Cooling device for a heat source and heat source assembly

Abstract

Cooling device (3) for a heat source (2), comprising a heat sink (4), a heat-conducting support body (5), at least one heat pipe (6) extending along a longitudinal axis (L), wherein a first section (8) of the heat pipe (6) is thermally connected to the support body (5) and a second section (9) of the heat pipe (6), spaced apart from the first section (8), is thermally connected to the heat sink (4), and at least one heat transfer plate (11) arranged between the support body (5) and at least one of the heat pipes (6), which is connected in a region to the at least one heat pipe (6) in a region of planar and rotationally secure manner, and which is connected in a region of planar to the support body (5) so that the support body (5) is rotatable relative to the at least one heat transfer plate (11) about at least one axis of rotation (R1, R2, R3).

Description

[0001] The invention relates to a cooling device for a heat source, comprising a cooling element, a support body for the heat source and at least one heat pipe, according to the preamble of claim 1.

[0002] The invention also relates to a heat source arrangement consisting of the cooling device and the heat source.

[0003] Numerous different heat sources are known that release useful heat and / or waste heat into the environment, such as heating elements, light sources, energy converters, voltage and / or current transformers, or power units, to name just a few. Often, there is a need to dissipate the heat from the heat source in a controlled manner to cool the heat source and, in particular, to prevent overheating of the heat source or adjacent components.

[0004] For example, a light source or lamp / light fixture often requires sufficient cooling to ensure high light output over a long period. The waste heat generated during operation of the light source must be effectively dissipated from its point of origin and then released into the surrounding environment in a controlled manner.

[0005] For effective and controlled heat dissipation from a heat source, it is known to attach the heat source to a thermally conductive support body and to arrange a so-called heat pipe, i.e., a heat tube, between the support body and a heat sink. A heat pipe is a known heat exchanger that, by utilizing the enthalpy of vaporization of a medium, enables a high heat flux density, allowing large quantities of heat to be transported over a small cross-sectional area and, due to its tubular, elongated shape, also with great flexibility between at least two locations. A corresponding arrangement is described, for example, in DE 20 2008 010 175 U1 for a signal lamp and its circuit arrangement.

[0006] A problem with heat dissipation arises, however, when the heat source needs to be movable relative to its surroundings, for example, if it needs to be rotatable or tiltable. This is a common requirement for light sources and lamps. To maintain good heat dissipation, the lamps are usually rigidly connected to the heat conductors / heat sinks, which means the entire assembly, often heavy and bulky due to the heat sink, has to be moved. The technical requirements, especially for fixing such an assembly in a tilted position, are extremely high.

[0007] To solve this problem, US Patent 2006 / 044804A1 proposes connecting the light source's support body to a heat pipe in a movable manner by forming a hinged connection between the support body and the heat pipe. Depending on the design of the hinge, rotation of the support body with the attached light source around up to three orthogonal axes of rotation or degrees of freedom is possible, while the rest of the assembly, in particular the heat pipe and the heat sink, can remain stationary.

[0008] However, it has been shown that creating a joint connection between the support body and the heat pipe is complex and expensive to manufacture, and can lead to high susceptibility to wear and tear, thus generally resulting in a short service life for the cooling device. With this solution, there is also a risk of plastically deforming the sensitive heat pipe and thereby mechanically damaging it when aligning the light source or the support body. Furthermore, fixing the support body in the aligned position can sometimes be difficult: if the joint is too stiff, the mechanical stress on the heat pipe increases when the joint is actuated; if the joint is too loose, the fixation in the intended position may not be sufficient.

[0009] Therefore, there is a need to further improve existing cooling devices.

[0010] WO 2012 / 171734 A1 relates to a heat dissipation structure for a lighting system according to the preamble of claim 1. For further technological background, reference is made to US 2012 / 168129 A1, which relates to an adaptive heat dissipation device having sufficient degrees of freedom to rotate in different directions and tilt at different angles. CN 106642034 A discloses a heat dissipation system for a luminaire arranged in a busbar.

[0011] In view of the prior art, the object of the present invention is to provide a cooling device for a heat source, in particular a cooling device for a light source, which enables good heat dissipation of the heat generated by the heat source and at the same time allows flexible rotation of the heat source, preferably with low susceptibility to wear.

[0012] The present invention also aims to provide a heat source arrangement comprising a heat source and a cooling device for the heat source, in which good heat dissipation of the heat generated by the heat source and at the same time flexible rotation of the heat source is enabled, preferably with low susceptibility to wear.

[0013] The problem is solved for the cooling device by the features listed in claim 1. With regard to the heat source arrangement, the problem is solved by the features of claim 14. The dependent claims and the features described below relate to advantageous embodiments and variants of the invention.

[0014] A cooling device for a heat source is proposed.

[0015] The cooling device is preferably a passive cooling device, meaning it dissipates heat from the heat source without active components such as fans, pumps, or other components requiring electrical power. However, active components can also be incorporated to further optimize heat dissipation.

[0016] According to the invention, the cooling device has a heat sink.

[0017] The heat sink can dissipate the heat from the heat source to the environment, for example to a fluid surrounding the heat sink (e.g., ambient air and / or a coolant), preferably through thermal radiation and convection. The heat sink allows the surface area available for heat dissipation to be defined or increased.

[0018] It should be noted here that, within the scope of the invention, a "heat sink" can essentially be understood as any heat sink within the cooling device, even if it goes beyond the conventional definition of a heat sink. The essential point is that the heat sink is capable of sufficiently dissipating or otherwise releasing the heat supplied to it via the heat pipes mentioned below.

