Heat dissipation structure and cooling device

Abstract

Heat dissipation structure (D), comprising: - several heat dissipation plates (D1), which are porous, plate-shaped structures, and - at least one adhesive layer (D2) arranged between two adjacent heat dissipation plates (D1) and connected to the multiple heat dissipation plates (D1).

Description

[0001] The present invention relates to a heat dissipation structure and a cooling device, in particular to a heat dissipation structure made of a combined heat dissipation material and a cooling device.

[0002] It is common for industrial machinery or equipment to be connected to a cooling water circuit to cool the machinery and equipment. The waste heat generated by the respective production facility is released into the atmosphere through evaporation of the cooling water. The cooling water circuit uses water as the cooling medium and usually consists of a cooling device and piping, with the most common cooling device being a cooling water tower, for example.

[0003] However, the heat sinks in the cooling water tower are currently scattered, so the installation and replacement of the heat sinks requires a lot of effort and the heat dissipation efficiency is low.

[0004] Based on the disadvantages of the prior art, the present invention aims to provide a heat dissipation structure and a cooling device.

[0005] To achieve this objective, the present invention proposes a heat dissipation structure comprising a plurality of heat dissipation plates and at least one adhesive layer. The plurality of heat dissipation plates are porous, plate-shaped structures. The at least one adhesive layer is arranged between two adjacent heat dissipation plates and bonded to the plurality of heat dissipation plates.

[0006] To achieve this object, the present invention further proposes a cooling device comprising a device body and a plurality of heat dissipation structures. The device body has at least one first opening, a second opening, and a receiving chamber, wherein the receiving chamber communicates with the at least one first opening and the second opening. The plurality of heat dissipation structures are arranged suspended in the receiving chamber, wherein each of the heat dissipation structures comprises a plurality of heat dissipation plates and at least one adhesive layer. The plurality of heat dissipation plates are porous, plate-shaped structures. The at least one adhesive layer is arranged between two adjacent heat dissipation plates and bonded to the plurality of heat dissipation plates.

[0007] One of the advantageous effects of the present invention is that the comfort and heat dissipation efficiency of the heat dissipation structure and the cooling device according to the present utility model can be improved by the above technical solutions.

[0008] For a better understanding of the features and technical content of the present invention, reference is made to the following detailed description and the drawings, which, however, are for illustrative purposes only and are not intended to limit the scope of the present invention. In the drawing: Fig. 1 a schematic partial section through a cooling device of a first embodiment of the present invention. Fig. 2 is a schematic exploded view of a heat dissipation structure of the first embodiment of the present invention. Fig. 3 shows the schematic structure of the heat dissipation structure of the first embodiment of the present invention. Fig. 4 is a three-dimensional schematic diagram of the heat dissipation structure of the first embodiment of the present invention. Fig. 5 is a schematic exploded view of a heat dissipation structure of a second embodiment of the present invention and Fig. 6 shows the schematic structure of the heat dissipation structure of the second embodiment of the present invention.

[0009] In the following, the embodiments of a heat dissipation structure and a cooling device disclosed within the scope of the present invention are described using specific concrete embodiments. Those skilled in the art will appreciate that advantages and technical effects of the present invention can be derived from the disclosures in the present description. The present invention can be implemented or applied by other concrete embodiments, and various modifications or changes can be made to the details disclosed in the present description as needed and according to application, without departing from the basic ideas of the present invention. Furthermore, it should be noted that the individual components of the present invention are not shown in their actual size, but only schematically.The following embodiments serve to further describe the embodiments of the present invention in more detail, but the corresponding disclosures do not represent a limitation on the scope of the present invention. First embodiment

[0010] It is based on the Fig. 1 to 4, which respectively show a schematic partial section through a cooling device of a first embodiment of the present invention, a schematic exploded view of a heat dissipation structure, the schematic layout of the heat dissipation structure, and a three-dimensional schematic representation of the heat dissipation structure, respectively. As depicted in the aforementioned drawings, the first embodiment of the present invention provides a cooling device Z that may include a device body 1 and a plurality of heat dissipation structures D.

