Coil device, chip capacitor holder and method for manufacturing a coil device

Abstract

A coil device (100) comprises a coil (110) and a chip capacitor (120). A coil wire (111) is wound around the coil (110). The chip capacitor (120) has an electrode surface (121a). The electrode surface (121a) is electrically connected to the coil (110). Connecting sections (111b) are partial lengths of the coil wire (111) that extend out of the coil (110). The connecting sections (111b) are each directly connected to the electrode surfaces (121a).

Description

TECHNICAL AREA

[0001] The present invention relates to a coil device, a chip capacitor holder and a method for manufacturing such a coil device. TECHNICAL BACKGROUND

[0002] Some coil devices incorporate chip capacitors. Patent document 1, described below, discloses a coil antenna (100) comprising a coil (3) and a chip-like capacitor (referred to as a chip capacitor (10)) connected to the coil (3). One end of a coil wire extending from the coil is soldered to a relay terminal (9b) integrally provided with metal wiring (7c). Furthermore, the chip capacitor (10) is mounted on an electrode (8b) integrally formed with the metal wiring (7c) by soldering. In other words, one end of the coil (3) is indirectly connected to an electrode of the chip capacitor (10) via the relay terminal (9b), the metal wiring (7c), and the electrode (8b). CITATION LIST PATENT DOCUMENTS

[0003] Patent document 1: WO 2017 / 208828 A OVERVIEW OF THE PROBLEM THAT THE INVENTION IS INTENDED TO SOLVE.

[0004] However, if one end of the coil (3) and the chip capacitor (10) are connected via one or more other elements, such as the metal wiring (7c), the problem arises that the number of components required for manufacture increases, the manufacturing costs for connecting the components increase, and the overall size of the coil device increases.

[0005] The present invention was made with regard to the problems described above, and one object of it is to provide a coil device that is able to reduce the cost of manufacture or that is able to be miniaturized. MEANS TO SOLVENT THE PROBLEM

[0006] A coil device according to the present invention comprises: a coil around which a coil wire is wound; and a chip capacitor which is electrically connected to the coil and which has an electrode surface, wherein a connecting section, which is a partial length of the coil wire which is brought out of the coil, is directly connected to the electrode surface.

[0007] A chip capacitor holder according to the present invention comprises: a mounting section for mounting a chip capacitor; and a first side section and a second side section, which are spaced apart from each other by the mounting section and facing each other, wherein a notched section is formed on an end surface of the first side section, a further notched section is formed on an end surface of the second side section, and the notched section and the further notched section overlap each other when viewed in a direction in which the first side section and the second side section are spaced apart from each other.

[0008] A method for manufacturing a coil device according to the present invention is a method for manufacturing a coil device comprising a coil around which a coil wire is wound; and a chip capacitor which is electrically connected to the coil and which has an electrode surface, wherein the coil wire is led out of the coil and a connecting section, which is a partial length region of the led-out coil wire, is directly connected to the electrode surface.

[0009] Because a portion of the coil wire leading out of the coil is directly connected to the electrode surface of the chip capacitor, it is not necessary to provide other elements for connecting the coil wire and the chip capacitor. IMPACT OF THE INVENTION

[0010] According to the coil device of the present invention, by directly connecting the coil wire and the electrode surface of the chip capacitor, it is no longer necessary to provide other elements for connecting the coil wire and the chip capacitor, or to provide space for arranging the other elements. This allows steps for arranging such other elements and for connecting the other elements to the coil wire, and the like, to be omitted.

[0011] Accordingly, the costs for manufacturing the coil device can be reduced, and the coil device can be made smaller. BRIEF DESCRIPTION OF THE FIGURES

[0012] The above-described task, as well as other tasks, features and advantages, are further illustrated by the preferred embodiments described below and the accompanying figures. Fig. Figure 1 is a perspective view showing an example of a coil device according to a first embodiment of the present invention. Fig. Figure 2 is an expanded perspective view of the coil device according to the first embodiment. Fig. Figure 3 is a front view of the coil device according to the first embodiment, in which the contours of a coil, a coil wire and a chip capacitor are shown by dotted lines. Fig. Figure 4 is a top view of the coiling device according to the first embodiment. Fig. Figure 5 is a bottom view of the coil device according to the first embodiment. Fig. Figure 6 is a right-side view of the coil device according to the first embodiment, in which contours of a coil wire and a chip capacitor are shown by dotted lines. Fig. 7 is a longitudinal section view of a cross-section along a line in Fig. 3 dashed line of the coil device according to the first embodiment when viewed in the direction of arrow VII-VII. Fig. Figure 8A is an enlarged view of a first arrangement section and its surroundings in a top view of a coil device according to a second embodiment. Fig. Figure 8B is an enlarged view of a first arrangement section and its surroundings in a top view of a coil device according to a third embodiment. DESCRIPTION OF THE EXECUTION FORMS

[0013] The various components of a coiling device according to the present invention need not be independent units. For example, several components can be designed as a single element, a single component can be formed by several elements, a specific structural element can form part of another component, and part of a specific structural element and part of another structural element can overlap.

[0014] Although a method for manufacturing a coil device according to the present invention can be described using several successively described steps, the described sequence is not intended to restrict the order and timing of the execution of the several steps. Therefore, when the method for manufacturing a coil device according to the present invention is implemented, the order of the several steps can be modified to such an extent that such a modification does not affect the content, and some or all of the times at which the several steps are executed may overlap.

[0015] The following describes embodiments of the present invention with reference to the drawings. In the respective drawings, corresponding components are designated by common reference numerals, and redundant descriptions are not repeated.

[0016] The present embodiments are described, with the directions front, back, left, right, top, and bottom defined as shown. However, these directions are defined solely for the sake of simplicity, to clearly illustrate the relative relationships between the structural elements, and are not intended to restrict orientation during the manufacture or use of products embodying the present invention. In the present embodiments, the front-to-back direction coincides with the direction of the winding axis of a coil, the left-to-right direction coincides with the width direction of the coil assembly, and the top-to-bottom direction coincides with the thickness direction of the coil assembly.

[0017] Furthermore, the term “flat surface” as used in the present invention means a shape that has been physically formed with a flat surface as its goal, whereby this shape need not necessarily be geometrically perfectly flat. <Erste Ausführungsform> (Coil device)

[0018] The present embodiment is described with reference to the Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 to Fig. 7 described. In the Fig. 1, Fig. 2, Fig. 4 and Fig. Solder material 140 is not shown in figure 5.

[0019] Fig. Figure 1 is a perspective view showing an example of a coil device 100 according to a first embodiment of the present invention.

[0020] First, an overview of the coil device 100 according to the present embodiment is described.

[0021] The coil device 100 comprises a coil 110 and a chip capacitor 120. A coil wire 111 is wound around the coil 110. The chip capacitor 120 is electrically connected to the coil 110 and has electrode surfaces 121a. The electrode surfaces 121a are the surfaces of electrodes of the chip capacitor 120. Connecting sections 111b are partial lengths of the coil wire 111 that extend from the coil 110. The connecting sections 111b are each directly connected to the electrode surfaces 121a.

[0022] Because the coil wire 111 and the electrode surfaces 121a of the chip capacitor 120 are directly connected, it is not necessary to provide other elements (e.g., metal wiring) for connecting the coil wire 111 and the chip capacitor 120, or to provide space for arranging the other elements. This allows steps for arranging such other elements and for connecting the other elements to the coil wire 111, and the like, to be omitted.

[0023] Accordingly, the coil device 100 can be manufactured more easily, the costs of manufacturing the coil device 100 can be reduced, and the coil device 100 can be made smaller.

[0024] Next, the coil device 100 according to the present embodiment will be described in detail.

[0025] The coil device 100 here refers to a device comprising a coil 110. Examples of the coil device 100 include an antenna, an inductor, and a transformer. The coil device 100 can be electrically connected to another device or component and can be a coil component that, together with other devices or components, forms an electronic circuit and is a component of an electrical device. Alternatively, the coil device 100 can also comprise a closed electronic circuit and can operate independently. The coil device 100 according to the present embodiment is an antenna device. In particular, the coil device 100 according to the present embodiment is a radio frequency identification tag (RF tag) that can be used to identify or track goods and the like.An RF tag according to the present embodiment, which can be very small, can be attached to medical elements, such as gauze, or medical instruments, such as surgical instruments, that are temporarily or permanently positioned or implanted in the body. Furthermore, the coil device 100 can also be used as a voice coil or LC filter to selectively extract or selectively transmit signals in a specific frequency band.

[0026] According to the present embodiment, the coil wire 111 is wound around the coil 110. The coil 110, according to the present embodiment, has a winding core 112, and the coil wire 111 is wound around the winding core 112. Individual coil wires 111 in a winding section of the Fig. The coils shown in Figure 110 are not shown in the figure. The same applies to the Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 to Fig. 7. The shape of the coil 110 is not limited to the shape shown in the figures and includes various shapes that can function as a coil 110. For example, the coil 110 can also be an air-core coil that does not use a winding core 112. Alternatively, a coil wire 111 arranged in a ring shape on a flat surface can also serve as a coil 110.