[0019] Preferably, the heat sink is made of a material with a thermal conductivity suitable for functional heat conduction.

[0020] Insofar as the present description refers to a "material with a thermal conductivity suitable for functional heat conduction" (for example, in connection with the heat sink, the support body mentioned below, the heat transfer plate mentioned below, or any other component), this refers in particular to a material that a person skilled in the art would use for heat conduction, as opposed to a material that a person skilled in the art would use for thermal insulation.

[0021] A material suitable for functional heat conduction can, for example, have the thermal conductivity of a metal.

[0022] A material suitable for functional heat conduction may preferably have a thermal conductivity of at least 10 watts per meter and Kelvin, particularly preferably a thermal conductivity of at least 100 watts per meter and Kelvin, most preferably a thermal conductivity of at least 200 watts per meter and Kelvin, and more preferably a thermal conductivity of at least 400 watts per meter and Kelvin.

[0023] Preferably, the material suitable for functional heat conduction is copper, aluminium or steel or structural steel, although other materials may also be used, in particular metals and metal alloys.

[0024] According to the invention, the cooling device has a carrier body made of a material with a thermal conductivity suitable for functional heat conduction, wherein the heat source can be thermally connected to the carrier body.

[0025] Preferably, the support body is directly connectable to, or connected to, the heat source. In principle, but less preferably, an indirect connection is also possible, particularly if the other components involved in the connection between the support body and the heat source also have high thermal conductivity.

[0026] The support body advantageously serves to hold the heat source. The heat source can be detachably attached to the support body, for example, by means of mechanical fasteners (such as screws or snap-fit ​​elements). The support body can be connected to the heat source by frictional, form-fitting, and / or material bonding.

[0027] Preferably, the support body and the heat source are connected to each other over a flat surface, so that particularly good and direct heat conduction from the heat source to the support body can take place.

[0028] Preferably, the support body has significantly smaller dimensions or a smaller spatial extent than the heat sink. Preferably, the support body extends in its main plane of extension over a length that is less than 1 / 4 the length of the heat sink in its main plane of extension. Particularly preferably, the support body occupies an area in its main plane of extension that is less than 1 / 8 the area of ​​the heat sink in its main plane of extension. In principle, however, the support body can have any dimensions, for example, dimensions that essentially correspond to those of the heat sink or that are even larger or much larger than the dimensions or extent of the heat sink.

[0029] According to the invention, the cooling device comprises at least one heat pipe extending along a longitudinal axis. A first axial section of the heat pipe is thermally connected to the support body, and a second axial section of the heat pipe, spaced apart from the first axial section along the longitudinal axis, is thermally connected to the heat sink.

[0030] For the sake of simplicity, the "first axial section" will sometimes be referred to simply as the "first section" and the "second axial section" simply as the "second section".

[0031] Heat pipes are generally elongated metallic vessels (thus, in effect, tubular heat conductors) containing a hermetically sealed working fluid (e.g., distilled water or ammonia). This fluid fills the internal volume of the heat pipe partly in liquid form and partly in gaseous form. The section of the heat pipe that absorbs energy is called the "evaporator" (in this case, the first axial section). The section that releases energy is called the "condenser" (in this case, the second axial section). Heat pipes are capable of transporting large amounts of heat over a small cross-sectional area with high flexibility. Since heat pipes are generally well-known, further details are omitted.

[0032] The longitudinal length of the heat pipe can be adapted to the specific installation location of the cooling device and bridge the required distance between the support body and the heat sink. The heat pipe can preferably be flexible. For example, the axial length of the heat pipe can be approximately 4 to 10 times the largest edge length of the support body.

[0033] Within the scope of the invention, any number of heat pipes can be provided, but for example, only a single heat pipe can also be provided. Preferably, several heat pipes are provided, for example, at least two heat pipes, at least three heat pipes, at least four heat pipes, at least five heat pipes, at least six heat pipes, or even more heat pipes.

[0034] In particular, several groups of heat pipes can be provided, especially two groups of heat pipes, each group of heat pipes preferably being assigned to a separate side or side surface of the support body. A "group" within the meaning of the present invention may optionally also comprise only a single heat pipe. Preferably, however, each group comprises at least two heat pipes, but optionally also more than two heat pipes, wherein the number of heat pipes in the groups need not be identical, but is preferably identical for reasons of symmetry.

[0035] Insofar as the present invention refers to a "side surface" of the support body, this side surface is preferably an outer lateral surface of the support body.

[0036] According to the invention, the cooling device comprises at least one heat transfer plate arranged between the support body and at least one of the heat tubes. The heat transfer plate is made of a material with a thermal conductivity suitable for functional heat conduction. The heat transfer plate is connected directly to the at least one heat tube in a planar and rotationally secure manner, at least along the first axial section of the heat tube. The heat transfer plate is also connected directly to the support body in a planar manner in certain areas, so that the support body is rotatable relative to the at least one heat transfer plate about at least one axis of rotation or along at least one degree of rotational freedom.

[0037] Exactly one heat transfer plate can be provided. Preferably, however, at least two or even more heat transfer plates are provided, for example, three, four, or five heat transfer plates. In particular, it can be provided that, when using multiple heat transfer plates, each heat transfer plate is assigned to its own side or side surface of the support body.

[0038] Preferably, the support body and the heat pipe are made of a metal, in particular copper. Preferably, the heat sink is also made of a metal, in particular aluminum. Preferably, the heat transfer plate and / or the guide plate mentioned below are also made of a metal, in particular copper, aluminum, or structural steel.

