Production aid device and production aid process

Abstract

A production aid device includes a generation section configured to produce recognition data used for a component recognition operation during an assembly operation by a component assembler, based on plate data specifying a feature section of a predetermined area that includes an assembly target position of the component on a plate.

Description

Technical field

[0001] The present invention relates to a production aid device and a production aid method. State of the art

[0002] A production aid is used in a component assembler that mounts a component onto a plate. During an assembly process, the component assembler performs, for example, a recognition process for the component being picked up. In this recognition process, image data acquired by scanning a target component is subjected to image processing, and the suitability of the target component is determined by comparing the image data with recognition data. Patent literature 1 discloses a configuration in which a template is generated as recognition data, which is used for a recognition process, based on data relating to an electrode of a component. Patent citation list

[0003] Patent literature 1: WO 2020 / 012621 Summary of the invention; Technical task

[0004] It is desirable that the recognition data described above be generated more appropriately so that the component recognition process can be carried out with high accuracy. One objective of this description is to provide a production aid and a production aid for generating recognition data with a configuration that differs from the configuration described in patent literature 1. Solution

[0005] The present description discloses a production aid device comprising: a generation section configured to produce recognition data used for a component recognition operation during an assembly operation by a component assembler, wherein the recognition data is generated based on plate data specifying a feature section of a predetermined area that includes an assembly target position of the component on a plate.

[0006] The present description further discloses a production aid method comprising: a generation step for generating recognition data that is used for a recognition operation for a component during an assembly operation by a component assembler, based on plate data that specifies a feature section of a predetermined area that includes an assembly target position of the component on a plate.

[0007] The present description also discloses a technical idea wherein “the production aid according to one of claims 1 to 3” in original claim 5 is amended to “the production aid according to one of claims 1 to 4”, a technical idea wherein “the production aid according to claim 6)” in original claim 9 is amended to “the production aid according to one of claims 1 to 8”, and a technical idea wherein “the production aid according to claim 5)” in original claim 10 is amended to “the production aid according to one of claims 1 to 9”. Advantageous effects of the invention

[0008] With such a configuration, for example, recognition data can be generated based on the plate data, which specifies the feature section of the predetermined area, including the component's target mounting position on the plate. The component recognition process can then be executed depending on whether the target component matches the feature section of the plate. Accordingly, it is possible to generate the required recognition data without needing design data of the component, thereby improving production efficiency. Brief description of the characters Fig. Figure 1 is a schematic diagram illustrating a production system to which a production auxiliary device is applied. Fig. Figure 2 is a schematic top view illustrating a component assembler. Fig. Figure 3 is a side partial cross-sectional view illustrating a configuration of a component camera. Fig. Figure 4 is a flowchart illustrating the assembly process by the component assembler. Fig. Figure 5 is a block diagram representing the production system. Fig. Figure 6 is a diagram that represents a first form of recognition data generated based on disk data. Fig. Figure 7 is a diagram that represents a second form of the recognition data generated on the basis of the disk data. Fig. Figure 8 is a flowchart illustrating a process for generating recognition data and a process for setting the imaging conditions. Fig. Figure 9 is a diagram illustrating an electrode detection process in the process of generating detection data. Fig. Table 10 illustrates a relationship between detection results and scoring values ​​for several types of imaging conditions. Description of the embodiments 1. Overview of the production aid device

[0009] The production aid device 60 supports the manufacture of a product plate by generating recognition data that is used for a component recognition operation during an assembly operation by a component assembler 2. The component assembler 2 performs the assembly operation to attach the component to the plate 91 as a predetermined plate job. As shown in Fig. As shown in Figure 1, the production line Ln is configured such that several sheet processing machines are installed in one transport direction of the sheet. Each of the several sheet processing machines is connected to a host computer 50, which controls the production line Ln collectively. The production line Ln comprises a printer 1, several component assemblers 2, a reflow oven 3, and an inspection device 4 as several sheet processing machines.

[0010] Printer 1 prints paste-like solder onto the fed plate at a component mounting position. Each of the multiple component assemblers 2 mounts the component onto the plate, which is fed from an upstream side of production line Ln. One configuration of component assembler 2 is described later. Reflow oven 3 heats the plate fed from the upstream side of production line Ln, melts the solder on the plate, and performs the soldering. Inspection device 4 checks whether the appearance or function of a plate product manufactured by production line Ln is normal.

