System and method for surface treatment of materials

Abstract

The invention relates to a system for surface treatment of materials (10), comprising a target material, at least one transfer device (100) and at least one plasma generator device (200). The plasma generator device (200) comprises a fluid (formula B) and generates a column (202) of cold plasma. The target material is able to travel a path between a starting point and an end point, passing through the plasma generator device (200) and the plasma column (202), along a unit vector of movement. The transfer device (100) comprises a fluid (formula A) transferred from the transfer device (100) to the plasma generator device (200). The plasma column (202), generated from the fluids (formula A) and (formula B), has an oblong geometric shape of length (formula C), according to a longitudinal axis colinear with the vector of movement, and of width (formula D), according to a transverse axis perpendicular to the vector of movement, such that (formula E).

Description

DESCRIPTION Title of the invention: System and method for surface treatment of materials

[0001] Technical field

[0002] The present invention relates generally to materials, and in particular to a system and method for surface treatment of materials using plasma generating devices.

[0003] Material surface treatment systems are classically used in many fields such as biomedical, cosmetics, material treatment by surface functionalization, lighting, etc.

[0004] Known material surface treatment systems use chemicals, using techniques involving bathing objects or spraying / evaporation to achieve surface treatment of materials. However, such solutions require the external supply of chemical components and are therefore not environmentally friendly.

[0005] To avoid the use and storage of chemicals, other material surface treatment systems use so-called "plasma" techniques for material treatment. These plasma techniques can be implemented using "torches" or DBD (for "dielectric barrier discharge") systems.

[0006] However, known plasma techniques are limited in gas mixtures for plasma generation. Indeed, they do not allow for material treatments with high concentrations of additional gases (such as high percentages of nitrogen or oxygen in rare gases), which leads to plasma quenching.

[0007] Furthermore, some known techniques (notably torches) consume significant power. Furthermore, in the case of torches, the technique is not suitable for heat-sensitive materials and is poorly suited to the treatment of moving objects. In DBD systems, they can lead to inhomogeneous treatments, as plasmas are difficult to produce homogeneously at atmospheric pressure. Thus, these techniques cannot guarantee direct and homogeneous treatment in the case of symmetrical objects. substantially cylindrical with a very high aspect ratio, such as fibers or wires, ribbons, tubes or capillaries. Furthermore, these techniques cannot guarantee efficient and rapid processing of these materials and objects due to the low volume of plasma generated at atmospheric pressure.

[0008] There is thus a need for an improved surface treatment method and system capable of treating the surface of materials without degradation, at atmospheric pressure, and in a manner suitable for hollow materials such as tubes or capillaries.

[0009] Summary of the invention

[0010] The present invention improves the situation by proposing a system for surface treatment of materials comprising a target material, at least one transfer device, at least one plasma generator device, the transfer device comprising a fluid ℱ1 intended to be transferred to the plasma generator device, the plasma generator device comprising a fluid ℱ2 and being configured to generate a column of cold plasma, the target material being able to travel a path, between a starting point and an arrival point, the path passing through at least the plasma generator device and the plasma column, the path being defined in a given reference frame according to a unit displacement vector ^^, the fluid ℱ1 being transferred from the transfer device to the plasma generator device, and the plasma column being generated from the fluid ℱ1 and the fluid ℱ2.The plasma column has an oblong geometric shape defined by a length ℒ, a width ℓ and an aspect ratio, the length ℒ being defined along a longitudinal axis. collinear to the displacement vector ^^ and the width ℓ being defined along a transverse axis perpendicular to the displacement vector ^^.

[0011] In one embodiment, the target material may further pass through at least a portion of the transfer device.

[0012] The plasma generator device may comprise a capillary for generating a plasma column comprising an inlet orifice configured to receive the target material at the inlet of the capillary and an outlet orifice configured to deliver the target material at the outlet of the capillary. 3

[0013] In embodiments, the plasma generator device is a “T” device, further comprising a fluid control and supply module ℱ2 and a fluid transport guide ℱ2, the control and supply module being configured to apply a pulsed discharge in the fluid ℱ2 according to a discharge frequency ƒ2. The guide and the capillary of the “T” device may each have a shape and dimensions chosen according to the target material and the surface treatment to be applied.

[0014] In some embodiments, the transfer device may be a "T" device configured to generate a plasma column, the transfer device and the plasma generator device being spaced apart from each other by a distance ℰ 1−2representing the distance between the inlet of the plasma generating device and the outlet of the transfer device. The plasma column can be generated depending on the distance ℰ 1−2 .

[0015] In particular, the capillary of the plasma generator device may comprise at least one part made of a conductive material and at least one part made of a dielectric material.

[0016] The target material may further have a width ϕ and the capillary may have a width ^^. The transfer device may be an enclosure attached to the plasma generating device, and connected at the inlet port of the plasma generating device by a connection having a given shape and an opening of diameter δ such that ϕ < δ ≤ d. The connection may allow the transfer of the fluid ℱ1 into the capillary and the plasma column may be generated depending on the connection.

[0017] The target material may be a fiber, a wire or a capillary, wound, at the starting point, in a starting coil, and at the arrival point, in an arrival coil, each coil being capable of being unwound and wound so that the target material travels the path at a given speed defined according to the surface treatment to be applied.

[0018] The invention also provides a method of manufacturing an object from at least one material surface treatment system comprising at least one target material, at least one transfer device and at least one plasma generator device, the target material traveling a path between a starting point and an arrival point along a unit displacement vector ^^, the transfer device comprising a fluid ℱ1, the plasma generator device comprising a fluid ℱ2, the method comprising the steps of: - transferring the fluid ℱ1 from the transfer device to the plasma generator device, - generating a column of cold plasma at surrounding pressure by means of the plasma generator device from the fluids ℱ1 and ℱ2, the plasma column having an oblong geometric shape defined by a length ℒ, a width ℓ and an aspect ratio noted the length ℒ being defined along a longitudinal axis collinear to the displacement vector and the width ℓ is defined along a transverse axis perpendicular to the displacement vector , and - passing the target material along the path, through the plasma generator device, at least when the plasma column is generated.

[0019] The method further comprises a step of passing the target material through the transfer device.

[0020] The method and system for surface treatment of materials according to the embodiments of the invention make it possible to generate multiple atmospheric plasmas, involving gas mixtures impossible to obtain from prior art plasma reactors. These plasmas can be generated over long lengths and suitable for the inhomogeneous and / or homogeneous treatment of materials with a very large aspect ratio. These plasmas can further be generated by interchangeable devices in a low-energy system.

[0021] Description of figures

[0022] Other characteristics, details and advantages of the invention will emerge from reading the description given with reference to the appended drawings given by way of example.

[0023] [Fig.1] Figure 1 is a diagram showing a system for treating the surface of materials, according to embodiments of the invention.

[0024] [Fig.2] Figure 2 is a diagram representing a plasma generator device, according to an example of use of the invention. 5

[0025] [Fig.3] Figure 3 is a diagram showing a plasma generator device, according to another example of use.

