Electromagnetic cooking device and combination cooker

Abstract

The present invention discloses an electromagnetic cooking device and a combination cooker. The electromagnetic cooking device includes a circuit board, a heat sink, a coil assembly, a first fan, and a second fan. The circuit board is provided with a first electronic component and a second electronic component. The heat sink has a first flow channel. A second flow channel is defined between the coil assembly and the circuit board. The first electronic component is in contact with the heat sink, and the second electronic component is located in the second flow channel. The first fan is adapted to generate an airflow flowing through the first flow channel, and the second fan is adapted to generate an airflow flowing through the second flow channel. The airflow generated by the first fan can take away heat of the first electronic component, and the airflow generated by the second fan can take away heat of the second electronic component. Under the actions of the first fan and the second fan, there is sufficient air volume for the heat dissipation of the first electronic component and the second electronic component. Through such a configuration, accurate and effective heat dissipation of different electronic components can be achieved. As a result, the electromagnetic cooking device can operate stably.

Description

FIELD

[0001] The present invention relates to the technical field of household appliances, and more particularly, to an electromagnetic cooking device and a combination cooker.BACKGROUND

[0002] An electromagnetic cooking device such as an electromagnetic cooker is internally provided with a large number of electronic components. These electronic components would generate a large amount of heat during their operation, and accumulation of the heat can reduce operational stability of the electronic components. To this end, it is necessary to dissipate the heat of the electronic components. The present invention herein provides a solution in which the heat of the electronic components can be effectively dissipated.SUMMARY

[0003] The present invention aims to solve one of the technical problems in the related art at least to some extent. To this end, the present invention provides an electromagnetic cooking device.

[0004] In order to achieve the above object, the present invention discloses an electromagnetic cooking device. The electromagnetic cooking device includes a circuit board, a heat sink, coil assembly, a first fan, and a second fan. The circuit board is provided with a first electronic component and a second electronic component. The heat sink has a first flow channel. The first electronic component is in contact with the heat sink. A second flow channel is defined between the coil assembly and the circuit board. The second electronic component is located in the second flow channel. The first fan is adapted to generate an airflow flowing through the first flow channel. The second fan is adapted to generate an airflow flowing through the second flow channel.

[0005] Optionally, the heat sink includes a body portion and a plurality of fin portions. The plurality of fin portions is arranged at the body portion, and the first flow channel is formed between adjacent fin portions of the plurality of fin portions.

[0006] Optionally, the body portion is in contact with the first electronic component.

[0007] Optionally, the electromagnetic cooking device further includes a first shielding structure.

[0008] Optionally, a side of the first flow channel facing away from the body portion is surrounded by the first shielding structure.

[0009] Optionally, the electromagnetic cooking device further includes a bottom casing. Optionally, the heat sink is mounted at the bottom casing. Optionally, the bottom casing is provided with a panel at a periphery of the bottom housing. Optionally, the panel is partially constructed as the first shielding structure.

[0010] Optionally, the electromagnetic cooking device further includes a first air duct and a second air duct. The second fan is in communication with the second flow channel via the first air duct, and the second fan is in communication with the second flow channel via the second air duct. Optionally, the first air duct is configured to allow air to outflow in a first direction, and the second air duct is configured to allow air to outflow in a second direction, to form at least two air outflowing directions.

[0011] Optionally, the electromagnetic cooking device further includes a first air duct. The second fan is in communication with the second flow channel via the first air duct, and the first air duct has an air outflowing direction towards the second electronic component.

[0012] Optionally, the circuit board is located at higher level than a lowest part of an air exhaust end of the first air duct. Optionally, the air outflowing direction of the first air duct is parallel to the circuit board.

[0013] Optionally, the first air duct has an air outflow end of a flared shape.

[0014] Optionally, the electromagnetic cooking device further includes a second air duct. The second fan is in communication with the second flow channel via the second air duct, and the second air duct has an air outflowing direction towards the coil assembly.

[0015] Optionally, the air outflowing direction of the second air duct is inclined towards the coil assembly.

[0016] Optionally, the coil assembly is located above the second air duct, and a bottom of the second air duct is inclined towards the coil assembly from the second fan.

[0017] Optionally, the electromagnetic cooking device further includes a second shielding structure. The second air duct is disposed at an end of the second flow channel, and the second shielding structure is disposed at another end of the second flow channel.

[0018] Optionally, the electromagnetic cooking device further includes a bottom casing. The circuit board and the coil assembly are disposed at the bottom housing. Optionally, the bottom casing is provided with a panel at a periphery of the bottom housing, and the panel is partially constructed as the second shielding structure.

[0019] Optionally, the first air duct of the electromagnetic cooking device is located closer to the heat sink than the second air duct of the electromagnetic cooking device.

[0020] Optionally, the first air duct of the electromagnetic cooking device and the second air duct of the electromagnetic cooking device are in communication with one second fan.

[0021] Optionally, the electromagnetic cooking device includes at least two second fans. Optionally, one of the two second fans is in communication with the first air duct of the electromagnetic cooking device, and / or another one of the two second fans is in communication with the second air duct of the electromagnetic cooking device.

[0022] Optionally, the electromagnetic cooking device further includes a bottom casing. The coil assembly is disposed at the bottom casing, and / or the circuit board and the heat sink are disposed between the bottom casing and the coil assembly.

[0023] Optionally, the bottom casing has an air outlet. The air outlet is adapted to allow the airflow generated by the first fan and / or the airflow generated by the second fan to be discharged through the air outlet.

[0024] Optionally, the air outlet directly faces towards the first flow channel.

[0025] Optionally, the bottom casing is provided with a protruding tongue portion and a snap. Optionally, the heat sink is disposed at the circuit board, a side of the heat sink and a side of the circuit board are snapped between the protruding tongue portion and a bottom of the bottom housing, and / or another side of the circuit board is connected to the snap.

[0026] Optionally, the heat sink is constructed as at least part of a flow channel wall of the second flow channel.

[0027] A second aspect of the present invention discloses a combination cooker. The combination cooker includes a range hood and the electromagnetic cooking device as described above.

[0028] In the technical solutions of the present invention, since the first electronic component is in contact with the heat sink, the airflow generated by the first fan can take away heat of the first electronic component when flowing through the first flow channel of the heat sink. In addition, since the second electronic component is disposed in the second flow channel, the airflow generated by the second fan can take away heat of the second electronic component when flowing through the second flow channel. Since more satisfactory heat dissipation for the first electronic component can be implemented by the heat sink, the first electronic component may be an electronic component with larger heat generation, while the second electronic component may be an electronic component with smaller heat generation. In addition, under the actions of the first fan and the second fan, sufficient air volume may be provided for the first electronic component and the second electronic component for the heat dissipation. Through such a configuration, accurate and effective heat dissipation of different electronic components can be achieved. As a result, the electromagnetic cooking device can operate stably.

[0029] Additional aspects and advantages of the embodiments of present invention will be provided at least in part in the following description, or will become apparent in part from the following description, or can be learned from the practice of the embodiments of the present invention.BRIEF DESCRIPTION OF THE DRAWINGS

[0030] FIG. 1 is a schematic view of an electromagnetic cooking device according to some embodiments. FIG. 2 is an exploded view of an electromagnetic cooking device according to some embodiments. FIG. 3 is a section view of an electromagnetic cooking device according to some embodiments. FIG. 4 is a schematic partial structural view of an electromagnetic cooking device according to some embodiments. FIG. 5 is an enlarged view of part A in FIG. 4. FIG. 6 is a schematic partial structural view of the electromagnetic cooking device according to some embodiments in a different viewing angle from FIG. 4. FIG. 7 is an enlarged view of part B in FIG. 6. FIG. 8 is a schematic view of a bottom casing according to some embodiments. FIG. 9 is an enlarged view of part C in FIG. 8. FIG. 10 is a schematic view of the bottom casing according to some embodiments in a different viewing angle from FIG. 8. FIG. 11 is an enlarged view of part D in FIG. 10. FIG. 12 is a schematic view of the bottom casing according to some embodiments in a different viewing angle from FIGS. 8 and 10. FIG. 13 is a schematic assembly view of a circuit board, a heat sink, a first electronic component, and a second electronic component according to some embodiments. FIG. 14 is schematic assembly view of the circuit board, the heat sink, the first electronic component, and the second electronic component according to some embodiments in a different viewing angle from FIG. 13. FIG. 15 is an enlarged view of part E in FIG. 14. FIG. 16 is a schematic view of a coil assembly according to some embodiments. FIG. 17 is a schematic view of an airflow discharged by a first fan according to some embodiments. FIG. 18 is a schematic view of the airflow discharged by the first fan according to some embodiments in a different viewing angle from FIG. 17. FIG. 19 is a schematic view of an airflow discharged by a second fan through a first air duct according to some embodiments. FIG. 20 is a schematic view of the airflow discharged by the second fan through the first air duct according to some embodiments in a different viewing angle from FIG. 19. FIG. 21 is a schematic view of an airflow discharged by a second fan through a second air duct according to some embodiments. FIG. 22 is a schematic view of the airflow discharged by the second fan through the second air duct according to some embodiments in a different viewing angle from FIG. 21. FIG. 23 is a schematic diagram of a combination cooker according to some embodiments. Description of reference numbers:

[0031] combination cooker 100, electromagnetic cooking device 1000, bottom casing 1100, bottom plate 1110, panel 1120, left panel / first shielding structure 1121, right panel 1122, front panel 1123, rear panel / second shielding structure 1124, protruding tongue portion 1130, snap 1140, air outlet 1150, circuit board 1200, first electronic component 1210, second electronic component 1220, heat sink 1300, body portion 1310, fin portion 1320, first flow channel 1330, coil assembly 1400, support plate 1410, coil 1420, second flow channel 1430, first air duct 1510, second air duct 1520, bottom 1521 of second air duct 1520, first fan 1610, second fan 1620, and range hood 2000.DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] The present invention provides an electromagnetic cooking device 1000. As illustrated in FIGS. 1 to 5, in some embodiments, the electromagnetic cooking device 1000 includes a circuit board 1200, a heat sink 1300, a coil assembly 1400, a first fan 1610, and a second fan 1620. The circuit board 1200 is provided with a first electronic component 1210 and a second electronic component 1220. The heat sink 1300 has a first flow channel 1330. The first flow channel 1330 is adapted to allow an airflow to flow through the first flow channel 1330. The first electronic component 1210 is designed to be in contact with the heat sink 1300. The coil assembly 1400 and the circuit board 1200 are spaced apart from each other to form a second flow channel 1430 between the coil assembly 1400 and the circuit board 1200. The second flow channel 1430 is adapted to allow an airflow to flow through the second flow channel 1430. The second electronic component 1220 is located in the second flow channel 1430. The first fan 1610 is configured to generate an airflow flowing through the first flow channel 1330, and the second fan 1620 is configured to generate airflow flowing through the second flow channel 1430.

