HIGH-VOLTAGE MANAGEMENT CHIP, BATTERY MANAGEMENT SYSTEM AND BATTERY MANAGEMENT METHOD

Abstract

A vehicle and a battery management system are provided. The vehicle includes a battery management system (1). The battery management system (1) has a high-voltage management chip (10). The high-voltage management chip (10) includes a sensing circuit (11) and a digital processing circuit (12). The sensing circuit (11) is electrically connected to a power cable of a battery pack and is configured to acquire state parameter information of the battery pack. The digital logic circuit (12) is connected to the sensing circuit (11) and is configured to control the sensing circuit (11) and to estimate a state of charge and / or health value of the battery pack based on the state parameter information of the battery pack.

Description

CROSS-REFERENCE TO RELATED REGISTRATIONS

[0001] The present disclosure claims priority from Chinese patent application No. 202310488307.X, filed with the China National Intellectual Property Administration on April 28, 2023, entitled “HIGH-VOLTAGE MANAGEMENT CHIP, BATTERY MANAGEMENT SYSTEM, VEHICLE AND BATTERY MANAGEMENT METHOD”, which is incorporated herein by reference in its entirety. TECHNICAL AREA

[0002] The present disclosure relates to the technical field of batteries and in particular to a high-voltage management chip, a battery management system and a battery management method. BACKGROUND

[0003] In a related technology, the chip and circuitry involved in high-voltage sensing within a battery management system are complex, resulting in delayed detection and low sensing efficiency. The current state of a battery pack cannot typically be detected in a timely manner. Therefore, it is necessary to improve the high-voltage sensing system within the conventional battery management system. SUMMARY

[0004] The present disclosure is intended to solve at least one of the prior art technical problems. To this end, a first objective of the present disclosure is to provide a high-voltage management chip. The high-voltage management chip has a simple architecture, can detect the current state of a battery pack in a timely manner, and therefore exhibits high detection efficiency.

[0005] A second purpose of the present disclosure is to provide a battery management system.

[0006] A third purpose of the present disclosure is to provide a battery management procedure.

[0007] To solve the above problem, a high-voltage management chip according to an embodiment of a first aspect of the present disclosure is used in a battery management system. The high-voltage management chip comprises: a sensing circuit electrically connected to a power cable of a battery pack and configured to acquire state parameter information of the battery pack; and a digital logic circuit connected to the sensing circuit and configured to control the sensing circuit and to estimate a state of charge value and / or a state of health value of the battery pack based on the state parameter information of the battery pack.

[0008] According to the high-voltage management chip described in the embodiments of the present disclosure, based on an architecture comprising the sensing circuit and the digital logic circuit, the state parameter information of the battery pack is actively acquired, and the digital logic circuit can estimate the state of charge value and / or the health state value of the battery pack in a timely manner, so that the current state of the battery pack can be acquired in a timely manner, thereby improving the stability and safety of the system.

[0009] In some embodiments, the high-voltage management chip further includes a power supply circuit. The power supply circuit is connected to an external power supply, and an output end of the power supply circuit is connected to an electrical circuit within the high-voltage management chip to provide operating current for the electrical circuit.

[0010] In some embodiments, the power supply circuit includes: a voltage converter sub-circuit connected to the power supply circuit and configured to provide different operating voltages for electrical circuits within the high-voltage management chip.

[0011] In some embodiments, the power supply circuit further includes a power supply voltage sensing circuit. The power supply voltage sensing circuit is separately connected to the voltage converter sub-circuit and the digital logic circuit and is configured to detect whether an output voltage of the voltage converter sub-circuit is within an operating range of the power supply circuit and to send a detection result to the digital logic circuit.

[0012] In some embodiments, the power supply circuit further comprises a power supply control circuit. The power supply control circuit is connected to the digital logic circuit and is configured to regulate the output voltage of the voltage converter sub-circuit so that it remains within the operating range of the power supply circuit when the output voltage of the voltage converter sub-circuit is outside the operating range of the power supply circuit.

[0013] In some embodiments, the high-voltage management chip further includes a power supply interface circuit. The power supply interface circuit is configured to be connected to an external power supply and is configured to provide operating current for the electrical circuitry within the high-voltage management chip.

[0014] In some embodiments, the high-voltage management chip further includes a peripheral differential sensing circuit. One end of the peripheral differential sensing circuit is connected to the battery pack's power cable, and the other end is connected to a signal input pin of the high-voltage management chip. The sensing circuit acquires the battery pack's state parameter information via the peripheral differential sensing circuit.

[0015] In some embodiments, the sensing circuit includes a voltage sensing circuit. The voltage sensing circuit is connected to the signal input terminal of the high-voltage management chip and is configured to acquire voltage information from the battery pack.

[0016] In some embodiments, the sensing circuit further includes a current sensing circuit. The current sensing circuit is connected to the signal input terminal and is configured to detect current information from the battery pack.

[0017] In some embodiments, the digital logic circuit is separately connected to the voltage sensing circuit and the current sensing circuit and is configured to estimate the state of charge value and / or the health value of the battery pack based on the voltage information and the current information of the battery pack.

[0018] In some embodiments, the sensing circuit includes an insulation resistance sensing circuit. The insulation resistance sensing circuit is connected to the signal input terminal of the high-voltage management chip and is configured to detect a resistance value between the battery pack's power cable and a vehicle body insulation ground. The digital logic circuit is further connected to the insulation resistance sensing circuit and is configured to determine a battery pack leakage condition based on the resistance value.

[0019] In some embodiments, the high-voltage management chip further includes a safety diagnostic circuit. The safety diagnostic circuit is connected to the sensing circuit and is configured to identify whether the battery pack's state parameter information is abnormal and to implement safety protection if the battery pack's state parameter information is abnormal.

[0020] In some embodiments, the safety diagnostic circuit includes a current diagnostic circuit. The current diagnostic circuit is connected to the current sensing circuit and is configured to identify, based on the battery pack's current information, whether an overcurrent is occurring in the battery pack and to perform overcurrent protection if an overcurrent occurs in the battery pack.

[0021] In some embodiments, the safety diagnostic circuit includes a voltage diagnostic circuit. The voltage diagnostic circuit is connected to the voltage sensing circuit and is configured to identify, based on the voltage information from the battery pack, whether an overvoltage or undervoltage is occurring in the battery pack and to perform overvoltage or undervoltage protection if such an overvoltage or undervoltage occurs in the battery pack.

[0022] In some embodiments, the high-voltage management chip includes a universal input / output interface circuit. This universal input / output interface circuit is connected to an external sensor or load and is configured to collect information from the external sensor or output a control signal to the external load.

[0023] In some embodiments, the high-voltage management chip further comprises: a temperature sensing circuit connected to an external temperature sensor via the universal input / output interface circuit to acquire temperature information from the high-voltage management chip; and a temperature diagnostic circuit connected to the temperature sensing circuit and configured to identify, based on the temperature information from the high-voltage management chip, whether an overtemperature is occurring in the high-voltage management chip and to perform overtemperature protection if the overtemperature is occurring in the high-voltage management chip.

[0024] In some embodiments, the digital logic circuit is further configured to receive configuration information of the high-voltage management chip from a processor chip of the battery management system and to send at least one selected of acquisition information, calculation result information, safety diagnostic information or safety alarm information of the high-voltage management chip to the processor chip.

[0025] In some embodiments, the high-voltage management chip further includes a communication interface circuit configured to transmit the battery pack's state parameter information and / or the battery pack's state of charge and health status to the battery management system's processor chip.

[0026] In some embodiments, the communication interface circuit is a serial daisy-chain peripheral interface (SPI) circuit, and the high-voltage management chip is connected to the processor chip via the serial daisy-chain peripheral interface circuit.

[0027] In some embodiments, the high-voltage management chip is connected to a serial daisy-chain peripheral interface bridge chip via the serial daisy-chain peripheral interface circuit, and the serial daisy-chain peripheral interface bridge chip is configured to be connected to the processor chip.

