ITEM WITH AN ELECTRONIC UNIT AND WITH CONDUCTOR STRUCTURES ON A SUPPORT STRUCTURE

Description

[0001] The application relates to an object comprising an electronic unit and conductor structures on a support structure; in particular, an object comprising at least one first conductor structure, at least one electronic unit and at least one second conductor structure on a support structure, wherein the second conductor structure is galvanically isolated from the first conductor structure and / or from the electronic unit, but electrically connectable to it.

[0002] US 5 466 892 A relates to a circuit board and a method for manufacturing a circuit board with signal and receptor fields arranged on layers spaced apart in the Z direction with an intermediate dielectric layer.

[0003] US 2013 / 230755 A1 concerns a flexible cable with a substrate divided into at least two sections. The first section contains a first electrically conductive layer, and the second section has a second and third electrically conductive layer. The first section is arranged on top of the second section to connect the first electrically conductive layer to the third electrically conductive layer. The resulting flexible cable can be used with an electrical device.

[0004] SOLDNER K ET AL: "POST ASSEMBLY MULTI-LAYER INTERCONNECTS FOR FLEXIBLE CIRCUITS", MOTOROLA TECHNICAL DEVELOPMENTS, MOTOROLA INC. SCHAUMBURG, ILLINOIS, US, Vol. 10, March 1, 1990 (1990-03-01), pages 19 / 20, XP000114622, ISSN: 0887-5286, concerns electrical circuits in which conductive traces are created on the same side of a flexible substrate. The electrical components are then applied to the circuit using conventional techniques. In addition to applying the components to the circuit, soldering is used to apply solder to pads that form the junctions between the two independent meta-patterns. After the components are applied, the flexible circuit is folded in on itself, creating a multi-layer circuit effect.

[0005] DE 10 2009 018285 A1 relates to a blister pack comprising: a blister body with pockets for portioned storage and removal of medication, conductive traces arranged relative to the pockets such that when a pocket is emptied, an associated conductive trace is locally severed, and an RFID chip with a semiconductor memory in which data can be stored containing information about whether and at what time the conductive traces have been severed, wherein the conductive traces and the RFID chip are insulated and decoupled from each other, and wherein the RFID chip is a passive chip designed for passive power supply and passive communication.

[0006] Various technical fields employ objects that incorporate one or more electronic units mounted on a substrate. Such electronic units can be, for example, active or passive components such as resistors, capacitors, coils, other electrical or electronic components, or more complex electronic units such as chips with electronic or microelectronic circuits. An electronic unit can also be a sensor unit, which, for example, includes a sensor element for measuring any physical quantity or parameter and / or its value, or is at least connected to or connectable with such a sensor element. This list of exemplary, potential electronic units is not exhaustive and could be extended indefinitely.Furthermore, an electronic unit can also comprise a plurality of electrical and / or electronic components, chips and / or other parts; for example, several structurally separate electronic elements, each individually connected to the supporting structure, can together form an electronic unit, according to the overall function of this group of components.

[0007] Examples include evaluation electronics for humidity measurements or humidity sensors, evaluation electronics for detecting and / or recording interruptions in conductor tracks, short circuits between conductor tracks, or temporary changes in the capacitance of capacitors or the inductance of coils; for example, depending on external environmental influences or human interaction. Furthermore, chips and / or transponders for NFC communication are also suitable electronic units, such as RFID chips or chips for communication via Bluetooth or WLAN.

[0008] Such objects have a support structure on which or within which conductor structures, in particular conductor tracks, are also arranged.

[0009] Most objects have rigid support structures, such as printed circuit boards (PCBs) or other inherently rigid substrates that can be screwed to a housing, for example. However, objects with flexible, i.e., bendable, support structures also exist; namely, objects in which the electronic unit and / or the conductor structures are applied to a film.

[0010] Examples of this include moisture sensors for incontinence diapers, which can detect moisture or wetness through changes in capacitance or inductance values ​​or through electrical short circuits, but where a rigid support structure would be unsuitable due to the body's shape.

[0011] Furthermore, blister packs for tablets, medication capsules, or other dosage units exist that can be bent and locally damaged by the patient or medical staff when opened. This damage can be detected and evaluated as an interruption of the associated electrical circuit, which is linked to the respective tablet or capsule and / or the surrounding cavity. An interruption of a conductive path is interpreted as removal or ingestion by the patient and recorded in time.

[0012] Furthermore, there are, for example, electronic seals that create and maintain a closed circuit, whereby any destruction or temporary interruption of the closed circuit caused by unauthorized intervention, or any change in capacitance or inductance values, can be electronically detected and proven as a seal break.

[0013] Such and other objects can in principle also be manufactured using a film or another flexible, i.e. bendable, support structure; however, the film-based manufacturing of such and other objects is conventionally inefficient.

[0014] For example, when electronic units or their components are soldered onto a plastic film, either films made of temperature-resistant material, such as those with operating temperatures above 250°C, are required, but these increase manufacturing effort and material costs. Alternatively, low-melting-point solders can be used, but these are also considerably more expensive. Soldering or bonding electronic components to flexible plastic films is particularly inefficient when only a relatively small number of solder joints need to be made on extensive, i.e., large-area films, or when the solder joints are only to be made in one or a few areas that are relatively small compared to the total film area.

[0015] Instead of soldered connections, a conductive adhesive can also be applied to connect electronic units to the film. However, conductive adhesives cure slowly, which in turn slows down the material throughput of the manufacturing process; thus, a certain amount of time is also required to create conductive adhesive connections. The cooling or curing time required for soldered or conductive adhesive connections is independent of the film size in other areas besides the soldered or conductive adhesive connections. Especially with large films with few electrical contact points, manufacturing, particularly the assembly and mounting of electronic components and units, quickly becomes uneconomical.

