Double sided grinding machine and method for operating a double sided grinding machine

A separate heating device for double-sided machining machines preheats discs to operating temperature, addressing suboptimal results post-downtime by ensuring consistent quality and efficiency.

EP4091767B1Active Publication Date: 2026-03-04LAPMASTER WOLTERS GMBH
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Patent Information

Application Number
EP2022166751
Authority / Receiving Office
EP · EP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-05-20
Filing Date
2022-04-05
Publication Date
2026-03-04
Estimated Expiration
2042-04-05

AI Technical Summary

Technical Problem

Double-sided machining centers, such as polishing machines, experience suboptimal machining results and reduced throughput after prolonged downtime due to insufficient temperature of the machining discs, leading to increased costs and lower quality workpieces.

Method used

Implementing a separate external heating device to preheat the machining discs to operating temperature before machining, eliminating the need for warm-up cycles during initial passes.

Benefits of technology

Ensures optimal machining quality in the first cycle post-downtime, increasing throughput and reducing costs by maintaining consistent disc temperature without additional warm-up cycles.

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Abstract

The invention relates to a method for operating a double-sided machining machine, in particular a double-sided polishing machine, comprising an upper working disc and a lower working disc which are rotatable relative to each other by means of a rotary drive and between which a working gap is formed for machining flat workpieces, wherein, prior to a machining step for machining workpieces, at least the working discs are heated to an operating temperature by means of a heating device in a warm-up step. The invention also relates to a corresponding double-sided machining machine.
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Citation Information

Patent Citations

  • Double sided polishing machine

    US20060040589A1

  • Method For The Simultaneous Double-Side Grinding Of A Plurality Of Semiconductor Wafers, And Semiconductor Wafer Having Outstanding Flatness

    US20080014839A1

  • Machining machine and method for operating a machining machine

    US20170225292A1