Liquid cooling device and electronic device

Abstract

Embodiments of the present application disclose a liquid cooling device that brings the first cooling plate and the heat conduction element mounting assemblies into thermal contact by means of first heat conduction structures, wherein the heat conduction element mounting assemblies are used to establish thermal contact with the VR power supply module, and at the same time, a plurality of second heat conduction structures are detachably and spaced apart arranged on the heat conduction element mounting assemblies, and the second heat conduction structures are used to clamp the memory module to dissipate heat from the memory module.In this way, the heat generated by the VR power module is transferred to and dissipated by the heat conduction element fixing assemblies and the second heat conduction structures to the first cooling plate, while the heat generated by the memory module is transferred to and dissipated by the second heat conduction structures, the heat conduction element fixing assemblies, and the first heat conduction structures to the first cooling plate. This enables heat dissipation of the VR power module and the memory module without a flow channel and reduces the difficulty of establishing the flow channel and the risk of liquid leakage, thus simplifying the structural layout of the liquid cooling device and improving the convenience of memory maintenance and the reliability of the liquid cooling device. Furthermore, the present application provides an electronic device.

Description

Cross-reference of relevant application

[0001] This application is based on and claims priority from Chinese Patent Application No. "202311237649.0", filed on September 22, 2023, the entire contents of which are hereby incorporated by reference into this application. Technical area

[0002] The present application belongs to the technical field of heat dissipation for electronic equipment, in particular it relates to a liquid cooling system and an electronic equipment. Technical background

[0003] A data center is a global, collaborative network of specific devices used to transmit, accelerate, display, compute, and store data and information over the internet infrastructure. The creation of data centers has led to a shift in human understanding from a quantitative, structured world to a more indeterminate and unstructured one. Like transport and network communications, they have gradually become part of the infrastructure of modern society, which in turn has had a positive impact on many industries.

[0004] Currently, the normal operation of data centers requires the use of a large number of electronic devices such as servers, and the heat generated by the operation of a large number of servers can negatively impact their performance and service life. Traditional air cooling technology can no longer meet the rapidly growing demand for heat dissipation in data centers, and liquid cooling technology with higher cooling efficiency is gradually replacing traditional air cooling as the main heat dissipation technology in data centers. Liquid cooling technology dissipates heat through a cooling medium instead of air. The cooling medium can achieve efficient heat exchange with the server, leading to electrical energy savings and meeting social development trends and the requirements of energy conservation and emission reduction.

[0005] However, current liquid cooling equipment still has problems such as complexity in overall piping design, difficulty in layout and a high risk of liquid leakage or the like, which are not conducive to the installation and maintenance of the liquid cooling equipment. Content of the invention

[0006] The object of embodiments of the present application is to provide a liquid cooling device and an electronic device to simplify the structural layout of the liquid cooling device and to improve the convenience of storage maintenance and the reliability of the liquid cooling device.

[0007] To solve the above technical problem, a first aspect of the present application provides a liquid cooling device comprising: a liquid inlet pipe for supplying cooling liquid; a first cooling plate with a liquid-receiving chamber connected to the liquid inlet pipe, wherein the liquid-receiving chamber is used to receive the cooling liquid, and the first cooling plate is used to dissipate heat from a CPU; a plurality of first heat conduction structures spaced apart from the first cold plate along a first direction, wherein the plurality of first heat conduction structures and the first cold plate are in thermal contact; a plurality of heat conduction element mounting assemblies spaced apart from the first cold plate along the first direction, wherein the heat conduction element mounting assemblies and the first heat conduction structures are clearly in thermal contact, wherein the heat conduction element mounting assemblies are used to thermally contact a VR power module to dissipate heat from the VR power module;a plurality of second heat conduction structures spaced apart from the first cooling plate along the first direction, the second heat conduction structures uniquely and releasably attached to the heat conduction element attachment assemblies, the second heat conduction structures used to clamp and secure a memory module and to dissipate heat from the memory module;

[0008] Optionally, the number of the first heat conduction structures is two, wherein the two first heat conduction structures are each arranged on two opposite sides of the first cooling plate along the first direction and are in thermal contact with the first cooling plate; the number of the heat conduction element fastening assemblies is two, wherein the two heat conduction element fastening assemblies are each arranged on two opposite sides of the first cooling plate along the first direction and are each fixedly connected to the two first heat conduction structures; and the number of the second heat conduction structures is two, wherein the two second heat conduction structures are each arranged on two opposite sides of the first cooling plate along the first direction and are each detachably connected to the heat conduction element fastening assemblies.