[0026] [Fig.4] Figure 4 is a diagram showing a transfer device and a plasma generator device arranged in series, according to embodiments of the invention.

[0027] [Fig.5] Figure 5 is a diagram showing a transfer device and a plasma generator device arranged in series and connected by a connection port, according to other embodiments of the invention.

[0028] [Fig.6] Figure 6 is a diagram showing a transfer device and a plasma generator device arranged in series and connected by a connecting nozzle, according to other embodiments of the invention.

[0029] [Fig.7] Figure 7 is a diagram showing a controlled mixing zone between a transfer device and a plasma generating device arranged in series and connected by a connection port, according to other embodiments of the invention.

[0030] [Fig.8] Figure 8 is a diagram showing a transfer device and two plasma generator devices arranged in series, according to embodiments of the invention.

[0031] [Fig.9] Figure 9 is a diagram showing a device for treating materials in the presence of liquid or gel, according to embodiments of the invention.

[0032] [Fig.10] Figure 10 is a diagram showing a system for treating the surface of materials, according to embodiments of the invention.

[0033] [Fig.11] Figure 11 is a flowchart showing a method of manufacturing an object from the material surface treatment system, according to embodiments of the invention.

[0034] Identical references are used in figures to designate identical or similar elements. For clarity, the elements shown are not to scale.

[0035] Detailed description 6

[0036] Figure 1 schematically represents a material surface treatment system 10 comprising a target material ℳ, a transfer device 100 and a plasma generator device 200.

[0037] The surface treatment system, according to the embodiments of the invention, can be used in different fields of application, such as, for example and without limitation, the field of biomedicine, sterilization, medicine, cosmetics, treatment of materials by functionalization of surfaces, production of ultrafine patterns, depollution and / or decontamination, germination, lighting, rapid switching, modification of flows, detection, metrology, etc.

[0038] The target material ℳ may be composed of one or more inert dielectric or conductive materials and / or biological tissues. The target material ℳ comprises a surface which may be defined for example by its chemical and / or structural composition, and / or its surface state. The surface of a material is in particular defined by specific surface properties such as for example physical properties, optical properties, and / or electrical properties, etc.

[0039] Some of these surface properties may be modified during and / or after interaction of the target material ℳ with a plasma at or very close to room temperature.

[0040] As used herein, the term "plasma" refers to a cold plasma formed at ambient pressure defined by a gaseous plasma (consisting of charged species and electrons) out of thermodynamic equilibrium for which the temperature of the electrons is very high compared to the temperature of the other species contained in the plasma. The temperature of the other species remains close to ambient temperature.

[0041] A plasma formed by the devices of the material surface treatment system 10 generates a production, in a controlled and homogeneous manner, of reactive species. These species are excited chemical elements or in their ground state (for example NO, OH, NO2, H2O2, O, O3, etc.) having given lifetimes. In particular, certain species have so-called 'short' lifetimes defined such that these reactive species are contained in the plasma formed, while other species have so-called 'long' lifetimes defined such that these other reactive species can be displaced outside the formed plasma.

[0042] For example, and in a non-limiting manner, the interaction of the target material ℳ with a plasma can modify the wettability of the surface of the target material ℳ by any type of physical or chemical process including in particular and without limitation the phenomenon of abrasion (or degreasing), deposition, functionalization, grafting, or even crosslinking. According to another example, the interaction of the target material ℳ with a plasma containing nanoparticles can modify the optical refraction or the fluorescence of the surface of the target material ℳ by deposition of thin layers.

[0043] In particular, the interaction of the target material ℳ with a plasma can locally induce the production of reactive species on the surface, used for example for the purpose of decontaminating the target material ℳ.

[0044] The target material ℳ may be an object with a large aspect ratio or cylindrical symmetry, defined according to a diameter denoted Φ. The target material ℳ may be, for example, a fiber, a wire, a tube or a capillary. The diameter Φ of such a target material ℳ may be, for example, characterized by a maximum value Φ max , that is, the diameter Φ is less than the maximum value of diameter Φ max . The maximum value Φ max may be equal to a few millimeters. For example and without limitations, the maximum value Φ max can be equal to 8 mm ( Φ < 8 mm ).

[0045] Advantageously, the target material ℳ treated by the material surface treatment system 10 can be used for the manufacture of multi-composite woven objects. Such objects are for example used in an application of the invention to the biomedical field or to the cosmetics field.

[0046] The material surface treatment system 10 is associated with a given reference frame, denoted ℛ. The target material ℳ is capable of traveling a path T, defined according to a unit displacement vector , between a starting point A and an arrival point B, in the reference frame ℛ. The path T passes through at least the plasma generator device 200.

[0047] In some embodiments, the path T may further partially or entirely pass through the transfer device 100. In other embodiments, the path T does not pass through the transfer device 100.

[0048] In the embodiments where the path T passes at least partly through the transfer device 100, the transfer device 100 and the plasma generator device 200 are arranged “in series” in the material surface treatment system 10. In such an embodiment, the path T can therefore extend between a starting point A, located upstream (or inside) the transfer device 100 and an arrival point B, located downstream of the plasma generator device 200, in the reference frame ℛ, as shown in FIG. 1.

[0049] In embodiments, all or part of the material surface treatment system 10 may be included in a chamber (also called an 'enclosure') configured to control environmental parameters such as pressure, temperature and humidity, but also the quality of the air in the chamber or the composition of the surrounding gas. For example and in a non-limiting manner, the pressure in the chamber may be defined between 0.5 atm and 5 atm (the unit atm corresponds to normal atmospheric pressure), the temperature may be defined between 0°C and 50°C, and the humidity between 0% and 100%.

[0050] The transfer device 100 and the plasma generator device 200 are separated from each other by a distance ℰ 1−2 . The distance ℰ 1−2can be positive, negative or zero. This distance is defined according to the target material ℳ of the surface treatment, and the embodiment used for the implementation of the devices 100 and 200.

[0051] The transfer device 100 comprises a fluid ℱ1 and the plasma generator device 200 comprises a fluid ℱ2. These fluids evolve in their respective devices according to characteristic parameters (such as for example the flow rate or the direction of flow of the fluid). In certain embodiments, the fluids ℱ1 and ℱ2 may be identical. Alternatively, the fluids ℱ1 and ℱ2 may be different and / or have one or more different characteristic parameters.

[0052] Each fluid ℱ1 and ℱ2 may be a gas or a mixture of gases in which and / or from which a plasma may be formed. 9

[0053] For example, each of fluids ℱ1 and / or ℱ2 may be air, nitrogen, oxygen, etc. Alternatively, each fluid ℱ1 and / or ℱ2 may be a mixture of gases. In embodiments where all or part of the material surface treatment system 10 is included in a chamber, fluid ℱ1 or fluid ℱ2 may be defined by the composition of the surrounding (or ambient) gas which depends on various control parameters of the chamber.