[0027] The coil wire 111 is a conductive, wire-shaped element. The cross-sectional shape of the coil wire 111 can be circular, polygonal, or flat, such as an ellipsoid or a rectangle. According to the present embodiment, the coil wire 111 consists of a conductive core wire coated with an insulating film. Examples of insulating film materials include resins, such as polyurethane.

[0028] Both ends (first exposed section 111a1 and second exposed section 111a2) of the coil wire 111 extend from the coil 110. More precisely, both ends extend from the coil 110 towards the side of the chip capacitor 120 (towards the base section 130). In the present embodiment, the two ends of the coil wire 111 are each connected to corresponding electrodes of the chip capacitor 120, but the connection of the coil wire 111 is not limited to this. It is also possible that only one end of the coil wire 111 is connected to an electrode of the chip capacitor 120. The other end of the coil wire 111 can also be connected directly or indirectly to a terminal of another element that, together with the coil device 100, forms an electronic circuit.

[0029] As described above, the connecting sections 111b are partial lengths of the coil wire 111 (in particular the first brought-out section 111a1 and the second brought-out section 111a2). More precisely, as in Fig. 3 or Fig. As shown in Figure 6, the connection sections 111b are partial lengths of the coil wire 111 that are in contact with the electrode surfaces 121a or are immersed in the solder material 140, which will be described later (direct connection areas). Furthermore, the connection sections 111b can also comprise partial lengths of a coil wire 111 that border direct connection areas. In other words, the connection sections 111b can be completely connected to the electrode surfaces 121a or only partially connected to them.

[0030] The connection sections 111b according to the present embodiment are partial lengths in the coil wire 111 that extend from a first arrangement section 131 to a second arrangement section 132. In other words, the connection sections 111b according to the present embodiment comprise both the direct connection areas that are arranged within the solder material 140 or are in contact with the electrode surfaces 121a, and the partial lengths of the coil wire 111 that are exposed at both ends of the direct connection areas from the solder material 140 and spaced apart from the electrode surfaces 121a.

[0031] The chip capacitor 120 is a capacitor in which part of the surface of the electrodes 121 serves as flat electrode surfaces 121a. The chip capacitor 120 has the electrodes 121 at both ends oriented from left to right. As shown in Fig. As shown in Figure 2, the shape of the chip capacitor 120 according to the present embodiment is a substantially rectangular cuboid, but the shape of the chip capacitor 120 is not limited to this.

[0032] More precisely, the electrode surfaces 121a are flat areas connected to the connecting sections 111b on the outer surfaces of the electrodes 121. The connecting sections 111b are arranged along the electrode surfaces 121a. According to the present embodiment, the electrode surfaces 121a are those surfaces on the electrodes 121 that face in the direction in which the base section 130 opens (i.e., forwards).

[0033] As an alternative to the present embodiment, the connecting sections 111b can also be connected to another electrode surface 121a, wherein any area on the outer surface of the electrodes 121 can be the electrode surface 121a. For example, the connecting sections 111b can be connected by bringing the connecting sections 111b into contact with a part of the outer surface that points either to the left or to the right away from the electrodes 121, in which case the electrode surfaces 121a are the parts of the outer surface that point either to the left or to the right away from the electrodes 121.

[0034] That the connecting sections 111b and the electrode surfaces 121a are directly connected means that the connecting sections 111b and the electrode surfaces 121a are connected without the use of other conductive elements, such as metal wiring (with the exception of connecting elements, such as the solder 140 described later, to connect the connecting sections 111b and the electrode surfaces 121a). For example, that the connecting sections 111b and the electrode surfaces 121a are directly connected means that the connecting sections 111b and the electrode surfaces 121a are in direct contact and electrically connected. Alternatively, that the connecting sections 111b and the electrode surfaces 121a are directly connected can also mean that the connecting sections 111b and the electrode surfaces 121a are connected by a connecting element, such as...The solder material 140 described below is connected and electrically connected to each other via this connecting element. The connecting element preferably consists of a material that is flexible enough to be applied to the connection sections 111b or the electrode surfaces 121a by deposition or the like, and is subsequently solidified when the connection sections 111b and the electrode surfaces 121a are connected to each other. Examples of the connecting element include solder materials such as solder and conductive adhesives.

[0035] In the present embodiment, as in Fig. As shown in Figure 7, the connecting sections 111b are arranged along the electrode surfaces 121a and are in direct contact with the electrode surfaces 121a. The connecting sections 111b can be in pressure contact with the chip capacitor 120 or simply rest against it.

[0036] Furthermore, in the present embodiment, as in Fig. As shown in Figure 6, the connecting sections 111b are connected to the electrode surfaces 121a by the solder material 140. The connecting sections 111b are immersed in the solder material 140. In the present embodiment, as shown in Figure 6, the connecting sections 111b are connected to the electrode surfaces 121a by the solder material 140. Fig. 3 and Fig. As shown in Figure 6, the solder material 140 covers the front, left and right sides of the electrodes 121. The solder material 140 can be arranged to penetrate between the chip capacitor 120 and the connection sections 111b, but this is not strictly necessary.

[0037] Additionally, in the connection sections 111b, the core wire is preferably exposed and not covered with an insulating film. In other words, the insulating film in the connection sections 111b is preferably removed by peeling or by dissolving, decomposing, or sublimating it through immersion in the molten solder material 140 before or during the connection process.

[0038] As in Fig. 1 and Fig. As shown in Figure 2, the coil device 100 further comprises a base section 130. The base section 130 is preferably made of an insulating material, and the base section 130 according to the present embodiment is made of plastic. The base section 130 holds the chip capacitor 120. Preferably, the base section 130 holds the chip capacitor 120 on the coil 110.

[0039] In the present embodiment, the chip capacitor 120 is held by the base section 130 by the fact that a portion of the chip capacitor 120 is received in the base section 130. A housing recess 139, open at the front, is formed in the base section 130. At least a portion of the chip capacitor 120 is received within the housing recess 139. As shown in Fig. As shown in Figure 7, the chip capacitor 120 is arranged such that it comes into contact with a bottom section of the housing recess 139. The chip capacitor 120 and the bottom section of the housing recess 139 can be in direct contact with each other, or the chip capacitor 120 can be connected to the base section 130 by an adhesive (not shown in the figure) applied to a surface of the bottom section of the base section 130.

[0040] Furthermore, as described below, the base section 130 is attached to the coil 110. As in Fig. As shown in Figure 2, a recess is formed in a rear section of the base section 130, into which the coil 110 (in particular, a front end section of the winding core 112) is fitted. The recess for receiving the coil is open upwards and to the rear. The coil 110 (more precisely, the winding core 112) is attached to the base section 130 by fitting it into the coil-receiving recess of the base section 130 from top to bottom or from back to front.

[0041] The base section 130 is not limited to a shape having a housing recess 139 and can have any shape as long as the shape allows the chip capacitor 120 to be held. The base section 130 can also be an element with a side section or a bottom section that covers part of the chip capacitor 120 without the housing recess 139, or an element with a structure (such as an engagement structure) that couples the base section 130 and the chip capacitor 120 without the side section or even without the bottom section. Alternatively to the present embodiment, it is also possible for the coil device 100 to have no base section 130. For example, the coil 110 and the chip capacitor 120 can be held in a desired positional relationship by being accommodated in a housing for the coil 110 and the chip capacitor 120, as described later.

[0042] To reduce the overall size of the chip capacitor 120 and the coil 110, the coil device 100 is configured as follows according to the present embodiment.

[0043] As in Fig. As shown in Figure 6, the base section 130 and the coil 110 (more precisely, the winding section) are in contact with each other. Accordingly, one dimension of the coil device 100 can be reduced in one direction of the winding axis. Alternatively to the present embodiment, the base section 130 and the coil 110 can also be separated from each other in the direction of the winding axis.

[0044] Furthermore, as in Fig. Figure 3 shows that the chip capacitor 120 used is preferably sufficiently small compared to the coil 110. More precisely, the outer contour of the chip capacitor 120 is preferably largest when viewed in the direction of the winding axis, but the largest outer contour of the chip capacitor 120 (i.e., the outer contour viewed in the direction of the winding axis) is smaller than the outer contour of the coil 110 when viewed in the direction of the winding axis. Furthermore, the chip capacitor 120 is preferably arranged such that, viewed in the direction of the winding axis, the outer contour of the chip capacitor 120 fits within the outer contour of the coil 110. Alternatively to the present embodiment, a coil 110 can also be used whose outer contour in the direction of the winding axis is smaller than the largest outer contour of the chip capacitor 120. By using such a smaller coil, a reduction in the size of the coil device 100 can be achieved.Furthermore, it is also possible that part of the chip capacitor 120 does not overlap with the coil 110 when viewed in the direction of the winding axis.

[0045] Furthermore, the chip capacitor 120 is arranged relative to the coil 110 in such a way that its dimensions in the direction of the winding axis are minimized. More precisely, according to the present embodiment, the dimensions of the chip capacitor 120 in the direction of the winding axis are larger than the dimensions of the chip capacitor 120 in both the width and thickness directions of the coil assembly 100. Accordingly, the dimensions of the coil assembly 100 in the direction of the winding axis can be kept small, and a reduction in size can be achieved.