[0039] In this context, a "rotationally secure" connection between the heat transfer plate and the heat pipe preferably refers to a rigid, mechanically tightly coupled connection such that the heat transfer plate cannot be rotated relative to the at least one heat pipe without plastic deformation of one of the components. However, a certain amount of play between the heat transfer plate and the heat pipe may be provided, particularly within tolerances and / or to compensate for tolerances. In particular, within the scope of the invention, the aforementioned rotationally secure connection can be understood to mean that the significant rotation occurs between the support body and the heat transfer plate, and not between the heat transfer plate and the heat pipe.

[0040] The torsion-resistant connection between the heat transfer plate and the heat pipe does not preclude the heat transfer plate from being displaceable along the at least one heat pipe. In an advantageous embodiment of the invention, displaceability between the heat transfer plate and the heat pipe along the longitudinal axis of the heat pipe can even be explicitly provided. Depending on the position of the heat transfer plate relative to the heat pipe, the first axial section for heat absorption or the axial position of the heat source can thereby be fixed or changed.

[0041] The support body can be rotatable relative to the at least one heat transfer plate about exactly one axis of rotation, about exactly two axes of rotation, or about three axes of rotation. Preferably, the aforementioned axes of rotation are oriented orthogonally to each other, thus enabling rotation along exactly one degree of freedom, along exactly two degrees of freedom, or along all three degrees of freedom.

[0042] The support body is preferably fixable in its respective rotational position. This fixability can also be achieved by designing the joints and / or hinges with sufficient resistance, so that fixation is achieved through frictional engagement or static friction between the connecting parts. However, more specific fixing devices, such as screws or locking elements, can also be provided.

[0043] The support body can be rotatable around at least one heat sink about exactly one axis of rotation, about exactly two axes of rotation, or about three axes of rotation.

[0044] A significant advantage of the cooling device according to the invention is that, in addition to efficient heat transfer, it allows for flexible rotation of the support body and thus also of the heat source connected to it. The heat source can therefore be easily aligned at different angles and adapted to specific requirements. This alignment can advantageously be achieved by positioning the support body without subjecting the heat pipes to any significant mechanical stress. As a result, the wear resistance and service life of the cooling device are considerably increased compared to the prior art.

[0045] As a rule, no changes in position relative to the support body are required at the heat source itself, although this is possible in modified versions.

[0046] The at least one heat transfer plate ensures a flat and therefore particularly effective heat transfer between the support body and the heat pipe. In this way, the heat generated by the heat source during operation can be quickly dissipated to the heat sink via the support body, the heat transfer plate, and the heat pipe. Overheating of the heat source is thus effectively prevented, allowing it to operate under optimal conditions.

[0047] In an advantageous embodiment of the invention, it can be provided that a side surface of the support body is connected to the heat transfer plate (in particular to a side surface of the heat transfer plate facing the support body) in a partially planar manner, but rotatable about at least one axis of rotation or about at least one degree of rotational freedom.

[0048] The side surface of the support body can thus be rotated relative to the heat transfer plate or the side surface of the heat transfer plate, in order to allow the rotation of the support body along at least one axis of rotation or along at least one degree of rotational freedom. At the same time, the planar connection enables high heat dissipation.

[0049] The side surface, preferably the outer surface, is preferably oriented perpendicular to the axis of rotation about which the support body can be pivoted.

[0050] Preferably, the at least one heat pipe extends laterally (at least along the first section) along the side surface of the support body, preferably parallel to the side surface of the support body that faces the heat pipe.

[0051] Preferably, the at least one heat pipe extends laterally (at least along the first section) along the side surface of the heat transfer plate, preferably parallel to the side surface of the heat transfer plate facing the heat pipe.

[0052] According to a further development of the invention, the heat transfer plate may have a guide groove or other recess or receiving section for receiving the first section of the heat tube.

[0053] The guide groove, recess, or receiving section can be designed to accommodate the heat pipe, at least partially, along its circumference. Preferably, the guide groove, recess, or receiving section can have an internal geometry that is at least substantially complementary to the outer geometry of the heat pipe.

[0054] Preferably, the guide groove is concave or has an inwardly curved geometry.

[0055] Preferably, the cross-section of the recess or receiving section is adapted to the cross-section of the heat pipe in its first section in order to receive the heat pipe as precisely and evenly as possible.

[0056] Advantageously, the guide groove, recess or receiving section can, on the one hand, enable the planar connection between the at least one heat pipe and the heat transfer plate and, on the other hand, at least partially guide, stabilize and / or fix the heat pipe.

[0057] According to a particularly preferred embodiment of the invention, the cooling device may have two of the aforementioned heat transfer plates, which are connected to different side surfaces of the support body, preferably to side surfaces of the support body facing away from each other, and in particular parallel to each other.

[0058] It can be provided that a first of the heat transfer plates is connected to a first group of the aforementioned heat pipes (which may have only a single heat pipe, but preferably exactly two heat pipes or more heat pipes) and a second of the heat transfer plates is connected to a second group of the aforementioned heat pipes (which may have only a single heat pipe, but preferably exactly two heat pipes or more heat pipes).

[0059] The use of two heat transfer plates has proven particularly advantageous, especially when the support body is positioned between the two plates. This allows for good guidance and fixation of the support body, and also, and more importantly, for significantly increased heat dissipation on both sides.

