METHOD FOR PRODUCE A VALUE OR SECURITY DOCUMENT BLANK WITH AN ELECTRONIC CIRCUIT, A VALUE OR SECURITY DOCUMENT BLANK AND A SECURITY AND VALUE DOCUMENT

Description

[0001] The invention relates to a method for producing a value or security document blank with an electronic circuit, a value or security document blank, and a security and value document based on such a value or security document blank. In particular, the invention relates to a method for producing a value or security document blank with at least one (integrated) biometric sensor, a security controller, and at least one visual feedback element.

[0002] Valuable or security documents are used, for example, to identify persons and / or objects and / or for cashless payment transactions. They have, among other things, visually recognizable features that clearly identify them to a person and / or object and / or a cash or securities account, and that allow only the document holder to identify themselves or to dispose of the object or account and, for example, to initiate money transfers. For this reason, these documents must be protected against misuse. For this purpose, they can, for example, have a fingerprint sensor that the user can use to authenticate themselves when using the card, as well as visual feedback elements, such as a display device.

[0003] ID documents are typically made of plastic materials to ensure their necessary flexibility. Valuable or security documents are frequently produced by laminating a plurality of partially graphically designed polymer films, such as polycarbonate films, in a hot / cold laminating press in a multi-sheet format or in a continuous laminating process with several heating and cooling press stations arranged one behind the other. Electronic components contained in the documents are typically mounted on a circuit carrier layer, which is bonded to other document layers to form the laminate. The components can be mounted on just one side of the circuit carrier layer or on both sides. The components are electrically connected to one another via conductor tracks.

[0004] For example, DE 10 2013 102 003 A1 discloses a chip card module that can be used as a component of a chip card. The module comprises a chip card module carrier, for example, made of FR4 material. A wiring structure, an integrated circuit, and a chip card module antenna are arranged on the carrier, with the integrated circuit and the antenna being electrically coupled to the wiring structure. A lighting device is arranged on the carrier and electrically coupled to the wiring structure.

[0005] DE 10 2012 223 472 A1 further describes a valuable and / or security document having an antenna structure. To produce the document, the antenna structure is applied to a carrier body, which can be formed as a plastic layer, for example, made of polyimide. Furthermore, an electronic component, for example, a semiconductor component, can also be arranged on the carrier body. Furthermore, submodules can also be used as chip carriers based on flexible printed circuit boards (Interposa), for example, made of polyimide or FR4.

[0006] DE 10 2014 204 552 A1 describes a display module that can be integrated into a blank of a valuable or security document. The display module comprises a carrier and at least one circuit arranged thereon. The circuit is formed by at least one antenna conductor track and at least one display element electrically connected to the at least one antenna conductor track. FR4 is mentioned as a substrate material for the carrier for the antenna conductor track.

[0007] DE 10 2009 060 862 discloses a method for laminating film layers, in which a carrier film layer equipped with an electronic component, a flow film layer, and a compensating film layer are stacked and laminated together to form a film laminate. It is stated that the film layers are preferably made of thermoplastic. Typical materials from which the film layers are made are polycarbonate, polyvinyl chloride, polyesters, for example, PET, polyolefins, for example, PE and PP, acrylonitrile-butadiene-styrene copolymer, polyurethane, and polyetheretherketone.

[0008] DE 25 12 085 B2 describes a mixture of an epoxy resin with a bismaleimide / triazine resin.

[0009] To improve the stability of documents with integrated electronic circuits, a security or valuable document is also known from DE 10 2015 222 364 A1. To protect the electronic circuitry during use of the valuable or security document and to ensure that the electronic components and their electrical connections on a circuit carrier are sufficiently protected against mechanical damage, the document layers forming the valuable or security document are made of a fiber composite material. However, the use of fiber composite materials in forming the document layers of the valuable or security document leads to increased complexity in the production of the valuable or security document and, consequently, to increased manufacturing costs.

[0010] WO 2007 / 031050 A1 discloses a chip module for producing contactless chip cards, comprising a chip carrier provided with inner and outer contacts on a substrate. The inner contacts are contacted with connection pads of a chip unit arranged on the chip carrier, and the outer contacts are used for contacting an antenna. The chip unit is sandwiched between the substrate and a fiber-reinforced cover layer, such that the cover layer is connected to the substrate adjacent to at least two opposite side edges of the chip unit. Furthermore, a method for producing a chip module is known. The independent device claim is delimited by this document.

