Wafer processing device, semiconductor chip manufacturing process and semiconductor chip

Abstract

A wafer processing device (100) comprises a wafer storage unit (202) configured to hold a wafer structure (W), a dicer (1) configured to perform singulation on a wafer (W1) of the wafer structure fed from the wafer storage unit, and a wafer transporter (203, 204) configured to transport the wafer structure between the wafer storage unit and the dicer. The wafer transporter includes a flipping mechanism (204d) configured to flip a layer of the wafer structure.

Description

Technical area

[0001] The present invention relates to a wafer processing apparatus, a semiconductor chip manufacturing method, and a semiconductor chip, and more particularly, it relates to a wafer processing apparatus that processes a wafer on which a plurality of semiconductor chips have been formed, a semiconductor chip manufacturing method, and a semiconductor chip. Technical background

[0002] A wafer processing apparatus is known from the prior art for processing a wafer on which a plurality of semiconductor chips are formed. Such a wafer processing apparatus is disclosed, for example, in Japanese Patent No. 6904368.

[0003] Japanese Patent No. 6904368 discloses a wafer processing apparatus that processes a wafer on which a plurality of integrated circuit chips have been formed. In the wafer processing apparatus, the wafer is diced. Specifically, after the wafer has been turned over, dicing is performed on the back side of the wafer. State of the artPatent document

[0004] Patent Document 1: Japanese Patent No. 6904368 Description of the invention Problem to be solved by the invention

[0005] Although not clearly described in Japanese Patent No. 6904368, it is conceivable that a flipping mechanism that flips the wafer is provided in the wafer processing apparatus described in Japanese Patent No. 6904368. However, if the flipping mechanism is provided separately and independently, the structure becomes complex.

[0006] The present invention has been proposed to solve the above-mentioned problem, and an object of the present invention is to provide a wafer processing apparatus, a semiconductor chip manufacturing method, and a semiconductor chip, each of which enables a flipping mechanism to flip a wafer structure while reducing or preventing the complexity of the structure. Means of solving the problem

[0007] To achieve the above-mentioned object, a wafer processing apparatus according to a first aspect of the present invention includes a wafer storage configured to store a wafer structure including a wafer on which a plurality of semiconductor chips have been formed and a plate member to which the wafer has been attached, a dicer configured to perform dicing to separate the wafer supplied from the wafer storage into individual semiconductor chips, and a wafer transporter configured to transport the wafer structure between the wafer storage and the dicer. The wafer transporter includes a flipping mechanism configured to flip a layer of the wafer structure.

[0008] In the wafer processing apparatus according to the first aspect of the present invention, as described above, the wafer transporter includes the flipping mechanism that flips the posture of the wafer structure. Accordingly, the flipping mechanism is provided by the effective use of the wafer transporter, and therefore, it is not necessary to provide the flipping mechanism separately and independently. Consequently, the complexity of the structure can be reduced or eliminated. Furthermore, the wafer structure can be flipped by the flipping mechanism. Consequently, the wafer structure can be flipped by the flipping mechanism while reducing or eliminating the complexity of the structure.

[0009] In the wafer processing apparatus according to the first aspect, the wafer transporter preferably further includes a suction unit configured to suck the wafer structure, and the flipping mechanism is preferably configured to flip the attitude of the wafer structure by rotating the suction unit that sucks the wafer structure around a rotation axis extending in the horizontal direction. Accordingly, the wafer can be reliably held by suction, and thus the wafer can be stably flipped and transported.

[0010] In the wafer processing apparatus according to the first aspect, the wafer storage is preferably configured to store the wafer structure that does not include an annular member surrounding the wafer, and the wafer transporter is preferably configured to turn over the wafer structure using the turning over mechanism and feed the wafer structure to the dicer. In the case of a wafer structure that does not include an annular member, the wafer may not be fed in a position suitable for dicing. Therefore, with the above-described configuration, even in the case of the wafer structure that does not include an annular member in which the wafer is not fed in a position suitable for dicing, the wafer can be brought into a position suitable for dicing by turning over the wafer structure using the turning over mechanism, and thus dicing can be performed appropriately.

[0011] In such a case, the wafer processing apparatus preferably further comprises a temporary placement unit provided between the wafer storage and the dicer and configured to place the wafer structure thereon. The wafer transporter is preferably configured to flip the wafer structure using the flipping mechanism and place the wafer structure on the temporary placement unit before feeding the wafer structure to the dicer. Accordingly, the next wafer can be prepared in a flipped state on the temporary placement unit, and thus the next wafer can be quickly fed to the dicer.

[0012] The wafer processing apparatus according to the first aspect preferably further comprises an expander configured to expand the plate member to which the wafer diced by the dicer has been attached. The wafer transporter is preferably configured to transport the wafer structure between the dicer and the expander, the wafer storage is preferably configured to store the wafer structure including an annular member surrounding the wafer, and the wafer transporter is preferably configured to feed the wafer structure to the dicer without inverting the wafer structure using the inverting mechanism, and to invert the wafer structure using the inverting mechanism and feed the wafer structure to the expander. In the case of the wafer structure including the annular member, the wafer is fed in a position suitable for dicing.However, if the position of the wafer suitable for dicing is opposite to the position of the wafer suitable for expanding, the position of the wafer suitable for dicing will not coincide with the position of the wafer suitable for expanding. Therefore, with the above-described configuration, even in the case of the wafer structure including the annular member in which the position of the wafer suitable for dicing does not coincide with the position of the wafer suitable for expanding, the wafer structure is flipped by the flipping mechanism, so that the dicing and expanding can be performed properly.

[0013] In such a case, the expander preferably includes a cooling device configured to cool the plate member when the plate member is expanded, and the wafer transporter is preferably configured to turn over the wafer structure using the turning over mechanism and supply the wafer structure to the cooling device. Accordingly, the wafer is supplied by effectively utilizing the cooling device, and therefore, it is not necessary to provide a wafer receiving section independent of the cooling device. Consequently, the complexity of the structure can be reduced or eliminated compared to a case where a wafer receiving section is provided independently of the cooling device.

[0014] In the wafer processing apparatus according to the first aspect, the wafer storage is preferably configured to store the wafer structure including an annular member surrounding the wafer, and the wafer transporter is preferably configured to turn over the wafer structure using the turning over mechanism and feed the wafer structure to the dicer. In the case of the wafer structure including the annular member, the wafer may not be fed in a position suitable for dicing. Therefore, with the above-described configuration, even in the case of the wafer structure including the annular member in which the wafer is not fed in a position suitable for dicing, the wafer can be brought into a position suitable for dicing by turning over the wafer structure using the turning over mechanism, and thus dicing can be properly performed.

[0015] In the wafer processing apparatus according to the first aspect, the wafer transporter preferably includes a removal unit configured to remove the wafer structure from the wafer storage, and a transport mechanism configured to transport a removed wafer structure. The flipping mechanism is preferably provided in the transport mechanism. Accordingly, the removal unit and the transport mechanism are provided separately from each other, and thus the wafer structure can be easily removed from the wafer storage, and the removed wafer structure can be easily transported. Furthermore, the flipping mechanism is provided in the transport mechanism, so that the wafer structure can be easily flipped by the flipping mechanism.

[0016] In the wafer processing apparatus according to the first aspect, the wafer transporter preferably includes a removal transporter configured to remove the wafer structure from the wafer storage and transport a removed wafer structure, and the reversing mechanism is preferably provided in the removal transporter. Accordingly, the wafer structure can be easily removed from the wafer storage using the removal transporter, and the removed wafer structure can be easily transported.

[0017] In the wafer processing apparatus according to the first aspect, the wafer transporter preferably includes a conveyor configured to retrieve the wafer structure from the wafer storage and transport the retrieved wafer structure, and the flipping mechanism is preferably provided as part of the conveyor. Accordingly, the flipping mechanism is provided as part of the conveyor by effectively utilizing the conveyor that retrieves the wafer structure from the wafer storage, and thus, compared to a case where the flipping mechanism is provided separately and independently, the complexity of the structure can be reduced or eliminated. Furthermore, the attitude of the wafer structure can be flipped while the wafer structure is being transported by the conveyor, and thus, no transportation loss of the wafer structure occurs (the transportation route does not become long).Consequently, an increase in cycle time can be reduced or prevented even if the position of the wafer structure is reversed.

[0018] In such a case, the conveyor preferably includes a rail configured to support the wafer structure removed from the wafer storage from below, and the flipping mechanism is preferably provided as part of the rail. Accordingly, the flipping mechanism is provided as part of the conveyor by effectively utilizing the conveyor's rail, and thus, the complexity of the structure can be easily reduced or eliminated.

[0019] In the configuration where the flipping mechanism is provided as part of the rail, the rail preferably comprises a pair of rails provided at a predetermined pitch, the flipping mechanism is preferably provided as part of a first rail of the pair of rails, and a second rail of the pair of rails is preferably configured to retract when the attitude of the wafer structure is flipped by the flipping mechanism. Accordingly, the flipping mechanism is provided as part of the first rail of the pair of rails, so that the complexity of the structure can be reduced or eliminated compared to a case where the flipping mechanism is provided as part of both pairs of rails.Furthermore, the second rail of the pair of rails retracts when the wafer structure's attitude is reversed by the reversing mechanism, making it possible to prevent the second rail of the pair of rails from interfering with the wafer structure, and thus, the wafer structure's attitude can be easily reversed by the reversing mechanism. Consequently, the wafer structure's attitude can be easily reversed by the reversing mechanism while reducing or preventing the complexity of the structure.

[0020] In such a case, the second rail of the pair of rails is preferably configured to move between a home position, in which the second rail supports the wafer structure from below, and a retracted position spaced from the wafer structure by rotating about a rotation axis extending along a direction in which the pair of rails extend. Accordingly, with a simple configuration in which the second rail of the pair of rails is simply rotated, the second rail of the pair of rails can be retracted from the home position to the retracted position. When the second rail of the pair of rails is retracted from the home position to the retracted position, a part of the wafer structure that is no longer supported from below by the second rail of the pair of rails can be slightly bent downward.In this connection, the second rail of the pair of rails is rotated so that the second rail of the pair of rails is returned from the retracted position to the home position, and thus, even if the portion of the wafer structure that is no longer supported from below by the second rail of the pair of rails is slightly bent downward, the second rail of the pair of rails can be easily returned to the home position while lifting the bent portion of the wafer structure.

[0021] In the configuration where the flipping mechanism is provided as part of the rail, the flipping mechanism preferably includes a holder provided as part of the rail and configured to hold the wafer structure, and is preferably configured to flip the attitude of the wafer structure by rotating the holder while the wafer structure is held by the holder. Accordingly, the holder is provided by effectively utilizing the rail supporting the wafer structure from below, thus reducing or eliminating the complexity of the structure, and the wafer structure is easily held by the holder.

[0022] In the configuration in which the flipping mechanism is provided as a part of the first rail of the pair of rails, the wafer storage is preferably configured to store the wafer structure including an annular member surrounding the wafer, and the flipping mechanism preferably comprises a clamping unit provided as a part of the first rail of the pair of rails and configured to clamp one end of the annular member of the wafer structure in an up-down direction, and preferably configured to flip the attitude of the wafer structure by rotating the clamping unit while the end of the annular member of the wafer structure is clamped by the clamping unit.Accordingly, the clamping unit is provided by effectively utilizing the first rail of the pair of rails supporting the wafer structure from below, thus reducing or eliminating the complexity of the structure. Furthermore, the end of the annular element of the wafer structure is clamped by the clamping unit, allowing the wafer structure to be reliably held, and thus the wafer structure's position can be stably reversed.

[0023] In the configuration where the flipping mechanism is provided as part of the conveyor, the wafer processing apparatus is preferably configured to switch between a setting in which the wafer pattern position is flipped by the flipping mechanism and a setting in which the wafer pattern position is not flipped by the flipping mechanism based on information about the laser processing of the wafer. Accordingly, it is possible to switch between laser processing from the circuit surface side of the wafer and laser processing from the surface side of the wafer opposite the circuit surface side, depending on the wafer to be processed. This can increase the degree of freedom in wafer processing.

[0024] A semiconductor chip manufacturing method according to a second aspect of the present invention includes performing dicing using a dicer to dice a wafer of a wafer structure including the wafer on which a plurality of semiconductor chips have been formed and a plate member to which the wafer is attached and fed from a wafer storage configured to store the wafer structure into individual semiconductor chips; and transporting the wafer structure between the wafer storage and the dicer using a wafer transporter. The wafer transporter has a flipping mechanism configured to flip the attitude of the wafer structure.

[0025] In the semiconductor chip manufacturing method according to the second aspect of the present invention, as described above, the wafer transporter includes the flipping mechanism that flips the posture of the wafer structure. Accordingly, the flipping mechanism is provided by effectively utilizing the wafer transporter, and thus, it is not necessary to provide the flipping mechanism separately and independently. Consequently, the complexity of the structure can be reduced or eliminated. Furthermore, the wafer structure can be flipped by the flipping mechanism. Consequently, it is possible to provide a semiconductor chip manufacturing method that allows the flipping mechanism to flip the wafer structure while reducing or eliminating the complexity of the structure.

[0026] A semiconductor chip according to a third aspect of the present invention is manufactured by a wafer processing apparatus including a wafer storage configured to store a wafer structure including a wafer on which a plurality of semiconductor chips have been formed and a plate member to which the wafer has been attached, a dicer configured to perform dicing to separate the wafer supplied from the wafer storage into individual semiconductor chips, and a wafer transporter configured to transport the wafer structure between the wafer storage and the dicer. The wafer transporter includes a flipping mechanism configured to flip the attitude of the wafer structure.