[0046] As in Fig. 1 and Fig. As shown in Figure 2, the base section 130 has a first side section 133 and a second side section 134. The first side section 133 covers a portion of the surface (first covered surface 122) of the chip capacitor 120. The second side section 134 covers another portion of the surface (second covered surface 123) of the chip capacitor 120. In other words, the first side section 133 and the second side section 134 are each arranged along the first covered surface 122 and the second covered surface 123, respectively, and cover a portion of the chip capacitor 120.

[0047] In the present embodiment, the first side section 133 is a side wall that delimits the housing recess 139 and is arranged above the chip capacitor 120. The first side section 133 covers substantially the entire upward-facing outer surface of the chip capacitor 120 (first covered surface 122). The fact that the first side section 133 covers substantially the entire first covered surface 122 can also mean that the chip capacitor 120 (electrode surfaces 121a, etc.), as shown in Fig. 4 shown and later described, in a notched section 131c and a second deflection section 137, some of the first side section 133 is exposed.

[0048] The second side section 134 is a side wall that delimits the housing recess 139 and is located below the chip capacitor 120. The second side section 134 substantially covers the entire downward-facing outer surface of the chip capacitor 120 (second covered surface 123). The fact that the second side section 134 substantially covers the entire second covered surface 123 can also mean that the surface of the chip capacitor 120 is as shown in Fig. 5 shown and later described, in a deflection section 132 or a second notched section 136, some of the second side section 134 is exposed.

[0049] Alternatively to the present embodiment, it is also possible that the first side section 133 or the second side section 134 only cover a part of the surface that points upwards or downwards from the chip capacitor 120.

[0050] In the present embodiment, the first side section 133 and the second side section 134 are positioned on either side of the chip capacitor 120, facing each other at 180 degrees. Alternatively, the first side section 133 and the second side section 134 can be arranged in a different positional relationship on either side of the chip capacitor 120. For example, of the four side walls that define the rectangular housing recess 139, two adjacent side walls can also be used as the first side section 133 and the second side section 134. In this case, a portion of the first side section 133 and a portion of the second side section 134 face each other diagonally, and the chip capacitor 120 is positioned between these portions.

[0051] As in Fig. As shown in Figure 3, the chip capacitor 120 and the side wall of the housing recess 139 are spaced apart. More precisely, the first covered surface 122 and the first side section 133 are spaced apart, and the second covered surface 123 and the second side section 134 are also spaced apart.

[0052] As in Fig. As shown in Figure 3, the connecting section 111b of the coil wire 111 extends from the first arrangement section 131 to the second arrangement section 132. More precisely, in the present embodiment, a part on an origin side (hereinafter also referred to as the base end side) of the coil wire 111 in the connecting section 111b is arranged at the first arrangement section 131, and a part on a side of the distal end of the coil wire 111 in the connecting section 111b is arranged at the second arrangement section 132.

[0053] The first arrangement section 131 and the second arrangement section 132 are formed on the first side section 133 and the second side section 134, respectively. In other words, the first arrangement section 131 is formed on the first side section 133, and the second arrangement section 132 is formed on the second side section 134. The first arrangement section 131 and the second arrangement section 132 are arranged on either side of a portion of the chip capacitor 120 (in particular, the electrode surfaces 121a of the electrodes 121). If the connecting section 111b is arranged in this way such that it extends between portions of the base section 130 that are arranged on either side of the chip capacitor 120, then the connecting section 111b is located in a position where the connecting section 111b and the chip capacitor 120 (or the electrode surfaces 121a) can be easily connected to one another.

[0054] This means that the first arrangement section 131 and the second arrangement section 132 are arranged on either side of a part of the chip capacitor 120, and that the chip capacitor 120 (in particular the electrode surfaces 121a of the electrodes 121) is arranged on a straight line connecting a part of the first arrangement section 131 and a part of the second arrangement section 132. In other words, when viewed from one direction of extension of the connection section 111b (e.g., from top to bottom), the connecting section 111b overlaps both the first arrangement section 131 (in particular the notched section 131c to be described later) and the second arrangement section 132 (in particular a wire arrangement recess 132d to be described later).

[0055] As described below, the first assembly section 131 and the second assembly section 132, according to the present embodiment, are recesses provided in the base section 130 and designed to guide the coil wire 111. Furthermore, the shapes of the first assembly section 131 and the second assembly section 132 differ from one another according to the present embodiment. More precisely, both the first assembly section 131 and the second assembly section 132 have opening sections, and when comparing the way in which the opening sections of the first assembly section 131 and the second assembly section 132 are open, the shape of the opening section of the second assembly section 132 is more open than that of the opening section of the first assembly section 131.

[0056] First, as in Fig. Figure 4 shows the first arrangement section 131 as a part of the base section 130. According to the present embodiment, the first arrangement section 131 is a notched section 131 that delimits the notched section 131c through which the coil wire 111 runs. Here, "notched section 131" refers to a wall of a wall section to be described later, in which the notched section 131c is formed, as well as a part of the surrounding area of ​​this wall. More precisely, in the present embodiment, the notched section 131c is formed by notching an end surface (first end surface 133a) of the first side section 133. According to the present embodiment, the notched section 131c has a V-shape.

[0057] The notched section 131c is bounded by a pair of wall sections (an upright section 131a and an inclined surface section 131b, described later). The angle formed between this pair of wall sections is less than 180 degrees. Preferably, the angle is an acute angle of less than 90 degrees, and more preferably less than 60 degrees. The angle is preferably at least 30 degrees, and more preferably at least 45 degrees.

[0058] Furthermore, in the present embodiment, a base section is provided between the upright section 131a and the inclined surface section 131b, and the notched section 131c is bounded by the upright section 131a, the inclined surface section 131b, and the base section. The width of the base section is greater than the diameter of the coil wire 111. Alternatively, the width of the base section can also be less than or approximately equal to the diameter of the coil wire 111. As an alternative to the present embodiment, it is also possible that no base section is provided between the upright section 131a and the inclined surface section 131b, that the upright section 131a and the inclined surface section 131b are arranged side by side, and that the notched section 131c is formed by the upright section 131a and the inclined surface section 131b.

[0059] As an alternative to the present embodiment, the first arrangement section 131 can also be an end of the first side section 133, comprising an end face of the first side section 133. In other words, it is possible that the first arrangement section 131 is not provided with a notched section 131c and that the coil wire 111 is in contact or pressure contact with the end face of the first side section 133. In this case, the first arrangement section 131 is the end face of the first side section 133 with which the coil wire 111 comes into contact or pressure contact, as well as part of the surrounding area of ​​this end face. Alternatively, the first arrangement section 131 can also be a recess bounded by being arranged between a pair of projecting sections extending from the base section 130.The depression and the preceding sections that delimit the depression may have properties similar to those of the notched section 131c described later, as well as the wall section of the notched section 131c.

[0060] Next, the form of the second arrangement section 132 is described. As in Fig. As shown in Figure 5, the second assembly section 132, according to the present embodiment, is the deflection section 132 with which the coil wire 111 comes into contact and is bent. At the deflection section 132, the coil wire 111 can be curved in an arc or bent and bent at an angle. The coil wire 111 can be in pressure contact with the deflection section 132 or simply rest against it. The coil wire 111 is bent from its connecting section 111b to its distal end, where it is in contact with the deflection section 132, and is deflected such that it runs towards a fastening section 135 described later.

[0061] In the present embodiment, the deflection section 132 is the wire arrangement recess 132d, which is formed by substantially rectangular indentation of the end face (second end face 134a) of the second side section 134. More precisely, the second side section 134 is indented in an L-shape to form the wire arrangement recess 132d. Part of the wire arrangement recess 132d is bounded by a deflection wall section 132a and a deflection bottom section 132b, which will be described later. More precisely, the deflection wall section 132a, which forms the deflection section 132, is arranged along the winding axis direction, and the deflection bottom section 132b, which forms the deflection section 132, is arranged along a direction orthogonal to the winding axis direction (left to right). Furthermore, the wire arrangement recess 132d is designed so that it is open to the front and to the right.

[0062] The deflection section 132 can be divided into two sections (surfaces) arranged on either side of a contact section 132c. In other words, the deflection section 132, as described above, is configured to include the deflection wall section 132a and the deflection base section 132b, and the contact section 132c is arranged between the deflection wall section 132a and the deflection base section 132b. Here, the deflection wall section 132a and the deflection base section 132b denote walls that delimit the wire arrangement recess 132d, and the deflection section 132 denotes walls such as the deflection wall section 132a and the deflection base section 132b, as well as a portion of the base section 130 in the vicinity of these walls. The contact section 132c is the portion of the deflection section 132 with which the coil wire 111 is in contact. In the present embodiment, the contact section 132c is a corner of the rectangular wire arrangement recess 132d.

[0063] As described later, one part and another part (deflection wall section 132a and deflection base section 132b) of the deflection section 132, which are arranged on either side of the contact section 132c, form a predetermined angle around the contact section 132c. In the present embodiment, the angle is essentially 90 degrees, but it is not limited to this. The angle is preferably at least 90 degrees. Furthermore, the angle is preferably at most 180 degrees. The angle can also be less than 90 degrees.

