ITEM WITH AN ELECTRONIC UNIT AND WITH CONDUCTOR STRUCTURES ON A SUPPORT STRUCTURE
Patent Information
- Application Number
- DE502016017121
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2015-08-21
- Filing Date
- 2016-08-18
- Publication Date
- 2026-01-22
- Estimated Expiration
- 2036-08-18
AI Technical Summary
Conventional methods for manufacturing objects with electronic units on flexible substrates are inefficient and costly due to the need for soldering or conductive adhesives, which slow down the manufacturing process and increase material costs, especially when only a few connections are required on large-area films.
The support structure is designed as a stack of layers, with electronic units on one layer and conductor structures on another, allowing for galvanic isolation and capacitive or inductive coupling without soldering or conductive adhesives, enabling higher throughput and reduced material usage.
This approach reduces manufacturing costs and effort by allowing simultaneous production of multiple units on smaller layers, while maintaining electrical functionality through capacitive or inductive coupling, thus enhancing efficiency and cost-effectiveness.