[0011] In the production system Sy, which manufactures the sheet product, several production lines Ln (Ln1, Ln2, ...) can be configured. The configuration of each of the multiple production lines Ln can be added or modified, for example, according to the type of sheet product being manufactured. In particular, sheet processing machines such as a buffer device that temporarily holds the transported sheet, a sheet feeding device or a sheet turning device, various types of testing devices, a shielding assembly device, an adhesive application device, a UV irradiation device, and the like can be installed in multiple production lines Ln as needed.

[0012] A setup device 30 is used to set up the device used for the assembly operation to be performed, to generate or correct various data, and the like. The setup device 30 is used, for example, for an operation to load the component into a feeder, an operation to remove the component from a feeder used for the assembly operation, and the like. The setup device 30 is connected to the host computer 50 and receives and outputs various information related to the setup. 2. Configuration of the component assembler 2

[0013] The component assembler 2 includes, as in Fig. Figure 2 shows a plate conveyor device 11, a component feeding device 12, a component transfer device 13, a component camera 14, a plate camera 15, and a control device 16. In the following description, a front-back direction (top-bottom direction) is used. Fig. 2) of the component assembler 1, which is a horizontal direction, defined as the Y-direction, the left-right direction (in Fig. 2. The left-right direction of component assembler 1, which is a horizontal direction intersecting the Y direction, is defined as the X direction, and the vertical direction (in Fig. 2 the front-back direction), which is orthogonal to the X-direction and the Y-direction, is defined as the Z-direction. 2-1. Plate conveyor device

[0014] The plate conveyor 11 then conveys the plates 91 in the conveying direction and positions the plate 91 at a predetermined position in the component assembler 2. 2-2. Component feeding device 12

[0015] The component feeder 12 feeds the component to be mounted on the plate 91. The component feeder 12 is equipped with feeders 122 in several slots 121 arranged side by side in the X direction. The feeder 122 uses a belt feeder that advances a carrier belt containing numerous components, thus making the components available for pickup. The component feeder 12 can, for example, feed relatively large components in a state where the components are arranged on a tray placed on a pallet. In the configuration above, the component feeder 12 feeds the components by pulling predetermined pallets from a housing device that holds multiple pallets according to the assembly process. 2-3. Component transfer device 13

[0016] The component transfer device 13 transfers the component fed by the component feeder 12 to a predetermined mounting position on the plate 91, which is conveyed by the plate conveyor 11 into the component assembler 2. The head drive device 131 of the component transfer device 13 moves a moving body 132 with a linear motion mechanism in the horizontal direction (X-direction and Y-direction). The mounting head 133 is interchangeably attached to the moving body 132 by a clamping element (not shown). Various tools are detachably attached to the mounting head 133.

[0017] The tool includes a suction nozzle 134 as a holding element that holds the component. The suction nozzle 134 picks up and holds the component using supplied vacuum air. The lifting and lowering position or angle of the suction nozzle 134 relative to the mounting head 133 and the vacuum air supply condition are controlled. A chuck or the like can also be used as a holding element, gripping the component. Furthermore, the mounting head 133 includes additional tools such as a pin used to apply an adhesive to the plate, a gripper used to pick up a locking device (not shown) of the plate conveyor 11, and the like. 2-4. Component camera 14 and plate camera 15

[0018] The component camera 14 and the plate camera 15 are digital imaging devices that include an imaging element, such as a CMOS sensor. Both the component camera 14 and the plate camera 15 perform imaging based on a control signal and transmit the image data acquired during the imaging process. The component camera 14 is configured to image the component held by the suction nozzle 134 from below. Details of the component camera 14 are described later.

