A VARIETY OF MODULES

Description

[0001] The present invention relates to a variety of modules.

[0002] In module development, the goal is to continually reduce module size while simultaneously increasing the degree of integration and functionality. For the future, the progressive integration of electrical and electronic components within a module, the available space is very limited. Therefore, the development of innovative assembly and connection technologies is necessary.

[0003] US 2009 / 236731 A1 relates to a stackable integrated circuit packaging system comprising mounting an integrated circuit device over a package carrier, mounting a stiffener over the package carrier, and mounting an attachable package carrier over the stiffener with a vertical gap between the integrated circuit device and the attachable package carrier.

[0004] JP 2006 186091 A relates to a semiconductor device formed by stacking substrates. A semiconductor device includes a first substrate having a first component while a first bump electrode is formed on the surface; a second substrate having a second component while a second bump electrode is formed on the surface, and the first bump electrode is connected to the second bump electrode for lamination on the first substrate; and a first sealing bonding material and a second sealing bonding material are disposed between the first substrate and the second substrate to bond them, while surrounding the first bump electrode and the second bump electrode in the bonded state and hermetically sealing the internal space.

[0005] The object of the present invention is to provide an improved module that, for example, allows a further increase in the degree of integration of the module. The module could, for example, be suitable for use in a mobile device, in an industrial application, or in the automotive sector. A further object is to provide a construction and connection technology that enables the simple manufacture of such a module.

[0006] The above object is achieved by a module according to the present claim 1.

[0007] A module is proposed which has a lower module component comprising a material in which at least one first component is embedded, and an upper module component comprising a material in which at least one second component is embedded, wherein the upper module component and the lower module component are stacked one above the other and the lower and upper module components are electrically contacted with one another and are mechanically connected to one another.

[0008] The module is not limited to a design with just two module components. Rather, it can comprise additional module components that are stacked on top of each other and that are electrically contacted and mechanically connected to each other.

[0009] By stacking the module components on top of each other, the module can increase its degree of integration in a third dimension, namely height. Each of the module components can act as a technology platform into which any components can be embedded. The components can be embedded in the respective material in such a way that no additional solder joints are required to connect the components. This allows the space requirement to be further reduced.

[0010] Stacking the module components can make it possible to create a module with short signal paths and low power consumption, thereby reducing parasitic inductances. For example, in modules whose components form a filter, this can make it possible to improve the filter properties.

[0011] The module components can be designed as technology platforms into which a wide variety of components can be integrated, so that the module can be used for standardization, since different types of components can each be embedded in interconnectable module components.

[0012] The material used for the lower and upper module components can, for example, be a molding material. The molding material can be selected to match the embedded components. For example, the molding material and the components can have very similar thermal expansion coefficients to avoid mechanical stresses caused by temperature fluctuations. Alternatively, the material can also be a prepreg material (prepreg = preimpregnated fibers). The prepreg material can be applied by pressing or laminating. These materials can be applied bubble-free in a pressing and / or laminating process.

[0013] Alternatively, the material can be a glass substrate, a ceramic substrate, or a PCB substrate (PCB = polychlorinated biphenyls), which can be copper-clad on one or both sides.

[0014] The material of the lower module component and the material of the upper module component can be identical. However, it is also possible to use different materials for the lower and upper module components. One of the above-mentioned materials can be selected for each of the two module components.

[0015] A module can be defined here as a unit that has at least two components and can be installed in a circuit arrangement. The module can have a housing in which the module components are encapsulated. The module can be mounted as a whole on a printed circuit board and electrically connected to it.

[0016] At least one of the module components has, on a side facing the other module component, a rewiring layer which has a metal layer via which the module components are electrically contacted with one another.

[0017] The rewiring layer can be single- or multi-layered. The rewiring layer can be produced, for example, using a photolithography process. Alternatively, the rewiring layer can also be manufactured using two-dimensional or three-dimensional printing processes or laser structuring, for example, LDI (Laser Direct Imaging). LDI is a process in which photosensitive materials are cured using a laser. The metal layer of the rewiring layer can also be subsequently thickened, for example, using galvanic or chemical deposition processes.

[0018] Furthermore, the metal layer is electrically connected to the component embedded in the respective module component. Accordingly, the component can be contacted with components of the other module component via the rewiring layer.

[0019] The metal layer in the rewiring layer can make it possible to relocate a contact of the component arranged in the module component with respect to its position on the top or bottom of the module component. In this way, the contacts of the individual components can be arranged in such a way that a high integration density can be achieved without two contacts being arranged too close to one another. This can prevent two contacts from undesirably influencing each other. The rewiring layer can therefore be used to rewire peripherally arranged component contacts into a flat arrangement on the respective outer surface, so that the contact center distance can be significantly increased.