[0011] Therefore, the object of the present invention is to create a value or security document blank with an electronic circuit for a value or security document, in which the electronic circuit is protected against mechanical damage, but at the same time the cost of production is reduced. Definitions

[0012] Where the term 'value or security document' is used in the description and claims of this application, this shall be understood to mean, for example, an identity card, driving license, access control card or other ID document, such as an ID card, vehicle registration document, check, bank, credit or cash payment card, customer card, health card, company ID card, proof of entitlement, membership card, gift or shopping voucher or other proof of entitlement or another value or security document.

[0013] The valuable or security document is characterized by the fact that it contains authenticating information, for example information about the person or object to which the document is assigned, or information with which its authenticity can be verified. For example, the valuable or security document can have at least one imprint that is visible without optical aids or is exclusively machine-readable, which is personalizing for the person to whom the document is assigned or which attests to the authenticity of the document. Alternatively or additionally, individualizing data can also be contained in an electronic data storage device in the document. Or the document can have at least one other security element that is readable by optical means and / or a tactile security element that allows the document to be clearly assigned to a person or to prove its authenticity.

[0014] Where the term 'electronic component' is used in the description and claims of this application, this refers to any active or passive electronic component, in particular a semiconductor component, which may also be referred to below as 'IC' or 'chip'. A semiconductor component, IC, or chip is understood to mean, for example, an unhoused semiconductor chip (bare die) or a housed semiconductor chip, for example in the form of a surface mount device (SMD), a chip scale package (CSP), or one of the following designs: DIP, TQFP, MLF, SOTP, SOT, PLCC, QFN, SSOT, BGA, MOB, or a chip module. If the chip is unhoused, it may be inserted in a thinned form.

[0015] Where the terms "individualizing", "individualized", "personalizing" and "personalized" are used in the description and claims of this application, they are to be understood as meaning that the valuable or security document to which the term refers is different from other valuable or security documents and that this valuable or security document is assigned to an entity (in the case of the terms "individualizing" or "individualized"), in particular to a person (in the case of the terms "personalizing" or "personalized"). Instead of a person, the valuable or security document can also be assigned to an object, such as a motor vehicle, a sales product (in this case the valuable or security document is, for example, packaging or a tag, label, pendant, sticker or the product itself) or a security. Through individualization orPersonalization allows a third party to recognize the unique assignment of the value or security document to the entity or groups of identical or similar entities.

[0016] Where the terms "lamination" and "lamination" are used in the description and claims of this application, they refer to the surface bonding of two layers under the influence of pressure and heat, whereby no adhesive material is used between the two layers to be joined. During lamination, a monolithic bond is formed between the layers due to the softening or liquefaction of the layer materials, meaning that an interface is not discernible after lamination. Basic features of the invention and preferred embodiments

[0017] The technical problem is solved according to the invention by a method having the features of patent claim 1 and a value or security document blank having the features of patent claim 2. Advantageous embodiments of the invention emerge from the subclaims.

[0018] The basic idea of ​​the invention is to create a highly integrated and robust compact module in which the electronic circuit is housed and to incorporate this module into a conventional mobile token. According to the invention, the compact module comprises a first document layer in the form of a circuit carrier layer carrying the electronic circuit and at least one second document layer. The first document layer and the at least one second document layer are formed from a fiber composite material. The first document layer and the at least one second document layer are arranged in a stack. The document layers are permanently joined, in particular laminated, to form the compact module, so that the compact module is sufficiently protected against mechanical stress. The compact module is arranged in a recess provided for this purpose in the mobile token that complements the shape of the compact module and is connected to the token.The mobile token and the compact module arranged within it form the value or security document blank.

[0019] For the production of the value or security document blank according to the invention, in particular a method for producing a value or security document blank with an electronic circuit is provided, comprising the following steps: (a) Providing a mobile token, (b) Manufacturing a compact module, comprising the following sub-steps: (b1) Providing a first document layer in the form of a circuit carrier layer carrying the electronic circuit and at least one second document layer, wherein the first document layer and the at least one second document layer are formed from a fiber composite material, (b2) Stacking the document layers, (b3) Permanently joining the first document layer and the at least one second document layer to form a compact module, (c) Forming a recess complementary to the compact module on an outer side of the mobile token, (d) Arranging the compact module in the recess in the mobile token and connecting it to the mobile token.

[0020] Furthermore, in particular, a value or security document blank with an electronic circuit is created, comprising: a mobile token, a compact module, wherein the compact module comprises a first document layer in the form of a circuit carrier layer carrying the electronic circuit and at least one second document layer, wherein the first document layer and the at least one second document layer are formed from a fiber composite material, wherein the first document layer and the at least one second document layer are arranged in a stacked manner and wherein the first document layer and the at least one second document layer are non-detachably joined to form the compact module; and wherein the compact module is arranged in a recess complementary to the compact module on an outer side of the mobile token and is connected to the mobile token.

