Foldable cooling device, converter, foldable electronic apparatus and simulation program product

Abstract

The invention relates to a cooling device (30) which comprises a first and a second section (10, 20), which are both of plate-like design. At least one channel (12, 22) for a cooling fluid (25) is formed in each section (10, 20), wherein the first and second sections (10, 20) are connected via a bending structure (40) so as to be pivotable repeatedly relative to each other about a bending axis (15). According to the invention, the bending structure (40) is designed for exerting a restoring force in a bent state and has at least one channel (12) in the first section (10), which channel is hydraulically connected to a channel (22) in the second section (20). The invention also relates to a converter (50) and to a foldable electronic apparatus (60), which are both provided with such a cooling device (30). Furthermore, the invention relates to a simulation program product (70) designed to simulate an operating behaviour of such a cooling device (30).

Description

[0001] Description

[0002] Foldable cooling device, inverter, foldable electronic device and simulation program product

[0003] The invention relates to a foldable cooling device and to a converter equipped with such a cooling device. Furthermore, the invention relates to a foldable electronic device having such a cooling device and to a simulation program product designed to simulate the operating behavior of such a cooling device.

[0004] International application WO 2021 / 232134 A1 discloses a heat pipe for an electronic device, comprising a first and a second module, each having a foldable section. A polymer layer is arranged on the first and second modules. Protrusions extending in a straight line are formed in a foldable region.

[0005] The publication US 5,743,325 A1 discloses a movable radiator panel for a satellite, which is attached to a stationary radiator panel with a hinge. Channels for heat pipes are formed in both radiator panels and are hydraulically connected to one another. The channels of the heat pipes in the radiator panels are connected to one another via a pipe having a multiple loop shape. The pipe is made of a flexible metal.

[0006] Cooling devices are used in a wide variety of devices which are increasingly subject to losses in the form of heat. Accordingly, there is an increasing demand for the thermal performance of cooling devices. At the same time, the objective is to design devices that are compact, so that a consistently flat design is less able to meet this requirement. Furthermore, there is an increasing demand for foldable devices. Likewise, quick, simple and cost-effective production of cooling devices is sought. The object of the invention is to provide a cooling device which offers an improvement in at least one of the aspects outlined.

[0007] The object is achieved by a cooling device according to the invention which comprises a first and a second section, each of which is essentially plate-shaped. The first and second section are suitable for serving as a so-called hot side and cold side respectively during operation of the cooling device. In each of the first and second sections there is at least one channel which is suitable for a cooling fluid. The cooling fluid can be a liquid, a gas, a vapor or a mixture thereof. The first and second sections are connected to one another via a bending structure which can be bent about a bending axis. The first and second sections can be pivoted relative to one another by means of the bending structure. Furthermore, the bending structure is designed for repeated bending, for example for more than 10,000 bending cycles. According to the invention, the bending structure is designed to exert a restoring force in a bent state.The bending structure can be designed such that, during a bending cycle, at least predominantly elastic deformations occur in the bending structure. The bending structure is also designed to hydraulically connect at least one channel in the first section with at least one channel in the second section. For this purpose, a channel can be formed in the bending structure itself, which is arranged between the channels in the first and second sections.

[0008] The cooling device according to the invention is suitable for repeatedly achieving bending angles at which the first and second sections are substantially opposite one another. At the same time, cooling operation is ensured by the hydraulic connection between the first and second sections at any achievable bending angle. Furthermore, a wide range of cooling concepts can be implemented in the claimed cooling device. Likewise, the bending structure, and thus also the cooling device according to the invention, can be miniaturized.

[0009] In one embodiment of the claimed cooling device, the bending structure is formed integrally with the first and second sections. The bending structure can, for example, be manufactured using the same construction as the first and second sections. In particular, the bending structure, the first and second sections can be manufactured using a layered construction. Furthermore, the bending structure can be plate-shaped, i.e. flat. As a result, the channel in the bending structure is formed integrally with the channels in the first and second sections, so that the cooling device can be designed with a reduced number of sealing elements, for example rubber seals. This ensures reliable cooling operation.

[0010] In a further embodiment of the claimed cooling device, the bending structure is designed to be meander-shaped or have multiple Z-shaped sections to reduce plastic deformation during bending. The bending structure can in particular have a multiple loop shape, which offers increased repeatable flexibility. Such a bending structure can be produced, for example, by milling or punching plate-shaped semi-finished products. Likewise, meander-shaped or multiple Z-shaped bending structures can have a bionically optimized shape, whereby their repeatable flexibility can be further increased. This means that in particular the flexural rigidity of the bending structure can be specified with an increased degree of design freedom. Alternatively, the bending structure can be designed as a plurality of connected circumferential structures. Circumferential structures are understood to mean closed structures, for example rectangular frames.The connected circumferential structures can be arranged offset, allowing the flexibility of the bent structure to be adjusted. Circumferential structures exhibit greater flexural rigidity than similarly dimensioned structures with open shapes. With the same material usage as with open structures, increased flexural rigidity can be achieved with connected circumferential structures. This allows the bent structure, and thus the cooling device used, to be easily adapted to a wide range of applications as needed.

[0011] Furthermore, the bending structure of the cooling device can comprise longitudinal webs which extend essentially along the bending axis. The longitudinal web thus essentially follows an edge of the first and / or second essentially plate-shaped section of the cooling device. The bending axis represents an axis about which the cooling device can be curved, i.e. bent, as intended in the region of the bending structure. Alternatively, the bending structure can comprise Z-webs which, in a bent state, extend essentially skew to the bending axis. In an unbent state of the bending structure, the Z-webs are aligned essentially diagonally between edges of the first and second section of the cooling device. The Z-webs can be connected to one another directly, i.e. without transverse webs. At least one of the Z-webs can be connected to the first or second section of the cooling device.Z-webs offer increased flexibility of the bending structure with minimal use of material, and therefore reduced weight. This further increases the design freedom in the layout of the cooling device in question and thus further expands the potential range of applications. Likewise, several Z-webs can be formed parallel to one another and arranged in a nested manner. The Z-webs can be of essentially identical construction. This allows the first and second sections to be compactly connected to one another via several essentially identical channels. The hydraulic connection between the first and second sections of the cooling device can therefore be easily scalable in terms of cooling fluid exchange capacity. Furthermore, the cooling device can be designed as a planar heat pipe, as a planar pulsating heat pipe or as a thermosiphon.The first and / or second section, which are essentially plate-shaped, can accordingly be designed as hollow bodies for evaporation or condensation for the cooling fluid, which are connected to one another via channels. The claimed cooling device can therefore be implemented in different thermal designs, which are preferred for different temperature regimes. This also further broadens the spectrum of applications covered by the claimed cooling device. Furthermore, the cooling device can have a plurality of bending structures which are arranged between the first and second section. The bending structures can in this case be of essentially identical construction. The cooling capacity of the cooling device is therefore scalable. Complex cooling architectures can also be implemented. This also further broadens the possible range of applications of the claimed cooling device.

[0012] In a further embodiment of the claimed cooling device, the bending structure can have a plurality of transverse channels, by means of which, for example, longitudinal webs or Z-webs are hydraulically connected to one another. The transverse channels are formed in corresponding transverse sections within the bending structure, which can each connect, for example, two longitudinal webs or two Z-webs. The transverse channels are designed and positioned to impose a preferred direction on a fluid flow of the cooling fluid between the first and second section of the cooling device. The transverse channels, and correspondingly the transverse sections, can be angular or essentially arc-shaped. This makes it possible, for example, to achieve cooling devices in which, over one section of the bending structure, cooling fluid flows from the first to the second section and in another section from the second to the first section.Alternatively or additionally, the bending structure can be designed as a Tesla valve in sections. For this purpose, a longitudinal web or Z-web itself can be designed in the form of a Tesla valve. Alternatively or additionally, the channel in the longitudinal web or in the Z-web can be designed in the form of a Tesla valve. The Tesla valve also imposes a preferred direction on the fluid flow of the cooling fluid. Tesla valves have no moving parts and allow a preferred direction of the fluid flow to be imposed in a simple manner. At the same time, Tesla valves offer increased flexural rigidity due to their sectionally circumferential design. The claimed cooling device can therefore be used to implement a multitude of self-contained cooling fluid-based cooling concepts.

