Component carrier with at least one part designed as a three-dimensionally printed structure

Description

Technical area

[0001] The invention relates to a component carrier, wherein at least a portion of the component carrier is formed as a three-dimensional structure. Furthermore, the invention relates to a method for producing a component carrier, wherein at least a portion of the component carrier is formed as a three-dimensional structure. Background of the invention

[0002] Conventional component carriers are manufactured as single-layer or multi-layer component carriers. They are usually produced photochemically by laminating the electrically conductive layers using a photoresist. After the photoresist is exposed through a mask containing the desired structure of the electrically conductive layer, either the exposed or unexposed portions of the photoresist are removed in a suitable solution. Important for the quality and functionality of the component carrier are, on the one hand, the materials used and, on the other hand, the application and connection of the materials used to one another. Due to the ever-increasing demands on component carriers due to increasing miniaturization in electrical engineering, the requirements for the materials used and the structure of the component carrier itself are also increasing.For this reason, there is still room for improved component carriers and their manufacturing processes.

[0003] US 2015 / 0201500 A1 discloses a component carrier according to the preamble of claim 1.

[0004] US 2017 / 013712 A1 discloses a multilayer 3D printing laser direct structuring method and apparatus for electrical interconnects and antennas. 3D-printed components can be configured with structurally integrated metal interconnects (e.g., highly conductive metal in bulk) traversing multiple layers (some embedded and others external) of a structure fabricated with an additive manufacturing system enhanced by iterative laser-activated deposition processes. US 2015 / 104562 A1 describes a fully additive process for fabricating multilayer electrical interconnects for printed electronic and / or optoelectronic devices. Electrical interconnects are created by direct inkjet printing of a dielectric material with selective vias.Conductive patterns are then printed using inkjet printing and the connection holes are filled with conductive material to create multi-layer connections. Description of the invention

[0005] It is an object of the present invention to provide a component carrier which is easy to manufacture and allows more flexibility in the arrangement of the component carrier structures.

[0006] This object is achieved by the subject matter having the features of claims 1 and 13, respectively. Further embodiments are shown in the dependent claims.

[0007] The term "component carrier" refers, in particular, to any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, a component carrier can be configured as a mechanical and / or electrical support for components. In particular, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid board that combines the various types of component carriers mentioned above.

[0008] According to one embodiment of the invention, the component carrier comprises a carrier body with a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate of said electrically insulating layer structure(s) and the electrically conductive layer structure(s), which is formed in particular by applying mechanical pressure, if desired assisted by thermal energy. Said stack can provide a plate-shaped component carrier capable of providing a large mounting surface for further components and which is nevertheless very thin and compact. The term "layer structure" is understood in particular to mean a continuous layer, a structured layer, or a plurality of non-consecutive islands within a common plane.The component carrier has a carrier body consisting of various layer structures, i.e., electrically insulating and electrically conductive layer structures. The various layer structures can be arranged such that the order of the electrically insulating layer structure and the electrically conductive layer structure alternates. For example, the carrier body can have a layer structure that begins with the electrically conductive layer structure, which is followed by an electrically insulating layer structure, and which is further followed by an electrically conductive layer structure, thus forming the stack of the component carrier.

[0009] The term "at least one part" of the component carrier refers in particular to at least one layer of the component carrier, electrically conductive components of the component carrier, or any other parts that form the component carrier. The at least one part can be a conductive part of the component carrier and / or a non-conductive and / or insulating part of the component carrier, or a combination thereof. Furthermore, the at least one part can be formed on and / or in at least one of the electrically conductive layer structures and / or electrically insulating layer structures. In particular, the entire component carrier can also be formed as a three-dimensionally printed structure.

[0010] The term "three-dimensional printed structure" refers specifically to a structure produced using a three-dimensional printing process. During the three-dimensional printing process, the 3D-printed structures are built up layer by layer. Specifically, three-dimensional printing refers to printing with powdered material. One process that uses printable material in powder form is selective laser sintering (SLS) or selective laser melting (SLM). Another process that uses printable materials in powder form is electron beam melting (EBM, or electron beam additive manufacturing EBAM). 3D printing with fusible materials can specifically be understood as fused filament fabrication (FFF) or fused deposition modeling (FDM). During the 3D printing process, the three-dimensional printed structure is built up layer by layer.

[0011] Forming a part of a component carrier using a three-dimensional printing process can simplify the manufacturing of the component carrier. Furthermore, the design of the component carrier part can be easily adapted to its function and / or its position on the component carrier, allowing the design of the component carrier itself to be easily adapted. Using 3D printing can guarantee greater precision during the forming of the component carrier part. Furthermore, the 3D printing process allows for the arrangement of various parts on the component carrier with high precision.

[0012] It is noted that the term "layer structures" can be used in this document to represent the majority of electrically conductive layer structures and electrically insulating layer structures.

[0013] According to an exemplary embodiment of the invention, the three-dimensionally printed structure is formed in the interior and / or on a surface of the carrier body. The three-dimensionally printed structure is formed on one of the plurality of layer structures and optionally formed in one of the plurality of layer structures. Furthermore, the three-dimensionally printed structure can be a part of one of the plurality of layer structures. Furthermore, the three-dimensionally printed structure can extend at least partially through the carrier body, such that the three-dimensionally printed structure extends through one of the plurality of layer structures.

[0014] According to an exemplary embodiment, the three-dimensionally printed structure is formed along a stacking direction of the plurality of layer structures. The plurality of layer structures of the component carrier can be arranged as a stack, i.e., layered one above the other. Therefore, the term "stacking direction" can be understood in particular as the direction along which the stacked layers are stacked one above the other. The stacking direction can thus be an extension direction of the three-dimensionally printed structure through the plurality of layer structures.

[0015] According to an exemplary embodiment, the three-dimensionally printed structure is formed perpendicular to a stacking direction of the plurality of layer structures. The perpendicular extension with respect to the stacking direction can be an extension direction of the three-dimensionally printed structure along at least one of the plurality of layer structures.

[0016] According to an exemplary embodiment, the three-dimensionally printed structure has different cross-sectional areas, in particular in a stacking direction of the plurality of layer structures and / or perpendicular to a stacking direction of the plurality of layer structures. The three-dimensionally printed structure can have different cross-sectional areas in the direction of a plane extending parallel to the plurality of layer structures and / or the three-dimensionally printed structure can have different cross-sectional areas in the direction of a plane extending perpendicular to the plurality of layer structures. For this reason, the three-dimensionally printed structure can have different thicknesses in a plane parallel and / or perpendicular to the plurality of layer structures. Different thicknesses can be easily realized by means of 3D printing.

[0017] According to an exemplary embodiment, the component carrier has a surrounding component carrier region and a surrounded component carrier region which is surrounded by the surrounding component carrier region, wherein in particular at least a part of the surrounding component carrier region and / or the surrounded component carrier region can be formed as a further three-dimensionally printed structure. In other words, the three-dimensionally printed structure can be formed in a component carrier region which surrounds the three-dimensional structure and / or the three-dimensionally printed structure can be formed in a component carrier region such that the three-dimensional structure surrounds another component carrier region. Depending on the region in which the three-dimensionally printed structure is arranged, the corresponding other region is also formed as (i.e. as a further) three-dimensionally printed structure.In particular, the three-dimensionally printed structure can be embedded in a component carrier, so that the three-dimensionally printed structure is formed on / in a component carrier which can be integrated into another component carrier, or vice versa.

[0018] According to an exemplary embodiment, the three-dimensionally printed structure at least partially forms the electrically conductive layer structures. In particular, the three-dimensionally printed structure can at least partially form one of the plurality of layer structures. Thus, the three-dimensionally printed part of the component carrier can be at least one of the plurality of layer structures.

[0019] According to an exemplary embodiment, the three-dimensionally printed structure is designed as a rigid and / or flexible structure. If the three-dimensionally printed structure is designed as a rigid structure, the three-dimensionally printed structure can be used to form at least a part of a rigid carrier body, in particular a rigid printed circuit board. If the three-dimensionally printed structure is designed as a flexible structure, the three-dimensionally printed structure can be used to form at least a part of a flexible carrier body, in particular a flexible printed circuit board. Depending on the 3D printable material used for the three-dimensionally printed structure, the 3D printed structure has rigid and / or flexible properties. Flexible properties, or flexible carrier body, are understood to mean, for example,A flexible material is understood to mean that at least a portion of the support body is reversibly deformable under load. In contrast, a rigid portion of a support body is less and / or not at all deformable.