[0064] As an alternative to the present embodiment, it is also possible that the second side section 134 is not notched, and the deflection section 132 is simply an end face of the base section 130 (second side section 134) with which the coil wire 111 comes into contact and where it is deflected. In other words, the angle formed around the contact section 132c by a portion and another portion of the deflection section 132, which are arranged on either side of the contact section 132c, can also be 180 degrees. For example, the second side section 134 can also have an end face that is directed forward or to the right, and the coil wire 111 can be in contact with this end face.

[0065] As described above, the first arrangement section 131 has an opening section with a more closed shape, and the second arrangement section 132 has an opening section with a more open shape. In particular, the angle formed by the deflection section 132 around the contact section 132c in the deflection section 132 is greater than the angle formed by the pair of wall sections (the upright section 131a and the inclined surface section 131b) that bound the notched section 131c. The angle formed by the deflection section 132 around the contact section 132c in the deflection section 132 is the angle formed around the contact section 132c by a part and another part of the deflection section 132 which are arranged on either side of the contact section 132c, and is in particular the angle formed between the deflection wall section 132a and the deflection bottom section 132b.The angle formed by the pair of wall sections that bound the notched section 131c is the angle formed by the upright section 131a and the inclined surface section 131b as described above.

[0066] In this way, the first arrangement section 131, in which a portion of the coil wire 111 is arranged towards the base end, has an opening section with a more closed shape, and the second arrangement section 132, in which a portion of the coil wire 111 is arranged towards the distal end, has an opening section with a more open shape, so that the coil device 100 can be manufactured easily. In other words, when attaching the coil wire 111, which has been pulled out of the coil 110, to the base section 130 in a manufacturing process described later, the coil wire 111 can be guided efficiently. More precisely, sections of the coil wire 111 to be guided can be fixed when arranging the coil wire 111 in the first arrangement section 131.And since the deflection section 132 has a more open shape, guidance errors can be avoided when arranging the coil wire 111 in the deflection section 132, such as the coil wire 111 not being arranged within the wire arrangement recess 132d.

[0067] As in Fig. As shown in Figure 4, the notched section 131 in the present embodiment has an asymmetrical shape. As described above, the notched section 131c is bounded by a pair of wall sections (an upright section 131a and an inclined surface section 131b). The angle formed by one wall section (the upright section 131a) with respect to the first end surface 133a is greater than the angle formed by the other wall section (the inclined surface section 131b) with respect to the first end surface 133a. In other words, the upright section 131a is arranged to rise more steeply with respect to the first end surface 133a, and the inclined surface section 131b is arranged to lie at a shallower angle with respect to the first end surface 133a.

[0068] The angle formed by the respective wall sections that define the notched section 131c with respect to the first end surface 133a is the smaller of the angles formed by the first end surface 133a and the respective wall sections. The first end surface 133a is the end surface in which the notched section 131c is provided in the first side section 133. More precisely, the first end surface 133a is a surface in the end section of the first side section 133 that encloses the end surface of the first side section 133 in a hypothetical case where the notched section 131c is not formed. The first end surface 133a can be a flat surface, as in the present embodiment, but it can also be a curved surface or a narrow surface consisting essentially of a line. According to the present embodiment, the first end surface 133a extends from left to right.

[0069] When viewed in the direction in which the connecting section 111b extends (i.e., essentially in the top-to-bottom direction in the present embodiment), the upright section 131a and the deflecting section 132 (deflection wall section 132a) are arranged such that they are positioned on either side of the connecting section 111b. Accordingly, the two ends of the connecting section 111b can be brought into pressure contact with the base section 130 in different orientations relative to each other (in the present embodiment, in corresponding orientations along the left-to-right direction). Therefore, the guidance of the coil wire 111 is stabilized, so that the coil wire 111, which is guided to the base section 130, is less likely to detach from the base section 130.

[0070] More precisely, as in Fig. 4, in which the coil device 100 is viewed from above, or in Fig. Figure 5, in which the coil assembly 100 is shown viewed from below, shows the upright section 131a and the deflecting wall section 132a arranged such that they face each other across the connecting section 111b. In other words, the upright section 131a and the deflecting wall section 132a are spaced apart from each other by a certain separation distance when viewed in a direction in which the first assembly section 131 and the second assembly section 132 are spaced apart from each other (i.e., essentially in the top-to-bottom direction). It is sufficient for the upright section 131a and the deflecting wall section 132a, which face each other, to have a common directional component, and there is no restriction that the upright section 131a and the deflecting wall section 132a must be substantially parallel.

[0071] Furthermore, in the present embodiment, the coil wire 111 is arranged at the two ends of the connecting section 111b pointing in different directions, with respect to the left-to-right direction. More precisely, the coil wire 111 is, as shown in Fig. As shown in Figure 4, the coil wire 111 is arranged at the base end of the connecting section 111b pointing backwards and to the right. In other words, when viewed in the direction of extension of the connecting section 111b (i.e., viewed from above), the coil wire 111 at the base end of the connecting section 111b has a component extending from the connecting section 111b to the upright section 131a. Fig. 5 shown. In other words, the extension direction of the coil wire 111 at the distal end of the connecting section 111b has a component in a direction from the connecting section 111b to the deflecting wall section 132a when viewed in the extension direction of the connecting section 111b (i.e., viewed from below).

[0072] In the present embodiment, the coil wire 111 is not in contact with the upright section 131a but is spaced apart from it, but the coil wire 111 is in contact with the deflecting wall section 132a. The coil wire 111 (connecting section 111b) can also be in contact with both the upright section 131a and the deflecting wall section 132a (either abutting or in pressure contact) or spaced apart from each of them.

[0073] Viewed from the first covered surface 122 or the second covered surface 123, a portion of the electrode surface 121a is exposed from an end section that includes the first arrangement section 131 and / or the second arrangement section 132 in the base section 130. In other words, a portion of the chip capacitor 120 (a portion that includes the electrode surface 121a) projects further forward in an opening direction (facing forward) of the housing recess 139 than at least a portion of the first side section 133 or the second side section 134, and the electrode surface 121a is positioned further outward in the opening direction than a portion of an end section of the first side section 133 or the second side section 134. “Further outward in the opening direction” means a direction from a center within the coil assembly 100 outward in the opening direction.Accordingly, it is easy to arrange the connecting sections 111b so that they come into contact with the electrode surface 121a.

[0074] In the present embodiment, as in Fig. As shown in Figure 4, when viewed from above (i.e., from above) the first covered surface 122, part of the electrode surface 121a is free from the notched section 131c. In other words, the electrode surface 121a is located further outwards in the opening direction of the housing recess 139 than the bottom section of the notched section 131. Furthermore, as shown in Fig. As shown in Figure 5, when viewed from below (i.e., from below) the second covered surface 123, part of the electrode surface 121a is free from the wire arrangement recess 132d. In other words, the electrode surface 121a is located further outwards in the opening direction of the housing recess 139 than the deflecting bottom section 132b of the wire arrangement recess 132d.

[0075] It should be noted that the exposure of the electrode surface 121a from the base section 130 merely requires that the electrode surface 121a be positioned further outwards than the end section of the base section 130 in a predetermined direction (in the present embodiment, in the forward direction, i.e., in the opening direction of the housing recess 139), and there is no restriction that substantially the entire electrode surface 121a or a part thereof must be visible in a top or bottom view. The fact that the electrode surface 121a is exposed from the base section 130 also includes, for example, the case where the electrode surface 121a, which, as in the present embodiment, has practically no thickness, is visible along a direction orthogonal to the thickness direction of the electrode surface 121a. In this case, no partial area of ​​the electrode surface 121a is visible.Furthermore, the exposure of the electrode surface 121a from the end section of the base section 130 can preferably be determined by a positional relationship between the base section 130 and the electrode surface 121a. In other words, it is possible that the exposure of the electrode surface 121a from the end section of the base section 130 cannot be visually detected due to elements other than the base section 130 and the electrode surface 121a. For example, it is possible that in a top view or a bottom view, the electrode surface 121a exposed by the end section of the base section 130 is obscured by other elements, such as a large-diameter coil wire 111, so that the exposure of the electrode surface 121a cannot be visually detected.

[0076] Furthermore, as stated in Fig. 4 and Fig. As shown in Figure 5 of the present embodiment, the chip capacitor 120 (in particular the electrode surface 121a) does not project further than the first end surface 133a or the second end surface 134a. In other words, the depth of the housing recess 139 (a depth from the first end surface 133a or the second end surface 134a to the housing recess 139) is greater than a dimension of the chip capacitor 120 in a depth direction of the housing recess 139. Alternatively to the present embodiment, the chip capacitor 120 can also project further than the first end surface 133a or the second end surface 134a. In other words, when viewed from above or below, the chip capacitor 120 can also project from the first end surface 133a or the second end surface 134a.

[0077] As described above, in the present embodiment, as in Fig. 3 and Fig. Figure 7 shows the electrode surfaces 121a of the chip capacitor 120 and the connecting sections 111b soldered together using solder material 140. An example of solder material 140 is tin solder.

[0078] As in the Fig. 3, Fig. 6 and Fig. As shown in Figure 7, in the present embodiment the solder material 140 is arranged such that it covers a front surface of the electrodes 121 (electrode surface 121a) or a portion (on the front surface) of the surfaces of the electrodes 121 facing left and right. In other words, in the present embodiment, substantially the entire surface of the electrodes 121 exposed by the base section 130 is covered and protected by the solder material 140. Because the solder material 140 is arranged in this way over several surfaces of the electrodes 121 facing in different directions, the solder material 140 is firmly bonded to the chip capacitor 120.

