CRYOGENS SUPPLY SYSTEM

Description

[0001] The invention relates to a cryogen supply system for supplying a consumer with a cryogen.

[0002] In the cryogenic operation of liquefied media, it is often necessary to monitor the process temperature of the medium, especially a cryogen, in containers or pipes. According to internal experience, this temperature measurement can be achieved using a temperature sensor directly connected to a process pipe, both mechanically and thermally. Direct measurements are difficult to implement, particularly at higher pressures. If the process pipe is encased in pressure-tight insulating tubes for good thermal insulation, it is undesirable from both a safety and operational perspective to penetrate these tubes for wiring or the temperature sensor. Penetrating the insulating tubes can lead to a loss of the vacuum within them. This, in turn, can result in a loss of insulation and a failure of the affected area.Leak detection and repair of such a system are labor-intensive and time-consuming. This needs to be improved. EP3070444A1 discloses a surface temperature measuring device.

[0003] Against this background, the object of the present invention is to provide an improved cryogen supply system.

[0004] Accordingly, a cryogen supply system for supplying a consumer with cryogen is proposed. The cryogen supply system comprises a process pipe through which the cryogen can be passed, a protective barrier in which the process pipe is contained, a gap provided between the process pipe and the protective barrier, a heat conducting device arranged in the gap which is configured to transfer heat from the process pipe to the protective barrier or vice versa, and a temperature sensor arranged outside the protective barrier for detecting the temperature of the cryogen, wherein the temperature sensor is thermally coupled to the heat conducting device.

[0005] Because the temperature sensor is located outside the protective barrier and the heat conducting device handles the heat transfer from the process pipe to the protective barrier and vice versa, it is advantageously unnecessary to breach the protective barrier to place the temperature sensor.

[0006] The cryogen is preferably hydrogen. The terms "cryogen" and "hydrogen" can therefore be used interchangeably. In principle, however, the cryogen can also be any other cryogen. Examples of cryogenic liquids, cryogenic fluids, or simply cryogens, besides the aforementioned hydrogen, are liquid helium, liquid nitrogen, or liquid oxygen. A "cryogen" is thus primarily understood to be a liquid. The cryogen can therefore also be called a cryogenic liquid. The cryogen can be vaporized and thus converted into a gaseous phase. After vaporization, the cryogen is a gas or can be described as a gaseous or vaporized cryogen. The term "cryogen" can therefore encompass both the gaseous and the liquid phases. As mentioned previously, the liquid phase can also be called a cryogenic liquid.The term "evaporated cryogen" here preferably refers only to the gas phase of the cryogen.

[0007] In the cryogen supply system, a gas zone and an underlying liquid zone can form after or during the filling of the cryogen. A phase boundary is provided between the gas zone and the liquid zone. Therefore, after filling, the cryogen preferably has two phases with different states of matter, namely liquid and gaseous. The liquid phase can transition into the gaseous phase and vice versa. The liquid phase can be referred to as the liquid phase. The gaseous phase can be referred to as the gas phase. Filling the cryogen supply system with a purely liquid material is also possible.

[0008] The consumer is preferably a fuel cell. In this context, a "fuel cell" is understood to be a galvanic cell that converts the chemical reaction energy of a continuously supplied fuel, in this case hydrogen, and an oxidant, in this case oxygen, into electrical energy. The cryogen is supplied to the consumer, particularly in gaseous form, at a defined supply pressure. This means that the cryogen is completely vaporized before or upstream of the consumer. For example, the cryogen is supplied to the consumer at a supply pressure of 1 to 2.5 bara and a temperature of +10 to +25°C. However, the supply pressure can also be up to 6 bara.

[0009] The cryogen supply system can also be referred to as a hydrogen supply system. Specifically, the cryogen supply system is a pipe for conveying or transporting the cryogen. Alternatively, the cryogen supply system can also be a storage container or tank for storing the cryogen. Therefore, the cryogen supply system can also be referred to as a cryogen supply pipe or a cryogen storage container. In the following, it is assumed that the cryogen supply system is a pipe, specifically a cryogen supply pipe. The heat conduction device can also be referred to as a heat transfer device.

