Laser processing machine for processing workpieces

Abstract

Laser processing machine (1), in particular laser welding machine, for processing workpieces, wherein the laser processing machine • has a first workstation (2) and a second workstation (3) for receiving workpieces, wherein the workstations (2, 3) are arranged spatially separated from each other along a traversing axis (V); • has at least one movable laser head (13a, 13b), in particular at least two movable laser heads (13a, 13b), in particular laser welding heads, for carrying out processing operations; • has a protective enclosure (20) wherein the protective enclosure (20) encloses the at least one laser head (13a, 13b), in particular the at least two laser heads (13a, 13b), and is transferable along the travel axis (V) between a first working position (A) surrounding the first work station (2) and a second working position (B) surrounding the second work station (3); • a first traversing system (30) with a first set of traversing rails (31a, 31b) for traversing the protective enclosure (20) along the traversing axis (V); • has at least one processing unit (10a) arranged within the protective housing (20) and comprising at least one laser head (13a, 13b); and • a second traversing system (40) for traversing the at least one processing unit (10a) along the traversing axis (V) within the protective enclosure (20) and between the workstations (2, 3), wherein the second traversing system (40) is designed such that a relative movement of the at least one processing unit (10a) relative to the protective enclosure (20) is enabled along the traversing axis (V).

Description

[0001] The present invention relates to a laser processing machine, in particular a laser welding machine, for processing workpieces, comprising a first workstation and a second workstation for receiving workpieces, at least one movable laser head, in particular at least two movable laser heads, a protective enclosure, a first traversing system for moving the protective enclosure, at least one processing unit and a second traversing system for moving the at least one processing unit.

[0002] Industrial laser processing technology, particularly laser welding, has become an indispensable process in modern manufacturing. Laser welding machines enable precise and high-quality joining of metal components through the application of focused laser radiation. In addition to laser welding, laser processing also includes laser-assisted adhesive seam preparation for cleaning, laser-assisted surface roughening, sequential surface laser hardening, and technical laser surface treatment. This laser processing technology is widely used in the automotive industry, mechanical engineering, and electronics manufacturing, where high processing speeds and minimal heat-affected zones are required.

[0003] A crucial aspect of operating laser processing machines is the safety of operators and the surrounding environment from hazardous laser radiation, particularly reflected scattered beams. For this reason, laser processing machines are equipped with protective enclosures that completely enclose the work area and prevent the escape of laser radiation. These enclosures must comply with applicable laser safety regulations and ensure reliable shielding throughout the entire processing operation.

[0004] Modern laser processing machines have workstations that serve to hold and position the workpieces to be processed. These workstations are equipped with workpiece fixtures and holding devices to enable precise fixation of the workpieces during the processing operation.

[0005] To perform the processing operations, laser processing machines are equipped with movable laser heads. In the case of laser welding machines, these are laser welding heads that direct the focused laser beam onto the areas of the workpiece to be welded. These laser heads must be guided precisely along defined paths to ensure uniform processing and, for example, to produce high-quality welds. The movement of the laser heads is typically achieved via multi-axis positioning systems that allow for two-dimensional positioning.

[0006] A critical aspect in the design of laser processing machines is the implementation of traversing systems that enable precise and repeatable movement of the various machine components. These traversing systems typically include guide rails, guide elements, and drive units that work together to achieve the required motion sequences. The mechanical separation of different traversing systems can be crucial for achieving high positioning accuracy.

[0007] Conventional laser processing machines use static protective enclosures that permanently enclose the entire work area. Loading and unloading workpieces is accomplished by opening doors or flaps within the enclosure. This approach inevitably leads to longer interruptions in the processing process, as no machining operations can be performed during workpiece changes. Instead, the operator must wait until the finished workpiece is removed and a new one is inserted. This resulting downtime significantly reduces the overall productivity of the machine and represents a particular economic disadvantage in series production, as it leads to slower cycle times. Furthermore, access to the workpieces is often hampered by the limited openings in the protective enclosure, resulting in even longer setup times and reduced operator ergonomics.

[0008] Furthermore, in conventional systems, the motion systems for the protective enclosure and the laser heads are often mechanically coupled, meaning the laser head can only be moved together with the enclosure. This leads to compromises and disadvantages in positioning accuracy, as the heavy enclosure can impair the precision of the laser head movements. These limitations prevent optimal utilization of the available processing time and reduce flexibility when processing different workpiece geometries.

[0009] Starting from the prior art, the object of the present invention is to provide a laser processing machine that not only eliminates the non-productive time for loading and unloading, but also significantly reduces the main processing time per workpiece in order to further improve the overall throughput of the laser processing machine without compromising the high positioning accuracy required for the processing process.

[0010] This problem is solved in a laser processing machine of the type mentioned above by having a first workstation and a second workstation for holding workpieces, wherein the workstations are arranged spatially separated from one another along a traversing axis; having at least one movably arranged laser head, in particular at least two movably arranged laser heads, in particular laser welding heads, for carrying out processing operations; having a protective enclosure, wherein the protective enclosure encloses the at least one laser head, in particular the at least two laser heads, and is transferable along the traversing axis between a first working position surrounding the first workstation and a second working position surrounding the second workstation; having a first traversing system with a first set of traversing rails for moving the protective enclosure along the traversing axis;comprising at least one processing unit arranged within the protective enclosure and comprising at least one laser head; and comprising a second traversing system for moving the at least one processing unit along the traversing axis within the protective enclosure and between the workstations, wherein the second traversing system is designed to allow relative movement of the at least one processing unit with respect to the protective enclosure along the traversing axis.

[0011] This specific linear arrangement along the traverse axis offers advantages for the travel path of the protective enclosure, as it only needs to perform a single translational movement between two defined working positions. The spatial separation allows the workstation not enclosed by the protective enclosure to be freely accessible from three sides (e.g., from the left, right, and the front or rear of the laser processing machine) or four sides (e.g., from the left, right, top, and the front or rear of the laser processing machine), thus significantly simplifying the loading and unloading of workpieces and making the laser processing machine ready for mass production and series manufacturing. Furthermore, the solution according to the invention enables simple quality inspection after processing, since the workpiece is easily accessible after the protective enclosure has been moved.

[0012] The transfer of the protective enclosure from the first working position to the second working position and back to the first working position is accomplished via the first traversing system with the first set of rails, allowing the protective enclosure to be precisely positioned between the two working positions. During the movement of the protective enclosure between the working positions, the laser of the laser head can be switched off, so that no laser radiation is emitted and no laser-safe shielding is required between the workstations. Upon reaching the working positions, the work area can be shielded from the outside by the protective enclosure to ensure the necessary protection against laser radiation.

[0013] The protective enclosure completely encloses the at least one laser head, in particular the at least two laser heads, and encapsulates the laser head(s) within a common protective volume. This common enclosure fulfills laser safety requirements by providing reliable shielding against hazardous laser radiation and reflected scattered beams. Despite the complete encapsulation, the laser head(s) are granted sufficient freedom of movement within the protective enclosure to perform their processing tasks flexibly and precisely.

[0014] The protective enclosure can be open or closed at the top. It can enclose a protective volume on all four sides and optionally also at the top, i.e., along a direction perpendicular to the axis of travel, pointing away from the workstation. The enclosure can be designed as a box open on one or both sides to accommodate part of the volume above a workpiece holder of the workstation, while remaining open towards the workstation to allow the laser head(s) to process a workpiece held by the workpiece holder. The protective enclosure can also be completely closed at the top, particularly in a laser-safe manner.

