Device and method for fixing a substrate

Abstract

The invention relates to a method and a device for fixing a substrate.

Description

[0001] Description

[0002] Device and method for fixing a substrate

[0003] The present invention relates to a device and a method for fixing a substrate. The device comprises at least one fixing element that fixes the substrate after contacting, allowing the substrate to be held and transported.

[0004] The state of the art provides several tools for securing and transporting substrates. These tools are usually controlled by robots to transport substrates from one module to another within a device, particularly a vacuum device.

[0005] For example, EP3306397B1 and EP3382749A1 show tools for fixing or holding a substrate, equipped with suction cups as fixing elements. The suction cups have a well-defined height and are not height-adjustable. Rather, in EP3382749A1, only a suction cup holder and thus indirectly the corresponding suction cup can be moved. Changing the height of the suction cups is therefore not possible. Only an indirect relative movement of the suction cups can be performed without adjusting the height. Thus, actuators and other components are necessary to adjust the position of the suction cup surface for contacting the substrate. Such tools have the disadvantage of being relatively high or thick.Due to the large number of components and built-in electronics, these tools are only suitable to a very limited extent, or even not at all, for picking up substrates that are stacked tightly together in boxes. The space between the substrates in such a box is relatively limited. However, state-of-the-art tools do not offer the option of varying the height of the suction cups and can therefore only rarely be used to remove substrates from such boxes.

[0006] Furthermore, when processing substrates, for example when bonding substrates, the space for positioning the substrates is very limited, so that conventional fixing devices are disadvantageous due to their height and the devices are designed larger or more complex.

[0007] Another problem when removing substrates from substrate boxes and when processing them is that substrates are not precisely aligned. Accordingly, a fixture for contacting an uneven substrate cannot work precisely. Rather, the fixture elements will contact the substrate at different times or only insufficiently. Thus, the fixation of uneven substrates with conventional tools is only possible to a limited extent.

[0008] It is therefore the object of the invention to at least partially eliminate, and in particular to completely eliminate, the disadvantages cited in the prior art. In particular, it is an object of the invention to provide an improved device and an improved method for securing substrates. Furthermore, it is an object of the present invention to provide a device and a method with which the securing of non-planar, i.e. curved or bent, substrates is made possible. In addition, it is an object of the present invention to provide a device and a method with which the securing of a substrate is made possible even in confined spaces and with a small maneuvering area.

[0009] The present object is achieved by the features of the independent claims. Advantageous developments of the invention are specified in the dependent claims. The scope of the invention also includes all combinations of at least two features specified in the description, the claims, and / or the drawings. For specified value ranges, values ​​within the specified limits are also considered to be disclosed as limit values ​​and can be claimed in any combination.

[0010] Accordingly, the invention relates to a device for fixing a substrate, at least comprising a substrate holder with at least one fixing element for contacting the substrate, wherein the at least one fixing element is height-adjustable by a fluid flow.

[0011] The at least one fixing element protrudes at least partially from a substrate holder surface, so that contact is made between the substrate to be fixed and the fixing element surface. It is also conceivable for the at least one fixing element to be partially embedded in the substrate holder. The at least one fixing element is height-adjustable and is thus in particular stretched or compressed. The at least one fixing element is preferably elastically deformable. The absolute spatial extent of the at least one fixing element is thus changed, preferably in a direction perpendicular to the substrate holder, so that the height or thickness of the device as a whole can be changed. Thus, in a first position, without the action of a fluid flow in the region of the at least one fixing element, the at least one fixing element has a height which is adjustable by the fluid flow.At the same time, a contact surface of the at least one fixing element is moved, so that the substrate can be advantageously fixed without any relative movement of the substrate holder or other components. The at least one fixing element is preferably designed such that the height adjustment can be performed along an axis arranged perpendicular to the substrate holder.

[0012] Therefore, the fixing device is ideal for use in areas with limited space, particularly for removing a substrate from a box containing several closely spaced substrates. Furthermore, the height can be advantageously adjusted to uneven substrates, especially if the device has multiple fixing elements, thus improving the adhesive properties of the fixing and reducing the force exerted by the at least one fixing element on the fixed substrate. Another advantage is that contacting can be carried out in a controlled manner, and no electrical components in the substrate holder are required to adjust the height.