[0010] The process pipe is in direct contact with the cryogen. This means, in particular, that the cryogen is conveyed through the process pipe. The cryogen supply system has a central or symmetry axis, around which the process pipe and the protective barrier can be rotationally symmetrical. The protective barrier completely surrounds the process pipe in one circumferential direction. This means, in particular, that the protective barrier completely encloses the process pipe. The gap provided between the process pipe and the protective barrier can be filled, at least partially, with a damping or insulating element. The gap can also be subjected to a negative pressure or vacuum. The gap can also be filled with gas.

[0011] With the aid of the heat conduction device, it is possible to transfer heat from the process pipe through which the cryogen flows to the protective barrier and vice versa. The temperature sensor itself is preferably in contact with the protective barrier. Thus, the heat transferred from the process pipe to the protective barrier via the heat conduction device can be transferred to the temperature sensor or vice versa. This allows at least an indirect or indirect temperature determination of the process pipe or the cryogen.

[0012] The fact that the temperature sensor is arranged "outside" the protective barrier means, in particular, that the temperature sensor is not located within the gap. Specifically, the temperature sensor is located outside the gap. The thermal coupling of the temperature sensor to the heat-conducting device preferably occurs indirectly via the protective barrier arranged between the heat-conducting device and the temperature sensor. Thus, the heat-conducting device transfers heat to the protective barrier, or vice versa, which in turn transfers heat to the temperature sensor, or vice versa. The temperature sensor can be referred to as a temperature transducer. Several temperature sensors can be provided.

[0013] According to one embodiment, the heat conducting device is connected to the process pipe and / or the protective barrier by force-fit, material-fit and / or form-fit.

[0014] Preferably, the heat-conducting device comprises an annular base element with a cylindrical outer surface and a cylindrical inner surface. The inner surface is, in particular, at least thermally connected to the process pipe. Similarly, the outer surface is, in particular, at least thermally connected to the protective barrier. A force-fit connection requires a normal force acting on the surfaces to be joined. Force-fit connections can be achieved through frictional engagement. Mutual displacement of the surfaces is prevented as long as a counterforce caused by static friction is not exceeded. For example, the heat-conducting device is pressed or shrunk onto the process pipe. Similarly, the heat-conducting device can be pressed into the protective barrier. In material-bonded connections, the joining partners are held together by atomic or molecular forces.Material-bonded connections are permanent joints that can only be separated by destroying the bonding material and / or the components being joined. For example, the base element is bonded, soldered (especially hard-soldered), and / or welded to the process pipe and / or the protective barrier. A form-fit connection is created by the interlocking or overlapping of at least two components.

[0015] According to another embodiment, the heat conducting device has a slot extending along a radial direction of the heat conducting device, which completely penetrates the heat conducting device.

[0016] The heat-conducting device is preferably associated with the aforementioned axis of symmetry, with respect to which the heat-conducting device is essentially rotationally symmetrical. The aforementioned base element of the heat-conducting device is also rotationally symmetrical with respect to the axis of symmetry. The slot extends from the inside of the base element to the outside of the base element. The radial direction is perpendicular to the axis of symmetry and oriented away from it. The heat-conducting device, or rather the base element, thus has an annular geometry, which, however, is not closed but open. The slot allows the heat-conducting device to be elastically deformed and, for example, expanded or compressed in the radial direction. This can be advantageous during assembly of the heat-conducting device.

[0017] According to another embodiment, the heat conducting device is either fluid-permeable or fluid-impermeable.

[0018] For example, the gap is gas-filled. If the heat transfer device is fluid-permeable, the gas can pass through it. This can be achieved by providing holes, openings, or recesses. This avoids dividing the gap into separate gas or pressure chambers. If the heat transfer device is fluid-impermeable, the gas cannot pass through it. This allows the gap to be deliberately divided into multiple gas or pressure chambers.

[0019] According to another embodiment, the heat conducting device has recesses which are designed as through holes or as blind holes.

[0020] The recesses are provided in or on the base element. Accordingly, the base element has these recesses. The number of recesses is arbitrary. The recesses can have any cross-sectional geometry. For example, the recesses can be circular or polygonal. Recesses can be designed as through holes as well as blind holes. The recesses allow the thermal conductivity of the heat-conducting device to be modified, in particular reduced, in certain areas. This is achieved by locally reducing the material thickness of the heat-conducting device or the base element. This leads to reduced heat conductivity in the area of ​​the respective recess. The recesses act as thermal insulation.In areas without recesses, the thermal conductivity remains unchanged. These areas without recesses can therefore be used for targeted local heat conduction. The heat-conducting device or base element can thus have a spoke-wheel-shaped geometry. If the recesses are through-holes, the gas in the gap can flow through them.