[0054] In embodiments, each fluid ℱ1 and / or ℱ2 may be a rare gas, or a mixture of rare gases (typically helium He, argon Ar, neon Ne etc.).

[0055] The gases (and / or rare gases) used may also include one or more minor constituents, i.e., those added at a low concentration. These constituents may be molecular gases corresponding, for example, to oxygen O2, hydrogen H2, sulfur hexafluoride SF6, nitrogen N2 and / or any type of gas resulting from the vaporization of a liquid, such as water vapor H2O. A molecular gas may in particular be loaded or not with nanoparticles (of a metallic, dielectric nature, etc.), or with all types of precursors such as molecular precursors of polymers.

[0056] The plasma generator device 200 may be configured to generate a column 202 of cold plasma formed at ambient pressure from the fluid ℱ2 and the fluid ℱ1 transferred from the transfer device 100 to the plasma generator device 200. This plasma column 202 has a substantially oblong geometric shape, defined by a length ℒ and a width ℓ. As used herein, the term "width ℓ" refers to the diameter of the plasma column 202 at its center as shown in FIG. 1. The geometric shape is defined by a ratio ℒ ℓ, also called “aspect ratio”. The geometric shape being oblong, the value of the length ℒ of the plasma column 202 is greater than the value of the width ℓ. The aspect ratio of the plasma column 202 is therefore defined by equation (1):

[0057] (1)

[0058] Advantageously, the length ℒ of the plasma column 202 is defined along a longitudinal axis collinear with the displacement vector and the width ℓ is defined, along a transverse axis perpendicular to the displacement vector

[0059] Thus, the target material ℳ passes through the plasma column 202, longitudinally and along the path T. One or more surface properties of the target material ℳ are then modified by the interaction between the target material ℳ and the plasma column 202.

[0060] Figures 2 and 3 show a plasma generator device 200, according to embodiments and examples of use of the invention. The plasma generator device 200 is configured to generate a plasma column 202 from one or more fluids.

[0061] The plasma generator device 200 may comprise a module 204 for controlling and supplying the fluid ℱ2, a guide 206 for transporting the fluid ℱ2 and a capillary 208 for generating the plasma column 202.

[0062] The module 204 for controlling and supplying the fluid ℱ2 may comprise a supply enclosure connected to the source of fluid ℱ2, and configured to supply the capillary 208 with fluid ℱ2 through the guide 206. The supply of the fluid ℱ2 is then controlled, by the module 204, according to characteristic parameters such as flow parameters associated with: - the flow rate of the fluid ℱ2 in the guide 206 and / or the capillary 208, noted ^^2, or else, - the flow modulation ^^2 of the fluid ℱ2, which makes it possible to generate a flow which may be continuous or discontinuous (or intermittent).

[0063] For example, the guide 206 can be traversed by the fluid ℱ2 according to a flow rate ^^2 between 0.001 l / min and 10 l / min.

[0064] In embodiments, the control and power supply module 204 may be a device for producing a “plasma jet” obtained from a plasmagenic gas, as described for example and in a non-limiting manner in WO 2009 / 050240 and WO 2016 / 083539.

[0065] In an exemplary embodiment, a “plasma jet” production device may comprise a supply enclosure connected to a source of fluid ℱ2 in which one or two electrodes connected to a high-voltage generator are housed (elements not shown in the figures). Reference is made to the concept of plasma “jet” because the plasma propagates beyond the discharge electrodes at through the flow of the fluid ℱ2. In these embodiments, the control and power module 204 can control another characteristic parameter corresponding to the discharge parameter (also called “pulse discharge”). A pulse discharge designates a discontinuous discharge of plasma jet in the fluid ℱ2 and is defined by a discharge frequency ƒ2.

[0066] For example, the pulse discharge in the fluid ℱ2 can be defined so as to obtain a cold plasma in the plasma column 202, the discharge frequency ƒ2 being chosen according to the target material ℳ and the surface treatment.

[0067] The shapes, dimensions and constituent materials of the guide 206 for transporting the fluid ℱ2 and the capillary 208 for generating the plasma column 202 can advantageously depend on the type of target material ℳ and / or surface properties of the target material ℳ to be modified.

[0068] The guide 206 and / or the capillary 208 may be made of one or more rigid or flexible materials, among dielectric materials or conductive materials covered with none, one or more dielectric materials. The plasma column 202 is formed in the capillary 208 at the level of dielectric materials (or conductive materials whose interior of the capillary is covered with dielectric materials).

[0069] The guide 206 and / or the capillary 208 may have a cylindrical shape. The guide 206 may further extend transversely relative to the direction of the displacement vector, at any angle α. In such embodiments, the plasma generator device 200 is called a “T” device. For example and in a non-limiting manner, the angle α may be substantially equal to 90° so that the orientation of the guide 206 may be perpendicular to that of the capillary 208. Thus, the target material ℳ traveling along the path T longitudinally passes through the capillary 208 and the generated plasma column 202.

[0070] The capillary 208 for generating the plasma column 202 may include an inlet orifice 208-01 configured to receive the target material ℳ and an outlet orifice 208-02 for delivering the target material ℳ out of the capillary 208, the inlet and outlet orifices 208-01 and 208-02 being positioned on the path T.

[0071] As shown in Figures 2 and 3, the capillary 208 can be defined by its diameter d and its length D . For example, the diameter d of the capillary 208 can be between 500 µm and 1 cm. In particular, the diameter d of the capillary 208 can be defined relative to the diameter Φ of the target material ℳ, such that d > Φ, taking into account certain constraints such as for example mechanical constraints of displacement of the target material ℳ longitudinally passing through the capillary 208. Advantageously, the diameter d of the capillary 208 can be slightly greater than the diameter Φ of the target material ℳ, such that d ≳ Φ , which makes it possible to generate a plasma column 202 having a lower energy cost.

[0072] Furthermore, the guide 206 may or may not be positioned in the middle of the capillary 208 of length D. If the guide 206 is positioned in the middle of the capillary, the “T” device may be symmetrical. Otherwise, the “T” device is asymmetrical. For example, an asymmetrical “T” device may comprise a capillary 208 defined by two branches, respectively called 'long branch' of length D long and 'short branch' of length D court , such as D long > D court and that D = D long + D court . Alternatively, an asymmetrical “T” device may comprise a capillary 208 comprising two branches defined relative to the position of the guide 206, and respectively having a large diameter d grand and a small diameter of petit , such that d grand > d petit .

[0073] The 206 guide can also be defined by its diameter d g and its length D g . In particular, the diameter ofg of the guide 206 can be defined relative to the diameter d of the capillary 208.

[0074] More generally, the parameters d d, D , d g and D g are linked to the flow parameters of the fluid ℱ2, to the nature of the fluid ℱ2 or to the pulse discharge in the fluid ℱ2. These parameters can influence the characteristic parameters of formation of the plasma column 202, such as for example its diameter ℓ and its length ℒ.