[0013] In a preferred embodiment of the device for fixing substrates, it is provided that the at least one fixing element has at least one continuous cavity so that the fluid flow can be conducted through the at least one fixing element. By applying the fluid flow or by passing the fluid flow through the continuous cavity in the at least one fixing element, the height can advantageously be adjusted efficiently and in a controlled manner. If the substrate holder has a plurality of fixing elements with individually controllable fluid flows, the height can also advantageously be adjusted individually. In a preferred embodiment of the device for fixing substrates, it is provided that the substrate holder has a fluid channel opening adjoining the at least one continuous cavity.In particular, a fluid channel is connected to the fluid channel opening, which is thus fluidically connected to the continuous cavity of the at least one fixing element. In this way, the fluid flow acting for height adjustment can advantageously be controlled via one or more fluid channels, which are arranged in particular inside the substrate holder.

[0014] In a preferred embodiment of the device for fixing substrates, the at least one fixing element is at least partially elastic. By stretching the at least one fixing element in the elastic range, the height can advantageously be adjusted via the fluid flow. If the at least one fixing element is not subjected to a fluid flow or if no flow resistance acts on the at least one fixing element, the at least one fixing element returns to its original shape and in particular height. The material of the at least one fixing element is preferably an expandable material. The at least one fixing element is designed such that stretching occurs as a result of the action of the fluid flow under the load conditions normally expected in the elastic range of the material.

[0015] In an extension of the embodiment of the device for fixing substrates, it is provided that the at least one fixing element is an electric medium. This makes it possible to ground the fixing element. In the prior art, for example, conductive polymers exist from which the fixing element can be manufactured. The electrical conductivity is between 10E8 S / m and 10E-11 S / m, preferably between 10E7 S / m and 10E-11 S / m, more preferably between 10E6 S / m and 10E-11 S / m, most preferably between 10E5 S / m and 10E-11 S / m.

[0016] In an extension of the embodiment of the device for fixing substrates, it is provided that the at least one fixing element has a dust-repellent layer. This is intended to prevent or at least minimize the adhesion of contaminants. For example, the use of an anti-sticking layer (ASL) is conceivable.

[0017] In a preferred embodiment of the device for securing substrates, the at least one securing element has a resilient section. The resilient section is primarily responsible for the height adjustment of the at least one securing element when subjected to the fluid flow. The resilient section thus provides a spring force with respect to the expansion of the at least one securing element perpendicular to the substrate holder. The resilient section is preferably formed by several folds in an outer wall of the at least one securing element. The continuous hollow space is then arranged centrally around the axis of the height adjustment. In this way, the height of the at least one securing element can advantageously be adjusted easily and in a controlled manner.

[0018] In a preferred embodiment of the device for fixing substrates, it is provided that the at least one fixing element has a flow resistance section. The flow resistance section is formed in particular in the region of an upper opening of the at least one fixing element and is fluidically connected to the at least one continuous cavity. The flow resistance section preferably also has openings so that the fluid flow guided through the cavity can exit or enter the at least one fixing element and can be guided through the fixing element. The flow resistance section is therefore not a cover and does not completely close the at least one fixing element or the continuous cavity.The flow resistance section is preferably designed such that it has a round, plate-like central part, which is connected to an outer edge via webs. The peripheral edge is preferably also round and connected to the resilient section. This advantageously allows the desired flow resistance for height adjustment by means of the fluid flow to be provided through the dimensioning of the central part. Particularly preferably, a center point of the central part is aligned with a central axis of the at least one fixing element. The central axis is parallel to or identical to the axis that defines the direction of the height adjustment of the at least one fixing element.