[0027] In the semiconductor chip according to the third aspect of the present invention, as described above, the wafer transporter includes the flipping mechanism that flips the posture of the wafer structure. Accordingly, the flipping mechanism is provided by effectively utilizing the wafer transporter, and thus, it is not necessary to provide the flipping mechanism separately and independently. Consequently, the complexity of the structure can be reduced or eliminated. In addition, the wafer structure can be flipped by the flipping mechanism. Consequently, it is possible to provide the semiconductor chip that allows the flipping mechanism to flip the wafer structure while reducing or eliminating the complexity of the structure. Advantageous effect of the invention

[0028] According to the invention, as described above, it is possible to flip the wafer structure by means of the flipping mechanism and thereby reduce or avoid the complexity of the structure. Brief description of the drawings [ Fig. 1]: A plan view of a semiconductor wafer processing apparatus including a dicing apparatus and an expanding apparatus according to a first embodiment. [ Fig. 2]: A plan view showing a wafer ring structure to be processed in the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 3]: A sectional view along the line III-III in Fig. 2. [ Fig. 4]: Top view of the separating device arranged next to the expansion device according to the first embodiment. [ Fig. 5]: A side view showing the separating device arranged next to the expanding device according to the first embodiment, viewed from the Y2 direction side. [ Fig. 6]: Top view of the expansion device according to the first embodiment. [ Fig. 7]: A side view showing the expansion device according to the first embodiment as seen from the Y2 direction side. [ Fig. 8]: A side view showing the expansion device according to the first embodiment, viewed from the X1 direction side. [ Fig. 9]: A block diagram showing the control configuration of the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 10]: A flowchart of the first half of a semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 11]: A flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 12]: A diagram illustrating the flipping of a wafer according to the first embodiment. [ Fig. 13]: Top view of a semiconductor wafer processing apparatus with a dicing device and an expanding device according to a second embodiment. [ Fig. 14]: A side view showing the semiconductor wafer processing apparatus having the dicing apparatus and the expanding apparatus according to the second embodiment, viewed from the Y2 direction side. [ Fig. 15]: A side view showing the semiconductor wafer processing apparatus having the dicing apparatus and the expanding apparatus according to the second embodiment, viewed from the X1 direction side. [ Fig. 16]: A block diagram showing the control configuration of the semiconductor wafer processing apparatus according to the second embodiment. [ Fig. 17]: A flowchart of the first half of a semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the second embodiment. [ Fig. 18]: A flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the second embodiment. [ Fig. 19]: A plan view of a semiconductor wafer processing apparatus according to a third embodiment. [ Fig. 20]: A plan view showing a wafer structure to be processed in the semiconductor wafer processing apparatus according to the third embodiment. [ Fig. 21]: A sectional view along the line XXI-XXI in Fig. 20. [ Fig. 22]: A side view showing a cassette unit and a temporary placement unit according to the third embodiment, viewed from the Y2 direction side. [ Fig. 23]: A diagram (1) illustrating the turning over of a wafer according to the third embodiment. [ Fig. 24]: A diagram (2) illustrating the wafer flipping according to the third embodiment. [ Fig. 25]: A diagram illustrating the image of the wafer according to the third embodiment. [ Fig. 26]: A plan view showing a semiconductor wafer processing apparatus according to a fourth embodiment. [ Fig. 27]: A side view showing an expansion device according to the fourth embodiment, viewed from the Y2 direction side. [ Fig. 28]: A diagram illustrating the flipping of a wafer according to the fourth embodiment. [ Fig. 29]: Plan view of a semiconductor wafer processing apparatus according to a modified example of the fourth embodiment. [ Fig. 30]: A diagram illustrating the reversing of a wafer according to the modified example of the fourth embodiment. [ Fig. 31]: Top view of a semiconductor wafer processing apparatus according to a fifth embodiment. [ Fig. 32]: A plan view of a turning mechanism and rails according to the fifth embodiment. [ Fig. 33]: A diagram (1) illustrating the turning over of a wafer according to the fifth embodiment. [ Fig. 34]: A diagram (2) illustrating the wafer flipping according to the fifth embodiment. Modes for carrying out the invention

[0029] Embodiments of the present invention are described below with reference to the drawings. First embodiment

[0030] The configuration of a semiconductor wafer processing apparatus 100 according to a first embodiment of the present invention will now be described with reference to FIG. Fig. 1 to 12. The semiconductor wafer processing apparatus 100 is an example of a "wafer processing apparatus" in the claims.

[0031] Semiconductor wafer processing apparatus As in Fig. As shown in FIG. 1, the semiconductor wafer processing apparatus 100 is an apparatus that processes a wafer W1 provided on a wafer ring structure W. The semiconductor wafer processing apparatus 100 forms a modified layer in the wafer W1 and divides the wafer W1 along the modified layer to form a plurality of semiconductor chips Ch (see FIG. Fig. 8). The wafer ring structure W is an example of a “wafer structure” in the claims.

[0032] The wafer ring structure W is now described with reference to the Fig. 2 and Fig. 3. The wafer ring structure W comprises the wafer W1, a plate element W2, and an annular element W3.

[0033] The wafer W1 is a circular, thin plate made of a crystal of a semiconductor material used as a material for a semiconductor integrated circuit. The modified layer is formed inside the wafer W1 by modifying the inside along a dividing line through processing in the semiconductor wafer processing apparatus 100. That is, the wafer W1 is processed so that it can be divided along the dividing line. The plate member W2 is an elastic adhesive tape. An adhesive layer is provided on the top surface W21 of the plate member W2. The wafer W1 is bonded to the adhesive layer on the plate member W2. The annular member W3 is a ring-shaped metal frame in plan view. The annular member W3 is attached to the adhesive layer on the plate member W2 and surrounds the wafer W1. The wafer W1 contains an SC circuit layer W11.In the first embodiment, the wafer W1 is arranged on the plate member W2 such that the Sc circuit layer W11 is arranged on the opposite side to the plate member W2.

[0034] The semiconductor wafer processing apparatus 100 includes a dicing device 1 and an expanding device 2. An up-down direction is defined as the Z direction, an upward direction is defined as the Z1 direction, and a downward direction is defined as the Z2 direction. In a horizontal direction perpendicular to the Z direction, a direction in which the dicing device 1 and the expanding device 2 are aligned is defined as the X direction, a direction from the dicing device 1 to the expanding device 2 in the X direction is defined as the X1 direction, and a direction from the expanding device 2 to the dicing device 1 in the X direction is defined as the X2 direction. A direction perpendicular to the X direction in the horizontal direction is defined as the Y direction, a direction in the Y direction is defined as the Y1 direction, and the other direction in the Y direction is defined as the Y2 direction.The separating device 1 is an example of a “dicer” in the claims. Separation device

[0035] As in the Fig. 1, Fig. 4 and Fig. As shown in Fig. 5, the dicing apparatus 1 performs dicing of the wafer W1, which is fed from a cassette unit 202 (described below) and on which a plurality of semiconductor chips Ch have been formed, to dicing the wafer W1 into the plurality of semiconductor chips Ch. The dicing apparatus 1 emits a laser having a wavelength transparent to the wafer W1 along the dividing line (street) to form the modified layer. The modified layer refers to a crack, a gap, or the like formed within the wafer W1 by the laser. A method for forming the modified layer in the wafer W1 in this way is called dicing.

[0036] The separation device 1 has a base 11, a clamping table unit 12, a laser 13 and an image generator 14.

[0037] Base 11 is a base on which the clamping table unit 12 is installed. Base 11 has a rectangular shape in plan view. clamping table unit

[0038] The chuck table unit 12 includes a suction unit 12a, clamps 12b, a rotation mechanism 12c, and a table moving mechanism 12d. The suction unit 12a sucks the wafer ring structure W on the upper surface of the suction unit 12a on the Z1 direction side. The suction unit 12a is a table with a suction hole, a suction piping, etc., for sucking the lower surface of the annular member W3 of the wafer ring structure W on the Z2 direction side. The suction unit 12a is supported by the table moving mechanism 12d via the rotation mechanism 12c. The clamps 12b are provided at an upper end of the suction unit 12a. The clamps 12b hold the wafer ring structure W sucked by the suction unit 12a. The clamps 12b hold the annular element W3 of the wafer ring structure W sucked by the suction unit 12a from the Z1 direction side. In this way, the wafer ring structure W is held by the suction unit 12a and the clamps 12b.

[0039] The rotation mechanism 12c rotates the suction unit 12a in a circumferential direction about a rotational center axis C parallel to the Z direction. The rotation mechanism 12c is attached to an upper end of the table movement mechanism 12d. The table movement mechanism 12d moves the wafer ring structure W in the X and Y directions. The table movement mechanism 12d includes an X-direction movement mechanism 121 and a Y-direction movement mechanism 122. The X-direction movement mechanism 121 moves the rotation mechanism 12c in the X1 direction or the X2 direction. The X-direction movement mechanism 121 includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. The Y-direction movement mechanism 122 moves the rotation mechanism 12c in the Y1 direction or the Y2 direction.The Y-direction motion mechanism 122 includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. Laser

[0040] The laser 13 emits a laser beam toward the wafer W1 of the wafer ring structure W held by the chuck unit 12. The laser 13 is arranged on the Z1-direction side of the chuck unit 12. The laser 13 includes a laser irradiation device 13a, a fixture 13b, and a Z-direction movement mechanism 13c. The laser irradiation device 13a emits a pulsed laser beam. The fixture 13b is a frame to which the laser 13 and the imager 14 are mounted. The Z-direction movement mechanism 13c moves the laser 13 in the Z1 or Z2 direction. The Z-direction movement mechanism 13c includes a linear feed module or a ball screw and a drive, for example, a motor with an encoder.The laser irradiation device 13a may be a laser irradiation device that oscillates a continuous wave laser beam as a laser beam as long as a modified layer can be formed by multiphoton absorption. Image provider

[0041] The imager 14 images the wafer W1 of the wafer ring structure W held by the chuck unit 12. The imager 14 is arranged on the Z1-direction side of the chuck unit 12. The imager 14 includes a high-resolution camera 14a, a wide-angle camera 14b, a Z-direction movement mechanism 14c, and a Z-direction movement mechanism 14d.

[0042] The high-resolution camera 14a and the wide-angle camera 14b are near-infrared imaging cameras. The high-resolution camera 14a has a narrower viewing angle than the wide-angle camera 14b. The high-resolution camera 14a has a higher resolution than the wide-angle camera 14b. The wide-angle camera 14b has a wider viewing angle than the high-resolution camera 14a. The wide-angle camera 14b has a lower resolution than the high-resolution camera 14a. The high-resolution camera 14a is arranged on the X1 direction side of the laser irradiation device 13a. The wide-angle camera 14b is arranged on the X2 direction side of the laser irradiation device 13a. Thus, the high-resolution camera 14a, the laser irradiation device 13a, and the wide-angle camera 14b are arranged side by side in this order from the X1 direction side to the X2 direction side.

[0043] The Z-direction movement mechanism 14c moves the high-resolution camera 14a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14c includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. The Z-direction movement mechanism 14d moves the wide-angle camera 14b in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14d includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. Expansion device

[0044] As in the Fig. 1, Fig. 6 and Fig. 7, the expansion device 2 divides the wafer W1 to form the plurality of semiconductor chips Ch (see FIG. Fig. 8). The expansion device 2 forms a sufficient gap between the plurality of semiconductor chips Ch. A modified layer is formed in the wafer W1 by emitting a laser having a wavelength transparent to the wafer W1 along the dividing line (street) in the dicing device 1. In the expansion device 2, the plurality of semiconductor chips Ch are formed by dividing the wafer W1 along the modified layer previously formed in the dicing device 1.

[0045] Therefore, in the expansion device 2, the wafer W1 is divided along the modified layer by expanding the plate member W2. Furthermore, in the expansion device 2, the gap between the plurality of semiconductor chips Ch formed by the division is widened by expanding the plate member W2.

[0046] The expansion device 2 includes an expansion main body 200, a base 201, a cassette unit 202, a lifting hand unit 203, and a suction hand unit 204. The expansion main body 200 expands the plate member W2 to which the wafer W1 (with the modified layer formed thereon) singulated by the dicing device 1 has been attached. The expansion main body 200 includes a base 205, a cooling air supply device 206, a cooling unit 207, an expander 208, a base 209, an expansion holding member 210, a heat shrink device 211, an ultraviolet irradiation device 212, a squeegee unit 213, and a clamp unit 214. The expansion main body 200 is an example of an "expander" in the claims. The cassette unit 202 is an example of a "wafer storage" in the claims. The lifting hand unit 203 and the suction hand unit 204 are examples of a "wafer transporter" in the claims.The lifting hand unit 203 is an example of a "removal unit" in the claims. The suction hand unit 204 is an example of a "suction unit" or "transport mechanism" in the claims. The cooling air supply device 206 is an example of a "cooling device" in the claims. base

[0047] The base 201 is a base on which the cassette unit 202 and the lifting hand unit 203 are installed. The base 201 has a rectangular shape in plan view. Cassette unit

[0048] The cassette unit 202 can accommodate a plurality of wafer ring structures W. In the first embodiment, the wafer ring structure W is stored in the cassette unit 202 such that the plate member W2 is arranged on the top side, the wafer W1 is arranged on the bottom side, and the circuit layer W11 is arranged on the bottom side. The cassette unit 202 includes wafer cassettes 202a, a Z-direction moving mechanism 202b, and pairs of placement sections 202c.

[0049] A plurality of (three) wafer cassettes 202a are arranged in the Z direction. Each of the wafer cassettes 202a has a receiving space that can accommodate a plurality of (five) wafer ring structures W. The wafer ring structure W is manually fed and inserted into the wafer cassette 202a. The wafer cassette 202a can accommodate one to four wafer ring structures W or six or more wafer ring structures W. Furthermore, one, two, or four or more wafer cassettes 202a can be arranged in the Z direction.

[0050] The Z-direction movement mechanism 202b moves the wafer cassettes 202a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 202b includes a linear conveyor module or a ball screw and a drive, such as a motor with an encoder. The Z-direction movement mechanism 202b also includes mounting tables 202d that support the wafer cassettes 202a from below. A plurality of (three) mounting tables 202d are arranged corresponding to the positions of the plurality of wafer cassettes 202a.

[0051] A plurality of (five) pairs of placement sections 202c are arranged within the wafer cassette 202a. The annular element W3 of the wafer ring structure W is placed on the pair of placement sections 202c from the Z1 direction side. One of the pair of placement sections 202c protrudes in the X2 direction from the inner surface of the wafer cassette 202a on the X1 direction side. The other of the pair of placement sections 202c protrudes in the X1 direction from the inner surface of the wafer cassette 202a on the X2 direction side. Lifting hand unit

[0052] The lifting hand unit 203 can remove the wafer ring structure W from the cassette unit 202. Furthermore, the lifting hand unit 203 can transfer the wafer ring structure W into the cassette unit 202.

[0053] Specifically, the lifting hand unit 203 includes a Y-direction movement mechanism 203a and a lifting hand 203b. The Y-direction movement mechanism 203a includes a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The lifting hand 203b supports the annular element W3 of the wafer ring structure W from the Z2 direction side. Suction hand unit

[0054] The suction hand unit 204 sucks the ring-shaped element W3 of the wafer ring structure W from the Z1 direction side.

[0055] Specifically, the suction hand unit 204 includes an X-direction movement mechanism 204a, a Z-direction movement mechanism 204b, and a suction hand 204c. The X-direction movement mechanism 204a moves the suction hand 204c in the X-direction. The Z-direction movement mechanism 204b moves the suction hand 204c in the Z-direction. The X-direction movement mechanism 204a and the Z-direction movement mechanism 204b each include a linear conveyor module or a ball screw and a drive, such as a motor with an encoder. The suction hand 204c sucks and supports the annular element W3 of the wafer ring structure W from the Z1-direction side. The suction hand 204c supports the annular element W3 of the wafer ring structure W by generating a negative pressure. The suction hand 204c contains a suction hole or the like to suck the wafer ring structure W by the negative pressure.The wafer transporter includes the lifting hand unit 203 and the suction hand unit 204 and transports the wafer ring structure W between the cassette unit 202, the singulation device 1, and the expansion main body 200. In the first embodiment, the wafer transporter includes the lifting hand unit 203 for removing the wafer ring structure W from the cassette unit 202 and the suction hand unit 204 for transporting the removed wafer ring structure W. base

[0056] As in the Fig. 7 and Fig. As shown in Figure 8, the base 205 is a base on which the expander 208, the cooling unit 207, the ultraviolet irradiation device 212, and the doctor blade unit 213 are installed. The base 205 has a rectangular shape in plan view. Fig. 8, the clamping unit 214, which is arranged on the side of the cooling unit 207 in the Z1 direction, is indicated by dashed lines. Cooling air supply device

[0057] The cooling air supply device 206 cools the plate element W2 when the plate element W2 is expanded. The cooling air supply device 206 supplies cooling air to the plate element W2 from the Z1 direction side when the plate element W2 is expanded by the expander 208.

[0058] Specifically, the cooling air supply device 206 includes a main body 206a, a cooling air supply port 206b, and a moving mechanism 206c. Cooling air supplied from a cooling air supply device can flow out through the cooling air supply port 206b. The cooling air supply port 206b is provided at one end of the supply device main body 206a on the Z2 direction side. The cooling air supply port 206b is arranged in a central portion of the end of the supply device main body 206a on the Z2 direction side. The moving mechanism 206c includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder.