[0021] According to another embodiment, the recesses are at least partially filled with a plastic material.

[0022] This further reduces the thermal conductivity of the heat-conducting device in certain areas. Polytetrafluoroethylene (PTFE), for example, can be used as a suitable plastic material. The plastic material is provided, for instance, in the form of plugs that fit into the recesses. With the help of this plastic material, the recesses can be sealed fluid-tight if they are designed as through-holes.

[0023] According to a further embodiment, the recesses are arranged unevenly spaced apart from each other in a circumferential direction of the heat conducting device, so that at least one recess-free area is provided between two adjacent recesses.

[0024] "Cutout-free" in this context means that no cutouts are provided in the aforementioned area. The area is therefore solid. As a result, the cutout-free area has increased or improved thermal conductivity compared to areas with cutouts. This makes it possible to conduct heat selectively from the process pipe to the protective barrier, preferably only in the area where the temperature sensor makes contact with the protective barrier.

[0025] According to another embodiment, the gap is filled with gas, in particular with helium.

[0026] The gas must be selected specifically so that it does not condense during operation of the cryogen supply system. When using the cryogen supply system with hydrogen, helium is particularly suitable as the gas for filling the gap. Helium does not condense at the temperatures encountered with liquid hydrogen. However, other suitable gases can also be used.

[0027] According to another embodiment, the cryogen supply system further comprises a vacuum shell in which the protective barrier is contained, and a gap provided between the protective barrier and the vacuum shell.

[0028] The gap provided between the process pipe and the protective barrier can be referred to as the first gap. Similarly, the gap provided between the protective barrier and the vacuum shell can be referred to as the second gap. The vacuum shell is, in particular, tubular. The vacuum shell can therefore also be referred to as the vacuum pipe. The vacuum shell completely surrounds the protective barrier, which in turn completely surrounds the process pipe. This means, in particular, that the cryogen supply system is three-layered, with the process pipe forming the innermost or first layer or shell, the protective barrier forming the second layer or shell, and the vacuum shell forming the third layer or shell. The process pipe, the protective barrier, and / or the vacuum shell can be made of a metallic material, such as an aluminum alloy or stainless steel.

[0029] According to another embodiment, the temperature sensor is guided through the vacuum shell and the gap to the protective barrier.

[0030] This allows the temperature sensor to make direct contact with the protective barrier. The temperature sensor is thus positioned, at least partially, in the second gap provided between the vacuum envelope and the protective barrier.

[0031] According to another embodiment, the cryogen supply system further comprises a protective tube in which the temperature sensor is housed, wherein the protective tube is led through the vacuum shell and the gap to the protective barrier.

[0032] The protective tube is positioned perpendicular to the axis of symmetry of the cryogen supply system. The protective tube may have a cap or closure at its end face, which is in contact with the protective barrier. In this case, the temperature sensor makes contact with this cap or closure. Alternatively, the protective tube may be directly connected to the protective barrier, so that the temperature sensor housed within the protective tube makes direct contact with the protective barrier. In this case, the protective tube has no cap or closure.

[0033] According to another embodiment, the protective tube is fluid-tight and connected to the vacuum shell.

[0034] In particular, the protective tube is bonded to the vacuum enclosure. For example, the protective tube is soldered, especially hard-soldered, or welded into the vacuum enclosure. The protective tube can also be bonded to the protective barrier.

[0035] According to another embodiment, the heat conducting device has a heat conducting element for transferring heat from the process pipe to the protective barrier or vice versa.

[0036] The heat-conducting element allows for the localized concentration of heat transfer. It can be cylindrical or rod-shaped. The heat-conducting element can also be referred to as a heat transfer reservoir or a heat transfer element.

[0037] According to a further embodiment, the heat conducting device has a base element which carries the heat conducting element, wherein the thermal conductivity of a material from which the heat conducting element is made is greater than the thermal conductivity of a material from which the base element is made.