[0020] According to an exemplary embodiment, the carrier body has a recess, wherein the three-dimensionally printed structure is printed within the recess. The term "recess" is understood in particular to mean a cavity within the carrier body. The recess can be formed in the carrier body such that the recess is surrounded by the carrier body on at least three sides and thus has contact with the surroundings of the carrier body through the non-surrounded side. On the other hand, the recess in the carrier body can be formed such that the recess is enclosed by the carrier body on all sides and thus has no contact with the surroundings of the carrier body, i.e., it only has contact with the carrier body itself. The recess can extend in the direction of a stacking direction of the carrier body and / or the recess can extend perpendicular to a stacking direction.Furthermore, the three-dimensionally printed structure can at least partially fill the recess, or the three-dimensionally printed structure can completely fill the recess. Thus, for example, a component that can be sunk into the carrier body can be printed three-dimensionally.

[0021] According to an exemplary embodiment, the three-dimensionally printed structure is at least partially designed as an electrically conductive connecting element, in particular as a connection pad, a pin, a socket, a micropin (or also micropillar), a sliding contact, in particular a ring-shaped one, and / or a spring contact. Furthermore, the 3D printed structure can be a solderable connection pad that is printed directly onto the carrier body. Likewise, the 3D printed structure can be an electrical connecting element extending outward from the carrier body, so that a pin, a socket and / or a micropin is formed, by means of which electronic components can be connected to the carrier body. Furthermore, the 3D printed structure can be a sliding contact in order to thus produce a non-permanent plug connection with a very long service life and reliability. The electrically conductive connecting element can also be a wire connection, i.e.Conductor track connection between different components of the carrier body.

[0022] According to an exemplary embodiment, a solder deposit can be applied to the conductive connecting element, in particular as a three-dimensionally printed structure. Thus, a standard soldering process can be replaced by 3D printing of solder. The printable solder can, in particular, be tin solder. Printing the solder itself is advantageous when printing on copper-free elements, such as copper layers as an electrically conductive layer, so that a direct electrically conductive contact can be established between the two different materials, thus making special fluxes for the soldering process obsolete.

[0023] According to an exemplary embodiment, the three-dimensionally printed structure is designed as a damping element, in particular as a spring. In particular, the 3D-printed structure is designed as a microspring. The damping element(s) can be printed directly onto the carrier body or directly onto one of the plurality of layer structures. This avoids the need for additional manufacturing of the damping elements and subsequent connection of the damping elements to the carrier body. Furthermore, integrable, detachable damping connections (or plug connections) for the assembly of electronic devices are created. For example, a damping element can be printed directly onto copper plates of the carrier body using a powder-based 3D printing process.

[0024] According to an exemplary embodiment, the three-dimensionally printed structure is designed as a mechanical connecting element, in particular a threaded bushing, a snap connection, a hook-and-loop connection, a zipper connection, a guide rail and / or a guide pin. If the 3D-printed structure is designed as a threaded bushing, it represents in particular a mechanical depot for screws and serves to secure screws. In particular, the mechanical connecting element is a specially shaped element as a mechanical depot for screws for receiving and fixing screw connections. The mechanical connections by means of the mechanical connecting element can be detachable and / or movable. The connections can also function as electrical connections, which can be released as required. For example, a zipper connection can partially have or enter into electrical connections.Furthermore, if the mechanical connecting element is a hook-and-loop connection, it is possible for the hook-and-loop connection formed on the carrier body to adhere the carrier body to textile elements or another associated element, such as another carrier body, PCB, modular textile element, clothing, or a casing. Furthermore, the mechanical connecting element can serve as an anchor connection to hold the carrier body at a specific location in a larger unit.

[0025] According to an exemplary embodiment, the mechanical connecting element is configured to form a detachable connection. The detachable connection can be a detachable mechanical connection and / or a detachable, partially electrical connection.

[0026] According to an exemplary embodiment, the three-dimensionally printed structure forms a reinforcement structure, in particular a reinforcement structure of the electrically conductive layer structures. The reinforcement structure can further serve to protect components embedded in the carrier body, wherein the reinforcement structure is arranged around these components. Furthermore, the reinforcement structure can be arranged around recesses in at least one of the plurality of layer structures, thus ensuring stability around these recesses.

[0027] According to an exemplary embodiment, the three-dimensionally printed structure is a thermally conductive structure. In particular, the 3D-printed structure serves to dissipate heat from heat-generating elements, such as electronic components, on and / or in the carrier body. The thermally conductive structure can, in particular, be at least one of a heat sink, a heat pipe, a simple copper conductor for heat dissipation, or a cooling plate. The thermally conductive structure can be printed in and / or on the carrier body. Copper or thermally conductive ceramics can be used as the material for the thermally conductive structure.

[0028] According to an exemplary embodiment, the three-dimensionally printed structure forms a surface of the carrier body, wherein regions of the surface differ in their hardness, roughness and / or elasticity. The three-dimensionally printed structure forms the outermost layer of the carrier body, which can be exposed to the environment of the carrier body. If a part of the carrier body is exposed to a harsh environment, this part can have a three-dimensionally printed surface with a high hardness in order to protect the part of the carrier body, for example, from abrasion and dirt. Furthermore, a surface with a higher hardness can be exposed to higher clamping forces. The three-dimensionally printed surface can have a low hardness and / or high elasticity if a flexible printed circuit board is to be formed. Furthermore, the surface can completely enclose the carrier body in order to form a shell around the carrier body.The differently shaped surfaces can all be formed on a single carrier body.

[0029] According to an exemplary embodiment, a region of the three-dimensionally printed structure is formed from steel and / or titanium. If the three-dimensionally printed structure is formed, for example, as a surface of the carrier body, it can form a shell, wherein the surface. This protects the carrier body from environmental influences. The three-dimensionally printed structure can cover the carrier body at least partially or completely. Furthermore, biocompatible carrier bodies or circuit boards can be produced by using titanium materials.

[0030] According to an exemplary embodiment, the three-dimensionally printed structure forms at least part of a component. "Component" can be understood to mean a component that is arranged on / in the carrier body to fulfill a specific function, such as an electronic component. In particular, the three-dimensionally printed structure can form a surface of the component or be printed onto the component as a final surface of the component (e.g., as a shell; heat-dissipating structure). Furthermore, the three-dimensionally printed structure can completely form the component, resulting in a three-dimensionally printed component.

[0031] According to an exemplary embodiment, at least a portion of the carrier body is at least partially encapsulated by the three-dimensionally printed structure as an encapsulation. The encapsulation can completely or partially enclose the carrier body. If only certain areas of the carrier body are to be protected, for example, from external influences, only the areas to be protected are encapsulated by the three-dimensionally printed structure. For example, the uppermost copper layers of the carrier body are encapsulated so that these copper layers are not exposed.

[0032] According to an exemplary embodiment, the component carrier further comprises a component, in particular an electronic component, surface-mounted on and / or embedded in at least one of the plurality of electrically conductive layer structures and / or electrically insulating layer structures. The component can be an electronic component or device for performing various functions, depending on the application in which the component carrier is embedded. The component can be surface-mounted on and / or embedded in at least one of the plurality of electrically conductive layer structures and / or surface-mounted on and / or embedded in at least one of the plurality of electrically insulating layer structures.

[0033] According to an exemplary embodiment, the three-dimensionally printed structure comprises at least one material component comprising copper and optionally aluminum, steel, titanium, or a metal alloy. Furthermore, the material component may comprise solder.

[0034] According to an exemplary embodiment, the three-dimensionally printed structure is configured such that another three-dimensionally printed structure can be printed onto it. This means that first, a three-dimensionally printed structure is printed onto at least part of the carrier body. Subsequently, another three-dimensionally printable structure is printed onto the one three-dimensionally printed structure. Thus, several three-dimensionally printed structures can be printed onto one another. This allows, for example, the layer structure (i.e., the stacks) of the carrier body to be created.

[0035] According to an exemplary embodiment, a further part of the component carrier is formed as a further three-dimensionally printed structure, wherein the three-dimensionally printed structure and the further three-dimensionally printed structure are made of different materials. The component carrier thus consists of a part which is formed as a three-dimensionally printed structure and of a further part which is formed from a further three-dimensionally printed structure. The three-dimensionally printed structures can differ in their materials and properties in order to fulfill different functions. For example, one three-dimensionally printed structure can be electrically conductive and the further three-dimensionally printed structure can be electrically insulating.

[0036] According to an exemplary embodiment, one three-dimensionally printed structure has a higher thermal conductivity and / or electrical conductivity than the other three-dimensionally printed structure. Materials with different thermal conductivities can be used as insulation.

[0037] According to an exemplary embodiment, the further three-dimensionally printed structure is formed from an electrically conductive material, in particular aluminum. Since aluminum proves difficult to solder, it is advantageous to apply the aluminum as a three-dimensionally printed structure directly to a component carrier. On the other hand, it is also easier to print a three-dimensionally printed structure onto the aluminum than to solder it, thus creating better adhesion between aluminum and another material (e.g., copper).