[0015] One or both end walls of the protective enclosure extending transversely to the axis of travel can be removable or opened, e.g. by a door or flap mechanism, to allow easy access to the protective volume for maintenance and repairs, especially of the machining unit.

[0016] The protective enclosure, which is stationary during the main processing time and may in particular be a laser safety enclosure, surrounds the laser head(s), the respective workstation and the workpiece held by it during processing, thus providing the necessary external protection.

[0017] The second traverse system allows the machining unit to move independently of the protective enclosure along the traverse axis. This second traverse system can include a drive motor that powers the machining unit along the traverse axis. The drive motor can be located directly on the machining unit, or even integrated into it. The drive motor enables the machining unit to move along the traverse axis. This movement can occur, in particular, via the rail set of the first traverse system, where these rails are passive, allowing both the protective enclosure and the machining unit to move independently and autonomously. Similarly, the other machining units can also have their own traverse systems with drive motors to move along the traverse axis via the rails of the first traverse system.In this way, a rail set can enable independent operation of the protective enclosure and the processing unit or units along the travel axis.

[0018] Alternatively, the processing unit can also be moved along the travel axis by means of its associated travel system via a separate travel rail from the travel rail of the protective enclosure's travel system, whereby these travel rails can then also be actively designed.

[0019] The one or more machining units are arranged within the protective enclosure and spatially integrated into its protective volume. Despite the compact design, sufficient freedom of movement for the machining units is ensured, and the arrangement still allows access for maintenance and adjustment work. The second traverse system enables relative movement of the at least one machining unit with respect to the protective enclosure along the traverse axis. Together with the protective enclosure, the one or more machining units can be moved from one workstation to another along the traverse axis.

[0020] This kinematic decoupling via the first and second traversing systems enables the at least one laser head, and in particular the at least two laser heads, to operate with high precision and flexibility, moving along the traversing axis while the protective enclosure remains stationary in one of its working positions. The coordination of movements during the processing operation is independent of the position of the protective enclosure, allowing weld seams to be created simultaneously by the laser heads or in a time-optimized choreography, thus drastically reducing the pure process time and therefore the main processing time. The at least one or more processing units can move the laser heads along the traversing axis within the protective enclosure during the main processing time to precisely position them over the workpiece.

[0021] To switch between workstations, synchronization can be achieved during the shared process between the workstations. In this process, the laser head, which is otherwise decoupled from the protective enclosure, moves along the axis of travel together with the enclosure. This allows one workstation to be freed up for loading and unloading while work can continue simultaneously at the other workstation. This also reduces the downtime for loading and unloading, resulting in a significant reduction in standby or idle time.

[0022] By using at least two laser heads, multiple areas of the workpiece can be processed simultaneously at the workstation. This achieves a twofold increase in efficiency: minimizing downtime and increasing productivity during the main processing time. This results in shorter processing times per workpiece and increases the overall throughput of the laser processing machine.

[0023] In a further development of the invention, the second traversing system comprises a second set of traversing rails for moving the at least one processing unit along the traversing axis within the protective enclosure and between the workstations, wherein the second traversing system is mechanically separated from the first traversing system by the use of different sets of rails. This complete kinematic decoupling ensures that movements of the protective enclosure have no negative impact on the positioning accuracy of the laser heads and that the protective enclosure and the one or more processing units, in particular the laser heads, can be moved independently of each other along the traversing axis. This design of the separation can prevent the transmission of vibrations between the systems and allow for different load profiles of the respective sets of rails.While the first set of rails has to support the heavy protective housing, the set of rails of the second traversing system can be optimized for the precise movement of the lighter processing unit.

[0024] In a further embodiment, the laser processing machine can have more than two workstations that are used cyclically. This expansion to multiple workstations can enable even higher productivity, as more workpieces can be processed or prepared in parallel. The cyclical use can involve continuous rotation of the protective enclosure between the different workstations, thus enabling virtually uninterrupted production.

[0025] Each workstation can have a workpiece holder for receiving the workpiece and several clamping devices for securing it. The workpiece can be placed on the workpiece holder by a robot or a human operator. The robot can be controlled by a control unit of the laser processing machine to enable automated and precise positioning of the workpiece.

[0026] The machining unit can be configured as a 2-axis gantry, or in particular a 3-axis gantry, in which the laser head can be moved along two, or in particular three, axes relative to the workpiece holder. The first axis of movement of the laser head results from the linear movement of the entire machining unit along the guide rails above the workpiece holder. Additionally, the laser head can be moved along a second axis of movement, which runs longitudinally to the longitudinal axis of a support gantry of the machining unit. Optionally, the laser head can be moved along a third axis of movement to be lowered towards or raised away from the workpiece holder. This enables precise machining of the workpiece.

[0027] Preferably, the processing unit is designed to include two laser heads. This configuration reduces manufacturing costs by minimizing the number of complex, movable processing units. Simultaneously, it simplifies the control system and kinematics, as only one processing unit needs to be coordinated. This arrangement allows for flexible configuration according to the specific requirements of each processing operation, thereby reducing the overall mechanical complexity of the system.

[0028] The two laser heads can be arranged on the same long side of the processing unit, for example one behind the other for laser smoothing, making sequential processing steps on a workpiece possible without repositioning the processing unit.

[0029] Alternatively, the laser heads can be arranged on opposite long sides, which allows simultaneous processing of different areas of the workpiece.

[0030] The long sides are positioned perpendicular to the traversing axis, ensuring optimal accessibility to the machining areas.

[0031] It is possible for the laser processing machine to have at least two independently movable processing units, each comprising at least one laser head. This design maximizes flexibility, as the processing units can process different areas of the workpiece simultaneously and independently. The parallel use of two or more completely independent processing operations can significantly increase throughput. The at least two processing units can be located within the protective enclosure. Each of the at least two processing units can have its own separate motion units for the laser heads, enabling precise and coordinated processing of complex geometries.Each processing unit and each laser head can be positioned independently of the other processing units, enabling optimal path planning and collision avoidance.

[0032] Another embodiment involves mounting at least two machining units on the rail set of the second traversing system so that they can move freely. This configuration reduces manufacturing costs and the required installation space by utilizing a shared guide infrastructure for both machining units. Sharing the traversing rails can simplify the design and maintenance of the overall system while simultaneously ensuring the necessary freedom of movement for both machining units. The machining units can have separate drive systems, enabling independent positioning along the shared traversing rails.

[0033] Furthermore, the laser processing machine may have a second traverse system assigned to the first of at least two processing units to move the first processing unit along the traverse axis, and a third traverse system with a third set of traverse rails, the third traverse system assigned to the second of at least two processing units to move the second processing unit along the traverse axis. This configuration maximizes positioning accuracy through the complete mechanical decoupling of vibrations between the processing units. Additionally, it increases system redundancy, as the failure of one drive only affects one processing unit.The third traversing system can be mechanically separate from the first and second traversing systems and allow relative movement of the second machining unit with respect to the protective enclosure along the traversing axis. Likewise, the third traversing system can allow relative movement of the second machining unit with respect to the first machining unit along the traversing axis. The machining units can, in particular, be designed to be linearly traversable on traversing rails, with the two sets of rails preferably arranged parallel to each other.

[0034] Both sets of guide rails can preferably be arranged on both sides of the travel axis, so that at least one guide rail of each set is located to the left and at least one guide rail of the respective set is located to the right of the travel axis.

