Contactless transition from microstrip to waveguide

Abstract

Microstrip-to-conductor transition (100, 200, 300, 400, 600) comprising a waveguide module (130) and a circuit board, PCB, (110), the module (130) arranged to form an interface with the PCB (110), the PCB comprising a patch antenna (120) and a ground plane, the module comprising a waveguide opening (140) and a gap waveguide structure (155), the waveguide opening arranged to extend through the module to attach a waveguide to an outer side (132) of the module, the gap waveguide structure (155) comprising a plurality of projecting metal or metallized elements (150) arranged on an inner side (131) of the module and defining a passage (145) into the waveguide opening (140) on the inner side (131), wherein the module is arranged to form an interface with a portion of the PCB that supports the patch antenna (120) such that the patch antenna is opposite the passage (145) into the waveguide opening (140),wherein the gap waveguide structure (155) is configured to attenuate electromagnetic signal transmission past the gap waveguide structure while allowing transmission via the passage (145), wherein the gap waveguide structure is arranged at a distance from the ground plane, the distance being less than one-quarter of an operating wavelength of the waveguide module (130).

Description

TECHNICAL FIELDThis disclosure relates generally to wireless communication systems and, more particularly, to waveguide transmission media. Arrangements are disclosed for transmitting a signal from a microstrip transmission medium to a tubular waveguide transmission medium.BACKGROUNDWireless communication networks include radio frequency transceivers such as radio base stations in cellular access networks, microwave transceivers used for backhaul into a core network, for example, and satellite transceivers communicating with orbital satellites. Radar transceivers also include radio frequency transceivers for transmitting and receiving radio frequency signals.A transmission medium is used to carry radio frequency signals to and from the radio frequency transceiver. A common type of transmission medium is waveguide structures. The term waveguide may refer to any linear structure that transmits electromagnetic waves between its end points. Waveguides are often implemented as hollow metal tubes or metallized tubular structures and are commonly used at microwave frequencies to connect, for example, microwave transmitters and receivers to their antennas.A specific type of waveguide transmission medium is microstrip. A microstrip is an electrical transmission line that can be manufactured using printed circuit board (PCB) technology and is used for transmitting microwave frequency signals. It consists of a conductive strip separated from a ground plane by a dielectric layer. Microwave components such as antennas, couplers, filters, power splitters, etc. may be formed from microstrips, the entire device being present as a metallization structure on the substrate. The microstrip is one of many forms of planar transmission lines; others include strip line and coplanar waveguides, and it is possible to integrate all of them on the same substrate.It is often desirable to pass between a tubular waveguide, for example a microstrip transmission medium and a rectangular waveguide. Such junctions often comprise probes or the like which extend into the waveguide structure.U.S. Pat. No. 7,265,558 B1 discloses a waveguide transition with feed probes.U.S. Pat. No. 6,573,803 B1 discloses a microstrip waveguide transition based on ridges.Feed probes and ridges must be carefully positioned in the waveguide structure so as not to affect the overall performance of the junction. The demands on accuracy increase with frequency, as higher operating frequencies often imply smaller components. Such high precision requirements complicate assembly and add cost.There is a need for high performance transition assemblies that allow efficient assembly of waveguide junctions during fabrication.SUMMARYThe object of this disclosure is to provide novel transition arrangements for the transition between microstrip and tubular waveguides, which offer high performance, for example with respect to return loss and insertion loss, and at the same time allow efficient and convenient assembly of waveguide transitions during production.This objective is achieved at least in part by a microstrip waveguide transition comprising a waveguide module and a printed circuit board (PCB), the module being arranged to interface with the printed circuit board and the printed circuit board comprising a patch antenna and a ground plane.The module comprises a waveguide opening and a repeating structure. The waveguide opening is arranged to extend through the module to attach a waveguide to an outside of the module. The repeating structure includes a plurality of protruding metal or metalized elements