[0033] In this embodiment, since the first electronic component 1210 is brought into contact with the heat sink 1300, the airflow generated by the first fan 1610 can take away heat of the first electronic component 1210 when flowing through the first flow channel 1330 of the heat sink 1300. In addition, since the second electronic component 1220 is disposed in the second flow channel 1430, the airflow generated by the second fan 1620 can take away heat of the second electronic component 1220 when flowing through the second flow channel 1430. Since more satisfactory heat dissipation for the first electronic component 1210 can be implemented by the heat sink 1300, the first electronic component 1210 may be an electronic component with larger heat generation, and the second electronic component 1220 may be an electronic component with lower heat generation. In addition, under the actions of the first fan 1610 and the second fan 1620, sufficient air volume may be supplied to the first electronic component 1210 and the second electronic component 1220 for heat dissipation. Through such a configuration, accurate and effective heat dissipation for different electronic components can be achieved. As a result, the electromagnetic cooking device 1000 can operate stably.

[0034] Specifically, the electromagnetic cooking device 1000 is configured to heat cookware based on an electromagnetic induction phenomenon. That is, in the electromagnetic cooking device 1000, an alternating magnetic field may be generated, and an eddy current is induced in a conductor (the cookware) in the alternating magnetic field. Joule heating effect of the eddy current rises a temperature of the conductor (the cookware). Thus, heating is implemented. In the electromagnetic cooking device 1000, the alternating magnetic field is generated mainly through a cooperation between the circuit board 1200 and the coil assembly 1400.

[0035] The circuit board 1200 is provided with the first electronic component 1210 and the second electronic component 1220. The electronic components (the first electronic component 1210, the second electronic component 1220) include but are not limited to resistors, capacitors, inductors, potentiometers, electron tubes, heat sinks 1300, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, electronic transformers, relays, bridge rectifiers, and insulated gate bipolar transistors (IGBTs).

[0036] The coil assembly 1400 is configured to generate the alternating magnetic field. For example, the coil assembly 1400 includes a support plate 1410 and a coil 1420. The coil 1420 may include a plurality of coils 1420 arranged at the support plate 1410 side by side. The support plate 1410 can support the plurality of coils 1420. The alternating current flows through the coil 1420, and therefore an alternating magnetic field with a continuously changing direction may be generated. The coil assembly 1400 and the circuit board 1200 are spaced apart from each other to form the second flow channel 1430 between the coil assembly 1400 and the circuit board 1200. The second flow channel 1430 is configured to allow the airflow to flow through the second flow channel 1430, and the second electronic component 1220 is located in the second flow channel 1430. The airflow, when flowing through the second flow channel 1430, can take away the heat of the second electronic component 1220.

[0037] It will be appreciated that the coil assembly 1400 also generates heat during its operation, and the airflow, when flowing through the second flow channel 1430, can also take away the heat of the coil assembly 1400. Generally speaking, the support plate 1410 may be made of a material selected from materials having satisfactory thermal conductivity, such as metal materials. Aluminum and stainless steel may be selected to prepare the support plate 1410. The heat generated by the coil 1420 during its operation may be transferred to the support plate 1410. The airflow, when flowing through the second flow channel 1430, can take away the heat of the support plate 1410, i.e., the heat of the coil 1420. In this way, the heat dissipation of the coil assembly 1400 can be achieved.

[0038] The heat dissipation of the first electronic component 1210 mainly depends on the heat sink 1300. The heat sink 1300 generally has a larger heat dissipation area than the first electronic component 1210, and the heat sink 1300 has satisfactory thermal conductivity. For example, the heat sink 1300 is made of a metal material. The first electronic component 1210 needs to be in contact with the heat sink 1300. For example, the first electronic component 1210 is attached to the heat sink 1300, and the heat generated by the first electronic component 1210 during its operation is transferred to the heat sink 1300. The heat sink 1300 has a first flow channel 1330. The first flow channel 1330 is configured to allow an airflow to flow through the first flow channel 1330. The airflow, when flowing through the first flow channel 1330, can take away the heat of the heat sink 1300. In this way, the heat dissipation of the first electronic component 1210 can be achieved.

[0039] Through the heat sink 1300, faster heat dissipation can be achieved for the first electronic component 1210 than the second electronic component 1220. Generally speaking, the circuit board 1200 has electronic components with different heat generation (or power). Therefore, the electronic components with larger heat generation (or power) may be brought into contact with the heat sink 1300 (such as IGBT), while the electronic components with relatively lower heat generation (or power) may be brought into contact with the airflow, achieving the heat dissipation of different electronic components. That is, the first electronic component 1210 and the second electronic component 1220 may be designed in such a manner that the heat generation (or the power) of the first electronic component 1210 is greater than the heat generation (or the power) of the second electronic component 1220. In this way, the accurate heat dissipation can be achieved. It will be appreciated that an electronic component on the circuit board 1200 that is in contact with the heat sink 1300 may be regarded as the first electronic components 1210, and an electronic component on the circuit board 1200 that is in no contact with the heat sink 1300 and located in the second flow channel 1430 may be regarded as the second electronic component 1220.

[0040] The airflow flowing through the first flow channel 1330 is generated by the first fan 1610, and the airflow flowing through the second flow channel 1430 is generated by the second fan 1620. For example, the first fan 1610 and the second fan 1620 each are configured to suck ambient air. By providing the first fan 1610 and the second fan 1620, the sufficient air volume can be generated to take away the heat, thereby ensuring a heat dissipation effect. Compared with providing a single fan to provide the same air volume, in this embodiment, by providing the first fan 1610 and the second fan 1620, it is beneficial to reduce a rotational speed of the first fan 1610 and a rotational speed of the second fan 1620. Thus, operating noise can be reduced.

[0041] With reference to FIGS. 13, 14, and 15, in some embodiments, the heat sink 1300 includes a body portion 1310 and a fin portion 1320. The first electronic component 1210 is in contact with the body portion 1310. The fin portion 1320 is disposed at the body portion 1310. The fin portion 1320 may include a plurality of fin portions 1320 (the plurality means two or more), and the first flow channel 1330 is defined between adjacent fin portions 1320 of the plurality of fin portions 1320. The body portion 1310 and the fin portion 1320 may be integrally formed, or the body portion 1310 and the fin portion 1320 may also be separate parts connected and fixed together by connecting means.

[0042] The body portion 1310 has an inclined surface inclined relative to the circuit board 1200. The first electronic component 1210 is attached to the inclined surface. The fin portions 1320 are arranged at the body portion 1310, and two adjacent fin portions 1320 are spaced apart from each other. Therefore, the first flow channel 1330 is defined between the adjacent fin portions 1320. The heat of the first electronic component 1210 is transferred to the body portion 1310 and then to the fin portions 1320. The airflow, when flowing through the first flow channel 1330, can take away the heat of the fin portions 1320. Thus, the heat dissipation of the first electronic component 1210 can be achieved. Since the plurality of fin portions 1320 are provided, a heat dissipation area of the heat sink 1300 can be greatly increased through such a configuration. Thus, more satisfactory heat dissipation of the first electronic component 1210 can be achieved.

[0043] Further, with reference to FIGS. 4, 5, 17, and 18, in some embodiments, the electromagnetic cooking device 1000 further includes a first shielding structure 1121. The first shielding structure 1121 surrounds a side of the first flow channel 1330 away from the body portion 1310.

[0044] When arranged at the body portion 1310, the plurality of fin portions 1320 is arranged at intervals, and a side of the first flow channel 1330 facing towards the body portion 1310 is surrounded by the body portion 1310, and other parts of the first flow channel 1330 is opened. In this embodiment, by providing the first shielding structure 1121 in such a manner that the first shielding structure 1121 surrounds the side of the first flow channel 1330 away from the body portion 1310, the first flow channel 1330 is relatively closed circumferentially. In this case, when the airflow flows from one end of the first flow channel 1330 and is discharged from the other end of the first flow channel 1330, it is beneficial for the airflow to flow in the first flow channel 1330 at a high velocity. Thus, an improvement in heat exchange efficiency is facilitated. It will be appreciated that the first shielding structure 1121 surrounds the first flow channel 1330, that is, the first shielding structure 1121 serves to block the airflow, avoiding leakage of the airflow to increase the flow velocity of the airflow in the first flow channel 1330. As a result, through the first shielding structure 1121, the airflow in the first flow channel 1330 is prevented from leaking to the second flow channel 1430, which would affect the heat dissipation of the second electronic component 1220.

[0045] With continued reference to FIGS. 4 and 5, in some embodiments, the electromagnetic cooking device 1000 includes a bottom casing 1100. The heat sink 1300 is mounted at the bottom casing 1100. The bottom casing 1100 is provided with a panel 1120 at a periphery of the bottom casing 1100. The panel 1120 is partially constructed as the first shielding structure 1121.

[0046] The bottom casing 1100 is a main structural member of the electromagnetic cooking device 1000, and configured for mounting of other components of the electromagnetic cooking device 1000. For example, the first fan 1610, the second fan 1620, the circuit board 1200, the heat sink 1300, and the coil assembly 1400 are mounted at the bottom casing 1100. The bottom casing 1100 may be made of a metal material or other materials. In order to meet mounting requirements for different components, the bottom casing 1100 generally has an irregular shape.

[0047] Generally speaking, the bottom casing 1100 includes a bottom plate 1110 and a panel 1120, and the panel 1120 is located at the periphery of the bottom plate 1110. When the heat sink 1300 is mounted at the bottom casing 1100, the heat sink 1300 is engaged with a part of the panel 1120, and the part of the panel 1120 is constructed as the first shielding structure 1121. For example, as illustrated in FIGS. 4, 5, 8, and 9, the panel 1120 includes a front panel 1123, a rear panel 1124, a left panel 1121, and a right panel 1122. The heat sink 1300, when mounted at the bottom casing 1100, is engaged with the left panel 1121, and the left panel 1121 surrounds the first flow channel 1330. Through such a configuration, the mounting requirements for various components can be met while taking full advantage of the structure of the bottom casing 1100.

[0048] With reference to FIGS. 4, 6, 8, 10, and 12, in some embodiments, the electromagnetic cooking device 1000 includes a first air duct 1510 and a second air duct 1520. The first air duct 1510 has an end in communication with the second fan 1620 and another end in communication with the second flow channel 1430. The first air duct 1510 is a structure configured to guide an airflow output from the second fan 1620 towards the second flow channel 1430. The second air duct 1520 has an end in communication with the second fan 1620 and another end in communication with the second flow channel 1430. The second air duct 1520 is a structure configured to guide an airflow output from the second fan 1620 towards the second flow channel 1430.

[0049] In this embodiment, the first air duct 1510 has an air outflowing direction, i.e., a direction in which the airflow is discharged from the first air duct 1510. The second air duct 1520 has an air outflowing direction, i.e., a direction in which the airflow is discharged from the second air duct 1520. The air outflowing direction of the first air duct 1510 is a first direction, and the air outflowing direction of the second air duct 1520 is a second direction. In this way, at least two air outflowing directions are defined.