[0009] Optionally, the first heat conduction structures comprise two first heat conduction assemblies, the two first heat conduction assemblies being respectively arranged on the two opposite sides of the first cooling plate along the second direction; the heat conduction element fixing assemblies comprise two heat conduction element fixing seats, the two heat conduction element fixing seats being arranged spaced apart along the second direction, and the two first heat conduction assemblies and the two heat conduction element fixing seats being uniquely connected; the second heat conduction structures comprise a plurality of second heat conduction elements, the plurality of second heat conduction elements being spaced apart from the second heat conduction elements along the first direction and detachably fixed to the two heat conduction element fixing seats, and any two of the second heat conduction elements are used to clamp the memory module;wherein the first cooling plate dissipates heat from the storage module via the first heat conduction assemblies, the heat conduction element mounting seats, and the second heat conduction assemblies, wherein the first direction and the second direction are arranged at an angle in an extension plane of the first cooling plate;

[0010] Optionally, the first heat conduction structures further comprise a mounting plate, wherein the first heat conduction assemblies comprise a plurality of first heat conduction elements, one end of the plurality of first heat conduction elements being mounted to the mounting plate and the other end of the plurality of first heat conduction elements being mounted to the heat conduction element mounting seats; and the mounting plate is also mounted to the first cooling plate, wherein the first heat conduction elements thermally contact the first cooling plate via the mounting plate.

[0011] Optionally, the heat conduction element fixing seat is provided with a plurality of fixing grooves, wherein both ends of the plurality of second heat conduction elements are embedded along the first direction in the fixing grooves of the two heat conduction element fixing seats, respectively, and a scratch-resistant film is arranged partially adhered to an inner wall of the fixing grooves facing surface of the second heat conduction elements.

[0012] Optionally, it further comprises two second cooling plates, wherein the two second cooling plates are each arranged on the two opposite sides of the first cooling plate along the second direction, the two second cooling plates are adjacent to and thermally contact the first cooling plate, and the two second cooling plates are used to dissipate heat from the VR power supply module.

[0013] Optionally, the first cooling plate comprises a cooling plate fixing plate, a cooling plate cover plate, and a cooling plate base plate, wherein the cooling plate cover plate and the cooling plate base plate are arranged on both opposite sides of the cooling plate fixing plate, and the cooling plate fixing plate, the cooling plate cover plate, and the cooling plate base plate enclose the liquid-receiving chamber; and opposite surfaces of the cooling plate cover plate and the cooling plate base plate are provided with heat dissipation fins.

[0014] Optionally, a heat-conducting spacer is arranged partially glued to a surface of the second heat conduction elements facing the storage module.

[0015] Optionally, it further comprises a clamping element, wherein the clamping element is arranged on the second heat conduction structure, wherein the clamping element is used for clamping and fixing the plurality of second heat conduction elements.

[0016] A second aspect of the present application provides an electronic device comprising: a device body and a liquid cooling device described in the first aspect, wherein the liquid cooling device is arranged on the device body.

[0017] Compared to the relevant art, the liquid cooling device provided by the present application brings the first cooling plate and the heat conduction element fixing assemblies into thermal contact by means of the first heat conduction structures, wherein the heat conduction element fixing assemblies are used to establish thermal contact with the VR power supply module, and at the same time, a plurality of second heat conduction structures are detachably and spaced apart arranged on the heat conduction element fixing assemblies, and the second heat conduction structures are used to clamp the memory module to dissipate heat from the memory module.In this way, the heat generated by the VR power module is transferred and dissipated to the first cooling plate through the heat conduction element fixing assemblies and the second heat conduction structures, while the heat generated by the memory module is transferred and dissipated to the first cooling plate through the second heat conduction structures, the heat conduction element fixing assemblies, and the first heat conduction structures, which enables heat dissipation of the VR power module and the memory module without a flow channel and reduces the difficulty of setting up the flow channel and the risk of liquid leakage, thus simplifying the structural layout of the liquid cooling device and improving the convenience of memory maintenance and the reliability of the liquid cooling device. Description of the attached drawings

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the attached drawings to be used in the embodiments of the present application will be briefly described below, and from these drawings, a person having ordinary knowledge in this technical field can obtain further attached drawings without doing any creative work. Fig. 1 is a plan view of a liquid cooling device of an embodiment of the present application; Fig. 2 is a side view of Fig. 1; Fig. 3 is a plan view of a first heat conduction structure and a second heat conduction structure of an embodiment of the present application; Fig. 4 is a side view of Fig. 3; Fig. 5 is a plan view of a printing plate of an embodiment of the present application; Fig. 6 is a front view of Fig. 5; Fig. 7 is a side view of Fig. 5; Fig. 8 is a plan view of a first cooling plate and a second cooling plate of an embodiment of the present application; Fig. 9 is a sectional view of Fig. 8 along line AA'; Fig. 10 is a sectional view of Fig. 8 along line BB'; Fig. 11 is a schematic view of the structure of a second heat conduction element of an embodiment of the present application; Fig. 12 is a schematic view of the structure of another second heat conduction element of an embodiment of the present application. Specific embodiments

[0019] To clarify the object, technical solutions, and advantages of embodiments of the present application, the embodiments of the present application are described in detail below in conjunction with the accompanying drawings. However, those skilled in the art with average knowledge in this technical field will understand that many technical details are proposed in the embodiments of the present application to enable the reader to better understand the present application. However, even without these technical details, and based on the following embodiments, various variations and modifications can achieve the technical solutions claimed in the present application.