arranged to surround the waveguide opening on an interior side of the module and define a passage into the waveguide opening on the interior side. The module is arranged to interface with a board section having the patch antenna such that the patch antenna faces the passage into the waveguide opening. The repeating structure is configured to attenuate the propagation of electromagnetic signals in a frequency band behind the repeating structure while allowing the propagation over the passage.The aperture serves as an interface to a waveguide structure, such as a tubular waveguide, which is attached to the outside of the module, while the passageway allows a patch antenna disposed on the board to radiate into the waveguide and also receive radio signals leaving the waveguide. The repeating structure implements a gap waveguide structure that effectively seals the passageway so that electromagnetic energy can pass more or less unimpeded between the waveguide and the patch antenna, but not in a different direction. The transition between the printed circuit board and the waveguide is therefore contact-free, since no electrical contact is required between the waveguide and the microstrip on the printed circuit board. This is advantageous because a highly precise mounting of probes and the like, for example, is not required; the circuit board is simply fastened to the waveguide module by fastening means such as screws or the like, an electrical contact does not have to be detected, since the repeating structure seals the transition without contact.In some aspects, the repeating structure is integrally formed with a flange of the waveguide. The repeating structure can be worked directly into a metal element, for example, which forms the boundary surface with the waveguide and comprises the waveguide opening. This is an advantage since such machining can be carried out cost-effectively and with high mechanical precision. This type of integrally formed repeating structure is also mechanically stable, which is an advantage.In some other aspects, the repeating structure is configured on a separate carrier mounted to the waveguide module. Thus, the repeating structure can be configured separately from the other sections of the waveguide module in accordance with the operating frequency band. During assembly, a set of different repeating structures having different dimensions may be available and an appropriate repeating structure may be selected for the current operating scenario. It is advantageous that the other sections of the waveguide module are reusable.In further aspects, the waveguide module includes one or more alignment holes configured to receive respective alignment studs soldered to the circuit board. This "pin-and-hole" means for alignment provides higher alignment accuracy and simplifies the mounting of the waveguide module on the board.Also disclosed herein is a board or board section that / includes a patch antenna connected to a transmission line, such as a microstrip transmission line. The board is arranged to form an interface with a waveguide module having a passage through a repeating structure into a waveguide opening. The patch antenna is configured to face the passage into the waveguide opening.The printed circuit board therefore forms together with the waveguide module a high-power transition between a transmission line such as a microstrip and a waveguide. The transition allows cost-effective assembly since it is contact-free and does not require any soldering during assembly.In some aspects, the board includes at least one alignment pin soldered to the board at a location relative to the patch antenna and arranged to enter a respective alignment hole on the waveguide module.As noted above, this "pin-and-hole" alignment device provides greater alignment accuracy and simplifies the mounting of the waveguide module on the board. As will be explained below, soldering the alignment pin allows high mechanical precision in the placement of the pin relative to the patch antenna, which is an advantage.Also disclosed herein are microstrip waveguide junctions and exemplary methods associated with the above advantages.In general, all terms used in the claims should be interpreted according to their ordinary meaning in the technical field, unless expressly defined otherwise herein. All references to "a / e element / s, a device, a component, a means, a step, etc." are open to reference at least one instance of the element, the device, the component, the means, the step, etc., unless expressly stated otherwise. The steps of an exemplary method disclosed herein need not be performed in the exact order disclosed, unless expressly stated. Other features and advantages of this invention will be apparent from the appended claims and the following description. It will be apparent to one skilled in the art that various features of this invention may be combined to produce