[0011] As in Fig. 1, the device body 1 may have at least a first opening 10, a second opening 11, and a receiving chamber 12, wherein the receiving chamber 12 communicates with the first opening 10 and the second opening 11. The device body 1 may be, for example, a heat-dissipating water tower structure. The first opening 10 may be located on the top side of the device body 1; in the present embodiment, the first opening 10 may be provided in multiple locations, but is not limited thereto. The second opening 11 may be located on the bottom side of the device body 1 and connected to an external discharge pipe (not shown in the figure).

[0012] Furthermore, the device body 1 can have a conveying element 13, a plurality of liquid spray elements 14, a gas flow generating element 15, and at least one ventilation opening 16. The conveying element 13 is suspended in the receiving chamber 12, can be a pipe for conveying a liquid, and can be connected to an external supply pipe (not shown in the figure). The plurality of liquid spray elements 14 are arranged on the conveying element 13 and can be spray heads or sprinkler heads. The gas flow generating element 15 can be a known fan assembly movably arranged on top of the device body 1. The ventilation opening 16 can be located on a side wall of the device body 1 and connects the receiving chamber 12 to an exterior of the device body 1.

[0013] As in Fig. 1 to 4, the plurality of heat dissipation structures D are arranged suspended in the receiving chamber 12, wherein each of the heat dissipation structures D may comprise a plurality of heat dissipation sheets D1 and at least one adhesive layer D2.

[0014] Out of Fig. 1 to 4, it can be seen that the plurality of heat dissipation plates D1 can be solid, porous, plate-like structures. Each of the heat dissipation plates D1 can be made of polyethylene terephthalate (PET) or polyvinyl chloride (PVC). Each of the heat dissipation plates D1 can be provided on both sides with a plurality of projections D10, wherein the plurality of projections D10 of one of the heat dissipation plates D1 correspond to the plurality of projections D10 of another heat dissipation plate D1. Each of the heat dissipation plates D1 can have a plurality of through-holes D11, wherein each of the through-holes D11 penetrates a base body D1a of the respective heat dissipation plate D1 and is arranged between two adjacent projections D10. Each of the heat dissipation plates D1 can have a geometric shape, such assquare, semicircular, polygonal or irregular, whereby in the present embodiment a square shape is used as an example, but this is not a limitation.

[0015] As in the Fig. 1 to 4, the at least one adhesive layer D2 may be arranged between two adjacent heat dissipation plates D1 and bonded to the plurality of heat dissipation plates D1, wherein the adhesive layer D2 may comprise a moisture-curing adhesive. In the present embodiment, the heat dissipation structure D may comprise a plurality of adhesive layers D2, wherein the plurality of heat dissipation plates D1 may be arranged stacked, and each of the adhesive layers D2 may be arranged between two adjacent heat dissipation plates D1. Furthermore, each of the adhesive layers D2 may be arranged between two adjacent protrusions D10 and bond the plurality of corresponding protrusions D10 to one another.

[0016] Thus, during operation of the cooling device Z of the present invention, as shown in Fig. 1 to 4, a liquid to be cooled (e.g., water, but not limited thereto) is transported to the conveying element 13 via the external supply pipe and sprayed onto the plurality of heat dissipation structures D by means of the plurality of liquid spray elements 14. At this time, the first opening 10 can introduce external gas into the receiving chamber 12, while the gas flow generating element 15 can suck in the gas and generate a heat dissipation gas flow for delivery to the heat dissipation structures D, thereby solving the problem of hot air being blown from the top of the tower and generating white smoke. When the liquid to be cooled is sprayed onto the heat dissipation structures D, the liquid to be cooled can be cooled as it flows through the heat dissipation structures D and then drip onto the bottom of the device body 1 and collected there. The ventilation opening 16 enables the heat dissipation gas flow to be discharged from the device body 1.