[0020] In the embodiments of the present application, the terms "top", "bottom", "left", "right", "front", "rear", "upper", "lower", "inside", "outside", "center", "vertical", "horizontal", "across", "longitudinal", etc., indicate that the orientation or positional relationship is based on the orientation or positional relationship illustrated in the accompanying drawings. These terms are primarily intended to better describe the present application and its embodiments and are not intended to limit the specified devices, elements, or components to have a particular orientation or to be constructed and operated in a particular orientation.

[0021] Some of the above terms may be used to indicate other meanings in addition to the orientation or positional relationship. For example, the term "on" may also be used in certain cases to indicate a specific dependency or connection relationship. A person of ordinary skill in the art can understand the specific meaning of these terms in the present application on a case-by-case basis.

[0022] Furthermore, the terms "install / assemble," "arrange," "provide," "introduce," "connect," and "connect" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or a monolithic structure; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection via an intermediate medium; or it may be an internal connection between two devices, elements, or components.

[0023] A person skilled in the art having average knowledge of this technical field can understand the specific meaning of the above terms in the present application on a case-by-case basis.

[0024] It should be noted that relational terms such as "first" and "second" or the like are used in this document only to distinguish one object or actuation from another and do not necessarily require or imply any such actual relationship or sequence between those objects or acts. And the terms "comprise," "include," or any other variation thereof are intended to cover non-exclusive inclusion, such that an operation, method, article, or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or includes elements inherent in that operation, method, article, or device. Without further limitation, an element defined by the phrase "comprise" includes...’ does not preclude the presence of other identical elements in the operation, method, article or device which comprises those elements.

[0025] The normal operation of a data center requires the use of a large number of electronic devices such as servers, and the heat generated by the operation of such a large number of servers could negatively impact their performance and service life. Currently, heat dissipation from the servers is mainly carried out using air cooling. However, heat dissipation through air cooling has problems with cleanliness and low heat dissipation efficiency, and the continuous operation of air cooling devices itself could also lead to extremely high energy consumption. Therefore, heat dissipation through liquid cooling is a better choice than air cooling. Currently, servers that dissipate heat through heat and cold exchange by injecting cooling liquid into the device are called liquid-cooled servers, with cold plate liquid cooling being the most widely used.However, the existing cold plate liquid cooling technology is generally focused on the heat dissipation of the server's CPU, and the heat dissipation design of other heat-producing means inside the server is complicated in structure, difficult to disassemble, and has low heat dissipation efficiency or the like.

[0026] To solve the above technical problems, an embodiment of the present application provides a liquid cooling device comprising: a liquid inlet pipe for supplying cooling liquid; a first cooling plate having a liquid receiving chamber connected to the liquid inlet pipe, the liquid receiving chamber being used to receive the cooling liquid, and the first cooling plate being used to dissipate heat from a CPU; a plurality of first heat conduction structures spaced apart from the first cooling plate along a first direction, the plurality of first heat conduction structures and the first cooling plate being in thermal contact;a plurality of heat conduction element mounting assemblies spaced apart from the first cold plate along the first direction, the heat conduction element mounting assemblies and the first heat conduction structures being in explicit thermal contact, the heat conduction element mounting assemblies being used to thermally contact a VR power module to dissipate heat from the VR power module; a plurality of second heat conduction structures spaced apart from the first cold plate along the first direction, the second heat conduction structures being explicitly and removably attached to the heat conduction element mounting assemblies, the second heat conduction structures being used to clamp and secure a memory module and to dissipate heat from the memory module;

[0027] An embodiment of the present application provides an electronic device comprising: a device body and the above-mentioned liquid cooling device.

[0028] Compared to the prior art, the liquid cooling device of the present embodiment brings the first cooling plate and the heat conduction element fixing assemblies into thermal contact by means of the first heat conduction structures, wherein the heat conduction element fixing assemblies are used to establish thermal contact with the VR power supply module, and at the same time, a plurality of the second heat conduction structures are detachably and spaced apart arranged on the heat conduction element fixing assemblies, and the second heat conduction structures are used to clamp the memory module to dissipate heat from the memory module.In this way, the heat generated by the VR power module is transferred and dissipated to the first cooling plate through the heat conduction element fixing assemblies and the second heat conduction structures, while the heat generated by the memory module is transferred and dissipated to the first cooling plate through the second heat conduction structures, the heat conduction element fixing assemblies, and the first heat conduction structures, which enables heat dissipation of the VR power module and the memory module without a flow channel and reduces the difficulty of setting up the flow channel and the risk of liquid leakage, thus simplifying the structural layout of the liquid cooling device and improving the convenience of memory maintenance and the reliability of the liquid cooling device.

