Device and method for processing a substrate in an evacuated processing chamber

Abstract

Disclosed are a device and a method for processing, in particular nano-imprinting, a substrate (13) in a local fluid-tight processing chamber (14).

Description

[0001] Description

[0002] Apparatus and method for processing a substrate in an evacuated processing space

[0003] The present invention relates to a method and apparatus for processing substrates. In particular, the invention relates to a method and apparatus for embossing, in particular nano-embossing, substrates with improved alignment.

[0004] In the current state of the art, processing substrates in a vacuum is advantageous for some processing methods. This often requires evacuating the entire device, or at least the corresponding module. The lengthy evacuation process is particularly disadvantageous, as productivity decreases due to frequent and lengthy evacuations. Processing the substrate in a vacuum is often necessary to prevent embossing defects, especially air inclusions.

[0005] The invention relates in particular to a method and a device for UV-NIL embossing, wherein structures, in particular nanostructures, can be produced using a soft nanostructure stamp, in particular a flexible foil stamp.

[0006] Nanoimprint lithography (NIL) is a molding process in which micro- and / or nanostructures are molded into curable materials, such as resist, using a stamp. This process allows for the molding of a large number of nanostructure systems. In principle, a distinction is made between thermal NIL (hot-embossing NIL) and UV-based NIL processes. In UV-NIL, the stamp is pressed into the flowable resist at room temperature. Due to the viscosity of the photoresist, the capillary action completely fills the interstices of the stamp. Upon exposure to UV radiation, the UV resist crosslinks to form a stable polymer (curing).

[0007] Structuring with soft polymer stamps offers several advantages over hard stamps. These include easy stamp production, efficient stamping processes, excellent surface properties of the respective stamp materials, low costs, reproducibility of the stamped product, and, above all, the possibility of elastic deformation of the stamp during demolding.

[0008] The production of high-precision nanostructures on large surfaces can be achieved using a roller-based process without vacuum (SmartNIL). W02014 / 037044A1 describes a method and a device using a micro- and / or nanostructure stamp, in particular a flexible foil stamp and a frame. Furthermore, the structures from the foil stamp of W02014 / 037044A1 must be pressed into the embossed material using an embossing element, in particular a rigid embossing roller.

[0009] In WO2015 / 161868A1, a nanostructure stamp is prestressed before contacting. The prestress is achieved by deforming the nanostructure stamp using a deformation agent. Positioning inaccuracies and other stamping errors can thus impair the stamping result. The device in WO2015 / 161868A1 can also be operated in a vacuum, although the entire device must be evacuated. In this case, the stamping stamp is not a flexible, soft foil stamp clamped to a foil frame, but a hard polymer stamp.

[0010] It is therefore the object of the invention to at least partially eliminate, in particular completely eliminate, the disadvantages listed in the prior art. In particular, it is an object of the invention to provide an improved method and an improved device for processing, in particular for embossing, substrates.

[0011] The present object is achieved by the features of the independent claims. Advantageous developments of the invention are specified in the dependent claims. The scope of the invention also includes all combinations of at least two features specified in the description, the claims, and / or the drawings. For specified value ranges, values ​​within the specified limits are also considered to be disclosed as limit values ​​and can be claimed in any combination.

[0012] Accordingly, the invention relates to a method for processing, in particular for nanoimprinting, a substrate with at least the following steps: a) providing a substrate receiving device for receiving the substrate, b) providing a device for processing the substrate, c) forming a local and fluidically tight processing space between the substrate receiving device and the device, d) evacuating the processing space and e) processing the substrate, wherein the evacuation in step d) takes place after the formation of the processing space in step c). Instead of a substrate, a substrate stack can also be processed. In the following, the method and the device are described in connection with a substrate, but a substrate stack can also be processed accordingly. The processing can also comprise processing of both sides of the substrate, wherein a multiple or triple stacked arrangement (English:Triple stack is used. This allows, for example, a substrate to be embossed on both sides.

[0013] This advantageously allows for the creation of a processing space that is locally or significantly smaller than the space around the device. The processing space is at least partially formed or sealed by the device and the substrate receiving device. In other words, a spatially defined processing space can be created around the substrate. Due to its small volume, this space can be evacuated particularly quickly and efficiently.

[0014] The evacuation is carried out by means of evacuation devices arranged on the substrate receiving device and / or the device, so that after the processing chamber has been formed, it can be evacuated. The substrate is arranged within the processing chamber. The processing takes place in the processing chamber, which is at least partially evacuated.

[0015] In a preferred embodiment of the method for processing, it is provided that the formation of the processing space takes place by approaching the substrate receiving device and the device, wherein the device and the substrate receiving device are aligned with each other before the approach.

[0016] During alignment and / or approach, the substrate receiving device and the device are aligned to each other in such a way that optimal processing and an optimal processing result are possible. Precise alignment is particularly necessary for embossing or bonding processes. By aligning the substrate receiving device and the device to each other, the substrate can also be precisely aligned or positioned.

[0017] The substrate is preferably fixed in the substrate receiving device using fixing elements. The approach and alignment are preferably performed by actuators or other means for alignment or approach. The alignment and approach in step c) can also be performed in different sequences. It is conceivable that alignment is performed first, followed by an approach of the substrate receiving device and the device. After the approach and the formation of the processing space, an additional alignment of the substrate or the processing means can be performed. It is also conceivable that the approach and alignment can be performed in parallel.

[0018] By bringing the substrate receiving device and the device closer together, a local and fluidically sealed processing space is created around the substrate. This processing space can be evacuated and is formed at least partially between the two receiving devices. The processing space can also be partially formed by seals, which are preferably attached at least to the substrate receiving device. A part of the substrate receiving device or the device can also form the seals. A sealing ring is preferably used to seal or form the processing space.

[0019] By performing the alignment and approach before the evacuation, a local evacuation can advantageously take place afterwards, avoiding alignment errors. Furthermore, only the local processing space can advantageously be evacuated. Evacuation of the device or the entire module is therefore not necessary. In this way, particularly fast and efficient processing of the substrate is possible. In a preferred embodiment of the processing method, it is provided that the processing space is formed by controllable sealing means. In other words, no approach to form the processing space takes place; instead, the processing space is sealed by the sealing means. The substrate can, for example, be loaded from the side, so that the design of the device can be particularly small.This means that only a small space needs to be evacuated, so that processing time can be reduced.

[0020] In a preferred embodiment of the processing method, it is provided that the device has a flexible foil stamp for processing, in particular for embossing, the substrate. During processing of the substrate, a fluidically sealed rinsing chamber between the device and the foil stamp is rinsed to bend the foil stamp, wherein the processing chamber and the rinsing chamber are fluidically separated from one another by the foil stamp. In other words, two different pressure zones are formed in the device, which are fluidically separated from one another by the foil stamp, so that the foil stamp can be deformed in a targeted manner for embossing and demolding by the pressure differences. The rinsing chamber is rinsed with a fluid by rinsing agents, which can also be designed as evacuation agents, so that the foil stamp is curved or bent towards the substrate.The stamping force and deformation of the foil stamp can be advantageously adjusted by the pressure difference. Furthermore, demolding after processing or stamping can be advantageously carried out or supported more gently by reducing the pressure difference. The pressure in the processing area can also be adjusted accordingly.

[0021] The rinsing chamber is at least partially formed by rinsing with a fluid containing the rinsing agent, since the foil stamper rests directly against a section of the device and / or a foil frame. However, it is also conceivable that part of the rinsing chamber is already formed due to the design of the foil frame or the device, and that this rinsing chamber is further enlarged by the rinsing. The foil stamper seals the rinsing chamber from the processing chamber. This enables particularly gentle and error-free embossing, especially nano-embossing.

[0022] In a preferred embodiment of the processing method, a pressure difference between the pressure in the processing chamber and the rinsing chamber is set between 0 and 800 mbar, preferably between 100 and 600 mbar, and even more preferably between 200 and 600 mbar for processing, in particular for embossing. In other words, the prevailing pressure in the processing chamber and the prevailing pressure in the rinsing chamber are regulated to achieve a desired embossing force and deformation of the foil stamp. A pressure difference in the aforementioned ranges has proven particularly advantageous in tests.

[0023] In a preferred embodiment of the processing method, it is provided that the substrate is aligned relative to processing means of the device in the formed processing space. The processing means can be, for example, embossing means, bonding or debonding means or other processing means for which a precise relative alignment to the substrate is advantageous. Because the substrate is aligned relative to the processing means of the device during alignment, particularly precise alignment before evacuation is possible. Indirect alignment of the substrate to the processing means by aligning the substrate receiving device or the device is also conceivable, wherein alignment marks are preferably used. In a preferred embodiment of the processing method, it is provided that the alignment of the substrate is carried out at normal pressure.In other words, the evacuation only takes place after the substrate has been aligned and the processing space has been formed. Normal pressure is the pressure prevailing in the device under normal conditions. If the device is loaded with the substrate at ambient pressure, this pressure is, in particular, the prevailing atmospheric pressure. The approach also takes place at normal pressure. This allows the processing process to be carried out particularly efficiently. Furthermore, alignment can be carried out with particular precision at normal pressure.

[0024] In a preferred embodiment of the processing method, the substrate is released during processing in step e). The substrate can then freely interact with processing media during processing in the evacuated processing space. In this way, a particularly good processing result can be achieved, for example, in embossing processes.

[0025] In a preferred embodiment of the processing method, it is provided that the processing in step e) comprises full contacting of the substrate with the foil stamp. The substrate is thus embossed or contacted with the embossing stamp in the evacuated processing space. For example, a lacquer previously applied to the embossing stamp can be incorporated into structures, preferably nanostructures, on the substrate or a specific structure can be embossed into the substrate. The embossing stamp is flexible and can adhere particularly freely to the substrate, so that embossing can be carried out particularly precisely and freely in the evacuated processing space. The substrate and the embossing stamp lie completely against one another, enabling full-surface embossing.