[0060] The invention is described below essentially with regard to two heat transfer plates. However, this is not to be understood as a limitation – in principle, each of the mentioned further developments, variants, configurations and embodiments can also be provided with only a single heat transfer plate or with more than two heat transfer plates. This also applies, among other things, to the guide plate(s) mentioned below.

[0061] According to a further development of the invention, it can be provided that the side surfaces of the support body, to which the heat transfer plates are connected, each run parallel to the longitudinal axis of the heat pipe in the first section.

[0062] Preferably, the side surface of the support body that is connected to the heat transfer plate, or the side surfaces of the support body to which the heat transfer plates are connected, are each designed as flat surfaces.

[0063] In this way, the support body can be rotatable along exactly one axis of rotation relative to the heat transfer plate and advantageously fixed in the other two degrees of rotational freedom. Rotation about exactly one axis is advantageous and sufficient for many applications, for example, when the heat source is a light source.

[0064] According to a further developed embodiment, the support body has a rectangular cross-section, for example a cube-shaped geometry.

[0065] The support body (regardless of its geometric design) can be a solid, i.e., filled, body. However, it can also be a hollow body. In particular, the support body can have bores, recesses, grooves, etc., for example, for attachment to the heat transfer plate or for mounting and / or accommodating the heat source.

[0066] The support body can optionally have openings for connecting lines (for example, but not exclusively, electrical lines). These connecting lines can supply the heat source with energy, data, and / or fluids to enable it to perform its intended function. Optional mounting elements for securing the connecting lines can be provided on the heat pipes and / or on the optional support bodies.

[0067] In a further development of the invention, it can be provided that the side surfaces of the support body to which the heat transfer plates are connected have a convex profile, or that the side surface of the support body to which the heat transfer plate is connected has a convex profile.

[0068] The convex profile can be formed as a defined elevation or curvature on the side surface, for example, a spherical curvature. In particular, it can also be provided that the entire side surface is curved or spherical. Preferably, the support body is substantially or completely spherical, especially in the area of ​​the side surfaces to be connected to the heat transfer plates. It should be noted here that, within the scope of the invention, the term "side surface" can also be understood as "side" in the case of overlapping side surfaces, as in a completely or approximately round body, which faces the respective component (e.g., the heat transfer plate), even though the term "side surfaces" is used below and above for the sake of simplicity.

[0069] In this way, a connection between the support body and the at least one heat transfer plate can be made in the manner of a ball joint. For example, in this non-inventional embodiment, rotation of the support body relative to the at least one heat transfer plate by up to three degrees of rotational freedom is possible.

[0070] In particular, it may be provided that the heat transfer plates for planar connection with the respective side surface of the support body each have a concave recess, preferably a recess complementary to the convex shape, in order to at least partially accommodate the support body in the recess.

[0071] In this way, a flat connection for good heat dissipation and a particularly advantageous joint connection can be provided on the one hand.

[0072] In a further development of the invention, it can be provided that the first group of heat pipes and the second group of heat pipes each have at least two heat pipes (in particular exactly two heat pipes each) which run parallel to each other at least along their first sections, and which are each connected to the associated heat transfer plate.

[0073] Using more than one heat pipe per side of the support body or per heat transfer plate can be advantageous for further increasing the mechanical stability of the cooling device while simultaneously improving cooling performance. In particular, it has been shown that a significantly more stable cooling device can be provided if, instead of a single large-diameter heat pipe per side of the support body or heat transfer plate, several smaller-diameter heat pipes are used.

[0074] According to the invention, the cooling device has at least one guide plate extending laterally or longitudinally to the at least one heat pipe for the section-wise guidance and stabilization of the at least one heat pipe along its longitudinal axis.

[0075] At least one heat pipe is arranged with its first axial section between the guide plate and the heat transfer plate.

[0076] Preferably, two guide plates are provided, in particular one guide plate per side surface of the support body or per heat transfer plate.

[0077] The guide plates significantly increase the mechanical stability of the cooling device. In particular, the heat pipes can be securely positioned between a guide plate and an associated heat transfer plate – at least in the first axial section.

[0078] The guide plate can have a greater longitudinal extent (along the heat pipes) than the heat transfer plate, preferably by at least a factor of 2, for example also by at least a factor of 3 or at least a factor of 4.

[0079] Preferably, the guide plate extends substantially or completely along the entire longitudinal extent of the at least one heat pipe, starting from the first section (including or excluding the first section) to the heat sink or to the second section (including or excluding the second section).

[0080] Optionally, the guide plate can be attached to the heat sink, in particular to an underside of the heat sink facing the support body. The heat pipes preferably also terminate in the heat sink at this underside or are otherwise thermally connected to the heat sink.

[0081] The heat pipes can also transition into the heat sink in one piece, or form the heat sink at their second sections.

[0082] The guide plate can optionally contribute to heat dissipation from the support body.

[0083] According to the invention, the cooling device has at least one connecting element, in particular a rotationally symmetrical connecting element, for example a screw element, which extends through respective coaxially positioned bores of the support body, the heat transfer plate and the guide plate in order to force-fit the at least one heat pipe between the heat transfer plate and the guide plate and to force-fit the heat transfer plate to the support body.

[0084] In particular, it may be provided that each guide plate is connected to one of the heat transfer plates via two first screw elements in order to clamp the heat pipes between the guide plate and the heat transfer plate.

[0085] It can also be provided that the support body is connected to the two heat transfer plates and the two guide plates via a second screw element. The second screw elements preferably define the axis of rotation about which the support body can rotate.