[0029] Implementation details of the liquid cooling device of the present embodiment will be specifically described below, and the following is only for better understanding of the provided implementation details and is not required for implementation of the present variant.

[0030] The liquid cooling device 100 of the present embodiment, the structure of which is shown in the Fig. 1 to 7, comprises: a liquid inlet pipe 101 for supplying cooling liquid; a first cooling plate 102 having a liquid-receiving chamber 1021 connected to the liquid inlet pipe 101, wherein the liquid-receiving chamber 1021 is used to receive the cooling liquid, and the first cooling plate 102 is used to dissipate heat from a CPU 200; a plurality of first heat conduction structures 103 spaced apart from the first cooling plate 102 along a first direction P1, wherein the plurality of first heat conduction structures 103 and the first cooling plate 102 are in thermal contact.A plurality of heat conduction element mounting assemblies 104 spaced apart from the first cold plate 102 along the first direction P1, wherein the heat conduction element mounting assemblies 104 and the first heat conduction structures 103 are clearly in thermal contact, wherein the heat conduction element mounting assemblies 104 are used to be in thermal contact with a VR power module 300 to dissipate heat from the VR power module 300. A plurality of second heat conduction structures 105 spaced apart from the first cooling plate 102 along the first direction P1, the second heat conduction structures 105 being uniquely and releasably attached to the heat conduction element attachment assemblies 104, the second heat conduction structures 105 being used to clamp and secure a memory module 104 and to dissipate heat from the memory module 104.

[0031] It should be indicated that the solid arrows in Fig. 1 illustrates the schematic flow path of the cooling liquid in the cooling channel of the liquid cooling device 100.

[0032] An arrangement is made such that the heat generated by the VR power module 300 is transferred and dissipated to the first cooling plate 102 through the heat conduction element fixing assemblies 104 and the second heat conduction structures 105, while the heat generated by the memory module 400 is transferred and dissipated to the first cooling plate 102 through the second heat conduction structures 105, the heat conduction element fixing assemblies 104, and the first heat conduction structures 103, which enables heat dissipation of the VR power module 300 and the memory module 400 without a flow channel and reduces the difficulty in setting up the flow channel and the risk of liquid leakage, thus simplifying the structural layout of the liquid cooling device and improving the convenience of memory maintenance and the reliability of the liquid cooling device.

[0033] Referring to the Fig. 8 and Fig. 10 together, in some feasible solutions, the first cooling plate 102 comprises a cooling plate mounting plate 1022, a cooling plate cover plate 1023, and a cooling plate base plate 1024, wherein the cooling plate cover plate 1023 and the cooling plate base plate 1024 are arranged on both opposite sides of the cooling plate mounting plate 1022, and the cooling plate mounting plate 1022, the cooling plate cover plate 1023, and the cooling plate base plate 1024 enclose the liquid-receiving chamber 1021. The opposite surfaces of the cooling plate cover plate 1023 and the cooling plate base plate 1024 are provided with heat dissipation fins 1025.

[0034] Specifically, the cooling plate cover plate 1023 is provided with a liquid inlet port 1023a and a liquid outlet port 1023b on a side facing away from the cooling plate base plate 1024. The liquid inlet pipe 101 is connected to the liquid inlet port 1023a, and the cooling liquid enters the liquid receiving chamber 1021 from the liquid inlet pipe 101 via the liquid inlet port 1023a, thereby realizing liquid cooling heat dissipation. On the opposite surfaces of the cooling plate cover plate 1023 and the cooling plate base plate 1024, ieOn the inner wall surfaces surrounding the liquid-accommodating chamber 1021, the cooling plate cover plate 1023 and the cooling plate base plate 1024 are each provided with the heat dissipation fins 1025. The heat dissipation fins 1025 further increase the contact area of ​​the cooling liquid with the cooling plate cover plate 1023 and the cooling plate base plate 1024, and improve the heat dissipation efficiency. More specifically, the cooling plate cover plate 1023 is connected to the first heat conduction structures 103 to dissipate heat from the VR power module 300 through the first heat conduction structures 103, and also to dissipate heat from the storage module 400 through the first heat conduction structure 103 and the second heat conduction structures 105. The CPU 200 is glued to a side of the cooling plate base plate 1024 facing away from the cooling plate cover plate 1023, and the cooling plate base plate 1024 dissipates heat from the CPU 200.

[0035] Again referring to Fig. 10, in some feasible solutions, the cooling plate mounting plate 1022 is provided with reinforcing ribs 1026, which can increase the compressive strength of the first cooling plate 102.

