Method and device for imaging a beam on an object, and method for introducing an opening in a workpiece by means of this method

Abstract

The invention relates to a method for imaging at least one beam (1) on an object (2), wherein the beam (1) is deflected over its beam path (3) through an optical arrangement (4) by means of at least two optical scanners (6) in a manner changing the beam path (3) of the beam (1) at least twice, and the beam (1), after having been deflected, is additionally imaged on the object (2) by means of an imaging optics (7) and, as a result of the imaging by means of the imaging optics (7), a focus region (8) of the beam (1) is placed on and / or in the object (2). The scanner (6) is used here to generate at least one pivoting movement of a beam portion (9) of the beam (1), in which the pivot point (10) of the beam portion (9) lies in the beam path (3) in front of or in the imaging optics (7) and the pivoting movement and / or at least one rotational movement (15) about the pivot point (10) causes a movement of the focus region (8) in at least one spatial direction (X) perpendicular to the optical axis of the imaging optics (7). The invention further relates to a method for introducing at least one opening in the object (2) formed as a workpiece (11) from a transparent material, by means of the above-mentioned method, and to a device for imaging the beam (1) on the object (2).

Description

[0001] Method and device for imaging a beam onto an object and method for making an opening in a workpiece by means of this method

[0002] The invention relates to a method and a device for imaging at least one beam onto an object, wherein the beam is deflected at least twice along its beam path by an optical arrangement using at least two optical scanners, changing the beam path of the beam, and the beam is further imaged onto the object by means of imaging optics after its deflection, and a focus area of ​​the beam is placed on and / or into the object by means of the imaging optics.

[0003] Furthermore, the invention relates to a method for introducing at least one opening into the object formed as a workpiece made of a transparent material by means of the above-mentioned method.

[0004] Due to its optical, electrical, chemical, and mechanical properties, glass is highly suitable for replacing silicon, for example, not only as a carrier but also as a directly structured bulk material at comparatively low cost, thus opening up a wide range of possible applications. These range, for example, from micro- and nanoelectronics to microelectromechanical systems (MEMS) and applications in the field of microfluidics to use in system packaging. A key prerequisite for this, however, is the availability of a glass processing method that enables the creation of precise structures of very small dimensions in the glass and thus micromachining of the glass with a preferably high degree of freedom of form of the structures combined with short processing times.In principle, a wide variety of glass processing methods are already known from the state of the art, including abrasive cutting, etching, or laser ablation processes. However, these processes sometimes have the disadvantage of long processing times and limited design freedom. These processes also sometimes introduce unwanted defects into the glass, for example, in the form of chipping, microcracks, or thermally induced stresses.

[0005] Another state-of-the-art process that does not suffer from these disadvantages involves micromachining glass using laser-induced deep etching. This process has become known as LIDE (Laser Induced Deep Etching). The LIDE process enables the creation of extremely precise structures with extremely short processing times, thus paving the way for the increased use of glass as a material in the applications mentioned above.

[0006] The LIDE process contrasts with a process known as selective laser-induced etching (ISLE), also known as in-volume selective laser-induced etching (ISLE), which is suitable for creating structures from and in transparent materials. For this purpose, laser radiation is focused almost point-like inside a transparent material such as glass, thereby structurally and / or chemically altering the material in a small volume of just a few cubic micrometers. The altered volumes can then be etched at an etching rate several orders of magnitude higher than that of unaltered material. Due to the small volumes altered by the point-like focusing of the laser beam, an extremely high number of pulse sequences is necessary for structuring. However, this in turn leads to long processing times.

[0007] In contrast, in laser-induced deep etching, known for example from WO 2014 / 161 534 A2 and WO 2016 / 041 544 A1, a transparent material, in particular glass, is modified by means of a laser pulse or a pulse sequence over an elongated region along the beam axis, so that the modification is again etched anisotropically in a subsequent wet-chemical etching bath. The modification is often carried out across the entire thickness of the transparent material, for example across the entire thickness of a glass plate. WO 2021 / 239 302 A1 also discloses a similar method for creating a recess, for example a blind hole, in a transparent material by means of laser-induced deep etching, wherein the modification of the material also takes place across the entire elongated region of the recess to be formed.The modification is achieved by the fact that the focus area of ​​the laser beam, as opposed to a point-like configuration, has a spatial extension in the beam direction and thus a beam shape. This spatial extension, or extension of the focus area of ​​the laser beam in the beam direction, allows a sufficiently high intensity to be coupled into the transparent material to modify a region along its length.

