Capacitor assembly and power module with a power electronic component

Description

[0001] The invention relates to a power module with a capacitor assembly comprising several capacitors arranged in a mounting structure, wherein each capacitor has a first capacitor electrode and a second capacitor electrode. The mounting structure itself has a first electrode and a second electrode. The capacitors are electrically contacted via their first capacitor electrodes to the first electrode and via their second capacitor electrodes to the second electrode. Furthermore, the mounting structure has a mounting surface for surface mounting. The mounting surface is equipped with a first contact surface for the first electrode and a second contact surface for the second electrode, thus enabling electrical contact of the mounting structure via surface mounting.The capacitor assembly thus forms a surface-mountable component that can be mounted and electrically connected to a substrate such as organic or inorganic substrates, like printed circuit boards. Surface-mountable components, also known as SMDs (Surface Mounted Devices), are widely used in electronics assembly because they are easy to process.

[0002] The power module comprises a power electronic component mounted on a substrate plate. The substrate plate with the mounted power module preferably forms a package, which in turn can be mounted on another circuit carrier as a substrate. Power electronic components are frequently used in combination with capacitors. This allows for the implementation of power electronic circuits.

[0003] From US 2016 / 0174356 A1, a capacitor comprising a first winding element is known, wherein the first winding element includes a first dielectric layer and a first conductive layer. A second winding element comprises a second dielectric layer and a second conductive layer. The first winding element is partially or completely nested with the second winding layer. A dielectric shell or sheath is adapted to at least radially contain or confine the first and second winding elements. The first winding element is electrically connected to a first conductive end. A second winding element is electrically connected to a second conductive end. The second conductive end is located opposite the first conductive end. The first conductive end forms a first line, and the second conductive end forms a second line.

[0004] Power electronic circuits are typically designed and adapted to a specific application. These applications vary considerably, resulting in significant effort during the design and manufacturing of the power electronic circuits. This individualized nature of the applications particularly hinders the automation of power module production. Specifically, the use of capacitors increases assembly effort, as required capacitance values ​​can only be achieved by connecting multiple capacitors in parallel, all of which must be integrated into the power electronic circuit.

[0005] The object of the invention is to further develop a power module, wherein power electronic circuits can be produced with reduced effort in the design or manufacture using the capacitor structure or the power module, especially in the case of individual production of power modules or small quantities.

[0006] This problem is solved according to the invention with the power module described above by the fact that the mounting structure encloses a cuboid interior in which the capacitors are arranged. Furthermore, an additional structural element is provided on an outer surface of the mounting structure located outside the mounting side.

[0007] The mounting structure advantageously allows for the arrangement of capacitors within the structure while minimizing manufacturing effort. The capacitors can, for example, be soldered or otherwise contacted to the electrodes, creating a single unit in which the electrodes hold the capacitors together. This advantageously results in a high packing density of the capacitors, making the capacitor assembly compact and easily handled as a surface-mount component. Further advantages arise from the fact that the arrangement according to the invention enables a low-inductance design for a power electronic circuit. The capacitor assembly can be advantageously manufactured in large quantities and then used in power electronic circuits. The capacitors can also be classified (binned) before being assembled into the capacitor assembly.The capacitor assembly can be measured before further use to determine its suitability for the power requirements of the electronic circuit. Subsequently, the capacitor assembly can be advantageously mounted using surface mounting, requiring minimal manufacturing effort.

[0008] According to an advantageous embodiment of the invention, the first and second electrodes form side walls of the interior of the mounting structure. The side walls extend perpendicularly from the first and second contact surfaces, respectively. This allows the capacitors to be advantageously arranged between the side walls. The capacitors mounted in the interior have their electrodes on opposite sides and are preferably cuboid in shape. This advantageously results in a dense packing within the mounting structure, optimizing space utilization. Furthermore, the contact via the side walls advantageously enables the capacitors to be connected in parallel with short contact paths, thus allowing for large conductor cross-sections and short conductor lengths relative to the available space.This allows the parasitic inductance of the capacitor assembly to be kept as small as possible.

[0009] The capacitors can be arranged in the mounting structure, advantageously in several tiers. Simultaneously, a side-by-side arrangement is possible, thus utilizing the available space in the power electronic circuit. unknown The interior space is optimally utilized due to its angular shape. The parallel-connected capacitors are made contact with the substrate, on which, for example, a power electronic circuit can be implemented, of which the capacitor assembly is a part, via the side walls and the adjacent connection surfaces.