embodiments other than those described below without departing from the scope of this invention as defined by the appended claims.BRIEF DESCRIPTION OF THE DRAWINGSThis disclosure will now be described in more detail with reference to the accompanying drawings, in which: FIG. 1 schematically shows a circuit board section and a waveguide module; FIG. 2 schematically illustrates a mounted waveguide transition; FIG. 3 shows a patch antenna arranged opposite a waveguide opening; FIG. 4 illustrates a waveguide transition with multiple openings; FIG. 5 shows a circuit board section with a patch antenna; FIG. 6 schematically illustrates a waveguide transition; FIG. 7 is a flow chart illustrating an example method; and FIGS. 8A-8D illustrate example patch antennas.DETAILED DESCRIPTIONThe invention will be described in more detail below with reference to the accompanying drawings, in which certain aspects of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments and aspects set forth herein; rather, these embodiments are provided by way of example in order to make this disclosure thorough and complete and fully convey the scope of the invention to those skilled in the art as defined by the appended claims. Like numerals refer to like elements throughout the specification.The term "waveguide" as used herein refers to a metallized tubular structure, unless expressly stated otherwise. The metallized tubular structure can be, for example, a hollow conductor with a circular, elliptical or rectangular cross section. A waveguide may also refer to other known waveguide structures, such as arrangements having a web, a double web or the like.The term microstrip here denotes a generally planar transmission medium. For example, unless otherwise noted, strip lines and the like are included when referring to microstrips.As the communication frequency bands become higher and higher, the transmission components become smaller and smaller. This is because the size of many components, such as waveguides and filters, is determined in proportion to the wavelength of the carrier frequency. This makes it difficult to produce transmission components because higher and higher mechanical precision is required to obtain satisfactory performance.A radio or radar transceiver generally includes one or more integrated circuits disposed on a portion of a printed circuit board (PCB). The transceiver sends and receives signals via ports in the integrated circuits. The ports are often connected to one or more antenna devices via microstrips on the board. Often, it is desirable to route the microstrip signals to and from a waveguide interface. This transition is decisive for the performance of the entire system.A central concept is the use of repeating structures for attenuating electromagnetic fields. Such repeating structures are often referred to in the literature as "void waveguide structures.". A gap waveguide is generally constructed from two sections: a patterned metal surface and a flat metal surface that are in close proximity to each other, but not necessarily placed in direct contact with each other. The structured surface is characterized by pins or other protrusions that form a meta-material surface, sometimes referred to as an artificial magnetic conductor. The protrusions form a barrier that prevents the electromagnetic waves from propagating in undesired directions. Thus, the pins replace the walls in rectangular waveguides. This is done without requiring a perfectly sealed metal housing, which is an advantage.FIG. 1 schematically shows a circuit board section 110 and a waveguide module 130. The waveguide module 130 and the circuit board section are separate units which can be arranged fixed to one another. A signal input to a microstrip transmission line 125 is radiated from a patch antenna 120 disposed on the board 110. Microstrip transmission lines and patch antennas are known and will not be discussed in detail herein. However, those skilled in the art have recognized that a ground plane is disposed at the back of patch antenna 120; this ground plane is not shown in FIG. 1. The patch antenna and the microstrip transmission line are, of course, bi-directional, which means that the signal fed into the transmission line is radiated from the patch and the incoming electromagnetic signals are picked up by the patch antenna 120 and output on the transmission line 125.The waveguide module 130 is arranged such that it can form an interface with a circuit board section comprising a patch antenna 120. The module comprises a waveguide opening 140 and a repeating structure 155. The waveguide opening 140 is arranged to extend through the module 130. A tubular waveguide, such as a circular, elliptical, or rectangular waveguide, may be attached to an outer side 132 of the waveguide module. The waveguide module can comprise, for example, a waveguide flange which is manufactured, for example, from a metal