[0026] In a preferred embodiment of the processing method, it is provided that the foil stamp is at least partially released during processing in step e) after complete contact with the substrate, so that the foil stamp can relax on the substrate. In the local and evacuated processing space, the flexible foil stamp is thus at least partially lifted or moved after complete contact so that a particularly free relaxation of the foil stamp on the substrate can occur. For this purpose, the foil stamp is preferably deformed or released using rinsing agents. The rinsing agents are arranged in particular on a rear side of the foil stamp facing away from the substrate, so that when rinsed with a fluid, a slight overpressure is created in relation to the pressure otherwise prevailing in the evacuated processing space, so that the foil stamp is released from a holding surface.The foil stamp does not have to be in contact with the foil receiving device. Preferably, the flushing agent does not flood the entire processing area, but rather only creates a small overpressure in the area of ​​the back of the foil stamp to release the foil stamp. In this way, particularly precise and gentle embossing can take place in the processing space. In this embodiment of the method for processing and embossing, it is provided that two pressure zones are present and these are separated by the foil stamp. The processing space in the area of ​​the back of the foil stamp is fluidically separated from the rest of the processing space, in particular by the foil stamp itself. A first pressure zone is defined by the design of the processing space, which can be evacuated. A second pressure zone is located in the area of ​​the back of the foil stamp (flushing zone).This second pressure zone can be flooded with detergent.

[0027] In a preferred embodiment of the processing method, it is provided that a foil frame for receiving the foil stamp remains fixed to the device. The foil stamp is preferably fixed or clamped on or to a foil frame. The foil frame can thus be fixed to the foil receiving device independently of the foil stamp and can advantageously remain fixed during release or flushing. In this way, the foil stamp remains fixed to the frame in a preferred embossing position, whereby the foil stamp can still adhere particularly well to the substrate. In other words, the foil stamp can relax particularly well to the substrate when the frame is further fixed.

[0028] In a preferred embodiment of the processing method, the rinsing agents additionally increase the pressure in the rinsing chamber during processing, so that an embossing force for embossing the substrate can be adjusted. Particularly preferably, the pressure in the processing chamber is kept constant. This allows the foil stamper to contact or emboss the substrate particularly evenly and gently. This allows the foil stamper to relax on the substrate. During the embossing process, the filling of the foil stamper's structures by capillary forces is additionally supported by the (slight) rear-side overpressure in the rinsing chamber.

[0029] In a preferred embodiment of the processing method, the pressure difference between the pressure in the processing chamber and the pressure in the rinsing chamber is used to demold the foil stamp from the substrate. The pressure in the processing chamber is preferably kept constant. In other words, by reducing the pressure in the rinsing chamber or by evacuating it, the foil stamp can advantageously withdraw from the embossing compound.

[0030] In a preferred embodiment of the processing method, the device is configured such that embossing and demolding are controlled automatically by regulating the pressure in the processing chamber and the pressure in the rinsing chamber. The resulting pressure difference between the two pressure zones is used to generate external forces acting on the foil stamp during embossing and demolding.

[0031] Furthermore, the invention relates to a device for processing a substrate, at least comprising i) a substrate receiving device for receiving the substrate, ii) a device for processing the substrate, iii) means for forming a local and fluidically tight processing space between the substrate receiving device and the device, iv) evacuation means for evacuating the processing space and v) processing means for processing the substrate.

[0032] The aforementioned advantages and features of the method for processing a substrate apply analogously to the device. The device is preferably configured such that evacuation of the forming processing space by the evacuation means can only be carried out after alignment. The processing space is arranged at least partially, preferably completely, between the substrate receiving device and the device.

[0033] The processing means are at least partially arranged in the processing chamber or can act on the substrate in the processing chamber. The processing chamber is evacuated during processing. The processing means can, in particular, be embossing means, bonding or debonding means, laser processing means, or other means. Furthermore, the processing means can also at least partially form the sealing means. This enables particularly efficient processing of the substrate in the processing chamber.

[0034] The device is preferably designed so that the substrate can be released. The device thus allows for particularly precise alignment and processing of the substrate in the processing space. The device is thus ideal for efficient and precise processing of a substrate or a substrate stack in a vacuum, particularly for nanoimprinting of substrates.

[0035] In a preferred embodiment of the device for processing substrates, the means are proximity means for bringing the substrate receiving device and the device closer together. In other words, the processing space is advantageously formed quickly and directly by a relative movement of the device and / or the substrate receiving device. In this way, a local processing space can advantageously be formed between the two components.

[0036] In a preferred embodiment of the device for processing substrates, the device additionally comprises alignment means for aligning the substrate receiving device and the device with respect to one another, wherein the alignment means are configured such that the substrate receiving device and the device can be aligned with respect to one another before and / or during the action of the approaching means. The alignment can also comprise an adjustment. In this way, the processing space can be precisely formed. Furthermore, the alignment of the substrate with respect to the processing means can advantageously be carried out simultaneously by the alignment means. Fine alignment of the substrate after the formation of the processing space can additionally be carried out if required.

[0037] During alignment and / or approach, the substrate receiving device and the device are aligned to each other in such a way that optimal processing and an optimal processing result are possible. Precise alignment is particularly necessary for embossing or bonding processes. By aligning the substrate receiving device and the device to each other, the substrate can also be precisely aligned or positioned.

[0038] The substrate is preferably secured in the substrate receiving device using fixing elements. The approach and alignment are performed, for example, by actuators. The alignment and approach can also be performed in different sequences. It is also conceivable to first align, followed by an approach of the substrate receiving device and the device. After the approach and the formation of the processing space, an additional alignment can be performed. It is also conceivable to perform the approach and alignment in parallel.

[0039] By bringing the substrate receiving device and the device closer together, a local and fluidically sealed processing space is created around the substrate. This processing space can be evacuated and is formed at least partially between the two receiving devices. The processing space can be formed by seals, which are preferably attached at least to the substrate receiving device. A part of the substrate receiving device or the device can also form the seals. A sealing ring is preferably used to seal or form the processing space. If the seals are formed on the substrate receiving device and on the device, they are preferably corresponding sealing elements.

[0040] By performing the alignment and approach before evacuation, evacuation can advantageously be performed afterward, avoiding alignment errors. Furthermore, only the local processing space can be evacuated. Evacuating the device or the entire module is therefore unnecessary. This enables particularly fast and efficient processing of the substrate.

[0041] In a preferred embodiment of the device for processing substrates, it is provided that the substrate receiving device and the device have corresponding sealing means, wherein the approach means are configured such that, after the approach means have acted, the corresponding sealing means form the processing space between the substrate receiving device and the device. In other words, part of the processing space is formed by the sealing means. The sealing means can be configured such that, for example, engagement is possible at several points, so that in this way the substrate can advantageously be aligned with the processing means simultaneously. The processing space can thus advantageously be formed in different positions of the device and the substrate receiving device.

[0042] In a preferred embodiment of the device for processing substrates, the means are controllable sealing means for forming the processing space between the substrate receiving device and the device. Thus, there is no direct approach between the device and the substrate receiving device. Rather, the sealing means seals the space between the device and the substrate receiving device, thus forming the processing space. In this way, the processing space can advantageously be formed quickly and efficiently. Furthermore, alignment of the substrate receiving device and the device with respect to one another can be omitted or can be performed in advance.

[0043] In a preferred embodiment of the device for processing substrates, the substrate receiving device and the device are formed as a single piece. This enables a particularly compact design of the device. In addition, the single-piece design eliminates the need for alignment of the substrate to the processing means, or this can be done when the device is loaded with the substrate, preferably by inserting the substrate from the side or parallel to the receiving surface of the substrate receiving device. This avoids positioning errors and provides a processing space with a particularly small volume for the efficient formation of a vacuum. In a preferred embodiment of the device for processing substrates, the processing means comprise a flexible foil stamp for embossing, in particular for nano-embossing, the substrate.A flexible foil stamp is ideal for use in this device. The foil stamp can be provided in a foil frame. Particularly preferred is that the foil stamp forms part of the processing area or an outer edge.

[0044] In a preferred embodiment of the device for processing substrates, the device additionally comprises rinsing means for forming a fluidically sealed rinsing chamber between the device and the foil stamp, wherein the rinsing chamber is fluidically separated from the processing chamber by the foil stamp, and wherein the foil stamp can be deformed in a targeted manner by the rinsing means. The rinsing means are, for example, valves via which the rinsing chamber can be flooded or evacuated. In other words, the pressure can be adjusted by the corresponding amount of fluid on the side of the foil stamp facing away from the processing chamber, so that the foil stamp can be deformed in a targeted manner or bent towards the substrate. The rinsing chamber is formed at least partially by the foil stamp. The device itself or also partially a foil frame can also define the rinsing chamber.The foil stamp can initially rest against the device or a foil frame with the side facing away from the processing space, so that the rinsing space is only formed when a fluid is introduced by the rinsing agent. It is also conceivable for part of the rinsing space to already be provided by the geometry of the device and / or the foil frame. In this case, the rinsing space is enlarged by the rinsing agent, whereby the foil stamp is deformed towards the substrate. In this way, particularly gentle and error-free embossing is possible. In a preferred embodiment of the device for processing substrates, the device is set up such that a pressure difference between the pressure in the processing space and the rinsing space can be set to between 0 and 800 mbar, preferably between 100 and 600 mbar, even more preferably between 200 and 600 mbar.In other words, a pressure difference is set in the aforementioned areas to specifically adjust the deformation and stamping force. The pressure difference is preferably controlled by the flushing agent as a function of a constant pressure in the processing chamber. In this way, the flushing agent can advantageously initiate the stamping process.

[0045] In a preferred embodiment of the device for processing substrates, the rinsing agents simultaneously serve as evacuation agents, so that the foil stamp can be demolded from the substrate by evacuating the rinsing chamber. In other words, by evacuating the rinsing chamber with the rinsing agents, the stamping force can be reduced or the deformation during stamping can be reduced. In this way, the foil stamp can be advantageously gently demolded from the substrate or an embossing compound provided thereon after stamping.

[0046] The pressure in the area of ​​the back of the foil stamp or in the rinsing chamber is set between 1 mbar and 1500 mbar, preferably between 1100 mbar and 1250 mbar.

[0047] In a preferred embodiment, after alignment, a rough vacuum is set between the foil stamp and the substrate in the processing space.

[0048] During evacuation, the pressure in the embossing chamber is less than 500 mbar, preferably less than 300 mbar, and most preferably less than 250 mbar. In particular, a rough vacuum of between 300 mbar and 1 mbar is preferably set, most preferably between 250 mbar and 100 mbar. In a preferred embodiment, in addition to the rough vacuum in the processing chamber, during and / or after the (full-surface) contact between the foil stamp and the substrate coated with embossing compound, the pressure in the region of the rear side of the foil stamp (rinsing zone) is preferably set between 1,100 mbar and 1,250 mbar.