[0028] In some embodiments, the high-voltage management chip sends data to the serial daisy-chain peripheral interface bridge chip via the serial daisy-chain peripheral interface circuit, and the serial daisy-chain peripheral interface bridge chip sends data to the processor chip via a first standard peripheral interface circuit.

[0029] In some embodiments, a second serial daisy-chain peripheral interface circuit and the first standard peripheral interface circuit are integrated into the bridge chip of the processor chip.

[0030] In some embodiments, the communication interface circuit includes a second standard peripheral interface circuit and / or an I2C bus interface circuit, and the second standard peripheral interface circuit and / or the I2C bus interface circuit is configured to connect the high-voltage management chip to the processor chip.

[0031] In some embodiments, the high-voltage management chip further includes a controller local area network (CAN) interface circuit. The CAN interface circuit is configured to connect to an external communication bus in order to receive external bus information.

[0032] To solve the aforementioned problem, a battery management system according to an embodiment of a second aspect of the present disclosure comprises a processor chip, the high-voltage management chip, an analog front-end chip, and an application-specific integrated circuit (ASIC). The processor chip is electrically connected to the application-specific integrated circuit, and the application-specific integrated circuit is further electrically connected to the high-voltage management chip and the analog front-end chip.

[0033] According to the battery management system described in the embodiments of the present disclosure, the high-voltage management chip in one of the foregoing embodiments is used to actively acquire the state parameter information of the battery pack, so that the current state of the battery can be acquired in a timely manner and the acquisition of high-voltage signals is more reliable, thereby improving the stability and safety of the system.

[0034] In some embodiments, the battery management system is located in a vehicle. The vehicle further includes a battery pack, and the battery pack is connected to the battery management system.

[0035] According to the vehicle described in the embodiments of the present disclosure, the current state of the battery pack can be detected in a timely manner using the high-voltage battery management chip according to one of the preceding embodiments, the reliability of the parameter detection of the battery pack is improved, and the consistency and safety of an entire battery system are improved.

[0036] A battery management method according to an embodiment of a third aspect of the present disclosure is applied to the high-voltage management chip. The battery management method comprises: acquiring state parameter information of a battery pack using an acquiring circuit of the high-voltage management chip; and controlling the acquiring circuit using a data logic circuit of the high-voltage management chip and estimating a state of charge value and / or a health value of the battery pack based on the state parameter information of the battery pack.

[0037] According to the battery management method described in the embodiments of the present disclosure, the state parameter information of the battery pack is actively acquired, and the state of charge value and / or the health value of the battery pack is estimated by the data logic circuit, so that a current state of the battery can be acquired in a timely manner and the signal reliability can be improved, thereby improving the stability and safety of the system.

[0038] In some embodiments, the battery pack's state parameter information includes voltage and current information. The battery management procedure further includes estimating the battery pack's state of charge and / or health value based on the battery pack's voltage and current information.

[0039] In some embodiments, the battery pack's condition parameter information includes a resistance value between the battery pack's power cable and a vehicle body insulating ground. The battery management method further includes determining a battery pack leakage state based on this resistance value.

[0040] In some embodiments, the battery management method further includes: identifying whether the battery pack's state parameter information is abnormal, and performing a safety protection if the battery pack's state parameter information is abnormal.

[0041] In some embodiments, the high-voltage battery pack management system's identification of whether the battery pack's state parameter information is abnormal, and the implementation of safety protection when the battery pack's state parameter information is abnormal, includes at least one of the following: identifying whether an overcurrent is occurring in the battery pack, based on the battery pack's current information, and implementing overcurrent protection when the overcurrent occurs in the battery pack; and identifying whether an over- or undervoltage is occurring in the battery pack, based on the battery pack's voltage information, or implementing over- or undervoltage protection when the over- or undervoltage occurs in the battery pack.

[0042] In some embodiments, the battery management method further includes: obtaining temperature information from the high-voltage management chip; and identifying whether an overtemperature occurs in the high-voltage management chip, based on the temperature information from the high-voltage management chip, and performing overtemperature protection when the overtemperature occurs in the high-voltage management chip.

[0043] In some embodiments, the battery management method further includes: receiving configuration information of the high-voltage management chip from a processor chip of the battery management system and sending at least one selected of acquisition information, calculation result information, safety diagnostic information or safety alarm information of the high-voltage management chip to the processor chip.

[0044] Additional aspects and benefits of the present revelation are partly set forth in the following description and partly become apparent from the following description or can be learned through the practical application of the present revelation. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The foregoing and / or additional aspects and advantages of the present disclosure will become apparent and easily understandable from the description of the embodiments in conjunction with the following accompanying drawings, wherein: Fig. 1 a block diagram of a high-voltage management chip according to an embodiment of the present disclosure; Fig. 2 a block diagram of a high-voltage management chip according to a further embodiment of the present disclosure; Fig. 3 a block diagram of a power supply circuit according to an embodiment of the present disclosure; Fig. 4 a block diagram of a battery management system according to an embodiment of the present disclosure; Fig. 5 a block diagram of a vehicle according to an embodiment of the present disclosure; Fig. 6 a flowchart of a battery management method according to an embodiment of the present disclosure; Fig. 7 a flowchart of a battery management method according to a further embodiment of the present disclosure; Fig. 8 is a flowchart of a battery management method according to an embodiment of the present disclosure; and Fig. 9 is a flowchart of a battery management method according to yet another embodiment of the present disclosure. Reference symbol:

[0046] 1000: Vehicle; 1: Battery management system; 2: Battery pack; 10: High-voltage battery management chip; 11: Sensing circuit; 13: Digital logic circuit; 14: Power supply circuit; 12: Communication interface circuit; 15: Peripheral differential sensing circuit; 16: Safety diagnostic circuit; 17: Universal input / output interface circuit; 18: Temperature sensing circuit; 19: Temperature diagnostic circuit; 111: Voltage sensing circuit; 112: Current sensing circuit; 113: Insulation resistance sensing circuit; 162: Voltage diagnostic circuit; 161: Current diagnostic circuit; 141: Voltage converter sub-circuit; 142: Power supply voltage sensing circuit; 143: Power supply regulation circuit; 21: Power supply interface circuit; 22: Controller local area network bus interface circuit; 23: Signal input connector; 20: Processor chip; 30: Analog front-end chip; 40: application-specific integrated circuit. DESCRIPTION OF THE EXECUTION FORMS

[0047] Embodiments of the present disclosure are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Embodiments of the present disclosure are described in detail below.

[0048] The stability and safety of a vehicle battery, which serves as a power source, influence the ongoing promotion and development of new energy vehicles to a certain extent. During normal driving and charging of a new energy vehicle, it is necessary to monitor various safety-related parameters of the vehicle battery in real time to determine its safety status. This also includes high-voltage monitoring of the battery.

[0049] The high-voltage sensing system of a power battery typically needs to acquire current, voltage, resistance, and other battery data. In a sensing system, the accuracy and reliability of the current and high-voltage signals are critical, especially for state-of-charge (SOC) and state-of-expansion (SOE) algorithms. Sometimes, the accuracy of the sensing values ​​cannot be guaranteed, compromising the safety of the power battery. To address this problem, one embodiment of the present disclosure provides a high-voltage management chip.

[0050] The following are, with reference to Fig. 1 to Fig. 4 high-voltage management chips are described according to embodiments of a first aspect of the present disclosure.

[0051] Fig. Figure 1 is a block diagram of a high-voltage management chip according to an embodiment of the present disclosure. As in Fig. As shown in Figure 1, the high-voltage battery management chip 10 described in the embodiment of the present disclosure comprises a detection circuit 11 and a digital logic circuit 13.

[0052] The sensing circuit 11 is electrically connected to a power cable of a battery pack and is configured to acquire state parameter information of the battery pack. In this embodiment, the sensing circuit 11 can include an analog-to-digital converter (ADC) circuit, and the AD circuit is connected to an external sensor or sensing unit to obtain the state parameter information of the battery pack.