[0059] The cooling air supply device is a device that generates cool air. The cooling air supply device supplies cooled air, for example, by a heat pump. Such a cooling air supply device is installed on the base 205. The cooling air supply device 206 and the cooling air supply device are connected to each other by a hose (not shown). Cooling unit

[0060] The cooling unit 207 cools the plate element W2 from the Z2 direction side.

[0061] Specifically, the cooling unit 207 includes a cooling element 207a, which includes a heat sink 271 and a Peltier element 272, and a Z-direction movement mechanism 207b. The heat sink 271 is made of a member with a large heat capacity and high thermal conductivity. The heat sink 271 is made of metal, such as aluminum. The Peltier element 272 cools the heat sink 271. The heat sink 271 is not limited to aluminum and can also be made of another member with a large heat capacity and high thermal conductivity. The Z-direction movement mechanism 207b is a cylinder.

[0062] The cooling unit 207 is movable in the Z1 direction or the Z2 direction by the Z-direction moving mechanism 207b. Thus, the cooling unit 207 can be moved to a position where it contacts the plate member W2 and to a position spaced apart from the plate member W2. expander

[0063] The expander 208 expands the plate element W2 of the wafer ring structure W to separate the wafer W1 along the dividing line.

[0064] Specifically, the expander 208 includes an expansion ring 281. The expansion ring 281 expands the plate element W2 by supporting the plate element W2 from the Z2 direction side. The expansion ring 281 has a ring shape in plan view. The structure of the expansion ring 281 is described in detail below. base

[0065] The base 209 is a base material on which the cooling air supply device 206, the expansion holding member 210 and the heat shrink device 211 are mounted. Expansion holding element

[0066] As in the Fig. 7 and Fig. 8, the expansion holding member 210 holds the plate member W2 from the Z1 direction side so that the plate member W2 does not shrink near the wafer W1 due to heating by a heater ring 211a.

[0067] Specifically, the expansion holding member 210 includes a pressing ring 210a, a lid 210b, and an inlet 210c. The pressing ring 210a has a ring shape in plan view. The lid 210b is provided on the pressing ring 210a to close an opening of the pressing ring 210a. The inlet 210c is an inlet ring with a ring shape in plan view. A plurality of inlet openings are formed in the lower surface of the inlet 210c on the Z2 direction side. The pressing ring 210a is moved in the Z direction by a Z-direction moving mechanism 210d. That is, the Z-direction moving mechanism 210d moves the pressing ring 210a to a position where the plate member W2 is held down and to a position away from the plate member W2. The Z-direction movement mechanism 210d includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. Heat shrink device

[0068] The heat shrinking device 211 shrinks the plate member W2 expanded by the expander 208 by heating while maintaining the gap between the plurality of semiconductor chips Ch.

[0069] The heat shrink device 211 includes the heating ring 211a and a Z-direction movement mechanism 211b. The heating ring 211a has a ring shape in plan view. The heating ring 211a contains a jacketed heater that heats the plate member W2. The Z-direction movement mechanism 211b moves the heating ring 211a in the Z direction. The Z-direction movement mechanism 211b includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder.

[0070] Ultraviolet Irradiation Device: The ultraviolet irradiation device 212 emits ultraviolet rays onto the plate member W2 to reduce the adhesive strength of the adhesive layer of the plate member W2. Specifically, the ultraviolet irradiation device 212 includes an ultraviolet illumination device. The ultraviolet irradiation device 212 is arranged at one end of a press 213a of the squeegee unit 213 described below, on the Z1 direction side. The ultraviolet irradiation device 212 emits the ultraviolet rays onto the plate member W2 as it moves together with the squeegee unit 213. Squeegee unit

[0071] The squeegee unit 213 divides the wafer W1 along the modified layer by locally pressing the wafer W1 from the side in the Z2 direction after the plate member W2 is stretched. Specifically, the squeegee unit 213 includes the press 213a, a Z-direction moving mechanism 213b, an X-direction moving mechanism 213c, and a rotation mechanism 213d.

[0072] The press 213a generates bending stress in the wafer W1 to divide the wafer W1 along the modified layer by being moved by the rotation mechanism 213d and the X-direction movement mechanism 213c while pressing the wafer W1 from the Z2 direction side over the plate member W2. The press 213a presses the wafer W1 over the plate member W2 by being raised to a raised position on the Z1 direction side by the Z-direction movement mechanism 213b. When the press 213a is lowered to a lowered position on the Z2 direction side by the Z-direction movement mechanism 213b, the wafer W1 is no longer pressed. The press 213a is a squeegee.

[0073] The press 213a is attached to one end of the Z-direction movement mechanism 213b on the Z1 direction side. The Z-direction movement mechanism 213b moves the press 213a linearly in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 213b is, for example, a cylinder. The Z-direction movement mechanism 213b is attached to one end of the X-direction movement mechanism 213c on the Z1 direction side.

[0074] The X-direction movement mechanism 213c is mounted on one end of the rotation mechanism 213d on the Z1 direction side. The X-direction movement mechanism 213c moves the press 213a linearly in one direction. The X-direction movement mechanism 213c includes a linear feed module or a ball screw and a drive, for example, a motor with an encoder.

[0075] In the squeegee unit 213, the press 213a is raised by the Z-direction movement mechanism 213b. In the squeegee unit 213, the press 213a is moved in the Y direction by the X-direction movement mechanism 213c, while locally pressing the wafer W1 from the Z2 direction side via the plate member W2, so that the wafer W1 is split. In the squeegee unit 213, the press 213a is lowered to the lowered position by the Z-direction movement mechanism 213b. After the press 213a completes its movement in the Y direction, the press 213a is rotated 90 degrees in the squeegee unit 213 by the rotation mechanism 213d.

[0076] In the squeegee unit 213, the press 213a is raised by the Z-direction movement mechanism 213b. After the press 213a is rotated 90 degrees in the squeegee unit 213, the press 213a is moved by the X-direction movement mechanism 213c while locally pressing the wafer W1 from the Z2 direction side via the plate member W2, so that the wafer W1 is divided. clamping unit

[0077] The clamping unit 214 holds the annular element W3 of the wafer ring structure W. Specifically, the clamping unit 214 includes a gripper 214a, a Z-direction movement mechanism 214b, and a Y-direction movement mechanism 214c. The gripper 214a supports the annular element W3 from the Z2 direction side and holds down the annular element W3 from the Z1 direction side. Thus, the annular element W3 is held by the gripper 214a. The gripper 214a is connected to the Z-direction movement mechanism 214b.

[0078] The Z-direction movement mechanism 214b moves the clamping unit 214 in the Z direction. In particular, the Z-direction movement mechanism 214b moves the gripper 214a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 214b includes a linear conveyor module or a ball screw and a drive, which has, for example, a motor with an encoder. The Z-direction movement mechanism 214b is connected to the Y-direction movement mechanism 214c. The Y-direction movement mechanism 214c moves the Z-direction movement mechanism 214b in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 214c includes a linear conveyor module or a ball screw and a drive, which has, for example, a motor with an encoder. Control configuration of a semiconductor wafer processing apparatus

[0079] As in Fig. 9, the semiconductor wafer processing apparatus 100 includes a first controller 101, a second controller 102, a third controller 103, a fourth controller 104, a fifth controller 105, a sixth controller 106, a seventh controller 107, an eighth controller 108, a stretch control computer 109, a handling control computer 110, and a singulation control computer 111.

[0080] The first controller 101 controls the squeegee unit 213. The first controller 101 includes a central processing unit (CPU) and a memory, which includes, for example, a read-only memory (ROM) and a random access memory (RAM). The first controller 101 may include a hard disk drive (HDD) as memory, which retains the stored information even after the power is turned off. The hard disk drive may be provided jointly for the first controller 101, the second controller 102, the third controller 103, the fourth controller 104, the fifth controller 105, the sixth controller 106, the seventh controller 107, and the eighth controller 108.

[0081] The second controller 102 controls the cooling air supply device 206 and the cooling unit 207. The second controller 102 includes a CPU and a memory, including, for example, a ROM and a RAM. The third controller 103 controls the heat shrink device 211 and the ultraviolet irradiation device 212. The third controller 103 includes a CPU and a memory, including, for example, a ROM and a RAM. The second controller 102 and the third controller 103 may include a hard disk as storage, which retains stored information even after the power is turned off.

[0082] The fourth controller 104 controls the cassette unit 202 and the lifting hand unit 203. The fourth controller 104 has a CPU and a memory, which includes, for example, a ROM and a RAM. The fifth controller 105 controls the suction hand unit 204. The fifth controller 105 has a CPU and a memory, which includes, for example, a ROM and a RAM. The fourth controller 104 and the fifth controller 105 can include a hard disk as storage, which retains stored information, for example, even after the power is turned off.

[0083] The sixth controller 106 controls the clamping table unit 12. The sixth controller 106 has a CPU and a memory, which includes, for example, a ROM and a RAM. The seventh controller 107 controls the laser 13. The seventh controller 107 has a CPU and a memory, which includes, for example, a ROM and a RAM. The eighth controller 108 controls the imager 14. The eighth controller 108 has a CPU and a memory, which includes, for example, a ROM and a RAM. The sixth controller 106, the seventh controller 107, and the eighth controller 108 can include, for example, a hard disk as storage, which retains stored information even after the power is switched off.

[0084] The expansion control computer 109 performs calculations regarding a process for expanding the plate member W2 based on the processing results of the first controller 101, the second controller 102, and the third controller 103. The expansion control computer 109 includes a CPU and a memory including, for example, a ROM and a RAM.

[0085] The handling control computer 110 performs calculations regarding a process for moving the wafer ring structure W based on the processing results of the fourth controller 104 and the fifth controller 105. The handling control computer 110 includes a CPU and a memory including, for example, a ROM and a RAM.

[0086] The singulation control computer 111 performs calculations related to a process for singulating the wafer W1 based on the processing results of the sixth controller 106, the seventh controller 107, and the eighth controller 108. The singulation control computer 111 includes a CPU and a memory, including, for example, a ROM and a RAM.

[0087] The memory 112 stores programs for operating the separating device 1 and the expanding device 2. The memory 112 includes, for example, a ROM, a RAM, and an HDD. Semiconductor chip manufacturing process

[0088] The overall operation of the semiconductor wafer processing apparatus 100 is described below with reference to the Fig. 10 and Fig. 11 described.

[0089] In step S1, the wafer ring structure W is removed from the cassette unit 202. That is, after the wafer ring structure W stored in the cassette unit 202 is supported by the lifting hand 203b, the lifting hand 203b is moved in the Y1 direction by the Y-direction moving mechanism 203a, so that the wafer ring structure W is removed from the cassette unit 202. In step S2, the wafer ring structure W is transferred to the chuck table unit 12 of the singulation device 1 by the suction hand 204c. That is, the wafer ring structure W removed from the cassette unit 202 is moved in the X2 direction by the X-direction moving mechanism 204a while being sucked by the suction hand 204c. The wafer ring structure W, which has been moved in the X2 direction, is brought to the chuck table unit 12 by the suction hand 204c and then held by the chuck table unit 12.

[0090] In step S3, a modified layer is formed in the wafer W1 by the laser 13. In step S4, the wafer ring structure W containing the wafer W1 in which the modified layer has been formed is transferred to the clamping unit 214 by the suction hand 204c. In step S5, the plate member W2 is cooled by the cooling air supply device 206 and the cooling unit 207. That is, the wafer ring structure W held by the clamping unit 214 is moved (lowered) in the Z2 direction by the Z-direction moving mechanism 214b to contact the cooling unit 207, and the cooling air supply device 206 supplies cooling air from the Z1 direction side to cool the plate member W2.

[0091] In step S6, the wafer ring structure W is moved from the clamping unit 214 to the expander 208. That is, the wafer ring structure W with the cooled plate member W2 is moved in the Y1 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. In step S7, the plate member W2 is expanded by the expander 208. That is, the wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping unit 214. Then, the plate member W2 contacts the expansion ring 281 and is expanded by pulling the expansion ring 281. In this way, the wafer W1 is divided along the dividing line (modified layer).

[0092] In step S8, the expanded plate element W2 is held down from the Z1 direction side by the expansion holding member 210. That is, the pressing ring 210a is moved (lowered) in the Z2 direction by the Z-direction moving mechanism 210d until it touches the plate element W2. Then, the process proceeds from a point A in Fig. 10 over a point A in Fig. 11 proceed to step S9.

[0093] As in Fig. As shown in Figure 11, in step S9, after the plate member W2 is held down by the expansion holding member 210, the plate member W2 is irradiated with ultraviolet rays by the ultraviolet irradiation device 212 while the wafer W1 is compressed by the squeegee unit 213. In this way, the wafer W1 is further divided by the squeegee unit 213. Furthermore, the adhesive force of the plate member W2 is reduced by the ultraviolet rays emitted by the ultraviolet irradiation device 212.

[0094] In step S10, while the heat shrinking device 211 heats and shrinks the plate member W2, the clamping unit 214 is lifted. At this time, the inlet 210c sucks in air near the heated sheet W2. In step S11, the wafer ring structure W is transferred from the clamping unit 214 to the suction hand 204c. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. Then, the wafer ring structure W is sucked by the suction hand 204c after the holding by the clamping unit 214 on the cooling unit 207 side is released in the Z1 direction.

[0095] In step S12, the wafer ring structure W is transferred to the lifting hand 203b by the suction hand 204c. In step S13, the wafer ring structure W is stored in the cassette unit 202. That is, the wafer ring structure W carried by the lifting hand 203b is moved in the Y1 direction by the Y-direction moving mechanism 203a to be stored in the cassette unit 202. This completes the process performed on one wafer ring structure W. Then, the process returns from a point B in Fig. 11 via a point B in Fig. 10 back to step S1. Turning mechanism

[0096] In the first embodiment, as shown in the Fig. 1, Fig. 6 and Fig. 8, the suction hand unit 204 has a reversing mechanism 204d for reversing the position of the wafer ring structure W.

[0097] A manufacturing method for the semiconductor chip Ch by the semiconductor wafer processing apparatus 100 includes a dicing step using the dicing apparatus 1, the wafer W1 of the wafer ring structure W supplied from the cassette unit 202 that stores the wafer ring structure W including the wafer W1 on which the plurality of semiconductor chips Ch have been formed and the plate member W2 to which the wafer W1 has been attached, to dicing the wafer W1 into the individual semiconductor chips Ch, and a step of transporting the wafer ring structure W between the cassette unit 202 and the dicing apparatus 1 using the lifting hand unit 203 and the suction hand unit 204, and the suction hand unit 204 has the inversion mechanism 204d to invert the attitude of the wafer ring structure W.

[0098] The semiconductor chip Ch manufactured by the semiconductor wafer processing apparatus 100 is manufactured by the semiconductor wafer processing apparatus 100, which includes the cassette unit 202 for storing the wafer ring structure W including the wafer W1 on which the plurality of semiconductor chips Ch have been formed and the plate member W2 to which the wafer W1 has been attached, the dicing device 1 for dicing the wafer W1 of the wafer ring structure W, which is fed from the cassette unit 202 to dicing the wafer W1 into the individual semiconductor chips Ch, and the lifting hand unit 203 and the suction hand unit 204 including the reversing mechanism 204d for reversing the attitude of the wafer ring structure W to transport the wafer ring structure W between the cassette unit 202 and the dicing device 1.

[0099] In the first embodiment, the reversing mechanism 204d is provided in the suction hand unit 204. In the first embodiment, the reversing mechanism 204d rotates the suction hand 204c of the suction hand unit 204, which sucks the wafer ring structure W, around a rotation axis Ax extending in the horizontal direction (Y direction) to reverse the position of the wafer ring structure W. The reversing mechanism 204d includes a motor and a rotating shaft rotated by the motor. The rotating shaft of the reversing mechanism 204d is connected to the suction hand 204c to rotate the suction hand 204c around the rotating axis Ax.