[0038] For example, the base element can be made of corrosion-resistant or stainless steel. In this case, the heat-conducting element can be made of, for example, a copper alloy or an aluminum alloy. Multiple heat-conducting elements can be used. The number of heat-conducting elements is essentially arbitrary. For example, there can be exactly one heat-conducting element. However, there can also be two, three, or more than three heat-conducting elements.

[0039] According to another embodiment, the base element has a bore in which the heat conducting element is received, wherein an axis of symmetry of the bore is oriented perpendicular to an axis of symmetry of the heat conducting device.

[0040] For example, the heat-conducting element is pressed into the bore of the base element. The bore extends from the outside of the base element to the inside. Thus, the bore completely penetrates the base element in the radial direction.

[0041] The term "one" here is not necessarily to be understood as restricting it to exactly one element. Rather, it can also refer to multiple elements, such as two, three, or more. Likewise, every other counter used here is not to be understood as restricting the number to exactly the stated number of elements. Instead, numerical deviations, both higher and lower, are possible unless otherwise specified.

[0042] Other possible implementations of the cryogen supply system also include combinations of features or embodiments described previously or subsequently with regard to the exemplary embodiments, even if not explicitly mentioned. In such cases, the person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the cryogen supply system.

[0043] Further advantageous embodiments and aspects of the cryogen supply system are the subject of the dependent claims and the exemplary embodiments of the cryogen supply system described below. The cryogen supply system is further explained below with reference to preferred embodiments and the accompanying figures. Fig. 1 shows a schematic sectional view of an embodiment of a cryogen supply system; Fig. 2 shows a schematic overview of a heat conduction device for the cryogen supply system according to Fig. 1 ; Fig. 3 shows a schematic sectional view of the heat conducting device according to section line III-III of the Fig. 2 ; and Fig. 4 shows another schematic sectional view of the heat conducting device according to section line IV-IV of the Fig. 2 .

[0044] In the figures, identical or functionally equivalent elements have been given the same reference symbols, unless otherwise indicated.

[0045] The Fig. 1 Figure 1 shows a schematic sectional view of an embodiment of a cryogen supply system 1. The cryogen supply system 1 can be a pipe or a container. The cryogen supply system 1 is suitable for supplying a cryogen, in particular hydrogen H2, to a consumer 2, for example, a fuel cell. The cryogen supply system 1 can therefore also be referred to as a hydrogen supply system.

[0046] Furthermore, the cryogenic supply system 1 can also be suitable for storing hydrogen (H2). The cryogenic supply system 1 can be a storage container for hydrogen (H2). However, the cryogenic supply system 1 can also be a pipe for conveying or transporting hydrogen (H2). In the following, it will be assumed that the cryogenic supply system 1 is a pipe or a transport line.

[0047] Cryogen supply system 1 is suitable for receiving and / or pumping liquid hydrogen H₂ (boiling point 1 bara: 20.268 K = -252.882 °C). However, cryogen supply system 1 can also be used for other cryogenic fluids or cryogenic liquids. Examples of cryogenic fluids or liquids, or simply cryogens, include, in addition to the aforementioned liquid hydrogen H₂, liquid helium He (boiling point 1 bara: 4.222 K = -268.928 °C), liquid nitrogen N₂ (boiling point 1 bara: 77.35 K = -195.80 °C), and liquid oxygen O₂ (boiling point 1 bara: 90.18 K = -182.97 °C).

[0048] The cryogen supply system 1 is suitable for use in or on a vehicle (not shown). The vehicle can be, for example, a maritime vessel, in particular a ship. The vehicle can be referred to as a maritime vessel. In particular, the vehicle can be a maritime passenger ferry. Alternatively, the vehicle can also be a land vehicle. However, it is assumed below that the vehicle is a vessel.

[0049] In this context, a "fuel cell" is understood to be a galvanic cell that converts the chemical reaction energy of a continuously supplied fuel, in this case hydrogen, and an oxidizing agent, in this case oxygen, into electrical energy. The resulting electrical energy can, for example, power an electric motor (not shown), which in turn drives a propeller to propel the vehicle. Cryogenic supply system 1 is provided to supply the consumer 2 with hydrogen (H2).