[0021] The advantage of the value or security document blank according to the invention and the associated manufacturing method is that the mobile token no longer needs to be manufactured from a fiber composite material. Only the compact module with the integrated electronic circuit needs to be manufactured and reinforced using a fiber composite material. This allows for savings in manufacturing effort and costs, despite ensuring the stability of the electronic circuit, since there are significantly fewer areas that are or will be manufactured from fiber composite materials.

[0022] A circuit carrier layer carries or comprises several separately housed electronic components as well as conductor tracks connecting the components. The electronic components form, in particular, a logic circuit. The electronic components can be both passive and active. In particular, the electronic components are distributed over a surface, in particular the entire surface, of the circuit carrier layer. The electronic components and conductor tracks can be arranged either on a top side or on a bottom side of the circuit carrier layer.

[0023] The electronic circuitry of the security or security document blank is designed to store individualized data. This enables exceptionally high data security, as enrollment takes place on the security or security document blank, and the data is only recorded, securely stored, and verified in the security or security document blank or the finished security or security document. Therefore, sensitive data never leaves the document.

[0024] In particular, it can be provided that a value or security document blank produced using the described method is subsequently customized. For example, authenticating information can be printed, lasered, or exposed. In particular, authenticating information can be incorporated into a memory of the electronic circuit. This customization creates a value or security document.

[0025] Thus, a value or security document is further created, comprising a value or security document blank according to the invention, wherein the value or security document blank is individualized to form the value or security document.

[0026] The fiber composite material used to form the compact module is preferably non-fusible. In this context, this means that the material cannot melt without decomposition. Therefore, the material cannot transition to a liquid state without changing its chemical composition, even though it may exhibit a glass transition temperature at which the material transforms from a brittle glass state to a soft, rubbery state. During production, a lamination process is used in which the layer components are temporarily liquefied. However, a chemical reaction (polymerization) causes the material to solidify (harden) and is therefore subsequently no longer fusible.

[0027] The fiber composite material can therefore be formed, in particular, with a non-thermoplastic, preferably with a thermosetting, matrix material, most preferably a polymer material. The polymer material can be produced, for example, on the basis of a bifunctional or higher-functional epoxy resin, in particular based on bisphenol A, or a mixture of an epoxy resin with a bismaleimide / triazine resin. The latter is described, for example, in DE 25 12 085 B2. Alternatively, a phenolic resin, including novolak-type phenolic resin, can also be provided in the form of polyimide or a fluorinated polymer, such as a polymer of tetrafluoroethylene, known, for example, under the name Teflon® (trademark of DuPont, USA).

[0028] The fiber material of the fiber composite material is preferably formed from glass fibers. Alternatively, fibers made of other materials, such as quartz, aramid, carbon (carbon fibers, for example, carbon fiber-reinforced plastic (CFRP)), stretched polymer fibers, for example, polyester fibers, and the like, can also be used. The fibers can be contained in the composite material in a random form, for example by impregnating a fiber felt together with the matrix material and curing the latter. Alternatively, the fibers can also be added to the matrix material in individual form before the matrix material is cured. Advantageously, the fibers in the matrix material are present in the form of a woven fabric, for example in the form of woven mats, in particular glass woven mats, which are impregnated with the matrix material before the matrix material is cured.Such glass fabric mats impregnated with prepolymerized epoxy resin material are known as prepregs.

[0029] In a preferred embodiment of the present invention, the fiber composite material of the first and the at least one second and optionally further document layers of the compact module is formed from a thermoset reinforced with glass fiber fabric, for example, based on an epoxy resin. Such materials are extremely resistant to chemical, mechanical, and thermal influences due to their properties. Furthermore, these materials also have excellent electrical properties, which are particularly suitable for use as valuable or security documents with an electrical circuit. In particular, the mechanical stability, for example, dimensional stability against bending stress, is outstanding with such materials due to the combination of a non-meltable material by selecting a thermoset and the embedding of a glass fiber fabric in the polymer material.

[0030] FR4, FR5, and FR5 / BT are particularly preferred materials. FR4 is made from fiberglass mats impregnated with bifunctional epoxy resin and is flame-retardant due to the bromination of the resin. FR5 differs from this in that it uses more highly functional epoxy resins (tetra-, multifunctional resins). FR5 / BT material also contains bimaleimide / triazine resin. The T g points (glass transition temperatures) of these materials increase in the range T g (FR4) < T g (FR5) < T g (FR5 / BT). Higher thermal resistance can be achieved by using FR5 or even FR5 / BT.