[0100] In the first embodiment, the suction hand unit 204 feeds the wafer ring structure W to the dicing device 1 without inverting the wafer ring structure W by means of the inverting mechanism 204d, and inverts the wafer ring structure W by means of the inverting mechanism 204d and delivers it to the expansion main body 200. Specifically, the suction hand unit 204 feeds the wafer ring structure W in which the plate member W2 is arranged on the upper side and the wafer W1 is arranged on the lower side to the dicing device 1, and feeds the wafer ring structure W in which the plate member W2 is arranged on the lower side and the wafer W1 is arranged on the upper side to the expansion main body 200 by inverting the wafer ring structure W by means of the inverting mechanism 204d.

[0101] In the first embodiment, the suction hand unit 204 inverts the wafer ring structure W using the inversion mechanism 204d and delivers it to the cooling air supply device 206. Specifically, the suction hand unit 204 inverts the wafer ring structure W using the inversion mechanism 204d to deliver the wafer ring structure W, in which the plate member W2 is arranged on the bottom side and the wafer W1 is arranged on the top side, to the cooling air supply device 206. The cooling air supply device 206 generates a negative pressure to suck the wafer ring structure W and picks up the wafer ring structure W from the suction hand unit 204. The cooling air supply device 206 includes a suction hole or the like for sucking the wafer ring structure W by the negative pressure.

[0102] The turning over of the wafer ring structure W is described with reference to Fig. 12. The operation of the separating device 1 is controlled by the separating control computer 111. The operation of the lifting hand unit 203 and the suction hand unit 204 is controlled by the handling control computer 110. The operation of the expansion main body 200 is controlled by the expansion control computer 109.

[0103] First, the wafer ring structure W, in which the plate element W2 is arranged on the upper side and the wafers W1 on the lower side (hereinafter referred to as the wafer ring structure W in the first state), is removed from the cassette unit 202 by the lifting hand unit 203. Then, as shown in Fig. 12, the wafer ring structure W in the first state is transferred from the lifting hand unit 203 to the suction hand unit 204. Then, the wafer ring structure W in the first state is delivered to the singulation device 1 by the suction hand unit 204. In the wafer singulation device 1, the wafer ring structure W in the first state is picked up by the chuck table unit 12.

[0104] Then, the modified layer is formed by emitting a laser beam onto the wafer ring structure W in the first state by the laser 13. At this time, the laser beam is irradiated onto the wafer W1 through the plate member W2 from the side opposite to the Sc circuit layer W11 by the laser 13. When the laser beam is emitted from the side of the Sc circuit layer W11 on which the road is formed, the width of the laser beam may not fit the width of the road if the road width is narrow. However, the laser beam is emitted onto the wafer W1 through the plate member W2 from the side opposite to the Sc circuit layer W11 by the laser 13, so that the width of the laser beam can be prevented from not fitting the width of the road. Thereby, the wafer W1 is fed to the dicing device 1 in a posture suitable for dicing.

[0105] After dicing, the wafer ring structure W in the first state is transferred from the chuck table unit 12 to the suction hand unit 204. Then, the wafer ring structure W in the first state is turned over by the turning mechanism 204d during transportation from the dicing device 1 to the expansion main body 200. Then, the wafer ring structure W in which the plate member W2 is arranged on the bottom side and the wafers W1 are arranged on the top side (hereinafter referred to as the wafer ring structure W in the second state) is supplied to the expansion main body 200 by the suction hand unit 204. In the expansion main body 200, the wafer ring structure W in the second state is delivered by the suction hand unit 204 to the cooling air supply device 206. At this time, the top side of the annular element W3 of the wafer ring structure W in the second state is sucked by the cooling air supply device 206.Then, the wafer ring structure W in the second state is delivered from the cooling air supply device 206 to the clamping unit 214.

[0106] Then, the wafer ring structure W in the second state is cooled by the cooling air supply device 206 and the cooling unit 207, expanded by the expander 208, irradiated with ultraviolet rays by the ultraviolet irradiation device 212, squeezed by the doctor blade unit 213, and heat-shrinked by the heat-shrinking device 211. During expansion by the expander 208, the wafer ring structure W in the second state, in which the plate member W2 is arranged on the bottom side and the wafer W1 is arranged on the top side, is expanded. Thus, the wafer W1 is supplied to the expansion main body 200 in a position suitable for expansion.

[0107] After expansion and the like, the wafer ring structure W in the second state is delivered from the clamping unit 214 to the cooling air supply device 206. Then, the wafer ring structure W in the second state is delivered from the cooling air supply device 206 to the suction hand unit 204. Then, during transportation from the suction hand unit 204 to the lifting hand unit 203, the wafer ring structure W in the second state is turned over by the turning mechanism 204d. Then, the wafer ring structure W in the first state, in which the plate member W2 is arranged on the upper side and the wafers W1 are arranged on the lower side, is delivered from the suction hand unit 204 to the lifting hand unit 203. Subsequently, the wafer ring structure W in the first state is placed in the cassette unit 202 by the lifting hand unit 203.

[0108] The semiconductor wafer processing apparatus 100 can process the wafer ring structure W without inverting it. When the wafer ring structure W is not inverted, the wafer ring structure W is stored in the cassette unit 202 so that the plate member W2 is located on the bottom side, the wafer W1 is located on the top side, and the SC circuit layer W11 is located on the top side. In such a case, the wafer ring structure W is fed to the dicing apparatus 1 by the suction hand unit 204 without being inverted. The wafer ring structure W is also fed to the expansion main body 200 by the suction hand unit 204 without being inverted. Advantageous effects of the first embodiment

[0109] According to the first embodiment, the following advantageous effects are achieved.

[0110] According to the first embodiment, as described above, the suction hand unit 204 includes the flipping mechanism 204d configured to flip the posture of the wafer ring structure W. Accordingly, the flipping mechanism 204d is provided by effectively utilizing the suction hand unit 204, and therefore, it is not necessary to provide the flipping mechanism 204d separately and independently. Consequently, the complexity of the structure can be reduced or eliminated. Furthermore, the wafer ring structure W can be flipped by the flipping mechanism 204d. Consequently, the wafer ring structure W can be flipped by the flipping mechanism 204d while reducing or eliminating the complexity of the structure.

[0111] According to the first embodiment, as described above, the flipping mechanism 204d is configured to flip the attitude of the wafer ring structure W by rotating the suction hand 204c of the suction hand unit 204, which sucks the wafer ring structure W, around the rotation axis Ax extending in the horizontal direction. Accordingly, the wafer W1 can be reliably held by suction, and thus the wafer W1 can be stably flipped and transported.

[0112] According to the first embodiment, as described above, the semiconductor wafer processing apparatus 100 further includes the expansion main body 200 configured to expand the plate member W2 to which the wafer W1 singulated by the singulating apparatus 1 has been attached, the lifting hand unit 203 and the suction hand unit 204 are configured to transport the wafer ring structure W between the singulating apparatus 1 and the expansion main body 200, the cassette unit 202 is configured to store the wafer ring structure W including the ring-shaped member W3 surrounding the wafer W1, and the suction hand unit 204 is configured to feed the wafer ring structure W to the singulating apparatus 1 without inverting the wafer ring structure W using the inverting mechanism 204d.and that it turns over the wafer ring structure W using the turning mechanism 204d and feeds the wafer ring structure W to the expansion main body 200. In the case of the wafer ring structure W including the annular member W3, the wafer W1 is fed in a position suitable for dicing. However, if the position of the wafer W1 suitable for dicing is opposite to the position of the wafer W1 suitable for expanding, the position of the wafer W1 suitable for dicing does not coincide with the position of the wafer W1 suitable for expanding. Therefore, with the configuration described above, even in the case of the wafer ring structure W including the ring-shaped element W3, in which the position of the wafer W1 suitable for dicing does not coincide with the position of the wafer W1 suitable for expanding, the wafer ring structure W is turned over by the turning over mechanism 204d,so that the separation and expansion can be carried out effectively.

[0113] According to the first embodiment, as described above, the expansion main body 200 includes the cooling air supply device 206 configured to cool the plate member W2 when the plate member W2 is expanded, and the suction hand unit 204 is configured to invert the wafer ring structure W using the inversion mechanism 204d and supply the wafer ring structure W to the cooling air supply device 206. Accordingly, the wafer W1 is supplied by effectively utilizing the cooling air supply device 206, and therefore, it is not necessary to provide a receiving portion for the wafer W1 independently of the cooling air supply device 206. Consequently, the complexity of the structure can be reduced or eliminated compared to a case where a receiving portion for the wafer W1 is provided independently of the cooling air supply device 206.

[0114] According to the first embodiment, as described above, the wafer transporter includes the lifting hand unit 203 configured to remove the wafer ring structure W from the cassette unit 202, and the suction hand unit 204 configured to transport the removed wafer ring structure W. The flipping mechanism 204d is provided in the suction hand unit 204. Accordingly, the lifting hand unit 203 and the suction hand unit 204 are provided separately from each other, and thus the wafer ring structure W can be easily removed from the cassette unit 202, and the removed wafer ring structure W can be easily transported. In addition, the flipping mechanism 204d is provided in the suction hand unit 204, so that the wafer ring structure W can be easily flipped by the flipping mechanism 204d. Second embodiment

[0115] The configuration of a semiconductor wafer processing apparatus 300 according to a second embodiment will now be described with reference to FIG. Fig. 13 to 18. In the second embodiment, unlike the first embodiment, a squeegee unit 3213 is arranged outside an expansion ring 3281. In the second embodiment, a detailed description of the same or similar configurations as in the first embodiment is omitted. The semiconductor wafer processing apparatus 300 is an example of a "wafer processing apparatus" in the claims.

[0116] Semiconductor wafer processing apparatus As shown in the Fig. 13 and Fig. 14, the semiconductor wafer processing apparatus 300 is an apparatus that processes a wafer W1 provided on a wafer ring structure W.

[0117] The semiconductor wafer processing apparatus 300 includes a dicing device 1 and an expanding device 302. An up-down direction is defined as the Z direction, an upward direction is defined as the Z1 direction, and a downward direction is defined as the Z2 direction. In a horizontal direction perpendicular to the Z direction, a direction in which the dicing device 1 and the expanding device 302 are aligned is defined as the X direction, a direction from the dicing device 1 toward the expanding device 302 in the X direction is defined as the X1 direction, and a direction from the expanding device 302 toward the dicing device 1 in the X direction is defined as the X2 direction. A direction perpendicular to the X direction in the horizontal direction is defined as the Y direction, a direction in the Y direction is defined as the Y1 direction, and the other direction in the Y direction is defined as the Y2 direction. Separation device

[0118] The dicing device 1 emits a laser having a wavelength transparent to the wafer W1 along a dividing line (street) to form a modified layer.

[0119] The separation device 1 has a base 11, a clamping table unit 12, a laser 13 and an image generator 14. Expansion device

[0120] As in the Fig. 14 and Fig. As shown in Fig. 15, the expansion device 302 divides the wafer W1 to form a plurality of semiconductor chips Ch.

[0121] The expansion device 302 includes an expansion main body 302a, a base 201, a cassette unit 202, a lifting hand unit 203, and a suction hand unit 204. The expansion main body 302a expands a plate member W2 to which the wafer W1 (with the modified layer formed thereon) singulated by the singulation device 1 has been attached. The expansion main body 302a includes a base 205, a cooling air supply device 206, a cooling unit 207, an expander 3208, a base 209, an expansion holding member 210, a heat shrink device 211, an ultraviolet irradiation device 212, a squeegee unit 3213, and a clamp unit 214. The expansion main body 302a is an example of an “expander” in the claims. expander

[0122] The expander 3208 expands a plate element W2 of the wafer ring structure W to separate the wafer W1 along the dividing line.

[0123] The expander 3208 has an expansion ring 3281 and a Z-direction movement mechanism 3282.

[0124] The expansion ring 3281 expands the plate member W2 by supporting the plate member W2 from the Z2 direction side. The expansion ring 3281 has a ring shape in plan view. The Z-direction movement mechanism 3282 moves the expansion ring 3281 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 3282 includes a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The Z-direction movement mechanism 3282 is attached to the base 205. Squeegee unit

[0125] The squeegee unit 3213 divides the wafer W1 along the modified layer by pressing the wafer W1 from the side in the Z2 direction after the plate member W2 is stretched. Specifically, the squeegee unit 3213 includes a press 3213a, an X-direction moving mechanism 3213b, a Z-direction moving mechanism 3213c, and a rotation mechanism 3213d.

[0126] The press 3213a generates bending stress in the wafer W1 to divide the wafer W1 along the modified layer by being moved by the rotation mechanism 3213d and the X-direction movement mechanism 3213b, while pressing the wafer W1 from the Z2 direction side over the plate member W2 after it has been moved in the Z direction by the movement mechanism 3213c. The press 3213a is a squeegee. The press 3213a is attached to one end of the rotation mechanism 3213d on the Z1 direction side. The Z-direction movement mechanism 3213c moves the rotation mechanism 3213d in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 3213c includes, for example, a cylinder. The Z-direction moving mechanism 3213c is attached to one end of the X-direction moving mechanism 3213b on the Z1-direction side.The X-direction movement mechanism 3213b includes a linear motion module or a ball screw and a drive, such as a motor with an encoder. The X-direction movement mechanism 3213b is mounted on one end of the base 205 on the Z1 direction side.

[0127] In the squeegee unit 3213, the press 3213a divides the wafer W1 by moving in the Y direction by the X-direction moving mechanism 3213b, while pressing the wafer W1 from the Z2 direction side over the plate member W2 after being moved in the Z1 direction by the Z-direction moving mechanism 3213c. Furthermore, in the squeegee unit 3213, after the press 3213a completes its movement in the Y direction, the press 3213a is rotated 90 degrees by the rotation mechanism 3213d. In addition, the press 3213a in the squeegee unit 3213 divides the wafer W1 by being moved in the X direction by the X direction moving mechanism 3213b while pressing the wafer W1 from the Z2 direction side over the plate member W2 after being rotated by 90 degrees.

[0128] Also omitted from detailed description, the suction hand unit 204 has a reversing mechanism 204d for reversing the position of the wafer ring structure W, and the reversing of the wafer ring structure W by the reversing mechanism 204d is similar to that in the first embodiment described above. Control configuration of a semiconductor wafer processing apparatus

[0129] As in Fig. 16, the semiconductor wafer processing apparatus 300 includes a first controller 101, a second controller 102, a third controller 103, a fourth controller 3104, a fifth controller 3105, a sixth controller 3106, a seventh controller 3107, an eighth controller 3108, a ninth controller 3109, a stretch control computer 3110, a handling control computer 3111, a dicing control computer 3112, and a memory 3113.The first controller 101, the second controller 102, the third controller 103, the fifth controller 3105, the sixth controller 3106, the seventh controller 3107, the eighth controller 3108, the ninth controller 3109, the stretch control computer 3110, the handling control computer 3111, the singulation control computer 3112, and the memory 3113 have the same configurations as the first controller 101, the second controller 102, the third controller 103, the fourth controller 104, the fifth controller 105, the sixth controller 106, the seventh controller 107, the eighth controller 108, the stretch control computer 109, the handling control computer 110, the singulation control computer 111, and the memory 112 according to the first embodiment, and therefore its description is omitted.