[0035] Preferably, the second set of rails is a first pair of traversing rails defining a first track gauge, and the third set of rails is a second pair of traversing rails defining a second track gauge that differs from the first. Both pairs of traversing rails are arranged essentially coaxially to the traversing axis, such that one pair forms an inner and the other pair an outer track. This arrangement enables a particularly compact and nested design of the overall system, which structurally supports the function of one unit passing under another. The traversing rails of the first pair can be located on the side of the traversing rails of the second pair facing the traversing axis, thus achieving optimal space utilization. This nested arrangement can enable collision-free movement of the machining units while simultaneously minimizing the overall system's footprint.

[0036] In a further development of the invention, the second set of rails is a first pair of traversing rails defining a first track gauge, and the third set of rails is a second pair of traversing rails whose track gauge corresponds to the first track gauge. Both pairs of traversing rails are arranged essentially coaxially to the traversing axis, such that one traversing rail of the first pair is located on the inside of the traversing axis on one side, and one traversing rail of the second pair is located on the inside of the traversing axis on the other side. This configuration simplifies the design and inventory management, as identical components for the support gantries can be used for the machining units, thus supporting a common parts strategy. Because the track gauges are the same, the support gantries can also be of the same length along their longitudinal axes.The symmetrical arrangement of the guide rails can enable a uniform load distribution and a simplified control logic, since both machining units can have identical kinematic properties.

[0037] According to one embodiment of the invention, the at least one processing unit comprises at least one support gantry that extends like a bridge, in particular over one of the workstations, from one traversing rail to another traversing rail of the traversing system associated with the processing unit. This design ensures high rigidity and positioning accuracy for guiding the laser heads through the use of a gantry construction. The support gantry can extend like a bridge between the two traversing rails of the second traversing system associated with the processing unit, between which the workstations are arranged in a central area of ​​the laser processing machine. The first and second processing units can each have a support gantry that extends like a bridge over the central area of ​​the laser processing machine containing the workstations.This portal structure can ensure optimal force distribution and minimal deflection under operating loads, which is crucial for the required machining precision.

[0038] Furthermore, it can be provided that at least one laser head of the processing unit is movably mounted along the longitudinal axis of the support gantry. This arrangement enables the workpiece to be processed across its entire width by moving the laser head along the longitudinal axis of the support gantry, perpendicular to the traverse axis. The movable mounting can be achieved, in particular, by means of a motion unit arranged on the support gantry and functionally connected between the support gantry and the laser head. In this way, two-dimensional positioning of the laser head can be realized.

[0039] The motion unit can also raise and lower the laser head towards the workstation, enabling three-dimensional positioning of the laser head. This multi-axis mobility allows for flexible adaptation to different workpiece geometries and optimal guidance of the laser head along complex machining paths.

[0040] In a further embodiment, the at least two machining units are designed so that they can move past each other along the traverse axis. This functionality enables collision-free machining of overlapping or difficult-to-access areas of a workpiece. Additionally, efficiency is maximized by minimizing circumvention movements and optimizing path planning for the two machining units.

[0041] Furthermore, the support gantries of the machining units can be designed to have different heights. This configuration enables a mechanically robust and control-engineered simple solution for collision avoidance, allowing one machining unit to pass underneath another. The support gantry of the first machining unit can be shorter along its longitudinal axis than that of the second to prevent collisions. This height staggering ensures reliable and predictable motion coordination between the machining units without requiring complex collision detection algorithms for control.

[0042] At least one support gantry, and in particular all support gantry units, of the processing units may have a variable, especially linear, height adjustment. This allows them to temporarily have different heights to allow them to pass each other or to adjust the distance between the laser head and the workpiece for better laser focusing.

[0043] It is proposed that at least one of the machining units has a pivot axis to temporarily reduce its overall height. This solution enables a kinematically flexible and space-saving collision avoidance solution that also works with gantries of otherwise identical height. The machining unit can pivot around an axis parallel to its longitudinal axis to allow it to pass under or over the other machining unit. This pivoting function enables adaptive collision avoidance and increases flexibility in the arrangement and movement of the machining units without requiring permanent height differences in the structure.

[0044] According to one design, it is proposed that the first set of guide rails is arranged in a first, lower plane of motion, and the second set of guide rails, in particular the second and third sets, are arranged in a second, higher plane of motion. The first, lower plane of motion is located lower than the second, higher plane of motion; that is, in the operating position of the laser processing machine, it is closer to the surface supporting the laser processing machine than the second plane of motion. These planes of motion are those in which the guide rails are located and which enable the movements of the protective enclosure or the processing unit.This vertical separation allows the protective enclosure to extend further downwards beyond the connection of the processing unit to the traversing rail, thus providing even better protection, especially laser protection.

[0045] In a further embodiment of the invention, a drive motor for moving a machining unit is either arranged on the machining unit itself and acts on passive traverse rails; or is designed as a stationary component of the second and / or third traverse system and acts on at least one active traverse rail. This flexibility in the design of the drive concept allows for optimization depending on the requirements for cost, dynamics, or ease of maintenance. Active traverse rails can, in particular, be designed as linear drives, which may include a linearly movable sliding table on which the machining unit can be mounted.

[0046] Furthermore, a drive motor for moving the protective enclosure can be arranged either on the enclosure itself and act on passive guide rails; or it can be stationary as part of the first movement system and act on at least one active guide rail. This design allows for optimization of the drive for heavy protective enclosures, either by reducing the complexity of the stationary infrastructure through an on-board drive or by minimizing the moving mass through an external drive. Active guide rails can be designed as linear drives, which may include a linearly movable transfer table on which the protective enclosure can be mounted. The drive design can be tailored to the specific requirements regarding travel speed, positioning accuracy, and energy efficiency.

[0047] According to one embodiment of the invention, a movable sealing element is provided to close a gap between the workstations below the protective enclosure after the enclosure has reached its working position. This design ensures complete laser safety of the system during processing by sealing the gap inherent in the design. This gap is present during the movement of the protective enclosure between working positions to allow collision-free movement; however, since the lasers are switched off during this process, it does not pose a safety risk. Additionally, the escape of harmful fumes from the work area is prevented. The sealing element can create a reliable seal between the workstations while ensuring the necessary freedom of movement for the protective enclosure to move between working positions.

[0048] In a further development of the invention, the sealing element is designed as an intermediate element that can be raised relative to the substructure of the laser processing machine between the workstations. This solution enables a reduction in the moving mass and the complexity of the protective enclosure, since the sealing mechanism is part of the stationary substructure and not the protective enclosure itself. In its raised position, the intermediate element can precisely rest against the underside of the protective enclosure, ensuring a complete seal.

[0049] It is possible for the sealing element to be designed as a lowering seal from the underside of the protective enclosure. This design creates a self-contained protective enclosure system that does not require complex installations in the substructure and is therefore easier to assemble. The lowering seal can be flexibly adapted to various floor configurations and ensure a reliable seal regardless of the substructure's condition. This mobile solution can allow for increased flexibility in machine setup and configuration.

[0050] Another embodiment involves using an inflatable seal as the sealing element. This solution enables a highly effective and fault-tolerant seal by adapting to minor misalignments or unevenness. Additionally, it minimizes mechanical wear compared to a frictional solid seal. The inflatable seal can be pneumatically or hydraulically actuated, allowing for adaptive adjustment to various operating conditions.

[0051] Furthermore, it is possible to arrange the at least two workstations in a fixed position on the laser processing machine. This design simplifies the overall construction, as only the lighter components, such as the protective enclosure and processing units, need to be moved, not the heavy workpieces and their clamping devices. Additionally, it allows the use of high-precision and robust workpiece fixtures, since these do not need to be designed for movement. The fixed arrangement can ensure increased stability and repeatability of the processing operations while simultaneously reducing the mechanical complexity of the overall system.