[0031] The recess on the outside of the mobile token, complementary to the compact module, is formed, for example, by milling. For this purpose, the complementary recess is milled out following the joining step, particularly lamination, using a card milling process, for example. The module is then inserted into the mobile token using chip implantation.

[0032] The advantage is that the method according to the invention and the value or security document blank according to the invention can be integrated into existing process chains, since known and established production techniques and stages can be used.

[0033] Preferably, process steps (b1) to (b3) for producing the compact module are carried out for several compact modules simultaneously by producing a multiple-panel assembly. In contrast to the production of valuable or security documents made entirely of fiber composite materials, the number of compact modules produced from such a multiple-panel assembly can be significantly increased. For example, a typical number of 16 valuable or security documents on a multiple-panel assembly is offset by approximately 100 compact modules on the same multiple-panel assembly. Each of the approximately 100 compact modules can then be incorporated into a cost-effective mobile token manufactured without the complex use of fiber composite materials. The manufacturing effort is thus significantly reduced. This, in turn, can save costs.

[0034] In one embodiment, the value or security document blank comprises at least a third document layer made of a fiber composite material, wherein the first document layer is or will be arranged between the at least one second and the at least one third document layer. This allows for improved protection of the first document layer, i.e., the circuit carrier layer, and electronic components arranged thereon against mechanical influences. In particular, if both a top side and a bottom side of the first document layer, i.e., the circuit carrier layer, carry electronic components, the electronic components can be protected on both sides. The arrangement takes place, for example, within the scope of method step (b2).

[0035] In one embodiment, it is provided that a layer thickness of the at least one second document layer and / or a layer thickness of the at least one third document layer is or will be selected such that, after joining, it corresponds to a dimension of a distinguished electronic component on the respectively relevant side of the first document layer plus 30%, preferably 20%, particularly preferably 10%. The dimension is measured in particular in the direction of a layer sequence of the document layers. The distinguished electronic component is in particular an electronic component to be covered by means of the second or the third document layer with the greatest extent in the direction of the layer sequence.This allows for an optimal combination of good mechanical protection of the components, good mechanical strength of the compact module and low thickness of the document layers and the compact module.

[0036] In a preferred embodiment, the electronic circuit of the compact module comprises at least one biometric sensor, a security controller, and at least one visual feedback element. The biometric sensor can, for example, be a sensor for detecting a user's fingerprint. The security controller protects complex circuits against manipulation, enabling the execution of cryptographic operations, and providing secure data storage and processing functions. This enables the security controller to withstand physical and logical attacks. The feedback element serves to provide a user with visual feedback as to whether a specific function, for example, authentication using the biometric sensor, was successfully performed or not. The feedback element can also prompt the user to perform an action, e.g.to put your finger on.

[0037] A typical application for a valuable or security document created through customization based on such a valuable or security document blank is described below. A user wants to authenticate themselves using the valuable or security document, for example, to gain access to a secure area in a building. Authentication is performed using two-factor authentication. To gain access to the secure area, the user must have both the valuable or security document, for example, in the form of a document card (first factor), and the correct fingerprint (second factor).At the checkpoint, the user holds the valuable or security document to a designated reader, which uses wireless communication (RFID) to power the electronic circuit in the compact module of the valuable or security document and establishes data communication with the security controller, for example, via a dedicated antenna in the mobile token. The reader detects that the personalized valuable or security document is present and thus determines the presence of the first factor. The corresponding fingerprint must now be queried. This is signaled, for example, by corresponding feedback via the visual feedback element. The user now knows that they must place their finger on the biometric sensor, in this case a fingerprint sensor.Once this has been done, the fingerprint sensor captures the fingerprint and transmits the result, preferably encrypted, to the reader. The capture and successful completion of the capture are also signaled via the visual feedback element. The reader verifies the fingerprint as a second factor. If the combination of the first and second factors matches, the user is granted access to the secured area of ​​the building; otherwise, access is denied.

[0038] In some embodiments, it may be provided that the at least one biometric sensor is arranged only after the compact module has been formed and connected to the remaining elements of the electronic circuit. For this purpose, the compact module may have a sensor recess. This sensor recess may, for example, be milled or can be milled.

[0039] Using the compact module, a contactless, battery-free function according to ISO 14443 or NFC can be realized.