[0008] The aforementioned embodiments of laser-induced deep etching, in particular WO 2021 / 239 302 A1, also describe the modification of several regions aligned parallel to one another, partially overlapping, so that, for example, larger, flat structures can also be formed in a transparent material. For this purpose, a laser head, which emits the laser beam causing the modification, is usually moved along at least one linear axis and, during the process, at least one laser pulse is emitted at the regions to be modified. Despite the short processing times already achievable through laser-induced deep etching, this embodiment disadvantageously limits the achievable shorter processing times, since the accelerations and speeds of linear axes are comparatively limited, particularly due to high masses.

[0009] In this context, however, it is already known from the prior art to deflect a laser beam by means of an optical scanner system, for example by means of at least one galvanometer scanner, in order to increase the area that can be covered by a laser beam in a short period of time.

[0010] However, the use of scanner systems for deflecting laser beams, which have a beam shaping as mentioned above, is problematic, especially in combination with standard optics commonly used for imaging the laser beam onto the material, since this causes a disturbance in the beam shaping of the laser beam, so that the extended focus range cannot be guaranteed.

[0011] However, solutions to this problem have already been proposed in the prior art. For example, US 2014 / 0 008 549 A1 discloses a method and a device for creating a volumetric image of a sample with an extended depth of field using laser scan imaging. For this purpose, a laser beam with an extended focus area in the region of the image to be captured is used, which is deflected across the surface, i.e. in two spatial directions, by two scanner mirrors. To provide the extended focus area on the sample, a Bessel-like, non-diffracting beam is generated from the laser beam initially emitted by a laser source using an axicon. Before each deflection by one of the two scanner mirrors, this beam is transformed via a converging lens into a ring beam with the focus on the scanner mirror in order to avoid distortions of the laser beam during deflection.After each deflection, the beam is re-transformed into a non-diffracting beam via an achromatic lens. This beam is then refocused into a ring beam by a converging lens to provide the beam with an extended focal range for imaging the sample. The focus is placed on the rear focal plane of the objective lens that images the beam onto the sample. The imaging objective lens repeatedly transforms the beam into a non-diffracting, Bessel-like beam, which has an extended focal range on the sample. However, the complex optical design chosen for this purpose disadvantageously creates superimposed imaging errors, which are imprinted on the beam by the multitude of optical elements. Furthermore, the design chosen for a microscopy system is largely unsuitable for applications in the field of laser processing due to the number of optical elements required in some cases.

[0012] WO 2010 / 069 987 A1 discloses a comparable method and device for dynamically shifting a light beam relative to an optical system that focuses the light beam in the context of confocal microscopy. In order to scan an object with the focused light beam in a two-dimensional scanning area, the light beam is deflected in two different directions relative to the optical axis of the optical system, with each deflection in one direction being achieved via two independently moving deflection mirrors. This allows the position of the pivot point of the light beam deflected by the deflection mirrors forming a mirror deflection system to be adjusted in the longitudinal direction of the optical axis. The pivot point of the light beam is fixed at the location of an image of a pupil of an optical system that focuses the light beam and is connected to the mirror deflection system.For this purpose, the deflection mirrors are arranged around this imaging location. The pivot point of a beam section of the light beam emerging from the mirror deflection system lies accordingly within the mirror deflection system. DE 10 2020 131 405 A1 also discloses a device for material processing, in particular for generating perforations, lines, free-form contours, or the like, using a laser beam source. In addition to the laser beam source, the device comprises a mirror deflection system that deflects the laser beam, and a focusing lens. The mirror deflection system provides deflection of the laser beam relative to the optical axis in two different spatial directions, with each deflection in one direction being realized via a deflection mirror.For this purpose, the two deflection mirrors are designed to be independently movable, and their rotation axes are aligned at right angles to each other. Thus, the pivot point of the laser beam section emerging from the mirror deflection system lies on the deflection mirror located at the rear of the beam path. Furthermore, a diffractive optical element (DOE) is arranged in the laser beam path between the mirror deflection system and the focusing lens to split the beam path into two or more beam paths. This creates a pattern of processing points on the material to be processed and / or positions the processing point(s) on the material.By positioning the "DOE" in the beam path of the laser after the mirror deflection system and before the focusing lens, the resulting short beam length allows the widening of the beam spacing of the individual beam bundles to be kept together to such an extent that even if the primary laser beam is deflected within the area that can be covered by the mirror deflection system, all individual beam bundles of the laser beam multiplied by the "DOE" can still be directed onto the focusing lens and thus focused accordingly.