[0019] The plate camera 15 is integrally arranged with the mounting head 133 on the moving body 132 to allow horizontal movement. The plate camera 15 is configured to image the plate 91 from above. In addition to using a surface of the plate 91 as an imaging target, the plate camera 15 can also use various devices or the like as imaging targets, provided these devices are located within the operating range of the moving body 132. For example, the plate camera 15 is used to image a predetermined section of the plate 91 before the component is mounted. As described above, the plate camera 15 can be used in combination to image various targets and acquire image data for different types of image processing. 2-5. Control device 16

[0020] The control device 16 mainly comprises a CPU, various memory components, and a control circuit. The control device 16 executes the assembly process for attaching the component to the plate 91. During the assembly process, the control device 16 controls the operation of the component transfer device 13 based on information output from various sensors, image processing results, a previously stored control program, or similar sources. This controls the positions and angles of several suction nozzles 134 carried by the assembly head 133. The control program specifies the assembly position, mounting angle, and component type of the component to be mounted onto the plate 91 in a planned assembly sequence.

[0021] The control device 16 stores recognition data Dc, which was downloaded from the host computer 50. This "recognition data Dc" is a template used for the component recognition process during the assembly process, as described above. During the recognition process, the control device 16, for example, performs image processing of the image data acquired by imaging the target component and determines whether the target component is suitable by comparing the image data with the recognition data Dc. Additionally, the control device 16 can use the imaging conditions from the host computer 50 when imaging the target component. Details of the assembly process performed by the control device 16 are described later. 3. Detailed configuration of the component camera 14

[0022] The component camera 14 comprises a camera body 21, a coupling section 22, an upper shell section 23, and an illumination section 24. The camera body 21 is mounted on the base 19 via a support table 211 such that the optical axis An is aligned with the Z-direction. The optical axis An of the camera body 21 is a light incidence axis perpendicular to the imaging element. The light incidence section 212, onto which light falls from above, is formed in the center of an upper section of the camera body 21. The coupling section 22 is arranged above the camera body 21. The coupling element 22 is a tubular element with a rectangular cross-section. An upper shell section 23 is arranged at an upper end section of the coupling section 22. The upper shell section 23 is designed as an upwardly open shell without a bottom.

[0023] The illumination section 24 extends from an inner surface of the coupling section 22 to an inner surface of the upper shell section 23. Specifically, the illumination section 24 is located on a side surface of an inner wall of the coupling section 22 and comprises an incident light source 241 with numerous LEDs. The illumination section 24 includes a semi-mirror 242, which is arranged to obliquely traverse the interior of the coupling section 22. The semi-mirror 242 reflects the horizontal incident light emitted by the incident light source 241 upwards in the Z direction and allows light to pass from above towards the light incidence section 212 of the camera main body 21. The incident light source 241 is a light source that emits light parallel to the optical axis An in the direction of the imaging target.

[0024] The illumination section 24 comprises an oblique illumination light source 244, which is arranged on a cup-shaped inner surface of the upper cup section 23 and includes numerous LEDs. The oblique illumination light source 244 is configured such that, for example, several LED arrays, arranged at equal intervals in the horizontal direction and around the optical axis An, are arranged in four steps in the top-bottom direction. The oblique illumination light source 244 is a light source that emits light obliquely relative to the optical axis An in the direction of the imaging target. Furthermore, the illumination section 24 includes a side illumination light source 246, which is arranged on an upper edge region of the cup-shaped inner surface of the upper cup section 23 and includes numerous LEDs. The side illumination light source 246 is a light source that emits light orthogonally to the optical axis An from the side in the direction of the imaging target.

[0025] The component camera 14 performs an imaging process according to predetermined imaging conditions in response to the control signal from the control device 16. The imaging process includes the control of an imaging process of the camera main body 21 and an illumination process of the illumination section 24.

[0026] Furthermore, the imaging conditions can include switching each light source on and off, the irradiation time, the amount of light, and the like. The illumination section 24 illuminates the imaging target with illumination light according to the imaging conditions. In addition, the imaging conditions can include an exposure time by the imaging element, an exposure time (shutter speed), and the like. The component camera 14 images the imaging target and transmits the image data acquired by the imaging process to the control device 16.

[0027] For the component camera 14, several imaging conditions can be predefined and selected by the control signal, or at least some of the imaging conditions can be defined by the control signal. For example, the component camera 14 downloads several predefined imaging conditions from the host computer 50 according to the component type that is the imaging target and stores the multiple imaging conditions. Then, the imaging conditions are set by the control signal according to the component type that is the imaging target, and the component camera 14 performs the imaging operation under the imaging conditions (type of light source, irradiation time, exposure time, and the like).