[0050] The cryogenic supply system 1 is suitable for supplying gaseous hydrogen H2 to the consumer 2, which is preferably a fuel cell, at a defined supply pressure and temperature. For example, the hydrogen H2 is supplied to the consumer 2 in gaseous form at a supply pressure of 1 to 2.5 bara and a temperature of +10 to +25 °C. However, the supply pressure can also be up to 6 bara.

[0051] The cryogen supply system 1 is a pipe and can therefore also be referred to as a cryogen supply pipe. The cryogen supply system 1 is rotationally symmetrical about a central or symmetry axis 3. A longitudinal direction L of the cryogen supply system 1 is oriented along the symmetry axis 3. The cryogen supply system 1 has a main pipe or process pipe 4 through which the liquid hydrogen H2 is passed. The process pipe 4 is in direct contact with the liquid hydrogen H2. The process pipe 4 can be made of a metallic material, in particular stainless steel.

[0052] The process pipe 4 is contained within a tubular protective barrier 5, which completely encloses the process pipe 4. A space or gap 6 is provided between the process pipe 4 and the protective barrier 5. The gap 6 can be filled with an inert gas, for example, nitrogen or helium (He). The gap 6 can also be subjected to a negative pressure or a vacuum. In this vacuum, a negative pressure prevails compared to the environment 7 of the cryogen supply system 1. A damping or insulating element can be provided in the gap 6, which at least partially or completely fills the gap 6. The insulating element can have or be designed as a multilayer insulation layer (MLI). The protective barrier 5 can be made of a metallic material, for example, an aluminum alloy or stainless steel.

[0053] A tubular vacuum enclosure 8 surrounds the protective barrier 5. A gap or space 9 is provided between the protective barrier 5 and the vacuum enclosure 8. The space 9 can be pressurized or vacuum-operated. An insulating or damping element can be provided in the space 9, at least partially or completely filling the space 9. The insulating element can have a multi-layered insulating layer as mentioned above, or be designed as such. The vacuum enclosure 8 can be made of a metallic material, for example, an aluminum alloy or stainless steel. The vacuum enclosure 8 separates the cryogen supply system 1 from the environment 7.

[0054] The cryogen supply system 1 further comprises a temperature measurement arrangement 10, which includes a temperature transducer or temperature sensor 11, with which the temperature of the liquid hydrogen H2 in the process tube 4 can be detected. In addition to the temperature sensor 11, the temperature measurement arrangement 10 has a protective tube 12, which is positioned perpendicular to the axis of symmetry 3. The temperature sensor 11 is housed in the protective tube 12.

[0055] The protective tube 12 extends through the vacuum envelope 8 to the protective barrier 5, so that the protective tube 12 abuts the protective barrier 5. The protective tube 12 thus extends through the gap 9. The protective tube 12 can be soldered or welded into the vacuum envelope 8. The protective tube 12 does not extend through the protective barrier 5. However, the protective tube 12 can be connected to the protective barrier 5 at its end face, for example, by soldering or welding. The protective tube 12 is thus sealed at its end face by the protective barrier 5. Alternatively, the protective tube 12 can be sealed fluid-tight with a cover or the like on the side facing the protective barrier 5. In the latter case, the cover can, for example, rest against the protective barrier 5. With respect to a gravitational direction g, the protective tube 12 is positioned at the lowest point or region of the protective barrier 5.

[0056] The temperature measuring arrangement 10 further comprises a heat transfer device or heat conducting device 13 for transferring or conducting heat Q from the process pipe 4 to the protective barrier 5 and vice versa. The heat conducting device 13 is thus also suitable for transporting heat Q from the liquid hydrogen H2 flowing through the process pipe 4 to the temperature sensor 11 and vice versa. The heat conducting device 13 is sleeve-shaped or ring-shaped and surrounds the process pipe 4. The heat conducting device 13 can also be referred to as a heat-conducting sleeve or heat-conducting ring. The heat conducting device 13 is positioned in the gap 6. For example, the heat conducting device 13 is materially bonded to the process pipe 4 and to the protective barrier 5.