[0013] Similarly, EP 3 106 943 B1 describes a device for material processing using a laser beam, wherein the device has a mirror deflection system for deflecting the laser beam. The mirror deflection system is designed such that the mirror deflection system provides deflection of the laser beam relative to the optical axis in two different spatial directions. Each deflection in one direction is achieved via a deflection mirror, wherein the two deflection mirrors are designed to be movable independently of one another for this purpose and their rotation axes are aligned at right angles to one another. Thus, the pivot point of the beam section of the laser beam emerging from the mirror deflection system is again located on the deflection mirror located rearward in the beam path.In order to enable integration of the mirror deflection system into a path control of a machine tool due to the non-gimbal arrangement of the deflection mirrors, the device provides a control module via which target data of two gimbal, virtual swivel axes transferred from the path control are converted into a first and second, real target axis swivel angle of the deflection mirrors.

[0014] WO 2014 / 161534 A2 also discloses a method and a device for creating a plurality of recesses in a substrate, which can be used in particular as an interposer. The method involves directing laser radiation onto the surface of the substrate, with the exposure time to the laser radiation being deliberately kept very short. This merely results in a modification of the substrate in a concentric pattern around the axis of the laser beam. However, the effect of the laser radiation does not create recesses in the substrate material itself. To achieve this, the laser radiation is first directed through a transmissive medium with an intensity-dependent refractive index that is higher than that of air. The laser radiation then strikes the substrate. The intensity of the laser beam varies during the individual pulse. It increases to a maximum and then decreases again.This change in intensity results in a change in the refractive index of the medium. Due to this change in the refractive index, the focal point of the laser radiation moves along the beam axis between the outer surfaces of the substrate. This allows the desired modification along the beam axis to be achieved without requiring realignment of the laser processing head along the Z-axis. The substrate modifications created in this way can then be etched in hydrofluoric acid at a significantly higher etching rate than unmodified areas.

[0015] Against this background, the object of the invention is to provide a method and a device of the type mentioned at the outset, which have an optical structure adapted for use in a laser processing application and, moreover, simplified.

[0016] This object is achieved according to the invention with a method according to the features of claims 1 and 2 and with a device according to the features of claim 12.

[0017] The further development of the invention can be found in the subclaims.

[0018] According to the invention, a method is provided for imaging at least one beam of electromagnetic radiation, in particular a laser beam of laser radiation, onto an object. Such a beam, in particular a pulsed beam, would preferably first be emitted by a beam source, in particular a laser source, of the optical arrangement.

[0019] In this case, the emitted beam is deflected along its beam path by an optical arrangement using an optical scanner system of the optical arrangement, changing the beam path or a propagation direction of the beam. For this purpose, the scanner system has at least two optical scanners, via which the beam is deflected at least twice at a predetermined and / or predeterminable, variable angle.

[0020] The beam, or rather the radiation, is not subject to any further refraction before and / or between each deflection. Thus, at least between each deflection, the beam does not pass through any further optical element that specifically refracts the beam, such as a converging lens, which significantly simplifies the optical design and prevents unwanted aberrations. However, any disturbance to any existing beam shaping caused by this during beam deflection requires correction.

[0021] Thus, according to the invention, after the beam has been deflected, it is imaged onto the object by means of imaging optics, wherein the imaging by means of the imaging optics places a focus region of the beam on and / or in the object. The invention further provides that the scanner system generates at least one pivoting movement of a beam section emerging from the scanner system, in which the pivot point or rotation point of the beam section lies in the beam path in front of or in the imaging optics. The pivoting movement and / or at least one rotational movement about the pivot point causes the focus region to move in at least one spatial direction perpendicular to the optical axis of the imaging optics. By placing the pivot point of the beam section in front of and / or in the imaging optics, unwanted imaging errors introduced into the beam by the deflection are advantageously avoided.This is especially true without the use of special imaging optics to prevent such undesirable aberrations. Instead, standard optics commonly used to project the beam onto the object can be used as imaging optics.