[0019] The flow resistance section specifically provides a flow resistance in order to adjust the height of the at least one fixing element. When the at least one fixing element is subjected to pressure, the flow resistance section thus generates, in particular, a pressure difference between the pressure inside the fixing element, in particular in the continuous cavity, and a pressure downstream of the flow resistance section. In this way, the height of the at least one fixing element can be advantageously specifically adjusted or particularly precisely adjusted by the dimensioning and arrangement of the flow resistance section as well as by the fluid flow. Preferably, a contraction of the at least one fixing element can be predetermined by the flow resistance section.In a preferred embodiment of the device for securing substrates, the flow resistance section is arranged on a side of the at least one securing element facing away from the substrate holder. Preferably, the flow resistance section is formed at an end of the securing element opposite the substrate holder. In this way, the largest possible portion of the securing element can advantageously be adjusted in height. Thus, the flow resistance section preferably simultaneously provides a contact surface for contacting the substrate to be secured. It is also conceivable for the flow resistance section to additionally comprise a layer or component for particularly gentle contacting.

[0020] In a preferred embodiment of the device for fixing substrates, the flow resistance section is formed by a flow resistance component that can be attached, in particular, to the resilient section. The flow resistance component is preferably an injection-molded component and can advantageously be attached to the at least one fixing element. Thus, the flow resistance component can advantageously be designed and replaced for the respective application. A further advantage is that appropriately suitable fixing elements can be retrofitted with a flow resistance component in order to enable particularly simple and controlled height adjustment. The flow resistance component can particularly preferably be fixed or snapped onto the resilient section of the at least one fixing element.For this purpose, the flow resistance component preferably has corresponding locking lugs or similar sections for fixing. The type of fixing is particularly preferably detachable. In this way, the flow resistance can advantageously be flexibly adjusted via the flow resistance component. In a preferred embodiment of the device for fixing substrates, the flow resistance component is arranged at least partially within the continuous cavity. By arranging the flow resistance component within the continuous cavity, the fluid flow can act on the flow resistance component in a particularly controlled manner and without further flow influences from outside the at least one fixing element. Thus, the height adjustment can be carried out in a particularly controlled and efficient manner.

[0021] In a preferred embodiment of the device for securing substrates, the flow resistance component at least partially forms an outer wall of the continuous cavity. The flow resistance component thus directly adjoins the opening of the at least one securing element facing away from the substrate holder or forms an upper end of the securing element. In this way, the flow resistance component can advantageously provide a flow resistance at the upper end, and the at least one securing element can be adjusted along its entire height.

[0022] In a preferred embodiment of the device for fixing substrates, it is provided that the at least one fixing element has a specific height in a non-loaded state. In the non-loaded or expanded state, the at least one fixing element thus has the specific or original height which the at least one fixing element has without the effect of the fluid flow. In this way, the substrate holder with the at least one fixing element can be positioned particularly precisely and predeterminably in the vicinity of the substrate to be fixed. Furthermore, in the event of a contraction (reduction in height) of the at least one fixing element due to the fluid flow, the at least one fixing element advantageously resumes the specific height after an interruption of the fluid flow.The combination of these features ensures that the device initially has a low thickness or height (contraction of at least one fixing element or all fixing elements), can be positioned close to the substrate to be fixed in a space-saving manner, and then contact is made by interrupting the fluid flow. This allows for particularly simple and gentle contact, especially in confined spaces (e.g., in substrate boxes).

[0023] In a preferred embodiment of the device for fixing substrates, it is provided that the specific height of the at least one fixing element can be reduced by at least 1 / 4, preferably by at least 1 / 3, even more preferably by at least 1 / 2 by exposure to the fluid flow. In other words, the height or the extent perpendicular to the substrate holder surface (z-direction) of the at least one fixing element can be reduced at least temporarily to at least 3 / 4, preferably to at least 2 / 3, even more preferably to at least half of the specific height by exposure to the fluid flow. The fluid flow preferably flows through the at least one fixing element in the direction of the substrate holder. Particularly preferably, a negative pressure is generated on the side of the substrate holder to reduce the height or to contract the at least one fixing element.

[0024] Most preferably, the at least one fixing element is contracted, or its height is reduced, by evacuating a fluid channel in or beneath the substrate holder. The fluid channel is fluidically connected to the continuous cavity of the at least one fixing element. Furthermore, after an interruption of the evacuation, contact with the substrate can be initiated, since the fluid flow also stops due to the interruption. After contact, the substrate can be sucked onto the at least one fixing element by a subsequent evacuation and held even better for transport.

[0025] In a preferred embodiment of the device for fixing substrates, it is provided that a fluid channel, which is preferably arranged at least partially within the substrate holder, is fluidically connected to the continuous cavity of the at least one fixing element.