[0049] The pressure difference between the processing chamber and the area on the back of the foil stamp (rinsing zone) or the rinsing chamber is also used to demold the foil stamp from the embossing compound. For example, the pressure in the processing chamber is set to normal pressure, while the pressure in the area on the back of the foil stamp (rinsing zone) is set between 1100 mbar and 1500 mbar.

[0050] In a preferred embodiment of the device for processing substrates, the pressure difference between the processing chamber and the back of the foil stamp is used to actively control the embossing and demolding process. This generates external forces that are used to process the substrate. The range of the generated forces, in particular the embossing forces, is preferably between 100 N and 10 kN.

[0051] In a preferred embodiment of the device for processing substrates, it is provided that the processing space can be formed between the substrate receiving device and the device in the region of the substrate, so that the substrate can be arranged entirely within the processing space. In this way, commercially available wafers or other semiconductor elements, in particular, can be processed efficiently in the processing space.

[0052] In one embodiment of the device for processing substrates, the processing means comprise bonding means, preferably for bonding flexible substrates and / or film substrates fixed to film frames. In this way, particularly efficient processing of the substrate in the processing space is possible through flexible joining and contacting during bonding. For example, electronic and / or optical components, in particular chips (die), which are applied to a thin (carrier) substrate, can be bonded to a second substrate, in particular a wafer (chip-to-wafer bonding).

[0053] In a preferred embodiment of the device for processing substrates, the processing means comprise embossing means, preferably a flexible embossing die, for embossing the substrate. The device is predestined for particularly precise and efficient embossing in a vacuum. The flexible embossing die is a soft die. The embossing die can itself have structures that are transferred to the substrate or molded onto the substrate. In addition, the flexible embossing die can also apply lacquers or other materials to the substrate. Especially in a vacuum, embossing with embossing means can be carried out particularly precisely and efficiently. The embossing means and / or the substrate particularly preferably have micro- or nanostructures, so that particularly small structures can advantageously be produced or embossed.

[0054] In a preferred embodiment of the device for processing substrates, the device is a foil stamp receiving device, and the embossing means comprise a foil stamp. The foil stamp receiving device is particularly suitable for use in the device as a device, since a received foil stamp can carry out the structuring of the substrate in the evacuated processing or embossing space with particular precision.

[0055] In a preferred embodiment of the device for processing substrates, the foil stamp receiving device has a frame that can be fixed to the foil receiving device for receiving the foil stamp. The frame accommodates the foil stamp in one piece and is preferably fixed to the foil receiving device by fixing means of the foil receiving device. This allows for an advantageous indirect and flexible arrangement of the foil stamp on the foil receiving device. This allows for particularly good processing or stamping results. In addition, when a substrate is released, it can rest particularly well against the foil stamp in a position for stamping. The substrate is preferably held to the foil stamp fastened in the frame by capillary forces.

[0056] In a preferred embodiment of the device for processing substrates, it is provided that the foil stamp can be at least partially released in the processing space by means of flushing agent. In other words, at least one flushing agent is present on the back of the foil stamp in the region of the holding surface of the foil receiving device, which enables partial flooding of the processing space during processing or embossing. The foil stamp held in the frame is thus advantageously at least partially releasable. The foil stamp can thus be lifted and thus released by targeted flooding on the back of the foil stamp, so that particularly good contact with or relaxation of the substrate in the processing space can take place. The processing space in the region of the back of the foil stamp is fluidically separated from the rest of the processing space, in particular by the foil stamp itself.The frame particularly preferably remains fixed during rinsing with the rinsing agents, so that the position of the foil stamp relative to the substrate can be advantageously specified.

[0057] In a preferred embodiment of the device for processing substrates, it is provided that the processing space is at least partially formed by the frame. In other words, the frame represents a boundary of the processing space. Particularly preferably, the sealing means are at least partially formed by the frame. In this way, the local and fluidically tight processing space can be provided particularly easily. In a preferred embodiment of the device for processing substrates, it is provided that the sealing means are arranged on the substrate receiving device and / or the film receiving device in such a way that the frame can be arranged completely within the processing space. In other words, the sealing means are arranged outside, in particular in the region of the periphery of the receiving devices.Thus, a particularly advantageous arrangement of the frame and the foil stamp can be carried out completely in the processing space.

[0058] A particularly important aspect is that the process and processing device enable nanoimprinting with very precise overlay alignment. This advantageously allows for optimal control of the contact between the substrate and stamp. The filling behavior of nanostructures, especially those with a low residual layer, is best achieved with flexible stamps that can relax on the substrate. In particular, controlled contact and stamping are possible despite the soft and flexible imprinting media.

[0059] The idea is to first fix and align the stamp, then apply a vacuum between the substrate and stamp to prevent air pockets, and then establish contact by controlled bending of the substrate and / or stamp and / or initiating an imprinting wave. This process or method enables efficient nanoimprinting in a vacuum with precise control of surface contact for flexible stamps.

[0060] In addition, particularly precise control of the contact between the stamp and the substrate is possible, while the rigidity of the substrate simultaneously allows highly precise alignment to each other.

[0061] One of the advantages of the method and device is that it does not require a flexible stamp.

[0062] Furthermore, the entire fixtures do not need to be loaded and adjusted in a vacuum. This allows for faster contact than with SmartNIL (W02014 / 037044A1), despite the vacuum, and thus higher throughput.

[0063] A particularly important aspect is vacuum embossing with a flexible foil stamper. The alignment of stamper and substrate takes place at atmospheric pressure, creating a locally evacuatable embossing space between the upper and lower holding devices when the holding devices are sufficiently close together. This allows for simplified contacting and embossing in a vacuum. Contact between the substrate and stamper foil is established by controlled bending of the substrate and / or the foil stamper and initiation of an embossing wave. This enables nano-embossing with very precise overlay alignment and without air inclusions using foil stampers.

[0064] In the following, the terms stamp, foil stamp, embossing stamp, and nanostructure stamp are used synonymously. Furthermore, structuring and embossing refer to the creation of micro- and / or nanostructures.

[0065] Another important aspect is the contacting, whereby by pre-stressing the substrate and / or the foil stamp, initially only a partial surface is contacted and then, an automatic contact of the contact surfaces is effected, whereby preferably the entire substrate surface is embossed with a thin, flexible foil stamp in a vacuum in an embossing space locally delimited by seals, without repeating the aforementioned steps.

[0066] Another particularly important aspect is that the alignment of the substrate and foil stamp initially takes place under normal pressure. Only then, after sufficient proximity of the upper and lower holding devices and contact via seals, does a locally confined embossing chamber emerge, which is actively evacuated. The substrate and foil stamp are first fixed and aligned, then a vacuum is created between the substrate and foil stamp in the embossing chamber to prevent air pockets. Finally, contact between the substrate to be embossed and the foil stamp is established through controlled bending of the substrate and initiation of an embossing wave.

[0067] The embossing front is initiated, in particular, by an actuator in the center. As the embossing front expands, the structured stamping surface is pressed into the curable material, especially resist, on the substrate, replicating the structures of the foil stamp. This process is ideal for embossing a first layer or a second layer in combination with precise alignment (SmartView Alignment).

[0068] The coating of the stamp and / or the substrate can optionally be carried out separately from the embossing process in a separate module.

[0069] A key advantage is that alignment takes place at ambient pressure, allowing the fully coated substrates to be contacted and embossed in a vacuum without defects. This eliminates the positioning errors caused by substrate movement, which can occur particularly in an evacuatable environment. The locally confined embossing chamber allows for relatively rapid evacuation compared to systems in which the entire embossing module must be evacuated.

[0070] For embossing with flexible stamps in a vacuum, foil frames or other stamp holders with frames are used. The frame can also be used to define the vacuum zone or the evacuatable embossing chamber. In a preferred embodiment, only a (rough) vacuum is set between the foil stamp and the substrate in an embossing chamber, so the entire embossing module does not need to be evacuated.

[0071] Before embossing, the substrate and stamp are aligned as precisely as possible. Alignment is usually achieved using alignment marks. The basic system can be provided, in particular, by an EVG SmartView system. It's not necessary to see between the substrate and the foil stamp because the foil stamp is preferably predominantly transparent. This advantageously prevents alignment from being hindered by the foil stamp, as alignment optics can see through the foil stamp.

[0072] The embossing device consists in particular of a stamp receiving device and a device for receiving a nanostructure stamp. The nanostructure stamp, in particular a foil stamp, is preferably clamped in a foil frame.

[0073] According to an advantageous embodiment, a detection device ensures the exact alignment of the substrate and the foil stamp by detecting the relative positions and passing them on to the control unit, which then aligns the substrate and the foil stamp with each other.

[0074] The system preferably has a system for contactless wedge error compensation between the parallel aligned foil stamp and substrate, as described and referenced in detail in WO2012 / 028166A1.

[0075] A major challenge in embossing lies in the embossing process itself, i.e., from the initiation of the embossing wave, following the point-like, central contact, to the complete contact of the contact surfaces of the substrate and foil stamp. During this time, the alignment can change significantly compared to the previous alignment. For nanoembossing with very precise overlay alignment, it is necessary to optimally control the contact between the substrate and foil stamp. The deposition / contacting of the substrate and foil stamp is particularly critical, as errors can occur here, and these errors can accumulate.

[0076] In the critical step of contacting the aligned contact surfaces of the substrate and the foil stamp, ever more precise alignment accuracy, or offset, is desired. The alignment error is less than 100 pm, in particular less than 10 pm, preferably less than 1 pm, most preferably less than 100 nm, and most preferably less than 10 nm.

[0077] The contacting of the contact surfaces and the embossing of the corresponding surfaces by means of the devices takes place in particular at an embossing initiation point. Nanoimprinting of the substrate with the foil stamp is carried out along an embossing front running from the embossing initiation point to the side edges of the foil stamp by detaching the substrate and / or the foil stamp from the receiving surface.

[0078] The speed of the embossing wave can also be controlled by controlled release of the substrate and / or the foil stamp. Preferably, the fixation elements are divided into separately controllable zones. Vacuum fixation is preferred.