[0020] The rewiring layer can thus enable increased design flexibility in the arrangement of contacts on the top and bottom surfaces of the module components. The rewiring layer can be made very thin, in particular considerably thinner than conventional substrates, so that the use of the rewiring layer does not result in a significant increase in the thickness of the module. Rewiring layers can be manufactured with very high precision.

[0021] In particular, each of the module components can have a rewiring layer on its top and bottom sides, via which it is connected to the adjacent module component in the stack. At least one of two module components stacked one above the other can have a rewiring layer arranged on the side facing the other module component.

[0022] At least one of the module components can have a rewiring layer on its underside and on its upper side opposite thereto, wherein the rewiring layers are connected to a via extending through the module component.

[0023] The through-hole plating enables electrical contact between the two rewiring layers. The through-hole plating can be so-called embedded Z-lines. Embedded Z-lines are thin copper strips that extend from the bottom of the lower module component to the top of the lower module component.

[0024] Alternatively or in addition to the through-hole plating, special components with vertical electrical connections or a structured contact pattern on the module's outer edges can be used to connect the underside of a module component with the top side of the module component. Other common methods for creating electrically conductive cuts for connecting the underside of a module component with the top side of the module component are also conceivable.

[0025] In one embodiment, the lower module component can have a rewiring layer on its upper side facing the upper module component, which rewiring layer has a metal layer via which the lower module component is electrically contacted with the upper module component.

[0026] In one embodiment, the lower module component can have a further rewiring layer on its underside facing away from the upper module component, which is connected to a via via which the further rewiring layer is electrically contacted with the rewiring layer arranged on the upper side of the lower module component.

[0027] In one embodiment, the upper module component can have a rewiring layer on its underside facing the lower module component, which rewiring layer has a metal layer via which the upper module component is electrically contacted with the lower module component.

[0028] The first component and / or the second component can be a filter that operates with acoustic waves. Such a component typically has a cavity. The component can have a housing within which the cavity is formed, wherein the housing is embedded in the material. Due to the short signal paths resulting from the high degree of integration of the module, several filters that operate with acoustic waves can be interconnected in the module, and a reduction in parasitic inductances can improve the filter properties.

[0029] The lower module component can have metal columns on its upper side facing the upper module component. The upper module component can also have metal columns on its underside facing the lower module component. The metal columns of the lower module component and the metal columns of the upper module component can be connected to one another.

[0030] The metal pillars can be connected, in particular, by eutectic bonding. The metal pillars can comprise copper covered with a tin-containing layer. Copper and tin are suitable for eutectic bonding. Eutectic bonding can be performed with high precision and, in particular, requires only structures with a very low height. Accordingly, compared to the use of solder balls for connection, for example, the precision can be increased while simultaneously reducing the height of the connecting structures. Furthermore, the areal extent of the metal pillars can be smaller than the minimum possible areal extent of a solder ball.

[0031] A metallization layer can be arranged on an outer surface of the module, which enables electromagnetic shielding of the module and / or serves to dissipate heat from the module. The metallization layer can also form an antenna structure.

[0032] On the upper side of the upper module component, which faces away from the lower module component, at least one further module component can be arranged, which comprises a material in which at least one third component is embedded. In this way, almost any number of module components can be stacked on top of one another. This allows the degree of integration into the third dimension of the module to be continually increased. Furthermore, at least one rewiring layer can be arranged between each two module components, through which the two module components are electrically connected to one another.

[0033] The material in which the first and second components are embedded can be a prepreg material. This is particularly characterized by its good flow properties. It allows for easy layer formation and the lamination of multiple layers together.

[0034] The first and / or second component can be one selected from a semiconductor chip with an integrated active or passive circuit, a passive component, a sensor, a digital chip, or a MEMS component. In addition to the actual sensor element, such a sensor can also include logic for evaluating the measured data and a memory element. This variety of possible components demonstrates that the module can be a technology platform for combining a wide variety of component types.

[0035] The upper module component can have a rewiring layer on its upper side facing away from the lower module component, which has a metallization that forms both an antenna structure and passive elements connected to the second component. The metallization thus serves a variety of purposes simultaneously.

[0036] An exemplary method for manufacturing a plurality of modules is explained below. This may be helpful for understanding the invention, even if no method is claimed. The modules may be the modules described above. Accordingly, any structural and functional feature disclosed in connection with the module may also apply to the method. Any feature disclosed in connection with the method may also apply to the modules described above.

