PRINTED CIRCUIT BOARD AND POWER CONVERSION DEVICE

Abstract

A printed circuit board and a power conversion device are provided to prevent a short circuit or insulation fault between the fuse terminals after a fuse blows due to an overcurrent or the like, in the event of an abnormality. The printed circuit board (10) comprises a substrate (2) with a through-hole (3a) and a fuse (1) positioned opposite the through-hole (3a) and connected to the substrate (2) via a connection terminal (1b), the fuse (1) being positioned at an interval from the substrate (2) such that a space (8) is formed.

Description

Technical field

[0001] The present application relates to the field of printed circuit boards and power conversion devices. State of the art

[0002] Up to now, with regard to a printed circuit board in which a pattern fuse is provided together with a conductive pattern, a printed circuit board has been proposed in which an insulating hole is provided in a direction following the pattern fuse in a position lateral to the pattern fuse so that no insulation fault occurs after the pattern fuse melts (for example, see patent literature 1).

[0003] When a pattern fuse melts, the copper foil or solder that is one of the components of the pattern fuse evaporates due to the heat or liquefies and spreads, but the dispersed components can re-adhere to the circuit board. Furthermore, if the components adhere between adjacent patterns, a short circuit occurs between the adjacent patterns, resulting in an insulating fault. Consequently, the conventional printed circuit board disclosed in patent literature 1 is designed such that an insulating hole is provided in a direction following the pattern fuse at a position lateral to the pattern fuse to prevent an insulating fault between adjacent patterns. Citation list for patent literature

[0004] PTL 1: JP H07 - 30213 A Summary of the invention: Technical problem

[0005] The conventional printed circuit board disclosed in patent literature 1 has the problem that, while it can prevent an insulation fault between adjacent patterns, it cannot prevent a short circuit or insulation fault between fuse terminals after a fuse has blown. Therefore, if fuse terminals are short-circuited by a conductive foreign object or the like after a pattern fuse has blown due to a high current caused by a circuit abnormality or the like, the high current will continue to flow.There is also the problem that if a printed circuit board is mounted, for example, in a power conversion device, a short circuit or insulation fault between fuse terminals caused by a foreign body generated by a part mounted in the power conversion device cannot be prevented in the same way.

[0006] The present application was filed to disclose a technology for solving the above-mentioned problem, and the objective of the present application is to provide a printed circuit board and a power conversion device with which a short circuit or insulation fault between fuse terminals can be prevented after a fuse has blown due to an overcurrent or the like when an abnormality occurs. Solution to the problem

[0007] A printed circuit board disclosed in the present application comprises a substrate with a through-hole and a fuse arranged opposite the through-hole and attached to the substrate via a connecting terminal, wherein the fuse is separated from the substrate by an interval, forming a space.

[0008] A power conversion device disclosed in the present application also comprises the printed circuit board, a cooler arranged above the circuit board with a coolant channel inside it, and a shielding plate arranged between the circuit board and the cooler. Advantageous effects of the invention

[0009] According to a printed circuit board and a power conversion device disclosed in the present application, a short circuit or insulation fault between fuse terminals can be prevented after a fuse has blown due to an overcurrent or the like when an abnormality occurs. Brief description of the drawings [ Fig. 1] Fig. Figure 1 is an enlarged perspective view showing a printed circuit board according to a first embodiment. [ Fig. 2] Fig. Figure 2 is an enlarged perspective view showing a printed circuit board according to a second embodiment. [ Fig. 3] Fig. Figure 3 is an enlarged perspective view showing a printed circuit board according to a third embodiment. [ Fig. 4] Fig. Figure 4 is an enlarged perspective view showing a printed circuit board according to a fourth embodiment. [ Fig. 5] Fig. Figure 5 is a schematic view showing a power conversion device according to a fifth embodiment. Description of the embodiments

[0010] The following describes a printed circuit board according to a first embodiment, based on the drawings. In the drawings, identical reference numerals indicate identical or corresponding components. First embodiment

[0011] Fig. Figure 1 is an enlarged perspective view showing a printed circuit board according to a first embodiment. As in Fig. As shown in Figure 1, a printed circuit board 10 of the first embodiment comprises a substrate 2 having a through-hole 3a and a fuse 1 arranged opposite the through-hole 3a and attached to the substrate 2 via a connecting terminal 1b, wherein the fuse 1 is provided with an interval between the fuse 1 and the substrate 2.

[0012] A circuit pattern 7 (or wiring pattern 7) is provided on the substrate 2, and the connection terminal 1b of the fuse 1 is connected to the circuit pattern 7 of the printed circuit board 10. The connection terminal 1b is made, for example, of tin-plated copper, and the circuit pattern 7 is made, for example, of copper. Furthermore, to prevent the main body section 1a of the fuse 1 from coming into contact with the substrate 2, the connection terminal 1b is designed with a predetermined length. The printed circuit board 10 also has a gap 8 between the main body section 1a of the fuse 1 and the substrate 2.