[0038] According to an exemplary embodiment, the three-dimensionally printed structure and the further three-dimensionally printed structure are formed one above the other to form a bimetallic element. When the three-dimensionally printed structures are formed as a bimetallic element, both the one three-dimensionally printed structure and the further three-dimensionally printed structure comprise different materials. For example, a copper layer can be printed onto which another metal layer is printed to form a bimetallic strip. Using this structure, a sensor (or a relay, thermometer, or energy harvester) can be formed through the resulting expansion effects.

[0039] According to an exemplary embodiment, the three-dimensionally printed structure is an antenna structure. Current PCB antenna solutions include either microstrip antennas, which are manufactured during a standard PCB manufacturing process, or external antennas, which are manufactured as a surface-mounted device (SMT) antenna or attached with separate connectors. To combine the advantages of both variants and reduce manufacturing costs, a three-dimensionally printed antenna can be used. This allows for an antenna with improved antenna characteristics and a high degree of design freedom, which can be applied directly to the component carrier or the PCB. This three-dimensionally printed antenna can be used in radar, IoT (Internet of Things), or GPS applications.

[0040] According to an exemplary embodiment, the antenna structure is designed such that the antenna structure can be printed directly onto and / or into the carrier body. In particular, the antenna structure can be printed into / onto at least one of the plurality of layer structures.

[0041] According to an exemplary embodiment, the three-dimensionally printed structure is formed as at least one of a group consisting of an active or passive electronic component, a resistor, a capacitor, an inductor, an electrical contact, a fuse, a USB contact, and a QFN contact. The three-dimensionally printed structure can directly form the aforementioned active or passive electronic components and thus also perform their functions. For example, resistors can be integrated into the component carrier by printing various metals (or alloys) using 3D printing processes to form a resistor. By printing the materials three-dimensionally, tighter tolerances can be achieved for the resistors than with conventional manufacturing processes.

[0042] An electrical contact can, for example, be a 3D-printed adapter for electronic testing of printed circuit boards. Furthermore, various other electrical contacts can be printed on and / or into the carrier body (i.e., USB, QFN, converter switch). Furthermore, two different 3D-printed structures can be realized: first, a metallic 3D-printed structure is realized to form the housing or fastening means of a socket of an electrical contact, and second, an electrically conductive 3D-printed structure is created, which represents the electrical contact itself.

[0043] If the three-dimensional printed structure is designed as a fracture protection device, this includes a mechanically stressable 3D printed structure with the possibility of breaking under a defined mechanical load.

[0044] According to an exemplary embodiment, the three-dimensional printed structure is formed as at least one of a group consisting of a sensor, an actuator, a magnetic sensor, EMC shielding and a microelectromechanical system.

[0045] A three-dimensionally printed EMC shield can replace prefabricated EMC shielding and be printed directly onto the component carrier. The 3D printing process allows for a high degree of variability in the design selection of the EMC shielding. For example, a three-dimensionally printed magnetic sensor can be used to implement a wireless charging mechanism that converts magnetic energy into electrical energy. Coils can be printed onto the surface of the component carrier, with a Z-axis of the coils parallel to the component carrier surface. This embodiment can serve as a sensor for detecting magnetic flux density (or fields of magnetic flux density) parallel to the component carrier surface.

[0046] According to an exemplary embodiment, the three-dimensionally printed structure is formed as at least one element selected from the group consisting of a microphone, a loudspeaker, and a Helmholtz horn. The Helmholtz horn, also known as a so-called Helmholtz resonator, can be used, for example, to create a bottleneck for unwanted frequencies that would reach the microphone and cause interference therein. Complex geometries for corresponding applications (such as corresponding Helmholtz resonators for specific frequencies) can be realized using 3D printing.

[0047] According to an exemplary embodiment, the at least one component may be selected from a group consisting of an electrically non-conductive inlay, an electrically conductive inlay (such as a metal inlay), a heat dissipation unit (e.g., a heat pipe), an electronic component, or combinations thereof.For example, the component can be an active electronic component, a passive electronic component, an electronic chip, a memory device (e.g., a DRAM or other data storage device), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectric converter, a voltage converter (e.g., a DC / DC converter or AC / DC converter), a cryptographic component, a transmitting and / or receiving unit, an electromechanical converter, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, an accumulator, a switch, a camera, an antenna, a magnetic element, another component carrier, a logic chip, and an energy harvesting unit. However, other components can also be embedded in the component carrier.For example, a magnetic element can be used as a component. Such a magnetic element can be a permanent magnet element (such as a ferromagnetic element, an antiferromagnetic element, or a ferrimagnetic element, e.g., a ferrite core) or a paramagnetic element. However, the component can also be another component carrier, e.g., a board-in-board configuration. The component can be surface-mounted on the component carrier and / or embedded in an interior thereof. Furthermore, other components can also be used as components, in particular those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation emitted by an environment.

[0048] According to an exemplary embodiment of the invention, at least one of the plurality of electrically insulating layer structures comprises at least one of the group consisting of resin (such as reinforced or non-reinforced resins, e.g., epoxy resin or bismaleimide-triazine resin, more particularly FR-4 or FR-5), cyanate esters, polyphenylene derivatives, glass (particularly glass fibers, multilayer glass, glass-like materials), prepreg material, polyimide, polyamide, liquid crystalline polymer (LCP), epoxy-based build-up film, polytetrafluoroethylene (Teflon), a ceramic, and a metal oxide. Reinforced materials such as fabrics, fibers, or spheres, e.g., made of glass (multilayer glass), may also be used. Although prepreg or FR4 is usually preferred, other materials are also possible.For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystalline polymer and / or cyanate ester resins can be implemented in the component carrier as an electrically insulating layer structure.

[0049] According to one embodiment of the invention, the component carrier is shaped as a plate. This contributes to the compact design, while the component carrier still provides a large base for mounting components. Furthermore, a bare chip, in particular, as an example of an embedded electronic component, can be conventionally embedded into a thin plate, such as a printed circuit board, due to its small thickness.

[0050] According to one embodiment of the invention, the component carrier is configured as one of the group consisting of a printed circuit board and a substrate (in particular an IC substrate).

[0051] The term "printed circuit board" (PCB) refers in particular to a component carrier (which may be plate-shaped (i.e., planar), three-dimensionally curved (e.g., when produced using 3D printing), or which may have any other shape) formed by laminating several electrically conductive layer structures with several electrically insulating layer structures, for example, by applying pressure, if desired accompanied by the addition of thermal energy. Preferred materials for PCB technology are the electrically conductive layer structures made of copper, while the electrically insulating layer structures comprise a resin and / or glass fibers, a so-called prepreg or FR4 material.The various electrically conductive layer structures can be interconnected in a desired manner by forming through-holes through the laminate, for example, by laser drilling or mechanical drilling, and by filling them with electrically conductive material (especially copper), thus forming vias as through-hole connections. Apart from one or more components, which may be embedded in a printed circuit board, a printed circuit board is typically configured to receive one or more components on one or opposite surfaces of the plate-shaped printed circuit board. These may be connected to the respective main surface by soldering. A dielectric part of a printed circuit board may be made of resin with reinforcing fibers (such as glass fibers).

[0052] The term "substrate" refers specifically to a small component carrier that is essentially the same size as a component mounted on it (especially an electronic component). Specifically, a substrate can be understood as a carrier for electronic connections or electrical networks, just as a component carrier comparable to a printed circuit board (PCB), but with a considerably higher density of laterally and / or vertically arranged connections. Lateral connections are, for example, conductive paths, while vertical connections can be, for example, drill holes.These lateral and / or vertical connections are located within the substrate and can be used to provide electrical and / or mechanical connections of packaged components or unpackaged components (such as exposed chips), particularly IC chips, to a printed circuit board or intermediate printed circuit board. Therefore, the term "substrate" also includes "IC substrates." A dielectric portion of a substrate can be made of resin with reinforced beads (such as glass beads).

[0053] In one embodiment, the component carrier is a laminate-type component carrier. In such an embodiment, the component carrier is a composite of multiple layer structures that are stacked and bonded together by applying a compressive force and, if desired, accompanied by heat.

[0054] Further exemplary embodiments of the method for producing a component carrier are described below.