[0026] In a preferred embodiment of the device for securing substrates, it is provided that the at least one securing element is compressed toward the substrate holder by evacuating the fluid channel. In this case, the resilient portion of the at least one securing element preferably contracts. The folded and flexible portion of the outer wall of the at least one securing element is compressed or contracted, like the bellows of a hand-pulled instrument (e.g., a concertina or accordion), thereby reducing the height of the at least one securing element.

[0027] In one embodiment of the device for fixing substrates, it is provided that by flooding the fluid channel, the at least one fixing element is stretched in a direction away from the substrate holder. The fluid flow thus preferably flows through the fluid channel opening, through the at least one continuous cavity, and out of the top of the at least one fixing element, wherein the flow resistance section particularly preferably enables a particularly simple and controlled stretching or adjustment (increasing) of the height of the at least one fixing element. In a preferred embodiment of the device for fixing substrates, it is provided that the substrate holder has three or more fixing elements. Particularly preferably, the substrate holder has at least five and very particularly preferably at least ten fixing elements. The fixing elements are designed like the at least one fixing element.The fixing elements are all height-adjustable by applying a fluid flow.

[0028] Preferably, the fixing elements are arranged regularly on the substrate holder. The substrate holder is preferably fork-shaped, with the fixing elements arranged along the prongs of the fork-shaped substrate holder. This allows the substrate to be fixed particularly easily along the prongs.

[0029] In a preferred embodiment of the device for fixing substrates, a fluid channel is formed in the substrate holder or below it, which fluid channel is fluidically connected to at least one continuous cavity of at least two fixing elements. In this way, the height of several fixing elements can advantageously be adjusted by flooding or evacuating the fluid channel. Very particularly preferably, all fixing elements or the respective continuous cavities are fluidically connected to a fluid channel. Preferably, the fluid channels are also all fluidically connected, so that the height of all fixing elements of the device for fixing a substrate can be adjusted almost simultaneously or in parallel. Very particularly preferably, all fixing elements each have a flow resistance section or flow resistance component of the same size.Furthermore, the invention relates to a method for fixing a substrate, comprising at least the following steps, i) providing a device for fixing a substrate, at least comprising:.

[0030] -a substrate holder with at least one fixing element for contacting the substrate, wherein the at least one fixing element is height-adjustable by a fluid flow, ii) applying the fluid flow to the at least one fixing element, iii) positioning the substrate holder relative to the substrate, iv) interrupting the fluid flow for contacting the substrate.

[0031] The device provided in step i) can also have all the features of the device for fixing a substrate. The application in step ii) can occur before, after, or simultaneously with the positioning in step iii). The interruption of the fluid flow in step iv) occurs after steps ii) and iii). In this way, the method for fixing a substrate can advantageously be controlled and fixed in narrow areas.

[0032] It is advantageous that the at least one fixing element or elements are or are particularly elastic, so that they only expand until contact is made with a substrate surface. If the substrate surface is curved, the at least one fixing element or elements will adapt differently to different positions, i.e. will expand to different extents. In other words, the elastic fixing elements adapt particularly advantageously to non-planar substrates, so that fixing can be carried out even better and regardless of the position of the curvature. Furthermore, the method can additionally comprise the following step after step iv): v) (re-)applying pressure to the at least one fixing element according to step ii) of the substrate. As a result, the contacted substrate is fixed even better and is in particular sucked in.In this way, the substrate is fixed, for example, by vacuum.

[0033] In a preferred embodiment of the fixing method, the application in step ii) comprises evacuating or flooding at least one fluid channel of the substrate holder. The fluid channel is preferably fluidically connected to a continuous cavity of the at least one fixing element. By evacuating the fluid channel, the height of the at least one fixing element(s) is preferably reduced. By flooding the fluid channel, the height of the at least one fixing element(s) is preferably increased.

[0034] In the following, the at least one fixing element(s) are described as suction cups. In contrast to a pure cup shape, however, the fixing elements of the fixing device are open, particularly in the (lower) area of ​​the substrate holder, so that a fluid flow can be conducted through the suction cups.