[0013] The fuse 1 mounted on the printed circuit board 10 according to the first embodiment is, for example, a glass tube fuse. The printed circuit board 10, to which the fuse 1 is attached, is integrated into a power conversion device 50, which, for example, has a cooler 5, as described below. For example, it is possible that, due to a problem with the cooler 5 or an impact from an accident or the like, coolant from the cooler 5 or a conductive foreign body, such as a solder ball, could flow to a position of the fuse 1 on the printed circuit board 10.For example, if the main body section 1a of the fuse 1 and the substrate 2 of the printed circuit board 10 come into contact, there is a possibility that the main body section 1a of the fuse 1 will be wetted by the coolant or that a conductive foreign body, such as a solder ball, will remain between the main body section 1a of the fuse 1 and the substrate 2.

[0014] However, the fuse 1 mounted on the printed circuit board 10 according to the first embodiment is designed such that there is sufficient space 8 between the main body section 1a of the fuse 1 and the substrate 2 of the printed circuit board 10, which prevents a short circuit or an insulation fault between the connection terminals 1b of the fuse 1 caused by the coolant of the radiator 5 or a conductive foreign body such as a solder ball.

[0015] The printed circuit board 10 of the first embodiment is also designed such that the through-hole 3a is provided between the connection terminals 1b of the fuse 1. The through-hole 3a must be of sufficient size to ensure an insulating distance between the connection terminals 1b. In particular, the length W of the through-hole 3a is preferably an opening width that is greater than, for example, the width W1 of the circuit pattern 7. Furthermore, the through-hole 3a is a hole section (a hole) without a bottom surface and is designed such that a required insulating distance, or more, is ensured when a line is drawn between the position of one circuit pattern 7 and the positions of the other circuit patterns 7.

[0016] Such a configuration means that even if coolant or a conductive foreign body, such as a solder ball, flows between the connection terminals 1b of fuse 1, the foreign body is removed through the through hole 3a and an insulating distance between the connection terminals 1b of fuse 1 can be ensured.

[0017] An insulating distance between the connecting terminals 1b of the fuse 1 can also be ensured by the through hole 3a, which has a circular shape, encompassing a perfect circle, an ellipse, and the like, of a sufficient size, as shown in Fig. 1 shown. By using a tool that also opens a hole through which a screw or the like passes to attach the substrate 2 of the printed circuit board 10, a special tool for forming the through hole 3a is not required, and a reduction in the number of processes in the manufacture of the printed circuit board 10 is possible.

[0018] As previously described, the printed circuit board 10 according to the first embodiment comprises the substrate 2, which has the through-hole 3a, and the fuse 1, which is arranged opposite the through-hole 3a and is attached to the substrate 2 via the connection terminal 1b. The fuse 1 is separated from the substrate 2 by a gap and positioned such that the space 8 between the fuse 1 and the substrate 2 is formed. Consequently, a short circuit or insulation fault between the connection terminals 1b of the fuse 1 can be prevented if a fuse blows due to an overcurrent or the like upon the occurrence of an abnormality. Second embodiment

[0019] Fig. Figure 2 is an enlarged perspective view showing a printed circuit board according to a second embodiment. Fig. 2 specifies a reference numeral that is identical to a reference numeral used to describe the printed circuit board 10 in the first embodiment, an identical or corresponding configuration, and a description thereof is omitted.

[0020] The configurations of the printed circuit board 10 according to the second embodiment, which differ from those of the first embodiment, consist in that the width of the connection terminal 1b of the fuse 1 is greater in the width direction W and that the shape of the through-hole 3b is polygonal, comprising a rectangle, and so on. The printed circuit board 10 according to the second embodiment is such that the connection terminal 1b has, for example, a width that is approximately identical to a width W2 of the fuse 1. Also, in order to prevent the main body section 1a of the fuse 1 from coming into contact with the substrate 2, the connection terminal 1b has a predetermined height.

[0021] In particular, a length between the connection terminals 1b or between the circuit patterns 7 that is longer in the width direction W compared to the connection terminal 1b of the fuse 1 means that if end sections in identical positions of the opposite connection terminals 1b are connected by a straight line, and the shape of the through-hole is a perfect circle, the straight line may not be able to touch the through-hole. Meanwhile, if the shape of the through-hole is also elliptical, the opening of the through-hole at an end section of the connection terminal 1b is small compared to that at a middle section, meaning that a sufficient insulating distance may not be guaranteed.