[0053] The digital logic circuit 13 is connected to the sensing circuit 11 and is configured to control the sensing circuit 11 and to estimate a state of charge and / or health value of the battery pack based on the battery pack's state parameter information. The digital logic circuit 13 is responsible for scheduling tasks, controlling components, processing data, and the like on the chip, and can control a sensing mode of the sensing circuit 11.

[0054] According to the high-voltage management chip 10 described in the embodiments of the present disclosure, based on an architecture comprising the sensing circuit 11 and the digital logic circuit 13, the state parameter information of a battery pack is actively acquired, and the digital logic circuit 13 can estimate the state of charge and / or the health of the battery pack in a timely manner, so that the current state of the battery can be detected in a timely manner and the reliability of the high-voltage signal can be improved, thereby improving the stability and safety of the system.

[0055] In some embodiments of the present disclosure, the high-voltage management chip 10 comprises a power supply interface circuit 21. The power supply interface circuit 21 is configured to be connected to an external power supply; that is, the high-voltage management chip 10 can be connected to an external power supply via the power supply interface circuit 21. The power supply interface circuit 21 is configured to provide operating current for electrical circuits within the high-voltage management chip 10, such as the sensing circuit 11 and the digital logic circuit 13, in order to implement an external power supply.

[0056] In some examples, the high-voltage management chip 10 itself can alternatively have a power supply function. As in Fig. As shown in Figure 2, the high-voltage management chip 10 includes a power supply circuit 14.

[0057] The power supply circuit 14 is connected to an external power supply. An output end of the power supply circuit 14 is connected to the electrical circuitry within the high-voltage management chip 10 to provide operating current for the electrical circuitry within the high-voltage management chip 10, thereby implementing an autonomous power supply for the high-voltage management chip 10.

[0058] Furthermore, it is understood that the operating voltages of the electrical circuits within the high-voltage management chip 10 may differ. Therefore, a functional block diagram of a power supply circuit according to an embodiment of the present disclosure is shown in Fig. Figure 3 shows the power supply circuit 14, which includes a voltage converter sub-circuit 141. The voltage converter sub-circuit 141 is connected to the electrical circuit. The voltage converter sub-circuit 141 can provide different operating voltages for the electrical circuits within the high-voltage management chip 10 to meet the operating voltage requirements of the different electrical circuits. In this embodiment, the voltage converter sub-circuit 141 can include a step-up and / or a step-down circuit to meet the current consumption requirements of the different power supply circuits within the high-voltage management chip.

[0059] In some embodiments, such as in Fig. As shown in Figure 3, the power supply circuit 14 further comprises a power supply voltage detection circuit 142.

[0060] The power supply voltage sensing circuit 142 is separately connected to the voltage converter sub-circuit 141 and the digital logic circuit 13 and is configured to detect whether an output voltage of the voltage converter sub-circuit 141 is within an operating range of the power supply circuit 14 and to send a detection result to the digital logic circuit 13. The digital logic circuit 13 can then determine, based on a detection result, whether to initiate a voltage regulation function to provide a more stable and reliable power supply voltage.

[0061] As in Fig. As shown in Figure 3, the power supply circuit 14 further comprises a power supply control circuit 143.

[0062] The power supply control circuit 143 is connected to the digital logic circuit 13 and is configured to regulate an output voltage of the voltage converter sub-circuit 141 so that it is within the operating range of the power supply circuit when the output voltage of the voltage converter sub-circuit 141 is outside the operating range of the power supply circuit in order to provide a stable and consistent power supply.

[0063] In particular, a detection loop senses a voltage from an input source to determine whether it is necessary to start the voltage converter sub-circuit 141. If the voltage converter sub-circuit 141 needs to be started, demultiplexing is performed across the voltage converter sub-circuit 141, and an output voltage of the voltage converter sub-circuit 141 is sensed using the power supply voltage detection circuit 142. If an output voltage value of the voltage converter sub-circuit 141 is offset from a range limit by a large or small voltage, that is, outside the range limit, a signal to enable regulation is sent to the digital logic circuit 13 and stored in a register, and the digital logic circuit 13 activates the power supply regulation circuit 143.The output of the voltage converter sub-circuit 141 is output after passing through the power supply regulation circuit 143 until the output voltage of the voltage converter sub-circuit 141 is stable, and the voltage converter sub-circuit 141 can then be switched back to direct output. In this embodiment, the voltage converter sub-circuit 141 can include a voltage regulator, such as a low-dropout regulator (LDO).

[0064] It should be noted that the power supply control circuit 143 is merely a safety mechanism that is set up by the digital logic circuit 13 for a malfunction of the voltage converter sub-circuit 141 to ensure that the functionality of an application-specific integrated circuit 40 is safely completed, and cannot override the functionality of the voltage converter sub-circuit 141.

[0065] As in Fig. As shown in Figure 2, the high-voltage management chip 10 further comprises a peripheral differential sensing circuit 15. One end of the peripheral differential sensing circuit 15 is connected to the power cable of the battery pack, and another end of the peripheral differential sensing circuit 15 is connected to a signal input terminal of the high-voltage management chip 10. The sensing circuit 11 acquires the state parameter information of the battery pack via the peripheral differential sensing circuit 15.

[0066] In particular, the peripheral differential sensing circuit 15 can acquire the battery pack's state parameter information, such as a voltage differential signal or a current differential signal, and send the acquired state parameter information of the battery pack via the signal input terminal to the sensing circuit 11 in the high-voltage management chip 10, thereby enabling the sensing circuit 11 to acquire the battery pack's state parameter information. The sensing circuit 11 can include an analog-to-digital converter (ADC) circuit. The ADC circuit acquires and converts the acquisition data from the peripheral differential sensing circuit 15.

[0067] As in Fig. As shown in Figure 2, the sensing circuit 11 includes a voltage sensing circuit 111. The voltage sensing circuit 111 is connected to the signal input terminal of the high-voltage management chip 10 and is configured to acquire voltage information from the battery pack.

[0068] In this embodiment, the voltage sensing circuit 111 can be an analog-to-digital converter (ADC) circuit. The peripheral differential sensing circuit 15 detects voltage information from the battery pack and sends this information via the signal input terminal to the voltage sensing circuit 111 in the high-voltage management chip 10. The voltage sensing circuit 111 receives the voltage information and converts it.

[0069] As in Fig. As shown in Figure 2, the detection circuit 11 further comprises a current detection circuit 112. The current detection circuit 112 is connected to the signal input terminal and is configured to detect current information from the battery pack.

[0070] In particular, the current sensing circuit 112 can be an analog-to-digital converter (ADC) circuit. The peripheral differential sensing circuit 15 detects current information from the battery pack and sends this information via the signal input connector to the current sensing circuit 112 in the high-voltage management chip 10. The current sensing circuit 112 receives the current information and converts it.

[0071] In this embodiment, the processor chip of the battery management system can manage the battery management system based on the state parameter information of a battery cell and / or the battery pack, including: estimating the state of charge value and / or the state of health value of the battery pack based on the voltage information and the current information of the battery pack by the processor chip.

[0072] In particular, the voltage sensing circuit 111 and the current sensing circuit 112 of the high-voltage management chip 10 each receive the voltage and current information from the battery pack and transmit this information to the processor chip via an application-specific integrated circuit 40. Based on the voltage and current information from the battery pack, the processor chip estimates the state of charge and / or the state of health using a state-of-charge (SOC) algorithm. Furthermore, the processor chip can schedule power supply information, set an operating state for each electrical unit, and perform similar actions based on the battery pack's state of charge.

[0073] In the embodiments of the present disclosure, the digital logic circuit 13 of the high-voltage management chip 10 can alternatively have data processing capabilities. For example, the digital logic circuit can perform appropriate estimations based on the state parameter information of the battery pack and can offload data processing tasks from the processor chip, thereby reducing the data processing load of the processor chip and improving the data processing efficiency of the processor chip.