[0035] An important aspect is the use of suction cups or fixing elements whose height can be adjusted by a fluid flow. In particular, a component is used that influences the flow resistance. Thus, the height of the suction cups can be changed or controlled by regulating the fluid flow. In other words, the suction cups can contract or expand by generating an air flow.

[0036] The device is described as a general substrate holder. In a specific embodiment, the device is disclosed as a tool, in particular as a fixing tool or gripper, with the aid of which the removal of substrates and their transport within a device, in particular a cluster consisting of several modules, is possible. In this case, the tool is usually part of a robot that is part of this device, this cluster.

[0037] In particular, the use of a flow-restricting component in or on the suction cup enables height adjustment solely by controlling the fluid flow. Mechanical and / or electrical control is not necessary, or only required for the unit that generates the air flow. Furthermore, suitable and installed suction cups can easily be fitted with a new component or flow resistance component to allow their height to be adjusted by the fluid flow. The component or flow resistance component can also consist of multiple components.

[0038] A suction cup or the at least one fixing element is particularly designed so that its side walls can be expanded. Preferably, the side walls of the suction cup or the at least one fixing element are designed as bellows. The bellows design allows the suction cup to be easily expanded and / or contracted. A flow resistance component is located on and / or in the suction cup, which acts as additional resistance for a flowing fluid. Thus, a distinction is made between two states.

[0039] The first state is the expanded state, in which the suction cups or the fixing elements are at their specified height. In this state, no fluid flow occurs. This state is therefore characterized by the absence of any volume flow that would cause the suction cups to contract.

[0040] The second state is the contracted or expanded state, in which the suction cups have a height that deviates from the specified height, particularly a height that is smaller or larger. This state is characterized by a volume flow or fluid flow acting on the fixing elements. For example, the flow resistance in or on the suction cup causes a drop in pressure inside the suction cup, causing it to contract and thus reducing its height.

[0041] A flow resistance section is part of the suction cup. Alternatively, a flow resistance component, which is considered part of the at least one fixing element, can be attached to the fixing element. The flow resistance component is preferably designed so that it can be attached to the opening of the suction cup (upper end and end opposite the substrate holder). The purpose of the flow resistance component is, in particular, to further reduce the pressure inside the suction cup as soon as gases are sucked in via the suction cup. The flow resistance component can have any shape. The following geometries are conceivable, for example:

[0042] -Plate, in particular a circular plate

[0043] -hemispherical shape, convex or planar side facing outwards

[0044] -Half-shell shape, convex or concave side facing outwards

[0045] -Conical shape, pointed or planar side facing outwards.

[0046] In a first exemplary embodiment of the device, a first substrate holder with suction cups is described, which can preferably be used for removing, securing, and transporting substrates. This first substrate holder has the smallest possible overall thickness. A distinction is made between two overall thicknesses. The first overall thickness is understood to be the height when the suction cups are expanded and not exposed to the fluid flow. The overall thickness of the substrate holder is then in particular less than 5 cm, preferably less than 4 cm, even more preferably less than 3 cm, most preferably less than 2 cm, and most preferably less than 1 cm.

[0047] The second total thickness refers to the height with the suction cups contracted. The total thickness of the substrate holder is then in particular less than 4 cm, preferably less than 3 cm, even more preferably less than 2 cm, most preferably less than 1 cm, and most preferably less than 0.5 cm.

[0048] The compact design of the substrate holder enables the removal and securing of substrates that are stacked tightly together. In the semiconductor industry in particular, substrates are transported, stored, and stored in substrate boxes. The distance between the substrates in such a substrate box is relatively small to maximize substrate density. The distance between the substrates is only a few centimeters.

[0049] The first example substrate holder consists of a holder. Several suction cups are attached to the holder, which can be evacuated via channels in the holder. The holder must be stiff enough not to bend, but also thin enough to fit between closely spaced substrates. Preferably, the holder is a component group consisting of at least an upper and lower cover, which can preferably be connected to one another via a seal. This design method enables the channels to be created as simply as possible, as they can simply be milled into the upper and / or lower cover. However, it would be conceivable and preferred to create the channels directly in a voluminous holder made from a single part. One possible process would be erosion, in particular spark erosion.The holder can be designed so that the suction cups are grouped into zones so that all suction cups in a zone can be evacuated simultaneously.