[0075] For example, the evolution of the fluid ℱ2 in the device can be characterized in particular by the flow rate parameter and the flow rate of the fluid ℱ2 in the capillary 208 can depend on a condition relating to the diameter d g of the guide 206 and the diameter d of the capillary 208. In particular: - if the diameter of g u guide 206 is greater than or equal to the diameter d of the capillary 208 (d g≥ d), the fluid ℱ2 flowing from the guide 206 to the capillary 208 undergoes an increase in flow velocity in the capillary 208, relative to the guide 206, and - alternatively, if the diameter d g of the guide 206 is strictly less than the diameter d of the capillary 208 (d g < d), the fluid ℱ2 undergoes a decrease in flow speed in capillary 208, relative to the guide 206.

[0076] In embodiments, the diameter ℓ of the plasma column 202 may be such that ℓ ≳ Φ in order to obtain a certain efficiency and homogeneity of surface treatment of the target material ℳ.

[0077] For example, the length ℒ of the plasma column 202 can be between 1 cm and 100 cm.

[0078] The length ℒ of the plasma column 202 may further depend on the nature of the fluid ℱ2. For example and without limitation, a pure gas may generate a length ℒ pureof the plasma column 202 larger than a gas mixture generating a length ℒ mixte of the plasma column 202, such that ℒ pure > ℒ mixte . The fluid ℱ2 flowing in the capillary 208 towards the inlet and outlet ports 208-01 and 208-02 mixes with the surrounding air (or ambient air or surrounding gas or chamber gas) outside or inside the capillary 208. Thus, the flow parameters of the fluid ℱ2 can similarly influence the length ℒ of the plasma column 202. The high flow velocity (or high flow rate) can limit the mixing of the fluid ℱ2 with the surrounding air and therefore influence certain characteristics of the generated plasma column 202. For example, a device 200 using a high flow velocity in the capillary 208 can generate a length ℒ forteof the plasma column 202 larger than a device 200 using a low flow velocity in the capillary 208 generating a length ℒ faible of the plasma column 202, such that ℒ forte > ℒ faible .

[0079] As an illustrative example, Figure 2 represents a device comprising a plasma column 202 held in the capillary 208, such that ℒ < D . Figure 3 represents a device alternatively comprising a plasma column 202 extending on either side of the inlet and outlet ports 208-01 and 208-02 capillary 208, such that ℒ > D .

[0080] In the mode of use of Figure 2, the fluid ℱ2 flows from the control and supply module 204, into the guide 206, then passes through the plasma column 202 according to flow parameters defined for example by the speed of the fluid ℱ2 towards the inlet and outlet ports 208-01 and 208-02. The plasma column 202 may in particular comprise reactive species having 'long lifetimes' and which can be carried away / displaced outside the plasma formed according to the direction of flow of the fluid. This results in a modified fluid ℱ2, then denoted fluid ℱ 2−m comprising reactive species. The length of this modified fluid ℱ 2−m depends in particular on the lifetime of the species and the flow rate of the fluid ℱ2. Advantageously, the smaller the diameters involved, the more the displacement speeds of the species increase and the more the fluid ℱ2_ m and reactive species can reach long distances.

[0081] The mode of use of figure 3 shows a propagation zone of the plasma column 202 outside the capillary 208, also called “plasma plume” 202-02. The plasma plume 202-02 corresponding to the plasma column 202 interacting outside the capillary 208 with the ambient air for example. The properties called plasma properties of the plasma plume 202-02 and the plasma column 202 may therefore be different.

[0082] The external supply of fluid ℱ1 can be carried out by the transfer device 100. For example and in a non-limiting manner, the supply of fluid ℱ1 can be carried out by means of: - another plasma generator device as described in relation to figures 2 and 3; or - an enclosure connected to a source of plasma gas.

[0083] Figure 4 shows the transfer device 100 and the plasma generator device 200 arranged in series, according to the embodiment of the invention in which the external supply of the fluid ℱ1 is carried out by means of another plasma generator device (as described in relation to Figures 2 and 3).

[0084] In such an embodiment, the transfer device 100 may comprise the same characteristics as the plasma generator device 200 described in relation to FIGS. 2 and 3. Thus, the transfer device 100 may be configured to generate a plasma column 102 from one or more fluids. The transfer device 100 may also comprise a control and supply module 104 for the fluid ℱ1, a guide 106 for transporting the fluid ℱ1 and a capillary 108 for generating the plasma column 102, also of oblong geometric shape. The transfer device 100 may be a “T” device such that the orientation of the guide 106 may extend substantially perpendicular to the orientation of the capillary 108.

[0085] As shown in Figure 4, in some embodiments the target material ℳ traveling along the path T can longitudinally and entirely pass through the capillary 108 and the generated plasma column 102.

[0086] Alternatively, in other embodiments (not shown in the figures), the target material ℳ may not pass through the transfer device 100. In such an embodiment, the capillary 108 and the generated plasma column 102 may for example have a transverse direction or at a given angle relative to the longitudinal direction of the path T.

[0087] The devices 100 and 200 may be identical and induce identical fluids ℱ1 and ℱ2. Alternatively, the fluids ℱ1 and ℱ2 may be different and / or the devices 100 and 200 may be different or include one or more different characteristic parameters associated with the control and supply of the fluids. For example, the flow rates of the fluids ℱ1 and ℱ2 in the capillaries 108 and 208 may be equal or different and / or defined according to different, identical, synchronous or asynchronous flow modulations of the fluids m1 and m2. Similarly, the pulse discharges of the modules 104 and 204 in the fluids ℱ1 and ℱ2 can be defined by different discharge frequencies and / or modulations of discharge frequencies ƒ1 and ƒ2, identical synchronous or asynchronous.

[0088] In this embodiment shown in Figure 4, the capillary 108 includes an inlet orifice 108-01 configured to receive the target material ℳ and an outlet orifice 108-02 configured to deliver the target material ℳ out of the capillary 108. The inlet and outlet ports can therefore be positioned on the path T. In this case, the target material ℳ passes through the transfer device 100 and the plasma generator device 200 arranged in series, and the target material ℳ passes through the plasma column 102 and the plasma column 202, longitudinally, following the path T. Thus, one or more surface properties of the target material ℳ can be modified by the interaction between the target material ℳ and the plasma columns 102 and 202.

[0089] The distance ℰ 1−2between the transfer device 100 and the plasma generator device 200, shown in Figure 4, corresponds to the distance between the outlet orifice 108-02 of the transfer device 100 and the inlet orifice 208-01 of the plasma generator device 200. In other embodiments, the order of the devices can be reversed on the path T, so that the distance ℰ 1−2 represents the distance between the outlet port 208-02 of the plasma generator device 200 and the inlet port 108-01 of the transfer device 100.