[0036] With further reference to the Fig. 1 and Fig. 8, the liquid cooling device further comprises a liquid cooling head 106 and a liquid outlet pipe 107, wherein the liquid inlet pipe 101 and the liquid outlet pipe 107 are each connected to the liquid cooling head 106, wherein the liquid outlet pipe 107 is further connected to the liquid outlet port 1023b. The liquid cooling head 106 is connected to an external liquid supply device for receiving the cooling liquid, so that the cooling liquid enters the liquid receiving chamber 1021 via the liquid inlet pipe 101, and the liquid outlet pipe 107 serves to guide the cooling liquid, so that the cooling liquid flows from the liquid receiving chamber 1021 to the liquid cooling head 106 and then enters the external liquid supply device, thereby realizing cyclic liquid cooling.

[0037] It is understood that the liquid cooling head 106 is a two-channel liquid cooling head, that is, the channel connected to the liquid inlet pipe 101 and the channel connected to the liquid outlet pipe 107 of the liquid cooling head 106 are independent of each other.

[0038] To ensure the closure of the first cooling plate 102, the cooling plate fixing plate 1022, the cooling plate cover plate 1023, and the cooling plate base plate 1024 can be welded as a unit by vacuum brazing or friction stir welding. For the same reason, the liquid inlet port 1023a and the liquid outlet port 1023b can also be welded and fixed to the cooling plate cover plate 1023 using the same welding method.

[0039] In some other feasible solutions, considering that the power consumption of the memory module 400 is lower compared to the power consumption of the CPU 200, the heat dissipation fins 1025 of the cooling plate cover plate 1023 may be replaced by the traditional serpentine flow channel design, wherein the serpentine flow channel may be formed using CNC machining, which can reduce the difficulty in manufacturing the liquid cooling device.

[0040] Referring again to Fig. 1, the number of first heat conduction structures 103 is two in some feasible solutions, and the two first heat conduction structures 103 are each arranged on two opposite sides of the first cooling plate 102 along the first direction P1 and are in thermal contact with the first cooling plate 102. The number of heat conduction element fastening assemblies 104 is two, and the two heat conduction element fastening assemblies 104 are each arranged on the two opposite sides of the first cooling plate 102 along the first direction P1 and are each fixedly connected to the two first heat conduction structures 103. The number of second heat conduction structures 105 is two, and the two second heat conduction structures 105 are each arranged on the two opposite sides of the first cooling plate 102 along the first direction P1 and are each detachably fastened to the heat conduction element fastening assemblies 104.

[0041] Specifically, the liquid cooling device 100 is arranged in a symmetrical layout, so that the overall layout of the liquid cooling device 100 is more beautiful and simple, which is conducive to the installation and maintenance of the liquid cooling device 100.

[0042] It is understood that the first heat conduction structures 103, the heat conduction element fixing assemblies 104, and the second heat conduction structures 105 may be provided in larger numbers if other needs exist, and the number of the first heat conduction structures 103 arranged on the two opposite sides of the first cooling plate 102 may be the same or different, and the same applies to the heat conduction element fixing assemblies 104 and the second heat conduction structures 105.

[0043] Again referring to the Fig. 3 and Fig. 5, in some feasible solutions, the first heat conduction structures 103 comprise two first heat conduction assemblies 1031, wherein the two first heat conduction assemblies 1031 are each arranged on the two opposite sides of the first cooling plate 102 along the second direction P1. The heat conduction element fastening assemblies 104 comprise two heat conduction element fastening seats 1041, wherein the two heat conduction element fastening seats 1041 are arranged spaced apart along the second direction P2, and the two first heat conduction assemblies 1031 and the two heat conduction element fastening seats 1041 are uniquely connected.The second heat conduction structures 105 include a plurality of second heat conduction elements 1051, wherein the plurality of second heat conduction elements 1051 are spaced apart along the first direction P1 and removably attached to the two heat conduction element mounting seats 1041, wherein any two of the second heat conduction elements 1051 are used to clamp the memory module 400. The first cooling plate 102 dissipates heat from the memory module 400 via the first heat conduction assemblies 1031, the heat conduction element mounting seats 1041, and the second heat conduction elements 1051, wherein the first direction P1 and the second direction P2 are arranged at an angle in the extension plane of the first cooling plate 102.