piece such as aluminum or the like, or can be integrally formed from such a module. The repeating structure 155 includes a plurality of protruding metal or metallized elements 150 arranged to surround the waveguide opening 140 on an inner side 131 of the module and define a passage 145 into the waveguide opening 140 on the inner side 131.The board portion 110 includes a patch antenna 120 connected to a transmission line 125. The board is arranged to form an interface 130 to a waveguide module having a passage 145 through a repeating structure 155 into a waveguide opening 140. The patch antenna 120 is configured to face the passage 145 into the waveguide opening 140.As explained above, the protruding elements 150 together with a ground plane of the board 110 form the two sections of a gap waveguide structure; the protruding elements form the structured metal surface which is placed in the immediate vicinity of the metal surface of the ground plane of the board. Close together here means that the distance is less than one quarter of the operating wavelength. Note that the repeating structure is a periodic or quasi-periodic structure. The projections therefore form a barrier which prevents the electromagnetic waves from propagating in undesired directions. The dimensions of the protruding elements and their relative location determine the frequency dependent damping characteristics of the repeating structure. The undesired directions here are the directions leading away from the passage 145 between the patch antenna 120 and the waveguide opening 140. Thus, the repeating structure 155 is configured to attenuate the propagation of electromagnetic signals in a frequency band behind the repeating structure while permitting the propagation via the passage 145.In some aspects, repeating structure 155 is a pin structure that includes conductive pins, such as metal pins or metallized pins, that are periodically arranged protruding from a conductive plane in the waveguide module. The conductive pins may be formed as rectangular or cylindrical protrusions, for example. However, it has been found that many different forms can be used with similar effect. For example, mushroom-shaped or conical projections with the same or a similar effect can also be used.According to one example, the waveguide module comprises a waveguide flange which extends in a plane perpendicular to the waveguide opening 140. In this case, the repeating structure 155 is preferably arranged integrally with the waveguide flange. The respective structure can be milled or otherwise machined, for example, from the same piece of metal from which the waveguide flange is also produced.However, the repeating structure 155 may not necessarily be integrally formed with the metal forming the waveguide opening. According to some aspects, the repeating structure 155 is arranged, for example, on a separate carrier which is mounted on the waveguide module.The separate support may be, for example, a piece of polytetrafluoroethylene (PTFE), which is a synthetic fluoropolymer of tetrafluoroethylene. PTFE can be shaped with high precision to form the protrusions and fit into a machined groove or cut-out formed in conjunction with the waveguide aperture. Any type of dielectric or plastic can be used for this application. The insert may be metallized to form the repeating structure 155 configured to attenuate the propagation of electromagnetic signals in a frequency band behind the repeating structure while permitting the propagation via the passage 145.An advantage of using a separate support for the repeating structure is that the dimensions of the repeating structure can be selected based on the application, while the other portions of the waveguide module can be reused, at least when a pass-through element in the waveguide aperture is arranged to form the correct aperture size for the operating frequency band.The repeating structure may also be formed on the board section, i.e., extend downwardly from the board 110 into the waveguide module 130.Patch antenna 120 radiates into the waveguide aperture via passage 145 to form the transition. Therefore, the patch antenna and the waveguide opening 140 must be aligned with each other. In the case of a misalignment, performance losses, for example in the case of return loss and insertion loss, are to be expected. Some alignment is, of course, obtained by the conventional attachment means by which the board 110 is attached to the waveguide module 130. However, the mechanical tolerances may be too large for normal manufacturing processes.To improve the alignment between patch antenna and waveguide aperture 140, one or more alignment holes 170 may optionally be configured to receive respective alignment studs 160 that are soldered to the circuit board 110. The soldering process is associated with a self-alignment effect; when mounting a circuit board, solder paste is first applied to the