[0013] In addition, a first channel with a first width and a second channel with a second width can be formed in the first section, in the second section and / or in the bending structure. Width here is to be understood as a dimension of the cross-section of the corresponding channel which extends essentially parallel to an edge of the first or second section. The first width is less than the second width. By varying the width of the channels, their hydraulic cross-section can be predetermined. At the same time, with constant height and wall thickness, the flexural rigidity is only increased relatively slightly by an increased width. Consequently, the hydraulic cross-sections of the channels in the claimed cooling device can be adapted in a simple manner without changing the mechanical properties of the bending structure, in particular its flexural rigidity.Consequently, the hydraulic cross-section of the channels and the bending properties of the flexural structure are virtually decoupled. The claimed cooling device is thus easily adaptable. Furthermore, the hydraulic cross-sections of the channels can be used to specify a preferred flow direction and / or accelerate or decelerate the flow velocity of the cooling fluid in the corresponding channel.

[0014] In the claimed cooling device, the bent structure can have substantially the same thickness as the first and second sections. The thickness is to be understood as the dimension which corresponds to a plate thickness in the substantially plate-shaped sections of the cooling device. The first section, the second section and the bent structure can therefore be manufactured in an unbent state from a flat semi-finished product. The manufacture of the bent structure can therefore be integrated into the manufacture of the first and second sections, whereby an increased degree of production automation can be achieved. For example, the cooling device can be built up on a flat production bed during its manufacture and pressed with a flat punch. Alternatively or additionally, the claimed cooling device can be manufactured quickly by means of additive manufacturing due to its plate shape.The claimed cooling device can thus be manufactured cost-effectively and reliably. Furthermore, such a cooling device can be designed compactly, making it suitable for use in low-profile devices, such as foldable electronic devices such as smartphones, tablets, or notebooks.

[0015] In particular, the channel formed in the bending structure can be delimited by at least one cover layer made of a dielectric along a construction direction. The construction direction is the direction along which the thickness of the first or second section is to be measured. The cover layer can essentially close off the first section, the second section and / or the bending structure on one side and prevent cooling fluid from escaping. The cover layer can be applied as a flat semi-finished product during production of the cooling device. This allows rapid production and ensures reliable containment of the cooling fluid.

[0016] In a further embodiment of the claimed cooling device, the channel in the flexural structure can be coated with a gas barrier layer. Such a gas barrier layer minimizes the penetration of vapors and gases into the cooling fluid. The gas barrier layer can be easily manufactured, particularly during additive manufacturing of the flexural structure. The flexural structure, and thus the claimed cooling device, thus offers increased thermal performance over an extended service life.

[0017] In the claimed cooling device, the first and / or second section can be made at least partially from a plastic, a synthetic resin or a composite material with a synthetic resin, in particular from FR4. Such materials are dielectrics and offer reliable electrical insulation. The cooling device can therefore also be used in applications in which increased electrical voltages and / or electrical currents are to be expected, for example in inverters. Furthermore, such materials offer advantageous repeated flexibility and processability. Likewise, a cooling device made from such a material, in particular a plastic, can be produced by means of additive manufacturing.

[0018] In addition, the first and / or second section of the claimed cooling device can comprise a conductor layer. The first and / or second section can have a layered structure, wherein the conductor layer is made of an electrically conductive material. Accordingly, the first and / or second section can be designed as a printed circuit board in a corresponding area with a conductor layer. The conductor layer can be electrically insulated from the cooling fluid by a dielectric. Alternatively or additionally, the cooling fluid can be designed as an electrically non-conductive liquid. Further alternatively or additionally, the first and / or second section can be provided with a surface-mounted device element, or SMD element for short. The first and / or second section can be correspondingly electrically contacted on their outer surface. The claimed cooling device therefore also allows an electrical structure to be integrated therein.In the claimed cooling device, an improved thermal connection to electrical elements to be alerted can thus be provided and, at the same time, a particularly compact design can be achieved.

[0019] The problem described at the outset is also solved by a foldable electronic device according to the invention. The foldable electronic device is designed as a smartphone, as a tablet or notebook and comprises a first and a second device section which are designed to be pivotable relative to one another. A cooling device is arranged in the foldable electronic device and is designed to transport heat from the first device section to the second device section. According to the invention, the cooling device is designed according to at least one of the embodiments described above. The cooling device is compact, offers increased cooling performance, achievable service life and cost-effectiveness. Based on the claimed cooling device, foldable electronic devices can be produced in which increased heat losses occur in the first device section and must be transported to a heat sink, for example a heat sink, in the second device section.This makes it possible to produce more powerful foldable electronic devices with consistently sufficient, reliable cooling. The technical performance of foldable electronic devices is thus further enhanced.

[0020] The object is also achieved by a converter according to the invention which comprises a plurality of power semiconductors and capacitors which are electrically connected to one another. The converter also has a cooling device which is designed and arranged to dissipate heat from the power semiconductors and / or the capacitors. According to the invention, the cooling device is designed according to one of the embodiments presented above. The converter can comprise at least one printed circuit board, on each of which power semiconductors and / or capacitors are mounted. The printed circuit board can be cooled into a heat sink via the cooling device. The printed circuit board and the associated heat sink can be arranged at an angle to one another. An angular arrangement is to be understood as an arrangement which does not lie essentially in one plane, i.e. does not extend along a continuous main direction.The cooling device in question allows the power semiconductors and capacitors to be positioned independently of the heat sink's orientation. The resulting design freedom allows the converter in question to be designed compactly.

[0021] The object described above is equally achieved by a method according to the invention for simulating the operating behavior of a cooling device. The method comprises a first step in which a data set is provided by means of which the mode of operation of at least part of the cooling device to be simulated can be reproduced. In particular, the data set can comprise a digital image of the cooling device, i.e. represent its structure. This can comprise a size, position, shape, material information and / or associated material properties of the bending structure, of at least one longitudinal web, of at least one Z-web and / or of a cooling fluid. Alternatively or additionally, the data set can comprise information about a heat dissipation behavior, a heat conduction behavior and / or a heat dissipation behavior.

[0022] The method according to the invention further comprises specifying at least one operating condition which characterises the operating behaviour to be simulated. The operating condition can comprise a heat release at at least one reservoir. Alternatively or additionally, an ambient temperature and / or an indication of a flow behaviour of the cooling fluid can be part of the operating conditions. The claimed method likewise includes a third step in which a simulation program product is executed which processes the data set provided in the first step in combination with the at least one operating condition specified in the second step. The computer program product is designed to simulate the operating behaviour of the cooling device on the basis of the data set and the at least one operating condition. In this case, at least one characteristic operating value is determined.The operating characteristic can, for example, be a temperature distribution on a surface and / or in the material of at least one reservoir, a longitudinal web and / or a Z-web. Alternatively or additionally, the operating characteristic can also include a thermal indication of the cooling fluid located in the reservoirs. For this purpose, the simulation program product can be designed as a so-called digital twin, as described in more detail, for example, in the document US 2017 / 286572 A1. The disclosure content of US 2017 / 286572 A1 is incorporated by reference into the present application.

[0023] The method according to the invention also includes a fourth step in which the at least one operating characteristic determined in the third step is output to a user and / or a data interface. The data interface is suitable for outputting results of the method described above to other simulation-oriented computer programs. According to the invention, the optical filter arrangement simulated by the method is designed according to one of the embodiments described above. The features of the claimed cooling device are accordingly transferable to the claimed method.