[0040] In one embodiment, a document card made of plastic material is used as the mobile token, or the mobile token is a document card made of plastic material. The document card can, in particular, be a smart card. The document card can be in ID-1, ID-2, ID-3, ID-T format, or any other standardized or non-standardized format, for example, in card form. Reference is made to the relevant standard ISO / IEC 7810 in the version valid on the filing date. The document format is preferably ID-1. The valuable or security document should meet the standardized requirements, for example ISO 10373, ISO / IEC 7810, ISO 14443, and, if applicable, the ISO / DIS 18328-2 standard, which is still in draft form, in the versions valid on the filing date.

[0041] It may be provided that an internal contact interface in accordance with ISO 7816 is connected to the compact module, thus enabling use as a bank card.

[0042] In another embodiment, a ring is used as the mobile token, or the mobile token is a ring. This can, for example, be a ring for a finger that is worn on a hand and into which the compact module is or is integrated.

[0043] In other embodiments, other mobile tokens may also be used, such as key chains, necklaces, bracelets, brooches, etc.

[0044] In some embodiments, the mobile token comprises an antenna, wherein the antenna is connected to the electronic circuit via electrical contacts provided for this purpose. The antenna can be manufactured using printing technology, wire-laying technology, etching technology, grinding technology, or other known methods.

[0045] The manufacturing process provides for the antenna to be connected to the electronic circuit during the placement of the compact module in the recess of the mobile token.

[0046] In one embodiment, the antenna is connected to the electronic circuit via dedicated electrical contacts. For example, two contacts for contacting the antenna are provided on the underside of the compact module. Complementary antenna contacts are located on the upper side within the recess in the mobile token. The contacts are connected to each other by arranging the compact module in the recess in the mobile token. The electrical connection of the contacts can be achieved by soldering, welding, crimping, or using conductive adhesives.

[0047] In an alternative embodiment, however, it is provided that the antenna is or will be connected to the electronic circuit via inductive coupling elements provided for this purpose. For this purpose, both the electronic circuit in the compact module and the antenna comprise inductive coupling elements. One of these coupling elements is located, for example, in the region of the recess of the mobile token. Another inductive coupling element is correspondingly located in the compact module, so that the coupling elements are arranged adjacent to one another when the compact module is or is arranged in the recess. After arrangement, there is an inductive coupling between the antenna in the mobile token and the electronic circuit without the need for galvanic contact.This allows for simplified arrangement of the compact module in the complementary recess in the mobile token, especially since electrical contacts need to be formed. This reduces manufacturing effort and thus saves costs. The antenna in the mobile token can then serve, for example, as a booster antenna.

[0048] In other embodiments, the electronic circuit in the compact module may include an antenna. In this case, no further contacting is required.

[0049] The antenna in the value or security document blank can be used to wirelessly supply power to the electronic circuit as well as to exchange data with a transmitting and receiving station located outside the value or security document blank or the value or security document.

[0050] In a preferred embodiment, the compact module is formed into a T-shape or has a T-shape. The T-shape means that the compact module has a smaller extension on the side facing the mobile token over a certain material thickness than on the side facing away from the mobile token, so that a T-like shape is present in cross-section. The T-shape can in particular be circumferential, i.e. the compact module has a circumferential shoulder or a mushroom-like shape. This shape is advantageous for several reasons: firstly, it facilitates the precise arrangement of the compact module because a correspondingly complementary recess exists in the mobile token and the compact module is automatically arranged in the correct position during arrangement.Second, electrical contacts can be arranged on the underside of a projection of the compact module, which can be brought into contact with complementary contacts on the upper side of the recess of the mobile token. This makes it possible, for example, to provide areas exclusively intended for forming an electrical contact and other areas serving as a mechanical connection.

[0051] In a further embodiment, the T-shape is created by milling out corresponding recesses after the permanent joining to form the compact module. The compact module, which after the permanent joining takes the form of a rectangular cuboid, for example, is brought into its final shape by milling away areas where the recesses are to be located. This particularly enables mass production, as a large number of compact modules can first be manufactured together, for example in a multiple-use assembly, and then separated. The separated compact modules are then each formed into a T-shape using a milling step and inserted into the respective mobile tokens.

[0052] In some embodiments, to connect the compact module to the mobile token, a portion of a surface of the compact module designed for this purpose is or will be locked to a complementary portion of a surface of the recess of the mobile token. For this purpose, both the compact module and the mobile token comprise correspondingly complementary locking elements, which lock together when the compact module is arranged in the recess. The advantage of locking or such locking elements lies in an easier connection of the compact module to the mobile token.