[0044] More specifically, the bottom surface of the heat conduction element fixing seats 1041 may be used to fix the VR power module 300, and the heat generated by the VR power module 300 during operation is transferred through the heat conduction element fixing seats 1041 to the first heat conduction assemblies 1031, then transferred from the first heat conduction assemblies 1031 to the cooling plate cover plate 1023, and finally dissipated through the cooling liquid.The second heat conduction elements 1051 may be in the form of a plate or a sheet, both ends of which are detachably attached to the two heat conduction element attachment seats 1041, respectively, and any two adjacent ones of the second heat conduction elements 1051 may clamp and attach a memory strip, and the heat generated by the memory strip during operation is transferred to the second heat conduction elements 1051, then transferred to the cooling plate cover plate 1023 via the heat conduction element attachment seats 1041 and the first heat conduction assemblies 1031.To increase the heat conduction efficiency, a heat-conducting spacer 1041a may be arranged on the surface where the heat-conducting element fixing seats 1041 and the VR power supply module 300 are in contact to fill the gap between the heat-conducting element fixing seats 1041 and the VR power supply module 300, and in the same way, the surfaces where the second heat-conducting elements 1051 are in contact with the memory strip, that is, the surfaces facing the memory module 400, may be provided with a heat-conducting spacer.

[0045] With reference to the Fig. 11 and Fig. 12, a groove may be further arranged in the side wall of the second heat conduction elements 1051 that is in contact with the memory strip, and a heat pipe 1051a may be embedded in the groove, the heat pipe being in a flattened state, or it may be a plate with a homogeneous temperature, so that the heat dissipation efficiency to the memory module 400 can be increased. Two different types of arrangement of the heat pipe 1051a are shown in Fig. 11 and Fig. 12 shown.

[0046] Preferably, the first direction P1 and the second direction P2 are perpendicular to each other, and the plurality of second heat conduction structures 105 are respectively arranged on the two opposite sides of the first cooling plate 102, so that mutual interference of different first heat conduction structures 103 can be avoided as much as possible.

[0047] With further reference to Fig. 5 to Fig. 8, in some feasible solutions, the first heat conduction structures 103 further comprise a mounting plate 1032, wherein the first heat conduction assemblies 1031 comprise a plurality of first heat conduction elements 1031a, wherein one end of the plurality of first heat conduction elements 1031a is fixed to the mounting plate 1032 and the other end of the plurality of first heat conduction elements 1031a is fixed to the heat conduction element fixing seats 1041. The mounting plate 1032 is also fixed to the first cooling plate 102, wherein the first heat conduction elements 1031a are in thermal contact with the first cooling plate 102 via the mounting plate 1032.

[0048] Specifically, the first heat conduction elements 1031a may have an L-shape, wherein a side of one of its ends facing the cooling plate cover plate 1023 abuts against the fixing plate 1032, wherein the fixing plate 1032 abuts against the cooling plate cover plate 1023, and wherein the heat dissipation efficiency can be increased by the fixing plate 1032 increasing the contact area between the first heat conduction elements 1031a and the cooling plate cover plate 1023.In order to prevent the first heat conduction elements 1031a from detaching from the fixing plate 1032, a pressure plate 1033 for fixing to the cooling plate cover plate 1023 may further be provided, wherein the end of the first heat conduction elements 1031a overlapping the cooling plate cover plate 1023 and the fixing plate 1032 are each clamped between the pressure plate 1033 and the cooling plate cover plate 1023, and the pressure plate 1033 and the cooling plate cover plate 1023 may be fixed to each other by screws, rivets or the like. In order to avoid the liquid inlet port 1023a and the liquid outlet port 1023b, the pressure plate 1033 may be designed more concretely in an H-shape, wherein arms projecting from its both ends may be used to hold the first heat conduction elements 1031a and the fixing plate 1032, and a recess between two arms on the same side may avoid the ports.

[0049] Optionally, the first heat conduction elements 1031a may be flat heat pipes or plates with a homogeneous temperature, so that flow channel-free cooling and heat dissipation can be achieved, the risk of liquid leakage can be reduced and the reliability of the liquid cooling device 100 can be increased.

[0050] With further reference to Fig. 5 and Fig. 6, in some feasible solutions, the heat conduction element fixing seat 1041 is provided with a plurality of fixing grooves 1041b, both ends of the plurality of second heat conduction elements 1051 along the first direction P1 are respectively embedded in the fixing grooves 1041b of the two heat conduction element fixing seats 1041, and the surfaces of the inner walls of the second heat conduction elements 1051 facing the fixing grooves 1041b are partially provided with a scratch-resistant film.

[0051] Specifically, a plurality of spaced-apart fixing grooves 1041b are provided on the heat conduction element fixing seats 1041. The fixing grooves 1041b extend along the second direction P2, and each of the fixing grooves 1041b has one end of the second heat conduction elements 1051 embedded in it. Since the second heat conduction elements 1051 need to be inserted and removed during maintenance of the memory module 400, the scratch-resistant film may be disposed on the surface of the second heat conduction elements 1051 embedded in the fixing grooves 1041b to prevent the second heat conduction elements 1051 from being damaged during repeated insertion and removal. The scratch-resistant film may be a PI film, a metal foil, or the like.Furthermore, the scratch-resistant film is arranged on a side of the heat-conducting spacer facing away from the second heat-conducting elements 1051 on the second heat-conducting elements 1051.