[0079] A pin in the central bore or a line from which overpressure can be generated between the substrate holding device and the substrate by introducing a gas serves to controllably deflect the fixed substrate (curvature means and / or curvature-changing means). Other deformation means, such as the application of a fluid, are conceivable.

[0080] In a further embodiment, a pin in the central bore or a line from which an overpressure can be generated by an introduced gas between the foil stamp receiving device and the foil stamp serves for the controllable deflection of the fixed foil stamp (curvature means and / or curvature changing means).

[0081] Preloading and contacting at the imprinting initiation point are described and referenced in detail in WO2015 / 161868A1. Therefore, a detailed description is omitted here.

[0082] In a first embodiment, the substrate is fixed to the upper support device and, after contacting, is pulled downward in a controlled manner, partly by gravity and partly by a force acting along the embossing wave and between the substrate and the stamp. This results in the formation of a radially symmetrical embossing wave, which runs particularly from the center to the side edge. The formation of an embossing wave is not limited to a radially symmetrical embossing wave. In an alternative embodiment, the formation of a linear embossing wave is desired. For this purpose, contacting takes place at the substrate edge, and the linear embossing front spreads away from the edge point.

[0083] In a second, preferred embodiment, the substrate is fixed to the lower support device. During pre-tensioning and contacting at the embossing initiation point, only the fixing means in the edge area of ​​the substrate support device are used. As soon as the substrate comes into contact with the foil stamp, the fixation from the substrate coated with embossing compound is released by breaking the vacuum. By reducing the negative pressure at the support surface, detachment from the substrate can be carried out in a controlled manner. The fixing elements are controlled accordingly. The foil stamp remains fixed to the stamp support device.

[0084] In a third preferred embodiment, the substrate is fixed to the lower receiving device and the foil stamp fixed to the upper receiving device is bent by deformation means to contact the substrate and foil stamp. The distance between the substrate and foil stamp is first reduced to a precisely defined distance before the embossing process is started. In the embossing process, the substrate and foil stamp are not placed flat on top of each other, but are first brought into contact with each other at a point, e.g. the center M of the substrate or an edge point R of the substrate, by the foil stamp being lightly pressed against the substrate by deformation means and thereby deformed. After the deformedWhen the foil stamp is bent (in the direction of the opposite substrate), continuous and uniform embossing occurs along the embossing front due to the advance of a radially symmetrical or linear embossing wave.

[0085] Another unique feature of the proposed invention is that, after full-surface contact between the foil stamp and the substrate, the flexible foil stamp is "released" by a slight rearward overpressure via flushing valves, while the foil frame remains fixed. This allows the foil stamp to relax on the substrate. Capillary forces fill the structures, and the flexibility provided at this point allows the foil stamp to conform to the substrate surface. This enables high-resolution surface structuring. The flushing or pressure increase in the area of ​​the rear side of the foil stamp (flushing zone) – with constant pressure or vacuum in the processing area – is used to relax the foil stamp on the substrate but also to ensure a uniform application of force during embossing.During the embossing process, the filling of the structures of the foil stamp is supported by capillary forces and the (light) overpressure on the back. This advantageously shortens the embossing time.

[0086] To ensure the highest possible alignment accuracy, a first embodiment provides for the imprint to be cured and demolded externally. After the embossing process in the alignment and embossing module, the stack is transferred to an unloading station, and then, in the curing and detachment module, the varnish is cross-linked by the transparent foil stamp using electromagnetic radiation, particularly UV light. In a second embodiment, curing and demolding also take place in the embossing module. Thus, only one module is required for alignment, embossing, curing, and demolding, which optimizes process times.

[0087] The UV light used is either broadband or specifically matched to the photoinitiator used in the embossing varnish. The wavelength range of the curable material is generally between 50 nm and 1000 nm, preferably between 150 nm and 500 nm, and more preferably between 200 nm and 450 nm.

[0088] In an alternative embodiment, the embossing compound can also be thermally cured. Thermal curing occurs between 0°C and 500°C, preferably between 50°C and 450°C, more preferably between 100°C and 400°C, most preferably between 150°C and 350°C, and most preferably between 200°C and 300°C.

[0089] At the end of the process, the foil stamp is removed from the substrate, and the substrate is unloaded. The system preferably has force monitoring sensors to control the demolding step.

[0090] In an exemplary embodiment of the method for processing or embossing a substrate with a flexible foil stamp, in a general embodiment, the method comprises in particular the following steps, preferably in the following order: a) Substrate coating or lacquering by means of an application device, e.g.a spin coating system, b) adjustment of substrate and foil stamp by means of an adjustment device at normal pressure, c) approach of the upper and / or lower holding device until the evacuable embossing space is formed by sealing, d) evacuation / formation of the vacuum in the defined embossing space between foil stamp and substrate, e) embossing of the substrate in a vacuum with start of the imprinting process by an actuator on the substrate and / or on the foil stamp and embossing shaft, f) release of the substrate fixation, g) gas purging behind the foil stamp for foil relaxation and control of the embossing process, h) UV exposure of the curable material and i) demolding of foil stamp and substrate, in particular by evacuating the rinsing space using the rinsing agent.

[0091] If the device for processing substrates is disclosed in connection with bonding means, point a) more generally includes possible pre-processes such as cleaning, surface activation, imprinting, etc.

[0092] The processing device is preferably disclosed in connection with the production or embossing of micro- and / or nanostructures. A substrate can be fixed, in particular, with an embossing compound on a substrate receiving device, and a structural stamp can be brought into contact with the embossing compound. The fixation of the substrate can be at least partially removed, and the embossing compound can be cured, with the embossing compound being removable from the structural stamp.

[0093] The stamp is particularly preferably an imprint stamp for use in imprint technology. The stamp is preferably designed as a soft stamp for imprinting substrates. The stamp is preferably produced in series with a backplane, whereby the stamp and backplane can generally consist of different materials. The use of several different materials leads to the individual or combined stamps produced from them being referred to as hybrid stamps. The backplane can serve to stiffen the stamp, but backplates that are very flexible and serve only as a carrier for the stamp are preferred. The backplate can, for example, be a film or be made of glass. The backplate is preferably made of a film.The back plate then has in particular a thickness which is less than 1000 pm, preferably less than 500 pm, more preferably less than 250 pm, most preferably less than 100 pm.

[0094] In another embodiment, the backplate is a very thin and flexible glass plate. The glass plate is in particular thinner than 10 mm, preferably thinner than 5 mm, even more preferably thinner than 1 mm, most preferably thinner than 500 μm, most preferably thinner than 100 μm, and most preferably thinner than 10 μm.

[0095] In particular, technical glasses with an adjusted coefficient of thermal expansion (CTE) are preferred.

[0096] A special type of soft stamp is the foil stamp, which consists of a thin foil onto which micro- and / or nano-embossed structures are applied. The foil and embossed structures form the soft stamp. Hard stamps are used as master stamps to create the soft stamp, a negative of the hard stamp. The embossing compound for stamp production is applied to the foil, which serves as the backing plate. After the master stamp is removed from the hardened embossing compound, the resulting stamp preferably remains on the backing plate, especially on the foil.

[0097] The soft stamp consists in particular of one of the following materials:

[0098] • Thermoplastic,

[0099] • Elastomer and / or

[0100] • Duroplast.

[0101] The foil stamp consists in particular of at least one of the following materials:

[0102] • Poly(organo)siloxanes (silicone), in particular polyhedral oligomeric silsesquioxane (POSS) and / or

[0103] Polydimethylsiloxane (PDMS),

[0104] • Perfluoropolyether (PFPE) and / or

[0105] • Tetraethyl orthosilicate (TEOS).

[0106] For vacuum embossing with flexible stamps, foil frames or other stamp holders with frames are preferred. The nanostructure stamp, especially a foil stamp, is clamped within the frame.

[0107] The frame on the foil stamp allows for quick and easy stamp changes, particularly thanks to the automation of the foil stamp change process. Film frames, which are industrially standardized, are preferred.

[0108] The foil stamp with frame is preferably larger than the substrate. The frame is used to define the local vacuum zone or the evacuable stamping space. In a first embodiment, when the upper and lower holding devices are sufficiently close together, an annular seal of the substrate holding device contacts the frame, creating an evacuable stamping space between the foil stamp with frame and the substrate. In another embodiment, the contact point is located directly behind the frame.

[0109] The foil stamp is predominantly UV-transparent. The wavelength range for optical transparency is primarily between 100 nm and 1000 nm, preferably between 150 nm and 500 nm, more preferably between 200 nm and 450 nm, most preferably between 250 nm and 450 nm. The foil stamp can also be transparent to other ranges of electromagnetic radiation. The foil stamp can also be transparent, particularly in the infrared range.

[0110] In a separate embodiment, the embossing compound is thermally cured. In this embodiment, the foil stamp does not need to be transparent to electromagnetic radiation and consists, in particular, of a metallic foil. The foil stamp, which is particularly flexible, consists, in particular, of at least one of the following materials:

[0111] • Plastic

[0112] • Metal,

[0113] • Metal alloy.

[0114] The substrates can have any shape, but are preferably circular. The diameter of the substrates is, in particular, industrially standardized. For wafers, the industry-standard diameters are 1 inch, 2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, 12 inches, and 18 inches. However, the embodiment can fundamentally handle any substrate, regardless of its diameter.

[0115] When aligning the foil stamp and the substrate, they are aligned relative to each other, in particular using optical aids. The alignment is carried out in particular using alignment marks located on the foil stamp and the substrate, with the substrate and foil stamp having at least two alignment marks. This achieves very precise positioning of the foil stamp relative to the substrate. The foil stamp and / or the substrate are transparent to the electromagnetic radiation used for alignment. In particular, the foil stamp is transparent to the electromagnetic radiation used for alignment.

[0116] The substrate, foil stamp frame, and stamp backplate are secured to the corresponding receiving device by at least one fixing element. The fixing elements can be switched on and off. The fixing elements are preferably

[0117] Vacuum fixations, especially with

[0118] Individually controllable vacuum tracks and / or several interconnected vacuum tracks (vacuum segments),

[0119] Mechanical fixations, especially clamps,

[0120] Electrical fixations, especially

[0121] Electrostatic fixations and / or

[0122] Magnetic fixations,

[0123] Adhesive fixations.

[0124] The fixing elements for the substrate, foil stamp frame, and foil stamp backplate are preferably vacuum fixators. At least one fixing element is, in particular, electronically controllable.