[0022] In response, according to the printed circuit board 10 of the second embodiment, the image of the through-hole 3b is rectangular, as shown in Fig. 2 shown, where the width of the through-hole 3b is the same as seen from each position of the connection terminal 1b, which means that a sufficient insulating distance between the connection terminals 1b of the fuse 1 can be ensured.

[0023] In Fig. For example, the width of the rectangular through-hole 3b is approximately equal to the width W1 of the circuit pattern 7 of substrate 2, but since no problem is presented as long as sufficient insulating distance is ensured between the terminals 1b of the fuse 1, the width of the rectangular through-hole 3b does not necessarily have to be equal to the width W1 of the circuit pattern 7 of substrate 2. Also, several are in the Fig. The cavities formed at connection point 1b shown in connection 2 are not necessarily required. Third embodiment

[0024] Fig. Figure 3 is an enlarged perspective view showing a printed circuit board according to a third embodiment. Fig. 3 denotes a reference numeral identical to a reference numeral used to describe the printed circuit board 10 in the first embodiment and the second embodiment, an identical or corresponding configuration, and a description thereof is omitted.

[0025] The printed circuit board 10 according to the third embodiment differs from the printed circuit board 10 according to the second embodiment in that a through-hole 3c is formed by a plurality of interconnected holes.

[0026] As in Fig. As shown in Figure 3, the printed circuit board 10 according to the third embodiment is such that the through-hole 3c is formed by a plurality of holes which are continuously connected to each other in the width direction W of the connection terminal 1b of the fuse 1.

[0027] According to the printed circuit board 10 of the third embodiment, the through-hole 3c, formed by connecting several holes, ensures an insulating distance between the connection terminals 1b of the fuse 1. Due to the through-hole 3c formed in this way, it is also not necessary to prepare a special tool according to a specific shape, size, or the like for the through-hole 3c, and the number of processes is reduced when manufacturing the printed circuit board 10.

[0028] By using a tool that also opens a hole through which a screw or the like passes to attach the printed circuit board 10, no special tool or modification of the setup is required, and the number of processes in the manufacture of the substrate 2 of the printed circuit board 10 is further reduced. Fourth embodiment

[0029] Fig. Figure 4 is an enlarged perspective view showing a printed circuit board according to a fourth embodiment. Fig. 4 specifies a reference numeral that is identical to a reference numeral used to describe the printed circuit board in the first to third embodiments, an identical or corresponding configuration, and a description thereof is omitted.

[0030] As in Fig. As shown in Figure 4, the printed circuit board 10 according to the fourth embodiment is configured such that the connection terminal 1b of the fuse 1 is connected to the circuit pattern 7 of the substrate 2. Furthermore, to prevent the main body section 1a of the fuse 1 from coming into contact with the substrate 2, the connection terminal 1b has a predetermined height. The printed circuit board 10 also includes the space 8 between the main body section 1a of the fuse 1 and the substrate 2.

[0031] Furthermore, according to the fourth embodiment, the printed circuit board 10 is designed such that the space 8 is filled with a protective element 4 made of resin or the like. Since the space 8 is filled with the protective element 4, no coolant or conductive foreign bodies such as solder balls can enter between the connection terminals 1b of the fuse 1, an insulation distance between the connection terminals 1b of the fuse 1 can be ensured, and a short circuit or insulation fault between the fuse terminals can be prevented.

[0032] Furthermore, the printed circuit board 10 of the fourth embodiment is designed in such a way that an improvement in the earthquake resistance of the fuse 1 can also be expected.

[0033] The in Fig. The printed circuit board 10 shown in Figure 4 is depicted in a state in which the entire space 8 between the connection terminals 1b of the fuse 1 is filled with the protective element 4, but the same advantage is obtained if only at least the connection terminal 1b at one of the two ends is covered with the protective element 4. Fifth embodiment

[0034] Fig. Figure 5 is a schematic view of a power conversion device according to a fifth embodiment. As shown in Fig. As shown in Figure 5, the power conversion device 50 according to the fifth embodiment comprises the printed circuit board 10 according to the first to fourth embodiments, the cooler 5, which is arranged above the printed circuit board 10 and has a coolant channel in its interior, and a shielding plate 6, which is arranged between the printed circuit board 10 and the cooler 5. The cooler 5 also includes a power semiconductor element 11, and a terminal of the power semiconductor element 11 is physically and electrically connected to the printed circuit board 10 by soldering through a hole (not shown) formed in the shielding plate 6. The power semiconductor element 11 is connected to electronic components (not shown) via the circuit pattern 7 of the printed circuit board 10.A bracket 9 (or support 9) is provided on the cooler 5 for attaching the printed circuit board 10 and the shielding plate 6.