[0074] For example, the digital logic circuit 13 is separately connected to the voltage sensing circuit 111 and the current sensing circuit 112 and is configured to estimate the state of charge value and / or the health value of the battery pack based on the voltage information and the current information of the battery pack.

[0075] In this embodiment, the digital logic circuit 13 has data processing capabilities, meaning it has more advanced data processing capabilities than a simple digital logic circuit. For example, the state of charge and / or the health of the battery pack can be estimated to offload computational tasks from the processor chip, thereby improving data processing efficiency. Additionally, appropriate functional protection or error handling can be performed based on the data processing results.

[0076] In some embodiments, such as in Fig. As shown in Figure 2, the detection circuit 11 includes an insulation resistance detection circuit 113. The insulation resistance detection circuit 113 is connected to the signal input terminal 23 of the high-voltage management chip 10 and is configured to detect a resistance value between the power cable of the battery pack 2 and a vehicle body insulation ground. The digital logic circuit 13 is connected to the insulation resistance detection circuit 113 and is configured to determine a leakage condition of the battery pack based on the resistance value and can issue an alarm for timely treatment if a leakage occurs.

[0077] In particular, the insulation resistance sensing circuit 113 can be an analog-to-digital converter (ADC) circuit and can detect an insulation resistance value using a peripheral insulation resistance sensing bridge. The insulation resistance sensing circuit 113 receives the resistance value via the signal input terminal and sends the resistance value to the digital logic circuit 13. The digital logic circuit 13 can calculate and store the current insulation resistance of the battery pack. This can improve safety.

[0078] As in Fig. As shown in Figure 2, the high-voltage management chip 10 further comprises a safety diagnostic circuit 16. The safety diagnostic circuit 16 is connected to the detection circuit 11 and is configured to identify whether the battery pack's state parameter information is abnormal and to perform safety protection, such as shutting down a power supply loop of the battery pack, if the battery pack's state parameter information is abnormal.

[0079] As in Fig. As shown in Figure 2, the safety diagnostic circuit 16 includes, in particular, a current diagnostic circuit 161. The current diagnostic circuit 161 is connected to the current sensing circuit 112 and is configured to identify, based on the current information of the battery pack, whether an overcurrent is occurring in the battery pack and to perform overcurrent protection when the overcurrent is occurring in the battery pack.

[0080] In particular, the current sensing circuit 112 receives current information from the battery pack via the signal input terminal and sends this information to the current diagnostic circuit 161. The current diagnostic circuit 161 identifies whether a current value in the current information exceeds an overcurrent threshold and determines that an overcurrent is occurring in the battery pack if the current value exceeds the overcurrent threshold. If so, open-circuit protection or similar measures can be implemented in a monitoring loop. Additionally, a trigger signal for overcurrent protection can be fed back to the processor chip at a higher level to further implement overcurrent protection.

[0081] This means that a current sensing and protection loop, formed by the signal input terminal 23, the current sensing circuit 112, the current diagnostic circuit 161, and the digital logic circuit 13, detects a differential current at both ends of the battery pack and converts the differential current value into a numerical value for storage and related calculations. During sensing, overcurrent protection is continuously performed on an input current signal, and relevant protective measures, such as open circuit and short circuit protection, are implemented on the current monitoring loop.

[0082] The safety diagnostic circuit 16 includes a voltage diagnostic circuit 162. The voltage diagnostic circuit 162 is connected to the voltage detection circuit 111 and is configured to identify, based on the voltage information of the battery pack, whether an over- or undervoltage occurs in the battery pack and to perform over- or undervoltage protection if the over- or undervoltage occurs in the battery pack.

[0083] In particular, the voltage sensing circuit 111 receives the voltage information from the battery pack via the signal input terminal 23 and sends the voltage information to the voltage diagnostic circuit 162. The voltage diagnostic circuit 162 identifies whether a voltage value in the voltage information exceeds an overvoltage threshold or is lower than an undervoltage threshold, and determines whether an overvoltage is occurring in the battery pack if the voltage value exceeds the overvoltage threshold, or whether an undervoltage is occurring in the battery pack if the voltage value is lower than the undervoltage threshold, and then open-circuit protection or the like can be performed on the monitoring loop.Additionally, a trigger signal for overvoltage protection or undervoltage protection can be fed back to the processor chip to further implement overvoltage or undervoltage protection.

[0084] This means that a high-voltage detection and protection loop, formed by the signal input terminal 23, the voltage detection circuit 111, the voltage diagnostic circuit 162, and a processing module chip, detects a differential voltage at both ends of the battery pack, converts the differential voltage value into a numerical value, and stores it. During detection, over- or undervoltage protection is continuously applied to an input signal, and relevant protective measures, such as open circuit or short circuit protection, are implemented in the monitoring loop.

[0085] As in Fig. As shown in Figure 2, the high-voltage management chip 10 includes a universal input / output interface circuit 17. The universal input / output interface circuit 17 is connected to an external sensor or an external load and is configured to collect information from the external sensor or to output a control signal to the external load. For example, the external sensor may include a temperature sensor and is configured to receive temperature information from the high-voltage management chip. Alternatively, the high-voltage management chip 10 can be connected to the external load via the universal input / output interface circuit 17 to control the external load and the like.

[0086] In this embodiment, the high-voltage management chip 10 further comprises a temperature sensing circuit 18 and a temperature diagnostic circuit 19.

[0087] The temperature sensing circuit 18 is connected to an external temperature sensor via the universal input / output interface circuit 17 to acquire temperature information from the high-voltage management chip 10. The temperature diagnostic circuit 19 is connected to the temperature sensing circuit 18 and is configured to identify, based on the temperature information from the high-voltage management chip 10, whether an overtemperature is occurring in the high-voltage management chip 10 and to implement overtemperature protection if an overtemperature occurs in the high-voltage management chip 10.

[0088] In particular, the temperature sensing circuit 18 can receive a temperature sensing signal via the universal input / output interface 17. That is, the universal input / output interface 17, the temperature sensing circuit 18, the temperature diagnostic circuit 19, and the digital logic circuit 13 / processor chip form a temperature sensing and protection loop. The loop performs a temperature sensing test on the current sensing loop of the high-voltage management chip 10, converts a temperature-sensitive voltage value into a numerical value and stores it, and performs several compensation and protection measures, such as continuous thermal switch protection, on the current sensing loop based on temperature-sensitive parameters. Meanwhile, relevant protective measures, such as open circuit or short circuit protection, are implemented on a temperature-sensitive monitoring loop.

[0089] In this embodiment, a protection strategy of the high-voltage management chip 10 can include functions for stopping a relevant signal acquisition activity, stopping a computation activity, issuing an alarm to a higher-level control system, and the like. A specific operation is determined by the digital logic circuit 13 based on an acquisition result.

[0090] In some embodiments, the digital logic circuit 13 is further configured to receive configuration information of the high-voltage management chip 10 from the processor chip of the battery management system and furthermore to perform a parameter configuration on each internal circuit based on the configuration information to ensure that each circuit is working and meets requirements.

[0091] The digital logic circuit 13 is further configured to send at least one selected of acquisition information, calculation result information, safety diagnostic information or safety alarm information from the high-voltage management chip 10 to the processor chip.For example, the processor chip can receive the voltage information, current information, and the like of the battery pack, which is acquired by the high-voltage management chip 10; can receive a SOC value of the battery pack, which is estimated by the high-voltage management chip 10, in order to perform mutual verification; can furthermore receive safety diagnostic information of an overvoltage, overcurrent, undervoltage, overtemperature, and the like from the high-voltage management chip 10; and can furthermore feed safety alarm information back to the processor chip when the high-voltage management chip 10 diagnoses that the battery pack has a safety abnormality.The processor chip can determine a protective measure based on a diagnostic result; for example, the protective measure may include stopping a relevant detection step, stopping a relevant calculation step, performing further detection and diagnosis, such as an idle detection or a short circuit detection, and issuing an alarm to a higher-level control system.