[0037] A method is described for producing a plurality of modules, each comprising a lower module component comprising a material in which at least one first component is embedded, and an upper module component comprising a material in which at least one second component is embedded, wherein the upper module component and the lower module component are stacked one above the other, and wherein the lower and upper module components are electrically contacted and mechanically connected to one another. The method comprises the following steps: Producing a lower wafer or a lower panel in which a plurality of lower module components are arranged in a composite, producing an upper wafer or an upper panel in which a plurality of upper module components are arranged in a composite, attaching the lower wafer to the upper wafer or attaching the lower panel to the upper panel, and singulating the modules.

[0038] The steps are preferably performed in the order specified here. Accordingly, many of the steps can be performed while the modules are present in a wafer assembly or a panel assembly. In the assembly, a large number of modules can be processed simultaneously in common work steps. This significantly simplifies production. Since the modules are separated only after the module components have been attached to one another, laborious individual handling of the module components can be avoided.

[0039] The lower and upper wafers or the lower and upper panels can be joined together using eutectic bonding, an electrically conductive adhesive bond, sintering, or soldering. A connection using eutectic bonding, in particular, offers numerous advantages, as this joining technique can be performed with high precision.

[0040] During the production of the lower wafer or the lower panel, the first components can be embedded on one side in the material using a sheet-molding process, with the material being laminated on as a film. During the production of the upper wafer or the upper panel, the second components can be embedded on one side in the material using a sheet-molding process, with the material being laminated on as a film.

[0041] During the fabrication of the lower wafer or lower panel, the first components can be embedded in the material in a vacuum lamination press process, and then the lower wafer or lower panel is cross-linked with an insulating material. During the fabrication of the upper wafer or upper panel, the second components can be embedded in the material in a vacuum lamination press process, and then the upper wafer or upper panel is cross-linked with an insulating material. The insulating material can be applied by rolling, dispensing, jetting, or a combination of these methods.

[0042] After attaching the lower wafer or lower panel to the upper wafer or upper panel, the upper wafer or upper panel can be subjected to a grinding process in which the thickness of the upper wafer or upper panel is reduced. This minimizes the material mass above the components and further reduces the thickness of the module. A number of components can also be thinned.

[0043] In the following, the present invention is described in detail with reference to the accompanying figures. Figure 1 shows a lower module component in a cross section. Figure 2 shows an upper module component in a cross-section. Figure 3 shows a module that is created by stacking the Figure 1 shown lower module component and the one in Figure 2 shown upper module component was manufactured, in a cross section. Figure 4 shows that in Figure 3shown module after performing further processing steps. Figure 5 shows a module according to an alternative embodiment in cross section.

[0044] Figure 1 shows a lower module component 1, which can be connected to an upper module component 2 to form a module. In Figure 1 A single lower module component 1 is shown. The lower module component 1 can be manufactured together with a plurality of other lower module components in a wafer assembly or a panel assembly.

[0045] The lower module component 1 comprises a material 3 in which a first component 4 and further components 5 are embedded. The material 3 can be, for example, a molding material, an organic laminate, in particular based on epoxy or phenol, or a prepreg material.

[0046] For example, the first component 4 is a component that operates with SAW waves (SAW = Surface Acoustic Wave). Accordingly, it is an encapsulated component that has a cavity. The lower module component 1 is designed in such a way that various components 4, 5 can be embedded in the material 3. It therefore represents a technology platform that enables the integration of various components 4, 5 into the module.

[0047] The additional components 5 can be, for example, sensor chips, which can be analog or digital. In addition to the actual sensor element, such a sensor chip can also include logic for evaluating the measured data and a memory element. Alternatively or additionally, the additional components 5 can be one or more selected from a semiconductor chip with an integrated active or passive circuit, a passive component, a digital chip, or a MEMS component.

[0048] Furthermore, a rewiring layer 7 is arranged on the upper side 6 of the lower module component 1. The rewiring layer 7 has a metal layer 8. The rewiring layer 7 is multi-layered, with the metal layer 8 being arranged in several layers. The first component 4 has a plurality of contacts 9. These are connected to the metal layer 8 of the rewiring layer 7. Via the metal layer 8, the contacts 9 of the first component 4 are connected to contacts 10 arranged on the upper side of the rewiring layer 7. As a result, the position of the contacts 10 can be adjusted in any desired manner. In particular, the contacts 9 of the components 4, 5 can be rewired into a flat arrangement on the top side 6 of the lower module component 1, so that the contact center distance can be significantly increased.