[0125] The vacuum fixation preferably consists of several vacuum tracks that exit the holding surface of the receiving device. The vacuum tracks can preferably be controlled individually.

[0126] In a preferred embodiment, several vacuum tracks are combined into vacuum track segments that can be individually controlled and thus evacuated or flooded. However, each vacuum segment is independent of the other vacuum segments. This makes it possible to construct individually controllable vacuum segments.

[0127] Such individually controllable vacuum tracks or vacuum segments are used in the holding surface of the foil stamp receiving device to create separate fixing elements or fixing zones for the

[0128] • Foil stamp frame,

[0129] • Outer area of ​​the back plate without structuring and / or

[0130] • Define the stamping area of ​​the back plate with structuring for improved control of the stamping process.

[0131] Vacuum segments for substrate fixation on the substrate receiving device are preferably designed in a ring shape. This enables targeted, radially symmetrical fixation and / or release of the substrate from the substrate receiving device, particularly from the inside out. Alternatively, a linear fixation and / or release of the substrate and / or foil stamp from the receiving device is also possible.

[0132] In a first embodiment of the foil stamp and / or substrate receiving device, a pin in the central bore or a line from which overpressure can be generated by an introduced gas between the holding surface of the substrate receiving device and the substrate serves to controllably deflect the fixed foil stamp and / or substrate. The foil stamp or substrate remains fixed in a ring-shaped manner in the edge area.

[0133] In a second embodiment of the foil stamp and / or substrate receiving device, an inner vacuum segment, which serves as a vacuum fixation, can be switched so that a gas and / or a gas mixture can be pumped into the space between the holding surface of the receiving device and the back of the foil stamp or substrate, for controllable deflection of the foil stamp and / or substrate fixed at the edge. The at least one fixing element can then be used simultaneously as a curving means after switching. The design of the vacuum zones or the vacuum segments enables active control of the pressure zones as a curving means for embossing.

[0134] The selection of the introduced process gases as a gas and / or gas mixture can have an additional influence on the processing of substrates (embossing, imprinting, bonding). For example, a deionizing gas can be used to combat static charge, or slightly humidified helium (He) or nitrogen (N2) gas can be used to regulate humidity.

[0135] A key advantage of the device is that the alignment or adjustment of substrate and foil stamp is carried out with high precision under normal pressure and that defect-free and simplified embossing in a vacuum is then possible by creating a local, spatially limited and evacuatable embossing space.

[0136] The foil stamp frame can also be used to define the vacuum zone or the evacuable embossing space.

[0137] A defined area or processing space is sealed by means of seals, in particular ring seal(s) between the upper and lower receiving device.

[0138] In a preferred embodiment, the ring seal(s) are located on the substrate receiving device.

[0139] The evacuable embossing chamber is created by bringing the upper and lower receiving devices closer together until the evacuable embossing chamber is formed by sealing after contacting the stamp receiving device and the substrate receiving device equipped with an annular seal(s). In a preferred embodiment, the seals are located after the foil stamp frame, so that the entire foil stamp frame is located in the embossing chamber.

[0140] Located in the area of ​​the embossing chamber, preferably in the substrate receiving device, are vacuum inlets for the active evacuation of the embossing chamber. According to one embodiment of the invention, the inlets are either attached vacuum holes or comparable vacuum elements, with the aid of which the embossing chamber can be evacuated in a controlled manner.

[0141] In a preferred embodiment, only a rough vacuum is set between the foil stamp and the substrate in the locally limited embossing space.

[0142] A particular advantage of the embodiments and processes is that the entire device or the entire embossing module does not need to be evacuated. The embossing chamber is thus only evacuated when a vacuum is required. The smaller space that must be evacuated allows for simplified embossing in a vacuum. In particular, the alignment and adjustment of the substrate and foil stamp is first performed at normal pressure. Subsequently, to ensure defect-free embossing, the embossing process is only performed after the embossing chamber has been evacuated.

[0143] After the embossing process, the substrate and foil stamp are preferably in full-surface contact. After full-surface contact between the foil stamp and the substrate, the flexible foil stamp can be lifted off by applying slight overpressure via flushing valves. The flushing valves are preferably located in the outer area of ​​the back plate or the foil. This outer area has no structure and is not part of the stamping surface. During this time, the foil stamp frame remains fixed to the stamp holder so that the foil stamp can relax on the substrate. Capillary forces fill the structures, and the flexibility provided at this point allows the foil stamp to conform to the substrate surface. This enables high-resolution surface structuring.

[0144] The stamp receiving device has, in particular, at least one flushing valve for lifting the foil stamp from the rear of the holding surface of the receiving device. Preferably, the at least one flushing valve is a fluid element through which a gas and / or gas mixture can flow out to create an overpressure between the holding surface of the stamp receiving device and the foil stamp. The flushing valves are preferably located in the outer region of the back plate or the foil. This outer region has no structure and is not part of the stamp surface.

[0145] In a first embodiment, the vacuum fixation for the foil stamp frame and for the areas of the back plate with and without structuring is separated from the fluid elements for overpressure for lifting the foil stamp (lifting element). In a second embodiment, individual fixation elements, in particular vacuum fixations for the outer area of ​​the back plate, which is not structured, can be switched and supplied with overpressure.

[0146] This means that, if necessary, individual fixing elements can be used simultaneously as lifting elements, thereby relaxing the film.

[0147] In a preferred embodiment of the alignment and embossing method, the flushing or pressure increase in the area of ​​the back of the foil stamp (flushing zone) is used to relax the foil stamp on the substrate, but also to ensure a uniform application of force during embossing. During the embossing process, the filling of the structures of the foil stamp is additionally supported by capillary forces and the (slight) back-side overpressure.

[0148] In a preferred embodiment of the method for aligning and embossing, it is provided that the pressure difference between the processing space and the area of ​​the back of the foil stamp (rinsing zone) is also used to demold the foil stamp from the embossing compound.

[0149] In a preferred embodiment of the alignment and embossing method, the pressure setting and pressure regulation in the processing area and in the rinsing zone provide active control of the pressure zones for embossing and demolding. The resulting pressure difference between the two pressure zones is used to generate external forces acting on the foil stamper during embossing and demolding.

[0150] The dimensions of the individual nanostructures of the embossed pattern of the embossing means or the foil stamp are preferably in the micrometer and / or nanometer range. The dimensions of the individual nanostructures of the embossing means, in particular of the flexible foil stamp, are less than 1000 μm, preferably less than 10 μm, more preferably less than 100 nm, and even more preferably less than 10 nm. The accuracy with which the detection devices, in particular alignment optics, can be moved individually is better than 1 mm, preferably better than 100 μm, much preferably better than 10 μm, much preferably better than 1 μm, even more preferably better than 100 nm, most preferably better than 10 nm, and most preferably better than 1 nm.

[0151] In a preferred embodiment, after alignment is completed, only a rough vacuum is set between the foil stamp and the substrate in the locally limited embossing space (processing space).

[0152] During evacuation, the pressure in the embossing chamber is less than 500 mbar, preferably less than 300 mbar, and most preferably less than 250 mbar. In particular, a rough vacuum of between 300 mbar and 1 mbar is preferred, and most preferably between 250 mbar and 100 mbar.

[0153] The pressure in the area of ​​the back of the foil stamp (flushing zone) is preferably set between 1 mbar and 1500 mbar. In a preferred embodiment, in addition to the rough vacuum in the processing chamber, during and / or after the (full-surface) contact between the foil stamp and the substrate coated with embossing compound, the pressure in the area of ​​the back of the foil stamp (flushing zone) is preferably set between 1100 mbar and 1250 mbar.

[0154] The pressure difference between the processing chamber and the area on the back of the foil stamp (flushing zone) is also used to demold the foil stamp from the embossing compound. For example, the pressure in the processing chamber is set to normal pressure, while the pressure in the area on the back of the foil stamp (flushing zone) is set between 1100 mbar and 1500 mbar.

[0155] In a preferred embodiment of the device for processing substrates, the pressure difference between the processing chamber and the back of the foil stamp is used to actively control the embossing and demolding process. This generates external forces that are used to process the substrate. The range of the generated forces is preferably between 100 N and 10 kN.

[0156] The UV light used is either broadband or specifically matched to the photoinitiator used in the embossing varnish. The wavelength range of the curable material is generally between 50 nm and 1000 nm, preferably between 150 nm and 500 nm, and more preferably between 200 nm and 450 nm.

[0157] Further advantages, features, and details of the invention will become apparent from the following description of preferred embodiments and from the drawings. These schematically show:

[0158] Figure la: a cross-sectional view of the device of a first embodiment in a first method step,

[0159] Figure 1 b: a cross-sectional view of the device of a first embodiment in a second method step,

[0160] Figure 1 c: a cross-sectional view of the device of a first embodiment in a third method step,

[0161] Figure I d: a cross-sectional view of the device of a first embodiment in a fourth method step,

[0162] Figure 1e: a cross-sectional view of the device of a first embodiment in a fifth method step,

[0163] Figure 2a: a cross-sectional view of the device of a second embodiment in a first method step,

[0164] Figure 2b: a cross-sectional view of the device of a second embodiment in a second method step,

[0165] Figure 2c: a cross-sectional view of the device of a second embodiment in a third method step, Figure 2d: a cross-sectional view of the device of a second embodiment in a fourth method step,

[0166] Figure 2e: a cross-sectional view of the device of a second embodiment in a fifth method step,

[0167] Figure 2f: a cross-sectional view of the device of a second embodiment in a sixth method step,

[0168] Figure 2g: a cross-sectional view of the device of a second embodiment with substrate-stamp stack in the exposure and demolding module in a first process step,

[0169] Figure 2h: a cross-sectional view of the device of a second embodiment with substrate-stamp stack in the exposure and demolding module in a second process step,

[0170] Figure 2i: a cross-sectional view of the device of a second embodiment with substrate-stamp stack in the exposure and demolding module in a third process step,

[0171] Figure 2j: a cross-sectional view of the device of a second embodiment with substrate-stamp stack in the exposure and demolding module in a fourth process step,

[0172] Figure 3a: a cross-sectional view of the device of a third embodiment with loaded substrate and foil stamp with foil frame in a first process step,

[0173] Figure 3b: a cross-sectional view of the device of a third embodiment in a second method step,

[0174] Figure 3c: a cross-sectional view of the device of a third embodiment in a third method step.