[0079] As in Fig. As shown in Figure 7, a portion of the solder material 140 is preferably arranged between the coil wire 111 and the first assembly section 131 or the second assembly section 132. Even more preferably, as in the present embodiment, a portion of the solder material 140 is arranged between the coil wire 111 and both the first assembly section 131 and the second assembly section 132. More precisely, a portion of the solder material 140 is arranged in a gap between the coil wire 111, which is arranged in the first assembly section 131, and the first assembly section 131 (in particular the bottom section, the upright section 131a, or the inclined surface section 131b, which form the notched section 131c).Alternatively, a portion of the solder material 140 is arranged in a gap between the coil wire 111, which is arranged in the second arrangement section 132, and the second arrangement section 132 (in particular the deflection wall section 132a or the deflection bottom section 132b). Since the solder material 140 is not only arranged around the electrode surfaces 121a, but is also arranged to penetrate the gap between the coil wire 111 and the first arrangement section 131 or the second arrangement section 132, it prevents the solder material 140 from detaching from the electrode 121 or the connection section 111b.

[0080] In the present embodiment, the coil wire 111, which is arranged in the first assembly section 131 or the second assembly section 132, and the solder material 140 are in contact with each other; however, the coil wire 111 and the solder material 140 can also be spaced apart from each other. Furthermore, in the present embodiment, the solder material 140 and the first assembly section 131 as well as the second assembly section 132 are in contact with each other; however, the solder material 140 and the first assembly section 131 as well as the second assembly section 132 can also each be spaced apart from each other.

[0081] Furthermore, as an alternative to the present embodiment, a gap section can also be provided between the coil wire 111 and the first assembly section 131 and the second assembly section 132, in which no soldering material 140 is arranged. Furthermore, an adhesive other than the soldering material 140 described above can also be provided. As an alternative to the present embodiment, the connecting sections 111b and the electrode surfaces 121a can also be connected without soldering or the like, and the connecting sections 111b and the electrode surfaces 121a can also be electrically connected to each other simply by coming into contact or touching each other.

[0082] As in Fig. As shown in Figure 1, the chip capacitor 120 is arranged on one side (front) of the coil 110 in the direction of the winding axis of the coil 110 (direction from back to front). Furthermore, the second covered surface 123, which is covered by the second side section 134, extends in the direction of the winding axis and in the direction of the width of the coil device 100 (direction from left to right).

[0083] As in Fig. As shown in Figure 3, the second side section 134 has the fastening section 135 to which the distal end of the coil wire 111 is attached. According to the present embodiment, the fastening section 135 is a connecting section to which the distal end of the coil wire 111 is connected and to which it is attached. More precisely, the fastening section 135 is designed to project upwards from a surface (the top) of the base section 130. As shown in Figure 3, the fastening section 135 is designed to project upwards from a surface (the top) of the base section 130. Fig. As shown in Figure 6, a projecting end of the fastening section 135 has a flange that is thicker than a base end of the fastening section 135 (than the part to which the coil wire 111 is connected).

[0084] As in Fig. As shown in Figure 3, at least part of the fastening section 135, when viewed in the direction of the winding axis, is formed more towards the center in the second side section 134 than the second arrangement section 132, with respect to the width of the coil device 100. Preferably, the fastening section 135, when viewed in the direction of the winding axis, is formed approximately in the middle with respect to the width of the coil device 100 in the second side section 134.

[0085] Viewed along the winding axis, the shape of the coil 110 in the present embodiment is essentially circular, and the outline of the coil 110, viewed along the winding axis, is most convex in its width (in the left-to-right direction) essentially at the center of the coil assembly 100. In other words, the dimension of the coil 110, viewed along the winding axis (dimension in the top-to-bottom direction), is greatest in the width direction at this point. In contrast, the mounting section 135, which is designed to project from a portion of the base section 130, occupies a predetermined space.By arranging the mounting section 135 in the middle instead of at the end, in the direction of the width of the coil device 100, the outer shape of the base section, when viewed in the direction of the winding axis, is prevented from deviating too much from the outer contour of the coil 110. Accordingly, the volume of the coil device 100 can be kept small, and the coil device 100 can be made smaller.

[0086] If the second side section 134 extends in the direction of the winding axis (front to back) and in the direction of the thickness of the coil device 100 (top to bottom), then the fastening section 135 is preferably formed more towards the center with respect to the second side section 134 than the second arrangement section 132. In this case, the top to bottom direction can also be considered the width direction of the coil device 100.

[0087] Alternatively to the present embodiment, the fastening section 135 can also be part of the base section 130, to which one end of the coil wire 111 is simply attached by gluing, welding, soldering or another joining method.

[0088] In the present embodiment, the second extended section 111a2 is also attached to the base section 130 and directly connected to the electrode surface 121a, similar to the first extended section 111a1.

[0089] More precisely, partial length sections (connection sections 111b) of the second projected section 111a2 are soldered and connected to the electrode surface 121a by the soldering material 140. The connection section 111b extends between the second notched section 136 and the second deflection section 137, which is provided in the base section 130. The second notched section 136 is a notch formed in the second side section 134 and has a similar shape to the notched section 131. The second deflection section 137 is a recess formed in the first side section 133 and has a similar shape to the deflection section 132. A distal end of the second projected section 111a2 is connected to and attached to a second fastening section 138 formed in the first side section 133.The second fastening section 138 is designed in a similar shape to the fastening section 135.

[0090] The coil device 100 can further comprise a housing (not shown) in which the coil 110, the base section 130 and the chip capacitor 120 are accommodated. The housing according to the present embodiment has a cylindrical shape that is elongated in the direction of the winding axis. (Chip capacitor holder)

[0091] The base section 130 can also be provided separately from the chip capacitor 120 and the coil 110 as a holder for holding the chip capacitor 120.

[0092] The chip capacitor holder (base section 130) has a mounting section (housing recess 139) for mounting a chip capacitor, the first side section 133 and the second side section 134. The first side section 133 and the second side section 134 are spaced apart from each other by the mounting section and face each other.

[0093] The notched section 131c is formed on the end face of the first side section 133. Another notched section (the wire arrangement recess 132d) is formed on the end face of the second side section 134. The notched section 131c and the wire arrangement recess 132d overlap when viewed in the direction in which the first side section 133 and the second side section 134 are spaced apart (i.e., essentially in the top-to-bottom direction). It is sufficient if at least a portion of the notched section 131c and at least a portion of the wire arrangement recess 132d overlap when viewed in the aforementioned direction in which the side sections are spaced apart. With such a mounting, the chip capacitor 120 can be held, and the coil wire 111 can be arranged appropriately. (Method for manufacturing a coil device)

[0094] The following describes a method for manufacturing the coil device 100 according to the present embodiment (hereinafter also referred to as the "present method").

[0095] First, an overview of the present procedure is described.

[0096] As described above, the coil device 100 produced by the present method comprises: the coil 110 around which the coil wire 111 is wound; the chip capacitor 120, which is electrically connected to the coil 110 and which has the electrode surface 121a; and the base section 130, which holds the chip capacitor 120.

[0097] In the present method, the coil wire 111 is led out of the coil 110 and the connecting section 111b is directly connected to the electrode surface 121a. Since the coil wire 111 and the electrode surface 121a are directly connected, the coil device 100 can be manufactured more easily, the manufacturing costs of the coil device 100 can be reduced, and / or the coil device 100 can be made smaller.

[0098] In particular, the connecting section 111b is arranged such that it extends from the first arrangement section to the second arrangement section. As described above, the first arrangement section 131 and the deflection section 132 are parts of the base section 130 and are arranged on either side of a portion of the electrode surfaces. The connecting section 111b is arranged such that it comes into pressure contact with the electrode surface 121a, and in this state, the connecting section 111b is connected to the electrode surface 121a. Because the connecting section 111b is brought into pressure contact with the electrode surface 121a, it is easy to connect the connecting section 111b and the electrode surface 121a together.

[0099] Next, the present procedure will be described in detail.

[0100] First, the coil wire 111 (first exposed section 111a1) pulled out of the coil 110 is guided or laid as follows. When guiding or laying the coil wire 111, a certain tension is preferably applied so that the laid coil wire 111 does not sag.

[0101] As in Fig. As shown in Figure 4, the first exposed section 111al extends forward from the winding section of the coil wire 111 along a surface of the first side section 133. More precisely, the first exposed section 111a1 extends forward and to the left from the winding section of the coil 110. In other words, the direction of extension of a portion of the first exposed section 111al, which is arranged along the surface of the first side section 133, has, in addition to a component in the direction of the winding axis (direction from front to back), also a component in the direction from right to left.

[0102] After the first extended section 111al has been extended to the first arrangement section 131, which is the notch section 131, it is deflected around the first arrangement section 131. More precisely, as in Fig. As shown in Figure 3, the first extended section 111al is bent so that it passes through the interior of the notched section 131c and extends downwards from there to the second arrangement section 132. If the first extended section 111al is deflected at the first arrangement section 131, it can come into pressure contact with the first arrangement section 131 (in particular the upright section 131a or the inclined surface section 131b). As shown in Fig. As shown in Figure 7, the first brought-out section 111al is bent twice in a process in which it is brought out of the first arrangement section 131 to the second arrangement section 132, each time coming into contact with one of the two corners of the chip capacitor 120.