[0052] It is proposed that the laser processing machine have a central control unit configured to move at least one processing unit independently of the protective enclosure, and in particular at least two processing units independently of each other and independently of the protective enclosure, along the traverse axis during the processing operation. The control unit can be configured to control the first, second, and third traverse systems individually. In this way, the control unit can move the processing units individually to process the workpiece while keeping the protective enclosure in the respective working position. Furthermore, the control unit can be configured to control the movement of the laser heads along the support gantries as well as the raising and lowering of the laser heads.Furthermore, the control unit can be set up to move the laser heads into a parking position before the protective enclosure process, in order to ensure a collision-free and safe transfer between the workstations.

[0053] In a further embodiment, the central control unit is designed to synchronize the movements of the protective enclosure and the at least one processing unit during transfer between the first and second working positions. This synchronization ensures a collision-free, safe, and time-optimized sequence of all independent movements of the protective enclosure and the at least one processing unit during their simultaneous transfer from one workstation to the other. The protective enclosure and processing units can thus be moved together and simultaneously from the first workstation to the second workstation and vice versa. Before the transfer, the laser heads can be moved to their parked position and the lasers deactivated. This coordinated movement ensures minimal transition time between workstations and maximum productivity of the entire laser processing machine.

[0054] Another embodiment provides for the laser processing machine to have a control system for checking the workpiece's leak tightness after processing. This integrated leak test using the control system can be performed immediately after the processing operation, while the workpiece is still fixed in the workpiece holder. The control system can be designed to perform leak testing by pressurization, vacuum testing, or other suitable testing methods, enabling an immediate quality assessment of the welded joints without requiring any additional handling steps or separate testing stations.

[0055] The laser processing machine may be equipped with a process monitoring system. These systems enable continuous monitoring of processing quality during operation, capturing parameters such as weld geometry, penetration depth, and porosity in real time. Integrating process monitoring systems into the laser processing machine allows for automatic quality control and immediate process correction in case of deviations, thereby reducing the scrap rate and increasing process stability.

[0056] Preferably, the laser processing machine is designed to have exactly two workstations and / or exactly two laser heads. This optimized configuration can represent an ideal balance between complexity and performance, while keeping investment and operating costs within an economically attractive range.

[0057] In a method for operating a laser processing machine, it is proposed to solve the aforementioned problem that the method comprises the following steps: positioning a first workpiece on the first workstation; synchronously moving the protective enclosure and the at least one processing unit along the traversing axis into a first working position in which the protective enclosure surrounds the first workstation; performing a processing operation on the first workpiece using the at least one laser head, in particular the at least two laser heads; positioning a second workpiece on the second workstation parallel to the first workpiece; synchronously moving the protective enclosure and the at least one processing unit along the traversing axis into a second working position in which the protective enclosure surrounds the second workstation, after completion of the first processing operation;Performing a second processing operation on the second workpiece using the at least one laser head, in particular the at least two laser heads; and removing the first workpiece from the first workstation in parallel with the processing operation on the second workpiece.

[0058] This process can increase productivity by largely eliminating downtime. While work is being carried out at one workstation under the protective enclosure, workpieces can be loaded and unloaded simultaneously at the other, freely accessible workstation by a robot or a human operator. The robot can be controlled by the central control unit of the laser processing machine to enable fully automated process control. This parallel process control can drastically reduce the overall cycle time and ensure continuous utilization of the processing capacity. The synchronized operation of the protective enclosure and the processing units allows for precise coordination of all movements to guarantee the necessary safety throughout the entire operating cycle.

[0059] The use of at least two laser heads can enable simultaneous processing of different areas of the workpiece, thereby significantly reducing the pure processing time per workpiece.

[0060] The features described in connection with the laser processing machine according to the invention can also be applied individually or in combination to the method. The same advantages arise as already described.

[0061] Preferably, the procedure is designed to include further steps that enable continuous and optimized process control.

[0062] The process can include additional cycles in which, after the first workpiece is removed from the first workstation, a third workpiece is positioned on the first workstation while the processing of the second workpiece at the second workstation is still ongoing. This cyclical process can ensure continuous utilization of both workstations and maximize the overall productivity of the laser processing machine.

[0063] The process can enable adaptive timing that adjusts to different processing times and workpiece changeover times in order to achieve optimal synchronization between the parallel processes.

[0064] Furthermore, the process can include quality control steps that are carried out during processing breaks at the currently available workstation, thus enabling integrated quality assurance without additional downtime.

[0065] Another embodiment of the process involves automated coordination of the laser heads during the machining operation, with at least two laser heads working simultaneously or in a time-optimized choreography. This coordinated machining strategy can drastically reduce the pure processing time per workpiece, as different areas of the workpiece can be machined in parallel.

[0066] The process can implement intelligent path planning that avoids collisions between the laser heads and simultaneously optimizes the processing sequence for minimal distortion effects.

[0067] Time-optimized choreography can include various processing strategies, such as simultaneously processing symmetrical seams to minimize tension or sequentially processing with overlapping work areas to maximize processing speed.

[0068] The following section explains embodiments, further developments, and examples of the invention in more detail with reference to the accompanying drawings. The figures show: Fig. 1 a perspective view of a first embodiment of the laser processing machine according to the invention in a first working position, Fig. 2 a perspective view of the laser processing machine according to Fig. 1 in a second working position, Fig. 3 a top view of the laser processing machine according to Fig. 1, Fig. 4 a sectional view of the laser processing machine according to Fig. 1 along the travel axis, Fig. 5 a perspective view of a second embodiment of a machining unit according to the invention, Fig. 6 a perspective view of a third embodiment of a machining unit according to the invention and Fig. 7 a perspective, partially cutaway view of a fourth embodiment of a machining unit according to the invention.

[0069] Fig. Figure 1 shows a perspective view of a first embodiment of the laser processing machine 1 according to the invention in a first working position A. The laser processing machine 1 comprises a substructure (not visible here) that extends longitudinally and supports two workstations positioned at defined intervals along a traversing axis V that runs along the length of the laser processing machine 1. This arrangement forms the structural foundation of the laser processing machine 1 and defines the operational working area.

[0070] A first workstation 2 and a second workstation 3 are spatially separated from each other along the traversing axis V. Each workstation 2, 3 includes a workpiece holder 4, which is configured for receiving and precisely positioning workpieces during machining operations. Holding devices 5 are provided at each workstation 2, 3 to securely fix the workpieces during machining and to ensure reproducible positioning.

[0071] A protective enclosure 20 is shown positioned in its first working position A above the first workstation 2. The protective enclosure 20 has a box-shaped configuration with vertical side walls and creates an enclosed protective volume to contain the laser radiation during the processing operations of the laser processing machine 1, which is configured as a laser welding machine. This volume is completely and laser-safely sealed at the top by a lid of the protective enclosure 20. Fig. However, in Figure 1, this lid is not shown in order to allow a view of the interior of the protective volume.

[0072] The protective enclosure 20 is mounted on a traversing system 30, which enables movement along the traversing axis V between the two workstations 2, 3. The traversing system 30 associated with the protective enclosure 20 comprises the traversing rails 31a and 31b, which ensure precise linear guidance of the protective enclosure along the traversing axis V.