[0055] In an exemplary embodiment of the method, three-dimensional printing comprises introducing a printable material into a processing device. Furthermore, the method comprises melting the printable material in the processing device and feeding the molten printable material onto and / or into the carrier body to form at least one layer of at least a portion of the three-dimensionally printed structure. According to this embodiment, meltable material is used for 3D printing. The material can be introduced into a 3D printer. The 3D printer can have a print head that functions as a processing device. The print head can be a heatable extruder into which the material is fed.The material is melted within the extruder so that the material can be transferred through the extruder (for example through an extruder nozzle) to a structure onto which the molten material is to be applied and / or introduced (such as onto at least one of the layered structures). The processing device and the carrier body can be moved relative to one another. After the applied layer of the part of the carrier body has solidified (cured), a further layer of the part of the carrier body is subsequently formed by means of the extruder. The number of layers formed of one part of the carrier body depends on the size, in particular on the height, of that part of the carrier body. For example, a formed layer can have a thickness (or height) of 50 µm. The part of the carrier body can have a thickness (or height) of 200 µm.Therefore, four layers are printed on top of each other to form the part of the carrier body. For example, the processing device may have a high resolution, so that individual layers have a thickness of approximately 1 µm to 16 µm. Furthermore, more than one processing device may be used during the manufacturing process to apply different materials simultaneously and / or to form different layers of different parts of the carrier body. According to this embodiment, it may be possible to print more than one part of the carrier body simultaneously. Two parts of the same carrier body may be formed in and / or on different levels of the carrier body or on different layer structures.

[0056] According to a further embodiment of the method, three-dimensional printing comprises applying a printable material, in particular a powdered material, onto and / or into the carrier body and solidifying or consolidating the applied printable material to form at least one layer of at least a portion of the three-dimensionally printed structure. The term "solidifying / consolidating" can, in particular, refer to a step or activity in which the printable material is brought into a solid state, wherein the solid state is a state of the at least one layer of the at least a portion of the three-dimensional structure. For example, solidifying / consolidating can be at least one of the following: adhering, gluing, curing, tempering, solidifying, melting, and hardening or curing the printable material.The formation of the at least one layer of the part of the carrier body can be carried out by applying an adhesive to the at least one layer of the part of the carrier body. The adhesive bonds the individual particles of the powdered material together, forming a corresponding layer. The adhesive can be applied to the powder layer using a print head. The adhesive (or binder) can be a fluidic adhesive. During 3D printing with powder, the first (bottom) layer is applied to the powder layer using the fluidic adhesive. The 3D printer draws a 3D image onto the first layer of the powder bed and bonds the powder material particles together. After this step, another thin layer of powder is applied to the first layer, and the 3D printing process is repeated to create a second layer.Thus, a 3D model of one part of the component carrier is created layer by layer by bonding powder layers together. In this case, the 3D structure grows from the bottom up. To do this, the powder bed is lowered by the height of one powder layer. The powder and the adhesive are made of different materials. It is also possible to use copper as a powder material for 3D printing conductive parts of the component carrier. The 3D printer can be equipped with at least one print head or with multiple print heads. The adhesive used can be a conductive adhesive, so that layered structures are formed using conductive metal powder and conductive adhesive to be electrically conductive. The adhesive can be cured using thermal treatment, such as a heat lamp or a laser.

[0057] According to the invention, the three-dimensional printed structure is formed by means of at least one of a group consisting of selective laser melting, selective laser sintering and electron beam melting.

[0058] According to another exemplary embodiment of the method, prior to solidifying / consolidating the printable material, the printable material is melted using a thermal treatment device, in particular a laser device. Instead of using an adhesive to bond the material particles together, the individual layers can be melted using a thermal treatment device, such as a laser. This thermal treatment method is called Selective Laser Sintering (SLS) or Selective Laser Melting (SLM). When SLS or SLM is used as the manufacturing method, the formation of the layer of powder material is carried out using a laser, wherein the laser melts or sinters the powder material to form at least one layer of one part of the component carrier. When using SLS or SLM methods, the use of an adhesive to bond the powder particles is unnecessary.

[0059] Furthermore, the printable material can be melted using a controllable electron beam, which is referred to as electron beam melting (EBM).

[0060] According to another exemplary embodiment of the method, the printable material is applied using a material feed nozzle. The printable material, e.g., powder, is provided by the material feed nozzle, so that the printable material to be applied is sprayed out of the material feed nozzle. A precise amount of material can be provided by the material feed nozzle, so that only the part of the component carrier to be printed needs to be covered with a (new) layer of printable material, instead of the entire component carrier.

[0061] According to another exemplary embodiment, the method further comprises moving the material feed nozzle to form another layer of the at least one part of the three-dimensionally printed structure. The term "moving" can be understood in particular as a movement along at least one spatial direction. Furthermore, it can be understood as adjusting the material feed nozzle with respect to the carrier body. For example, a distance between the carrier body and the material feed nozzle can be adjusted. Furthermore, the material feed nozzle can be moved along other spatial directions to establish a desired alignment between the carrier body and the material feed nozzle. The thickness and location of the layer to be formed can be adjusted depending on the movement of the material feed nozzle.This step can be repeated until a final thickness of one part of the three-dimensional printed structure is achieved. Thus, one part of the three-dimensional printed structure is formed layer by layer by spraying printable material.

[0062] According to a further exemplary embodiment, the carrier body is provided in a material bed before the printable material is fed to the carrier body. The carrier body can be placed in the material bed. The component carrier can be completely covered by the printable material when the component carrier is arranged in the material bed. Furthermore, the carrier body can be arranged in the material bed such that a surface of the carrier body, on which one part of the three-dimensionally printed structure is formed, is arranged at a defined distance from a surface of the material bed. Therefore, a desired thickness of the printable material can be applied between the surroundings and the surface of the carrier body. Afterwards, the applied printable material is solidified between the surface of the material bed and the carrier body. The solidification orConsolidation may be carried out by means of a treatment device which may be designed to apply thermal energy to the surface of the material bed.

[0063] According to another exemplary embodiment, the method further comprises moving the carrier body to form another layer of the at least one part of the three-dimensionally printed structure. After printing a layer of the one part of the three-dimensionally printed structure on / in the carrier body, the carrier body can be moved. In particular, the carrier body can be lowered by the thickness of the next layer of the one part of the three-dimensionally printed structure to be printed.

[0064] According to a further exemplary embodiment, the method comprises arranging the carrier body in a container. Furthermore, the three-dimensional printing comprises providing a solidifiable fluid material in the container and solidifying the fluid material by means of a treatment device, in particular a laser device, on and / or in the carrier body to form at least one layer of at least a part of the three-dimensionally printed structure. In particular, the fluid material is solidified after the carrier body has been arranged. An ultraviolet laser can be used for solidification. The laser is focused on the container containing the fluid material. The laser can be used to solidify desired regions of the fluid material in order to form a defined design of the one part of the three-dimensionally printed structure.The fluid material can be solidified, in particular cured, and forms a single layer of the desired one part of the three-dimensionally printed structure. These steps can be repeated for each layer of the one part to be printed. A lifting platform can be used to move the carrier body or surface onto which the one part is to be 3D printed. The lifting platform can be moved by a distance corresponding to the thickness of a single layer of the structure to be printed in the container. After solidification, a scraper or knife can be moved over the solidified layer and scrape off material to provide a homogeneous distribution of the fluid material for the next layer to be 3D printed. The laser then solidifies further desired regions of the fluid material to form the desired design of the one part of the three-dimensionally printed structure.These steps can be repeated until the desired 3D structure is obtained.

[0065] According to a further exemplary embodiment, the method further comprises moving the carrier body to form a further layer of the at least part of the three-dimensionally printed structure.

[0066] It should be noted that the embodiments described here represent only a limited selection of possible embodiments of the invention. It is thus possible to combine the features of individual embodiments in a suitable manner, so that a multitude of different embodiments can be regarded as obviously disclosed to a person skilled in the art with the embodiments explicitly described here. In particular, some embodiments of the invention are described with device claims and other embodiments of the invention with method claims. However, upon reading this application, it will immediately become clear to a person skilled in the art that, unless explicitly stated otherwise, in addition to a combination of features belonging to one type of subject matter of the invention, any combination of features belonging to different types of subject matter of the invention is also possible. Short description of the drawings