[0024] Furthermore, the object outlined at the outset is achieved by a simulation program product according to the invention which is designed to simulate the operating behavior of a cooling device. For this purpose, the simulation program product comprises instructions which, when executed, cause a computer to simulate the operating behavior of the cooling device. The cooling device has a first and a second section which are essentially plate-shaped and is designed to transport heat from the first to the second section. The operating behavior comprises a thermal behavior of the cooling device and can, among other things, simulate the release of heat at the first section of the cooling device and transfer the released heat to the first section of the cooling device.The thermal behavior can also include heating behavior, evaporation behavior, condensation behavior and / or flow behavior of a cooling fluid in the cooling device. The thermal behavior can also include simulating heat transfer from the cooling fluid to the second section. The operating behavior can be simulated to be dynamic, quasi-stationary or stationary. The simulated, i.e. simulated, heat releases, heat conduction, heat transfers, as well as the resulting temperature distribution on and / or in the cooling device can be output by the simulation program product. Furthermore, mechanical behavior of the cooling device when bending around its bending structure can also be part of the operating behavior.Depending on an existing bend in the cooling device and its orientation, a changed flow behavior of the cooling fluid can occur due to gravity, which can also be simulated. According to the invention, the simulation program product is designed to carry out a method for simulating the operating behavior of a corresponding physical cooling device. Accordingly, the features of the described method can be readily transferred to the claimed simulation program product. Alternatively or additionally, the cooling device whose operating behavior is to be simulated is designed according to one of the embodiments outlined above. The invention is based, among other things, on the finding that the functioning of such a cooling device can be simulated in a surprisingly simple manner based on a simulation of a flat and / or rectilinear cooling device, for example a heat pipe.

[0025] Depending on the position and curvature of the cooling device, the force of gravity acting on the cooling fluid can be represented as a vector whose orientation varies locally, which is superimposed on the simulation of the planar or rectilinear cooling device. This results in a surprisingly simple, precise simulation of the corresponding cooling device. The claimed simulation program product requires reduced computing power and allows modeling with reduced computational effort. The underlying cooling device can be reproduced, i.e., simulated, essentially in real time using the claimed simulation program product.

[0026] Likewise, the claimed simulation program product can be used to simulate the respective operating behavior of a plurality of cooling devices with acceptable computational effort. This makes it possible, in particular, to monitor cooling devices during operation by changing their position and / or their bending. In particular, temperatures and / or temperature distribution on such cooling devices detected by sensors can be checked for plausibility using the simulation program product, so that defective cooling devices can be identified more quickly. This makes it possible to avoid harmful operation of a device equipped with the defective cooling device. Furthermore, the simulation program product can have a data interface via which measured values ​​for temperatures on and / or in the cooling device can be specified as inputs, and / or information on heat flows in the first and / or second section of the corresponding cooling device.Alternatively or additionally, the simulation program product may have a data interface for outputting simulation results, for example to other simulation-oriented computer programs, in particular the digital twin of the device equipped with the underlying cooling device.

[0027] The simulation program product can be designed as a so-called digital twin of a corresponding cooling device. The digital twin can be used to simulate the operating behavior of a correspondingly used cooling device. The digital twin can, for example, be designed according to US 2017 / 268572 A1. The disclosure content of US 2017 / 268572 A1 is incorporated into the present application by reference. The simulation program product can further be designed to output control commands with which a device with which the cooling device is equipped can be controlled. For example, the corresponding device can be operated by the control command in such a way that, if the cooling device is defective, operation is initiated in which the resulting heat losses are reduced.

[0028] In one embodiment of the claimed simulation program product, it can comprise a data interface designed to connect the simulation program product to a sensor associated with a corresponding physical cooling device. The sensor can provide a feedback channel for the simulation program product, so that the actual operating behavior is comparable to the simulated operating behavior. The data interface can also be designed as a so-called Application Programming Interface, or API for short.

[0029] The invention is explained in more detail below with reference to individual embodiments in figures. The figures are to be read as complementary to one another in that identical reference numerals in different figures have the same technical meaning. The features of the individual embodiments can also be combined with one another. Furthermore, the features of the embodiments shown in the figures can be combined with the features outlined above. They show in detail:

[0030] FIG 1 shows a first embodiment of the claimed cooling device in the unbent state in a plan view;

[0031] FIG 2 shows a second embodiment of the claimed cooling device in the unbent state in a plan view;

[0032] FIG 3 shows a third embodiment of the claimed cooling device in the unbent state in a plan view;

[0033] FIG 4 shows a fourth embodiment of the claimed cooling device in the unbent state in a plan view; FIG 5 shows a fifth embodiment of the claimed cooling device in the unbent state in a plan view;

[0034] FIG 6 shows a sixth embodiment of the claimed cooling device in the unbent state in a plan view;

[0035] FIG 7 shows a seventh embodiment of the claimed cooling device in the unbent state in a plan view;

[0036] FIG 8 shows an embodiment of a claimed foldable electronic device in an oblique view;

[0037] FIG 9 shows an embodiment of a claimed converter in a longitudinal section.

[0038] A first embodiment of the claimed cooling device 30, which comprises a first section 10 and a second section 20, which are connected to one another via a bending structure 40, is shown in a plan view in FIG. 1. The first and second sections 10, 20 are essentially plate-shaped and have essentially the same thickness. The cooling device 10 is shown in an unbent state in FIG. 1. The bending structure 40 is formed integrally with the first and second sections 10, 20 and is also essentially plate-shaped in the unbent state. The first section 10, the second section 20 and the bending structure 40 are made of a material which consists at least partially of synthetic resin 48. The bending structure 40 also has essentially the same thickness as the first and second sections 10, 20.The first section 10 is suitable for absorbing a heat input 31 and thereby evaporating a cooling fluid 25. Such evaporation 32 of the cooling fluid 25 is shown schematically in FIG. 1. The first section 10 is at least partially designed as a hollow body, so that the first section 10 forms a reservoir 14 for the cooling fluid 25. Likewise, a channel 12 through which the cooling fluid 25 can be conducted is formed in the first section 10. The channel 12 is formed in the interior of the first section 10 and is hydraulically connected to a channel 42 in the bending structure 40. The channel 42 in the bending structure 40 is in turn hydraulically connected to a second channel 22 in the second section 20. As a result, there is an overall hydraulic connection between the first and second sections 10, 20, respectively. between their channels 12 , 22 .The second section 20 is also at least partially designed as a hollow body and also forms a reservoir 24 for the cooling fluid 25. The second section 20 is designed to dissipate heat via a heat dissipation 33 to a heat sink 18 shown only schematically. The second section 20 is designed to condense vaporous cooling fluid 25. Such a condensation 34 is shown schematically in FIG. 1, corresponding to the evaporation 32.