[0050] The mount can also be designed so that the suction cups are controlled individually.

[0051] The holder is preferably designed in a fork shape so that the substrate can be secured only peripherally. A fork shape then also allows, for example, the removal and securing of a substrate that is not fully secured from another substrate holder.

[0052] In a second exemplary embodiment, a second substrate holder with suction cups is described, which is preferably used exclusively for securing substrates. This substrate holder is preferably used in different systems such as bonders, debonders, binders, etc. Transporting the substrate holder, particularly between different systems, would also be conceivable here. The main aspect of this second exemplary embodiment, however, is that the substrate holder may have a relatively large thickness, since its function is not to remove closely spaced substrates. The suction cups are also preferably distributed symmetrically across the substrate holder surface of the substrate holder.

[0053] In this second exemplary embodiment of the substrate holder, it can be designed such that the suction cups are grouped into zones, allowing all suction cups in a zone to be evacuated simultaneously. The second substrate holder can also be designed such that the suction cups are controlled individually.

[0054] In a specific extension of both exemplary embodiments of the substrate holder, the fixing elements or suction cups can be used as loading units. In the prior art, the loading units are usually loading pins onto which a substrate can be placed at a distance from the substrate holder surface. The loading pins are then retracted to bring the substrate closer to the substrate holder surface. As soon as the substrate rests on the substrate holder surface, it can be fixed in place using another fixing mechanism. Such loading pins are known to those skilled in the art. The fixing elements can thus be used instead of a loading unit, in particular instead of the loading pins.

[0055] In a first step of an exemplary first method for securing a substrate, an evacuation is performed in the channels and thus also in the suction cups. Since the suction cups are still open to the atmosphere, a continuous gas flow is formed. Due to the flow resistance, the pressure inside the suction cups drops relative to the ambient pressure. The increased ambient pressure then causes the suction cups to contract. Due to the contraction of the suction cups, the overall thickness of the first substrate holder decreases to such an extent that the first substrate holder can be positioned even between closely spaced substrates.

[0056] In a second step of an exemplary first method for fixing a substrate, the substrate holder of the device for fixing substrates is positioned so that it can fix a substrate. In particular, it engages between two substrates that are relatively close to one another.

[0057] In a third step of an exemplary first method for fixing a substrate, a vacuum pump is switched off. By switching off the vacuum pump, the pressure in the suction cup equalizes to the ambient pressure. The suction cup therefore expands again and contacts a substrate surface of the substrate to be removed. It is advantageous that each individual suction cup is designed in particular as a bellows and therefore only expands until contact is made with a substrate surface. If the substrate surface is curved, different suction cups in different positions adapt accordingly differently, i.e. they will expand to different extents. The substrate can therefore already be fixed to the at least one fixing element or to the suction cup. In an optional fourth step of an exemplary first method for fixing a substrate, the vacuum pump is switched on again.Since the suction cups are already in contact with a substrate surface this time, they are evacuated. The external pressure now presses the substrate against the suction cups, thus providing increased holding force.

[0058] In a fifth step of an exemplary first method for fixing a substrate, the substrate is removed and transported accordingly.

[0059] In a sixth step of an exemplary first method for fixing a substrate, the substrate is released by turning off the vacuum pump. The substrate can then be removed from the device.

[0060] Further advantages, features, and details of the invention will become apparent from the following description of preferred embodiments and from the drawings. These schematically show:

[0061] Figure 1 shows three representations of an embodiment of an exemplary fixing element,

[0062] Figure 2 the fixing element in an expanded and contracted state,

[0063] Figure 3a shows a first method step of an exemplary method for fixing substrates,

[0064] Figure 3b shows a second method step of an exemplary method for fixing substrates,

[0065] Figure 3c shows a third method step of an exemplary method for fixing substrates,

[0066] Figure 3d shows a fourth method step of an exemplary method for fixing substrates, Figure 3e shows a fifth method step of an exemplary method for fixing substrates and

[0067] Figure 3f shows a sixth method step of an exemplary method for fixing substrates.

[0068] In the figures, identical components or components with the same function are identified by the same reference numerals. All sketches may be exaggerated for illustrative purposes; therefore, the figures may not necessarily reflect the proportions of the actual embodiments.