[0053] Alternatively or additionally, it can be provided that, to connect the compact module to the mobile token, a portion of a surface of the compact module designed for this purpose is or will be glued to a complementary portion of a surface of the recess of the mobile token. Such an adhesive connection has the advantage of creating a mechanically more stable connection between the compact module and the mobile token.

[0054] In a preferred embodiment, the circuit carrier layer has a privacy screen, at least in the area of ​​the safety controller. This privacy screen prevents the safety controller from being visible from the outside, or prevents light from penetrating the safety controller from the outside. In this way, light-based attacks (e.g., laser attacks) can be prevented. For example, copper conductor tracks can be applied as a privacy screen on one side of the circuit carrier layer, which is opposite the side with the safety controller, covering the area in which the safety controller is located. Copper conductor tracks provide good privacy protection in this case.

[0055] The invention will be explained in more detail below using preferred embodiments with reference to the figures. Herein: Fig. 1 a schematic representation of an embodiment of the value or security document blank with a document card as a mobile token in a side view; Fig. 2 a schematic representation of the Fig. 1 shown embodiment of the value or security document blank in a plan view; Fig. 3 a schematic representation of an embodiment of the compact module; Fig. 4 a schematic representation of a further embodiment of the compact module; Fig. 5 a schematic representation of a further embodiment of the compact module; Fig. 6 a schematic representation of a further embodiment of the compact module; Fig. 7 a schematic representation of an embodiment of the value or security document blank with a ring as a mobile token in a side view; Fig. 8 a schematic flow diagram of an embodiment of the method for producing the value or security document blank.

[0056] Fig. 1 shows a schematic representation of an embodiment of the value or security document blank 1 in a side view, Fig. 2 shows the corresponding top view. The value or security document blank 1 comprises a mobile token 2 and a compact module 3. The mobile token 2 is a document card 4, for example, in ID-1 format. For clarity, the compact module 3 is shown separately from the mobile token 2; in the finished value or security document blank 1, the compact module 3 is inserted into a recess 5 in the document card 4 and connected to it (indicated by the arrows).

[0057] The compact module 3 and the recess 5 preferably have a circumferential T-shape.

[0058] The document card 4 is made of plastic material, for example polycarbonate. The document card 4 comprises three material layers 6, 7, 8. Applied to an upper side of the inner material layer 7 is an antenna 9 running along the outer edge of the document card 4, the contacts 10 of which are arranged on an outer side within the recess 5. The antenna 9 can, for example, be printed on the inner material layer 7. On a side of the compact module 3 facing the document card 4, the compact module 3 has contacts 11 complementary to the contacts 10 of the antenna 9, which are brought into electrical contact with the contacts 10 of the antenna 9 when the compact module 3 is arranged in the recess 5. An electrical connection is established between an electronic circuit in the compact module 3 and the antenna 9 via the contacts 10, 11.

[0059] The compact module 3 preferably comprises a biometric sensor 12 on its upper side. This can, in particular, be a sensor for detecting a user's fingerprint. Furthermore, the compact module 3 preferably comprises a security controller (not shown) and a visual feedback element 13, which comprises, for example, light-emitting diodes (LEDs).

[0060] Fig. 3 shows a schematic representation of an embodiment of the compact module 3. In this preferred embodiment of the compact module 3, the compact module 3 comprises a fingerprint sensor, a security controller 14, and visual feedback elements 13 in the form of LEDs as a biometric sensor 12. The compact module 3 consists of an internal first document layer 15 designed as a circuit carrier layer. The first document layer 15 is equipped with active and passive electronic components. The first document layer 15 designed as a circuit carrier layer is arranged between a second document layer 16 and a third document layer 17 and is permanently joined, in particular laminated, to these. According to the invention, the document layers 15, 16, 17 comprise fiber composite materials and, after the permanent joining, are hermetically encapsulated to form the compact module 3, thus making them extremely mechanically stable.This is achieved in particular by pressing (laminating individual film layers forming the document layers 15, 16, 17 under high pressure and high temperature) with so-called prepregs and FR4 layers.

[0061] The compact module 3 has a circumferential T-shape. For this purpose, the areas 21 located on the left and right in the illustration, as well as the areas not shown in the figure, which are located in front of and behind the figure plane, were milled away in the third document layer 17 after pressing, so that the width and depth of the third document layer 17 are smaller than the width and depth of the first document layer 15 and the second document layer 16 arranged above it. The T-shape (or mushroom shape) enables it to be fitted into the mobile token 2 (cf. Fig. 1 ) is facilitated. On the underside of the projections 22 of the first document layer 15, electrical contacts 11 are formed, which are electrically connected to complementary contacts of an antenna of the mobile token 2 ( Fig. 1 ) serve.