[0039] The bending structure 40 is meander-shaped and comprises a plurality of longitudinal webs 44 which extend substantially parallel to a bending axis 15 about which the bending structure 40 can be repeatedly bent. The bending axis 15 is aligned substantially parallel to an edge 11, 21 of the first and second sections 10, 20. The longitudinal webs 44 are connected to one another via transverse webs 46, so that the meandering shape of the bending structure 40 is formed. The channel 42 of the bending structure 40 extends through the longitudinal webs 44 and transverse webs 46. Within the channel 42 of the bending structure 40, there is a first flow direction 27 for evaporated cooling fluid 25 and an opposite second flow direction 29 for condensed cooling fluid 25. As a result, and in conjunction with the substantially plate-shaped first and second sections, the cooling device 30 forms a planar two-phase cooling system, i.e. a planar heat pipe or planar thermosiphon.The meandering shape of the bending structure 40 makes it repeatedly bendable about the bending axis 15. In particular, the meandering shape essentially mechanically implements the principle of a bellows. A corresponding bend is symbolized in FIG. 1 as arrow 49. In a bent state, the bending structure 40 exerts a restoring force by means of which the cooling device 30 strives back to the unbent state shown. Even when bent 49 about the bending axis by 90° or more, elastic deformations predominantly, preferably exclusively, occur in the bending structure 40. The cooling device 30 can also be bent repeatedly about the bending axis 15 to such an extent that surfaces of the first and second sections 10, 20 lie opposite one another. Due to the shape of the bending structure 40, plasticization and / or cracking in the synthetic resin 48 during bending 49 is minimized, so that the bending structure 40 is suitable for withstanding an increased number of bending cycles.The bent structure 40 with the channel 42 formed therein can be produced, for example, by additive manufacturing. Alternatively or additionally, the shape of the bent structure 40 can be produced from a flat semi-finished product by machining or punching. The claimed cooling device 30 can thus be produced in a simple and economical manner. The cooling device 30 according to FIG. 1 essentially represents a repeatedly bendable planar heat pipe. The cooling device 30 is suitable for use in a converter 50 (not shown in detail) which has an angular design. The cooling device 30 can also be used in a foldable electronic device 60 (not shown in detail). A simulation program product 70 is available for the cooling device 30 and is designed to simulate an operating behavior of the cooling device 30.The operating behavior can include a mechanical behavior, in particular a mechanical load on longitudinal webs 44 and / or transverse webs 46 of the bending structure 40, an evaporation behavior, a flow behavior and / or condensation behavior of the cooling fluid 25. Depending on the existing bending state and its spatial position, the cooling device 30 can be simulated in the unbent state. The effect of gravity on the cooling fluid 25 can be represented as a changing vector field along the first section 10, the second section 20 and / or the bending structure 40. This allows a simplified simulation with reduced computational effort. The simulation program product is designed as a so-called digital twin of the cooling device 30.

[0040] A second embodiment of the claimed cooling device 30, which comprises a first section 10 and a second section 20, which are connected to one another via a bending structure 40, is shown in a plan view in FIG. 2. The first and second sections 10, 20 are essentially plate-shaped and have essentially the same thickness. The cooling device 10 is shown in an unbent state in FIG. 2. The bending structure 40 is formed integrally with the first and second sections 10, 20 and is also essentially plate-shaped in the unbent state. The first section 10, the second section 20 and the bending structure 40 are made of a material which consists at least partially of synthetic resin 48. The bending structure 40 also has essentially the same thickness as the first and second sections 10, 20.The first section 10 is suitable for absorbing a heat input 31 and thereby evaporating a cooling fluid 25. Such evaporation 32 of the cooling fluid 25 is shown schematically in FIG. 2. The first section 10 is at least partially designed as a hollow body, so that the first section 10 forms a reservoir 14 for the cooling fluid 25. Likewise, a channel 12 through which the cooling fluid 25 can be conducted is formed in the first section 10. The channel 12 is formed in the interior of the first section 10 and is hydraulically connected to a channel 42 in the bending structure 40. The channel 42 in the bending structure 40 is in turn hydraulically connected to a second channel 22 in the second section 20. As a result, there is an overall hydraulic connection between the first and second sections 10, 20, respectively. between their channels 12 , 22 .The second section 20 is also at least partially designed as a hollow body and also forms a reservoir 24 for the cooling fluid 25. The second section 20 is designed to dissipate heat via a heat dissipation 33 to a heat sink 18 shown only schematically. The second section 20 is designed to condense vaporous cooling fluid 25. Such a condensation 34 is shown schematically in FIG. 2, corresponding to the evaporation 32.

[0041] The bending structure 40 is designed in a multiple Z-shape and comprises a plurality of Z-webs 45 which, in the unbent state shown, extend substantially diagonally to a bending axis 15 about which the bending structure 40 can be bent repeatedly. In a bent state, the Z-webs 45 extend skewed to the bending axis 15. The bending axis 15 is aligned substantially parallel to an edge 11, 21 of the first and second sections 10, 20. The Z-webs 45 are directly connected to one another, so that the multiple Z-shape of the bending structure 40 is formed. In particular, the multiple Z-shape mechanically essentially realizes the principle of a bellows. The channel 42 of the bending structure 40 extends through the Z-webs 45. Within the channel 42 of the bending structure 40, there is a first flow direction 27 for evaporated cooling fluid 25 and an opposite second flow direction 29 for condensed cooling fluid 25.As a result of this and in conjunction with the essentially plate-shaped first and second sections, the cooling device 30 forms a planar two-phase cooling system, i.e. a heat pipe or a planar thermosiphon. The Z-shape of the bending structure 40 makes it repeatedly bendable about the bending axis 15. A corresponding bend is symbolized in FIG 2 as arrow 49. In a bent state, the bending structure 40 exerts a restoring force by means of which the cooling device 30 strives back to the unbent state shown. Even when bent 49 about the bending axis by 90° or more, predominantly, preferably exclusively, elastic deformations occur in the bending structure 40. The cooling device 30 can also be bent repeatedly about the bending axis 15 to such an extent that surfaces of the first and second sections 10, 20 lie opposite one another.The shape of the bent structure 40 minimizes plasticization and / or cracking in the synthetic resin 48 during bending 49, so that the bent structure 40 is suitable for withstanding an increased number of bending cycles. The bent structure 40 with the channel 42 formed therein can be produced, for example, by additive manufacturing. Alternatively or additionally, the shape of the bent structure 40 can be produced from a flat semi-finished product by machining or punching. The claimed cooling device 30 can therefore be produced in a simple and economical manner. The cooling device 30 according to FIG. 2 essentially represents a repeatedly bendable planar two-phase cooling system. The cooling device 30 is suitable for use in a converter 50 (not shown in detail) which has an angular design. The cooling device 30 is also suitable for use in a foldable electronic device 60 (not shown in detail).A simulation program product 70 is available for the cooling device 30 and is designed to simulate an operating behavior of the cooling device 30. The operating behavior can include a mechanical behavior, in particular a mechanical load on the Z-webs 45 and / or in a connecting region of the individual Z-webs 45 of the bending structure 40, an evaporation behavior, a flow behavior and / or condensation behavior of the cooling fluid 25. Depending on the existing bending state and its spatial position, the cooling device 30 can be simulated in the unbent state. The effect of gravity on the cooling fluid 25 can be represented as a changing vector field along the first section 10, the second section 20 and / or the bending structure 40. This allows a simplified simulation with reduced computational effort. The simulation program product is designed as a so-called digital twin of the cooling device 30.

[0042] A third embodiment of the claimed cooling device 30, which comprises a first section 10 and a second section 20, which are connected to one another via a bending structure 40, is shown in a plan view in FIG. 3. The first and second sections 10, 20 are essentially plate-shaped and have essentially the same thickness. The cooling device 10 is shown in an unbent state in FIG. 3. The bending structure 40 is formed integrally with the first and second sections 10, 20 and is also essentially plate-shaped in the unbent state. The first section 10, the second section 20 and the bending structure 40 are made of a material which consists at least partially of synthetic resin 48. The bending structure 40 also has essentially the same thickness as the first and second sections 10, 20.The first section 10 is suitable for absorbing a heat input 31 and thereby evaporating a cooling fluid 25. Such evaporation 32 of the cooling fluid 25 is shown schematically in FIG 3. The first section 10 is at least partially designed as a hollow body, so that the first section 10 forms a reservoir 14 for the cooling fluid 25. Likewise, channels 12 are formed in the first section 10, through which the cooling fluid 25 can be conducted. The channels 12 are formed in the interior of the first section 10 and are each hydraulically connected to a channel 42 in the bending structure 40. The channels 42 in the bending structure 40 are, in turn, hydraulically connected to second channels 22 in the second section 20. As a result, there is a hydraulic connection between the first and second sections 10, 20, or between their corresponding channels 12, 22. Via reservoir 14, 14 in the first andIn the second section 10, 20, the first and second channels 12, 22 are also hydraulically connected to one another. The second section 20 is also at least partially formed as a hollow body and also forms a reservoir 24 for the cooling fluid 25. The second section 20 is designed to dissipate heat via a heat dissipation 33 to a heat sink 18 shown only schematically. The second section 20 is designed to condense vaporous cooling fluid 25. Such a condensation 34 is shown schematically in FIG. 3, corresponding to the evaporation 32.

