executes a cleaning request on the touch panel.

[0063] As described above, the control device 100 determines whether the number of measurements CT is equal to or greater than the upper limit value TH each time the measuring device 22 measures the electrical property of the component s (S23, S27), and makes the determination using the upper limit value TH, which differs depending on the resistance value of the measurement target component s (S11). Thus, the need for cleaning for each measurement can be determined based on the appropriate upper limit value TH depending on the resistance value. The control device 100 may not determine the number of measurements CT for each measurement, but may determine the number of measurements CT every predetermined number of times (e.g., every three times). As shown in the Fig. As shown in Figure 9, the control device 100 sets the upper limit value TH when changing the job data JOB, but the present invention is not limited thereto. For example, the control device 100 may appropriately change the upper limit value TH each time the measuring device 22 performs a measurement, depending on the resistance value of the component s to be measured. For example, the control device 100 may change the upper limit value TH depending on the resistance value of the measured component s after the execution of S25 of the Fig. 10 and before the execution of S27. In this case, the control device 100 must perform the first determination process of the Fig.9. In addition, the control device 100 determines whether each of the plurality of measurement numbers CT is equal to or greater than the upper limit value TH at every predetermined time, for example, when the job data JOB changes or after each measurement end. The control device 100 uses the same value as the upper limit value TH to compare it with each of the plurality of measurement numbers CT using the same job data JOB, and determines each of the plurality of measurement numbers CT using the same upper limit value TH. Thereby, it is not necessary to change the upper limit value TH while using the same job data JOB if the appropriate upper limit value TH is set based on information about the component s in the job data JOB. The size-dependent number of measurement numbers CT can be uniformly determined, with the upper limit value TH being set using the same reference (e.g., resistance value).In addition, the control device 100 causes the head moving device 8 to place the component s at different positions depending on the size of the component when placing the component s on the component placement section 44. When this control is performed, the contaminated areas of the measuring elements 37 differ depending on the size of the component s. Therefore, the size-dependent counting of the number of measurements CT is very effective. By changing the placement position of the component s according to the shape of the placement section, for example, by forming the component placement section 44 in the shape of a V-groove 44c, the size of the component s can be reduced and appropriate measurements can be performed. The control device 100 can place the component s at the same position in the component placement section 44 regardless of the size of the component s.In the present embodiment, the head moving device 8 is an example of the moving device of the present disclosure. Furthermore, the tape feeder 14 is an example of a component supply unit.

[0064] As described above, the following beneficial effects can be achieved according to the example described above.

[0065] In one aspect of the present example, the control device 100 uses the upper limit value TH, which varies depending on the resistance value of the component s. When the number of measurements CT of the electrical property of the component s measured by the measuring device 22 is equal to or greater than the upper limit value TH (S13: NO, S27: NO), the control device 10 determines that cleaning of the measuring device 22 is required. For example, even with the same degree of contamination of the measuring elements 37, the influence of the contamination on the measurement result for the component s with a low resistance value is greater than the influence of the contamination on the measurement result for the component s with a high resistance value. By setting an upper limit value TH, which varies depending on the resistance value, and determining the number of measurements CT, it is possible to more appropriately determine the timing of required cleaning.It is possible to avoid excessive cleaning with the cleaning nozzle or requiring the user to perform cleaning. Furthermore, it is possible to prevent the occurrence of a measurement error due to contamination. Furthermore, the upper limit value TH is set lower with a lower resistance value; however, the present disclosure is not limited thereto. Depending on the shape, structure, material, and the like of the sensing elements 37, if the influence of contamination on the measurement result is greater for the component s with a higher resistance value, the upper limit value TH may be set lower for the component s with a higher resistance value.

[0066] In one aspect of the present example, the control device 100 counts the number of measurements CT of the electrical property of the component s measured by the measuring device 22 for each size of the component. If at least one number of measurements CT among a plurality of numbers of measurements CT is equal to or greater than the upper limit value TH (S13: NO, S27: NO), the control device 100 determines that cleaning of the measuring device 22 is required. Depending on the size of the component s, the position, degree, and the like of contamination of the measuring elements 37 differ. Therefore, the appropriate timing for cleaning is different for each size. By counting and determining the number of measurements CT for each size of the component, it is possible to more precisely determine the timing at which cleaning is required. It is possible to avoid excessive automatic cleaning or prompting the user to perform cleaning.In addition, it is possible to prevent the occurrence of a measurement error due to contamination.

[0067] The present disclosure is not limited to the example described above, and it goes without saying that various improvements and changes can be made without departing from the gist of the present disclosure.

[0068] For example, in the example described above, the necessity of cleaning the measuring device 22 is determined by comparing the number of measurements CT with the upper limit value TH, but the determination method is not limited to this. For example, the necessity of cleaning may be determined based on the elapsed time. The control device 100 may determine that cleaning is necessary when the upper limit value has been exceeded since the date and time of the last cleaning. In this case, the control device 100 may, for example, set half a year as the upper period (set a shorter period) when the minimum value of the resistance of the component s included in the job data JOB is 1 Ω or less, and set one year as the upper period (set a longer period) when the minimum value is greater than 1 Ω.