[0050] For example, the air outflowing direction of the first air duct 1510 is towards a right rear of the first air duct 1510 (the first direction), and the air outflowing direction of the second air duct 1520 is towards a rear of the second air duct 1520 but offset by a predetermined angle relative to a right rear of the second air duct 1520 (the second direction). In this way, two air outflowing directions are defined.

[0051] For another example, air flowing out of the first air duct 1510 is divergent (in the first direction), and air flowing out of the second air duct 1520 is divergent by a smaller divergent angle than the air flowing out of the first air duct 1510 (in the second direction. In this way, two air outflowing directions are defined.

[0052] By allowing the air outflowing direction of the first air duct 1510 and the air outflowing direction of the second air duct 1520 to form the at least two air outflowing directions, the airflow output from the first air duct 1510 and the airflow output from the second air duct 1520 may be blown to more parts of the second flow channel 1430 compared with a case where there is one air outflowing direction. In this way, coverage of the airflow in the second flow channel 1430 is improved. Thus, the heat dissipation effect of the second electronic component 1220 and the coil assembly 1400 is improved.

[0053] For example, the circuit board 1200 and the coil assembly 1400 each have a predetermined size and have a plate shape. The second flow channel 1430 formed between the circuit board 1200 and the coil assembly 1400 has a size (length, width, and height) much larger than a size (length, width, and height) of the first flow channel 1330. The first air channel 1510 and the second air channel 1520 are much smaller than the second flow channel 1430. By allowing the first air channel 1510 and the second air channel 1520 to form the at least two air outflowing directions, the airflow can be easily blown to more parts of the second flow channel 1430. In this way, heat dissipation dead corners of the second flow channel 1430 are reduced. Thus, the heat dissipation effect is improved.

[0054] As illustrated in FIGS. 4, 6, 19, and 20, optionally, the electromagnetic cooking device 1000 includes a first air duct 1510. The first air duct 1510 has an end in communication with the second fan 1620 and another end in communication with the second flow channel 1430. The first air duct 1510 has an air outflowing direction towards the second electronic component 1220.

[0055] The air outflowing direction towards the second electronic component 1220 means that the airflow, when output from the first air duct 1510 and flowing into the second flow channel 1430, is blown towards the second electronic component 1220, to take away the heat of the second electronic component 1220. For example, the airflow, when output from the first air duct 1510 and flowing into the second flow channel 1430, is directly blown towards the second electronic component 1220 without any obstruction and reflection. As a result, the heat dissipation effect on the second electronic component 1220 can be improved. That is, the first air duct 1510 is a structure configured to guide the airflow output from the second fan 1620 towards the second flow channel 1430 and the second electronic component 1220.

[0056] For example, optionally, the circuit board 1200 is positioned at higher level than a lowest part of an air outflowing end of the first air duct 1510, and the air outflowing direction of the first air duct 1510 is parallel to the circuit board 1200. Through such a configuration, the airflow, when output from the first air duct 1510, can flow along a plane where the circuit board 1200 is located. Since the second electronic component 1220 protrudes from a surface of the circuit board 1200 relative to the circuit board 1200, a contact between the airflow and the second electronic component 1220 can be enhanced to avoid a predetermined distance between the airflow output from the first air duct 1510 and the circuit board 1200. Through such a configuration, the heat dissipation effect on the second electronic component 1220 can be enhanced.

[0057] Further, in some embodiments, the first air duct 1510 has an air outflow end of a flared shape. In this way, the airflow output from the first air duct 1510 can cover the second electronic components 1220 as much as possible. For example, an orientation illustrated in FIG. 19 is taken as an example, when observed from top to bottom, the first air duct 1510 has a dimension (in a left-right direction in FIG. 19) much smaller than a dimension of the circuit board 1200 (in the left-right direction in FIG. 19). By designing the air outflow end of the first air duct 1510 to be flared, the airflow can flow in a divergent manner and thus can flow through more positions of the circuit board 1200 to take away the heat of the second electronic components 1220 at different positions.

[0058] With reference to FIGS. 4, 6, 8, 10, and 12, optionally, the electromagnetic cooking device 1000 includes a second air duct 1520. The second air duct 1520 has an end in communication with the second fan 1620 and another end in communication with the second flow channel 1430. The second air duct 1520 has an outflowing direction towards the coil assembly 1400.

[0059] The air outflowing direction towards the coil assembly 1400 means that the airflow, when output from the second air duct 1520 and flowing into the second flow channel 1430, is blown towards the coil assembly 1400, to take away the heat of the coil assembly 1400. That is, the second air duct 1520 is a structure configured to guide the airflow output from the second fan 1620 towards the second flow channel 1430 and the coil assembly 1400.

[0060] For example, the airflow, when output from the second air duct 1520 and flowing into the second flow channel 1430, is directly blown towards the coil assembly 1400 without any obstruction and reflection. As a result, the heat dissipation effect on the coil assembly 1400 can be improved. As mentioned above, the coil assembly 1400 includes the support plate 1410 and the coil 1420 disposed at the support plate 1410. The airflow output from the second air duct 1520 is blown towards the support plate 1410 of the coil assembly 1400, and heat of the coil 1420 is transferred to the support plate 1410. As a result, the airflow is brought into contact with the support plate 1410 to take away the heat.

[0061] Optionally, the air outflowing direction of the second air duct 1520 is designed to be inclined relative to the coil assembly 1400, and the airflow output from the second air duct 1520 is in contact with the coil assembly 1400 in a tilted manner relative to the coil assembly 1400, to take away the heat of the coil assembly 1400. Generally speaking, the second fan 1620 and the second air duct 1520 are disposed at the bottom casing 1100, and the coil assembly 1400 is disposed above the second air duct 1520. By designing the air outflowing direction of the second air duct 1520 to be inclined relative to the coil assembly 1400, air flowing out of the second air duct 1520 can be blown towards the coil assembly 1400 without many direction changes.

[0062] For example, in combination with Figures 10, 21, and 22, in some embodiments, the coil assembly 1400 is disposed above the second air duct 1520, and a bottom 1521 of the second air duct 1520 is arranged to be inclined towards the coil assembly 1400 from the second fan 1620. In this way, the air outflowing direction of the second air duct 1520 is toward the coil assembly 1400. With reference to an orientation illustrated in FIG. 10, the second fan 1620 is horizontally placed on the bottom casing 1100. The phase "horizontally placed" means that a rotation axis of a fan wheel of the second fan 1620 extends in an up-down direction. The fan wheel of the second fan 1620 is a centrifugal impeller, which can reduce occupation of a space in the up-down direction. The coil assembly 1400 is located above the second fan 1620 and the second air duct 1520. The bottom 1521 of the second air duct 1520 is inclined towards the coil assembly 1400 from the second fan 1620. That is, the bottom of the second air duct 1520 is inclined relative to the coil assembly 1400. In this way, the airflow generated by the second fan 1620, when flowing through the second air duct 1520, flows towards the coil assembly 1400 under an action of the bottom 1521 of the second air duct 1520 and then is blown towards the coil assembly 1400. As a result, the contact between the airflow and the coil assembly 1400 is enhanced to take away the heat of the coil assembly 1400.

[0063] Further, with reference to FIGS. 2, 10, 12, 16, 21, and 22, in some embodiments, the electromagnetic cooking device 1000 further includes a second shielding structure 1124. The second air duct 1520 is disposed at an end of the second flow channel 1430, and the second shielding structure 1124 is disposed at the other end of the second flow channel 1430.

[0064] Since the second air duct 1520 is disposed at the end of the second flow channel 1430, when the airflow is output from the second air duct 1520 and blown towards the coil assembly 1400 in the titled manner relative to the coil assembly 1400, the airflow can be in quick contact with a part of the coil assembly 1400 close to the second air duct 1520 (a front end portion of the coil assembly 1400 in FIG. 16). When the airflow continues to flow along the coil assembly 1400, due to flowing characteristic of the airflow, as the airflow flows away from the second air duct 1520, the airflow will be divergent. As a result, the heat dissipation effect of the airflow output from the second air duct 1520 on a part of the coil assembly 1400 away from the second air duct 1520 (a rear end portion of the coil assembly 1400 in FIG. 16) becomes weaker. Therefore, in this embodiment, by disposing the second shielding structure 1124 at the other end of the second flow channel 1430, the airflow of the second air channel 1520, when flowing to the second shielding structure 1124, is blocked and then is diverted upwards to be in contact with the part of the coil assembly 1400 away from the second air channel 1520. In this way, the heat dissipation of the part of the coil assembly 1400 away from the second air channel 1520 is enhanced.

[0065] As mentioned above, other components of the electromagnetic cooking device 1000 are mounted at the bottom casing 1100. For example, in this embodiment, with reference to FIGS. 1 to 6, the coil assembly 1400 covers the bottom casing 1100. The circuit board 1200 is disposed between the coil assembly 1400 and the bottom casing 1100. Apart of the panel 1120 is designed as the second shielding structure 1124. For example, the rear panel 1124 is constructed as the second shielding structure 1124. Through such a configuration, the mounting requirements for various components can be met while making full advantage of the structure of the bottom casing 1100.

[0066] With reference to FIG. 1, in some embodiments, the first air duct 1510 and the second air duct 1520 are in communication with the second fan 1620. That is, one fan, i.e., the second fan 1620 can provide an airflow to both the first air duct 1510 and the second air duct 1520. Through such a configuration, the number of fans can be reduced to avoid a plurality of fans from occupying space and increasing cost while ensuring the air volume. For example, in this embodiment, the electromagnetic cooking device 1000 includes one first fan 1610 and one second fan 1620.

[0067] Of course, in other embodiments, the first air duct 1510 and the second air duct 1520 may be in communication with different second fans 1620. That is, the electromagnetic cooking device 1000 includes at least two second fans 1620. One of the at least two second fans 1620 is in communication with the first air duct 1510, and another one of the at least two second fans 1620 is in communication with the second air duct 1520. This solution is more suitable for an electromagnetic cooking device 1000 with a larger specification.

[0068] As described above, the coil assembly 1400, the circuit board 1200, and the heat sink 1300 of the electromagnetic cooking device 1000 are mounted at the bottom casing 1100. With reference to FIGS. 8, 10, and 12, in some embodiments, the first air duct 1510 and the second air duct 1520 may be disposed at the bottom casing 1100. For example, the first air duct 1510 and the second air duct 1520 may be designed to be integrally formed with the bottom plate 1110, and the first fan 1610 and the second fan 1620 may also be disposed at the bottom casing 1100. In this way, the coil assembly 1400 can cover the circuit board 1200, the heat sink 1300, the first fan 1610, the second fan 1620, the first air duct 1510, and the second air duct 1520. When the first fan 1610 and the second fan 1620 are disposed at the bottom casing 1100, air may inflow from a bottom of the bottom casing 1100 (the bottom plate 1110 has an air inlet).