[0073] Within the protective enclosure 20, two processing units 10a and 10b are visibly arranged. Each processing unit comprises a support gantry that extends across the width of the machine and forms a bridge-like connection between the opposite sides of the laser processing machine 1. The processing units 10a and 10b are mounted on traversing rails 41a, 41b, 51a, and 51b, which run parallel to the traversing axis V and enable their movement between the workstations 2 and 3.

[0074] The traversing rails 41a, 41b are part of a traversing system 40, which enables the movement of the processing unit 10a along the traversing axis V both during joint traversing with the protective enclosure 20 between the workstations 2, 3 and during relative traversing within the protective enclosure 20 when it is at rest in one of its working positions A, B.

[0075] The traversing rails 51a, 51b belong to a traversing system 50, which provides corresponding movement possibilities for the processing unit 10b.

[0076] The traversing systems are arranged in several parallel tracks positioned on opposite sides of the work area. A first set of traversing rails 31a, 31b is used to move the protective enclosure 20 along the traversing axis V. A second set of traversing rails 41a, 41b is used to move the first processing unit 10a, while a third set of traversing rails 51a, 51b is used to move the second processing unit 10b.

[0077] This mechanical separation between the traversing systems 30, 40, 50 enables the protective enclosure 20 and the machining units 10a, 10b to move independently of each other during station changes, while the machining units 10a, 10b can perform precise positioning movements within the protective enclosure 20 during the machining operations.

[0078] The traversing rails 31a, 31b, 41a, 41b, 51a, 51b are grouped into two rail groups 7, each rail group comprising traversing rails positioned on opposite sides of a central area 6 in which the workstations 2, 3 are arranged.

[0079] The central area 6 extends along the travel axis V, and the workstations 2, 3 are positioned in this central area 6 below the travel path of the machining units 10a, 10b and the protective enclosure 20.

[0080] Drive motors 32, 42, 52 of the traversing systems 30, 40, 50, which are particularly in Fig. The motors shown in Figure 2 are designed to actuate the movement along the respective traverse systems 30, 40, and 50. The drive motor 32 is assigned to the traverse rails 31a and 31b for moving the protective enclosure 20. The drive motor 42 is assigned to the traverse rails 41a and 41b for moving the first processing unit 10a. The motor 52 is assigned to the traverse rails 51a and 51b for moving the second processing unit 10b.

[0081] In this view, the protective enclosure 20 is positioned in the first working position A, where it encloses the first workstation 2 for machining operations. The second workstation 3 remains fully accessible and open for workpiece handling. The distance between workstations 2 and 3 corresponds to the travel range of the protective enclosure 20 and allows the enclosure to traverse from one station to the other along the travel axis V.

[0082] Fig. Figure 2 shows a perspective view of the laser processing machine 1 according to the first embodiment of Fig. Figure 1 shows the spatial arrangement of the components with the protective enclosure 20 in its second working position B above the second workstation 3. In this working position B, the protective enclosure 20 encloses the second workstation 3 for machining operations. This view illustrates the change between working positions A and B.

[0083] The protective enclosure 20 is positioned in its second working position B above the second workstation 3. The protective enclosure 20 thus creates an enclosed volume to contain the radiation during the processing operation on a workpiece picked up by the workpiece holder 4 of the second workstation 3.

[0084] Two processing units 10a, 10b are visible inside the protective enclosure 20. These were moved together with the protective enclosure 20 from the first workstation 2 to the second workstation 3 along the traverse axis V.

[0085] In this second working position B of the protective enclosure 20, the first workstation 2 remains fully accessible and open for workpiece handling.

[0086] The distance between workstations 2, 3 corresponds to the travel range of the protective enclosure 20 and enables the protective enclosure 20 to travel from one station to the other along the travel axis V.

[0087] Fig. Figure 3 shows a top view of the laser processing machine 1 according to the first embodiment with the protective enclosure 20, which is positioned in the first working position A above the first workstation 2. This view shows the internal arrangement of the components enclosed by the protective enclosure 20.

[0088] The laser processing machine 1 comprises the first workstation 2, positioned in the upper part of the view, and the second workstation 3, positioned in the lower part. The protective enclosure 20 surrounds the first workstation 2, creating an enclosed protective volume for processing operations. The removable end walls 21 of the protective enclosure 20, which define this protective volume along the travel axis V, provide access to the protective volume for maintenance and repair purposes. This allows external access to the processing units 10a and 10b, enabling, for example, work to be carried out on the laser heads 13a and 13b.

[0089] The two processing units 10a and 10b are arranged within the protective enclosure 20. The first processing unit 10a comprises a support gantry 11a, which extends horizontally along its longitudinal axis L across the width of the central area 6. A laser head 13a is mounted on one longitudinal side of the support gantry 11a via a movement unit 14a. The movement unit 14a enables the laser head 13a to be positioned along the longitudinal axis L of the support gantry 11a relative to it.

[0090] Similarly, the second processing unit 10b also comprises a support gantry 11b with a laser head 13b, which is mounted via a motion unit 14b. This support gantry 11b also extends horizontally along its longitudinal axis L across the width of the laser processing machine 1.

[0091] This view also shows the intermediate element 9, which is positioned between the first workstation 2 and the second workstation 3. This intermediate element 9 can be raised or lowered to create a laser-safe separation between the work areas 2 and 3 when the protective enclosure 20 is positioned in one of its working positions A or B. In its raised position, the intermediate element 9 rests against the bottom of the protective enclosure 20, sealing it so that no laser radiation can escape from the protective volume in the lower part of the enclosure 20 along the travel axis V. When the intermediate element 9 is lowered, this seal is released, creating a gap between the intermediate element 9 and the protective enclosure 20. This allows the protective enclosure 20 to move along the travel axis V without rubbing against the intermediate element 9.

[0092] In this position of the laser processing machine 1, the protective enclosure 20 encloses the first workstation 2 in the first working position A and enables the laser heads 13a, 13b to perform processing operations. The processing units 10a, 10b can be moved along the traverse axis V across the entire workstation 2 while enclosed by the protective enclosure 20. The movement units 14a, 14b enable the laser heads 13a, 13b to move along the longitudinal axis L of their respective support gantries 11a, 11b, thus providing coverage across the entire width of the workstation 2.

[0093] The second workstation 3 remains open and accessible for loading and unloading workpieces.

[0094] The arrangement of the guide rails is clearly visible. On one side of the travel axis V, guide rail 41a of the travel system 40 is located on the inside, meaning it is closest to the travel axis V compared to the other guide rails of rail group 7, in particular guide rail 51b of the travel system 50. On the other side of the travel axis V, guide rail 51b of the travel system 50 is located on the inside. The track gauges of the two travel systems 40 and 50 for the processing units 10a and 10b are therefore the same. In this way, identical parts can be used for both processing units 10a and 10b, since they are the same length along their longitudinal axes L. In particular, the support gantries 11a and 11b of the processing units 10a and 10b can thus be designed identically.

[0095] The traversing rails 51a, 51b of the traversing system 30 for the protective enclosure 20 have a larger track gauge, since the protective enclosure 20 must surround the processing units 10a, 10b.

[0096] Fig. Figure 4 shows a sectional view along the traverse axis V of the laser processing machine 1 according to the first embodiment and illustrates the internal arrangement of the components and the spatial relationship between the two workstations. This view provides a detailed representation of the structural elements and motion systems along the traverse axis. For better visibility, the protective enclosure 20 is shown in Figure 4. Fig. 4 not shown.