[0016] Existing equipment and processes for assembling or contacting electronic components are also limited in throughput. For example, with a predetermined number of electronic components per unit of the manufactured item, the speed for placing a component on the substrate is limited by the manufacturing equipment; furthermore, the volume or footprint of assembly and contacting systems is limited and, depending on the size of the product, is quickly exhausted before the material for the next batch of units of the manufactured item can be supplied.

[0017] The objective of this application is to provide an object comprising an electronic unit and conductor structures on a carrier structure, but which can nevertheless be manufactured at lower overall costs and with lower manufacturing effort, and is therefore more cost-effective. Furthermore, the objective of this application is to provide a suitable manufacturing process.

[0018] The invention relates to an object having the features of claim 1, an object having the features of claim 14 and a method having the features of claim 16.

[0019] Some exemplary embodiments are described below with reference to the figures. They show: Figure 1 a schematic cross-sectional view of a first exemplary embodiment of an object according to the invention, Figure 2 a schematic top view of the object according to Figure 1 , Figure 3a top view of a second embodiment of the object, Figure 4 an alternative embodiment of an object with a single first and second conductor structure each, Figure 5 an exemplary embodiment of an object with inductive rather than capacitive coupling, Figure 6 an embodiment of an object with a capacitive bridge, Figure 7 an exemplary embodiment of an object designed as a blister pack, Figure 8 a schematic top view of an object designed as an electronic seal, Figure 9 the electronic seal Figure 8 in its folded state, Figure 10 a schematic cross-sectional view of the closed electronic seal made of Figure 9 , Figure 11 another embodiment of an electronic seal as an alternative to Figure 8 and Figure 12 yet another embodiment of an electronic seal as an alternative to the Figure 8 and11 .

[0020] According to the invention, instead of a single film, which conventionally serves as a support structure for the electronic unit and for conductive traces, the support structure is designed, at least in some areas, particularly in a portion of its base area, as a stack of layers, i.e., as a layered composite comprising at least two films or film sections or two other support layer areas stacked on top of or above one another; optionally with an adhesive layer or other intermediate layer arranged between them. While this requires the addition and processing of a further, additional film or support layer in most of the embodiments described in detail below, which is why such a solution appears a priori to the person skilled in the art to be of little advantage when it comes to reducing costs and manufacturing effort, the additional film or support layer makes it possible to reduce the total required film area.The base area of ​​the support structure can be divided into the base areas of two separate support layers and an overlap area where both support layers are stacked on top of each other, in such a way that, from the perspective of throughput optimization in the processing and assembly of the respective individual films, an eventual gain in production time and / or material throughput can still be achieved. For example, starting from a total base area that is conventionally filled by a single film, the base area of ​​the film to be fitted with the electronic unit can be reduced to such an extent that this film extends laterally only over the immediate vicinity of the electronic unit, while more distant areas are filled only by the other, second film or support layer.The film to be fitted with the electronic unit does not even need to extend beyond the other film, but can occupy a portion of its surface, such as a base area, in which it is stacked on top of it, for example, glued to it over its entire surface.

[0021] On the other, second film, the second conductor structure is arranged, which may include, for example, a second conductor track connected to a second contact terminal of the electronic unit, a capacitor plate, a coil, an antenna, and / or an electrode. The conductor structures on the two substrate layers or films can be printed, i.e., applied without the use of solder or conductive adhesives, or manufactured in other ways. Although they are arranged on different films or substrate layers, they do not need to be conductively connected to each other, but can remain galvanically isolated, provided that at least one alternating current circuit can be generated between them.Therefore, the film containing the first conductor structure and the electronic unit does not need to be soldered or made conductively connected to the second film, on which the second conductor structure is located, using conductive adhesive. From a manufacturing perspective, it is sufficient to join both films or carrier layers together by an adhesive or lamination process after they have been completed and populated, thus creating the finished product.

[0022] Soldering or otherwise contacting the electronic unit, especially with the smaller of the two films or carrier layers, can therefore be carried out at a higher throughput rate and thus be particularly efficient. Furthermore, the other, larger film, which is previously only subjected to printing processes, can also be produced in larger quantities per unit of time.

[0023] The first and second conductor structures can be galvanically isolated from each other but capacitively or inductively coupled, for example by corresponding capacitor plates or coils / coil windings arranged on both films. Applying or exciting an alternating voltage or current then creates a capacitive or inductive coupling through both films and, if applicable, through an intermediate layer or adhesive layer, without impairing the functionality of the electronic unit due to the partially doubled film.

[0024] According to this application, the coupling of the two conductor structures to each other, or of the second conductor structure to the first conductor structure and / or to the electronic unit, is not achieved by the electronic unit itself, but by the stack of layers, which comprises the two support layers or support layer areas (e.g., two films or film sections) with the first and the second conductor structures. The electronic unit is located outside, i.e., laterally outside the base area of ​​the stack of layers in which the electrical coupling between the two conductor structures, or the coupling of the second conductor structure to the first conductor structure and / or to the electronic unit, takes place. In particular, the electronic unit can be arranged outside the base area of ​​the stack of layers. Thus, the stack of layers can, in particular, be arranged outside the electronic unit.The base area of ​​the layer stack and the base area of ​​the electronic unit do not overlap (. Figures 1 and 2 Alternatively, ( Figures 3 to 12 The base of the layer stack encompasses the base of the electronic unit but extends laterally beyond it. In all these cases, the electrical coupling between the first and second conductor structures occurs in a portion of the layer stack or its base that is not filled (or covered) by the electronic unit.