[0022] Furthermore, the invention provides a method for introducing at least one opening, in particular a recess and / or an opening, into the object designed as a workpiece, preferably as a substrate, made of a transparent material, in particular glass. By means of the above-described inventive method for imaging the beam, a modification of the material of the workpiece is produced at least in the focus region of the beam, but in particular exclusively in the focus region of the beam. This is done without any removal of the material occurring as a result of the action of the radiation of the beam, so that the opening is subsequently produced in the workpiece by the action of an etching medium through anisotropic removal of the material in the respective region of the modification.The material removal therefore occurs exclusively as a result of the etching effect of the etching medium and not as a direct result of the action of the beam or the radiation from the beam. Although the etching rate of the modification or modifications is several orders of magnitude higher than that of an unmodified material, the workpiece can additionally be provided with a mask, in particular an etching mask, preferably made of a patterned photoresist, in which the areas to be etched are exposed.

[0023] Each modification would preferably be generated by at least one pulse of the beam, whereby in order to generate several modifications, e.g. located at different positions on the workpiece, the beam or the focus area of ​​the beam is moved across the workpiece between the pulses of the beam by deflection. In this way, non-contiguous or contiguous, even overlapping modifications can be generated in the workpiece, which are removed during the subsequent action of the etching medium and which form at least one opening in the workpiece. By generating several contiguous modifications, structures with a high degree of freedom of form can be formed in the workpiece, correspondingly composed of a large number of individual openings.

[0024] By moving the focus area by deflecting it via the optical scanners to create a variety of modifications, a significant reduction in processing times can be achieved while maintaining a high degree of freedom of form, especially in comparison with a standard LIDE process.

[0025] The area in each spatial direction that can be covered by the deflection of the beam and thus the movement of the focus area, in which the modifications could consequently be generated, especially without superimposing any further movement, can be up to plus or minus ten millimeters around a central axis or center point. This is achieved with an extremely small positioning error of the focus area and thus of the modifications of less than ten micrometers.

[0026] In a particularly advantageous development of the invention, a respective rotational movement of the beam section about – exclusively – one axis of rotation of the pivot point and thus a respective linear movement of the focus area in a – single – spatial direction is carried out via two interacting rotational movements of two optical scanners about their two parallel axes of rotation, which deflect the beam in the beam path. The two scanners form a scanner pair. By using two scanners with parallel axes of rotation to move the focus area of ​​the beam in a single spatial direction, undesirable imaging errors of the beam, and in particular of the focus area, which would occur when using only one scanner, can be advantageously minimized or even avoided in a simple manner.

[0027] An embodiment of the invention is also extremely advantageous if, for the linear movement of the focus area in two spatial directions, two rotational movements of the beam section around, in particular perpendicular to, rotation axes of the pivot point are superimposed. In this way, the focus area of ​​the beam, or the beam impinging on the object or workpiece, could be moved not only along a line but also two-dimensionally, across a surface. To carry out the two rotational movements of the beam section around the pivot point, the beam would be deflected over two and thus a total of four rotational axes for each rotational movement into two groups of two rotational axes, with the rotational axes of the two groups being aligned perpendicular to one another. The rotational axes would be provided accordingly by the optical scanners, with one group of two rotational axes consequently being formed by a pair of scanners.

[0028] Furthermore, a promising embodiment of the invention provides that the two interacting rotational movements of a scanner pair, which cause a rotational movement of the beam section around – exclusively – a rotational axis of the pivot point and deflect the beam in the beam path, are designed asynchronously. This asynchronous movement advantageously allows the pivoting movement of the beam around at least one scanner of the scanner pair, in particular the second or rear scanner of the scanner pair in the beam path. At least one of the absolute angle, angular velocity, and / or angular acceleration of the scanners, in particular of a deflection element of the scanners, should differ from one another.

[0029] It should also be noted that it is fundamentally possible for the beam formed in at least one of the methods to exhibit a Gaussian focus in general, but particularly in the focus area of ​​the beam on and / or in the object or workpiece. This would thus correspond to a design without beam shaping of the beam and thus an extended focus area. Potentially occurring imaging errors could nevertheless be advantageously avoided.