[0017] Subsequently, the cooled liquid collected at the bottom of the device body 1 can be led through the second opening 11 of the device body 1 into the external discharge pipe and then transported via this to a heat source device for heat absorption.

[0018] In this way, in the cooling device Z of the present invention, by the above-described configurations, a combination of a plurality of heat dissipation plates D1 can be achieved using the adhesive layer D2, thus enabling users to easily install and replace the heat dissipation plates. Furthermore, by the structural configuration of the heat dissipation plate D1 (protrusions D10, through holes D11) and the combination of a plurality of heat dissipation plates D1, the heat dissipation efficiency of the heat dissipation structure D can be increased. Furthermore, the present utility model uses polyethylene terephthalate for the heat dissipation plate D1 and a moisture-curing adhesive as the adhesive layer D2, thereby reducing environmental pollution and thus achieving the effect of environmental protection.

[0019] Since heat sinks must withstand moisture for extended periods and may even be immersed in liquids, hydrolysis resistance is one of the industry's concerns. Conventional moisture-curing adhesives can hydrolyze and fail within two to three weeks at 65°C / 95% humidity in reliability tests. In contrast, the hydrolysis resistance of the moisture-curing adhesive used as adhesive layer D2 in the present invention has been improved to the point that it can be used and maintained for up to six weeks or even longer, retaining its adhesive properties. This relatively extends the service life and reduces the amount of waste material to be disposed of. Furthermore, moisture-curing adhesives are more environmentally friendly and safer (low VOC) to process than conventional solvent adhesives.

[0020] Based on the above, the present invention further provides a heat dissipation structure D that may comprise a plurality of heat dissipation plates D1 and at least one adhesive layer D2. The plurality of heat dissipation plates D1 may be porous, plate-shaped structures. The at least one adhesive layer D2 may be arranged between two adjacent heat dissipation plates D1 and bonded to the plurality of heat dissipation plates D1. Second embodiment

[0021] It is based on the Fig. 5 to 6, which each show a schematic exploded view and the schematic structure of a heat dissipation structure of a second embodiment of the present invention, wherein also Fig. 1 to 4. As illustrated, the heat dissipation structure D of the present embodiment is substantially similar to the heat dissipation structure D of the above embodiment, so the arrangement or operation of the same elements is not repeated here. The present embodiment differs from the above-described first embodiment in that, in the present embodiment, the heat dissipation structure D may further include a plurality of adhesive layers D2, the plurality of heat dissipation sheets D1 being stacked, and each of the adhesive layers D2 being located between two adjacent heat dissipation sheets D1.

[0022] As can be seen from Fig. 1, Fig. 5 and Fig.6, for example, a recess D12 is formed between the plurality of adjacent protrusions D10 of each of the heat dissipation plates D1. Thus, when two heat dissipation plates D1 are bonded together using the adhesive layer D2, the adhesive layer D2 not only contacts each of the protrusions D10 but also fills the recesses D12 of each of the heat dissipation plates D1, so that the two heat dissipation plates D1 can be firmly bonded together.

[0023] However, the above example is only one of the possible embodiments and is not intended to limit the scope of the present invention.

[0024] However, the above example is only one of the possible embodiments and is not intended to limit the scope of the present invention. Advantageous effects of the embodiments

[0025] One of the advantageous effects of the present invention is that the comfort and heat dissipation efficiency of the heat dissipation structure D and the cooling device Z according to the present invention can be improved by the above technical solutions.

[0026] Furthermore, the cooling device Z of the present invention can combine multiple heat dissipation plates D1 with an adhesive layer D2, allowing users to easily install and replace them. Furthermore, by structuring the heat dissipation plate D1 (protrusions D10, through holes D11) and combining multiple heat dissipation plates D1, the heat dissipation efficiency of the heat dissipation structure D can be increased. Furthermore, the present invention uses polyethylene terephthalate for the heat dissipation plate D1 and a moisture-curing adhesive as the adhesive layer D2, which can reduce environmental impact and thus achieve the effect of environmental protection.