[0090] In these embodiments, the distance ℰ 1−2 between the capillaries can be chosen depending on the type of target material ℳ and the surface treatment to be applied. In particular, the variability of the spacing ℰ 1−2between the capillaries 108 and 208 can influence the interaction between the devices 100 and 200, so that the plasma generator device 200 can generate a plasma column 202 from the fluid ℱ1 and the fluid ℱ2.

[0091] For this, in the example shown in Figure 4, the transfer device 100 can be configured to generate a plasma column 102 of length ℒ > D , so that a plasma plume 102-02 exits the outlet orifice 108-02. The fluid ℱ1 then comprises a plasma jet generating a plasma column 102. The spacing ℰ 1−2 thus influences the interaction (or mixing) of the plasma plume 102-02 with: - a plasma plume 202-02, - the plasma column 202, - the fluid ℱ 2−m containing reactive species, and / or - fluid ℱ2.

[0092] In particular, the plasma plume 102-02 can reach the fluid ℱ2 discharged in the capillary 208 (at any angle defined by the path T) and thus generate a plasma column 202 by plasma transfer, from a new fluid resulting from the mixing of fluids ℱ1 and ℱ2. In this interaction (or transfer) zone, it should be noted that the spacing ℰ 1−2 can also influence the processing of material ℳ locally.

[0093] Spacing ℰ 1−2 can notably be negative, zero or positive. A spacing ℰ 1−2 negative corresponds in particular to the case where one of the two capillaries 108 or 208 is inserted into the other capillary, depending on their respective diameters. In addition, a spacing ℰ 1−2 positive may be less than a maximum distance noted (with for example and without limitation: corresponding to the upper limit of possible interaction between the plasmas and / or fluids of the two devices 100 and 200.

[0094] In embodiments using an asymmetrical “T” device, the capillary 208 of the plasma generator device 200 may comprise two branches of different diameters. grand and d petit Advantageously, the branch of the capillary 208 having the diameter d grand may include the inlet port 208-01 positioned at a distance ℰ 1−2 of the outlet orifice 108-02 of the device 100 and the branch of the capillary 208 having the diameter d petit may include the outlet port 208-02 of the material ℳ so that the diameter d petit is defined to best fit the diameter Φ. Such an asymmetrical “T” device makes it possible to minimize the problems of flux transfer in the interaction zone between the devices 100 and 200, while limiting the energy consumption to generate the plasma 202.

[0095] Figures 5 to 7 represent embodiments of the invention in which the external supply of fluid ℱ1 is carried out by means of an enclosure connected to a source of plasma gas.

[0096] Figure 5 represents in particular a series arrangement of the transfer device 100 and the plasma generator device 200, according to such embodiments of the invention.

[0097] The transfer device 100 may be composed of an enclosure (open or closed) comprising a fluid ℱ1 (for example a plasma gas, as described above) and / or a source of fluid ℱ1. The enclosure further comprises an outlet orifice 102-02 of the target material ℳ, positioned on the path T. The source of fluid ℱ1 may be configured to control the supply of the fluid ℱ1, according to parameters characteristics such as the flow rate of the fluid ℱ1in the enclosure or through outlet port 102-02.

[0098] The starting point A of the path T of the target material ℳ may be located inside the enclosure of the transfer device 100. Alternatively, the starting point A may be located outside the enclosure of the transfer device 100 so that the path T of the target material ℳ passes through the transfer device 100. The transfer device 100 may then also comprise an inlet orifice 102-01 of the target material ℳ, positioned on the path T.

[0099] The distance ℰ 1−2between the transfer device 100 and the plasma generator device 200 is positive, negative or zero. In embodiments, as shown in Figures 5, 6 or 7 for example, the transfer device 100 can thus be attached to the plasma generator device 200 by a connection coinciding with the outlet orifice 102-02 of the transfer device 100 and the inlet orifice 208-01 of the plasma generator device 200. The connection positioned on the path T coinciding with the attachment of the devices 100 and 200 will be noted hereinafter C 1−2 .

[0100] The C connection 1−2 has a specific shape and an opening of diameter δ 1−2 by which the fluid ℱ1 is sent into the capillary 208 for generating the plasma column 202. The minimum value of the diameter δ 1−2 can be defined with respect to the diameter Φ of the target material ℳ, such that δ 1−2> ϕ. Similarly, the maximum value of the diameter δ1 can be defined with respect to the diameter d −2 of the capillary 208 generating the plasma column 202, such that δ 1−2 ≤ d .

[0101] As shown in Figure 5, connection C 1−2 may include an injection orifice. For example, the diameter δ 1−2 of the injection orifice can be between 500 µm and 5 mm. Such an injection orifice allows a simple supply of the fluid ℱ1, and the diameter δ 1−2 influences the flow rate p1 of the fluid. In embodiments, the connection C 1−2 may include a diameter control unit δ 1−2 of the injection orifice allowing to modify or modulate the flow of the fluid ℱ1 towards the device 200. For example, this control unit can comprise a diaphragm or a slot system.

[0102] The embodiment of Figure 6 is similar to that of Figure 5 but has a C connection 1−2 having a shape comprising a so-called “scrolling” surface, which may advantageously be structured, textured or porous. The specific form of the C connection 1−2 as shown in Figure 6 may be, for example, a connection nozzle comprising an injection cone of angle α, and an injection orifice of length noted Δ, according to the diameter δ 1−2 . For example, the angle α of the injection cone can be between 30° and 50°, and the length Δ of the injection orifice can be between 1 mm and 20 mm.

[0103] Advantageously, the scrolling surface induces a drive of the fluid ℱ1 towards the capillary 208 of the plasma generator device 200 to induce the generation of the plasma column 202. A connection C 1−2in the form of an injection nozzle also allows a more complex supply of the fluid ℱ1, inducing for example an acceleration of the speed of the fluid ℱ1 and thus an increase in the flow rate p1 compared to a simple supply.

[0104] The transfer device 100 may further comprise one or more units for supplying one or more additional fluids to the fluid ℱ1 (units not shown in the figures). These additional fluids may be steam, microdroplet mist and / or microparticles or nanoparticles or powders. For example, and in a non-limiting manner, these additional fluids may be produced by evaporation, nebulization or smoke; an additional fluid supply unit may then be an evaporator, a nebulizer, etc. An additional fluid supply unit may be configured to inject an additional fluid and / or the fluid ℱ1 in a controlled manner at the connection C 1−2 .

[0105] Figure 7 represents a mixing zone Z 1−2 between a transfer device 100 and a plasma generator device 200 arranged in series, according to another embodiment of the invention. This mixing zone Z 1−2 is located at the start of the capillary 208 generating the plasma column 202 on the path T.

[0106] Advantageously, the control of the mixture of fluids ℱ1 and ℱ2 in zone Z 1−2 can be improved by the use of pulsed discharges of the module 204 according to a discharge frequency ƒ2 in the fluid ℱ2. This discharge frequency ƒ2 in the fluid ℱ2 is such that it induces an entrainment of the fluid ℱ1 according to a fluidodynamic (i.e. relating to fluid dynamics) and electrodynamic process, which can depend on the flow rate ^^2 of the fluid ℱ2 in the capillary 208. As represented in figure 7, the fluidodynamic and electrodynamic process can induce the flow of fluid ℱ1 along the walls of the capillary 208 in the mixing zone Z 1−2 .