[0130] The fourth controller 3104 controls the expander 3208. The fourth controller 3104 has a CPU and a memory, which includes, for example, a ROM and a RAM. The fourth controller 3104 can include, for example, a hard disk as memory, which retains stored information even after the power is turned off. Semiconductor chip manufacturing process

[0131] The overall operation of the semiconductor wafer processing apparatus 300 will be described below with reference to Fig. 17 and Fig. 18 described.

[0132] The process operations in step S1 to step S6, step S8 and step S11 are the same as the process operations in step S1 to step S6, step S8 and step S11 in the semiconductor chip manufacturing process according to the first embodiment, so the description thereof is omitted.

[0133] In step S307, the plate member W2 is expanded by the expander 3208. That is, the expansion ring 3281 is moved in the Z1 direction by the Z-direction moving mechanism 3282. The wafer ring structure W is moved in the Z2 direction by a Z-direction moving mechanism 214b while being held by the clamp unit 214. Then, the plate member W2 is expanded by contact with the expansion ring 3281 and pulled by the expansion ring 3281. In this way, the wafer W1 is divided along the dividing line (modified layer).

[0134] As in Fig. As shown in Figure 18, in step S309, while the heat shrinking device 211 heats and shrinks the plate member W2 and the ultraviolet irradiation device 212 irradiates the plate member W2 with ultraviolet rays, the clamp unit 214 is lifted. At this time, an inlet 210c sucks in air near the heated plate member W2. In step S310, the wafer ring structure W is moved from the clamp unit 214 to the squeegee unit 3213. That is, the wafer ring structure W is moved in the Y2 direction by a Y-direction moving mechanism 214c while being held by the clamp unit 214.

[0135] In step S311, after the wafer ring structure W is moved to the squeegee unit 3213, the wafer W1 is pressed by the squeegee unit 3213. Thus, the wafer W1 is further divided by the squeegee unit 3213. The remaining configurations of the second embodiment are similar to those of the first embodiment.

[0136] Advantageous Effects of the Second Embodiment According to the second embodiment, the following advantageous effects are achieved.

[0137] According to the second embodiment, as described above, the suction hand unit 204 includes the reversing mechanism 204d for reversing the position of the wafer ring structure W. Accordingly, similar to the first embodiment, the wafer ring structure W can be reversed by the reversing mechanism 204d while reducing or eliminating the complexity of the structure. The other advantageous effects of the second embodiment are similar to those of the first embodiment. Third embodiment

[0138] The configuration of a semiconductor wafer processing apparatus 400 according to a third embodiment will now be described with reference to FIG. Fig. 19 to 25. In the third embodiment, a wafer structure Wa that does not include an annular element is singulated, unlike the first embodiment and the second embodiment. In the third embodiment, a detailed description of the same or equivalent configurations as in the first or second embodiment is omitted. The semiconductor wafer processing apparatus 400 is an example of a "wafer processing apparatus" in the claims. Semiconductor wafer processing device

[0139] As in Fig. 19, the semiconductor wafer processing apparatus 400 is an apparatus that processes a wafer W1 provided on the wafer structure Wa.

[0140] The wafer structure Wa is described with reference to the Fig. 20 and Fig. 21. The wafer structure Wa includes the wafer W1 and a plate member W2a, and does not include an annular member. The plate member W2a is an adhesive tape for relief grinding, which is made of a harder material that is not elastic, compared to the plate member W2 for expansion in the first and second embodiments. An adhesive layer is provided on the upper surface of the plate member W2a. The wafer W1 is attached to the adhesive layer of the plate member W2a. In the third embodiment, the wafer W1 is arranged on the plate member W2a such that an Sc circuit layer W11 is arranged on the plate member W2a side.

[0141] As in Fig. As shown in Figure 19, the semiconductor wafer processing apparatus 400 includes a dicing apparatus 1 and a wafer supply apparatus 403. An up-down direction is defined as the Z direction, an upward direction is defined as the Z1 direction, and a downward direction is defined as the Z2 direction. In a horizontal direction perpendicular to the Z direction, a direction in which the dicing apparatus 1 and the wafer supply apparatus 403 are aligned is defined as the X direction, a direction from the dicing apparatus 1 to the wafer supply apparatus 403 in the X direction is defined as the X1 direction, and a direction from the wafer supply apparatus 403 to the dicing apparatus 1 in the X direction is defined as the X2 direction.A direction perpendicular to the X direction in the horizontal direction is defined as the Y direction, a direction in the Y direction is defined as the Y1 direction, and the other direction in the Y direction is defined as the Y2 direction. Separation device

[0142] The dicing device 1 emits a laser having a wavelength transparent to the wafer W1 along a dividing line (street) to form a modified layer.

[0143] The separation device 1 has a base 11, a clamping table unit 12, a laser 13 and an image generator 14. Wafer feeder

[0144] As in Fig. 19 and Fig. 21, the wafer feeding device 403 feeds the wafer W1 (wafer structure Wa).

[0145] The wafer supply device 403 includes a base 201, a cassette unit 202, a lifting hand unit 503, suction hand units 504 and 505, a temporary placement unit 506, and an imager 507. The lifting hand unit 503 and the suction hand units 504 and 505 are examples of a "wafer transporter" in the claims. The lifting hand unit 503 is an example of a "removal unit" in the claims. The suction hand unit 504 is an example of a "suction unit" or "transport mechanism" in the claims. base

[0146] The base 201 is a base on which the cassette unit 202 and the lifting hand unit 503 are installed. Cassette unit

[0147] The cassette unit 202 can accommodate a plurality of wafer structures Wa. In the third embodiment, the wafer structure Wa is stored in the cassette unit 202 with the plate member W2 on the top side, the wafer W1 on the bottom side, and the Sc circuit layer W11 on the top side. Furthermore, the wafer structure Wa is stored in the cassette unit 202 with the wafer structure flexed downward. The cassette unit 202 includes wafer cassettes 202a, a Z-direction moving mechanism 202b, and pairs of placement sections 202c. Lifting hand unit

[0148] The lifting hand unit 503 can remove the wafer structure Wa from the cassette unit 202. Furthermore, the lifting hand unit 503 can pick up the wafer structure Wa into the cassette unit 202.

[0149] Specifically, the lifting hand unit 503 includes a Y-direction movement mechanism 503a and a lifting hand 503b. The Y-direction movement mechanism 503a includes a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The lifting hand 503b generates negative pressure to suck and support the wafer W1 of the wafer structure Wa from the Z2 direction side. The lifting hand 503b includes a suction hole or the like for sucking the wafer structure Wa through the negative pressure. The lifting hand 503b is I-shaped and extends in the Y direction in plan view. Suction hand unit

[0150] The suction hand unit 505 sucks the plate element W2a of the wafer structure Wa from the Z1 direction side.

[0151] Specifically, the suction hand unit 505 includes a Z-direction movement mechanism 505a and a suction hand 505b. The Z-direction movement mechanism 505a moves the suction hand 505b in the Z direction. The Z-direction movement mechanism 505a includes a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The suction hand 505b generates negative pressure to suck and support the plate member W2a of the wafer structure Wa from the Z1 direction side. The suction hand 505b includes a suction hole or the like for sucking the wafer structure Wa through the negative pressure. The suction hand 505b has a circular shape in plan view.

[0152] The suction hand unit 504 sucks the wafer structure Wa.

[0153] The suction hand unit 504 includes an X-direction movement mechanism 504a, a Z-direction movement mechanism 504b, a suction hand 504c, and a reversing mechanism 504d. The X-direction movement mechanism 504a moves the suction hand 504c in the X-direction. The Z-direction movement mechanism 504b moves the suction hand 504c in the Z-direction. The X-direction movement mechanism 504a and the Z-direction movement mechanism 504b each include a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The suction hand 504c generates a negative pressure to suck and support the wafer structure Wa. The suction hand 504c includes a suction hole or the like for sucking the wafer structure Wa through the negative pressure. The suction hand 504c has a circular shape with a diameter equal to or greater than the diameter of the wafer structure Wa in plan view, and can suck substantially the entire wafer structure Wa.

[0154] The wafer transporter has the lifting hand unit 503 and the suction hand units 504 and 505 and transports the wafer structure Wa between the cassette unit 202 and the singulation device 1. In the third embodiment, the wafer transporter has the lifting hand unit 503 for removing the wafer structure Wa from the cassette unit 202 and the suction hand units 504 and 505 for transporting the removed wafer structure Wa.

[0155] In the third embodiment, the suction hand unit 504 includes the reversing mechanism 504d for reversing the position of the wafer structure Wa. In the third embodiment, the reversing mechanism 504d is provided in the suction hand unit 504. In the third embodiment, the reversing mechanism 504d reverses the position of the wafer structure Wa by rotating the suction hand 504c of the suction hand unit 504, which sucks the wafer structure Wa, around a rotation axis Ax extending in the horizontal direction (Y direction). The reversing mechanism 504d includes a motor and a rotation shaft rotated by the motor. The rotation shaft of the reversing mechanism 504d is connected to the suction hand 504c to rotate the suction hand 504c around the rotation axis Ax.

[0156] In the third embodiment, the wafer structure Wa is flipped over by the suction hand unit 504 using the flipping mechanism 504d and fed to the dicing device 1. Specifically, the suction hand unit 504 delivers the wafer structure Wa, in which the plate member W2 is arranged on the bottom side and the wafer W1 is arranged on the top side, to the dicing device 1 by flipping the wafer structure Wa, in which the plate member W2 is arranged on the top side and the wafer W1 is arranged on the bottom side, using the flipping mechanism 504d. In the third embodiment, the suction hand unit 504 flips the wafer structure Wa using the flipping mechanism 504d and places the wafer structure Wa on the temporary placement unit 506 before feeding the wafer structure Wa to the dicing device 1. Unit for temporary placement

[0157] The temporary placement unit 506 is a table on which the wafer structure Wa is temporarily placed before the wafer structure Wa is fed to the dicing device 1. The temporary placement unit 506 is arranged between the cassette unit 202 and the dicing device 1. The wafer structure Wa to be sawn next (in which a modified layer is to be formed) is placed on the temporary placement unit 506. The temporary placement unit 506 has a suction surface 506a on its upper surface. The suction surface 506a generates a negative pressure for sucking and supporting the wafer structure Wa. The suction surface 506a includes a suction hole or the like for sucking the wafer structure Wa through the negative pressure. The suction surface 506a has a circular shape with a diameter equal to or greater than the diameter of the wafer structure Wa in plan view and can suck substantially the entire wafer structure Wa. Image provider

[0158] The imager 507 is a camera that images the wafer W1 of the wafer structure Wa placed on the temporary placement unit 506. Based on the imaging result of the wafer W1 of the wafer structure Wa by the imager 507, deviations of the wafer W1 in the X and Y directions and a rotational deviation of the wafer W1 within an XY plane can be detected. Furthermore, after the wafer structure Wa is transferred to the chuck unit 12, the position of the wafer W1 of the wafer structure Wa on the chuck unit 12 can be corrected based on the deviations of the wafer W1 in the X and Y directions and the rotational deviation of the wafer W1 within the XY plane. Flipping the wafer structure

[0159] The flipping of the wafer structure Wa is determined by the Fig. 23 and Fig. 24 described.

[0160] First, the lifting hand 503b of the lifting hand unit 503 is moved in the Y1 direction by the Y-moving mechanism 503a and moved into the cassette unit 202. Then, the lifting hand 503b sucks and supports the wafer structure Wa from the Z2 direction side in the cassette unit 202. While the lifting hand 503b sucks and supports the wafer structure Wa from the Z2 direction side, the lifting hand 503b is moved in the Y2 direction by the Y-direction moving mechanism 503a and moved to the outside of the cassette unit 202. Then, the wafer structure Wa in which the plate member W2a is arranged on the upper side and the wafer W1 is arranged on the lower side (hereinafter referred to as the wafer structure Wa in the first state) is taken out of the cassette unit 202 by the lifting hand unit 503. Then, as in Fig. As shown in Figure 23, the suction hand 505b of the suction hand unit 505 is moved in the Z2 direction by the Z-direction moving mechanism 505a. Then, the wafer structure Wa in the first state is sucked and held by the suction hand unit 505, and the suction by the lifting hand unit 503 is released, so that the wafer structure Wa in the first state is delivered from the lifting hand unit 503 to the suction hand unit 505. Then, the suction hand 505b of the suction hand unit 505 is moved in the Z1 direction by the Z-direction moving mechanism 505a.

[0161] Then, the suction hand 504c of the suction hand unit 504 is moved in the X1 direction by the X-direction moving mechanism 504a and moved to a position below the suction hand 505b of the suction hand unit 505. At this time, the suction surface of the suction hand 504c of the suction hand unit 504 faces the Z1 direction side (the suction hand 505b side). Then, the suction hand 505b of the suction hand unit 505 is moved in the Z2 direction by the Z-direction moving mechanism 505a. Then, the wafer structure Wa in the first state is sucked and supported by the suction hand unit 504, and the suction by the suction hand unit 505 is released, so that the wafer structure Wa in the first state is delivered from the suction hand unit 505 to the suction hand unit 504.

[0162] As in Fig. As shown in Figure 24, the wafer structure Wa in the first state is turned over by the turning over mechanism 504d during transportation to the singulating device 1. The wafer structure Wa in which the plate member W2a is arranged on the bottom side and the wafers W1 are arranged on the top side (hereinafter referred to as the wafer structure Wa in the second state) is supplied to the singulating device 1 by the suction hand unit 504. Specifically, before being supplied to the singulating device 1, the wafer structure Wa in the second state is placed on the suction surface 506a of the temporary placement unit 506 by the suction hand unit 504.

[0163] At this time, the suction hand 504c of the suction hand unit 504 is moved in the X2 direction by the X-moving mechanism 504a and moved to a position above the suction surface 506a of the temporary placement unit 506. Then, the suction hand 504c of the suction hand unit 504 is moved in the Z2 direction by the Z-direction moving mechanism 504b. Then, the wafer structure Wa in the second state is sucked and supported by the temporary placement unit 506, and the suction by the suction hand unit 504 is released, so that the wafer structure Wa in the second state is delivered from the suction hand unit 504 to the temporary placement unit 506. In the dicing device 1, the dicing (formation of a modified layer) is performed on the wafer structure Wa supplied to the dicing device 1 before the wafer structure Wa is placed on the temporary placement unit 506.

[0164] As in Fig. As shown in Figure 25, the wafer W1 of the wafer structure Wa in the second state is imaged by the imager 507 while the wafer W1 is placed on the temporary placement unit 506. Based on the imaging result of the wafer W1 by the imager 507, the deviations of the wafer W1 in the X and Y directions and the rotational deviation of the wafer W1 within the XY plane are detected.

[0165] Then, when the dicing (formation of a modified layer) for the previous wafer structure Wa is completed, the wafer structure Wa for which the dicing is completed is transported from the dicing device 1 to the cassette unit 202. The method for transporting the wafer structure Wa from the dicing device 1 to the cassette unit 202 is generally opposite to the method for transporting the wafer structure Wa from the cassette unit 202 to the dicing device 1.

[0166] That is, the wafer structure Wa in the second state is delivered from the chuck table unit 12 of the singulation device 1 to the suction hand unit 504. At this time, the suction surface of the suction hand 504c of the suction hand unit 504 faces the Z2 direction side (the chuck table unit 12 side). Then, the suction hand unit 504 is moved in the X1 direction by the X-movement mechanism 504a and moved to a position below the suction hand unit 505. During this movement, the wafer structure Wa in the second state is turned over by the turning mechanism 504d. Subsequently, the wafer structure Wa in the first state, in which the plate member W2a is arranged on the upper side and the wafer W1 is arranged on the lower side, is delivered from the suction hand unit 504 via the suction hand unit 505 to the lifting hand unit 503. Then, the lifting hand 503b of the lifting hand unit 503 is moved in the Y1 direction by the Y-moving mechanism 503a and retracted into the cassette unit 202.Then, the wafer structure Wa in the first state is delivered from the lifting hand unit 503 to the cassette unit 202 and stored in the cassette unit 202.