[0028] The imaging conditions described above can be switched depending on the imaging type, in addition to the component type. The imaging type includes on-the-fly imaging, in which imaging is performed while the horizontal movement of the assembly head 133, which holds the component to be imaged during the imaging process, is maintained, and stop imaging, in which imaging is performed after the assembly head 133 has been temporarily stopped above the component camera 14. 4. Assembly process by the component assembler 2

[0029] The assembly process by component assembler 2 is described with reference to Fig. 4 described. In the assembly process, first, as described in Fig. Figure 4 shows that the plate conveyor 11 of the component assembler 2 performs a process for inserting the plate 91 (S11). Accordingly, the plate 91 is conveyed into the component assembler 2 and positioned at a predetermined position in the component assembler 2.

[0030] Next, the control device 16 performs a pick-and-place cycle (PP cycle). In the PP cycle, the control device 16 performs a pick-up cycle in which a pick-up operation to pick up the component using multiple suction nozzles 134 is repeated (S12). In this case, the control device 16 controls the operation of the component transfer device 13 such that the assembly head 133 is positioned according to the position to which the component, which is the pick-up target, is fed.

[0031] The control device 16 then performs a detection process for a holding state of the component held by each of the multiple suction nozzles 134 (S13). Specifically, the control device 16 moves the assembly head 133 over the component camera 14 and sends the control signal as an imaging command to the component camera 14. The control device 16 detects a posture (position and angle) of the component held by each of the multiple suction nozzles 134 by performing image processing on the image data acquired by the component camera 14. The result of the holding state detection process (S13) includes an operating result indicating whether the acquisition process is being carried out normally, along with the detected posture of the component.

[0032] In the detection process for the holding state (S13), detection data Dc is used to indicate whether the picked-up component is suitable. Various forms can be used as detection data Dc. For example, detection data Dc is also referred to as shape data when it provides information about the shape of the component and can include information such as the component's external dimensions, a permissible dimensional error, and the position and color of a terminal in the case of a terminal component. Detection data Dc can also be data indicating whether the positions and number of protrusions on a mounting surface (underside) of the component are suitable.

[0033] In particular, the recognition data Dc1, as shown on the right side of Fig. Figure 6 shows an outer contour line Nt, which indicates the shape of an electrode section of the component, or a search line Bs, which intersects the outer contour line Nt. The control device 16 detects the holding state of the picked-up component by processing the image data acquired with the component camera 14, searching the image data for an electrode specified by the outer contour line Nt or an electrode intersecting the search line Bs, and calculating the position and angle of the component relative to a reference position of the mounting head 133 if the electrode is present.

[0034] As on the right side of Fig. As shown in Figure 7, the recognition data Dc2 contains position information specifying the center position Np corresponding to each of the multiple protrusions arranged on the mounting surface (underside) of the component. The recognition data Dc2 indicates the positions and number of multiple protrusions in the component suitable for the assembly operation, based on the positions and number of multiple center positions Np. The control device 16 detects the holding state of the picked-up component by processing the image data acquired by the component camera 14, searching for the protrusions shown at the center position Np in the image data, and calculating the position and angle of the component relative to a reference position of the assembly head 133 if the position and number are suitable.

[0035] In the detection process described above, using the search line Bs and the center position Np in the detection data Dc, information about the external shape of the electrode or the protrusion of the component can be omitted from the detection data Dc, as this is not detected. This is because it is sufficient that each electrode of the component mounted on the plate 91 is electrically connected to a wiring section 92 (see left side of Fig. 6 and left side of Fig. 7) such as a contact surface or pad of plate 91.

[0036] Here, the control device 16 can perform image processing of the image data acquired by imaging the component, for example, with a head camera unit integrally equipped with the assembly head 133, from the side, from below, or from above, in addition to the component camera 14. In such image processing, the recognition data corresponding to the imaging direction is used.

[0037] The control device 16 then executes an assembly cycle in which an assembly operation for mounting the component using multiple suction nozzles 134 is repeated (S14). During the assembly operation of the assembly cycle (S14), the control device 16 controls the operation of the assembly head 133 so that each of the components is mounted at the assembly position specified by the control program. Furthermore, the assembly head 133 controls its operation so that the suction nozzle 134 is positioned and aligned relative to the assembly position based on the result of the recognition operation (S13).