[0025] In particular, the layer stack allows the second conductor structure to be connected to the first conductor structure by capacitive or inductive coupling. For example, while one segment or end of the first conductor is coupled to a corresponding segment or end of the second conductor in the layer stack, an opposite segment or end of the first conductor can be connected to the electronic unit. In this way, for example—as also illustrated in the figures discussed below—the second conductor can be coupled to the electronic unit via the layer stack and the first conductor, even though the second conductor is galvanically isolated from them.Furthermore, as shown, several second conductor tracks can also be coupled to the electronic unit via corresponding area regions of the layer stack and via corresponding first conductor tracks.

[0026] Specifically, it shows Figure 1A first embodiment of an object 100 is shown in a schematic cross-sectional view. Instead of the conventional single film or carrier layer, the invention provides for both a first carrier layer 10 and a second carrier layer 20; both overlap at least in a base area G, which corresponds to a partial area of ​​the base area of ​​the carrier structure 15 as a whole. The carrier structure 15 therefore comprises both carrier layers 10, 20; these can optionally be films 19 or 29, in particular plastic films, or alternatively, other material films 18 or 28, for example, plastic films (such as polyurethane films) or lacquer films or lacquer layers. Material films 18, 28, i.e., film-like thin layers of suitable material, can be printed onto any substrate surface, peeled off again, and then handled individually, similar to plastic films.The at least one second conductor structure 2 can, for example, be printed onto the second substrate layer 2, i.e., onto the second foil 29 or the second material film 28, for example as a silver conductive paste or other electrically conductive printed coating. The at least one first conductor structure 1 can be applied to the first substrate layer in the same way. Both conductor structures 1, 2 can, in addition to conductor tracks 9, also include capacitor plates 7, coils and / or coil windings and / or sensors, in particular printed, laminated, or bonded sensors.

[0027] On the first carrier layer 10, at least one electronic unit 5 is additionally attached using solder or conductive adhesive. Although the same process steps are involved as when soldering or applying the electronic unit to a single film using conductive adhesive, the surface area of ​​the first film can be chosen to be so small compared to the surface area of ​​the second film (see the following figures) that a much larger number of first films can be produced simultaneously, for example, populated with electronic units 5 in an assembly unit, while a large number of second films with a comparatively large surface area can be manufactured in an independent process step and in separate systems with an increased throughput rate, including the printing of the second conductor structures. The production of the larger second films is thus not hindered or delayed by the assembly of the smaller first films.

[0028] It is therefore not necessary to subject the second carrier layer 20; 28; 29 to a soldering process or the application of conductive adhesive material, as is conventionally required when populating a single film with electronic components or units. Instead, it suffices to dimension the first film 10 to be populated according to the footprint and / or position of the electronic unit 5 and to design the remaining, predominant part of the carrier structure 15 entirely with the help of the other, second carrier layer 20, film 29, or material web 28. Only in a smaller area G where both carrier layers 10, 20 overlap, do both carrier layers 10, 20 need to be provided and stacked on top of each other and, if necessary, attached to each other or to an adhesive or other intermediate layer.

[0029] Optionally, the carrier layer 10 equipped with the electronic unit 5 can also extend in certain areas beyond the base area of ​​the larger carrier layer 20, as shown in Figure 1 This is shown. However, this is not necessary; it suffices to place a significantly smaller carrier layer 10, already equipped with the electronic unit 5, in only a portion of the base area of ​​the carrier layer 20. The need for longer conductor structures 1 or conductor tracks 9 on this carrier layer 10 can also be eliminated if, for example, the electronic unit 5 is already positioned within the area of ​​the foil composite or layer composite formed by the layer stack 16.

[0030] Thus, an object with a support structure 15 is provided, which is formed as a layer stack 16 in a base area G that comprises at least a partial area of ​​the base area of ​​the support structure 15 in total, wherein the layer stack 16 in the base area 15 comprises a first support layer area 11 and a second support layer area 12. The first support layer area 11 is a partial area of ​​the first support layer 10, or of the first film 19 or of the first material film 18, in particular a partial area. The second support layer area 12 is according to Figure 1an overlapping area of ​​another, second carrier layer 20, or a second film 29, or a second material film 28. Both sublayer areas 11, 12 are stacked on top of each other, i.e., integrated into a layer stack 16 or layer composite 17. Preferably, an intermediate layer 14, for example in the form of an adhesive layer 13 or a laminating layer, is arranged between them, but this is optional and can be omitted, for example, if both carrier layer areas 11, 12 are pressed and / or held together in the area of ​​the base surface G by a housing of the object. In the area of ​​the layer stack 16 orFurthermore, at least a part of the second conductor structure 2 and preferably also a part of the first conductor structure 1 is arranged on the base area G (this preferably applies to all figures and other embodiments of the application), although these conductor structures or parts of them do not have to fill the entire base area G of the layer stack.

[0031] The electronic unit 5 in Figure 1and the following figures can be any electronic unit mentioned in the introductory remarks of this application. The first conductor structure 1 and / or the second conductor structure 2 can also be configured as described in the introductory remarks; in particular as a conductor track 9, antenna 3, coil, coil winding 8 and / or as a capacitor plate 7. Alternatively, the conductor structures 1, 2, or one or some of them can be implemented as a sensor element of a control element, for example, a control button. With regard to the number of conductor structures provided, for example, one first and one second conductor structure 1; 2, or two first and two second conductor structures 1; 2 (approximately as in Figure 1 ) are planned.