pads of the circuit board arranged with high mechanical precision. In a second step, surface-mounted components are placed on the pads. The third step is reflowing the solder, where the solder joints are formed. During reflow, forces from surface tension and capillary effects act on the surface mount component to align the component with the older pads on the board. Thus, it is believed that the soldered alignment studs are placed on the board with high accuracy relative to the patch antenna.Thus, in some aspects, the board 110 includes at least one alignment post 160 soldered to the board at a location relative to the patch antenna 120 and arranged to enter a respective alignment hole on the waveguide module 130. It should be noted that a single alignment pin provides a fixed point, i.e. the board can then be rotated with respect to the waveguide module. Two or more alignment studs having respective holes machined into the waveguide module fix the patch antenna 120 with respect to the waveguide aperture 140 and the passage 145.FIG. 2 schematically illustrates a mounted microstrip waveguide transition 200. The outer side 131 of the waveguide module 130 with the waveguide opening for fastening the waveguide is visible. The microstrip, i.e., transmission line 125, is visible upon entering transition 200. The protruding pins 150 forming the repeating structure are also seen. Here, a rectangular waveguide opening is used. Other types of waveguides are also suitable, however.FIG. 3 shows a plan view of a patch antenna 120 which is arranged opposite a waveguide opening 140. In this case, the transmission line 125 comprises a smaller patch arranged before the larger patch forming the antenna. It should be appreciated that any number of microstrip designs, including filters and the like, may be arranged in the transmission line 125 in conjunction with the patch antenna 120. The patch antenna is aligned with the passage leading to the waveguide aperture 140. Thus, the radiated electromagnetic energy enters the waveguide which is mounted on the outside of the waveguide module 130 in order to complete the transition from the microstrip to the waveguide. The protruding elements 150 are shown as forming the repeating structure 155.FIG. 4 illustrates an example of a waveguide transition 400 having multiple waveguide openings. Disposed on the board 110 is a circuit 410 such as a radio transceiver, a radar transceiver, or other integrated circuit. A first transmission line 125 aand a second transmission line 125 bextend from the circuit 410 to a first patch antenna 120 aand to a second patch antenna 120 b, respectively. Thus, two waveguide junctions are integrated into a single unit. Such microstrip waveguide transitions are suitable, for example, for MIMO transmission / reception systems (multiple-input multiple-output) and also for back-to-back test circuits.FIG. 4 also shows, by way of example, fastening means 420, 425, here in the form of holes in which bolts can be arranged in order to firmly connect the printed circuit board to the waveguide module 130. Such fasteners provide some alignment between the patch antennas and the waveguide openings. However, if additional mechanical precision is desired, one or more alignment studs 160 may be disposed on the board as discussed above.FIG. 5 shows a plan view of a circuit board section with a patch antenna. This board includes fasteners 420 and alignment studs 160. The board shown in FIG. 5 also includes an integrated circuit, such as a radio or radar transceiver circuit.FIG. 6 schematically illustrates a waveguide transition according to the above explanation. By way of example, the dimensions of the waveguide transition are: long side of the waveguide 120=3.0988 mm, short side of the waveguide 120=1.5494 mm, height of the pin 150=1 mm, period of the pin P=1.94 mm, width of the pin W=0.95 mm, distance of the pin from the substrate=0.1 mm, width of the microstrip patch=1.78 mm, length of the microstrip patch=1.04 mm, length of the matching double stub=1 mm, width of the matching double stub=0.79 mm, distance of the stub from the patch 0.43 mm.FIG. 7 is a flow diagram illustrating an example method. An example method is illustrated, comprising:Forming S1 a waveguide module 130 for a microstrip waveguide transition, the module comprising a waveguide opening 140 and a repeating structure 155, the waveguide opening being arranged to extend through the module to attach a waveguide to an outer side 132 of the module, the repeating structure 155 comprising a plurality of protruding metal or metallized elements 150 arranged to enclose the waveguide opening 140 on an inner side 131 of the module and defining a passage 145 into the waveguide opening 140 on the inner side 131, the repeating structure 155 being arranged to attenuate the propagation of electromagnetic signals in a frequency band past the repeating structure while permitting the