[0103] After the first extended section 111a1 extends to the second arrangement section 132, which is the deflection section 132, it is deflected by the deflection section 132. More precisely, as shown in Fig. As shown in Figure 5, the first exposed section 111al passes through the wire arrangement recess 132d and is led out towards the fastening section 135. Accordingly, the first exposed section 111a1 (connecting section 111b) (see Figure 5) Fig. 6 or Fig. 7)), which differs from the first order section 131 (see Fig. 6 or Fig. 7) extends to the second arrangement section 132, in pressure contact with the electrode surface 121a of the chip capacitor 120. Furthermore, if the first brought-out section 111al is deflected at the deflection section 132, the first brought-out section 111al can come into pressure contact with the deflection section 132.

[0104] As described above, the first extended section 111a1 is extended towards the fastening section 135. In the present embodiment, the first extended section 111a1 is extended rearward and to the left along a surface of the second side section 134. In other words, a portion of the first extended section 111a1 along the surface of the second side section 134 has a front-to-back component and a right-to-left component. The first extended section 111a1, extending to the fastening section 135, is connected to and fastened to the fastening section 135.

[0105] As an alternative to the present embodiment, the coil wire 111 can also be guided or laid in a procedure that is the reverse of the procedure described above. In other words, the coil wire 111 can first be attached to the fastening section 135, then guided or laid through the base section 130, and subsequently the coil wire 111 can be wound around the winding core 112.

[0106] The second section 111a2 can be routed or relocated in a similar manner to the first section 111al. More precisely, as in Fig. As shown in Figure 5, the second projecting section 111a2 is projected forward to the second notched section 136 and deflected upwards at the second notched section 136. Furthermore, as shown in Fig. Figure 3 shows the second brought-out section 111a2 being brought out towards the second deflection section 137, while it is in contact with the electrode surface of the chip capacitor 120. The second brought-out section 111a2 is deflected at the second deflection section 137 and attached to the second mounting section 138.

[0107] Next, the connecting sections 111b of the coil wire 111 are connected to the electrode surfaces 121a. In the present embodiment, the coil wire 111 and the connecting sections 111b are joined by the solder material 140. In the present embodiment, the solder material 140 is not only, as in Fig. 3 shown, arranged on the front of the electrode surfaces 121a, but also outside the chip capacitor 120 (electrode 121) in the direction from left to right, as shown in Fig. 6 shown. Furthermore, as in Fig. As shown in Figure 7, at least part of the connection sections 111b are embedded in the solder material 140. As described above, part of the solder material 140 is arranged in the gaps between the coil wire 111 and the first arrangement section 131 or the deflection section 132. Furthermore, in the present embodiment, part of the solder material 140 is arranged such that it penetrates the gap between the first side section 133 and the first covered surface 122, as well as the gap between the second side section 134 and the second covered surface 123. Alternatively, however, it is also possible for the solder material 140 to be arranged only on the surface of the electrode surfaces 121a.

[0108] Soldering can be carried out by immersing parts of the connection sections 111b and the chip capacitor 120 in a tank filled with molten solder 140, such as a solder bath. Alternatively, soldering can be carried out by applying the molten solder 140 to the chip capacitor 120 and the connection sections 111b. Another method is to first apply and solidify the solder 140 onto the surface of the electrode surface 121a, and then, after positioning the coil wire 111 so that it is in pressure contact with the solder 140, melt the solder 140.

[0109] After soldering, the coil wire 111 can be in pressure contact with the chip capacitor (in particular a corner or the electrode surface 121a) or the base section 130 (in particular the first arrangement section 131 or the second arrangement section 132) or simply rest against it.

[0110] As an alternative to the present embodiment, the connecting sections 111b and the electrode surfaces 121a can also be electrically connected to one another by methods other than soldering. In particular, the connecting sections 111b and the electrode surfaces 121a can also be connected to one another using a connecting material other than the solder material 140. Alternatively, the connecting sections 111b can also be welded to the electrode surfaces 121a. Furthermore, the connecting sections 111b and the electrode surfaces 121a can also be brought into engagement with one another by forming a recess on the electrode surfaces 121a and fitting the connecting sections 111b into the recess or the like.Alternatively, the connecting sections 111b can also be brought into pressure contact with the electrode surfaces 121a and attached to them, and the connecting sections 111b and the electrode surfaces 121a can be connected to each other through this contact. <Zweite Ausführungsform>

[0111] Fig. Figure 8A is an enlarged top view showing an example of a first arrangement section 131 in a coil device 100 according to the present embodiment.

[0112] First, an overview of the coil device 100 according to the present embodiment is described.

[0113] As in the first embodiment, the coil device 100 comprises a coil 110 and a chip capacitor 120. A coil wire is wound around the coil 110. The chip capacitor 120 is electrically connected to the coil 110 and has electrode surfaces 121a. The electrode surfaces 121a are surfaces of electrodes of the chip capacitor 120. Connecting sections 111b are partial lengths of the coil wire 111 that extend out of the coil 110. The connecting sections 111b are each directly connected to the electrode surfaces 121a.

[0114] The coil device 100 further comprises a base section 130 which holds the chip capacitor 120. The base section 130 has a first side section 133 and a second side section 134. The first side section 133 covers a first covered surface 122 of the surface of the chip capacitor 120. The second side section 134 covers a second covered surface 123 of the surface of the chip capacitor 120.

[0115] The connecting section 111b of the coil wire 111 extends between a first arrangement section 131 and a second arrangement section 132. The first arrangement section 131 and the second arrangement section 132 are arranged on either side of a portion of the chip capacitor 120. The first arrangement section 131 and the second arrangement section 132 are formed on the first side section 133 and the second side section 134, respectively.

[0116] Next, the coil device 100 according to the present embodiment will be described in detail.

[0117] Similar to the first embodiment, the first arrangement section 131 is part of the base section 130 (notch section 131) that defines a notched section 131c through which the coil wire 111 passes.

[0118] The coil device 100 according to the present embodiment differs from the first embodiment described above in that the width of the notched section 131c, formed by the notched section 131, narrows towards an opening section of the notched section 131c. In other words, the notched section 131c according to the present embodiment has a narrowed opening section. More precisely, the width at the opening section of the notched section 131 (i.e., the distance between the parts of the notched section 131) is smaller than the width of the notched section 131c at a predetermined position in the front-to-back direction. Preferably, the opening width of the opening section of the notched section 131 is smaller than the diameter of the coil wire 111.Accordingly, it can be prevented that the coil wire 111 detaches from the notched section 131, and the connection between the connecting sections 111b and the electrode surfaces 121a can be advantageously maintained.

[0119] In the present embodiment, the notched section 131 is spaced apart from the predominant part of the circumferential surface of the coil wire 111, but it is not limited to this area. The notched section 131 can be arranged such that it comes into surface contact with or abuts a portion of the circumferential surface of the coil wire 111. When the notched section 131 is arranged in this way in contact with the coil wire 111, it can hold the coil wire 111 more effectively.

[0120] In the present embodiment, the notched section 131c is bounded by a first wall section forming a left side of the notched section 131c, a second wall section forming a right side of the notched section 131c, and a bottom section. A portion on the side of the bottom section of the first wall section (the inclined surface section 131b) and a portion on the side of the bottom section of the second wall section (the upright section 131a) differ from each other with respect to the angles formed with respect to the first end surface 133a. In particular, similarly to the first embodiment, the angle formed by the upright section 131a with respect to the first end surface 133a is greater than the angle formed by the inclined surface section 131b with respect to the first end surface 133a.

[0121] The notched section 131 according to the present embodiment can be formed as follows. For example, a wide notched section 131c is first formed in the base section 130, and the coil wire 111 is arranged within the notched section 131c. Subsequently, a shape of the notched section 131 according to the present embodiment can be formed by deforming an opening end of the notched section 131 to narrow the opening end, by applying a mechanical stress to the opening end of the notched section 131, or by shaping the opening end by applying heat, or the like. If the opening end of the notched section 131 is shaped by applying heat, the heat from the solder material 140, with which the connecting sections 111b and the electrode surfaces 121a are soldered together, can also be used for this purpose.In other words, the opening end of the notched section 131 can be deformed by bringing the opening end of the notched section 131 close to the heated solder material 140 or by immersing the opening end of the notched section 131 into the heated solder material 140. Alternatively, the notched section 131c can be pre-formed with a narrowed opening in the base section 130, and the coil wire 111 can be pressed into the notched section 131c by pressing the coil wire 111 against the opening section of the notched section 131.

[0122] The chip capacitor 120 is arranged further to one side (forward) than the coil 110 in the direction of the winding axis of the coil 110. Furthermore, the connecting sections 111b are arranged on a surface of the electrode surface 121a that faces forward. In the present embodiment, the electrode surface 121a is arranged further forward than the coil wire 111, which is arranged in the first arrangement section 131 or the second arrangement section 132. Accordingly, the coil wire 111 (connecting section 111b) can advantageously be brought into contact with the electrode surface 121a.