[0049] The Figure 1The lower module component 1 shown does not have a rewiring layer on its underside 11. This is created in a later process step.

[0050] The rewiring layer 7 arranged on the upper side 6 of the lower module component 1 is electrically connected to a through-plating 12 which extends through the lower module component 1.

[0051] Furthermore, metal columns 13 are arranged on the upper side 6 of the lower module component 1. The metal columns 13 can be made of copper, for example. The metal columns 13 are arranged on the contacts 10 of the rewiring layer 7 and are accordingly electrically contacted with the metal layer 8 of the rewiring layer 7. The metal columns 13 can, in conjunction with corresponding metal columns on the underside of the upper module component 2, provide electrical contact between the two module components. 1, 2 care for each other.

[0052] A ring 14 is also arranged on the upper side 6 of the lower module component 1. This ring is made of a metal, for example, copper. The ring 14 provides mechanical stabilization and is connected, for example, by eutectic bonding, to a corresponding ring arranged on the underside of an upper module component 2.

[0053] Furthermore, further metallic structures 15, for example made of copper, can be arranged on the upper side 6 of the lower module component 1, which ensure mechanical stabilization of the mechanical connection between the lower and the upper module component 1, 2 and which are not electrically connected.

[0054] The ring 14 arranged at the edge of the upper side 6 and the further metallic structures 15 arranged in an inner region of the upper side 6 ensure mechanical strengthening of the lower module component 1 and avoidance of warping.

[0055] Figure 2 shows the upper module component 2. In Figure 2 A single upper module component 2 is shown. The upper module component 2 can be manufactured together with a plurality of other upper module components 2 in a wafer assembly or a panel assembly.

[0056] The upper module component 2 is designed to be connected to the lower module component 1 to form a module. The upper module component 2 has a structure similar to the lower module component 1. The upper module component 2 also has a material 3 into which a second component 16 and further components 5 are embedded. The material 3 can, for example, be one of the above-mentioned materials that are also used for the lower module component 1. The material 3 can be identical to the material 3 of the lower module component 1 or different from it.

[0057] The upper module component 2 also forms a platform for the integration of various components 16, 5. The second component 16 and the further components 5 can, for example, be one or more selected from an analog or digital chip, a passive component or a sensor chip.

[0058] The Figure 2 The upper module component 2 shown does not have a rewiring layer 7. In alternative embodiments, the upper module component 2 can have a single- or multi-layer rewiring layer 7 on its underside 17 and / or on its top side 18.

[0059] Metal columns 13 are arranged on the underside 17 of the upper module component 2, which can be connected to the metal columns 13 on the upper side 6 of the lower module component 1 in order to connect the two module components 1, 2to electrically contact one another. The metal columns 13 are made of copper, for example, and have a tin-containing coating 19 on their side facing the lower module component 1. The metal columns 13 of the lower module component 1 and the metal columns 13 of the upper module component 2 are connected by eutectic bonding, with the combination of copper and tin forming a connection.

[0060] Alternatively, the metal columns 13 can be coated with a conductive adhesive instead of tin. In this case, the metal columns 13 can be bonded to the corresponding metal columns of the lower module component 1.

[0061] On its underside 17, the upper module component 2 further comprises a ring 14, which is designed to be connected to the ring 14 of the lower module component 1. Furthermore, the underside 17 of the upper module component 2 comprises further metallic structures 15, which contribute to increasing the mechanical stability of the module. As already discussed in connection with the lower module component 1, the ring 14 and the further metallic structures 15 ensure mechanical strengthening and prevent warping of the upper module component. 2. The ring 14 and the other metallic structures 15 are also coated with tin to enable connection by eutectic bonding. Alternatively, these elements can be coated with an adhesive, for example. As an alternative to connection by eutectic bonding, other joining processes are also possible, such as an Ag sintering process or soldering.

[0062] Figure 3 shows the module after the lower module component 1 from Figure 1 on the upper module component 2 Figure 2 was attached. In this case, a wafer or a panel having a plurality of lower module components 1 is attached to a wafer or panel having a corresponding plurality of upper module components 2.

[0063] The two module components 1, 2 were connected to each other by eutectic bonding. This step was performed while the two module components 1, 2 were each connected to a plurality of other module components 1, 2 in a wafer composite or a panel composite. During eutectic bonding, the rings 14, the metal pillars 13, and the other metallic structures 15 were connected to each other. The metal pillars 13 ensure electrical contact between the two module components 1, 2. The rings 14 and the other metallic structures 15 are mechanically connected to each other, increasing the mechanical stability of the module and thus preventing warping of the module.