[0175] In the figures, identical components or components with the same function are identified by the same reference numerals. Size relationships may be incorrect for illustrative purposes. In Figures 1a to 1e, the processing method is shown as an embossing process in the alignment and embossing module in a first embodiment analogous to fusion bonding with the foil stamp at the bottom and the substrate at the top. The arrangement is also conceivable in the reverse, classically with a foil stamp at the top and the substrate at the bottom, as shown in a second embodiment in Figures 2a to 2j. In the figures, the processing device is represented by way of example by an embossing device. The processing device can also be, for example, a laser processing device, a coating device, a bonding or debonding device.The local processing space can then be formed accordingly between the devices or the elements of the device and the substrate receiving device around the substrate.

[0176] A key advantage of the device is that the adjustment and approach of the substrate and the device or foil stamp is first carried out with a high level of adjustment accuracy under normal pressure and then defect-free and simplified embossing in a vacuum is possible in a spatially limited, evacuable embossing chamber.

[0177] Figure 1a shows the receiving devices 1 and 2 of a device for receiving the substrate 13 and the foil stamp 12 with foil frame 9. The substrate receiving device 1 contains a central opening for the passage of an actuator 8 or an actuator device (not shown). In this first exemplary embodiment, the embossing process (nanoimprint process) is initiated with the actuator 8 in the substrate center. The actuator 8 can have various shapes or designs. Instead of an actuator pin or pin as the actuator 8, pressurization with a fluid or a gas is also possible as an alternative. The opening for the actuator 8 according to Figure 1a can have various sizes and shapes.

[0178] In Figure 1a, the foil stamp 12 with foil frame 9 has already been picked up on the foil stamp receiving device 2. The foil frame 9 is fixed via fixing elements 11 and via vacuum track segments distributed in the holding surface of the receiving device 2, which fix defined zones of the foil backside (not shown). Figure 1a also shows the substrate receiving device 1 with loaded substrate 13. The substrate 13 is fixed by vacuum or negative pressure via the vacuum tracks 6. In a preferred embodiment according to Figure 1a, several vacuum tracks 6 are combined to form vacuum track segments, which can be individually controlled and thus evacuated or flooded.

[0179] The substrate receiving device 1 according to Figure 1a contains seals, in particular sealing rings 7, in order to form a spatially defined and sealed embossing chamber 14 after contact with the lower foil stamp receiving device 2. Since the stamp, in particular a foil stamp 12 with frame 9, is usually larger than the substrate 13, charging or coating of the stamp preferably takes place outside the substrate zone.

[0180] In the next process step shown in Figure 1b, after alignment or adjustment and approach until contact is made between the upper and lower support devices 1, 2 at the seals 7, the embossing chamber 14 is formed. The embossing chamber 14 is evacuated via vacuum lines 5 in the substrate support device 1. The frame 9 is used according to Figure 1b to define the local vacuum zone or the evacuable embossing chamber 14. Alternatively, sealing after the frame 9 is also possible.

[0181] In the next process step according to Figure 1c, after the embossing chamber 14 has been evacuated and the vacuum has been created between the substrate 13 and the foil stamp 12, the foil stamp 12 and the substrate 13 are contacted as precisely as possible on a partial surface. The contact shown in Figure 1c is achieved by concentric deformation of the substrate 13 by the pressure exerted by the actuator 8, particularly in the center of the substrate 13. The substrate 13 remains fixed in a ring shape in the edge area. The substrate 13 is bent in a controlled manner until contact is made with the foil stamp 12 and then released. After it has been completely released, it contacts the foil stamp 12 over its entire surface. The vacuum prevents any possible air pockets.

[0182] Instead of a pin as actuator 8 in the central bore of the substrate receiving device, a line is also possible, from which an overpressure can be generated by an introduced gas between the holding surface of the substrate receiving device and the substrate 13, for the controllable deflection of the fixed substrate 13.

[0183] The vacuum fixation for the substrate 13 preferably consists of several vacuum tracks 6 that exit at the holding surface of the substrate receiving device. In a preferred embodiment, some vacuum tracks 6 are combined into vacuum track segments that can be individually controlled. The vacuum segments for substrate fixation to the substrate receiving device are preferably designed in a ring shape. This enables a controlled, radially symmetrical, particularly from the inside out, detachment of the substrate 13 from the substrate receiving device after contacting.

[0184] Figure 1d shows a completed embossing wave, where the embossing front has reached the edge of the substrate 13. The substrate 13 and the foil stamp 12 are in almost full-surface contact, and the substrate 13 is no longer fixed to the upper substrate holding device. The actuator 8 can initially remain in contact with the substrate and / or be retracted into the central opening as needed.

[0185] The foil stamp receiving device 2 according to Figures 1a to 1e has additional valves or gas lines, in particular at least one flushing valve 10 for lifting the foil stamp 12 from the rear of the holding surface of the foil stamp receiving device 2. The at least one flushing valve 10 is preferably a fluid element through which a gas and / or a gas mixture can flow out in order to generate an overpressure between the holding surface of the stamp receiving device and the foil stamp 12. The flushing valves are preferably located in the outer region of the back plate or the film of the foil stamp 12. This outer region has no structure and is not part of the stamp surface.

[0186] According to Figure 1e, after full-surface contact between the foil stamp 12 and the substrate 13, the flexible foil stamp 12 is "released" by an overpressure between the outer holding surface of the foil stamp holder and the foil stamp 12. Meanwhile, the foil stamp frame 9 remains fixed to the foil stamp holder, allowing the foil stamp 12 to relax on the substrate. Capillary forces fill the structures, and the flexibility provided at this point allows the foil stamp 12 to conform to the substrate surface. The ambient pressure delta can be used as an additional external force to improve the filling behavior.

[0187] To ensure the highest possible alignment accuracy, the imprint is cured and demolded externally in a second module of the device. This would also be possible with this setup, but would make the setup significantly more complex and cause undesirable temperature buildup.

[0188] Figures 2a to 2j show the process steps in a second embodiment of the device and the method.

[0189] The device, in particular, has a module group with a common work space that can be sealed from the ambient atmosphere if necessary. The device consists, in particular, of at least two modules. Alignment and embossing are carried out in a first module according to Figures 2a to 2f. Curing and demolding are carried out, in particular, in a second module according to Figures 2g to 2j. The coating can be carried out separately from the embossing process in a separate module. In a first process step, the substrate 13' and foil stamp 12' are loaded and picked up and fixed on the respective receiving devices 1', 2'.

[0190] Figure 2a shows the receiving devices 1' and 2' of a device for receiving the substrate 13' and the foil stamp 12' with foil back plate and frame 9'. In this second embodiment, the foil stamp 12' is located at the top of the foil stamp receiving device 2', and the substrate 13' is located at the bottom of the substrate receiving device 1'.

[0191] In Figure 2a, the foil stamp 12' with backplate and foil frame 9' has already been mounted on the foil stamp mounting device 2'. The foil frame 9' is secured via fixing elements 11' and vacuum track segments distributed in the holding surface of the mounting device 2', which fix defined zones of the foil backside (not shown). In particular, structured stamp areas and non-structured areas of the (foil) backplate are divided into different vacuum track segments.

[0192] In Figure 2a, the substrate 13' was placed on loading pins 17 of the substrate receiving device 1'.

[0193] Figure 2b shows the substrate 13' after being picked up on the receiving surface of the receiving body 3' of a substrate receiving device 1', with loading occurring from above. The substrate 13' is fixed by vacuum or negative pressure via the vacuum tracks 6'. In a preferred embodiment, several vacuum tracks 6' are combined into vacuum track segments, which can be individually controlled and thus evacuated or flooded (not shown).

[0194] If the substrate 13' is located on the lower receiving device, as shown in the embodiment according to Figures 2a to 2j, a further embodiment allows for mechanical fixation of the substrate 13' as an alternative or in addition to vacuum fixation. The coating or lacquering of the substrate 13' with the embossing compound (embossing lacquer) can optionally be carried out separately from the embossing process in a separate module or in the alignment and embossing module after the substrate 13' has been fixed. The invention can be used in combination with established industrial lacquering processes, such as spin-coating processes. Thus, the lacquering of the substrate is fast, defect-free, full-surface, free of particles and standardized, which also brings throughput advantages during the embossing step. In a first embodiment, the substrate 13' is coated with an embossing compound before loading.In a further embodiment, the substrate 13' is coated with an application device (not shown) only after loading and fixing.

[0195] In a second method step according to Figure 2c, the foil stamp 12' is aligned relative to the substrate 13', in particular using optical aids 15. The foil stamp 12' and the substrate 13' are brought closer to each other.

[0196] In a preferred embodiment, it is provided that the substrate 13 ' and / or the substrate receiving device 1 ' is movable in at least three degrees of freedom, preferably in at least four degrees of freedom, more preferably in at least five degrees of freedom, most preferably in all six degrees of freedom.

[0197] In the alignment and embossing module according to Figures 2a to 2f, there is an adjustment unit 16 for the substrate 13' and the foil stamp 12', in particular on the top and bottom. The corresponding holding device 1', 2' is located on each adjustment unit. Each holding device 1', 2' has in particular six degrees of freedom, three degrees of freedom of translation along the X, Y and Z directions and three degrees of freedom of rotation about the X, Y and Z axes. The translational degrees of freedom are used to move the holding device 1', 2' and thus the substrate 13' or the foil stamp 12' within the XY plane spanned by the X and Y directions and to bring the substrate 13' and the foil stamp 12' closer to one another along the Z direction. The possibility of rotation around the X, Y and Z axes is used to carry out wedge error compensation.Wedge error compensation (WEC) (Z-axis 18) and / or the orientation of the substrate and / or foil stamp. Rotations around the X, Y, and Z axes are particularly small rotation angles, so one could also speak of tilting.

[0198] In the loading position, the Z direction or Z axis runs perpendicularly as a surface normal to the holding surface of the receiving devices 1, 1', 1", 2, 2', 2". The X and Y directions or X and Y axes run perpendicular to each other and parallel to or in the holding surface of the receiving devices.

[0199] In another embodiment, it is provided that the positioning, holding and movement system of the upper and lower receiving devices 1, 1', 1", 2, 2', 2" is designed with a coarse drive and a fine drive for at least one degree of freedom.