propagation via the passage 145.The method also includes forming S 2 a board 110 with a patch antenna 120 connected to a transmission line 125, the board being arranged to interface with the waveguide module 130 including the passage 145 through the repeating structure 155 into the waveguide opening 140, and mounting S 3 the board to the waveguide module such that the patch antenna 120 is opposite the passage 145 into the waveguide opening 140.FIGS. 8A through 8D schematically illustrate some example patch antennas 120. Figure 8A shows an open stub used as a patch antenna, i.e. a piece of microstrip terminated with a stub. FIG. 8B shows another example of a patch antenna having a rectangular element disposed at the end of the microstrip transmission line. The element may have many different shapes, for example disc-shaped, as shown in Fig. 8C.The patch antenna 120 may include a plurality of antenna elements to form an antenna array. This antenna array can be used to shape a transmit lobe of the patch antenna to better fit into the waveguide aperture. The antenna array can also be electrically controllable, which allows calibration of the waveguide transition during or after production and / or assembly.Aspects of this invention include one or more of the following enumerated aspects (AAs):AA 1. Waveguide module 130 for a microstrip-to-conductor transition, the module 130 arranged to interface with the PCB 110, the PCB comprising a patch antenna 120 and a ground plane, the module comprising a waveguide aperture 140 and a repeating structure 155, the waveguide aperture arranged extending through the module to attach a waveguide to an outer side 132 of the module, the repeating structure 155 comprising a plurality of protruding metal or metallized elements 150 arranged to enclose the waveguide aperture 140 at an inner side 131 of the module and to define a passage 145 into the waveguide aperture 140 at the inner side 131, wherein the repeating structure 155 is configured to attenuate electromagnetic signal transmission past the repeating structure while permitting transmission via the passage 145, and wherein the repeating structure and the ground plane represent a gap waveguide structure, wherein the repeating structure is arranged at a distance from the ground plane, wherein the distance is less than a quarter of an operating wavelength of the waveguide module 130.AA 2. Waveguide module 130 according to EE 1, wherein the repeating structure 155 is a pin structure comprising conductive pins periodically arranged protruding from a conductive plane comprised in the waveguide module.The AA 3. waveguide module 130 of any of the preceding AA, wherein the waveguide module 130 has a waveguide flange in a plane perpendicular to the waveguide opening 140, wherein the repeating structure 155 is integrally arranged with the waveguide flange.The AA 4. waveguide module 130 of any of the preceding AA, wherein the repeating structure 155 is disposed on a separate carrier mounted to the waveguide module.AA 5. Waveguide module 130 according to any of the preceding AA, wherein the waveguide opening 140 is arranged to interface at the outside 132 of the module with one of a rectangular waveguide, an elliptical waveguide or a circular waveguide.The AA 6. waveguide module 130 according to any of the preceding AA, wherein the waveguide module 130 is arranged to interface with a portion of a board, wherein the portion of the board comprises a patchantena 120 configured to oppose the passage 145 into the waveguide opening 140.The AA 7. waveguide module 130 of any preceding AA, wherein the waveguide module 130 includes one or more alignment holes 170 configured to receive respective alignment taps 160 soldered to the PCB 110.The AA 8. waveguide module 130 of any preceding AA, wherein the PCB 110 comprises an integrated circuit 510.The AA 9. waveguide module 130 of any preceding AA, wherein the patch antenna 120 comprises a plurality of antenna elements.The AA 10. waveguide module 130 of any of the preceding AA, wherein the waveguide module 130 comprises a plurality of waveguide openings 140a, 140b, each waveguide opening being arranged to interface with respective patch antennas 120a, 120b.AA 11, PCB 110, the PCB 110 comprising a patch antenna 120 connected to a transmission line 125 and having a ground plane, the PCB being arranged to interface with a waveguide module 130, the waveguide module comprising a passage 145 through a repeating structure 155 into a waveguide opening 140, the repeating structure 155 comprising a plurality of protruding metal or metallized elements 150 arranged to enclose the waveguide opening 140, the repeating structure 155 being arranged to attenuate electromagnetic signal transmission past the repeating structure in a frequency band while permitting transmission via the passage 145, the patch antenna 120 being arranged to confront the passage 145 into the waveguide