[0064] An electrically insulating underfill layer 20 was also arranged between the two module components 1, 2. The underfill layer 20 can be made of a conventional material or an anisotropic conductive adhesive. It has no air pockets or cavities. The underfill layer 20 is interrupted by the structures for the electrical and mechanical connection of the module components 1, 2. These include, in particular, the rings 14, the other metallic structures 15, and the metallic columns 13.

[0065] The underfill layer 20 ensures that the underside 17 of the upper module component 2 and the upper side 6 of the lower module component 1 each have a uniform surface without steps. The connection between the two module components 1, 2 can be sealed by the underfill layer 20.

[0066] Furthermore, material 3 was removed from the underside 11 of the lower module component 1 to expose the downward-facing ends of the through-hole 12. A contacting layer 21 was then applied to the underside 11 of the lower module component 1. This allows the module to be contacted with a printed circuit board or the like.

[0067] The removal of the material 3 from the underside 11 of the lower module component 1 was only carried out after the lower module component 1 was connected to the upper module component 2, since the module then has an increased mechanical stability, so that the risk of the module breaking during the material removal is quite low.

[0068] Figure 4 shows that in Figure 3 The module shown after carrying out further steps of the manufacturing process.

[0069] The modules that are Figure 3in a wafer or panel assembly, were now separated, for example, by a sawing process. Figure 4 shown sloping side surfaces of the module.

[0070] Furthermore, material 3 was removed from the upper side 18 of the upper module component 2. In particular, the upper module component 2 was thinned through a grinding process. In the process, the thickness of the materials 3 above the components 5, 16 was reduced. Furthermore, incisions were inserted that are used for vias.

[0071] Metallizations 22, 23, and 24 are applied to the top side 18 of the upper module component 2. Metallization 22 forms an antenna structure. Metallization 23 serves to cool the module. Metallization 24 serves to protect against electrostatic discharges. Furthermore, a thermal via 25 is provided, which is intended to dissipate heat generated by the module to the top side 18.

[0072] The second component 16 was exposed during the thinning process, so that its upper side is not covered by the material 3. Instead, the metallization 23, which serves to cool the second component 16, is now arranged on the upper side of the second component 16.

[0073] Figure 5 shows a module according to an alternative embodiment. The Figure 5 The module shown differs from the previously shown module in that a rewiring layer 7 is arranged on the top side 18 of the upper module component 2, and that through-contacts 12 are provided in the upper module component 2, which contact the rewiring layer 7 arranged on the top side 18 of the upper module component 2 with a contact arranged on the bottom side 17. The through-contacts 12 are embedded Z-lines.

[0074] The rewiring layer 7 arranged on the upper side 18 of the upper module component 2 forms an antenna structure.

[0075] In the Figure 5 In the module shown, the upper module component 2 was not thinned.

Claims

1. A module, comprising a lower module component (1), which comprises a material (3), in which at least one first element (4) is embedded, and an upper module component (2), which comprises a material (3), in which at least one second element (16) is embedded, wherein the material (3), in which the first and the second element (4, 16) are embedded, is selected from: prepreg material, molding material, glass substrate, ceramic substrate, or PCB substrate, and wherein the material (3) for the first element (4) and the material (3) for the second element (16) can be identical or different; wherein the upper module component (2) and the lower module component (1) are stacked on top of each other, wherein the lower and the upper module component (2) are electrically contacted with each other and are mechanically connected with each other, wherein a metal ring (14) on an upper side (6) of the lower module component (1) is connected with a metal ring (14) on a lower side of the upper module component (2); and a. wherein at least the lower module component (1) comprises, on a side facing the upper module component (2), a rewiring layer (7), which comprises a metal layer (8), via which the module components (1, 2) are electrically contacted with each other, wherein the first element (4) is connected with the metal layer (8) via a plurality of contacts (9), or b. wherein at least the upper module component (2) comprises, on a side facing the lower module component (1), a rewiring layer (7), which comprises a metal layer (8), via which the module components (1, 2) are electrically contacted with each other, wherein the second element (16) is connected with the metal layer (8) via a plurality of contacts (9).

2. The module according to the preceding claim, wherein at least one of the module components (1, 2) comprises a rewiring layer (7) on its lower side (11, 17) and on its upper side (6, 18) opposite thereto, wherein the rewiring layers (7) are connected with a through-connection (12), which extends through the module component (1, 2).

3. The module according to one of the preceding claims, wherein the first and / or the second element (4, 16) is one selected from a semiconductor chip with an integrated active or passive circuit, a passive element, a sensor, a digital chip or an MEMS element.