[0123] Here, coil wire 111, which is arranged in the first arrangement section 131 or the second arrangement section 132, in particular a coil wire 111 which is in contact with the bottom section of the notch section 131 or a surrounding area thereof, or a coil wire 111 which is in contact with the deflecting bottom section 132b (see Fig. 5 according to the first embodiment) of the deflection section 132 or its vicinity. In other words, the electrode surface 121a is arranged further forward than the bottom section of the notch section 131 or the deflection bottom section 132b (see Figure 5). Fig. 5) of the deflection section 132.

[0124] In a similar manner to the coil device 100 according to the first embodiment, the coil device 100 according to the present embodiment has the following properties.

[0125] In the present embodiment, the electrode surfaces 121a of the chip capacitor 120 and the connecting sections 111b are soldered together by the solder material 140. A portion of the solder material 140 is arranged between the coil wire 111 and the first assembly section 131 as well as the second assembly section 132.

[0126] The chip capacitor 120 is arranged on one side (front) of the coil 110 in the direction of the winding axis of the coil 110 (front to back). The second covered surface 123, which is covered by the second side section 134, extends in the direction of the winding axis. The second side section 134 has the mounting section 135, to which one end of the coil wire 111 is attached. When viewed in the direction of the winding axis, the mounting section 135 is positioned more towards the center of the second side section 134 than the second mounting section 132, relative to the width of the coil assembly 100.

[0127] Furthermore, similar to the first embodiment, the base section 130 according to the present embodiment can be provided separately from the coil 110 and the like.

[0128] The chip capacitor holder (base section 130) has a mounting section (housing recess 139) for mounting a chip capacitor, the first side section 133 and the second side section 134. The first side section 133 and the second side section 134 are spaced apart from each other by the mounting section and face each other.

[0129] The notched section 131c is formed on the end face of the first side section 133. Another notched section (the wire arrangement recess 132d) is formed on the end face of the second side section 134. The notched section 131c and the wire arrangement recess 132d overlap when viewed in the direction in which the first side section 133 and the second side section 134 are spaced apart (i.e., in the top-to-bottom direction).

[0130] The coil device 100 is manufactured in a similar manner to the first embodiment according to the present embodiment by the following method.

[0131] The coil wire 111 is led out of the coil 110 and the connecting sections 111b are each directly connected to the electrode surfaces 121a.

[0132] In particular, the connecting section 111b is arranged such that it extends from the first arrangement section to the second arrangement section. As described above, the first arrangement section 131 and the deflection section 132 are parts of the base section 130 and are arranged on either side of a portion of the electrode surfaces. The connecting section 111b is arranged such that it comes into pressure contact with the electrode surface 121a, and in this state, the connecting section 111b is connected to the electrode surface 121a. <Dritte Ausführungsform>

[0133] Fig. Figure 8B is an enlarged top view showing an example of a first arrangement section 131 in a coil device 100 according to the present embodiment.

[0134] First, an overview of the coil device 100 according to the present embodiment is described.

[0135] As in the first embodiment, the coil device 100 comprises a coil 110 and a chip capacitor 120. A coil wire is wound around the coil 110. The chip capacitor 120 is electrically connected to the coil 110 and has electrode surfaces 121a. The electrode surfaces 121a are the surfaces of electrodes of the chip capacitor 120. Connecting sections 111b are partial lengths of the coil wire 111 that extend out of the coil 110. The connecting sections 111b are each directly connected to the electrode surfaces 121a.

[0136] The coil device 100 further comprises a base section 130 which holds the chip capacitor 120. The base section 130 has a first side section 133 and a second side section 134. The first side section 133 covers a first covered surface 122 of the surface of the chip capacitor 120. The second side section 134 covers a second covered surface 123 of the surface of the chip capacitor 120.

[0137] The connecting section 111b of the coil wire 111 extends between a first arrangement section 131 and a second arrangement section 132. The first arrangement section 131 and the second arrangement section 132 are arranged on either side of a portion of the chip capacitor 120. The first arrangement section 131 and the second arrangement section 132 are formed on the first side section 133 and the second side section 134, respectively.

[0138] Next, the coil device 100 according to the present embodiment will be described in detail.

[0139] The coiling device 100 according to the present embodiment differs from the first and second embodiments described above in that a portion of the coil wire 111, which is arranged in the first assembly section 131, is surrounded by the base section 130. The first assembly section 131 according to the present embodiment is a hole-forming section 131 that forms a hole section 131c into which the coil wire 111 is to be inserted. In the present embodiment, the first assembly section 131 that forms the hole section 131c has a cut on a front face. In other words, there is essentially no gap between portions of the first assembly section 131 that form the hole section 131c, and the portions are in contact with each other on the front face of the hole section 131c.Instead of the present embodiment, the first arrangement section 131 can integrally form the circumference of the hole section 131c without a cut.

[0140] Since the coil wire 111 passes through the hole section 131c in this way, it is prevented from detaching from the base section 130, and the connection between the connecting sections 111b and the electrode surfaces 121a is advantageously maintained.

[0141] In the present embodiment, the hole section 131c is bounded by a first circumferential wall section forming a left side of the hole section 131c and a second circumferential wall section forming a right side of the hole section 131c. A portion on the rear side of the first circumferential wall section (the inclined surface section 131b) and a portion on the rear side of the second circumferential wall section (the upright section 131a) differ from each other with respect to the angles formed with respect to the first end surface 133a. In particular, similarly to the first embodiment, the angle formed by the upright section 131a with respect to the first end surface 133a is greater than the angle formed by the inclined surface section 131b with respect to the first end surface 133a.

[0142] The hole formation section 131 according to the present embodiment can be formed in a similar manner to the second embodiment. More precisely, a wide notched section is first formed in the base section 130, and the coil wire 111 is arranged within the notched section. Subsequently, the hole section 131c according to the present embodiment can be formed by deforming an opening end of the notched section to close the opening end by applying a mechanical stress to the opening end of the notched section, or by shaping the opening end by applying heat, or the like. Alternatively, the hole section 131c can also be formed by closing the opening section of the notched section by further applying a plastic material to the opening end of the notched section.Alternatively, the hole formation section 131 can be formed in the base section 130, and the coil wire 111 can be inserted into the hole section 131c if the coil wire 111 is guided or laid in the base section 130.

[0143] The chip capacitor 120 is arranged further to one side (forward) than the coil 110 in the direction of the winding axis of the coil 110. Furthermore, the connecting sections 111b are arranged on a surface of the electrode surface 121a that faces forward. In the present embodiment, the electrode surface 121a is arranged further forward than the coil wire 111, which is arranged in the first arrangement section 131 or the second arrangement section 132. Accordingly, the coil wire 111 (connecting section 111b) can advantageously be brought into contact with the electrode surface 121a.

[0144] Here, the coil wire 111, which is arranged in the first arrangement section 131 or the second arrangement section 132, in particular refers to a coil wire 111 which is arranged in contact with the hole section or a surrounding area thereof, or a coil wire 111 which is in contact with the deflecting bottom section 132b (see Fig. 5 according to the first embodiment) of the deflection section 132 or its vicinity. In other words, the electrode surface 121a is arranged further forward than the hole section 131c, which is located in the hole formation section 131 or the deflection base section 132b (see Figure 5). Fig. 5) of the deflection section 132 is limited.

[0145] In a similar manner to the coil device 100 according to the first embodiment, the coil device 100 according to the present embodiment has the following properties.

[0146] In the present embodiment, the electrode surfaces 121a of the chip capacitor 120 and the connecting sections 111b are soldered together by the solder material 140. A portion of the solder material 140 is arranged between the coil wire 111 and the first assembly section 131 as well as the second assembly section 132.

[0147] The chip capacitor 120 is arranged on one side (front) of the coil 110 in the direction of the winding axis of the coil 110 (front to back). The second covered surface 123, which is covered by the second side section 134, extends in the direction of the winding axis. The second side section 134 has the mounting section 135, to which one end of the coil wire 111 is attached. When viewed in the direction of the winding axis, the mounting section 135 is positioned more towards the center of the second side section 134 than the second mounting section 132, relative to the width of the coil assembly 100.

[0148] Furthermore, similar to the first embodiment, the base section 130 according to the present embodiment can be provided separately from the coil 110 and the like.

[0149] The chip capacitor holder (base section 130) has a mounting section (housing recess 139) for mounting a chip capacitor, the first side section 133 and the second side section 134. The first side section 133 and the second side section 134 are spaced apart from each other by the mounting section and face each other.

[0150] A notched section is formed on the end face of the first side section 133. Another notched section (a space bounded by the deflection section 132) is formed on the end face of the second side section 134. The notched section and the other notched section overlap when viewed in a direction in which the first side section 133 and the second side section 134 are spaced apart.

[0151] The coil device 100 according to the present embodiment can be manufactured by the following method in a similar manner to the first embodiment.

[0152] The coil wire 111 is led out of the coil 110 and the connecting sections 111b are each directly connected to the electrode surfaces 121a.

[0153] More precisely, the connecting section 111b is arranged such that it extends from the first arrangement section to the second arrangement section. As described above, the first arrangement section 131 and the deflection section 132 are parts of the base section 130 and are arranged on either side of a portion of the electrode surfaces. The connecting section 111b is arranged such that it comes into pressure contact with the electrode surface 121a, and in this state, the connecting section 111b is connected to the electrode surface 121a.