[0067] For further explanation and better understanding of the present invention, embodiments are described in more detail below with reference to the accompanying drawings. Fig. 1 shows a component carrier according to an exemplary embodiment of the invention. Fig. 2 shows a component carrier with an encapsulation according to an exemplary embodiment of the invention. Fig. 3 shows a component carrier with a surrounding component carrier region and a surrounded component carrier region according to an exemplary embodiment of the invention. Fig. 4 shows a component carrier with connecting elements according to an exemplary embodiment of the invention. Fig. 5 shows a connecting element on a component carrier according to an exemplary embodiment of the invention. Fig. 6shows a sliding contact on a component carrier according to an exemplary embodiment of the invention. Fig. 7 shows a cross section through a sliding contact on a component carrier according to an exemplary embodiment of the invention. Fig. 8 shows a further cross section through a sliding contact on a component carrier according to an exemplary embodiment of the invention. Fig. 9 shows a component carrier with an encapsulation according to an exemplary embodiment of the invention. Fig. 10 shows another view of the component carrier with the encapsulation according to an exemplary embodiment of the invention. Fig. 11 shows a component carrier with aluminum layers according to a comparative example not belonging to the invention. Fig. 12 shows a component carrier with 3D printed aluminum layers according to an exemplary embodiment of the invention. Fig. 13shows another view of the component carrier with 3D printed aluminum layers according to an exemplary embodiment of the invention. Fig. 14 shows a component carrier with damping elements according to an exemplary embodiment of the invention. Fig. 15 shows a component carrier with connecting elements according to an exemplary embodiment of the invention. Fig. 16 shows a component carrier with a reinforcement structure and / or a heat-conducting structure according to an exemplary embodiment of the invention. Fig. 17 shows a three-dimensional printing process according to an exemplary embodiment of the invention. Fig. 18 shows a component carrier with various three-dimensional printed structures according to an exemplary embodiment of the invention. Fig. 19 shows a component carrier with 3D printed glass fibers according to an exemplary embodiment of the invention. Fig. 20shows a component carrier with a threaded bushing according to an exemplary embodiment of the invention. Fig. 21 shows a component carrier with a threaded bushing and a fastening element according to an exemplary embodiment of the invention. Fig. 22 shows a component carrier with a three-dimensionally printed structure and another three-dimensionally printed structure according to an exemplary embodiment of the invention. Fig. 23 shows a component carrier with an optical element according to a comparative example not belonging to the invention. Fig. 24 shows a component carrier with a bridge according to an exemplary embodiment of the invention. Fig. 25 shows a component carrier with a bridge according to another exemplary embodiment of the invention. Fig. 26 shows a component carrier with a waveguide according to a comparative example not belonging to the invention. Fig. 27shows a component carrier with a three-dimensional printed structure formed as at least part of a component. Detailed description of exemplary embodiments

[0068] Identical or similar components in different figures are provided with the same reference numerals. The representations in the figures are schematic.

[0069] In the following with reference to Fig. 1A component carrier 100 is described, wherein the component carrier 100 has a carrier body 101. The carrier body 101 comprises a plurality of electrically conductive layer structures 104 and / or electrically insulating layer structures 103. At least a portion of the component carrier 100 is formed as a three-dimensionally printed structure. Thus, the three-dimensionally printed structure can partially form the electrically conductive layer structures 104. The three-dimensionally printed structure can be formed in the interior and / or on a surface of the carrier body 101. In Fig. 1 The three-dimensionally printed structure can be formed as an electrically conductive layer structure 104 on the surface of the carrier body 101. The three-dimensionally printed structure is formed along a stacking direction R of the plurality of layer structures.

[0070] As in Fig. 1As can be seen, the inner electrically conductive layer structures 104 are formed on an electrically insulating layer structure 103. Furthermore, the bottom layer is again formed from a layer of electrically conductive layer structures 104, so that the carrier body 101 consists of stacked layer structures 103, 104. Furthermore, the three-dimensionally printed structure can be formed perpendicular to a stacking direction R of the plurality of layer structures.

[0071] The component carrier 100 further comprises at least one component 105, in particular an electronic component 105, which is surface-mounted on and / or embedded in at least one of the plurality of electrically conductive layer structures 104 and / or electrically insulating layer structures 103. The component 105 is arranged directly on the carrier body 101 or fastened to the carrier body 101 by means of connecting elements 106. In Fig. 1the components 105 are arranged on the carrier body 101.

[0072] In the following with reference to Fig. 2A component carrier 100 is shown, wherein at least a part of the carrier body 101 is at least partially encapsulated by means of the three-dimensionally printed structure as encapsulation 207. The carrier body 101 has at least one side which is free of the encapsulation 207. Electrically conductive layer structures 104 are arranged on the side which is free of the encapsulation 207. These electrically conductive layer structures 104 are free of the encapsulation in order to establish electrical contacts with corresponding other components. The encapsulation 207 has a U-shape. Other shapes of the encapsulation 207 are also possible, such as an oval or a rounded shape. The encapsulation 207 is adapted accordingly to the shape of the component carrier 100.Furthermore, the encapsulation can have different cross-sections, both along a stacking direction and perpendicular to a stacking direction, in order to meet different requirements. For example, if the encapsulation is to be protected from external influences, such as heavy loads, a thicker cross-section is used than for an encapsulation 207 for light loads.

[0073] According to Fig. 2 At least one of the plurality of layer structures 103, 104 can be designed as a three-dimensional printed structure, wherein a further three-dimensional printed structure can be printed onto it. In Fig. 2 the encapsulation 207 is printed as a further three-dimensionally printed structure on the three-dimensionally printed structure of the copper layer 102 and at least one of the plurality of layer structures 103, 104.

[0074] In the following with reference to Fig. 3A component carrier 100 is shown, which has a surrounding component carrier region 101b and a surrounded component carrier region 101a, which is surrounded by the surrounding component carrier region 101b, wherein in particular at least a part of the surrounding component carrier region 101b and / or of the surrounded component carrier region 101a can be formed as a further three-dimensionally printed structure. In other words, the component carrier 100 can have two regions of carrier bodies 101a, 101b, wherein a first region of the carrier body 101a is an inner region and a second region of the carrier body 101b is an outer region, which surrounds the inner region of the carrier body 101a. The second region of the carrier body 101b (or the surrounding component carrier region 101b) has a recess 330, within which the first region of the carrier body 101a is formed.In particular, the first region of the carrier body 101a is printed three-dimensionally within the recess 330. On the other hand, it is also possible for the component carrier 100 to be printed three-dimensionally in a recess 330 of another component carrier 300. In this case, two different component carriers 100, 300 are thus present, which can be manufactured using 3D printing processes.

[0075] In the following with reference to Fig. 4A component carrier 100 is shown in which the three-dimensionally printed structure is at least partially formed as an electrically conductive connecting element 408, 409, 410, in particular as a connection pad 410, a pin 408, a socket, a micropin 408. A plurality of pins 408, which represent electrical contacts for components 105, are arranged on the carrier body 101. Furthermore, connection pads 410 or solder pads are arranged on the carrier body, to which components 105 can be directly attached and / or to which pins or other electrical conductors can be attached in order to connect the carrier body 101 to further electrical elements (such as electrical components or electrical devices).

[0076] In the following with reference to Fig. 5A component carrier 100 is shown on whose carrier body 101 a pin 408 has been printed three-dimensionally, with a solder deposit 510 being printed as a further three-dimensional printed structure on the pin 408. The pin 408 can thus be equipped with a corresponding solder deposit 510. Other electrical contacts, such as contacts, or solder pads, as in Fig. 4 shown can be printed with a solder deposit 510.

[0077] In the following with reference to Fig. 6The three-dimensionally printed structure is at least partially formed as an electrically conductive connecting element, in particular as a ring-shaped sliding contact 612. The sliding contact 612 establishes electrical connections between moving parts; for example, a current collector slides across a metal surface and taps off the electrical energy. By using a 3D-printed material for the sliding contact 612, materials, in particular metals and / or metal alloys, can be used that are resistant to chemical, mechanical, and thermal stress. Depending on the layer thickness selected for the sliding contact 612, a thick layer makes it less susceptible to mechanical abrasion than sliding contacts with a thin layer. Sliding contacts 612 with a thick layer thickness therefore also have a longer service life.

[0078] In the following with reference to Fig. 7a cross-section of a sliding contact 612 is shown. The sliding contact 612 consists of a material combination of three different materials, i.e. material A 713, material B 714 and material C 715. Material A 713 is a stable metal alloy against abrasion and is designed as a support ring for the sliding contact 612. Material B 714 is gold, which is electroplated onto material C 715 or printed onto material C 715 using 3D printing. Material B 714 serves as a tap for the electrical signal, with gold having good electrical conductivity, which improves signal transmission. Material C 715 is a carrier metal for the gold material, material C 715 is copper. In a sliding contact 612 with this type of structure, the mechanical load is predominantly applied to material A 714, so that little pressure (and little abrasion) acts on material B 714, so that material B 714 has a longer service life.Other materials or other metal alloys can also be used.

[0079] In the following with reference to Fig. 8 A cross-section of a sliding contact 612 is shown. This sliding contact 612 has a high layer thickness; the layer thickness of the sliding contact 612 can be effectively and directly adjusted using three-dimensional printing.

[0080] In the following with reference to Fig. 9 A component carrier 100 is shown, which has an encapsulation 207. An electrically conductive layer 104, which is designed as a conductor track, is arranged in the carrier body 101 of the component carrier 100. The encapsulation 207 surrounds at least one side of the component carrier 100.