[0043] The bending structure 40 has a plurality of circumferential structures 47, which are essentially designed as rectangular frames. As a result, the circumferential structures 47 have increased flexural rigidity about the bending axis 15 compared to otherwise similarly dimensioned open structures such as in FIG 1 or FIG 2. The circumferential structures 47 are aligned along their long side, essentially parallel to an edge 11, 21 of the first or second section 10, 20, respectively, in the unbent state shown. These remain essentially parallel to the edge 11, 21 of the first or second section 10, 20, respectively, even when bent 49 about the bending axis 15. The circumferential structures 47 are connected to one another via transverse webs 46, through which the channels 42 in the bending structure 40 also extend. The circumferential structures 47 enable the bending structure 40 to be bent repeatedly.The bending axis 15 is aligned substantially parallel to an edge 11, 21 of the first and second sections 10, 20. The channels 42 of the bending structure 40 extend through the circumferential structures 47 and transverse webs 46. Within one channel 42 of the bending structure 40, there is a first flow direction 27 for evaporated cooling fluid 25. In another channel 42, there is an opposite second flow direction 29 for condensed cooling fluid 25. This causes the cooling fluid 25 to circulate in the bending structure 40. In conjunction with the substantially plate-shaped first and second sections, the cooling device 30 forms a planar two-phase cooling system, i.e. a planar heat pipe or a planar thermosiphon. The multiple connected circumferential structures 47 in the bending structure 40 make it repeatedly bendable about the bending axis 15. This shape also essentially implements the mechanical principle of a bellows.A corresponding bend is symbolized in FIG 3 as arrow 49. The bent structure 40 exerts a restoring force in a bent state, by means of which the cooling device 30 strives back into the unbent state shown. Even when bent 49 around the bending axis by 90° or more, the bent structure 40 predominantly, preferably exclusively, exhibits elastic deformations. The cooling device 30 can also be bent repeatedly around the bending axis 15 until surfaces of the first and second sections 10, 20 lie opposite one another. The shape of the bent structure 40 minimizes plasticization and / or cracking in the synthetic resin 48 during bending 49, such that the bent structure 40 is suitable for withstanding an increased number of bending cycles. The bent structure 40 with the channels 42 formed therein can be produced, for example, by additive manufacturing.Alternatively or additionally, the shape of the bent structure 40 can be produced from a flat semi-finished product by machining or punching. The claimed cooling device 30 can therefore be produced in a simple and economical manner. The cooling device 30 according to FIG 3 essentially represents a repeatedly bendable planar two-phase cooling system. The cooling device 30 is suitable for use in a converter 50 (not shown in detail) which has an angular design. The cooling device 30 can also be used in a foldable electronic device 60 (not shown in detail). A simulation program product 70 is available for the cooling device 30 and is designed to simulate an operating behavior of the cooling device 30.The operating behavior can include a mechanical behavior, in particular a mechanical load on the surrounding structures 47 and / or transverse webs 46 of the bending structure 40, an evaporation behavior, a flow behavior and / or condensation behavior of the cooling fluid 25. Depending on the existing bending state and its spatial position, the cooling device 30 can be simulated in the unbent state. The effect of gravity on the cooling fluid 25 can be represented as a changing vector field along the first section 10, the second section 20 and / or the bending structure 40. This allows a simplified simulation with reduced computational effort. The simulation program product is designed as a so-called digital twin of the cooling device 30.

[0044] A fourth embodiment of the claimed cooling device 30, which comprises a first section 10 and a second section 20 which are connected to one another via a bending structure 40, is shown in a plan view in FIG. 4. The first and second sections 10, 20 are essentially plate-shaped and have essentially the same thickness. The cooling device 10 is shown in an unbent state in FIG. 4. The bending structure 40 is formed integrally with the first and second sections 10, 20 and is also essentially plate-shaped in the unbent state. The first section 10, the second section 20 and the bending structure 40 are made of a material which consists at least partially of synthetic resin 48. The bending structure 40 also has essentially the same thickness as the first and second sections 10, 20.The first section 10 is suitable for absorbing a heat input 31 and thereby evaporating a cooling fluid 25. Such evaporation 32 of the cooling fluid 25 is shown schematically in FIG. 4. The first section 10 is at least partially designed as a hollow body, so that the first section 10 forms a reservoir 14 for the cooling fluid 25. Likewise, a first channel 12 is formed in the first section 10, through which cooling fluid 25 can be conducted and which ends in the first section 10. The first channel 12 is formed in the interior of the first section 10 and is hydraulically connected to a channel 42 in the bending structure 40. The channel 42 in the bending structure 40 is in turn hydraulically connected to a second channel 22 in the second section 20. As a result, there is an overall hydraulic connection between the first and second sections 10, 20, respectively. between their channels 12 , 22 .The second section 20 is also at least partially designed as a hollow body and also forms a reservoir 24 for the cooling fluid 25, wherein the second channel 22 ends in the second section 20. The second section 20 is designed to dissipate heat via a heat dissipation 33 to a heat sink 18 shown only schematically. The second section 20 is designed to condense vaporous cooling fluid 25. Such a condensation 34 is shown schematically in FIG. 4, corresponding to the evaporation 32.

[0045] The bending structure 40 is meander-shaped and comprises a plurality of longitudinal webs 44 which extend substantially parallel to a bending axis 15 about which the bending structure 40 can be repeatedly bent. The bending axis 15 is aligned substantially parallel to an edge 11, 21 of the first and second sections 10, 20. The longitudinal webs 44 are connected to one another via transverse webs 46, so that the meandering shape of the bending structure 40 is formed. The channel 42 of the bending structure 40 extends through the longitudinal webs 44 and transverse webs 46. Within the channel 42 of the bending structure 40, there is an alternating flow direction 28 for evaporated and liquid, i.e. condensed, cooling fluid 25. Such an alternating flow direction 28 of evaporated and condensed cooling fluid 25 results in heat transport from the first to the second section 10, 20.As a result, and in conjunction with the essentially plate-shaped first and second sections 10, 20, the cooling device 30 forms a planar two-phase cooling system, in particular a planar pulsating heat pipe. The meandering shape of the bending structure 40 makes it repeatedly bendable about the bending axis 15. In particular, the meandering shape essentially implements the principle of a bellows mechanically. A corresponding bend is symbolized in FIG. 4 as arrow 49. In a bent state, the bending structure 40 exerts a restoring force by means of which the cooling device 30 strives back to the unbent state shown. Even when bent 49 about the bending axis by 90° or more, predominantly, preferably exclusively, elastic deformations occur in the bending structure 40. The cooling device 30 can also be bent repeatedly about the bending axis 15 to such an extent that surfaces of the first and second sections 10, 20 lie opposite one another.Due to the shape of the bending structure 40, plasticization and / or cracking in the synthetic resin 48 during bending 49 is minimized, so that the bending structure 40 is suitable for withstanding an increased number of bending cycles.

[0046] The bent structure 40 with the channel 42 formed therein can be produced, for example, by additive manufacturing. Alternatively or additionally, the shape of the bent structure 40 can be produced from a flat semi-finished product by machining or punching. The claimed cooling device 30 can thus be produced in a simple and economical manner. The cooling device 30 according to FIG 4 essentially represents a repeatedly bendable planar heat pipe. The cooling device 30 is suitable for use in a converter 50 (not shown in detail) that has an angular design. The cooling device 30 can also be used in a foldable electronic device 60 (not shown in detail). A simulation program product 70 is available for the cooling device 30 and is designed to simulate an operating behavior of the cooling device 30.The operating behavior can include a mechanical behavior, in particular a mechanical load on longitudinal webs 44 and / or transverse webs 46 of the bending structure 40, an evaporation behavior, a flow behavior and / or condensation behavior of the cooling fluid 25. Depending on the existing bending state and its spatial position, the cooling device 30 can be simulated in the unbent state. The effect of gravity on the cooling fluid 25 can be represented as a changing vector field along the first section 10, the second section 20 and / or the bending structure 40. This allows a simplified simulation with reduced computational effort. The simulation program product is designed as a so-called digital twin of the cooling device 30.