[0092] In short, the high-voltage management chip 10 in the embodiments of the present disclosure can detect the differential voltage and differential current at the two ends of the battery pack, detect the insulation resistance value of the battery pack and the ambient temperature-sensitive values, and furthermore has computational and functional safety protection, safety measures and the like.

[0093] In some embodiments of the present disclosure, as in Fig. As shown in Figure 2, the high-voltage management chip 10 further comprises a communication interface circuit 12. The communication interface circuit 12 is an interface circuit for transmitting information. The communication interface circuit 12 is configured to transmit the battery pack's state parameter information to the battery management system's processor chip. The battery management system's processor chip can be a main data processing module in the battery management system and is responsible for monitoring operations, scheduling tasks, and the like for each chip or module within the battery management system.

[0094] In this embodiment, the communication interface circuit 12 can be directly connected to the processor chip and send the battery pack's state parameter information to the processor chip, or it can be connected to the processor chip via a bridge chip of the processor chip to send the battery pack's state parameter information to the processor chip.

[0095] For example, in some embodiments, the communication interface circuit 12 is a serial daisy-chain peripheral interface circuit. The high-voltage management chip 10 is connected to the processor chip via the serial daisy-chain peripheral interface circuit. A serial daisy-chain interface connection allows for isolated communication and improves communication security and reliability.

[0096] In some other embodiments, the high-voltage management chip 10 can be connected to a serial daisy-chain peripheral interface bridge chip via a serial daisy-chain peripheral interface circuit. The serial daisy-chain peripheral interface bridge chip is configured to connect to the processor chip. That is, the high-voltage management chip 10 can be connected to the processor chip via the bridge chip and communicate in a daisy-chain configuration, thus enabling isolated communication and improving communication security and reliability.

[0097] In some embodiments of the present disclosure, the communication interface circuit 12 can be a first serial daisy-chain peripheral interface circuit. The first serial daisy-chain peripheral interface circuit is configured to be connected to the processor chip via a second serial daisy-chain peripheral interface circuit and a first standard peripheral interface circuit.

[0098] In this embodiment, the second serial daisy-chain peripheral interface circuit and the first standard peripheral interface circuit can be integrated into a bridge chip of the processor chip, and the bridge chip can be used as a dedicated chip for connecting the processor chip to another chip, such as the high-voltage management chip 10 or another module. The bridge chip can include various interfaces and / or power distribution circuits and the like to implement data forwarding and information transfer between the processor chip and the other chip or module.

[0099] In particular, the processor chip uses a standard peripheral interface circuit. The high-voltage management chip 10 is connected to the processor chip via the first serial daisy-chain peripheral interface circuit, the second serial daisy-chain peripheral interface circuit, and the first standard peripheral interface circuit of the bridge chip. The serial daisy-chain peripheral interface circuit can act as communication isolation, thereby reducing signal crosstalk and improving communication stability.

[0100] In some other embodiments, the communication interface circuit 12 may include a second standard peripheral interface circuit and / or an I2C bus interface circuit. The second standard peripheral interface circuit and / or the I2C bus interface circuit is configured to connect the high-voltage management chip 10 to the processor chip. That is, the high-voltage management chip 10 may alternatively be connected directly to the processor chip via a suitable interface circuit.

[0101] As in Fig. As shown in Figure 2, the high-voltage management chip 10 in this embodiment further comprises a controller local area network bus interface circuit 22. The controller local area network bus interface circuit 22 is configured to be connected to an external communication bus in order to receive external bus information.

[0102] In particular, the processor chip is connected to the high-voltage management chip 10 via a bridge chip or directly to the high-voltage management chip 10. The processor chip can participate in the management of the high-voltage management chip 10 and can not only configure relevant parameters (operating behavior, running modes, interface parameters, timing parameters) but also analyze the state of a high-voltage signal by reading differential data collected by the high-voltage management chip 10 and calculated data. Additionally, the processor chip analyzes the operating state of the high-voltage management chip 10 by reading relevant stored data and functional safety detection data. Furthermore, the processor chip can configure relevant parameters via the analysis interface to manage a monitored chip system more intelligently.

[0103] In summary, the high-voltage management chip 10 in the embodiments of the present disclosure mainly comprises a core processing section, a sensing section, a power supply circuit 14 and a peripheral interface section.

[0104] The core processing section is responsible for scheduling tasks, controlling components, processing data, and similar activities on the chip. The acquisition section is responsible for collecting a differential signal from the differential interface of a dedicated high-voltage monitoring chip and a temperature-sensitive signal generated at a GPIO interface. It performs simple verification of the collected signal against a threshold and stores both a test signal and the collected signal. The power supply section converts an external battery voltage into a stable module drive voltage.Peripheral interfaces include, but are not limited to, a UART interface, an SPI interface, a GPIO interface, and an isolated communication interface, such as a CAN and a daisy-chain SPI, and are responsible for transmitting data and control signals between the chip and an external system and for controlling and managing external sensors.

[0105] In some embodiments, the core processing section comprises a digital logic circuit 13 and a memory 121. The digital logic circuit 13 can control the operating process of all modules within the high-voltage management chip 10, including routine testing of a relevant monitoring module, test result verification, data transmission / receive processing at a peripheral interface, and data read / write operations of the memory unit. It is also responsible for computations related to the power battery, such as SoC, SoE, and internal resistance estimation. Additionally, the digital logic circuit monitors the system's safety state, modifies the system's safety state based on an abnormal feedback signal, performs regular internal self-tests to ensure system safety, and similar functions.The term "memory 121" can be a general term for a chip that incorporates a data storage functional unit. This memory stores data generated by various chips and data sent and received by peripheral interfaces.

[0106] The sensing section mainly comprises two sections: a sensing section, which includes sensing circuits for differential high-voltage and current signals received from the signal input connector, such as current and voltage sensing circuits, and a temperature sensing section, which includes a sensing loop for an ambient temperature signal from a universal input / output (GPIO) connector, such as a temperature sensing module.

[0107] In the embodiments of the present disclosure, a superior management processing system can set operating parameters for the high-voltage management chip 10, and the system can be started for operation.

[0108] After startup, the high-voltage management chip detects 10 current and voltage signals via a peripheral circuit at the signal input port and monitors the external temperature using a temperature-sensitive sensor. If it detects that the current temperature exceeds the operating temperature, the corresponding operating modules and tasks are shut down to ensure the safety of the dedicated chip and to send an abnormal signal to the higher-level processing system.

[0109] The differential signal at the signal input terminal is converted into a digital signal by a corresponding acquisition circuit 11 within the chip, and a result is stored. Furthermore, a threshold-limited diagnostic operation is performed on the acquired signal to check whether the collected differential signal corresponds to a normal operating range, and a result is stored. If a non-coherent step change is detected between a currently acquired differential signal and a previous signal, the processing unit initiates the protection circuit, checks for an abnormality in the relevant loop, interface, or module, and sends an abnormal signal to the higher-level processing system.

[0110] The digital logic circuit 13 can perform estimation calculations on the differential voltage, current and temperature signals acquired within a specific time, including SoC, SoH and the like, according to requirements, store results and transfer relevant data to the higher processing system.

[0111] In addition, in some embodiments, the digital logic circuit 13 can also trigger the protection circuit irregularly or periodically based on the configuration information in order to diagnose some or all modules in order to detect operating states of the modules and to ensure normal operation of the dedicated chip.

[0112] In some embodiments, the high-voltage management chip 10 can be provided with a peripheral interface, a signal input connector, a universal input / output connector, a power supply input connector, and the like, on a package for connection to a peripheral circuit or module, and other modules of the high-voltage management chip 10 are arranged within the package. That is to say, the high-voltage management chip 10 in the embodiments of the present disclosure integrates a core processing section, a sensing section, a power supply section, and a peripheral interface.