[0069] Generally speaking, the heat sink 1300 needs to be fixedly connected to the circuit board 1200 to be joined together. In order to facilitate the mounting and the fixing of the heat sink 1300 to the circuit board 1200, the bottom casing 1100 is provided with a snap 1140 and a protruding tongue portion 1130. The heat sink 1300 is disposed at the circuit board 1200 (i.e., the heat sink 1300 is fixedly connected to the circuit board 1200). A side of the circuit board 1200 and a side of the heat sink 1300 are snapped between a bottom of the bottom casing 1100 and the protruding tongue portion 1130, and another side of the circuit board 1200 is connected to the snap 1140. In this way, the heat sink 1300 and the circuit board 1200 can be fixedly mounted to the bottom casing 1100.

[0070] For example, with reference to FIGS. 4 to 11, the bottom casing 1100 includes a bottom plate 1110 and a panel 1120 disposed at a periphery of the bottom plate 1110. The panel 1120 includes a front panel 1123, a rear panel 1124, a left panel 1121, and a right panel 1122. The protruding tongue portion 1130 is disposed at a top of the left panel 1121. The snap 1140 is disposed at the right panel. The heat sink 1300 and the circuit board 1200 are first connected to be assembled together, and then the side of the heat sink 1300 and the side (a left side) of the circuit board 1200 are snapped between the protruding tongue portion 1130 and the bottom plate 1110. Then, the other side (a right side) of the control circuit board 1200 is engaged with the snap 1140 to be snapped with each other. In this way, the mounting of the circuit board 1200 to the heat sink 1300 is realized conveniently and quickly.

[0071] With reference to FIG. 3, in some embodiments, the heat sink 1300 is constructed as at least part of a channel wall of the second channel 1430. In this way, the airflow output from the second fan 1620 into the second channel 1430 can also take away the heat of the heat sink 1300 (and the first electronic component 1210). In this way, the heat dissipation effect on the first electronic component 1210 is improved.

[0072] For example, the circuit board 1200 is disposed at the bottom plate 1110. The heat sink 1300 is disposed at a left side of the circuit board 1200, and the heat sink 1300 is tightly attached to the left panel 1121 to allow the first flow channel 1330 to be surrounded by the left panel 1121. The right panel 1122 is located at a right side of the circuit board 1200. The coil assembly 1400 covers the bottom casing 1100 to cover the circuit board 1200. The first fan 1610 and the second fan 1620 are disposed at a front side of the circuit board 1200. The first air duct 1510 and the second air duct 1520 are disposed between the second fan 1620 and the circuit board 1200. The heat sink 1300, the circuit board 1200, the right panel 1122, the rear panel 1124, and the coil assembly 1400 are constructed as the flow channel wall of the second flow channel 1430. The airflow output by the second fan 1620 may also take away the heat of the first electronic component 1210 when flowing into the second flow channel 1430. In this way, the airflow discharged from the second air duct 1520 may be blocked by the rear panel 1124 and diverted upwards when flowing to the rear panel 1124.

[0073] It will be appreciated that in order to discharge the airflow carrying heat out of the electromagnetic cooking device 1000, an air outlet 1150 needs to be provided. With reference to FIGS. 4 and 12, optionally, the bottom casing 1100 has an air outlet 1150. For example, the air outlet 1150 of the bottom casing 1100 may be formed at the rear panel 1124. The air outlet 1150 is in communication with an ambient environment. The air outlet 1150 may be configured to allow the airflow generated by the first fan 1610 to be discharged through the air outlet 1150, and also to allow the airflow generated by the second fan 1620 to be discharged through the air outlet 1150, and also the airflow generated by both the first fan 1610 and the second fan 1620 to be discharged through the air outlet 1150. In this way, the airflow carrying the heat can be discharged from the electromagnetic cooking device 1000 to the ambient environment through the air outlet 1150.

[0074] Furthermore, in some embodiments, the air outlet 1150 directly faces towards the first flow channel 1330. The phase "directly faces towards" means that the air outlet 1150 and the first flow channel 1330 are at least partially overlapped with each other in the air outflowing direction of the first flow channel 1330. In this way, the airflow discharged from the first flow channel 1330 can be quickly discharged through the air outlet 1150. When an amount of the heat generated by the first electronic component 1210 is much than an amount of the heat generated by the second electronic component 1220, with such a configuration, the rapid discharge of the heat from the electromagnetic cooking device 1000 can be facilitated without allowing the airflow to flow into the second flow channel 1430. As a result, the overall heat dissipation effect is improved.

[0075] When the air outlet 1150 directly faces towards the first flow channel 1330, the first air channel 1510 may be designed to be located closer to the heat sink 1300 than the second air channel 1520. In this way, the second air channel 1520 may be further away from the heat sink 1300. Since the airflow output from the second air channel 1520 is blocked by the second shielding structure 1124 (the rear panel 1124) and is diverted upwardly, the airflow output from the second air channel 1520 can be prevented from being discharged directly through the air outlet 1150 after flowing through the second flow channel. As a result, more airflow is in contact with the part of the coil assembly 1400 away from the second air channel 1520 before being discharged through the air outlet 1150.

[0076] The present invention also discloses a combination cooker 100. With reference to FIG. 23, the combination cooker 100 includes a range hood 2000 and the above-mentioned electromagnetic cooking device 1000. That is, the range hood 2000 and the electromagnetic cooking device 1000 are combined together. For example, the range hood 2000 is located in a middle part, and the electromagnetic cooking devices 1000 are disposed at a left side and a right side of the range hood 2000, respectively. The electromagnetic cooking device 1000 includes a circuit board 1200, a heat sink 1300, a coil assembly 1400, a first fan 1610, and a second fan 1620. The circuit board 1200 is provided with a first electronic component 1210 and a second electronic component 1220. The heat sink 1300 has a first flow channel 1330. The first flow channel 1330 is adapted to allow an airflow to flow through the first flow channel 1330. The first electronic component 1210 is designed to be in contact with the heat sink 1300. The coil assembly 1400 and the circuit board 1200 are spaced apart from each other to form a second flow channel 1430 between the coil assembly 1400 and the circuit board 1200. The second flow channel 1430 is adapted to allow an airflow to flow through the second flow channel 1430. The second electronic component 1220 is located in the second flow channel 1430. The first fan 1610 is configured to generate an airflow flowing through the first flow channel 1330, and the second fan 1620 is configured to generate airflow flowing through the second flow channel 1430.

[0077] Since the first electronic component 1210 is brought into contact with the heat sink 1300, the airflow generated by the first fan 1610 can take away heat of the first electronic component 1210 when flowing through the first flow channel 1330 of the heat sink 1300. In addition, since the second electronic component 1220 is disposed in the second flow channel 1430, the airflow generated by the second fan 1620 can take away heat of the second electronic component 1220 when flowing through the second flow channel 1430. Since more satisfactory heat dissipation for the first electronic component 1210 can be implemented by the heat sink 1300, the first electronic component 1210 may be an electronic component with larger heat generation, while the second electronic component 1220 may be an electronic component with smaller heat generation. In addition, under the actions of the first fan 1610 and the second fan 1620, sufficient air volume may be provided for the first electronic component 1210 and the second electronic component 1220 for heat dissipation. Through such a configuration, accurate and effective heat dissipation of different electronic components can be achieved. As a result, the electromagnetic cooking device 1000 can operate stably. It will be appreciated that the electromagnetic cooking device 1000 of the combination cooker 100 of this embodiment adopts the technical solutions of the above embodiments, and thus has at least the beneficial effects brought by the technical solutions of the above embodiments, and details thereof will be omitted herein.

Examples

Embodiment Construction

[0032]The present invention provides an electromagnetic cooking device 1000. As illustrated in FIGS. 1 to 5, in some embodiments, the electromagnetic cooking device 1000 includes a circuit board 1200, a heat sink 1300, a coil assembly 1400, a first fan 1610, and a second fan 1620. The circuit board 1200 is provided with a first electronic component 1210 and a second electronic component 1220. The heat sink 1300 has a first flow channel 1330. The first flow channel 1330 is adapted to allow an airflow to flow through the first flow channel 1330. The first electronic component 1210 is designed to be in contact with the heat sink 1300. The coil assembly 1400 and the circuit board 1200 are spaced apart from each other to form a second flow channel 1430 between the coil assembly 1400 and the circuit board 1200. The second flow channel 1430 is adapted to allow an airflow to flow through the second flow channel 1430. The second electronic component 1220 is located in the second flow channel...

FIELD

[0001] The present invention relates to the technical field of household appliances, and more particularly, to an electromagnetic cooking device and a combination cooker.BACKGROUND

[0002] An electromagnetic cooking device such as an electromagnetic cooker is internally provided with a large number of electronic components. These electronic components would generate a large amount of heat during their operation, and accumulation of the heat can reduce operational stability of the electronic components. To this end, it is necessary to dissipate the heat of the electronic components. The present invention herein provides a solution in which the heat of the electronic components can be effectively dissipated.SUMMARY

[0003] The present invention aims to solve one of the technical problems in the related art at least to some extent. To this end, the present invention provides an electromagnetic cooking device.

[0004] In order to achieve the above object, the present invention discloses an electromagnetic cooking device. The electromagnetic cooking device includes a circuit board, a heat sink, coil assembly, a first fan, and a second fan. The circuit board is provided with a first electronic component and a second electronic component. The heat sink has a first flow channel. The first electronic component is in contact with the heat sink. A second flow channel is defined between the coil assembly and the circuit board. The second electronic component is located in the second flow channel. The first fan is adapted to generate an airflow flowing through the first flow channel. The second fan is adapted to generate an airflow flowing through the second flow channel.

[0005] Optionally, the heat sink includes a body portion and a plurality of fin portions. The plurality of fin portions is arranged at the body portion, and the first flow channel is formed between adjacent fin portions of the plurality of fin portions.

[0006] Optionally, the body portion is in contact with the first electronic component.

[0007] Optionally, the electromagnetic cooking device further includes a first shielding structure.

[0008] Optionally, a side of the first flow channel facing away from the body portion is surrounded by the first shielding structure.

[0009] Optionally, the electromagnetic cooking device further includes a bottom casing. Optionally, the heat sink is mounted at the bottom casing. Optionally, the bottom casing is provided with a panel at a periphery of the bottom housing. Optionally, the panel is partially constructed as the first shielding structure.

[0010] Optionally, the electromagnetic cooking device further includes a first air duct and a second air duct. The second fan is in communication with the second flow channel via the first air duct, and the second fan is in communication with the second flow channel via the second air duct. Optionally, the first air duct is configured to allow air to outflow in a first direction, and the second air duct is configured to allow air to outflow in a second direction, to form at least two air outflowing directions.

[0011] Optionally, the electromagnetic cooking device further includes a first air duct. The second fan is in communication with the second flow channel via the first air duct, and the first air duct has an air outflowing direction towards the second electronic component.