[0107] In the non-limiting example shown in Figure 7, the specific form of connection C 1−2 is a connection port such that δ 1−2 = d.

[0108] The use of a device 100 and a device 200, arranged in series, allows in particular a pretreatment of the target material ℳ in the device 100 before a subsequent plasma treatment in the device 200, inducing an efficiency of surface treatment of the target material ℳ.

[0109] Figure 8 shows a transfer device 100 and two plasma generator devices 200-1 and 200-2 arranged in series, according to other embodiments of the invention.

[0110] In such embodiments, the transfer device 100 is a device similar to the plasma generator device described in relation to FIGS. 2 and 3. The transfer device 100 is thus produced in the form of a device comprising a control and power supply module 104, a guide 106 and a capillary 108. The module 104 may in particular be a plasma jet production device making it possible to generate a plasma column in the capillary 108 from a fluid ℱ1.

[0111] In the example shown in Figure 8, the plasma generator devices 200-1 and 200-2 comprise capillaries 208 symmetrical with respect to the transfer device 100 and positioned respectively at the inlet and outlet of the capillary 108. The target material ℳ traveling along the path T can pass through one or more of these capillaries 108 and / or 208.

[0112] The capillaries 208 comprise a fluid ℱ2, for example air. The capillaries 208 may consist of at least two parts 208-03 and 208-04 made of different materials. For example, as illustrated in FIG. 8, the inner surface of the capillary 208 of the part 208-03 may be made of a conductive material that does not allow the propagation of the plasma column 102 in the plasma generator devices 200-1 and 200-2. Advantageously, the “conductive parts” 208-03 of the capillaries 208 may be entirely metallic. The flow of the fluid ℱ 1−m comprising reactive species, follows the flow in the capillaries 208 placed in series with the capillary 108, according to a spacing δ 1-2(zero spacing in the example of Figure 8). Furthermore, the inner surface of the capillary 208 of the part 208-04 may be made of a dielectric material, which allows the generation of the plasma columns 202 at these “dielectric parts” 208-04 of the capillaries 208. It should be noted that the plasma of the plasma column 102 is conductive and may be capable of applying a voltage to the conductive parts 208-03 attached to the capillary 108. This applied voltage notably allows the regeneration of plasma into plasma columns 202 at the other end of the conductive parts 208-03 (i.e. at the dielectric parts 208-04), as well as the transport of reactive species having “long lifetimes” through these conductive parts 208-03.

[0113] In some embodiments, the conductive portion 208-03 and the dielectric portion 208-04 of a capillary 208 may have equal or different diameters, respectively denoted dconductor and ddielectric. A variation in the diameters dconductorddielectric', such as for example dconductor> ddielectric or dconductor< ddielectric, may induce a slowing down or an acceleration of the flow of the fluid in the capillary 208 to respectively slow down or accelerate the residence time of the reactive species in a dielectric portion 208-04. Equivalently, the conductive portion 208-03 and the dielectric portion 208-04 of a capillary 208 may have equal or different lengths.

[0114] In embodiments, other similar capillaries 208-i may be attached to the capillaries 208 already present. The capillaries 208 already present then fulfill the role of transfer device 100 for these other capillaries 208-i. A complex device may be produced using a single plasma jet production device, and one or more capillaries 208. Each capillary then comprises parts formed from one or more dielectric materials and parts formed from one or more conductive materials. Such a complex device may generate a multitude of oblong-shaped plasmas in the dielectric parts of the capillaries. This multitude of plasmas then forms a so-called “intermittent plasma” having an equivalent length L q Advantageously, such a configuration comprising other capillaries 208-i allows the treatment of the target material M over a very long length L qwhile reducing energy consumption compared to a device forming a "continuous" plasma having a large length L = £ q .

[0115] Furthermore, this multitude of plasmas can have a geometry defined according to the complexity of the arrangement of the different capillaries. For example, at least two capillaries can be connected together at a point, according to any connection angles, in particular between 0° and 180°. Furthermore, the plasma columns generated in such a device can be of identical or different nature depending on the geometries applied and the fluids contained and / or supplied in these different parts. Advantageously, such a configuration (not shown in the figures) comprising one or more complex geometries for connecting three or more capillaries 208-i, according to any connection angles (for example 90°), allows the formation of multiple intermittent plasmas from a single transfer device 100 similar to the plasma generator device described in relation to figures 2 and 3.

[0116] Figure 9 shows a liquid material processing device 700 containing a liquid solution 702.

[0117] Solution 702 may be any chemical solution already used for the treatment of materials. In particular, solution 702 may contain one or more plasma-treated liquids or gels suitable for the desired treatment. For example, the solution may be a 'Plasma Activated Water' (EAP or PAW), a 'Plasma Activated Liquid' (LAP or PAL), a 'Plasma Activated Solution' (SAP or PAS), a 'Plasma Activated Medium' (MAP or PAM) or a 'Plasma Activated Gel' (GAP or PAG).

[0118] This device for treating materials in the presence of liquid or gel 700 may be, for example, a treatment, deposition or surface modification tank by immersion of the target material ℳ in the solution 702.

[0119] According to certain embodiments, such a device 700 can be inserted into the material surface treatment system 10 and arranged in series with respect to the transfer device 100 and the plasma generator device 200. This arrangement can be carried out in different configurations, at any point in the processing chain of the system 10 on the path ^^ of the target material ℳ.

[0120] A first arrangement configuration of the device 700 may be defined by positioning the device 700 upstream of the plasma generator device 200. This configuration allows deposition of liquid and / or gel on the surface of the target material ℳ and then subsequent treatment for applications of modification of the surface of the materials by plasma. For example, in the field of functionalization of optical fibers, such a configuration allows the deposition of a protective sheath.

[0121] A second arrangement configuration of the device 700 can be defined by positioning the device 700 downstream of the plasma generator device 200. This configuration fixes molecules on the surface of the target material ℳ following a previous plasma treatment. Indeed, it should be noted that the surface treatments of materials by plasma interaction can be treatments which evolve over time defined according to, for example, a time interval ^^, depending on the target material ℳ and the surface properties treated. In order to fix certain plasma treatments, the target material ℳ can undergo a liquid treatment of materials 700 in this time interval ^^. Thus, such a configuration of the devices allows an optimal arrangement of the plasma treatments and by solution in the liquid state 702.

[0122] Figure 10 shows a material surface treatment system 10 according to embodiments, comprising a target material ℳ passing through constituent elements 10-01, 10-02, 10-03, 10-04 and 10-05, between the starting point A and the arrival point B.