[0069] Figure 1 shows three representations of an exemplary fixing element 1 or vacuum fixation 1, consisting of a suction cup 3 and a flow resistance component 2 mounted thereon. The upper right image is a top view, the lower left image is a side view, and the lower right image is a sectional side view. The flow resistance component 2 can be mounted above or inside the suction cup 3. For the sake of clarity, only one mounting on its top side is shown.

[0070] Furthermore, by fixing the flow resistance component 2 to the top of the suction cup 3, replacement is correspondingly easy. The flow resistance component 2 consists of a central part 2z, which is primarily responsible for generating the flow resistance. The central part 2z is connected to a periphery 2p by connecting elements 2v, in particular webs or wires. The periphery 2p preferably has fixings 2k to fix the flow resistance component 2 directly and as simply as possible to the suction cup 3. Simple lugs, projections, or grooves are particularly preferred. The flow resistance component 2 is preferably manufactured by an injection molding process.

[0071] If the flow resistance component 2 is designed to be fixed within the suction cup 3, the flow resistance component 2 is preferably manufactured as a full-volume body with at least one bore.

[0072] Figure 2 shows two side sectional views of the exemplary fixing element or vacuum fixation 1 in two different states. The left image shows vacuum fixation 1 in an expanded state. The right image shows vacuum fixation 1 in a contracted state. The contracted state results from the generation of a gas flow j by vacuum fixation 1. Gas flow j is generated by machines that are not shown here for the sake of clarity. In the extracted state, it can be seen that the pressure outside and inside vacuum fixation 1 is pO. In the contracted state, gas flow j is impeded by flow resistance component 2. Flow resistance ensures that the pressure inside suction cup 3 drops to p1. Due to the lower pressure inside suction cup 3, ambient pressure pO compresses suction cup 3.The suction cup 3, in combination with a flow resistance component 2, therefore becomes a vacuum fixation 1 whose height can be controlled via a gas flow j and which can be adjusted even better in height.

[0073] Figure 3a shows a first method step of an exemplary method for fixing substrates, with a first exemplary substrate holder 4. The first substrate holder 4 has a plurality of fixing elements or vacuum fixing devices 1, which can be distributed as desired over the substrate holder 4. They are preferably distributed within a circular area, which corresponds to the circular area of ​​a round substrate to be fixed. Each vacuum fixing device 1 can be controlled, in particular individually, by a corresponding channel 5. It is also conceivable that all channels 5 are connected to one another, so that all vacuum fixing devices 1 can be controlled simultaneously. The gas or gas mixture of the environment is preferably sucked out through the channels 5, i.e., an attempt is made to build up a vacuum. However, it is also conceivable that the channels 5 are flushed with a gas. In the figure, neither evacuation nor flushing takes place, i.e.the vacuum fixations 1 are in the extracted state. The total height h of the substrate holder 4 is composed of the height h1 of the vacuum fixations 1 in the extracted state and the height h6 of the holder 6, which can also be formed as part of the substrate holder. The holder 6 can, for example, be fork-shaped in order to contact a substrate exclusively at the periphery. A full-surface holder 6 is also conceivable. The holder 6 is preferably connected to a robot (not shown) via at least one further component, in particular an extension component. It is also conceivable that the substrate holder 4 can be handled manually via the component.

[0074] Figure 3b shows a second method step of an exemplary method for securing substrates, with a first substrate holder 4. Switching on a vacuum pump (not shown) connected to the channels 5 creates a gas flow j , which leads to a contraction of the vacuum fixtures 1 (see also Figure 2). Generally, each vacuum fixture 1 has its own channel 5. This reduces the height hl of the vacuum fixtures 1 to the height hl ' and thus the total height h to h' .

[0075] Figure 3c shows a third method step of an exemplary method for securing substrates, using a first substrate holder 4. The first substrate holder 4 is inserted between two substrates 7 (insertion direction v) while maintaining the gas flow j. Insertion into the narrow area is only possible by the contracted vacuum fixtures 1. The substrates 7 are shown with an exaggerated degree of bending or waviness to explain a further advantage of the device in the next figure. The holding elements for the substrates 7 are not shown for the sake of clarity.