[0032] Depending on the function of the electronic unit 5 and the surface and / or spatial structure of the object 100, a wide variety of objects can be manufactured more cost-effectively and efficiently than conventionally. For example, the in Figure 1 The object 100 shown only schematically could be, for example, a moisture sensor 101, for instance for incontinence diapers, or alternatively a blister pack, an electronic seal, a sensor device for any parameter, as already explained at the beginning, or a transponder for RFID or other NFC applications, to name just a few examples.

[0033] The in Figure 1The partially curved course of the first and second support layer areas 11, 12 or support layers 10, 20, as shown at least in areas laterally near the base G of the overlap area, indicates that these support layer areas or support layers can be flexible according to a first embodiment, i.e., bendable, and therefore can have a curved or bendable shape. For example, both support layer areas or support layers can be bendable.

[0034] Secondly, it is conceivable that only one of the two support layers is flexible, for example the one on which the electronic unit and the first conductor structure are arranged, or alternatively the support layer on which the second conductor structure is arranged.

[0035] Furthermore, it is conceivable that the support structure, or its two support layers, or one of the two support layers, is only locally flexible or deformable, i.e., only in certain areas; for example, in a surface area where, according to the design, a fold or crease line, a local bend, in particular a folding of the respective support layer, or some other deformation is intended to form. Such at least local deformation can be used to bring one of the two conductor structures closer to the electronic unit and / or to the other conductor structure, thus enabling a closed alternating current circuit. For example, the first support layer area and / or the second support layer area, or a partial area thereof, can be flexible, for instance, to fold, flip, or otherwise bring at least one of the support layer areas closer to the other support layer area or a partial area thereof.

[0036] In such embodiments, where not the entire support structure is flexible, those support layers or support layer areas that are not flexible or at least not readily intended for bending may be rigid, have a greater layer thickness, or have less elasticity and / or flexibility than those support layers or support layer areas that are intended, at least locally, for bending or other deformation.

[0037] Furthermore, it is conceivable that only the conductor structures, or at least one of them, are flexible, either across their entire surface or at least locally. For example, it is conceivable that a conductor structure, which is attached to one of the two support layers but does not lie across its entire surface (i.e., not with its entire surface or underside), but only partially on the support layer, is locally lifted from the support layer in order to bring it closer to the other conductor structure and / or to the electronic unit.

[0038] Depending on which of the above embodiments is realized, the object, its support structure, its support layers or support layer areas and / or its conductor structures, insofar as they are completely or at least locally flexible, can be nestled against another body, for example to reach places to which the electronic unit 5 itself cannot be brought or not close enough.

[0039] The carrier layers 10, 20 can be, in particular, films 19, 29 or material films 18, 28 made of suitable plastics or other, especially flexible, materials. Optionally, the layer stack 16 or layer composite 17 formed in the overlap area of ​​both carrier layers 10, 20 is also flexible.

[0040] Figure 2 shows a schematic top view of the object. Figure 1A portion of the second support layer 20 is arranged below a part of the first support layer 10. In the overlap area with the base area G, the first and second conductor structures 1, 2 each comprise conductor track sections of conductor tracks 9 as well as corresponding capacitor plates 7. The capacitors 27 formed thereby enable coupling between the conductor structures 1, 2 of both support layers 10, 20 by means of an alternating current circuit; for example, by applying or inducing an alternating voltage in the (alternating) circuit formed by the first and second conductor structures. The first conductor structures 1 are connected at one end to the electronic unit 5 and at the other end to a respective capacitor plate 7. Overlapping with these, i.e., below them and optionally by an intermediate layer 14 or 20, the capacitor plates 7 are connected to the second support layer 10, 20.Adhesive layer 13 and the layer thicknesses of one or both carrier layers 10, 20 are separated, and associated capacitor plates 7 of the second conductor structures 2 are located. The second conductor structures 2 also comprise further conductor tracks 9, which are either linear with an open end (left in . Figure 2 ) can proceed or, alternatively, as in Figure 2The second conductor structures 2, represented by dotted lines, can comprise an interdigital structure. However, even without such an interdigital structure, the pair of second conductor structures 2 forms a capacitor, which can be used, for example, for measuring humidity in ambient air. The length and / or mutual spacing of the two second conductor structures 2 on the second support layer 20 are selected appropriately. The second conductor structures 2; 9, or at least end pieces or sections thereof, can further comprise a sensor element 4 for any parameter or a touch sensor, such as a capacitive or inductive touch sensor for a control panel or an operating element, such as a control button. The alternating current circuit for operating the object 100 can be generated by the electronic unit 5 itself or induced externally, for example by RFID or other wireless transmission.

[0041] Figure 3shows a top view of another embodiment of an object. In contrast to Figure 2 In the lateral direction, the first support layer 10 or film 19 or material web 18 does not extend beyond the second 20; 28; 29, but runs completely within a partial area of ​​this, for example at an end edge (right in Figure 3 Furthermore, regarding Figure 3 and all subsequent figures refer again to the explanations regarding the Figures 1 and 2 as well as reference to the introductory remarks of the description.

[0042] In Figure 3 The capacitor 27' is designed in the form of two parallel, unbranched conductor tracks 2; 9. If the object 100 includes a housing (not shown), this housing only needs to enclose the overlapping area of ​​both support layers 10, 20; this also applies to all other figures and other embodiments of the application. Figure 3A housing that is attached to the edge (right side) is sufficient. Figure 3 ) is attached, whereas the largest surface area of ​​the first carrier layer 10 or film can protrude from the housing.