opening 140 when the PCB is connected to the waveguide module 130, and wherein the repeating structure and ground plane represent a gap waveguide structure, wherein the repeating structure is arranged at a distance from the ground plane, wherein the distance is less than a quarter of an operating wavelength of the waveguide module 130.The AA 12 board 110 of AA 8, wherein the PCB 110 comprises at least one alignment tap 160 soldered to the PCB at a location relative to the patch antenna 120 and arranged to enter a respective alignment hole on the waveguide module 130.AA 13. Microstrip-to-Conductor Transition 100, 200, 300, 400, 600 comprising a waveguide module 130 according to any of the AAs 1-7, and a printed circuit board, PCB, 110 according to any of the AAs 8-9.AA 14. Radio or radar transceiver comprising the microstrip-to-conductor transition 100, 200, 300, 400, 600 according to AA 13.References included in the specificationThis list of documents cited by the applicant has been produced in an automated manner and is only included for the better information of the reader. The list is not part of the German patent application or utility model application. The DPMA does not take any adhesion for any faults or omissions.Patent Literature citedU.S. Pat. No. 7,265,558 B1

[0006] U.S. Pat. No. 6,573,803 B1

[0007]

Claims

A microstrip-to-conductor transition (100, 200, 300, 400, 600) comprising a waveguide module (130) and a printed circuit board, PCB, (110), the module (130) arranged to interface with the PCB (110), the PCB comprising a patch antenna (120) and a ground plane, the module comprising a waveguide opening (140) and a gap waveguide structure (155), the waveguide opening being arranged extending through the module to attach a waveguide to an outer side (132) of the module, the gap waveguide structure (155) comprising a plurality of protruding metal or metallized elements (150) being arranged on an inner side (131) of the module and defining a passage (145) into the waveguide opening (140) on the inner side (131), wherein the module is arranged, interfacing with a portion of the PCB that includes the patch antenna (120) such that the patch antenna faces the passageway (145) into the waveguide aperture (140), the gap waveguide structure (155) being configured to attenuate electromagnetic signal transmission past the gap waveguide structure while allowing transmission via the passageway (145), the gap waveguide structure being disposed at a distance from the ground plane, the distance being less than a quarter of an operating wavelength of the waveguide module (130).The microstrip-to-conductor transition (100, 200, 300, 400, 600) of claim 1, wherein the gap waveguide structure (155) is a pin structure having conductive pins periodically protruding from a conductive plane exhibited in the waveguide module.The microstrip-to-conductor transition (100, 200, 300, 400, 600) of any preceding claim, wherein the waveguide module (130) has a waveguide flange in a plane perpendicular to the waveguide opening (140), wherein the gap waveguide structure (155) is integrally arranged with the waveguide flange.The microstrip-to-conductor transition (100, 200, 300, 400, 600) of any preceding claim, wherein the gap waveguide structure (155) is disposed on a separate carrier mounted to the waveguide module.The microstrip-to-conductor transition (100, 200, 300, 400, 600) of any preceding claim, wherein the waveguide opening (140) is arranged to interface at the outside (132) of the module with one of a rectangular waveguide, an elliptical waveguide or a circular waveguide.The microstrip-to-conductor transition (100, 200, 300, 400, 600) of any preceding claim, wherein the waveguide module (130) includes one or more alignment holes (170) configured to receive respective alignment taps (160) soldered to the PCB (110).The microstrip-to-conductor transition (100, 200, 300, 400, 600) of any preceding claim, wherein the PCB (110) comprises an integrated circuit (510).The microstrip-to-conductor transition (100, 200, 300, 400, 600) of any preceding claim, wherein the patch antenna (120) comprises a plurality of antenna elements.The microstrip-to-conductor transition (100, 200, 300, 400, 600) of any preceding claim, wherein the waveguide module (130) comprises a plurality of waveguide openings (140a, 140b), each waveguide opening being arranged to interface with respective patch antennas (120a, 120b).The microstrip-to-conductor transition (100, 200, 300, 400, 600) of any preceding claim, wherein the PCB (110) comprises at least one alignment tap (160) soldered to the PCB at a location relative to the patch antenna (120) and arranged to enter a respective alignment hole on the waveguide module (130).A radio or radar transceiver comprising the microstrip-to-conductor transition (100, 200, 300, 400, 600) according to any of claims 1 to 10.

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