[0081] In the following with reference to Fig. 10a component carrier 100 with a three-dimensional structure as encapsulation 207 is shown in another view. A cross section B through the component carrier 100 is shown from Fig. 9shown. The encapsulation 207 is formed on a surface of the carrier body 207 so that the encapsulation 207 can serve as surface protection. Beneath the encapsulation is the electrically conductive structure 104, which is protected from external influences by the encapsulation 207. The carrier body 101 can consist of a multilayer circuit board or a single-layer circuit board. The three-dimensionally printed structure thus forms a surface of the carrier body, whereby areas of the surface can differ in their hardness, roughness, and / or elasticity. Depending on which material is used for the three-dimensional structure (encapsulation 207), it can have different properties. A correspondingly roughened surface of the three-dimensional structure (the encapsulation 207) can ensure greater heat dissipation than a smooth surface.

[0082] In particular, one and the same surface can have different regions, which, for example, have different roughnesses. A region of the surface of the three-dimensional structure (encapsulation 207) arranged above an electrically conductive layer structure 104 can have a higher roughness than surrounding regions of the surface of the three-dimensional structure (the encapsulation 207) in order to dissipate heat produced by a high roughness from the electrically conductive layer structure 104. Furthermore, the surface of the three-dimensionally printed structure (the encapsulation 207) above the electrically conductive layer structure can have a different material to better protect the underlying structures from external mechanical influences.

[0083] In the following with reference to Fig. 11a component carrier 100 according to a comparative example not belonging to the invention is shown, which has aluminum layers 1116 on at least a part of the carrier body 101. In particular, in Fig. 11 Three areas of the carrier body 101 are covered by aluminum layers 1116. The aluminum layer 1116 is printed directly onto the carrier body 101. The various aluminum layers 1116 can have different layer thicknesses, so that each aluminum layer 1116 has a different thickness. The aluminum layer 1116 can be applied at any position on / in the carrier body 101.

[0084] In the following with reference to Fig. 12A component carrier 100 with three aluminum layers 1116 is shown, wherein the aluminum layers are each covered with a copper layer 102. Both the aluminum layer 1116 and the copper layer 102 can be produced using 3D printing. Since aluminum is difficult to solder, it is advantageous if conductive layers, such as the copper layers 102, are printed directly onto the aluminum. The copper layer 102 can have various shapes, such as a rectangular shape for forming a battery connection, or a round shape for forming a pin for electronic components. Furthermore, the copper layer 102 can completely cover the aluminum layer 1116 in order to provide large-area electrically conductive contacts.

[0085] In the following with reference to Fig. 131 shows a side view of the component carrier 100 with three aluminum layers 1116 and copper layers 102 applied thereto. It can be seen that two of the three aluminum layers 1116 are not completely covered by the copper layer 102, while one is completely covered by the copper layer 102.

[0086] In the following with reference to Fig. 14 The three-dimensionally printed structure is at least partially formed as an electrically conductive connecting element, in particular a spring contact. The spring contact can be printed directly onto the carrier body 101. In Fig. 14Two different springs 1417a, 1417b are shown, which differ in their shape. The springs 1417a, 1417b serve as flexible electrical contacts so that movements at the contacts 1417a, 1417b and / or at the component carrier 101 can be absorbed, and the spring contacts 1417a, 1417b are not impaired in their signal transmission by the movement. Furthermore, the three-dimensionally printed structure can be designed as a damping element, in particular as a spring 1417a, 1417b, wherein the damping element 1417a, 1417b is not electrically conductive, but merely serves as an element for absorbing mechanical vibrations.

[0087] In the following with reference to Fig. 15The three-dimensionally printed structure is depicted as a mechanical connecting element 1521, 1522, 1523, 1524, which is designed in particular as a snap connection 1523, a hook-and-loop connection 1522, a zipper connection 1521, a guide rail, and / or a guide pin 1524. The mechanical connecting element 1521, 1522, 1523, 1524 is configured to form a detachable connection. All of the above-mentioned connecting elements 1521, 1522, 1523, 1524 can be configured to provide electrically conductive connections. The hook-and-loop connection 1522 can, for example, be used to attach the carrier body 101 to corresponding hook-and-loop connections on textile elements. By means of the snap connection 1523 (or clamp connection), the component carrier 100 can be attached from one side to another component carrier 300.The mechanical connecting elements 1521, 1522, 1523, 1524 can be used to connect the component carrier 100 to another component carrier 300, so that at least mechanical and / or electrical connections can be established between two different component carriers 100, 300. The mechanical connecting elements 1521, 1522, 1523, 1524 can also be used to connect the component carrier 100 to another device, to attach it to a module, to connect it to an electronic component, or to insert it into a housing and releasably secure it.

[0088] In the following with reference to Fig. 16The three-dimensionally printed structure is represented as a reinforcement structure 1625, in particular a reinforcement structure of the electrically conductive layer structures and / or electrically insulating layer structures. Or represented as a heat-conducting structure 1629. A component 105 is arranged on the carrier body 101 and is enclosed by the heat-conducting structure 1629. The heat-conducting structure 1629 surrounds the component 105 on at least one side. It is also possible for the heat-conducting structure 1629 to completely enclose the component 105. The heat generated by the component 105 is dissipated by means of the heat-conducting structure 1629, so that the component 105 is protected from overheating and thus from damage. The heat-dissipating structure 1629 can be printed directly onto the carrier body 101 or printed into the carrier body 101.The copper layer 102, onto which components can be applied (printed), can also serve as a heat-dissipating structure. The heat-dissipating structure 1629 can have various shapes. In . Fig. 16 The heat-dissipating structure 1629 has a rectangular shape; an oval or round shape is also possible. Furthermore, the carrier body 101 has a recess 330. A three-dimensionally printed reinforcement 1625 is applied to at least one side of the recess 330 on the surface of the carrier body. The reinforcement 1625 increases the stability of the recess 330. The reinforcement 1625 can also be arranged around the component 105 in order to protect the component 105 from impacts from at least one side. The reinforcement 1625 in Fig. 16 has a rectangular shape, other shapes (round, oval, trapezoidal) are also applicable.

[0089] In the following with reference to Fig. 17A method for producing a component carrier 100 is shown, wherein at least a portion of the component carrier 100 is formed as a three-dimensional printed structure. A further component carrier 300 is shown, wherein the further component carrier 300 can be produced using the same manufacturing method. The component carrier 100 is printed directly onto and / or into the further component carrier 300. The further component carrier 300 provides a surface on / into which the component carrier 100 is formed by means of 3D printing. The further component carrier 300 has a recess 330 into which the component carrier 100 can be printed. A processing device, such as a print head 1727 (which can also be a material feed nozzle), has a printable material 1728.The printable material 1728 is dispensed by means of the print head 1727 so that it can form a three-dimensionally printed structure of the component carrier 100. Thus, the component carrier 100 is three-dimensionally printed on and / or in the further component carrier 300 using the printable material 1728. Furthermore, a treatment device 1734, such as a laser device, can be provided, which emits a laser beam for treating the printable material 1728. The printable material 1728, such as powder material, can thereby be melted or sintered to form a solidified three-dimensionally printed structure. It is also possible for the print head 1727 to function as an extruder, so that molten printable material 1728 is dispensed at a desired position, wherein the printable material 1728 can harden on its own.

[0090] In the following with reference to Fig. 18The three-dimensionally printed structure 1831, 1832, 1833 is shown in various variations. On the one hand, the three-dimensionally printed structure 1831 is designed as a connection pad (or solder pad). On the other hand, the three-dimensionally printed structure 1832 is designed as a pin. Furthermore, the three-dimensionally printed structure 1833 is designed as a conductive reinforcement structure.

[0091] The connection pads 1831 and / or pins 1832 are printed from copper. The three-dimensionally printed structure can also form the copper layer 102, which can function as an electrically conductive layer and / or as a heat-dissipating layer.

[0092] In the following with reference to Fig. 19The three-dimensionally printed structure is represented as an antenna structure 1942. The antenna structure 1942 is designed such that the antenna structure 1942 can be printed directly onto and / or into the carrier body 101. The antenna structure can be printed onto the carrier body 101 with different thicknesses, depending on the desired reception or transmission strength of the antenna structure 1942. The antenna structure 1942 is coupled to a component 105 so that the component 105 can serve as a transmitter and / or receiver of antenna signals. Furthermore, the component 105 can be designed as a sensor for measuring frequencies. The antenna structure 1942 is coupled to components 105, which are arranged on and / or in the carrier body 101. Furthermore, the three-dimensionally printed structure is designed as a reinforcement structure, in particular as a glass fiber 1940. The glass fibers 1940 are used to produce stiff areas on a flexible carrier body 101.The glass fibers 1940 can be arranged both directly on (i.e., over) components 105 and directly on the carrier body 101 in order to at least partially stiffen electrically conductive and / or electrically insulating layer structures.

[0093] In the following with reference to Fig. 20 A three-dimensionally printed structure is shown as a mechanical connecting element, in particular as a threaded bushing 106. The threaded bushing 106b can be provided with a thread or used without a thread 106a. The mechanical connecting element 106a, b is printed directly onto at least one of the plurality of layer structures of the carrier body 101.