[0038] The control device 16 determines, based on the control program (S15), whether all PP cycles have been completed. If not all PP cycles have been completed (S15: No), the PP cycle (S12 to S14) is executed. If all PP cycles have been completed (S15: Yes), the control device 16 executes an operation to execute plate 91 (S16). During the execution of plate 91, the conveyor device 11 releases the positioned plate 91 and conveys it out of the component assembler 2. 5. Configuration of the production aid 60

[0039] The recognition data Dc used in the recognition process for the component (S13) are generated, for example, based on design information of the target component and produced by image processing of the image data acquired by imaging the target component. Here, to determine whether the component recognized in the recognition process (S13) is suitable for the assembly process, in addition to the method based on the component type, as in the processing using the recognition data Dc1 from Fig. 6 and the recognition data DC2 from Fig. 7 described a method is used which is based on whether the component matches the shape of the wiring section 92 on the side of the plate 91 on which the component is mounted.

[0040] In the present embodiment, the production aid 60 automatically generates recognition data Dc, which is applied to the aforementioned determination method. The production aid 60 generates recognition data Dc based on plate data Db on the plate 91. Accordingly, the recognition data Dc used in the assembly process can be generated in advance, independent of the component being fed in. Furthermore, the production aid 60 has a configuration for setting the imaging conditions that are applied when the component camera 14 images the component in the recognition process (S13). This improves the accuracy of the recognition process (S13) and supports the production of the plate.

[0041] As in Fig. As shown in Figure 5, the production aid 60 comprises a generation section 61, an acquisition section 62, and a setting section 63. The production aid 60 performs a Fig. The production support process shown in Figure 8 is carried out. In this production support process, generation section 61 and acquisition section 62 perform a generation process for recognition data Dc (generation step, S20). In the production support process, setup section 63 performs a setup process for the imaging conditions (setting step, S30). 5-1. Generation section 61 and Acquisition section 62

[0042] Generation section 61 generates recognition data Dc based on plate data Db, which specifies a feature section Tc of a predetermined area Rd containing a mounting target position Pt of a component 95 on a plate 91. Here, the plate data Db can be design data of the plate 91 or data acquired by acquisition section 62.

[0043] Acquisition section 62 first captures the disk data Db (S21) in the generation process for the recognition data Dc (S20). In particular, acquisition section 62, as described in Fig. 9 shows the image processing on the image data, which is carried out by mapping the predetermined area Rd (in Fig. (9, represented by a thick solid line) were captured to capture the plate data Db, which specifies the position of the feature section Tc. Here, the predetermined area Rd encompasses the assembly target position Pt, where a predetermined type of component 95 is mounted in the assembly process.

[0044] Within the predetermined area Rd is a feature section Tc, which serves as a reference for the assembly process of component 95. In the present embodiment, feature section Tc is a section electrically connected to the electrode section of component 95 and is a wiring section 92 that forms a pattern such as a land surface or pad on the plate 91. Feature section Tc may include a registration mark on the plate 91, a registration mark line indicating the shape of at least a part of the component 95 to be assembled, and the like.

[0045] The image data is acquired by imaging the plate 91 used for the assembly process with a predetermined imaging device. The imaging device can be an external device installed around the host computer 50 or a device arranged in the setup device 30. Alternatively, the image data can be acquired by imaging a predetermined area Rd with a plate camera 15 arranged in the component assembler 2, which is capable of imaging the plate 91.

[0046] Next, the acquisition section 62 detects the feature section Tc of the disk data Db (S22). During the detection process, the acquisition section 62 can, for example, perform binarization processing using a predetermined threshold as image processing and extract the feature section Tc whose brightness differs from that of the main body of the disk in the predetermined area Rd. Furthermore, the acquisition section 62 can display the predetermined area Rd on a monitor (not shown) and receive the label of the area contained in feature section Tc from an operator. As shown on the right side of Fig. As shown in Figure 9, when the operator determines a reference point Gn, areas with the same brightness (e.g., two wiring sections 92) are determined as a closed figure.