[0043] Figure 4 Figure 1 shows an alternative embodiment of an object 100, which has only a single, continuous first conductor structure 1 and only a single, continuous second conductor structure 2 on the respective film. The coupling between the two films or their conductor structures is again effected by the capacitor 27. Apart from one of the capacitor plates 7, the second conductor structure mainly comprises an unbranched conductor track 9, the length of which is essentially the length of the second film 20 in the direction of a first lateral direction x (cf. Figure 1). Figures 1 and 2 ) determined. In the embodiment of the Figure 4The second conductor structure 2; 9 forms an antenna 3 or another sensor element 4; the AC circuit is closed via ground and thus wirelessly. The electronic unit 5 can, for example, comprise an RFID chip 25, another NFC chip and / or another transponder.

[0044] Figure 5Figure 1 shows a further embodiment with inductive rather than capacitive coupling between the conductor structures of both films. The first conductor structure 1, connected to two terminals of the electronic unit 5, forms a coil 38 with one or more coil turns 8 and preferably surrounds the electronic unit 5 in a lateral direction. Overlapping with it is an associated coil or coil turn on or at the second support layer 20 (shown with a dashed line, as it is obscured by the first support layer 10), which forms a component of the second conductor structure 2 and terminates at its two ends in two elongated conductor track sections 9 located outside the overlap area, which also belong to the second conductor structure 2.The second conductor structure 2, which is thus inductively coupled or can be coupled to the first conductor structure 1, can in turn form a sensor for detecting any parameter, for example humidity, or alternatively comprise another sensor, such as a touch sensor or an antenna. While the second conductor structure 2 is in . Figure 4 If it is implemented as a monopole antenna, it can alternatively be implemented as a dipole antenna or as another type of antenna.

[0045] In all figures and embodiments of this application, the first and / or second conductor structures 1, 2 can alternatively be arranged on the inner side 10b, 20b of the respective support layer 10, 20 instead of on the outer side 10a, 20a. Thus, compared to the layer structure as described in Figure 1As shown by way of example, the first conductor structures 1 or the second conductor structures 2 or both of them are arranged between the mutually facing main surfaces of the two support layers 10, 20. However, even then they are arranged and / or separated from each other by an adhesive or other intermediate layer in such a way that no current, in particular no direct current, can flow between them, i.e., both conductor structures are preferably dimensioned and designed as galvanically isolated conductor structures.

[0046] Figure 6Figure 1 shows a further embodiment in which two relatively large capacitor plates 7a, 7b are connected to the electronic unit 5 via corresponding conductor tracks 1; 9 on the first support layer 10. On the second support layer 20, however, the second conductor structure 2 forms a third capacitor plate 7c, which serves as a capacitive bridge 26; it bridges the lateral distance between the two capacitor plates 7a, 7b of the two first conductor structures 1. Figure 6Figure 27 is an example of an embodiment in which two first conductor tracks 1; 7a, 7b, but only a single second conductor track 2; 7c, are present. The capacitor 27 formed by the first and second conductor tracks 1, 2 has a capacitance that is composed of the partial capacitances of the layer structure in the overlap region, namely between the capacitor plates 7a and 7c and between the plates 7c and 7b. The electrically insulated capacitor plate 7c has approximately twice the capacitor area of ​​each of the other capacitor plates 7a, 7b. The distance between the capacitor plates 7a and 7b can be chosen to be suitably large in order to reduce interference capacitance between them. As in the other figures, the dimensions, overlap regions, and dimensions, as well as the size ratios of the carrier layers 10, 20 or films 19, 29 or material films 18, 28, are merely exemplary and not to scale.

[0047] The item 100 according to Figure 6 , but also the Figures 1 to 5 , can be configured, for example, as a sensor for measuring the humidity of the ambient atmosphere or for any other sensor. A material whose thickness is independent of the humidity or any other parameter to be detected, measured, or monitored is preferably used as the intermediate layer 14 between the two support layers 10, 20. Alternatively, however, a material can also be used whose thickness or other material properties (such as polarization, dielectric constant, magnetization, or the like) change depending on the humidity or any other measurement parameter. The subject matter of the application, particularly in the embodiment according to Figure 6This is particularly suitable for measuring sensors with a moisture-dependent or parameter-dependent, and therefore variable, layer thickness of the intermediate layer 14; 13, i.e., for measuring sensors with at least one intermediate layer whose layer thickness changes depending on physical and / or chemical parameters. It is also suitable for measuring sensors with at least one intermediate layer whose dielectric constant changes depending on physical and / or chemical parameters.