[0010] In addition to the mounting side, the holding structure, according to the invention, also forms at least one outer surface. Up to five outer surfaces can be formed by the cuboid interior, which is at least partially enclosed by the holding structure. These outer surfaces can consist, relative to the mounting side, of the side surfaces (formed by the side walls) and a top surface opposite the mounting side, which forms the top of the capacitor assembly. Naturally, the capacitor assembly can be used in any mounting position. The terms side surface, side walls, top surface, and top surface are to be understood relative to the mounting side, which, relative to the substrate, forms the underside of the component during assembly.

[0011] The design of the support structure with at least partially parallel surfaces enables optimal space utilization and / or mass production.

[0012] Flat surfaces are particularly preferred as support structures because they are well suited for use as assembly surfaces.

[0013] By incorporating an additional structural element, additional functionalities for the capacitor assembly can be advantageously implemented. These functionalities simplify the fabrication of a power electronic circuit from prefabricated modules, because they eliminate the manufacturing effort that would otherwise be required to implement these functionalities separately within the power electronic circuit. This will be explained in more detail below.

[0014] The additional structural element can consist of components or functional parts that are mounted separately onto the support structure. Alternatively, the structural element can be designed as an integral part of the support structure. This is possible, for example, if the structural element is designed as a stiffening structure, particularly as ribs, according to a specific embodiment of the invention. This advantageously stabilizes the capacitor assembly, eliminating the need for external stiffening structures during assembly. This reduces the assembly effort.

[0015] According to a further embodiment of the invention, the structure can be provided with electrical conduction paths extending from the mounting side to a top surface of the capacitor assembly. These electrical conduction paths advantageously enable the connection of additional electrical or electronic functional components mounted on the top surface of the structure. These components can then be connected to a power electronic circuit on the substrate, which is connected to the capacitor assembly via the mounting side.

[0016] This makes it possible to integrate additional electronic functionalities into the capacitor structure, which can be manufactured cost-effectively in large quantities when producing standardized capacitor assemblies. This significantly reduces assembly effort during the design of, for example, power electronic circuits, as the electronic functionality does not need to be separately assembled during the manufacturing process.

[0017] To utilize the conductive pathways for electronic functionality, the device structure can advantageously incorporate a circuit carrier. This can consist, for example, of an organic and / or inorganic substrate (e.g., a printed circuit board) that is appropriately structured. This substrate then establishes the connection between the conductive pathways and an electronic circuit. It is advantageous to utilize a proven technology here, which minimizes manufacturing effort and maximizes reliability.

[0018] The circuit carrier can accommodate a driver circuit for at least one power electronic component. This advantageously creates a power module which can be combined with other power modules to form a power electronic circuit.

[0019] According to another embodiment of the invention, the structure can also consist of a cooling element. This is thermally conductive and attached to the structure to be cooled, resulting in advantageously short conduction paths for the generated heat. This allows the cooling element to be operated with improved efficiency, thus saving installation space. Furthermore, when the capacitor assembly is used in a power electronic circuit, the pre-assembled coolers reduce assembly effort.

[0020] Advantageously, the structure can be designed to include at least one sensor element, in particular a temperature sensor and / or a humidity sensor and / or a current sensor and / or an acceleration sensor and / or a gas sensor. The sensor signals can be advantageously used to determine the operating state and / or operational changes of the capacitor assembly (aging, damage, health monitoring, i.e., self-state observation) in order to obtain information about the operating state of the capacitor assembly. This allows for predictions about the remaining service life, impending failure, or overload of the capacitor assembly or power module. The sensor signals can be processed by an evaluation circuit to arrive at these conclusions.

[0021] Temperature sensors are used, for example, to monitor the operating temperature of power modules. This allows for timely shutdown to prevent overloading or damage to the power module. A temperature sensor can also be used to determine the ambient temperature of the power electronic circuitry and, for example, to determine its expected cooling behavior. Humidity sensors can be used to monitor the operating conditions of the power electronic circuitry. If humidity is too high, the power electronic circuitry must be dried before it can be operated or continue to operate. Excessive humidity can occur, for example, at low ambient temperatures due to dew formation. Another possibility is a leak in the water cooling system.

[0022] Current sensors are used to monitor the operating status of the power electronic circuit. For example, the current load in the individual power modules can be compared. Current measurement may also be necessary for the operation of a driver circuit for the power modules (more on this below).