[0123] The target material ℳ may be, for example, a material capable of being wound on the one hand in a starting coil at point A and on the other hand in an arrival coil at point B, such as, for example, a fiber, a wire, a tube or a capillary. Each of these two coils is capable of being unwound and wound, so as to allow the target material ℳ to travel along the path T, at a speed ^^ defined as a function of the surface treatment to be applied to the target material ℳ by plasma interaction.

[0124] In embodiments, the material surface treatment system 10 (and therefore the two starting coils at point A and arriving at point B) is configured so that the target material ℳ passes through the constituent elements 10-01, 10-02, 10-03, 10-04 and 10-05 at least once. For example and without limitation, the path of the target material ℳ may be a round trip such that the target material ℳ passes through the constituent elements 10-01, 10-02, 10-03, 10-04 and 10-05 a first time, then passes through the constituent elements 10-05, 10-04, 10-03, 10-02 and 10-01 a second time.

[0125] When the target material ℳ passes through the plasma generator device 200, the interaction with the generated cold plasma can take place statically or in a flowing manner. A static interaction is defined by the generation of the plasma column 200 when the target material ℳ is stationary in the capillary 208: the speed ^^ of the target material ℳ is then zero (v = 0 m / s). Similarly, a flowing interaction is defined by the generation of the plasma column 200 when the target material ℳ is in motion: the speed v of the target material ℳ can then be between a minimum value v min and a maximum value v max .

[0126] In other embodiments, the target material ℳ may be an object, with a large aspect ratio comprising a small object length compared to the size of the path T. The target material ℳ may move on a conveyor belt going from a starting point A to an arrival point B, according to a speed ^^ defined according to the surface treatment to be applied.

[0127] The speed ^^ of the target material ℳ along the path T can be limited by a maximum value ^^ max defined by the maximum displacement limit of the target material ℳ. In particular, such a maximum speed v max can be determined from a minimum residence time. This minimum residence time is defined by the minimum plasma interaction time of the target material ℳ to obtain the surface treatment to be applied.

[0128] Similarly, the velocity v of the target material ℳ along the path T can be limited by a minimum value vmin defined by the minimum displacement limit of the target material ℳ in the case of a parade interaction. In particular, such a minimum speed v min can be determined from a maximum residence time of the target material ℳ in a produced plasma column. This maximum residence time is defined by the maximum interaction time plasma so as not to damage the target material ℳ or produce any other unwanted surface treatment.

[0129] Advantageously, the system may comprise a plurality of devices 200 generating a plurality of plasma columns 202 arranged in series, with or without transfer devices 100. Such an implementation makes it possible, for example, to carry out multi-surface treatments or to reduce the so-called “local” residence time of the target material ℳ in a specific plasma column, while guaranteeing a so-called “global” residence time sufficient to induce the surface treatment to be applied. For example, for natural fibers whose local residence time is very low, such an implementation allows cooling of the target material ℳ between two plasma interactions.Alternatively, such an implementation allows plasma heating of the target material ℳ allowing for example an expansion of the material and then a subsequent surface treatment, thus avoiding known problems of treated materials undergoing stretching during application resulting in a loss of their functionalization.

[0130] In embodiments, the speed v of the target material ℳ may vary over time, during the movement of the target material ℳ in the system 10. For example, if the initial properties of the target material ℳ evolve during the unwinding of the starting coil and / or if the properties to be modified must evolve during the processing.

[0131] Advantageously, the various constituent elements 10-01, 10-02, 10-03, 10-04 and 10-05 may be any devices for treating materials or the surface of materials. For example, and in a non-limiting manner, a constituent element may be a device as described above, i.e. a “T” device, an enclosure, or a liquid material treatment device. The constituent elements may in particular be interchangeable to easily adapt the surface treatment of the target material ℳ according to the desired functionality, according to the application of the invention.

[0132] In the embodiment of Figure 10, element 10-01 is an enclosure comprising a fluid denoted ℱ 01 , similarly to the enclosure shown in Figures 5, 6 and 7. Elements 10-02, 10-03 and 10-05 are also plasma generating devices respectively comprising the fluids, denoted ℱ 02 , ℱ 03and ℱ 05 , similar to the plasma generators shown in Figures 2, 3 and 4. Element 10-04 is a device for treating materials in the presence of liquid or gel 700, similar to the liquid treatment device shown in Figure 9.

[0133] Element 10-01 is thus a transfer device 100 with respect to element 10-02, and fluid ℱ 01 is injected into element 10-02 to create the first plasma column 12 through which the target material ℳ passes. Similarly, element 10-02 may be a transfer device 100 relative to element 10-03 (depending on the spacing between elements 10-02 and 10-03), and fluid ℱ 02 (or resulting from the mixing of fluids ℱ 01 and ℱ 02) is injected into element 10-03 to create the second plasma column 14 through which the target material ℳ passes. Element 10-03 may be a transfer device 100 relative to element 10-05 (depending on the structure of element 10-04 and the spacing between elements 10-03 and 10-05), and fluid ℱ 03 (or resulting from the mixing of fluids ℱ 03 and ℱ 02 ) is injected into element 10-05 to create the third plasma column 16 which is crossed by the target material ℳ.

[0134] The embodiments of the invention thus allow the generation of multiple and homogeneous atmospheric plasmas over long lengths. These cold plasmas are generated using mixtures generally impossible to obtain from other plasma treatment techniques known to those skilled in the art. Such mixtures comprise, for example, high percentages of nitrogen or oxygen in rare gases. These plasmas are particularly suitable for consecutive and homogeneous plasma treatments of materials with a very high aspect ratio.

[0135] The different devices according to the embodiments allow great ease of generation and combination of plasmas of different compositions one after the other. In addition, the system allows great ease of injection of aerosols, microdroplets, specific vapors or nanomaterials outside the plasma generating devices, as well as a combination of these plasma treatments with liquid treatments (or aerosols, or microdroplets). The treatment system according to the embodiments of the invention allows optimal treatment of a material from point A to point B, in a single pass on path T.

[0136] Figure 11 is a flowchart describing the method of manufacturing an object from a material surface treatment system 10, according to embodiments of the invention.

[0137] In step 902, the fluid ℱ1 is transferred from the transfer device 100 to the plasma generator device 200.

[0138] In step 904, the column 202 of cold plasma at atmospheric pressure is generated by the plasma generator device 200 from the fluid ℱ1 and the fluid ℱ2.

[0139] In step 906, the target material ℳ passes through the plasma generator device 200, along the path T, at least while the plasma column 202 is being generated. In step 904 or step 902, the target material ℳ may further pass through the transfer device 100 depending on the defined path T.

[0140] The method may further comprise a step 908 consisting of applying pulsed discharges by the module 204 (and / or the module 104 according to the embodiments) in the fluid ℱ2 (and / or in the fluid ℱ1), discontinuously according to a discharge frequency ƒ2 (and / or discharge frequency ƒ1) of for example between 10 Hz and 50 kHz.