[0012] Optionally, the circuit board is located at higher level than a lowest part of an air exhaust end of the first air duct. Optionally, the air outflowing direction of the first air duct is parallel to the circuit board.

[0013] Optionally, the first air duct has an air outflow end of a flared shape.

[0014] Optionally, the electromagnetic cooking device further includes a second air duct. The second fan is in communication with the second flow channel via the second air duct, and the second air duct has an air outflowing direction towards the coil assembly.

[0015] Optionally, the air outflowing direction of the second air duct is inclined towards the coil assembly.

[0016] Optionally, the coil assembly is located above the second air duct, and a bottom of the second air duct is inclined towards the coil assembly from the second fan.

[0017] Optionally, the electromagnetic cooking device further includes a second shielding structure. The second air duct is disposed at an end of the second flow channel, and the second shielding structure is disposed at another end of the second flow channel.

[0018] Optionally, the electromagnetic cooking device further includes a bottom casing. The circuit board and the coil assembly are disposed at the bottom housing. Optionally, the bottom casing is provided with a panel at a periphery of the bottom housing, and the panel is partially constructed as the second shielding structure.

[0019] Optionally, the first air duct of the electromagnetic cooking device is located closer to the heat sink than the second air duct of the electromagnetic cooking device.

[0020] Optionally, the first air duct of the electromagnetic cooking device and the second air duct of the electromagnetic cooking device are in communication with one second fan.

[0021] Optionally, the electromagnetic cooking device includes at least two second fans. Optionally, one of the two second fans is in communication with the first air duct of the electromagnetic cooking device, and / or another one of the two second fans is in communication with the second air duct of the electromagnetic cooking device.

[0022] Optionally, the electromagnetic cooking device further includes a bottom casing. The coil assembly is disposed at the bottom casing, and / or the circuit board and the heat sink are disposed between the bottom casing and the coil assembly.

[0023] Optionally, the bottom casing has an air outlet. The air outlet is adapted to allow the airflow generated by the first fan and / or the airflow generated by the second fan to be discharged through the air outlet.

[0024] Optionally, the air outlet directly faces towards the first flow channel.

[0025] Optionally, the bottom casing is provided with a protruding tongue portion and a snap. Optionally, the heat sink is disposed at the circuit board, a side of the heat sink and a side of the circuit board are snapped between the protruding tongue portion and a bottom of the bottom housing, and / or another side of the circuit board is connected to the snap.

[0026] Optionally, the heat sink is constructed as at least part of a flow channel wall of the second flow channel.

[0027] A second aspect of the present invention discloses a combination cooker. The combination cooker includes a range hood and the electromagnetic cooking device as described above.

[0028] In the technical solutions of the present invention, since the first electronic component is in contact with the heat sink, the airflow generated by the first fan can take away heat of the first electronic component when flowing through the first flow channel of the heat sink. In addition, since the second electronic component is disposed in the second flow channel, the airflow generated by the second fan can take away heat of the second electronic component when flowing through the second flow channel. Since more satisfactory heat dissipation for the first electronic component can be implemented by the heat sink, the first electronic component may be an electronic component with larger heat generation, while the second electronic component may be an electronic component with smaller heat generation. In addition, under the actions of the first fan and the second fan, sufficient air volume may be provided for the first electronic component and the second electronic component for the heat dissipation. Through such a configuration, accurate and effective heat dissipation of different electronic components can be achieved. As a result, the electromagnetic cooking device can operate stably.

[0029] Additional aspects and advantages of the embodiments of present invention will be provided at least in part in the following description, or will become apparent in part from the following description, or can be learned from the practice of the embodiments of the present invention.BRIEF DESCRIPTION OF THE DRAWINGS

[0030] FIG. 1 is a schematic view of an electromagnetic cooking device according to some embodiments. FIG. 2 is an exploded view of an electromagnetic cooking device according to some embodiments. FIG. 3 is a section view of an electromagnetic cooking device according to some embodiments. FIG. 4 is a schematic partial structural view of an electromagnetic cooking device according to some embodiments. FIG. 5 is an enlarged view of part A in FIG. 4. FIG. 6 is a schematic partial structural view of the electromagnetic cooking device according to some embodiments in a different viewing angle from FIG. 4. FIG. 7 is an enlarged view of part B in FIG. 6. FIG. 8 is a schematic view of a bottom casing according to some embodiments. FIG. 9 is an enlarged view of part C in FIG. 8. FIG. 10 is a schematic view of the bottom casing according to some embodiments in a different viewing angle from FIG. 8. FIG. 11 is an enlarged view of part D in FIG. 10. FIG. 12 is a schematic view of the bottom casing according to some embodiments in a different viewing angle from FIGS. 8 and 10. FIG. 13 is a schematic assembly view of a circuit board, a heat sink, a first electronic component, and a second electronic component according to some embodiments. FIG. 14 is schematic assembly view of the circuit board, the heat sink, the first electronic component, and the second electronic component according to some embodiments in a different viewing angle from FIG. 13. FIG. 15 is an enlarged view of part E in FIG. 14. FIG. 16 is a schematic view of a coil assembly according to some embodiments. FIG. 17 is a schematic view of an airflow discharged by a first fan according to some embodiments. FIG. 18 is a schematic view of the airflow discharged by the first fan according to some embodiments in a different viewing angle from FIG. 17. FIG. 19 is a schematic view of an airflow discharged by a second fan through a first air duct according to some embodiments. FIG. 20 is a schematic view of the airflow discharged by the second fan through the first air duct according to some embodiments in a different viewing angle from FIG. 19. FIG. 21 is a schematic view of an airflow discharged by a second fan through a second air duct according to some embodiments. FIG. 22 is a schematic view of the airflow discharged by the second fan through the second air duct according to some embodiments in a different viewing angle from FIG. 21. FIG. 23 is a schematic diagram of a combination cooker according to some embodiments. Description of reference numbers:

[0031] combination cooker 100, electromagnetic cooking device 1000, bottom casing 1100, bottom plate 1110, panel 1120, left panel / first shielding structure 1121, right panel 1122, front panel 1123, rear panel / second shielding structure 1124, protruding tongue portion 1130, snap 1140, air outlet 1150, circuit board 1200, first electronic component 1210, second electronic component 1220, heat sink 1300, body portion 1310, fin portion 1320, first flow channel 1330, coil assembly 1400, support plate 1410, coil 1420, second flow channel 1430, first air duct 1510, second air duct 1520, bottom 1521 of second air duct 1520, first fan 1610, second fan 1620, and range hood 2000.DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] The present invention provides an electromagnetic cooking device 1000. As illustrated in FIGS. 1 to 5, in some embodiments, the electromagnetic cooking device 1000 includes a circuit board 1200, a heat sink 1300, a coil assembly 1400, a first fan 1610, and a second fan 1620. The circuit board 1200 is provided with a first electronic component 1210 and a second electronic component 1220. The heat sink 1300 has a first flow channel 1330. The first flow channel 1330 is adapted to allow an airflow to flow through the first flow channel 1330. The first electronic component 1210 is designed to be in contact with the heat sink 1300. The coil assembly 1400 and the circuit board 1200 are spaced apart from each other to form a second flow channel 1430 between the coil assembly 1400 and the circuit board 1200. The second flow channel 1430 is adapted to allow an airflow to flow through the second flow channel 1430. The second electronic component 1220 is located in the second flow channel 1430. The first fan 1610 is configured to generate an airflow flowing through the first flow channel 1330, and the second fan 1620 is configured to generate airflow flowing through the second flow channel 1430.

[0033] In this embodiment, since the first electronic component 1210 is brought into contact with the heat sink 1300, the airflow generated by the first fan 1610 can take away heat of the first electronic component 1210 when flowing through the first flow channel 1330 of the heat sink 1300. In addition, since the second electronic component 1220 is disposed in the second flow channel 1430, the airflow generated by the second fan 1620 can take away heat of the second electronic component 1220 when flowing through the second flow channel 1430. Since more satisfactory heat dissipation for the first electronic component 1210 can be implemented by the heat sink 1300, the first electronic component 1210 may be an electronic component with larger heat generation, and the second electronic component 1220 may be an electronic component with lower heat generation. In addition, under the actions of the first fan 1610 and the second fan 1620, sufficient air volume may be supplied to the first electronic component 1210 and the second electronic component 1220 for heat dissipation. Through such a configuration, accurate and effective heat dissipation for different electronic components can be achieved. As a result, the electromagnetic cooking device 1000 can operate stably.

[0034] Specifically, the electromagnetic cooking device 1000 is configured to heat cookware based on an electromagnetic induction phenomenon. That is, in the electromagnetic cooking device 1000, an alternating magnetic field may be generated, and an eddy current is induced in a conductor (the cookware) in the alternating magnetic field. Joule heating effect of the eddy current rises a temperature of the conductor (the cookware). Thus, heating is implemented. In the electromagnetic cooking device 1000, the alternating magnetic field is generated mainly through a cooperation between the circuit board 1200 and the coil assembly 1400.

[0035] The circuit board 1200 is provided with the first electronic component 1210 and the second electronic component 1220. The electronic components (the first electronic component 1210, the second electronic component 1220) include but are not limited to resistors, capacitors, inductors, potentiometers, electron tubes, heat sinks 1300, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, electronic transformers, relays, bridge rectifiers, and insulated gate bipolar transistors (IGBTs).

[0036] The coil assembly 1400 is configured to generate the alternating magnetic field. For example, the coil assembly 1400 includes a support plate 1410 and a coil 1420. The coil 1420 may include a plurality of coils 1420 arranged at the support plate 1410 side by side. The support plate 1410 can support the plurality of coils 1420. The alternating current flows through the coil 1420, and therefore an alternating magnetic field with a continuously changing direction may be generated. The coil assembly 1400 and the circuit board 1200 are spaced apart from each other to form the second flow channel 1430 between the coil assembly 1400 and the circuit board 1200. The second flow channel 1430 is configured to allow the airflow to flow through the second flow channel 1430, and the second electronic component 1220 is located in the second flow channel 1430. The airflow, when flowing through the second flow channel 1430, can take away the heat of the second electronic component 1220.

[0037] It will be appreciated that the coil assembly 1400 also generates heat during its operation, and the airflow, when flowing through the second flow channel 1430, can also take away the heat of the coil assembly 1400. Generally speaking, the support plate 1410 may be made of a material selected from materials having satisfactory thermal conductivity, such as metal materials. Aluminum and stainless steel may be selected to prepare the support plate 1410. The heat generated by the coil 1420 during its operation may be transferred to the support plate 1410. The airflow, when flowing through the second flow channel 1430, can take away the heat of the support plate 1410, i.e., the heat of the coil 1420. In this way, the heat dissipation of the coil assembly 1400 can be achieved.