[0086] Alternatively, two screw elements can be provided, each connecting the support body to a heat transfer plate and a guide plate on the respective side. Even a single screw element can be provided, in which case it extends completely through the support body.

[0087] Tightening the screw element(s) advantageously establishes surface contact between the support body and the heat transfer plate, as well as with the at least one heat pipe located between the heat transfer plate and the guide plate. The heat pipes can thus be firmly clamped or pressed between the support body and the heat transfer plate.

[0088] By loosening the screw element, the support body and thus also the heat source can be rotated into a different position, after which the screw elements can be tightened again to fix the support body in the new position, for example in a different axial position along the heat pipe.

[0089] The frictional connection can preferably be selected such that the desired rotation between the support body and the heat transfer plate(s) is still possible. At the same time, the frictional connection, cumulatively combined with the respective planar connection of the respective connecting partners, can achieve particularly high heat dissipation.

[0090] In an advantageous embodiment of the invention, it can be provided that the at least one heat tube is connected to the heat transfer plate and / or to the guide plate via a snap-fit ​​connection.

[0091] The guide plate preferably has at least one recess (e.g. in the form of a longitudinal groove) for at least partial reception of the heat conductor, preferably for snap-fit ​​reception.

[0092] This can further improve the guidance, stabilization and fixing of the usually sensitive heat pipes.

[0093] In a further development of the invention, it can be provided in particular that the second section of the heat pipe is an end section of the heat pipe.

[0094] The heat pipe can therefore preferably be connected to the heat sink at one of its end sections. Optionally, the first section can also be an end section or the other end section of the heat pipe. However, the first section can also be a middle section of the heat pipe.

[0095] Preferably, the heat pipe has at least one bend, so that the second section (e.g., the end section connected to the heat sink) of the heat pipe runs at an angle to the first section of the heat pipe (e.g., at an angle of about 90° or exactly 90°).

[0096] In an advantageous further development of the invention, it can be provided that the heat sink is designed as a passive heat sink and has a plurality of cooling fins or differently designed cooling structures.

[0097] Suitable heat sinks for increasing the functionally usable surface area for heat dissipation are widely known, therefore further details are omitted.

[0098] The heat sink acts as a heat sink in the cooling device and is preferably passively designed. However, in modified versions, the heat sink can optionally also be actively cooled, for example, by a fluid flow generated by a turbomachine within the cooling device (or an external device).

[0099] In an advantageous further development of the invention, it can be provided that the heat source is designed as a light source and has at least one light source.

[0100] The light source is preferably designed as a single light-emitting diode or as a light-emitting diode arrangement with several light-emitting diodes.

[0101] The cooling device allows the heat generated during operation of the light source to be continuously dissipated. The light source can be equipped with multiple light sources and optionally with optical systems for deflecting the beams emitted by the light source(s). These optical systems can include, for example, lenses, prisms, diffusers, or other optical elements. For instance, optical systems (e.g., one or more lenses) can be used to produce a narrow beam pattern (with beam angles of, for example, up to 20° or less), or lenses can be used to produce a medium beam pattern (with beam angles of, for example, up to 30° or less). In principle, however, the beam pattern can be arbitrary.

[0102] However, the invention is not limited to use with a light source or lamp as a heat source. In principle, the heat source can be any type of heat source, such as a heating element, an energy converter, a voltage and / or current converter, or even a power unit. Combinations of different heat sources are also possible.

[0103] In a preferred embodiment of the invention, the heat pipe can be a heat pipe. However, the heat pipe can also be a two-phase thermosiphon or another type of heat pipe.

[0104] The invention also relates to a heat source arrangement comprising a cooling device according to the preceding and following embodiments and the heat source, wherein the heat source is thermally connected to the carrier body, in particular directly connected.

[0105] Using the proposed heat source arrangement, it is possible to dissipate large amounts of heat from the heat source to a location remote from the heat source, where a heat sink acts as a heat sink.

[0106] Advantageously, for example, a light source and the optional associated optics can be decoupled from the heat sink and therefore be flexibly aligned and positioned, while still allowing excellent heat dissipation to the heat sink.

[0107] The cooling device and heat source arrangement are particularly suitable for installation in a suspended ceiling or a cavity wall / drywall, without any restriction to a specific installation solution. The heat source and the support structure are preferably located in the room where the heat source is intended to be effective (i.e., in the room to be illuminated by a light source) and are therefore visible. The heat pipes preferably extend through a wall or ceiling panel, allowing the heat sink to be concealed behind them. Particularly with suspended ceilings, there is usually sufficient space above the visible ceiling panel to accommodate a correspondingly large heat sink. In specific applications, the heat sink can also be positioned in a ventilation duct.

[0108] By appropriately positioning and / or aligning the support body, the heat source can be directed according to the specific application. For example, the distance between the heat sink and the support body can preferably be adjustable. This is possible, for instance, by designing the support body to be axially displaceable along the heat pipes, as already mentioned above.

[0109] Features described in connection with one of the objects of the invention, in particular the cooling device and the heat source arrangement according to the invention, can also be advantageously implemented for the other objects of the invention. Likewise, advantages mentioned in connection with one of the objects of the invention can also be understood to relate to the other objects of the invention.

[0110] It should also be noted that terms such as "comprehensive," "exhibiting," or "with" do not exclude other characteristics or steps. Furthermore, terms such as "a" or "the," which indicate a singular number of steps or characteristics, do not exclude a plurality of characteristics or steps—and vice versa.