[0048] Figure 7Figure 1 shows an alternative embodiment in which the object 100 is designed as a blister pack 102 or at least as a part thereof. The blister pack 102 has a plastic film that is partially formed into cavities 22 into which the tablets, capsules, or other drug units are inserted, as well as a cover film for closing the cavities. According to the invention, the cover film is designed at least partially as a double film comprising the two carrier layers 10, 20. The object 100 can thus be a cover film of a blister pack. The electronic unit 5, which may comprise an RFID chip 25 or another NFC transponder (optionally with an antenna; not shown), is mounted on the first carrier layer 10, which need not overlap the surface area of ​​the cavities.At least the second carrier layer 20, however, covers and seals the cavities 22 filled with tablets or capsules and also extends over their surrounding areas. The second conductor structure 2; 9 comprises conductor tracks 2a to 2f, each of which runs over individual cavities 22 and is interrupted, i.e., destroyed, when the respective tablets are removed. With a number N cavities (here N = 6), N (i.e., here six) individual second conductor structures 2 are thus provided, branched off from an additional connecting line 2; 9, which, for example, according to . Figure 7The branch or node points are connected to each other and are galvanically coupled via a dedicated capacitor (with capacitor plates 7b and 7c) and via a first conductor 1; 9 to a first terminal of the electronic unit 5 on the first carrier layer 10. The remaining second conductor tracks 2a to 2f; 9 are each connected via further capacitors (with capacitor plates 7a and 7b) and via further first conductor structures 1a to 1f to further terminals of the electronic unit 5. Thus, for N cavities, a total of N+1 first or second conductor branches and therefore also N+1 terminals on the electronic unit 5 are required. These allow the removal of the respective tablet and / or the time of removal to be individually recorded, stored, and / or evaluated. Furthermore, the blister pack is made of Figure 7Compatible with any conventional blister pack; for other individual features, please refer to the preceding figures. The second support layer 20 overlaps the first support layer 10 at least in a peripheral area laterally outside the cavities, but is also connected to the more stable film, which is formed into cavities 22 and therefore has a higher mechanical strength, stiffness and / or layer thickness than the support layers 10, 20.

[0049] Figure 8 Figure 1 shows a schematic top view of an object 100 designed as an electronic seal 103. The object 100 has two conductor structures 1, 2 and an interposed electronic unit 5. At least one of the two conductor structures 1, 2 comprises a conductor track 9 that runs predominantly outside the electronic unit 5; according to Figure 8This is the case for both conductor tracks 1, 2. Each conductor track 1, 2 can additionally include a capacitor electrode or capacitor plate 7a, 7b or alternatively a coil turn or coil (not shown). The two conductor structures 1, 2 are designed so that end pieces or at least sections thereof can be coupled together to enable a closed alternating current circuit, at the latest when they are attached to or brought into contact with each other. The base of the support structure 15 is designed such that it can accommodate an object 105 to be sealed ( Figure 9 ) or enclose and electronically secure, i.e., seal, a part of it. For this purpose, the electronic seal 103 has... Figure 8 a support structure 15 consisting of only a single support layer 10 (or alternatively with at least one support layer 10), such as a foil 19 or a material film 18. According to Figure 8Both conductor structures 1, 2 are arranged on this carrier layer 10, either on the same foil surface or on opposite surfaces. The base area of ​​the carrier layer 10 or carrier structure 15 is selected such that the carrier layer 10 or carrier structure 15 can be folded, creased, bent, or otherwise folded or closed, and that the two carrier layer areas 11, 12 can be brought together and / or bonded to each other to form a layered composite or layer stack 16. For example, two respective end pieces and / or sections of the two conductor structures 1, 2 can be brought together to form a capacitor or a double coil, wherein the capacitance or inductance or another transmission property can be monitored periodically, continuously, and / or permanently over a period of time by the electronic unit 5 in order to detect a potential seal breach.

[0050] In Figure 8Both support layer areas 11, 12 belong to the same film 19 or support layer 10; they are connected to each other by the connection area 30 and are stacked on top of each other when the support structure 15 is assembled. The electronic unit 5 can be arranged on one of the two support layer areas 11, 12 or on the connection area 30. Furthermore, at least one of the conductor structures 1, 2 runs in or through the connection area 30, for example between the optional fold or crease line F and the second support layer area 12 spaced apart from it. Figure 8 .

[0051] Both conductor structures 1, 2 can optionally be conductively connected to each other or galvanically isolated from each other. The galvanic isolation can be achieved, for example, by the electronic unit 5 itself, i.e., within it. Alternatively, one or both of the conductor structures 1, 2, can be locally interrupted by a capacitor 27' or a double inductor. The two capacitor plates 7a, 7b or inductors are located on opposite main surfaces of the support structure 15 or support layer, respectively.

[0052] Figure 9 The electronic seal shows Figure 8 in its folded and therefore sealed state. The [item] was [partially] ... sealed]. Figure 8The part of the seal 103 located to the right of the fold line F is folded over and placed onto the part of the electronic seal 103 located to the left of the fold line F. In this process, an end piece or section of the second carrier layer area 12, in particular an end piece or section of the second conductor structure 2 (here comprising at least one capacitor plate 7b or alternatively a coil or coil winding), comes to lie on or over an associated end piece or section of the first carrier layer area 11 or an end piece or section of the first conductor structure 1 (here comprising a capacitor plate 7a, alternatively a coil or coil winding). By bending, folding, creasing, collating, or otherwise closing the carrier structure 15 or carrier layer 10, the electronic seal 103 is closed, thereby also activating an alternating current circuit that exists between the two carrier layer areas 11, 12 (or...).The end or partial sections of the two conductor structures 1, 2) can also flow through the layer stack.

[0053] Before the seal 103 was closed, an object 105 to be sealed was enclosed with it ( Figure 9 ), for example, by routing the connection area 30 around a part of the object 105. Once the AC circuit is closed, i.e., the electronic unit 5 and / or the electronic seal 103 is activated, any interruption of the AC circuit or change in capacitance or inductance between the two conductor structures 1, 2 in the layer stack 16 is detected and interpreted as a seal break. Furthermore, the seal break can also be indicated by supplementary optical indicators (e.g., void effect) or by mechanical destruction (e.g., by irreversible bonding). Figure 10 shows a schematic cross-sectional view of the closed electronic seal 103 from Figure 9. In this case, both support layer areas 11, 12 of the support structure 15 are stacked on top of each other and thus form a layer stack 16.