[0023] The sensor element can advantageously also be designed as an accelerometer. Accelerometers are useful for determining mechanical stresses on the power electronic circuit. For example, events can be recorded that preclude further operation of the power electronic circuit before maintenance has been performed, such as when the circuit has been dropped during mobile use. Accelerometers can also be used to detect vibrations. Depending on the frequency and intensity of the vibration, flexible maintenance intervals for the power electronic circuit can be determined.

[0024] Furthermore, the structure can advantageously incorporate an electrical shield that at least partially encloses the capacitor assembly. This makes it possible to protect electrical circuits from interference. Finally, the interior of the mounting structure can be advantageously encapsulated. Inorganic and organic potting compounds, such as silicone or casting resins, can be used for encapsulation, and these are themselves electrically insulating. Encapsulation using a suitable material has the advantage of better protecting the capacitor assembly from environmental influences (dust, moisture).

[0025] A particularly preferred embodiment of the invention is obtained when the holding structure comprises an electrically insulating material (in particular, plastic) into which the first and second electrodes are integrated. The integration of these electrodes can be achieved in various ways. For example, the first and second electrodes can be overmolded by the insulating material. A thermoplastic or other functional plastic is preferably suitable for this purpose. The electrical contact surfaces provided for the capacitors, as well as the connection surfaces for surface mounting, remain free so that an electrical connection between said components can be established (preferably by soldering, sintering, adhesive bonding, or metal spraying).Another option is to manufacture a housing from the material individually (for example, by injection molding), with the housing having recesses for the electrode. These can then be glued, inserted, or clipped in, for example.

[0026] The electrically insulating material significantly improves the handling of the capacitor assembly, as it allows the assembly to form a self-supporting structure even before the capacitors are mounted. Furthermore, the insulating material enhances the electrical isolation of the capacitor assembly from its surroundings. Moreover, the insulating material is advantageously robust, especially if it is a plastic, thus minimizing the risk of damage to the capacitor assembly during installation.

[0027] It is particularly advantageous to provide at least one recess for the component structure made of electrically insulating material. This simplifies the assembly of components designed as individual parts, thus saving assembly time. Furthermore, the components integrated into the recess are securely fixed, which ultimately improves the reliability of the entire capacitor assembly. The recess can also advantageously serve as protection for the component structure, which has a positive impact both during assembly and operation of the capacitor assembly.

[0028] The problem stated above is also solved according to the invention with the power module described above by electrically contacting a capacitor assembly of the type described above with the power electronic component. As already described, many power electronic assemblies require that power electronic components be combined with capacitors (more on this below). Therefore, the capacitor assembly is advantageously suited for manufacturing a power module with reduced assembly effort, since the capacitor assembly can be pre-assembled.

[0029] The power electronic components are preferably implemented as bare chips. These can be directly contacted with the substrate, for example, by a sintered connection that also ensures electrical contact. The substrate is preferably made of a ceramic material. This material does not conduct electricity, thus simultaneously providing electrical insulation. Therefore, an electronic circuit can be implemented by structuring an electrically conductive coating on the substrate. This provides, for example, contact surfaces for connecting the power electronic components.

[0030] The design of the power modules according to the invention has the advantage that they can be combined into various configurations with comparatively little effort during the design and assembly on the base circuit carrier, in order to realize power electronic circuits with different requirements. The base circuit carrier can, for example, be designed as a printed circuit board, with a circuit on its surface for contacting the power modules used. Alternatively, the base circuit carrier can also consist of a housing component or the like, with the housing then simultaneously serving as a support for the power electronic circuit.

[0031] Furthermore, the power electronic component is mounted on one side of the substrate plate, and the capacitor assembly on the other. Connections between the power electronic component and the capacitor assembly can be created, for example, by means of a through-hole via in the substrate plate. The substrate plate also allows for easy integration of the power module into a larger power electronic circuit, thus reducing manufacturing costs. For example, the substrate plate, which is populated with at least one power electronic component, can be mounted on a base circuit carrier. Surface mount methods can be used for this purpose. If the power electronic component is a power chip, its side facing away from the substrate plate can be directly contacted with the aforementioned base circuit carrier.

[0032] Further details of the invention are described below with reference to the drawing. Identical or corresponding drawing elements are each provided with the same reference numerals and are only explained more than once to the extent that differences arise between the individual figures.