[0094] In the following with reference to Fig. 21The three-dimensionally printed structure is represented as a mechanical connecting element 106a, b, in particular as a threaded bushing 106, wherein the mechanical connecting element 106a, b connects the component carrier 100 to another component carrier 300 by means of a fastening means 2141. The mechanical connecting element 106a, b can also connect the component carrier 100 to other devices or to a housing. Screws or bolts can be used as the fastening means 2141.

[0095] In the following with reference to Fig. 22A further three-dimensional structure 2253 is formed as a further part of the component carrier, wherein the three-dimensional structure 2252 and the further three-dimensional structure 2253 are made of different materials. In particular, the three-dimensional structure 2252 and the further three-dimensional structure 2253 are made of materials with different thermal conductivity and / or electrical conductivity. Furthermore, the one three-dimensionally printed structure 2252 has a higher thermal conductivity and / or electrical conductivity than the further three-dimensional structure 2253. The different thermal conductivity of the three-dimensionally printed structures 2252, 2253 is in Fig. 22marked with arrows 2251. The electrical conductivity is represented by an electrical signal 2250 running through the three-dimensionally printed structures 2252, 2253. Both the heat 2251 and the strength of the electrical signal 2250 vary in the corresponding three-dimensionally printed structures 2252, 2253. Furthermore, the three-dimensionally printed structure and / or the further three-dimensionally printed structure can be formed from electrically conductive materials, in particular aluminum with copper. Aluminum has a thermal conductivity lower than the thermal conductivity of copper, so that a three-dimensionally printed structure made of aluminum / copper is a good thermal conductor but worse than copper alone and is also an equally good electrical conductor. If the three-dimensionally printed structure 2252 and the further three-dimensionally printed structure 2253 are formed one above the other, they form a bimetallic element.

[0096] In the following with reference to Fig. 23 According to a comparative example not belonging to the invention, the three-dimensionally printed structure is formed as at least one element selected from the group consisting of an optical element, a light detector, a light emitter, a lens 2360, and a microlens. A recess 330 is created in the carrier body 101, within which a three-dimensionally printed lens 2360 is arranged. The lens 2360 is arranged above a component 105, wherein the component 105 is arranged within, preferably at the bottom of, the recess 330. The component 105 can be a light emitter or a light detector, which emits or detects corresponding light waves through the lens 2360. Furthermore, the lens 2360 can additionally have at least one piezo crystal 2361, which serves to focus the lens 2360.

[0097] In the following with reference to Fig. 24The three-dimensionally printed structure is represented as an electrical contact 2471, in particular a USB contact and / or a QFN contact. The electrical contact 2471 can be arranged on one side of the component carrier 100, so that contact with the electrical contact (USB contact) 2471 can be easily established, for example by means of a USB stick. Furthermore, the three-dimensionally printed structure can form the component 105, which component 105 is in particular an active or passive component. Furthermore, the three-dimensionally printed structure is designed as a break protection device 2470. The break protection device connects, for example, two different component carriers 100 and 300 to one another and can separate them if necessary. The break protection device 2470a can be attached to a surface of the component carriers 100, 300.Furthermore, the fracture protection device 2470b can also be formed on at least one of the plurality of layer structures of the respective component carriers 100, 300. The fracture protection device 2470 can be an electrically conductive layer structure of the component carriers 100, 300, so that an electrically conductive connection can be established.

[0098] Furthermore, the three-dimensionally printed structure can be designed as a rigid and / or flexible structure, so that the fracture protection device 2470 is either rigid and thus easy to break, or the fracture protection device 2470 has a certain flexibility and only breaks under a certain stress.

[0099] In the following with reference to Fig. 25A component carrier 100 is shown, the three-dimensionally printed structure being a break-protection device 2470. The break-protection device 2470 connects two components 105a and 105b on one and the same component carrier 100. The break-protection device can function as an electrical conductor, which breaks as a safety function, for example, if the voltage or current is too high.

[0100] In the following with reference to Fig. 26According to a comparative example not forming part of the invention, the three-dimensionally printed structure is represented as a waveguide 2680. The waveguide 2680 can be printed directly onto and / or into the component carrier 100. At least one component 105 is arranged on the waveguide 2680; preferably, a plurality of components 105 are arranged. The components 105 serve as sensors (detectors) to detect or monitor, for example, the path or intensity of the light waves within the guide.

[0101] In the following with reference to Fig. 27A component carrier is shown, wherein the three-dimensionally printed structure forms at least a part 2790a,b of a component 105. The three-dimensionally printed structure can be printed directly onto the component and thus form a part of the component 2790a. The three-dimensionally printed structure can serve for heat dissipation, e.g., as a heat sink with fins. Furthermore, the three-dimensionally printed structure can be formed as part of a component 2790b, which connects the component 105 to the carrier body 101 in order to form electrically conductive structures for signal transmission. Furthermore, the three-dimensionally printed structure can also completely form the component 105 itself.

[0102] Additionally, it should be noted that "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. Furthermore, it should be noted that features or steps described with reference to one of the above embodiments may also be used in combination with other features or steps of other embodiments described above. Reference signs in the claims are not to be considered as limitations. List of reference symbols:

[0103] 100, 300Component carrier 101, 301Carrier body 102Copper layer 103Electrically insulating layer 104Electrically conductive layer 105Component 106Connecting element 207Encapsulation 330Recess 408Pins 409Contacts 410Connection pads 511Solder deposit 612Sliding contact 713Material A 714Material B 715Material C 1116Aluminum layer 1417Damping element 1521Zipper elements 1522Velcro elements 1523Clamping elements 1524Anchor elements 1625Reinforcement 1626Recess 1629Thermally conductive structure 1727Print head 1728Printable material 1734Treatment device 1831, 1832, 1833 three-dimensional printed structure 1940 optical fiber 1942 antenna structure 2141 fastener 2250 electrical signal 2251 heat 2252 three-dimensional printed structure 2253 another three-dimensional printed structure 2360 lens 2361 piezoelectric crystal 2470 bridge 2471 electrical contact 2680 waveguide 2790 part of a component RStacking direction

Claims

1. A component carrier (100, 300), wherein the component carrier (100, 300) comprises: a carrier body (101, 301) comprising a plurality of electrically conductive layer structures (104) and / or electrically insulating layer structures (103); wherein at least a part of the component carrier (100, 300) is configured as a three-dimensionally printed structure (1831, 1832, 1833, 2252), characterized in that at least one of the plurality of electrically conductive layer structures (104) comprises at least one of the group consisting of aluminum, nickel, silver, gold, palladium, and tungsten; the three-dimensionally printed structure (1831, 1832, 1833, 2252) comprises copper and is printed on the at least one of the plurality of electrically conductive layer structures (104) comprising at least one of the group consisting of aluminum, nickel, silver, gold, palladium, and tungsten; and the three-dimensionally printed structure (1831, 1832, 1833, 2252) is formed by at least one of a group consisting of selective laser melting, selective laser sintering, and electron beam melting.

2. The component carrier (100, 300) according to claim 1, wherein the three-dimensionally printed structure (1831, 1832, 1833, 2252) is one of: a pin, a micropin, a socket, an annular sliding contact, a threaded socket, a hook and loop connection, a zipper connection, a bimetal, an anti-break, a USB contact, a QFN contact, a magnetic sensor, a lens, a microlens, a waveguide, an energy harvesting unit, an optoelectric converter, a voltage converter, a cryptographic component, an accumulator, or a camera.

3. The component carrier (100, 300) according to one of the preceding claims, wherein the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured according to one of the following embodiments: 3.i) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is formed inside and / or on a surface of the carrier body (101, 301); 3.ii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is formed along a stacking direction (R) of the plurality of layer structures; 3.iii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is formed perpendicular to a stacking direction (R) of the plurality of layer structures; wherein in embodiment 3.iii) preferably the three-dimensionally printed structure (1831, 1832, 1833, 2252) has different cross-sectional areas, further in particular in a stacking direction (R) of the plurality of layer structures and / or perpendicular to a stacking direction (R) of the plurality of layer structures.

4. The component carrier (100, 300) according to one of the preceding claims, wherein the component carrier comprises a surrounding component carrier region and a surrounded component carrier region which is surrounded by the surrounding component carrier region, wherein in particular at least a part of the surrounding component carrier region and / or of the surrounded component carrier region can be configured as a further three-dimensionally printed structure (2253).

5. The component carrier (100, 300) according to one of the preceding claims, wherein the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured according to one of the following embodiments: 5.i) the three-dimensionally printed structure (1831, 1832, 1833, 2252) at least partially forms the electrically conductive layer structures (104) and / or electrically insulating layer structures (103); 5.ii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured as a rigid and / or flexible structure.