[0062] The light 18 emitted by the LEDs can ideally exit on both sides of the compact module 3 and serve as visual feedback.

[0063] In a preferred embodiment, both a privacy screen 19 and additional mechanical protection of the internal, thin integrated circuits are achieved by additional metal layers on the first document layer 15 forming the circuit carrier layer. Such a privacy screen 19 makes optically based attacks (e.g., laser attacks) on the security controller 14 more difficult. The privacy screen 19 can be formed, for example, by applying copper conductor tracks in larger areas on the first document layer 15 forming the circuit carrier layer, wherein the copper conductor tracks are applied or are applied on a side of the circuit carrier layer opposite the security controller 14.

[0064] In the in the Fig. 3 In the embodiment shown, the biometric sensor 12, designed as a fingerprint sensor, also has a T-shape. After the document layers 15, 16, 17 have been pressed (laminated) together to form the compact module 3, the fingerprint sensor is arranged in a sensor recess 19 milled for this purpose and connected to the remaining part of the electronic circuit via opposing, complementary sensor contacts according to the principle already described for the electrical connection of the compact module 3 to the mobile token.

[0065] Fig. 4 shows a schematic representation of a further embodiment of the compact module 3. Reference numerals corresponding to the other figures denote the same features. In the otherwise Fig. 3 In an identical embodiment, the biometric sensor 12, designed as a fingerprint sensor, is flat. The biometric sensor 12 is arranged in a sensor recess 20 milled into the second document layer 16 for this purpose and is connected to the rest of the electronic circuit via electrical contacts.

[0066] Fig. 5 shows a schematic representation of another embodiment of the compact module 3. The structure is basically the same as in Fig. 4 The embodiment shown is shown in the drawing. Reference numerals corresponding to the other figures denote identical features. However, the compact module 3 has a cuboid block shape. The electrical contacts 11 are therefore routed through the second document layer 17 to the underside of the compact module 3.

[0067] As an alternative to electrical contacting of the antenna 9 in the described embodiments, a connection between the antenna 9 and the electronic circuit of the compact module 3 can also be made inductively via inductive coupling elements provided for this purpose in the mobile token and the compact module 3.

[0068] In Fig. 6 A schematic representation of a further embodiment of the compact module 3 is shown. Reference numerals corresponding to the other figures denote the same features. In contrast to the Figuren 3 bis 5 In contrast to the embodiments shown, the compact module 3 in this embodiment does not have a third document layer, so that the compact module 3 only comprises a first document layer 15 and a second document layer 16. The flat biometric sensor 12 is inserted into a sensor recess 20 in the second document layer 16.

[0069] In Fig. 7 1 is a schematic side view of an embodiment of the value or security document blank 1 with a ring 23 as a mobile token 2. The compact module 3 is arranged in a recess 5 provided for this purpose on the top side of the ring 23 and is connected to the ring 23. The compact module 3 comprises, for example, a biometric sensor 12 designed as a fingerprint sensor, a visual feedback element 13 designed as an LED, and a security controller 14. A circumferential antenna 9 is embedded in the ring 23 and is electrically or inductively connected to the electronic circuit in the compact module 3.

[0070] Fig. 8shows a schematic flow diagram of an embodiment of the method for producing the value or security document blank with an electronic circuit. In a first method step 100, a mobile token is provided. This can be, for example, a document card, a ring, or a key chain.

[0071] In a method step 101, a compact module is produced that comprises the electronic circuit. The compact module preferably comprises a biometric sensor, for example a fingerprint sensor, a security controller, and a visual feedback element. Within the scope of this method step 101, in a method step 102, a first document layer in the form of a circuit carrier layer carrying the electronic circuit and at least one second document layer are provided, wherein the first document layer and the at least one second document layer are formed from a fiber composite material. In a subsequent method step 103, the document layers are stacked.

[0072] If a third document layer made of the fiber composite material is also present, it can be provided that in this method step 103 the first document layer is arranged between the at least one second document layer and the third document layer.

[0073] After stacking, the document layers are permanently joined, in particular laminated, to form a compact module in process step 104.

[0074] It may be provided that, following the permanent joining, cutouts are made at designated locations on the compact module in order to insert, for example, a biometric sensor.

[0075] In a method step 105, a recess complementary to the shape of the compact module is formed on an outer side of the mobile token. This can be done, for example, using a chip implanter and card milling processes.