[0033] They show: Figure 1 shows an embodiment of the power module according to the invention with an embodiment of the capacitor structure according to the invention in a three-dimensional view, partially cut away; Figure 2 shows detail II according to Figure 1 , partially cut away, Figure 3 a power electronic circuit with a plurality of power modules, which according to Figure 1 or similarly constructed, as shown in Figure 4, a schematic circuit diagram for contacting power modules according to Figure 1 in a power electronic circuit according to Figure 3Figure 5 shows another embodiment of a capacitor structure according to the invention in a three-dimensional representation, partially cut away, and Figure 6 shows a final embodiment of a power module according to the invention with an embodiment of the capacitor structure according to the invention as a side view, partially cut away.

[0034] A performance module 11 according to Figure 1 The substrate plate 12 has a substrate plate on whose visible upper surface 13 a capacitor assembly 14 has been mounted using a surface mounting method. The capacitor assembly has eight capacitors 15, of which in Figure 1However, only seven are shown (the capacitor located at the top right is missing; more on this below). The capacitors 15 each have first capacitor electrodes 16 and second capacitor electrodes 17, wherein the first capacitor electrodes 16 are electrically contacted with a first electrode 18 and the second capacitor electrodes 17 with a second electrode 19 by soldered connections or other material- or form-fit connections (not shown in detail). The first electrode 18 and the second electrode 19 also each have a contact structure 20, the lower sides of which form a first contact surface on the first electrode and a second contact surface on the second electrode (in Figure 1not visible, as it faces the top 13). The first and second contact surfaces, which together form the mounting side of the capacitor assembly 14, are connected to the top of the substrate plate 12 by means of a solder joint 21 (not shown in detail) (see figure). Figure 2 ) mounted.

[0035] The first electrode 18 and the second electrode 19 together form a support structure for the capacitors 15. Since the capacitors 15 are soldered to the side walls 22 of the first electrode 18 and the second electrode 19 via their first contact electrodes 16 and their second contact electrodes 17, the self-supporting capacitor assembly 14 is created, even though the first electrode 18 and the second electrode 19 are not directly connected. The capacitor assembly 11 gains additional stability from being mounted on the substrate plate 12. Furthermore, a circuit carrier 24 is attached to the mounting structures 23 of the first electrode 18 and the second electrode 19 as an additional structural element. The circuit carrier 24 establishes a connection between the first electrode 18 and the second electrode 19, thus stabilizing the support structure.

[0036] In the side wall 22 of the first electrode 18 (not visible in Figure 1Windows 28 are punched into the first and second electrodes 19. These windows allow tongues 29 to be bent into the interior of the holding structure, facilitating the positioning of the capacitors 15 and also increasing the electrical contact area. Since the capacitor located at the top right behind the side wall 22 has been omitted, the tongue 29 can be shown there. In the other windows, the tongues are concealed by the second capacitor electrodes 17.

[0037] A sensor element 25a, which may be, for example, a temperature sensor or an accelerometer (or humidity sensor or gas sensor), is mounted on the circuit carrier 24. The sensor element 25a is connected to an evaluation circuit in the form of an integrated circuit 27 via conductor tracks 26 on the circuit carrier 24. The integrated circuit 27 can evaluate the sensor signal and make it available for further processing in a manner not shown (for example, via wired connections not shown or a wireless interface, i.e., via radio or infrared).

[0038] As a further structural element, ribs 30 are produced on the side edges of the side wall 22 as a stiffening structure. These can be created by bending the side edges of the side walls 22. The first electrode 18 and the second electrode 19 can thus be produced cost-effectively as a leadframe by stamping and subsequent bending. The receiving structures 23 and the contact structures 20 can also be produced by bending.

[0039] In Figure 2 is shown how a contacting of the capacitor arrangement 14 according to Figure 1This can be achieved with a power electronic component 31 designed as a transistor. For this purpose, the contact structure 20 is contacted via the solder joint 21 with a contact pad 32a, wherein the contact pad 32a is contacted via a via 33a with a source electrode 34 of the power electronic component 31. The source electrode 34 is also connected via a conductor track 35 to a spacer 36, which has the same height as the power electronic component 31.

[0040] A drain electrode 37 of the power electronic component 31 is connected to a base circuit carrier 39 via a contact surface 38a, and the spacer 36 is connected to a base circuit carrier 39 via a contact surface 38b. The base circuit carrier 39 provides a base plate on which the entire electronic circuit, consisting of several power modules according to Figure 1, is mounted (see also Figure 1). Figure 3 ).

[0041] In the case of the power electronic component according to Figure 2 This is a transistor. A gate electrode 40 is also required for it to be switched. To enable this, a via 33b is provided in the substrate plate 12, leading from a contact pad 32b to a contact pad 32c. The source electrode 34, gate electrode 40, drain electrode 37, and the bonding layers 41 on the spacer 36 are designed as sintered connections.