[0054] According to the Figures 8 to 10 Not only the first support layer area 11, but also the second support layer area 12 is a support layer area of ​​the first support layer 10. Thus, a layer stack 16 in the area of ​​the base area G can be formed using only a single support layer 10, i.e., a single-layer support structure 15. Optionally, an adhesive layer 13 or other intermediate layer 14 can be included. The position of the electronic unit 5 in the Figures 8 to 10 This is merely an example. Alternatively, it can also be located where in Figure 8one of the capacitor plates 7a or 7b is shown. One of the conductor tracks can even be completely integrated into the electronic unit 5 or arranged completely above or below it. Furthermore, the conductor structures 1, 2, or one of them can have vias through the substrate layer 10, for example at the location of the optionally shown capacitor 27' in Figure 8 Thus, at least one of the ladder structures can be located section by section on each of the two main surfaces of the support structure 15 or support layer 10. The structure, geometry, and proportions of the objects depicted in the figures of this application are, moreover, merely exemplary.

[0055] While according Figure 10 the electronic seal Figure 8The electronic seal 103 can be formed if the two conductor structures are located on opposite surfaces or outer sides of the two support layer areas 11, 12 in the area of ​​the layer stack 16. Figure 8 (and likewise that of Figures 11 and 12 ; see below) alternatively, they can also be folded or joined together in such a way that the two conductor structures in the area of ​​the layer stack 16 are located on the mutually facing surfaces or inner sides of the two support layer areas 11, 12.

[0056] Furthermore, the electronic seal 103 can also be joined together or formed into a closed loop such that, within the layer stack 16, one of the two conductor structures is arranged on the inside – relative to the arrangement within the layer stack 16 – of the respective carrier layer area, whereas the other conductor structure is arranged on the outside of the (other) carrier layer area; then exactly one of the two conductor structures faces the adhesive layer. In this embodiment, the carrier layer can additionally be rotated by 180° during the joining process in the transition or connection area between the two carrier layer areas.

[0057] The Figures 11 and 12 show to Figure 8Alternative embodiments of collapsible or foldable electronic seals 103, in which, in particular, the surface area of ​​the carrier layer 10 is designed differently. Again, by enclosing an object 105 when it is brought close to the carrier layer 10 near the fold line F and enclosed on both sides by the carrier layer areas 11, 12 provided with the conductor structures 1 and 2 or capacitor plates 7a, 7b, a closed alternating current circuit around the object 105 is enabled; similar to in Figure 9 and 10 depicted.

[0058] The in the Figure 8 , 11 and 12 The surface designs and layouts shown are merely examples. Reference symbol list

[0059] 1 First conductor structure 2 Second conductor structure 2a-2f Conductor tracks 3 Antenna 4 Sensor element 5 Electronic unit 7; 7a, 7b, 7c Capacitor plate 8 Coil winding 9 Conductor track 10 First carrier layer 10a Outer side 10b Inner side 11 First carrier layer area 12 Second carrier layer area 13 Adhesive layer 14 Intermediate layer 15 Carrier structure 16 Layer stack 17 Layer composite 18 First material film 19 First foil 20 Second carrier layer 20a Outer side 20b Inner side 21 Second carrier layer area 22 Cavity 25 RFID chip 26 Capacitive bridge 27; 27'Capacitor 28Second material film 29Second foil 30Connection area 38Coil 100Object 101Humidity sensor 102Blister pack 103Electronic seal 105 sealed object FFold or crease left Gbase area xfirst lateral direction ysecond lateral direction zthird direction

Claims

1. An object (100), comprising at least the following: - at least one first conductor structure (1), - at least one electronic unit (5), - at least one second conductor structure (2), which is galvanically isolated from the first conductor structure (1) and / or from the electronic unit (5) but is coupled or can be coupled electrically thereto, and - a carrier structure (15) with at least one first pliable carrier layer (10), a first carrier layer region (11) of the first pliable carrier layer (10) and with a second carrier layer region (12; 21), - wherein the carrier structure (15) is formed as a layer stack (16) in a base surface region (G), which comprises at least one part of the base surface of the carrier structure (15), - wherein the layer stack (16) in the base surface region (G) comprises at least the first carrier layer region (11) of the first carrier layer (10) and the second carrier layer region (12; 21), - wherein at least one part of the first (1) and of the second conductor structure (2) is disposed in the base surface region (G), - wherein the first conductor structure (1) and / or the electronic unit (5) is soldered, bonded to the first carrier layer region (11), adhered or printed on it or joined in some other way with the first carrier layer region (11) and / or worked into it, - while the second conductor structure (2) is soldered, bonded to the second carrier layer region (12; 21), adhered or printed on it or joined in some other way with the second carrier layer region (12; 21) or worked into it, - wherein the second conductor structure (2) is coupled electrically to the first conductor structure (1) in a folded state of the pliable carrier layer (10) by a surface region of the layer stack (16) disposed outside the electronic unit (5), - wherein the first conductor structure (1) is arranged on the first carrier layer region (11) and / or on the first carrier layer (10) and is galvanically connected to the electronic unit (5) or to individual components or parts of the electronic unit (5), characterized in that the first (1) and second conductor structures (2) together form at least a pair of coils (28) suitable for inductive transmission in the base surface region (G) of the layer stack (16).

2. Object according to claim 1, characterized in that the second carrier layer region (21) comprises a second pliable carrier layer (20) or at least one partial region of another, second carrier pliable layer (20), wherein the first carrier layer region (11) and the second carrier layer region (21) are surface regions of the carrier layers (10; 20), the base surfaces of which overlap one another at least regionally.