[0167] After the wafer structure Wa is delivered from the suction hand unit 504 to the suction hand unit 505 in the first state, the suction hand 504c of the suction hand unit 504, which is in an empty state in which the suction hand 504c does not suck the wafer structure Wa, is moved in the X2 direction by the X-direction moving mechanism 504a and moved to a position above the wafer structure Wa placed on the temporary placement unit 506. At this time, the suction surface of the suction hand 504c of the suction hand unit 504 faces the Z2 direction side (the temporary placement unit 506 side). Then, the suction hand 504c of the suction hand unit 504 is moved in the Z2 direction by the Z-direction moving mechanism 504b.Then, the wafer structure Wa in the second state is sucked and supported by the suction hand unit 504, and the suction by the temporary placement unit 506 is released, so that the wafer structure Wa in the second state is delivered from the temporary placement unit 506 to the suction hand unit 504.

[0168] Then, the suction hand 504c of the suction hand unit 504 is moved in the Z1 direction by the Z-direction movement mechanism 504b and in the X2 direction by the X-direction movement mechanism 504a to a position above the chuck unit 12. Then, the suction hand 504c of the suction hand unit 504 is moved in the Z2 direction by the Z-direction movement mechanism 504b. Then, the wafer structure Wa in the second state is supported by the chuck unit 12, and the suction by the suction hand unit 504 is released, so that the wafer structure Wa in the second state is delivered from the suction hand unit 504 to the chuck unit 12.

[0169] Then, the modified layer is formed by the laser 13 emitting a laser beam onto the wafer structure Wa in the second state. At this time, the laser beam from the laser 13 is emitted onto the wafer W1 from the side opposite the Sc circuit layer W11. Therefore, similar to the first embodiment, the width of the laser beam can be prevented from mismatching the width of the street. Thus, the wafer W1 is fed to the dicing device 1 in a position suitable for dicing. The other configurations of the third embodiment are similar to those of the first embodiment. Advantageous effects of the third embodiment

[0170] According to the third embodiment, the following advantageous effects are achieved.

[0171] According to the third embodiment, as described above, the suction hand unit 504 includes the flipping mechanism 504d configured to flip the position of the wafer structure Wa. Accordingly, similar to the first embodiment, the wafer structure Wa can be flipped by the flipping mechanism 504d while reducing or preventing the complexity of the structure.

[0172] According to the third embodiment, as described above, the cassette unit 202 is configured to store the wafer structure Wa that does not include an annular member surrounding the wafer W1, and the wafer W1 transporter is configured to turn over the wafer structure Wa using the turning over mechanism 504d and supply the wafer structure Wa to the dicing device 1. In the case of the wafer structure Wa that does not include an annular member, the wafer W1 may not be supplied in a position suitable for dicing.Therefore, even in the case of the wafer structure Wa not including an annular member in which the wafer W1 is not supplied in a position suitable for dicing, the wafer W1 having the above-described configuration can be brought into a position suitable for dicing by inverting the wafer structure Wa using the inverting mechanism 504d, and thus the dicing can be properly performed.

[0173] According to the third embodiment, as described above, the semiconductor wafer processing apparatus 400 includes the temporary placement unit 506 provided between the cassette unit 202 and the dicing apparatus 1 and configured to place the wafer structure Wa thereon. The suction hand unit 504 is configured to flip the wafer structure Wa using the flipping mechanism 504d and place the wafer structure Wa on the temporary placement unit 506 before the wafer structure Wa is fed to the dicing apparatus 1. Accordingly, the next wafer W1 can be prepared in a flipped state on the temporary placement unit 506, and thus the next wafer W1 can be quickly fed to the dicing apparatus 1. The other advantageous effects of the third embodiment are similar to those of the first embodiment. Fourth embodiment

[0174] The configuration of a semiconductor wafer processing apparatus 600 according to a fourth embodiment will now be described with reference to FIG. Fig. 26 and Fig. 27. In the fourth embodiment, a lifting hand unit 703 includes a reversing mechanism 703d, unlike the first to third embodiments. In the fourth embodiment, a detailed description of the same or similar configurations as those in the first, second, or third embodiments is omitted. The semiconductor wafer processing apparatus 600 is an example of a "wafer processing apparatus" in the claims. The lifting hand unit 703 is an example of a "wafer transporter" or a "removal transporter" in the claims.

[0175] Semiconductor wafer processing apparatus As in Fig. 26 and Fig. 27, the semiconductor wafer processing apparatus 600 is an apparatus that processes a wafer W1 provided on a wafer ring structure W.

[0176] The semiconductor wafer processing apparatus 600 includes a dicing apparatus 601 and a wafer supply apparatus 603. An up-down direction is defined as the Z direction, an upward direction is defined as the Z1 direction, and a downward direction is defined as the Z2 direction. In a horizontal direction perpendicular to the Z direction, a direction in which the dicing apparatus 601 and the wafer supply apparatus 603 are aligned is defined as the X direction, a direction from the dicing apparatus 601 to the wafer supply apparatus 603 in the X direction is defined as the X2 direction, and a direction from the wafer supply apparatus 603 to the dicing apparatus 601 in the X direction is defined as the X1 direction. A direction perpendicular to the X direction in the horizontal direction is defined as the Y direction, a direction in the Y direction is defined as the Y1 direction, and the other direction in the Y direction is defined as the Y2 direction.The separating device 601 is an example of a “dicer” in the claims. Separation device

[0177] The dicing device 601 emits a laser having a wavelength transparent to the wafer W1 along a dividing line (street) to form a modified layer.

[0178] Specifically, the separating device 601 comprises a base 11, a clamping table unit 12, a laser 13, an imager 14 and the lifting hand unit 703. Wafer feeder

[0179] The wafer supply device 603 supplies the wafer W1 (wafer ring structure W).

[0180] The wafer supply device 603 includes a cassette unit 202. The cassette unit 202 can accommodate a plurality of wafer ring structures W. In the fourth embodiment, the wafer ring structure W is stored in the cassette unit 202 such that a plate member W2 is arranged on the bottom side, the wafer W1 is arranged on the top side, and an SC circuit layer W11 is arranged on the top side. Lifting hand unit

[0181] The lifting hand unit 703 can remove the wafer ring structure W from the cassette unit 202 and transport the removed wafer ring structure W. Furthermore, the lifting hand unit 703 can pick up the wafer ring structure W into the cassette unit 202. The lifting hand unit 703 transports the wafer ring structure W between the cassette unit 202 and the singulation device 601.

[0182] Specifically, the lifting hand unit 703 includes an X-direction movement mechanism 703a, a Z-direction movement mechanism 703b, and a lifting hand 703c. The X-direction movement mechanism 703a moves the lifting hand 703c in the X direction. The Z-direction movement mechanism 703b moves the hand 703c in the Z direction. The X-direction movement mechanism 703a and the Z-direction movement mechanism 703b each include a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The lifting hand 703c generates a negative pressure to suck and support an annular element W3 of the wafer ring structure W from the Z2 direction side. The lifting hand 703c includes a suction hole or the like to suck the wafer ring structure W by the negative pressure.

[0183] In the fourth embodiment, the lifting hand unit 703 includes the reversing mechanism 703d for reversing the position of the wafer ring structure W. In the fourth embodiment, the reversing mechanism 703d is provided in the lifting hand unit 703. In the fourth embodiment, the reversing mechanism 703d reverses the position of the wafer ring structure W by rotating the lifting hand 703c of the lifting hand unit 703, which sucks the wafer ring structure W, around a rotation axis Ax extending in the horizontal direction (Y direction). The reversing mechanism 703d includes a motor and a rotation shaft rotated by the motor. The rotation shaft of the reversing mechanism 703d is connected to the lifting hand 703c to enable the lifting hand 703c to rotate around the rotation axis Ax. The lifting hand 703c is rotated about the rotation axis Ax by the reversing mechanism 703d so that it is moved from one side to the other side with respect to the rotation axis Ax.

[0184] In the fourth embodiment, the lifting hand unit 703 turns over the wafer ring structure W using the turning over mechanism 703d and feeds it to the dicing device 601. Specifically, the lifting hand unit 703 feeds the wafer ring structure W, in which the plate member W2 is arranged on the upper side and the wafer W1 is arranged on the lower side, to the dicing device 601 by turning over the wafer ring structure W, in which the plate member W2 is arranged on the lower side and the wafer W1 is arranged on the upper side, using the turning over mechanism 703d. Flipping the wafer structure

[0185] The turning over of the wafer ring structure W is described with reference to Fig. 28 described.

[0186] As in Fig. As shown in Fig. 28, first, the lifting hand 703c of the lifting hand unit 703 is moved in the X2 direction by the moving mechanism 703a and moved into the cassette unit 202. Then, the lifting hand 703c sucks and supports the wafer ring structure W from the Z2 direction side in the cassette unit 202. Then, while the lifting hand 703c sucks and supports the wafer ring structure W from the Z2 direction side, the lifting hand 703c is moved in the X1 direction by the X-direction moving mechanism 703a and moved to the outside of the cassette unit 202. Then, the wafer ring structure W in which the plate member W2 is arranged on the lower side and the wafers W1 are arranged on the upper side (hereinafter referred to as the wafer ring structure W in the first state) is taken out from the cassette unit 202 by the lifting hand unit 703.

[0187] Then, the wafer ring structure W in the first state is turned over by the turning mechanism 703d during transportation to the chuck table unit 12. Then, the wafer ring structure W in which the plate member W2 is arranged on the upper side and the wafers W1 are arranged on the lower side (hereinafter referred to as the wafer ring structure W in the second state) is delivered to the chuck table unit 12 by the lifting hand unit 703. Specifically, the lifting hand 703c of the lifting hand unit 703 and the chuck table unit 12 are moved in the X direction, and the lifting hand 703c is moved to a position above the chuck table unit 12. Then, the lifting mechanism 703c is moved in the Z2 direction by the Z-direction moving mechanism 703b. Then, the wafer ring structure W in the second state is delivered from the lifting hand unit 703 to the chuck table unit 12.

[0188] Then, the modified layer is formed by emitting a laser beam onto the wafer ring structure W in the second state by the laser 13. At this time, the laser beam is emitted onto the wafer W1 through the plate member W2 from the side opposite the Sc circuit layer W11 by the laser 13. Therefore, similar to the first embodiment, the width of the laser beam can be prevented from mismatching the street width. Thus, the wafer W1 is fed to the dicing device 601 in a position suitable for dicing.

[0189] Then, when the dicing (formation of the modified layer) for the wafer structure Wa is completed, the wafer ring structure W for which the dicing is completed is transported from the chuck unit 12 to the cassette unit 202. The method for transporting the wafer ring structure W from the chuck unit 12 to the cassette unit 202 is generally opposite to the method for transporting the wafer ring structure W from the cassette unit 202 to the chuck unit 12.

[0190] That is, the wafer structure Wa in the second state is transferred from the chuck table unit 12 to the lifting hand unit 703. Then, the lifting hand 703c of the lifting hand unit 703 is moved in the X2 direction by the X-direction moving mechanism 703a. During this movement, the wafer ring structure W in the second state is turned over by the turning over mechanism 703d. The wafer ring structure W is placed in the first state in which the plate member W2a is arranged on the bottom side and the wafer W1 is arranged on the top side. Then, the lifting hand 703c of the lifting hand unit 703 is moved in the Y1 direction by the X-direction moving mechanism 703a and moved into the cassette unit 202. Then, the wafer structure Wa in the first state is delivered from the lifting hand unit 703 to the cassette unit 202 and stored in the cassette unit 202.

[0191] The semiconductor wafer processing apparatus 600 can also process the wafer ring structure W without inverting it. When the wafer ring structure W is not inverted, the lifting hand 703c sucks and supports the wafer ring structure W from the Z1 direction side in the cassette unit 202. Then, the wafer ring structure W is fed to the chuck table unit 12 by the lifting hand unit 703 without being inverted. The other configurations of the fourth embodiment are similar to those of the first embodiment.

[0192] Advantageous Effects of the Fourth Embodiment According to the fourth embodiment, the following advantageous effects are achieved.

[0193] According to the fourth embodiment, as described above, the lifting hand unit 703 includes the flipping mechanism 703d configured to flip the position of the wafer ring structure W. Accordingly, similar to the first embodiment, the wafer ring structure W can be flipped by the flipping mechanism 703d while reducing or preventing the complexity of the structure.

[0194] According to the fourth embodiment, as described above, the cassette unit 202 is configured to store the wafer ring structure W including the annular member W3 surrounding the wafer W1, and the lifting hand unit 703 is configured to turn over the wafer ring structure W using the turning over mechanism 703d and supply the wafer ring structure W to the dicing device 601. In the case of the wafer ring structure W including the annular member W3, the wafer W1 may not be supplied in a position suitable for dicing.Therefore, even in the case of the wafer ring structure W having the annular member W3 in which the wafer W1 is not supplied in a position suitable for dicing, the wafer W1 having the above-described configuration can be brought into a position suitable for dicing by inverting the wafer ring structure W using the inverting mechanism 703d, and thus the dicing can be properly performed.

[0195] According to the fourth embodiment, as described above, the wafer transporter includes the lifting hand unit 703 configured to remove the wafer ring structure W from the cassette unit 202 and transport the removed wafer ring structure W, and the inversion mechanism 703d is provided in the lifting hand unit 703. Accordingly, the wafer ring structure W can be easily removed from the cassette unit 202 using the lifting hand unit 703, and the removed wafer ring structure W can be easily transported. The other advantageous effects of the fourth embodiment are similar to those of the first embodiment. Modification example of the fourth embodiment

[0196] A modification example of the fourth embodiment will now be described with reference to the Fig. 29 and Fig. 30. In the modified example, an example is described in which a lifting hand 703c is rotated about a rotation axis Ax extending in the X direction by a reversing mechanism 703d, in contrast to the fourth embodiment in which the lifting hand 703c is rotated about the rotation axis Ax extending in the Y direction by the reversing mechanism 703d.

[0197] As in the Fig. 29 and Fig. As shown in Fig. 30, in the modified example of the fourth embodiment, the reversing mechanism 703d rotates the lifting hand 703c of a lifting hand unit 703 that sucks a wafer ring structure W around the rotation axis Ax extending in a horizontal direction (X direction) to reverse the posture of the wafer ring structure W. The reversing mechanism 703d includes a motor and a rotation shaft rotated by the motor. The rotation shaft of the reversing mechanism 703d is connected to the lifting hand 703c to rotate the lifting hand 703c around the rotation axis Ax. The holding hand 703c is rotated in place around the rotation axis Ax by the reversing mechanism 703d.

[0198] The inversion of the wafer ring structure W in the modified example of the fourth embodiment is similar to that of the fourth embodiment, so a detailed description is omitted. However, the wafer ring structure W in the first state is taken out from a cassette unit 202 by the lifting hand unit 703. During transportation to the receiving table unit 12, the wafer ring structure W in the first state is inverted by the inversion mechanism 703d. Then, the wafer ring structure W in the second state is fed from the lifting hand unit 703 to the chuck table unit 12. The operations below are similar to those of the fourth embodiment. The other configurations of the modified example of the fourth embodiment are similar to those of the fourth embodiment. Fifth embodiment

[0199] The configuration of a semiconductor wafer processing apparatus 800 according to a fifth embodiment will now be described with reference to FIG. Fig. 31 to 34. In the fifth embodiment, a conveyor 803a includes a reversing mechanism 803c, unlike the first to fourth embodiments. In the fifth embodiment, a detailed description of the same or similar configurations as those in the first, second, third, or fourth embodiments is omitted. The semiconductor wafer processing apparatus 800 is an example of a "wafer processing apparatus" in the claims.