[0154] The present invention is not limited to the embodiments described above and also includes various modifications, improvements, and the like, provided that the problem of the present invention is solved. Hereinafter, the first to third embodiments may also be collectively referred to as "the present embodiment".

[0155] The modifications described below can be combined with each other in a suitable manner.

[0156] While in the present embodiment the coil wire 111 is in contact with the deflecting section 132 (in particular the contact section 132c), the coil wire 111 can also be spaced apart from the deflecting section 132. In this case as well, the coil wire 111 is preferably bent in a portion near the deflecting section 132. Furthermore, the deflecting section 132 preferably forms a predetermined angle around a portion near the bent portion of the coil wire 111 (a portion which, in the embodiments described above, corresponds to the contact section 132c), and the angle is preferably larger than the angle formed between a pair of wall sections that bound the notched section 131c.

[0157] The embodiments described above cover the following technical ideas. (1) Coil device comprising: a coil around which a coil wire is wound; and a chip capacitor electrically connected to the coil and having an electrode surface, wherein a connecting section, which is a partial length of the coil wire that is led out of the coil, is directly connected to the electrode surface. (2) Coil device according to (1), further comprising: a base section holding the chip capacitor, wherein the base section has a first side section covering a portion of the surface of the chip capacitor, and a second side section covering another portion of the surface of the chip capacitor, and the connecting section of the coil wire extends from a first arrangement section to a second arrangement section, which are arranged on both sides of a part of the chip capacitor and which are formed respectively in the first side section and in the second side section. (3) Coil device according to (2), wherein the first arrangement section is a part of the base section which defines a notched section through which the coil wire is passed, the second arrangement section is a deflection section with which the coil wire comes into contact and at which it is bent, and the angle formed by the deflection section at the point where the coil wire is in contact with the deflection section is greater than the angle formed by a pair of wall sections that bound the notched section. (4) Coil device according to (3), wherein the angle formed by one of the wall sections with an end face of the first side section on which the notched section is provided is greater than the angle formed by the other of the wall sections with the end face of the first side section, and one of the wall sections and the deflection section are arranged such that they lie on both sides of the connecting section when viewed in the direction of extension of the connecting section. (5) Coil device according to any one of (2) to (4), wherein a part of the electrode surface is free with respect to one sub-area or the other sub-area from an end section comprising the first arrangement section and / or the second arrangement section in the base section. (6) Coil device according to (2), wherein the first arrangement section is a part of the base section which defines a notched section through which the coil wire is passed, and the width of the notched section becomes narrower towards an opening section of the notched section. (7) Coil device according to (2), wherein a circumference of a part of the coil wire arranged in the first arrangement section is covered by the base section. (8) Coil device according to (6) or (7), wherein the chip capacitor is arranged more on one side in the direction of the winding axis of the coil than the coil, the connecting section is arranged on a surface of the electrode surface that faces one side, and the electrode surface is arranged further towards one side than the first arrangement section or the second arrangement section. (9) Coil device according to any one of (2) to (8), wherein the electrode surface of the chip capacitor and the connecting section are soldered together by means of a soldering material, and a portion of the solder material is arranged between the coil wire and the first assembly section or the second assembly section. (10) Coil device according to any one of (2) to (9), wherein the chip capacitor is arranged on one side of the coil in the direction of the winding axis of the coil, the other sub-area, which is covered by the second side section, extends in the direction of the winding axis, the second side section has a fastening section to which one end of the coil wire is attached, and The fastening section, when viewed in the direction of the winding axis, is formed more towards the center in the second side section than the second arrangement section, with respect to the width of the coil device. (11) Chip capacitor holder, comprising: a mounting section for mounting a chip capacitor; and a first side section and a second side section, which are spaced apart from each other by the assembly section and facing each other, wherein a notched section is formed on an end face of the first side section, a further notched section is formed on an end face of the second side section, and The notched section and the further notched section overlap when viewed in a direction in which the first side section and the second side section are spaced apart. (12) Method for manufacturing a coil device comprising a coil around which a coil wire is wound and a chip capacitor electrically connected to the coil and having an electrode surface, wherein the coil wire is led out of the coil and a connecting section, which is a partial length region of the led-out coil wire, is directly connected to the electrode surface. (13) Method for manufacturing a coil device according to (12), wherein the coil device further comprises a base section that holds the chip capacitor, wherein the connecting section of the coil wire is arranged such that it extends between a first arrangement section and a second arrangement section, which are parts of the base section and which are arranged on either side of a part of the electrode surface, and the connecting section is connected to the electrode surface in a state in which the connecting section is arranged so that it comes into pressure contact with the electrode surface. REFERENCE MARK LIST 100 coil device 110 coil 111 coil wire 111a1 first extracted section 111a2 second extracted section 111b Connecting section 112 winding core 120 chip capacitor 120 chip capacitor 121 Electrode 121a Electrode area 122 first covered surface 123 second covered surface 130 Base section 131 first arrangement section, notch section, hole section 131a upright section 131b inclined surface section 131c notched section 132 second arrangement section, deflection section 132a Deflection wall section 132b Deflection floor section 132c Contact section 132d wire arrangement recess 133 first page section 133a first end surface 134 second page section 134a second end surface 135 Fastening section 136 second notched section 136a second upright section 136b second inclined surface section 137 second deflection section 137a second deflection wall section 137b second deflection floor section 138 second fastening section 139 Case recess 140 soldering materials QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] WO 2017 / 208828 A

[0003]

Claims

[1] Coil device comprising: a coil around which a coil wire is wound; and a chip capacitor electrically connected to the coil and having an electrode surface, wherein a connecting section, which is a partial length of the coil wire extending out of the coil, is directly connected to the electrode surface. [2] Coil device according to claim 1, further comprising: a base section that holds the chip capacitor, wherein the base section has a first side section covering a portion of the surface of the chip capacitor, and a second side section covering another portion of the surface of the chip capacitor, and the connecting section of the coil wire extends from a first arrangement section to a second arrangement section, which are arranged on both sides of a part of the chip capacitor and which are formed respectively in the first side section and in the second side section. [3] Coil device according to claim 2, wherein the first arrangement section is a part of the base section that delimits a notched section through which the coil wire is passed, the second arrangement section is a deflection section with which the coil wire comes into contact and at which it is bent, and the angle formed by the deflection section at the point where the coil wire is in contact with the deflection section is greater than the angle formed by a pair of wall sections that bound the notched section. [4] Coil device according to claim 3, wherein the angle formed by one of the wall sections with an end face of the first side section on which the notched section is provided is greater than the angle formed by the other of the wall sections with respect to the end face of the first side section, and the one of the wall sections and the deflecting section are arranged such that they lie on both sides of the connecting section when viewed in the extension direction of the connecting section. [5] Coil device according to one of claims 2 to 4, wherein a part of the electrode surface is free with respect to one sub-area or the other sub-area from an end section which comprises the first arrangement section and / or the second arrangement section in the base section. [6] Coil device according to claim 2, wherein the first arrangement section is a part of the base section that delimits a notched section through which the coil wire is passed, and the width of the notched section becomes narrower towards an opening section of the notched section. [7] Coil device according to claim 2, wherein a circumference of a part of the coil wire arranged in the first arrangement section is covered by the base section. [8] Coil device according to claim 6 or 7, wherein the chip capacitor is arranged further to one side in the direction of the winding axis of the coil than the coil, the connecting section is arranged on a surface of the electrode surface that faces one side, and the electrode surface is arranged further towards one side than the first arrangement section or the second arrangement section. [9] Coil device according to one of claims 2 to 8, wherein the electrode surface of the chip capacitor and the connecting section are soldered together by means of a soldering material, and a part of the soldering material is arranged between the coil wire and the first arrangement section or the second arrangement section. [10] Coil device according to one of claims 2 to 9, wherein the chip capacitor is arranged on one side of the coil in the direction of the winding axis of the coil, the other sub-area, which is covered by the second side section, extends in the direction of the winding axis, the second side section has a fastening section to which one end of the coil wire is attached, and The fastening section, when viewed in the direction of the winding axis, is formed more towards the center in the second side section than the second arrangement section, with respect to the width of the coil device. [11] Chip capacitor holder, comprising: a mounting section for mounting a chip capacitor; and a first side section and a second side section, which are spaced apart from each other by the assembly section and facing each other, wherein a notched section is formed on an end face of the first side section, a further notched section is formed on an end face of the second side section, and The notched section and the further notched section overlap when viewed in a direction in which the first side section and the second side section are spaced apart. [12] Method for manufacturing a coil device comprising a coil around which a coil wire is wound and a chip capacitor which is electrically connected to the coil and which has an electrode surface, wherein the coil wire is brought out of the coil and a connecting section, which is a partial length region of the brought-out coil wire, is directly connected to the electrode surface. [13] Method for manufacturing a coil device according to claim 12, wherein the coil device further comprises a base section that holds the chip capacitor, wherein the connecting section of the coil wire is arranged such that it extends between a first arrangement section and a second arrangement section, which are parts of the base section and which are arranged on either side of a part of the electrode surface, and the connecting section is connected to the electrode surface in a state in which the connecting section is arranged so that it comes into pressure contact with the electrode surface.

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