[0047] Generation section 61 generates recognition data Dc based on disk data Db acquired by acquisition section 62 (S23). Specifically, generation section 61 inverts the data in the generation section as shown in Fig. Figure 6 shows several feature sections Tc in the plate data Db symmetrical with respect to a predetermined axis (in the present embodiment, as shown on the right side of Figure 6). Fig. (Figure 6 shows the left and right sides being inverted). This is because, in the recognition process for component 95, the image data obtained by imaging component 95 from below is used with the recognition data Dc, and thus the appearance of component 95 matches the appearance of the underside of component 95. When the image data captured in the recognition process is inverted, the inversion process for multiple feature sections Tc in the plate data Db is omitted in the generation process (S23).

[0048] In the generation process (S23), the generation section 61 determines that the feature section Tc corresponding to the electrode section is present in component 95 and defines the outer contour line Nt, which specifies the shape of the electrode section, or the search line Bs, which intersects the outer contour line Nt, according to predetermined generation parameters. These generation parameters include, for example, the type of recognition data Dc (outer contour line Nt, search line Bs, center position Np, a combination thereof, and the like), an interval for the search lines Bs, a permissible error, and the like, which are predefined for each type of component 95.

[0049] By executing the generation process (S23), the generation section 61 generates recognition data Dc1 and Dc2 according to the recognition process for component 95 based on the disk data Db1 and Db2, as described in the Fig. 6 and Fig. 7 shown. The in Fig. The recognition data Dc2 shown in Figure 7 indicates the positions and number of multiple electrode sections that correspond to multiple feature sections Tc within a predetermined area Rd2. The generated recognition data Dc is stored in storage section 51 of the host computer 50. 5-2. Setting section 63

[0050] The assembly process includes a process for recognizing component 95 by applying the recognition data Dc to the image data (S13) acquired by imaging component 95. The image data is acquired, for example, by imaging component 95 from below with the component camera 14. The component camera 14 performs the imaging process according to the predetermined imaging conditions.

[0051] In this case, depending on the imaging conditions, for example, the outer shape or the electrode section on the underside of component 95 may become unclear, or several electrode sections may be recognized as one electrode section. In this case, even when using recognition data Dc, there is a risk that it will not be accurately determined whether component 95 is suitable for the assembly process or in what position component 95 is held if it is suitable.

[0052] Therefore, setting section 63 of the production aid 60 defines the imaging conditions when the image data used for the recognition process for component 95 are acquired based on the recognition data Dc (S30). Setting section 63 first selects candidates for the imaging conditions (S31). As in Fig. As shown in Figure 10, for each candidate imaging condition, the type of light source, irradiation time, exposure time, and the like are specified. The setting section 63 can select one from all candidates or one from predetermined types of light sources based on the results of the recognition process so far and the type of component 95. Hereinafter, the “candidates imaging conditions” are also referred to as “preliminary imaging conditions Mp.” As described above, the setting section 63 performs the setting conditions step (S31) to set the preliminary imaging conditions Mp when the preliminary image data is acquired.

[0053] Next, the setup section 63 captures the preliminary image data by imaging component 95 (capture step, S32). To distinguish it from the "image data" captured by the imaging card 91, the "image data" in the setup process of the imaging operation is referred to as "preliminary image data." Here, the components 95 exhibit individual differences, and their appearance in the image data can vary even under the same imaging conditions. Therefore, when capturing the preliminary image data, it is preferable to define a suitable component 95C in advance as the imaging target, which is a component 95 that is positioned for the assembly operation, has a standard shape and color, and is suitable for the assembly operation.

[0054] The adjustment section 63 performs the acquisition step (S32) and acquires the preliminary image data by imaging the suitable component 95C. The adjustment section 63 can perform the acquisition step (S32) by imaging with the same imaging equipment as the component camera 14 of the component assembler 2. In the present embodiment, the adjustment section 63 acquires the preliminary image data by imaging the suitable component 95C with the component camera 14 in a state in which the suitable component 95C is held by the assembly head 133 of the component assembler 2. Thus, an image can be acquired in the same imaging environment as during the assembly process.