[0057] In bonded connections, the components are held together by atomic or molecular forces. Bonded connections are permanent and can only be separated by destroying the bonding agent and / or the components themselves. Bonded connections can be achieved, for example, by gluing, brazing, soldering, or welding. This means that the heat-conducting device 13 is bonded, soldered (especially brazed), and / or welded to the process tube 4 and / or the protective barrier 5. Optionally or additionally, a force-fit connection and / or a form-fit connection may also be provided.

[0058] The Fig. 2 Figure 1 shows a schematic top view of an embodiment of a heat conducting device 13 as previously mentioned. Fig. 3 shows a schematic sectional view of the heat conducting device 13 according to section line III-III of the Fig. 2 . The Fig. 4shows another schematic sectional view of the heat conducting device 13 according to section line IV-IV of the Fig. 2 The following refers to the Figs. 2 to 4 Reference was made at the same time.

[0059] The heat conducting device 13 comprises a base body or base element 14. The base element 14 is annular or sleeve-shaped and is rotationally symmetrical about a central or symmetry axis 15. A cylindrical outer surface 16 of the base element 14 is thermally coupled to the protective barrier 5. For example, the outer surface 16 is bonded to the protective barrier 5. The outer surface 16 is rotationally symmetrical about the symmetry axis 15. The symmetry axes 3 and 15 can be arranged coaxially.

[0060] Facing away from the outer surface 16, the base element 14 has a cylindrical inner surface 17 that defines an opening 18 that penetrates the heat conducting device 13 centrally. The process tube 4 passes through the opening 18. The inner surface 17 is thermally coupled to the process tube 4. For example, the inner surface 17 is bonded to the process tube 4 by a material bond. The inner surface 17 is rotationally symmetrical about the axis of symmetry 15.

[0061] Viewed along a circumferential direction U, which is oriented along the outer side 16 or along the inner side 17, the heat conducting device 13 or the base element 14 is not closed in a ring shape, but is open and has a gap or slot 19 which, viewed along a radial direction R, which is oriented perpendicular to and away from the axis of symmetry 15, extends from the inner side 17 to the outer side 16 and thus completely penetrates the base element 14.

[0062] The heat-conducting device 13, or base element 14, comprises a first end face 20 and a second end face 21 facing away from the first end face 20. A plurality of recesses 22 to 29 extend from at least one end face 20, 21 into or through the base element 14. The recesses 22 to 29 can be designed as blind holes, as shown in the Fig. 4as shown by recess 22. Alternatively, recesses 22 to 29 can be through holes, as shown in the Fig. 4 as shown by the recess 27. Each recess 22 to 29 is assigned a central or symmetry axis 30, 31, which is arranged parallel to the symmetry axis 15 and spaced apart from it along the radial direction R.

[0063] With the aid of the recesses 22 to 29, it is possible to design the heat-conducting device 13 such that as little material as possible is arranged between the inner surface 17 and the outer surface 16. The recesses 22 to 29 impede the transfer of heat Q from the inner surface 17 to the outer surface 16 and vice versa. A region 32 between the recesses 22 and 29 is free of holes or recesses, i.e., solid. This means that no recesses 22 to 29 are provided in region 32. As a result, the heat conduction in region 32 is improved compared to the area without recesses 22 to 29.

[0064] If the recesses 22 to 29 are designed as through-holes, it is possible for a gas, for example helium (He), contained in the gap 6 to flow through the heat conducting device 13. The heat conducting device 13 is therefore fluid-permeable. The heat conducting device 13 can, for example, be designed as a fluid-permeable spoked wheel. However, this is not mandatory. This means that the heat conducting device 13 can also be fluid-tight.

[0065] The recesses 22 to 29 can be filled with a poorly thermally conductive material, such as a plastic. Polytetrafluoroethylene (PTFE) can be used as the plastic material. The plastic material can be in the form of plugs that close the recesses 22 to 29. If the recesses 22 to 29 are filled with the plastic material, the flow of gas, in particular helium (He), contained in the gap 6 through the heat conducting device 13 can be prevented. Alternatively, the recesses 22 to 29 can be designed as blind holes. Due to the fluid tightness of the heat conducting device 13, local convective heat transfer Q by the gas, in particular helium (He), contained in the gap 6 can be avoided or at least reduced.