[0097] The laser processing machine 1 comprises a substructure 8 that extends longitudinally along the traversing axis V and provides support for the functional components. A first workstation 2 and a second workstation 3 are positioned at defined intervals along the substructure 8. Workstations 2 and 3 are designed to be freestanding and thus mechanically decoupled from the rest of the substructure 8. Each workstation 2 or 3 includes a workpiece holder 4 configured for receiving and positioning workpieces during processing. Holding devices 5 are provided around the workpiece holders 4 at each workstation 2 or 3 to secure the workpieces in position during processing.

[0098] The intermediate element 9 between the first workstation 2 and the second workstation 3 is shown in its raised position. As can be seen, in this position the top surface of the intermediate element 9 is flush with the top edge of the guide rails of the traversing systems 40 and 50, so that it can rest against the protective housing 20 from below.

[0099] The two processing units 10a and 10b are shown in more detail in the diagram. The first processing unit 10a comprises the support gantry 11a, which extends across the width of the machine. The support gantry 11a has two longitudinal sides 12a, arranged on opposite sides along its longitudinal axis L. The laser head 13a is mounted on this longitudinal side 12a of the support gantry 11a via a motion unit 14a, which enables the laser head 13a to be positioned along the support gantry 11a.

[0100] The second processing unit 10b comprises the support portal 11b with two opposing longitudinal sides 12b along its longitudinal axis L. The laser head 13b is mounted on the support portal 11b via a movement unit 14b.

[0101] The laser heads 13a, 13b can each be moved independently along two, in particular three, axes to achieve precise positioning during processing. A first axis of movement X extends along the traverse axis V and enables forward and backward movements. The movement of the laser head 13a, 13b along the axis of movement X is made possible by the movement of the respective processing unit 10a, 10b by the respective traverse system 40, 50.

[0102] A second axis of movement Y of the laser heads 13a, 13b extends along the longitudinal axis L of the support gantries 11a, 11b and enables left and right movements across the width of the workpiece. The movement of the laser head 13a, 13b along the axis of movement Y is enabled by the respective motion unit 14a, 14b of the processing unit 10a, 10b. The motion unit 14a, 14b can move the laser head 13a, 13b linearly along the longitudinal axis L relative to the support gantry 11a, 11b.

[0103] An optional third axis of movement Z of the laser heads 13a, 13b enables vertical movements and allows the laser heads 13a, 13b to be raised or lowered relative to the workstations 2, 3. The movement of the laser head 13a, 13b along the axis of movement Z is also enabled by the respective motion unit 14a, 14b of the processing unit 10a, 10b. The motion unit 14a, 14b can linearly raise or lower the laser head 13a, 13b along the axis of movement Z, which is perpendicular to the longitudinal axis L and perpendicular to the traverse axis V, relative to the support gantry 11a, 11b, in order to achieve the optimal distance to the workpiece (not shown) on the workpiece holder 4. Alternatively, the movement of the laser heads 13a, 13b along the third axis of movement Z can be achieved by a variable, in particular linear, height adjustment of the respective support portals 11a, 11b.

[0104] The traversing systems 30, 40, and 50 are arranged on different horizontal planes E1 and E2. The first traversing system 30, for the protective enclosure, is positioned in a first, lower plane of motion E1. The second traversing system 40, for the first machining unit 10a, and the third traversing system 50, for the second machining unit 10b, are positioned in a second, higher plane of motion E2. Specifically, the traversing rails 31a, 31b, 41a, 41b, 51a, and 51b of the respective traversing systems 30, 40, and 50 are located in these two planes of motion E1 and E2.

[0105] Also visible are the coupling gears 33, 43, 53 of the traversing systems 30, 40, 50. These connect the respective drive motor 32, 42, 52 to the two traversing rails 31a, 31b, 41a, 41b, 51a, 51b of the traversing systems 30, 40, 50 to enable smooth movement. In particular, the coupling gears 33, 43, 53 transmit the torque of the respective drive motor 32, 42, 52 to the two traversing rails 31a, 31b, 41a, 41b, 51a, 51b to drive them. The guide rails 31a, 31b, 41a, 41b, 51a, 51b are designed as linear drives which move the protective housing 20 or the processing units 10a, 10b.

[0106] Since the traversing systems 40, 50 are arranged on the same plane of motion E2, their drive motors 42, 52 and their coupling gears 43, 53 are each arranged at opposite ends of the laser processing machine 1 along the traversing axis V. Thus, the drive motor 42 and the coupling gear 43 of the second traversing system 40 are located at the end shown in Fig. 4 right end of the laser processing machine 1 and the drive motor 52 and the coupling gearbox 53 of the third traversing system 50 at the in Fig. 4 arranged at the left end of the laser processing machine 1.

[0107] The arrangement of the components in different planes of motion E1, E2 provides a mechanical separation between the motion system of the protective enclosure 20 and the motion systems of the machining units 10a, 10b.

[0108] Fig. Figure 5 shows a perspective view of the laser processing machine 1 according to a second embodiment and illustrates the spatial arrangement of the components, with the protective housing not shown in order to better demonstrate the internal structure and component arrangement. The design of the laser processing machine 1 according to the second embodiment largely corresponds to the design of the laser processing machine 1 according to the first embodiment. Fig. 1 to Fig. 4, so that the following discussion will primarily focus on the differences between the second embodiment and the first embodiment.

[0109] The laser processing machine 1 comprises a first workstation 2 and a second workstation 3, arranged along the traversing axis V. Workstations 2 and 3 are positioned in a central area 6 of the laser processing machine 1, which extends longitudinally along the traversing axis V. Between workstations 2 and 3, in the central area 6, is an intermediate element 9, which can be raised and lowered to create a laser-safe separation between the work areas when the protective enclosure is in one of its working positions.

[0110] In this second embodiment, the processing unit 10a comprises both laser heads 13a, 13b. The two laser heads 13a, 13b are arranged on one of the two longitudinal sides of the support portal 11a via a movement unit 14a, 14b, respectively. The laser heads 13a, 13b can be moved independently of one another along the longitudinal axis L of the support portal 11a by means of the movement units 14a, 14b.

[0111] One support gantry 11a extends transversely between the traversing rails 41a, 41b and provides a bridge-like structure spanning the central area 6. The laser heads 13a, 13b are positioned to access the work area, with the arrangement allowing both laser heads 13a, 13b to operate within the same processing unit 10a and providing simultaneous processing capabilities at a single workstation.

[0112] Since this laser processing machine 1 has only one processing unit 10a, the laser processing machine 1 has, in addition to the traversing system 30 of the protective enclosure 20, only the traversing system 40 assigned to this processing unit 10a. A third traversing system 50 is not required.

[0113] The guide rails 31a and 31b form part of a first guide system 30 for moving the protective housing along the guide axis V. A motor 32 is assigned to the guide rails 31a and 31b to actuate the movement. The guide rails 41a and 41b form part of a second guide system 40 for moving the machining unit 10a along the guide axis V. A motor 42 is assigned to the guide rails 41a and 41b to actuate the movement of the machining unit 10a.

[0114] Since the laser processing machine 1 has only one processing unit 10a, the two rail groups 7 each comprise only two traversing rails 31a, 41a and 31b, 41b, which are positioned on opposite sides of the central area 6 and provide parallel tracks that enable coordinated movement of the respective components along the traversing axis V.

[0115] Fig. Figure 6 shows a perspective view of the laser processing machine 1 according to a third embodiment. The structure of the laser processing machine 1 according to the third embodiment largely corresponds to the structure of the laser processing machine 1 according to the first embodiment. Fig. 1 to Fig. 4, so that the following discussion will primarily focus on the differences between the third embodiment and the first embodiment.