[0055] Subsequently, the setting section 63 performs the recognition process, in which the recognition data Dc is applied to the preliminary image data, and determines whether the preliminary image data is suitable (determination step, S33). For example, setting section 63 performs the binarization processing of the preliminary image data as image processing, as in the recognition process, and further determines, based on the recognition data Dc, whether component 95 is suitable. Since component 95 contained in the preliminary image data is a component 95C suitable for the assembly process, setting section 63 recognizes that the preliminary imaging conditions are faulty if the determination step determines that component 95 is not suitable.

[0056] If, however, the determination step determines that the suitable component 95C is suitable, the setting section 63 recognizes that the preliminary imaging conditions are good. In the determination step, setting section 63 calculates an evaluation value Ve, which indicates the degree of suitability of the preliminary image data. For example, in Fig. As shown in Figure 10, a five-level rating (1 to 5 / 5) can be used. The setting section 63 can calculate the rating value Ve based on the number (Vf11, Vf12, ...) of feature sections (electrode sections or the like) of component 95 detected in the determination step, the permissible error specified in the detection data Dc, or the degree of deviation from an ideal shape.

[0057] If the result of the recognition process to which the recognition data Dc is applied indicates "suitable" in the determination step (S34: Yes), i.e., if the positions and number of several feature sections Tc in a suitable component 95C can be adequately recognized, the setting step 63 specifies the imaging conditions candidates selected in S31 (preliminary imaging conditions) as the imaging conditions (S35). Conversely, if the result of the recognition process to which the recognition data Dc is applied indicates "not suitable" in the determination step (S34: No), the setting step 63 determines that the imaging conditions candidates selected in S31 are not suitable for the assembly process and repeats the setting cycle, including S31 to S33.

[0058] Even if the result of the recognition process in the determination step indicates "suitable" as described above, the adjustment section 63 can repeatedly execute the adjustment cycle (S31 to S33) until imaging is complete for all predefined candidates in order to search for more suitable imaging conditions (S34). As a result, the positions and number of several feature sections Tc in the suitable component 95C are recorded for each of the preliminary imaging conditions Mp, and the evaluation value Ve is calculated.

[0059] If the feature section Tc of the suitable component 95C can then be adequately identified in several iterations of the determination step, the setting section 63 specifies preliminary imaging conditions Mp as candidate conditions for imaging conditions Mc and designates one of the several candidate conditions as imaging conditions Mc based on the evaluation value Ve (S35). Accordingly, even if it is determined that several preliminary imaging conditions Mp are suitable, a candidate condition with a higher evaluation value Ve can be designated as imaging conditions Mc. 6. Effects of the configuration of the design

[0060] With the configuration of the production aid device 60 and the production aid procedure (according to the production aid process of Fig.8) As described above, recognition data Dc is generated based on plate data Db, which specifies a feature section Tc of a predetermined area Rd containing a mounting target position Pt of a component 95 on a plate 91. Accordingly, the control device 16 of the component assembler 2 can perform the recognition operation for the component 95, depending on whether the component 95, which is the recognition target, corresponds to feature section Tc of the plate 91. Therefore, it is possible to generate the required recognition data Dc without needing design data of the component 95, and consequently, it is possible to improve production efficiency.

[0061] Furthermore, it is possible to define imaging conditions Mc for executing a suitable recognition process for component 95 using the generated recognition data Dc. This allows the imaging to be carried out appropriately to capture the image data used for the recognition process and prevents errors from occurring in the recognition process. As described above, the production aid 60 and the production aid method can improve the accuracy of the recognition process (S13) and thereby support the production of the product plate. 7. Modification of the embodiment

[0062] In this embodiment, the production aid 60 includes an adjustment section 63 that sets the imaging conditions Mc. Alternatively, the production aid 60 can be configured in such a way that, for example, the operator sets the imaging conditions Mc as in the prior art, and the adjustment section 63 is omitted. Similarly, in the production aid method, the adjustment step (S30) for the imaging conditions Mc can be omitted.

[0063] In this embodiment, the production aid 60 is integrated into the host computer 50. Alternatively, the production aid 60 can be integrated into the component assembler 2 or the setup device 30. For example, in a configuration where the production aid 60 is integrated into the control device 16 of the component assembler 2, the plate camera 15 will image the plate 91, which is first conveyed into the component assembler 2 before production, and the generation step (S20) for the recognition data Dc will be executed.