[0200] In a preferred embodiment, it is provided that the receiving devices 1, 1', 1", 2, 2', 2" have a central control unit and / or regulating unit for controlling and / or regulating movements and / or processes, in particular the fixing of the substrate 13, 13' and the foil stamp 12, 12' and the position of the receiving devices 1, 1', 1", 2, 2', 2". In addition, the receiving devices 1, 1', 1", 2, 2', 2" have at least one sensor (not shown) for measuring influencing factors, in particular at least one distance and / or position sensor.

[0201] In a third method step according to Figure 2c, after the receiving devices 1', 2' have sufficiently approached each other, a locally limited and evacuable embossing space 14' is formed. In this case, a defined area 14' is sealed by means of seals 7', in particular ring seal(s) between the upper and lower receiving devices 1', 2'. This area can be evacuated if necessary. In a preferred embodiment, the ring seal(s) 7' are located on the substrate receiving device 1'. This evacuable embossing space 14' is created by the upper and lower receiving devices approaching each other until the embossing space is formed by sealing after contacting the stamp receiving device 2' and the substrate receiving device 1' provided with ring seal(s) 7'. In a preferred embodiment, the seals are located after the foil stamp frame 9', so that the entire foil stamp frame 9' is located in the embossing space.In alternative embodiments, the seals 7' can be attached to both receiving devices or only to one of the receiving devices 1', 2'.

[0202] In the area of ​​the embossing chamber 14', preferably in the substrate receiving device 1', there are vacuum inlet openings 5' for the active evacuation of the embossing chamber 14'. According to a preferred embodiment of the invention, the inlet openings 5' are either attached vacuum holes or comparable vacuum elements, with the aid of which the embossing chamber 14' can be evacuated in a controlled manner.

[0203] Figure 2c shows the formed embossing space 14' by contacting the upper and lower receiving devices 1', 2' at the sealing ring 7' after alignment. The distance between the substrate 13' and the foil stamp 12' was reduced to a precisely defined distance before the embossing process began.

[0204] The foil stamp 12' is aligned relative to the substrate 13' using optical aids 15 before the evacuation of the embossing chamber 14' begins. A further fine alignment of the foil stamp 12' can also be performed relative to the substrate 13' after the evacuation of the embossing chamber 14'. The alignment takes place beforehand, in particular using optical aids 15, before the evacuation of the processing chamber, so that a particularly precise alignment can advantageously take place under normal pressure. Furthermore, the substrate 13' can also be rotated after the evacuation of the processing chamber, for example, to compensate for a wedge error. This is carried out in particular using a WEC 18.

[0205] In a fourth process step according to Figure 2d, the embossing compound is embossed by the foil stamp 12'. An actuator is used to convexly bend the substrate 13', particularly centrally, and thereby first contact the foil stamp 12' with its central part (not shown). During the deformation, the substrate 13' remains fixed to the substrate receiving device 1', particularly at the peripheral edge.

[0206] In this second embodiment of the substrate receiving device 1', an inner vacuum segment, which serves as a vacuum fixation, can be switched so that a gas and / or a gas mixture can be pumped into the space between the holding surface of the substrate receiving device 1' and the substrate's backside, for controllable deflection of the substrate fixed at the edge. The at least one central fixing element can thus be used simultaneously as a curving means after switching.

[0207] After the deformed, bent substrate 13' has been released, a continuous and uniform embossing takes place along the embossing front by the advance of an embossing wave.

[0208] According to Figure 2d, the substrate 13' and the foil stamp 12', with the embossing compound in between, are held together by capillary forces and contacted over their entire surface. For this to happen, at least the foil stamp 12' must be highly flexible. Due to the viscosity of the embossing compound, the spaces between the foil stamp 12' are completely filled with it, particularly through capillary action.

[0209] A further unique feature of the proposed invention is that, after full-surface contact between the foil stamp 12' and the substrate 13', the flexible foil stamp 12' is relaxed by a slight rearward overpressure via flushing valves 10', while the foil frame 9' remains fixed. This allows the foil stamp 12' to relax on the substrate 13'. Capillary forces fill the structures, and the flexibility provided at this point allows the foil stamp 12' to conform to the substrate surface. This allows high-resolution surface structuring to be performed.

[0210] In a fifth process step, the imprinting compound is cured. To ensure the highest possible alignment accuracy, the imprint is cured and demolded externally. As shown in Figures 2e and 2f, after the embossing chamber is opened, the frame 9' with the foil stamp and substrate stack is removed from the upper foil stamp holder 2' and transferred to the curing and demolding module.

[0211] According to Figures 2g and 2h, after the embossing process in the alignment and embossing module, the foil stamp substrate stack is transferred to an unloading station (not shown) and then in the curing and release module, the embossing compound or the varnish is cross-linked by the transparent foil stamp using UV light.

[0212] The curing and release module according to Figure 2g has, analogously to the alignment and embossing module according to Figures 2a to 2f, a substrate receiving device 1" and a foil stamp receiving device 2", the detailed description of which is omitted here.

[0213] After securing the foil stamp-substrate stack to the foil stamp holder 2" as shown in Figure 2g, the holders 1", 2" are brought closer together to a defined distance as shown in Figure 2h to form the space 14" defined by the ring seal(s) 7". The space 14" is evacuated as needed. The UV lamp housing 19 enables the irradiation of the embossing varnish using UV light. During curing with UV radiation, temperature control and, if necessary, temperature compensation are carried out.

[0214] In a sixth process step, the foil stamp 12' is removed from the embossing compound according to Figures 2i and 2j. At the end of the process, the foil stamp 12' is removed, in particular, from the substrate 13' in the curing and release module, and the substrate 13' is unloaded. The system preferably has force monitoring sensors to control the demolding step.

[0215] In the curing and release module according to Figures 2g to 2j there is an adjustment unit 16' for the holding device 1", in particular on the underside. The holding device 1" has in particular six degrees of freedom, three degrees of freedom of translation along the X, Y and Z directions and three degrees of freedom of rotation about the X, Y and Z axes. The translational degrees of freedom are used to move the holding device 1" and thus the substrate 13' within the XY plane spanned by the X and Y directions and to move the substrate 13' and foil stamp 12' relative to one another along the Z direction. The possibility of rotation about the X, Y and Z axes is used to carry out wedge error compensation (WEC Z-axis 18') and / or the orienta-tion of the substrate 13' for demolding.

[0216] Figures 2h and 2i show lines 5" that can be used either as vacuum lines for evacuating the space 14" or as purge valves for purging or creating an overpressure in the space 14" using gas or gas mixtures. Demolding is assisted by purging the space 14" between or around the foil stamp 12' and the substrate 13'. This allows a targeted, additional influence on demolding to be achieved. In addition, the flexible foil stamp 12' can be relaxed during demolding by applying a slight overpressure to the back using purge valves 10", while the foil frame 9' remains fixed.

[0217] Figures 3a to 3c show the device and method for processing as an embossing process in a third embodiment, with the foil stamp on the film frame 9' at the top and the substrate 13" at the bottom. In the device according to Figures 3a to 3c, alignment, embossing, curing, and demolding are preferably carried out in the same module. The device according to Figures 3a to 3c has a fixed design in which the lower and upper parts of the device, in which the holding devices are integrated, are not separable. The substrate holding device with adjustment unit 16' with the holding surface for holding the substrate 13" is integrated in the lower part of the device and dimensioned to be as space-saving as possible. This advantageously allows the smallest possible processing space 14'" to be formed. The spatially delimited and evacuable processing space 14'" around the substrate is defined by the gate valves 20, 20'.The gate valves 20, 20' are loading and unloading openings for gas-tight sealing of the processing chamber and are each formed in a wall of the process chamber. Evacuation is achieved by means of evacuation means 5', which are arranged on the device, so that after the gate valves 20, 20' are closed, the processing chamber 14"' can be evacuated. The substrate 13" and the foil stamp 12" with film frame 9' are arranged within the processing chamber 14"'. Processing takes place in the processing chamber.

[0218] In an exemplary embodiment of the method with the device according to Figures 3a to 3c, the steps c) approaching the upper and / or lower receiving device and d) evacuating / forming the vacuum in the defined embossing space between the foil stamp and the substrate are interchangeable as desired.

[0219] Preferably, the lower substrate receiving device with adjustment unit 16' approaches the upper punch.

[0220] In Figure 3a, the foil stamp with backplate and film frame 9' has already been picked up by the foil stamp pick-up device. Pick-up is performed by the film frame loading unit 21 after introduction into the device via a gate valve 20, 20'. The foil frame 9' is secured by means of securing elements 11' and vacuum track segments distributed in the holding surface of the pick-up device, which secure defined zones of the foil backside (not shown). In particular, structured stamp areas and non-structured areas of the (foil) backplate are divided into different vacuum track segments.

[0221] The foil stamp is stretched in a frame, specifically in a film frame 9'.

[0222] The substrate can be temporarily stored (not shown) and transferred by means of a handling device (not shown), for example a robot arm, through one of the gate valves 20, 20' into the process chamber onto the substrate loading pins 17'. The gate valve 20, 20' is then closed again. The presence of two gate valves 20, 20' allows for greater flexibility in process execution. One gate valve can, for example, be used for the insertion and removal of the substrate 13", while the second gate valve is used for the insertion and removal of the foil stamper 12" with film frame 9'. Multiple substrates and / or different substrates can be embossed with a single foil stamper. The foil stamper can remain in the device according to Figure 3a for multiple embossing processes.

[0223] Figure 3a shows the substrate 13" coated with embossing lacquer after it has been picked up on the receiving surface of the receiving body of a substrate receiving device, wherein the loading takes place via the loading pins 17' from above after introduction into the device via a gate valve 20, 20'. The substrate 13" is fixed by vacuum or negative pressure via the vacuum tracks. In a preferred embodiment, several vacuum tracks are combined to form vacuum track segments which can be individually controlled and therefore evacuated or flooded (not shown). If the substrate 13" is located on the lower receiving device, as shown in the embodiment according to Figure 3a, a mechanical fixation for the substrate 13" is possible as an alternative or in addition to the vacuum fixation in a further embodiment.

[0224] According to an advantageous embodiment, a detection device, in particular with optics 15o, 15u, ensures the exact alignment of substrate 13" and foil stamp 12" by detecting the relative positions and passing them on to the control unit, which then causes the substrate and foil stamp to be aligned with one another.