[0116] The laser processing machine 1 comprises two processing units 10a, 10b. In this third embodiment, each processing unit 10a, 10b has a laser head 13a, 13b and a motion unit 14a, 14b. The second processing unit 10b includes a support gantry 11b that extends transversely across the central area 6 and provides a bridge-like structure for mounting the laser head 13a, 13b and the motion unit 14a, 14b.

[0117] The second machining unit 10b has a greater overall height than the first machining unit 10a. Along its respective longitudinal axis L, machining unit 10b is therefore longer than machining unit 10a. Since machining unit 10b is also taller, it allows machining unit 10a to pass underneath it. In this way, the first machining unit 10a can move under the second machining unit 10b. Thus, both machining units 10a and 10b can reach every area of ​​the workpiece holder 4 without being blocked by the other machining unit 10a or 10b while moving along the traverse axis V.

[0118] To allow the processing units 10a and 10b to pass each other, this design also differs in the arrangement of the guide rails of the traversing systems 40 and 50 assigned to the processing units 10a and 10b. The guide rails 41a and 41b of traversing system 40 are located closer to the traversing axis V on both sides of the traversing axis V than the guide rails 51a and 51b of traversing system 50. The guide rails 41a and 41b thus form an inner track, and the guide rails 51a and 51b an outer track, for the processing units 10a and 10b. In this way, the processing unit 10b can be moved over and around the processing unit 10a on both sides via the traversing rails 51a, 51b along the traversing axis V without its support portal 11b colliding with the support portal 11a of the processing unit 10a.

[0119] Along its respective longitudinal axis L, the processing unit 10b is therefore longer than the processing unit 10a. Since the processing unit 10b is also taller, it allows the processing unit 10a to pass underneath it.

[0120] The guide rails 31a, 31b of the travel system 30 assigned to the protective enclosure 20 remain outside the guide rails 51a, 51b on both sides in both rail groups 7.

[0121] Here too, the traversing systems 30, 40, and 50 are arranged on different horizontal planes of motion E1 and E2. The traversing rails 31a and 31b are arranged in a first, lower plane of motion E1. The traversing rails 41a and 41b and the traversing rails 51a and 51b are arranged in a second, higher plane of motion E2.

[0122] Fig. Figure 7 shows a perspective, partially cutaway view of the laser processing machine 1 according to a fourth embodiment, wherein the protective enclosure 20 is positioned above the first workstation 2 in the first working position A. The construction of the laser processing machine 1 according to the fourth embodiment largely corresponds to the construction of the laser processing machine 1 according to the first embodiment. Fig. 1 to Fig. 4, so that the following discussion will primarily focus on the differences between the third embodiment and the first embodiment.

[0123] The laser processing machine 1 includes a workpiece holder 4, which is positioned at the first workstation. The protective enclosure 20 is positioned above the workpiece holder 4 in the first working position A. The protective enclosure 20 creates an enclosed protective volume that completely surrounds the workpiece holder 4 and the workpieces positioned on it during the laser processing operations. The protective enclosure 20 has vertical side walls that extend upwards from the substructure 8 and laterally define the protective volume. The protective enclosure 20 can be completely and laser-safely closed at the top by a cover (not shown) to provide reliable shielding against hazardous laser radiation and reflected scattered beams.

[0124] A single processing unit 10a is arranged within the protective enclosure 20. The processing unit 10a comprises the support gantry 11a, which extends across the width of the machine and forms a bridge-like structure. The support gantry 11a spans the central area 6 of the laser processing machine 1, in which the workstations are arranged. The bridge-like design of the support gantry 11a ensures high rigidity and positioning accuracy for guiding the laser head 13a during the processing operations.

[0125] A single laser head 13a is mounted on the support gantry 11a via a motion unit 14a. The motion unit 14a enables the laser head 13a to be positioned along the longitudinal axis L of the support gantry 11a, allowing the laser head 13a to be moved across the entire width of the workpiece holder 4. The motion unit 14a can be designed as a linear guide with a drive system that enables precise and repeatable positioning of the laser head 13a.

[0126] The laser head 13a can be moved along several axes to achieve precise machining of the workpieces. A first axis of movement X extends along the traverse axis V and enables forward and backward movements of the laser head 13a over the length of the workpiece holder 4. The movement of the laser head 13a along the axis of movement X is made possible by the movement of the entire machining unit 10a along the traverse rails 41a, 41b of the second traverse system 40.

[0127] A second axis of movement Y extends along the longitudinal axis L of the support portal 11a and enables left and right movements of the laser head 13a across the width of the workpiece holder 4. The movement of the laser head 13a along the axis of movement Y is enabled by the motion unit 14a, which can move the laser head 13a linearly along the longitudinal axis L relative to the support portal 11a.

[0128] An optional third axis of motion Z enables vertical movement of the laser head 13a, allowing it to be raised or lowered relative to the workpiece holder 4. The movement of the laser head 13a along the axis of motion Z can be achieved by the motion unit 14a, which can linearly raise or lower the laser head 13a along the axis of motion Z, which is perpendicular to the longitudinal axis L and perpendicular to the travel axis V, relative to the support gantry 11a. Alternatively, the movement of the laser head 13a along the third axis of motion Z can be achieved by a variable, in particular linear, height adjustment of the support gantry 11a.

[0129] Parts of the traversing systems 30 and 40 are visible on both sides of the central area. The traversing rails 31a and 31b of the first traversing system 30 support the movement of the protective enclosure 20 along the traversing axis V. These traversing rails 31a and 31b are positioned in a lower movement plane E1, which is closer to the substructure 8 than the traversing rails 41a and 41b of the machining unit 10a.

[0130] The traverse rails 41a and 41b of the second traverse system 40 support the machining unit 10a and enable its movement along the traverse axis V. These traverse rails 41a, 41b are arranged in a higher traverse plane E2, which lies above the traverse plane E1 of the traverse rails 31a, 31b.

[0131] The support portal 11a extends between the traversing rails 41a and 41b and is mounted on them so as to be movable. This arrangement allows the machining unit 10a to move independently of the protective enclosure 20 along the traversing axis V, while the protective enclosure 20 remains stationary in its working position A.

[0132] The laser head 13a is positioned to access the working area of ​​the workpiece holder 4. This arrangement allows the laser head 13a to perform machining operations on workpieces positioned on the workpiece holder 4. Using a single laser head 13a can reduce the mechanical complexity of the machining unit 10a and simplify its control, while simultaneously ensuring high machining precision.