[0064] Furthermore, the component 95 to be assembled is captured and imaged by the component camera 14 under several preliminary imaging conditions Mp, and the setting step (S30) for the imaging conditions is executed. This makes it possible to generate recognition data Dc before the assembly process and to set the imaging conditions suitable for the recognition data Dc. The same effects are achieved in this configuration as in the embodiment. List of reference symbols

[0065] 2: Component assembler, 11: Plate conveyor, 12: Component feeder, 13: Component transfer device, 131: Head drive device, 132: Motion body, 133: Assembly head, 134: Suction nozzle, 14: Component camera, 15: Plate camera, 16: Control device, 21: Camera main body, 24: Lighting section, 241: Incident light source, 242: Half-mirror, 244: Oblique light source, 246: Side light source, 30: Setup device, 50: Host computer, 51: Storage section, 60: Production aid device, 61: Generation section, 62: Acquisition section, 63: Adjustment section, 91: Plate, 92: Wiring section, 95: Component, 95C: Suitable component, Bs: Search bar, Nt: Outer contour line, Np: center position, Dc: recognition data, Db: plate data, Dm: image data, Mc: imaging conditions, Mp: preliminary imaging conditions, Pt: assembly target position, Rd: predetermined area, Tc: feature section, Ve: evaluation value, Sy: production systemLn: Production line, QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] WO 2020 / 012621

[0003]

Claims

[1] A production aid comprising the following: a generation section configured to produce recognition data used for a component recognition operation during an assembly operation by a component assembler, based on plate data specifying a feature section of a predetermined area encompassing an assembly target position of the component on a plate. [2] The production aid device according to claim 1, which further comprises: an acquisition section configured to capture plate data indicating the position of the feature section by performing image processing on image data captured by mapping the predetermined area. [3] The production aid device according to claim 2, wherein The acquisition section is configured to acquire the plate data by performing image processing on the image data acquired by imaging the predetermined area with a plate camera located in the component assembler and capable of imaging the plate. [4] The production aid device according to one of claims 1 to 3, wherein the feature section is a section that is electrically connected to an electrode section of the component, and The recognition data specifies the positions and the number of multiple electrode sections that correspond to multiple feature sections in the predetermined area. [5] The production aid device according to one of claims 1 to 3, wherein the recognition process comprises a process for recognizing the component by applying the recognition data to image data acquired by imaging the component, and The production aid further includes a setting section that is configured to set the imaging conditions when the image data used for the recognition process is acquired based on the recognition data. [6] The production aid device according to claim 5, wherein the setting section is configured to repeatedly perform a setting cycle comprising a capture step for capturing preliminary image data by imaging a suitable component that is arranged for and suitable for the assembly operation, a determination step for determining whether the preliminary image data are suitable by performing the recognition operation in which the recognition data are applied to the preliminary image data, and a condition setting step for setting preliminary imaging conditions when the preliminary image data are captured, and for setting the imaging conditions based on a result of the determination step and the preliminary imaging conditions. [7] The production aid device according to claim 6, wherein the setting section is configured when the positions and number of several feature sections in the suitable component are adequately identifiable in the determination step, to define the preliminary imaging conditions when the preliminary image data are acquired. [8] The production aid device according to claim 7, wherein The settings section is configured to calculate an evaluation value in the determination step, which indicates a degree of suitability of the preliminary image data, and The setting section is configured when the positions and number of multiple feature sections in the appropriate component are adequately identifiable in several iterations of the determination step, several preliminary imaging conditions are defined as condition candidates when the preliminary image data is acquired, and one is selected from several condition candidates based on the evaluation value as the imaging conditions. [9] The production aid device according to claim 6, wherein the setting section is configured to capture the preliminary image data in the capture step by imaging the suitable component with a component camera arranged in the component assembler which is capable of imaging the component. [10] The production aid device according to claim 5, wherein the imaging conditions comprise a type and exposure time of a light source which emits light when the component is imaged. [11] A production aid procedure comprising: a generation step to generate recognition data that is used for a recognition process for a component during an assembly process by a component assembler, based on plate data that specifies a feature section of a predetermined area that includes an assembly target position of the component on a plate.

Images