[0141] Those skilled in the art will readily understand that steps 902, 904, 906 and 908 can be performed simultaneously and / or in an order defined according to the target material ℳ and the surface properties to be applied.

[0142] In some embodiments, several material surface treatment systems 10 may be arranged, in parallel, into a complete object manufacturing system (not shown in the figures). This complete system may for example comprise n systems configured to treat the surface of n target materials ℳ. The complete system may further comprise a unit for combining the n target materials ℳ at the output of the n surface treatment systems.

[0143] The target materials may in particular be different or identical materials, and / or requiring different or identical surface treatments. The surface treatment systems may comprise the same or different constituent elements. The constituent elements may be arranged identically or interchanged, depending on the treatments to be applied in the systems.

[0144] The manufacturing process of an object can thus include an additional step of combining the n target materials ℳ after their surface treatment by the n systems.

[0145] The combination of the n target materials ℳ can be, for example, a weaving of a set of fibers or threads, tubes or capillaries. The unit of combination is then a weaving unit.

[0146] Such a complete system is perfectly suited to multi-fiber weaving or the manufacture of materials with splicing. In particular, this complete system has the advantage of not having shading problems encountered in the surface treatment of sets of pieces, fibers or yarns already combined or braided before treatment.

[0147] In embodiments, a surface treatment system 10 may comprise k target materials ℳ capable of traveling q different paths T within the system 10. The number k of target materials ℳ may be less than, greater than, or equal to the number q of different paths T within the system 10. In this case, the system 10 may further comprise a unit for combining the k target materials ℳ at the output of the surface treatment system, as described above. These embodiments, with k target materials ℳ capable of traveling q different paths T, may be associated with the embodiments relating to the complete object manufacturing system comprising several material surface treatment systems 10 for manufacturing woven or combined objects.

[0148] The invention is not limited to the embodiments described above as a non-limiting example. It encompasses all variant embodiments that may be envisaged by those skilled in the art. In particular, those skilled in the art will understand that the invention is not limited to the transfer devices 100 and the plasma generator devices 200 described as a non-limiting example.

Claims

Claims 1. A material surface treatment system (10), comprising a target material (ℳ), at least one transfer device (100), at least one plasma generator device (200), characterized in that said transfer device (100) comprises a fluid ℱ1 intended to be transferred to said plasma generator device (200), said plasma generator device (200) comprising a fluid ℱ2 and being configured to generate a column (202) of cold plasma, said target material (ℳ) being capable of traveling a path (T) at ambient pressure between a starting point (A) and an ending point (B), said path passing through at least said plasma generator device (200) and said plasma column (202), said path (T) being defined in a given frame of reference according to a unit displacement vector ^^, said fluid ℱ1 being transferred from said transfer device (100) to said plasma generator device (200),and in that said plasma generating device (200) comprises a device for producing a plasma jet obtained from said fluid ℱ2, said plasma column (202) being generated from said fluid ℱ1 and said plasma jet, and the plasma generating device (200) further comprising a capillary (208) for generating said plasma column (202) arranged so that said plasma column has an oblong geometric shape defined by a length ℒ, a width ℓ and an aspect ratio, said length ℒ being defined along a longitudinal axis collinear with the, displacement vector and said width ℓ being defined along a transverse axis perpendicular to the displacement vector t⃗.

2. A material surface treatment system according to claim 1, wherein the target material (ℳ) further passes through at least a portion of the transfer device (100).

3. A material surface treatment system according to any one of the preceding claims, wherein said capillary (208) comprises an inlet orifice (208-01) configured to receive the target material (ℳ) at the inlet of the capillary and an outlet orifice (208-02) configured to deliver the target material (ℳ) at the outlet of the capillary.

4. A material surface treatment system according to claim 3, wherein the plasma generator device (200) is a "T-shaped" device, further comprising a fluid control and supply module (204) and a fluid transport guide (206), said control and supply module (204) being configured to apply a pulsed discharge into the fluid ℱ2, at a discharge frequency ƒ2, wherein said guide (206) and said capillary (208) each have a shape and dimensions selected according to the target material (ℳ) and the surface treatment to be applied. 5.Material surface treatment system, according to any one of the preceding claims, wherein the transfer device (100) is a "T" device comprising a capillary (108) and is configured to generate a plasma column (102), said capillary (108) comprising at least one outlet orifice (108-02), said transfer device (100) and said plasma generator device (200) being separated from each other by a distance ℰ. 2 representing the distance between the inlet port (208-01) of the plasma generating device (200) and the outlet port (108-02) of the transfer device (100), and in which said plasma column (202) is generated as a function of said distance ℰ 1−26. A material surface treatment system according to claim 4 or 5, wherein the capillary (208) of the plasma generator device (200) comprises at least one portion (208-03) made of a conductive material and at least one portion (208-04) made of a dielectric material.

7. A material surface treatment system according to claim 4, wherein the target material (ℳ) has a width ϕ and the capillary (208) has a width φ, the transfer device (100) being an enclosure connected to the plasma generator device (200) by a connection (C 1−2 ) at the inlet port (208-01) of the plasma generator device (200), said connection (C 1−2 ) having a given shape and an opening of diameter δ such that ϕ < δ ≤ d, and being adapted for the transfer of fluid ℱ1 in the capillary (208), and in which said plasma column (202) is generated as a function of the connection (C 1−2 ).

8. A material surface treatment system according to any one of the preceding claims, wherein the target material (ℳ) is a fiber, wire, or capillary, wound on one side at the starting point ( ), in a starting reel, and on the other side at the ending point ( ), in an ending reel, each reel being capable of being unwound and wound so that the target material (ℳ) travels along the path ( ) at a given speed ( ) defined according to said surface treatment to be applied.

9. A method for manufacturing an object from at least one material surface treatment system (10), said treatment system comprising at least one target material (ℳ), at least one transfer device (100), and at least one plasma generator device (200), said target material (ℳ) traveling along a path ( ) between a starting point (A) and an ending point (B).said path ( ^^) being defined in a given frame of reference according to a unit displacement vector ^^, said transfer device (100) comprising a fluid ℱ1, said plasma generator device (200) comprising a fluid ℱ2, the process comprising the steps of: - transferring (902) the fluid ℱ1 from the transfer device (100) to the plasma generator device (200), - generating (904) a cold plasma column at ambient pressure by means of said plasma generator device (200) from said fluid ℱ1 and said fluid ℱ2, said plasma column (202) having an oblong geometric shape defined by a length ℒ, a width ℓ and an aspect ratio denoted, said length ℒ being defined along a longitudinal axis collinear with the displacement vector and said width ℓ being defined along a transverse axis perpendicular to the displacement vector, and - passing (906) said target material (ℳ), along path (T), through said plasma generating device (200), at least when said plasma column (202) is generated.

10. Method for manufacturing an object, according to claim 9, wherein step (906) further comprises a step of passing the target material (ℳ) through at least a portion of the transfer device (100).

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