[0038] The heat dissipation of the first electronic component 1210 mainly depends on the heat sink 1300. The heat sink 1300 generally has a larger heat dissipation area than the first electronic component 1210, and the heat sink 1300 has satisfactory thermal conductivity. For example, the heat sink 1300 is made of a metal material. The first electronic component 1210 needs to be in contact with the heat sink 1300. For example, the first electronic component 1210 is attached to the heat sink 1300, and the heat generated by the first electronic component 1210 during its operation is transferred to the heat sink 1300. The heat sink 1300 has a first flow channel 1330. The first flow channel 1330 is configured to allow an airflow to flow through the first flow channel 1330. The airflow, when flowing through the first flow channel 1330, can take away the heat of the heat sink 1300. In this way, the heat dissipation of the first electronic component 1210 can be achieved.

[0039] Through the heat sink 1300, faster heat dissipation can be achieved for the first electronic component 1210 than the second electronic component 1220. Generally speaking, the circuit board 1200 has electronic components with different heat generation (or power). Therefore, the electronic components with larger heat generation (or power) may be brought into contact with the heat sink 1300 (such as IGBT), while the electronic components with relatively lower heat generation (or power) may be brought into contact with the airflow, achieving the heat dissipation of different electronic components. That is, the first electronic component 1210 and the second electronic component 1220 may be designed in such a manner that the heat generation (or the power) of the first electronic component 1210 is greater than the heat generation (or the power) of the second electronic component 1220. In this way, the accurate heat dissipation can be achieved. It will be appreciated that an electronic component on the circuit board 1200 that is in contact with the heat sink 1300 may be regarded as the first electronic components 1210, and an electronic component on the circuit board 1200 that is in no contact with the heat sink 1300 and located in the second flow channel 1430 may be regarded as the second electronic component 1220.

[0040] The airflow flowing through the first flow channel 1330 is generated by the first fan 1610, and the airflow flowing through the second flow channel 1430 is generated by the second fan 1620. For example, the first fan 1610 and the second fan 1620 each are configured to suck ambient air. By providing the first fan 1610 and the second fan 1620, the sufficient air volume can be generated to take away the heat, thereby ensuring a heat dissipation effect. Compared with providing a single fan to provide the same air volume, in this embodiment, by providing the first fan 1610 and the second fan 1620, it is beneficial to reduce a rotational speed of the first fan 1610 and a rotational speed of the second fan 1620. Thus, operating noise can be reduced.

[0041] With reference to FIGS. 13, 14, and 15, in some embodiments, the heat sink 1300 includes a body portion 1310 and a fin portion 1320. The first electronic component 1210 is in contact with the body portion 1310. The fin portion 1320 is disposed at the body portion 1310. The fin portion 1320 may include a plurality of fin portions 1320 (the plurality means two or more), and the first flow channel 1330 is defined between adjacent fin portions 1320 of the plurality of fin portions 1320. The body portion 1310 and the fin portion 1320 may be integrally formed, or the body portion 1310 and the fin portion 1320 may also be separate parts connected and fixed together by connecting means.

[0042] The body portion 1310 has an inclined surface inclined relative to the circuit board 1200. The first electronic component 1210 is attached to the inclined surface. The fin portions 1320 are arranged at the body portion 1310, and two adjacent fin portions 1320 are spaced apart from each other. Therefore, the first flow channel 1330 is defined between the adjacent fin portions 1320. The heat of the first electronic component 1210 is transferred to the body portion 1310 and then to the fin portions 1320. The airflow, when flowing through the first flow channel 1330, can take away the heat of the fin portions 1320. Thus, the heat dissipation of the first electronic component 1210 can be achieved. Since the plurality of fin portions 1320 are provided, a heat dissipation area of the heat sink 1300 can be greatly increased through such a configuration. Thus, more satisfactory heat dissipation of the first electronic component 1210 can be achieved.

[0043] Further, with reference to FIGS. 4, 5, 17, and 18, in some embodiments, the electromagnetic cooking device 1000 further includes a first shielding structure 1121. The first shielding structure 1121 surrounds a side of the first flow channel 1330 away from the body portion 1310.

[0044] When arranged at the body portion 1310, the plurality of fin portions 1320 is arranged at intervals, and a side of the first flow channel 1330 facing towards the body portion 1310 is surrounded by the body portion 1310, and other parts of the first flow channel 1330 is opened. In this embodiment, by providing the first shielding structure 1121 in such a manner that the first shielding structure 1121 surrounds the side of the first flow channel 1330 away from the body portion 1310, the first flow channel 1330 is relatively closed circumferentially. In this case, when the airflow flows from one end of the first flow channel 1330 and is discharged from the other end of the first flow channel 1330, it is beneficial for the airflow to flow in the first flow channel 1330 at a high velocity. Thus, an improvement in heat exchange efficiency is facilitated. It will be appreciated that the first shielding structure 1121 surrounds the first flow channel 1330, that is, the first shielding structure 1121 serves to block the airflow, avoiding leakage of the airflow to increase the flow velocity of the airflow in the first flow channel 1330. As a result, through the first shielding structure 1121, the airflow in the first flow channel 1330 is prevented from leaking to the second flow channel 1430, which would affect the heat dissipation of the second electronic component 1220.

[0045] With continued reference to FIGS. 4 and 5, in some embodiments, the electromagnetic cooking device 1000 includes a bottom casing 1100. The heat sink 1300 is mounted at the bottom casing 1100. The bottom casing 1100 is provided with a panel 1120 at a periphery of the bottom casing 1100. The panel 1120 is partially constructed as the first shielding structure 1121.

[0046] The bottom casing 1100 is a main structural member of the electromagnetic cooking device 1000, and configured for mounting of other components of the electromagnetic cooking device 1000. For example, the first fan 1610, the second fan 1620, the circuit board 1200, the heat sink 1300, and the coil assembly 1400 are mounted at the bottom casing 1100. The bottom casing 1100 may be made of a metal material or other materials. In order to meet mounting requirements for different components, the bottom casing 1100 generally has an irregular shape.

[0047] Generally speaking, the bottom casing 1100 includes a bottom plate 1110 and a panel 1120, and the panel 1120 is located at the periphery of the bottom plate 1110. When the heat sink 1300 is mounted at the bottom casing 1100, the heat sink 1300 is engaged with a part of the panel 1120, and the part of the panel 1120 is constructed as the first shielding structure 1121. For example, as illustrated in FIGS. 4, 5, 8, and 9, the panel 1120 includes a front panel 1123, a rear panel 1124, a left panel 1121, and a right panel 1122. The heat sink 1300, when mounted at the bottom casing 1100, is engaged with the left panel 1121, and the left panel 1121 surrounds the first flow channel 1330. Through such a configuration, the mounting requirements for various components can be met while taking full advantage of the structure of the bottom casing 1100.

[0048] With reference to FIGS. 4, 6, 8, 10, and 12, in some embodiments, the electromagnetic cooking device 1000 includes a first air duct 1510 and a second air duct 1520. The first air duct 1510 has an end in communication with the second fan 1620 and another end in communication with the second flow channel 1430. The first air duct 1510 is a structure configured to guide an airflow output from the second fan 1620 towards the second flow channel 1430. The second air duct 1520 has an end in communication with the second fan 1620 and another end in communication with the second flow channel 1430. The second air duct 1520 is a structure configured to guide an airflow output from the second fan 1620 towards the second flow channel 1430.

[0049] In this embodiment, the first air duct 1510 has an air outflowing direction, i.e., a direction in which the airflow is discharged from the first air duct 1510. The second air duct 1520 has an air outflowing direction, i.e., a direction in which the airflow is discharged from the second air duct 1520. The air outflowing direction of the first air duct 1510 is a first direction, and the air outflowing direction of the second air duct 1520 is a second direction. In this way, at least two air outflowing directions are defined.

[0050] For example, the air outflowing direction of the first air duct 1510 is towards a right rear of the first air duct 1510 (the first direction), and the air outflowing direction of the second air duct 1520 is towards a rear of the second air duct 1520 but offset by a predetermined angle relative to a right rear of the second air duct 1520 (the second direction). In this way, two air outflowing directions are defined.

[0051] For another example, air flowing out of the first air duct 1510 is divergent (in the first direction), and air flowing out of the second air duct 1520 is divergent by a smaller divergent angle than the air flowing out of the first air duct 1510 (in the second direction. In this way, two air outflowing directions are defined.

[0052] By allowing the air outflowing direction of the first air duct 1510 and the air outflowing direction of the second air duct 1520 to form the at least two air outflowing directions, the airflow output from the first air duct 1510 and the airflow output from the second air duct 1520 may be blown to more parts of the second flow channel 1430 compared with a case where there is one air outflowing direction. In this way, coverage of the airflow in the second flow channel 1430 is improved. Thus, the heat dissipation effect of the second electronic component 1220 and the coil assembly 1400 is improved.

[0053] For example, the circuit board 1200 and the coil assembly 1400 each have a predetermined size and have a plate shape. The second flow channel 1430 formed between the circuit board 1200 and the coil assembly 1400 has a size (length, width, and height) much larger than a size (length, width, and height) of the first flow channel 1330. The first air channel 1510 and the second air channel 1520 are much smaller than the second flow channel 1430. By allowing the first air channel 1510 and the second air channel 1520 to form the at least two air outflowing directions, the airflow can be easily blown to more parts of the second flow channel 1430. In this way, heat dissipation dead corners of the second flow channel 1430 are reduced. Thus, the heat dissipation effect is improved.

[0054] As illustrated in FIGS. 4, 6, 19, and 20, optionally, the electromagnetic cooking device 1000 includes a first air duct 1510. The first air duct 1510 has an end in communication with the second fan 1620 and another end in communication with the second flow channel 1430. The first air duct 1510 has an air outflowing direction towards the second electronic component 1220.

[0055] The air outflowing direction towards the second electronic component 1220 means that the airflow, when output from the first air duct 1510 and flowing into the second flow channel 1430, is blown towards the second electronic component 1220, to take away the heat of the second electronic component 1220. For example, the airflow, when output from the first air duct 1510 and flowing into the second flow channel 1430, is directly blown towards the second electronic component 1220 without any obstruction and reflection. As a result, the heat dissipation effect on the second electronic component 1220 can be improved. That is, the first air duct 1510 is a structure configured to guide the airflow output from the second fan 1620 towards the second flow channel 1430 and the second electronic component 1220.

[0056] For example, optionally, the circuit board 1200 is positioned at higher level than a lowest part of an air outflowing end of the first air duct 1510, and the air outflowing direction of the first air duct 1510 is parallel to the circuit board 1200. Through such a configuration, the airflow, when output from the first air duct 1510, can flow along a plane where the circuit board 1200 is located. Since the second electronic component 1220 protrudes from a surface of the circuit board 1200 relative to the circuit board 1200, a contact between the airflow and the second electronic component 1220 can be enhanced to avoid a predetermined distance between the airflow output from the first air duct 1510 and the circuit board 1200. Through such a configuration, the heat dissipation effect on the second electronic component 1220 can be enhanced.