[0030] However, in a preferred development of the invention, beam shaping is imparted to the beam as it passes through the optical arrangement by means of beam-shaping optics, whereby a focal region extended in the direction of the beam path is imaged on and / or in the object, said focal region extending over at least part of a dimension of the object formed in the direction of the beam path. As already mentioned at the beginning, the extended focal region could, for example, significantly reduce the processing times of the object, particularly in the form of a workpiece, within the scope of a LIDE process compared to a point-like focus, thus increasing throughput.

[0031] Beam shaping can be achieved by beam-shaping optics, which are embodied, for example, as an axicon, a diffractive optical element (DOE), or a spatial light modulator (SLM). This would allow the beam to be configured, in particular, as a Bessel-like beam. In a widely preferred embodiment, however, beam shaping would occur by imposing a spherical aberration, which also results in an extended, particularly cigar-shaped, focal area of ​​the beam. For such beam shaping, the beam-shaping element should preferably be embodied as a particularly plane-parallel quartz plate.

[0032] In a further advantageous embodiment of the invention, the beam shaping is also applied by means of the beam-shaping optics before the beam enters the optical scanner system of the arrangement. This avoids the occurrence of imaging errors caused by shaping a deflected beam, which thus impinges on the beam-shaping element, particularly at an angle.

[0033] A further extremely practical design of the invention is that a respective focus area of ​​the beam, whose beam path changes due to the optical arrangement due to the deflection, is imaged by the imaging optics onto a single, in particular common, focal plane on which the respective focus area lies or from which the respective focus area extends into the object. By thus always lying on the focal plane or extending from the focal plane, an intensity of the beam acting on the object and in particular the material of the workpiece can be advantageously ensured in the focal area. This also results in a uniform or similar generation of several modifications in the material of the workpiece. For this purpose, the imaging optics should preferably be designed as at least one f-theta lens.

[0034] In a no less advantageous embodiment, the invention further provides for the imaging of a respective focal area by the imaging optics to be carried out telecentrically. In this way, the focal area of ​​the beam would always be aligned parallel to the optical axis of the imaging optics, allowing modifications to be created in the workpiece that are always aligned in the same direction and thus do not differ in their angular orientation. This is possible with a corresponding alignment of the object or workpiece, in particular perpendicular to the surface of the object or workpiece. For this purpose, the imaging optics should preferably be designed as at least one telecentric f-theta lens.

[0035] Likewise, a particularly promising development of the invention is described in which the linear movement of the focus area in at least one spatial direction is superimposed with at least one additional movement, in particular a linear movement, of a travel axis. In this case, the travel axis is part of a device, with at least part of the optical arrangement associated with the device being arranged on the travel axis. The travel axis is designed, in particular, as a linear axis.By combining the movement of the focus area by deflecting the beam, particularly via one or two scanner pairs, with the additional movement of at least one travel axis, it is also possible to machine workpieces whose dimensions exceed the maximum possible deflection of the beams or the resulting possible movement section of the focus area. This allows the workpiece to be machined preferably over its entire extent, with very high processing speeds and thus short processing times. Furthermore, modifications can be created in the workpiece that follow a virtually arbitrary trajectory, e.g., in the form of a spline, either individually or contiguously. The respective possible directions of movement of the focus area and the travel axis do not have to be parallel and / or perpendicular to one another.However, it is conceivable to align it at virtually any angle, for example an angle of 45 degrees.

[0036] Particularly in connection with the above development, but also in general, an embodiment of the invention is considered advantageous in which the additional movement of the travel axis is at least partially corrected and / or at least partially compensated by superimposing the linear movement of the focus region in at least one spatial direction with the at least one additional linear movement of the travel axis. With parallel movement directions of the focus region and the travel axis, the movement of the focus region could be superimposed in this way, particularly in redundancy with the movement of the travel axis, thus increasing, for example, the resolution of the positioning of modifications compared to the resolution provided by the travel axis itself in the workpiece. Furthermore, the movement of the travel axis can also be fully compensated by the movement of the focus region.This is the case, for example, when multiple modifications are to be created in the workpiece at exactly the same position in the direction of movement of the travel axis, or at the same position but with an offset, e.g., perpendicular to the direction of movement of the travel axis. This ensures a very high degree of freedom of form for the structures created in the workpiece with outstanding precision.