[0133] After the machining operation at the first workstation 2, the protective enclosure 20 can be moved along the travel axis V to the second workstation 3, with the machining unit 10a moving synchronously with the protective enclosure 20. REFERENCE MARK LIST 1 laser processing machine 2 first workstation 3 second workstation 4 Workpiece holder 5 Holding devices 6 Middle range 7 Rail group 8 Substructure 9 Intermediate element 10a Processing unit 10b Processing unit 11a Carrier Portal 11b Carrier Portal 12a Long side 12b Long side 13a Laser head 13b Laser head 14a Movement Unit 14b Movement Unit 20 protective enclosures 21 Front wall 30 traversing system 31a Traverse rail 31b Traction rail 32 Drive motor 33 Coupling gear 40 traversing system 41a Traverse rail 41b Traction rail 42 Drive motor 43 coupling gear 50 traversing system 51a Traverse rail 51b Traverse rail 52 Drive motor 53 coupling gear A first job position B second work position E1 plane of motion E2 plane of motion L Longitudinal axis V travel axis X first axis of movement Y second axis of motion Z third axis of motion

Claims

[1] Laser processing machine (1), in particular laser welding machine, for processing workpieces, wherein the laser processing machine • has a first workstation (2) and a second workstation (3) for receiving workpieces, wherein the workstations (2, 3) are arranged spatially separated from each other along a traversing axis (V); • has at least one movable laser head (13a, 13b), in particular at least two movable laser heads (13a, 13b), in particular laser welding heads, for carrying out processing operations; • has a protective enclosure (20) wherein the protective enclosure (20) encloses the at least one laser head (13a, 13b), in particular the at least two laser heads (13a, 13b), and is transferable along the travel axis (V) between a first working position (A) surrounding the first work station (2) and a second working position (B) surrounding the second work station (3); • a first traversing system (30) with a first set of traversing rails (31a, 31b) for traversing the protective enclosure (20) along the traversing axis (V); • has at least one processing unit (10a) arranged within the protective housing (20) and comprising at least one laser head (13a, 13b); and • a second traversing system (40) for traversing the at least one processing unit (10a) along the traversing axis (V) within the protective enclosure (20) and between the workstations (2, 3), wherein the second traversing system (40) is designed such that a relative movement of the at least one processing unit (10a) relative to the protective enclosure (20) is enabled along the traversing axis (V). [2] Laser processing machine (1) according to claim 1, characterized by , that the second traversing system (40) has a second set of traversing rails (41a, 41b) for traversing the at least one processing unit (10a) along the traversing axis (V) within the protective enclosure (20) and between the work stations (2, 3), wherein the second traversing system (40) is mechanically separated from the first traversing system (30) by the use of different sets of rails (31a, 31b; 41a, 41b). [3] Laser processing machine (1) according to claim 1 or 2, characterized by , that the processing unit (10a) comprises two laser heads (13a, 13b). [4] Laser processing machine (1) according to claim 1 or 2, characterized by, that the laser processing machine (1) has at least two independently movable processing units (10a, 10b), each comprising at least one of the laser heads (13a, 13b). [5] Laser processing machine (1) according to claim 4, characterized by , that the at least two processing units (10a, 10b) are mounted on the rail set of traversing rails (41a, 41b) of the second traversing system (40) in a traversable manner. [6] Laser processing machine (1) according to claim 4, characterized by, that the second traversing system (40) is assigned to the first processing unit (10a) of the at least two processing units (10a, 10b) in order to traverse the first processing unit (10a) along the traversing axis (V), and that the laser processing machine (1) has a third traversing system (50) with a third set of traversing rails (51a, 51b), wherein the third traversing system (50) is assigned to the second processing unit (10b) of the at least two processing units (10a, 10b) in order to traverse the second processing unit (10b) along the traversing axis (V). [7] Laser processing machine (1) according to claim 6, characterized by, that the second set of rails (41a, 41b) is a first pair of guide rails (41a, 41b) defining a first track gauge, and the third set of rails (51a, 51b) is a second pair of guide rails (51a, 51b) defining a second track gauge different from the first track gauge, with both pairs of guide rails (41a, 41b, 51a, 51b) arranged side by side substantially coaxially with respect to the travel axis (V), such that one pair (41a, 41b) forms an inner and the other pair (51a, 51b) an outer track. [8] Laser processing machine (1) according to claim 6, characterized by, that the second set of rails (41a, 41b) is a first pair of traversing rails (41a, 41b) defining a first track gauge, and the third set of rails (51a, 51b) is a second pair of traversing rails (51a, 51b) whose track gauge corresponds to the first track gauge, wherein both pairs of traversing rails (41a, 41b, 51a, 51b) are arranged side by side substantially coaxially with respect to the traversing axis (V), such that a traversing rail (41a) of the first pair (41a, 41b) is located inside on one side of the traversing axis (V) and a traversing rail (51b) of the second pair (51a, 51b) is located inside on the other side of the traversing axis (V). [9] Laser processing machine (1) according to any one of the preceding claims, characterized by, that the at least one processing unit (10a, 10b) comprises at least one support portal (11a, 11b) which extends in a bridge-like manner, in particular over one of the workstations (2, 3), from one traversing rail (31a, 41a) to another traversing rail (31b, 41b) of the traversing system (30, 40) assigned to the processing unit. [10] Laser processing machine (1) according to claim 9, characterized by , that the at least one laser head (13a, 13b) of the processing unit (10a, 10b) is movably mounted along the longitudinal axis (L) of the support portal (11a, 11b). [11] Laser processing machine (1) according to any one of claims 4 to 10, characterized by , that the at least two processing units (10a, 10b) are designed so that they can pass each other along the travel axis (V). [12] Laser processing machine (1) according to claim 11, characterized by, that the support portals (11a, 11b) of the processing units (10a, 10b) have different construction heights. [13] Laser processing machine (1) according to one of claims 11 or 12, characterized by , that at least one of the machining units (10a, 10b) has a pivot axis to temporarily reduce its height. [14] Laser processing machine (1) according to any one of the preceding claims, characterized by , that the first set of guide rails (31a, 31b) is arranged in a first, lower plane of movement (E1), and the second set of guide rails (41a, 41b), in particular the second and third set of guide rails (41a, 41b; 51a, 51b), is arranged in a second, higher plane of movement (E2). [15] Laser processing machine (1) according to any one of the preceding claims, characterized by, that a drive motor (42, 52) for moving a processing unit (10a, 10b) is either arranged on the processing unit (10a, 10b) itself and acts on passive traversing rails (41a, 41b, 51a, 51b); or is designed as a stationary part of the second and / or third traversing system (40; 50) and acts on at least one active traversing rail (41a, 41b, 51a, 51b). [16] Laser processing machine (1) according to any one of the preceding claims, characterized by , that a drive motor (32) for moving the protective enclosure (20) is either arranged on the protective enclosure (20) itself and acts on passive traversing rails (31a, 31b); or is designed as a stationary part of the first traversing system (30) and acts on at least one active traversing rail (31a, 31b). [17] Laser processing machine (1) according to any one of the preceding claims, characterized by, that a movable sealing element (9) is provided to close a gap between the work stations (2, 3) below the protective enclosure (20) after the protective enclosure (20) has reached its working position (A, B). [18] Laser processing machine (1) according to claim 17, characterized by , that the sealing element is designed as an intermediate element (9) that can be lifted relative to a substructure (8) of the laser processing machine (1) between the work stations (2, 3). [19] Laser processing machine (1) according to claim 18, characterized by , that the sealing element is designed as a sealing element that can be lowered from the underside of the protective housing (20). [20] Laser processing machine (1) according to one of claims 17 to 19, characterized by that the sealing element is designed as an inflatable seal. [21] Laser processing machine (1) according to any one of the preceding claims, characterized bythat the at least two workstations (2, 3) are fixed in place. [22] Laser processing machine (1) according to one of the preceding claims, characterized by , that the laser processing machine (1) has a central control unit which is set up to move at least one processing unit (10a) independently of the protective enclosure (20), in particular the at least two processing units (10a, 10b) independently of each other and independently of the protective enclosure (20), along the traversing axis (V) during the processing operation. [23] Laser processing machine (1) according to claim 22, characterized by , that the central control unit is set up to synchronize the movements of the protective enclosure (20) and the at least one processing unit (10a; 10a, 10b) when transferring between the first working position (A) and the second working position (B). [24] Laser processing machine (1) according to any one of the preceding claims, characterized by that the laser processing machine (1) has exactly two workstations (2, 3) and / or exactly two laser heads (13a, 13b).

Images