[0225] In a first embodiment, the foil stamp 12" is aligned relative to the substrate 13" using optical aids 15o, 15u before the evacuation of the embossing chamber 14'" begins. A further fine alignment of the foil stamp 12" can also be performed relative to the substrate 13" after the evacuation of the embossing chamber 14'". Furthermore, the substrate 13" can also be rotated after the evacuation of the processing chamber 14'", for example, in order to compensate for a wedge error. This is carried out in particular by means of a WEC 18' (wedge error compensation).

[0226] In the next process step, as shown in Figure 3b, the distance between the substrate 13" and the foil stamp 12" is reduced to a precisely defined distance before the embossing process begins. Preferably, the lower substrate receiving device approaches the foil stamp 12" relative to the foil stamp.

[0227] In the next process step according to Figure 3c, the embossing compound is embossed by the 12" foil stamp. In a preferred embodiment of the receiving device for the foil stamp with film frame, an inner vacuum segment, which serves as a vacuum fixation, can be switched so that a gas and / or a gas mixture can be pumped into the space between the holding surface of the receiving device for the foil stamp with film frame and the back of the foil stamp, for the controllable deflection of the foil stamp fixed at the edge. The at least one central fixing element can thus be used as a curving means after switching.

[0228] The contacting in the device according to Figure 3b preferably takes place after the lower substrate receiving device has approached, whereby by pre-tensioning the upper foil stamp, initially only a partial surface of the foil stamp 12" is contacted with the substrate 13" and then an automatic contacting of the contact surfaces is effected, whereby preferably the entire substrate surface is embossed with a thin, flexible foil stamp in a stamping chamber 14" in a vacuum without repeating the aforementioned steps.

[0229] After full-surface contact between the foil stamp 12" and the substrate 13", the flexible foil stamp 12" is "released" as shown in Figure 3c by an overpressure between the outer holding surface of the foil stamp holder and the foil stamp 12". During this time, the foil stamp frame 9' remains fixed to the foil stamp holder so that the foil stamp 12" can relax on the substrate 13". The capillary forces fill the structures with the embossing varnish, and the flexibility available at this time allows the foil stamp 12" to conform to the substrate surface. In addition, the delta of the ambient pressures can be used as an additional external force to improve the filling behavior. For this purpose, the pressure behind the foil stamp 12" in the foil stamp rinsing chamber 23 and the pressure or vacuum in the processing chamber 14'" are specifically adjusted.The pressure in the processing chamber 14" is in particular between 1 mbar and 1100 mbar. During evacuation, the pressure in the processing chamber is less than 500 mbar, preferably less than 300 mbar, most preferably less than 250 mbar. In particular, a rough vacuum is preferably set between 300 mbar and 1 mbar, most preferably between 250 mbar and 100 mbar.

[0230] The pressure in the flushing chamber 23 on the back of the 12" foil stamp is in particular between 1 mbar and 1500 mbar. The pressure difference between the processing chamber 14" and the foil stamp flushing chamber 23 (delta of the ambient pressures) is between 0 and 800 mbar, preferably between 100 and 600 mbar, even more preferably between 200 and 600 mbar. A pressure difference of 500 mbar, for example, corresponds to a force of 4.5 kN, which can be used as additional force in the embossing process.

[0231] The UV lamp housing 19' enables the irradiation of the embossing varnish using UV light. During curing with UV radiation, the temperature is controlled and, if necessary, temperature equalization is achieved. During UV curing of the embossing material on the substrate, the foil stamp material is preferably at least partially transparent to the wavelength range of the electromagnetic radiation that crosslinks the embossing material. The optical transparency is in particular greater than 20%, preferably greater than 50%, more preferably greater than 80%, and most preferably greater than 95%. The foil stamp can also be transparent to other ranges of electromagnetic radiation. Other adjacent components of the upper receiving device, as well as a section of the upper part of the device adjacent to the UV lamp housing 19', are also made of UV and / or IR-transparent materials.

[0232] In the last process step (not shown), the foil stamp 12" is removed from the embossing compound. At the end of the process, the foil stamp 12" is pulled off the substrate 13" in particular, and the substrate 13" is unloaded. The system preferably has sensors for force monitoring to control the demolding step. In the device according to Figures 3a to 3c, an adjustment unit 16' for the substrate receiving device is located, in particular on the underside. The receiving device has, in particular, six degrees of freedom, three degrees of freedom of translation along the X, Y and Z directions and three degrees of freedom of rotation about the X, Y and Z axes. The translational degrees of freedom are used to move the receiving device and thus the substrate 13" within the XY plane spanned by the X and Y directions, as well as to move the substrate 13" and the foil stamp 12" relative to one another along the Z direction.The rotation capability around the X, Y, and Z axes is used to perform wedge error compensation (WEC Z-axis 18') and / or the orientation of substrate 13" for demolding. List of reference symbols: 1', 1" substrate receiving device, substrate.

[0233] Recording device, 2', 2“ device for editing,

[0234] Foil stamp holder, foil stamp holder, 3' substrate holder, substrate holder, 4' foil stamp holder, 5', 5" evacuation means, evacuation means, vacuum line, 6' fixing element(s) for substrate, 7' seal, sealant actuator (pin), 9' frame, stamp frame, foil frame, film

[0235] Frame 0, 10', 10“ Flushing agent, Gas line 1, 11' Fixing element(s) for foil frame 2, 12', 12“ Processing means, embossing means, stamp,

[0236] Embossing stamp, flexible foil stamp 3, 13', 13“ Substrate, substrate stack 4, 14', 14“, 14'“ Processing room, vacuum embossing room, room 5, 15o, 15u Optics for alignment 6, 16' Alignment stage 7, 17' Substrate loading pins 8, 18' WEC Z-axis (Wedge Error Compensation), 19' UV lamp housing, 20' Sealant, gate valve, gate valve Loading unit for film frame with foil stamp (film frame) Processing device, chamber, process chamber, process module Rinsing room

Claims

P at ent ansp rü che 1) Method for processing, in particular for nano-imprinting, a substrate (13) with at least the following steps: a) providing a substrate receiving device (1, 1', 1") for receiving the substrate (13), b) providing a device (2, 2', 2", 22) for processing the substrate (13), c) forming a local and fluidically tight processing space (14, 14', 14") between the substrate receiving device (1, 1', 1") and the device (2, 2', 2", 22), d) evacuating the processing space (14, 14', 14") and e) processing the substrate (13), wherein the evacuation in step d) takes place after the formation of the processing space (14, 14', 14") in step c). 2) Method according to claim 1, wherein the formation of the processing space (14, 14', 14") takes place by approaching the substrate receiving device (1, 1', 1") and the device (2, 2', 2"), wherein before the approach the device (2, 2', 2") and the substrate receiving device (1, 1', 1") are aligned with each other. 3) Method according to claim 1, wherein the formation of the processing space (14, 14', 14") is carried out by controllable sealing means (20, 20'). 4) Method according to one of claims 1 to 3, wherein the device (2, 2', 2", 22) has a flexible foil stamp (12") for processing, in particular for embossing, the substrate (13) and in step e) a fluidically tight rinsing chamber (23) between the device (22) and the foil stamp (12") is rinsed to curvature the foil stamp (12"), wherein the processing chamber (14, 14', 14") and the rinsing chamber (23) are fluidically separated from one another by the foil stamp (12, 12', 12"). 5) Method according to claim 4, wherein a pressure difference between the pressure of the processing chamber (14, 14', 14") and the rinsing chamber (23) is set between 0 and 800 mbar, preferably between 100 and 600 mbar, more preferably between 200 and 600 mbar for processing, in particular for embossing. 6) Device for processing a substrate (13), at least comprising: i) a substrate receiving device (1, 1', 1") for receiving the substrate (13), ii) a device (2, 2', 2", 22) for processing the substrate (13), iii) means for forming a local and fluidically tight Processing space (14, 14', 14") between the Substrate receiving device (1, 1', 1") and the device (2, 2', 2", 22) vi) evacuation means (5, 5') for evacuating the processing space (14, 14', 14") v) processing means (12, 12', 12") for processing the substrate. 7) Device according to claim 6, wherein the means are approaching means for approaching the substrate receiving device (1, 1', 1") and the device (2, 2', 2"). 8) Device according to claim 7, wherein the device additionally has alignment means for aligning the substrate receiving device (1, 1', 1") and the device (2, 2', 2", 22) with each other, wherein the alignment means are arranged such that before and / or during an action of the approaching means the substrate receiving device (1, 1', 1") and the device (2, 2', 2") can be aligned with each other. 9) Device according to claim 7 or 8, wherein the substrate receiving device (1, 1', 1") and the device (2, 2', 2", 22) have corresponding sealing means (7, 7'), wherein the approaching means are arranged such that after the action of the approaching means the corresponding sealing means (7, 7') form the processing space (14, 14', 14") between the substrate receiving device (1, 1', 1") and the device (2, 2', 2"). 10) Device according to claim 6, wherein the means are controllable sealing means (20, 20') for forming the processing space (14, 14', 14") between the substrate receiving device (1, 1', 1") and the device (22). 11) Device according to claim 10, wherein the substrate receiving device (1, 1', 1") and the device (22) are formed in one piece. 12) Device according to at least one of the preceding claims, wherein the processing means comprise a flexible foil stamp (12") for embossing, in particular for nano-embossing, the substrate (13). 13) Device according to claim 12, wherein the device additionally comprises rinsing means (10, 10', 10") for forming a fluidically tight rinsing chamber (23) between the device (22) and the foil stamp (12"), wherein the rinsing chamber (23) is fluidically separated from the processing chamber (14, 14', 14") by the foil stamp (12"), and wherein the foil stamp (12") is deformable in a targeted manner by the rinsing means (10"). 14) Device according to claim 12, wherein the device is arranged such that a pressure difference between the pressure of the processing chamber (14, 14', 14") and the rinsing chamber (23) can be set between 0 and 800 mbar, preferably between 100 and 600 mbar, more preferably between 200 and 600 mbar. 15) Device according to claim 13 or 14, wherein the rinsing means (10") are simultaneously evacuation means, so that the foil stamp (12") can be demolded from the substrate (13) by evacuating the rinsing chamber (23).

Images