[0037] Furthermore, the invention also provides a device with an optical arrangement, in particular for carrying out at least one of the methods explained above. The optical arrangement of the device comprises a beam source, in particular a laser source, for emitting a beam of electromagnetic radiation, in particular a laser beam, and an optical scanner system. The scanner system, in turn, is designed with at least two optical scanners, each with at least one rotatable deflection element for deflecting the beam. In this context, it should be noted that no further, in particular optically refractive, element is arranged in the beam path between the scanners.In addition, the optical arrangement has at least one imaging optics by means of which the beam can be imaged onto an object and, by imaging using the imaging optics, a focus area of ​​the beam can be placed on and / or in the object. According to the invention, two scanners each form a scanner pair, wherein the rotation axes of the scanners belonging to a respective scanner pair are aligned parallel to one another. The optical arrangement has at least one scanner pair or at least two, preferably exclusively two, scanner pairs. It should be noted, however, that the rotation axes or the groups of rotation axes of the scanners of the different scanner pairs are aligned perpendicular to one another. By means of the device according to the invention, at least some of the methods according to the invention can advantageously be carried out, wherein a significantly simplified optical design of the optical arrangement is provided.This allows unwanted imaging errors to be avoided and, at the same time, any disturbances caused by beam deflection in any existing beam shaping to be corrected by placing a pivot point or rotation point of a beam section emerging from the scanner system in the beam path in front of or into the imaging optics via the scanner system. In addition to the optical arrangement, the device would also have at least one travel axis on which at least part of the optical arrangement is arranged.

[0038] In a particularly advantageous development of the invention, the optical arrangement additionally comprises beam-shaping optics, by means of which beam shaping can be applied to the beam. As already explained above, the beam-shaping optics are designed, for example, as an axicon, a diffractive optical element (DOE), a spatial light modulator (SLM), or a particularly plane-parallel quartz plate, and / or are preferably arranged downstream of the beam source and upstream of the optical scanner system.

[0039] The invention is susceptible of various embodiments. To further clarify its basic principle, some of these are illustrated in the drawings and described below. These drawings show in

[0040] Fig. 1 shows a further development of a device according to the invention;

[0041] Fig. 2a to 3b Further developments of the method according to the invention.

[0042] Figure 1 shows a further development of an optical arrangement 4, wherein the optical arrangement 4 comprises the beam source 19 for emitting the beam 1, the beam shaping optics 16, the scanner system 5 comprising the two optical scanners 6, each with a rotatable deflection element, here a mirror, for deflecting the beam 1, and the imaging optics 7.

[0043] After the beam 1 emerges from the beam source 19, a beam shaping is imprinted on the beam 1 by means of the beam shaping optics 16 following the beam source 19 in the beam path 3.

[0044] Beam 1 is then deflected twice by the optical scanner system 5, which follows the beam-shaping optics 16 in the beam path 3, at a predetermined, variable angle, each time changing the beam path 3 of beam 1, in order to be imaged at different positions on the workpiece 11 and thereby create a modification 20 of the material of the workpiece 11 in the focus area 8 of beam 1. In the embodiment of Figure 1, the focus area 8 of beam 1 is placed within the workpiece 11. The deflection of beam 1 is effected via the two scanners 6 of the scanner system 5.In order to avoid any disruption of the beam shaping imposed on beam 1 via the beam shaping optics 16, a pivoting movement of the beam section 9 of beam 1 emerging from the scanner system 5 is generated by means of the scanner system 5, and in particular by means of the scanner 6 following the first scanner 6 in the beam path 3 and arranged in front of the imaging optics 7, in which the rotation or pivot point 10 of this beam section 9 lies in the beam path 3 in the imaging optics 7. The pivoting movement thus results in the rotational movement 15 of beam 1 about the pivot point 10, which in this further development in turn causes a movement of the focus area 8 in the spatial direction X perpendicular to the optical axis of the imaging optics 7.

[0045] In this context, it should be briefly noted that Figure 1 shows beam 1 in a very simplified form in its beam profile, with only one beam path 3 of beam 1 being shown.