[0200] Semiconductor wafer processing apparatus As in Fig. 31, the semiconductor wafer processing apparatus 800 is an apparatus that processes a wafer W1 provided on a wafer ring structure W.

[0201] The semiconductor wafer processing apparatus 800 includes a dicer 801, a cassette unit 202, and a wafer transporter 803. An up-down direction is defined as the Z direction, an upward direction as the Z1 direction, and a downward direction as the Z2 direction. A horizontal direction perpendicular to the Z direction is defined as the X direction, a direction in the X direction is defined as the X1 direction, and the other direction in the X direction is defined as the X2 direction. A horizontal direction perpendicular to the X direction is defined as the Y direction, a direction in the Y direction is defined as the Y1 direction, and the other direction in the Y direction is defined as the Y2 direction. Dicer

[0202] Dicer 801 emits a laser with a wavelength that is transparent to wafer W1 along a dividing line (street) to form a modified layer. Specifically, Dicer 801 comprises a chuck unit 12, a laser 13, and an imager 14. Cassette unit

[0203] The cassette unit 202 can accommodate a plurality of wafer ring structures W, each comprising an annular member W3 surrounding the wafer W1. In the fifth embodiment, the wafer ring structure W is stored in the cassette unit 202 such that a plate member W2 is arranged on the bottom side, the wafer W1 is arranged on the top side, and an SC circuit layer W11 is arranged on the top side. The cassette unit 202 includes wafer cassettes 202a, a Z-direction moving mechanism 202b, and pairs of placement sections 202c. Wafer transporter

[0204] The wafer transporter 803 transports the wafer ring structure W between the cassette unit 202 and the dicer 801. Specifically, the wafer transporter 803 has the conveyor 803a for removing the wafer ring structure W from the cassette unit 202 and transporting the removed wafer ring structure W, as well as a suction hand unit 803b for transferring the wafer ring structure W transported by the conveyor 803a to the chuck table unit 12 of the dicer 801.

[0205] The conveyor 803a has rails 831 and 832 for supporting the wafer ring structure W taken out from the cassette unit 202 from below, a clamp hand 833 for taking out the wafer ring structure W from the cassette unit 202 and transporting the wafer ring structure W on the rails 831 and 832, and a Y-direction moving mechanism 834 for moving the clamp hand 833 in the Y direction.

[0206] The rails 831 and 832 are aligned in this order from the Y2 direction side to the Y1 direction side. The rails 831 are arranged near the cassette unit 202. The rails 832 are arranged near the rails 831. The rails 831 and 832 extend in the Y direction. A pair of rails 831 and a pair of rails 832 are arranged at a predetermined distance in the X direction. The pair of rails 832 has a rail drive mechanism 832a for changing the distance in the X direction between the pair of rails 832. The rail drive mechanism 832a moves the pair of rails 832 away from each other in the X direction to increase the distance in the X direction between the pair of rails 832. The rail drive mechanism 832a moves the pair of rails 832 closer to each other in the X direction to reduce the distance in the X direction between the pair of rails 832.The rail drive mechanism 832a includes, for example, a cylinder (for example, an air cylinder) provided on each of the two pairs of rails 832.

[0207] The clamping hand 833 clamps and transports the wafer ring structure W. The clamping hand 833 transports the wafer ring structure W between three positions: a storage position of the wafer ring structure W in the cassette unit 202, a flip position in which the attitude of the wafer ring structure W is flipped by a flip mechanism 803c described below, and a delivery position in which the wafer ring structure W is delivered to the suction hand unit 803b. The clamping hand 833 has a hook shape. The clamping hand 833 includes a clamp 833a at its tip end for clamping the wafer ring structure W. The clamp 833a clamps one end of the annular member W3 of the wafer ring structure W on the Y1 direction side in the up-down direction.

[0208] The Y-direction movement mechanism 834 moves the clamping hand 833 in the Y1 direction or Y2 direction. The clamping hand 833 transports the wafer ring structure W by being moved by the Y-direction movement mechanism 834. The Y-direction movement mechanism 834 includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder.

[0209] The suction hand unit 803b includes a suction hand 841 for sucking the wafer ring structure W and a Z-direction movement mechanism 842 for moving the suction hand 841 in the Z-direction. The suction hand 841 generates a negative pressure to suck and support the wafer ring structure W. The suction hand 841 includes a suction hole or the like for sucking the wafer ring structure W. The Z-direction movement mechanism 842 moves the suction hand 841 in the Z-direction. The Z-direction movement mechanism 842 includes a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder.

[0210] In the fifth embodiment, the wafer transporter 803 has the turning mechanism 803c. Specifically, the turning mechanism 803c is as shown in Fig. 31 and Fig. 32, is provided as part of the conveyor 803a. More specifically, the turning mechanism 803c is provided as part of the rails 831. Moreover, the turning mechanism 803c is provided as part of a first rail of the pair of rails 831.

[0211] The turning mechanism 803c includes a holder 851 for holding the wafer ring structure W, a clamp driving mechanism 852 for driving the holder 851 in the up-down direction (Z direction), and a rotation driving mechanism 853 for rotating the holder 851. The holder 851 is an example of a "clamp" in the claims.

[0212] The holder 851 is provided as a part of the first rail of the pair of rails 831. The inversion mechanism 803c inverts the attitude of the wafer ring structure W by rotating the holder 851 about a rotation axis Ax1 extending in the horizontal direction (X direction) while holding the wafer ring structure W with the holder 851. Specifically, the holder 851 clamps one end of the annular member W3 of the wafer ring structure W on the X1 direction side in the up-down direction (Z direction). The inversion mechanism 803c inverts the attitude of the wafer ring structure W by rotating the holder 851 about the rotation axis Ax1 while clamping the end of the annular member W3 of the wafer ring structure W on the X1 direction side with the holder 851.

[0213] The holder 851 includes a first clamping member 851a, which is a movable member, and a second clamping member 851b, which is a fixed member. The first clamping member 851a and the second clamping member 851b face each other in the up-down direction (Z direction). The clamp driving mechanism 852 is connected to the first clamping member 851a. The clamp driving mechanism 852 drives the first clamping member 851a in the up-down direction, so that the holder 851 clamps the wafer ring structure W between the first clamping member 851a and the second clamping member 851b. The clamp driving mechanism 852 includes cylinders 852a, such as air cylinders, as a drive source.

[0214] The rotary drive mechanism 853 includes a fastening member 853a and a motor 853b as a drive source for rotating the fastening member 853a. The clamp drive mechanism 852 and the second clamp member 851b are connected to the fastening member 853a. The first clamp member 851a is connected to the fastening member 853a via the clamp drive mechanism 852. The rotary drive mechanism 853 rotates the clamp drive mechanism 852, the first clamp member 851a, and the second clamp member 851b by rotating the fastening member 853a with the aid of the motor 853b. Thus, it is possible to rotate the first clamping element 851a and the second clamping element 851b while the wafer ring structure W is clamped between the first clamping element 851a and the second clamping element 851b, and thus it is possible to reverse the position of the wafer ring structure W.The motor 853b may be connected to the mounting member 853a via a pulley mechanism or the like.

[0215] In the fifth embodiment, as shown in the Fig. 32 and Fig. As shown in Fig. 33, a second rail of the pair of rails 831 is retracted when the posture of the wafer ring structure W is reversed by the reversing mechanism 803c. Specifically, the second rail of the pair of rails 831 moves between an initial position, in which the second rail supports the wafer ring structure W from below, and a retracted position spaced apart from the wafer ring structure W by rotating about a rotation axis Ax2 extending along a direction (Y direction) in which the rails 831 extend. The second rail of the pair of rails 831 includes a retraction drive mechanism 861 for rotating the pair of rails 831. The retraction drive mechanism 861 has a rotary actuator 861a as a drive source.

[0216] As in Fig. As shown in Figure 34, the rotation center Ce (rotation axis Ax1) of the inversion of the wafer ring structure W is located at a height position S / 2 above the seating surfaces (tops) of the rails 831 when the cylinders 852a travel S. Thus, it is possible to substantially align the height positions of the seating surfaces (tops) of the first clamp member 851a with the height positions of the seating surfaces (tops) of the rails 831 in a state where the wafer ring structure W is inverted and the piston rods of the cylinders 852a are retracted. The stroke amount S is equal to a distance between the first clamp member 851a and the second clamp member 851b, but since the annular member W3 has a thickness t, the piston rods of the cylinders 852a do not reach the stroke ends, and an actual stroke movement distance is St.

[0217] The height position of a support surface of the holder 851 of the flipping mechanism 803c, which supports the annular member W3 of the wafer ring structure W from below, is substantially aligned with the height positions of the support surfaces (upper surfaces) of the rails 831 in both the state before flipping and the state after flipping of the wafer ring structure W.

[0218] Specifically, in the state before the wafer ring structure W is turned over, the height position of a support surface (top surface) of the second clamping member 851b, which supports the annular member W3 of the wafer ring structure W from below, is substantially aligned with the height positions of the support surfaces (top surfaces) of the rails 831. Furthermore, in a state where the piston rods of the cylinders 852a are retracted in the post-turnover state of the wafer ring structure W, the height position of a support surface (top surface) of the first clamping member 851a, which supports the annular member W3 of the wafer ring structure W from below, is substantially aligned with the height positions of the support surfaces (top surfaces) of the rails 831.

[0219] In the fifth embodiment, the semiconductor wafer processing apparatus 800 can switch between a setting in which the position of the wafer ring structure W is flipped by the flipping mechanism 803c and a setting in which the position of the wafer ring structure W is not flipped by the flipping mechanism 803c based on information about the laser processing of the wafer W1. The information about the laser processing of the wafer W1 includes setting information about whether to perform laser processing from the circuit surface side (the side where the Sc circuit layer W11 is present) of the wafer W1 or whether to perform laser processing from the surface side (the side where the Sc circuit layer W11 is not present) of the wafer W1 opposite to the circuit surface side by the plate member W2.The information about the laser processing of the wafer W1 is set by a user and stored in advance in a memory of the semiconductor wafer processing apparatus 800. When laser processing is performed from the circuit surface side of the wafer W1, the setting in which the position of the wafer ring structure W is not reversed by the reversing mechanism 803c is used. When laser processing is performed by the plate member W2 from the surface side of the wafer W1 opposite the circuit surface side, the setting in which the position of the wafer ring structure W is reversed by the reversing mechanism 803c is used.

[0220] Operation of a semiconductor wafer processing apparatus The operation of the semiconductor wafer processing apparatus 800 according to the fifth embodiment will now be described with reference to FIG. Fig. 31 to 34.

[0221] As in Fig. 31, first, the wafer cassettes 202a are moved up-down by the Z-direction moving mechanism 202b so that the wafer ring structure W to be processed is at a height position where it can be removed by the clamping hand 833. Then, the clamping hand 833 is moved to the storage position by the Y-direction moving mechanism 834, and the wafer ring structure W is clamped by the clamping hand 833. Then, in the case of the setting in which the attitude of the wafer ring structure W is reversed by the reversing mechanism 803c, the wafer ring structure W is moved on the rails 831 by the clamping hand 833 and transported from the storage position to the reversing position.

[0222] As in the Fig. 32 and Fig. As shown in Figure 33, the holder 851 holds the end of the annular member W3 of the wafer ring structure W on the X1 direction side, and the retraction drive mechanism 861 retracts the second rail of the pair of rails 831. That is, the cylinders 852a move the first clamping member 851a toward the second clamping member 851b, so that the end of the annular member W3 of the wafer ring structure W on the X1 direction side is clamped between the first clamping member 851a and the second clamping member 851b. The rotary actuator 861a rotates the second rail of the pair of rails 831 away from the wafer ring structure W, so that the second rail of the pair of rails 831 is moved from the home position to the retracted position. In the retracted position, the second rail of the pair of rails 831 does not interfere with the turning over of the wafer ring structure W.When the wafer ring structure W is turned over, the clamping hand 833 releases its grip on the wafer ring structure W, and the clamping hand 833 is retracted by the Y-direction moving mechanism 834 to a position where it does not interfere with the turning over of the wafer ring structure W.

[0223] Then, as in the Fig. 33 and Fig. 34, the holder 851 is rotated 180 degrees by the rotation drive mechanism 853. That is, the fixing member 853a is rotated 180 degrees by the motor 853b, so that the clamp drive mechanism 852, the first clamp member 851a, and the second clamp member 851b are rotated 180 degrees. This reverses the wafer ring structure W held between the first clamp member 851a and the second clamp member 851b. Then, the second rail of the pair of rails 831 is returned from the retracted position to the home position, and the holder 851 releases its grip on the wafer ring structure W. Further, the clamp hand 833 is moved by the Y-direction moving mechanism 834 to a position where it can hold the wafer ring structure W, and the wafer ring structure W is held by the clamp hand 833.

[0224] Then, as in Fig.As shown in Figure 31, the wafer ring structure W is moved by the clamping hand 833 on the rails 831 and 832 and transported to the delivery position. In the case of the setting where the position of the wafer ring structure W is not reversed by the reversing mechanism 803c, the wafer ring structure W is transported by the clamping hand 833 from the storage position to the delivery position, passing through the reversing position without stopping at the reversing position.

[0225] Then, in the delivery position, the wafer ring structure W is delivered from the clamping hand 833 to the suction hand unit 803b. That is, the suction hand 841 is lowered by the Z-direction movement mechanism 842, and the annular element W3 of the wafer ring structure W is sucked by the suction hand 841. Then, the suction hand 841 is raised by the Z-direction movement mechanism 842, so that the wafer ring structure W sucked by the suction hand 841 is retracted from the rails 832. Then, the rail driving mechanism 832a increases the distance in the X direction between the pair of rails 832. In this way, it is possible to deliver the wafer ring structure W to the chuck table unit 12, which has been moved by the X-direction moving mechanism 121 and the Y-direction moving mechanism 122 under the suction hand 841 and the rails 832.

[0226] Then, the wafer ring structure W is transferred from the suction hand 841 to the chuck table unit 12. That is, the suction hand 841 is lowered in the Z direction under the rails 832 by the moving mechanism 842, and the wafer ring structure W is placed on a suction unit 12a. Then, the suction of the annular element W3 of the wafer ring structure W by the suction hand 841 is released, and the wafer ring structure W is sucked by the suction unit 12a. Then, the suction hand 841 is raised in the Z direction by the moving mechanism 842, so that the suction hand 841 is retracted from the chuck table unit 12.

[0227] Then, the wafer ring structure W is moved by the chuck unit 12 to a position where the laser 13 can emit a laser beam onto the wafer W1. Then, laser processing is performed on the wafer W1 of the wafer ring structure W. The details of the laser processing are similar to those of the first embodiment, and therefore, a detailed description is omitted. In the case of the setting in which the position of the wafer ring structure W is reversed by the reversing mechanism 803c, laser processing is performed from the surface side of the wafer W1 opposite to the circuit surface side by the plate member W2. This type of laser processing is effective when it is difficult to perform laser processing on the wafer W1 from the circuit surface side of the wafer W1 because the street width of the wafer W1 is narrow.In the case of the setting where the position of the wafer ring structure W is not flipped by the flipping mechanism 803c, laser processing is performed from the circuit surface side of the wafer W1. In such a case, there is no need to flip the position of the wafer ring structure W by the flipping mechanism 803c, and thus, it is possible to shorten the cycle time compared to a case where the position of the wafer ring structure W is flipped by the flipping mechanism 803c. Advantageous effects of the fifth embodiment

[0228] According to the fifth embodiment, the following advantageous effects are achieved.