[0027] The above disclosure merely represents preferred possible embodiments of the present invention and is not intended to limit the scope of the claims of the present invention, so that all equivalent technical changes made by applying the contents of the description and the drawings of the present invention fall within the scope of the claims of the present invention. List of reference symbols Z cooling device 1 fixture body 10 First opening 11 Second opening 12 Recording chamber 13 Conveyor element 14 Liquid spray element 15 Gas flow generating element 16 Ventilation opening D Heat dissipation structure D1 heat dissipation plate D1a base body D10 lead D11 through hole D12 Deepening D2 adhesive layer

Claims

[1] Heat dissipation structure (D) comprising: - several heat dissipation plates (D1), which are porous, plate-shaped structures, and - at least one adhesive layer (D2) arranged between two adjacent heat dissipation plates (D1) and connected to the plurality of heat dissipation plates (D1). [2] The heat dissipation structure (D) according to claim 1, wherein the at least one adhesive layer (D2) comprises a moisture-curing adhesive, wherein each of the heat dissipation sheets (D1) is made of polyethylene terephthalate. [3] The heat dissipation structure (D) according to claim 1 or 2, wherein the heat dissipation structure (D) further comprises a plurality of adhesive layers (D2), wherein the plurality of heat dissipation sheets (D1) are stacked while each of the adhesive layers (D2) is located between two adjacent heat dissipation sheets (D1). [4] The heat dissipation structure (D) according to claim 3, wherein each of the heat dissipation plates (D1) is provided on both sides with a plurality of projections (D10), the plurality of projections (D10) of one of the heat dissipation plates (D1) corresponding to the plurality of projections (D10) of another heat dissipation plate (D1), each of the adhesive layers (D2) being arranged between two adjacent projections (D10) and connecting the plurality of corresponding projections (D10) to each other. [5] Heat dissipation structure (D) according to claim 3 or 4, wherein each of the heat dissipation plates (D1) has a plurality of through holes (D11), each of the through holes (D11) penetrating a base body (D1a) of the respective heat dissipation plate (D1) and being arranged between two adjacent projections (D10). [6] Cooling device (Z), comprising: - a device body (1) having at least one first opening (10), a second opening (11) and a receiving chamber (12), wherein the receiving chamber (12) is connected to the at least one first opening (10) and the second opening (11), and - a plurality of heat dissipation structures (D) suspended in the receiving chamber (12), each of the heat dissipation structures (D) comprising: - several heat dissipation plates (D1), which are porous, plate-shaped structures, and - at least one adhesive layer (D2) arranged between two adjacent heat dissipation plates (D1) and connected to the plurality of heat dissipation plates (D1). [7] Cooling device (Z) according to claim 6, wherein the at least one adhesive layer (D2) comprises a moisture-curing adhesive, wherein each of the heat dissipation sheets (D1) is made of polyethylene terephthalate. [8] Cooling device (Z) according to claim 6 or 7, wherein at least one of the heat dissipation structures (D) further comprises a plurality of adhesive layers (D2), wherein the plurality of heat dissipation sheets (D1) are arranged in a stacked manner while each of the adhesive layers (D2) is located between two adjacent heat dissipation sheets (D1). [9] Cooling device (Z) according to claim 8, wherein each of the heat dissipation plates (D1) is provided on both sides with a plurality of projections (D10), wherein the plurality of projections (D10) of one of the heat dissipation plates (D1) correspond to the plurality of projections (D10) of another heat dissipation plate (D1), wherein each of the adhesive layers (D2) is arranged between two adjacent projections (D10) and connects the plurality of corresponding projections (D10) to each other. [10] Cooling device (Z) according to claim 8 or 9, wherein each of the heat dissipation plates (D1) has a plurality of through holes (D11), wherein each of the through holes (D11) penetrates a base body (D1a) of the respective heat dissipation plate (D1) and is arranged between two adjacent projections (D10).

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