[0046] The special feature of the deflection of beam 1 via scanner system 5, which was only briefly outlined above, is that the rotational movement 15 of beam section 9 about the rotational axis 12 of pivot point 10, and thus also the linear movement of focus area 8 in spatial direction X, is carried out via two interacting rotational movements 13 of scanners 6 about their two mutually parallel rotational axes 14, which deflect beam 1 in beam path 3. The two scanners 6 form a scanner pair, with the rotational movements 13 of scanners 6 of the scanner pair being asynchronous.

[0047] By imposing the beam shaping and imaging the beam 1 having the beam shaping via the imaging optics 7, a focus region 8 extended in the direction of the beam path 3 is imaged on or in the workpiece 11, which in this further development extends over the entire dimension formed in the direction of the beam path 3, here the thickness of the workpiece 11. The extended focus region 8 thus effects a modification 20 of the material of the workpiece 11 over the entire thickness of the workpiece 11, so that an opening, here a perforation of the workpiece 11, is created by an etching step following the modification 20.

[0048] In order to ensure a substantially constant intensity of the beam 1 acting on the material of the workpiece 11 in the focus area 8 in the case of several modifications 20 to be produced at different positions in the workpiece 11, the respective focus area 8 producing a modification 20 of the beam 1 deflected for positioning and thus changing in its beam path 3 is

[0049] 7 is imaged telecentrically onto a single focal plane 17, from which the respective focal area 8 extends into the workpiece 11.

[0050] Further developments of the method according to the invention are also evident from Figures 2a and 2b, as well as 3a and 3b. These figures show that the movement of the focus area 8 in the spatial directions X, Y is superimposed with an additional movement of the travel axis 18 in the direction of movement Y', which coincides with the spatial direction Y. This allows modifications 20 to be created in the focus areas 8 in the workpiece 11 shown in more detail in Figure 1, which modifications are designed individually as in Figures 2a and 3a or as in Figures 2b and 3b.

[0051] It is possible for the focus areas 8 and thus the modifications 20, as shown in Figures 2a and 2b, to follow a virtually arbitrary trajectory, here in the form of a spline, so that depending on the pulse sequence of the beam 1 shown in Figure 1, as in Figure 2a, individual openings or, as in Figure 2b, sections through an overlap of several openings are generated in the workpiece 11. In the further development of Figures 2a and 2b, the movement of the focus area 8 in only the spatial direction X is superimposed with the movement of the travel axis 18 in its direction of movement Y', wherein the spatial direction X and the direction of movement Y' are perpendicular to one another.

[0052] By superimposing the movement of the focus area 8 in the spatial directions X, Y with the additional movement of the travel axis 18 in its direction of movement Y', the additional movement of the travel axis 18 can also be at least partially corrected and / or at least partially compensated.

[0053] Thus, as shown in Figure 3a, the movement of the focus area 8 can be superimposed, in particular in redundancy, on the movement of the travel axis 18 and thus, for example, a resolution of the positioning of the modifications 20 can be increased compared to the resolution provided by the travel axis 18 itself in the workpiece 11.

[0054] In addition, the movement of the travel axis 18 can also be completely compensated by the movement of the focus area 8. This is particularly the case when, as in Figure 3b, several modifications 20 are created in the same position in the movement direction Y' of the travel axis 18, but with an offset transverse to the movement direction Y' in the spatial direction X in the workpiece 11. REFERENCE SYMBOL LIST

[0055] Beam 16 beam shaping optics

[0056] Object 17 focal plane

[0057] Beam path 18 Travel axis optical arrangement 19 Beam source scanner system 20 Modification

[0058] Scanner X, Y spatial direction

[0059] Imaging optics Y' Direction of movement Focus area Beam section Pivot point

[0060] Workpiece rotation axis rotational movement rotation axis

[0061] rotational movement

Claims

PATENT CLAIMS E 1. A method for imaging at least one beam (1) of electromagnetic radiation onto an object (2), wherein the beam (1) is deflected via its beam path (3) by an optical arrangement (4) by means of an optical scanner system (5) of the optical arrangement (4), comprising at least two optical scanners (6), at least twice at a predetermined and / or predeterminable, variable angle, each time changing the beam path (3) of the beam (1), and the beam (1) is not subject to refraction between each deflection, the beam (1) is also imaged onto the object (2) by means of imaging optics (7) after its deflection, and a focus area (8) of the beam (1) is placed on and / or into the object (2) by means of the imaging optics (7), characterized in that at least one pivoting movement of a beam section (9) of the beam (1) emerging from the scanner system (5) is generated by means of the scanner system (5),in which the pivot point (10) of the beam section (9) in the beam path (3) lies in front of or in the imaging optics (7) and the pivoting movement and / or at least one rotational movement (15) about the pivot point (10) causes a movement of the focus area (8) in at least one spatial direction (X, Y) perpendicular to the optical axis of the imaging optics (7).