[0111] In a purist embodiment of the invention, however, it may also be provided that the features introduced in the invention with the terms "comprising," "comprising," or "with" are exhaustively listed. Accordingly, one or more lists of features within the scope of the invention may be considered complete, for example, for each claim. The invention may, for instance, consist exclusively of the features mentioned in claim 1.

[0112] It should be noted that designations such as "first" or "second" etc. are primarily used for the purpose of distinguishing between the respective device or process features and are not necessarily intended to indicate that features are mutually dependent or related to each other.

[0113] Furthermore, it should be emphasized that the values ​​and parameters described herein include deviations or fluctuations of ±10% or less, preferably ±5% or less, more preferably ±1% or less, and most preferably ±0.1% or less of the respective named value or parameter, provided that such deviations are not excluded in the practical implementation of the invention. The specification of ranges by initial and final values ​​also includes all those values ​​and fractions that are encompassed by the respective named range, in particular the initial and final values ​​and a respective mean value.

[0114] This disclosure also relates to a cooling device for a heat source that is independent of claim 1. This further cooling device has at least one elongated heat conductor extending along a longitudinal axis (e.g., the aforementioned heat pipe, but optionally also a sheet or profile section or any other elongated component suitable for heat conduction). The heat source can be thermally attached to a first axial section of the heat conductor, and a heat sink (of any design) is thermally connected to a second axial section of the heat conductor. The further features of claim 1 and the dependent claims, as well as the features described in this description, relate to advantageous embodiments and variants of this cooling device. This applies in particular to the heat sink, the support body, the heat transfer plate(s), and the guide plate(s).

[0115] Exemplary embodiments of the invention are described in more detail below with reference to the drawings.

[0116] The figures each show preferred embodiments in which individual features of the present invention are combined with one another. Features of an embodiment can also be implemented independently of the other features of the same embodiment and can therefore be readily combined by a person skilled in the art to form further meaningful combinations and subcombinations with features of other embodiments.

[0117] In the figures, functionally equivalent elements are labelled with the same reference symbols. They schematically illustrate: Figure 1 shows a heat source arrangement consisting of a cooling device and a heat source according to a first embodiment of the invention, in a perspective view; Figure 2 shows the heat source arrangement of the Figure 1in a perspective exploded view; Figure 3 the heat source arrangement of the Figure 1 in a further perspective exploded view; Figure 4 the heat source arrangement of the Figure 1 in a side view; Figure 5 a heat source arrangement consisting of a cooling device and a heat source according to a second, non-inventive embodiment of the invention, in a perspective view; Figure 6 the heat source arrangement of the Figure 5 in a perspective exploded view; Figure 7 the heat source arrangement of the Figure 5 in a further perspective exploded view; Figure 8 the heat source arrangement of the Figure 5 in a side view; and Figure 9, the enlarged section IX of the Figure 8 .

[0118] A first embodiment of a heat source arrangement 1 according to the invention is described below with reference to the Figures 1 to 4 explained in more detail. Figure 1shows a perspective view of the first embodiment, while the Figures 2 and 3 Explosive representations and Figure 4 show a side view.

[0119] The heat source arrangement 1 includes a heat source 2 (see, among others, the Figures 2 and 6 ) and a cooling device 3 for the heat source 2. In principle, the invention can be used with any heat source 2 that generates waste heat to be dissipated, but optionally also useful heat. In the exemplary embodiments, the heat source 2 is, by way of example, a light source, but this should not be understood as a limitation.

[0120] The cooling device 3 has a heat sink 4 and a support body 5.

[0121] The support body 5 serves to hold the heat source 2. The heat source 2 can be attached in a suitable manner, in particular to the end face of the support body 5 facing away from the heat sink 4, as shown, preferably by means of detachable mechanical fasteners (not shown).

[0122] The support body 5 is thermally connected to the heat sink 4 via several heat pipes 6. The heat pipes 6 are designed as elongated bodies and extend along a respective longitudinal axis L (see figure). Figure 2 In the exemplary embodiments, a total of four heat pipes 6 are provided, wherein two groups of two parallel heat pipes 6 are formed, each of which faces a side surface 7 of the support body 5 (or "sides" of the support body 5 in the exemplary embodiment). Figures 5 to 9 ), in the exemplary embodiments, outer shell surfaces, are assigned.

[0123] A first axial section 8 (see Figure 2 and Figure 6 ) of the heat pipes 6 is connected to the support body 5 and a second axial section 9 (see Figure 2 and Figure 6 The second section 9 is thermally connected to the heat sink 4. The second section 9 is angled relative to the first section 8 and is formed at an end section of the respective heat tube 6, which is inserted into the heat sink 4 from an underside of the heat sink 4. In the exemplary embodiments, the first section 8 is formed at the other end section of the respective heat tube 6, the one facing away from the second section 9; however, this is not mandatory. The first section 8 can also be a central section of the heat tube 6. In particular, it can also be provided that the first section 8 is variably adjustable by allowing the support body 5 to be displaced along the longitudinal axis L of the heat tubes 6.

[0124] The heat sink 4 is preferably made of aluminum or another suitable material and has several cooling fins 10. In the exemplary embodiments, a passive heat sink 4 is provided. However, to increase heat dissipation, a turbomachine can optionally be provided that directs a fluid past the heat sink 4. Furthermore, the heat sink 4 can itself be connected to a higher-level cooling system.