[0229] According to the fifth embodiment, as described above, the wafer transporter 803 includes the flipping mechanism 803c configured to flip the position of the wafer ring structure W. Accordingly, the wafer ring structure W can be flipped by the flipping mechanism 803c, similar to the first embodiment, while reducing or preventing the complexity of the structure.

[0230] According to the fifth embodiment, as described above, the wafer transporter 803 includes the conveyor 803a configured to remove the wafer ring structure W from the cassette unit 202 and transport the removed wafer ring structure W, and the flipping mechanism 803c is provided as a part of the conveyor 803a. Accordingly, the flipping mechanism 803c is provided as a part of the conveyor 803a by effectively utilizing the conveyor 803a that removes the wafer ring structure W from the cassette unit 202, and thus, compared to a case where the flipping mechanism 803c is provided separately and independently, the complexity of the structure can be reduced or eliminated. In addition, the posture of the wafer ring structure W can be flipped while the wafer ring structure W is being transported by the conveyor 803a, and thus, no transport loss of the wafer ring structure W occurs (the transport route does not become long).Consequently, even if the position of the wafer ring structure W is reversed, an increase in cycle time can be reduced or prevented.

[0231] According to the fifth embodiment, as described above, the conveyor 803a includes the rails 831 configured to support the wafer ring structure W taken out from the cassette unit 202 from below, and the flipping mechanism 803c is provided as a part of the rails 831 of the conveyor 803a. Accordingly, the flipping mechanism 803c is provided as a part of the conveyor 803a by effectively utilizing the rails 831, and thus the complexity of the structure can be easily reduced or eliminated.

[0232] According to the fifth embodiment, as described above, the pair of rails 831 is provided at the predetermined interval, the flipping mechanism 803c is provided as a part of the first rail of the pair of rails 831, and the second rail of the pair of rails 831 is configured to retract when the position of the wafer ring structure W is flipped by the flipping mechanism 803c. Accordingly, the flipping mechanism 803c is provided as a part of the first rail of the pair of rails 831, so that the complexity of the structure can be reduced or eliminated compared to a case where the flipping mechanism 803c is provided as a part of both pairs of rails 831.Furthermore, the second rail of the pair of rails 831 is retracted when the posture of the wafer ring structure W is reversed by the reversing mechanism 803c, so that it is possible to prevent the second rail of the pair of rails 831 from interfering with the wafer ring structure W, and thus the posture of the wafer ring structure W can be easily reversed by the reversing mechanism 803c. Consequently, the posture of the wafer ring structure W can be easily reversed by the reversing mechanism 803c while reducing or preventing the complexity of the structure.

[0233] According to the fifth embodiment, as described above, the second rail of the pair of rails 831 is configured to move between the home position where the second rail supports the wafer ring structure W from below and the retracted position spaced from the wafer ring structure W by rotating about the rotation axis Ax2 extending along the direction in which the rails 831 extend. Accordingly, with a simple configuration in which the second rail of the pair of rails 831 is simply rotated, the second rail of the pair of rails 831 can be retracted from the home position to the retracted position. When the second rail of the pair of rails 831 is retracted from the home position to the retracted position, a part of the wafer ring structure W that is no longer supported from below by the second rail of the pair of rails 831 can be slightly bent downward.In this connection, the second rail of the pair of rails 831 is rotated so that the second rail of the pair of rails 831 is returned from the retracted position to the home position, and thus, even if the portion of the wafer ring structure W that is no longer supported from below by the second rail of the pair of rails 831 is slightly bent downward, the second rail of the pair of rails 831 can be easily returned to the home position while the bent portion of the wafer ring structure W is lifted.

[0234] According to the fifth embodiment, as described above, the reversing mechanism 803c includes the holder 851 provided as a part of the rails 831 and configured to hold the wafer ring structure W, and is configured to reverse the posture of the wafer ring structure W by rotating the holder 851 while the wafer ring structure W is held by the holder 851. Accordingly, the holder 851 is provided by effectively utilizing the rails 831 that support the wafer ring structure W from below, and thus, the complexity of the structure is reduced or eliminated, and the wafer ring structure W is easily held by the holder 851.

[0235] According to the fifth embodiment, as described above, the cassette unit 202 is configured to store the wafer ring structure W including the annular member W3 surrounding the wafer, and the reversing mechanism 803c includes the holder 851, which is provided as part of the first rail of the pair of rails 831 and is configured to clamp the end of the annular member W3 of the wafer ring structure W in the up-down direction, and is configured to reverse the posture of the wafer ring structure W by rotating the holder 851 while the end of the annular member W3 of the wafer ring structure W is clamped by the holder 851. Accordingly, the holder 851 is provided by effectively utilizing the first rail of the pair of rails 831 that support the wafer ring structure W from below, and thus the complexity of the structure can be reduced or eliminated.In addition, the end of the annular element W3 of the wafer ring structure W is clamped by the holder 851, so that the wafer ring structure W can be reliably held and thus the position of the wafer ring structure W can be stably reversed.

[0236] According to the fifth embodiment, as described above, the semiconductor wafer processing apparatus is configured to switch between the setting in which the position of the wafer ring structure W is reversed by the reversing mechanism 803c and the setting in which the position of the wafer ring structure W is not reversed by the reversing mechanism 803c based on the laser processing information of the wafer W1. Accordingly, it is possible to switch between laser processing from the circuit surface side of the wafer W1 and laser processing from the surface side of the wafer W1 opposite to the circuit surface side depending on the wafer W1 to be processed. This can improve the degree of freedom in processing the wafer W1. The other advantageous effects of the fifth embodiment are similar to those of the first embodiment. Modification examples

[0237] The embodiments disclosed this time are to be considered as exemplary and not restrictive in all respects. The scope of the present invention is not indicated by the above description of the embodiments, but by the scope of the claims, and all modifications (modified examples) within the meaning and scope equivalent to the scope of the claims are further included.

[0238] For example, while the example in which the wafer transporter includes the suction hand that sucks and supports the wafer structure, and the reversing mechanism reverses the suction hand that sucks the wafer structure, was shown in each of the aforementioned first to fourth embodiments, the present invention is not limited thereto. In the present invention, the wafer transporter may include a carrier other than the suction unit that supports the wafer structure, and the reversing mechanism may reverse the carrier that supports the wafer structure.

[0239] Although the aforementioned third embodiment showed the example in which the semiconductor wafer processing apparatus includes the temporary placement unit, the present invention is not limited thereto. In the present invention, the wafer processing apparatus may not include the temporary placement unit in the case of a wafer structure that does not include an annular member. In such a case, the wafer structure can be flipped over by the flipping mechanism and directly fed to the dicer.

[0240] While the example in which the semiconductor wafer processing apparatus includes the imager for imaging the wafer of the wafer pattern placed on the temporary placement unit was shown in the above-mentioned third embodiment, the present invention is not limited thereto. In the present invention, even if the semiconductor wafer processing apparatus includes the temporary placement unit, the semiconductor wafer processing apparatus may not include the imaging device for placing the wafer of the wafer pattern on the temporary placement unit.

[0241] Although the example in which the semiconductor wafer processing apparatus includes the ultraviolet irradiation device and the squeegee unit was shown in each of the above-mentioned first and second embodiments, the present invention is not limited thereto. In the present invention, even if the semiconductor wafer processing apparatus includes the expander, the semiconductor wafer processing apparatus may not include the ultraviolet irradiation device and the squeegee unit.

[0242] Although in each of the aforementioned first and second embodiments, the example in which the wafer transporter turns over the wafer structure using the turning over mechanism and delivers the wafer structure to the cooling air supply device was shown, the present invention is not limited to this. In the present invention, the wafer transporter may turn over the wafer structure using the turning over mechanism and deliver the wafer structure to a receiving section other than the cooling air supply device.

[0243] While the control process is described using the described flowchart in a manner controlled by a flow in which processes are executed in order along a process flow for the convenience of illustration in each of the aforementioned first and second embodiments, the present invention is not limited thereto. In the present invention, the control process may be performed in an event-driven manner, with the processes being performed on an event basis. In this case, the control process may be performed entirely in an event-driven manner or in a combination of event-driven and sequence-driven.

[0244] Although the above-mentioned fifth embodiment showed the example in which the reversing mechanism is provided as part of the first rail of the pair of rails, the present invention is not limited thereto. In the present invention, the reversing mechanism may be provided as part of both pairs of rails. That is, the holder of the reversing mechanism may be provided as part of both pairs of rails.

[0245] Although the above-mentioned fifth embodiment showed the example in which the holder of the flipping mechanism is the clamping unit that clamps the wafer structure, the present invention is not limited to this. In the present invention, the holder of the flipping mechanism may be a suction unit that sucks the wafer structure.

[0246] Although the above-mentioned fifth embodiment showed the example in which the second rail of the pair of rails rotates to move between the home position and the retracted position, the present invention is not limited to this. In the present invention, the second rail of the pair of rails can slide to move between the home position and the retracted position. List of reference symbols 1, 601 Separation device (Dicer) 100, 300, 400, 600, 800 semiconductor wafer processing apparatus (wafer processing apparatus) 200, 302a Expansion main body (expander) 202 Cassette unit (wafer storage) 203 Lifting hand unit (wafer transporter, removal unit) 204, 504 suction hand unit (wafer transporter, suction unit, transport mechanism) 204d, 504d, 703d, 803c reversing mechanism 206 Cooling air supply device (cooling device) 506 Unit for temporary placement 703 Lifting hand unit (wafer transporter, suction unit, removal transporter) 801 Dicer 803 wafer transporter 803a Sponsor 831 Rail 852 Holder (clamping unit) Ax, Ax2 rotation axis Ch semiconductor chip W wafer ring structure (wafer structure) Wa wafer structure W1 wafer W2, W2a plate element W3 annular element QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 6904368 [0002, 0003, 0004, 0005]

Claims

[1] Wafer processing apparatus, comprising: a wafer storage configured to store a wafer structure including a wafer on which a plurality of semiconductor chips have been formed and a plate member to which the wafer has been attached; a dicer configured to perform a singulation process to separate the wafer fed from the wafer storage into individual semiconductor chips; and a wafer transporter configured to transport the wafer structure between the wafer storage and the dicer; wherein the wafer transporter includes a flipping mechanism configured to flip the attitude of the wafer structure. [2] Wafer processing apparatus according to claim 1, wherein the wafer transporter further comprises a suction unit configured to suck the wafer structure; and the flipping mechanism is configured to flip the position of the wafer structure by rotating the suction unit that sucks the wafer structure about a rotation axis extending in a horizontal direction. [3] Wafer processing apparatus according to claim 1, wherein the wafer storage is configured to store the wafer structure that does not include an annular element surrounding the wafer; and the wafer transporter is configured to flip the wafer structure using the flipping mechanism and feed the wafer structure to the dicer. [4] Wafer processing apparatus according to claim 3, further comprising: a temporary placement unit provided between the wafer storage and the dicer and configured to receive the wafer structure; wherein the wafer transporter is configured to flip the wafer structure using the flipping mechanism and place the wafer structure on the temporary placement unit before feeding the wafer structure to the dicer. [5] The wafer processing apparatus according to claim 1, further comprising: an expander configured to expand the plate member to which the wafer singulated by the dicer has been attached; wherein the wafer transporter is configured to transport the wafer structure between the dicer and the expander; the wafer storage is configured to store the wafer structure including an annular element surrounding the wafer; and the wafer transporter is configured to feed the wafer structure to the dicer without flipping the wafer structure using the flipping mechanism, and to flip the wafer structure using the flipping mechanism and feed the wafer structure to the expander. [6] Wafer processing apparatus according to claim 5, wherein the expander comprises a cooling device configured to cool the plate element as the plate element expands; and the wafer transporter is configured to turn over the wafer structure using the turning mechanism and deliver the wafer structure to the cooling device. [7] Wafer processing apparatus according to claim 1, wherein the wafer storage is configured to store the wafer structure including an annular element surrounding the wafer; and the wafer transporter is configured to flip the wafer structure using the flipping mechanism and feed the wafer structure to the dicer. [8] Wafer processing apparatus according to claim 1, wherein the wafer transporter comprises a removal unit configured to remove the wafer structure from the wafer storage and a transport mechanism configured to transport a removed wafer structure; and the turning mechanism is provided in the transport mechanism. [9] Wafer processing apparatus according to claim 1, wherein the wafer transporter comprises a removal transporter configured to remove the wafer structure from the wafer storage and to transport a removed wafer structure; and the turning mechanism is provided in the removal transporter. [10] Wafer processing apparatus according to claim 1, wherein the wafer transporter comprises a conveyor configured to remove the wafer structure from the wafer storage and to transport a removed wafer structure; and the turning mechanism is provided as part of the conveyor. [11] Wafer processing apparatus according to claim 10, wherein the conveyor has a rail configured to support the wafer structure removed from the wafer storage from below; and the turning mechanism is provided as part of the rail. [12] Wafer processing apparatus according to claim 11, wherein the rail comprises a pair of rails provided at a predetermined distance; the turning mechanism is provided as part of a first rail of the pair of rails; and a second rail of the pair of rails is configured to be retracted when the position of the wafer structure is reversed by the reversing mechanism. [13] The wafer processing apparatus according to claim 12, wherein the second rail of the pair of rails is configured to move between a home position in which the second rail supports the wafer structure from below and a retracted position spaced from the wafer structure by rotating about a rotation axis extending along a direction in which the pair of rails extend. [14] The wafer processing apparatus according to claim 11, wherein the reversing mechanism comprises a holder provided as a part of the rail and configured to hold the wafer structure, and configured to reverse the attitude of the wafer structure by rotating the holder while the wafer structure is held by the holder. [15] Wafer processing apparatus according to claim 12, wherein the wafer storage is configured to store the wafer structure including an annular element surrounding the wafer; and the turning mechanism comprises a clamping unit provided as a part of the first rail of the pair of rails and configured to clamp one end of the annular member of the wafer structure in an up-down direction, and configured to turn over the attitude of the wafer structure by rotating the clamping unit while the end of the annular member of the wafer structure is clamped by the clamping unit. [16] The wafer processing apparatus according to claim 10, wherein the wafer processing apparatus is configured to switch between a setting in which the attitude of the wafer structure is flipped by the flipping mechanism and a setting in which the attitude of the wafer structure is not flipped by the flipping mechanism based on information about the laser processing of the wafer. [17] A semiconductor chip manufacturing method comprising: Performing dicing using a dicer to divide a wafer of a wafer structure comprising the wafer on which a plurality of semiconductor chips have been formed and a plate member to which the wafer has been attached and fed from a wafer storage configured to store the wafer structure into individual semiconductor chips; and Transporting the wafer structure between the wafer storage and the dicer using a wafer transporter; wherein the wafer transporter has a reversing mechanism configured to reverse the position of the wafer structure. [18] A semiconductor chip manufactured by a wafer processing apparatus, the wafer processing apparatus comprising: a wafer storage configured to store a wafer structure including a wafer on which a plurality of semiconductor chips have been formed and a plate member to which the wafer has been attached; a dicer configured to perform a singulation process to separate the wafer fed from the wafer storage into individual semiconductor chips; and a wafer transporter configured to transport the wafer structure between the wafer storage and the dicer; wherein the wafer transporter has a reversing mechanism configured to reverse the position of the wafer structure.

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