[0113] In general, the high-voltage management chip 10, in the embodiments of the present disclosure, implements functions such as active measurement, computation, and safety diagnostics, which not only improves the measurement efficiency and consistency of a measurement system but also simplifies system circuitry, reduces the number of components, and increases the system's computational accuracy. Furthermore, functional safety detection, diagnostic, and protection circuits are systematically integrated, thereby reducing the system failure rate.

[0114] Based on the high-voltage management chip in one of the foregoing embodiments, an embodiment of a second aspect of the present disclosure provides a battery management system.

[0115] As in Fig. As shown in Figure 4, a battery management system 1 in the embodiments of the present disclosure comprises a high-voltage management chip 10, an application-specific integrated circuit 40, an analog front-end chip 30 and a processor chip 20.

[0116] The processor chip 20 is electrically connected to the application-specific integrated circuit 40. The application-specific integrated circuit 40 is further electrically connected to the high-voltage management chip 10 and the analog front-end chip 30. The application-specific integrated circuit 40 serves as a bridge chip between the processor chip 20 and each of the analog front-end chip 30 and the high-voltage management chip 10 to implement functions such as data forwarding and / or power distribution.

[0117] In the battery management system 1 in the embodiments of the present disclosure, the high-voltage management chip 10 of one of the preceding embodiments is used to actively acquire the state parameter information of the battery pack and to estimate the state of charge value and the health state value of the battery pack, so that the current state of the battery pack can be acquired in a timely manner and the high-voltage signal can be acquired more reliably, thereby improving the stability and safety of the system.

[0118] In one embodiment, the battery management system 1 is arranged in a vehicle. As in Fig. As shown in Figure 5, the vehicle 1000 comprises a battery pack 2 and the battery management system 1, which is described in the preceding embodiment. The battery management system 1 is connected to the battery pack 2 and is configured to manage the battery pack 2.

[0119] In the vehicle 1000 in the embodiments of the present disclosure, the reliability of the parameter acquisition of the battery pack 2 can be improved and the consistency and safety of the entire battery system can be improved by using the high-voltage management chip 10 according to the preceding embodiment.

[0120] Based on the high-voltage management chip described in one of the foregoing embodiments, an embodiment of a fourth aspect of the present disclosure provides a battery management method.

[0121] Fig. Figure 6 is a flowchart of a battery management method according to an embodiment of the present disclosure. As in Fig. As shown in section 6, the procedure comprises the following steps.

[0122] In S1, state parameter information of a battery pack is acquired by a sensing circuit of a high-voltage management chip.

[0123] In S2, the sensing circuit is controlled by a data logic circuit of the high-voltage management chip, and a state of charge value and / or a state of health value of the battery pack is / are estimated based on the state parameter information of the battery pack.

[0124] According to the battery management method described in the embodiments of the present disclosure, the high-voltage management chip actively acquires state parameter information of the battery pack and estimates a battery state, so that a current state of the battery pack can be detected in a timely manner and the reliability of a high-voltage signal can be improved, thereby improving the stability and safety of the system.

[0125] The battery pack's state parameter information includes voltage and current information. The battery management method further includes estimating the state of charge and / or health of the battery pack based on this voltage and current information. That is, the high-voltage management chip described in the embodiments of this disclosure possesses autonomous computing capabilities and can offload data processing tasks from a processor chip, thereby improving the processor chip's data processing efficiency.

[0126] In some embodiments, the battery pack's condition parameter information includes a resistance value between the battery pack's power cable and a vehicle body insulation ground. The battery management procedure further includes: determining a battery pack leakage state based on this resistance value. Furthermore, if a leakage occurs, leakage protection measures can be implemented, such as shutting down a high-voltage power supply and / or feeding alarm information back to a higher-level processor chip, thereby improving safety.

[0127] In the embodiments of the present disclosure, the high-voltage management chip further comprises a multi-stage safety protection function. For example, the battery management method further includes: identifying whether the battery pack's state parameter information is abnormal, and performing safety protection if the battery pack's state parameter information is abnormal.

[0128] Appropriate protective measures, implemented when an abnormality occurs, may include stopping relevant data acquisition activity, stopping relevant computation activity, performing further data acquisition and diagnostics (idle or short-circuit detection), issuing an alarm to a higher-level control system, and the like. Specific operations are determined based on the differential signal acquisition result.

[0129] Furthermore, the high-voltage management chip's identification of whether the battery pack's state parameter information is abnormal, and the implementation of safety protection if the battery pack's state parameter information is abnormal, includes at least one of the following: identifying whether an overcurrent is occurring in the battery pack based on the battery pack's current information, and implementing overcurrent protection if the overcurrent occurs in the battery pack; and identifying whether an over- or undervoltage is occurring in the battery pack based on the battery pack's voltage information, or implementing over- or undervoltage protection if the over- or undervoltage occurs in the battery pack.

[0130] In some embodiments, temperature information from the high-voltage management chip can also be obtained, and whether an overtemperature occurs in the high-voltage management chip is identified based on the temperature information of the high-voltage management chip, and overtemperature protection is carried out if the overtemperature occurs in the high-voltage management chip.

[0131] According to the high-voltage management method described in the embodiments of this disclosure, the battery pack's state parameter information is actively obtained, and a safety diagnosis is performed; that is, active measurement or diagnosis is carried out. A state value of the battery unit is estimated based on the electrical differential signal, and appropriate protection is implemented if an abnormality is detected; that is, active measurement, calculation, and safety diagnosis are performed. Operations such as frequent signal reception and forwarding are not required. This not only improves measurement efficiency and signal stability but also simplifies the system circuitry, reduces the number of components, and enhances the stability and safety of the entire battery system.

[0132] In some embodiments, such as in Fig. As shown in Figure 7, the battery management method in the embodiments of the present disclosure comprises the following steps.

[0133] At S4, a chip ambient temperature signal is collected, and a temperature threshold limiting diagnosis is performed on the chip ambient temperature signal.

[0134] At S5, a second protection trigger signal is sent if the chip ambient temperature signal is determined to be abnormal.

[0135] In S6, appropriate protection is implemented in response to the second protection trigger signal.

[0136] Implementing appropriate protection based on the second protection trigger signal can include stopping a relevant large signal acquisition activity, stopping a computation activity, issuing an alarm to a higher-level control system, and the like. A specific operation can be determined based on an acquisition result.

[0137] As in Fig. As shown in Figure 7, the battery management method in the embodiments of the present disclosure further comprises the following steps.

[0138] In S7, a power supply voltage signal is generated that provides power to each module in the high-voltage management chip, and a voltage threshold limiting diagnostic is performed on the power supply voltage signal.

[0139] In S8, a voltage threshold limit diagnostic result is used to determine whether a power supply module is functioning abnormally.

[0140] For example, the power supply voltage signal is compared to a voltage threshold to diagnose whether the power supply voltage signal is within a voltage threshold range, and a diagnostic result is stored.

[0141] Furthermore, step S9 is performed. In S9, based on the voltage threshold limitation diagnostic result, it is determined that the power supply voltage signal is outside a power supply voltage threshold range, and a control module is started to regulate the power supply voltage signal until the power supply module's power supply voltage signal is within the power supply voltage threshold range.

[0142] In one embodiment, the battery management method further comprises: receiving configuration information of the high-voltage management chip from a processor chip and sending at least one selected of acquisition information, calculation result information, safety diagnostic information or safety alarm information of the high-voltage management chip to the processor chip.

[0143] Fig. Figure 8 is a flowchart of a battery management method according to an embodiment of the present disclosure. As in Fig. As shown in section 8, the procedure includes in particular the following steps.

[0144] In S11, a higher-level processor chip configures the operating parameters of a high-voltage management chip.

[0145] The high-voltage management chip is started at S12.

[0146] In the S13, current and voltage signals are acquired by a peripheral circuit at a differential signal input terminal.

[0147] In step S14, a temperature-sensitive sensor detects an external temperature, and if the external temperature exceeds an operating temperature, a relevant operating module is shut down and an alarm signal is sent to the higher-level processor chip. Step S14 can be performed simultaneously with step S13.