[0057] Further, in some embodiments, the first air duct 1510 has an air outflow end of a flared shape. In this way, the airflow output from the first air duct 1510 can cover the second electronic components 1220 as much as possible. For example, an orientation illustrated in FIG. 19 is taken as an example, when observed from top to bottom, the first air duct 1510 has a dimension (in a left-right direction in FIG. 19) much smaller than a dimension of the circuit board 1200 (in the left-right direction in FIG. 19). By designing the air outflow end of the first air duct 1510 to be flared, the airflow can flow in a divergent manner and thus can flow through more positions of the circuit board 1200 to take away the heat of the second electronic components 1220 at different positions.

[0058] With reference to FIGS. 4, 6, 8, 10, and 12, optionally, the electromagnetic cooking device 1000 includes a second air duct 1520. The second air duct 1520 has an end in communication with the second fan 1620 and another end in communication with the second flow channel 1430. The second air duct 1520 has an outflowing direction towards the coil assembly 1400.

[0059] The air outflowing direction towards the coil assembly 1400 means that the airflow, when output from the second air duct 1520 and flowing into the second flow channel 1430, is blown towards the coil assembly 1400, to take away the heat of the coil assembly 1400. That is, the second air duct 1520 is a structure configured to guide the airflow output from the second fan 1620 towards the second flow channel 1430 and the coil assembly 1400.

[0060] For example, the airflow, when output from the second air duct 1520 and flowing into the second flow channel 1430, is directly blown towards the coil assembly 1400 without any obstruction and reflection. As a result, the heat dissipation effect on the coil assembly 1400 can be improved. As mentioned above, the coil assembly 1400 includes the support plate 1410 and the coil 1420 disposed at the support plate 1410. The airflow output from the second air duct 1520 is blown towards the support plate 1410 of the coil assembly 1400, and heat of the coil 1420 is transferred to the support plate 1410. As a result, the airflow is brought into contact with the support plate 1410 to take away the heat.

[0061] Optionally, the air outflowing direction of the second air duct 1520 is designed to be inclined relative to the coil assembly 1400, and the airflow output from the second air duct 1520 is in contact with the coil assembly 1400 in a tilted manner relative to the coil assembly 1400, to take away the heat of the coil assembly 1400. Generally speaking, the second fan 1620 and the second air duct 1520 are disposed at the bottom casing 1100, and the coil assembly 1400 is disposed above the second air duct 1520. By designing the air outflowing direction of the second air duct 1520 to be inclined relative to the coil assembly 1400, air flowing out of the second air duct 1520 can be blown towards the coil assembly 1400 without many direction changes.

[0062] For example, in combination with Figures 10, 21, and 22, in some embodiments, the coil assembly 1400 is disposed above the second air duct 1520, and a bottom 1521 of the second air duct 1520 is arranged to be inclined towards the coil assembly 1400 from the second fan 1620. In this way, the air outflowing direction of the second air duct 1520 is toward the coil assembly 1400. With reference to an orientation illustrated in FIG. 10, the second fan 1620 is horizontally placed on the bottom casing 1100. The phase "horizontally placed" means that a rotation axis of a fan wheel of the second fan 1620 extends in an up-down direction. The fan wheel of the second fan 1620 is a centrifugal impeller, which can reduce occupation of a space in the up-down direction. The coil assembly 1400 is located above the second fan 1620 and the second air duct 1520. The bottom 1521 of the second air duct 1520 is inclined towards the coil assembly 1400 from the second fan 1620. That is, the bottom of the second air duct 1520 is inclined relative to the coil assembly 1400. In this way, the airflow generated by the second fan 1620, when flowing through the second air duct 1520, flows towards the coil assembly 1400 under an action of the bottom 1521 of the second air duct 1520 and then is blown towards the coil assembly 1400. As a result, the contact between the airflow and the coil assembly 1400 is enhanced to take away the heat of the coil assembly 1400.

[0063] Further, with reference to FIGS. 2, 10, 12, 16, 21, and 22, in some embodiments, the electromagnetic cooking device 1000 further includes a second shielding structure 1124. The second air duct 1520 is disposed at an end of the second flow channel 1430, and the second shielding structure 1124 is disposed at the other end of the second flow channel 1430.

[0064] Since the second air duct 1520 is disposed at the end of the second flow channel 1430, when the airflow is output from the second air duct 1520 and blown towards the coil assembly 1400 in the titled manner relative to the coil assembly 1400, the airflow can be in quick contact with a part of the coil assembly 1400 close to the second air duct 1520 (a front end portion of the coil assembly 1400 in FIG. 16). When the airflow continues to flow along the coil assembly 1400, due to flowing characteristic of the airflow, as the airflow flows away from the second air duct 1520, the airflow will be divergent. As a result, the heat dissipation effect of the airflow output from the second air duct 1520 on a part of the coil assembly 1400 away from the second air duct 1520 (a rear end portion of the coil assembly 1400 in FIG. 16) becomes weaker. Therefore, in this embodiment, by disposing the second shielding structure 1124 at the other end of the second flow channel 1430, the airflow of the second air channel 1520, when flowing to the second shielding structure 1124, is blocked and then is diverted upwards to be in contact with the part of the coil assembly 1400 away from the second air channel 1520. In this way, the heat dissipation of the part of the coil assembly 1400 away from the second air channel 1520 is enhanced.

[0065] As mentioned above, other components of the electromagnetic cooking device 1000 are mounted at the bottom casing 1100. For example, in this embodiment, with reference to FIGS. 1 to 6, the coil assembly 1400 covers the bottom casing 1100. The circuit board 1200 is disposed between the coil assembly 1400 and the bottom casing 1100. Apart of the panel 1120 is designed as the second shielding structure 1124. For example, the rear panel 1124 is constructed as the second shielding structure 1124. Through such a configuration, the mounting requirements for various components can be met while making full advantage of the structure of the bottom casing 1100.

[0066] With reference to FIG. 1, in some embodiments, the first air duct 1510 and the second air duct 1520 are in communication with the second fan 1620. That is, one fan, i.e., the second fan 1620 can provide an airflow to both the first air duct 1510 and the second air duct 1520. Through such a configuration, the number of fans can be reduced to avoid a plurality of fans from occupying space and increasing cost while ensuring the air volume. For example, in this embodiment, the electromagnetic cooking device 1000 includes one first fan 1610 and one second fan 1620.

[0067] Of course, in other embodiments, the first air duct 1510 and the second air duct 1520 may be in communication with different second fans 1620. That is, the electromagnetic cooking device 1000 includes at least two second fans 1620. One of the at least two second fans 1620 is in communication with the first air duct 1510, and another one of the at least two second fans 1620 is in communication with the second air duct 1520. This solution is more suitable for an electromagnetic cooking device 1000 with a larger specification.

[0068] As described above, the coil assembly 1400, the circuit board 1200, and the heat sink 1300 of the electromagnetic cooking device 1000 are mounted at the bottom casing 1100. With reference to FIGS. 8, 10, and 12, in some embodiments, the first air duct 1510 and the second air duct 1520 may be disposed at the bottom casing 1100. For example, the first air duct 1510 and the second air duct 1520 may be designed to be integrally formed with the bottom plate 1110, and the first fan 1610 and the second fan 1620 may also be disposed at the bottom casing 1100. In this way, the coil assembly 1400 can cover the circuit board 1200, the heat sink 1300, the first fan 1610, the second fan 1620, the first air duct 1510, and the second air duct 1520. When the first fan 1610 and the second fan 1620 are disposed at the bottom casing 1100, air may inflow from a bottom of the bottom casing 1100 (the bottom plate 1110 has an air inlet).

[0069] Generally speaking, the heat sink 1300 needs to be fixedly connected to the circuit board 1200 to be joined together. In order to facilitate the mounting and the fixing of the heat sink 1300 to the circuit board 1200, the bottom casing 1100 is provided with a snap 1140 and a protruding tongue portion 1130. The heat sink 1300 is disposed at the circuit board 1200 (i.e., the heat sink 1300 is fixedly connected to the circuit board 1200). A side of the circuit board 1200 and a side of the heat sink 1300 are snapped between a bottom of the bottom casing 1100 and the protruding tongue portion 1130, and another side of the circuit board 1200 is connected to the snap 1140. In this way, the heat sink 1300 and the circuit board 1200 can be fixedly mounted to the bottom casing 1100.

[0070] For example, with reference to FIGS. 4 to 11, the bottom casing 1100 includes a bottom plate 1110 and a panel 1120 disposed at a periphery of the bottom plate 1110. The panel 1120 includes a front panel 1123, a rear panel 1124, a left panel 1121, and a right panel 1122. The protruding tongue portion 1130 is disposed at a top of the left panel 1121. The snap 1140 is disposed at the right panel. The heat sink 1300 and the circuit board 1200 are first connected to be assembled together, and then the side of the heat sink 1300 and the side (a left side) of the circuit board 1200 are snapped between the protruding tongue portion 1130 and the bottom plate 1110. Then, the other side (a right side) of the control circuit board 1200 is engaged with the snap 1140 to be snapped with each other. In this way, the mounting of the circuit board 1200 to the heat sink 1300 is realized conveniently and quickly.

[0071] With reference to FIG. 3, in some embodiments, the heat sink 1300 is constructed as at least part of a channel wall of the second channel 1430. In this way, the airflow output from the second fan 1620 into the second channel 1430 can also take away the heat of the heat sink 1300 (and the first electronic component 1210). In this way, the heat dissipation effect on the first electronic component 1210 is improved.

[0072] For example, the circuit board 1200 is disposed at the bottom plate 1110. The heat sink 1300 is disposed at a left side of the circuit board 1200, and the heat sink 1300 is tightly attached to the left panel 1121 to allow the first flow channel 1330 to be surrounded by the left panel 1121. The right panel 1122 is located at a right side of the circuit board 1200. The coil assembly 1400 covers the bottom casing 1100 to cover the circuit board 1200. The first fan 1610 and the second fan 1620 are disposed at a front side of the circuit board 1200. The first air duct 1510 and the second air duct 1520 are disposed between the second fan 1620 and the circuit board 1200. The heat sink 1300, the circuit board 1200, the right panel 1122, the rear panel 1124, and the coil assembly 1400 are constructed as the flow channel wall of the second flow channel 1430. The airflow output by the second fan 1620 may also take away the heat of the first electronic component 1210 when flowing into the second flow channel 1430. In this way, the airflow discharged from the second air duct 1520 may be blocked by the rear panel 1124 and diverted upwards when flowing to the rear panel 1124.