[0042] In Figure 3 is shown how several power modules 11 are mounted on a basic circuit carrier 39 according to Figure 2 can be combined to form a power electronic circuit 42. Five power modules 11 are each configured into a row 43, with a total of six rows provided. How Figure 2As can be seen, only the left side of the substrate plate 12 is shown, with the right side having another power electronic component 31 (as in Figure 6 (shown). This means that on the side of the substrate plate not shown, according to Figure 2 A transistor is also installed as a power electronic component. This provides a contact option which is in Figure 3 for each performance module 11 is implemented and in Figure 4 schematically represented as a circuit diagram.

[0043] In Figure 4 Is capacitor 15 a replacement for the entire capacitor assembly according to Figure 1 The diagram is shown. This simplifies the representation, although alternatively, a large number of capacitors connected in parallel can be used. Capacitor 15 according to Figure 4The capacitor assembly 14 is shown only schematically. The same applies to the substrate plate 12 and the power electronic components mounted on it, which consist of a first transistor 44 and a second transistor 45. The first transistor 44 is connected with its source electrode to the positive terminal 46, also known as the high-side, while the second transistor 45 is connected with its drain electrode to the negative terminal 47, also known as the low-side. The drain electrode of the first transistor 44 is connected to the source electrode of the second transistor 45, forming a half-bridge 64 with a phase contact 48.

[0044] For controlling the power module 11, the capacitor assembly 14 is provided with a driver circuit 49, which according to Figure 5 for example, it can be located on a top surface 50 of the capacitor assembly 14.

[0045] The driver circuit according to Figure 4 The diagram is only schematically represented to describe its basic function. The driver circuit has a controller function C and a sensor function S. The controller function is provided by contact lines 51, which serve as an interface to the gate electrodes of the first transistor 44 and the second transistor 45. This allows the driver circuit to control both transistors more intelligently as switches. The information necessary for this function is provided by the sensor function S. The sensor function is provided via signal lines 52, which detect the current flow before and after the capacitor 15 and before and after the phase contact 48 in the half-bridge 64.

[0046] The capacitor 15 is connected to the positive terminal 46 and the negative terminal 47 and thus fulfills a smoothing function, which is necessary for multi-phase operation of the power electronic circuit 42 according to Figure 3 is required.

[0047] As in Figure 3 The power electronic circuit 42 can be seen according to Figure 3 modular structure. By means of the performance modules 11 according to Figure 4 In the implemented circuit, these components can be used together in three groups to generate a three-phase AC voltage from a DC voltage applied to the common positive terminal 46p and the common negative terminal 47m. This AC voltage can then be tapped at the common phase contacts 48a, 48b, and 48c. The magnitude of the maximum current to be switched determines how many of the power modules 11 must be used per phase. Figure 3 This involves ten power modules (11) per phase.

[0048] As can be seen, the electrodes 53m, 53p of the positive terminal 46p and the negative terminal 47m are comb-shaped, so that the first transistor 44 of each power module 11 can be contacted by the electrode 53p forming the positive terminal 46p, and the second transistor 45 of each power module 11 can be contacted by the electrode 53m forming the negative terminal 53m. The phase contacts 48a, 48b, 48c are each connected to U-shaped electrodes 54a, 54b, 54c, which in each case contact both the first capacitor 44 and the second capacitor 45 in the middle region of the power modules 11, thus connecting each of the three groups of ten power modules 11 via a half-bridge (64 in Figure 4 ) contact. This means that for each of the 11 power modules, a circuit according to Figure 4 realized, with each group of power modules 11 connected in parallel.

[0049] In the capacitor arrangement 14 according to Figure 5A first electrode 18 and a second electrode 19 are used to connect the capacitors 15 in the Figure 1 to contact in the manner described. According to Figure 5 Five capacitors 15 are arranged one above the other and two capacitors are arranged side by side. The capacitor arrangement 14 differs from that in Figure 1 an electrically insulating material 55. This consists according to Figure 5 made of plastic, wherein the first electrode 18 and the second electrode 19 are injected into the material 55 in such a way that contact with the capacitors 15 can take place (so-called assembly injection molding).