[0076] Figure 3d shows a fourth method step of an exemplary method for securing substrates, using a first substrate holder 4. The gas flow 6 is shut off, and the channels 5 are no longer evacuated. Due to the elasticity of the suction cups 1, which are preferably designed as bellows, they increase their height again until they contact the surface of a substrate 7. This illustration reveals another aspect of the vacuum fixtures 1. In the extracted state, the vacuum fixtures 1 adapt to the waviness of the substrate to be secured.

[0077] Figure 3e shows a fifth method step of an exemplary method for fixing substrates, using a first substrate holder 4. The channels 5 are evacuated again. This removes the gas or gas mixture in the channels. Since a substrate 5 now prevents or at least severely impedes the further inflow of gas particles via the vacuum fixations, the substrate 7 is fixed to the vacuum fixations 1. Furthermore, the substrate 7 is preferably planarized.

[0078] Figure 3f shows a sixth method step of an exemplary method for fixing substrates, with a first substrate holder 4. The substrate 7 is removed from the set of substrates 7 (direction of movement v) and transported accordingly, while maintaining the evacuation of the channels 5 of the substrate holder 4.

[0079] List of reference symbols

[0080] 1 fixing element, vacuum fixation

[0081] 2 Flow resistance section, flow resistance component

[0082] 2z central part

[0083] 2p Periphery

[0084] 2v connecting elements

[0085] 2k fixations

[0086] 3 springy section, folded section, suction cup

[0087] 4 substrate holders

[0088] 5 Fluid channel, channel

[0089] 6 Bracket

[0090] 7 Substrate pO, pl Pressure

[0091] Fluid flow, gas flow

Claims

Patent and regulations 1. Device for fixing a substrate (7), at least comprising -a substrate holder (4) with at least one fixing element (1) for contacting the substrate (7), characterized in that the at least one fixing element (1) is height-adjustable by a fluid flow (j).

2. Device according to claim 1, wherein the at least one fixing element (1 ) has at least one continuous cavity, so that the fluid flow (j) can be conducted through the at least one fixing element (1).

3. Device according to at least one of the preceding claims, wherein the substrate holder (4) has a fluid channel opening adjoining the at least one through cavity.

4. Device according to at least one of the preceding claims, wherein the at least one fixing element (1) is at least partially elastic.

5. Device according to at least one of the preceding claims, wherein the at least one fixing element (1) has a resilient section (3).

6. Device according to at least one of the preceding claims, wherein the at least one fixing element (1) has a flow resistance section (2).

7. Device according to at least one of the preceding claims, wherein the flow resistance section (2) is arranged on a side of the at least one fixing element (1) facing away from the substrate holder (4).

8. Device according to at least one of the preceding claims, wherein the flow resistance section (2) is formed by a flow resistance component (2) that can be attached to the resilient section (3).

9. Device according to at least one of the preceding claims, wherein the flow resistance component (2) is arranged at least partially in the through cavity.

10. Device according to at least one of the preceding claims, wherein the flow resistance component (2) forms at least a partial outer wall of the continuous cavity.

11. Device according to at least one of the preceding claims, wherein the at least one fixing element (1 ) has a certain height (hl) in an unloaded state.

12. Device according to at least one of the preceding claims, wherein the determined height (hl ) of the at least one fixing element (1) can be reduced by at least 1 / 4, preferably by at least 1 / 3, more preferably by at least 1 / 2 by applying the fluid flow (j).

13. Device according to at least one of the preceding claims, wherein the substrate holder (4) has three or more fixing elements (1).

14. Method for fixing a substrate (7), comprising at least the following steps, i) providing a device for fixing a substrate (7), comprising at least: -a substrate holder (4) with at least one fixing element (1 ) for contacting the substrate (7), wherein the at least one fixing element (1) is height-adjustable by a fluid flow (j), ii) supplying the at least one fixing element (1 ) with the fluid flow (j), iii) positioning the substrate holder (4) relative to the substrate (7), iv) interrupting the fluid flow (j) to contact the substrate (7).

15. Method according to claim 14, wherein the application in step ii) comprises an evacuation or a flooding of at least one fluid channel (5) of the substrate holder (4).

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