[0052] It is understood that the electronic device includes a memory slot for mounting and electrically connecting the memory module 400. When the memory module 400 is mounted to the memory slot, the second heat conduction members 1051 dissipate heat through the part of the memory module 400 exposed outside the memory slot. Therefore, the height of the heat conduction member mounting seats 1041 can be increased, and thus the height of the second heat conduction members 1051 can be increased by providing a bracket 108. Based on heat dissipation and considering the electronic device, it is possible for the liquid cooling device 100 to support a server with a height of 1U (1U = 4.445 cm) through the bracket 108.

[0053] With further reference to Fig. 3, in some feasible solutions, since one of the second heat conduction structures 105 comprises a plurality of second heat conduction elements 1051, in order that each of the second heat conduction elements 1051 and the storage module 400 lie closely against each other so that the second heat conduction element 1051 can efficiently dissipate the heat from the storage module 400, the liquid cooling device 100 may further comprise a clamping element 109, wherein the clamping element 109 is arranged on the second heat conduction structures 105, and wherein the clamping element is used for clamping and fixing the plurality of the second heat conduction elements.

[0054] For example, the clamping element 109 may be a buckle means or a clamp for clamping the plurality of the second heat conduction elements 1051, such that each of the second heat conduction elements 1051 clamps the memory module 400 by applying a force on both sides of the second heat conduction structures 105 toward the center.

[0055] Again referring to Fig. 8, two second cooling plates 110 are also included in some feasible solutions, the two second cooling plates 110 are respectively arranged on the two opposite sides of the first cooling plate 102 along the second direction P2, the two second cooling plates 110 are adjacent to the first cooling plate 102 and are in thermal contact with the first cooling plate, and the two second cooling plates 110 are used to dissipate heat from the VR power supply module 300.

[0056] In fact, the number of the VR power supply modules 300 is adjustable according to the actual needs, and when one of the VR power supply modules 300 is additionally arranged on the two opposite sides of the CPU 200 along the second direction P2, that is, heat dissipation by the newly added second cooling plate 110 is required.

[0057] In the present application, the cooling liquid may be deionized water, an aqueous solution of propylene glycol, an aqueous solution of ethylene glycol, or another cooling liquid. The first cooling plate 102, the first heat conduction structures 103, the heat conduction element mounting seats 1041, and the second heat conduction structures 105 may be made of aluminum, copper, an aluminum alloy, or other metals with superior thermal conduction properties, and the specific selection of materials may be determined based on the cooling liquid used. Note that, since among these heat dissipation structures, only the first cooling plate 102 is in direct contact with the cooling liquid, compatibility with the cooling liquid for heat dissipation structures other than the first cooling plate 102 can be neglected.

[0058] It should be noted that all of the above-mentioned executable solutions can be implemented individually or in any combination according to the actual situation without conflicting with each other, and the specific combination is subject to the teachings of the present application and can be adapted according to actual needs, which are not described in detail here.

[0059] The liquid cooling device 100 provided by the present application has at least one of the following advantageous effects: 1. The heat generated by the VR power supply module 300 and the storage module 400 is concentrated and dissipated onto the first cooling plate 102 by means of the first heat conduction structures 103, the heat conduction element fixing seats 1041, and the second heat conduction structures 105, which can reduce the risk of liquid leakage and increase the reliability of the liquid cooling device 100. 2. The piping layout of the liquid cooling device is simple, the first cooling plate 102 is designed in double-sided liquid cooling design, with a compact structure, few piping connections, easy installation and maintenance, and reduced cost of liquid leakage. 3. The second heat conduction structures 105 are arranged in the heat conduction element fixing seats 1041 in a pluggable and retractable manner, which can increase the convenience of maintenance of the memory module 400. 4. The liquid cooling heat transfer device 100 can support the heat transfer requirements of a 1U server, increase the percentage of liquid cooling, and reduce the PUE (Power Usage Effectiveness).

[0060] A further embodiment of the present application provides an electronic device comprising: a device body and a liquid cooling device 100 described in the previous embodiments, wherein the liquid cooling device is arranged on the device body.

[0061] The electronic device in the present application may be a server, a computer, or other electronic device in which the liquid cooling device 100 provided by the present application is applied, and no specific limitation is made thereto here.