[0066] The base element 14 has a bore 33 with a central or symmetry axis 34, which is oriented perpendicular to the symmetry axis 15. The bore 33 extends from the outer surface 16 towards the inner surface 17. The bore 33 penetrates both the outer surface 16 and the inner surface 17. A thermal conducting element 35 is accommodated in the bore 33. The thermal conducting element 35 can also be referred to as a thermal storage element.

[0067] The heat-conducting element 35 is cylindrical. The heat-conducting element 35 can be pressed into the bore 33. The heat-conducting element 35 contacts both the process tube 4 and the protective barrier 5 and thus serves to transfer heat Q from the process tube 4 to the protective barrier 5 and vice versa. More than one heat-conducting element 35 can be provided. The heat-conducting element 35 is arranged in the area 32.

[0068] The thermal conductivity element 35 can also be referred to as a heat transfer element, thermal conductor, thermal insert, or guide element insert. The thermal conductivity element 35 is made of a material with a higher thermal conductivity than the material from which the base element 14 is made. For example, the thermal conductivity element 35 is made of a copper alloy or an aluminum alloy. The base element 14 itself can, for example, be made of stainless steel, which has a lower thermal conductivity than the material used for the base element 14. The base element 14 can also be made of a plastic material, particularly one that is non-outgassing.

[0069] Heat is then conducted from the hydrogen H2 to the process tube 4, from the process tube 4 to the heat-conducting element 35, from the heat-conducting element 35 to the protective barrier 5, and from the protective barrier 5, optionally via the interposition of the protective tube 12, to the temperature sensor 11, or vice versa. If the heat-conducting device 13 does not have a heat-conducting element 35, the base element 14 itself takes over the heat transfer.

[0070] With the aid of the heat conducting device 13, it is thus possible to perform a temperature measurement that reacts sufficiently quickly from a process engineering perspective while simultaneously allowing as little heat conduction as possible. Advantageously, the protective barrier 5 is not breached or damaged for temperature measurement. Advantageously, the heat conducting device 13 does not lead to a segmentation of the gap 6. This can be achieved by the fluid permeability of the heat conducting device 13.

[0071] The heat conduction device 13 is designed in such a way that a process temperature of the hydrogen H2 is directed for temperature measurement.

[0072] The heat-conducting device 13 is thus a sleeve that is positively inserted between the protective barrier 5 and the vacuum envelope 8. The heat-conducting device 13 is positively and / or materially bonded to the protective barrier 5 and / or the vacuum envelope 8.

[0073] To mount the heat-conducting device 13, it is inserted as a fitting and positively connected to the protective barrier 5 and / or the vacuum shell 8. For easier installation, the base element 14 is designed as a single, slotted piece or as a multi-part structure consisting of several segments. "Single-piece" or "one-piece" in this context means that the base element 14 is not composed of different components, but rather forms a single component. "One-piece material" in this context means that the base element 14 is manufactured entirely from the same material.

[0074] The base element 14, or the heat-conducting device 13, is slotted. This is particularly advantageous when the gap 6 is filled with a gas to detect leaks between individual passages. The position of the heat-conducting element 35 can be chosen arbitrarily. For example, a measurement of the coldest temperature ( Fig. 1) at 6 o'clock (bottom +- 90°) or a measurement of the warmest temperature at 12 o'clock (top +- 45°).

[0075] Due to the possible temperature differences between the process tube 4 and the protective barrier 5, the material of the base element 14 is preferably selected such that an equal or smaller coefficient of thermal expansion than the smaller coefficient of thermal expansion of the process tube 4 or the protective barrier 5 is achieved.

[0076] The temperature sensor 11 can be installed without a protective sleeve. In a three-shell configuration of the cryogenic supply system 1, one shell can be designed as vacuum insulation or superinsulation, and the inner shell can be filled with a gas. When using liquid hydrogen (H₂), this gas is helium (He). Only helium (He) does not condense at the temperatures encountered with liquid hydrogen (H₂).

[0077] By filling the gap 6 with an inert gas, a leak between all passages can be detected. The temperature sensor 11 is installed on the vacuum envelope 8. The vacuum envelope 8 is therefore not breached. It is possible to provide several heat-conducting elements 35 for the spatially close installation of multiple temperature sensors 11.