[0076] In method step 106, the compact module is arranged in the recess in the mobile token and connected to the mobile token. In this method step 106, the necessary electrical connections, for example, to an antenna arranged in the mobile token, are also established, for example by connecting complementary electrical contacts.

[0077] To connect the compact module and the mobile token, the compact module and the mobile token can, for example, have complementary locking elements that engage with each other so that the compact module locks onto the mobile token. Alternatively or additionally, the compact module and the mobile token can also be glued together, for example, on opposing surfaces provided for this purpose.

[0078] In a subsequent process step 107, the finished value or security document blank can be individualized by applying or incorporating authenticating information. This creates a value or security document. This step does not have to take place at the same location as the production of the value or security document blank. List of reference symbols

[0079] 1Value or security document blank 2Mobile token 3Compact module 4Document card 5Recess 6Material layer 7Material layer 8Material layer 9Antenna 10Contact 11Contact 12Biometric sensor 13Visual feedback element 14Security controller 15First document layer 16Second document layer 17Third document layer 18Light 19Screen 20Sensor recess 21Area 22Protrusion 23Ring

Claims

1. A method for producing a value or security document blank (1) having an electronic circuit, said method comprising the following steps: (a) providing a mobile token (2), (b) producing a compact module (3), comprising the following sub-steps: (b1) providing a first document layer (15) in the form of a circuit carrier layer supporting the electronic circuit and at least one second document layer (16), wherein the first document layer (15) and the at least one second document layer (16) are formed from a fibre composite material, wherein the circuit carrier layer carries or comprises a plurality of separately housed electronic components and conductor tracks connecting the components, (b2) stacking the document layers (15, 16, 17), (b3) non-releasably joining the first document layer (15) and the at least one second document layer (16) to form a compact module (3), (c) forming a recess (5) complementary to the compact module (3) on an outer side of the mobile token (2), (d) arranging the compact module (3) in the recess in the mobile token (2) and connecting to the mobile token (2).

2. The value or security document blank (1) having an electronic circuit, comprising: a mobile token (2), a compact module (3), wherein the compact module (3) comprises a first document layer (15) in the form of a circuit carrier layer carrying the electronic circuit and at least one second document layer (16), wherein the first document layer (15) and the at least one second document layer (16) are formed from a fibre composite material, wherein the first document layer (15) and the at least one second document layer (16) are arranged stacked, wherein the first document layer (15) and the at least one second document layer (16) are joined non-releasably to form the compact module (17), characterised in that the circuit carrier layer carries or comprises a plurality of separately housed electronic components and also conductor tracks connecting the components, and the compact module (3) is arranged in a recess (5) complementary to the compact module (3) on an outer side of the mobile token (2) and is connected to the mobile token (2).

3. The value or security document blank (1) according to claim 2, characterised in that the mobile token (2) is a document card (4) made of plastics material.

4. The value or security document blank (1) according to claim 2, characterised in that the mobile token (2) is a ring (23).

5. The value or security document blank (1) according to any one of claims 2 to 4, characterised in that the mobile token (2) comprises an antenna (9) inserted thereinto, wherein the antenna (9) is connected to the electronic circuit.

6. The value or security document (1) according to claim 5, characterised in that the antenna (9) is connected to the electronic circuit via electrical contacts (10, 11) provided for this purpose.

7. The value or security document blank (1) according to claim 5, characterised in that the antenna (9) is connected to the electronic circuit via inductive coupling elements provided for this purpose.

8. The value or security document blank (1) according to any one of claims 2 to 7, characterised in that the compact module (3) has a T-shape.

9. The value or security document blank (1) according to any one of claims 2 to 8, characterised in that the compact module (3) has a screen (19) at least in the region of a safety controller (14), wherein the safety controller (14) protects complex circuits against manipulation, wherein the safety controller (14) allows cryptographic operations to be performed and also provides a secure data memory and secure processing functions.

10. The value or security document blank (1) according to any one of claims 2 to 9, characterised in that the compact module (3) is latched via a part of a surface of the compact module (3) configured for this purpose to a complementary part of a surface of the recess (5) of the mobile token (2).

11. The value or security document blank (1) according to any one of claims 2 to 10, characterised in that the compact module (3) is glued via a part of a surface of the compact module (3) configured for this purpose to a complementary part of a surface of the recess (5) of the mobile token (2).

12. A value or security document, comprising a value or security document blank (1) according to any one of claims 2 to 11, wherein the value or security document blank (1) is provided with authenticating information and is hereby individualised in order to form the value or security document.