[0125] The cooling device 3 also has two heat transfer plates 11 made of a material with good thermal conductivity, each arranged between the support body 5 and the corresponding heat pipes 6. These heat transfer plates are directly connected to the respective heat pipes 6, at least partially, over a surface area and in a rotationally secure manner, along the first sections 8 of the heat pipes 6. The heat transfer plates 11 are also directly connected to the support body 5 over a surface area in certain regions.

[0126] However, the support body 5 remains rotatable relative to the heat transfer plates 11 by at least one degree of rotational freedom or by at least one axis of rotation R1, R2, R3. In the exemplary embodiment of the Figures 1 to 4 The support body 5 is rotatable about exactly one first axis of rotation R 1 (cf. Figure 1 ), whereas the support body 5 of the second embodiment described below in Figures 5 to 10 can be rotatable about all three axes of rotation R 1 , R 2 , R 3 (cf. Figure 5 ).

[0127] The heat transfer plates 11 have guide grooves 12 (particularly well in the Figures 2 and 6 recognizable) for receiving the first sections 8 of the heat pipes 6, which are preferably concave and shaped at least substantially complementary to the outer geometry of the heat pipes 6 in order to enable a particularly full-surface connection.

[0128] In both embodiments, the cooling device 3 has exactly two heat transfer plates 11 – however, this should not be interpreted as a limitation. In principle, even a single heat transfer plate 11 may suffice, for example, for a one-sided connection of the support body 5. In the embodiments, the heat transfer plates 11 are connected to different side surfaces 7 or outer shell surfaces of the support body 5. Preferably, these are opposite side surfaces 7 of the support body 5, as shown. Thus, a first heat transfer plate 11 can be connected to the first group of heat tubes 6, and the second heat transfer plate 11 to the second group of heat tubes 6. The axis of rotation R1, about which the support body 5 is rotatable, is oriented orthogonally to the side surfaces 7 connected to the heat transfer plates 11.This results in very good guidance and stabilization along the rotation axes R2, R3 that are orthogonal to the first rotation axis R1.

[0129] The side surfaces 7 of the support body 5, to which the heat transfer plates 11 are connected, each run parallel to the longitudinal axis L of the heat pipe 6 in the first section 8 and are also each designed as flat surfaces. In the first embodiment, the support body 5 specifically has a rectangular cross-section and is, by way of example, designed as a solid cube.

[0130] The carrier body 5 preferably has a through-hole 13 (see, for example, Figure 1 ) for routing a connecting cable 14. The connecting cable 14 can, in particular, be an electrical cable for supplying power to a light source. The connecting cable 14 is in Figure 4 hinted at.

[0131] In Figure 4The diagram also shows the path of a ceiling panel 15 of a suspended ceiling. It is evident that the heat sink 4 can be positioned above the ceiling panel 15, while the support body 5 is located below the ceiling panel 15. The cooling device 3 can, for example, be attached to the ceiling panel 15 by means of mounting profiles 16.

[0132] Optionally, the rigid or immobile part of the cooling device 3, preferably extending from the support body 5 to the heat sink 4 – or at least to the top plate 15 – can be enclosed in a first housing part 17. The movable part of the cooling device 3, in particular the support body 5 with the heat source 2, can be enclosed in a second housing part 18, so that the second housing part 18 is mechanically coupled to the support body 5 and is therefore movable relative to the first housing part 17 together with the support body 5. The housing parts 17, 18 can preferably be hollow cylindrical, preferably made of a metal, in order to mechanically protect the heat source arrangement 1 and, if necessary, also to provide electrical shielding.The housing parts 17, 18 can also further limit the uncontrolled heat dissipation to the environment below the ceiling plate 15 and focus the heat conduction towards the heat sink 4. Furthermore, the housing parts 17, 18 can positively influence the optics of the heat source arrangement 1.

[0133] In addition to the components already mentioned, the cooling device 3 also has optional guide plates 19 that extend laterally to the heat pipes 6. Each group of heat pipes 6 is assigned a guide plate 19. The guide plates 19 serve to guide and stabilize the heat pipes 6 section by section along the longitudinal axis L. In the respective first section 8, the heat pipes 6 are mechanically clamped or fastened between the guide plate 19 and the associated heat transfer plate 11.

[0134] For fastening, the cooling device 3 has several connecting elements 20, 21 on each side surface 7 of the support body 5, which in the exemplary embodiments are designed as screw elements. In the first exemplary embodiment, two first screw elements 20 are provided, which connect the respective guide plate 19 with the associated heat transfer plate 11 in order to clamp the corresponding heat tubes 6 between the guide plate 19 and the heat transfer plate 11. Furthermore, a second screw element 21 is provided, which extends from the guide plate 19 through the heat transfer plate 11 into the support body 5 in order to connect the combination of guide plate 19 and heat transfer plate 11 to the support body 5 such that the second screw element 21 forms the axis of rotation R 1 or runs coaxially to the axis of rotation R 1.In this way, the alignment of the support body 5 can be made possible by loosening the second screw elements 21 and fixed again by tightening the second screw elements 21.

[0135] The screw elements 20, 21 make it possible to connect the heat transfer plate 11 to the support body 5 in a force-fit manner, which can result in particularly good heat dissipation.

[0136] The heat tubes 6 can be connected to the heat transfer plate (11) and / or to the guide plate 19 via snap connections not shown in detail, in order to further improve the stability of the heat source arrangement 1.

[0137] The Figures 5 to 9 show a second embodiment of the heat source arrangement according to the invention, which is not in accordance with the invention. Figure 5 shows a perspective view of the second embodiment, while the Figure 6 and 7 Explosive diagrams, Figure 8a front view and Figure 9 an enlarged section of the Figure 8 show.