[0073] It will be appreciated that in order to discharge the airflow carrying heat out of the electromagnetic cooking device 1000, an air outlet 1150 needs to be provided. With reference to FIGS. 4 and 12, optionally, the bottom casing 1100 has an air outlet 1150. For example, the air outlet 1150 of the bottom casing 1100 may be formed at the rear panel 1124. The air outlet 1150 is in communication with an ambient environment. The air outlet 1150 may be configured to allow the airflow generated by the first fan 1610 to be discharged through the air outlet 1150, and also to allow the airflow generated by the second fan 1620 to be discharged through the air outlet 1150, and also the airflow generated by both the first fan 1610 and the second fan 1620 to be discharged through the air outlet 1150. In this way, the airflow carrying the heat can be discharged from the electromagnetic cooking device 1000 to the ambient environment through the air outlet 1150.

[0074] Furthermore, in some embodiments, the air outlet 1150 directly faces towards the first flow channel 1330. The phase "directly faces towards" means that the air outlet 1150 and the first flow channel 1330 are at least partially overlapped with each other in the air outflowing direction of the first flow channel 1330. In this way, the airflow discharged from the first flow channel 1330 can be quickly discharged through the air outlet 1150. When an amount of the heat generated by the first electronic component 1210 is much than an amount of the heat generated by the second electronic component 1220, with such a configuration, the rapid discharge of the heat from the electromagnetic cooking device 1000 can be facilitated without allowing the airflow to flow into the second flow channel 1430. As a result, the overall heat dissipation effect is improved.

[0075] When the air outlet 1150 directly faces towards the first flow channel 1330, the first air channel 1510 may be designed to be located closer to the heat sink 1300 than the second air channel 1520. In this way, the second air channel 1520 may be further away from the heat sink 1300. Since the airflow output from the second air channel 1520 is blocked by the second shielding structure 1124 (the rear panel 1124) and is diverted upwardly, the airflow output from the second air channel 1520 can be prevented from being discharged directly through the air outlet 1150 after flowing through the second flow channel. As a result, more airflow is in contact with the part of the coil assembly 1400 away from the second air channel 1520 before being discharged through the air outlet 1150.

[0076] The present invention also discloses a combination cooker 100. With reference to FIG. 23, the combination cooker 100 includes a range hood 2000 and the above-mentioned electromagnetic cooking device 1000. That is, the range hood 2000 and the electromagnetic cooking device 1000 are combined together. For example, the range hood 2000 is located in a middle part, and the electromagnetic cooking devices 1000 are disposed at a left side and a right side of the range hood 2000, respectively. The electromagnetic cooking device 1000 includes a circuit board 1200, a heat sink 1300, a coil assembly 1400, a first fan 1610, and a second fan 1620. The circuit board 1200 is provided with a first electronic component 1210 and a second electronic component 1220. The heat sink 1300 has a first flow channel 1330. The first flow channel 1330 is adapted to allow an airflow to flow through the first flow channel 1330. The first electronic component 1210 is designed to be in contact with the heat sink 1300. The coil assembly 1400 and the circuit board 1200 are spaced apart from each other to form a second flow channel 1430 between the coil assembly 1400 and the circuit board 1200. The second flow channel 1430 is adapted to allow an airflow to flow through the second flow channel 1430. The second electronic component 1220 is located in the second flow channel 1430. The first fan 1610 is configured to generate an airflow flowing through the first flow channel 1330, and the second fan 1620 is configured to generate airflow flowing through the second flow channel 1430.

[0077] Since the first electronic component 1210 is brought into contact with the heat sink 1300, the airflow generated by the first fan 1610 can take away heat of the first electronic component 1210 when flowing through the first flow channel 1330 of the heat sink 1300. In addition, since the second electronic component 1220 is disposed in the second flow channel 1430, the airflow generated by the second fan 1620 can take away heat of the second electronic component 1220 when flowing through the second flow channel 1430. Since more satisfactory heat dissipation for the first electronic component 1210 can be implemented by the heat sink 1300, the first electronic component 1210 may be an electronic component with larger heat generation, while the second electronic component 1220 may be an electronic component with smaller heat generation. In addition, under the actions of the first fan 1610 and the second fan 1620, sufficient air volume may be provided for the first electronic component 1210 and the second electronic component 1220 for heat dissipation. Through such a configuration, accurate and effective heat dissipation of different electronic components can be achieved. As a result, the electromagnetic cooking device 1000 can operate stably. It will be appreciated that the electromagnetic cooking device 1000 of the combination cooker 100 of this embodiment adopts the technical solutions of the above embodiments, and thus has at least the beneficial effects brought by the technical solutions of the above embodiments, and details thereof will be omitted herein.

Examples

Embodiment Construction

[0032]The present invention provides an electromagnetic cooking device 1000. As illustrated in FIGS. 1 to 5, in some embodiments, the electromagnetic cooking device 1000 includes a circuit board 1200, a heat sink 1300, a coil assembly 1400, a first fan 1610, and a second fan 1620. The circuit board 1200 is provided with a first electronic component 1210 and a second electronic component 1220. The heat sink 1300 has a first flow channel 1330. The first flow channel 1330 is adapted to allow an airflow to flow through the first flow channel 1330. The first electronic component 1210 is designed to be in contact with the heat sink 1300. The coil assembly 1400 and the circuit board 1200 are spaced apart from each other to form a second flow channel 1430 between the coil assembly 1400 and the circuit board 1200. The second flow channel 1430 is adapted to allow an airflow to flow through the second flow channel 1430. The second electronic component 1220 is located in the second flow channel...

Claims

1. An electromagnetic cooking device (1000), comprising: a circuit board (1200) provided with a first electronic component (1210) and a second electronic component (1220); a heat sink (1300) having a first flow channel (1330), wherein the first electronic component (1210) is in contact with the heat sink (1300); a coil assembly (1400), wherein a second flow channel (1430) is defined between the coil assembly (1400) and the circuit board (1200), and the second electronic component (1220) is located in the second flow channel (1430); a first fan (1610) adapted to generate an airflow flowing through the first flow channel (1330); and a second fan (1620) adapted to generate an airflow flowing through the second flow channel (1430).

2. The electromagnetic cooking device (1000) according to claim 1, wherein: the heat sink (1300) comprises: a body portion (1310) in contact with the first electronic component (1210); and a plurality of fin portions (1320) arranged at the body portion (1310), and the first flow channel (1330) is formed between adjacent fin portions (1320) of the plurality of fin portions (1320).

3. The electromagnetic cooking device (1000) according to claim 2, further comprising a first shielding structure (1121), wherein a side of the first flow channel (1330) facing away from the body portion (1310) is surrounded by the first shielding structure (1121).

4. The electromagnetic cooking device (1000) according to claim 3, further comprising a bottom casing (1100), wherein: the heat sink (1300) is mounted at the bottom casing (1100); the bottom casing (1100) is provided with a panel (1120) at a periphery of the bottom casing (1100); and the panel (1120) is partially constructed as the first shielding structure (1121).

5. The electromagnetic cooking device (1000) according to any one of claims 1 to 4, further comprising a first air duct (1510) and a second air duct (1520), wherein: the second fan (1620) is in communication with the second flow channel (1430) via the first air duct (1510); the second fan (1620) is in communication with the second flow channel (1430) via the second air duct (1520); and the first air duct (1510) is configured to allow air to outflow in a first direction, and the second air duct (1520) is configured to allow air to outflow in a second direction, to form at least two air outflowing directions.

6. The electromagnetic cooking device (1000) according to any one of claims 1 to 4, further comprising a first air duct (1510), wherein: the second fan (1620) is in communication with the second flow channel (1430) via the first air duct (1510); and the first air duct (1510) has an air outflowing direction towards the second electronic component (1220).

7. The electromagnetic cooking device (1000) according to claim 6, wherein: the circuit board (1200) is located at higher level than a lowest part of an air outflow end of the first air duct (1510), and the air outflowing direction of the first air duct (1510) is parallel to the circuit board (1200); and / or the first air duct (1510) has an air outflow end of a flared shape.

8. The electromagnetic cooking device (1000) according to any one of claims 1 to 4, further comprising a second air duct (1520), wherein: the second fan (1620) is in communication with the second flow channel (1430) via the second air duct (1520); and the second air duct (1520) has an air outflowing direction towards the coil assembly (1400).

9. The electromagnetic cooking device (1000) according to claim 8, wherein the air outflowing direction of the second air duct (1520) is inclined towards the coil assembly (1400), alternatively, the coil assembly (1400) is located above the second air duct (1520), and a bottom (1521) of the second air duct (1520) is inclined towards the coil assembly (1400) from the second fan (1620).

10. The electromagnetic cooking device (1000) according to claim 8 or 9, further comprising a second shielding structure (1124), wherein: the second air duct (1520) is disposed at an end of the second flow channel (1430); and the second shielding structure (1124) is disposed at another end of the second flow channel (1430), alternatively, the electromagnetic cooking device (1000) further comprises a bottom casing (1100), wherein: the circuit board (1200) and the coil assembly (1400) are disposed at the bottom casing (1100); the bottom casing (1100) is provided with a panel (1120) at a periphery of the bottom casing (1100); and the panel (1120) is partially constructed as the second shielding structure (1124).

11. The electromagnetic cooking device (1000) according to any one of claims 1 to 10, wherein a first air duct (1510) of the electromagnetic cooking device (1000) is located closer to a heat sink (1300) than the second air duct (1520) of the electromagnetic cooking device (1000); or wherein: a first air duct (1510) of the electromagnetic cooking device (1000) and a second air duct (1520) of the electromagnetic cooking device (1000) are in communication with the same second fan (1620); or the electromagnetic cooking device (1000) comprises at least two second fans (1620), one of the two second fans (1620) is in communication with the first air duct (1510) of the electromagnetic cooking device (1000), and another one of the two second fans (1620) is in communication with the second air duct (1520) of the electromagnetic cooking device (1000).

12. The electromagnetic cooking device (1000) according to any one of claims 1 to 11, further comprising a bottom casing (1100), wherein: the coil assembly (1400) is disposed at the bottom casing (1100); and the circuit board (1200) and the heat sink (1300) are disposed between the bottom casing (1100) and the coil assembly (1400).

13. The electromagnetic cooking device (1000) according to claim 12, wherein: the bottom casing (1100) has an air outlet (1150), and the air outlet (1150) is adapted to allow the airflow generated by the first fan (1610) and / or the airflow generated by the second fan (1620) to be discharged through the air outlet (1150), alternatively, the air outlet (1150) directly faces towards the first flow channel (1330).

14. The electromagnetic cooking device (1000) according to claim 12 or 13, wherein: the bottom casing (1100) is provided with a protruding tongue portion (1130) and a snap (1140), the heat sink (1300) is disposed at the circuit board (1200), a side of the heat sink (1300) and a side of the circuit board (1200) are snapped between the protruding tongue portion (1130) and a bottom of the bottom casing (1100), and another side of the circuit board (1200) is connected to the snap (1140); and / or the heat sink (1300) is constructed as at least part of a flow channel wall of the second flow channel (1430).

15. A combination cooker (100), comprising: a range hood (2000); and the electromagnetic cooking device (1000) according to any one of claims 1 to 14.

Images