6. The component carrier (100, 300) according to one of the preceding claims, wherein the component carrier (100, 300) is configured according to one of the following embodiments: 6.i) the carrier body (101, 301) has a recess (330, 1626), wherein the three-dimensionally printed structure (1831, 1832, 1833, 2252) is printed within the recess (330, 1626); 6.ii) at least a part of the carrier body (101, 301) is at least partially encapsulated by means of the three-dimensionally printed structure (1831, 1832, 1833, 2252) as an encapsulant (207), wherein the encapsulant (207) is a steel and / or titanium encapsulant.

7. The component carrier (100, 300) according to one of the preceding claims, wherein the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured according to one of the following embodiments: 7.i) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is at least partially configured as an electrically conductive connecting element (106), in particular as a connection pad (410), a pin (408), a socket, a micropin, an, in particular annular, sliding contact (612), and / or a spring contact; wherein in embodiment 7i) preferably a solder deposit (511) can be applied to the conductive connecting element (106), in particular as a three-dimensionally printed structure (1831, 1832, 1833, 2252); 7.ii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured as a damping element, in particular as a spring (1417a, 1417b); 7.iii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured as a mechanical connecting element (106), in particular a threaded socket (106), a snap connection (1523), a hook and loop connection (1522, 1523), a zipper connection (1521), a guide rail, and / or a guide pin (1524); wherein in embodiment 7.iii) preferably the mechanical connecting element (106) is configured to form a releasable connection; 7.iv) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is a thermally conductive structure (1629); 7.v) the three-dimensionally printed structure (1831, 1832, 1833, 2252) comprises at least one material component selected from the group consisting of copper, aluminum, steel, titanium, metal alloy, plastic, and photoresist; 7.vi) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is an antenna structure (1942), wherein in embodiment 7.vi) preferably the antenna structure (1942) is configured such that the antenna structure (1942) can be printed directly onto and / or into the carrier body (101, 301); 7.vii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) forms a reinforcement structure, in particular a reinforcement structure (1625) of the electrically conductive layer structures (104) and / or electrically insulating layer structures (103); 7.viii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) forms a surface of the carrier body (101, 301), wherein regions of the surface differ in their hardness, roughness and / or elasticity; wherein in embodiment 7.ii) preferably at least one region of the three-dimensionally printed structure (1831, 1832, 1833, 2252) is formed from steel and / or titanium; and / or wherein in embodiment 7.ii) preferably the three-dimensionally printed structure (1831, 1832, 1833, 2252) forms at least one part of a component.

8. The component carrier (100, 300) according to one of the preceding claims, wherein the component carrier (100, 300) is configured according to one of the following embodiments: 8.i) the component carrier (100, 300) further comprises a component, in particular an electronic component, surface-mounted to and / or embedded in at least one of the plurality of electrically conductive layer structures (104) and / or electrically insulating layer structures (103); wherein preferably in embodiment 8.i) the component is selected from a group consisting of an electronic component, an electrically non-conductive and / or electrically conductive inlay, a heat transfer unit, a light guiding element, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a data storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectric converter, a voltage converter, a cryptographic component, a transmitting and / or receiving unit, an electromechanical converter, an actuator, a microelectromechanical system, a microprocessor, a capacitance, a resistor, an inductance, an accumulator, a switch, a camera, an antenna (1942), a magnetic element, a further component carrier (100, 300), and a logic chip; 8.ii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured such that a further three-dimensionally printed structure (2253) can be printed thereon; 8.iii) a further part of the component carrier (100, 300) is configured as a further three-dimensionally printed structure (2253), wherein the three-dimensionally printed structure (1831, 1832, 1833, 2252) and the further three-dimensionally printed structure (2253) consist of different materials; wherein preferably in embodiment 8.iii): 8.iii.1) the one three-dimensionally printed structure (1831, 1832, 1833, 2252) comprises a higher thermal conductivity (1629) and / or current conductivity than the further three-dimensionally printed structure (2253), or 8.iii.2) the three-dimensionally printed structure (1831, 1832, 1833, 2252) and / or the further three-dimensionally printed structure (2253) is configured from an electrically conductive material, in particular aluminum, and / or wherein preferably in embodiment 8.iii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) and the further three-dimensionally printed structure (2253) are configured one above the other for forming a bimetallic element.

9. The component carrier (100, 300) according to one of the preceding claims, wherein the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured according to one of the following embodiments: 9.i) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured as at least one of a group consisting of an active or passive electronic component, a resistor, a capacitor, a coil, an electrical contact (409, 2471), an anti-break, a USB contact, and a QFN contact; 9.ii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured as at least one of a group consisting of a sensor, an actuator, a magnetic sensor, EMC shielding, and a microelectromechanical system; 9.iii) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured as at least one element selected from the group consisting of an optical element, a light detector, a light emitter, a lens (2360), a microlens, a waveguide (2680); 9.iv) the three-dimensionally printed structure (1831, 1832, 1833, 2252) is configured as at least one element selected from the group consisting of a microphone, a speaker, and a Helmholtz horn.

10. The component carrier (100, 300) according to one of the preceding claims, wherein the component carrier (100, 300) is configured according to one of the following embodiments: 10.i) at least one of the plurality of electrically conductive layer structures (104) comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, wherein one of said materials is optionally coated with highly conductive material such as graphene; and / or 10.ii) at least one of the plurality of electrically insulating layer structures (103) comprises at least one of the group consisting of resin, in particular reinforced or non-reinforced resin, for example epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivatives, glass, prepreg material, polyimide, polyamide, liquid crystalline polymer, epoxy-based construction film, polytetrafluoroethylene, a ceramic, and a metal oxide; 10.iii) the component carrier (100, 300) is formed as a board; 10.iv) the component carrier (100, 300) is configured as one of the group consisting of a printed circuit board and a substrate; 10.v) the component carrier (100, 300) is configured as a laminate type component carrier (100, 300).

11. The component carrier (100, 300) according to claim 1, wherein the three-dimensionally printed structure (1831, 1832, 1833, 2252) is at least partially configured as an electrically conductive connecting element (106), in particular as a connection pad (410), a pin (408), or a micropin; and a solder deposit (511) is applied to the conductive connecting element (106) as a further three-dimensionally printed structure (1831, 1832, 1833, 2252).

12. The component carrier (100, 300) according to claim 1, wherein the at least one of the plurality of electrically conductive layer structures (104) comprising at least one of the group consisting of aluminum, nickel, silver, gold, palladium, and tungsten is a further three-dimensionally printed structure (1116).

13. A method for producing a component carrier (100, 300) according to one of the preceding claims, wherein the method comprises: connecting a plurality of electrically conductive layer structures (104) and / or electrically insulating layer structures (103) to form a carrier body (101, 301); forming at least one part of the component carrier (100, 300) as a three-dimensionally printed structure (1831, 1832, 1833, 2252) by means of three-dimensionally printing; wherein the three-dimensionally printed structure (1831, 1832, 1833, 2252) is formed by at least one of a group consisting of selective laser melting, selective laser sintering, and electron beam melting.

14. The method according to claim 13, wherein the three-dimensionally printing comprises: introducing a printable material into a processing device, melting the printable material in the processing device, feeding the melted printable material onto and / or into the carrier body (101, 301) for forming at least one layer of at least a part of the three-dimensionally printed structure (1831, 1832, 1833, 2252); and / or applying a printable material, in particular a powdery material, onto and / or into the carrier body (101, 301), solidifying the applied printable material for forming at least one layer of at least a part of the three-dimensionally printed structure (1831, 1832, 1833, 2252); wherein further preferably one of the following embodiments is implemented: 14.i) before the solidifying of the printable material, the printable material is melted by means of a thermal treatment device, in particular a laser device, and / or 14.ii) the printable material is applied by means of a material feed nozzle, wherein in the embodiment 14.ii) more preferably the method further comprises moving the material feed nozzle for forming a further layer of the at least one part of the three-dimensionally printed structure (1831, 1832, 1833, 2252); or 14.iii) the carrier body (101, 301) is provided in a material bed before the printable material is fed to the carrier body (101, 301); wherein in the embodiments 14.i) to 14.iii) more preferably the method further comprises moving the carrier body (101, 301) for forming a further layer of the at least one part of the three-dimensionally printed structure.

15. The method according to claim 13, wherein the method comprises arranging the carrier body (101, 301) in a container, wherein the three-dimensionally printing comprises: providing a solidifiable fluid material in the container, solidifying the fluid material by means of a treatment device, in particular a laser device, onto and / or in the carrier body (101, 301) for forming at least one layer of at least a part of the three-dimensionally printed structure (1831, 1832, 1833, 2252); wherein in particular the method further comprises moving the carrier body (101, 301) for forming a further layer of the at least one part of the three-dimensionally printed structure (1831, 1832, 1833, 2252).