[0138] In contrast to the previously described embodiment, the support body 5 in the second embodiment is spherical and clamped between the heat transfer plates 11. To fix the heat transfer plates 11 to the heat pipes 6, each of the two guide plates 19 is connected to one of the two heat transfer plates 11 via one of the first screw elements 20.

[0139] The spherical support body 5 is in concave recesses 22 (see, for example, Figure 6 The heat transfer plates 11 are incorporated to form a ball joint, allowing the support body 5 to be easily rotated into the desired position. This results in further improved adjustability of the support body 5 along all three axes of rotation R1, R2, R3, as shown in Figure 5The ball joint is shown in detail in Figure 9 depicted.

[0140] It is preferably possible to fix the support body 5 according to its orientation in order to prevent unintentional deflection of the support body 5.

Claims

1. Cooling device (3) for a heat source (2), comprising - a heat sink (4); - a support body (5) made of a material with a thermal conductivity suitable for functional heat conduction, wherein the heat source (2) can be connected to the support body (5) in a thermally conductive manner; - at least one thermal pipe (6) extending along a longitudinal axis (L), wherein a first axial section (8) of the thermal pipe (6) is thermally conductively connected to the support body (5) and a second axial section (9) of the thermal pipe (6), spaced apart from the first section (8) along the longitudinal axis (L), is thermally conductively connected to the heat sink (4); - at least one heat transfer plate (11) arranged between the support body (5) and at least one of the thermal pipes (6), made of a material with a thermal conductivity suitable for functional heat conduction, which is, at least along the first section (8) of the at least one thermal pipe (6), directly connected to the at least one thermal pipe (6) in areas of its surface and in a rotationally secure manner, and which is directly connected to the support body (5) in areas of its surface, so that the support body (5) can rotate relative to the at least one heat transfer plate (11) about at least one axis of rotation (R1, R2, R3); and - at least one guide plate (19) extending laterally to the at least one thermal pipe (6) for guiding and stabilizing the at least one thermal pipe (6) in sections along its longitudinal axis (L), wherein the at least one thermal pipe (6) is arranged in the first section (8) between the guide plate (19) and the heat transfer plate (11), characterized by at least one connecting element extending through respective coaxially positioned bores of the support body (5), the heat transfer plate (11) and the guide plate (19) in order to fasten the at least one thermal pipe (6) in a force-fitting manner between the heat transfer plate (11) and the guide plate (19) and to connect the heat transfer plate (11) in a force-fitting manner to the support body (5).

2. Cooling device (3) according to claim 1, characterized in that a side surface (7) of the support body (5) is connected directly to the heat transfer plate (11) in areas of its surface, but rotatably about exactly one axis of rotation (R1), wherein the at least one thermal pipe (6) extends laterally along the side surface (7) of the support body (5).

3. Cooling device (3) according to claim 1 or 2, characterized in that the heat transfer plate (11) has a guide groove (12) for receiving the first section (8) of the thermal pipe (6), preferably a concave-shaped guide groove (12).

4. Cooling device (3) according to claim 2 or 3, characterized by two of the aforementioned heat transfer plates (11), which are connected to different side surfaces (7) of the support body (5), preferably to side surfaces (7) of the support body (5) facing away from each other, wherein a first one of the heat transfer plates (11) is connected to a first group of the aforementioned thermal pipes (6) and a second one of the heat transfer plates (11) is connected to a second group of the aforementioned thermal pipes (6).

5. Cooling device (3) according to claim 4, characterized in that the side surfaces (7) of the support body (5) to which the heat transfer plates (11) are connected each run parallel to the longitudinal axis (L) of the thermal pipe (6) in the first section (8) and are also each designed as flat surface.

6. Cooling device (3) according to claim 4, characterized in that the side surfaces (7) of the support body (5) to which the heat transfer plates (11) are connected have a convex profile, wherein the heat transfer plates (11) each have a concave recess (22) for flat connection to the respective side surface (7) of the support body (5).

7. Cooling device (3) according to any one of claims 4 to 6, characterized in that the first group of thermal pipes (6) and the second group of thermal pipes (6) each comprise at least two thermal pipes (6) which run parallel to each other at least along their first sections (8) and are each connected to the associated heat transfer plate (11).

8. Cooling device (3) according to one of claims 1 to 7, characterized in that the connecting element is a screw element (20, 21).

9. Cooling device (3) according to one of claims 1 to 8, characterized in that the at least one thermal pipe (6) is connected to the heat transfer plate (11) and / or to the guide plate (19) via a snap connection.

10. Cooling device (3) according to one of claims 1 to 9, characterized in that the second section of the thermal pipe (6) is an end section (9) of the thermal pipe (6), wherein the thermal pipe (6) preferably has a bend so that the end section (9) of the thermal pipe (6) runs at an angle to the first section (8) of the thermal pipe (6).

11. Cooling device (3) according to any one of claims 1 to 10, characterized in that the heat sink (4) is designed as a passive heat sink (4) and has a plurality of cooling fins (10).

12. Cooling device (3) according to one of claims 1 to 11, characterized in that the heat source (2) has at least one light source, preferably at least one light-emitting diode or a light-emitting diode array.

13. Cooling device (3) according to one of claims 1 to 12, characterized in that the thermal pipe (6) is a heat pipe.

14. Heat source assembly (1) comprising a cooling device (3) according to one of claims 1 to 13 and the heat source (2), wherein the heat source (2) is thermally connected to the support body (5).

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