[0148] At S15, the differential signal input terminal receives a differential signal, converts the differential signal into a corresponding digital differential signal using a monitoring loop within the high-voltage management chip, and the digital differential signal is stored.

[0149] At step S16, it is determined whether the corresponding differential signal is within a normal range, and a diagnostic result is stored. If the differential signal is abnormal, the procedure proceeds to step S19. Otherwise, the procedure proceeds to step S17.

[0150] In S17, a main processing module performs corresponding estimation calculations on the acquired differential voltage and current signals, including SOC, SOH, and the like.

[0151] In S18, recorded data, diagnostic data and calculated data are transferred to a higher-level processing system as needed via a peripheral communication interface.

[0152] At S19, if abnormal data is detected that is inconsistent with the previous data, a protection circuit is initiated to detect the state of a relevant loop.

[0153] Step S20 can also be performed while steps S15 to S17 are being performed.

[0154] In the S20, the high-voltage management chip triggers the protection circuit irregularly or periodically based on the configuration information to diagnose some or all modules in order to detect the operating states of the modules.

[0155] Fig. 9 is a flowchart of a battery management method according to a further embodiment of the present disclosure. As in Fig.As shown in section 9, the procedure includes in particular the following steps.

[0156] A control current supply is fed into S101.

[0157] At S102, a high-voltage battery management chip is activated, and the process proceeds separately to step S103 and step S122.

[0158] At S103, a differential signal is received using a differential signal input port, and the procedure proceeds separately to step S104 and step S113.

[0159] Step S104 detects whether a voltage exceeds a threshold value. If so, the procedure proceeds to step S105. Otherwise, the procedure proceeds to step S112.

[0160] At S105, feedback is provided to a main processing module.

[0161] At S106, a protection circuit is activated.

[0162] Step S107 detects whether an abnormality exists in another monitoring loop. If so, the procedure proceeds to step S108. Otherwise, the procedure proceeds to step S109.

[0163] At S108, a switch to a relevant loop is performed.

[0164] At S109, the corresponding monitoring loop is restored by the high-voltage management chip and the procedure returns to step S104.

[0165] In S110, an abnormality report is sent to a cascaded main controller if a capture result is abnormal a certain number of times.

[0166] In case S111, the procedure is awaiting a treatment measure.

[0167] In the S112, a test is continuously performed based on parameters configured by the high-voltage management chip.

[0168] Step S113 detects whether a current exceeds a threshold value. If so, the procedure proceeds to step S114. Otherwise, the procedure proceeds to step S120.

[0169] Step S114 detects whether a temperature exceeds a temperature threshold. If so, the procedure proceeds to step S115. Otherwise, the procedure proceeds to step S121.

[0170] In S115, information is fed back to the main processing module.

[0171] At S116, a protection circuit is activated.

[0172] At S117, the corresponding loop is restored by the high-voltage management chip and the process returns to step S113.

[0173] In S118, an abnormality report is sent to a cascaded main controller if a capture result is abnormal a certain number of times.

[0174] In case of S119, the procedure is awaiting treatment.

[0175] In the S120, a test is continuously performed based on parameters configured by the high-voltage management chip.

[0176] The abnormality treatment measure is performed at S121.

[0177] Step S122 detects whether a temperature exceeds a threshold. If so, the procedure proceeds to step S123. Otherwise, the procedure proceeds to step S129.

[0178] At S123, a protection circuit is activated.

[0179] In S124, the remaining monitoring loops are stopped by the high-voltage management chip.

[0180] At S125, an abnormality report is sent to the cascaded main controller.

[0181] At S126, a control signal from the main controller is passed through the high-voltage management chip and the process returns to step S122.

[0182] In S127, an abnormality report is sent to the cascaded main controller if a capture result is abnormal a certain number of times.

[0183] In case of S128, the procedure is awaiting treatment.

[0184] In the S129, a test is continuously performed based on parameters configured by the high-voltage management chip.

[0185] In general, compared to a conventional distributed high-voltage sensing system, the battery management chip and the management method described in the embodiments of the present disclosure can improve system consistency, systematically cover functional safety sensing, diagnostic and protection circuits and thus reduce the system failure rate, actively perform testing and calculations and thus improve the system's intelligence level and operating efficiency, greatly reduce circuit complexity and thus improve the reliability of the entire system, and additionally provide relevant sensing, diagnostic and protection circuits for the internal modules, thereby improving the system's functional safety level.

[0186] In this description, descriptions referring to the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “examples”, “specific examples”, or “some examples” mean that specific features, structures, materials, or properties described in connection with that embodiment or example are included in at least one embodiment or example of the present disclosure. In this description, the schematic representations of the foregoing terms do not necessarily refer to the same embodiment or example.

[0187] Although the embodiments of the present disclosure have been shown and described, persons skilled in the art can understand that many changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and purposes of the present disclosure, and the scope of the present disclosure is defined by the claims and their equivalents. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] CN 202310488307

[0001]