[0050] Material 55 is in Figure 5 only partially shown. The housing structure formed by material 55 is largely broken up, with only the contours 55a formed by material 55 indicated by dashed lines. Therefore, the structures indicated inside the material can be seen in Figure 5These include, in addition to the first electrode 18 and the second electrode 19 and the capacitors 15, electrical conduction paths 56, which are formed by metallic conductors and electrically connect the top surface 50 to the mounting side of the capacitor assembly 14. The conduction paths form contact structures 57 on the mounting side, which are located on a substrate plate (see 12 in Figure 1 ) can be contacted if corresponding contact pads are present on it.

[0051] On the upper side 50, the driver circuit 49 can be installed according to Figure 4 be arranged so that these are on the substrate plate according to Figure 2 To control the arranged power electronic components 31, the conductive paths 56 can be used. For this purpose, conductive traces 58 and contact pads 59 are provided on the upper surface 15, with the contact pads 59 being electrically connected to the conductive paths 56.

[0052] The side wall formed by the electrode 19 is used as a structural element to accommodate a cooling structure 60, wherein the cooling structure 60 consists of a passive aluminum cooler with fins 61. Alternatively (not shown), an active cooler with a cooling channel having an inlet and an outlet for a preferably liquid cooling medium could also be used.

[0053] In Figure 6 A further power module 11 is shown. This is mounted on the substrate plate 12 in the manner already described, the substrate plate having power electronic components 31 and spacers 36 (arrangement as in Figure 2 The capacitor assembly 14 is shown only schematically and can be constructed as shown in Figure 5The assembly is shown as follows. A sensor element 25b is attached to the side wall 22; this element could be, for example, a temperature sensor, a humidity sensor, or an accelerometer. In the embodiment shown in Figure 6, the sensor signal can be fed to a driver circuit (not shown) on the substrate plate 12 via a signal line 62.

[0054] As a further structural element, the power module 11 according to Figure 6 has a shielding structure 63, which can, for example, consist of a metal grid. This enables electromagnetic shielding of the power module to ensure interference-free operation.

Claims

1. Power module having a power electronic component (31) which is mounted on one side of a substrate board (12), wherein a capacitor structure: - is mounted on the other side of the substrate board (12), wherein the other side of the substrate board (12) has a mounting side, - is in electrical contact with the power electronic component (31), and - has a plurality of capacitors (15) disposed in a support structure (18, 19, 55), wherein the capacitors (15) each have a first capacitor electrode (16) and a second capacitor electrode (17), wherein • the support structure (18, 19, 55) has a first electrode (18) and a second electrode (19), • the capacitors (15) are in electrical contact with the first electrode (18) via their first capacitor electrodes (16) and with the second electrode (19) via their second capacitor electrodes (17), • the support structure (18, 19, 55) has the mounting side for surface mounting and the mounting side is provided with a first contact area of the first electrode (18) and with a second contact area of the second electrode (19) for establishing electrical contact with the support structure, • the support structure (18, 19, 55) encloses a cuboid interior in which the capacitors (15) are disposed, and • an additional structural framework (24, 25a, 25b, 30, 49, 56, 60, 63) is provided on an outer side of the support structure (18, 19, 55) outside the mounting side.

2. Power module according to claim 1, wherein the first electrode (18) and the second electrode (19) form opposite side walls (22) of the interior of the support structure (18, 19, 55), wherein • the side walls (22) extend perpendicularly away from the first contact area and the second contact area in each instance, • the capacitors (15) are disposed between the side walls (22).

3. Power module according to one of the preceding claims, wherein the structural framework has a reinforcing structure, in particular ribs (30).

4. Power module according to one of the preceding claims, wherein the structural framework has electrical pathways (56) running from the mounting side to an upper side (50) of the capacitor structure.

5. Power module according to one of the preceding claims, wherein the structural framework has a cooling structure (60).

6. Power module according to one of the preceding claims, wherein the structural framework has at least one sensor element (25), in particular a temperature sensor and / or a humidity sensor and / or a current sensor and / or an acceleration sensor.

7. Power module according to one of the preceding claims, wherein the structural framework has a circuit carrier (24).

8. Power module according to one of the preceding claims, wherein the structural framework has an electrical shielding structure (63) which at least partially encases the capacitor structure.

9. Power module according to one of the preceding claims, wherein the interior of the support structure (18, 19, 55) is encapsulated.

10. Power module according to one of the preceding claims, wherein the support structure (18, 19, 55) has an electrically insulating material (55) into which the first electrode (18) and the second electrode (19) are integrated.

11. Power module according to claim 10, wherein at least one seating for the structural framework (24, 25a, 25b, 30, 49, 56, 60, 63) is formed from the electrically insulating material (55).