[0078] Although the present invention has been described using exemplary embodiments, it can be modified in many ways without leaving the scope of protection of the attached claims. Reference symbols used

[0079] 1 Cryogen supply system 2 Consumer 3 Axis of symmetry 4 Process tube 5 Protective barrier 6 Gap 7 Environment 8 Vacuum envelope 9 Gap 10 Temperature measuring arrangement 11 Temperature sensor 12 Protective tube 13 Heat conducting device 14 Base element 15 Axis of symmetry 16 Outer side 17 Inner side 18 Opening 19 Slot 20 End side 21 End side 22 Recess 23 Recess 24 Recess 25 Recess 26 Recess 27 Recess 28 Recess 29 Recess 30 Axis of symmetry 31 Axis of symmetry 32 Area 33 Bore 34 Axis of symmetry 35 Heat conducting element g Direction of gravity He Helium / Gas H2 Hydrogen / Cryogen L Longitudinal direction Q Heat R Radial direction U Circumferential direction

Claims

1. Cryogen supply system (1) for supplying a cryogen (H2) to a consumer (2), comprising a process pipe (4) through which the cryogen (H2) can be conducted, a protective barrier (5) in which the process pipe (4) is accommodated, a gap (6) which is provided between the process pipe (4) and the protective barrier (5), a heat conduction device (13) which is arranged in the gap (6) and is designed to transfer heat (Q) from the process pipe (4) to the protective barrier (5) or vice versa, and a temperature sensor (11) arranged outside the protective barrier (5) for detecting a temperature of the cryogen (H2), wherein the temperature sensor (11) is thermally coupled to the heat conduction device (13).

2. Cryogen supply system according to claim 1, wherein the heat conduction device (13) is connected to the process pipe (4) and / or the protective barrier (5) in a force-fitting, integrally bonded, and / or form-fitting manner.

3. Cryogen supply system according to claim 1 or claim 2, wherein the heat conduction device (13) has a slot (19) which extends in a radial direction (R) of the heat conduction device (13) and passes fully through the heat conduction device (13).

4. Cryogen supply system according to any of claims 1 - 3, wherein the heat conduction device (13) is fluid-permeable or fluid-impermeable.

5. Cryogen supply system according to any of claims 1 - 4, wherein the heat conduction device (13) has recesses (22 - 29) which are in the form of through holes or blind holes.

6. Cryogen supply system according to claim 5, wherein the recesses (22 - 29) are filled at least in part with a plastics material.

7. Cryogen supply system according to claim 5 or claim 6, wherein the recesses (22 - 29) are arranged so as to be unevenly spaced apart in a peripheral direction (U) of the heat conduction device (13), so that at least one recess-free region (32) is provided between two adjacent recesses (22, 29).

8. Cryogen supply system according to any of claims 1 - 7, wherein the gap (6) is gas-filled, in particular filled with helium (He).

9. Cryogen supply system according to any of claims 1 - 8, further comprising a vacuum envelope (8) in which the protective barrier (5) is accommodated and a gap (9) provided between the protective barrier (5) and the vacuum envelope (8).

10. Cryogen supply system according to claim 9, wherein the temperature sensor (11) is guided through the vacuum envelope (8) and the gap (9) to the protective barrier (5).

11. Cryogen supply system according to claim 10, further comprising a protective tube (12) in which the temperature sensor (11) is accommodated, wherein the protective tube (12) is guided through the vacuum envelope (8) and the gap (9) to the protective barrier (5).

12. Cryogen supply system according to claim 11, wherein the protective tube (12) is fluid-tightly connected to the vacuum envelope (8).

13. Cryogen supply system according to any of claims 1 - 12, wherein the heat conduction device (13) comprises a heat conduction element (35) for transferring heat (Q) from the process tube (4) to the protective barrier (5) or vice versa.

14. Cryogen supply system according to claim 13, wherein the heat conduction device (13) comprises a base element (14) which carries the heat conduction element (35), wherein the thermal conductivity of a material from which the heat conduction element (35) is made is greater than the thermal conductivity of a material from which the base element (14) is made.

15. Cryogen supply system according to claim 14, wherein the base element (14) has a bore (33) in which the heat conduction element (35) is accommodated, wherein an axis of symmetry (34) of the bore (33) is oriented perpendicularly to an axis of symmetry (15) of the heat conduction device (13).