[0035] Since the power semiconductor element 11 of the power conversion device 50 generates considerable heat, the power conversion device 50, as shown in Fig. Figure 5 shows a structure comprising the cooler 5, which has a coolant channel inside it, thereby cooling the power semiconductor element 11. If a problem such as porosity in the cooler 5 or damage or the like occurs due to an impact in a traffic accident or similar event, there is a possibility that coolant will leak from the cooler 5.

[0036] According to the power conversion device 50 of the fifth embodiment, the shielding plate 6 is provided between the cooler 5 and the printed circuit board 10, thereby reducing the amount of coolant that comes into contact with the printed circuit board 10 and reducing the amount of coolant that flows between the connection terminals 1b of the fuse 1.

[0037] Provided that the length of the shielding plate 6 in the width direction is greater than the length of the printed circuit board 10 in the width direction and that the printed circuit board 10 can be covered by the shielding plate 6, as shown in Fig.As shown in Figure 5, coolant exiting the cooler 5 falls from an edge of the shielding plate 6 onto an outside of the printed circuit board 10 after coming into contact with the shielding plate 6, thereby greatly reducing the amount of coolant flowing onto the printed circuit board 10.

[0038] If an edge on an outer surface of the shielding plate 6, for example, is machined so that it points downwards in a diagonal outward direction, the coolant is diverted from the edge to a rear (underside) of the shielding plate 6, and it is less likely that coolant will fall onto the printed circuit board 10. Furthermore, assuming a condition in which the power semiconductor element 11 and the printed circuit board 10 are electrically connected through a hole in the shielding plate 6, the possibility of coolant falling from the hole onto the printed circuit board 10 on the shielding plate 6 can be reduced by machining a circumferential edge of the hole in the shielding plate 6 so that it points, for example, diagonally upwards.

[0039] In this way, by processing the edge of the shielding plate 6 in such a way that the edge is directed upwards in a section where coolant falling onto the printed circuit board 10 causes a problem, and the edge is directed downwards in a section on the outside or the like of the printed circuit board 10 where falling coolant does not cause a problem, suitable processing can be carried out without coolant falling onto the printed circuit board 10.

[0040] If no coolant comes into contact with the printed circuit board 10, a short circuit caused by the coolant will no longer occur, meaning that fuse 1 will no longer blow. Using a metal plate as a shielding plate 6 also offers the advantage of blocking radiated noise.

[0041] Although the present application has been described above with reference to various exemplary embodiments and implementations, it should be clear that the various features, aspects and functions described in one or more of the individual embodiments are not limited in their applicability to the specific embodiment in which they are described, but can be applied alone or in various combinations to one or more of the embodiments.

[0042] It is therefore understood that numerous modifications, not shown by way of example, can be developed without deviating from the scope of the present application. For example, at least one of the components can be modified, added, or removed. At least one of the components mentioned in at least one of the preferred embodiments can be selected and combined with the components mentioned in another preferred embodiment. Reference symbol list 1 fuse 1a Main body section 1b Connection port 2 Substrat 3a, 3b, 3c Through hole 4 protective elements 5 coolers 6 Shielding plate 7 circuit patterns 8 Room 9 bracket 10 printed circuit boards 11 Power semiconductor element 50 Power conversion device W Latitude direction W1, W2 width QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP H07 - 30213 A

[0004]

Claims

[1] Printed circuit board, comprising: a substrate with a through hole; and a safety device positioned opposite the through-hole and attached to the substrate via a connecting port, wherein The fuse is provided by an interval separated from the substrate, so that a space is formed. [2] Printed circuit board according to claim 1, characterized by that the through-hole is circular or polygonal. [3] Printed circuit board according to claim 1 or claim 2, characterized by that the through-hole has an opening width that is larger than the width of a circuit pattern on the substrate. [4] Printed circuit board according to any one of claims 1 to 3, characterized by , that the through-hole is formed by connecting several holes. [5] Printed circuit board according to any one of claims 1 to 4, characterized by, that the through-hole is formed using a tool that is used for a screw hole to attach the substrate. [6] Printed circuit board according to any one of claims 1 to 5, characterized by that the fuse connection is covered by a protective element. [7] Printed circuit board according to any one of claims 1 to 5, characterized by that the space between the fuse and the substrate is filled with a protective element. [8] Power conversion device comprising: the printed circuit board according to one of claims 1 to 7; a cooler positioned above the printed circuit board and incorporating a coolant channel inside it; and a shielding plate that is positioned between the printed circuit board and the cooler. [9] Power conversion device according to claim 8, characterized by, that the length in the width direction of the shielding plate is greater than the length in the width direction of the printed circuit board. [10] Power conversion device according to claim 8 or claim 9, characterized by , that the cooler has a power semiconductor element, and a connection of the power semiconductor element is connected to the printed circuit board via a hole formed in the shielding plate.

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