[0069] In the example described above, the belt conveyor 14 serves as the component supply unit of the present disclosure, but the present disclosure is not limited thereto. The component supply unit of the present disclosure is not limited to the conveyor and may also include other types of component supply units, for example, a tray-type component supply unit that places and provides the component s on a tray.

[0070] The control device 100 also performs the process of setting the upper limit value TH depending on the resistance value and the process of counting the number of measurements CT depending on the size of the component s, but may also perform only one of the processes. Therefore, the upper limit value TH may be a fixed value, and the number of measurements CT may be a value for all components s.

[0071] It should be noted that the content of the present disclosure is not limited to the dependency relationships described in the claims. For example, the present description also discloses a technical idea in which, in claim 4, the term "component mounting device according to claim 1 or 3" is changed to "component mounting device according to any one of claims 1 to 3." Furthermore, for example, the present description also discloses a technical idea in which, in claim 5, the term "component mounting device according to claim 1 or 2" is changed to "component mounting device according to any one of claims 1 to 4." Furthermore, for example, the present description also discloses a technical idea in which, in claim 6, the term "component mounting device according to claim 1" is changed to "component mounting device according to any one of claims 1 to 5."Furthermore, for example, the present description also discloses a technical idea in which, in claim 8, the term "component mounting device according to claim 6 or 7" is changed to "component mounting device according to any one of claims 1 to 7." Furthermore, for example, the present description also discloses a technical idea in which, in claim 9, the term "component mounting device according to claim 6 or 7" is changed to "component mounting device according to any one of claims 1 to 8." List of reference symbols

[0072] 1: Component mounting device, 8: Head moving device (moving device), 14: Belt feeder (component feeding unit), 22: Measuring device, 44: Component placing section, 100: Control device, CT: Number of measurements, P: Plate, s: Component, TH: Upper limit, JOB: Job data. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP-A-2018-174249

[0003]

Claims

[1] A component assembly device comprising: a component supply unit configured to supply a component to be mounted on a plate; a measuring device configured to measure an electrical characteristic of the component supplied from the component supply unit; a moving device configured to move the component supplied from the component supply unit to the measuring device; and a control device configured to determine, using an upper limit value that varies depending on the resistance value of the component, that cleaning of the measuring device is required when a number of measurements of the electrical property of the component measured by the measuring device is equal to or greater than the upper limit value. [2] The component mounting apparatus according to claim 1, wherein the control device performs the component mounting on the board based on job data corresponding to the type of the board, changes the job data according to the type of the board to be mounted, and determines whether the number of measurements measured so far is equal to or greater than the upper limit value according to the change of the job data. [3] The component mounting device according to claim 2, where the resistance value of the component is specified in the order data and the control device sets the upper limit based on the resistance value of the component contained in the job data, resets the upper limit according to the change in the job data, and determines that cleaning of the measuring device is required when the number of measurements measured so far is equal to or greater than the newly set upper limit. [4] The component mounting apparatus according to claim 1 or 3, wherein the control device sets the upper limit value based on the smallest resistance value among the resistance values ​​of a plurality of components to be mounted on a board. [5] The component mounting apparatus according to claim 1 or 2, wherein the control device determines whether the number of measurements is equal to or greater than the upper limit value every time the electrical characteristic of the component is measured by the measuring device, and makes the determination based on the upper limit value which is different depending on the resistance value of a component to be measured. [6] The component mounting apparatus according to claim 1, wherein the control device counts the number of measurements for each size of the component and determines that cleaning of the measuring device is required when at least one number of measurements among a plurality of numbers of measurements is equal to or greater than an upper limit value. [7] A component assembly device comprising: a component supply unit configured to supply a component to be mounted on a plate; a measuring device configured to measure an electrical characteristic of the component supplied from the component supply unit; a moving device configured to move the component supplied from the component supply unit to the measuring device; and a control device configured to count, for each size of the component, a number of measurements of the electrical property of the component measured by the measuring device and to determine that cleaning of the measuring device is required if at least one number of measurements among a plurality of numbers of measurements is equal to or greater than an upper limit. [8] The component mounting apparatus according to claim 6 or 7, wherein the control device performs mounting of the component on the board based on job data corresponding to the type of the board, changes the job data according to the type of the board to be mounted, determines at every predetermined time whether each of the plurality of numbers of measurements is equal to or greater than the upper limit value, uses the same value as the upper limit value to be compared with each of the plurality of numbers of measurements using the same job data, and determines each of the plurality of numbers of measurements from the upper limit value of the same value. [9] The component mounting device according to claim 6 or 7, wherein the measuring device comprises a component placement section on which the component is placed before the measurement, and the control device causes the movement device to arrange the component in different positions when placing the component on the component placement section depending on the size of the component. [10] A determination method for determining whether cleaning of a measuring device that measures an electrical property of a component to be mounted on a board is required in a component mounting facility having the measuring device, the determination method comprising: determining, using an upper limit value that varies depending on the resistance value of the component, that cleaning of the measuring device is necessary when a number of measurements of the electrical property of the component measured by the measuring device is equal to or greater than the upper limit value.

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