3. Object according to claim 1 or 2, characterized in that the first (1) and the second conductor structure (2) are structured conductive coatings, prints of the carrier layer regions (11; 12; 21) and / or of the carrier layers (10; 20) created, for instance with screen printing, flexography or any other printing technique, or conductive structures stamped, adhered onto the carrier layer regions (11; 12; 21) and / or carrier layers (10;20) and / or created by an etching process or other kind of machining process on the carrier layer regions (11; 12; 21) and / or carrier layers (10;20).

4. Object according to one of claims 1 to 3, characterized in that the second conductor structure (2) comprises an antenna (3), a sensor element (4), which can be capacitively influenced, of a control panel or of a control element, a capacitor plate (7), an inductor (28) or induction coil (8) and / or a conductor track (9).

5. Object according to claim 1, characterized in that the electronic unit (5) is arranged outside the base surface region (G) of the layer stack (16), where the first (1) and the second conductor structures (2) are coupled or can be coupled to one another electrically.

6. Object according to one of claims 1 to 5, characterized in that the layer stack (16) is a foil composite, layer composite (17) or some other multilayer structure, which permits an electrical measurement, signal transmission and / or the formation, maintenance and / or monitoring of an alternating current circuit.

7. Object according to one of claims 1 to 6, characterized in that the first (1) and the second conductor structure (2) are disposed on outer surfaces, facing away from one another, of the two carrier layer regions (11; 12; 21) or carrier layers (10; 20) or on their inner surfaces, facing one another, or in that precisely one of the two conductor structures (1, 2) is disposed on that side of the respective carrier layer regions (11; 12; 21) or of the respective carrier layer (10; 20) which is facing the other carrier layer region or regions (12; 21; 11) or the other carrier layer (20; 10).

8. Object according to one of claims 1 to 3 or 5 to 7, characterized in that the object (100) is a capacitive moisture sensor (101), for example a moisture sensor (101) for clothing items, incontinence diapers or for technical systems or instruments.

9. Object according to one of claims 1 to 3 or 5 to 7, characterized in that the object (100) is a blister pack (102), in which an associated first or second conductor structure (1; 2) is severed at least locally during the removal of a tablet or capsule.

10. Object according to one of claims 1 to 9, characterized in that the first (11) and / or the second conductor structure (2) comprises a mobile communications antenna or an antenna (3) for NFC signals, Bluetooth, WLAN or other radio systems and / or in that the electronic unit (5) comprises an RFID transponder or an RFID chip (25).

11. Object according to one of claims 1 to 10, characterized in that the first conductor structure (1) comprises two capacitor plates (7a, 7b) and in that the second conductor structure (2) is a capacitive bridge (26) between the two capacitor plates (7a, 7b) of the first conductor structure (1).

12. Object according to one of claims 1 or 3 to 11, characterized in that the second carrier layer region (12) is a further carrier layer region of the first carrier layer (10), which is integrated into the layer stack (16), wherein the first carrier layer (10), at least in places, is bent back, creased, folded and / or formed in some other way to a closed loop, strap or to a ribbon or strip.

13. Object according to claim 12, characterized in that the object (100) is an electronic seal (103) and in that the first carrier layer (10) has a joint region (30) extending from the first carrier layer region (11) to the second carrier layer region (12) and in that at least the electronic unit (5) is interconnected between the first conductor structure (1) and the second conductor structure (2).

14. Object (100), comprising at least the following: - at least one first conductor structure (1), - at least one second conductor structure (2), - at least one electronic unit (5), which is interconnected between the first (1) and the second conductor structure (2), and - a carrier structure (15) with at least one pliable carrier layer (10), - wherein the carrier structure (15) has at least one first carrier layer region (11), one second carrier layer region (12) and one joint region (30), which joins the first carrier layer region (11) to the second carrier layer region (12), - wherein the carrier structure (15) can be folded, creased, bent back or otherwise placed together, such that the first carrier layer region (11) and the second carrier layer region (12) are stacked as a layer stack (16), and that, in a surface region of the layer stack (16) disposed outside the electronic unit (5) an end piece or partial piece of the first conductor structure (1), which is disposed in the first carrier layer region (11), gets coupled electrically to an end piece or partial piece of the second conductor structure (2) disposed in the second carrier layer region (12) in a folded state of the pliable carrier layer, characterized in that the end pieces or partial pieces of the first (1) and second conductor structures (2) together form at least a pair of coils (28) suitable for inductive transmission.

15. Object according to claim 14, characterized in that the object is an electronic seal (103), the first (11) and second carrier layer region (12) of which can be guided up to one another and / or fastened to one another, in order to close an alternating current circuit.

16. Method for manufacturing an object (100), which has an electronic unit and conductor structures on a carrier structure, wherein the method comprises at least the following: a) application of at least one first conductor structure (1) and at least one electronic unit (5) on a first pliable carrier layer (10) as well as application of at least one second conductor structure (2) on a pliable second carrier layer (20), and b) finishing of the object (100) by joining, especially adhering or welding, of the first pliable carrier layer (10) with the pliable second carrier layer (20), whereby - a carrier structure (15) is formed which, in a base surface region (G) that comprises the at least one partial surface of the base surface of the carrier structure (15), is constructed as a layer stack (16), and whereby - in an area of the layer stack (16) located outside the electronic unit (5), in a folded state of the pliable carrier layer the second conductor structure (2) gets electrically coupled to the first conductor structure (1), such that the end pieces or partial pieces of the first (1) and second conductor structures (2) together form at least a pair of coils (28) suitable for inductive transmission.