[0047] A fifth embodiment of the claimed cooling device 30, which comprises a first section 10 and a second section 20, which are connected to one another via a bending structure 40, is shown in a plan view in FIG. 5. The first and second sections 10, 20 are essentially plate-shaped and have essentially the same thickness. The cooling device 10 is shown in an unbent state in FIG. 5. The bending structure 40 is formed integrally with the first and second sections 10, 20 and is also essentially plate-shaped in the unbent state. The first section 10, the second section 20 and the bending structure 40 are made of a material which consists at least partially of synthetic resin 48. The bending structure 40 also has essentially the same thickness as the first and second sections 10, 20.The first section 10 is suitable for absorbing a heat input 31 and thereby evaporating a cooling fluid 25. Such evaporation 32 of the cooling fluid 25 is shown schematically in FIG 5. The first section 10 is at least partially designed as a hollow body, so that the first section 10 forms a reservoir 14 for the cooling fluid 25. Likewise, a first channel 12 is formed in the first section 10, through which cooling fluid 25 can be conducted. The first channel 12 is formed in the interior of the first section 10 and is hydraulically connected to a channel 42 in the bending structure 40. The channel 42 in the bending structure 40 is in turn hydraulically connected to a second channel 22 in the second section 20. As a result, there is an overall hydraulic connection between the first and second sections 10, 20, respectively. between their channels 12 , 22 .The second section 20 is also at least partially designed as a hollow body and also forms a reservoir 24 for the cooling fluid 25. The second section 20 is designed to dissipate heat via a heat dissipation 33 to a heat sink 18 shown only schematically. The second section 20 is designed to condense vaporous cooling fluid 25. Such a condensation 34 is shown schematically in FIG. 5, corresponding to the evaporation 32.

[0048] The bending structure 40 is meander-shaped and comprises a plurality of longitudinal webs 44 which extend substantially parallel to a bending axis 15 about which the bending structure 40 can be bent repeatedly. The bending axis 15 is aligned substantially parallel to an edge 11, 21 of the first and second sections 10, 20. The longitudinal webs 44 are connected to one another via transverse webs 46, so that the meander shape of the bending structure 40 is formed. The channel 42 of the bending structure 40 extends through the longitudinal webs 44 and transverse webs 46. The channel 42 further extends through a return section 35. The first and second sections 10, 20 are connected to one another by the return section 35. Within the channel 42 of the bending structure 40 there is a first flow direction 27 for evaporated and liquid, i.e. condensed, cooling fluid 25, through which the cooling fluid 25 circulates in the bending structure 40.As a result of this and in conjunction with the essentially plate-shaped first and second sections, the cooling device 30 forms a planar two-phase cooling system, i.e. a planar loop-shaped heat pipe, also called a closed-loop heat pipe. The meandering shape of the bending structure 40 makes it repeatedly bendable about the bending axis 15. In particular, the meandering shape essentially implements the principle of a bellows mechanically. A corresponding bend is symbolized in FIG 5 as arrow 49. In a bent state, the bending structure 40 exerts a restoring force by means of which the cooling device 30 strives back to the unbent state shown. Even when bent 49 around the bending axis by 90° or more, the bending structure 40 predominantly, preferably exclusively, exhibits elastic deformations. The cooling device 30 is also repeatedly bendable about the bending axis 15 so that surfaces of the first and second sections 10, 20 are opposite each other.Due to the shape of the bending structure 40, plasticization and / or cracking in the synthetic resin 48 during bending 49 is minimized, so that the bending structure 40 is suitable for withstanding an increased number of bending cycles.

[0049] The bent structure 40 with the channel 42 formed therein can be produced, for example, by additive manufacturing. Alternatively or additionally, the shape of the bent structure 40 can be produced from a flat semi-finished product by machining or punching. The claimed cooling device 30 can thus be produced in a simple and economical manner. The cooling device 30 according to FIG 5 essentially represents a repeatedly bendable planar heat pipe. The cooling device 30 is suitable for use in a converter 50 (not shown in detail) that has an angular design. The cooling device 30 can also be used in a foldable electronic device 60 (not shown in detail). A simulation program product 70 is available for the cooling device 30 and is designed to simulate an operating behavior of the cooling device 30.The operating behavior can include a mechanical behavior, in particular a mechanical load on longitudinal webs 44 and / or transverse webs 46 of the bending structure 40, an evaporation behavior, a flow behavior and / or condensation behavior of the cooling fluid 25. Depending on the existing bending state and its spatial position, the cooling device 30 can be simulated in the unbent state. The effect of gravity on the cooling fluid 25 can be represented as a changing vector field along the first section 10, the second section 20 and / or the bending structure 40. This allows a simplified simulation with reduced computational effort. The simulation program product is designed as a so-called digital twin of the cooling device 30.

[0050] A sixth embodiment of the claimed cooling device 30, which comprises a first section 10 and a second section 20, which are connected to one another via a bending structure 40, is shown in a plan view in FIG. 6. The first and second sections 10, 20 are essentially plate-shaped and have essentially the same thickness. The cooling device 10 is shown in an unbent state in FIG. 6. The bending structure 40 is formed integrally with the first and second sections 10, 20 and is also essentially plate-shaped in the unbent state. The first section 10, the second section 20 and the bending structure 40 are made of a material which consists at least partially of synthetic resin 48. The bending structure 40 also has essentially the same thickness as the first and second sections 10, 20.The first section 10 is suitable for absorbing a heat input 31 and thereby evaporating a cooling fluid 25. Such evaporation 32 of the cooling fluid 25 is shown schematically in FIG. 6. The first section 10 is at least partially designed as a hollow body, so that the first section 10 forms a reservoir 14 for the cooling fluid 25. Likewise, a channel 12 through which the cooling fluid 25 can be conducted is formed in the first section 10. The channel 12 is formed in the interior of the first section 10 and is hydraulically connected to a channel 42 in the bending structure 40. The channel 42 in the bending structure 40 is in turn hydraulically connected to a second channel 22 in the second section 20. As a result, there is an overall hydraulic connection between the first and second sections 10, 20, respectively. between their channels 12 , 22 .The second section 20 is also at least partially designed as a hollow body and also forms a reservoir 24 for the cooling fluid 25. The second section 20 is designed to dissipate heat via a heat dissipation 33 to a heat sink 18 shown only schematically. The second section 20 is designed to condense vaporous cooling fluid 25. Such a condensation 34 is shown schematically in FIG. 6, corresponding to the evaporation 32.