Claims

[1] High-voltage management chip (10) for a battery management system (1), wherein the high-voltage management chip (10) comprises: a detection circuit (11) which is electrically connected to a power cable of a battery pack (2) and is configured to detect state parameter information of the battery pack (2); and a digital logic circuit (13) connected to the sensing circuit (11) and configured to control the sensing circuit (11) and to estimate a state of charge value and / or a state of health value of the battery pack (2) based on the state parameter information of the battery pack (2). [2] High-voltage management chip (10) according to claim 1, wherein the high-voltage management chip (10) further comprises: a power supply circuit (14) wherein the power supply circuit (14) is connected to an external power supply and an output end of the power supply circuit (14) is connected to an electrical circuit within the high-voltage management chip (10) to provide operating current for the electrical circuit. [3] High-voltage management chip (10) according to claim 2, wherein the power supply circuit (14) comprises: a voltage converter sub-circuit (141) which is connected to the electrical circuit and is configured to provide different operating voltages for electrical circuits within the high-voltage management chip (10). [4] High-voltage management chip (10) according to claim 3, wherein the power supply circuit (14) further comprises: a power supply voltage detection circuit (142), wherein the power supply voltage detection circuit (142) is separately connected to the voltage converter sub-circuit (141) and the digital logic circuit (13) and is configured to detect whether an output voltage of the voltage converter sub-circuit (142) is within an operating range of the power supply circuit and to send a detection result to the digital logic circuit (13). [5] High-voltage management chip (10) according to claim 3 or 4, wherein the power supply circuit (14) further comprises: a power supply control circuit (143) wherein the power supply control circuit (143) is connected to the digital logic circuit (13) and is configured to control an output voltage of the voltage converter sub-circuit (141) so that it is within the operating range of the power supply circuit (14) when the output voltage of the voltage converter sub-circuit (141) is outside the operating range of the power supply circuit (14). [6] High-voltage management chip (10) according to any one of claims 1 to 5, wherein the high-voltage management chip (10) further comprises: a power supply interface circuit (21) wherein the power supply interface circuit (21) is configured to be connected to an external power supply and is configured to provide an operating current for the electrical circuit within the high-voltage management chip (10). [7] High-voltage management chip (10) according to claim 1, wherein the high-voltage management chip (10) further comprises: a peripheral differential sensing circuit (15), wherein one end of the peripheral differential sensing circuit (15) is connected to the power cable of the battery pack (2) and another end of the peripheral differential sensing circuit (15) is connected to a signal input terminal (23) of the high-voltage management chip (1); and the sensing circuit (11) acquires the state parameter information of the battery pack (2) via the peripheral differential sensing circuit (15). [8] High-voltage management chip (10) according to any one of claims 1 to 7, wherein the detection circuit (11) comprises: a voltage sensing circuit (111) wherein the voltage sensing circuit (111) is connected to a signal input terminal (23) of the high-voltage management chip (10) and is configured to sensing voltage information from the battery pack (2). [9] High-voltage management chip (10) according to claim 8, wherein the detection circuit (11) further comprises: a current sensing circuit (112) wherein the current sensing circuit (112) is connected to the signal input terminal (23) and is configured to sensing current information from the battery pack (2). [10] High-voltage management chip (10) according to claim 9, wherein the digital logic circuit (13) is separately connected to the voltage sensing circuit (111) and the current sensing circuit (112) and is configured to estimate the state of charge value and / or the state of health value of the battery pack (2) based on the voltage information and the current information of the battery pack (2). [11] High-voltage management chip (10) according to any one of claims 1 to 10, wherein the detection circuit (11) comprises: an insulation resistance sensing circuit (113), wherein the insulation resistance sensing circuit (113) is connected to a signal input terminal (23) of the high-voltage management chip (10) and is configured to sensing a resistance value between the power cable of the battery pack (2) and a vehicle body insulation ground; and the digital logic circuit is further connected to the insulation resistance detection circuit (113) and is configured to determine a leakage state of the battery pack (2) based on the resistance value. [12] High-voltage management chip (10) according to claim 9, wherein the high-voltage management chip (10) further comprises: a safety diagnostic circuit (16) wherein the safety diagnostic circuit (16) is connected to the detection circuit (11) and is configured to identify whether the state parameter information of the battery pack (2) is abnormal and to perform a safety protection if the state parameter information of the battery pack (2) is abnormal. [13] High-voltage management chip (10) according to claim 12, wherein the safety diagnostic circuit (16) comprises: a current diagnostic circuit (161) wherein the current diagnostic circuit (161) is connected to the current sensing circuit (112) and is configured to identify, based on the current information of the battery pack (2), whether an overcurrent is occurring in the battery pack (2) and to perform overcurrent protection when the overcurrent is occurring in the battery pack (2). [14] High-voltage management chip (10) according to claim 13, wherein the safety diagnostic circuit (16) comprises: a voltage diagnostic circuit (162) wherein the voltage diagnostic circuit (162) is connected to the voltage detection circuit (111) and is configured to identify, based on the voltage information of the battery pack (2), whether an over- or undervoltage occurs in the battery pack (2) and to perform over- or undervoltage protection when the over- or undervoltage occurs in the battery pack (2). [15] High-voltage management chip (10) according to any one of claims 1 to 14, wherein the high-voltage management chip (10) further comprises: a universal input / output interface circuit (17) wherein the universal input / output interface circuit (17) is connected to an external sensor or an external load and is configured to collect information from the external sensor or to output a control signal to the external load. [16] High-voltage management chip (10) according to claim 15, wherein the high-voltage management chip (10) further comprises: a temperature sensing circuit (18), wherein the temperature sensing circuit (18) is connected via the universal input / output interface circuit (17) to an external temperature sensor to acquire temperature information from the high-voltage management chip (10); and a temperature diagnostic circuit (19) wherein the temperature diagnostic circuit (19) is connected to the temperature sensing circuit (18) and is configured to identify, based on the temperature information of the high-voltage management chip (10), whether an overtemperature occurs in the high-voltage management chip (10) and to perform overtemperature protection when the overtemperature occurs in the high-voltage management chip (10). [17] High-voltage management chip (10) according to any one of claims 1 to 16, wherein the digital logic circuit (13) is further configured to receive configuration information of the high-voltage management chip (10) from a processor chip of the battery management system and to send at least one selected acquisition information, calculation result information, safety diagnostic information or safety alarm information of the high-voltage management chip (10) to the processor chip. [18] High-voltage management chip (10) according to any one of claims 1 to 17, wherein the high-voltage management chip (10) further comprises a communication interface circuit (12) configured to transmit the state parameter information of the battery pack (2) and / or the state of charge value and the state of health value of the battery pack (2) to a processor chip of the battery management system (1). [19] High-voltage management chip (10) according to claim 18, wherein the communication interface circuit is a serial daisy-chain peripheral interface circuit and the high-voltage management chip (10) is connected to the processor chip via the serial daisy-chain peripheral interface circuit. [20] High-voltage management chip (10) according to claim 19, wherein the high-voltage management chip (10) is connected to a serial daisy-chain peripheral interface bridge chip via the serial daisy-chain peripheral interface circuit and the serial daisy-chain peripheral interface bridge chip is configured to be connected to the processor chip. [21] High-voltage management chip (10) according to claim 20, wherein the high-voltage management chip (10) sends data to the serial daisy-chain peripheral interface bridge chip via the serial daisy-chain peripheral interface circuit and the serial daisy-chain peripheral interface bridge chip sends data to the processor chip via a first standard peripheral interface circuit. [22] High-voltage management chip (10) according to claim 18, wherein the communication interface circuit (12) comprises a second standard peripheral interface circuit and / or an I2C bus interface circuit and the second standard peripheral interface circuit and / or the I2C bus interface circuit is configured to connect the high-voltage management chip (10) to the processor chip. [23] High-voltage management chip (10) according to any one of claims 1 to 22, wherein the high-voltage management chip (10) further comprises: a controller local area network bus interface circuit (22), wherein the controller local area network bus interface circuit (22) is configured to be connected to an external communication bus in order to receive external bus information. [24] Battery management system (1) comprising a processor chip (20), the high-voltage management chip (10) according to any one of claims 1 to 23, an analog front-end chip (30) and an application-specific integrated circuit (40), wherein the processor chip (20) is electrically connected to the application-specific integrated circuit (40) and the application-specific integrated circuit (40) is further electrically connected to the high-voltage management chip (10) and the analog front-end chip (30). [25] Battery management system according to claim 24, wherein the battery management system is located in a vehicle; and the vehicle further comprises a battery pack (2) and the battery pack is connected to the battery management system (1). [26] Battery management method for the high-voltage management chip (10) according to any one of claims 1 to 23, wherein the battery management method comprises: Acquisition of state parameter information of the battery pack (2) by the acquisition circuit (11) of the high-voltage management chip (10); and Control of the sensing circuit (11) by the data logic circuit (13) of the high-voltage management chip (10) and estimation of a state of charge value and / or a state of health value of the battery pack (2) based on the state parameter information of the battery pack (2). [27] Battery management method according to claim 26, wherein the state parameter information of the battery pack (2) comprises voltage information and current information of the battery pack (2) and the battery management method further comprises: Estimating the state of charge and / or health value of the battery pack (2) based on the voltage information and current information of the battery pack (2). [28] Battery management method according to claim 26 or 27, wherein the state parameter information of the battery pack (2) includes a resistance value between the power cable of the battery pack (2) and a vehicle body insulating ground, and the battery management method further comprises: Determining a leakage state of the battery pack (2) based on the resistance value. [29] Battery management method according to any one of claims 26 to 28, wherein the battery management method further comprises: Identify whether the battery pack (2) condition parameter information is abnormal, and perform a safety protection if the battery pack (2) condition parameter information is abnormal. [30] Battery management method according to claim 29, wherein the identification by the high-voltage management chip (10) whether the state parameter information of the battery pack (2) is abnormal and the implementation of a safety protection if the state parameter information of the battery pack (2) is abnormal comprises at least one of the following: Identify whether an overcurrent occurs in the battery pack (2) based on the current information of the battery pack (2), and perform overcurrent protection when the overcurrent occurs in the battery pack (2); and Identify whether an over- or undervoltage occurs in the battery pack (2) based on the voltage information of the battery pack (2), and perform over- or undervoltage protection when the over- or undervoltage occurs in the battery pack (2). [31] Battery management method according to claim 29, wherein the battery management method further comprises: Obtaining temperature information from the high-voltage management chip (10); and Identify whether an overtemperature occurs in the high-voltage management chip (10) based on the temperature information of the high-voltage management chip (10), and perform overtemperature protection when the overtemperature occurs in the high-voltage management chip (10). [32] Battery management method according to any one of claims 26 to 31, wherein the battery management method further comprises: Receiving configuration information of the high-voltage management chip (10) from a processor chip (20) of a battery management system (1); and Send at least one selected of acquisition information, calculation result information, safety diagnostic information or safety alarm information from the high-voltage management chip (10) to the processor chip (20).

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