[0062] Above, the liquid cooling device and electronic device provided by the embodiments of this application are introduced in detail, and in this document, the principles and embodiments of the present application are explained using specific examples; the above explanations of the embodiments are only used to help understand the idea of ​​the present application and may be changed in the specific embodiments and scope of application; in summary, the content of this specification should not be construed as a limitation of the present application. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] CN 202311237649.0

[0001]

Claims

[1] A liquid cooling device, characterized by that it includes: a liquid inlet pipe for supplying cooling liquid; a first cooling plate having a liquid receiving chamber connected to the liquid inlet tube, the liquid receiving chamber being used to receive the cooling liquid, and the first cooling plate being used to dissipate heat from a CPU; a plurality of first heat conduction structures spaced apart from the first cooling plate along a first direction, the plurality of first heat conduction structures and the first cooling plate being in thermal contact; a plurality of heat conduction element mounting assemblies spaced apart from the first cold plate along the first direction, the heat conduction element mounting assemblies and the first heat conduction structures being in explicit thermal contact, the heat conduction element mounting assemblies being used to thermally contact a VR power module to dissipate heat from the VR power module; a plurality of second heat conduction structures spaced apart from the first cold plate along the first direction, the second heat conduction structures being uniquely and releasably attached to the heat conduction element attachment assemblies, the second heat conduction structures being used to clamp and secure a memory module and to dissipate heat from the memory module. [2] Liquid cooling device according to claim 1, characterized bythat the number of the first heat conduction structures is two, wherein the two first heat conduction structures are each arranged on two opposite sides of the first cooling plate along the first direction and are in thermal contact with the first cooling plate; that the number of the heat conduction element fastening assemblies is two, wherein the two heat conduction element fastening assemblies are each arranged on the two opposite sides of the first cooling plate along the first direction and are each fixedly connected to the two first heat conduction structures; and that the number of the second heat conduction structures is two, wherein the two second heat conduction structures are each arranged on the two opposite sides of the first cooling plate along the first direction and are each detachably connected to the heat conduction element fastening assemblies. [3] Liquid cooling device according to claim 2, characterized bythat the first heat conduction structures comprise two first heat conduction assemblies, wherein the two first heat conduction assemblies are respectively arranged on the two opposite sides of the first cooling plate along the second direction; that the heat conduction element fastening assemblies comprise two heat conduction element fastening seats, wherein the two heat conduction element fastening seats are arranged at a distance along the second direction and the two first heat conduction assemblies and the two heat conduction element fastening seats are uniquely connected; that the second heat conduction structures comprise a plurality of second heat conduction elements, the plurality of second heat conduction elements being spaced apart from the second heat conduction elements along the first direction and detachably fastened to the two heat conduction element fastening seats, and any two of the second heat conduction elements are used to clamp the memory module;that the first cooling plate dissipates heat from the storage module via the first heat conduction assemblies, the heat conduction element mounting seats and the second heat conduction assemblies, wherein the first direction and the second direction are arranged at an angle in an extension plane of the first cooling plate; [4] Liquid cooling device according to claim 3, characterized bythat the first heat conduction structures further comprise a mounting plate, wherein the first heat conduction assemblies comprise a plurality of first heat conduction elements, wherein one end of the plurality of first heat conduction elements is fixed to the mounting plate and the other end of the plurality of first heat conduction elements is fixed to the heat conduction element fixing seats; and that the mounting plate is further fixed to the first cooling plate, wherein the first heat conduction elements thermally contact the first cooling plate via the mounting plate. [5] Liquid cooling device according to claim 3, characterized byin that the heat conduction element fixing seats are provided with a plurality of fixing grooves, both ends of the plurality of second heat conduction elements are embedded along the first direction in the fixing grooves of the two heat conduction element fixing seats, respectively, and a scratch-resistant film is arranged on a surface of the second heat conduction elements facing the inner walls of the fixing grooves, in a partially adhered manner. [6] Liquid cooling device according to claim 3, characterized by that it further comprises two second cooling plates, wherein the two second cooling plates are respectively arranged on the two opposite sides of the first cooling plate along the second direction, the two second cooling plates are adjacent to and thermally contact the first cooling plate, and the two second cooling plates are used to dissipate heat from the VR power supply module. [7] Liquid cooling device according to claim 1, characterized by that the first cooling plate comprises a cooling plate fixing plate, a cooling plate cover plate, and a cooling plate base plate, wherein the cooling plate cover plate and the cooling plate base plate are arranged on both opposite sides of the cooling plate fixing plate, and the cooling plate fixing plate, the cooling plate cover plate, and the cooling plate base plate enclose the liquid-receiving chamber; and that opposite surfaces of the cooling plate cover plate and the cooling plate base plate are each provided with heat dissipation fins. [8] Liquid cooling device according to one of claims 3 to 7, characterized by that a heat-conducting spacer is arranged partially glued to a surface of the second heat conduction elements facing the storage module. [9] Liquid cooling device according to one of claims 3 to 7, characterized bythat it further comprises a clamping element, wherein the clamping element is arranged on the second heat conduction structures, wherein the clamping element is used for clamping and fixing the plurality of the second heat conduction elements. [10] An electronic device, characterized by that it comprises a device body and a liquid cooling device according to one of claims 1-9, wherein the liquid cooling device is arranged on the device body.

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