[0051] The bending structure 40 is meander-shaped and comprises a plurality of longitudinal webs 44 which extend substantially parallel to a bending axis 15 about which the bending structure 40 can be bent repeatedly. The bending axis 15 is aligned substantially parallel to an edge 11, 21 of the first and second sections 10, 20. The longitudinal webs 44 are connected to one another via transverse webs 46, so that the meandering shape of the bending structure 40 is formed. The channel 42 of the bending structure 40 extends through the longitudinal webs 44 and transverse webs 46. A plurality of longitudinal webs 44 is formed integrally with a Tesla valve 41, by means of which a preferred direction is imposed on the flowing cooling fluid 25 in the corresponding longitudinal web 44.As a result, in particular for evaporated cooling fluid 25, the flow direction can be imposed on the cooling fluid 25 regardless of any existing bend and / or spatial position of the cooling device 30, thus ensuring the functionality of the cooling device 30. For the return of condensed cooling fluid 25, the second section 20 can be connected to a further bending structure 40 (not shown). The Tesla valves 41 are free of moving parts and therefore offer increased reliability. Within the channel 42 of the bending structure 40, there is a first flow direction 27 for evaporated cooling fluid 25 and for condensed cooling fluid 25. As a result, and in conjunction with the essentially plate-shaped first and second section, the cooling device 30 forms a planar two-phase cooling system, i.e. a planar heat pipe or a planar thermosiphon.The meandering shape of the bending structure 40 makes it repeatedly bendable about the bending axis 15. In particular, the meandering shape essentially mechanically implements the principle of a bellows. A corresponding bend is symbolized in FIG. 6 as arrow 49. In a bent state, the bending structure 40 exerts a restoring force by means of which the cooling device 30 strives back to the unbent state shown. Even when bent 49 about the bending axis by 90° or more, the bending structure 40 predominantly, preferably exclusively, exhibits elastic deformations. The cooling device 30 can also be bent repeatedly about the bending axis 15 to such an extent that surfaces of the first and second sections 10, 20 lie opposite one another. Due to the shape of the bending structure 40, plasticization and / or cracking in the synthetic resin 48 during bending 49 is minimized, so that the bending structure 40 is suitable for withstanding an increased number of bending cycles.The bent structure 40 with the channel 42 formed therein can be produced, for example, by additive manufacturing. Alternatively or additionally, the shape of the bent structure 40 can be produced from a flat semi-finished product by machining or punching. The claimed cooling device 30 can therefore be produced in a simple and economical manner. The cooling device 30 according to FIG 6 essentially represents a repeatedly bendable planar two-phase cooling system. The cooling device 30 is suitable for use in a converter 50 (not shown in detail) which has an angular design. The cooling device 30 can also be used in a foldable electronic device 60 (not shown in detail). A simulation program product 70 is available for the cooling device 30 and is designed to simulate an operating behavior of the cooling device 30.The operating behavior can include a mechanical behavior, in particular a mechanical load on longitudinal webs 44 and / or transverse webs 46 of the bending structure 40, an evaporation behavior, a flow behavior and / or condensation behavior of the cooling fluid 25. Depending on the existing bending state and its spatial position, the cooling device 30 can be simulated in the unbent state. The effect of gravity on the cooling fluid 25 can be represented as a changing vector field along the first section 10, the second section 20 and / or the bending structure 40. This allows a simplified simulation with reduced computational effort. The simulation program product is designed as a so-called digital twin of the cooling device 30.

[0052] A seventh embodiment of the claimed cooling device 30, which comprises a first section 10 and a second section 20, which are connected to one another via a bending structure 40, is shown in a plan view in FIG. 7. The first and second sections 10, 20 are essentially plate-shaped and have essentially the same thickness. The cooling device 10 is shown in an unbent state in FIG. 7. The bending structure 40 is formed integrally with the first and second sections 10, 20 and is also essentially plate-shaped in the unbent state. The first section 10, the second section 20 and the bending structure 40 are made of a material which consists at least partially of synthetic resin 48. The bending structure 40 also has essentially the same thickness as the first and second sections 10, 20.The first section 10 is suitable for absorbing a heat input 31 and thereby evaporating a cooling fluid 25. Such evaporation 32 of the cooling fluid 25 is shown schematically in FIG. 7. The first section 10 is at least partially designed as a hollow body, so that the first section 10 forms a reservoir 14 for the cooling fluid 25. Likewise, a channel 12 through which the cooling fluid 25 can be conducted is formed in the first section 10. The channel 12 is formed in the interior of the first section 10 and is hydraulically connected to a channel 42 in the bending structure 40. The channel 42 in the bending structure 40 is in turn hydraulically connected to a second channel 22 in the second section 20. As a result, there is an overall hydraulic connection between the first and second sections 10, 20, respectively. between their channels 12 , 22 .The second section 20 is also at least partially designed as a hollow body and also forms a reservoir 24 for the cooling fluid 25. The second section 20 is designed to dissipate heat via a heat dissipation 33 to a heat sink 18 shown only schematically. The second section 20 is designed to condense vaporous cooling fluid 25. Such a condensation 34 is shown schematically in FIG. 7, corresponding to the evaporation 32.

[0053] The bending structure 40 is meander-shaped and comprises a plurality of longitudinal webs 44 which extend substantially parallel to a bending axis 15 about which the bending structure 40 can be bent repeatedly. The bending axis 15 is aligned substantially parallel to an edge 11, 21 of the first and second sections 10, 20. The longitudinal webs 44 are connected to one another via transverse webs 46, so that the meandering shape of the bending structure 40 is formed. The channel 42 of the bending structure 40 extends through the longitudinal webs 44 and transverse webs 46. A plurality of longitudinal webs 44 is formed integrally with at least one transverse channel 43, through which a preferred direction is imposed on the flowing cooling fluid 25 in the corresponding longitudinal web 44. For this purpose, the transverse channels 43 branch off essentially diagonally in the corresponding longitudinal webs 44.As a result, in particular for evaporated cooling fluid 25, the flow direction can be imposed on the cooling fluid 25 regardless of any existing bend and / or spatial position of the cooling device 30, thus ensuring the functionality of the cooling device 30. For the return of condensed cooling fluid 25, the second section 20 can be connected to a further bending structure 40 (not shown). The transverse channels 43 are free of moving parts and therefore offer increased reliability. Within the channel 42 of the bending structure 40, there is a first flow direction 27 for evaporated cooling fluid 25 and for condensed cooling fluid 25. As a result, and in conjunction with the essentially plate-shaped first and second sections, the cooling device 30 forms a planar two-phase cooling system, i.e. a planar heat pipe or a planar thermosiphon.The meandering shape of the bending structure 40 makes it repeatedly bendable about the bending axis 15. In particular, the meandering shape essentially mechanically implements the principle of a bellows. A corresponding bend is symbolized in FIG. 7 as arrow 49. In a bent state, the bending structure 40 exerts a restoring force by means of which the cooling device 30 strives back to the unbent state shown. Even when bent 49 about the bending axis by 90° or more, elastic deformations predominantly, preferably exclusively, occur in the bending structure 40. The cooling device 30 can also be bent repeatedly about the bending axis 15 to such an extent that surfaces of the first and second sections 10, 20 lie opposite one another. Due to the shape of the bending structure 40, plasticization and / or cracking in the synthetic resin 48 during bending 49 is minimized, so that the bending structure 40 is suitable for withstanding an increased number of bending cycles.The bent structure 40 with the channel 42 formed therein can be produced, for example, by additive manufacturing. Alternatively or additionally, the shape of the bent structure 40 can be produced from a flat semi-finished product by machining or punching. The claimed cooling device 30 can therefore be produced in a simple and economical manner. The cooling device 30 according to FIG 7 essentially represents a repeatedly bendable planar two-phase cooling system. The cooling device 30 is suitable for use in a converter 50 (not shown in detail) which has an angular design. The cooling device 30 can also be used in a foldable electronic device 60 (not shown in detail). A simulation program product 70 is available for the cooling device 30 and is designed to simulate an operating behavior of the cooling device 30.The operating behavior can include a mechanical behavior, in particular a mechanical load on longitudinal webs 44 and / or transverse webs 46 of the bending structure 40, an evaporation behavior, a flow behavior and / or condensation behavior of the cooling fluid 25. Depending on the existing bending state and its spatial position, the cooling device 30 can be simulated in the unbent state. The effect of gravity on the cooling fluid 25 can be represented as a changing vector field along the first section 10, the second section 20 and / or the bending structure 40. This allows a simplified simulation with reduced computational effort. The simulation program product is designed as a so-called digital twin of the cooling device 30.