2. Method for introducing at least one opening into the object (2) formed as a workpiece (11) made of a transparent material, wherein by means of the method according to claim 1 a modification (20) of the material of the workpiece (11) is produced at least in the focus area (8) of the beam (1), without any removal of the material occurring as a result of the action of the beam (1), so that the opening is subsequently produced by the action of an etching medium by an anisotropic removal of the material in the respective area of ​​the modification (20) in the workpiece (11).

3. Method according to claim 1 or 2, characterized in that a respective rotational movement (15) of the beam section (9) about a rotation axis (12) of the pivot point (10) and thus a respective linear movement of the focus area (8) in a spatial direction (X, Y) is carried out via two interacting rotational movements (13) of two optical scanners (6) forming a scanner pair about their two mutually parallel rotational axes (14) which deflect the beam (1) in the beam path (3).

4. Method according to at least one of the preceding claims, characterized in that for the linear movement of the focus area (8) in two spatial directions (X, Y), two rotational movements (15) of the beam section (9) about two axes of rotation (12) of the pivot point (10) are superimposed.

5. Method according to at least one of the preceding claims, characterized in that the rotational movements (13) of the scanners (6) of a scanner pair are asynchronous.

6. Method according to at least one of the preceding claims, characterized in that the beam (1) is subjected to beam shaping via its beam path (3) by the optical arrangement (4) by means of beam shaping optics (16), so that a focus area (8) which is extended in the direction of the beam path (3) and extends over at least part of the dimension of the object (2) formed in the direction of the beam path (3) is imaged on and / or in the object (2).

7. Method according to at least one of the preceding claims, characterized in that the beam shaping is applied by means of the beam shaping optics (16) before the beam (1) enters the optical scanner system (5).

8. Method according to at least one of the preceding claims, characterized in that a respective focus area (8) of the beam (1) which changes in its beam path (3) through the optical arrangement (4) due to the deflection is imaged by the imaging optics (7) onto a focus plane (17) on which the respective focus area (8) lies or from which the respective focus area (8) extends.

9. Method according to at least one of the preceding claims, characterized in that the imaging of a respective focus area (8) by the imaging optics (7) is carried out telecentrically.

10. Method according to at least one of the preceding claims, characterized in that the movement of the focus area (8) in at least one spatial direction (X, Y) is superimposed with at least one additional movement of a travel axis (18) belonging to a device, on which at least part of the optical arrangement (4) belonging to the device is arranged.

11. Method according to at least one of the preceding claims, characterized in that by superimposing the movement of the focus area (8) in at least one spatial direction (X, Y) with the at least one additional movement of the travel axis (18), the additional movement of the travel axis (18) is at least partially corrected and / or at least partially compensated.

12. Device with an optical arrangement (4), in particular for carrying out a method according to at least one of the preceding claims, wherein the optical arrangement (4) comprises a beam source (19) for emitting a beam (1) of electromagnetic radiation, a scanner system (5) comprising at least two optical scanners (6), each with at least one rotatable deflection element for deflecting the beam (1), and at least one imaging optics (7) by which the beam (1) can be imaged onto an object (2) and, by imaging by means of the imaging optics (7), a focus area (8) of the beam (1) can be placed onto and / or into the object (2), wherein no further optical element is arranged in the beam path (3) between the scanners (6), characterized in that two scanners (6) each form a scanner pair,whose rotation axes (14) are aligned parallel to each other and the optical arrangement (4) has at least one scanner pair or at least two scanner pairs and the rotation axes (14) of the scanner pairs are aligned perpendicular to each other.

13. Device according to claim 12, characterized in that the optical arrangement (4) has a beam-shaping optic (16) by means of which a beam shape can be imposed on the beam (1).

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