[0054] An embodiment of a claimed foldable electronic device 60 is shown schematically in an unbent state in FIG 8. The foldable electronic device 60 is designed as a foldable smartphone and comprises a first device section 61 which is connected to a second device section 62 so as to be repeatedly bendable about a bending axis 15. Bending or folding of the foldable electronic device 60 occurs along the arrow 49 in FIG 8. During operation, heat is released in the first device section 61, which leads to heat being introduced 31 into a first section 10 of a cooling device 30. The cooling device 30 also has a second section 20 which is in thermally conductive contact with a heat sink 18 which is designed as a heat sink.The cooling device 30 is designed to transport the heat introduced into the first section 10 via the heat input 31 from the first device section 61 to a heat dissipation 33 in the heat sink 18 in the second device section 62. The first section 10 and the second section 20 of the cooling device 30 are connected to one another via a bending structure 40 which is essentially meander-shaped. The bending structure 40 belongs to the cooling device 30 and is suitable for exerting a restoring force in a bent state, by means of which restoring force the foldable electronic device 60 strives back into the unbent state shown in FIG. 8. The cooling structure 30 can in particular be designed according to one of the embodiments according to one of FIGS. 1 to 7. The operating behavior of the cooling device 30 is further simulated by a simulation program product 70 (not shown in detail).The simulation program product 70 is designed as a digital twin of the cooling device 30 or as a digital twin of the foldable electronic device 60. FIG 9 shows a schematic longitudinal section of an embodiment of a claimed converter 50. The converter 50 comprises a first printed circuit board 51, on which a plurality of capacitors 56 are arranged. The capacitors 56 are electrically connected via vias 57 to a conductor layer 55, which is arranged between dielectric layers 54. The first printed circuit board 59 is fastened to an anchor 59. Furthermore, the converter 50 comprises a second printed circuit board 52, which likewise has a conductor layer 55 between dielectric layers 54. The second printed circuit board 52 is likewise fastened to the anchor 59.A plurality of power semiconductors 58 are arranged on the second circuit board 52 and are connected to the conductor layer 55 in the second circuit board 52 via vias 57. The first and second circuit boards 51, 52 are arranged at an angle to one another, namely essentially at a 90° angle. The associated bend 49 takes place during assembly of the converter 50. The first and second circuit boards 51, 52 are connected to one another via a bending structure 40 which can be bent repeatedly. The bending structure 40 is designed according to a bending structure 40 according to one of FIGS. 1 to 7. Furthermore, the conductor layer 55 also extends through the bending structure 40. The first and second circuit boards 51, 52 also belong to a cooling device 30 and accordingly form its first and second sections 10, 20, between which heat is to be transported.Accordingly, the first circuit board 51 is formed integrally with the first section 10 of the cooling device 30 and the second circuit board 52 is formed integrally with the second section 20 of the cooling device 30. Accordingly, the cooling device 30 is designed according to one embodiment as in one of FIGS. 1 to 7. The concept of a corresponding cooling device 30 can be supplemented by a conductor layer 55 accommodated therein, so that the sections 10, 20 of the cooling device 50 simultaneously serve as circuit boards 51, 52. This achieves an improved thermal connection to the power semiconductors 58 and / or the capacitors 56. The claimed converter 50 can therefore be designed for complex assembly situations, which in turn allows a compact design of the converter 50. Likewise, the converter 50 can be easily disassembled and thus serviced due to its flexibility.The cooling device 30 is further simulated by a simulation program product 70 (not shown in detail), which is designed as a digital twin of the cooling device 30 or the converter 50.

Claims

Patent claims 1. Cooling device (30), comprising a first and a second section (10, 20), each of which is plate-shaped and in which at least one channel (12, 22) for a cooling fluid (25) is formed, wherein the first and second sections (10, 20) are connected via a bending structure (40) so as to be repeatedly pivotable relative to one another about a bending axis (15), wherein the bending structure (40) is designed to exert a restoring force in a bent state and hydraulically connects at least one channel (12) in the first section (10) to a channel (22) in the second section (20), characterized in that the bending structure (40) is meander-shaped to reduce plastic deformation during bending and in that the bending structure (40) comprises longitudinal webs (44) which extend along the bending axis (15).

2. Cooling device (30), comprising a first and a second section (10, 20), each of which is plate-shaped and in which at least one channel (12, 22) for a cooling fluid (25) is formed, wherein the first and second sections (10, 20) are repeatedly pivotally connected relative to one another about a bending axis (15) via a bending structure (40), wherein the bending structure (40) is designed to exert a restoring force in a bent state and hydraulically connects at least one channel (12) in the first section (10) to a channel (22) in the second section (20), characterized in that the bending structure (40) is designed to be multiply Z-shaped to reduce plastic deformation during bending and comprises Z-webs (45) which, in a bent state, extend skewed to the bending axis (15).

3. Cooling device (30) according to claim 1 or 2, characterized in that the bending structure (40) is formed integrally with the first and second sections (10, 20).

4. Cooling device (30) according to one of claims 1 to 3, characterized in that the cooling device (10) is designed as a planar heat pipe, planar pulsating heat pipe, or as a planar thermosiphon.

5. Cooling device (30) according to one of claims 1 to 4, characterized in that the bending structure (40) has a plurality of transverse channels for imposing a preferred direction of a fluid flow between the first and second section (10, 20) and / or that the bending structure () is designed in sections as a Tesla valve (41) for imposing a preferred direction of a fluid flow.

6. Cooling device (30) according to one of claims 1 to 5, characterized in that in the first section (10), in the second section (20) and / or the bending structure (30) a first channel (12, 22, 42) with a first width and a second channel (12, 22, 42) with a second width are formed, wherein the first width is smaller than the second width.

7. Cooling device (30) according to one of claims 1 to 6, characterized in that the bending structure (40) has the same thickness as the first and second sections (10, 20).

8. Cooling device (30) according to one of claims 1 to 7, characterized in that the channel (42) in the bending structure (40) is delimited by at least one cover layer made of a dielectric along a construction direction.

9. Cooling device (30) according to one of claims 1 to 8, characterized in that the channel (42) in the bending structure (40) is coated with a gas barrier layer.

10. Cooling device (30) according to one of claims 1 to 9, characterized in that the first and / or second section (10, 20) is made at least partially of a plastic, a synthetic resin (48) or a composite material with a synthetic resin (48), in particular FR4.

11. Cooling device (30) according to one of claims 1 to 10, characterized in that the first and / or second section (10, 20) comprises a conductor layer (55) and / or is provided with an SMD element.

12. Converter (50) comprising a first and a second circuit board (51, 52) which are arranged at an angle to one another and are cooled together via a cooling device (10), characterized in that the cooling device (10) is designed according to one of claims 1 to 11.

13. A foldable electronic device (60) designed as a smartphone, tablet or notebook, comprising a first and a second device section (61, 62) which are designed to be pivotable relative to one another, and in which a cooling device (30) is arranged for heat transport from the first to the second device section (61, 62), characterized in that the cooling device (30) is designed according to one of claims 1 to 11.

14. A method for simulating an operating behavior of a cooling device (30), comprising the steps of: a) providing a data set by means of which a functioning of at least part of the cooling device (30) to be simulated can be reproduced; b) specifying at least one operating condition which characterizes the operating behavior to be simulated; c) executing a simulation program product (70) which is designed to simulate the operating behavior of the cooling device (30) based on the data set and the at least one operating condition and to determine at least one operating characteristic value; d) outputting the at least one operating characteristic value to a user and / or a data interface; characterized in that the cooling device (30) is designed according to one of claims 1 to 12.

15. Simulation program product (70) comprising instructions which, when executed, cause a computer to simulate an operating behavior of a cooling device (30) according to one of claims 1 to 10, characterized in that (30), characterized in that the simulation program product (70) is designed to carry out the method according to claim 14.

16. Simulation program product (70) according to claim 15, characterized in that the simulation program product comprises a data interface which is designed to connect the simulation program product (70) to a sensor which is assigned to a corresponding physical cooling device (30).

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